User Manual
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| Document ID | 3622104 |
| Application ID | mQukesTYijIEC0Czy0YE9Q== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 219.66kB (2745731 bits) |
| Date Submitted | 2017-10-30 00:00:00 |
| Date Available | 2017-10-30 00:00:00 |
| Creation Date | 2017-09-13 14:16:12 |
| Producing Software | Microsoft® Word 2016 |
| Document Lastmod | 2017-10-20 16:41:28 |
| Document Title | BMD-330 Datasheet |
| Document Creator | Microsoft® Word 2016 |
| Document Author: | Rigado;Inc. |
User Manual Product Name: BMD-330 Brand: RIGADO Model:BMD-330 Manufacture: Rigado, Inc. BMD-330 Module for Bluetooth 5 LE The BMD-330 from Rigado is a powerful, highly flexible, ultra-low power Bluetooth Smart module based on the nRF52810 SoC from Nordic Semiconductor. With an ARM® Cortex™ M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a complete RF solution with no additional RF design, allowing faster time to market. Providing full use of the nRF52810’s capabilities and peripherals, the BMD-330 can power demanding applications, while simplifying designs and reducing BOM costs. With an internal DC-DC converter and intelligent power control, the BMD-330 provides classleading power efficiency, enabling ultra-low power sensitive applications. Regulatory pre-approvals reduce the burden to enter the market. As a drop in replacement for the BMD-300/301, the BMD-330 completes Rigado’s BMD-300 Series lineup with an optimized peripheral set that is attractive for a wide range of cost-sensitive applications. 1. Features • • • • • • • • • • • • • • Based on the Nordic nRF52810 SoC Complete RF solution with integrated antenna Integrated DC-DC converter No external components required ARM® Cortex™-M4 32-bit processor Serial Wire Debug (SWD) Nordic SoftDevice ready Over-the-Air (OTA) firmware updates 192kB embedded flash memory 24kB RAM 32 General Purpose I/O Pins 12-bit/200KSPS ADC -40C to +85C Temperature Range FCC: 2AA9B09 (Pending) • • • • • • • • • • • • SPI Master/Slave (8 Mbps) General purpose comparator Temperature sensor Random Number Generator 2-wire serial Master/Slave (I2C compatible) UART (w/ CTS/RTS and DMA) 20 channel CPU independent Programmable Peripheral Interconnect (PPI) Quadrature Demodulator (QDEC) 128-bit AES HW encryption 3 x 32bit, 2 x 24bit Real Timer Counters (RTC) Dimensions: 14 x 9.8 x 1.9mm IC: 12208A-09 (Pending) 2. Applications • • • • • • Climate Control Lighting Products Safety and Security Home Appliances Access Control Internet of Things (IoT) BMD-330-DS V0.9 • • • • • Home Health care Advanced Remote Controls Smart Energy Management Low-Power Sensors Beacons– iBeacon™, AltBeacon, Eddystone, etc. Industry Canada • • • • Environmental Monitoring Hotel Automation Office Automation Wearables Page 1 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 3. Ordering Information Email modules@rigado.com for quotes and ordering or visit http://www.rigado.com/BMD-330 Part Number BMD-330-A-R BMD-330-EVAL Description BMD-330 module, Rev A, Tape & Reel, 1000 piece multiples BMD-330 Evaluation Kit with Segger J-Link programmer Table 1 – Ordering Part Numbers 4. Block Diagram BMD-330 Module nRF52810 24kB RAM SWD Debug & Programming Core LDO DC/DC Buck Regulator DC-DC Inductor Accel Address Resolver ARM Cortex-M4 @ 64MHz 2.4GHz Radio Multi-protocol AES ECB Balun 192kB Flash Mat chi ng Network AES CCM Mode Encryption Cloc k Management Real Time Counter x2 Watchdog Timer Timer x3 Random Number Gen TWI Master SPI Master UART TWI Slave SPI Slave 4ch P WM Bulk Capacitors Decoupling Capacitors Programmable Peripheral Interconnect Temperature Sensor GPIO Task Event Blocks General Purpose Comparator Quadrature Decoder 8-ch 12-bit ADC Antenna PDM GPIO x32 (Analog x8) 32 MHz Crystal Figure 1 – Block Diagram BMD-330-DS V0.9 Page 2 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 Table of Contents 1. FEATURES...............................................................................................................................................................................1 2. APPLICATIONS ........................................................................................................................................................................1 3. ORDERING INFORMATION......................................................................................................................................................2 4. BLOCK DIAGRAM....................................................................................................................................................................2 5. QUICK SPECIFICATIONS ..........................................................................................................................................................4 6. PIN DESCRIPTIONS .................................................................................................................................................................5 7. ELECTRICAL SPECIFICATIONS ..................................................................................................................................................7 7.1 ABSOLUTE MAXIMUM RATINGS ..................................................................................................................................................... 7 7.2 OPERATING CONDITIONS .............................................................................................................................................................. 7 7.3 GENERAL PURPOSE I/O ............................................................................................................................................................... 7 7.4 MODULE RESET ....................................................................................................................................................................... 8 7.5 DEBUG & PROGRAMMING ............................................................................................................................................................ 8 7.6 CLOCKS ................................................................................................................................................................................... 8 8. FIRMWARE .............................................................................................................................................................................9 8.1 FACTORY IMAGE ........................................................................................................................................................................ 9 8.2 SOFTDEVICES ............................................................................................................................................................................ 9 8.2.1 S132 ................................................................................................................................................................................... 9 8.3 MAC ADDRESS INFO ................................................................................................................................................................ 10 9. MECHANICAL DATA ..............................................................................................................................................................11 9.1 MECHANICAL DIMENSIONS ......................................................................................................................................................... 11 9.2 RECOMMENDED PCB LAND PADS................................................................................................................................................. 12 10. MODULE MARKING ..............................................................................................................................................................12 11. RF DESIGN NOTES.................................................................................................................................................................13 11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ............................................................................................................................... 13 11.1.1 BMD-300 .......................................................................................................................................................................... 13 11.2 MECHANICAL ENCLOSURE........................................................................................................................................................... 13 11.3 ANTENNA PATTERNS ................................................................................................................................................................. 14 12. EVALUATION BOARDS ..........................................................................................................................................................16 13. SOLUTION SERVICES .............................................................................................................................................................16 14. BLUETOOTH QUALIFICATION................................................................................................................................................17 15. REGULATORY STATEMENTS..................................................................................................................................................17 15.1 FCC STATEMENT: .................................................................................................................................................................... 17 15.2 FCC IMPORTANT NOTES ............................................................................................................................................................ 17 15.3 IC STATEMENT: ....................................................................................................................................................................... 19 15.4 IC IMPORTANT NOTES ............................................................................................................................................................... 19 15.5 CE REGULATORY ...................................................................................................................................................................... 20 15.6 AUSTRALIA / NEW ZEALAND........................................................................................................................................................ 20 16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ...................................................................................................................21 16.1 MOISTURE SENSITIVITY LEVEL ...................................................................................................................................................... 21 17. PACKAGING AND LABELING..................................................................................................................................................21 17.1 CARRIER TAPE DIMENSIONS ........................................................................................................................................................ 21 17.2 REEL PACKAGING ..................................................................................................................................................................... 22 17.3 PACKAGING LABEL .................................................................................................................................................................... 22 18. CAUTIONS ............................................................................................................................................................................23 19. LIFE SUPPORT POLICY ...........................................................................................................................................................23 20. DOCUMENT HISTORY ...........................................................................................................................................................24 21. RELATED DOCUMENTS .........................................................................................................................................................24 BMD-330-DS V0.9 Preliminary – Subject to Change Page 3 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 5. Quick Specifications Bluetooth Version 5.0 (Bluetooth Smart) Concurrent Central & Peripheral (S132) Security AES-128 Concurrent central, observer, peripheral, and broadcaster roles with multiple concurrent connections along with one Observer and one Broadcaster (S132) LE connections Radio Frequency Modulations Transmit power Receiver sensitivity Antenna 2402-2480MHz GFSK at 1 Mbps, 2 Mbps data rates +4 dBm -96 dBm (BLE mode) Integrated Current Consumption TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled TX only @ +4 dBm, 0 dBm RX only @ 1 Mbps @ 3V, DCDC enabled RX only @ 1 Mbps RX only @ 2 Mbps @ 3V, DCDC enabled RX only @ 2 Mbps CPU @ 64MHz from flash, from RAM CPU @ 64MHz from flash, from RAM @ 3V, DCDC System Off, On Additional current for RAM retention 7.0 mA, 4.6 mA 15.4 mA, 10.1 mA 4.6 mA 10.0 mA 5.8 mA 11.2 mA 4.0 mA, 3.8 mA 2.4 mA, 2.1 mA 0.3 µA, 0.6 µA 30 nA / 4KB block Dimensions BMD-330 Length Width Height 14.0 mm ± 0.3mm 9.8 mm ± 0.3mm 1.9 mm ± 0.1mm Hardware Interfaces Power supply Temperature Range SPI Master/Slave UART Two-Wire Master/Slave (I2C) GPIO x 32 1.7V to 3.6V -40C to +85°C I2S PWM PDM ADC Certifications FCC IC CE Australia / New Zealand Bluetooth FCC part 15 modular certification (Pending) FCC ID: 2AA9B09 Industry Canada RSS-210 modular certification IC: 12208A-09 EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V3.1.1 EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices (Pending) RF-PHY Component (Pending) Export ECCN 5A992.C, Exception 742.15(b)(1) HTS 8473.30.1180 Table 2 – Quick Specifications BMD-330-DS V0.9 Preliminary – Subject to Change Page 4 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 6. Pin Descriptions Figure 2 – BMD-330 Pin out (Top View) Pin 10 11 12 13 14 15 19 20 21 22 23 24 25 26 27 28 31 BMD-330-DS V0.9 Name P0.25 P0.26 P0.27 P0.28 P0.29 P0.30 P0.31 P0.00 P0.01 P0.02 P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 Pin description Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out Preliminary – Subject to Change Description GPIO2 GPIO2 GPIO2 GPIO/AIN42 GPIO/AIN52 GPIO/AIN62 GPIO/AIN72 GPIO/XTAL1 (32.768kHz) GPIO/XTAL2 (32.768kHz) GPIO/AIN0 GPIO/AIN1 GPIO/AIN2 GPIO/AIN3 GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Page 5 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 Pin 32 33 34 35 36 37 38 39 40 41 42 43 44 17 1, 2, 3, 4, 5, 16, 18, 29, 30, 45, 46, 47 Name P0.14 P0.15 P0.16 P0.17 P0.18 P0.19 P0.20 P0.21 P0.22 P0.23 P0.24 SWCLK SWDIO VCC Direction In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In/Out In In/Out Power Description GPIO GPIO GPIO GPIO GPIO GPIO GPIO ̅̅̅̅̅̅̅̅ GPIO/RESET GND Power Electrical Ground GPIO2 GPIO2 GPIO2 SWD Clock SWD IO +1.7V to +3.6V1 Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw. Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using only low frequency, low-drive functions when possible. Table 3 – BMD-330 Pin Descriptions BMD-330-DS V0.9 Preliminary – Subject to Change Page 6 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 7. Electrical Specifications 7.1 Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 VIO_MAX Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3V Storage Temperature Range -40 125 °C TS Table 4 – Absolute Maximum Ratings 7.2 Operating Conditions Symbol VCC TR_VCC TA Parameter Operating supply voltage Supply rise time (0V to 1.7V) Operating Ambient Temperature Range Min. Typ. Max. Unit 1.7 3.0 3.6 60 ms -40 25 85 °C Table 5 – Operating Conditions 7.3 General Purpose I/O The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features: • Input/output direction • Output drive strength • Internal pull-up and pull-down resistors • Wake-up from high or low level triggers on all pins • Trigger interrupt on all pins • All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels • All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Min. Typ. Max. Unit VIH Input High Voltage 0.7 x VCC VCC VIL Input Low Voltage VSS 0.3 x VCC VOH Output High Voltage VCC − 0.4 VCC VOL Output Low Voltage VSS VSS + 0.4 RPU Pull-up Resistance 11 13 16 kΩ RPD Pull-down Resistance 11 13 16 kΩ Table 6 – GPIO BMD-330-DS V0.9 Preliminary – Subject to Change Page 7 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 7.4 Module RESET GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as ̅̅̅̅̅̅̅̅, the internal pull-up is automatically enabled. Rigado and Nordic example applications and development RESET ̅̅̅̅̅̅̅̅. kits program P0.21 as RESET 7.5 Debug & Programming The BMD-330 supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. 7.6 Clocks The BMD-330 requires two clocks, a high frequency clock and a low frequency clock. The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the nRF52810 for radio operation. The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest accuracy. Using the internal RC oscillator with calibration provides acceptable performance for BLE applications at a reduced cost and slight increase in power consumption. Note: the ANT protocol requires the use of an external crystal. 32.768 kHz Crystal (LFXO) Symbol Typ. Max. Unit 32.768 kHz Frequency tolerance, BLE applications ±250 ppm CL_LFXO Load Capacitance 12.5 pF C0_LFXO Shunt Capacitance pF RS_LFXO Equivalent series resistance 100 kΩ Input Capacitance on XL1 & XL2 pads pF FNOM_LFXO FTOL_LFXO_BLE Cpin Parameter Crystal frequency Table 7 – 32.768 kHz Crystal 32.768 kHz Oscillator Comparison Symbol Parameter Min. Typ. Max. Unit ILFXO Current for 32.768kHz Crystal Oscillator 0.25 µA ILFRC Current for 32.768kHz RC Oscillator 0.6 µA ILFSYNT Current for 32.768kHz Synthesized Oscillator Frequency Tolerance, 32.768kHz Crystal Oscillator (BLE Stack)1 Frequency Tolerance, 32.768kHz Crystal Oscillator (ANT Stack)1 100 µA ±250 ppm ±50 ppm fTOL_LFXO_BLE fTOL_LFXO_ANT BMD-330-DS V0.9 Preliminary – Subject to Change Page 8 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 Symbol Parameter Min. Typ. Max. Unit f TOL_LFRC Frequency Tolerance, 32.768kHz RC Oscillator ±2 fTOL_CAL_LFRC Frequency tolerance, 32.768kHz RC after calibration Frequency Tolerance, 32.768kHz Synthesized Oscillator ±250 ppm ±48 ppm fTOL_LFSYNT Note 1: fTOL_LFXO_BLE and fTOL_LFXO_ANT are the max allowed for BLE and ANT applications. Actual tolerance depends on the crystal used. Table 8 – 32.768 kHz Oscillator 8. Firmware 8.1 Factory Image Due to the BMD-330’s reduced memory capacity, no factory firmware image is provided on the module. This is indicated with a factory version code of “00” printed on the module label. Since there is no bootloader on the module, firmware must be loaded on the module with the SWD interface 8.2 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic website. The BMD-330 with the nRF52810 SoC supports the S132 (BLE Central & Peripheral) SoftDevice. 8.2.1 S132 The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution supporting up to 20 connections with an additional Observer and a Broadcaster role all running concurrently. The S132 SoftDevice integrates a BLE Controller and Host, and provides a full and flexible API for building Bluetooth Smart nRF52 System on Chip (SoC) solutions. Key Features • • Bluetooth 4.2 compliant low energy single-mode protocol stack suitable for Bluetooth Smart products Concurrent central, observer, peripheral, and broadcaster roles with up to twenty concurrent connections along with one Observer and one Broadcaster Configurable number of connections and connection properties Configurable attribute table size Custom UUID support Link layer LL Privacy LE Data Packet Length Extension L2CAP, ATT, and SM protocols LE Secure Connections pairing model GATT and GAP APIs GATT Client and Server Configurable ATT MTU Complementary nRF5 SDK including Bluetooth profiles and example applications BMD-330-DS V0.9 • • • • • • • • Master Boot Record for over-the-air device firmware update o SoftDevice, application, and bootloader can be updated separately Memory isolation between the application and the protocol stack for robustness and security Thread-safe supervisor-call based API Asynchronous, event-driven behavior No RTOS dependency o Any RTOS can be used No link-time dependencies o Standard ARM® Cortex®-M4 project configuration for application development Support for concurrent and non-concurrent multiprotocol operation o Concurrent with the Bluetooth stack using Radio Timeslot API o Alternate protocol stack in application space Support for control of external Power Amplifiers and Low Noise Amplifiers Preliminary – Subject to Change Page 9 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 8.3 MAC Address Info The BMD-330 module comes preprogrammed with a unique MAC address from the factory. The MAC address is also printed on a 2D barcode on the top of the module. Figure 3 – BMD-300/301 MAC Address on Label The 6-byte BLE Radio MAC address is stored in the nRF52810 UICR at NRF_UICR_BASE+0x80 LSB first. From the factory, the MAC address can be read over SWD since read-back protection is not enabled. If performing a full-chip-erase, the MAC can then only be recovered from the 2D barcode and human-readable text. UICR Register: NRF_UICR + 0x80 (0x10001080): MAC_Addr [0] (0xZZ) NRF_UICR + 0x81 (0x10001081): MAC_Addr [1] (0xYY) NRF_UICR + 0x82 (0x10001082): MAC_Addr [2] (0xXX) NRF_UICR + 0x83 (0x10001083): MAC_Addr [3] (0x93) NRF_UICR + 0x84 (0x10001084): MAC_Addr [4] (0x54) NRF_UICR + 0x85 (0x10001085): MAC_Addr [5] (0x94) BMD-330-DS V0.9 Preliminary – Subject to Change Page 10 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 9. Mechanical Data 9.1 Mechanical Dimensions Figure 4 – BMD-330 Module Dimensions (All dimensions are in mm) BMD-330-DS V0.9 Preliminary – Subject to Change Page 11 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 9.2 Recommended PCB Land Pads The BMD-330, BMD-300, and BMD-301 have identical PCB layout footprints. Figure 5 – BMD-300/301 Dimensions (Top View) (All dimensions are in mm) 10. Module Marking Figure 6 – BMD-330 Module Marking – Rev A BMD-330-DS V0.9 Preliminary – Subject to Change Page 12 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 11. RF Design Notes 11.1 Recommended RF Layout & Ground Plane 11.1.1 BMD-300 For the BMD-330, the integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane from that shown in Figure 7 will reduce the effective radiated power. For example, a 27mm x 29mm board (about the size of a coin cell) has approximately 3dB lower output than the BMD-330 Evaluation Board. Figure 7 – BMD-300 Recommended RF Layout 11.2 Mechanical Enclosure Care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer. BMD-330-DS V0.9 Preliminary – Subject to Change Page 13 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 11.3 Antenna Patterns Antenna patterns are based on the BMD-300 Evaluation Kit vA with a ground plane size of 82mm x 56mm. The BMD-300 module was replaced with a BMD-330 module. X-Y-Z orientation is shown in Figure 8: Figure 8 – X-Y-Z Antenna Orientation 11.3.1.1 X-Y Plane Figure 9 – X-Y Plane Antenna Pattern BMD-330-DS V0.9 Preliminary – Subject to Change Page 14 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 11.3.1.2 Y-Z Plane Figure 10 – Y-Z Plane Antenna Pattern 11.3.1.3 Z-X Plane Figure 11 – Z-X Plane Antenna Pattern BMD-330-DS V0.9 Preliminary – Subject to Change Page 15 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 12. Evaluation Boards Rigado has developed full featured evaluation boards for the BMD-300 which can be used for BMD-330 development. The BMD-300 evaluation board provides a complete I/O pin out to headers, on-board programming and debug, 32.768 kHz crystal, power & virtual COM port over USB, 4 user LEDs, and 4 user buttons. The evaluation boards also provide the option to be powered from a CR2032 coin cell battery, and have current sense resistors and headers to allow for convenient current measurements. An Arduino Uno R3 style header is provided for easy prototyping of additional functions. The evaluation boards also support programming off-board BMD-300 Series modules. 13. Solution Services Rigado is a full-service design house offering end-to-end product solution development from concept to manufacturing. We can provide custom modules and do electrical and mechanical design, end product manufacturing, firmware and mobile development, and web and cloud integration. Please contact Rigado at info@rigado.com or 1-866-6-RIGADO for custom engineering options and fees. BMD-330-DS V0.9 Preliminary – Subject to Change Page 16 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 14. Bluetooth Qualification The BMD-330 Series modules are qualified as a Bluetooth Component (tested) for RF-PHY (Pending). This allows customers to use different SoftDevices that have been qualified by Nordic without the need to complete additional RF-PHY testing. To achieve Bluetooth End Product qualification, the Rigado RF-PHY QDID can be combined with Nordic QDIDs for the SoftDevice used when filing on the Bluetooth SIG website. The only testing required is for the Bluetooth profiles supported by the customer’s product. Products with only custom profiles do not require any additional testing. • RF-PHY BT5.0 Component(Tested) Declaration ID Pending / QDID Pending 15. Regulatory Statements Notice: All certifications are currently pending 15.1 FCC Statement: This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and the receiver • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment. Note: Modification to this product will void the users’ authority to operate this equipment. 15.2 FCC Important Notes (1) FCC Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in this document. Caution! The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment. BMD-330-DS V0.9 Preliminary – Subject to Change Page 17 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter antenna. (3) OEM integration instructions： This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.) In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Caution! The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B limits for unintentional radiators through an accredited test facility. (4) End product labeling： The final end product must be labeled in a visible area with the following: • “Contains FCC ID: 2AA9B09” • Any similar wording that expresses the same meaning may be used. The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” (5) Information regarding the end user manual： The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)). BMD-330-DS V0.9 Preliminary – Subject to Change Page 18 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 15.3 IC Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur . A separation distance of at least 20 cm is maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Une distance de séparation d'au moins 20 cm est maintenue entre l'émetteur rayonnant structure (s) et le corps de l'utilisateur ou des personnes à proximité. 15.4 IC Important Notes 1. The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures. 3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system. 4. The host device shall be properly labelled to identify the module within the host device. The end product must be labeled in a visible area with the following: • “Contains IC: 12208A-09” (Pending) Any similar wording that expresses the same meaning may be used. The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device. “This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.” BMD-330-DS V0.9 Preliminary – Subject to Change Page 19 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 15.5 CE Regulatory The BMD-330 module is being tested and is expected to be compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC: • EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 From R&TTE Directive 1999/5/EC: • ETSI EN 300 328 V 2.1.1 From Directive 2004/108/EC: • ETSI EN 301 489-1 V2.1.1 • ETSI EN 301 489-17 V3.1.1 Declarations of Conformity and supporting test reports are available at www.rigado.com. 15.6 Australia / New Zealand The BMD-330 module has been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices – Limits and methods of measurement. The report may be downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM. Information on registration as a Responsible Party, license and labeling requirements may be found at the following websites: Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-2004 New Zealand: http://www.rsm.govt.nz/compliance The A-Tick and C-Tick marks are being migrated to the Regulatory Compliance Mark (RCM). Only Australianbased and New Zealand-based companies who are registered may be granted permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the RCM on behalf of a company not in Australia or New Zealand. BMD-330-DS V0.9 Preliminary – Subject to Change Page 20 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 16. Solder Reflow Temperature-Time Profile Figure 12 – Reflow Profile for Lead Free Solder 16.1 Moisture Sensitivity Level The BMD-330 is rated for MSL 3, 168-hour floor life after opening. 17. Packaging and Labeling 17.1 Carrier Tape Dimensions Figure 13 – BMD-330 Carrier Tape Dimensions BMD-330-DS V0.9 Preliminary – Subject to Change Page 21 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 17.2 Reel Packaging Modules come on 330mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340x350x65mm box. On the outside of the bag an antistatic warning and reel label are adhered. Figure 14 – Reel Cartons 17.3 Packaging Label Part No.: BMD-330-A-R Figure 15 – Packaging Label BMD-330-DS V0.9 Preliminary – Subject to Change Page 22 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 18. Cautions 1) The guidelines of this document should be followed in order to assure proper performance of the module. 2) This product is for use in office, business, and residential applications, but not medical devices. 3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used. This could be accomplished by redundant systems and protection circuits. 4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally, it should not contain noise, spikes, or AC ripple voltage. 5) Avoid use with other high frequency circuits. 6) Use methods to eliminate static electricity when working with the module as it can damage the components. 7) Contact with wires, the enclosure, or any other objects should be avoided. 8) Refer to the recommended pattern when designing for this module. 9) If hand soldering is used, be sure to use the precautions outlined in this document. 10) This module should be kept away from heat, both during storage and after installation. 11) Do not drop or physically shock the module. 12) Do not damage the interface surfaces of the module. 13) The module should not be mechanically stressed at any time (storage, handling, installation). 14) Do not store or expose this module to: • Humid or salty air conditions • High concentrations of corrosive gasses. • Long durations of direct sunlight. • Temperatures lower than -40°C or higher than 125°C. 19. Life Support Policy This product is not designed to be used in a life support device or system, or in applications where there is potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that result. BMD-330-DS V0.9 Preliminary – Subject to Change Page 23 of 24 BMD-330 Module Datasheet Bluetooth 5 September 13, 2017 20. Document History Revision Date Changes / Notes 0.9 09/13/2017 Preliminary release 21. Related Documents Rigado Documents: • BMD-300-Series-EVAL-UG: Evaluation Kit User Guide • BMD-300 Series Data Sheet Nordic Documents: Visit infocenter.nordicsemi.com for a comprehensive library of Nordic technical documentation. • nRF52810 – nRF52810 Product Specification • S132-SDS – nRF52832 S132 Soft Device Specification BMD-330-DS V0.9 Preliminary – Subject to Change Page 24 of 24 FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AA9B09 Or ContainsFCC ID: 2AA9B09” When the module is installed inside another device, the user manual of the host must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with Single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C : 15.247 requirement, Only if the test result comply with FCC part 15C : 15.247 requirement, then the host can be sold legally. IC statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme aux CNR exemptes de licence d'Industrie Canada . Son fonctionnement est soumis aux deux conditions suivantes : ( 1 ) Ce dispositif ne peut causer d'interférences ; etc ( 2 ) Ce dispositif doit accepter toute interférence , y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. A separation distance of at least 20 cm is maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Une distance de séparation d'au moins 20 cm est maintenue entre l'émetteur rayonnant structure (s) et le corps de l'utilisateur ou des personnes à proximité. For a host manufacture's using a certified modular, if (1) the module's IC number is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the IC number of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module IC: " 12208A-09 " or "Contains IC: 12208A-09" must be used.
Source Exif Data:
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