u blox 1EHQ24NN UMTS/LTE Voice and Data Module User Manual TOBY L2 series

u-blox AG UMTS/LTE Voice and Data Module TOBY L2 series

Contents

Users manual

    TOBY-R2 series LTE Cat 1 / HSPA / EGPRS modules System Integration Manual               Abstract This  document  describes  the  features  and  the  system  integration  of TOBY-R2 series multi-mode cellular modules. These  modules  are  a  complete,  cost  efficient  and  performance optimized LTE Cat 1 / 3G / 2G multi-mode solution covering up to five LTE  bands,  up  to  four  3G  UMTS/HSPA  bands  and  up  to  four  2G GSM/EGPRS bands in the compact TOBY LGA form factor. www.u-blox.com UBX-16010572 - R01
TOBY-R2 series - System Integration Manual UBX-16010572 - R01         Page 2 of 146  Document Information Title TOBY-R2 series Subtitle LTE Cat 1 / HSPA / EGPRS modules  Document type System Integration Manual  Document number UBX-16010572 Revision and date R01 08-Jul-2016 Document status Objective Specification  Document status explanation Objective Specification Document contains target values. Revised and supplementary data will be published later. Advance Information Document contains data based on early testing. Revised and supplementary data will be published later. Early Production Information Document contains data from product verification. Revised and supplementary data may be published later. Production Information Document contains the final product specification.  This document applies to the following products: Name Type number Modem version Application version PCN / IN TOBY-R200 TOBY-R200-02B-00 TBD TBD TBD TOBY-R201 TOBY-R201-02B-00 TBD TBD TBD TOBY-R202 TOBY-R202-02B-00 30.01 A01.00 UBX-16016282                u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited. The  information  contained herein  is  provided  “as  is” and  u-blox  assumes no  liability  for the  use  of  the information. No warranty,  either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com. Copyright © 2016, u-blox AG u-blox®  is  a  registered  trademark  of  u-blox  Holding  AG  in  the  EU  and  other  countries.  Microsoft  and  Windows  are  either  registered trademarks  or  trademarks  of  Microsoft  Corporation  in  the  United  States  and/or  other  countries.  All  other  registered  trademarks  or trademarks mentioned in this document are property of their respective owners.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Preface     Page 3 of 146 Preface u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development.  AT  Commands  Manual:  This  document  provides the  description of  the  AT commands  supported  by  the  u-blox cellular modules.  System  Integration  Manual:  This document  provides  the description  of  u-blox  cellular  modules’  system from the hardware and the software point of view, it provides hardware design guidelines for the optimal integration of the cellular modules in the application device and it provides information on how to set up production and final product tests on application devices integrating the cellular modules.  Application  Note:  These  documents  provide  guidelines  and  information  on  specific  hardware  and/or software topics on u-blox cellular modules. See Related documents for a list of Application Notes related to your Cellular Module.  How to use this Manual The  TOBY-R2  series  System  Integration  Manual  provides  the  necessary  information  to  successfully  design  and configure the u-blox cellular modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  Questions If you have any questions about u-blox Cellular Integration:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com/  Technical Support Worldwide Web Our website  (http://www.u-blox.com/)  is a rich pool of  information. Product  information,  technical  documents can be accessed 24h a day. By E-mail Contact  the  closest  Technical  Support  office  by  email.  Use  our  service  pool  email  addresses  rather  than  any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support, have the following information ready:  Module type (TOBY-R202) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Contents     Page 4 of 146 Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1 System description ....................................................................................................... 8 1.1 Overview .............................................................................................................................................. 8 1.2 Architecture ........................................................................................................................................ 10 1.3 Pin-out ............................................................................................................................................... 12 1.4 Operating modes ................................................................................................................................ 16 1.5 Supply interfaces ................................................................................................................................ 18 1.5.1 Module supply input (VCC) ......................................................................................................... 18 1.5.2 RTC supply input/output (V_BCKP) .............................................................................................. 26 1.5.3 Generic digital interfaces supply output (V_INT) ........................................................................... 27 1.6 System function interfaces .................................................................................................................. 28 1.6.1 Module power-on ....................................................................................................................... 28 1.6.2 Module power-off ....................................................................................................................... 30 1.6.3 Module reset ............................................................................................................................... 32 1.6.4 Module / host configuration selection ......................................................................................... 32 1.7 Antenna interface ............................................................................................................................... 33 1.7.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 33 1.7.2 Antenna detection interface (ANT_DET) ...................................................................................... 35 1.8 SIM interface ...................................................................................................................................... 35 1.8.1 SIM interface ............................................................................................................................... 35 1.8.2 SIM detection interface ............................................................................................................... 35 1.9 Data communication interfaces .......................................................................................................... 36 1.9.1 UART interface ............................................................................................................................ 36 1.9.2 USB interface............................................................................................................................... 47 1.9.3 DDC (I2C) interface ...................................................................................................................... 50 1.9.4 SDIO interface ............................................................................................................................. 51 1.10 Audio .............................................................................................................................................. 52 1.10.1 Digital audio over I2S interface ..................................................................................................... 52 1.11 General Purpose Input/Output ........................................................................................................ 53 1.12 Reserved pins (RSVD) ...................................................................................................................... 53 1.13 System features............................................................................................................................... 54 1.13.1 Network indication ...................................................................................................................... 54 1.13.2 Antenna supervisor ..................................................................................................................... 54 1.13.3 Jamming detection ...................................................................................................................... 54 1.13.4 Dual stack IPv4/IPv6 ..................................................................................................................... 55 1.13.5 TCP/IP and UDP/IP ....................................................................................................................... 55 1.13.6 FTP .............................................................................................................................................. 55 1.13.7 HTTP ........................................................................................................................................... 55
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Contents     Page 5 of 146 1.13.8 SSL / TLS ...................................................................................................................................... 56 1.13.9 Bearer Independent Protocol ....................................................................................................... 57 1.13.10 AssistNow clients and GNSS integration ................................................................................... 57 1.13.11 Hybrid positioning and CellLocate® .......................................................................................... 58 1.13.12 Wi-Fi integration ...................................................................................................................... 60 1.13.13 Firmware update Over AT (FOAT)............................................................................................. 60 1.13.14 Firmware update Over The Air (FOTA) ...................................................................................... 60 1.13.15 Smart temperature management ............................................................................................. 61 1.13.16 Power saving ........................................................................................................................... 63 2 Design-in ..................................................................................................................... 64 2.1 Overview ............................................................................................................................................ 64 2.2 Supply interfaces ................................................................................................................................ 65 2.2.1 Module supply (VCC) .................................................................................................................. 65 2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 79 2.2.3 Generic digital interfaces supply output (V_INT) ........................................................................... 81 2.3 System functions interfaces ................................................................................................................ 82 2.3.1 Module power-on (PWR_ON) ...................................................................................................... 82 2.3.2 Module reset (RESET_N) .............................................................................................................. 83 2.3.3 Module / host configuration selection ......................................................................................... 84 2.4 Antenna interface ............................................................................................................................... 85 2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 85 2.4.2 Antenna detection interface (ANT_DET) ...................................................................................... 92 2.5 SIM interface ...................................................................................................................................... 94 2.5.1 Guidelines for SIM circuit design.................................................................................................. 94 2.5.2 Guidelines for SIM layout design ................................................................................................. 99 2.6 Data communication interfaces ........................................................................................................ 100 2.6.1 UART interface .......................................................................................................................... 100 2.6.2 USB interface............................................................................................................................. 105 2.6.3 DDC (I2C) interface .................................................................................................................... 107 2.6.4 SDIO interface ........................................................................................................................... 111 2.7 Audio interface ................................................................................................................................. 112 2.7.1 Digital audio interface ............................................................................................................... 112 2.8 General Purpose Input/Output .......................................................................................................... 116 2.9 Reserved pins (RSVD) ........................................................................................................................ 117 2.10 Module placement ........................................................................................................................ 117 2.11 Module footprint and paste mask ................................................................................................. 118 2.12 Thermal guidelines ........................................................................................................................ 119 2.13 ESD guidelines .............................................................................................................................. 120 2.13.1 ESD immunity test overview ...................................................................................................... 120 2.14 Schematic for TOBY-R2 series module integration ......................................................................... 121 2.14.1 Schematic for TOBY-R2 series module “02” product version ..................................................... 121 2.15 Design-in checklist ........................................................................................................................ 122 2.15.1 Schematic checklist ................................................................................................................... 122
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Contents     Page 6 of 146 2.15.2 Layout checklist ......................................................................................................................... 123 2.15.3 Antenna checklist ...................................................................................................................... 123 3 Handling and soldering ........................................................................................... 124 3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 124 3.2 Handling ........................................................................................................................................... 124 3.3 Soldering .......................................................................................................................................... 125 3.3.1 Soldering paste.......................................................................................................................... 125 3.3.2 Reflow soldering ....................................................................................................................... 125 3.3.3 Optical inspection ...................................................................................................................... 126 3.3.4 Cleaning .................................................................................................................................... 126 3.3.5 Repeated reflow soldering ......................................................................................................... 127 3.3.6 Wave soldering.......................................................................................................................... 127 3.3.7 Hand soldering .......................................................................................................................... 127 3.3.8 Rework ...................................................................................................................................... 127 3.3.9 Conformal coating .................................................................................................................... 127 3.3.10 Casting ...................................................................................................................................... 127 3.3.11 Grounding metal covers ............................................................................................................ 127 3.3.12 Use of ultrasonic processes ........................................................................................................ 127 4 Approvals .................................................................................................................. 128 4.1 Product certification approval overview ............................................................................................. 128 4.2 US Federal Communications Commission notice ............................................................................... 129 4.2.1 Safety warnings review the structure ......................................................................................... 129 4.2.2 Declaration of Conformity ......................................................................................................... 129 4.2.3 Modifications ............................................................................................................................ 129 4.3 Industry Canada notice ..................................................................................................................... 130 4.3.1 Declaration of Conformity ......................................................................................................... 130 4.3.2 Modifications ............................................................................................................................ 131 4.4 R&TTED / RED and European Conformance CE mark ........................................................................ 133 5 Product testing ......................................................................................................... 134 5.1 u-blox in-series production test ......................................................................................................... 134 5.2 Test parameters for OEM manufacturer ............................................................................................ 135 5.2.1 “Go/No go” tests for integrated devices .................................................................................... 135 5.2.2 RF functional tests ..................................................................................................................... 135 Appendix ........................................................................................................................ 137 A Migration between TOBY-L2 and TOBY-R2 ............................................................ 137 A.1 Overview .......................................................................................................................................... 137 A.2 Pin-out comparison between TOBY-L2 and TOBY-R2 ........................................................................ 139 A.3 Schematic for TOBY-L2 and TOBY-R2 integration ............................................................................. 141 B Glossary .................................................................................................................... 142
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Contents     Page 7 of 146 Related documents......................................................................................................... 144 Revision history .............................................................................................................. 145 Contact ............................................................................................................................ 146
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 8 of 146 1 System description 1.1 Overview The TOBY-R2 series comprises LTE Cat 1 / 3G / 2G multi-mode modules supporting up to five LTE bands, up to four  3G  UMTS/HSPA  bands  and  up  to  four 2G  GSM/(E)GPRS  bands for  voice  and/or  data  transmission  in  the small TOBY LGA form-factor (35.6 x 24.8 mm), easy to integrate in compact designs:  TOBY-R200 are designed for worldwide operation, and primarily in North America (on AT&T network)   TOBY-R201 are designed primarily for operation in North America (on AT&T / Verizon network)  TOBY-R202 are designed primarily for operation in North America (on AT&T network)  TOBY-R2 series modules are form-factor compatible with u-blox SARA, LISA and LARA cellular module families and are pin-to-pin compatible with u-blox TOBY-L cellular module families: this facilitates  easy migration from the  u-blox  GSM/GPRS,  CDMA,  UMTS/HSPA,  and  LTE  high  data  rate  modules,  maximizes  the  investments  of customers, simplifies logistics, and enables very short time-to-market. The  modules  are  ideal  for  applications  that  are  transitioning  to  LTE  from  2G  and  3G,  due  to  the  long  term availability and scalability of LTE networks. With a range of interface options and an integrated IP stack, the modules are designed to support a wide range of data-centric applications. The unique combination of performance and flexibility make these modules ideally suited  for  medium  speed  M2M  applications,  such  as  smart  energy  gateways,  remote  access  video  cameras, digital signage, telehealth and telematics. TOBY-R2 series modules support Voice over LTE (VoLTE) and voice service over 3G (CSFB) for  applications that require voice, such as security and surveillance systems.  Table 1 summarizes the main features and interfaces of TOBY-R2 series modules.  Model Region Radio Access Technology Positioning Interfaces Audio Features Grade   LTE Bands* UMTS Bands GSM Bands GNSS via modem AssistNow Software CellLocate® UART USB 2.0 SDIO  DDC (I2C) GPIOs Analog audio Digital audio  Network indication Antenna supervisor Rx Diversity Jamming detection Embedded TCP/UDP stack Embedded HTTP,FTP,SSL FOTA Dual stack IPv4/IPv6 Standard Professional Automotive TOBY-R200 North America  2,4, 5,12  850,900, 1900,2100 Quad ● ● ● ● ● ● ● ●  ● ● ● ● ● ● ● ● ●    TOBY-R201 North America  2,4,5, 12,13 850,1900  ● ● ● ● ● ● ● ●  ● ● ● ● ● ● ● ● ●    TOBY-R202 North America  2,4, 5,12 850,1900  ● ● ● ● ● ● ● ●  ● ● ● ● ● ● ● ● ●    * = LTE band 12 is a superset that includes band 17 Table 1: TOBY-R2 series main features summary
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 9 of 146 Table 2 reports a summary of cellular radio access technologies characteristics and features of the modules.  4G LTE 3G UMTS/HSDPA/HSUPA 2G GSM/GPRS/EDGE 3GPP Release 9 Long Term Evolution (LTE) Evolved Uni.Terrestrial Radio Access (E-UTRA) Frequency Division Duplex (FDD) DL Rx Diversity 3GPP Release 9 High Speed Packet Access (HSPA) UMTS Terrestrial Radio Access (UTRA)  Frequency Division Duplex (FDD) DL Rx diversity  3GPP Release 9 Enhanced Data rate GSM Evolution (EDGE) GSM EGPRS Radio Access (GERA) Time Division Multiple Access (TDMA) DL Advanced Rx Performance  Band support1:  TOBY-R200:  Band 12 (700 MHz)2  Band 5 (850 MHz)  Band 4 (1700 MHz)  Band 2 (1900 MHz)  TOBY-R201:  Band 12 (700 MHz)2  Band 13 (750 MHz)  Band 5 (850 MHz)  Band 4 (1700 MHz)  Band 2 (1900 MHz)  TOBY-R202:  Band 12 (700 MHz)2  Band 5 (850 MHz)  Band 4 (1700 MHz)  Band 2 (1900 MHz) Band support:  TOBY-R200:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz)  TOBY-R201:  Band 5 (850 MHz)  Band 2 (1900 MHz)     TOBY-R202:  Band 5 (850 MHz)  Band 2 (1900 MHz)  Band support:  TOBY-R200:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz  LTE Power Class  Class 3 (23 dBm)  UMTS/HSDPA/HSUPA Power Class  Class 3 (24 dBm)  GSM/GPRS (GMSK) Power Class  Class 4 (33 dBm) for GSM/E-GSM band  Class 1 (30 dBm) for DCS/PCS band EDGE (8-PSK) Power Class  Class E2 (27 dBm) for GSM/E-GSM band  Class E2 (26 dBm) for DCS/PCS band Data rate  LTE category 1:  up to 10.3 Mb/s DL, 5.2 Mb/s UL  Data Rate  HSDPA category 8: up to 7.2 Mb/s DL  HSUPA category 6:  up to 5.76 Mb/s UL Data Rate3  GPRS multi-slot class 124, CS1-CS4,  up to 85.6 kb/s DL/UL   EDGE multi-slot class 124, MCS1-MCS9, up to 236.8 kb/s DL/UL  Table 2: TOBY-R2 series LTE, 3G and 2G characteristics summary  TOBY-R2 modules provide Voice over LTE (VoLTE) as well as Circuit-Switched-Fall-Back (CSFB) audio capability.                                                        1 TOBY-R2 series modules support all the E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [21]. 2 LTE band 12 is a superset that includes band 17 3 GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can be transmitted and received, with higher classes typically allowing faster data transfer rates. 4 GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 10 of 146 1.2 Architecture Figure 1 summarizes the internal architecture of TOBY-R2 series modules.  CellularBase-bandProcessorMemoryPower Management Unit26 MHz32.768 kHzANT1RF TransceiverANT2V_INT (I/O)V_BCKP (RTC)VCC (Supply)SIMUSBGPIOPower OnExternal ResetPAsLNAs FiltersFiltersDuplexerFiltersPAsLNAs FiltersFiltersDuplexerFiltersLNAs FiltersFiltersLNAs FiltersFiltersSwitchSwitchDDC(I2C)SDIOUARTDigital audio (I2S)ANT_DETHost Select Figure 1: TOBY-R2 series modules simplified block diagram TOBY-R2 series modules internally consists of the RF, Baseband and Power Management sections here described with more details than the simplified block diagrams of Figure 1.  RF section The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches. Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch. Dual  receiving  paths  are  implemented  according  to  LTE  Receiver  Diversity  radio  technology  supported  by  the modules as LTE  category  1 User Equipments: incoming signal is received  through the  primary (ANT1) and the secondary  (ANT2)  antenna  input ports which  are connected  to the  RF  transceiver via  specific antenna  switch, diplexer, duplexer, LNA, SAW band pass filters.   RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and demodulation of the dual RF signals for Rx. The RF transceiver contains: Single chain high linearity receivers with integrated LNAs for multi band multi mode operation, Highly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM,  RF synthesizer, VCO.  Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver   RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path  SAW duplexers and band pass filters separate the Tx and Rx signal paths and provide RF filtering  26  MHz  voltage-controlled  temperature-controlled  crystal  oscillator  generates  the  clock  reference  in active-mode or connected-mode.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 11 of 146 Baseband and power management section The Baseband and Power Management section is composed of the following main elements:  A mixed signal ASIC, which integrates Microprocessor for control functions DSP core for cellular Layer 1 and digital processing of Rx and Tx signal paths Memory interface controller Dedicated peripheral blocks for control of the USB, SIM and generic digital interfaces Interfaces to RF transceiver ASIC  Memory system, which includes NAND flash and LPDDR2 RAM  Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC  Voltage sources for external use: V_BCKP and V_INT   Hardware power on   Hardware reset  Low power idle-mode support  32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by enable power saving configuration using the AT+UPSV command.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 12 of 146 1.3 Pin-out Table 3 lists the pin-out of the TOBY-R2 series modules, with pins grouped by function.  Function Pin Name Pin No I/O Description Remarks Power VCC 70,71,72 I Module supply input VCC supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description / requirements. See section 2.2.1 for external circuit design-in.  GND 2, 30, 32, 44, 46, 69, 73, 74, 76, 78, 79, 80, 82, 83, 85, 86, 88-90, 92-152 N/A Ground GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.2.1 for external circuit design-in.  V_BCKP 3 I/O RTC supply input/output V_BCKP = 1.8 V (typical) generated by internal regulator when valid VCC supply is present. See section 1.5.2 for functional description. See section 2.2.2 for external circuit design-in.  V_INT 5 O Generic digital interfaces supply output V_INT = 1.8 V (typical) generated by internal DC/DC regulator when the module is switched on. Test-Point for diagnostic access is recommended. See section 1.5.3 for functional description. See section 2.2.3 for external circuit design-in. System PWR_ON 20 I Power-on input Internal 10 k pull-up resistor to V_BCKP. See section 1.6.1 for functional description. See section 2.3.1 for external circuit design-in.  RESET_N 23 I External reset input Internal 10 k pull-up resistor to V_BCKP. Test-Point for diagnostic access is recommended. See section 1.6.3 for functional description. See section 2.3.2 for external circuit design-in.  HOST_SELECT0 26 I/O Selection of module / host configuration Not supported. See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in.  HOST_SELECT1 62 I/O Selection of module / host configuration Not supported. See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in. Antennas ANT1  81 I/O Primary antenna Main Tx / Rx antenna interface. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements. See section 2.4 for external circuit design-in.  ANT2 87 I Secondary antenna Rx only for Rx diversity. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements  See section 2.4 for external circuit design-in.  ANT_DET 75 I Antenna detection ADC for antenna presence detection function  See section 1.7.2 for functional description. See section 2.4.2 for external circuit design-in.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 13 of 146 Function Pin Name Pin No I/O Description Remarks SIM VSIM 59 O SIM supply output VSIM = 1.8 V / 3 V output as per the connected SIM type. See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_IO 57 I/O SIM data Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to VSIM. See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_CLK 56 O SIM clock 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_RST 58 O SIM reset Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description.  See section 2.5 for external circuit design-in. UART RXD 17 O UART data output 1.8 V output, Circuit 104 (RXD) in ITU-T V.24,  for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. Test-Point and series 0  for diagnostic access recommended. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  TXD 16 I UART data input 1.8 V input, Circuit 103 (TXD) in ITU-T V.24,  for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. Internal active pull-up to V_INT. Test-Point and series 0  for diagnostic access recommended. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  CTS 15 O UART clear to send output 1.8 V output, Circuit 106 (CTS) in ITU-T V.24. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  RTS 14 I UART ready to send input 1.8 V input, Circuit 105 (RTS) in ITU-T V.24. Internal active pull-up to V_INT. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  DSR 10 O  UART data set ready output  1.8 V, Circuit 107 in ITU-T V.24. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  RI 11 O  UART ring indicator output  1.8 V, Circuit 125 in ITU-T V.24. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  DTR 13 I  UART data terminal ready input  1.8 V, Circuit 108/2 in ITU-T V.24. Internal active pull-up to V_INT. Test-Point and series 0  for diagnostic access recommended. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  DCD 12 O  UART data carrier detect output  1.8 V, Circuit 109 in ITU-T V.24. Test-Point and series 0  for diagnostic access recommended. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 14 of 146 Function Pin Name Pin No I/O Description Remarks USB VUSB_DET 4 I USB detect input  VBUS (5 V typical) USB supply generated by the host must be connected to this input pin to enable the USB interface. If the USB interface is not used by the Application Processor, Test-Point for diagnostic / FW update access is recommended  See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  USB_D- 27 I/O USB Data Line D- USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [6] are part of the USB pin driver and need not be provided externally. If the USB interface is not used by the Application Processor, Test-Point for diagnostic / FW update access is recommended. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  USB_D+ 28 I/O USB Data Line D+ USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [6] are part of the USB pin driver and need not be provided externally. If the USB interface is not used by the Application Processor, Test-Point for diagnostic / FW update access is recommended. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in. DDC SCL 54 O I2C bus clock line 1.8 V open drain, for communication with I2C-slave devices. See section 1.9.3 for functional description.  See section 2.6.3 for external circuit design-in.  SDA 55 I/O I2C bus data line 1.8 V open drain, for communication with I2C-slave devices. See section 1.9.3 for functional description.  See section 2.6.3 for external circuit design-in. SDIO SDIO_D0 66 I/O SDIO serial data [0] Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D1 68 I/O SDIO serial data [1] Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D2 63 I/O SDIO serial data [2] Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D3 67 I/O SDIO serial data [3] Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_CLK 64 O SDIO serial clock Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_CMD 65 I/O SDIO command Not supported by “02” product versions. SDIO interface for communication with u-blox Wi-Fi module See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 15 of 146 Function Pin Name Pin No I/O Description Remarks Audio I2S_TXD 51 O / I/O I2S transmit data / GPIO I2S transmit data output, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_RXD 53 I / I/O I2S receive data / GPIO I2S receive data input, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_CLK 52 I/O / I/O I2S clock / GPIO I2S serial clock, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_WA 50 I/O / I/O I2S word alignment / GPIO I2S word alignment, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in. GPIO GPIO1 21 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO2 22 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO3 24 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO4 25 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO5 60 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO6 61 I/O GPIO 1.8 V GPIO with alternatively configurable functions. See section 1.11 for functional description. See section 2.8 for external circuit design-in. Reserved RSVD 6 N/A Reserved pin This pin must be connected to ground. See sections 1.12 and 2.9  RSVD 18, 19 N/A Reserved pin Test-Point for diagnostic access is recommended. See sections 1.12 and 2.9  RSVD 1, 7-9, 29, 31, 33-43, 45, 47-49, 77, 84, 91 N/A Reserved pin Leave unconnected. See sections 1.12 and 2.9 Table 3: TOBY-R2 series module pin definition, grouped by function
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 16 of 146 1.4 Operating modes TOBY-R2  series  modules  have  several  operating  modes.  The  operating  modes  are  defined  in  Table  4  and described in detail in Table 5, providing general guidelines for operation.  General Status Operating Mode Definition Power-down Not-Powered Mode VCC supply not present or below operating range: module is switched off.  Power-Off Mode VCC supply within operating range and module is switched off. Normal Operation Idle-Mode  Module processor core runs with 32 kHz reference generated by the internal oscillator.  Active-Mode Module processor core runs with 26 MHz reference generated by the internal oscillator.  Connected-Mode RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference. Table 4: TOBY-R2 series modules operating modes definition  Mode Description Transition between operating modes Not-Powered  Module is switched off. Application interfaces are not accessible. When VCC supply is removed, the modules enter not-powered mode. When in not-powered mode, the modules cannot be switched on by PWR_ON, RESET_N or RTC alarm  When in not-powered mode, the modules can be switched on by applying VCC supply (see 1.6.1) so that the modules switch from not-powered to active-mode Power-Off  Module is switched off: normal shutdown by an appropriate power-off event (see 1.6.2). Application interfaces are not accessible. When the modules are switched off by an appropriate power-off event (see 1.6.2), the modules enter power-off mode from active-mode. When in power-off mode, the modules can be switched on by PWR_ON, RESET_N or an RTC alarm. When in power-off mode, the modules enter not-powered mode by removing VCC supply. Idle Module is switched on with application interfaces temporarily disabled or suspended: the module is temporarily not ready to communicate with an external device by means of the application interfaces as configured to reduce the current consumption. The module enters the low power idle-mode whenever possible if power saving is enabled by AT+UPSV (see u-blox AT Commands Manual [2]) reducing current consumption (see 1.5.1.5). The CTS output line indicates when the UART interface is disabled/enabled due to the module idle/active-mode according to power saving and HW flow control settings (see 1.9.1.3, 1.9.1.4). Power saving configuration is not enabled by default: it can be enabled by AT+UPSV (see the u-blox AT Commands Manual [2]). The modules automatically switch from the active-mode to low power idle-mode whenever possible if power saving is enabled (see sections 1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [2], AT+UPSV command). The modules wake up from low power idle-mode to active-mode in the following events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see 1.5.1.5, 1.9.1.4)  Automatic periodic enable of the UART interface to receive / send data, with AT+UPSV=1 (see 1.9.1.4)   Data received over UART, according to HW flow control (AT&K) and power saving (AT+UPSV) settings (see 1.9.1.4)   RTS input set ON by the host DTE, with HW flow control disabled and AT+UPSV=2 (see 1.9.1.4)   DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.1.4)   USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.2)  The connected USB host forces a remote wakeup of the module as USB device (see 1.9.2.4)  The connected u-blox GNSS receiver forces a wakeup of the cellular module using the GNSS Tx data ready function over GPIO3 (see 1.9.3)  The connected SDIO device forces a wakeup of the module as SDIO host (see 1.9.4)  A preset RTC alarm occurs (see u-blox AT Commands Manual [2], AT+CALA)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 17 of 146 Mode Description Transition between operating modes Active Module is switched on with application interfaces enabled or not suspended: the module is ready to communicate with an external device by means of the application interfaces unless power saving configuration is enabled by AT+UPSV (see 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [2]). When the modules are switched on by an appropriate power-on event (see 1.6.1), the module enter active-mode from not-powered or power-off mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from active to idle-mode whenever possible and the module wakes up from idle to active-mode in the events listed above (see idle-mode to active-mode transition description above). When a RF Tx/Rx data or voice connection is initiated or when RF Tx/Rx is required due to a connection previously initiated, the module switches from active to connected-mode. Connected RF Tx/Rx data connection is in progress. The module is prepared to accept data signals from an external device unless power saving configuration is enabled by AT+UPSV (see sections 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [2]). When a data or voice connection is initiated, the module enters connected-mode from active-mode. Connected-mode is suspended if Tx/Rx data is not in progress, due to connected discontinuous reception and fast dormancy capabilities of the module and according to network environment settings and scenario. In such case, the module automatically switches from connected to active mode and then, if power saving configuration is enabled by the AT+UPSV command, the module automatically switches to idle-mode whenever possible. Vice-versa, the module wakes up from idle to active mode and then connected mode if RF Tx/Rx is necessary. When a data connection is terminated, the module returns to the active-mode. Table 5: TOBY-R2 series modules operating modes description  Figure 2 describes the transition between the different operating modes.  Switch ON:•Apply VCCIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationNo RF Tx/Rx in progress, Call terminated, Communication droppedRemove VCCSwitch ON:•PWR_ON•RTC alarm•RESET_N Not poweredPower offActiveConnected IdleSwitch OFF:•AT+CPWROFF Figure 2: TOBY-R2 series modules operating modes transitions
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 18 of 146 1.5 Supply interfaces 1.5.1 Module supply input (VCC) The modules must be supplied via the three VCC pins that represent the module power supply input. The VCC pins are internally connected to the RF power amplifier and to the integrated Power Management Unit: all supply voltages needed by the module are generated from the VCC supply by integrated voltage regulators, including V_BCKP Real Time Clock supply, V_INT digital interfaces supply and VSIM SIM card supply. During operation, the current drawn by the TOBY-R2 series modules through the VCC pins can vary by several orders  of  magnitude.  This  ranges  from  the  pulse  of  current  consumption  during  GSM  transmitting  bursts  at maximum  power  level  in  connected-mode  (as  described  in  section  1.5.1.2)  to  the  low  current  consumption during low power idle-mode with power saving enabled (as described in section 1.5.1.5). TOBY-R200 modules provide separate supply inputs over the three VCC pins:  VCC pins #71 and #72 represent the supply input for the internal RF power amplifier, demanding most of the total current drawn of the module when RF transmission is enabled during a voice/data call  VCC pin #70 represents the supply input for the internal baseband Power Management Unit and the internal transceiver,  demanding  minor  part  of  the  total  current  drawn  of  the  module  when  RF  transmission  is enabled during a voice/data call  Figure 3 provides a simplified block diagram of TOBY-R2 series modules internal VCC supply routing.  72VCC71VCC70VCCTOBY-R201 / TOBY-R202Power ManagementUnitMemoryBaseband ProcessorTransceiverRF PMULTE/3G PAs72VCC71VCC70VCCTOBY-R200Power ManagementUnitMemoryBaseband ProcessorTransceiverRF PMULTE/3G/2G PAs Figure 3: TOBY-R2 series modules internal VCC supply routing simplified block diagram
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 19 of 146 1.5.1.1 VCC supply requirements Table 6 summarizes the requirements for the VCC modules supply. See section 2.2.1 for suggestions to properly design a VCC supply circuit compliant with the requirements listed in Table 6.   The supply circuit affects  the  RF compliance of the device integrating  TOBY-R2 series  modules with applicable required  certification schemes as  well  as antenna circuit design. Compliance  is guaranteed if the requirements summarized in the Table 6 are fulfilled.  Item Requirement Remark VCC nominal voltage Within VCC normal operating range: 3.30 V min. / 4.40 V max  RF  performance  is  guaranteed  when  VCC  PA  voltage  is inside the normal operating range limits. RF performance may be affected when VCC PA voltage is outside  the  normal  operating  range  limits,  though  the module  is  still  fully  functional  until  the  VCC  voltage  is inside the extended operating range limits. VCC voltage during normal operation Within VCC extended operating range: 3.00 V min. / 4.50 V max  VCC voltage must be above the extended operating range minimum limit to switch-on the module.  The module  may switch-off  when the  VCC  voltage  drops below the extended operating range minimum limit. Operation  above  VCC  extended  operating  range  is  not recommended and may affect device reliability. VCC average current Support with adequate margin the highest averaged VCC current consumption value in connected-mode conditions specified in TOBY-R2 Data Sheet [1]. The maximum average current consumption can be greater than the specified value according to the actual antenna mismatching, temperature and supply voltage. Sections 1.5.1.2, 1.5.1.3 and 1.5.1.4 describe current consumption profiles in 2G, 3G and LTE connected-mode. VCC peak current Support with margin the highest peak VCC current consumption value in connected-mode conditions specified in TOBY-R2 Data Sheet [1] The specified maximum peak of current consumption occurs during GSM single transmit slot in 850/900 MHz connected-mode, in case of mismatched antenna. Section 1.5.1.2 describes 2G Tx peak/pulse current. VCC voltage drop during 2G Tx slots Lower than 400 mV Supply voltage drop values greater than recommended during 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage drop during 2G Tx slots. VCC voltage ripple during 2G/3G/LTE Tx Noise in the supply has to be minimized  High supply voltage ripple values during LTE/3G/2G RF transmissions in connected-mode directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage ripple during RF Tx. VCC under/over-shoot at start/end of Tx slots Absent or at least minimized Supply voltage under-shoot or over-shoot at the start or the end of 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage under/over-shoot  Table 6: Summary of VCC modules supply requirements
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 20 of 146 1.5.1.2 VCC current consumption in 2G connected-mode When  a  GSM  call  is  established,  the  VCC  module  current  consumption  is  determined  by  the  current consumption profile typical of the GSM transmitting and receiving bursts. The peak of current consumption during a transmission slot is strictly dependent on the  RF transmitted power, which is regulated by the network (the current base station). The transmitted power in the transmit slot is also the more relevant factor for determining the average current consumption. If the module is transmitting in 2G single-slot mode in the 850 or 900 MHz bands, at the maximum RF power level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach an high peak (see the “Current consumption” section in the TOBY-R2 series Data Sheet [1]) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is transmitting in 2G single-slot mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications. During a GSM call, current consumption is not so significantly high in receiving or in monitor bursts and is low in the inactive unused bursts. Figure 4 shows an example of the module current consumption profile versus time in 2G single-slot mode.  Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200 mA60-120 mA1900 mAPeak current depends on TX power and actual antenna loadGSM frame             4.615 ms                                       (1 frame = 8 slots)60-120 mA10-40 mA0.01.51.00.52.02.5 Figure 4: VCC current consumption profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot) Figure  5 illustrates  VCC  voltage  profile versus  time  during a  2G  single-slot  call,  according  to the  relative  VCC current consumption profile described in Figure 4.  Time [ms]undershootovershootrippledropVoltage [mV]3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 5: VCC voltage profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 21 of 146 When a GPRS connection is established, more than one slot can be used to transmit and/or more than one slot can  be  used  to  receive.  The  transmitted  power  depends  on  network  conditions,  which  set  the  peak  current consumption, but following the 3GPP specifications the maximum Tx RF power is reduced if more than one slot is used to transmit, so the maximum peak of current is not as high as can be in case of a 2G single-slot call. The multi-slot transmission power can be further reduced by configuring the actual Multi-Slot Power Reduction profile with the dedicated AT command, AT+UDCONF=40 (see the u-blox AT Commands Manual [2]). If the module transmits in GPRS class 12 in the 850 or 900 MHz bands, at the maximum RF power control level, the current consumption can reach a quite high peak but lower than the one achievable in 2G single-slot mode. This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/2 duty cycle, according to 2G TDMA.  If the module is in GPRS connected mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications.  Figure  6 reports  the  current  consumption  profiles  in  GPRS class  12 connected  mode,  in  the 850  or  900  MHz bands, with 4 slots used to transmit and 1 slot used to receive.   Time [ms]RX   slotunused slotTX              slotTX   slotTX           slotTX                        slotMON       slotunused slotRX  slotunused slotTX                              slotTX   slotTX             slotTX                                slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200mA60-130mAPeak current depends on TX power and actual antenna loadGSM frame             4.615 ms                                       (1 frame = 8 slots)1600 mA0.01.51.00.52.02.5 Figure 6: VCC current consumption profile during a 2G GPRS/EDGE multi-slot connection (4 TX slots, 1 RX slot)  In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 6, representing the current consumption profile in GPRS class 12 connected mode, is valid for the EDGE class 12 connected mode as well.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 22 of 146 1.5.1.3 VCC current consumption in 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends on output RF power, which is always regulated by the network (the current base  station)  sending  power  control  commands  to  the  module.  These  power  control  commands  are  logically divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of 1.5 kHz. There  are  no  high  current  peaks  as  in  the  2G  connection,  since  transmission  and  reception  are  continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the 2G case. In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum  output  power (approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is  considerable (see  the  “Current  consumption”  section  in  TOBY-R2  series Data  Sheet [1]).  At  the  lowest  output  RF  power (approximately 0.01 µW or –50 dBm), the current drawn by the internal power amplifier is strongly reduced. The total current drawn by the module at the VCC pins is due to baseband processing and transceiver activity.  Figure 7 shows an example of current consumption profile of the module in 3G WCDMA/DC-HSPA+ continuous transmission mode.  Time [ms]3G frame  10 ms                                       (1 frame = 15 slots)Current [mA]Current consumption value depends on TX power and actual antenna load170 mA1 slot  666 µs850 mA0300200100500400600700 Figure 7: VCC current consumption profile versus time during a 3G connection (TX and RX continuously enabled)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 23 of 146 1.5.1.4 VCC current consumption in LTE connected-mode During  an  LTE  connection,  the  module  can  transmit  and  receive  continuously  due  to  the  Frequency  Division Duplex (FDD) mode of operation used in LTE radio access technology. The current consumption depends on output RF power, which is always regulated  by the network (the current base  station)  sending  power  control  commands  to  the  module.  These  power  control  commands  are  logically divided into a slot of 0.5 ms (time length of one Resource Block), thus the rate of power change can reach a maximum rate of 2 kHz. The  current  consumption  profile  is  similar  to  that  in  3G  radio  access  technology.  Unlike  the  2G  connection mode,  which  uses  the  TDMA  mode  of  operation,  there  are  no  high  current  peaks  since  transmission  and reception are continuously enabled in FDD. In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum  output  power (approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is considerable (see  the  “Current  consumption”  section  in  TOBY-R2  series Data  Sheet [1]).  At  the  lowest  output  RF  power (approximately 0.1 µW or –40 dBm), the current drawn by the internal power amplifier is strongly reduced and the total current drawn by the module at the VCC pins is due to baseband processing and transceiver activity.  Figure  8  shows  an  example  of  the  module  current  consumption  profile  versus  time  in  LTE  connected-mode. Detailed current consumption values can be found in TOBY-R2 series Data Sheet [1].  Time [ms]Current [mA]Current consumption value depends on TX power and actual antenna load1 Slot1 Resource Block (0.5 ms) 1 LTE Radio Frame (10 ms)0300200100500400600700 Figure 8: VCC current consumption profile versus time during LTE connection (TX and RX continuously enabled)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 24 of 146 1.5.1.5 VCC current consumption in cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (see the u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During low power idle-mode, the module processor runs with 32 kHz reference clock frequency. When  the  power  saving  configuration  is  enabled  and  the module  is  registered  or  attached  to a  network,  the module automatically enters the low  power idle-mode whenever possible, but it must periodically  monitor the paging  channel  of  the  current  base  station  (paging  block  reception),  in  accordance  to  the  2G/3G/LTE  system requirements, even if connected-mode is not enabled by the application. When the module monitors the paging channel,  it  wakes  up  to  the  active-mode,  to  enable  the  reception  of  paging  block.  In  between,  the  module switches to low power idle-mode. This is known as discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The  time  period  between  two  paging  block  receptions  is  defined  by  the  network.  This  is  the  paging  period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell:  In case of 2G radio access technology, the paging period can vary from 470.8 ms (DRX = 2, length of 2 x 51 2G frames = 2 x 51 x 4.615 ms) up to 2118.4 ms (DRX = 9, length of 9 x 51 2G frames = 9 x 51 x 4.615 ms)  In case of 3G radio access technology, the paging period can vary from 640 ms (DRX = 6, i.e. length of 26 3G frames = 64 x 10 ms) up to 5120 ms (DRX = 9, length of 29 3G frames = 512 x 10 ms).  In case of LTE radio access technology, the paging period can vary from 320 ms (DRX = 5, i.e. length of 25 LTE frames = 32 x 10 ms) up to 2560 ms (DRX = 8, length of 28 LTE frames = 256 x 10 ms). Figure 9 illustrates a typical example of the module current consumption profile when power saving is enabled. The module is registered with network, automatically enters the low power idle-mode and periodically wakes up to  active-mode  to  monitor  the  paging  channel  for  the  paging  block  reception.  Detailed  current  consumption values can be found in TOBY-R2 series Data Sheet [1].  ~50 msIDLE MODE ACTIVE MODE IDLE MODEActive Mode EnabledIdle Mode Enabled2G case: 0.44-2.09 s    3G case: 0.61-5.09 s LTE case: 0.27-2.51 sIDLE MODE~50 msACTIVE MODETime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 Figure 9: VCC current consumption profile with power saving enabled and module registered with the network: the module is in low-power idle-mode and periodically wakes up to active-mode to monitor the paging channel for paging block reception
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 25 of 146 1.5.1.6 VCC current consumption in fixed active-mode (power saving disabled) When power  saving  is disabled, the  module does not  automatically enter  the low power  idle-mode whenever possible: the  module  remains in active-mode. Power saving configuration is by default  disabled.  It  can  also be disabled using the AT+UPSV command (see u-blox AT Commands Manual [2] for detail usage). The module processor core is activated during idle-mode, and the 26 MHz reference clock frequency is used. It would draw more current during the paging period than that in the power saving mode. Figure 10 illustrates a typical example of the module current consumption profile when power saving is disabled. In  such  case,  the  module  is  registered  with  the  network  and  while  active-mode  is  maintained,  the  receiver  is periodically activated to monitor the paging channel for paging block reception. Detailed current consumption values can be found in TOBY-R2 series Data Sheet [1].  ACTIVE MODE2G case: 0.44-2.09 s    3G case: 0.61-5.09 sLTE case: 0.32-2.56 sPaging periodTime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 Figure 10: VCC current consumption profile with power saving disabled and module registered with the network: active-mode is always held and the receiver is periodically activated to monitor the paging channel for paging block reception
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 26 of 146 1.5.2 RTC supply input/output (V_BCKP)  The V_BCKP pin  of  TOBY-R2 series  modules connects  the supply for the Real Time  Clock  (RTC). A linear LDO regulator integrated in the Power Management Unit internally generates this supply, as shown in Figure 11, with low current  capability (see  the  TOBY-R2 series Data  Sheet  [1]).  The output  of  this  regulator  is always  enabled when the main module voltage supply applied to the VCC pins is within the valid operating range.  Baseband Processor70VCC71VCC72VCC3V_BCKPLinear LDOPower ManagementTOBY-R2 series32 kHzRTC Figure 11: TOBY-R2 series RTC supply (V_BCKP) simplified block diagram The RTC provides the module time reference (date and time) that is used to set the wake-up interval during the low power idle-mode periods, and is able to make available the programmable alarm functions. The RTC functions are available also in power-down  mode when the  V_BCKP voltage  is within its valid range (specified in the “Input characteristics of Supply/Power pins” table in  TOBY-R2 series Data Sheet [1]). The RTC can be supplied from an external back-up battery through the V_BCKP, when the main module voltage supply is not applied to the VCC pins. This lets the time reference (date and time) run until the V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. Consider  that  the  module  cannot  switch  on  if  a  valid  voltage  is  not  present  on  VCC  even  when  the  RTC  is supplied through V_BCKP (meaning that VCC is mandatory to switch on the module). The RTC has very low current consumption, but is highly temperature dependent. For example, V_BCKP current consumption at the maximum operating temperature can be higher than the typical value at 25 °C specified in the “Input characteristics of Supply/Power pins” table in the TOBY-R2 series Data Sheet [1]. If V_BCKP is left unconnected and the module main supply is not applied to the VCC pins, the RTC is supplied from  the  bypass  capacitor  mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range. This has no impact on cellular connectivity, as all the module functionalities do not rely on date and time setting.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 27 of 146 1.5.3 Generic digital interfaces supply output (V_INT)  The  V_INT  output  pin  of  the  TOBY-R2  series  modules  is  connected  to  an  internal  1.8  V  supply  with  current capability specified in the TOBY-R2 series Data Sheet [1]. This supply is internally generated by a switching step-down regulator integrated in the Power Management Unit and it is internally used to source the generic digital I/O interfaces of the cellular module, as described in Figure 12. The output of this regulator is enabled when the module is switched on and it is disabled when the module is switched off.  Baseband Processor70VCC71VCC72VCC5V_INTSwitchingStep-DownPower ManagementTOBY-R2 seriesDigital I/O Figure 12: TOBY-R2 series generic digital interfaces supply output (V_INT) simplified block diagram The switching regulator operates in Pulse Width Modulation (PWM)  mode for greater efficiency at high output loads and it automatically switches to Pulse Frequency Modulation (PFM) power save mode for greater efficiency at low output loads. The V_INT output voltage ripple is specified in the TOBY-R2 series Data Sheet [1].
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 28 of 146 1.6 System function interfaces 1.6.1 Module power-on When the TOBY-R2 series modules are in the not-powered mode (switched off, i.e. the VCC module supply is not applied), they can be switched on as following:  Rising  edge  on  the  VCC  supply  input  to  a  valid  voltage  for module  supply,  starting  from  a  voltage  value lower  than  2.25  V,  so  that  the  module  switches  on  applying  a  proper  VCC  supply  within  the  normal operating range.  Alternately, the RESET_N pin can be held to the low level during the VCC rising edge, so that the module switches on releasing the RESET_N pin when the VCC module supply voltage stabilizes at its proper nominal value within the normal operating range. The status of the PWR_ON input pin of TOBY-R2 series modules while applying the VCC module supply is not relevant: during this phase the PWR_ON pin can be set high or low by the external circuit.  When the TOBY-R2 series modules are in the power-off mode (i.e. switched off with valid VCC module supply applied), they can be switched on as following:  Low pulse on the PWR_ON pin, which is normally set high by an internal pull-up, for a valid time period.  Rising edge on the RESET_N pin, i.e. releasing the pin from the low level, as that the pin is normally set high by an internal pull-up.  RTC alarm, i.e. pre-programmed alarm by AT+CALA command (see u-blox AT Commands Manual [2]).  As described in Figure 13, the TOBY-R2 series PWR_ON input is equipped with an internal active pull-up resistor to  the  V_BCKP  supply:  the  PWR_ON  input  voltage  thresholds  are  different  from  the  other  generic  digital interfaces. Detailed electrical characteristics are described in TOBY-R2 series Data Sheet [1].  Baseband Processor20PWR_ONTOBY-R2 series3V_BCKPPower-onPower ManagementPower-on10k Figure 13: TOBY-R2 series PWR_ON input description
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 29 of 146 Figure 14 shows the module power-on sequence from the not-powered mode, describing the following phases:  The external supply is applied to the VCC module supply inputs, representing the start-up event.  The V_BCKP RTC supply output is suddenly enabled by the module as VCC reaches a valid voltage value.  The PWR_ON and the RESET_N pins suddenly rise to high logic level due to internal pull-ups.  All the generic digital pins of the module are tri-stated until the switch-on of their supply source (V_INT).  The internal reset signal is held low: the baseband core and all the digital pins are held in the reset state. The reset state of all the digital pins is reported in the pin description table of TOBY-R2 series Data Sheet [1].  When the internal reset signal is released, any digital pin is set in a proper sequence from the reset state to the default operational configured state. The duration of this pins’ configuration phase differs within generic digital interfaces and the USB interface due to host / device enumeration timings (see section 1.9.2).  The module is fully ready to operate after all interfaces are configured.   VCC V_BCKPPWR_ONRESET_NV_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFONStart of interface configurationModule interfaces are configuredStart-up event Figure 14: TOBY-R2 series power-on sequence description The greeting text can be activated by means of +CSGT AT command (see u-blox AT Commands Manual [2]) to notify the external application that the module is ready to operate (i.e. ready to reply to AT commands) and the first AT command can be sent to the module, given that autobauding has to be disabled on the UART to let the module  sending  the  greeting  text:  the  UART  has  to  be  configured  at  fixed  baud  rate  (the  baud  rate  of  the application processor) instead of the default autobauding, otherwise the module does not know the baud rate to be used for sending the greeting text (or any other URC) at the end of the internal boot sequence.   The Internal Reset signal is not available on a module pin, but the host application can monitor the V_INT pin to sense the start of the TOBY-R2 series module power-on sequence.  Before  the  switch-on  of  the  generic  digital  interface  supply  source  (V_INT)  of  the  module,  no  voltage driven by an external application should be applied to any generic digital interface of the module.  Before  the  TOBY-R2  series  module  is  fully  ready  to  operate,  the  host  application  processor  should  not send any AT command over the AT communication interfaces (USB, UART) of the module.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 30 of 146 1.6.2 Module power-off TOBY-R2 series can be properly switched off by:  AT+CPWROFF command (see u-blox AT Commands Manual [2]). The current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.  An  abrupt  under-voltage  shutdown  occurs  on  TOBY-R2  series  modules  when  the  VCC  module  supply  is removed. If this occurs, it is not possible to perform the storing of the current parameter settings in the module’s non-volatile memory or to perform the proper network detach.   It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY-R2 series modules normal operations: the power off procedure must be started by the AT+CPWROFF command, waiting the command response for a proper time period (see  u-blox AT Commands Manual [2]), and then a proper VCC  supply  has  to  be  held  at  least  until  the  end  of  the  modules’  internal  power  off  sequence,  which occurs when the generic digital interfaces supply output (V_INT) is switched off by the module.  An abrupt hardware shutdown occurs on TOBY-R2 series modules when a low level is applied on RESET_N pin. In  this  case,  the  current  parameter  settings are  not  saved  in the  module’s  non-volatile  memory  and  a  proper network detach is not performed.   It is highly recommended to avoid an abrupt hardware shutdown of the module by forcing a low level on the RESET_N input pin during module normal operation: the RESET_N line should be set low only if reset or shutdown via AT commands fails or if the module does not reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [2].  An  over-temperature  or  an  under-temperature  shutdown  occurs  on  TOBY-R2  series  modules  when  the temperature  measured  within  the  cellular  module  reaches  the  dangerous  area,  if  the  optional  Smart Temperature Supervisor feature is enabled and configured by the dedicated AT command. For more details  see section 1.13.15 and u-blox AT Commands Manual [2], +USTS AT command.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 31 of 146 Figure 15 describes the TOBY-R2 power-off sequence by means of AT+CPWROFF with the following phases:  When the +CPWROFF AT command is sent, the module starts the switch-off routine.  The module replies OK on the AT interface: the switch-off routine is in progress.   At the end of the switch-off routine, all the digital pins are tri-stated and all the internal voltage regulators are turned off, including the generic digital interfaces supply (V_INT), except the RTC supply (V_BCKP).  Then, the module remains in power-off mode as long as a switch on event does not occur (e.g. applying a proper low level to the PWR_ON input, or applying a proper low level to the RESET_N input), and enters not-powered mode if the supply is removed from the VCC pins.  VCC V_BCKPPWR_ONRESET_N V_INTInternal ResetSystem StateBB Pads State OperationalOFFTristate / FloatingONOperational → TristateAT+CPWROFFsent to the module0 s~2.5 s~5 sOKreplied by the moduleVCC                can be removed Figure 15: TOBY-R2 series power-off sequence description  The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the end of the power-off sequence.  The duration of each phase in the TOBY-R2 series modules’ switch-off routines can largely vary depending on the application / network settings and the concurrent module activities.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 32 of 146 1.6.3 Module reset TOBY-R2 series modules can be properly reset (rebooted) by:  AT+CFUN command (see u-blox AT Commands Manual [2]). In  the  case  listed  above  an  “internal”  or  “software”  reset  of  the  module  is  executed:  the  current  parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.  An abrupt hardware reset occurs on TOBY-R2 series modules when a low level is applied on RESET_N input pin. In  this  case,  the  current  parameter  settings  are  not  saved  in  the  module’s  non-volatile  memory  and  a  proper network detach is not performed.   It is highly recommended to avoid an abrupt hardware reset of the module by forcing a low level on the RESET_N  input during  modules  normal operation:  the  RESET_N  line  should  be  set  low  only if  reset or shutdown  via  AT commands  fails  or if  the  module  does not  provide a  reply  to a  specific  AT command after a time period longer than the one defined in the u-blox AT Commands Manual [2].  As described in Figure 16, the RESET_N input pins are equipped with an internal pull-up to the V_BCKP supply.  Baseband Processor23RESET_NTOBY-R2 series3V_BCKPResetPower ManagementReset10k Figure 16: TOBY-R2 series RESET_N input equivalent circuit description  For more electrical characteristics details see TOBY-R2 series Data Sheet [1].   1.6.4 Module / host configuration selection  Selection of module / host configuration over HOST_SELECT0 and HOST_SELECT1 pins is not supported.  TOBY-R2 series modules include two pins (HOST_SELECT0, HOST_SELECT1) for the selection of the module / host application processor configuration.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 33 of 146 1.7 Antenna interface 1.7.1 Antenna RF interfaces (ANT1 / ANT2) TOBY-R2 series modules provide two RF interfaces for connecting the external antennas:  The ANT1 represents the primary RF input/output for transmission and reception of LTE/3G/2G RF signals.  The ANT1 pin has a nominal characteristic impedance of 50  and must be connected to the primary Tx / Rx antenna through a 50  transmission line to allow proper RF transmission and reception.  The ANT2 represents the secondary RF input for the reception of the LTE RF signals for the Down-Link Rx diversity radio technology supported by TOBY-R2 series modules as required feature for LTE category 1 UEs.  The ANT2 pin has a nominal characteristic impedance of 50  and must be connected to the secondary Rx antenna through a 50  transmission line to allow proper RF reception.  1.7.1.1 Antenna RF interfaces requirements Table 7, Table  8  and  Table 9 summarize the requirements  for  the antennas RF interfaces (ANT1 / ANT2). See section 2.4.1 for suggestions to properly design antennas circuits compliant with these requirements.   The antenna circuits affect the RF compliance of the device integrating TOBY-R2 series modules with  applicable  required  certification  schemes  (for  more  details  see  section  4).  Compliance  is guaranteed  if  the  antenna  RF  interfaces  (ANT1  /  ANT2)  requirements  summarized  in  Table  7, Table 8 and Table 9 are fulfilled.  Item Requirements Remarks Impedance  50  nominal characteristic impedance The impedance of the antenna RF connection must match the 50  impedance of the ANT1 port. Frequency Range See the TOBY-R2 series Data Sheet [1]  The required frequency range of the antenna connected to ANT1 port depends on the operating bands of the used cellular module and the used mobile network. Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the antenna RF connection matches the 50  characteristic impedance of the ANT1 port. The impedance of the antenna termination must match as much as possible the 50  nominal impedance of the ANT1 port over the operating frequency range, reducing as much as possible the amount of reflected power. Efficiency > -1.5 dB ( > 70% ) recommended > -3.0 dB ( > 50% ) acceptable The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT1 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as Total Radiated Power (TRP) and the Total Isotropic Sensitivity (TIS), specified by applicable related certification schemes. Maximum Gain  According to radiation exposure limits The power gain of an antenna is the radiation efficiency multiplied by the directivity: the gain describes how much power is transmitted in the direction of peak radiation to that of an isotropic source.  The maximum gain of the antenna connected to ANT1 port must not exceed the herein stated value to comply with regulatory agencies radiation exposure limits. For additional info see sections 4.2.2 and/or 4.3.1 Input Power  > 33 dBm ( > 2 W ) The antenna connected to the ANT1 port must support with adequate margin the maximum power transmitted by the modules Table 7: Summary of primary Tx/Rx antenna RF interface (ANT1) requirements
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 34 of 146  Item Requirements Remarks Impedance  50  nominal characteristic impedance The impedance of the antenna RF connection must match the 50  impedance of the ANT2 port. Frequency Range  See the TOBY-R2 series Data Sheet [1]  The required frequency range of the antennas connected to ANT2 port depends on the operating bands of the used cellular module and the used Mobile Network. Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the antenna RF connection matches the 50  characteristic impedance of the ANT2 port. The impedance of the antenna termination must match as much as possible the 50  nominal impedance of the ANT2 port over the operating frequency range, reducing as much as possible the amount of reflected power. Efficiency > -1.5 dB ( > 70% ) recommended > -3.0 dB ( > 50% ) acceptable The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT2 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as the TIS, specified by applicable related certification schemes. Table 8: Summary of secondary Rx antenna RF interface (ANT2) requirements  Item Requirements Remarks Efficiency imbalance  < 0.5 dB recommended < 1.0 dB acceptable The radiation efficiency imbalance is the ratio of the primary (ANT1) antenna efficiency to the secondary (ANT2) antenna efficiency: the efficiency imbalance is a measure of how much better an antenna receives or transmits compared to the other antenna. The radiation efficiency of the secondary antenna needs to be roughly the same of the radiation efficiency of the primary antenna for good RF performance. Envelope Correlation Coefficient  < 0.4 recommended < 0.5 acceptable The Envelope Correlation Coefficient (ECC) between the primary (ANT1) and the secondary (ANT2) antenna is an indicator of 3D radiation pattern similarity between the two antennas: low ECC results from antenna patterns with radiation lobes in different directions. The ECC between primary and secondary antenna needs to be enough low to comply with radiated performance requirements specified by related certification schemes. Isolation  > 15 dB recommended > 10 dB acceptable The antenna to antenna isolation is the loss between the primary (ANT1) and the secondary (ANT2) antenna: high isolation results from low coupled antennas. The isolation between primary and secondary antenna needs to be high for good RF performance. Table 9: Summary of primary (ANT1) and secondary (ANT2) antennas relationship requirements
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 35 of 146 1.7.2 Antenna detection interface (ANT_DET) The  antenna  detection  is  based  on  ADC  measurement.  The  ANT_DET  pin  is  an  Analog  to  Digital  Converter (ADC) provided to sense the antenna presence. The antenna detection function provided by ANT_DET pin is an optional feature that can be implemented if the application  requires  it.  The  antenna  detection  is  forced  by  the  +UANTR  AT  command.  See  the  u-blox  AT Commands Manual [2] for more details on this feature. The ANT_DET pin generates a DC current (for detailed characteristics see the TOBY-R2 series Data Sheet [1]) and measures the resulting DC voltage, thus determining the resistance from the antenna connector provided on the application board to GND. So, the requirements to achieve antenna detection functionality are the following:  an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used  an antenna detection circuit must be implemented on the application board See section 2.4.2 for antenna detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines.  1.8 SIM interface 1.8.1 SIM interface TOBY-R2 series modules provide high-speed SIM/ME interface including automatic detection and configuration of the voltage required by the connected SIM card or chip. Both 1.8 V and 3 V SIM types  are supported. Activation  and  deactivation with automatic  voltage switch from 1.8 V  to  3  V  are  implemented,  according  to  ISO-IEC  7816-3  specifications.  The  VSIM  supply  output  provides internal short circuit protection to limit start-up current and protect the SIM to short circuits. The SIM driver supports the PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM card or chip.  1.8.2 SIM detection interface The GPIO5 pin is by default configured to detect the external SIM card mechanical / physical presence. The pin is configured as input, and it can sense SIM card presence as intended to be properly connected to the mechanical switch of a SIM card holder as described in section 2.5:  Low logic level at GPIO5 input pin is recognized as SIM card not present  High logic level at GPIO5 input pin is recognized as SIM card present The SIM card detection function provided by GPIO5 pin is an optional feature that can be implemented / used or not  according  to  the  application  requirements:  an  Unsolicited  Result  Code  (URC)  is generated  each  time  that there is a change of status (for more details see u-blox AT Commands Manual [2], +UGPIOC, +CIND, +CMER). The  optional  function  “SIM  card  hot  insertion/removal”  can  be  additionally  configured  on  the  GPIO5  pin  by specific AT command (see the u-blox AT Commands Manual [2], +UDCONF=50), in order to enable / disable the SIM interface upon detection of external SIM card physical insertion / removal.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 36 of 146 1.9 Data communication interfaces TOBY-R2 series modules provide the following serial communication interface:  UART interface: Universal Asynchronous Receiver/Transmitter serial interface available for the communication with a host application processor (AT commands, data communication, FW update by means of FOAT), for FW update by means of the u-blox EasyFlash tool and for diagnostic. (see section 1.9.1)  USB  interface:  Universal  Serial  Bus  2.0  compliant  interface  available  for  the  communication  with  a  host application processor (AT commands, data communication, FW update by means of the FOAT feature), for FW update by means of the u-blox EasyFlash tool and for diagnostic. (see section 1.9.2)  DDC interface: I2C bus compatible interface available for the communication with u-blox GNSS positioning chips or modules and with external I2C devices as an audio codec. (see section 1.9.3)  SDIO  interface:  Secure  Digital  Input  Output  interface  available  for  the  communication  with  compatible u-blox short range radio communication Wi-Fi modules. (see section 1.9.4)  1.9.1 UART interface 1.9.1.1 UART features The UART interface is a 9-wire 1.8 V unbalanced asynchronous serial interface available on all the TOBY-R2 series modules, supporting:  AT command mode5  Data mode and Online command mode5  Multiplexer protocol functionality (see 1.9.1.5)  FW upgrades by means of the FOAT feature (see 1.13.13 and Firmware Update Application Note [5])  FW upgrades by means of the u-blox EasyFlash tool (see Firmware Update Application Note [5])  Trace log capture (diagnostic purpose)  UART  interface  provides  RS-232  functionality conforming  to  the  ITU-T  V.24  Recommendation [7],  with  CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state (for detailed electrical characteristics see TOBY-R2 series Data Sheet [1]), providing:  data lines (RXD as output, TXD as input),   hardware flow control lines (CTS as output, RTS as input),   modem status and control lines (DTR as input, DSR as output, DCD as output, RI as output). TOBY-R2  series  modules  are  designed  to  operate  as  cellular  modems,  i.e.  as  the  data  circuit-terminating equipment (DCE) according to the ITU-T V.24 Recommendation [7]. A host application processor connected to the module through the UART interface represents the data terminal equipment (DTE).   UART signal names of the cellular modules conform to the ITU-T V.24 Recommendation [7]: e.g. TXD line represents data transmitted by the DTE (host processor output) and received by the DCE (module input).  TOBY-R2 series modules’ UART interface is by default configured in AT command mode: the module waits for AT  command  instructions  and  interprets  all  the  characters  received  as  commands  to  execute.  All  the functionalities supported by TOBY-R2 series modules can be in general set and configured by AT commands:  AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]  u-blox AT commands (for the complete list and syntax see the u-blox AT Commands Manual [2])                                                       5 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [2]
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 37 of 146 Flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [2], &K, +IFC, \Q AT commands): hardware flow control (over the RTS / CTS lines), software flow control (XON/XOFF), or none flow control.   Hardware flow control is enabled by default.  The one-shot autobauding is supported: the automatic baud rate detection is performed only once, at module start  up.  After  the  detection,  the  module  works  at  the  detected  baud  rate  and  the  baud  rate  can  only  be changed by AT command (see u-blox AT Commands Manual [3], +IPR).   One-shot automatic baud rate recognition (autobauding) is enabled by default.  The following baud rates can be configured by AT command (see u-blox AT Commands Manual [2], +IPR):  9600 b/s  19200 b/s  38400 b/s  57600 b/s  115200 b/s, default value when one-shot autobauding is disabled  230400 b/s  460800 b/s  921600 b/s  3000000 b/s  3250000 b/s  6000000 b/s   Baud rates higher than 460800 b/s cannot be automatically detected by TOBY-R2 series modules.  The modules support the one-shot automatic frame recognition in conjunction with the one-shot autobauding. The following frame formats can be configured by AT command (see u-blox AT Commands Manual [2], +ICF):  8N1 (8 data bits, No parity, 1 stop bit), default frame configuration with fixed baud rate, see Figure 17  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  8N2 (8 data bits, No parity, 2 stop bits)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit)  D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 17: Description of UART 8N1 frame format (8 data bits, no parity, 1 stop bit)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 38 of 146 1.9.1.2 UART interface configuration  The  UART  interface  of  TOBY-R2  series  modules  is  available  as  AT  command  interface  with  the  default configuration described in Table 10 (for more details and information about further settings, see the u-blox AT Commands Manual [2]).  Interface AT Settings Comments UART interface AT interface: enabled AT command interface is enabled by default on the UART physical interface  AT+IPR=0 One-shot autobauding enabled by default on the modules  AT+ICF=3,1 8N1 frame format enabled by default  AT&K3 HW flow control enabled by default  AT&S1 DSR line (Circuit 107 in ITU-T V.24) set ON in data mode6 and set OFF in command mode6  AT&D1 Upon an ON-to-OFF transition of DTR line (Circuit 108/2 in ITU-T V.24), the module (DCE) enters online command mode6 and issues an OK result code  AT&C1 DCD line (Circuit 109 in ITU-T V.24) changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise  MUX protocol: disabled Multiplexing mode is disabled by default and it can be enabled by AT+CMUX command. For more details, see the Mux Implementation Application Note [11]. The following virtual channels are defined:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling7 Table 10: Default UART interface configuration  1.9.1.3 UART signals behavior At  the  module  switch-on,  before  the  UART  interface  initialization  (as  described  in  the  power-on  sequence reported in Figure 14), each pin is first tri-stated and then is set to its relative internal reset state8. At the end of the  boot  sequence,  the  UART  interface  is  initialized,  the  module  is  by  default  in  active-mode,  and  the  UART interface is enabled as AT commands interface. The  configuration  and  the  behavior  of  the  UART  signals  after  the  boot  sequence  are  described  below.  See section 1.4 for definition and description of module operating modes referred to in this section.  RXD signal behavior The  module  data  output  line  (RXD)  is  set  by  default  to  the  OFF  state  (high  level)  at  UART  initialization.  The module holds RXD in the OFF state until the module does not transmit some data.  TXD signal behavior The module data input line (TXD) is set by default to the OFF state (high level) at UART initialization. The  TXD line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the TXD input.                                                        6 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [2] 7 Not supported by “02” product versions 8 See the pin description table in the TOBY-R2 series Data Sheet [1]
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 39 of 146 CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the  hardware flow  control  is enabled,  as it  is  by  default,  the  CTS line  indicates  when  the UART interface  is enabled (data can be received): the module drives the  CTS line to the ON state or to the OFF state when it  is either able or not able to accept data from the DTE over the UART (for example see section 1.9.1.4, Figure 20).   If hardware flow control is enabled, then when the CTS line is OFF it does not necessarily mean that the module is in low power idle-mode, but only that the UART is not enabled, as the module could be forced to stay in active-mode for other activities, e.g. related to the network or related to other interfaces.  If  hardware  flow  control  is  enabled  and  the  multiplexer  protocol  is  active,  then  the  CTS  line  state  is mapped to FCon / FCoff MUX command for flow control matters outside the power saving configuration while the physical CTS line is still used as a UART power state indicator (see Mux Application Note [11]).  The CTS  hardware flow control setting can be changed by AT commands (for more details, see the  u-blox AT Commands Manual [2], AT&K, AT\Q, AT+IFC AT commands).   When the power saving configuration is enabled by AT+UPSV command and the hardware flow-control is not implemented  in  the DTE/DCE connection,  data sent  by  the  DTE can be  lost:  the first character sent when  the  module  is  in  low  power  idle-mode  will  not  be  a  valid  communication  character  (see  section 1.9.1.4 and in particular the sub-section “Wake up via data reception” for further details).  RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The module then holds the RTS line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If the HW flow control is enabled, as it is by default, the module monitors the RTS line to detect permission from the DTE to send data to the DTE itself. If the  RTS line is set  to  the  OFF  state, any on-going data  transmission from the module is interrupted until the RTS line changes to the ON state.   The DTE must  still be able to accept a certain number of characters after the  RTS line is set to the OFF state: the module guarantees the transmission interruption within two characters from RTS state change.  The module behavior according to the  RTS  hardware flow control status can  be  configured by AT commands (for more details, see the u-blox AT Commands Manual [2], AT&K, AT\Q, AT+IFC AT commands). If AT+UPSV=2 is set and HW flow control is disabled, the module monitors the  RTS line to manage the power saving configuration (for more details, see section 1.9.1.4 and u-blox AT Commands Manual [2], AT+UPSV):  When an OFF-to-ON transition occurs on the  RTS input, the UART is enabled and the  module is forced to active-mode.  After  ~20 ms,  the  switch  is  completed  and  data  can  be  received  without  loss.  The  module cannot enter low power idle-mode and the UART is enabled as long as the RTS is in the ON state  If the RTS input line is set to the OFF state by the DTE, the UART is disabled (held in low power mode) and the module automatically enters low power idle-mode whenever possible  DSR signal behavior If AT&S1 is set, as it is by default, the DSR module output line is set by default to the OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode9 or in online command mode9 and is set to the ON state when the module is in data mode9. If AT&S0 is set, the DSR module output line is set by default to the ON state (low level) at UART initialization and is then always held in the ON state.                                                       9 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [2]
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 40 of 146 DTR signal behavior The DTR module input line is set by default to the OFF state (high level) at UART initialization. The module then holds the DTR line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the DTR input.  Module behavior according to DTR status can be changed by AT command configuration (for more details see the u-blox AT Commands Manual [2], &D AT command description). If AT+UPSV=3 is set, the  DTR line is monitored by the module to manage the power saving configuration (for more details, see section 1.9.1.4 and u-blox AT Commands Manual [2], AT+UPSV):   When an OFF-to-ON transition occurs on the DTR input, the UART is enabled and the module is forced to active-mode.  After  ~20 ms,  the  switch  is  completed  and  data  can  be  received  without  loss.  The  module cannot enter low power idle-mode and the UART is enabled as long as the DTR is in the ON state  If the DTR input line is set to the OFF state by the DTE, the UART is disabled (held in low power mode) and the module automatically enters low power idle-mode whenever possible  DCD signal behavior If AT&C1 is set, as it is by default, the DCD module output line is set by default to the OFF state (high level) at UART initialization. The module then sets the DCD line according to the carrier detect status: ON if the carrier is detected, OFF otherwise.  In case of voice calls, DCD is set to the ON state when the call is established.  In case of data calls, there are the following scenarios regarding the DCD signal behavior:  Packet  Switched  Data  call:  Before  activating  the  PPP  protocol  (data  mode)  a  dial-up  application  must provide the ATD*99***<context_number># to the module: with this command the module switches from command mode to data mode and can accept PPP packets. The module sets the DCD line to the ON state, then answers with a CONNECT to confirm the ATD*99 command. The DCD ON is not related to the context activation but with the data mode  Circuit Switched Data call: To establish a data call, the DTE can send the ATD<number> command to the module  which  sets  an  outgoing  data  call  to  a  remote  modem  (or  another  data  module).  Data  can  be transparent (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the  data  call,  the  module  DCD  line  is  set  to  ON  and  the  CONNECT  <communication  baudrate>  string  is returned  by  the  module.  At  this  stage  the  DTE  can  send  characters  through  the  serial  line  to  the  data module which sends them through the network to the remote DCE attached to a remote DTE   The DCD is set to ON during the execution of the +CMGS, +CMGW, +USOWR, +USODL AT commands requiring input data from the DTE: the DCD line is set to the ON state as soon as the switch to binary/text input mode is completed and the prompt is issued;  DCD line is set to OFF as soon as the input mode is interrupted or completed (for more details see the u-blox AT Commands Manual [2]).   The DCD line is kept in the ON state, even during the online command mode10, to indicate that the data call is still established even if suspended, while if the module enters command mode10, the DSR line is set to the OFF state. For more details see DSR signal behavior description.   For scenarios when the DCD line setting is requested for different reasons (e.g. SMS texting during online command  mode10),  the  DCD  line  changes  to  guarantee  the  correct  behavior  for  all  the  scenarios.  For example, in case of SMS texting in online command mode10, if the data call is released, DCD is kept ON till the SMS command execution is completed (even if the data call release would request DCD set OFF).   If AT&C0 is set, the DCD module output line is set by default to the ON state (low level) at UART initialization and is then always held in the ON state.                                                        10 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [2]
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 41 of 146 RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization.  The RI line can notify an incoming call: the RI line is switched from the OFF state to the ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s, OFF for 4 s, see Figure 18), until the DTE attached to the module sends the ATA string  and the  module  accepts  the  incoming data  call. The  RING  string  sent  by the  module  (DCE) to  the serial port at constant time intervals is not correlated with the switch of the RI line to the ON state.  Figure 18: RI behavior during an incoming call The RI output line can notify an SMS arrival. When the SMS arrives, the RI line switches from OFF to ON for 1 s (see Figure 19), if the feature is enabled by AT+CNMI command (see the u-blox AT Commands Manual [2]).  Figure 19: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. For SMS arrival, if several events coincidently occur or in quick succession each event independently triggers the RI line, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more  than  1  s,  if  an  incoming  call  is  answered  within  less  than  1  s  (with  ATA  or  if  auto-answering  is  set  to ATS0=1) than the RI line is set to OFF earlier, so that:  RI line monitoring cannot be used by the DTE to determine the number of received SMSes.  For multiple events (incoming call plus SMS received), the RI line cannot be used to discriminate the two events, but the DTE must rely on subsequent URCs and interrogate the DCE with the proper commands.  The RI line can additionally notify all the URCs and/or all the incoming data in PPP and Direct Link connections, if the feature is enabled by the AT+URING command (for more details see the  u-blox AT Commands Manual [2]): the RI line is asserted when one of the configured events occur and it remains asserted for 1 s unless another configured event will happen, with the same behavior described in Figure 19.  SMS arrives time [s] 0 RI ON RI OFF 1s time [s] 0 RI ON RI OFF 1s 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 42 of 146 1.9.1.4 UART and power-saving  The power saving configuration is controlled by the AT+UPSV command (for the complete description,  see the u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters low power idle-mode whenever possible, and otherwise the active-mode is maintained by the module (see section  1.4 for definition and description of module operating modes referred to in this section). The AT+UPSV command configures both the module power saving and also the UART behavior in relation to the power saving. The conditions for the module entering  low power idle-mode  also depend on the UART  power saving configuration, as the module does not enter the low power idle-mode according to any required activity related to the network (within or outside an active call) or any other required concurrent activity related to the functions and interfaces of the module, including the UART interface.  The AT+UPSV command can set these different power saving configurations:  AT+UPSV=0, power saving disabled (default configuration)   AT+UPSV=1, power saving enabled cyclically   AT+UPSV=2, power saving enabled and controlled by the UART RTS input line  AT+UPSV=3, power saving enabled and controlled by the UART DTR input line  The different power saving configurations that can be set by the +UPSV AT command are described in details in the  following  subsections.  Table  11  summarizes  the  UART  interface  communication  process  in  the  different power saving configurations, in relation with the hardware flow control settings and the RTS input line status. For more details on the +UPSV AT command description, see u-blox AT commands Manual [2].  AT+UPSV HW flow control RTS line DTR line Communication during idle-mode and wake up  0 Enabled (AT&K3) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 0 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 0 Disabled (AT&K0) ON or OFF ON or OFF Data sent by the DTE is correctly received by the module.  Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise the data is lost. 1 Enabled (AT&K3) ON ON or OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is correctly received by the DTE. 1 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON or OFF ON or OFF The first character sent by the DTE is lost by the module, but after ~20 ms the UART and the module are woken up: recognition of subsequent characters is guaranteed only after the UART / module complete wake-up (after ~20 ms). Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise the data is lost. 2 Enabled (AT&K3) ON or OFF ON or OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 2 Disabled (AT&K0) OFF ON or OFF Data sent by the DTE is lost by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 43 of 146 AT+UPSV HW flow control RTS line DTR line Communication during idle-mode and wake up  3 Enabled (AT&K3) ON ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) ON OFF Data sent by the DTE is lost by the module. Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Enabled (AT&K3) OFF OFF Data sent by the DTE is lost by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Disabled (AT&K0) ON or OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 3 Disabled (AT&K0) ON or OFF OFF Data sent by the DTE is lost by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. Table 11: UART and power-saving summary  AT+UPSV=0: power saving disabled, fixed active-mode The  module  does  not  enter  low  power  idle-mode  and  the  UART  interface  is  enabled  (data  can  be  sent  and received): the CTS line is always held in the ON state after UART initialization. This is the default configuration.  AT+UPSV=1: power saving enabled, cyclic idle/active-mode When the AT+UPSV=1 command is issued by the DTE, the UART will be normally disabled, and then periodically or upon necessity enabled as following:   During the periodic UART wake up to receive or send data, also according to the module wake up for the paging reception (see section 1.5.1.5) or other activities  If the module needs to transmit some data (e.g. URC), the UART is temporarily enabled to send data   If the DTE send data with HW flow control disabled, the  first character sent causes the UART and module wake-up after ~20 ms: recognition of subsequent characters is guaranteed only after the complete wake-up (see the following subsection “wake up via data reception”)  The module automatically enters the  low power  idle-mode whenever  possible but  it  wakes up to active-mode according to the UART periodic wake up so that the module cyclically enters the low power idle-mode and the active-mode. Additionally, the module wakes up to active-mode according to any required activity related to the network (e.g. for the periodic paging reception described in section 1.5.1.5, or for any other required RF Tx / Rx) or any other required activity related to module functions / interfaces (including the UART itself).   When  the  UART  interface  is enabled,  data  can  be received.  When  a character  is received,  it  forces  the  UART interface to stay enabled for a longer time and it forces the module to stay in the active-mode for a longer time, according to the timeout configured by the second parameter of the +UPSV AT command. The timeout can be set from 40 2G-frames (i.e. 40 x 4.615 ms = 184 ms) up to 65000 2G-frames (i.e. 65000 x 4.615 ms = 300 s). Default value is 2000 2G-frames (i.e. 2000 x 4.615 ms = 9.2 s). Every subsequent character received during the active-mode, resets and restarts the timer; hence the active-mode duration can be extended indefinitely.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 44 of 146 The CTS output line is driven to the ON or OFF state when the module is either able or not able to accept data from the DTE over the UART: Figure 20 illustrates the CTS output line toggling due to paging reception and data received over the UART, with AT+UPSV=1 configuration. time [s]~9.2 s (default)Data inputCTS ONCTS OFF Figure 20: CTS output pin indicates when module’s UART is enabled (CTS = ON = low level) or disabled (CTS = OFF = high level)  AT+UPSV=2: power saving enabled and controlled by the RTS line This configuration can only be enabled with the module hardware flow control disabled (i.e. AT&K0 setting). The UART interface is disabled after the DTE sets the RTS line to OFF. Afterwards, the UART is enabled again, and the module does not enter low power idle-mode, as following:   If an OFF-to-ON transition occurs on the RTS input, this causes the UART / module wake-up after ~20 ms: recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART is kept enabled as long as the RTS input line is set to ON.  If the module needs to transmit some data (e.g. URC), the UART is temporarily enabled to send data   The module automatically enters the  low power  idle-mode whenever  possible but  it  wakes up to active-mode according  to  any  required  activity  related  to  the  network  (e.g.  for  the  periodic  paging  reception  described  in section 1.5.1.5, or for any other required RF transmission / reception) or any other required activity related to the module functions / interfaces (including the UART itself).   AT+UPSV=3: power saving enabled and controlled by the DTR line The UART interface is disabled after the DTE sets the DTR line to OFF. Afterwards, the UART is enabled again, and the module does not enter low power idle-mode, as following:   If an OFF-to-ON transition occurs on the DTR input, this causes the UART / module wake-up after ~20 ms: recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART is kept enabled as long as the DTR input line is set to ON  If the module needs to transmit some data (e.g. URC), the UART is temporarily enabled to send data   The module automatically enters the  low power  idle-mode whenever  possible but  it  wakes up to active-mode according  to  any  required  activity  related  to  the  network  (e.g.  for  the  periodic paging  reception  described  in section  1.5.1.5,  or  for  any  other  required  RF  signal  transmission  or  reception)  or  any  other  required  activity related to the functions / interfaces of the module.   The AT+UPSV=3 configuration can be enabled regardless the flow control setting on UART. In particular, the HW flow control can be enabled (AT&K3) or disabled (AT&K0) on UART during this configuration. In both cases, with the AT+UPSV=3 configuration, the CTS line indicates when the module is either able or not able to accept data from the DTE over the UART. When the AT+UPSV=3 configuration is enabled, the  DTR input line can still be used by the DTE to control the module behavior according to AT&D command configuration (see u-blox AT commands Manual [2]).
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 45 of 146 Wake up via data reception The  UART  wake  up  via  data  reception  consists  of  a  special  configuration  of  the  module  TXD  input  line  that causes the system wake-up when a low-to-high transition occurs on the TXD input line. In particular, the UART is enabled and the module switches from the low power idle-mode to active-mode within ~20 ms from the first character received: this is the system “wake up time”. As a consequence, the first character sent by the DTE when the UART is disabled (i.e. the wake up character) is not a valid communication character even if the wake up via data reception configuration is active, because it cannot be recognized, and the recognition of the subsequent characters is guaranteed only after the complete system wake-up (i.e. after ~20 ms).  The TXD input line is configured to wake up the system via data reception in the following case:  AT+UPSV=1 is set with HW flow control disabled  Figure 21 and Figure 22 show examples of common scenarios and timing constraints:  AT+UPSV=1 power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000)  Hardware flow control is disabled  Figure 21 shows the case where the module UART is disabled and only a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE module UART is disabled when the timeout from last data received expires (2000 frames without data reception, as the default case). Wake up character        Not recognized by DCEOFFONDCE UART is enabled for 2000 GSM frames (~9.2 s)time Wake up time: ~20 mstime TXD inputUARTOFFON Figure 21: Wake-up via data reception without further communication  Figure  22  shows  the  case  where  in addition  to  the  wake-up  character  further  (valid) characters  are  sent.  The wake up character wakes-up the module UART. The other characters must be sent after the “wake up time” of ~20 ms. If this condition is satisfied, the module (DCE) recognizes characters. The module will disable the UART after 2000 GSM frames from the latest data reception. Wake up character        Not recognized by DCEValid characters          Recognized by DCEDCE UART is enabled for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: ~20 mstime OFFONTXD inputUARTOFFON Figure 22: Wake-up via data reception with further communication
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 46 of 146  The “wake-up via data reception” feature cannot be disabled.  In  command  mode11,  with  “wake-up  via  data  reception”  enabled  and  autobauding  enabled,  the  DTE should always send a dummy character to the module before the “AT” prefix set at the beginning of each command line: the first dummy character is ignored if the module is in active-mode, or it represents the wake-up character if the module is in low power idle-mode.  In  command  mode11,  with  “wake-up  via  data  reception”  enabled  and  autobauding  disabled,  the  DTE should always send a dummy “AT” to the module before each command line: the first dummy “AT” is not ignored if the module is in active-mode (i.e. the module replies “OK”), or it represents the wake up character if the module is in low power idle-mode (i.e. the module does not reply).  Additional considerations If the USB is connected and not suspended, the module is kept ready to communicate over USB regardless the AT+UPSV settings, which have instead effect on the UART behavior, as they configure the UART power saving, so that UART is enabled / disabled according to the AT+UPSV settings. To set the AT+UPSV=1, AT+UPSV=2 or AT+UPSV=3 configuration over the USB interface, the autobauding must be previously disabled on the UART by the +IPR AT command over the used USB AT interface, and this +IPR AT command  configuration  must  be  saved  in  the  module’  non-volatile  memory  (see  the  u-blox  AT  Commands Manual [2]). Then, after the subsequent module re-boot, AT+UPSV=1, AT+UPSV=2 or AT+UPSV=3 can be issued over the used USB AT interface: all the AT profiles are updated accordingly.  1.9.1.5 UART multiplexer protocol TOBY-R2 series modules include multiplexer functionality as per 3GPP TS 27.010 [10], on the UART physical link.  This  is  a  data  link  protocol  which  uses  HDLC-like  framing  and  operates  between  the  module  (DCE)  and  the application processor (DTE) and allows a number of simultaneous sessions over the used physical link (UART): the user can concurrently use AT interface on one MUX channel and data communication on another MUX channel.  The following virtual channels are defined (for more details, see Mux implementation Application Note [11]):  Channel 0: Multiplexer control  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS data tunneling   The GNSS data tunneling channel is not supported by “02” product versions.                                                         11 See the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 47 of 146 1.9.2 USB interface 1.9.2.1 USB features TOBY-R2 series modules include a High-Speed USB 2.0 compliant interface with 480 Mb/s maximum data rate, representing the main interface for transferring high speed data with a host application processor, supporting:  AT command mode12  Data mode and Online command mode12  FW upgrades by means of the FOAT feature (see 1.13.13 and Firmware Update Application Note [5])  FW upgrades by means of the u-blox EasyFlash tool (see Firmware Update Application Note [5])  Trace log capture (diagnostic purpose)  The module itself acts as a USB device and can be connected to a USB host such as a Personal Computer or an embedded application microprocessor equipped with compatible drivers. The USB_D+/USB_D- lines carry USB serial bus data and signaling according to the Universal Serial Bus Revision 2.0 specification [6], while the VUSB_DET input pin senses the VBUS USB supply presence (nominally 5 V at the source) to detect the host connection and enable the interface. The USB interface of the module is enabled only if a valid voltage is detected by the VUSB_DET input (see the TOBY-R2 series Data Sheet [1]). Neither the USB interface, nor the whole module is supplied by the VUSB_DET input: the VUSB_DET senses the USB supply voltage and absorbs few microamperes.  The USB interface is controlled and operated with:  AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]  u-blox AT commands (for the complete list and syntax see u-blox AT Commands Manual [2])  The  USB interface  of  TOBY-R2  series  modules,  according  to the  configured  USB  profile,  can  provide  different USB functions with various capabilities and purposes, such as:  CDC-ACM for AT commands and data communication  CDC-ACM for GNSS tunneling  CDC-ACM for SAP (SIM Access Profile)  CDC-ACM for Diagnostic log  CDC-NCM for Ethernet-over-USB   CDC-ACM  for  GNSS  tunneling,  CDC-ACM  for  SAP,  and  CDC-NCM  for  Ethernet-over-USB  are  not supported by “02” product versions.  The  USB  profile  of  TOBY-R2  series  modules  identifies  itself  by  its  VID  (Vendor  ID)  and  PID  (Product  ID) combination, included in the USB device descriptor according to the USB 2.0 specifications [6]. If the USB is connected to the host before the module is switched on, or if the module is reset (rebooted) with the USB connected to the host, the VID and PID are automatically updated during the boot of the module. First, VID and PID are the following:  VID = 0x8087  PID = 0x0716 This VID and PID combination identifies a USB  profile  where no USB function described above is available:  AT commands must not be sent to the module over the USB profile identified by this VID and PID combination.                                                       12 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [2]
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 48 of 146 Then,  after  a  time  period  (which  depends  on  the  host  /  device  enumeration  timings),  the  VID  and  PID  are updated to the ones related to the default USB profile providing the following set of USB functions:  6 CDC-ACM modem COM ports enumerated as follows: o USB1: AT and data o USB2: AT and data o USB3: AT and data o USB4: GNSS tunneling  o USB5: SAP (SIM Access Profile) o USB6: Primary Log (diagnostic purpose) VID and PID of this USB profile with the set of functions described above (6 CDC-ACM) are the following:  VID = 0x1546  PID = 0x1107  Figure 23 summarizes the USB end-points available with the default USB profile.  Default profile configurationInterface 0 Abstract Control ModelEndPoint Transfer: InterruptInterface 1 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 2 Abstract Control ModelEndPoint Transfer: InterruptInterface 3 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 4 Abstract Control ModelEndPoint Transfer: InterruptInterface 5 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 6 Abstract Control ModelEndPoint Transfer: InterruptInterface 7 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction GNSS tunnelingInterface 8 Abstract Control ModelEndPoint Transfer: InterruptInterface 9 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction SAPInterface 10 Abstract Control ModelEndPoint Transfer: InterruptInterface 11 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction Primary Log Figure 23: TOBY-R2 series USB End-Points summary for the default USB profile configuration
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 49 of 146 1.9.2.2 USB in Windows USB drivers are provided for Windows operating system platforms and should be properly installed / enabled by following the step-by-step instructions available in the  EVK-R2xx User Guide [3] or in the  Windows Embedded OS USB Driver Installation Application Note [4]. USB drivers are available for the following operating system platforms:  Windows 7  Windows 8  Windows 8.1  Windows 10  Windows Embedded CE 6.0  Windows Embedded Compact 7  Windows Embedded Compact 2013 The module firmware can be upgraded over the USB interface by means of the FOAT feature, or using the u-blox EasyFlash tool (for more details see Firmware Update Application Note [5]).  1.9.2.3 USB in Linux/Android It is not required to install a specific driver for each Linux-based or Android-based operating system (OS) to use the module USB interface, which is compatible with standard Linux/Android USB kernel drivers. The full capability and configuration of the module USB interface can be reported by running “lsusb –v” or an equivalent command available in the host operating system when the module is connected.  1.9.2.4 USB and power saving The  modules  automatically  enter  the USB  suspended  state  when the  device  has observed no  bus traffic for  a specific time  period according  to the  USB  2.0 specification  [6].  In suspended  state, the  module maintains  any USB  internal  status  as  device.  In  addition,  the  module  enters  the  suspended  state  when  the  hub  port  it  is attached to is disabled. This is referred to as USB selective suspend. If the USB is suspended and  a  power saving configuration is enabled  by the AT+UPSV  command, the module automatically enters the low power idle-mode whenever possible but it wakes up to active-mode according to any required activity related to the network (e.g. the periodic paging reception described in section  1.5.1.5) or any other required activity related to the functions / interfaces of the module. The USB exits suspend mode when there is bus activity. If the USB is connected and not suspended, the module is kept  ready to  communicate  over USB  regardless  the AT+UPSV  settings, therefore the  AT+UPSV settings are overruled but they have effect on the power saving configuration of the other interfaces (see 1.9.1.4). The modules are capable of USB remote wake-up signaling: i.e. it may request the host to exit suspend mode or selective  suspend  by  using  electrical  signaling  to  indicate  remote  wake-up,  for  example  due  to  incoming  call, URCs, data reception on a socket. The remote wake-up signaling notifies the host that it should resume from its suspended mode, if necessary, and service the external event. Remote wake-up is accomplished using electrical signaling described in the USB 2.0 specifications [6]. For the module current consumption description with power saving enabled and USB suspended, or with power saving disabled and USB not suspended, see the sections 1.5.1.5, 1.5.1.6 and the TOBY-R2 series Data Sheet [1]. The  additional  VUSB_DET  input  pin  available  on  TOBY-R2  series  modules  provides  the  complete  bus  detach functionality: the modules  disable the USB interface when a low logic  level  is  sensed after  a high-to-low logic level transition on the VUSB_DET input pin. This allows a further reduction of the module current consumption, in particular as compared to the USB suspended status during low-power idle mode with power saving enabled.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 50 of 146 1.9.3 DDC (I2C) interface  Communication  with  u-blox  GNSS  receivers  over  I2C  bus  compatible  Display  Data  Channel  interface, AssistNow embedded GNSS positioning aiding, CellLocate® positioning through cellular info, and custom functions  over  GPIOs  for  the  integration  with  u-blox  positioning  chips  /  modules  are  not  supported  by TOBY-R2 series modules “02” product versions.  The SDA and SCL pins represent an I2C bus compatible Display Data Channel (DDC) interface available for   communication with u-blox GNSS chips / modules,  communication with other external I2C devices as audio codecs. The AT commands interface is not available on the DDC (I2C) interface. DDC  (I2C)  slave-mode  operation  is  not  supported:  the  TOBY-R2  series  module  can  act  as  I2C  master  that  can communicate with more I2C slaves in accordance to the I2C bus specifications [12]. The  DDC  (I2C)  interface  pins  of  the  module,  serial  data  (SDA)  and  serial  clock  (SCL),  are  open  drain  outputs conforming to the I2C bus specifications [12].  u-blox has implemented special features to ease the design effort required for the integration of a u-blox cellular module with a u blox GNSS receiver. Combining  a  u-blox  cellular  module  with  a  u-blox  GNSS  receiver  allows  designers  to  have  full  access  to  the positioning  receiver  directly  via  the  cellular  module:  it  relays  control  messages  to  the  GNSS  receiver  via  a dedicated  DDC  (I2C)  interface.  A  2nd  interface  connected  to  the  positioning  receiver  is  not  necessary:  AT commands via the UART or USB serial interface of the cellular module allows a fully control of the GNSS receiver from any host processor. The modules feature embedded GNSS aiding that is a  set of specific features developed by u-blox to enhance GNSS performance, decreasing the Time To First Fix (TTFF), thus allowing to calculate the position in a shorter time with higher accuracy.  These GNSS aiding types are available:  Local aiding  AssistNow Online  AssistNow Offline  AssistNow Autonomous The  embedded  GNSS  aiding  features  can  be  used  only  if  the  DDC  (I2C)  interface  of  the  cellular  module  is connected to the u-blox GNSS receivers.  The cellular modules provide additional custom functions over GPIO pins to improve the integration with u-blox positioning chips and modules. GPIO pins can handle:  GNSS receiver  power-on/off:  “GNSS  supply enable” function  provided by  GPIO2 improves the positioning receiver power consumption. When the GNSS functionality is not required, the positioning receiver can be completely switched off by the cellular module that is controlled by AT commands  The wake up from idle-mode when the GNSS receiver is ready to send data: “GNSS Tx data ready” function provided by GPIO3 improves the cellular module power consumption. When power saving is enabled in the cellular  module  by  the  AT+UPSV  command  and  the  GNSS  receiver  does  not  send  data  by  the  DDC  (I2C) interface,  the  module automatically  enters  idle-mode  whenever  possible.  With  the  “GNSS  Tx  data ready” function the GNSS receiver can indicate to the cellular module that it is ready to send data by the DDC (I2C) interface:  the  positioning  receiver  can  wake  up  the  cellular  module  if  it  is  in  idle-mode,  so  the  cellular module does not lose the data sent by the GNSS receiver even if power saving is enabled
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 51 of 146  The  RTC  synchronization  signal  to  the  GNSS  receiver:  “GNSS  RTC  sharing”  function  provided  by  GPIO4 improves GNSS receiver performance, decreasing the Time To First Fix (TTFF), and thus allowing to calculate the position in a shorter time with higher accuracy. When GPS local aiding is enabled, the cellular module automatically  uploads data  such as  position,  time, ephemeris, almanac, health  and ionospheric  parameter from the positioning receiver into its local memory, and restores this to the GNSS receiver at the next power up of the positioning receiver   For  more  details  regarding  the  handling  of  the  DDC  (I2C)  interface,  the  GNSS  aiding  features  and  the GNSS related functions over GPIOs, see section 1.11, to the u-blox AT Commands Manual [2] (AT+UGPS, AT+UGPRF, AT+UGPIOC AT commands) and the GNSS Implementation Application Note [13].  “GNSS Tx data ready” and “GNSS RTC sharing” functions are not supported by all u-blox GNSS receivers HW or ROM/FW versions. Please see the GNSS Implementation Application Note [13] or to the Hardware Integration Manual of the u-blox GNSS receivers for the supported features.  As  additional  improvement  for  the  GNSS  receiver  performance,  the  V_BCKP  supply  output  of  the  cellular modules can be connected to the V_BCKP supply input pin of u-blox positioning chips and modules to provide the supply for the GNSS real time clock and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This  enables  the  u-blox  positioning  receiver  to  recover  from  a  power  breakdown  with  either  a  hot  start  or  a warm  start (depending  on  the  duration  of  the  GNSS  receiver  VCC outage)  and  to  maintain the  configuration settings saved in the backup RAM.  1.9.4 SDIO interface  Secure Digital Input Output interface is not supported by TOBY-R2 series modules “02” product versions.  TOBY-R2 series modules include a 4-bit Secure Digital Input Output interface (SDIO_D0, SDIO_D1,  SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) designed to communicate with an external u-blox short range Wi-Fi module: the cellular module acts as an SDIO host controller which can communicate over the SDIO bus with a compatible u-blox short range radio communication Wi-Fi module acting as SDIO device. The SDIO interface is the only one interface of TOBY-R2 series modules dedicated for communication between the u-blox cellular module and the u-blox short range Wi-Fi module.  The AT commands interface is not available on the SDIO interface of TOBY-R2 series modules.  Combining a u-blox cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not  necessary.  AT  commands  via  the  AT  interfaces  of  the  cellular  module  allows  a  full  control  of  the  Wi-Fi module  from  any  host  processor,  because  Wi-Fi  control  messages  are  relayed  to  the  Wi-Fi  module  via  the dedicated SDIO interface. u-blox has implemented special features in the cellular modules to ease the design effort for the integration of a u-blox cellular module with a u-blox short range Wi-Fi module to provide Router functionality. Additional custom function over GPIO pins is designed to improve the integration with u-blox Wi-Fi modules:  Wi-Fi enable  Switch-on / switch-off the Wi-Fi    Wi-Fi enable function over GPIO is not supported by TOBY-R2 series modules “02” product versions.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 52 of 146 1.10 Audio 1.10.1 Digital audio over I2S interface TOBY-R2 series modules include a 4-wire I2S digital audio interface (I2S_TXD data output, I2S_RXD data input, I2S_CLK  clock  input/output,  I2S_WA  world  alignment  /  synchronization  signal  input/output),  which  can  be configured  by  AT  command  for  digital  audio  communication  with  external  digital  audio  devices  as  an  audio codec (for more details see the u-blox AT Commands Manual [2], +UI2S AT command).  The I2S interface can be alternatively set in different modes, by <I2S_mode> parameter of AT+UI2S command:  PCM mode (short synchronization signal): I2S word alignment signal is set high for 1 or 2 clock cycles for the synchronization, and then is set low for 16 clock cycles according to the 17 or 18 clock cycles frame length.  Normal I2S mode (long synchronization signal): I2S word alignment is set high / low with a 50% duty cycle (high for 16 clock cycles / low for 16 clock cycles, according to the 32 clock cycles frame length).  The I2S interface can be alternatively set in different roles, by <I2S_Master_Slave> parameter of AT+UI2S:  Master mode  Slave mode  The sample rate of transmitted/received words, which corresponds to the I2S word alignment / synchronization signal frequency, can be alternatively set by the <I2S_sample_rate> parameter of AT+UI2S to:  8 kHz  11.025 kHz  12 kHz  16 kHz  22.05 kHz  24 kHz  32 kHz  44.1 kHz  48 kHz  The  modules  support  I2S  transmit  and  I2S  receive  data  16-bit  words  long,  linear,  mono  (or also  dual  mono  in Normal I2S mode). Data is transmitted and read in 2’s complement notation. MSB is transmitted and read first.  I2S clock signal frequency depends on the frame length, the sample rate and the selected mode of operation:  17 x <I2S_sample_rate> or 18 x <I2S_sample_rate> in PCM mode (short synchronization signal)  16 x 2 x <I2S_sample_rate> in Normal I2S mode (long synchronization signal)   For the complete description of the possible configurations and settings of the I2S digital audio interface for PCM and Normal I2S modes refer to the u-blox AT Commands Manual [2], +UI2S AT command.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 53 of 146 1.11 General Purpose Input/Output TOBY-R2 series modules include 10 pins (GPIO1-GPIO6, I2S_TXD, I2S_RXD, I2S_CLK, I2S_WA) which can be configured as General Purpose Input/Output or to provide custom functions via u-blox AT commands (for more details see the u-blox AT Commands Manual [2], +UGPIOC, +UGPIOR, +UGPIOW AT commands), as summarized in Table 12.  Function Description Default GPIO Configurable GPIOs Network status indication Network status: registered home network, registered roaming, data transmission, no service -- GPIO1-GPIO4 GNSS supply enable13 Enable/disable the supply of u-blox GNSS receiver connected to the cellular module -- GPIO1-GPIO4 GNSS data ready13 Sense when u-blox GNSS receiver connected to the module is ready for sending data by the DDC (I2C) -- GPIO3 GNSS RTC sharing13 RTC  synchronization  signal  to  the  u-blox  GNSS  receiver connected to the cellular module -- GPIO4 SIM card detection External SIM card physical presence detection  GPIO5 GPIO5 SIM card hot insertion/removal Enable / disable SIM interface upon detection of external SIM card physical insertion / removal  -- GPIO5 I2S digital audio interface I2S digital audio interface I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA Master clock output 13 MHz / 26 MHz clock output for an external device as an audio codec or an external Wi-Fi chip/module GPIO6 GPIO6 Wi-Fi control13 Control of an external Wi-Fi chip or module  -- -- General purpose input Input to sense high or low digital level -- All General purpose output Output to set the high or the low digital level GPIO4 All Pin disabled Tri-state with an internal active pull-down enabled GPIO1-GPIO3 All Table 12: TOBY-R2 series GPIO custom functions configuration   1.12 Reserved pins (RSVD) TOBY-R2 series modules have pins reserved for future use, marked as RSVD: they can all be left unconnected on the application board, except   the RSVD pin number 6 that must be externally connected to ground  the RSVD pin number 18 that is recommended to be connected to a Test-Point for diagnostic access  the RSVD pin number 19 that is recommended to be connected to a Test-Point for diagnostic access                                                        13 Not supported by “02” product versions.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 54 of 146 1.13 System features 1.13.1 Network indication GPIOs can be configured by the AT command to indicate network status (for further details see section 1.11 and the u-blox AT Commands Manual [2], GPIO commands):  No service (no network coverage or not registered)  Registered 2G / 3G / LTE home network  Registered 2G / 3G / LTE visitor network (roaming)  Call enabled (RF data transmission / reception)  1.13.2 Antenna supervisor The  antenna  detection  function  provided by  the ANT_DET  pin  is based  on  an ADC measurement  as  optional feature that can be implemented if the application requires it. The antenna  supervisor is forced by the +UANTR AT command (see the u-blox AT Commands Manual [2] for more details). The requirements to achieve antenna detection functionality are the following:  an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used  an antenna detection circuit must be implemented on the application board See  section  1.7.2  for  detailed  antenna  detection  interface  functional  description  and  see  section  2.4.2  for detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines.  1.13.3 Jamming detection  Congestion detection (i.e. jamming detection) is not supported by “02” product versions.  In  real  network  situations  modules  can  experience  various  kind  of  out-of-coverage  conditions:  limited  service conditions  when  roaming  to  networks  not  supporting  the  specific  SIM,  limited  service  in  cells  which  are  not suitable or barred due to operators’ choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operator’s carriers entitled to give access to the LTE/3G/2G service. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command: the feature  consists  of  detecting  an  anomalous  source  of  interference  and  signaling  the  start  and  stop  of  such conditions to the host application processor with an unsolicited indication, which can react appropriately by e.g. switching off the radio transceiver of the module (i.e. configuring the module in “airplane mode” by means of the +CFUN AT command) in order to reduce power consumption and monitoring the environment at constant periods (for more details see the u-blox AT Commands Manual [2], +UCD AT command).
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 55 of 146 1.13.4 Dual stack IPv4/IPv6 TOBY-R2 series support both Internet Protocol version 4 and Internet Protocol version 6 in parallel. For more details about dual stack IPv4/IPv6 see the u-blox AT Commands Manual [2].  1.13.5 TCP/IP and UDP/IP TOBY-R2 series modules provide embedded TCP/IP and UDP/IP protocol stack: a PDP context can be configured, established and handled via the data connection management packet switched data commands.  TOBY-R2 series modules provide Direct Link mode to establish a transparent end-to-end communication with an already  connected  TCP  or  UDP  socket via serial  interfaces  (USB,  UART).  In Direct  Link mode,  data sent  to  the serial interface from an external application processor is forwarded to the network and vice-versa. For more details about embedded TCP/IP and UDP/IP functionalities see the u-blox AT Commands Manual [2].  1.13.6 FTP  TOBY-R2 series provide embedded File Transfer Protocol (FTP) services. Files are read and stored in the local file system of the module. FTP files can also be transferred using FTP Direct Link:  FTP download: data coming from the FTP server is forwarded to the host processor via USB / UART serial interfaces (for FTP without Direct Link mode the data is always stored in the module’s Flash File System)  FTP  upload: data coming from the  host processor via USB / UART serial interface is forwarded to the FTP server (for FTP without Direct Link mode the data is read from the module’s Flash File System) When Direct Link is used for a FTP file transfer, only the file content pass through  USB / UART serial interface, whereas all the FTP commands handling is managed internally by the FTP application. For more details about embedded FTP functionalities see u-blox AT Commands Manual [2].  1.13.7 HTTP  TOBY-R2 series modules provide the embedded Hyper-Text Transfer Protocol (HTTP) services via AT commands for sending requests to a remote HTTP server, receiving the server response and transparently storing it in the module’s Flash File System (FFS).  For more details about embedded HTTP functionalities see the u-blox AT Commands Manual [2].
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 56 of 146 1.13.8 SSL / TLS TOBY-R2 series modules support the Secure Sockets Layer (SSL) / Transport Layer Security (TLS) with certificate key sizes up to 4096 bits to provide security over the FTP and HTTP protocols. The SSL/TLS support provides different connection security aspects:  Server  authentication:  use  of  the  server  certificate  verification  against  a  specific  trusted  certificate  or  a trusted certificates list  Client authentication: use of the client certificate and the corresponding private key  Data security and integrity: data encryption and Hash Message Authentication Code (HMAC) generation The security aspects used during a connection depend on the SSL/TLS configuration and features supported.  Table 13 contains the settings of the default SSL/TLS profile and  Table 14 to Table 18 report the main SSL/TLS supported  capabilities  of  the  products.  For  a  complete  list  of  supported  configurations  and  settings  see  the u-blox AT Commands Manual [2].  Settings Value  Meaning Certificates validation level Level 0 The server certificate will not be checked or verified Minimum SSL/TLS version Any The server can use any of the TLS1.0/TLS1.1/TLS1.2 versions for the connection Cipher suite Automatic The cipher suite will be negotiated in the handshake process Trusted root certificate internal name None No certificate will be used for the server authentication Expected server host-name None No server host-name is expected Client certificate internal name None No client certificate will be used Client private key internal name None No client private key will be used Client private key password None No client private key password will be used Pre-shared key None No pre-shared key password will be used Table 13: Default SSL/TLS profile  SSL/TLS Version   SSL 2.0  NO SSL 3.0  YES TLS 1.0  YES TLS 1.1  YES TLS 1.2  YES Table 14: SSL/TLS version support Algorithm   RSA  YES PSK  YES Table 15: Authentication  Algorithm   RC4  NO DES  YES 3DES  YES AES128  YES AES256  YES Table 16: Encryption
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 57 of 146 Algorithm   MD5  NO SHA/SHA1  YES SHA256  YES SHA384  YES Table 17: Message digest  Description Registry value   TLS_RSA_WITH_AES_128_CBC_SHA 0x00,0x2F  YES TLS_RSA_WITH_AES_128_CBC_SHA256 0x00,0x3C  YES TLS_RSA_WITH_AES_256_CBC_SHA 0x00,0x35  YES TLS_RSA_WITH_AES_256_CBC_SHA256 0x00,0x3D  YES TLS_RSA_WITH_3DES_EDE_CBC_SHA 0x00,0x0A  YES TLS_RSA_WITH_RC4_128_MD5 0x00,0x04  NO TLS_RSA_WITH_RC4_128_SHA 0x00,0x05  NO TLS_PSK_WITH_AES_128_CBC_SHA 0x00,0x8C  YES TLS_PSK_WITH_AES_256_CBC_SHA 0x00,0x8D  YES TLS_PSK_WITH_3DES_EDE_CBC_SHA 0x00,0x8B  YES TLS_RSA_PSK_WITH_AES_128_CBC_SHA 0x00,0x94  YES TLS_RSA_PSK_WITH_AES_256_CBC_SHA 0x00,0x95  YES TLS_RSA_PSK_WITH_3DES_EDE_CBC_SHA 0x00,0x93  YES TLS_PSK_WITH_AES_128_CBC_SHA256 0x00,0xAE  YES TLS_PSK_WITH_AES_256_CBC_SHA384 0x00,0xAF  YES TLS_RSA_PSK_WITH_AES_128_CBC_SHA256 0x00,0xB6  YES TLS_RSA_PSK_WITH_AES_256_CBC_SHA384 0x00,0xB7  YES Table 18: TLS cipher suite registry  1.13.9 Bearer Independent Protocol The Bearer Independent Protocol (BIP) is a mechanism by which a cellular module provides a SIM with access to the  data bearers supported  by the  network.  With  the  BIP  for Over-the-Air SIM  provisioning,  the data  transfer from and to the SIM uses either an already active PDP context or a new PDP context established with the APN provided by the SIM card. For more details, see the u-blox AT Commands Manual [2].  1.13.10 AssistNow clients and GNSS integration  AssistNow clients and u-blox GNSS receiver integration are not supported by “02” product versions.  For customers  using u-blox  GNSS receivers,  the TOBY-R2 series  cellular modules  feature  embedded AssistNow clients.  AssistNow  A-GPS  provides  better  GNSS  performance  and  faster  Time-To-First-Fix.  The  clients  can  be enabled and disabled with an AT command (see the u-blox AT Commands Manual [2]). TOBY-R2  series  cellular  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no additional requirements for resources or software integration on an external host micro controller. Full access to u-blox GNSS receivers is available via the TOBY-R2 series cellular module, through the DDC (I2C) interface, while the available GPIOs can handle the positioning chipset / module power-on/off. This means that cellular module and GNSS receiver can be controlled through a single serial port from any host processor.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 58 of 146 1.13.11 Hybrid positioning and CellLocate®  Hybrid positioning and CellLocate® are not supported by “02” product versions.  Although GNSS is a widespread technology, its reliance on the visibility of extremely weak GNSS satellite signals means that positioning is not always possible. Especially difficult environments for GNSS are indoors, in enclosed or underground  parking garages,  as well  as  in urban  canyons where GNSS  signals  are  blocked  or jammed  by multipath interference. The situation can be improved by augmenting GNSS receiver data with cellular network information to provide positioning information even when GNSS reception is degraded or absent. This additional information can benefit numerous applications.  Positioning through cellular information: CellLocate® u-blox CellLocate® enables the estimation of device position based on the parameters of the mobile network cells visible to the specific device. To estimate its position the u-blox cellular module sends the CellLocate® server the parameters  of  network  cells  visible  to  it  using  a  UDP  connection.  In  return  the  server  provides  the  estimated position  based  on  the  CellLocate®  database.  The  module  can  either  send  the  parameters  of  the  visible  home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators (deep scan).  The CellLocate® database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:  1. Several devices reported their position to the CellLocate® server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A)    2. CellLocate® server defines the area of Cell A visibility
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 59 of 146  3. If a new device reports the observation of Cell A CellLocate® is able to provide the estimated position from the area of visibility    4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility.    CellLocate® is implemented using a set of two AT commands that allow configuration of the CellLocate® service (AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy.   The accuracy of the position estimated by CellLocate® depends on the availability of historical observations in the specific area.  Hybrid positioning With  u-blox  Hybrid  positioning  technology,  u-blox  cellular  devices  can  be  triggered  to  provide  their  current position using either a u-blox GNSS receiver or the position estimated from CellLocate®. The choice depends on which positioning method provides the best and fastest solution according to the user configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid positioning is implemented through a set of three AT commands that allow configuration of the GNSS receiver (AT+ULOCGNSS), configuration of the CellLocate® service (AT+ULOCCELL), and requesting the position according  to  the  user  configuration  (AT+ULOC).  The  answer  is  provided  in  the  form  of  an  unsolicited  AT command  including  latitude,  longitude  and  estimated  accuracy  (if  the  position  has  been  estimated  by CellLocate®), and additional parameters if the position has been computed by the GNSS receiver.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 60 of 146 The  configuration  of  mobile  network  cells  does  not  remain  static  (e.g.  new  cells  are  continuously  added  or existing cells are reconfigured by the network operators). For this reason, when a Hybrid positioning method has been  triggered  and  the  GNSS  receiver  calculates  the  position,  a  database  self-learning  mechanism  has  been implemented so that these positions are sent to the server to update the database and maintain its accuracy. The use of hybrid positioning requires a connection via the DDC (I2C) bus between the TOBY-R2 series cellular module and the u-blox GNSS receiver (see sections 1.9.3 and 2.6.3). See GNSS Implementation Application Note [13] for the complete description of the feature.   u-blox  is  extremely  mindful  of  user  privacy.  When  a  position  is  sent  to  the  CellLocate®  server  u-blox  is unable to track the SIM used or the specific device.  1.13.12 Wi-Fi integration  u-blox short range communication Wi-Fi modules integration is not supported by “02” product versions.  Full access to u-blox short range communication Wi-Fi modules is available through a dedicated SDIO interface (see sections 1.9.4 and 2.6.4). This means that combining a TOBY-R2 series cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not necessary.  AT commands via the AT interfaces of the cellular module (UART, USB) allows a full control of the Wi-Fi module from any host processor, because Wi-Fi control messages are relayed to the Wi-Fi module via the dedicated SDIO interface. All the management software for Wi-Fi module operations runs inside the cellular module in  addition to those required for cellular-only operation.  1.13.13 Firmware update Over AT (FOAT) This feature allows upgrading the module firmware over USB / UART serial interfaces, using AT commands.  The +UFWUPD AT command triggers a reboot followed by the upgrade procedure at specified a baud rate  A special boot loader on the module performs firmware installation, security verifications and module reboot  Firmware authenticity verification is performed via a security signature during the download. The firmware is then  installed,  overwriting  the  current  version.  In  case  of  power  loss  during  this  phase,  the  boot  loader detects a fault at the next wake-up, and restarts the firmware download. After completing the upgrade, the module is reset again and wakes-up in normal boot For more details about Firmware update Over AT procedure see the Firmware Update Application Note [5] and the u-blox AT Commands Manual [2], +UFWUPD AT command.  1.13.14 Firmware update Over The Air (FOTA) This feature allows upgrading the module firmware over the LTE/3G/2G air interface.  In order to reduce the amount of data to be transmitted over the air, the implemented FOTA feature requires downloading only a “delta file” instead of the full firmware. The delta file contains only the differences between the two firmware versions (old and new), and is compressed. The firmware update procedure can be triggered using dedicated AT command with the delta file stored in the module file system via over the air FTP. For more details about Firmware update Over The Air procedure see the Firmware Update Application Note [5] and the u-blox AT Commands Manual [2].
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 61 of 146 1.13.15 Smart temperature management Cellular modules – independent of the specific model – always have a well defined operating temperature range. This range should be respected to guarantee full device functionality and long life span. Nevertheless  there  are  environmental  conditions  that  can  affect  operating  temperature,  e.g.  if  the  device  is located near a heating/cooling source, if there is/isn’t air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security  mechanism  embedded  into  the  module  is  a  good  solution  to  prevent  operation  of  the  device outside of the specified range.  Smart Temperature Supervisor (STS) The  Smart  Temperature  Supervisor  is  activated  and  configured  by  a  dedicated  AT+USTS  command.  See  the u-blox AT Commands Manual [2] for more details. The cellular module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range.   Temperature measurement is done inside the cellular module: the measured value could be different from the environmental temperature (Ta). Warningareat-1 t+1 t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea Figure 24: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 24) named t-2, t-1, t+1 and t+2.  Within the first limit, (t-1 < Ti < t+1), the cellular module is in the normal working range, the Safe Area  In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the cellular module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition  Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and  represents  a  dangerous  working  condition.  This  condition  is  indicated  and  the  device  shuts  down  to avoid damage   For security  reasons the  shutdown  is suspended  in case  an emergency  call  in  progress.  In this  case  the device will switch off at call termination.  The user can decide at anytime to enable/disable the Smart Temperature Supervisor feature. If the feature is disabled there is no embedded protection against disallowed temperature conditions.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 62 of 146 Figure 25 shows the flow diagram implemented for the Smart Temperature Supervisor.  IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)Wait emergencycall terminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is  within normal operating rangeYesTempetature  is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled in  indication only mode:no  further actionsSend notification (safe)Previously outside of Safe AreaTempetature  is back to safe areaNoNo furtheractionsYes Figure 25: Smart Temperature Supervisor (STS) flow diagram
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  System description     Page 63 of 146 Threshold Definitions When the application of cellular module operates at extreme temperatures with Smart Temperature Supervisor enabled, the user should note that outside the valid temperature range the device will automatically shut down as described above. The  input  for the  algorithm  is always  the  temperature  measured within  the  cellular  module (Ti,  internal). This value can be higher than the working ambient temperature (Ta, ambient),  as (for example) during transmission at  maximum  power  a  significant  fraction  of  DC  input  power  is  dissipated  as  heat  This  behavior  is  partially compensated  by  the  definition  of  the  upper shutdown  threshold  (t+2)  that  is slightly  higher  than  the  declared environmental temperature limit.   The sensor measures board temperature inside the shields, which can differ from ambient temperature.  1.13.16 Power saving The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (for the complete description of the AT+UPSV command, see the u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption (see section 1.5.1.5, TOBY-R2 series Data Sheet [1]). During the low power idle-mode, the module is temporarily not ready to communicate with an external device, as it is configured to reduce power consumption. The module wakes up from  low power idle-mode to active-mode in the following events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see 1.5.1.5, 1.9.1.4)  Automatic periodic enable of the UART interface to receive / send data, with AT+UPSV=1 (see 1.9.1.4)   RTS input set ON by the host DTE, with HW flow control disabled and AT+UPSV=2 (see 1.9.1.4)   DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.1.4)   USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.2)  The connected USB host forces a remote wakeup of the module as USB device (see 1.9.2.4)  The connected u-blox GNSS receiver forces a wakeup of the cellular module using the GNSS Tx data ready function over GPIO3 (see 1.9.3)  The connected SDIO device forces a wakeup of the module as SDIO host (see 1.9.4)  A preset RTC alarm occurs (see u-blox AT Commands Manual [2], AT+CALA) For the definition and the description of TOBY-R2 series modules operating modes, including the events forcing transitions between the different operating modes, see the section 1.4.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 64 of 146 2 Design-in 2.1 Overview For an optimal integration of TOBY-R2 series modules in the final application board follow the design guidelines stated in this section. Every  application  circuit  must  be  properly  designed  to  guarantee  the  correct  functionality  of  the  relative interface, however a number of points require high attention during the design of the application device.  The following list provides a rank of importance in the application design, starting from the highest relevance:  1. Module antenna connection: ANT1, ANT2 and ANT_DET pins. Antenna circuit directly affects the RF compliance of the device integrating  a TOBY-R2 series module with applicable certification schemes. Very carefully follow the suggestions provided in the relative section 2.4 for schematic and layout design. 2. Module supply: VCC and GND pins.  The  supply  circuit  affects  the  RF  compliance  of  the  device  integrating  a  TOBY-R2  series  module  with applicable  required  certification  schemes  as  well  as  antenna  circuit  design.  Very  carefully  follow  the suggestions provided in the relative section 2.2.1 for schematic and layout design.  3. USB interface: USB_D+, USB_D- and VUSB_DET pins.  Accurate  design  is  required  to  guarantee  USB  2.0  high-speed  interface  functionality.  Carefully  follow  the suggestions provided in the relative section 2.6.2 for schematic and layout design. 4. SIM interface: VSIM, SIM_CLK, SIM_IO, SIM_RST pins. Accurate design is required to guarantee SIM card functionality reducing the risk of RF coupling. Carefully follow the suggestions provided in the relative section 2.5 for schematic and layout design. 5. SDIO interface: SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD pins.  Accurate  design  is  required  to  guarantee  SDIO  interface  functionality.  Carefully  follow  the  suggestions provided in the relative section 2.6.4 for schematic and layout design. 6. System functions: RESET_N , PWR_ON pins. Accurate design  is required to guarantee  that the voltage level is  well defined during operation. Carefully follow the suggestions provided in the relative section 2.3 for schematic and layout design.  7. Other digital interfaces: UART, I2C, I2S, Host Select, GPIOs, and Reserved pins. Accurate design is required to guarantee proper functionality and reduce the risk of digital data frequency harmonics coupling. Follow the suggestions provided in sections 2.6.1, 2.6.3, 2.7.1, 2.3.3, 2.8 and 2.9 for schematic and layout design. 8. Other supplies: V_BCKP RTC supply and V_INT generic digital interfaces supply. Accurate  design  is  required  to  guarantee  proper  functionality.  Follow  the  suggestions  provided  in  the corresponding sections 2.2.2 and 2.2.3 for schematic and layout design.   It is recommended to follow the specific design guidelines provided by each manufacturer of any external part selected for the application board integrating the u-blox cellular modules.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 65 of 146 2.2 Supply interfaces 2.2.1 Module supply (VCC) 2.2.1.1 General guidelines for VCC supply circuit selection and design All the available VCC pins have to be connected to the external supply minimizing the power loss due to series resistance. GND pins are internally connected. Application design shall connect all the available pads to solid ground on the application board, since a good  (low impedance)  connection to external ground  can  minimize power loss and improve RF and thermal performance.  TOBY-R2  series  modules  must  be  sourced  through  the  VCC  pins  with  a  proper  DC  power  supply that  should meet the following prerequisites to comply with the modules’ VCC requirements summarized in Table 6. The proper DC power supply can be selected according to the application requirements (see Figure 26) between the different possible supply sources types, which most common ones are the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery  Primary (disposable) battery  Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage > 5V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 26: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage  much  higher  (e.g. greater  than  5  V)  than the  operating supply  voltage of  TOBY-R2  series. The  use of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from the main supply source. See sections 2.2.1.2, 2.2.1.6, 2.2.1.11, 2.2.1.12 for specific design-in. The use of an LDO linear regulator becomes convenient for a primary supply with a relatively low voltage (e.g. less or equal than 5 V). In this case the typical 90% efficiency of the switching regulator diminishes the benefit of  voltage  step-down  and  no  true  advantage  is  gained  in  input  current  savings.  On  the  opposite  side,  linear regulators are not recommended for high voltage step-down as they dissipate a considerable amount of energy in thermal power. See sections 2.2.1.3, 2.2.1.6, 2.2.1.11, 2.2.1.12 for specific design-in. If TOBY-R2 series modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected to  VCC  is  the  usual  choice  for  battery-powered  devices.  During  charging,  batteries  with  Ni-MH  chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. See sections 2.2.1.4, 2.2.1.6, 2.2.1.7, 2.2.1.11, 2.2.1.12 for specific design-in. Keep  in mind  that  the  use  of  rechargeable  batteries  requires  the  implementation  of  a  suitable  charger  circuit which is  not  included in the modules. The charger circuit has to be  designed to prevent  over-voltage on VCC pins,  and  it  should  be  selected  according  to  the  application  requirements:  a  DC/DC  switching  charger  is  the typical choice when the charging source has an high nominal voltage (e.g. ~12 V), whereas a linear charger is
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 66 of 146 the typical choice when the  charging source has  a relatively  low  nominal voltage  (~5 V). If both  a  permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at  the  same  time  as  possible  supply  source,  then  a  proper  charger  /  regulator  with  integrated  power  path management function can be selected to supply the module while simultaneously and independently charging the battery. See sections 2.2.1.8, 2.2.1.9, and 2.2.1.4, 2.2.1.6, 2.2.1.7, 2.2.1.11, 2.2.1.12 for specific design-in. An  appropriate  primary  (not  rechargeable)  battery  can  be  selected  taking  into  account  the  maximum  current specified  in  TOBY-R2  series  Data  Sheet [1]  during  connected-mode,  considering  that  primary  cells  might  have weak power capability. See sections 2.2.1.5, and 2.2.1.6, 2.2.1.7, 2.2.1.11, 2.2.1.12 for specific design-in.  The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply source characteristics, different DC supply systems can result as mutually exclusive. The usage of a regulator or a battery not able to support the highest peak of VCC current consumption specified in the TOBY-R2 series Data Sheet [1] is generally not recommended. However, if the selected regulator or battery is not able to support the highest peak current of the module, it must be able to support with adequate margin at  least  the  highest  averaged  current  consumption  value  specified  in  the  TOBY-R2  series  Data  Sheet [1].  The additional energy required  by the module during a 2G  Tx  slot  can be  provided by an appropriate  bypass  tank capacitor  or  a super-capacitor  with  very  large  capacitance  and  very  low ESR  placed  close  to  the  module  VCC pins. Depending  on  the  actual  capability of the selected  regulator or  battery, the required capacitance  can be considerably larger than 1 mF and the required ESR can be in the range of few tens of m. Carefully evaluate the super-capacitor characteristics since aging and temperature may affect the actual characteristics.  The following sections highlight some design aspects for each of the supplies listed above providing application circuit design-in compliant with the module VCC requirements summarized in Table 6.  2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator The use of a switching regulator is suggested when the difference from the available supply rail  source to the VCC  value  is  high,  since  switching  regulators  provide  good  efficiency  transforming  a  12  V  or  greater  voltage supply to the typical 3.8 V value of the VCC supply. The characteristics of the switching regulator connected to VCC pins should meet the following prerequisites to comply with the module VCC requirements summarized in Table 6:  Power  capability:  the switching  regulator with  its output  circuit  must  be capable of  providing  a  voltage value to the VCC pins within the specified operating range and must  be capable of delivering to  VCC pins the  maximum  peak  /  pulse  current  consumption  during  Tx  burst  at  maximum  Tx  power  specified  in  the TOBY-R2 series Data Sheet [1].  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC voltage profile.  High switching frequency: for best performance and for smaller applications it is recommended to select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be carefully evaluated since this can produce noise in the VCC voltage profile and therefore negatively impact LTE/3G/2G modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output to VCC supply pins can mitigate the ripple at the input of the module, but adds extra voltage drop due to resistive losses on series inductors.  PWM  mode  operation:  it  is  preferable  to  select  regulators  with  Pulse  Width  Modulation  (PWM)  mode. While in  connected-mode,  the  Pulse Frequency  Modulation (PFM)  mode  and  PFM/PWM modes  transitions must be avoided to reduce noise on VCC voltage profile. Switching regulators can be used that are able to switch between low ripple PWM mode and high ripple PFM mode, provided that the mode transition occurs when the module changes status from the idle/active-modes to connected-mode. It is permissible to use a regulator that switches from the PWM mode to the burst or PFM mode at an appropriate current threshold.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 67 of 146 Figure 27 and Table 19 show an example of a high reliability power supply circuit, where the module VCC input is supplied  by  a  step-down  switching regulator capable  of  delivering maximum current with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz.  12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R4R5L1C3U1TOBY-R2 series71 VCC72 VCC70 VCCGND Figure 27: Example of high reliability VCC supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C4 22 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H220JZ01 - Murata C5 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C6 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics R1 470 k Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 k Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 k Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 k Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 k Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo U1 Step-Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 19: Components for high reliability VCC supply application circuit using a step-down regulator
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 68 of 146 Figure 28 and the components listed in Table 20 show an example of a low cost power supply circuit, where the VCC  module  supply  is  provided  by  a  step-down  switching  regulator  capable  of  delivering  to  VCC  pins  the specified maximum peak / pulse current, transforming a 12 V supply input.  TOBY-R2 series12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1 R1R2L1U1GNDFBCOMP54R3C4R4C571 VCC72 VCC70 VCC Figure 28: Example of low cost VCC supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 – Murata C2 100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 – Kemet C3 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 – Murata C4  6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 – Murata C5 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 – Murata C6 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 – Murata D1 Schottky Diode 25V 2 A STPS2L25 – STMicroelectronics L1 5.2 µH Inductor 30% 5.28A 22 m MSS1038-522NL – Coilcraft R1 4.7 k Resistor 0402 1% 0.063 W RC0402FR-074K7L – Yageo R2 910  Resistor 0402 1% 0.063 W RC0402FR-07910RL – Yageo R3 82  Resistor 0402 5% 0.063 W RC0402JR-0782RL – Yageo R4 8.2 k Resistor 0402 5% 0.063 W RC0402JR-078K2L – Yageo R5 39 k Resistor 0402 5% 0.063 W RC0402JR-0739KL – Yageo U1 Step-Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR – ST Microelectronics Table 20: Components for low cost VCC supply application circuit using a step-down regulator
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 69 of 146 2.2.1.3 Guidelines for VCC supply circuit design using a Low Drop-Out linear regulator The use of a linear regulator is suggested when the difference from the available supply rail source and the VCC value is low. The linear regulators provide high efficiency when transforming a 5 VDC supply to a voltage value within the module VCC normal operating range. The characteristics of the Low Drop-Out (LDO) linear regulator connected to VCC pins should meet the following prerequisites to comply with the module VCC requirements summarized in Table 6:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a voltage value to the VCC pins within the specified operating range and must  be capable of delivering to VCC pins the maximum peak / pulse current consumption during Tx burst at maximum Tx power specified in TOBY-R2 series Data Sheet [1].  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the minimum output voltage to evaluate the power dissipation of the regulator).  Figure 29 and  the  components  listed  in Table 21  show  an example of a power  supply  circuit, where the  VCC module  supply  is  provided  by  an  LDO  linear  regulator  capable  of  delivering  the  required  current,  with proper power handling capability. It is recommended to configure the LDO linear regulator  to generate a voltage supply value slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V for the VCC, as in the circuits described in Figure 29 and Table 21). This reduces the power on the linear regulator and improves the thermal design of the circuit.  5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNTOBY-R2 series71 VCC72 VCC70 VCCGNDC3 Figure 29: Example of high reliability VCC supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET R1 47 k Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 9.1 k Resistor 0402 5% 0.1 W RC0402JR-079K1L - Yageo Phycomp R3 3.9 k Resistor 0402 5% 0.1 W RC0402JR-073K9L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 21: Components for high reliability VCC supply application circuit using an LDO linear regulator
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 70 of 146 Figure 30 and the components listed in Table 22 show an example of a low cost power supply circuit, where the VCC  module  supply  is  provided  by  an  LDO  linear  regulator  capable  of  delivering  the  specified  highest  peak  / pulse current, with proper power handling capability. The regulator described in this example supports a limited input voltage range and it includes internal circuitry for current and thermal protection. It is recommended to configure the LDO linear regulator to generate a voltage supply value slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V as in the circuit described in Figure 30 and  Table 22).  This reduces  the power  on  the linear  regulator  and improves  the whole  thermal design  of  the supply circuit.  5VC1IN OUTADJGND12453C2R1R2U1ENTOBY-R2 series71 VCC72 VCC70 VCCGNDC3 Figure 30: Example of low cost VCC supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET R1 27 k Resistor 0402 5% 0.1 W RC0402JR-0727KL - Yageo Phycomp R2 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LP38501ATJ-ADJ/NOPB - Texas Instrument Table 22: Components for low cost VCC supply application circuit using an LDO linear regulator
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 71 of 146 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery Rechargeable  Li-Ion  or  Li-Pol  batteries  connected  to  the  VCC  pins  should  meet  the  following  prerequisites  to comply with the module VCC requirements summarized in Table 6:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its related output circuit connected  to  the  VCC  pins  must  be  capable  of  delivering  a  pulse  current  as  the  maximum  peak  /  pulse current consumption during Tx burst at maximum Tx power specified in TOBY-R2 series Data Sheet [1] and must  be  capable  of  extensively  delivering  a  DC  current  as  the  maximum  average  current  consumption specified  in  TOBY-R2  series Data  Sheet [1].  The  maximum  discharge  current  is not  always  reported  in  the data  sheets  of  batteries,  but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery capacity in Amp-hours divided by 1 hour.  DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop below the operating range summarized in Table 6 during transmit bursts.  2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery The  characteristics  of  a  primary  (non-rechargeable)  battery  connected  to  VCC  pins  should  meet  the  following prerequisites to comply with the module VCC requirements summarized in Table 6:  Maximum  pulse  and  DC  discharge current: the non-rechargeable battery with its related output circuit connected  to  the  VCC  pins  must  be  capable  of  delivering  a  pulse  current  as  the  maximum  peak  current consumption during Tx burst at maximum Tx power specified in TOBY-R2 series Data Sheet [1] and must be capable  of extensively  delivering  a  DC  current  as the  maximum  average  current  consumption  specified  in TOBY-R2 series Data Sheet [1]. The maximum discharge current is not always reported in the data sheets of batteries, but the max DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour.  DC  series  resistance: the  non-rechargeable  battery with its output circuit must be capable  of  avoiding a VCC voltage drop below the operating range summarized in Table 6 during transmit bursts.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 72 of 146 2.2.1.6 Additional guidelines for VCC supply circuit design To reduce  voltage  drops,  use  a  low  impedance  power  source. The  series  resistance  of the  power supply  lines (connected  to  the  modules’  VCC  and  GND  pins)  on  the  application  board  and  battery  pack  should  also  be considered and minimized: cabling and routing must be as short as possible to minimize power losses. Three pins are allocated to VCC supply. Several pins are designated for GND connection. It is recommended to properly connect all of them to supply the module to minimize series resistance losses. In case of modules supporting 2G radio access technology, to avoid voltage drop undershoot and overshoot at the start and end of a transmit burst during a GSM call (when current consumption on the  VCC supply can rise up as specified in the TOBY-R2 series Data Sheet [1]), place a bypass capacitor with large capacitance (at least 100 µF) and low ESR near the VCC pins, for example:  330 µF capacitance, 45 m ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) To reduce voltage ripple and noise, improving RF performance especially if the application device integrates an internal antenna, place the following bypass capacitors near the VCC pins:  68 pF capacitor with Self-Resonant Frequency in the 800/900 MHz range (e.g. Murata GRM1555C1H680J)   15 pF capacitor with Self-Resonant Frequency in 1800/1900 MHz range (e.g. Murata GRM1555C1E150J)   10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  100 nF capacitor (e.g. Murata GRM155R61C104K) to filter digital logic noise from clocks and data sources A suitable series ferrite bead can be properly placed on the VCC line for additional noise filtering if required by the specific application according to the whole application board design.  C2GNDC3 C4TOBY-R2 series71VCC72VCC70VCCC1 C53V8+Recommended for cellular modules supporting 2G Figure 31: Suggested schematic for the VCC bypass capacitors to reduce ripple / noise on supply voltage profile  Reference Description Part Number - Manufacturer C1 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata C2 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET Table 23: Suggested components to reduce ripple / noise on VCC   The necessity of each part depends on the specific design, but it is recommended to provide all the bypass capacitors described in Figure 31 / Table 23 if the application device integrates an internal antenna.  ESD sensitivity rating of the VCC supply pins is 1 kV (HBM according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if accessible battery connector is directly connected to the supply pins. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 73 of 146 2.2.1.7 Additional guidelines for VCC supply circuit design of TOBY-R200 modules TOBY-R200 modules provide separate supply inputs over the VCC pins (see Figure 3):  VCC pins #71 and #72 represent the supply input for the internal RF power amplifier, demanding most of the total current drawn of the module when RF transmission is enabled during a voice/data call  VCC pin #70 represents the supply input for the internal baseband Power Management Unit and the internal transceiver,  demanding  minor  part  of  the  total  current  drawn  of  the  module  when  RF  transmission  is enabled during a voice/data call All the VCC pins are in general intended to be connected to the same external power supply circuit, but separate supply sources can be implemented for specific (e.g. battery-powered) applications considering that the voltage at the VCC pins #71 and #72 can drop to a value lower than the one at the VCC pin #70, keeping the module still switched-on and functional. Figure 32 describes a possible application circuit.  C1 C4 GNDC3C2 C5TOBY-R20071 VCC72 VCC70 VCC+Li-Ion/Li-Pol BatteryC6SWVINSHDNnGNDFB C7R1R2L1U1Step-up RegulatorD1C8 Figure 32: VCC circuit example with separate supply for TOBY-R200 modules  Reference Description Part Number - Manufacturer C1 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C4 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C5 15 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1E150JA01 - Murata C6 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 10 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1E100JA01 - Murata D1 Schottky Diode 40 V 1 A SS14 - Vishay General Semiconductor L1 10 µH Inductor 20% 1 A 276 m SRN3015-100M - Bourns Inc. R1 1 M Resistor 0402 5% 0.063 W RC0402FR-071ML - Yageo Phycomp R2 412 k Resistor 0402 5% 0.063 W RC0402FR-07412KL - Yageo Phycomp U1 Step-up Regulator 350 mA AP3015 - Diodes Incorporated Table 24: Example of components for VCC circuit with separate supply for TOBY-R200 modules
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 74 of 146 2.2.1.8 Guidelines for external battery charging circuit TOBY-R2 series modules do not have an on-board charging circuit. Figure 33 provides an example of a battery charger design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell. In  the  application  circuit,  a  rechargeable  Li-Ion  (or Li-Polymer)  battery  cell,  that  features  proper  pulse  and  DC discharge current capabilities and proper DC series resistance, is directly connected to the  VCC supply input of the module. Battery charging is completely managed by the STMicroelectronics L6924U Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA)  Constant  voltage:  when  the  battery  voltage  reaches  the  regulated  output  voltage  (4.2  V),  the  L6924U starts  to  reduce  the  current  until  the  charge  termination  is  done.  The  charging  process  ends  when  the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. The L6924U, as linear charger, is more suitable for applications where the charging source has a relatively low nominal voltage (~5 V), so that a switching charger is suggested for applications where the charging source has a relatively high nominal voltage (e.g. ~12 V, see the following section 2.2.1.9 for specific design-in). C5 C8C7C6 C9GNDTOBY-R2 series71 VCC72 VCC70 VCC+USB SupplyC3 R4θU1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer    Battery Charger ICD2 Figure 33: Li-Ion (or Li-Polymer) battery charging application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 470  NTC Various manufacturer C1, C4 1 µF Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata C2, C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C7 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C8 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C9 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata D1, D2 Low Capacitance ESD Protection CG0402MLE-18G - Bourns R1, R2 24 k Resistor 0402 5% 0.1 W RC0402JR-0724KL - Yageo Phycomp R3 3.3 k Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R4 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp U1 Single Cell Li-Ion (or Li-Polymer) Battery Charger IC  L6924U - STMicroelectronics Table 25: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 75 of 146 2.2.1.9 Guidelines for external battery charging and power path management circuit Application devices where both a permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at the same time as possible supply source should implement a suitable  charger  /  regulator  with  integrated  power  path management  function  to  supply the  module  and the whole device while simultaneously and independently charging the battery. Figure 34 reports a simplified block diagram circuit showing the working principle of a charger / regulator with integrated power path management function. This component allows the system to be powered by a permanent primary  supply  source  (e.g.  ~12  V)  using  the  integrated  regulator  which  simultaneously  and  independently recharges the battery (e.g. 3.7 V Li-Pol) that represents the back-up supply source of the system: the power path management  feature  permits  the  battery  to  supplement  the  system  current  requirements  when  the  primary supply source is not available or cannot deliver the peak system currents. A power management IC should meet the following prerequisites to comply with the module VCC requirements summarized in Table 6:  High efficiency internal step down converter, compliant with the performances specified in section 2.2.1.2  Low internal resistance in the active path Vout – Vbat, typically lower than 50 m  High efficiency switch mode charger with separate power path control  GNDPower path management ICVoutVinθLi-Ion/Li-Pol Battery PackGNDSystem12 V Primary SourceCharge controllerDC/DC converter and battery FET control logicVbat Figure 34: Charger / regulator with integrated power path management circuit block diagram  Figure 35 and the components listed in Table 26 provide an application circuit example where the MPS MP2617 switching  charger  /  regulator  with  integrated  power  path  management  function  provides  the  supply  to  the cellular  module  while  concurrently  and  autonomously  charging  a  suitable  Li-Ion  (or  Li-Polymer)  battery  with proper pulse and DC discharge current capabilities and proper DC series resistance according to the rechargeable battery recommendations described in section 2.2.1.4. The MP2617 IC constantly  monitors the battery voltage  and  selects  whether to use  the  external main primary supply / charging source or the battery as supply source for the module, and starts a charging phase accordingly.  The  MP2617  IC  normally  provides  a  supply  voltage  to  the  module  regulated  from  the  external  main  primary source  allowing  immediate  system operation  even  under  missing  or  deeply  discharged  battery:  the  integrated switching step-down regulator is capable to provide up to 3 A output current with low output ripple and fixed 1.6  MHz  switching  frequency  in  PWM  mode  operation.  The  module  load  is  satisfied  in  priority,  then  the integrated switching charger will take the remaining current to charge the battery. Additionally, the power path control allows an internal connection from battery to the module with a low series internal ON resistance (40 m typical), in order to supplement additional power to the module when the current demand increases over the external main primary source or when this external source is removed.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 76 of 146 Battery charging is managed in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant  current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for the application  Constant  voltage: when  the battery voltage reaches  the regulated output  voltage  (4.2  V),  the current  is progressively reduced  until the charge  termination is done. The  charging process ends when  the charging current reaches the 10% of the fast-charge current or when the charging timer reaches the value configured by an external capacitor  Using a battery pack with an internal NTC resistor, the MP2617 can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Several parameters as the charging current, the charging timings, the input current limit, the input voltage limit, the  system  output  voltage  can  be  easily  set  according  to  the  specific  application  requirements,  as  the  actual electrical characteristics of the battery and the external supply / charging source: proper resistors or capacitors have to be accordingly connected to the related pins of the IC.  C10 C13GNDC12C11 C14TOBY-R2 series71 VCC72 VCC70 VCC+Primary SourceR3U1ENILIMISETTMRAGNDVINC2C112VNTCPGNDSWSYSBATC4R1R2D1θLi-Ion/Li-Pol Battery PackB1C5Li-Ion/Li-Polymer Battery   Charger / Regulator with Power Path ManagmentVCCC3 C6L1BSTD2VLIMR4R5C7 C8 Figure 35: Li-Ion (or Li-Polymer) battery charging and power path management application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 10 k NTC Various manufacturer C1, C5, C6 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C2, C4, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C3 1 µF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E105KA12 - Murata C7, C13 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C8, C14 15 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E150JA01 - Murata C10 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C12 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata D1, D2 Low Capacitance ESD Protection CG0402MLE-18G - Bourns R1, R3, R5 10 k Resistor 0402 5% 1/16 W RC0402JR-0710KL - Yageo Phycomp R2 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp R4 22 k Resistor 0402 5% 1/16 W RC0402JR-0722KL - Yageo Phycomp L1 1.2 µH Inductor 6 A 21 m 20% 7447745012 - Wurth U1 Li-Ion/Li-Polymer Battery DC/DC Charger / Regulator with integrated Power Path Management function MP2617 - Monolithic Power Systems (MPS) Table 26: Suggested components for Li-Ion (or Li-Polymer) battery charging and power path management application circuit
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 77 of 146 2.2.1.10 Guidelines for removing VCC supply As described in section 1.6.2 and Figure 15, the  VCC supply can be removed after the end of  TOBY-R2 series modules  internal  power-off  sequence,  which  has  to  be  properly  started  sending  the  AT+CPWROFF  command (see u-blox AT Commands Manual [2]).  Removing the VCC power can be useful in order to minimize the current consumption when the TOBY-R2 series modules are switched off. Then, the modules can be switched on again by re-applying the VCC supply. If the VCC supply  is  generated  by  a  switching or an LDO  regulator, the application processor  may control the input pin of the regulator which is provided to enable / disable the output of the regulator (as for example the RUN input pin for the regulator described in Figure 27, the INH input pin for the regulator described in Figure 28, the SHDNn  input pin for  the regulator  described in  Figure  29, the EN  input pin for the  regulator  described  in Figure 30), in order to apply / remove the VCC supply. If the regulator that generates the VCC supply does not provide an on / off pin, or for other applications such as the battery-powered ones, the VCC supply can be switched off using an appropriate external p-channel MOSFET controlled by the application processor  by  means of a  proper inverting transistor as shown in Figure 36, given that the external p-channel MOSFET has provide:  Very low RDS(ON) (for example, less than 50 m), to minimize voltage drops   Adequate maximum Drain current (see TOBY-R2 series Data Sheet [1] for module consumption figures)  Low leakage current, to minimize the current consumption  C3GNDC2C1 C4TOBY-R2 series71 VCC72 VCC70 VCC+VCC Supply SourceGNDGPIO C5R1R3R2T2T1Application Processor Figure 36: Example of application circuit for VCC supply removal Reference Description Part Number - Manufacturer R1 47 k Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp R2 10 k Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R3 100 k Resistor 0402 5% 0.1 W  RC0402JR-07100KL - Yageo Phycomp T1 P-Channel MOSFET Low On-Resistance AO3415 - Alpha & Omega Semiconductor Inc.  T2 NPN BJT Transistor BC847 - Infineon C1 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C4 56 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E560JA01 - Murata C5 15 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1E150JA01 - Murata Table 27: Components for VCC supply removal application circuit   It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY-R2 series modules normal operations: the power off procedure must be started by the AT+CPWROFF command, waiting the command response for a proper time period (see  u-blox AT Commands Manual [2]), and then a proper VCC supply  has  to  be  held  at  least  until  the  end  of  the  modules’  internal  power  off  sequence,  which occurs when the generic digital interfaces supply output (V_INT) is switched off by the module.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 78 of 146 2.2.1.11 Guidelines for VCC supply layout design Good  connection  of  the  module  VCC  pins  with  DC  supply  source  is  required  for  correct  RF  performance. Guidelines are summarized in the following list:  All the available VCC pins must be connected to the DC source  VCC connection must be as wide as possible and as short as possible  Any series component with Equivalent Series Resistance (ESR) greater than few milliohms must be avoided  VCC connection must be routed through a PCB area separated from RF lines / parts, sensitive analog signals and sensitive functional units: it is good practice to interpose at least one layer of PCB ground between the VCC track and other signal routing  Coupling between VCC and digital lines, especially USB, must be avoided.  The tank bypass capacitor with low ESR for current spikes smoothing described in section 2.2.1.6 should be placed  close  to  the  VCC  pins.  If  the  main  DC  source  is  a  switching  DC-DC  converter,  place  the  large capacitor  close  to  the  DC-DC  output  and  minimize  VCC  track  length.  Otherwise  consider  using  separate capacitors for DC-DC converter and module tank capacitor  The  bypass  capacitors  in  the  pF  range  described  in  Figure  31  and  Table  23  should  be  placed  as  close  as possible  to the  VCC  pins,  where  the  VCC  line  narrows  close  to  the  module  input  pins,  improving  the  RF noise  rejection  in  the  band  centered  on  the  Self-Resonant  Frequency  of  the  pF  capacitors.  This  is  highly recommended if the application device integrates an internal antenna  Since VCC input provide the supply to RF Power Amplifiers, voltage ripple at high frequency may result in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case it is better to select the highest operating frequency for the switcher and add a large L-C filter before connecting to the TOBY-R2 series modules in the worst case  Shielding of  switching DC-DC converter circuit,  or  at least the use of  shielded inductors  for  the  switching DC-DC converter, may be considered since all switching power supplies may potentially generate interfering signals as a result of high-frequency high-power switching.  If  VCC  is  protected  by  transient  voltage  suppressor  to  ensure  that  the  voltage  maximum  ratings  are  not exceeded,  place the  protecting device  along the  path from  the DC  source toward  the module,  preferably closer to the DC source (otherwise protection functionality may be compromised)  2.2.1.12 Guidelines for grounding layout design Good connection of the module GND pins with application board solid ground layer is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer  The VCC supply current flows back to main DC source through GND as ground current: provide adequate return path with suitable uninterrupted ground plane to main DC source  It is recommended to implement one layer of the application board as ground plane as wide as possible  If  the  application  board  is  a  multilayer  PCB,  then  all  the  board layers  should  be  filled  with  GND  plane  as much as possible and each  GND area should be connected together with complete via stack down to the main ground layer of the board. Use as many vias as possible to connect the ground planes  Provide a dense line of vias at the edges of each ground area, in particular along RF and high speed lines  If the whole application device is composed by more than one PCB, then it is required to provide a good and solid ground connection between the GND areas of all the different PCBs  Good grounding of GND pads also ensures thermal heat sink. This is critical during connection, when the real  network  commands  the  module  to  transmit  at  maximum  power:  proper  grounding  helps  prevent module overheating.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 79 of 146 2.2.2 RTC supply output (V_BCKP) 2.2.2.1 Guidelines for V_BCKP circuit design TOBY-R2 series modules provide the V_BCKP RTC supply input/output, which can be mainly used to:   Provide RTC back-up when VCC supply is removed  If RTC timing is required to run for a time interval of T [s] when VCC supply is removed, place a capacitor with a nominal capacitance of C [µF] at the V_BCKP pin. Choose the capacitor using the following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 2.5 x T [s]  For example, a 100 µF capacitor can be placed at V_BCKP to provide RTC backup holding the V_BCKP voltage within its valid range for around  40 s at 25 °C, after the VCC  supply is removed. If a longer buffering time is required, a 70 mF super-capacitor can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 8 hours at 25 °C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to  let  a  fast  rise  time  of  the  voltage  value  at  the  V_BCKP  pin  after  VCC  supply  has  been  provided.  These capacitors allow the time reference to run during battery disconnection. TOBY-R2 seriesC1(a)3V_BCKPR2TOBY-R2 seriesC2(superCap)(b)3V_BCKPD3TOBY-R2 seriesB3(c)3V_BCKP Figure 37: Real time clock supply (V_BCKP) application circuits: (a) using a 100 µF capacitor to let the RTC run for ~80 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~15 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 28: Example of components for V_BCKP buffering If very long buffering time is required to allow the RTC time reference to run during a disconnection of the VCC supply,  then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a proper  nominal voltage  and must  never exceed the  maximum operating  voltage  for  V_BCKP  (specified  in  the Input characteristics of Supply/Power pins table in TOBY-R2 series Data Sheet [1]). The connection of the battery to  V_BCKP  should  be  done  with  a  suitable  series  resistor  for  a  rechargeable  battery,  or  with  an  appropriate series diode for  a  non-rechargeable  battery.  The  purpose  of the  series  resistor  is to limit  the  battery  charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the  V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery.   If  the  RTC  timing  is  not  required  when  the  VCC  supply  is  removed,  it  is  not  needed  to  connect  the V_BCKP pin to an external capacitor or battery. In this case the date and time are not updated when VCC is disconnected. If VCC is always  supplied, then the internal  regulator  is supplied from the  main supply and there is no need for an external component on V_BCKP.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 80 of 146 Combining a  TOBY-R2  series  cellular module  with a u-blox  GNSS  positioning receiver, the  positioning  receiver VCC supply is controlled by the cellular module by means of the “GNSS supply enable” function provided by the GPIO2 of the cellular module. In this case the V_BCKP supply output of the cellular module can be connected to the V_BCKP backup  supply input pin of the  GNSS receiver  to provide the supply for the  positioning real time clock and backup RAM when the VCC supply of the cellular module is within its operating range and the  VCC supply  of  the  GNSS  receiver  is  disabled.  This  enables  the  u-blox  GNSS  receiver  to  recover  from  a  power breakdown with either a hot start or a warm start (depending on the duration of the  positioning VCC outage) and  to  maintain  the  configuration  settings  saved  in the  backup  RAM.  Refer  to  section  2.6.3  for  more  details regarding the application circuit with a u-blox GNSS receiver.   The internal regulator for V_BCKP is optimized for low leakage current and very light loads. Do not apply loads which might exceed the limit for maximum available current from V_BCKP supply, as this can cause malfunctions in the module. TOBY-R2 series Data Sheet [1] describes the detailed electrical characteristics.  V_BCKP  supply  output  pin  provides  internal  short  circuit  protection  to  limit  start-up  current  and  protect  the device in short circuit situations. No additional external short circuit protection is required.   ESD sensitivity rating of the V_BCKP supply pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible back-up battery connector is directly connected to V_BCKP pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point.  2.2.2.2 Guidelines for V_BCKP layout design V_BCKP supply requires careful layout: avoid injecting noise on this voltage domain as it may affect the stability of the internal circuitry.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 81 of 146 2.2.3 Generic digital interfaces supply output (V_INT)  2.2.3.1 Guidelines for V_INT circuit design TOBY-R2 series provide the V_INT generic digital interfaces 1.8 V supply output, which can be mainly used to:  Indicate when the module is switched on (as described in sections 1.6.1, 1.6.2)  Pull-up SIM detection signal (see section 2.5 for more details)  Supply voltage translators to connect 1.8 V module generic digital interfaces to 3.0 V devices (e.g. see 2.6.1)  Pull-up DDC (I2C) interface signals (see section 2.6.3 for more details)  Supply a 1.8 V u-blox 6 or subsequent u-blox GNSS receiver generation (see section 2.6.3 for more details)  Supply an external device, as an external 1.8 V audio codec (see section 2.7.1 for more details)  V_INT supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required.   Do not apply loads which might exceed the limit for maximum available current from  V_INT supply (see the TOBY-R2 series Data Sheet [1]) as this can cause malfunctions in internal circuitry.  Since  the  V_INT  supply  is  generated  by  an  internal  switching  step-down  regulator,  the  V_INT  voltage ripple  can  range  as  specified  in  the  TOBY-R2  series Data  Sheet [1]:  it  is  not  recommended  to  supply sensitive analog circuitry without adequate filtering for digital noise.  V_INT can only be used as an output: do not connect any external supply source on V_INT.  ESD sensitivity rating  of  the  V_INT supply pin is 1  kV  (Human Body  Model according to JESD22-A114). Higher  protection  level  could  be  required  if  the  line  is  externally  accessible  and  it  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point.  It is  recommended  to provide  direct access  to the  V_INT  pin on  the  application  board by  means  of  an accessible test point directly connected to the V_INT pin.  2.2.3.2 Guidelines for V_INT layout design V_INT supply output is generated by an integrated switching step-down converter. Because of this, it can be a source of noise: avoid coupling with sensitive signals.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 82 of 146 2.3 System functions interfaces 2.3.1 Module power-on (PWR_ON) 2.3.1.1 Guidelines for PWR_ON circuit design TOBY-R2  series  PWR_ON  input  is  equipped  with  an  internal  active  pull-up  resistor  to  the  V_BCKP  supply  as described in Figure 38: an external pull-up resistor is not required and should not be provided.  If  connecting  the  PWR_ON  input  to  a  push  button,  the  pin  will  be  externally  accessible  on  the  application device. According to EMC/ESD requirements of the application, an additional ESD protection should be provided close to the accessible point, as described in Figure 38 and Table 29.   ESD sensitivity rating of the PWR_ON pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if  an accessible push button is directly connected to PWR_ON pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to the accessible point.  An open drain or open collector output is suitable to drive the PWR_ON input from an application processor, as the pin is equipped with an internal active pull-up resistor to the V_BCKP supply, as described in Figure 38. A compatible  push-pull output of an application  processor can  also be used. In any  case, take  care to set  the proper level in all the possible scenarios to avoid an inappropriate module switch-on.  TOBY-R2 series10 k3V_BCKP20 PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-R2 series10 k3V_BCKP20 PWR_ONTP TP Figure 38: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 29: Example ESD protection component for the PWR_ON application circuit   It is recommended to provide direct access to the PWR_ON pin on the application board by means of an accessible test point directly connected to the PWR_ON pin.  2.3.1.2 Guidelines for PWR_ON layout design The power-on circuit (PWR_ON) requires careful layout since it is the sensitive input available to switch on the TOBY-R2 series modules. It is required to ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious power-on request.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 83 of 146 2.3.2 Module reset (RESET_N) 2.3.2.1 Guidelines for RESET_N circuit design TOBY-R2 series RESET_N is equipped with an internal pull-up to the V_BCKP  supply as described in Figure 39. An external pull-up resistor is not required. If connecting the RESET_N input to a push button, the pin will be externally accessible on the application device. According  to  EMC/ESD  requirements  of  the  application,  an  additional  ESD  protection  device  (e.g.  the  EPCOS CA05P4S14THSG  varistor)  should  be  provided  close  to  accessible  point  on  the  line  connected  to  this  pin,  as described in Figure 39 and Table 30.   ESD  sensitivity  rating  of  the  RESET_N  pin  is  1  kV  (HBM  according  to  JESD22-A114).  Higher  protection level can be required if the line is externally accessible on the application board, e.g. if an accessible push button is directly connected to the RESET_N pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.  An open drain output is suitable to drive the RESET_N input from an application processor as it is equipped with an internal pull-up to V_BCKP supply, as described in Figure 39. A compatible push-pull output of an application processor can  also be used. In any case,  take care to set  the proper level in all the possible scenarios to avoid an inappropriate module reset, switch-on or switch-off.  TOBY-R2 series3V_BCKP23 RESET_NPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-R2 series3V_BCKP23 RESET_NTP TP10 k10 k Figure 39: RESET_N application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 30: Example of ESD protection component for the RESET_N application circuits   If the external reset function is not required by the customer application, the  RESET_N input pin can be left  unconnected  to  external  components,  but  it  is  recommended  providing  direct  access  on  the application board by means of an accessible test point directly connected to the RESET_N pin.  2.3.2.2 Guidelines for RESET_N layout design The RESET_N circuit require careful layout due to the pin function: ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious reset request. It is recommended to keep the connection line to RESET_N pin as short as possible.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 84 of 146 2.3.3 Module / host configuration selection 2.3.3.1 Guidelines for HOST_SELECTx circuit design  Selection of module / host configuration over HOST_SELECT0 and HOST_SELECT1 pins is not supported: the two pins should not be driven by the host application processor or any other external device.  TOBY-R2 series modules include two pins (HOST_SELECT0 and HOST_SELECT1) for the selection of the module / host application processor configuration.   Do not apply voltage to  HOST_SELECT0 and HOST_SELECT1  pins before the switch-on of their supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit  connections  and  set  to  high impedance before V_INT switch-on.  ESD sensitivity rating of the HOST_SELECT0 and HOST_SELECT1 pins is 1 kV (HBM as per JESD22-A114). Higher protection level could  be  required if the lines are externally accessible and it can be  achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points  If  the  HOST_SELECT0  and  HOST_SELECT1  pins  are  not  used,  they  can  be  left  unconnected  on  the application board.  2.3.3.2 Guidelines for HOST_SELECTx layout design The  pins  for  the  selection  of  the  module  /  host  application  processor  configuration  (HOST_SELECT0  and HOST_SELECT1) are generally not critical for layout.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 85 of 146 2.4 Antenna interface TOBY-R2 series modules provide two RF interfaces for connecting the external antennas:  The ANT1 pin represents the primary RF input/output for LTE/3G/2G RF signals transmission and reception.   The ANT2 pin represents the secondary RF input for LTE Rx diversity RF signals reception.  Both the ANT1 and the ANT2 pins have a nominal characteristic impedance of 50  and must be connected to the related antenna through a 50  transmission line to allow proper transmission / reception of RF signals.   Two antennas (one connected to ANT1 pin and one connected to ANT2 pin) must be used to support the LTE  Rx  diversity  radio  technology.  This is  a  required  feature  for  LTE  category  1  User  Equipments  (up to 10.2 Mb/s Down-Link data rate) according to 3GPP specifications.  2.4.1 Antenna RF interfaces (ANT1 / ANT2) 2.4.1.1 General guidelines for antenna selection and design The antenna is the most critical component to be evaluated. Designers must take care of the antennas from all perspective  at  the  very  start  of  the  design  phase  when  the  physical  dimensions  of  the  application  board  are under analysis/decision, since the RF  compliance of the device integrating TOBY-R2 series modules with all the applicable required certification schemes depends on antennas radiating performance.  LTE/3G/2G antennas are typically available in the types of linear monopole or PCB antennas such as patches or ceramic SMT elements.  External antennas (e.g. linear monopole) o External antennas basically do not imply physical restriction to the design of the PCB where the TOBY-R2 series module is mounted. o The  radiation  performance  mainly  depends  on  the  antennas.  It  is  required  to  select  antennas  with optimal radiating performance in the operating bands. o RF cables should be carefully selected to have minimum insertion losses. Additional insertion loss will be introduced by low quality or long cable. Large insertion loss reduces both transmit and receive radiation performance. o A  high  quality  50   RF  connector  provides  proper  PCB-to-RF-cable  transition.  It  is  recommended  to strictly follow the layout and cable termination guidelines provided by the connector manufacturer.  Integrated antennas (e.g. patch-like antennas): o Internal integrated antennas imply physical restriction to the design of the PCB:  Integrated antenna excites RF currents on its counterpoise, typically the PCB ground plane of the device that becomes part of the antenna: its dimension defines the minimum frequency that can be radiated. Therefore,  the  ground  plane  can  be  reduced  down  to  a  minimum  size  that  should  be  similar  to  the quarter of the wavelength of the minimum frequency that has to be radiated, given that the orientation of the ground plane relative to the antenna element must be considered. The isolation between the primary and the  secondary  antennas has  to  be as high as possible  and the correlation  between  the  3D  radiation  patterns  of  the  two  antennas  has  to  be  as  low  as  possible.  In general, a separation of at least a quarter wavelength between the two antennas is required to achieve a good isolation and low pattern correlation. As numerical example, the physical restriction to the PCB design can be considered as following:   Frequency = 750 MHz  Wavelength = 40 cm  Minimum GND plane size = 10 cm
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 86 of 146 o Radiation  performance  depends  on  the  whole  PCB  and  antenna  system  design,  including  product mechanical design and usage. Antennas should be selected with optimal radiating performance in the operating bands according to the mechanical specifications of the PCB and the whole product. o It is recommended to select a  pair  of custom antennas  designed by an  antennas’  manufacturer if  the required  ground  plane  dimensions  are  very  small  (e.g.  less  than  6.5  cm  long  and  4  cm  wide).  The antenna design process should begin at the start of the whole product design process o It is highly recommended to strictly follow the detailed and specific guidelines provided by the antenna manufacturer regarding correct installation and deployment of the antenna system, including PCB layout and matching circuitry o Further to the custom PCB and product restrictions, antennas may require tuning to obtain the required performance for compliance with all the applicable required certification schemes. It is recommended to consult  the  antenna  manufacturer  for  the  design-in  guidelines  for  antenna  matching  relative  to  the custom application  In both of cases, selecting external or internal antennas, these recommendations should be observed:  Select antennas providing optimal return loss (or V.S.W.R.) figure over all the operating frequencies.  Select antennas providing optimal efficiency figure over all the operating frequencies.  Select antennas providing similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna.  Select antennas providing appropriate gain figure (i.e. combined antenna directivity and efficiency figure) so that  the  electromagnetic  field  radiation  intensity  do  not  exceed  the  regulatory  limits  specified  in  some countries (e.g. by FCC in the United States, as reported in the section 4.2.2).  Select antennas capable to provide low Envelope Correlation Coefficient between the primary (ANT1) and the secondary (ANT2) antenna: the 3D antenna radiation patterns should have lobes in different directions.  2.4.1.2 Guidelines for antenna RF interface design Guidelines for ANT1 / ANT2 pins RF connection design Proper transition between ANT1 / ANT2 pads and the application board PCB must be provided, implementing the following design-in guidelines for the layout of the application PCB close to the ANT1 / ANT2 pads:  On a multilayer board, the whole layer stack below the RF connection should be free of digital lines  Increase GND keep-out (i.e. clearance, a void area) around the ANT1 / ANT2 pads, on the top layer of the application  PCB,  to  at  least  250 µm  up  to  adjacent  pads  metal  definition and  up  to  400 µm  on  the  area below the module, to reduce parasitic capacitance to ground, as described in the left picture in Figure 40  Add GND keep-out (i.e. clearance, a void area) on the buried metal layer below the  ANT1 / ANT2 pads if the top-layer to buried layer dielectric thickness is below 200 µm, to reduce parasitic capacitance to ground, as described in the right picture in Figure 40  Min. 250 µmMin. 400 µm GNDANT1GND clearance on very close buried layerbelow ANT1 padGND clearance on top layer around ANT1 padMin. 250 µmMin. 400 µmGNDANT2GND clearance on very close buried layerbelow ANT2 padGND clearance on top layer around ANT2 pad Figure 40: GND keep-out area on top layer around ANT1 / ANT2 pads and on very close buried layer below ANT1 / ANT2 pads
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 87 of 146 Guidelines for RF transmission line design Any RF transmission line, such as the ones from the ANT1 and ANT2 pads up to the related antenna connector or up to the related internal antenna pad, must be designed so that the characteristic impedance is as close as possible to 50 . RF transmission lines can be designed as a micro strip (consists of a conducting strip separated from a ground plane by a dielectric material) or a strip line (consists of a flat strip of metal which is sandwiched between two parallel ground planes within a dielectric material). The micro strip, implemented as a coplanar waveguide, is the most common configuration for printed circuit board.  Figure 41 and Figure 42 provide two examples of proper 50  coplanar waveguide designs. The first example of RF  transmission  line  can  be  implemented  in  case  of  4-layer  PCB  stack-up  herein  described,  and  the  second example of RF transmission line can be implemented in case of 2-layer PCB stack-up herein described.  35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric380 µm 500 µm500 µm Figure 41: Example of 50  coplanar waveguide transmission line design for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric1200 µm 400 µm400 µm Figure 42: Example of 50  coplanar waveguide transmission line design for the described 2-layer board layup If the two examples do not  match  the application PCB  stack-up the  50   characteristic impedance  calculation can be made using the HFSS commercial finite element method solver for electromagnetic structures from Ansys Corporation,  or  using  freeware  tools  like  AppCAD  from  Agilent  (www.agilent.com)  or  TXLine  from  Applied Wave  Research  (www.mwoffice.com),  taking  care  of  the  approximation  formulas  used  by  the  tools  for  the impedance computation. To achieve a 50  characteristic impedance, the width of the transmission line must be chosen depending on:  the thickness of the transmission line itself (e.g. 35 µm in the example of Figure 41 and Figure 42)  the thickness of the dielectric material between the top layer (where the transmission line is routed) and the inner closer layer implementing the ground plane (e.g. 270 µm in Figure 41, 1510 µm in Figure 42)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 88 of 146  the  dielectric  constant  of  the  dielectric  material  (e.g.  dielectric  constant  of  the  FR-4  dielectric  material  in Figure 41 and Figure 42)  the gap from the transmission line to the adjacent ground plane on the same layer of the transmission line (e.g. 500 µm in Figure 41, 400 µm in Figure 42)  If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the micro strip, use the “Coplanar Waveguide” model for the 50  calculation.  Additionally to the 50  impedance, the following guidelines are recommended for transmission lines design:  Minimize  the transmission  line length:  the  insertion  loss  should  be minimized as much  as possible,  in the order of a few tenths of a dB,  Add GND keep-out (i.e. clearance, a void area) on buried metal layers below any pad of component present on  the  RF  transmission  lines,  if  top-layer  to  buried  layer  dielectric  thickness  is  below  200 µm,  to  reduce parasitic capacitance to ground,  The transmission lines width and spacing to GND must be uniform and routed as smoothly as possible: avoid abrupt changes of width and spacing to GND,  Add GND stitching vias around transmission lines, as described in Figure 43,  Ensure  solid  metal  connection  of  the  adjacent  metal  layer  on  the  PCB  stack-up  to  main  ground  layer, providing enough vias on the adjacent metal layer, as described in Figure 43,  Route RF transmission lines far from any noise source (as switching supplies and digital lines) and from any sensitive circuit (as USB),  Avoid stubs on the transmission lines,  Avoid signal routing in parallel to transmission lines or crossing the transmission lines on buried metal layer,  Do not route microstrip lines below discrete component or other mechanics placed on top layer  An  example  of  proper  RF  circuit  design  is  reported  in  Figure  43.  In  this  case,  the  ANT1  and  ANT2  pins  are directly connected to SMA connectors by means of proper 50  transmission lines, designed with proper layout.  SMA Connector Primary AntennaSMA Connector Secondary AntennaTOBY Figure 43: Example of circuit and layout for antenna RF circuits on application board
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 89 of 146 Guidelines for RF termination design RF terminations must provide a characteristic impedance of 50  as well as the RF transmission lines up to the RF terminations themselves, to match the characteristic impedance of the ANT1 / ANT2 ports of the modules. However,  real  antennas  do  not  have  perfect  50   load  on  all  the  supported  frequency  bands.  Therefore,  to reduce as much as possible performance degradation due to antennas mismatch, RF terminations must provide optimal return loss (or V.S.W.R.) figure over all the operating frequencies, as summarized in Table 7 and Table 8.  If external antennas are used, the antenna connectors represent the RF termination on the PCB:  Use suitable 50  connectors providing proper PCB-to-RF-cable transition.  Strictly follow the connector manufacturer’s recommended layout, for example:  o SMA Pin-Through-Hole  connectors require  GND keep-out (i.e.  clearance, a void  area)  on all the  layers around the central pin up to annular pads of the four GND posts, as shown in Figure 43 o U.FL surface mounted  connectors require  no conductive traces (i.e. clearance,  a void area) in the area below the connector between the GND land pads.  Cut out the GND layer under RF connectors and close to buried vias, to remove stray capacitance and thus keep the RF line 50 , e.g. the active pad of UFL connectors needs to have a GND keep-out (i.e. clearance, a void area) at least on first inner layer to reduce parasitic capacitance to ground.  If integrated antennas are used, the RF terminations are represented by the integrated antennas themselves. The following guidelines should be followed:  Use antennas designed by an antenna manufacturer, providing the best possible return loss (or V.S.W.R.).  Provide a ground plane large enough according to the relative integrated antenna requirements. The ground plane of the application PCB can be reduced down to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated. As numerical example,   Frequency = 750 MHz  Wavelength = 40 cm  Minimum GND plane size = 10 cm  It  is  highly  recommended  to  strictly  follow  the  detailed  and  specific  guidelines  provided  by  the  antenna manufacturer  regarding  correct  installation  and  deployment  of  the  antenna  system,  including  PCB  layout and matching circuitry.  Further to the custom PCB and product restrictions, antennas may require a tuning to comply with all the applicable  required certification  schemes.  It is  recommended  to  consult the  antenna  manufacturer  for the design-in guidelines for the antenna matching relative to the custom application.  Additionally, these recommendations regarding the antenna system placement must be followed:  Do not place antennas within closed metal case.  Do not place the antennas in close vicinity to end user since the emitted radiation in human tissue is limited by regulatory requirements.  Place the antennas far from sensitive analog systems or employ countermeasures to reduce EMC issues.  Take care of interaction between co-located RF systems since the LTE/3G/2G transmitted power may interact or disturb the performance of companion systems.  Place the two LTE antennas providing low Envelope Correlation Coefficient (ECC) between primary (ANT1) and secondary (ANT2) antenna: the antenna 3D radiation patterns should have lobes in different directions. The  ECC  between  primary  and  secondary  antenna  needs  to  be  enough  low  to  comply  with  the  radiated performance requirements specified by related certification schemes, as indicated in Table 9.  Place  the  two  LTE  antennas  providing  enough  high  isolation  (see  Table  9)  between  primary  (ANT1)  and secondary (ANT2) antenna. The isolation depends on the distance between antennas (separation of at least a quarter wavelength required for good isolation), antenna type (using antennas with different polarization improves isolation), antenna 3D radiation patterns (uncorrelated patterns improve isolation).
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 90 of 146 Examples of antennas Table 31 lists some examples of possible internal on-board surface-mount antennas.  Manufacturer Part Number Product Name Description Taoglas PA.710.A Warrior GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PA.711.A Warrior II GSM / WCDMA / LTE SMD Antenna Pairs with the Taoglas PA.710.A Warrior for LTE MIMO applications 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PCS.06.A Havok GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2500..2690 MHz 42.0 x 10.0 x 3.0 mm Antenova SR4L002 Lucida  GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  35.0 x 8.5 x 3.2 mm Table 31: Examples of internal surface-mount antennas  Table 32 lists some examples of possible internal off-board PCB-type antennas with cable and connector.  Manufacturer Part Number Product Name Description Taoglas FXUB63.07.0150C  GSM / WCDMA / LTE PCB Antenna with cable and U.FL  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 96.0 x 21.0 mm Taoglas FXUB66.07.0150C Maximus GSM / WCDMA / LTE PCB Antenna with cable and U.FL  698..960 MHz, 1390..1435 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz, 3400..3600 MHz, 4800..6000 MHz 120.2 x 50.4 mm Taoglas FXUB70.A.07.C.001  GSM / WCDMA / LTE PCB MIMO Antenna with cables and U.FL  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 182.2 x 21.2 mm Ethertronics 5001537 Prestta GSM / WCDMA / LTE PCB Antenna with cable  704..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2500..2690 MHz 80.0 x 18.0 mm EAD FSQS35241-UF-10 SQ7 GSM / WCDMA / LTE PCB Antenna with cable and U.FL  690..960 MHz, 1710..2170 MHz, 2500..2700 MHz 110.0 x 21.0 mm Table 32: Examples of internal antennas with cable and connector
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 91 of 146 Table 33 lists some examples of possible external antennas.  Manufacturer Part Number Product Name Description Taoglas GSA.8827.A.101111  Phoenix GSM / WCDMA / LTE adhesive-mount antenna with cable and SMA(M)  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2490..2690 MHz 105 x 30 x 7.7 mm Taoglas TG.30.8112  GSM / WCDMA / LTE swivel dipole antenna with SMA(M)  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz  148.6 x 49 x 10 mm Taoglas MA241.BI.001 Genesis GSM / WCDMA / LTE MIMO 2in1 adhesive-mount combination antenna waterproof IP67 rated with cable and SMA(M) 698..960 MHz, 1710..2170 MHz, 2400..2700 MHz  205.8 x 58 x 12.4 mm Laird Tech. TRA6927M3PW-001  GSM / WCDMA / LTE screw-mount antenna with N-type(F)  698..960 MHz, 1710..2170 MHz, 2300..2700 MHz  83.8 x Ø 36.5 mm Laird Tech. CMS69273  GSM / WCDMA / LTE ceiling-mount antenna with cable and N-type(F)  698..960 MHz, 1575.42 MHz, 1710..2700 MHz  86 x Ø 199 mm Laird Tech. OC69271-FNM  GSM / WCDMA / LTE pole-mount antenna with N-type(M)  698..960 MHz, 1710..2690 MHz 248 x Ø 24.5 mm Laird Tech. CMD69273-30NM  GSM / WCDMA / LTE ceiling-mount MIMO antenna with cables & N-type(M)  698..960 MHz, 1710..2700 MHz  43.5 x Ø 218.7 mm Pulse Electronics WA700/2700SMA  GSM / WCDMA / LTE clip-mount MIMO antenna with cables and SMA(M)  698..960 MHz,1710..2700 MHz 149 x 127 x 5.1 mm Table 33: Examples of external antennas
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 92 of 146 2.4.2 Antenna detection interface (ANT_DET) 2.4.2.1 Guidelines for ANT_DET circuit design Figure 44 and Table 34 describe the recommended schematic / components for the antennas detection circuit that  must  be  provided  on  the  application  board  and  for  the  diagnostic  circuit  that  must  be  provided  on  the antennas’ assembly to achieve primary and secondary antenna detection functionality.  Application BoardAntenna CableTOBY-R2 series81ANT175ANT_DET R1C1 D1C2 J1Z0= 50 ohm Z0= 50 ohm Z0= 50 ohmPrimary Antenna AssemblyR2C4L3Radiating ElementDiagnostic CircuitL2L1Antenna Cable87ANT2C3 J2Z0= 50 ohm Z0= 50 ohm Z0= 50 ohmSecondary Antenna AssemblyR3C5L4Radiating ElementDiagnostic Circuit Figure 44: Suggested schematic for antenna detection circuit on application board and diagnostic circuit on antennas assembly Reference Description Part Number - Manufacturer C1 27 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H270J - Murata C2, C3 33 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H330J - Murata D1 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics L1, L2 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R1 10 k Resistor 0402 1% 0.063 W RK73H1ETTP1002F - KOA Speer J1, J2 SMA Connector 50  Through Hole Jack SMA6251A1-3GT50G-50 - Amphenol C4, C5 22 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1H220J - Murata L3, L4 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R2, R3 15 k Resistor for Diagnostic Various Manufacturers Table 34: Suggested components for antenna detection circuit on application board and diagnostic circuit on antennas assembly  The antenna detection circuit and diagnostic circuit suggested in Figure 44 and Table 34 are explained here:  When antenna detection is forced by AT+UANTR command, ANT_DET generates a DC current measuring the resistance (R2 // R3) from antenna connectors (J1, J2) provided on the application board to GND.  DC blocking capacitors are needed at the ANT1 / ANT2 pins (C2, C3) and at the antenna radiating element (C4, C5) to decouple the DC current generated by the ANT_DET pin.  Choke inductors with a Self Resonance Frequency (SRF) in the range of 1 GHz are needed in series at the ANT_DET  pin  (L1,  L2)  and  in  series  at  the  diagnostic  resistor  (L3,  L4),  to  avoid  a  reduction  of  the  RF performance of the system, improving the RF isolation of the load resistor.   Additional components (R1, C1 and D1 in Figure 44) are needed at the ANT_DET pin as ESD protection  The ANT1 / ANT2 pins must be connected to the antenna connector by means of a transmission line with nominal characteristics impedance as close as possible to 50 .
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 93 of 146 The DC impedance  at  RF  port for some  antennas may be a  DC  open (e.g. linear  monopole) or a  DC  short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 44, the measured DC  resistance  is  always  at  the  limits  of  the  measurement  range  (respectively  open  or  short),  and  there  is  no means  to  distinguish  between  a  defect  on  antenna  path  with  similar  characteristics  (respectively:  removal  of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.   It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 k to 30 k to  assure  good  antenna  detection  functionality  and  avoid  a  reduction  of  module  RF  performance.  The choke inductor should exhibit a parallel Self Resonance Frequency (SRF) in the range of 1 GHz to improve the RF isolation of load resistor.  For example: Consider  an  antenna  with  built-in  DC  load  resistor  of  15  k.  Using  the  +UANTR  AT  command,  the  module reports the resistance value evaluated from the antenna connector provided on the application board to GND:  Reported  values  close to  the  used  diagnostic resistor  nominal  value  (i.e. values  from  13  k to 17  k if  a 15 k diagnostic resistor is used) indicate that the antenna is properly connected.  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  k)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [2]) means that that the antenna is not connected or the RF cable is broken.  Reported values below the measurement range minimum limit (1 k) highlights a short to GND at antenna or along the RF cable.  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic.  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method.   If  the  primary  /  secondary  antenna  detection  function  is  not  required  by  the  customer  application,  the ANT_DET  pin  can  be  left  not  connected  and  the  ANT1 /  ANT2  pins  can  be directly  connected  to  the related antenna connector by means of a 50  transmission line as described in Figure 43.  2.4.2.2 Guidelines for ANT_DET layout design The recommended layout for the primary antenna detection circuit to be provided on the application board to achieve  the  primary  antenna  detection  functionality,  implementing  the  recommended  schematic  described  in Figure 44 and Table 34, is explained here:  The ANT1 / ANT2 pins have to be connected to the antenna connector by means of a  50  transmission line, implementing the design guidelines described in section  2.4.1 and the recommendations of the SMA connector manufacturer.  DC blocking capacitor at ANT1 / ANT2 pins (C2, C3) has to be placed in series to the 50  RF line.  The ANT_DET pin has to be connected to the 50  transmission line by means of a sense line.  Choke inductors in series at the ANT_DET pin (L1, L2) have to be  placed so that one pad is on the  50  transmission line and the other pad represents the start of the sense line to the ANT_DET pin.  The additional components (R1, C1 and D1) on the ANT_DET line have to be placed as ESD protection.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 94 of 146 2.5 SIM interface 2.5.1 Guidelines for SIM circuit design Guidelines for SIM cards, SIM connectors and SIM chips selection The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and functional  characteristics  of  Universal  Integrated  Circuit  Cards  (UICC),  which  contains  the  Subscriber Identification  Module  (SIM)  integrated  circuit  that  securely  stores  all  the  information  needed  to  identify  and authenticate subscribers over the LTE/3G/2G network.  Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221 as follows:  Contact C1 = VCC (Supply)           It must be connected to VSIM   Contact C2 = RST (Reset)           It must be connected to SIM_RST   Contact C3 = CLK (Clock)           It must be connected to SIM_CLK   Contact C4 = AUX1 (Auxiliary contact)       It must be left not connected  Contact C5 = GND (Ground)          It must be connected to GND  Contact C6 = VPP (Programming supply)       It can be left not connected   Contact C7 = I/O (Data input/output)        It must be connected to SIM_IO   Contact C8 = AUX2 (Auxiliary contact)       It must be left not connected A removable SIM card can have 6 contacts (C1, C2, C3, C5, C6, C7) or 8 contacts, also including the auxiliary contacts C4 and C8. Only 6 contacts are required and must be connected to the module SIM interface. Removable SIM cards are suitable for applications requiring a change of SIM card during the product lifetime.  A SIM card holder can have 6 or 8 positions  if a  mechanical card  presence detector  is not  provided,  or  it can have 6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch integrated in the SIM connector for the mechanical card presence detection are provided. Select a SIM connector providing 6+2 or  8+2  positions  if  the optional  SIM detection  feature is required  by  the  custom application, otherwise  a connector without integrated mechanical presence switch can be selected.  Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as:  Case Pin 8 = UICC Contact C1 = VCC (Supply)     It must be connected to VSIM   Case Pin 7 = UICC Contact C2 = RST (Reset)       It must be connected to SIM_RST   Case Pin 6 = UICC Contact C3 = CLK (Clock)       It must be connected to SIM_CLK   Case Pin 5 = UICC Contact C4 = AUX1 (Aux.contact)     It must be left not connected  Case Pin 1 = UICC Contact C5 = GND (Ground)     It must be connected to GND  Case Pin 2 = UICC Contact C6 = VPP (Progr. supply)    It can be left not connected  Case Pin 3 = UICC Contact C7 = I/O (Data I/O)    It must be connected to SIM_IO   Case Pin 4 = UICC Contact C8 = AUX2 (Aux. contact)    It must be left not connected A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses,  but only 6 contacts are required and must be connected to the module SIM card interface as described above. Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 95 of 146 Guidelines for single SIM card connection without detection A removable SIM card placed in a SIM card holder  has  to be connected to the SIM card interface of TOBY-R2 series modules as described in Figure 45, where the optional SIM detection feature is not implemented. Follow these guidelines to connect the module to a SIM connector without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) on SIM supply line, close to the relative pad of the SIM connector, to prevent digital noise.  Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder.  Provide  a  very  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Tyco  PESD0402-140)  on  each externally accessible SIM line, close to each relative pad of the SIM connector. ESD sensitivity rating of the SIM interface pins is 1 kV (HBM). So that, according to EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device.  Limit capacitance  and  series resistance  on each  SIM  signal  to  match the  SIM requirements  (27.7 ns  is the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-R2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4C8C4 Figure 45: Application circuits for the connection to a single removable SIM card, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3, D4 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  J1 SIM Card Holder, 6 p, without card presence switch Various manufacturers, as C707 10M006 136 2 - Amphenol Table 35: Example of components for the connection to a single removable SIM card, with SIM detection not implemented
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 96 of 146 Guidelines for single SIM chip connection A solderable SIM chip (M2M UICC Form Factor) has to be connected the SIM card interface of TOBY-R2 series modules as described in Figure 46. Follow these guidelines to connect the module to a solderable SIM chip without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Provide  a  100  nF  bypass  capacitor  (e.g.  Murata  GRM155R71C104K)  at  the  SIM  supply  line  close  to  the relative pad of the SIM chip, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM lines.  Limit capacitance  and  series resistance  on each  SIM  signal to  match the  SIM  requirements  (27.7  ns is the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-R2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5U1C4283671C1 C5C2 C6C3 C7C4 C887651234 Figure 46: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata U1 SIM chip (M2M UICC Form Factor) Various Manufacturers Table 36: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 97 of 146 Guidelines for single SIM card connection with detection A removable SIM card  placed  in a  SIM card  holder  must be connected  to  the SIM card  interface  of TOBY-R2 series modules as described in Figure 47, where the optional SIM card detection feature is implemented. Follow these guidelines to connect the module to a SIM connector implementing SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) to the VSIM pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Connect one pin of the normally-open mechanical switch integrated in the SIM connector (e.g. the SW2 pin as described in Figure 47) to the GPIO5 input pin of the module.  Connect  the  other  pin  of  the  normally-open  mechanical  switch  integrated  in  the  SIM connector  (e.g.  the SW1 pin as described in Figure 47) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 47.  Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 47  Provide  a  100  nF  bypass  capacitor  (e.g.  Murata  GRM155R71C104K)  at  the  SIM  supply  line,  close  to  the related pad of the SIM connector, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder.  Provide  a  very  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Tyco  PESD0402-140)  on  each externally accessible SIM line, close to each  related pad of the SIM connector: ESD sensitivity rating of the SIM interface pins is 1 kV (HBM), so that, according to the EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device.  Limit capacitance  and  series resistance  on each  SIM  signal to  match the  SIM  requirements  (27.7  ns is the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-R2 series5V_INT60GPIO5SIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4SW1SW2D1 D2 D3 D4 D5 D6R2R1C8C4TP59VSIM57SIM_IO56SIM_CLK58SIM_RST Figure 47: Application circuit for the connection to a single removable SIM card, with SIM detection implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, … , D6 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 1 k Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 k Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder, 6 + 2 p, with card presence switch Various manufacturers, as CCM03-3013LFT R102 - C&K  Table 37: Example of components for the connection to a single removable SIM card, with SIM detection implemented
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 98 of 146 Guidelines for dual SIM card / chip connection  Two SIM card / chip can be connected to the SIM interface of TOBY-R2 series modules as described in Figure 48. TOBY-R2 series modules do not support the usage of two SIM at the same time, but two SIM can be populated on the application board, providing a proper switch to connect only the first or only the second SIM at a time to the SIM interface of the modules, as described in Figure 48. TOBY-R2 series modules support SIM hot insertion / removal on the GPIO5 pin, to enable / disable SIM interface upon detection of external SIM card physical insertion / removal: if the feature is enabled using the specific AT commands  (see  sections  1.8.2  and  1.11,  and  u-blox  AT  Commands  Manual  [2],  +UGPIOC,  +UDCONF=50 commands), the switch from first SIM to the second SIM can be properly done when a Low logic level is present on the GPIO5 pin (“SIM not inserted” = SIM interface not enabled), without the necessity of a module re-boot, so that the SIM interface will be re-enabled by the module to use the second SIM when a high logic level is re-applied on the GPIO5 pin. In the application circuit example  represented in Figure 48, the application processor  will drive the SIM switch using its own GPIO to properly select the SIM that is used by the module. Another GPIO may be used to handle the SIM hot insertion / removal function of TOBY-R2 series modules, which can also be handled by other external circuits or by the cellular module GPIO according to the application requirements. The  dual  SIM  connection  circuit  described  in  Figure  48  can  be  implemented  for  SIM  chips  as  well,  providing proper connection between SIM switch and SIM chip as described in Figure 46. If it is required to switch between more than  2 SIM, a circuit similar to the one described in Figure 48 can be implemented: in case of 4 SIM circuit, using proper 4-throw switch instead of the suggested 2-throw switches.  Follow these guidelines to connect the module to two external SIM connectors:  Use a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) 2-throw analog switch (e.g. Fairchild FSA2567) as SIM switch to ensure high-speed data transfer according to SIM requirements.  Connect the contacts C1 (VCC) of the two UICC / SIM to the VSIM pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C7 (I/O) of the two UICC / SIM to the SIM_IO pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect  the contact  C3 (CLK)  of the  two  UICC /  SIM  to the  SIM_CLK pin  of the  module by  means of  a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect  the  contact  C2 (RST)  of  the two  UICC /  SIM  to  the  SIM_RST  pin  of  the  module  by  means  of  a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C5 (GND) of the two UICC / SIM to ground.  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply (VSIM), close to the related pad of the two SIM connectors, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close  to  each  related  pad  of  the  two  SIM  connectors,  to  prevent  RF  coupling  especially  in  case  the  RF antenna is placed closer than 10 - 30 cm from the SIM card holders.  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each pad of the two SIM connectors, according to the EMC/ESD requirements of the custom application.  Limit capacitance  and  series resistance  on each  SIM  signal to  match the SIM  requirements  (27.7  ns is  the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 99 of 146 TOBY-R2 seriesC1FIRST             SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4GNDU159VSIM VSIM 1VSIM2VSIMVCCC114PDT Analog Switch3V857SIM_IO DAT 1DAT2DAT56SIM_CLK CLK 1CLK2CLK58SIM_RST RST 1RST2RSTSELSECOND   SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6 C7 C8 C10C9 D5 D6 D7 D8Application ProcessorGPIOR1 Figure 48: Application circuit for the connection to two removable SIM cards, with SIM detection not implemented Reference Description Part Number – Manufacturer C1 – C4, C6 – C9 33 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H330JZ01 – Murata C5, C10, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 – Murata D1 – D8 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 47 k Resistor 0402 5% 0.1 W RC0402JR-0747KL- Yageo Phycomp J1, J2 SIM Card Holder, 6 + 2 p., with card presence switch CCM03-3013LFT R102 - C&K Components U1 4PDT Analog Switch,  with Low On-Capacitance and Low On-Resistance FSA2567 - Fairchild Semiconductor Table 38: Example of components for the connection to two removable SIM cards, with SIM detection not implemented  2.5.2 Guidelines for SIM layout design The layout of the SIM card interface lines (VSIM, SIM_CLK, SIM_IO, SIM_RST may be critical if the SIM card is placed  far  away  from  the  TOBY-R2  series  modules  or  in  close  proximity  to  the  RF  antenna:  these  two  cases should be avoided or at least mitigated as described below.  In the first case, the long connection can cause the radiation of some harmonics of the digital data frequency as any  other  digital  interface.  It  is  recommended  to  keep  the  traces  short  and  avoid  coupling  with  RF  line  or sensitive analog inputs. In  the  second  case,  the  same  harmonics  can  be  picked  up  and  create  self-interference  that  can  reduce  the sensitivity of LTE/3G/2G receiver channels whose carrier frequency is coincidental with harmonic frequencies. It is strongly recommended to place the RF bypass capacitors suggested in Figure 45 near the SIM connector. In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges. Add adequate ESD protection as suggested to protect module SIM pins near the SIM connector. Limit  capacitance  and  series  resistance  on  each  SIM  signal  to  match  the  SIM  specifications.  The  connections should always be kept as short as possible. Avoid coupling with any sensitive analog circuit, since the SIM signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 100 of 146 2.6 Data communication interfaces 2.6.1 UART interface 2.6.1.1 Guidelines for UART circuit design Providing the full RS-232 functionality (using the complete V.24 link) If RS-232 compatible signal levels are needed, two different external voltage translators  can be used to provide full RS-232 (9 lines) functionality: e.g. using the Texas Instruments SN74AVC8T245PW for the translation from 1.8 V to 3.3 V, and the Maxim MAX3237E for the translation from 3.3 V to RS-232 compatible signal level. If a 1.8 V Application Processor (DTE) is used and complete RS-232 functionality is required, then the complete 1.8 V UART interface of the module (DCE) should be connected to a 1.8 V DTE, as described in Figure 49. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTP0ΩTP Figure 49: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 50. 5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR1DIR3 OEB2 A2B4A4DIR4DIR2TP0ΩTP0ΩTP0ΩTP0ΩTP Figure 50: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T77414 - Texas Instruments Table 39: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE)                                                       14 Voltage translator providing partial power down feature so that the DTE 3.0 V supply can be also ramped up before V_INT 1.8 V supply
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 101 of 146 Providing the TXD, RXD, RTS, CTS and DTR lines only (not using the complete V.24 link) If the functionality of the DSR, DCD and RI lines is not required, or the lines are not available:  Leave DSR, DCD and RI lines of the module floating, with a test-point on DCD  If RS-232 compatible signal levels are needed, two different external voltage translators (e.g. Maxim MAX3237E and Texas Instruments SN74AVC4T774) can be used. The Texas Instruments chips provide the translation from 1.8 V to 3.3 V, while the Maxim chip provides the translation from 3.3 V to RS-232 compatible signal level.  Figure  51  describes  the  circuit  that  should  be  implemented  as  if  a  1.8  V  Application  Processor  (DTE)  is  used, given that the DTE will behave properly regardless DSR input setting. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series(1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0 Ω0 ΩTPTP0 ΩTPTP Figure 51: UART interface application circuit with partial V.24 link (6-wire) in the DTE/DCE serial communication (1.8 V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in  Figure 52, given that the DTE will behave properly regardless DSR input setting. 5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series(1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0 Ω0 ΩTPTP0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2VCCBVCCAUnidirectionalVoltage TranslatorC33V0DIR1OEB2 A2DIR2 C4 Figure 52: UART interface application circuit with partial V.24 link (6-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T77415 - Texas Instruments U2 Unidirectional Voltage Translator SN74AVC2T24515 - Texas Instruments Table 40: Component for UART application circuit with partial V.24 link (6-wire) in DTE/DCE serial communication (3.0 V DTE)                                                       15 Voltage translator providing partial power down feature so that the DTE 3.0 V supply can be also ramped up before V_INT 1.8 V supply
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 102 of 146 Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required in, or the lines are not available:  Connect the module DTR input to GND using a 0  series resistor, since it may be useful to set DTR active if not specifically handled (see u-blox AT Commands Manual [2], &D, S0, +CSGT, +CNMI AT commands)  Leave DSR, DCD and RI lines of the module floating, with a test-point on DCD  If RS-232 compatible signal levels are needed, the Maxim MAX13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.  If a 1.8 V Application Processor is used, the circuit should be implemented as described in Figure 53.  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTPTP Figure 53: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 54.  5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR4TP0ΩTP0ΩTP0ΩTPTP Figure 54: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T77416 - Texas Instruments Table 41: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE)                                                        16 Voltage translator providing partial power down feature so that the DTE 3.0 V supply can be also ramped up before V_INT 1.8 V supply
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 103 of 146 Providing the TXD and RXD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, then:  Connect  the  module  RTS  input  line  to  GND  or  to  the  CTS  output  line  of  the  module:  since  the  module requires RTS active (low electrical level) if HW flow-control is enabled (AT&K3, which is the default setting)  Connect the module DTR input line to GND using a 0  series resistor, because it is useful to set DTR active if not specifically handled (see u-blox AT Commands Manual [2], &D, S0, +CSGT, +CNMI AT commands)  Leave DSR, DCD and RI lines of the module floating, with a test-point on DCD  If RS-232 compatible signal levels are needed, the Maxim MAX13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.   If a 1.8 V Application Processor (DTE) is used, the circuit that should be implemented as described in Figure 55. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTPTP Figure 55: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 56. 5V_INTTxDApplication Processor(3.0V DTE)RxDDTRDSRRIDCDGNDTOBY-R2 series (1.8V DCE)16 TXD13 DTR17 RXD10 DSR11 RI12 DCDGND1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2 OEVCCB2 A2RTSCTS14 RTS15 CTSTP0ΩTP0ΩTP0ΩTPTP Figure 56: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T24517 - Texas Instruments Table 42: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE)                                                       17 Voltage translator providing partial power down feature so that the DTE 3.0 V supply can be also ramped up before V_INT 1.8 V supply
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 104 of 146 Additional considerations If  a  3.0  V  Application  Processor  (DTE)  is  used,  the  voltage  scaling  from  any  3.0  V  output  of  the  DTE  to  the corresponding  1.8  V  input  of  the  module  (DCE)  can  be  implemented  as  an  alternative  low-cost  solution,  by means of an appropriate voltage divider. Consider the value of the pull-up integrated at the input of the module (DCE) for the correct selection of the voltage divider resistance values and mind that any DTE signal connected to the  module  must  be  tri-stated  or  set  low  when  the  module  is  in  power-down  mode  and  during  the  module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module (see the remark below).  Moreover, the voltage scaling from any 1.8 V output of the cellular module (DCE) to the  corresponding 3.0 V input of the Application Processor (DTE) can be implemented by means of an appropriate low-cost non-inverting buffer with open drain output. The non-inverting buffer should be supplied by the V_INT  supply output of the cellular module. Consider the value of the pull-up integrated at each input of the DTE (if any) and the baud rate required by the application for the appropriate selection of the resistance value for the external pull-up biased by the application processor supply rail.   If power saving is enabled the application circuit with the TXD and RXD lines only is not recommended. During command mode the DTE must send to the module a wake-up character or a dummy “AT” before each command line (see section 1.9.1.4 for the complete description), but during data mode the wake-up character or the dummy “AT” would affect the data communication.   Do not apply voltage to any UART interface pin before the switch-on of the UART supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the  cellular  module  cannot  be  tri-stated  or  set  low,  insert  a  multi  channel  digital  switch  (e.g.  TI SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit  connections  and  set  to  high impedance before V_INT switch-on.   ESD  sensitivity  rating  of  UART  interface  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher protection level could  be  required if the lines are externally accessible  and  it  can be achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.   If the UART interface pins are not used, they can be left unconnected on the application board, but  it is recommended providing  accessible test points directly connected to the  TXD, RXD, DTR and DCD pins for diagnostic purpose, in particular providing a 0  series jumper on each line to detach each UART pin of the module from the DTE application processor.  2.6.1.2 Guidelines for UART layout design The UART serial interface requires the same consideration regarding electro-magnetic interference as any other digital  interface.  Keep  the  traces  short  and  avoid  coupling  with  RF  line  or  sensitive  analog  inputs,  since  the signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 105 of 146 2.6.2 USB interface 2.6.2.1 Guidelines for USB circuit design The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for full speed signaling handshake, as well as in differential mode for high speed signaling and data transfer. USB pull-up or pull-down resistors and external series resistors on USB_D+ and USB_D- lines as required by the USB 2.0 specification [6] are part of the module USB pins driver and do not need to be externally provided. The USB interface of the module is enabled only if a valid voltage is detected by the  VUSB_DET input (see the TOBY-R2 series Data Sheet [1]). Neither the USB interface, nor the whole module is supplied by the VUSB_DET input: the VUSB_DET senses the USB supply voltage and absorbs few microamperes. Routing the USB pins to a connector, they will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection device with very low capacitance should be provided close to accessible point on the line connected to this pin, as described in Figure 57 and Table 43.   The  USB interface  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F). Higher protection level could  be  required if the lines are externally accessible and it can be achieved by mounting  a  very  low  capacitance  (i.e.  less  or  equal  to  1  pF)  ESD  protection  (e.g.  Tyco  Electronics PESD0402-140 ESD protection device) on the lines connected to these pins, close to accessible points.  The USB pins of the modules can be directly connected to the USB host application processor without additional ESD protections if they are not externally accessible or according to EMC/ESD requirements.  D+D-GND28 USB_D+27 USB_D-GNDUSB DEVICE CONNECTORVBUSD+D-GND28 USB_D+27 USB_D-GNDUSB HOST PROCESSORTOBY-R2 series  TOBY-R2 series VBUS 4VUSB_DET4VUSB_DETD1 D2 D3 C1 C1 Figure 57: USB Interface application circuits Reference Description Part Number - Manufacturer C1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata D1, D2, D3 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  Table 43: Component for USB application circuits   If the USB interface pins are not used, they can be left unconnected on the application board, but it is recommended providing accessible test points directly connected to VUSB_DET, USB_D+, USB_D- pins.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 106 of 146 2.6.2.2 Guidelines for USB layout design The USB_D+ / USB_D- lines require accurate layout design to achieve reliable signaling at the high speed data rate (up to 480 Mb/s) supported by the USB serial interface.  The characteristic impedance of the USB_D+ / USB_D- lines is specified by the Universal Serial Bus Revision 2.0 specification  [6].  The  most  important  parameter  is  the  differential  characteristic  impedance  applicable  for  the odd-mode electromagnetic field, which should be as close as possible to 90  differential. Signal integrity may be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long. Use the following general routing guidelines to minimize signal quality problems:  Route USB_D+ / USB_D- lines as a differential pair  Route USB_D+ / USB_D- lines as short as possible  Ensure the differential characteristic impedance (Z0) is as close as possible to 90   Ensure the common mode characteristic impedance (ZCM) is as close as possible to 30   Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area  Figure  58  and  Figure  59  provide  two  examples  of  coplanar  waveguide  designs  with  differential  characteristic impedance close to 90  and common mode characteristic impedance close to 30 . The first transmission line can  be  implemented  in  case  of  4-layer  PCB  stack-up  herein  described,  the  second  transmission  line  can  be implemented in case of 2-layer PCB stack-up herein described.  35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric350 µm 400 µm400 µm350 µm400 µm Figure 58: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric740 µm 410 µm410 µm740 µm410 µm Figure 59: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 2-layer board layup
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 107 of 146 2.6.3 DDC (I2C) interface 2.6.3.1 Guidelines for DDC (I2C) circuit design  Communication with u-blox GNSS receivers over DDC (I2C) is not supported by “02” product versions.  The DDC I2C-bus master  interface can be used to communicate with u-blox GNSS receivers and other external I2C-bus slaves as an audio codec. Beside the general considerations reported below, see:  the following parts of this section for specific guidelines for the connection to u-blox GNSS receivers  the section 2.7.1 for an application circuit example with an external audio codec I2C-bus slave.  To be compliant with the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be mounted externally. Resistor values must conform to I2C bus specifications [12]: for example, 4.7 k resistors can be commonly used. Pull-ups must be connected to a supply voltage of 1.8 V (typical), since this is the voltage domain of the DDC pins which are not tolerant to higher voltage values (e.g. 3.0 V).   Connect the DDC (I2C) pull-ups to the V_INT 1.8 V supply source, or another 1.8 V supply source enabled after V_INT (e.g., as the GNSS 1.8 V supply present in Figure 60 application circuit), as any external signal connected to the DDC (I2C) interface must not be set high before the switch-on of the V_INT supply of DDC (I2C) pins, to avoid latch-up of circuits and let a proper boot of the module.  The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase  the capacitance. If  the bus  capacitance  is  increased, use  pull-up  resistors with  nominal resistance value lower than 4.7 k, to match the I2C bus specifications [12] regarding rise and fall times of the signals.   Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible.  If the pins are not used as DDC bus interface, they can be left unconnected.  ESD  sensitivity  rating  of  the  DDC  (I2C)  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher protection level could  be  required if the lines are externally accessible  and  it  can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 108 of 146 Connection with u-blox 1.8 V GNSS receivers Figure 60 shows an application circuit for connecting the cellular modules to a u-blox 1.8 V GNSS receiver.  SDA / SCL pins of the cellular module are directly connected to the relative I2C pins of the u-blox 1.8 V GNSS receiver,  with  appropriate  pull-up  resistors  connected  to  the  1.8  V GNSS  supply  enabled  after  the  V_INT supply of the I2C pins of the cellular module.  GPIO2  pin  is  connected  to  the  shutdown  input  pin  (SHDNn)  of  the  LDO  regulators  providing  the  1.8  V supply rail for the u-blox 1.8 V GNSS receiver implementing the “GNSS enable” function, with appropriate pull-down resistor mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver.  GPIO3 and GPIO4 pins are directly connected respectively to TXD1 and EXTINT0 pins of the u-blox 1.8 V GNSS receiver providing “GNSS Tx data ready” and “GNSS RTC sharing” functions.  The V_BCKP supply output of the cellular module is connected to the  V_BCKP backup supply input pin of the GNSS receiver to provide the supply for the GNSS real time clock and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either a hot start or a warm start (depending  on  the  actual  duration  of  the  GNSS  VCC  outage)  and  to  maintain  the  configuration  settings saved in the backup RAM.  R1INOUTGNDGNSS LDORegulatorSHDNnu-blox GNSS1.8 V receiverSDA2SCL2R21V8 1V8VMAIN1V8U122 GPIO2SDASCLC1TxD1 GPIO3555424VCCR3V_BCKP V_BCKP3GNSS Tx data readyGNSS supply enabledTOBY-R2 series(except ‘02’ product versions)EXTINT0 GPIO425GNSS RTC sharing Figure 60: Application circuit for connecting TOBY-R2 series modules to u-blox 1.8 V GNSS receivers Reference Description Part Number - Manufacturer R1, R2 4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 k Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp U1, C1 Voltage Regulator for GNSS receiver and capacitor See GNSS receiver Hardware Integration Manual Table 44: Components for connecting TOBY-R2 series modules to u-blox 1.8 V GNSS receivers
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 109 of 146 Figure 61 illustrates an alternative application circuit solution in which the cellular module supplies a u-blox 1.8 V GNSS receiver. The V_INT 1.8 V regulated supply output of the cellular module can be used as supply source for a  u-blox  1.8  V  GNSS  receiver  (u-blox  6  generation  receiver  or  newer)  instead  of  using  an  external  voltage regulator,  as  shown  in  Figure  60. The  V_INT  supply is  able to  support the maximum current  consumption  of these positioning receivers. The internal switching step-down regulator that generates the  V_INT supply is set to 1.8 V (typical) when the cellular module is switched on and it is disabled when the module is switched off. The supply of the u-blox 1.8 V GNSS receiver can be switched off using an external p-channel MOS controlled by the  GPIO2  pin  of  the  cellular  modules  by  means  of  a  proper  inverting  transistor  as  shown  in  Figure  61, implementing the “GNSS supply enable” function. If this feature is not required, the V_INT supply output can be directly connected to the u-blox 1.8 V GNSS receiver, so that it will switch on when V_INT output is enabled. According to the V_INT supply output voltage ripple characteristic specified in TOBY-R2 series Data Sheet [1]:  Additional filtering may be needed to properly supply an external LNA, depending on the characteristics of the used LNA, adding a series ferrite bead and a bypass capacitor (e.g. the Murata BLM15HD182SN1 ferrite bead and the Murata GRM1555C1H220J 22 pF capacitor) at the input of the external LNA supply line  u-blox GNSS1.8 V receiverTxD1V_BCKP V_BCKP3SDA2SCL2VCC1V8C1R35V_INTR5R4TPT2T1R1 R21V8 1V8GNSS data readyGNSS supply enabled 22 GPIO2SDASCLGPIO3555424TOBY-R2 series(except ‘02’ product versions)EXTINT0 GPIO425GNSS RTC sharing Figure 61: Application circuit for connecting TOBY-R2 series modules to u-blox 1.8 V GNSS receivers using V_INT as supply Reference Description Part Number - Manufacturer R1, R2 4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 k Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp R4 10 k Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R5 100 k Resistor 0402 5% 0.1 W  RC0402JR-07100KL - Yageo Phycomp T1 P-Channel MOSFET Low On-Resistance IRLML6401 - International Rectifier or NTZS3151P - ON Semi T2 NPN BJT Transistor BC847 - Infineon C1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata Table 45: Components for connecting TOBY-R2 series modules to u-blox 1.8 V GNSS receivers using V_INT as supply  For additional  guidelines regarding the  design of applications  with  u-blox 1.8  V GNSS  receivers  see  the  GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 110 of 146 Connection with u-blox 3.0 V GNSS receivers Figure 62 shows an application circuit for connecting the cellular modules to a u-blox 3.0 V GNSS receiver:  As the SDA and SCL pins of the cellular module are not tolerant up to 3.0 V, the connection to the related I2C pins  of  the u-blox  3.0  V  GNSS  receiver  must  be  provided  using  a  proper  I2C-bus  Bidirectional  Voltage Translator with proper pull-up resistors (e.g. the TI TCA9406 additionally provides the partial power down feature so that the GNSS 3.0 V supply can be ramped up before the V_INT 1.8 V cellular supply).  GPIO2  pin  is  connected  to  the  shutdown  input  pin  (SHDNn)  of  the  LDO  regulators  providing  the  3.0  V supply rail for the u-blox 3.0 V GNSS receiver implementing the “GNSS enable” function, with appropriate pull-down resistor mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver.  As the  GPIO3 and GPIO4 pins of the cellular module are not tolerant up to 3.0 V, the connection to the related  pins  of  the  u-blox  3.0  V  GNSS  receiver  must  be  provided  using  a  proper  Unidirectional  General Purpose  Voltage  Translator  (e.g.  TI  SN74AVC2T245,  which  additionally  provides  the  partial  power  down feature so that the 3.0 V GNSS supply can be also ramped up before the V_INT 1.8 V cellular supply).  The V_BCKP supply output of the cellular module can be directly connected to the V_BCKP backup supply input pin of the GNSS receiver as in the application circuit for a u-blox 1.8 V GNSS receiver. u-blox GNSS 3.0 V receiver24 GPIO31V8B1 A1GNDU3B2A2VCCBVCCAUnidirectionalVoltage TranslatorC4 C53V0TxD1R1INOUTGNSS LDO RegulatorSHDNnR2VMAIN3V0U122 GPIO255 SDA54 SCLR4 R51V8SDA_A SDA_BGNDU2SCL_ASCL_BVCCAVCCBI2C-bus Bidirectional Voltage Translator2V_INTC1C2 C3R3SDA2SCL2VCCDIR1DIR23V_BCKPV_BCKPOEnOEGNSS data readyGNSS supply enabledGNDTOBY-R2 series(except ‘02’ product versions)EXTINT0 GPIO425GNSS RTC sharing Figure 62: Application circuit for connecting TOBY-R2 series modules to u-blox 3.0 V GNSS receivers Reference Description Part Number - Manufacturer R1, R2, R4, R5 4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 k Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1, C1 Voltage Regulator for GNSS receiver and capacitor  See GNSS receiver Hardware Integration Manual U2 I2C-bus Bidirectional Voltage Translator TCA9406DCUR - Texas Instruments U3 Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 46: Components for connecting TOBY-R2 series modules to u-blox 3.0 V GNSS receivers For additional  guidelines regarding the  design of applications  with  u-blox 3.0  V GNSS  receivers  see  the  GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers.  2.6.3.2 Guidelines for DDC (I2C) layout design The  DDC  (I2C)  serial  interface  requires  the  same  consideration  regarding  electro-magnetic  interference  as  any other digital interface. Keep the traces short and avoid coupling with RF line or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 111 of 146 2.6.4 SDIO interface 2.6.4.1 Guidelines for SDIO circuit design  The  functionality  of  the  SDIO  Secure  Digital  Input  Output  interface  pins  is  not  supported  by  TOBY-R2 series modules “02” product versions: the pins should not be driven by any external device.   TOBY-R2 series modules include a 4-bit Secure Digital Input Output interface (SDIO_D0, SDIO_D1,  SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) designed to communicate with an external u-blox short range Wi-Fi module. Combining a u-blox cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not necessary. AT commands via the AT interfaces of the cellular module (UART, USB) allows full control of the Wi-Fi module from any host processor, because Wi-Fi control messages are relayed to the Wi-Fi module via the dedicated SDIO interface.   Further guidelines for SDIO interface circuit design will be described in detail in a successive release of the System Integration Manual.   Do  not  apply  voltage  to  any  SDIO  interface  pin  before  the  switch-on  of  SDIO  interface  supply  source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module.  ESD sensitivity rating of SDIO interface pins is 1 kV (HMB according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a very low capacitance ESD protection (e.g. Tyco Electronics PESD0402-140 ESD), close to accessible points.  If the SDIO interface pins are not used, they can be left unconnected on the application board.  2.6.4.2 Guidelines for SDIO layout design The SDIO serial interface requires the same consideration regarding electro-magnetic interference as any other high speed digital interface. Keep the traces short, avoid stubs and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. Consider the usage of low value series damping resistors to avoid reflections and other losses in signal integrity, which may create ringing and loss of a square wave shape.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 112 of 146 2.7 Audio interface 2.7.1 Digital audio interface 2.7.1.1 Guidelines for digital audio circuit design I2S digital audio interface can be connected to an external digital audio device for voice applications.  Any external digital audio device compliant with the configuration of the digital audio interface of the TOBY-R2 series cellular module can be used, given that the external digital audio device must provide:  The opposite role: slave or master role, as TOBY-R2 series modules may act as master or slave  The same mode and frame format: PCM / short synch mode or Normal I2S / long synch mode with o data in 2’s complement notation o MSB transmitted first o data word length = 16-bit (16 clock cycles) o frame length = synch signal period:  17-bit  or  18-bit  in  PCM  /  short  alignment  mode  (16 +  1  or  16  +  2  clock  cycles,  with  the  Word Alignment / Synchronization signal set high for 1 clock cycle or 2 clock cycles)  32-bit in Normal I2S mode / long alignment mode (16 x 2 clock cycles)  The same sample rate, i.e. synch signal frequency, configurable by AT+UI2S <I2S_sample_rate> parameter o 8 kHz o 11.025 kHz o 12 kHz o 16 kHz o 22.05 kHz o 24 kHz o 32 kHz o 44.1 kHz o 48 kHz  The same serial clock frequency: o 17 x <I2S_sample_rate> or 18 x <I2S_sample_rate> in PCM / short alignment mode, or  o 16 x 2 x <I2S_sample_rate> in Normal I2S mode / long alignment mode  Compatible  voltage  levels  (1.80  V  typ.),  otherwise  it  is  recommended  to  connect  the  1.8 V  digital  audio interface  of  the  module  to  the  external  3.0  V  (or  similar)  digital  audio  device  by  means  of  appropriate unidirectional voltage translators (e.g. TI SN74AVC4T774 or SN74AVC2T245, providing partial power down feature  so  that the  digital  audio  device  3.0 V supply  can  be  also ramped up  before  V_INT  1.8 V supply), using the module V_INT output as 1.8 V supply for the voltage translators on the module side   For the appropriate selection of a compliant external digital audio device, see section 1.10.1 and see the +UI2S AT command  description  in  the  u-blox AT  Commands  Manual [2]  for  further  details regarding  the  capabilities and the possible settings of I2S digital audio interface of TOBY-R2 series modules.  An  appropriate  specific  application  circuit  has  to  be  implemented  and  configured  according  to  the  particular external digital audio device or audio codec used and according to the application requirements.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 113 of 146 Examples of manufacturers offering compatible audio codec parts are the following:  Maxim Integrated (as the MAX9860, MAX9867, MAX9880A audio codecs)  Texas Instruments / National Semiconductor  Cirrus Logic / Wolfson Microelectronics   Nuvoton Technology   Asahi Kasei Microdevices   Realtek Semiconductor Figure  63  and  Table  47  describe  an  application  circuit  for  the  I2S  digital  audio  interface  providing  basic  voice capability using an external audio voice codec, in particular the Maxim MAX9860 audio codec.   DAC and ADC integrated in the external audio codec respectively converts an incoming digital data stream to analog audio output through a mono amplifier and converts the microphone input signal to the digital bit stream over the digital audio interface,   A digital side-tone mixer integrated in the external audio codec provides loopback of the microphones/ADC signal to the DAC/headphone output.  The module’s I2S interface (I2S master) is connected to the related pins of the external audio codec (I2S slave).  The GPIO6 of the TOBY-R2 series module (that provides a suitable digital output clock) is connected to the clock input of the external audio codec to provide clock reference.  The external audio codec  is controlled by the  TOBY-R2 series module using the DDC (I2C) interface, which can concurrently communicate with other I2C devices and control an external audio codec.  The V_INT output supplies the external audio codec, defining proper digital interfaces voltage level.  Additional components are provided for EMC and ESD immunity conformity: a 10 nF bypass capacitor and a series chip ferrite bead noise/EMI suppression filter provided on each microphone line input and speaker line output  of  the  external  codec  as  described  in  Figure  63  and  Table  47.  The  necessity  of  these  or  other additional parts for EMC improvement may depend on the specific application board design. Specific  AT commands are available  to configure  the  Maxim  MAX9860  audio  codec:  for  more  details see  the u-blox AT Commands Manual [2], +UEXTDCONF AT command. As various external audio codecs other than the one described  in Figure 63 / Table 47 can be used to provide voice capability, the appropriate specific application circuit has to be implemented and configured according to the particular external digital audio device or audio codec used and according to the application requirements.  TOBY-R2 seriesR2R1BCLKGNDU1LRCLKAudio   CodecSDINSDOUTSDASCLMCLKIRQnR3 C3C2C1VDD1V8MICBIASC4 R4C5C6MICLNMICLPD1Microphone Connector MICC12 C11J1MICGND R5 C8 C7D2SPKSpeaker ConnectorOUTPOUTNJ2C10 C9C14 C13EMI3EMI4EMI1EMI2GPIO655SDA54SCL61GND5V_INT52I2S_CLK50I2S_WA51I2S_TXD53I2S_RXD Figure 63: I2S interface application circuit with an external audio codec to provide voice capability
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 114 of 146 Reference Description Part Number – Manufacturer C1 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 – Murata C2, C4, C5, C6 1 µF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J105KE19 – Murata C3 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C7, C8, C9, C10 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 – Murata C11, C12, C13, C14 10 nF Capacitor Ceramic X5R 0402 10% 50V GRM155R71C103KA88 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX EMI1, EMI2, EMI3, EMI4 Chip Ferrite Bead Noise/EMI Suppression Filter 1800 Ohm at 100 MHz, 2700 Ohm at 1 GHz BLM15HD182SN1 – Murata J1 Microphone Connector Various manufacturers  J2 Speaker Connector Various manufacturers  MIC 2.2 k Electret Microphone Various manufacturers R1, R2  4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 10 k Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R4, R5 2.2 k Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp SPK 32  Speaker Various manufacturers  U1 16-Bit Mono Audio Voice Codec MAX9860ETG+ - Maxim Table 47: Example of components for audio voice codec application circuit   Do not apply voltage to any I2S pin before the switch-on of I2S supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on.  ESD sensitivity rating of I2S interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a general purpose ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.  If the I2S digital audio pins are not used, they can be left unconnected on the application board.  2.7.1.2 Guidelines for digital audio layout design I2S  interface  and  clock output  lines require  the  same  consideration  regarding  electro-magnetic  interference  as any other high speed digital interface. Keep the traces short and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency.  2.7.1.3 Guidelines for analog audio layout design Accurate design of the analog audio circuit is very important to obtain clear and high quality audio. The GSM signal burst has a repetition rate of 217 Hz that lies in the audible range. A careful layout is required to reduce the risk of noise from audio lines due to both VCC burst noise coupling and RF detection.  General guidelines for the uplink path (microphone), which is commonly the most sensitive, are the following:  Avoid  coupling  of  any  noisy  signal  to  microphone  lines:  it is  strongly  recommended  to  route  microphone lines away from module VCC supply line, any switching regulator line, RF antenna lines, digital lines and any other possible noise source.  Avoid coupling between microphone and speaker / receiver lines.  Optimize  the  mechanical  design  of the  application  device,  the position,  orientation  and  mechanical fixing (for  example,  using  rubber  gaskets)  of  microphone and  speaker  parts  in order  to  avoid  echo  interference between uplink path and downlink path.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 115 of 146  Keep ground separation from microphone lines to other noisy signals. Use an intermediate ground layer or vias wall for coplanar signals.  In case of external audio device providing differential microphone input, route microphone signal lines as a differential  pair  embedded in  ground to  reduce  differential noise  pick-up. The  balanced configuration will help reject the common mode noise.  Cross other signals lines on adjacent layers with 90° crossing.  Place bypass capacitor for RF very close to active microphone. The preferred microphone should be designed for GSM applications which typically have internal built-in bypass capacitor for RF very close to active device. If  the  integrated  FET  detects  the  RF  burst,  the  resulting  DC  level  will  be  in  the  pass-band  of  the  audio circuitry and cannot be filtered by any other device.  General guidelines for the downlink path (speaker / receiver) are the following:  The  physical  width  of  the audio  output lines  on  the application  board must  be  wide  enough  to  minimize series resistance since the lines are connected to low impedance speaker transducer.  Avoid  coupling  of  any  noisy  signal  to  speaker  lines:  it  is  recommended  to  route  speaker  lines  away  from module VCC supply line, any switching regulator line, RF antenna lines, digital lines and any other possible noise source.  Avoid coupling between speaker / receiver and microphone lines.  Optimize  the  mechanical  design  of  the  application  device,  the  position,  orientation  and  mechanical fixing (for  example,  using  rubber  gaskets)  of  speaker  and  microphone  parts  in  order  to  avoid  echo  interference between downlink path and uplink path.  In case of external audio device providing differential speaker / receiver output, route speaker signal lines as a differential pair embedded in ground up to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise.  Cross other signals lines on adjacent layers with 90° crossing.  Place bypass capacitor for RF close to the speaker.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 116 of 146 2.8 General Purpose Input/Output 2.8.1.1 Guidelines for GPIO circuit design A typical usage of TOBY-R2 series modules’ GPIOs can be the following:  Network indication provided over GPIO1 or GPIO4 pin (see Figure 64 / Table 48 below)  SIM card detection provided over GPIO5 (see Figure 47 / Table 37 in section 2.5)  Clock output provided over GPIO6 (see Figure 63 / Table 47 in section 2.7.1)  TOBY-R2 seriesGPIO1R1R33V8Network IndicatorR221DL1T1 Figure 64: Application circuit for network indication provided over GPIO1 Reference Description Part Number - Manufacturer R1 10 k Resistor 0402 5% 0.1 W Various manufacturers R2 47 k Resistor 0402 5% 0.1 W Various manufacturers R3 820  Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor BC847 - Infineon Table 48: Components for network indication application circuit   Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 k resistor on the board in series to the GPIO of TOBY-R2 series modules.  Do not apply voltage  to  any GPIO  of  the module before the switch-on of the GPIOs supply (V_INT),  to avoid latch-up of circuits and allow a proper module boot. If the external signals connected to the module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on.  ESD  sensitivity  rating  of  the  GPIO  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114).  Higher protection level could  be  required if the lines are externally accessible and it can be  achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.  If the GPIO pins are not used, they can be left unconnected on the application board.   2.8.1.2 Guidelines for general purpose input/output layout design The general purpose inputs / outputs pins are generally not critical for layout.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 117 of 146 2.9 Reserved pins (RSVD) TOBY-R2 series modules have pins reserved for future use, marked as  RSVD. All the RSVD pins are to be left unconnected on the application board except the following RSVD pins as described in Figure 65:  the RSVD pin number 6 that must be externally connected to ground  the RSVD pin number 18 that is recommended to be connected to a Test-Point for diagnostic access  the RSVD pin number 19 that is recommended to be connected to a Test-Point for diagnostic access  TOBY-R2 seriesRSVD6RSVDTest-Point18RSVD19RSVD Test-Point Figure 65: Application circuit for the reserved pins (RSVD)    2.10 Module placement An optimized placement allows a minimum RF line’s length and closer path from DC source for VCC. Make  sure  that  the  module,  analog  parts  and  RF  circuits  are  clearly  separated  from  any  possible  source  of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which can produce Electro-Magnetic  Interference  that  affects  the  module,  analog  parts  and  RF  circuits’  performance.  Implement  proper countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly separated from  any  sensitive  part  /  circuit  which  may  be  affected  by  Electro-Magnetic  Interference,  or  employ countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Provide enough clearance between the module and any external part.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature of the application base-board below the TOBY-R2 series modules: avoid placing temperature sensitive devices close to the module.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 118 of 146 2.11 Module footprint and paste mask Figure 66 and Table 49 describe the suggested footprint (i.e. copper mask) layout for  TOBY-R2 series modules. The  proposed  land  pattern  layout  slightly  reflects  the  modules’  pads  layout,  with  most  of  the  lateral  pads designed wider on the application board (1.8 x 0.8 mm) than on the module (1.5 x 0.8 mm).  I1AG H J1DF2KM1 M1 M2 P2BGHJOOLNM1 M1 M3I1I1OHJJJEP3F1P1HI1OI2I2F2Module placement outline Figure 66: TOBY-R2 series module suggest footprint (application board top view) Parameter Value  Parameter Value  Parameter Value A 35.6 mm  H 0.80 mm  M2 5.20 mm B 24.8 mm  I1 1.50 mm  M3 4.50 mm D 2.40 mm  I2 1.80 mm  N 2.10 mm E 2.25 mm  J 0.30 mm  O 1.10 mm F1 1.45 mm  K 3.15 mm  P1 1.10 mm F2 1.30 mm  L 7.15 mm  P2 1.25 mm G 1.10 mm  M1 1.80 mm  P3 2.85 mm Table 49: TOBY-R2 series module suggest footprint dimensions The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, implementing the solder mask opening 50 µm larger per side than the corresponding copper pad. The suggested paste mask layout for TOBY-R2 series modules slightly reflects the copper mask layout described in Figure 66 and Table 49, as different stencil apertures layout for any specific pad is recommended:   Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout  Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout  Purple marked pads: Paste layout one to one to Copper layout The recommended solder paste thickness is 150 µm, according to application production process requirements.   These are recommendations only and not specifications. The exact mask geometries, distances and stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.) of the customer.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 119 of 146 2.12 Thermal guidelines  Modules’ operating temperature range is specified in TOBY-R2 series Data Sheet [1].  The  most  critical  condition  concerning  module  thermal  performance  is  the  uplink  transmission  at  maximum power (data upload in connected-mode), when the baseband processor runs at full speed, radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks (for example, see the Terminal Tx Power distribution for WCDMA, taken from operation on a live network,  described  in  the  GSMA  TS.09  Battery  Life  Measurement  and  Current  Consumption  Technique  [14]); however the application should be correctly designed to cope with it. During  transmission  at  maximum  RF  power  the  TOBY-R2  series  modules  generate  thermal  power  that  may exceed 2 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the actual antenna return loss, the number of allocated TX resource blocks, the transmitting frequency band,  etc.  The  generated  thermal  power  must  be  adequately  dissipated  through  the  thermal  and  mechanical design of the application. The  spreading  of  the  Module-to-Ambient  thermal  resistance  (Rth,M-A)  depends  on  the  module  operating condition.  The  overall  temperature  distribution  is  influenced  by  the  configuration  of  the  active  components during the specific mode of operation and their different thermal resistance toward the case interface.   The  Module-to-Ambient  thermal  resistance  value  and  the  relative  increase  of  module  temperature  will differ according to the specific mechanical deployments of the module, e.g. application PCB with different dimensions and characteristics, mechanical shells enclosure, or forced air flow.  The  increase  of  the  thermal  dissipation,  i.e.  the  reduction  of  the  Module-to-Ambient  thermal  resistance,  will decrease  the  temperature  of  the  modules’  internal  circuitry  for  a  given  operating  ambient  temperature.  This improves the device long-term reliability in particular for applications operating at high ambient temperature. Recommended hardware techniques to be used to improve heat dissipation in the application:  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete thermal via stacked down to main ground layer.  Provide a ground plane as wide as possible on the application board.  Optimize antenna return loss, to optimize overall electrical performance of the module including a decrease of module thermal power.  Optimize  the  thermal  design  of  any  high-power  components  included  in  the  application,  such  as  linear regulators and amplifiers, to optimize overall temperature distribution in the application device.  Select  the  material,  the  thickness  and  the  surface  of  the  box  (i.e.  the  mechanical  enclosure)  of  the application device that integrates the module so that it provides good thermal dissipation. Further hardware techniques that may be considered to improve the heat dissipation in the application:  Force ventilation air-flow within mechanical enclosure.  Provide a heat  sink component  attached to the module  top  side,  with electrically  insulated / high thermal conductivity adhesive, or on the backside of the application board, below the cellular module, as a large part of the heat is transported through the GND pads of the TOBY-R2 series LGA modules and dissipated over the backside of the application board. For example, the Module-to-Ambient thermal resistance (Rth,M-A) is strongly reduced with forced air ventilation and a heat-sink installed on the back of the application board, decreasing the module temperature variation. Beside the reduction of the Module-to-Ambient thermal resistance implemented by proper application hardware design, the increase of module temperature can be moderated by proper application software implementation:  Enable power saving configuration using the AT+UPSV command (see section 1.13.16).   Enable module connected-mode for a given time period and then disable it for a time period enough long to properly mitigate temperature increase.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 120 of 146 2.13 ESD guidelines The sections 2.13.1 and 2.13.2 are related to EMC / ESD immunity. The modules are ESD sensitive devices, and the  ESD  sensitivity  for  each  pin  (as  Human  Body  Model  according  to  JESD22-A114F)  is  specified  in  TOBY-R2 series Data Sheet [1]. Special precautions are required when handling: see section 3.2 for handling guidelines.  2.13.1 ESD immunity test overview The  immunity  of  devices  integrating  TOBY-R2  series  modules  to  Electro-Static  Discharge  (ESD)  is  part  of  the Electro-Magnetic  Compatibility  (EMC)  conformity  which  is  required  for  products  bearing  the  CE  marking, compliant  with the  R&TTE  Directive (99/5/EC),  the  EMC  Directive  (89/336/EEC)  and  the  Low  Voltage  Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 [15] and the radio equipment standards ETSI EN 301 489-1 [16], ETSI EN 301 489-7 [17], ETSI EN 301 489-24 [18], which requirements are summarized in Table 50. The ESD immunity  test is performed at the enclosure  port, defined by  ETSI EN 301 489-1 [16] as the physical boundary through  which the electromagnetic field radiates. If the device  implements an  integral antenna,  the enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1 [16]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting cables  to  auxiliary  equipment,  depends  on  device  accessible  interfaces  and  manufacturer  requirements,  as defined by ETSI EN 301 489-1 [16]. Contact  discharges  are  performed  at  conductive  surfaces,  while  air  discharges  are  performed  at  insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [15].   For the definition of integral antenna, removable antenna, antenna port and device classification see ETSI EN 301 489-1 [16]. For the contact / air discharges definitions see CENELEC EN 61000-4-2 [15].  Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 50: EMC / ESD immunity requirements as defined by CENELEC EN 61000-4-2 and ETSI EN 301 489-1, 301 489-7, 301 489-24
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 121 of 146 2.14 Schematic for TOBY-R2 series module integration 2.14.1 Schematic for TOBY-R2 series module “02” product version Figure 67 is an example of a schematic diagram where a TOBY-R2 series cellular module “02” product version is integrated into an application board, using all the available interfaces and functions of the module. 3V8GND330µF 100nF 10nFTOBY-R2 series (’02’ product version)71 VCC72 VCC70 VCC3V_BCKP68pF 15pF+100µF+GNDRTC back-up26 HOST_SELECT062 HOST_SELECT1SDASCL5554RSVDRSVD621GPIO165SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLKGND23 RESET_NApplication ProcessorOpen drain output20 PWR_ONOpen drain outputTPTP16 TXD17 RXD12 DCD14 RTS15 CTS13 DTR10 DSR11 RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 hostD-D+27 USB_D-28 USB_D+VBUS 4VUSB_DETTPTPGND GND0Ω0Ω0Ω0ΩV_INTBCLKLRCLKAudio Codec MAX9860SDINSDOUTSDASCL52I2S_CLK50I2S_WA51I2S_TXD53I2S_RXD61GPIO6 MCLKIRQn10k10µF1µF100nFVDDSPKOUTPOUTNMICMICBIAS 1µF 2.2k1µF1µFMICLNMICLPMICGND2.2kESD ESDV_INT10nF10nFEMIEMI27pF27pF10nFEMIEMIESD ESD27pF27pF10nF47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pFSW1 SW25V_INT60GPIO5470k ESD ESD ESD ESD ESD ESD1kTPV_INT25 GPIO43V8Network Indicator22 GPIO224 GPIO30Ω0Ω87ANT275ANT_DET10kConnector27pF ESDSecondary Cellular  Antenna33pF82nH82nH81Connector Primary Cellular Antenna33pFANT14.7k4.7kTPMount for modules supporting 2G0ΩRSVD19TPRSVD18TP Figure 67: Example of schematic diagram to integrate a TOBY-R2 module “02” product version using all available interfaces
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 122 of 146 2.15 Design-in checklist This section provides a design-in checklist. 2.15.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC pin within the operating range limits.  DC  supply  must  be  capable  of  supporting  both  the  highest  peak  and  the  highest  averaged  current consumption values in connected-mode, as specified in the TOBY-R2 series Data Sheet [1].  VCC voltage supply should be clean, with very low ripple/noise: provide the suggested bypass capacitors, in particular if the application device integrates an internal antenna.  Do not apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the relative operating range.  Provide accessible  test points directly connected  to  the following pins of the  TOBY-R2 series modules: V_INT, PWR_ON and RESET_N for diagnostic purpose.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested pF capacitors on each SIM signal and low capacitance ESD protections if accessible.  Check UART signals direction, as the modules’ signal names follow the ITU-T V.24 Recommendation [7].  Provide  accessible  test  points  directly  connected  to  all  the  UART  pins  of  the  TOBY-R2  series  modules (TXD, RXD, DTR, DCD) for diagnostic purpose, in particular providing a 0  series jumper on each line to detach each UART pin of the module from the DTE application processor.  Capacitance and series resistance must be limited on each high speed line of the USB interface.  If the USB is not used, provide accessible test points directly connected to the USB interface (VUSB_DET, USB_D+ and USB_D- pins).  Consider providing appropriate low value series damping resistors on SDIO lines to avoid reflections.  Add a proper pull-up resistor (e.g. 4.7 k) to V_INT or another proper 1.8 V supply on each DDC (I2C) interface line, if the interface is used.  Check the digital audio interface specifications to connect a proper external audio device.  Capacitance and series resistance must be limited on master clock output line and each I2S interface line   Consider passive filtering parts on each used analog audio line.  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 k resistor on the board in series to the GPIO when those are used to drive LEDs.  Provide accessible test points directly connected to the RSVD pins number 18 and 19.  Provide proper precautions for EMC / ESD immunity as required on the application board.  Do not apply voltage to any generic digital interface pin  of TOBY-R2 series modules before the switch-on of the generic digital interface supply source (V_INT).  All unused  pins can be  left  unconnected  except  the  RSVD  pin  number  6  of TOBY-R2  series modules, which must be connected to GND.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Design-in     Page 123 of 146 2.15.2 Layout checklist The following are the most important points for a simple layout check:  Check 50  nominal characteristic impedance of the RF transmission  line connected to the ANT1 and the ANT2 ports (antenna RF interfaces).  Ensure no coupling occurs between the RF interface and noisy or sensitive signals (primarily analog audio input/output signals, SIM signals, high-speed digital lines such as SDIO, USB and other data lines).  Optimize placement for minimum length of RF line.  Check the footprint and paste mask designed for TOBY-R2 series module as illustrated in section 2.11.  VCC line should be wide and as short as possible.  Route VCC supply line away from RF lines / parts and other sensitive analog lines / parts.  The VCC bypass capacitors in the picoFarad range should be placed as close as possible to the VCC pins, in particular if the application device integrates an internal antenna.  Ensure an optimal grounding connecting each GND pin with application board solid ground layer.  Use as many vias as possible to connect the ground planes on multilayer application board, providing a dense line of vias at the edges of each ground area, in particular along RF and high speed lines.  Keep routing short and minimize parasitic capacitance on the SIM lines to preserve signal integrity.  USB_D+ / USB_D- traces should meet the characteristic impedance requirement (90  differential and 30  common mode) and should not be routed close to any RF line / part.  Keep the SDIO traces short, avoid stubs, avoid coupling with any RF line / part and consider low value series damping resistors to avoid reflections and other losses in signal integrity.  Ensure appropriate RF precautions for the Wi-Fi and Cellular technologies coexistence   Ensure appropriate RF precautions for the  GNSS and Cellular technologies coexistence  as  described  in the GNSS Implementation Application Note [13].  Route analog audio signals away from noisy sources (primarily RF interface, VCC, switching supplies).  The audio outputs lines on the application board must be wide enough to minimize series resistance.  2.15.3 Antenna checklist  Antenna termination should provide 50  characteristic impedance with V.S.W.R at least less than 3:1 (recommended 2:1) on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure compliance  with any regulatory  agency RF radiation requirement,  as  reported  in  sections 4.2.2 and/or 4.3.1 for products marked with the FCC and/or IC.  Ensure high and similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna.  Ensure high isolation between the primary (ANT1) and the secondary (ANT2) antenna.  Ensure  low  Envelope  Correlation  Coefficient  between  the  primary  (ANT1)  and  the  secondary  (ANT2) antenna: the 3D antenna radiation patterns should have radiation lobes in different directions.  Ensure high isolation between the cellular antennas and any other antenna or transmitter.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Handling and soldering     Page 124 of 146 3 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  3.1 Packaging, shipping, storage and moisture preconditioning For  information  pertaining  to  TOBY-R2  series  reels  /  tapes,  Moisture  Sensitivity  levels  (MSD),  shipment  and storage information, as well as drying for preconditioning, see the TOBY-R2 series Data Sheet [1] and the u-blox Package Information Guide [25].  3.2 Handling The TOBY-R2 series modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  Electrostatic  discharge  (ESD) is  the  sudden and  momentary  electric current  that flows between  two objects at different  electrical  potentials caused  by  direct  contact  or  induced  by  an  electrostatic  field.  The  term  is  usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment. The ESD sensitivity for each pin of TOBY-R2 series modules (as Human Body Model according to JESD22-A114F) is specified in the TOBY-R2 series Data Sheet [1]. ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on  ESD  sensitive  electronics  is  prevented.  International  standards  are  used  to  define  typical  EPA  and  can  be obtained  for  example  from  International  Electrotechnical  Commission  (IEC)  or  American  National  Standards Institute (ANSI). In  addition  to  standard  ESD  safety  practices,  the  following  measures  should  be  taken  into  account  whenever handling the TOBY-R2 series modules:  Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the first point of contact when handling the PCB must always be between the local GND and PCB GND.  Before mounting an antenna patch, connect ground of the device.  When  handling  the module,  do not  come  into  contact  with any  charged  capacitors and be  careful  when contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron,…).  To prevent  electrostatic discharge through the RF pin,  do not touch  any  exposed  antenna area.  If there  is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design.  When soldering the module and patch antennas to the RF pin, make sure to use an ESD safe soldering iron. For more robust designs, employ additional ESD protection measures on the application device integrating the TOBY-R2 series modules, as described in section 2.13.3.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Handling and soldering     Page 125 of 146 3.3 Soldering 3.3.1 Soldering paste "No  Clean"  soldering  paste  is  strongly  recommended  for  TOBY-R2  series  modules,  as  it  does  not  require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217 °C Stencil Thickness:  150 µm for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.11.  The  quality  of  the  solder  joints  on  the  connectors  (“half  vias”)  should  meet  the  appropriate  IPC specification.  3.3.2 Reflow soldering A convection type-soldering oven is strongly recommended for TOBY-R2 series modules over the infrared type  radiation  oven.  Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be heated up evenly, regardless of material properties, thickness of components and surface color. Consider the ”IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes”, published 2001. Reflow profiles are to be selected according to the following recommendations.  Failure to observe these recommendations can result in severe damage to the device!  Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out.  Note that this preheat phase will not replace prior baking procedures.  Temperature rise rate: max 3 °C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated.  Conversely, if  performed  excessively,  fine  balls  and  large balls will be generated in clusters.  End Temperature: 150 - 200 °C  If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The  temperature  rises  above  the  liquidus  temperature  of  217  °C.  Avoid  a  sudden  rise  in  temperature  as  the slump of the paste could become worse.  Limit time above 217 °C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245 °C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4 °C/s
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Handling and soldering     Page 126 of 146   To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  soldering  temperature  profile  chosen  at  the  factory  depends  on  additional  external  factors  like  choice  of soldering paste, size, thickness and properties of the base board, etc.   Exceeding  the  maximum  soldering  temperature  and  the  maximum  liquidus  time  limit  in  the recommended soldering profile may permanently damage the module.  Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50Elapsed time [s] Figure 68: Recommended soldering profile  The modules must not be soldered with a damp heat process.  3.3.3 Optical inspection After soldering the TOBY-R2 series modules, inspect the modules optically to verify that the module is properly aligned and centered. 3.3.4 Cleaning Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol  or  other organic  solvents can result in soldering flux residues flooding into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Handling and soldering     Page 127 of 146 3.3.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a module populated on it. 3.3.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with the modules. 3.3.7 Hand soldering Hand soldering is not recommended. 3.3.8 Rework Rework is not recommended.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such  actions immediately terminate the warranty. 3.3.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the cellular modules and it is important to prevent them from flowing into the module.  The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty. 3.3.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the cellular modules before implementing this in the production.  Casting will void the warranty. 3.3.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox  gives  no  warranty  for  damages  to  the  cellular  modules  caused  by  soldering  metal  cables  or  any other forms of metal strips directly onto the EMI covers. 3.3.12 Use of ultrasonic processes The  cellular  modules  contain  components  which  are  sensitive  to  Ultrasonic  Waves.  Use  of  any  Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox gives no warranty against damages to the cellular modules caused by any Ultrasonic Processes.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 128 of 146 4 Approvals   For the complete list and specific details regarding the certification schemes approvals, see TOBY-R2 series Data Sheet [1], or please contact the u-blox office or sales representative nearest you.  4.1 Product certification approval overview Product certification approval is the process of certifying that a product has passed all tests and criteria required by specifications, typically called “certification schemes” that can be divided into three distinct categories:  Regulatory certification o Country specific approval required by local government in most regions and countries, such as:  CE (Conformité Européenne) marking for European Union  FCC (Federal Communications Commission) approval for United States  Industry certification o Telecom industry specific approval verifying the interoperability between devices and networks:  GCF  (Global  Certification  Forum),  partnership  between  European  device  manufacturers  and network operators to ensure and verify global interoperability between devices and networks  PTCRB (PCS Type Certification Review Board), created by United States network operators to ensure and verify interoperability between devices and North America networks  Operator certification o Operator specific approval required by some mobile network operator, such as:  AT&T network operator in United States  Verizon Wireless network operator in United States Even if TOBY-R2 series modules are approved under all major certification schemes, the application device that integrates TOBY-R2 series modules must be approved under all the certification schemes required by the specific application device to be deployed in the market. The required certification scheme approvals and relative testing specifications differ depending on the country or the region where the device that integrates TOBY-R2 series modules must be deployed, on the relative vertical market of the device, on type, features and functionalities of the whole application device, and on the network operators where the device must operate.   Check  the  appropriate  applicability  of  the  TOBY-R2  series  module’s  approvals  while  starting  the certification  process  of  the  device  integrating  the  module:  the  re-use  of  the  u-blox  cellular  module’s approval can significantly reduce the cost and time to market of the application device certification.  The certification of the application device that integrates a TOBY-R2 series module and the compliance of the application device with all the applicable certification schemes, directives and standards are the sole responsibility of the application device manufacturer.  TOBY-R2  series  modules  are  certified  according  to  all  capabilities  and  options  stated  in  the  Protocol Implementation Conformance Statement document (PICS) of the module. The PICS, according to the  3GPP TS 51.010-2 [19], 3GPP TS 34.121-2 [20], 3GPP TS 36.521-2 [22] and 3GPP TS 36.523-2 [23], is a statement of the implemented and supported capabilities and options of a device.   The PICS document of the application device integrating TOBY-R2 series modules must be updated from the module PICS statement if any feature stated as supported by the module in its PICS document is not implemented or disabled in the application device. For more details regarding the AT commands settings that affect the PICS, see the u-blox AT Commands Manual [2].  Check the specific settings required for mobile network operators approvals as they may differ from the AT commands settings defined in the module as integrated in the application device.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 129 of 146 4.2 US Federal Communications Commission notice United States Federal Communications Commission (FCC) IDs:  u-blox TOBY-R200 cellular modules:  XPY1EHM44NN  u-blox TOBY-R201 cellular modules:  XPY1EHQ25NN  u-blox TOBY-R202 cellular modules:  XPY1EHQ24NN  4.2.1 Safety warnings review the structure  Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product  The  clearance  and  creepage  current  distances  required  by  the  end  product  must  be  withheld  when  the module is installed  The cooling of the end product shall not negatively be influenced by the installation of the module  Excessive sound pressure from earphones and headphones can cause hearing loss  No natural rubbers, hygroscopic materials, or materials containing asbestos are employed  4.2.2 Declaration of Conformity This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:  this device may not cause harmful interference  this device must accept any interference received, including interference that may cause undesired operation   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment  should be installed  and operated  with  a  minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The  gain  of  the  system  antenna(s)  used  for  the  TOBY-R2  series  modules  (i.e.  the  combined transmission line, connector, cable losses and radiating element gain)  must not exceed  8.5 dBi (1900 MHz, i.e. UMTS FDD-2 or LTE FDD-2 band), 10.0 dBi (850 MHz, i.e. UMTS FDD-5 or LTE FDD-5), 7.9 dBi (1700 MHz, i.e. LTE FDD-4) and 9.7 dBi (700 MHz, i.e. LTE FDD-12) for mobile and fixed or mobile operating configurations.  4.2.3 Modifications The  FCC requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers  of  mobile  or  fixed  devices  incorporating  the  TOBY-R2  series  modules  are authorized  to use  the  FCC  Grants of  the  TOBY-R2 series  modules  for  their  own  final  products according to the conditions referenced in the certificates.  The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains FCC ID: XPY1EHM44NN " resp. "Contains FCC ID: XPY1EHQ25NN " resp.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 130 of 146 "Contains FCC ID: XPY1EHQ24NN " resp.   IMPORTANT: Manufacturers of portable applications incorporating the TOBY-R2 series modules are required to have their final product certified and apply for their own FCC Grant related to the  specific  portable  device.  This  is  mandatory  to  meet  the  SAR  requirements  for  portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   Additional Note: as per 47CFR15.105 this equipment has been tested and found to comply with the  limits  for  a  Class  B  digital  device,  pursuant  to  part  15  of  the  FCC  Rules.  These  limits  are designed  to  provide  reasonable  protection  against  harmful  interference  in  a  residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: o Reorient or relocate the receiving antenna o Increase the separation between the equipment and receiver o Connect the equipment into an outlet on a circuit different from that to which the receiver is connected o Consultant the dealer or an experienced radio/TV technician for help  4.3 Industry Canada notice Industry Canada (IC) Certification Numbers:  u-blox TOBY-R200 cellular modules:  8595A-1EHM44NN  u-blox TOBY-R201 cellular modules:  8595A-1EHQ25NN  u-blox TOBY-R202 cellular modules:  8595A-1EHQ24NN  4.3.1 Declaration of Conformity   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment  should be installed  and operated  with  a  minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The  gain  of  the  system  antenna(s)  used  for  the  TOBY-R2  series  modules  (i.e.  the  combined transmission line, connector, cable losses and radiating element gain) must not exceed  9.1 dBi (1900 MHz, i.e. UMTS FDD-2 or LTE FDD-2 band), 6.7 dBi (850 MHz, i.e. UMTS FDD-5 or LTE FDD-5), 9.3 dBi (1700 MHz, i.e. LTE FDD-4) and 6.7 dBi (700 MHz, i.e. LTE FDD-12) for mobile and fixed or mobile operating configurations.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 131 of 146 4.3.2 Modifications The  IC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers  of  mobile  or  fixed  devices  incorporating  the  TOBY-R2  series  modules  are authorized to use the Industry Canada Certificates of the TOBY-R2 series modules for their own final products according to the conditions referenced in the certificates.  The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains IC: 8595A-1EHM44NN " resp. "Contains IC: 8595A-1EHQ25NN " resp. "Contains IC: 8595A-1EHQ24NN " resp.   Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian CAN ICES-3(B) / NMB-3(B) and RSS-210. Operation is subject to the following two conditions: o this device may not cause interference o this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The  radiated  output  power  of  the  u-blox  Cellular  Module  is  below  the  Industry  Canada  (IC) radio frequency  exposure limits.  The  u-blox Cellular  Module should be used  in  such a manner such that the potential for human contact during normal operation is minimized. This  device  has  been  evaluated  and  shown  compliant  with  the  IC  RF  Exposure  limits  under mobile exposure conditions (antennas are greater than 20 cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL (Radio Equipment List) can be found at the following web address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional  Canadian  information  on  RF  exposure  also  can  be  found  at  the  following  web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT: Manufacturers of portable applications incorporating the TOBY-R2 series modules are  required  to  have  their  final  product  certified  and  apply  for  their  own  Industry  Canada Certificate  related  to  the  specific  portable  device.  This  is  mandatory  to  meet  the  SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   Canada, avis d'Industrie Canada (IC) Cet  appareil  numérique  de  classe  B  est  conforme  aux  normes  canadiennes  CAN  ICES-3(B)  / NMB-3(B) et CNR-210. Son fonctionnement est soumis aux deux conditions suivantes: o cet appareil ne doit pas causer d'interférence o cet  appareil  doit  accepter  toute  interférence,  notamment  les  interférences  qui  peuvent affecter son fonctionnement
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 132 of 146 Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil u-blox Cellular Module est inférieure à la limite  d'exposition  aux  fréquences  radio  d'Industrie  Canada  (IC).  Utilisez  l’appareil  de  sans  fil u-blox  Cellular  Module  de  façon  à  minimiser  les  contacts  humains  lors  du  fonctionnement normal. Ce  périphérique  a  été  évalué  et  démontré  conforme  aux  limites  d'exposition  aux  fréquences radio  (RF)  d'IC  lorsqu'il  est  installé  dans  des  produits  hôtes  particuliers  qui  fonctionnent  dans des  conditions  d'exposition  à  des  appareils  mobiles  (les  antennes  se  situent  à  plus  de  20 centimètres du corps d'une personne). Ce  périphérique  est  homologué  pour  l'utilisation  au  Canada.  Pour  consulter  l'entrée correspondant  à  l’appareil  dans  la  liste  d'équipement  radio  (REL  -  Radio  Equipment  List) d'Industrie Canada rendez-vous sur:  http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplémentaires concernant l'exposition aux RF au  Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/fra/sf08792.html   IMPORTANT:  les  fabricants  d'applications  portables  contenant  les  modules  TOBY-R2  series doivent  faire  certifier  leur  produit  final  et  déposer  directement  leur  candidature  pour  une certification FCC ainsi que pour un certificat Industrie Canada délivré par l'organisme chargé de ce  type  d'appareil  portable.  Ceci  est  obligatoire  afin  d'être  en  accord  avec  les  exigences  SAR pour les appareils portables. Tout changement ou modification non expressément approuvé par la partie responsable de la certification peut annuler le droit d'utiliser l'équipement.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Approvals     Page 133 of 146 4.4 R&TTED / RED and European Conformance CE mark The TOBY-R200 modules have been evaluated against the essential requirements of the 1999/5/EC Directive. In  order  to  satisfy the  essential  requirements  of the  1999/5/EC  Directive,  the  modules  are  compliant  with the following standards:  Radio Frequency spectrum use (R&TTE art. 3.2): o EN 301 511  o EN 301 908-1  o EN 301 908-2  o EN 301 908-13   Electromagnetic Compatibility (R&TTE art. 3.1b): o EN 301 489-1  o EN 301 489-7  o EN 301 489-24   Health and Safety (R&TTE art. 3.1a) o EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 o EN 62311:2008   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment  should be installed  and operated  with  a  minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The  conformity  assessment  procedure  for  the  modules,  referred  to  in  Article  10  and  detailed  in  Annex  IV  of Directive 1999/5/EC, has been followed with the involvement of the following Notified Body number: 1588 Thus, the following marking is included in the product:    1588
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Product testing     Page 134 of 146 5 Product testing 5.1 u-blox in-series production test u-blox focuses  on high  quality  for  its products.  All units  produced are  fully tested  automatically in  production line. Stringent quality control process has been implemented in the production line. Defective units are analyzed in detail to improve the production quality. This  is  achieved  with  automatic  test  equipment  (ATE)  in  production  line,  which  logs  all  production  and measurement data. A detailed test report for each unit can be generated from the system.  Figure 69 illustrates typical automatic test equipment (ATE) in a production line.  The following typical tests are among the production tests.   Digital self-test (firmware download, Flash firmware verification, IMEI programming)  Measurement of voltages and currents  Adjustment of ADC measurement interfaces  Functional tests (serial interface communication, SIM card communication)  Digital tests (GPIOs and other interfaces)  Measurement and calibration of RF characteristics in all supported bands (such as receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels, etc.)  Verification of RF characteristics after calibration (i.e. modulation accuracy, power levels, spectrum, etc. are checked to ensure they are all within tolerances when calibration parameters are applied)    Figure 69: Automatic test equipment for module tests
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Product testing     Page 135 of 146 5.2 Test parameters for OEM manufacturer Because of the testing done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. However, an OEM manufacturer should focus on:  Module assembly on the device; it should be verified that: o Soldering and handling process did not damage the module components o All module pins are well soldered on device board o There are no short circuits between pins  Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna  Dedicated  tests  can  be  implemented  to  check  the  device.  For  example,  the  measurement  of  module  current consumption when set in a specified status can detect a short circuit if compared with a “Golden Device” result. In addition, module AT commands can be used to perform functional tests on digital interfaces (communication with host controller, check SIM interface, GPIOs, etc.), on audio interfaces (audio loop for test purposes can be enabled by the AT+UPAR=2 command as described in the u-blox AT Commands Manual [2]), and to perform RF performance tests (see the following section 5.2.2 for details).  5.2.1 “Go/No go” tests for integrated devices A “Go/No go” test is typically to compare the signal quality with a “Golden Device” in a location with excellent network  coverage  and  known  signal  quality.  This  test  should  be  performed  after  data  connection  has  been established. AT+CSQ is the typical AT command used to check signal quality in term of RSSI. See the u-blox AT Commands Manual [2] for detail usage of the AT command.    These kinds of test may be useful as a “go/no go” test but not for RF performance measurements.  This test is suitable to check the functionality of communication with host controller, SIM card as well as power supply. It is also a means to verify if components at antenna interface are well soldered.  5.2.2 RF functional tests  The overall RF functional test of the device including the antenna can be performed with basic instruments such as  a  spectrum  analyzer  (or  an  RF  power  meter)  and  a  signal  generator  with  the  assistance  of  AT+UTEST command over AT command user interface. The  AT+UTEST  command  provides  a  simple  interface  to  set  the  module  to  Rx  or  Tx  test  modes  ignoring  the LTE/3G/2G signaling protocol. The command can set the module into:  transmitting mode in a specified channel and power level in all supported modulation schemes and bands  receiving mode in a specified channel to returns the measured power level in all supported bands    See the u-blox AT Commands Manual [2] and the End user test Application Note [24], for the AT+UTEST command syntax description and detail guide of usage.
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Product testing     Page 136 of 146  This feature allows the measurement of the transmitter and receiver power levels to check component assembly related  to  the  module  antenna  interface  and  to  check  other  device  interfaces  from  which  depends  the  RF performance.   To  avoid  module  damage  during  transmitter  test,  a  proper  antenna  according  to  module specifications or a 50  termination must be connected to ANT1 port.  To avoid module damage during receiver test the maximum power level received at ANT1 and ANT2 ports must meet module specifications.   The AT+UTEST command sets the module to emit RF power ignoring LTE/3G/2G signaling protocol. This emission  can  generate  interference  that  can  be  prohibited  by  law  in  some  countries.  The  use  of  this feature is intended for testing purpose in controlled environments by qualified user and must not be used during  the  normal  module  operation.  Follow  instructions  suggested  in  u-blox  documentation.  u-blox assumes no responsibilities for the inappropriate use of this feature.  Figure 70 illustrates a typical test setup for such RF functional test.  Application BoardTOBY-R2 seriesANT1Application ProcessorAT   commandsCellular antennaSpectrumAnalyzerorPowerMeterINWideband antennaTXApplication BoardTOBY-R2 seriesANT1Application ProcessorAT   commandsCellular antennasSignalGeneratorOUTWideband antennaRXANT2 Figure 70: Setup with spectrum analyzer or power meter and signal generator for radiated measurements
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 137 of 146 Appendix A Migration between TOBY-L2 and TOBY-R2 A.1 Overview TOBY-L2 and TOBY-R2 series cellular modules have exactly the same TOBY form factor (35.6 x 24.8 mm LGA) with  exactly  the  same  152-pin  layout  as  described  in  Figure  71,  so  that  the  modules  can  be  alternatively mounted on a single application board using exactly the same copper mask, solder mask and paste mask. 11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167SDIO_CMDSDIO_D0GNDVCCVCCGNDANT_DETSDASIM_IOSIM_RSTGPIO5GPIO6SDIO_D2SDIO_CLKRSVDRSVDI2S_WAI2S_CLKI2S_RXDSDIO_D1VCCGNDSCLSIM_CLKVSIMHOST_SELECT1RSVDI2S_TXDSDIO_D3RIDSRRSVDV_INTVUSB_DETGNDRSVDGPIO1RSVDRSVDTXDCTSDTRDCDRSVDUSB_D-HOST_SELECT0GPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRXDRTSUSB_D+GPIO4RSVD90 91 927877769310079 80 83 85 86 88 8982 84 8781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT132 31 3044454614515243 42 39 37 36 34 3340 38 3541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD99 98 97 96 95 94106 105 104 103 102 101108 107124 123130 129 128 127 126 125136 135 134 133 132 131138 137144 143 142 141 140 139151 150 149 148 147 146114 113 112 111 110 109120 119 118 117 116 115122 121Pin 93-152: GNDTOBY-R2Top view11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167SDIO_CMDSDIO_D0GNDVCCVCCGNDANT_DETSDASIM_IOSIM_RSTGPIO5GPIO6SDIO_D2SDIO_CLKRSVDRSVDI2S_WAI2S_CLKI2S_RXDSDIO_D1VCCGNDSCLSIM_CLKVSIMHOST_SELECT1RSVDI2S_TXDSDIO_D3RIDSRRSVDV_INTVUSB_DETGNDRSVDGPIO1RSVDRSVDTXDCTSDTRDCDRSVDUSB_D-HOST_SELECT0GPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRXDRTSUSB_D+GPIO4RSVD90 91 927877769310079 80 83 85 86 88 8982 84 8781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT132 31 3044454614515243 42 39 37 36 34 3340 38 3541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD99 98 97 96 95 94106 105 104 103 102 101108 107124 123130 129 128 127 126 125136 135 134 133 132 131138 137144 143 142 141 140 139151 150 149 148 147 146114 113 112 111 110 109120 119 118 117 116 115122 121Pin 93-152: GNDTOBY-L2Top view Figure 71: TOBY-L2 and TOBY-R2 series modules pad layout and pin assignment TOBY modules are also form-factor compatible with the u-blox LISA, SARA and LARA cellular module families: although TOBY modules, LISA modules (33.2 x 22.4 mm, 76-pin LCC), SARA modules (26.0 x 16.0 mm, 96-pin LGA) and LARA modules (26.0 x 24.0 mm, 100-pin LGA) each have different form factors, the footprints for the TOBY, LISA, SARA and LARA modules have been developed to ensure layout compatibility. With the u-blox “nested design” solution, any TOBY, LISA, SARA or LARA module can be alternatively mounted on  the  same  space  of  a  single  “nested”  application  board  as  described  in  Figure  72.  Guidelines  in  order  to implement  a  nested  application  board,  description  of  the  u-blox  reference  nested  design  and  comparison between TOBY, LISA, SARA and LARA modules are provided in the Nested Design Application Note [28].  LISA cellular moduleLARA cellular moduleSARA cellular moduleNested application boardTOBY cellular module Figure 72: TOBY, LISA, SARA, LARA modules’ layout compatibility: all modules are accommodated on the same nested footprint
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 138 of 146 Table 51 summarizes the interfaces provided by TOBY-L2 and TOBY-R2 series modules.  Module RF / Radio Access Technology Power System SIM Serial Audio GPIO  LTE category LTE bands HSDPA category HSUPA category 3G bands GPRS/EDGE class 2G bands MIMO 2x2 / Rx diversity Antenna Detection VCC module supply in V_BCKP V_INT 1.8 V supply out PWR_ON RESET_N Host select SIM 1.8 V / 3.0 V SIM detection UART 1.8 V USB 2.0 High-Speed SDIO 1.8 V DDC (I2C) 1.8 V Analog audio Digital audio  GPIOs 1.8 V Network indication Clock output Wi-Fi control TOBY-L200 4 2,4,5 7,17 24 6 1,2,4 5,8 12 Quad ● ○ ● ● ● ● ●  ● ○ ○ ● ○ ○  ○ ○ ● ○ ○ TOBY-L201 4 2,4,5 13,17 24 6 2,5   ● ■ ● ● ● ● ●  ● ■ ● ● ■    ■ ●  ■ TOBY-L210 4 1,3,5 7,8,20 24 6 1,2 5,8 12 Quad ● ■ ● ● ● ● ●  ● ■ ○ ● ■ ■  ■ ■ ● ■ ■ TOBY-L220 4 1,3,5 8,19 24 6 1,8 19   ● ● ● ● ● ● ●  ● ● ● ● ● ●  ● ● ● ● ● TOBY-L280 4 1,3,5 7,8,28 24 6 1,2 5,8 12 Quad ● ● ● ● ● ● ●  ● ● ● ● ● ●  ● ● ● ● ● TOBY-R200 1 2,4 5,12 8 6 1,2 5,8 12 Quad ● ● ● ● ● ● ●  ● ● ● ● □ ●  ● ● ● ● □ TOBY-R201 1 2,4,5 12,13 8 6 2,5   ● ● ● ● ● ● ●  ● ● ● ● □ ●  ● ● ● ● □ TOBY-R202 1 2,4 5,12 8 6 2,5   ● ● ● ● ● ● ●  ● ● ● ● □ ●  ● ● ● ● □ ●  = supported by all product versions  ○ = supported by all product versions except version ‘00’ ■  = supported by all product versions except versions ‘00’,’01’,’60’  □ = supported by all product versions except versions ‘02’ Table 51: Summary of TOBY-L2 series and TOBY-R2 series modules interfaces Figure 73 summarizes the LTE, 3G and 2G operating frequency bands of TOBY-L2 and TOBY-R2 series modules.  TOBY-L200TOBY-L210TOBY-L201TOBY-L220TOBY-L2802500 2690800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 22001717704 1710750 2500 2550 2600 2650 27007 74 42 255700VII II850900850900 18001900 19001800IIVIIIVIII IV IVV960 2170800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 220020791750 2500 2550 2600 2650 27002500 26901710V20 7 73 3 115588960 2170700VII II850900850900 18001900 19001800IIVIIIVIIIV800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 22001717704 1710750 2500 2550 2600 2650 27004 42 255700VII IIV894 21551313800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200824750 2500 2550 2600 2650 270017103 3 115588960 2170700V IIVIIIVIIIV19 19800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 220028703750 2500 2550 2600 2650 27002500 26901710V7 73 3 115588960 2170700VII II850900850900 18001900 19001800IIVIIIVIIIV28TOBY-R201TOBY-R202 = 3G bands= 2G bands= LTE bandsLEGENDA800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 220012699 1710750 2500 2550 2600 2650 27004 42 255700VII IIV894 2155131312800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 220012699 1710750 2500 2550 2600 2650 27004 42 2700VII IIV894 215512 55TOBY-R200 800 850 900 950 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200699 1710750 2500 2550 2600 2650 27004 42 255700VII II850900850900 18001900 19001800IIVIIIVIIIV960 217012 12 Figure 73: Summary of TOBY-L2 and TOBY-R2 series modules LTE, 3G and 2G operating frequency bands
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 139 of 146 A.2 Pin-out comparison between TOBY-L2 and TOBY-R2   TOBY-L2  TOBY-R2   Pin No Pin Name Description Pin Name Description Remarks for migration 1 RSVD Reserved RSVD Reserved  2 GND Ground GND Ground  3 V_BCKP RTC Supply Input/Output 3.0 V output 1.4 V – 4.2 V input (RTC backup) V_BCKP RTC Supply Input/Output 1.8 V output 1.0 V – 1.9 V input (RTC backup) Voltage values slightly different, but with no functional difference 4 VUSB_DET Not supported VUSB_DET VBUS USB supply (5 V) detection 5 V must be applied at VUSB_DET input of TOBY-R2 to enable USB. The pin must be left unconnected on TOBY-L2, as it is not supported. 5 V_INT Interfaces Supply Output 1.8 V output V_INT Interfaces Supply Output 1.8 V output  6 RSVD Reserved This pin must be connected to GND RSVD Reserved This pin must be connected to GND  7-9 RSVD Reserved RSVD Reserved  10 DSR UART DSR Output18 / GPIO19 DSR UART DSR Output Further GPIO function on TOBY-L2 11 RI UART RI Output18 / GPIO19 RI UART RI Output Further GPIO function on TOBY-L2 12 DCD UART DCD Output18 / GPIO19 DCD UART DCD Output Further GPIO function on TOBY-L2 13 DTR UART DTR Input18 / GPIO19 DTR UART DTR Input Further GPIO function on TOBY-L2 14 RTS UART RTS Input18 RTS UART RTS Input  15 CTS UART CTS Output18 CTS UART CTS Output  16 TXD UART Data Input18 TXD UART Data Input  17 RXD UART Data Output18 RXD UART Data Output  18 RSVD Reserved RSVD Reserved Test-Point recommended for TOBY-R2 19 RSVD Reserved RSVD Reserved Test-Point recommended for TOBY-R2 20 PWR_ON Power-on Input Internal 50k pull-up to VCC PWR_ON Power-on Input Internal 10k pull-up to V_BCKP Internal pull-up slightly different, but with no functional difference 21 GPIO1 GPIO19 WWAN status indication on ”00”, “01” and “60” product versions GPIO1 GPIO  22 GPIO2 GPIO19 GPIO2 GPIO  23 RESET_N Reset signal Input Internal 50k pull-up to VCC Reset, Switch-on, Switch-off RESET_N Reset signal Input Internal 10k pull-up to V_BCKP Reset, Switch-on Internal pull-up slightly different. Function slightly different. 24 GPIO3 GPIO19 GPIO3 GPIO  25 GPIO4 GPIO19 GPIO4 GPIO  26 HOST_SELECT0 Not supported HOST_SELECT0 Not supported  27 USB_D- USB Data I/O (D-) USB_D- USB Data I/O (D-)  28 USB_D+ USB Data I/O (D+) USB_D+ USB Data I/O (D+)  29 RSVD Reserved RSVD Reserved  30 GND Ground GND Ground  31 RSVD Reserved RSVD Reserved  32 GND Ground GND Ground  33-43 RSVD Reserved RSVD Reserved  44 GND Ground GND Ground  45 RSVD Reserved RSVD Reserved  46 GND Ground GND Ground  47-49 RSVD Reserved RSVD Reserved  50 I2S_WA I2S Word Alignment18 / GPIO19 I2S_WA I2S Word Alignment / GPIO  51 I2S_TXD I2S Data Output18 / GPIO19 I2S_TXD I2S Data Output / GPIO  52 I2S_CLK I2S Clock18 / GPIO19  I2S_CLK I2S Clock / GPIO  53 I2S_RXD I2S Data Input18 / GPIO19 I2S_RXD I2S Data Input / GPIO                                                        18 Not supported by “00” product versions 19 Not supported by “00”, “01”, “60” product versions
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 140 of 146  TOBY-L2  TOBY-R2   Pin No Pin Name Description Pin Name Description Remarks for migration 54 SCL I2C Clock Output20  SCL I2C Clock Output   55 SDA I2C Data I/O20 SDA I2C Data I/O  56 SIM_CLK SIM Clock Output SIM_CLK SIM Clock Output  57 SIM_IO SIM Data I/O SIM_IO SIM Data I/O  58 SIM_RST SIM Reset Output SIM_RST SIM Reset Output  59 VSIM SIM Supply Output VSIM SIM Supply Output  60 GPIO5 GPIO20 SIM detection GPIO5 GPIO SIM detection  61 GPIO6 GPIO20 GPIO6 GPIO  62 HOST_SELECT1 Not supported HOST_SELECT1 Not supported  63 SDIO_D2 SDIO serial data [2]20  SDIO_D2 SDIO serial data [2]21   64 SDIO_CLK SDIO serial clock20 SDIO_CLK SDIO serial clock21   65 SDIO_CMD SDIO command20 SDIO_CMD SDIO command21  66 SDIO_D0 SDIO serial data [0]20 SDIO_D0 SDIO serial data [0]21   67 SDIO_D3 SDIO serial data [3]20  SDIO_D3 SDIO serial data [3]21  68 SDIO_D1 SDIO serial data [1]20  SDIO_D1 SDIO serial data [1]21  69 GND Ground GND Ground  70-72 VCC Module Supply Input 3.40 V – 4.35 V normal range 3.20 V – 4.35 V extended range VCC Module Supply Input 3.30 V – 4.40 V normal range 3.00 V – 4.50 V extended range Larger operating ranges on TOBY-R2. VCC BB / PA split on TOBY-R200 73-74 GND Ground GND Ground  75 ANT_DET Antenna Detection Input20 ANT_DET Antenna Detection Input  76 GND Ground GND Ground  77 RSVD Reserved RSVD Reserved  78-80 GND Ground GND Ground  81 ANT1 RF Antenna Input/Output Up to six LTE bands Up to five 3G bands Up to four 2G bands ANT1 RF Antenna Input/Output Up to five LTE bands Up to four 3G bands Up to four 2G bands No RF functional difference Different operating bands support 82-83 GND Ground GND Ground  84 RSVD Reserved RSVD Reserved  85-86 GND Ground GND Ground  87 ANT2 RF Antenna Input  ANT2 RF Antenna Input  No RF functional difference  Different operating bands support 88-90 GND Ground GND Ground  91 RSVD Reserved RSVD Reserved  92-152 GND Ground GND Ground  Table 52: TOBY-L2 and TOBY-R2 series modules pin assignment with remarks for migration   For further details regarding the characteristics, capabilities, usage or settings applicable for each interface of the cellular modules, see the TOBY-R2 series Data Sheet  [1], the TOBY-L2 series Data Sheet [26], the TOBY-L2 / MPCI-L2 series System Integration Manual [27], the u-blox AT Commands Manual [2] and the Nested Design Application Note [28].                                                        20 Not supported by “00”, “01”, “60” product versions 21 Not supported by “02” product versions
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 141 of 146 A.3 Schematic for TOBY-L2 and TOBY-R2 integration Figure 74 shows an  example  schematic diagram  where a TOBY-L2 series  module  or  a TOBY-R2 series  module (“00”, “01”, “02”, “60”, or “62” product versions) can be integrated into the same application board, using all the available interfaces and functions of the module. The different mounting options for the external parts are highlighted in different colors as described in the legend, according to the interfaces supported by the different module product versions.  3V8GND330uF 100nF 10nF71 VCC72 VCC70 VCC3V_BCKP23 RESET_NApplication ProcessorOpen Drain Output20 PWR_ONOpen Drain Output68pFTPTP15pF 8.2pF+100uF+GNDRTCback-up16 TXD17 RXD12 DCD14 RTS15 CTS13 DTR10 DSR11 RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 HostD-D+27 USB_D-28 USB_D+VBUS 4VUSB_DETTPTPGND GND0Ω0Ω0Ω0Ω0Ω0Ω0Ω26 HOST_SELECT062 HOST_SELECT1RSVDRSVD6RSVD19TP21GPIO1 Wi-Fi enableELLA-W131Wi-Fi ModuleANT1 29ANT2 26BPFLDO Regulator3V8OUTIN VIO51V86LDO Regulator 3V33V8OUTINGNDSHDNn3V341V8OUTINGNDSHDNnV_INT470k65SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLK22Ω22Ω22Ω22Ω22Ω22ΩSD_D015SD_D116SD_D211SD_D312SD_CLK14SD_CMD13GNDPDn9RESETn10SLEEP_CLK19CFG20GND47kWi-Fi Antenna3V8WWAN Indicator0Ω0Ω0ΩTOBY-L2 series (’00’, ‘01’, ’02’, ‘60’, ‘62’ versions)TOBY-R2 series (’02’ product versions)47pFSIM Card HolderCCVCC  (C1)CCVPP (C6)CCIO (C7)CCCLK  (C3)CCRST  (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pFSW1 SW25V_INT60GPIO5470k ESD ESD ESD ESD ESD ESD1kTPV_INTV_INTBCLKLRCLKAudio Codec MAX9860SDINSDOUT52I2S_CLK50I2S_WA51I2S_TXD53I2S_RXD61GPIO6 MCLK10µF1µF100nFVDDSPKOUTPOUTNMICMICBIAS1µFMICLNMICLPMICGNDEMIEMIEMIEMI1µF 2.2k1µF2.2kESD ESD10nF10nF 27pF27pF10nF ESD ESD27pF27pF10nF87ANT275ANT_DET10kConnector27pF ESDSecondary Cellular  Antenna33pF82nH82nH81Connector Primary Cellular Antenna33pFANT1LEGENDTOBY-L2xx-00TOBY-L2xx-01 TOBY-L2xx-60Mount forTOBY-L2xx-xxTOBY-R2xx-xxMount forTOBY-L2xx-01TOBY-L2xx-x2 TOBY-L2xx-60TOBY-R2xx-xxMount forMount for  TOBY-R2xx-xxMount for   TOBY-L2xx-x2Mount for0Ωfor TOBY-L2xx-00TOBY-L2xx-01TOBY-L2xx-6022 GPIO224 GPIO325 GPIO43V8NetworkIndicatorSDASCL5554SDASCLIRQn10kV_INT4.7k4.7kRSVD18TPTP0ΩMount for modules supporting 2GMount for modules supporting LTE Band-7TOBY-L2xx-x2TOBY-R2xx-xx Figure 74: Example of complete schematic diagram to integrate TOBY-L2 modules and TOBY-R2 modules (“00”, “01”, “02”, “60”, or “62” product versions) on the same application board, using all the available interfaces / functions of the modules
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 142 of 146 B Glossary  3GPP 3rd Generation Partnership Project 8-PSK 8 Phase-Shift Keying modulation 16QAM 16-state Quadrature Amplitude Modulation 64QAM 64-state Quadrature Amplitude Modulation ACM Abstract Control Model  ADC Analog to Digital Converter AP Application Processor ASIC Application-Specific Integrated Circuit AT AT Command Interpreter Software Subsystem, or attention BAW Bulk Acoustic Wave  CSFB Circuit Switched Fall-Back  DC Direct Current  DCE Data Communication Equipment DDC Display Data Channel interface DL Down-Link (Reception) DRX Discontinuous Reception DSP Digital Signal Processing DTE Data Terminal Equipment ECM Ethernet networking Control Model EDGE Enhanced Data rates for GSM Evolution EMC Electro-Magnetic Compatibility EMI Electro-Magnetic Interference ESD Electro-Static Discharge ESR Equivalent Series Resistance E-UTRA Evolved Universal Terrestrial Radio Access  FDD Frequency Division Duplex  FEM Front End Module FOAT Firmware Over AT commands FOTA Firmware Over The Air FTP File Transfer Protocol FW Firmware GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System HBM Human Body Model HSIC High Speed Inter Chip  HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HTTP HyperText Transfer Protocol  HW Hardware I/Q In phase and Quadrature I2C Inter-Integrated Circuit interface I2S Inter IC Sound interface IP Internet Protocol LDO Low-Dropout LGA Land Grid Array
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Appendix      Page 143 of 146 LNA Low Noise Amplifier LPDDR Low Power Double Data Rate synchronous dynamic RAM memory LTE Long Term Evolution  M2M Machine-to-Machine MBIM Mobile Broadband Interface Model MIMO Multi-Input Multi-Output N/A Not Applicable N.A. Not Available NCM Network Control Model OEM Original Equipment Manufacturer device: an application device integrating a u-blox cellular module OTA Over The Air PA Power Amplifier PCM Pulse Code Modulation PCN / IN Product Change Notification / Information Note PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit PWM Pulse Width Modulation QPSK  Quadrature Phase Shift Keying  RF Radio Frequency RMII Reduced Media Independent Interface RNDIS Remote Network Driver Interface Specification RSE Radiated Spurious Emission RTC Real Time Clock SAW Surface Acoustic Wave SDIO Secure Digital Input Output  SIM Subscriber Identification Module SMS Short Message Service SRF Self Resonant Frequency SSL Secure Socket Layer TBD To Be Defined TCP Transmission Control Protocol TDD Time Division Duplex  TDMA Time Division Multiple Access TIS Total Isotropic Sensitivity TP Test-Point TRP Total Radiated Power UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UICC Universal Integrated Circuit Card UL Up-Link (Transmission) UMTS Universal Mobile Telecommunications System USB Universal Serial Bus VCO Voltage Controlled Oscillator VoLTE Voice over LTE VSWR Voltage Standing Wave Ratio Wi-Fi Wireless Local Area Network (IEEE 802.11 short range radio technology) WLAN Wireless Local Area Network (IEEE 802.11 short range radio technology) WWAN Wireless Wide Area Network (GSM / UMTS / LTE cellular radio technology)
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Related documents      Page 144 of 146 Related documents [1] u-blox TOBY-R2 series Data Sheet, Docu No UBX-16005785 [2] u-blox AT Commands Manual, Docu No UBX-13002752 [3] u-blox EVK-R2xx User Guide, Docu No UBX-16016088 [4] u-blox Windows Embedded OS USB Driver Installation Application Note, Docu No UBX-14003263 [5] u-blox Firmware Update Application Note, Docu No UBX-13001845 [6] Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/usb20_docs/  [7] ITU-T Recommendation V.24 - 02-2000 - List of definitions for interchange circuits between Data Terminal Equipment (DTE) and Data Circuit-terminating Equipment (DCE), http://www.itu.int/rec/T-REC-V.24-200002-I/en [8] 3GPP TS 27.007 - AT command set for User Equipment (UE)  [9] 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)  [10] 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol [11] u-blox Mux Implementation Application Note, Docu No UBX-13001887 [12] I2C-bus specification and user manual - Rev. 5 - 9 October 2012 - NXP Semiconductors, http://www.nxp.com/documents/user_manual/UM10204.pdf [13] u-blox GNSS Implementation Application Note, Docu No UBX-13001849  [14] GSM Association TS.09 - Battery Life Measurement and Current Consumption Technique http://www.gsma.com/newsroom/wp-content/uploads/2013/09/TS.09-v7.6.pdf  [15] CENELEC EN 61000-4-2 (2001): "Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement techniques – Electrostatic discharge immunity test". [16] ETSI EN 301 489-1 V1.8.1: “Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 1: Common technical requirements” [17] ETSI EN 301 489-7 V1.3.1 “Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems“ [18] ETSI EN 301 489-24 V1.4.1 "Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment" [19] 3GPP TS 51.010-2 - Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) [20] 3GPP TS 34.121-2 - Technical Specification Group Radio Access Network; User Equipment (UE) conformance specification; Radio transmission and reception (FDD); Part 2: Implementation Conformance Statement (ICS) [21] 3GPP TS 36.521-1 - Evolved Universal Terrestrial Radio Access; User Equipment conformance specification; Radio transmission and reception; Part 1: Conformance Testing [22] 3GPP TS 36.521-2 - Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment conformance specification; Radio transmission and reception; Part 2: Implementation Conformance Statement (ICS) [23] 3GPP TS 36.523-2 - Evolved Universal Terrestrial Radio Access (E-UTRA) and Evolved Packet Core (EPC); User Equipment conformance specification; Part 2: Implementation Conformance Statement (ICS) [24] u-blox End user test Application Note, Docu No UBX-13001922 [25] u-blox Package Information Guide, Docu No UBX-14001652 [26] u-blox TOBY-L2 series Data Sheet, Docu No UBX-13004573 [27] u-blox TOBY-L2 / MPCI-L2 series System Integration Manual, Docu No UBX- 13004618 [28] u-blox Nested Design Application Note, Docu No UBX-16007243  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com/).
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Revision history      Page 145 of 146 Revision history Revision Date Name Status / Comments R01 08-Jul-2016 sses Initial release for TOBY-R2 series modules
TOBY-R2 series - System Integration Manual UBX-16010572 - R01  Objective Specification  Contact      Page 146 of 146 Contact For complete contact information visit us at http://www.u-blox.com/  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 703 483 3180 E-mail:  info_us@u-blox.com Regional Office West Coast: Phone:  +1 408 573 3640 E-mail:  info_us@u-blox.com Technical Support: Phone:  +1 703 483 3185 E-mail:  support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com Support:  support@u-blox.com  Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com Regional Office Australia: Phone:  +61 2 8448 2016 E-mail:  info_anz@u-blox.com Support:  support_ap@u-blox.com Regional Office China (Beijing): Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office China (Chongqing): Phone:  +86 23 6815 1588 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office China (Shanghai): Phone:  +86 21 6090 4832 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office China (Shenzhen): Phone:  +86 755 8627 1083 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office India: Phone:  +91 80 4050 9200 E-mail:  info_in@u-blox.com Support:  support_in@u-blox.com Regional Office Japan (Osaka): Phone:  +81 6 6941 3660 E-mail:  info_jp@u-blox.com  Support:  support_jp@u-blox.com  Regional Office Japan (Tokyo): Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com Support:  support_jp@u-blox.com Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com

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