u blox LISAU120 LISA-U120 User Manual LISA U1 LISA H1 series

u-blox AG LISA-U120 LISA U1 LISA H1 series

[short-term confidential] User's Manual

    LISA-U1/LISA-H1 series 3.75G/3.5G HSxPA  Wireless Modules System Integration Manual                Abstract This  document  describes  the  features  and  the  integration  of  the   LISA-U1/LISA-H1 series HSxPA wireless modules. LISA-U1/LISA-H1  series  modules  are  a  complete  and  cost  efficient 3.75G/3.5G  solution  offering  high-speed dual-band  HSDPA/HSUPA and  quad-band  GSM/GPRS  voice  and/or  data  transmission technology in a compact form factor.  locate, communicate, accelerate 33.2 x 22.4 x 2.7 mm www.u-blox.com
LISA-U1/LISA-H1 series - System Integration Manual  3G.G2-HW-10002-2   Page 2 of 116   Document Information Title LISA-U1/LISA-H1 series Subtitle 3.75G/3.5G HSxPA  Wireless Modules  Document type System Integration Manual  Document number 3G.G2-HW-10002-2 Document status Advance Information  Document status information Objective Specification This document contains target values. Revised and supplementary data will be published later. Advance Information This document contains data based on early testing. Revised and supplementary data will be published later. Preliminary This document contains data from product verification. Revised and supplementary data may be published later. Released This document contains the final product specification.  This document applies to the following products: Name Type number Firmware version PCN / IN LISA-U100 LISA-U100-00S-00 n.a. n.a. LISA-U110 LISA-U110-00S-00 n.a. n.a. LISA-U120 LISA-U120-00S-00 n.a. n.a. LISA-U130 LISA-U130-00S-00 n.a. n.a. LISA-H100 LISA-H100-00S-00 n.a. n.a. LISA-H110 LISA-H110-00S-00 n.a. n.a.            This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They can be downloaded from www.u-blox.com. u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice.  u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2011, u-blox AG. u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Preface      Page 3 of 116 Preface u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT  Commands  Manual:  This  document  provides  the  description  of  the  supported  AT  commands  by  the  LISA-U1/LISA-H1 series module to verify all implemented functionalities. System Integration Manual: This Manual provides hardware design instructions  and information on  how to set up production and final product tests. Application  Note:  document  provides  general  design  instructions  and  information  that  applies  to  all  u-blox Wireless  modules.  See  Section Related  documents for  a  list  of  Application  Notes  related  to  your  Wireless Module. How to use this Manual The LISA-U1/LISA-H1 series System Integration Manual provides the necessary information to successfully design in and configure these u-blox wireless modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  Questions If you have any questions about u-blox Wireless Integration, please:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com  Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com Technical Support Worldwide Web Our  website  (www.u-blox.com)  is  a  rich  pool  of  information.  Product  information,  technical  documents  and helpful FAQ can be accessed 24h a day. By E-mail Contact the nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support please have the following information ready:  Module type (e.g. LISA-U100) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Contents      Page 4 of 116 Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1 System description ....................................................................................................... 7 1.1 Overview .............................................................................................................................................. 7 1.2 Architecture .......................................................................................................................................... 8 1.2.1 Functional blocks ........................................................................................................................... 9 1.2.2 Hardware differences between LISA-U1/LISA-H1 series modules .................................................. 10 1.3 Pin-out ............................................................................................................................................... 11 1.4 Operating modes ................................................................................................................................ 14 1.5 Power management ........................................................................................................................... 16 1.5.1 Power supply circuit overview ...................................................................................................... 16 1.5.2 Module supply (VCC) .................................................................................................................. 17 1.5.3 Current consumption profiles ...................................................................................................... 24 1.5.4 RTC Supply (V_BCKP) .................................................................................................................. 28 1.5.5 Interface supply (V_INT) ............................................................................................................... 30 1.6 System functions ................................................................................................................................ 31 1.6.1 Module power on ....................................................................................................................... 31 1.6.2 Module power off ....................................................................................................................... 35 1.6.3 Module reset ............................................................................................................................... 36 1.7 RF connection ..................................................................................................................................... 37 1.8 (U)SIM interface .................................................................................................................................. 38 1.8.1 (U)SIM functionality ..................................................................................................................... 40 1.9 Serial communication ......................................................................................................................... 41 1.9.1 Serial interfaces configuration ..................................................................................................... 41 1.9.2 Asynchronous serial interface (UART)........................................................................................... 42 1.9.3 USB interface............................................................................................................................... 54 1.9.4 SPI interface ................................................................................................................................ 56 1.9.5 MUX Protocol (3GPP 27.010) ...................................................................................................... 60 1.10 DDC (I2C) interface .......................................................................................................................... 61 1.10.1 Overview ..................................................................................................................................... 61 1.10.2 DDC application circuit ................................................................................................................ 62 1.11 Audio Interface (LISA-U120 and LISA-U130 only) ............................................................................ 63 1.11.1 Analog Audio interface ............................................................................................................... 64 1.11.2 Digital Audio interface ................................................................................................................. 70 1.11.3 Voiceband processing system ...................................................................................................... 72 1.12 General Purpose Input/Output (GPIO) ............................................................................................. 74 1.13 Reserved pins (RSVD) ...................................................................................................................... 77 1.14 Schematic for LISA-U1/LISA-H1 series module integration ............................................................... 78 1.15 Approvals ........................................................................................................................................ 79
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Contents      Page 5 of 116 1.15.1 R&TTED and European Conformance CE mark ............................................................................ 79 1.15.2 IC ................................................................................................................................................ 79 1.15.3 Federal communications commission notice ................................................................................ 79 2 Design-In ..................................................................................................................... 82 2.1 Design-in checklist .............................................................................................................................. 82 2.1.1 Schematic checklist ..................................................................................................................... 82 2.1.2 Layout checklist ........................................................................................................................... 82 2.1.3 Antenna checklist ........................................................................................................................ 83 2.2 Design Guidelines for Layout .............................................................................................................. 84 2.2.1 Layout guidelines per pin function ............................................................................................... 84 2.2.2 Footprint and paste mask ............................................................................................................ 93 2.2.3 Placement ................................................................................................................................... 94 2.3 Thermal aspects .................................................................................................................................. 95 2.4 Antenna guidelines ............................................................................................................................. 96 2.4.1 Antenna termination ................................................................................................................... 97 2.4.2 Antenna radiation ....................................................................................................................... 98 2.4.3 Antenna detection functionality .................................................................................................. 99 2.5 ESD immunity test precautions ......................................................................................................... 102 2.5.1 General precautions .................................................................................................................. 102 2.5.2 Antenna interface precautions ................................................................................................... 103 2.5.3 Module interfaces precautions ................................................................................................... 104 3 Handling and soldering ........................................................................................... 105 3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 105 3.2 Soldering .......................................................................................................................................... 105 3.2.1 Soldering paste.......................................................................................................................... 105 3.2.2 Reflow soldering ....................................................................................................................... 105 3.2.3 Optical inspection ...................................................................................................................... 107 3.2.4 Cleaning .................................................................................................................................... 107 3.2.5 Repeated reflow soldering ......................................................................................................... 107 3.2.6 Wave soldering.......................................................................................................................... 107 3.2.7 Hand soldering .......................................................................................................................... 107 3.2.8 Rework ...................................................................................................................................... 107 3.2.9 Conformal coating .................................................................................................................... 107 3.2.10 Casting ...................................................................................................................................... 108 3.2.11 Grounding metal covers ............................................................................................................ 108 3.2.12 Use of ultrasonic processes ........................................................................................................ 108 4 Product Testing......................................................................................................... 109 4.1 u-blox in-series production test ......................................................................................................... 109 4.2 Test parameters for OEM manufacturer ............................................................................................ 109 Appendix ........................................................................................................................ 110
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Contents      Page 6 of 116 A Extra Features ........................................................................................................... 110 A.1 TCP/IP ............................................................................................................................................... 110 A.1.1 Multiple IP addresses and sockets .............................................................................................. 110 A.2 FTP ................................................................................................................................................... 110 A.3 FTPS ................................................................................................................................................. 110 A.4 HTTP ................................................................................................................................................. 110 A.5 HTTPS ............................................................................................................................................... 110 A.6 SMTP ................................................................................................................................................ 110 A.7 AssistNow clients and GPS integration .............................................................................................. 110 A.8 In-Band modem (LISA-U130 only) ..................................................................................................... 110 A.9 Smart temperature supervision ......................................................................................................... 111 B Glossary .................................................................................................................... 112 Related documents......................................................................................................... 114 Revision history .............................................................................................................. 114 Contact ............................................................................................................................ 116
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 7 of 116 1 System description 1.1 Overview The LISA-U1/LISA-H1 series is a family of SMT wireless modules featuring Leadless Chip Carrier (LCC) packaging and integrating a full-feature 3G UMTS/HSxPA and 2G GSM/GPRS/EDGE protocol stack with A-GPS support. UMTS/HSDPA/HSUPA characteristics:  UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD) operating mode  Dual-band support:  Band II (1900 MHz) and Band V (850 MHz) for LISA-U100, LISA-U120, LISA-H100  Band I (2100 MHz) and Band VIII (900 MHz) for LISA-U110, LISA-U130, LISA-H110  Power Class 3 (24 dBm) for WCDMA/HSDPA/HSUPA mode  HSUPA category 6, up to 7.2 Mb/s DL, 5.76 Mb/s UL (LISA-U1 series only)  HSDPA category 8, up to 7.2 Mb/s DL, 384 kb/s UL (LISA-U1 series only)  HSDPA category 6, up to 3.6 Mb/s DL, 384 kb/s UL (LISA-H1 series only)  WCDMA PS data up to 384 kb/s DL/UL  WCDMA CS data up to 64 kb/s DL/UL GSM/GPRS/EDGE characteristics:  Quad-band support: GSM 850 MHz, E-GSM 900 MHz, DCS 1800 MHz and PCS 1900 MHz  GSM/GPRS Power Class 4 (33 dBm) for GSM/E-GSM bands  GSM/GPRS Power Class 1 (30 dBm) for DCS/PCS bands  EDGE Power Class E2 (27 dBm) for GSM/E-GSM bands  EDGE Power Class E2 (26 dBm) for DCS/PCS bands  EDGE multislot class 121, coding scheme MCS1-MCS9, up to 236.8 kb/s   GPRS multislot class 121, coding scheme CS1-CS4, up to 85.6 kb/s   CSD Non-transparent / Transparent Mode, up to 9.6 kb/s  As  a  3G  module  the  LISA-U1/LISA-H1  series  module  is  Class  A  User  Equipment:  the  device  can  work simultaneously in Packet Switch and Circuit Switch mode. This means that voice calls are possible while the data connection is active without any interruption in service. As a 2G module the LISA-U1/LISA-H1 series module is Class B Mobile Station: the device can be attached to both GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode), using one service at a time. For instance, if during  data  transmission  an  incoming  call  occurs,  the  data  connection  is  suspended  to  permit  the  voice communication. Once the voice call has terminated, the data service is resumed. Network operation modes I to III  are  supported,  with  user-definable  preferred  service  selectable  from  GSM  to  GPRS.  Optionally  paging messages for GSM calls can be monitored during GPRS data transfer in not-coordinating NOM II-III. LISA-U1/LISA-H1  series  modules implement  GPRS/EGPRS class  12  for  data  transfer.  GPRS  class determines the number of timeslots available for upload and download and thus the speed at which data can be transmitted and received, with higher classes typically allowing faster data transfer rates.  Class 12 implies a maximum of 4 slots in download (reception) and 4 slots in upload (transmission) with 5 slots in total. The  network  automatically  configures  the  number  of  timeslots  used  for  reception  or  transmission  (voice  calls take precedence over GPRS traffic). The network also automatically configures channel encoding (CS1 to MCS9). The maximum (E)GPRS bit rate of the mobile station depends on the coding scheme and number of time slots. Direct Link mode is supported for TCP sockets.                                                       1 GPRS/EDGE multislot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 8 of 116 1.2 Architecture WirelessBase-bandProcessorMemoryPower Management UnitRF Transceiver26 MHz32.768 kHzSAWFilterFEM & 2G PAANTLNA3G PALNA3G PADDC (for GPS)(U)SIM CardUARTSPIUSBGPIO(s)Power OnExternal ResetV_BCKP (RTC)Vcc (Supply)V_INT (I/O) Figure 1: LISA-U100, LISA-U110, LISA-H100, LISA-H110 block diagram WirelessBase-bandProcessorMemoryPower Management UnitRF Transceiver26 MHz32.768 kHzSAWFilterFEM & 2G PAANTLNA3G PALNA3G PADDC (for GPS)(U)SIM CardUARTSPIUSBGPIO(s)Power OnExternal ResetV_BCKP (RTC)Vcc (Supply)V_INT (I/O)Digital Audio (I2S)AnalogAudio Figure 2: LISA-U120, LISA-U130 block diagram
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 9 of 116 1.2.1 Functional blocks LISA-U1/LISA-H1 series modules consist of the following internal functional blocks: RF high power front-end, RF transceiver, Baseband section and Power Management Unit. RF high-power front-end A separated shielding box includes the RF high-power signal circuitry, namely:  Front-End Module (FEM) with integrated quad-band 2G Power Amplifier and antenna switch multiplexer  Two single-band 3G HSxPA/WCDMA Power Amplifier modules with integrated duplexers The RF antenna is directly connected to the FEM, which dispatches the RF signals according to the active mode. For time-duplex 2G operation, the incoming signal at the active Receiver (RX) slot is applied to integrated SAW filters for out-of-band rejection and then sent to the appropriate receiver port of the RF transceiver. During the allocated Transmitter (TX) slots, the low level signal coming from the RF transceiver is enhanced by the 2G power amplifier module and then directed to the antenna through the FEM. The 3G transmitter and receiver are instead active at the same time due to frequency-domain duplex operation. The switch integrated in the FEM connects the  antenna  port  to  the  passive  duplexer  which  separates  the  TX  and  RX  signal  paths.  The  duplexer  itself provides front-end RF filtering for RX band selection while combining the amplified TX signal coming from the fixed gain linear power amplifier. RF Transceiver In the same shielding box that includes the RF high-power signal circuitry there are all the low-level analog RF components, namely:  Dual-band HSxPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver  Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO)  Low Noise Amplifier (LNA) and SAW RF filters for 2G and 3G receivers While  operating  in  3G  mode,  the  RF  transceiver  performs  direct  up-conversion  and  down-conversion  of  the baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the downlink path, the  external LNA enhances the  RX sensitivity while discrete inter-stage SAW filters  additionally improve  the  rejection  of  out-of-band  blockers.  An  internal  programmable  gain  amplifier  optimizes  the  signal levels before delivering to the analog I/Q to baseband for further digital processing. For  2G  operations,  a  constant  gain  direct  conversion  receiver  with  integrated  LNAs  and  highly  linear  RF quadrature  demodulator  are  used to  provide  the  same I/Q signals  to baseband  as  well. In transmit  mode,  the up-conversion  is  implemented  by  means of  a digital sigma-delta transmitter  or polar modulator depending  on the modulation to be transmitted. In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.8-4 GHz voltage controlled oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation circuits while operating in active mode. Modulation Types Used GSM  GSMK GPRS GMSK EDGE 8PSK WCDMA  QPSK HSDPA  16-QAM HSUPA BPSK Baseband section and power management unit Another shielding box includes all the digital circuitry and the power supplies, basically the following functional blocks:
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 10 of 116  Wireless baseband processor, a mixed signal ASIC which integrates:  Microprocessor for controller functions, 2G & 3G upper layer software  DSP core for 2G Layer 1 and audio processing  3G coprocessor and HW accelerator for 3G Layer 1 control software and routines  Dedicated HW for peripherals control, as UART, USB, SPI etc  Memory system in a Multi-Chip Package (MCP) integrating two devices:  NOR flash non-volatile memory  DDR SRAM volatile memory  Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC  32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or power off mode 1.2.2 Hardware differences between LISA-U1/LISA-H1 series modules Hardware differences between the LISA-U1/LISA-H1 series modules:  3G Dual-band support:  Band II (1900 MHz) and Band V (850 MHz) are supported by LISA-U100, LISA-U120, LISA-H100  Band I (2100 MHz) and Band VIII (900 MHz) are supported by LISA-U110, LISA-U130, LISA-H110  3G maximum data rate capabilities:  HSUPA category 6, up to 7.2 Mb/s DL, 5.76 Mb/s UL for LISA-U1 series  HSDPA category 8, up to 7.2 Mb/s DL, 384 kb/s UL for LISA-U1 series  HSDPA category 6, up to 3.6 Mb/s DL, 384 kb/s UL for LISA-H1 series  Audio support:  One differential analog audio input, one differential analog audio output and one 4-wire digital audio interface are supported by LISA-U120 and LISA-U130  No  analog  audio  input,  no  analog  audio  output  and  no  digital  audio  interface  are  supported  by LISA-U100, LISA-U110, LISA-H100, LISA-H110
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 11 of 116 1.3 Pin-out Table 1 lists the pin-out of the LISA-U1/LISA-H1 series modules, with pins grouped by function. Function Pin No I/O Description Remarks Power VCC 61, 62, 63 I Module Supply Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range. Consider that there are large current spikes in connected mode, when a GSM call is enabled. VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize power loss due to series resistance. See section 1.5.2 GND 1, 3, 6, 7, 8, 17, 25, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 60, 64, 65, 66, 67, 69, 70, 71, 72, 73, 75, 76 N/A Ground GND pins are internally connected but a good (low impedance) external ground connection can improve RF performance: all GND pins must be externally connected to ground. V_BCKP 2 I/O Real Time Clock supply input/output V_BCKP = 2.3 V (typical) generated by the module when VCC supply voltage is within valid operating range. See section 1.5.4 V_INT 4 O Digital I/O Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. See section 1.5.5 VSIM 50 O SIM supply output VSIM = 1.80 V typical or 2.90 V typical generated by the module according to the SIM card type. See section 1.8 RF ANT 68 I/O RF antenna interface 50  nominal impedance. See section 1.7, section 2.4 and section 2.2.1.1 SIM SIM_IO 48 I/O SIM data Internal 4.7 k pull-up to VSIM. Must meet SIM specifications. See section 1.8 SIM_CLK 47 O SIM clock Must meet SIM specifications. See section 1.8 SIM_RST 49 O SIM reset Must meet SIM specifications. See section 1.8 SPI SPI_MISO 57 O SPI Data Line. Master Input,  Slave Output Module Output: module runs as an SPI slave. See section 1.9.4 SPI_MOSI 56 I SPI Data Line. Master Output,  Slave Input Module Input: module runs as an SPI slave. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.4 SPI_SCLK 55 I SPI Serial Clock. Master Output,  Slave Input Module Input: module runs as an SPI slave. Internal active pull-down to GND enabled. See section 1.9.4 SPI_SRDY 58 O SPI Slave Ready to transfer control line. Master Input,  Slave Output Module Output: module runs as an SPI slave. See section 1.9.4
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 12 of 116 Function Pin No I/O Description Remarks SPI_MRDY 59 I SPI Master Ready to transfer control line. Master Output,  Slave Input Module Input: module runs as an SPI slave. Internal active pull- down to GND enabled. See section 1.9.4 DDC SCL 45 O I2C bus clock line Fixed open drain. External pull-up required. See section 1.10 SDA 46 I/O I2C bus data line Fixed open drain. External pull-up required. See section 1.10 UART RxD 16 O UART received data  Circuit 104 (RxD) in ITU-T V.24. Provide  access  to  the  pin  for  FW  update  and debugging if the USB interface is connected to the application processor. See section 1.9.2 TxD 15 I UART transmitted data Circuit 103 (TxD) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide  access  to  the  pin  for  FW  update  and debugging if the USB interface is connected to the application processor. See section 1.9.2 CTS 14 O UART clear to send  Circuit 106 (CTS) in ITU-T V.24. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2 RTS 13 I UART ready to send Circuit 105 (RTS) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2 DSR 9 O UART data set ready Circuit 107 (DSR) in ITU-T V.24. See section 1.9.2 RI 10 O UART ring indicator Circuit 125 (RI) in ITU-T V.24. See section 1.9.2 DTR 12 I UART data terminal ready Circuit 108/2 (DTR) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.2 DCD 11 O UART data carrier detect  Circuit 109 (DCD) in ITU-T V.24. See section 1.9.2 GPIO GPIO1 20 I/O GPIO See section 1.12 GPIO2 21 I/O GPIO See section 1.12 GPIO3 23 I/O GPIO See section 1.12 GPIO4 24 I/O GPIO See section 1.12 GPIO5 51 I/O GPIO See section 1.12 USB VUSB_DET 18 I USB detect input Input for  VBUS  (5  V  typical)  USB  supply sense  to enable USB interface. Provide  access  to  the  pin  for  FW  update  and debugging if the USB interface is not connected to the application processor. See section 1.9.3 USB_D+ 26 I/O USB Data Line D+ 90 Ω nominal differential impedance Pull-up  or  pull-down  resistors  and  external  series resistors  as  required  by  the  USB  2.0  high-speed specification [7] are part of the USB pad driver and need not be provided externally. Provide  access  to  the  pin  for  FW  update  and debugging if the USB interface is not connected to the application processor. See section 1.9.3
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 13 of 116 Function Pin No I/O Description Remarks USB_D- 27 I/O USB Data Line D- 90 Ω nominal differential impedance Pull-up  or  pull-down  resistors  and  external  series resistors  as  required  by  the  USB  2.0  high-speed specification [7] are part of the USB pad driver and need not be provided externally. Provide  access  to  the  pin  for  FW  update  and debugging if the USB interface is not connected to the application processor. See section 1.9.3 System PWR_ON 19 I Power-on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required.  See section 1.6.1 RESET_N 22 I External reset input Internal 10 kΩ pull-up to V_BCKP (2.3 V). See section 1.6.3 Audio (LISA-U120, LISA-U130) I2S_CLK 43 O I2S clock Check device specifications to ensure compatibility to module supported modes. See section 1.11.2. I2S_RXD 44 I I2S receive data Internal active pull-up to V_INT (1.8 V) enabled. Check device specifications to ensure compatibility to module supported modes. See section 1.11.2. I2S_TXD 42 O I2S transmit data Check device specifications to ensure compatibility to module supported modes. See section 1.11.2. I2S_WA 41 O I2S word alignment Check device specifications to ensure compatibility to module supported modes. See section 1.11.2. MIC_N 39 I Differential analog audio input (negative) Differential analog input shared for all analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. See section 1.11.1 MIC_P 40 I Differential analog audio input (positive) Differential analog input shared for all analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. See section 1.11.1 SPK_P 53 O Differential analog audio output (positive) Differential  analog  audio  output  shared  for  all analog  path  modes:  earpiece,  headset  and loudspeaker mode. See section 1.11.1 SPK_N 54 O Differential analog audio output (negative) Differential  analog  audio  output  shared  for  all analog  path  modes:  earpiece,  headset  and loudspeaker mode. See section 1.11.1 Reserved RSVD 5 N/A RESERVED pin This pin must be connected to ground RSVD 52 N/A RESERVED pin Do not connect RSVD 74 N/A RESERVED pin Do not connect Reserved (LISA-U100, LISA-U110, LISA-H100, LISA-H110) RSVD 43 N/A RESERVED pin Do not connect RSVD 44 N/A RESERVED pin Do not connect RSVD 42 N/A RESERVED pin Do not connect RSVD 41 N/A RESERVED pin Do not connect RSVD 39 N/A RESERVED pin Do not connect RSVD 40 N/A RESERVED pin Do not connect RSVD 53 N/A RESERVED pin Do not connect RSVD 54 N/A RESERVED pin Do not connect Table 1: LISA-U1/LISA-H1 series modules pin-out
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 14 of 116 1.4 Operating modes LISA-U1/LISA-H1  series  modules  include  several  operating  modes,  each  have  different  active  features  and interfaces. Table 2 summarizes the various operating modes and provides general guidelines for operation.  Operating Mode Description Features / Remarks Transition condition General Status: Power-down Not-Powered Mode VCC supply not present or below operating range. Microprocessor switched off (not operating). RTC only operates if supplied through V_BCKP pin. Module is switched off. Application interfaces are not accessible. Internal RTC timer operates only if a valid voltage is applied to V_BCKP pin. Module cannot be switched on by a falling edge provided on the PWR_ON input, or by a preset RTC alarm or by a rising edge provided on the RESET_N input. Power-Off Mode VCC supply within operating range. Microprocessor switched off (not operating). Only RTC runs. Module is switched off: normal shutdown after sending the AT+CPWROFF command (refer to u-blox AT Commands Manual [2]). Application interfaces are not accessible. Only the internal RTC timer in operation. Module can be switched on by a falling edge on the PWR_ON input, or by a rising edge on the RESET_N input, or by a preset RTC alarm. General Status: Normal Operation Idle-Mode Microprocessor runs with 32 kHz as reference oscillator. Module does not accept data signals from an external device. If power saving is enabled, the module automatically enters idle mode whenever possible. Application interfaces are disabled. If hardware flow control is enabled, the CTS line indicates that the module is in active mode and the UART interface is enabled: the line is driven in the OFF state when the module is not prepared to accept data by the UART interface. If hardware flow control is disabled, the CTS line is fixed to ON state. Module by default is not set to automatically enter idle mode whenever possible, unless power saving configuration is enabled by appropriate AT command (refer to u-blox AT Commands Manual [2], AT+UPSV). If the module is registered with the network and power saving is enabled, it automatically enters idle mode and periodically wakes up to active mode to monitor the paging channel for the paging block reception according to network indication. If module is not registered with the network and power saving is enabled, it automatically enters idle mode and periodically wakes up to monitor external activity. Module wakes up from idle mode to active mode if a voice or data call incoming. Module wakes up from idle mode to active mode if an RTC alarm occurs. Module wakes up from idle mode to active mode when data is received on UART interface (refer to 1.9.2). Module wakes up from idle mode to active mode when the RTS input line is set to the ON state by the DTE if the AT+UPSV=2 command is sent to the module (refer to 1.9.2). Module wakes up from idle mode to active mode at USB detection, applying 5 V (typ.) to the VUSB_DET pin. Module wakes up from idle mode to active mode when the connected USB host forces a remote wakeup of the module as USB device (refer to 1.9.3). Module wakes up from idle mode to active mode when the connected SPI master indicates to the module that it is ready to transmit or receive, by the IPC SPI_MRDY signal (refer to 1.9.4).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 15 of 116 Operating Mode Description Features / Remarks Transition condition Active-Mode Microprocessor runs with 26 MHz as reference oscillator. The module is prepared to accept data signals from an external device. Module is switched on and is fully active. Power saving is not enabled by default: it can be enabled by the AT+UPSV command (see u-blox AT Commands Manual [2]) The application interfaces are enabled. If power saving is enabled, the module automatically enters idle mode whenever possible (refer to u-blox AT Commands Manual [2], AT+UPSV). Connected-Mode Voice or data call enabled. Microprocessor runs with 26 MHz as reference oscillator. The module is prepared to accept data signals from an external device. The module is switched on and a voice call or a data call (2G/3G) is in progress. Module is fully active. The application interfaces are enabled. When call terminates, the module returns to the last operating state (Idle or Active). Table 2: Module operating modes summary  Transition between the different modes is described in Figure 3. Switch ON:•Apply VCCIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveAT+CPWROFF(no HW pin)Incoming/outgoing call or other dedicated device network communicationCall terminated, communication droppedRemove VCCSwitch ON:•PWR_ON•RESET_N•RTC AlarmNot poweredPower offActiveConnected Idle Figure 3: Operating modes transition
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 16 of 116 1.5 Power management 1.5.1 Power supply circuit overview LISA-U1/LISA-H1 series modules feature a power management concept optimized for the most efficient use of supplied power. This is achieved by hardware design utilizing a power efficient circuit topology (Figure 4), and by power management software controlling the module’s power saving mode.  Baseband Processor2G Power AmplifierSwitching Step-DownLISA-U1/LISA-H1 series5 x 10 µF61VCC62VCC63VCC50VSIM2V_BCKP4V_INT2 x 3G Power Amplifier(s)Linear LDOLinear LDOSwitching Step-DownLinear LDOLinear LDOLinear LDOI/OEBUCOREAnalogSIMRTCNOR FlashDDR SRAMRF TransceiverMemoryPower Management Unit Figure 4: Power management simplified block diagram Pins with supply function are reported in Table 3, Table 7 and Table 9. LISA-U1/LISA-H1 series modules must be supplied via the VCC pins. There is only one main power supply input, available on the three VCC pins that must be all connected to the external power supply The VCC pins are directly connected to the RF power amplifiers and to the integrated Power Management Unit (PMU)  within  the  module:  all  supply  voltages  needed  by  the  module  are  generated  from  the  VCC  supply  by integrated voltage regulators.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 17 of 116 V_BCKP  is  the  Real  Time  Clock  (RTC) supply.  When  the  VCC  voltage  is  within the  valid operating  range,  the internal PMU supplies the Real Time Clock and the same supply voltage will be available to the V_BCKP pin. If the VCC voltage is under the minimum operating limit (for example, during not powered mode), the Real Time Clock can be externally supplied via the V_BCKP pin (see section 1.5.4). When a 1.8 V or a 3 V SIM card type is connected, LISA-U1/LISA-H1 series modules automatically supply the SIM card via the VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is implemented, in accordance to the ISO-IEC 7816-3 specifications. The same voltage domain used internally to supply the digital interfaces is also available on  the  V_INT  pin, to allow more economical and efficient integration of the LISA-U1/LISA-H1 series modules in the final application. The integrated Power Management Unit also provides the control state machine for system start up and system reset control. 1.5.2 Module supply (VCC) The  LISA-U1/LISA-H1 series  modules  must  be  supplied through  the  VCC pins  by a DC power supply. Voltages must be stable: during operation, the current drawn from VCC can vary by some orders of magnitude, especially due to surging consumption profile of the GSM system (described in the section 1.5.3). It is important that the system power  supply circuit is  able to  support peak  power  (refer to  LISA-U1/LISA-H1  series Data  Sheet [1]  for specification).  Name Description Remarks VCC Module power supply input VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize the power loss due to series resistance. Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided must always be above the minimum limit of the operating range. Consider that during a GSM call there are large current spikes in connected mode. GND Ground GND pins are internally connected but a good (low impedance) external ground can improve RF performance: all available pads must be connected to ground. Table 3: Module supply pins   VCC pins ESD rating is 1 kV (contact discharge). A higher protection level  can be required if the line is externally accessible on the application board. A higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin.  The  voltage  provided  to  the  VCC  pins  must  be  within  the  normal  operating  range  limits  as  specified  in  the  LISA-U1/LISA-H1  series  Data  Sheet  [1].  Complete  functionality  of  the  module  is  only  guaranteed  within  the specified minimum and maximum VCC voltage operating range.   Ensure that the  input voltage at  the VCC pins never drops below the  minimum limit of the  operating range when the module is switched on. This is the case even during a GSM transmit burst, where the current consumption can rise up to minimum peaks of 2.5 A in case of a mismatched antenna load.   Operation  above  the  operating  range  maximum  limit  is  not  recommended  and  extended exposure beyond it may affect device reliability.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 18 of 116  Stress  beyond  the  VCC  absolute  maximum  ratings  can  cause  permanent  damage  to  the module: if necessary, voltage spikes beyond VCC absolute maximum ratings must be restricted to values within the specified limits by using appropriate protection.   When  designing  the  power  supply  for  the  application,  pay  specific  attention  to  power  losses  and transients.  The  DC  power  supply  must  be  able  to provide  a  voltage  profile  to  the  VCC  pins  with  the following characteristics:  Voltage drop during transmit slots must be lower than 400 mV   No undershoot or overshoot at the start and at the end of transmit slots   Voltage ripple during transmit slots must be minimized   TimeundershootovershootripplerippledropVoltage3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 5: Description of the VCC voltage profile versus time during a GSM call   Any degradation in power supply performance (due to losses, noise or transients) will directly affect the RF  performance  of  the  module  since  the  single  external  DC  power  source  indirectly  supplies  all  the digital and analog interfaces, and also directly supplies the RF power amplifier (PA).   The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms. This VCC slope allows a proper switch on of the module, that is switched on when the voltage rises to the VCC operating range starting from a voltage value lower than 2.25 V.  1.5.2.1 VCC application circuits LISA-U1/LISA-H1 series modules must be supplied through the VCC pins by one (and only one) proper DC power supply that must be one of the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Li-Ion battery  Primary (disposable) battery
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 19 of 116 Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage >5 V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 6: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the LISA-U1/LISA-H1 series modules operating supply voltage. The  use  of  switching  step-down  provides  the  best  power  efficiency  for  the  overall  application  and  minimizes current drawn from the main supply source. The use of an LDO linear regulator becomes convenient for a primary supply with a relatively low voltage (e.g. less  than  5  V).  In  this  case  the  typical  90%  efficiency  of  the  switching  regulator  will  diminish  the  benefit  of voltage step-down and no true advantage will be gained  in input current savings. On the opposite side, linear regulators  are  not  recommended  for  high  voltage  step-down  as  they  will  dissipate  a  considerable  amount  of energy in thermal power. If LISA-U1/LISA-H1 series modules are deployed in a mobile unit where no permanent primary supply source is available,  then  a  battery  will  be  required  to  provide  VCC.  A  standard  3-cell  Lithium-Ion  battery  pack  directly connected  to  VCC  is  the  usual  choice  for  battery-powered  devices.  During  charging,  batteries  with  Ni-MH chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. The use of primary (not rechargeable) battery is uncommon, since the most cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance. Keep in mind that the use of batteries requires the implementation of a suitable charger circuit (not included in LISA-U1/LISA-H1  series  modules).  The  charger  circuit  should  be  designed  in  order  to  prevent  over-voltage  on VCC beyond the upper limit of the absolute maximum rating. The following sections highlight some design aspects for each of the supplies listed above.  Switching regulator The characteristics of the switching regulator connected to VCC pins should meet the following requirements:  Power capability: the  switching  regulator with  its  output  circuit  must  be capable of  providing  a  voltage value to the VCC pins within the specified operating range and must be capable of delivering 2.5 A current pulses with 1/8 duty cycle to the VCC pins  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC voltage profile  High switching frequency: for best performance and for smaller applications select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency or with  a switching  frequency lower  than  600  kHz must be carefully evaluated since this can produce noise in the VCC voltage profile and therefore negatively impact GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 20 of 116 output  to  VCC  supply  pins  can  mitigate  the  ripple  on  VCC,  but  adds  extra  voltage  drop  due  to  resistive losses on series inductors  PWM mode operation: select preferably regulators with Pulse Width Modulation (PWM) mode.  While in active mode Pulse Frequency Modulation (PFM) mode and PFM/PWM mode transitions must be avoided to reduce the noise on the VCC voltage profile. Switching regulators able to switch between low ripple PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs when the GSM  module  changes  status  from  idle  mode  (current  consumption  approximately  1  mA)  to  active  mode (current  consumption  approximately  100  mA):  it  is  permissible  to  use  a  regulator  that  switches  from  the PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulator  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module  Figure 7 and the components listed in Table 4 show an example of a high reliability power supply circuit, where the module VCC is supplied by a step-down switching regulator capable of delivering 2.5 A current pulses with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz. The use of a switching  regulator  is  suggested  when  the  difference  from  the  available  supply  rail  to  the  VCC  value is high: switching regulators provide good efficiency transforming a 12 V supply to the  typical 3.8 V value of the  VCC supply.  LISA-U1/LISA-H1 series12VC6R3C5R2C3C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C71238114C8 C9L2D1 R4R5L1C4U162 VCC63 VCC61 VCCGND Figure 7: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 21 of 116 Reference Description Part Number - Manufacturer C1 47 µF Capacitor Aluminum 0810 50 V MAL215371479E3 - Vishay C2 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C5 22 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H220JZ01 - Murata C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C7 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C8 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C37 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics L2 1 µH Inductor 7445601 20% 8.6 A 7445601 - Wurth Electronics R1 470 kΩ Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 kΩ Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 kΩ Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 kΩ Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 kΩ Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo U1 Step Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 4: Suggested components for the VCC voltage supply application circuit using a step-down regulator  Low Drop-Out (LDO) linear regulator The  characteristics  of  the  LDO  linear  regulator  connected  to  the  VCC  pins  should  meet  the  following requirements:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a proper voltage value to the VCC pins and of delivering 2.5 A current pulses with 1/8 duty cycle  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the min output voltage to evaluate the power dissipation of the regulator)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulators  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module  Figure  8  and  the  components  listed  in  Table  5  show  an  example  of  a  power  supply  circuit,  where  the  VCC module  supply  is  provided  by  an LDO linear  regulator  capable  of delivering  2.5  A current  pulses, with  proper power  handling  capability.  The  use  of  a  linear  regulator  is  suggested  when  the  difference  from  the  available supply rail and the VCC value is low: linear regulators provide high efficiency when transforming a 5 V supply to the 3.8 V typical value of the VCC supply.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 22 of 116 5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNLISA-U1/LISA-H1 series62 VCC63 VCC61 VCCGND Figure 8: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 4.7 kΩ Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp R3 2.2 kΩ Resistor 0402 5% 0.1 W RC0402JR-072K2L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 5: Suggested components for VCC voltage supply application circuit using an LDO linear regulator  Rechargeable Li-Ion battery Rechargeable Li-Ion batteries connected to the VCC pins should meet the following requirements:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption to  VCC pins. The maximum  pulse  discharge  current  and  the  maximum  DC  discharge  current  are  not  always  reported  in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour  DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts   Primary (disposable) battery The  characteristics  of  a  primary  (non-rechargeable)  battery  connected  to  VCC  pins  should  meet  the  following requirements:  Maximum pulse and DC discharge current: the non-rechargeable battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption at the VCC pins. The maximum pulse and the maximum DC discharge current is not always reported in battery data sheets, but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour  DC series  resistance: the  non-rechargeable battery with its  output circuit  must be  capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 23 of 116 Additional hints for the VCC supply application circuits To  reduce  voltage  drops,  use  a  low  impedance  power  source.  The  resistance  of  the  power  supply  lines (connected to the VCC and GND pins of the module) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible in order to minimize power losses. Three pins are allocated for VCC supply. Another twenty pins are designated for GND connection. Even if all the VCC  pins  and  all  the  GND  pins  are  internally  connected  within  the  module,  it  is  recommended  to  properly connect all of them to supply the module in order to minimize series resistance losses. To avoid undershoot and overshoot on voltage drops at the start and end of a transmit burst during a GSM call (when current consumption on the VCC supply can rise up to 2.5 A in the worst case), place a 330 µF low ESR capacitor (e.g. KEMET T520D337M006ATE045) near the VCC pins. The use of very large capacitors (i.e. greater then 1000 µF) on the VCC line and the use of the soft start function provided by some voltage regulators must be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch on of the module.To reduce voltage ripple and noise, place the following near the VCC pins:  100 nF capacitor (e.g Murata GRM155R61A104K) to filter digital logic noise from clocks and data sources  10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  10 pF capacitor (e.g. Murata GRM1555C1E100J) to filter EMI in the 1800 / 1900 / 2100 MHz bands  39 pF capacitor (e.g. Murata GRM1555C1E390J) to filter EMI in the 850 / 900 MHz bands   Figure 9 shows the complete configuration but the mounting of each single component depends on the application design.  3V8C1 C4GNDC3C2 C5LISA-U1/LISA-H1series62 VCC63 VCC61 VCC+ Figure 9: Suggested schematic design to reduce voltage ripple and noise and to avoid undershoot/ overshoot on voltage drops Reference Description Part Number - Manufacturer C1 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 39 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E390JA01 - Murata C5 10 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E100JA01 - Murata Table 6: Suggested components to reduce voltage ripple and noise and to avoid undershoot/ overshoot on voltage drops
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 24 of 116 1.5.3 Current consumption profiles During operation, the current drawn by the LISA-U1/LISA-H1 series modules through the VCC pins can vary by several orders of magnitude. This ranges from the high peak of current consumption during GSM transmitting bursts at maximum power level in 2G connected mode, to continuous high current drawn in UMTS connected mode, to the low current consumption during power saving in idle mode. 1.5.3.1 2G connected mode When a GSM call is established, the VCC consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which is regulated by the network. If the module is transmitting in GSM talk mode in the GSM 850 or in the E-GSM 900 band and at the maximum RF power control level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach up to 2500 mA (with a highly unmatched antenna) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). During a GSM call, current consumption is in the order of 100-200 mA in receiving or in monitor bursts and is about 30-50 mA in the inactive unused bursts (low current period). The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot. An example of current consumption profile of the data module in GSM talk mode is shown in Figure 10. Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200 mA ~170 mA2500 mAPeak current depends on TX powerGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.0~170 mA ~40 mA Figure 10: VCC current consumption profile versus time during a GSM call (1 TX slot, 1 RX slot), with VCC=3.8 V When a GPRS connection is established there is a different VCC current consumption profile also determined by the transmitting and receiving bursts. In contrast to a  GSM call, during a GPRS connection more than one slot can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on network  conditions,  which  set  the  peak  current  consumption,  but  following  the  GPRS  specifications  the maximum transmitted RF power is reduced if more than one slot is used to transmit, so the maximum peak of current consumption is not as high as can be in case of a GSM call. If the module transmits in GPRS  class 12 connected  mode in the  GSM 850 or in the  E-GSM 900  band at the maximum  power  control  level  (27  dBm  typical  transmitted  power  in  the  transmit  slot/burst),  the  current consumption can reach up to 1400 mA (with unmatched antenna). This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/2 duty cycle, according to GSM TDMA.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 25 of 116 Figure 11 reports the current consumption profiles in GPRS mode with 4 slots used to transmit. Time [ms]RX   slotunused slotTX              slotTX   slotTX           slotTX                        slotMON       slotunused slotRX  slotunused slotTX                              slotTX   slotTX             slotTX                                slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200mA ~170mAPeak current depends on TX power~170mAGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.0~40mA1400 mA Figure 11: VCC current consumption profile versus time during a GPRS/EDGE connection (4TX slots, 1 RX slot), with VCC=3.8 V In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 11 is valid for EDGE as well. 1.5.3.2 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends  again  on  output  RF  power,  which  is  always  regulated  by  network  commands.  These  power  control commands are logically divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of  1.5  kHz.  There  are  no  high  current  peaks  as  in  the  2G  connection,  since  transmission  and  reception  are continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the  2G  case.  In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum output power (approximately 250 mW or 24 dBm), the current drawn by the module at the VCC pins is in the order  of  continuous  600-700  mA. Even  at lowest output  RF power  (approximately 0.01  µW or  -50  dBm), the current still remains in the order of 200 mA due to module baseband processing and transceiver activity. An example of current consumption profile of the data module in UMTS continuous transmission mode is shown in Figure 12.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 26 of 116 Time [ms]3G frame  10 ms                                       (1 frame = 15 slots)Current [mA]170 mADepends on TX power1 slot  666 µs670 mA3002001000500400600700 Figure 12: VCC current consumption profile versus time during a UMTS connection, with VCC=3.8 V When a packet data connection is established, the actual current profile depends on the amount of transmitted packets;  there  might  be  some  periods  of  inactivity  between  allocated  slots  where  current  consumption  drops about 100 mA. Alternatively, at higher data rates the transmitted power is likely to increase due to the higher quality signal required by the network to cope with enhanced data speed. 1.5.3.3 2G and 3G cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command (refer to u-blox AT Commands Manual [2], AT+UPSV command). When the power saving is enabled, the module automatically enters idle-mode whenever possible. When power saving is enabled, the module is registered or attached to a network and a voice or data call is not enabled,  the  module  automatically  enters  idle-mode  whenever  possible,  but  it  must  periodically  monitor  the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. When the module monitors the paging channel, it wakes up to active mode, to enable the reception of paging block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The time period between two paging block receptions is defined by the network (2G or 3G). This is the paging period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. In case of 2G network, the time interval between two paging block receptions can be from 470.76 ms (width of 2 GSM multiframes = 2 x 51 GSM frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (width of 9 GSM multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms).  In case of 3G network, the principle is similar but time interval changes from 640 ms (width of 26 x 3G frames = 64 x 10 ms = 640 ms) up to 5120 ms (width of 29 x 3G frames = 512 x 10 ms = 5120 ms). An example of a module current consumption profile is shown in Figure 13: the module is registered with the network  (2G or 3G), automatically  enters idle mode and  periodically wakes up to active mode to monitor the paging channel for paging block reception.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 27 of 116 ~30 msIDLE MODE ACTIVE MODE IDLE MODE500-700  µA 8-10 mA 20-22 mA~150 mAActive Mode EnabledIdle Mode EnabledPLL EnabledRX+DSP Enabled500-700  µA~150 mA2G case: 0.44-2.09  s    3G case: 0.61-5.09  sIDLE MODE2G or 3G case: ~30 msACTIVE MODETime [s]Current [mA]150100500Time [ms]Current [mA]150100500 Figure 13: Description of VCC current consumption profile versus time when the module is registered with 2G or 3G networks: the module is in idle mode and periodically wakes up to active mode to monitor the paging channel for paging block reception  1.5.3.4 2G and 3G fixed active mode (power saving disabled) Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (refer to u-blox AT Commands Manual [2], AT+UPSV command). When power saving is disabled, the module doesn’t automatically enter idle-mode whenever possible: the module remains in active mode. The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used. An example of the current consumption profile of the data module when power saving is disabled is shown in Figure 14: the module is registered with the network, active-mode is maintained, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 28 of 116 ACTIVE MODE20-22 mA 20-22 mA~150 mARX+DSP Enabled20-22 mA~150 mA2G case: 0.47-2.12 s  3G case: 0.64-5.12 sPaging periodTime [s]Current [mA]150100500Time [ms]Current [mA]150100500 Figure 14: Description of the VCC current consumption profile versus time when power saving is disabled: active-mode is always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception  1.5.4 RTC Supply (V_BCKP) The  V_BCKP pin connects  the  supply for  the  Real Time  Clock  (RTC)  and Power  On /  Reset internal  logic. This supply  domain  is  internally  generated  by  a  linear  regulator  integrated  in  the  Power  Management  Unit.  The output of this linear regulator is always enabled when the main voltage supply provided to the module through VCC is within the valid operating range, with the module switched-off or powered-on.  Name Description Remarks V_BCKP Real Time Clock supply V_BCKP = 2.3 V (typical) generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range. Table 7: Real Time Clock supply pin  The V_BCKP pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line  is  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin.  The RTC provides the time reference (date and time) of the module, also in power off mode, when the V_BCKP voltage  is  within  its  valid  range  (specified  in  u-blox  LISA-U1/LISA-H1  series Data  Sheet [1]).  The  RTC  timing  is
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 29 of 116 normally  used  to  set  the  wake-up  interval  during  idle-mode  periods  between  network  paging,  but  is  able  to provide programmable alarm functions by means of the internal 32.768 kHz clock. The RTC can be supplied from an external back-up battery through the V_BCKP, when the main voltage supply is not provided to the module through VCC. This lets the time reference (date and time) run even when the main supply is not provided to the module. Consider that the module cannot switch on if a valid voltage is not present on  VCC  even  when  the  RTC  is  supplied  through  V_BCKP  (meaning  that  VCC  is  mandatory  to  switch-on  the module). The  RTC  has  very low  power  consumption,  but  is  highly  temperature  dependent.  For  example  at  25°C and  a V_BCKP voltage of 2.3 V the power consumption is approximately 2 µA, whereas at 70°C and an equal voltage the power consumption increases to 5-10 µA.  The  internal  regulator  for  V_BCKP  is  optimized for  low  leakage  current  and  very  light  loads.  It  is  not recommended to use V_BCKP to supply external loads.  If V_BCKP is left unconnected and the module main voltage supply is removed from VCC, the RTC is supplied from  the  100  nF  capacitor mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1 V min). At this time  the  internal  RTC  will  stop  counting  and  the  date  and  time  setting  will  be  lost.  This  has  no  impact  on wireless connectivity, as all the functionalities of the module do not rely on the date and time setting.   Leave V_BCKP unconnected if the RTC is not required when the VCC supply is removed. The date and time  will  not  be  updated  when  VCC  is  disconnected.  If  VCC  is  always  supplied,  then  the  internal regulator is supplied from the main supply and there is no need for an external component on V_BCKP.  If RTC is required to run for a time interval of T [s] at 25°C when VCC supply is removed, place a capacitor with a nominal capacitance of C [µF] at the V_BCKP pin. Choose the capacitor using the following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 1.538 x T [s] The RTC current consumption is approximately 2 µA at 25°C, and the voltage drop is equal to 1.3 V (from the V_BCKP typical value of 2.3 V to the valid range minimum limit of 1.0 V). For example, a 100 µF capacitor (such as the Murata GRM43SR60J107M) can be placed at V_BCKP to provide a long buffering time. This capacitor will hold V_BCKP voltage within its valid range for around 50 s at 25°C, after the  VCC  supply  is  removed.  If  a  very  long  buffering  time  is  required,  a  70  mF  super-capacitor  (e.g.  Seiko Instruments XH414H-IV01E) can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 10 hours at 25°C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors will allow the time reference to run during battery disconnection.  LISA-U1/LISA-H1 seriesC1(a)2V_BCKPR2LISA-U1/LISA-H1 seriesC2(superCap)(b)2V_BCKPD3LISA-U1/LISA-H1 series2.3 V(c)2V_BCKP Figure 15: Real time clock supply (V_BCKP) application circuits : (a) using a 100 µF capacitor to let the RTC run for ~50 s at 25°C; (b) using a 70 mF capacitor to let the RTC run for ~10 hours at 25°C when the VCC supply is removed; (c) using non-rechargeable battery
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 30 of 116 Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 8: Example of components for V_BCKP buffering  If longer buffering time is required to allow the time reference to run during a disconnection of the  VCC supply, then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a  2.3  V nominal  voltage  and  must  never  exceed  the  maximum  operating  voltage  for  V_BCKP.  The  connection  of  the battery  to  V_BCKP  should  be  done  with  a  suitable  series  resistor  for  a  rechargeable  battery,  or  with  an appropriate series diode for a non-rechargeable battery. The purpose of the series resistor is to limit the battery charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery.  1.5.5 Interface supply (V_INT) The same voltage domain used internally to supply the digital interfaces is also available  on the V_INT pin. The internal regulator that generates the V_INT supply is a switching step down converter that is directly supplied from VCC. The voltage regulator output is set to 1.8 V (typical) when the module is switched on and is disabled when  the  module  is  switched  off or  when  the  RESET_N  pin  is  forced  the  low  level.  The  switching  regulator operates  in Pulse  Width Modulation  (PWM)  for  high  output current  mode  but automatically  switches to  Pulse Frequency Modulation (PFM) at low output loads for greater efficiency, e.g. when the module is in idle mode between paging periods.  Name Description Remarks V_INT Digital Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. V_INT is the internal supply for digital interfaces. The user may draw limited current from this supply rail. Table 9: Interface supply pin  The V_INT pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the line  is  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin.  Since it supplies internal digital circuits (see Figure 4), V_INT is not suited to directly supply any sensitive analog circuit: the voltage ripple can range from 15 mVpp during active mode (PWM), to 70 mVpp in idle mode (PFM).   V_INT can be used to supply external digital circuits operating at  the same voltage level as the digital interface  pins,  i.e.  1.8  V  (typical).  It  is  not  recommended  to  supply  analog  circuitry  without  adequate filtering for digital noise.   Don’t apply loads which  might exceed  the limit for maximum available current from  V_INT supply, as this  can  cause  malfunctions  in  internal  circuitry  supplies  to  the  same  domain.  The  detailed  electrical characteristics are described in the LISA-U1/LISA-H1 series Data Sheet [1].
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 31 of 116  V_INT can only be used as an output; don’t connect any external regulator on V_INT. If not used, this pin should be left unconnected.  The V_INT digital interfaces supply output is mainly used to:  Pull-up DDC (I2C) interface signals (see section 1.10 for more details)  Pull-up SIM detection signal (see section 1.8 for more details)  Indicate when the module is switched on and the RESET_N (external reset input pin) is not forced to the low level  1.6 System functions 1.6.1 Module power on The module power on sequence is initiated in one of 3 ways:  Rising edge on the VCC pin to a valid voltage for module supply  Falling edge on the PWR_ON pin  Rising edge on the RESET_N pin  RTC alarm  Name Description Remarks  PWR_ON Power on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required. Table 10: Power on pin  The PWR_ON pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the  line  is  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin.  1.6.1.1 Rising edge on VCC When  a  supply  is  connected  to  VCC  pins,  the  module  supply  supervision  circuit  controls  the  subsequent activation of  the  power up  state  machines: the  module  is  switched  on when the  voltage rises  up  to the  VCC operating  range minimum limit  (3.4 V)  starting  from a  voltage  value lower than  2.25 V  (See  LISA-U1/LISA-H1 series Data Sheet [1]).   The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to switch on the module.  1.6.1.2 Falling edge on PWR_ON The module power on sequence starts when a falling edge is forced on the PWR_ON input pin. After applying a falling edge, it is suggested to hold a low level on the PWR_ON signal for at least 5 ms to properly switch on the module. The electrical characteristics of the PWR_ON input pin are different from the other digital I/O interfaces: the high and  the  low  logic  levels  have  different  operating ranges  and  the  pin  is tolerant  to  voltages  up to  the  battery voltage. The detailed electrical characteristics are described in the LISA-U1/LISA-H1 series Data Sheet [1].
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 32 of 116  The PWR_ON pin has high input impedance and is weakly pulled to the high level on the module. Avoid keeping it floating in a noisy environment. To hold the high logic level stable, the PWR_ON pin must be connected to a pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module.  Once the module has turned on, moving the PWR_ON pin has no effect. On the other hand it makes no sense to keep this pin low once the module has been turned on: if the pin is kept low it will draw unnecessary current. Following are some typical examples of application circuits to turn the module on using the PWR_ON input pin. The simplest way to turn on the module is to use a push button that shorts the PWR_ON pin to ground: in this case the V_BCKP supply pin or the VCC supply of the module can be used to bias the pull-up resistor. If the PWR_ON input is connected to an external device (e.g. application processor), it is suggested to use an open drain output on the external device with an external pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module. A push-pull output of an application processor can also be used: in this case the pull-up can be used to pull the PWR_ON  level  high  when  the  application  processor  is  switched  off.  If  the  high-level  voltage  of  the  push-pull output pin of the application processor is greater than the maximum voltage value as V_BCKP operating range, the V_BCKP supply cannot be used to bias the pull-up resistor: the supply rail of the application processor or the VCC  supply  could  be  used,  but  this  will  increase  the  V_BCKP  (RTC  supply)  current  consumption  when  the module is in not-powered mode (VCC supply not present). To avoid an unwanted switch on of the module be sure to fix the proper level on PWR_ON in all possible scenarios. LISA-U1/LISA-H1 seriesRext2V_BCKP19 PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorLISA-U1/LISA-H1 seriesRext2V_BCKP19 PWR_ON Figure 16: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks Rext 100 kΩ Resistor 0402 5% 0.1 W External pull-up resistor ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 11: Example of pull-up resistor and ESD protection for the PWR_ON application circuits 1.6.1.3 Rising edge on RESET_N The module can be switched on by means of the RESET_N input pin: the RESET_N signal must be forced to the low level for at least 50 ms and then released from the low level to generate a rising edge that starts the module power-on sequence.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 33 of 116 The  RESET_N  input  pin  can  also  be  used  to  perform  an  “external”  or  “hardware”  reset  of  the  module,  as described in the section 1.6.3. The electrical characteristics of RESET_N are different from the other digital I/O interfaces. The detailed electrical characteristics are described in the LISA-U1/LISA-H1 series Data Sheet [1]. RESET_N is pulled high to V_BCKP by an integrated pull-up resistor also when the module is in power off mode. Therefore an external pull-up should not be required on the application board. The  simplest  way  to  switch  on the  module  by  means  of the  RESET_N  input  pin  is to  use  a push  button  that shorts the RESET_N pin to ground: the module will be switched on at the release of the push button, since the RESET_N will be forced to the high level by the integrated pull-up resistor, generating a rising edge. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case make sure that the high level voltage of the push-pull circuit is below the maximum voltage value of the V_BCKP  operating  range.  Make  sure  to  fix  the  proper  level  on  RESET_N  in  all  possible  scenarios,  to  avoid unwanted switch-on or reset of the module.  Some typical examples of application circuits using the RESET_N input pin are described in the section 1.6.3. 1.6.1.4 Real Time Clock (RTC) alarm If a voltage within the operating range is maintained at the VCC pin, the module can be switched on by the RTC alarm when  the RTC system reaches a pre-programmed scheduled time. The RTC system will then initiate the boot sequence by  instructing the Power Management Unit to turn on power. Also included in this setup is an interrupt signal from the RTC block to indicate to the baseband processor that an RTC event has occurred. 1.6.1.5 Additional considerations The module is switched on when the voltage rises up to the VCC operating range: the first time that the module is  used,  it  is  switched  on  in  this  way.  Then,  the  proper  way  to  switch  off  the  module  is  by  means  of  the AT+CPWROFF  command.  When the  module  is  in power-off mode,  i.e.  the  AT+CPWROFF command has  been sent  and  a  voltage  value  within  the  operating  range  limits  is  still  provided  to  the  VCC  pin,  the  digital  input-output pads of the baseband chipset (i.e. all the digital pins of the module) are locked in tri-state (i.e. floating). The power down tri-state function isolates the module pins from its environment, when no proper operation of the outputs can be guaranteed. The module can be switched on from power-off mode by forcing a proper start-up event (i.e. a falling edge on the PWR_ON pin, or an RTC alarm). After the detection of a start-up event, all the digital pins of the module are held in tri-state until all the internal LDO voltage regulators are turned on in a defined power-on sequence. Then, as described in Figure 17, the baseband core is still held in reset state for a time interval: the internal reset signal (which is not available on a module pin) is still low and any signal from the module digital interfaces is held in reset state. The reset state of all the digital pins is reported in the pin description table of the LISA-U1/LISA-H1 series Data  Sheet  [1].  When  the  internal  signal  is  released,  the  configuration  of  the  module  interfaces  starts: during  this  phase  any  digital  pin  is  set  in  a  proper  sequence  from  the  reset  state  to  the  default  operational configuration. Finally, the module is fully ready to operate when all interfaces are configured.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 34 of 116 VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFON*Start-up event0 ms~5 ms~6 ms~35 ms~1000 msPWR_ON can be set highStart of interface configurationAll interfaces are configured Figure 17: LISA power on sequence description (* - the PWR_ON signal state is not relevant during this phase)   The Internal Reset signal is not available on a module pin.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 35 of 116 1.6.2 Module power off The correct way to switch off  LISA-U1/LISA-H1 series modules is by means of +CPWROFF AT command (more details in u-blox AT Commands Manual [2]): in this way the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed. An under-voltage shutdown will be done if the VCC supply is removed, but in this case the current parameter settings are not saved in the module’s non-volatile memory and a proper network detach cannot be performed. The power off sequence is described in Figure 18. When the +CPWROFF AT command is sent, the module starts the  switch-off  routine  replying  OK  on  the  AT  interface:  during this  phase,  the  current  parameter  settings  are saved  in  the  module’s  non-volatile  memory,  a  network  detach  is  performed  and  all  module  interfaces  are disabled (i.e. the digital pins are locked in tri-state by the module). Since the time to perform a network detach depends on  the network settings, the  duration  of  this  phase can  differ  from the  typical value reported in  the following figure. At the end of the switch-off routine, all the digital pins are locked in tri-state by the module and all the internal LDO voltage regulators except the RTC supply (V_BCKP) are turned off in a defined power off sequence. The module remains in power off mode as long as a switch on event doesn’t occur (i.e. a falling edge on the PWR_ON pin or an RTC alarm), and enters not-powered mode if the supply is removed from the VCC pin. VCCV_BCKPPWR_ON *V_INTInternal ResetSystem StateBB Pads State OperationalOFFTristate / Floating ONOperational → Tristate / FloatingAT+CPWROFFsent to the module0 ms~50 ms~400 msOKreplied by the module Figure 18: LISA Power off sequence description (* - the PWR_ON signal state is not relevant during this phase)   The Internal Reset signal is not available on a module pin.  Tristated pins are always subject to floating caused by noise: to prevent unwanted effects, fix them with proper pull-up or pull down resistors to stable voltage rails to fix their level when the module is in Power down state.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 36 of 116 1.6.3 Module reset The module reset can be performed in one of 2 ways:  Forcing a low level on the RESET_N pin, causing an “external” or “hardware” reset  Via AT command, causing an “internal” or “software” reset LISA-U1/LISA-H1 series modules can be reset using the RESET_N pin: when the RESET_N pin is forced low for at least 50 ms, an “external”  or  “hardware” reset is performed. This causes an asynchronous  reset of the entire module,  including  the  integrated  Power  Management  Unit,  except  for  the  RTC  internal  block:  the  V_INT interfaces supply is switched off and all the digital pins are tri-stated, but the V_BCKP supply and the RTC block are  enabled.  Forcing  an  “external”  or  “hardware”  reset,  the  current  parameter  settings  are  not  saved  in  the module’s non-volatile memory and a proper network detach is not performed. LISA-U1/LISA-H1 series modules can also be reset by means of the AT+CFUN command (more details in u-blox AT Commands Manual [2]): in this case an “internal” or “software” reset is performed, causing an asynchronous reset of the baseband processor, excluding the integrated Power Management Unit and the RTC internal block: the V_INT interfaces supply is enabled and each digital pin is set in its internal reset state (reported in the pin description  table  in  the  LISA-U1/LISA-H1  series Data  Sheet [1]),  the  V_BCKP  supply  and  the  RTC  block  are enabled.  Forcing  an  “internal”  or  “software”  reset,  the current  parameter  settings  are  saved  in  the  module’s non-volatile memory and a proper network detach is performed. When RESET_N is released from the low level, the module automatically starts its power on sequence from the reset state. The same procedure is followed for the module reset via AT command after having performed the network detach and the parameter saving in non-volatile memory.  The internal reset state of all digital pins is reported in the pin description table in LISA-U1/LISA-H1 series Data Sheet [1].  Name Description Remarks RESET_N External reset input Internal 10 k pull-up to V_BCKP Table 12: Reset pin  The RESET_N pin ESD rating is 1 kV (contact discharge). A higher protection level could be required if the  line  is  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin.  For  more  details  about the  general  precautions for  ESD  immunity  about  RESET_N  pin please  refer to chapter 2.5.1.  The electrical characteristics of RESET_N are different from the other digital I/O interfaces. The detailed electrical characteristics are described in the LISA-U1/LISA-H1 series Data Sheet [1]. RESET_N is pulled high by an integrated 10 k pull-up resistor to V_BCKP. Therefore an external pull-up is not required on the application board. Following are some typical examples of application circuits using the RESET_N input pin. The simplest way to reset the module is to use a push button that shorts the RESET_N pin to ground. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case make sure that the high level voltage of the push-pull circuit is below the maximum voltage value of the V_BCKP operating range. To avoid unwanted reset of the module make sure to fix the proper level on RESET_N in all possible scenarios. As ESD  immunity  test precaution, a  47  pF  bypass  capacitor  (e.g.  Murata  GRM1555C1H470JA01)  and a  series ferrite bead (e.g. Murata BLM15HD182SN1) must be added on the RESET_N line pin to avoid a module reset caused by an electrostatic discharge applied to the application board (for more details, refer to chapter 2.5.1).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 37 of 116  LISA-U1/LISA-H1 series2V_BCKP22 RESET_NReset     push buttonESDOpen Drain OutputApplication ProcessorLISA-U1/LISA-H1 series2V_BCKP22 RESET_NRintRintFB1C1FB2C2 Figure 19: RESET_N application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection. CT0402S14AHSG - EPCOS C1, C2 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata FB1, FB2 Chip Ferrite Bead for Noise/EMI Suppression BLM15HD182SN1 - Murata Rint 10 kΩ Resistor 0402 5% 0.1 W Internal pull-up resistor Table 13: Example of ESD protection components for the RESET_N application circuit  1.7 RF connection The ANT pin has 50  nominal characteristic impedance and must be connected to the antenna through a 50  transmission  line  to  allow  transmission  and  reception  of  radio  frequency  (RF)  signals  in  the  GSM  and  UMTS operating bands.  Name Description Remarks ANT RF antenna Zo = 50  nominal characteristic impedance. Table 14: Antenna pin   The ANT port ESD rating is 500 V (contact discharge). A higher protection level could be required if the line is externally accessible on the application board.  Choose an antenna with optimal radiating characteristics for the best electrical performance and overall module functionality. An internal antenna, integrated on the application board, or an external antenna, connected to the application board through a proper 50  connector, can be used. See section 2.4 and section 2.2.1.1 for further details regarding antenna guidelines.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 38 of 116  The recommendations  of the  antenna producer  for  correct  installation  and  deployment (PCB layout and matching circuitry) must be followed.  If an external antenna is used, the PCB-to-RF-cable transition must be implemented using either a suitable 50  connector, or an RF-signal solder pad (including GND) that is optimized for 50  characteristic impedance. If  antenna  supervisor  functionality  is  required,  the  antenna  should  have  a  built  in  DC  diagnostic  resistor  to ground to get proper antenna detection functionality (See section 2.4.3).  1.8 (U)SIM interface A  (U)SIM  card  interface  is  provided  on  the  SMT  pads  of  the  LISA-U1/LISA-H1  series  modules:  the  high-speed SIM/ME interface is implemented as well as automatic detection of the required SIM supporting voltage. Both 1.8  V  and  3  V SIM  types  are  supported:  activation  and deactivation with  automatic  voltage switch  from  1.8 V  to  3  V  is  implemented,  according  to  ISO-IEC  7816-3  specifications.  The  SIM  driver  supports  the  PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM Card.  Name Description Remarks VSIM SIM supply 1.80 V typical or 2.90 V typical  Automatically generated by the module SIM_CLK SIM clock 3.25 MHz clock frequency SIM_IO SIM data Open drain, internal 4.7 k pull-up resistor to VSIM SIM_RST SIM reset  Table 15: SIM Interface pins   A low capacitance ESD protection (e.g.  Infineon ESD8V0L2B-03L  or  AVX  USB0002RP)  must be  placed near the SIM card holder on each line (VSIM, SIM_IO, SIM_CLK, SIM_RST). The SIM interface pins ESD rating is 1 kV (contact discharge): higher protection level is required if the lines are connected to an SIM card holder/connector, since they are externally accessible on the application board.  For more details about the general precautions for ESD immunity about SIM interface pins please refer to chapter 2.5.1.  Figure 20 shows an application circuit connecting the LISA module and the SIM card placed in a SIM card holder, using the SIM detection function provided by GPIO5 pin. Note that, as defined by ETSI TS 102 221 or ISO/IEC 7816, SIM card contacts assignment is the following:  Contact C1 = VCC (Supply)  It must be connected to VSIM  Contact C2 = RST (Reset)  It must be connected to SIM_RST  Contact C3 = CLK (Clock)  It must be connected to SIM_CLK  Contact C4 = AUX1 (Auxiliary contact for USB interface and other uses)  It must be left not connected  Contact C5 = GND (Ground)  It must be connected to GND  Contact C6 = VPP (Programming supply)  It must be connected to VSIM  Contact C7 = I/O (Data input/output)  It must be connected to SIM_IO  Contact C8 = AUX2 (Auxiliary contact for USB interface and other uses)  It must be left not connected A SIM card can have 6 contacts (C1 = VCC, C2 = RST, C3 = CLK, C5 = GND, C6 = VPP, C7 = I/O) or 8 contacts (providing also the auxiliary contacts C4 = AUX1 and C8 = AUX2). The contacts number depends if additional
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 39 of 116 features,  that  are  not  supported  by  the  (U)SIM  card  interface  of  the  LISA-U1/LISA-H1  series  modules,  are provided by the SIM card (contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses). A SIM card  holder can have 6 or 8 positions  if a mechanical card presence  detector  is not provided,  or it can have 6+2 or 8+2 positions if two additional pins for the mechanical card presence detection are provided. Figure 20 shows an application circuit connecting a LISA-U1/LISA-H1 series module and a SIM card placed in a SIM card holder with 6+2 pins (as the CCM03-3013LFT R102 connector, produced by C&K Components, which provides 2 pins for the mechanical card presence detection), using the SIM detection function provided by the GPIO5 of LISA-U1/LISA-H1 series module. This configuration allows the module to detect if a SIM card is present in the connector. The SW1 and SW2 pins of the SIM card holder are connected to a normally-open mechanical switch integrated in the SIM connector. The following cases are available   SIM card not present: the GPIO5 signal is forced low by the pull-down resistor connected to ground (i.e. the switch integrated in the SIM connector is open)  SIM card present: the GPIO5 signal is forced high by the pull-up resistor connected to V_INT (i.e. the switch integrated in the SIM connector is closed)  LISA-U1/LISA-H1 seriesC1SIM CARD HOLDERCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)C2 C3 C5D2 D3C5C6C7C1C2C3SIM Card Bottom View (contacts side)J150VSIM48SIM_IO47SIM_CLK49SIM_RSTC4SW1SW24V_INT51GPIO5R2R1D1 Figure 20: SIM interface application circuit Reference Description Part Number - Manufacturer C1, C2, C3, C4 33 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3 ESD Transient Voltage Suppressor USB0002RP or USB0002DP - AVX R1 1 kΩ Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 kΩ Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder Various Manufacturers, CCM03-3013LFT R102 - C&K Components Table 16: Example of components for SIM card connection  When connecting the module to an SIM connector, perform the following steps on the application board:  Bypass digital noise via a 100 nF capacitor (e.g. Murata GRM155R71C104K) on the SIM supply (VSIM)  To prevent RF coupling in case the module RF antenna is placed closer than 10 - 30 cm from the SIM card holder, connect a bypass capacitor  of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) at each SIM signal (VSIM, SIM_CLK, SIM_IO, SIM_RST) to ground near the SIM connector  Mount very low capacitance ESD protection (e.g. Infineon ESD8V0L2B-03L or AVX USB0002) near the SIM card connector
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 40 of 116  Limit capacitance and series resistance on each SIM signal to match the requirements  for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines): always route the connections to keep them as short as possible  1.8.1 (U)SIM functionality The following SIM services are supported:  Abbreviated Dialing Numbers (ADN)  Fixed Dialing Numbers (FDN)  Last Dialed Numbers (LDN)  Service Dialing Numbers (SDN)  USIM Application Toolkit (USAT)  is supported.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 41 of 116 1.9 Serial communication LISA-U1/LISA-H1  series  modules  provide  AT  command  interface,  Packet-Switched  /  Circuit-Switched  Data communication on the following serial communication interfaces:  One  asynchronous  serial  interface  (UART)  that  provides  complete  RS-232  functionality  conforming  to ITU-T V.24  Recommendation [3],  with  limited  data  rate.  The  UART  interface  can  be  used  for  firmware upgrade  One  Inter  Processor  Communication  (IPC)  interface  that  includes  a  synchronous  SPI-compatible  interface, with maximum data rate of 20 Mb/s  One high-speed USB 2.0 compliant interface, with maximum data rate of 480 Mb/s. The single USB interface implements  6  logical  devices.  Each  device  is  a  USB  communications  device  class  (or  USB  CDC),  that  is  a composite Universal Serial Bus device class. The USB interface can be used for firmware upgrade  The LISA-U1/LISA-H1 series modules are designed to operate as an HSPA wireless modem, which represents the data  circuit-terminating  equipment  (DCE)  as  described  by  the  ITU-T  V.24  Recommendation  [3].  A  customer application  processor  connected  to  the  module  through  one  of  the  interfaces  represents  the  data  terminal equipment (DTE).  All the interfaces listed above are controlled and operated with:  AT commands according to 3GPP TS 27.007 [4]  AT commands according to 3GPP TS 27.005 [5]  AT commands according to 3GPP TS 27.010 [6]  u-blox AT commands   For  the  complete  list  of  supported  AT  commands and  their  syntax  refer  to  the  u-blox  AT  Commands Manual [2].  The following serial communication interfaces can be used for firmware upgrade:  The UART interface, using the RxD and TxD lines only  The USB interface, using all the lines provided (VUSB_DET, USB_D+ and USB_D-)   To directly enable PC (or similar) connection to the module for firmware upgrade, provide direct access on the application board to the VUSB_DET, USB_D+ and USB_D- lines of the module (or to the RxD and  TxD  lines).  Also  provide  access  to  the  PWR_ON  or  the  RESET_N  pins,  or  enable  the  DC  supply connected to the VCC pin to start the module firmware upgrade (see Firmware Update Application Note [14]).  The following sub-chapters describe the serial interfaces configuration and provide a detailed description of each interface for the application circuits.  1.9.1 Serial interfaces configuration UART, USB and SPI/IPC serial interfaces are available as AT command interface and for Packet-Switched / Circuit-Switched  Data  communication.  The  serial  interfaces  are  configured  as  described  in  Table  17  (for  information about further settings, please refer to the u-blox AT Commands Manual [2]).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 42 of 116 Interface AT Settings Comments UART interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling AT+IPR=115200 Baud rate: 115200 b/s AT+ICF=0,0 Frame format: 8 bits, no parity, 1 stop bit AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise USB interface Enabled 6 CDCs are available, configured as described in the following list:  USB1: AT commands / data connection  USB2: AT commands / data connection  USB3: AT commands / data connection  USB4: GPS tunneling dedicated port  USB5: 2G trace dedicated port  USB6: 3G trace dedicated port  AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise SPI interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise Table 17: Default serial interfaces configuration  1.9.2 Asynchronous serial interface (UART) The UART interface is a 9-wire unbalanced asynchronous serial interface that  provides AT commands interface, PSD and CSD data communication, firmware upgrade. UART  interface  provides  RS-232  functionality  conforming  to  the  ITU-T  V.24  Recommendation  (more  details available in ITU Recommendation [3]), with CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8  V  for  high  data  bit  or  OFF  state.  Two  different  external  voltage  translators  (Maxim  MAX3237E  and  On Semiconductor NLSX3018MUTAG) could be used to provide full RS-232 (9 lines) compatible signal levels. The On Semiconductor chip provides the translation from 1.8 V to 3.3 V, while the Maxim chip provides the necessary RS-232 compatible signal towards the external connector. If a  UART interface with only 5 lines is needed,  the Maxim 13234E voltage level translator can be used. This chip translates the voltage levels from 1.8 V (module side) to the RS-232 standard. For detailed electrical characteristics refer to the LISA-U1/LISA-H1 series Data Sheet [1]. The LISA-U1/LISA-H1 series modules are designed to operate as an HSPA wireless modem, which represents the data  circuit-terminating  equipment  (DCE)  as  described  by  the  ITU-T  V.24  Recommendation  [3].  A  customer application  processor  connected  to  the  module  through  the  UART  interface  represents  the  data  terminal equipment (DTE).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 43 of 116   The  signal  names  of  the  LISA-U1/LISA-H1  series  modules  UART  interface  conform  to  the  ITU-T  V.24 Recommendation [3].  UART interfaces include the following lines:  Name Description Remarks DSR Data set ready Module output Circuit 107 (Data set ready) in ITU-T V.24 RI Ring Indicator Module output Circuit 125 (Calling indicator) in ITU-T V.24 DCD Data carrier detect Module output Circuit 109 (Data channel received line signal detector) in ITU-T V.24 DTR Data terminal ready Module input Circuit 108/2 (Data terminal ready) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RTS Ready to send Module hardware flow control input Circuit 105 (Request to send) in ITU-T V.24  Internal active pull-up to V_INT (1.8 V) enabled. CTS Clear to send Module hardware flow control output  Circuit 106 (Ready for sending) in ITU-T V.24 TxD Transmitted data Module data input Circuit 103 (Transmitted data) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RxD Received data Module data output Circuit 104 (Received data) in ITU-T V.24 GND Ground  Table 18: UART interface signals   The  UART  interface  pins  ESD  rating  is  1  kV  (contact  discharge).  A  higher  protection  level  could  be required if the lines are externally accessible on the application board. A higher protection level can be achieved  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines connected to these pins.  1.9.2.1 UART features All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [2], &K, +IFC, \Q AT commands): hardware flow control (RTS/CTS), software flow control (XON/XOFF), or none flow control.   Hardware flow control is enabled by default.  The following baud rates can be configured using AT commands:  1200 b/s  2400 b/s  4800 b/s  9600 b/s  19200 b/s  38400 b/s
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 44 of 116  57600 b/s  115200 b/s  230400 b/s  460800 b/s The default baud rate is 115200 b/s. Autobauding is not supported.  The frame format can be:  8N1 (8 data bits, No parity, 1 stop bit)  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  8N2 (8 data bits, No parity, 2 stop bits)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit) The default frame configuration with fixed baud rate is 8N1, described in the Figure 21. D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 21: UART default frame format (8N1) description  1.9.2.2 UART signal behavior (AT commands interface case) See Table 2 for a description of operating modes and states referred to in this section. At the switch on  of  the module, before the  initialization of the UART interface, as described  in the  power on sequence reported in the Figure 17, each pin is first tri-stated and then is set to its relative internal reset state that  is  reported  in  the  pin  description  table  in  LISA-U1/LISA-H1  series Data  Sheet [1].  At  the  end  of  the  boot sequence, the UART interface is initialized, the module  is by  default in active mode and the UART interface is enabled. The configuration and the behavior of the UART signals after the boot sequence are described below.   For a complete description of data and command mode please refer to  u-blox AT Commands Manual [2].  RxD signal behavior The module data output line (RxD) is set by default to OFF state (high level) at UART initialization. The module holds RxD in OFF state until no data is transmitted by the module.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 45 of 116 TxD signal behavior The module data input line (TxD) is set by default to OFF state (high level) at UART initialization. The TxD line is then held  by the  module in  the  OFF  state  if the  line is  not activated by  the  DTE:  an  active  pull-up  is enabled inside the module on the TxD input.  CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the hardware flow control is enabled (for more details please refer to u-blox AT Commands Manual [2], AT&K, AT\Q, AT+IFC AT command) the CTS line indicates when the UART interface is enabled (data can be sent and received): the module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE (refer to chapter 1.9.2.3 for the complete description). If the hardware flow control is not enabled, the CTS line is always held in the ON state after UART initialization.  In case of hardware flow control enabled, when CTS line is ON the UART is enabled and the module is in active mode. Instead, CTS line to OFF doesn’t necessary mean that the module is in idle-mode, but only that the UART is not enabled (the module could be forced to stay in active-mode for instance by USB).  When the power saving configuration is enabled and the hardware flow-control is not implemented in the DTE/DCE connection, data sent by the DTE can be lost: the first character sent when the module is in idle-mode  won’t  be  a  valid  communication  character  (refer  to  chapter  1.9.2.3  for  the  complete description).  During the MUX mode, the CTS line state is mapped to FCon / FCoff MUX command for flow control issues outside the power saving configuration while the physical CTS line is still used as a power state indicator. For more details please refer to Mux Implementation Application Note [15].  RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The RTS line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If the HW flow control is enabled (for more details please refer to u-blox AT Commands Manual [2] AT&K, AT\Q, AT+IFC command description) the  RTS line is monitored by the  module  to detect permission from the DTE to send data to the DTE itself. If the RTS line is set to OFF state, any on-going data transmission from the module is immediately interrupted or any subsequent transmission forbidden until the RTS line changes to ON state.   The DTE must be able to still accept a certain number of characters after the  RTS line has been set to OFF  state:  the  module  guarantees  the  transmission  interruption  within  2  characters  from  RTS  state change.  If AT+UPSV=2 is set and HW flow control is disabled, the  RTS line is monitored by the module to manage the power saving configuration:  When an OFF-to-ON transition occurs on the RTS input line, the UART is enabled and the module is forced to active-mode; after 20 ms from the transition the switch is completed and data can be received without loss. The module can’t enter idle-mode and the UART is keep enabled as long as the RTS input line is held in the ON state  If RTS is set to OFF state by the DTE, the module automatically enters idle-mode whenever possible as in the AT+UPSV=1 configuration (cyclic idle/active mode), but UART is disabled (held in low power mode) For more details please refer to chapter 1.9.2.3 and u-blox AT Commands Manual [2], AT+UPSV command.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 46 of 116 DSR signal behavior If AT&S0 is set, the DSR module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&S1 is set, the DSR module output line is set by default to OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode and is set to the ON state when the module is in data mode.   The above behavior is valide for both Packet-Switched and Circuit-Switched Data transfer.  DTR signal behavior The DTR module input line is set by default to OFF state (high level) at UART initialization. The DTR line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module  on  the  DTR  input.  Module  behavior  according  to  DTR  status  depends  on  the  AT  command configuration (see u-blox AT Commands Manual [2], &D AT command).  DCD signal behavior If AT&C0 is set, the DCD module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&C1 is set, the DCD module output line is set by default to OFF state (high level) at UART initialization. The DCD line is then set by the module in accordance with the carrier detect status: ON if the carrier is detected, OFF otherwise. In case of voice call DCD is set to ON state when the call is established. For a data call there are the following scenarios:   GPRS  data  communication:  Before  activating  the  PPP  protocol  (data  mode)  a  dial-up  application  must provide the ATD*99***<context_number># to the module: with this command the module switches from command mode to data mode and can accept PPP packets. The module sets the DCD line to the ON state, then  answers  with  a  CONNECT  to  confirm  the  ATD*99  command.  Please  note  that  the  DCD  ON  is  not related to the context activation but with the data mode  CSD data call: To establish a data call the DTE can send the ATD<number> command to the module which sets  an  outgoing  data  call  to  a  remote  modem  (or  another  data  module).  Data  can  be  transparent  (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the data call, the module  DCD  line  is  set  to  ON  and  the  CONNECT  <communication  baudrate>  string  is  returned  by  the module. At this stage the DTE can send characters through the serial line to the data module which sends them through the network to the remote DCE attached to a remote DTE   In case of a voice call DCD is set to ON state on all the serial communication interfaces supporting the AT command interface. (including MUX cirtual channels, if active).  DCD  is  set  to  ON  during  the  execution  of  a  command  requiring  input  data  from  the  DTE  (all  the commands where a prompt is issued; see u-blox AT Commands Manual [2]). The DCD line is set to ON state as soon as the switch to binary/text input mode is completed and the prompt is issued; DCD line is set to OFF as soon as the input mode is interrupted or completed.  RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization. Then, during an incoming call, the RI line is switched from OFF state to ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s,  OFF  for  4  s,  see  Figure  22),  until  the  DTE  attached  to  the  module sends the  ATA  string  and the  module accepts  the  incoming data  call. The  RING  string  sent  by  the  module  (DCE)  to  the serial  port  at  constant  time intervals is not correlated with the switch of the RI line to the ON state.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 47 of 116   Figure 22: RI behavior during an incoming call The RI line can notify an SMS arrival. When the SMS arrives, the RI line switches from OFF to ON for 1 s (see Figure 23), if the feature is enabled by the proper AT command (please refer to  u-blox AT Commands Manual [2], AT+CNMI command).  Figure 23: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. In case of SMS arrival, if several events occur coincidently or in quick succession each event triggers the  RI line independently, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more than 1 second. If an incoming call is answered within less than 1 second (with ATA or if autoanswering is set to ATS0=1) than the RI line will be set to OFF earlier. As a result:  RI line monitoring can’t be used by the DTE to determine the number of received SMSes.  In case of multiple events (incoming call plus SMS received), the RI line can’t be used to discriminate the two events, but the  DTE must  rely on the subsequent  URCs and interrogate the DCE with the proper commands.  1.9.2.3 UART and power-saving The  power  saving  configuration  is controlled  by  the  AT+UPSV  command  (for  the  complete  description  please refer  to  u-blox  AT  Commands  Manual  [2],  AT+UPSV  command).  When  power  saving  is  enabled,  the  module automatically enters idle-mode whenever possible, otherwise the active-mode is maintained by the module. The AT+UPSV  command  sets  the  module  power  saving  configuration,  but  also  configures  the  UART  behavior  in relation to the power saving configuration. The conditions for the module entering idle-mode also depend on the UART power saving configuration. The  different  power  saving  configurations  that  can  be  set  by  the  AT+UPSV  command  are  described  in  the following  subchapters  and  are  summarized  in  Table  19.  For  more  details on  the  command  description  please refer to u-blox AT commands Manual [2]. SMS arrives time [s] 0 RI ON RI OFF 1s SMS  time [s] 0 RI ON RI OFF 1s 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 48 of 116  AT+UPSV HW flow control RTS line Communication during idle mode and wake up  0 Enabled (AT&K3) ON Data sent by the DTE will be correctly received by the module. 0 Enabled (AT&K3) OFF Data sent by the module will be buffered by the module and will be correctly received by the DTE when it will be ready to receive data (i.e. RTS line will be ON). 0 Disabled (AT&K0) ON Data sent by the DTE will be correctly received by the module. 0 Disabled (AT&K0) OFF Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. 1 Enabled (AT&K3) ON Data  sent  by  the  DTE  will  be  buffered  by  the  DTE  and  will  be  correctly  received  by  the module when active-mode is entered. 1 Enabled (AT&K3) OFF Data sent by the module will be buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON If the module is in idle-mode, when a low-to-high transition occurs on the TxD input line, the module switches from idle-mode to active-mode after 20 ms: this is the “wake up time” of the module. As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) won’t be a valid communication character because it can’t be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up (i.e. after 20 ms). 1 Disabled (AT&K0) OFF Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. 2 Enabled (AT&K3) ON Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Enabled (AT&K3) OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON The module is forced in active-mode and it can’t enter idle-mode until RTS line is set to OFF state. When a high-to-low (i.e. OFF-to-ON) transition occurs on the RTS input line, the module switches from idle-mode to active-mode after 20 ms: this is the “wake up time” of the module. 2 Disabled (AT&K0) OFF When a low-to-high transition occurs on the TxD input line, the UART is re-enabled and if the module was in idle-mode it switches from idle-mode to active-mode after 20 ms: this is the “wake  up time”  of the  module. As a  consequence, the first character  sent when  the module  is  in  idle-mode  (i.e.  the  wake  up  character)  won’t  be  a  valid  communication character because it can’t be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up (i.e. after 20 ms). Table 19: UART and power-saving summary  AT+UPSV=0: power saving disabled, fixed active-mode The module doesn’t enter idle-mode and the CTS line is always held in the ON state after UART initialization. The UART interface is enabled and data can be received. This is the default configuration.  AT+UPSV=1: power saving enabled, cyclic idle/active mode The  module  is  allowed  to  automatically  enters  idle-mode  whenever  possible,  and  periodically  wakes  up  from idle-mode to active-mode to monitor the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. Idle-mode time is fixed by  network parameters and can be up to ~2.1 s. When the module is in idle-mode, a data transmitted by the DTE will be lost if hardware flow control is disabled, otherwise if hardware flow control is enabled, data will be buffered by the DTE and will be correctly received by the module when active-mode is entered. When the module wakes up to active-mode, the UART interface is enabled and data can be received. When a character is received, it forces the module to stay in the active-mode for a longer time. The active-mode duration depends by:  Network parameters, related to the time interval for the paging block reception (minimum of ~11 ms)  Time period from the last data received at the serial port during the active-mode: the module doesn’t enter idle-mode until a timeout expires. This timeout is configurable by the +UPSV AT command,  from 40 GSM frames (~184 ms) up to 65000 GSM frames (300 s). Default value is 2000 GSM frames (~9.2 s)
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 49 of 116 Every subsequent character received during the active-mode, resets and restarts the timer; hence the active-mode duration can be extended indefinitely.  The behavior of hardware flow-control output (CTS line) during normal module operations with power-saving and HW flow control enabled (cyclic idle-mode and active-mode) is illustrated in Figure 24.  Figure 24: CTS behavior with power saving enabled: the CTS line indicates when the module is able (CTS = ON = low level) or not able (CTS = OFF = high level) to accept data from the DTE and communicate through the UART interface  AT+UPSV=2: power saving enabled and controlled by the RTS line If  the  RTS  line  is  set  to  OFF  by  the  DTE  the  module  is  allowed  to  enter  the  idle-mode  as  for  UPSV=1  case. Instead, the UART is disabled as long as RTS line is set to OFF. If the RTS line is set to ON by the DTE the module is not allowed to enter the idle-mode and the UART is kept enabled until the RTS line is set to OFF. When an OFF-to-ON transition occurs on the  RTS input line, the UART is re-enabled and the module switches from  idle-mode  to  active-mode  in  20  ms.  This  configuration  can  only  be  enabled  with  the  module  HW  flow control disabled.  Since HW flow control is disabled, the CTS line is always set to ON by the module.  When the RTS line is set to OFF by the DTE, the timeout to enter idle-mode from the last data received at the serial port during the active-mode is the one previously set with the AT+UPSV=1 configuration or it is the default value.  If the module has to transmit some data (e.g. URC), the UART is  temporary enabled even if the RTS line is  set  to  OFF;  UART  wake-up  in  case  of  RTS  line  set  to  OFF  is  also  possible  via  data  reception  (as described in the following).  If the USB is connected and active, the module is forced to stay in active-mode, therefore +UPSV=1 and +UPSV=2 modes are overruled, but in any case they have effect on the UART behavior (they configure UART power saving mode (when it is enabled/disabled)).  Wake up from idle-mode to active-mode via data reception If a  data  is  transmitted  by the DTE  during the  module  idle-mode, it  will be  lost  (not  correctly received by  the module) in the following cases:  +UPSV=1 with hardware flow control disabled  +UPSV=2 with hardware flow control disabled and RTS line set to OFF When the module is in idle-mode, the TxD input line of the module is always configured to wake up the module from idle-mode to active-mode via data reception: when a low-to-high transition occurs on the TxD input line, it causes the wake-up of the system. The module switches from idle-mode to active-mode in 20 ms from the first data reception: this is the “wake up time” of the module.  As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) won’t be a valid communication character because it can’t be time [s] CTS ON CTS OFF max ~2.1 s UART disabled min ~11 ms UART enabled ~9.2 s (default) UART enabled Data input time [s] CTS ON CTS OFF max ~2.1 s UART disabled min ~11 ms UART enabled ~9.2 s (default) UART enabled
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 50 of 116 recognized, and the  recognition  of  the  subsequent  characters is  guaranteed  only after the  complete wake-up (i.e. after 20 ms). Figure 25 and Figure 26 show an example of common scenarios and timing constraints:  HW  flow  control  set  in  the  DCE,  and  no  HW  flow  control  set  in  the  DTE,  needed  to  see  the  CTS  line changing on DCE  Power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000)  Figure 25 shows the case where DCE is in idle mode and a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE will return to idle-mode when the timeout from last data received expires. (2000 frames without data reception). CTS OFFCTS ONActive mode is held for 2000 GSM frames (~9.2 s)time Wake up time: up to 15.6 mstime TxD module inputWake up character        Not recognized by DCE Figure 25: Wake-up via data reception without further communication Figure  26  shows  the  case  where  in addition to  the  wake-up  character  further  (valid) characters  are  sent.  The wake up character wakes-up the DCE. The other characters must be sent after the “wake up time” of 20 ms. If this condition is satisfied, the characters are recognized by the DCE. The DCE is allowed to re-enter idle-mode after 2000 GSM frames from the latest data reception. CTS OFFCTS ONActive mode is held for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: up to 15.6 mstime TxD module inputWake up character        Not recognized by DCEValid characters          Recognized by DCE Figure 26: Wake-up via data reception with further communication
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 51 of 116  The “wake-up via data reception” feature can’t be disabled.  The “wake-up via data reception” feature can be used in both +UPSV=1 and +UPSV=2 case (when RTS line is set to OFF).  In command  mode,  if  HW  flow  control  is  not  implemented  by  the  DTE, the  DTE  must  always  send  a dummy  “AT”  to the  module before  each command  line:  the first  character  will not  be  ignored  if the module is in active-mode (i.e. the module will reply “OK”), or it will represent the wake up character if the module is in idle-mode (i.e. the module won’t reply).  No dummy “AT” is required from the DTE during connected-mode since the module continues to be in active-mode and doesn’t need to be woken-up. Furthermore in data mode a dummy “AT” would affect the data communication.  1.9.2.4 UART application circuits Providing the full RS-232 functionality (using the complete V.24 link) For complete RS-232 functionality conforming to ITU Recommendation [3] in DTE/DCE serial communication, the complete UART interface of the module (DCE) must be connected to the DTE as described in Figure 27. LISA-U1/LISA-H1 series (DCE)TxDApplication Processor(DTE)RxDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND Figure 27: Interface application circuit with complete V.24 link in DTE/DCE serial communication
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 52 of 116 Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link) If the  functionality of  the  DSR, DCD,  RI and  DTR lines is not  required in the  application, or the  lines are  not available, the application circuit described in Figure 28 must be implemented:  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating LISA-U1/LISA-H1 series(DCE)TxDApplication Processor  (DTE)RxDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND Figure 28: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication If only TxD, RxD, RTS and CTS lines are provided as described in Figure 28 the procedure to enable the power saving depends on the HW flow-control status. If HW flow-control is enabled (AT&K3, that is the default setting) the power saving will be activated by AT+UPSV=1. Through this configuration, when the module is in idle-mode, a data transmitted by the DTE will be buffered by the DTE and will be correctly received by the module when active-mode is entered. If the HW flow-control is disabled (AT&K0), the power saving can be enabled by AT+UPSV=2. The module is in idle-mode  until  a  high-to-low  (i.e.  OFF-to-ON)  transition  on  the  RTS  input  line  will  switch  the  module  from idle-mode to active-mode in 20 ms. The module will be forced in active-mode if the RTS input line is held in the ON state.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 53 of 116 Providing the TxD and RxD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the application circuit described in Figure 29 must be implemented:  Connect the module  CTS output  line to the module  RTS  input line, since the  module requires  RTS active (low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), and CTS is active (low electrical level) when the module is in active mode, the UART interface is enabled and the HW flow-control is enabled  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating  LISA-U1/LISA-H1 series(DCE)TxDApplication Processor  (DTE)RxDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND Figure 29: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication If only TxD and RxD lines are provided as described in Figure 29 and HW flow-control is disabled (AT&K0), the power  saving  will  be  enabled  by  AT+UPSV=1.  The  module  enters  active-mode  20  ms  after  a  low-to-high transition on the TxD input line; the recognition of the subsequent characters is guaranteed until the module is in active-mode.  A data delivered by the DTE can be lost using this configuration and the following settings: o HW flow-control enabled in the module (AT&K3, that is the default setting) o Module power saving enabled by AT+UPSV=1 o HW flow-control disabled in the DTE In this case the first character sent when the module is in idle-mode will be a wake-up character and won’t be a valid communication character (refer to chapter 1.9.1.3 for the complete description).  If power saving is enabled the application circuit with the TxD and RxD lines only is not recommended. During  command  mode  the  DTE  must  send  to  the  module  a  wake-up  character  or  a  dummy  “AT” before each command line (refer to chapter 1.9.1.3 for the complete description), but during data mode the wake-up character or the dummy “AT” would affect the data communication.  Additional considerations  If the module USB interface of the is connected to the application processor, it is highly recommended to  provide  direct  access  to  RxD,  TxD,  CTS  and  RTS  lines  of  the  module  for  execution  of  firmware upgrade over UART and for debug purpose: testpoints can be added on the lines to accommodate the access and a 0 Ω series resistor must be mounted on each line to detach the module pin from any other connected  device.  Otherwise,  if  the  USB  interface  is  not  connected  to  the  application  processor,  it  is highly recommended  to  provide direct access  to  VUSB_DET,  USB_D+, USB_D-  lines for  execution  of
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 54 of 116 firmware upgrade over USB and for debug purpose. In both cases, provide as well access to RESET_N pin, or  to the PWR_ON pin, or  enable the  DC supply  connected  to the  VCC  pin to start  the  module firmware upgrade (see Firmware Update Application Note [14]).  If the UART interface is not used, all the UART interface pins can be left unconnected, but  it is highly recommended to provide direct access to the RxD, TxD, CTS and RTS lines for execution of firmware upgrade and for debug purpose. 1.9.3 USB interface LISA-U1/LISA-H1  series modules provide a  high-speed  USB interface  at 480 Mb/s  compliant with the Universal Serial Bus Revision 2.0 specification [7]. It acts as a USB device and can be connected to any USB host such as a PC or other Application Processor. The USB-device shall look for all upper-SW-layers like any other serial device. This means that LISA-U1/LISA-H1 series modules emulate all serial control logical lines.  If the logical DTR line isn't enabled by the USB host, the module doesn’t answer to AT commands by the USB interface.  Name Description Remarks VUSB_DET USB detect input Apply 5 V typical to enable USB USB_D+ USB Data Line D+ 90 Ω nominal differential impedance. Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [7] are part of the USB pad driver and need not be provided externally. USB_D- USB Data Line D- 90 Ω nominal differential impedance. Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [7] are part of the USB pad driver and need not be provided externally. Table 20: USB pins  The USB interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting  a  very  low capacitance  ESD  protection  (e.g.  Tyco  Electronics  PESD0402-140  ESD  protection device) on the lines connected to these pins.  1.9.3.1 USB features LISA-U1/LISA-H1 series modules simultaneously support 6 USB CDC (Communications Device Class) that assure multiple functionalities to  the USB  physical  interface. The 6  available  CDCs are configured as  described in  the following list:   USB1: AT commands / data connection  USB2: AT commands / data connection  USB3: AT commands / data connection  USB4: GPS tunneling dedicated port  USB5: 2G trace dedicated port  USB6: 3G trace dedicated port  LISA-U1/LISA-H1 series module identifies itself by its VID (Vendor ID) and PID (Product ID) combination, included in the USB device descriptor. VID and PID of LISA-U1/LISA-H1 series modules are the following:  VID = 0x1546  PID = 0x1101
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 55 of 116 If the USB interface of LISA-U1/LISA-H1 series modules is connected to the host before the module switch-on, or if the module is reset with the USB interface connected to the host, the VID and PID are automatically updated runtime, after the USB detection. First, VID and PID are the following:  VID = 0x058B  PID = 0x0041 Then, after a time period (~5 s), VID and PID are updated to the following:  VID = 0x1546  PID = 0x1101  If  power  saving is  enabled  by  AT  command  (AT+UPSV=1  or  AT+UPSV=2),  the  LISA-U1/LISA-H1  series  module automatically enters the USB suspended state when the device has observed no bus traffic for a specified period (refer  to the  Universal  Serial  Bus  Revision  2.0  specification  [7]).  In  suspended  state,  the  module maintains any internal  status  as  USB  device,  including  its  address  and  configuration.  In  addition,  the  module  enters  the suspended state when the hub port it is attached to is disabled: this is referred to as USB selective suspend. The module exits suspend mode when there is bus activity. LISA-U1/LISA-H1  series  module  is  capable  of  USB  remote  wake-up  signaling:  may  request  the  host  to  exit suspend  mode  or  selective  suspend  by  using  electrical  signaling  to  indicate  remote  wake-up.  This  notifies  the host that it should resume from its suspended mode, if necessary, and service the external event that triggered the  suspended  USB  device  to  signal  the  host.  Remote  wake-up  is  accomplished  using  electrical  signaling described in the Universal Serial Bus Revision 2.0 specification [7].  1.9.3.2 USB application circuit Since  the  module  acts  as  a  USB  device,  the  USB  supply  (5.0  V  typ.)  must  be  provided  to  VUSB_DET  by  the connected USB host. The USB interface is enabled only when a valid voltage as USB supply is detected by the VUSB_DET  input.  Neither  the  USB  interface,  nor  the  whole  module  is  supplied  by  the  VUSB_DET  input:  the VUSB_DET senses the USB supply voltage and absorbs few microamperes. The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake, as well as in differential mode for fast signaling and data transfer. USB pull-up or pull-down resistors on pins USB_D+ and USB_D- as required by the Universal Serial Bus Revision 2.0 specification [7] are part of the USB pad driver and do not need to be externally provided. External  series  resistors  on  pins  USB_D+  and  USB_D-  as  required  by  the  Universal  Serial  Bus  Revision  2.0 specification [7] are also integrated: characteristic impedance of USB_D+ and USB_D- lines is specified by the USB  standard.  The  most  important  parameter  is  the  differential  characteristic  impedance  applicable  for odd-mode electromagnetic field, which should be as close as possible to 90  differential: signal integrity may be degraded if the PCB layout is not optimal, especially when the USB signaling lines are very long. LISA-U1/LISA-H1 series VBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GNDC1USB DEVICE CONNECTORD1 D2 D3 Figure 30: USB Interface application circuit
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 56 of 116 Reference Description Part Number - Manufacturer D1, D2, D3 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata Table 21: Component for USB application circuit   If the USB interface is not connected to the application processor, it is highly recommended to provide direct  access  to  the  VUSB_DET,  USB_D+,  USB_D-  lines  for  execution of  firmware  upgrade  over  USB and for debug purpose: testpoints can be added on the lines to accommodate the access. Otherwise, if the USB interface is connected to the application processor, it is highly recommended to provide direct access to the RxD, TxD, CTS and RTS lines for execution of firmware upgrade over UART and for debug purpose. In both cases, provide as well access to RESET_N pin, or to the PWR_ON pin, or enable the DC  supply  connected  to  the  VCC  pin  to  start  the  module  firmware  upgrade  (see  Firmware  Update Application Note [14]).  If the USB interface  is not used, the  USB_D+,  USB_D-  and  VUSB_DET pins can be  left unconnected, but it is highly recommended to provide direct access to the lines for execution of firmware upgrade and for debug purpose.  1.9.4 SPI interface SPI is a master-slave protocol: the module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The SPI-compatible synchronous serial interface cannot be used for FW upgrade. The standard 3-wire SPI interface includes two signals to transmit and receive data (SPI_MOSI and SPI_MISO) and a clock signal (SPI_SCLK). LISA-U1/LISA-H1  series  modules  provide  two  handshake  signals  (SPI_MRDY  and  SPI_SRDY),  added  to  the standard 3-wire SPI interface, implementing the 5-wire Inter Processor Communication (IPC) interface. The  purpose  of  the  IPC  interface  is  to  achieve  high  speed  communication  (up  to  20  Mb/s)  between  two processors following the same IPC specifications: the module baseband processor and an external processor. The high speed communication is possible only if both sides follow the  same Inter Processor Communication  (IPC) specifications. This interface is designated for high speed HSPA communications and could be necessary to communicate with an Application Processor which is not equipped with a USB interface.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 57 of 116 Name Description Remarks SPI_MISO SPI Data Line. Master Input, Slave Output Module Output. Idle high. Shift data is on rising clock edge, latch on falling edge. MSB is shifted first. SPI_MOSI SPI Data Line. Master Output, Slave Input Module Input. Idle high. Shift data is on rising clock edge, latch on falling edge. MSB is shifted first. Internal active pull-up to V_INT (1.8 V) enabled. SPI_SCLK SPI Serial Clock. Master Output, Slave Input Module Input. Idle low. Up to 20 MHz supported. Internal active pull-down to GND enabled. SPI_MRDY SPI Master Ready to transfer data control line. Master Output, Slave Input Module Input. Idle low. Internal active pull-down to GND enabled. SPI_SRDY SPI Slave Ready to transfer data control line. Master Input, Slave Output Module Output. Idle low. Table 22: SPI interface signals   The SPI interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines  connected  to these pins.  1.9.4.1 IPC communication protocol overview The module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The  SPI-device  shall look  for  all upper-SW-layers  like  any  other  serial  device.  This  means  that  LISA-U1/LISA-H1 series modules emulate all  serial logical lines: the transmission and the reception of the  data  are  similar  to an asynchronous device. Two  additional  signals  (SPI_MRDY  and  SPI_SRDY)  are  added  to  the  SPI  lines  to  communicate  the  state  of readiness of the two processors: they are used as handshake signals to implement the data flow. The function of the SPI_MRDY and SPI_SRDY signals is twofold:  For transmitting data the signal indicates to the data receiver that data is available to be transmitted  For receiving data the signal indicates to the transmitter that the receiver is ready to receive data Due to this setup it is possible to use the control signals as interrupt lines waking  up  the receiving part when data  is  available  for  transfer.  When  the  handshaking  has  taken  place,  the  transfer  occurs  just  as  if  it  were  a standard SPI interface without chip select functionality (i.e. one master - one slave setup). SPI_MRDY is used by the application processor (i.e. the master) to indicate to the  module baseband processor (i.e.  the  slave)  that  it  is  ready  to  transmit  or  receive  (IPC  master  ready  signal),  and  can  also  be  used  by  the application processor to wake up the module baseband processor if it is in idle mode. SPI_SRDY line is used by the module baseband processor (i.e. the slave) to indicate to the application processor (i.e. the master) that it is ready to transmit or receive (IPC slave ready signal), and can also be used by the module baseband processor to wake up the application processor if it is in hibernation. If  power  saving is  enabled  by  AT  command  (AT+UPSV=1  or  AT+UPSV=2),  the  LISA-U1/LISA-H1  series  module automatically  enters  idle  mode  when  the  master  indicates  that  it  is  not  ready  to  transmit  or  receive  by  the SPI_MRDY signal, or when the LISA-U1/LISA-H1 series module itself doesn’t transfer data.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 58 of 116 SPI_MRDYSPI_SRDYDATA_EXCHANGESPI_MOSISPI_MISOHeader  DataSPI_SCLK Figure 31: IPC Data Flow: SPI_MRDY and SPI_SRDY line usage combined with the SPI protocol For  the  correct  implementation  of  the  SPI  protocol,  the  frame  size  is  known  by  both  sides  before  a  packet transfer of each packet. The frame is composed by a header with fixed size (always 4 bytes) and a payload with variable length (must be a multiple of 4 bytes). The  same  amount  of  data  is  exchanged  in  both  directions  simultaneously.  Both  sides  set  their  readiness  lines (SPI_MRDY / SPI_SRDY) independently when they are ready to transfer data. For the correct transmission of the data the other side must wait for the activating interrupt to allow the transfer of the other side. The  master  starts  the clock  shortly  after  SPI_MRDY and  SPI_SRDY are  set  to active.  The  amount of clocks  is exactly that one of the  frame-size to be transferred.  The SPI_SRDY line will be set down after the end of the clock. The SPI_MRDY line is also set inactive with the end of the clock, but in case of a big transfer containing multiple packets, the SPI_MRDY line stays active.  1.9.4.2 IPC communication examples In the following, three IPC communication scenarios are described:  Slave initiated data transfer, with a sleeping master  Master initiated data transfer, with a sleeping slave  Slave ended data transfer  Slave initiated transfer with a sleeping master  Figure 32: Data transfer initiated by LISA-U1/LISA-H1 series module (slave), with a sleeping application processor (master) When the master is sleeping (idle mode), the following actions happen: 1. The slave indicates the master that is ready to send data by activating SPI_SRDY 2. When the master becomes ready to send, it signalizes this by activating SPI_MRDY 3. The master activates the clock and the two processors exchange the communication header and data SPI_MRDY SPI_SRDY DATA EXCHG 2 4 5 Header Data Header 3 1
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 59 of 116 4. If the data have been exchanged, the slave deactivates SPI_SRDY to process the received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all the data are transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Master initiated transfer with a sleeping slave  Figure 33: Data transfer initiated by application processor (master) with a sleeping LISA-U1/LISA-H1 series module (slave) When the slave is sleeping (idle mode), the following actions happen: 1. The Master wakes the slave by setting the SPI_MRDY line active 2. As soon as the slave is awake, it signals it by activating SPI_SRDY 3. The master activates the clock and the two processors exchange the communication header and data 4. If the data have been exchanged, the slave deactivates SPI_SRDY to process the received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all data are transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Slave ended transfer  Figure 34: Data transfer terminated and then restarted by LISA-U1/LISA-H1 series module (slave) Starting from the state where data transfer is ongoing, the following actions will happen: 1. In case of the last transfer, the master will lower its SPI_MRDY line. After the data-transfer is finished the line must be low. If the slave has already set its SPI_SRDY line, the master must raise its line to initiate the next transfer (slave-waking-procedure) 2. If the data have been exchanged, the slave will deactivate  SPI_SRDY  to process the received information. This is the normal behavior 3. The slave will indicate the master that is ready to send data by activating SPI_SRDY SPI_MRDY SPI_SRDY DATA EXCHG 5 2 1 Header Data 3 4 SPI_MRDY SPI_SRDY DATA EXCHG 1 2 4 5 Header Data Header 3
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 60 of 116 4. When  the  master  is  ready  to  send,  it  will  signalize  this  by  activating  SPI_MRDY.  This  is  optional,  when SPI_MRDY is low before 5. The slave indicates immediately after a transfer termination that it wants to start transmission again. In this case the slave will raise SPI_SRDY again. The SPI_MRDY line can be either high or low: the master has only to ensure that the SPI_SRDY change will be detected correctly via interrupt  For more details regarding IPC communication protocol please refer to SPI Application Note [18].  1.9.4.3 IPC application circuit SPI_MOSI is the data line input for the module since it runs as SPI slave: it  must be connected to the data line output (MOSI) of the application processor that runs as an SPI master. SPI_MISO is the data line output for the module since it runs as SPI slave: it must be connected to the data line input (MISO) of the application processor that runs as an SPI master. SPI_SCLK  is  the  clock  input  for  the  module  since  it  runs  as  SPI  slave:  it  must  be  connected  to  the  clock  line output (SCLK) of the application processor that runs as an SPI master. SPI_MRDY  is an  input  for the  module able  to  detect  an  external  interrupt which  comes  from the  application processor. SPI_SRDY is  an  output  for  the  module,  and  the  application  processor  should  be  able  to  detect  an  external interrupt which comes from the module on its connected pin. Signal integrity of the high speed data lines may be degraded if the PCB layout is not optimal, especially when the SPI lines are very long: keep routing short and minimize parasitic capacitance to preserve signal integrity. LISA-U1/LISA-H1 series (SPI slave)MOSIApplication Processor(SPI master)MISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGND Figure 35: IPC Interface application circuit   If direct access to the USB or the UART interfaces of the module is not provided, it is recommended to provide  direct  access  to  the  SPI_MOSI,  SPI_MISO,  SPI_SCLK,  SPI_MRDY,  SPI_SRDY  lines  of  the module for debug purpose: testpoints can be added on the lines to accommodate the access and a 0 Ω series  resistor  must  be  mounted  on  each  line  to  detach  the  module  pin  from  any  other  connected device.  If the  SPI/IPC interface  is not used,  the  SPI_MOSI,  SPI_MISO,  SPI_SCLK,  SPI_MRDY, SPI_SRDY  pins can be left unconnected.  1.9.5 MUX Protocol (3GPP 27.010) The  LISA-U1/LISA-H1  series  module  has  a  software layer  with  MUX  functionality,  3GPP  TS  27.010 Multiplexer Protocol [6], available on the UART and on the SPI physical link. This  is  a  data  link  protocol  (layer  2  of  OSI  model)  which  uses  HDLC-like  framing  and  operates  between  the module (DCE) and the application processor (DTE) and allows a number of simultaneous sessions over the used
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 61 of 116 physical link (UART or SPI). Each session consists of a stream of bytes transferring various kinds of data such as SMS, CBS, GPRS, GPS, AT commands in general. This permits, for example, SMS to be transferred to the DTE when a data connection is in progress. The following virtual channels are defined:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling For more details please refer to GSM Mux implementation Application Note [15].  1.10 DDC (I2C) interface 1.10.1 Overview An I2C compatible Display Data Channel (DDC) interface for serial communication is implemented. This interface is dedicated exclusively to access u-blox GPS receivers.  Name Description Remarks SCL I2C bus clock line Open drain. External pull-up required. SDA I2C bus data line Open drain. External pull-up required. Table 23: DDC pins   The DDC (I2C) interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines connected to these pins.  To be compliant to the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors  must  be  used.  Since  the  pull-up  resistors  are  not  mounted  on  the  module,  they  must  be  mounted externally. Resistor values must conform to the I2C bus specifications [8]. If a LISA-U1/LISA-H1 series module is connected through the DDC bus to a single u-blox GPS receiver only (only one device is connected on the DDC bus), use a pull-up resistor of 4.7 k. Pull-ups must be connected to a supply voltage of 1.8 V (typical), since this is the voltage domain of the DDC pins. V_INT digital interfaces supply output can be used to provide 1.8 V for the pull-ups (for detailed electrical characteristics see the LISA-U1/LISA-H1 series Data Sheet [1]). DDC Slave-mode operation is not supported, the module can act as master only. Two lines, serial data (SDA) and serial clock (SCL), carry information on the bus. SCL is used to synchronize data transfers, and SDA is the data line. Since both lines are open drain outputs, the DDC devices can only drive them low or  leave them open.  The  pull-up resistor pulls  the line  up to  the supply  rail if  no DDC  device  is pulling  it down to GND. If the pull-ups are missing, SCL and SDA lines are undefined and the DDC bus will not work. The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase  the  capacitance.  If  the  bus  capacitance  is increased, use  pull-up  resistors with  nominal resistance value lower than 4.7 k, to match the I2C bus specifications [8].regarding rise and fall times of the signals.   Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible..  If the pins are not used as DDC bus interface, they can be left unconnected.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 62 of 116 1.10.2 DDC application circuit The SDA and SCL lines can be used only to connect the LISA module to a u-blox GPS module: LISA DDC (I2C) interface is enabled by the +UGPS AT command (for more details refer to u-blox AT Commands Manual [2]). GPIO2 is automatically driven as an output by the +UGPS AT command to switch-on or to switch-off the u-blox GPS module, connecting  GPIO2 to the active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS module on the application board.  GPIO3 is automatically driven as an input by the +UGPS AT command to sense when the u-blox GPS module is ready to send data. GPIO4  is  automatically  driven  as  an  output  by  the  +UGPS  AT  command  to  provide  a  synchronization  timing signal to the u-blox GPS module. The  application  circuit  for  the  connection  of  a  LISA-U1/LISA-H1  series  wireless  module  to a  u-blox  1.8  V  GPS receiver is illustrated in Figure 36. A pull-down resistor is mounted on the GPIO2 line to avoid a switch on of the GPS module when the LISA-U1/LISA-H1 series module is in the internal reset state. LISA-U1/LISA-H1 seriesR1INOUTGNDGPS LDORegulatorSHDNu-blox1.8 V GPS receiverSDA2SCL2R21V8 1V8VMAIN1V8U121 GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO446452324VCCR3 Figure 36: DDC Application circuit for u-blox 1.8 V GPS receiver Reference Description Part Number - Manufacturer R1, R2, R3 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp U1 Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual Table 24: Components for DDC application circuit for u-blox 1.8 V GPS receiver If  a  3  V  u-blox  GPS  receiver  is  used,  the  SDA,  SCL  pins  and  the  GPIO2,  GPIO3,  GPIO4  pins  of  the  LISA-U1/LISA-H1 series wireless module cannot be directly connected to the 3 V u-blox GPS receiver, since the pins of the LISA-U1/LISA-H1 series modules aren’t tolerant up to 3 V. An application circuit for the connection of a LISA-U1/LISA-H1 series wireless module to a u-blox 3.0 V GPS receiver is illustrated in Figure 37. A pull-down resistor is mounted on the GPIO2 line to avoid a switch on of the GPS module when the LISA-U1/LISA-H1 series module is in the internal reset state.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 63 of 116 LISA-U1/LISA-H1 seriesR1INOUTGNDGPS LDORegulatorSHDNu-blox3.0 V GPS receiverR2VMAIN3V0U121 GPIO246 SDA45 SCLR4 R51V8SDA1 SDA2GNDU2SCL1SCL2VREF1VREF2I2C-busBidirectional Voltage Translator21 V_INTC1C2 C3R323 GPIO324 GPIO41V8A1 B1GNDU3A2B2VCCAVCCBGenericBidirectional Voltage TranslatorC4 C53V0SDA2SCL2TxD1EXTINT0VCC Figure 37: DDC Application circuit for u-blox 3.0 V GPS receiver Reference Description Part Number - Manufacturer R1, R2, R3, R4, R5 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1 Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual U2 I2C-bus Bidirectional Voltage Translator PCA9306DCURG4 - Texas Instruments U3 Generic Bidirectional Voltage Translator TXB0104PWR - Texas Instruments Table 25: Components for DDC application circuit for u-blox 3.0 V GPS receiver  1.11 Audio Interface (LISA-U120 and LISA-U130 only) LISA-U120 and LISA-U130 modules provide analog and digital audio interfaces:  One differential analog audio input (microphone input)  One differential analog audio output (speaker output)  One 4-wire I2S digital audio interface: input and output  Audio signal routing can  be  controlled by  the dedicated AT command +USPM (refer  to  u-blox AT Commands Manual  [2]).  This command  allows setting  the audio path mode,  composed  by the  uplink audio  path  and the downlink audio path.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 64 of 116 Each  uplink  path  mode  defines  the  physical  input  (i.e.  the  analog  or  the  digital  audio  input)  and  the  set  of parameters to process the uplink audio signal (uplink gains, uplink digital filters, echo canceller parameters). For example  the  “Headset  microphone”  uplink  path  uses  the  differential  analog  audio  input  with  the  default parameters for the headset profile. Each downlink path mode defines the physical output (i.e. the analog or the digital audio output) and the set of parameters  to  process  the  downlink  audio  signal  (downlink  gains,  downlink  digital  filters  and  sidetone).  For example  the  “Mono  headset”  downlink  path  uses  the  differential  analog  audio  output  with  the  default parameters for the headset profile.  The  set of  parameters to  process the  uplink  or  the  downlink  audio signal can  be  changed  with  dedicated  AT commands for each uplink or downlink path and then stored in two profiles in the non volatile memory (refer to u-blox AT Commands Manual [2] for Audio parameters tuning commands).  1.11.1 Analog Audio interface 1.11.1.1 Uplink path (differential analog audio input) The pins related to the differential analog audio input are:  MIC_P / MIC_N: Differential analog audio signal inputs (positive/negative). These two pins are provided with internal series 100 nF capacitors for DC blocking that connect the module pads to the differential input of a Low  Noise  Amplifier.  The  LNA  output  is  internally  connected  to  the  digital  processing  system  by  an integrated sigma-delta analog-to-digital converter The  analog  audio  input  is  selected  when  the  parameter  <main_uplink>  in  AT+USPM  command  is  set  to “Headset  microphone”,  “Handset  microphone”  or  “Hands-free  microphone”:  the  uplink  analog  path  profiles use the same physical input but have different sets of audio parameters (for more details please refer to u-blox AT Commands Manual [2], AT+USPM, AT+UMGC, AT+UUBF, AT+UHFP commands). There is no microphone supply pin available on the module: an external low noise LDO voltage regulator should be added to provide a proper supply for a microphone. Detailed  electrical  characteristics  of  the  differential  analog  audio  input  can  be  found  in  the  LISA-U1/LISA-H1 series Data Sheet [1].  1.11.1.2 Downlink path (differential analog audio output) The pins related to the differential analog audio output are:  SPK_N  /  SPK_P:  Differential  analog  audio  signal  output  (positive/negative).  These  two  pins  are  internally directly connected to the differential output of a low power audio amplifier, for which the input is internally connected to the digital processing system by to an integrated digital-to-analog converter. The  analog  audio  output  is  selected  when  the  parameter  <main_downlink>  in  AT+USPM  command  is  set  to “Normal  earpiece”,  “Mono  headset”  or  “Loudspeaker”:  the  downlink  analog  path  profiles  use  the  same physical  output  but  have  different  sets  of  audio  parameters  (for  more  details  please  refer  to  u-blox  AT Commands Manual [2], AT+USPM, AT+USGC, AT+UDBF, AT+USTN commands). The differential analog audio output can be directly connected to a headset earpiece or handset earpiece but is not able to drive an 8  speaker. Detailed  electrical  characteristics  of  the  high  power  differential  audio  output  can  be  found  in  the  LISA-U1/LISA-H1 series Data Sheet [1].   Warning: excessive sound pressure from headphones can cause hearing loss.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 65 of 116 Table 26 lists the signals related to analog audio functions.  Name Description Remarks MIC_P Differential analog audio input (Positive) Shared for all uplink analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. MIC_N Differential analog audio input (Negative) Shared for all uplink analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. SPK_P Differential analog audio output (Positive) Shared for all uplink analog path modes: earpiece, headset, loudspeaker mode. SPK_N Differential analog audio output (Negative) Shared for all uplink analog path modes: earpiece, headset, loudspeaker mode. Table 26: Analog Audio Signal Pins  The audio pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines  are  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines  connected  to these pins.  All  corresponding  differential  audio  lines  must  be  routed  in  pairs,  be  embedded  in  GND  (have  the ground lines as close as possible to the audio lines), and maintain distance from noisy lines such as VCC and from components such as switching regulators.  If the audio pins are not used, they can be left unconnected on the application board.  1.11.1.3 Headset mode Headset  mode  is  the  default  audio  operating  mode  of  the  LISA-U120  and  LISA-U130  modules.  The  headset profile is configured when the uplink audio path is set to “Headset microphone” and the downlink audio path is set  to  “Mono  headset”  (refer  to  u-blox  AT  Commands  Manual  [2]:  AT+USPM  command:  <main_uplink>, <main_downlink> parameters):  Headset microphone must be connected to the module differential input MIC_P / MIC_N  Headset receiver must be connected to the module differential output SPK_P / SPK_N Figure 38 shows an example of an application circuit connecting a headset (with a 2.2 k electret microphone and  a  32    receiver)  to  the  LISA-U120  and  LISA-U130  modules,  with  an  external  low  noise  LDO  voltage regulator to provide a proper supply for the microphone.  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line, and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 66 of 116 LISA-U120/U130C2 C3 C4J1253461L254SPK_N53SPK_P39MIC_N40MIC_PD1AUDIO HEADSET CONNECTORD2INOUTGNDLow Noise LDO Regulator VMAINU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointL1C1C7 Figure 38: Headset mode application circuit Reference Description Part Number - Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JA01 - Murata C5, C6, C7 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX L1, L2 82 nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 - Murata J1 Audio Headset 2.5 mm Jack Connector SJ1-42535TS-SMT – CUI, Inc. R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L - Yageo Phycomp U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology Table 27: Example of components for headset jack connection  1.11.1.4 Handset mode The handset profile is configured when the uplink audio path is set to “Handset microphone” and the downlink audio  path  is  set  to  “Normal  earpiece”  (refer  to  u-blox AT  commands  manual [2]:  AT+USPM  command: <main_uplink>, <main_downlink> parameters):  Handset microphone must be connected to the module differential input MIC_P / MIC_N  Handset receiver must be connected to the module differential output SPK_P / SPK_N Figure 39 shows an example of an application circuit connecting a handset (with a 2.2 k electret microphone and  a  32    receiver)  to  the  LISA-U120  and  LISA-U130  modules,  with  an  external  low  noise  LDO  voltage regulator to provide a proper supply for the microphone.  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 67 of 116 LISA-U120/U130C1 C2 C3 J14321L153SPK_P54SPK_N40MIC_P39MIC_ND1AUDIO HANDSET CONNECTORD2INOUTGNDLow Noise LDO RegulatorU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointC4L2VMAINC7 Figure 39: Handset mode application circuit Reference Description Part Number - Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JA01 - Murata C5, C6, C7 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX L1, L2 82nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 - Murata J1 Audio Handset Jack Connector, 4Ckt (4P4C) 52018-4416 - Molex  R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L - Yageo Phycomp U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology Table 28: Example of components for handset connection  1.11.1.5 Hands-free mode The  hands-free  profile  is  configured  when  the  uplink  audio  path  is  set  to  “Hands-free  microphone”  and  the downlink audio path is set to “Loudspeaker” (refer to u-blox AT commands manual [2]:  AT+USPM command: <main_uplink>, <main_downlink> parameters):  Hands-free microphone signal must be connected to the module differential input MIC_P / MIC_N  High  power  loudspeaker  must  be  connected  to  the  output  of  an  external  audio  amplifier,  for  which  the input must be connected to the module differential output SPK_P / SPK_N The  module  differential  analog  audio  output  is  not  able  to  drive  an 8    speaker:  an  external  audio  amplifier must  be  provided  on  the  application  board  to  amplify  the  low  power  audio  signal  provided  by  the  module differential output SPK_P / SPK_N. Hands-free  functionality  is  implemented  using  appropriate  digital  signal  processing  algorithms  for  voice-band handling  (echo  canceller  and  automatic  gain  control),  managed  via  software  (refer  to  u-blox AT  commands manual [2], AT+UHFP command). Figure  39  shows  an  example  of  an  application  circuit  connecting  a  2.2  k  electret  microphone  and  an  8   speaker to the LISA-U120 and LISA-U130 modules, with an external low noise LDO voltage regulator to provide a proper supply for the microphone and with an external audio amplifier to amplify the low power audio signal provided by the module differential output.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 68 of 116  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance. C1 C2C3L139MIC_N53SPK_P40MIC_P54SPK_ND1Microphone ConnectorD2INOUTGNDLow Noise LDO RegulatorU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointC4SPKL2MICSpeaker ConnectorOUT+IN+GNDVMAINU2OUT-IN-C8C9R5R6VDDC11C10LISA-U120/U130Audio AmplifierJ1J2VMAINC7 Figure 40: Hands-free mode application circuit Reference Description Part Number - Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 - Murata C5, C6, C7, C10 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C8, C9 47 nF Capacitor Ceramic X7R 0402 10% 16V GRM155R71C473KA01 - Murata C11 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX J1 Microphone Connector  J2 Speaker Connector  L1, L2 82nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 - Murata MIC 2.2 k Electret Microphone  R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L - Yageo Phycomp R5, R6 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL - Yageo Phycomp SPK 8  Loudspeaker  U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology U2 Filter-less Mono 2.8 W Class-D Audio Amplifier SSM2305CPZ - Analog Devices Table 29: Example of components for hands-free connection
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 69 of 116 1.11.1.6 Connection to an external analog audio device The  differential  analog audio  input  /  output  can  be  used  to connect  the  module  to  an  external  analog  audio device.  Audio  devices  with  a  differential  analog  input  /  output  are  preferable,  as  they  are  more  immune  to external disturbances. If  the  external  analog  audio  device  is  provided  with  a  differential  analog  audio  input,  the  SPK_P /  SPK_N balanced output of the module must be connected to the differential input of the external audio device through a DC-block 10 µF series capacitor (e.g. Murata GRM188R60J106M) to decouple the bias present at the module output (see SPK_P / SPK_N common mode output voltage in the LISA-U1/LISA-H1 series Data Sheet [1]). Use a suitable power-on sequence to avoid audio bump due to charging of the capacitor: the final audio stage should be always enabled as last one. If the external analog audio device is provided with a single ended analog audio input, a proper differential to single  ended  circuit  must  be  inserted  from  the  SPK_P /  SPK_N  balanced  output  of  the  module  to  the  single ended  input  of  the  external  audio  device.  A  simple  application  circuit  is  described  in  Figure  41:  10  µF  series capacitors  (e.g. Murata  GRM188R60J106M)  are  provided  to decouple  the  bias present at the  module output, and a voltage divider is provided to properly adapt the signal level from the module output to the external audio device input. The DC-block series capacitor acts as high-pass filter for audio signals, with cut-off frequency depending on both the  values  of  capacitor  and  on  the  input  impedance  of  the  external  audio  device.  For  example:  in  case  of differential input impedance of 600  , the two 10 µF capacitors will set the -3 dB cut-off frequency to 53 Hz, while  for  single  ended  connection  to  600    external  device,  the  cut-off  frequency  with  just  the  single  10  µF capacitor will be  103 Hz. In both cases the  high-pass filter has a low enough cut-off to not impact the audio signal frequency response. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the SPK_P / SPK_N output level of the module is too high for the input of the audio device. If  the  external  analog  audio  device  is  provided  with  a  differential  analog  audio  output,  the  MIC_P /  MIC_N balanced input of the module must be connected directly to the differential output of the external audio device. Series capacitors are not needed since MIC_P / MIC_N pins are provided with internal 100 nF capacitors for DC blocking (see LISA-U1 series Data Sheet [1]). If the external analog audio device is provided with a single ended analog audio output, a proper single ended to differential  circuit  has  to  be  inserted  from  the  single  ended  output  of  the  external  audio  device  to  the MIC_P / MIC_N balanced input of the module. A simple application circuit is described in Figure 41: a voltage divider is provided to properly adapt the signal level from the external audio device output to the module input. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the output level of the audio device is too high for MIC_P / MIC_N. Please refer to Figure 41 for the application circuits.  To enable the audio path corresponding to the differential analog audio input / output, please refer to u-blox AT Commands Manual [2]: AT+USPM command.  To tune audio levels for the external device please refer to u-blox AT Commands Manual [2] (AT+USGC, AT+UMGC commands).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 70 of 116 LISA-U120/U130C1C254SPK_N53SPK_PGND40MIC_PGNDNegative Analog INPositive Analog INNegative Analog OUTPositive Analog OUTAudio DeviceReferenceReference39MIC_NLISA-U120/U13054SPK_N53SPK_PGND40MIC_PGNDAnalog INAudio DeviceReferenceReference39MIC_NAnalog OUTC3C4 R2R1R4R3 Figure 41: Application circuits to connect the module to audio devices with proper differential or single-ended input/output Reference Description Part Number - Manufacturer C1, C2, C3, C4 10 µF Capacitor X5R 0603 5% 6.3 V  GRM188R60J106M - Murata R1, R3 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL - Yageo Phycomp R2, R4 Not populated  Table 30: Connection to an Audio Device  1.11.2 Digital Audio interface  LISA-U120 and LISA-U130 modules support a bidirectional 4-wire I2S digital audio interface. The module acts as master only. The applicable pins are described in Table 31:  Name Description Remarks I2S_WA I2S word alignment Module output (master) I2S_TXD I2S transmit data Module output  I2S_CLK I2S clock Module output (master) I2S_RXD I2S receive data Module input  Table 31: I2S interface pins  The I2S interface pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines are externally accessible on the application board. A higher protection level can be achieved mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines  connected  to these pins.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 71 of 116  If the I2S digital audio pins are not used, they can be left unconnected on the application board.  The I2S interface can be can be used in two modes:  PCM mode  Normal I2S mode  To select the I2S digital audio interface the AT+USPM command parameters must assume these values (for more details please refer to u-blox AT Commands Manual [2]):  <main_uplink>: “I2S input line”  <main_downlink>: “I2S output line” Parameters  of  digital  path  can  be  configured  and  saved  as  the  normal  analog  paths,  using  appropriate  path parameter as described in the u-blox AT Commands Manual [2], +USGC, +UMGC, +USTN AT command. Analog gain parameters of microphone and speakers are unused when digital path is selected. I2S_TX and I2S_RX are respectively parallel to the analog front end, so resources available for analog path can be shared:  Digital  filters  and  digital  gains  are  available  in  both  uplink  and  downlink  direction.  Configure  using  AT commands  Ringer tone and service tone are mixed on the TX path when active (downlink)  The HF algorithm acts on I2S path   Refer  to  the  u-blox  AT  Commands  Manual  [2]:  AT+UI2S  command  for  possible  combinations  of connection and settings.  1.11.2.1 I2S interface - PCM mode Main features of the I2S interface in PCM mode:  I2S runs in PCM - short alignment mode (configurable by AT commands)  Module functions as I2S master (I2S_CLK and I2S_WA signals generated by the module)  I2S_WA signal always runs at 8 kHz  I2S_WA toggles high for 1 or 2 CLK cycles of synchronization (configurable), then toggles low for 16 CLK cycles of sample width. Frame length can be 1 + 16 = 17 bits or 2 + 16 = 18 bits  I2S_CLK frequency depends on frame length. Can be 17 x 8 kHz = 136 kHz or 18 x 8 kHz = 144 kHz  I2S_TX, I2S_RX data are 16 bit words with 8 kHz sampling rate, mono. Data is in 2’s complement notation. MSB is transmitted first  When I2S_WA toggles high, the first synchronization bit is always low. Second synchronization bit (present only in case of 2 bit long I2S_WA configuration) is MSB of the transmitted word (MSB is transmitted twice in this case)  I2S_TX changes on I2S_CLK rising edge, I2S_RX changes on I2S_CLK falling edge  1.11.2.2 I2S interface - Normal I2S mode Normal I2S supports:  16 bits word  Mono interface  8 kHz frequency Main features of I2S interface in normal I2S mode:
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 72 of 116  I2S_WA signal always runs at 8 kHz and synchronizes 2 channels (timeslots on WA high, WA low)  I2S_TX data are composed of 16 bit words, dual mono (the words are written on both channels). Data are in 2’s complement notation. MSB is transmitted first. The bits are written on I2S_CLK rising or falling edge (configurable)  I2S_RX data are read as 16 bit words, mono (words are read only on the timeslot with WA high). Data  is read  in  2’s  complement  notation.  MSB  is  read  first.  The  bits  are  read  on  the  I2S_CLK  edge  opposite  to I2S_TX writing edge (configurable)  I2S_CLK frequency is 16 bits x 2 channels x 8 kHz = 256 kHz The  modes  are  configurable  through  a  specific  AT  command  (refer  to  the  related  chapter  in  u-blox  AT Commands Manual [2], +UI2S AT command) and the following parameters can be set:  MSB can be 1 bit delayed or non-delayed on I2S_WA edge  I2S_TX data can change on rising or falling edge of I2S_CLK signal (rising edge in this example)  I2S_RX data are read on the opposite front of I2S_CLK signal  1.11.3 Voiceband processing system The voiceband processing on the LISA-U120 and LISA-U130 modules is implemented in the DSP core inside the baseband chipset. The analog audio front-end of the chipset is connected to the digital system through 16 bit ADC converters  in  the  uplink  path, and  through  16 bit  DAC converters  in the  downlink  path. External digital audio devices can be interfaced directly to the DSP digital processing part via the I2S digital interface. The analog amplifiers are skipped in this case. Possible processing of audio signal are:  Speech encoding (uplink) and decoding (downlink).The following speech codecs are supported in firmware on the DSP:  Fullrate, enhanced full rate, and half rate speech encoding and decoding  Adaptive multi rate (full rate and half rate) speech encoding and decoding  Mandatory sub-functions:  Discontinuous transmission, DTX (GSM 46.031, 46.041, 46.081 and 46.093 standards)  Voice activity detection, VAD (GSM 46.032, 46.042, 46.082 and 46.094 standards)  Background noise calculation (GSM 46.012, 46.022, 46.062 and 46.092 standards)  Function configurable via specific AT commands (refer to the u-blox AT Commands Manual [2])  Signal routing: +USPM command  Analog amplification, Digital amplification: +USGC,+CLVL, +CRSL, +CMUT command  Digital filtering: +UUBF, +UDBF commands  Hands-free algorithms (echo cancellation, Noise suppression, Automatic Gain control) +UHFP command  Sidetone generation (feedback of uplink speech signal to downlink path): +USTN command  Playing/mixing of alert tones: Service tones: Tone generator with 3 sinus tones +UPAR command User generated tones: Tone generator with 3 sinus tones +UTGN command Midi  melodies  (for  ringer):  Synthesizer  with  up  to  64  voices  and  a  48  kHz  sampling  rate,  +UPAR command AMR files (for prompting):  The storage format  of  AMR encoded audio content  is defined in  RFC3267 chapter 5 [9], +UPLAYFILE command  With exception of the speech encoder/decoder, this audio processing can be controlled by AT commands. This processing is implemented within three different blocks of the voiceband processing system:
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 73 of 116  Sample-based Voice-band Processing (single sample processed at 8 kHz, every 125 µs)  Frame-based Voice-band Processing (frames of 160 samples are processed every 20 ms)  MIDI synthesizer running at 47.6 kHz  These  three  blocks  are  connected  by  buffers  (circular  buffer  and  voiceband  sample  buffer)  and  sample  rate converters (for 8 to 47.6 kHz conversion) as illustrated in the block diagram in Figure 42, which summarizes the voiceband audio processing in the DSP.  DACADCI2S_RXDSwitchMICMicrophone Analog GainUplink filter 2Uplink filter 1Hands-freeTo Radio TXScal_MicDigital GainSidetoneDownlink filter 1Downlink filter 2MIDI playerSPK_P/NSwitchI2S_TXDScal_Rec Digital GainMix_AFE Digital GainSPK Analog_gainGain_out Digital GainTone GeneratorFrom Radio RXSpeech levelI2Sx RX Sample Based Processing Frame Based ProcessingAMR PlayerCircular bufferVoiceband Sample Buffer18 dBPower Amplifier Figure 42: Voiceband processing system block diagram
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 74 of 116 1.12 General Purpose Input/Output (GPIO) The LISA-U1/LISA-H1 series  modules provide 5 pins (GPIO1, GPIO2, GPIO3,  GPIO4 and GPIO5) which can be configured as general purpose input or output, or can be configured to provide special functions via u-blox AT commands  (for  further  details  refer  to  u-blox  AT  Commands  Manual  [2],  +UGPIOC,  +UGPIOR,  +UGPIOW, +UGPS, +UGPRF). The available functions are described below:  GSM  Tx  burst  indication:  the  GPIO1  can  be  configured  by  AT+UGPIOC  to  indicate  when  a  GSM  Tx burst/slot  occurs.  The  pin  can  be  connected  on  the  application  board  to  an  input  pin  of  an  application processor to indicate when a GSM Tx burst/slot occurs  GPS supply enable: the GPIO2 is by default configured to enable or disable the supply of the u-blox GPS receiver  connected  to  the  LISA-U1/LISA-H1  series  module.  The  pin  must  be  connected  to  the  active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS receiver on the application board. The pin is automatically set output high to switch on the u-blox GPS receiver when the parameter <mode> of +UGPS AT command is set to 1, and otherwise it is set in tri-state with an internal active  pull-down  enabled.  The  GPIO1,  GPIO3,  GPIO4 or GPIO5  can  be  configured  by  AT+UGPIOC  to provide this feature, alternatively to the default GPIO2  GPS data ready: the GPIO3 is by default configured to sense when the u-blox GPS receiver connected to the  LISA-U1/LISA-H1  series  module  is  ready  to  send  data  by  the  DDC  (I2C)  interface.  The  pin  must  be connected to the data ready output of the u-blox GPS receiver (i.e. the pin TxD1 of the u-blox GPS module) on the application board. The pin automatically senses the line status to wake up the LISA-U1/LISA-H1 series module from idle mode if the u-blox GPS receiver is ready to send data by the DDC (I2C) interface, when the parameter <mode> of +UGPS AT command is set to 1, and otherwise it is set  in tri-state with an internal active pull-down enabled  GPS aiding  synch:  the  GPIO4  is  by  default  configured  to  provide  a  synchronization  timing  signal to  the u-blox  GPS  receiver  connected  to  the  LISA-U1/LISA-H1  series  module.  The  pin  must  be  connected  to  the synchronization timing input of the u-blox GPS receiver (i.e. the pin EXTINT0 of the u-blox GPS module) on the  application  board.  The  pin  automatically  provides  a  synchronization  timing  signal  to  the  u-blox  GPS receiver when the parameter <mode> of +UGPS AT command is set to 1, and otherwise it is set in tri-state with an internal active pull-down enabled  SIM  card  detection:  the  GPIO5  is  by  default  configured  to  detect  SIM  card  presence.  The  pin  must  be connected  on  the  application board  to  the SW2 pin of  the  SIM card connector  with a  470 kΩ  pull-down resistor and SW1 pin of the SIM card connector must be pulled up to the module V_INT by a 1 kΩ pull-up resistor  Network status indication: each GPIO  (GPIO1, GPIO2, GPIO3, GPIO4 or GPIO5) can be configured  by AT+UGPIOC to indicate network status (registered home network, registered roaming, data transmission, no service). The pin configured to provide this feature can be connected on the application board to an input pin  of  an  application  processor  or  can  drive  a  LED  by  a  transistor  with  integrated  resistors  to  indicate network status  General purpose input: all the GPIOs (GPIO1, GPIO2, GPIO3, GPIO4 and GPIO5) can be configured by AT+UGPIOC as input, sensing high or low digital level by AT+UGPIOR  General purpose output: all the GPIOs (GPIO1, GPIO2, GPIO3, GPIO4 and GPIO5) can be configured by AT+UGPIOC as output, set in the high or low digital level by AT+UGPIOW, sensing high or low digital level by AT+UGPIOR  Pad disabled: all the GPIOs (GPIO1, GPIO2, GPIO3, GPIO4 and GPIO5) can be configured by AT+UGPIOC in tri-state, with an internal active pull-down enabled
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 75 of 116 Name Description Remarks GPIO1 GPIO By default, any function is disabled and the internal active pull-down is enabled. Can be alternatively configured by the AT+UGPIOC command   to provide the Output function  to provide the Input function  to provide the Network Status Indication function  to provide the GPS Supply Enable function  to provide the GSM Tx Burst Indication function GPIO2 GPIO By default, the pin is configured to provide the GPS Supply Enable function. Can be alternatively configured by the AT+UGPIOC command  to provide the Output function  to provide the Input function  to provide the Network Status Indication function  to disable any function and enable the internal active pull-down GPIO3 GPIO By default, the pin is configured to provide the GPS Data Ready function. Can be alternatively configured by the AT+UGPIOC command  to provide the Output function  to provide the Input function  to provide the Network Status Indication function  to provide the GPS Supply Enable function  to disable any function and enable the internal active pull-down GPIO4 GPIO By default, the pin is configured to provide the GPS Aiding Synch function. Can be alternatively configured by the AT+UGPIOC command  to provide the Output function  to provide the Input function  to provide the Network Status Indication function  to provide the GPS Supply Enable function  to disable any function and enable the internal active pull-down GPIO5 GPIO By default, the pin is configured to provide the SIM card detection function. Can be alternatively configured by the AT+UGPIOC command   to provide the Output function  to provide the Input function  to provide the Network Status Indication function  to provide the GPS Supply Enable function  to disable any function and enable the internal active pull-down Table 32: GPIO pins    The GPIO pins ESD rating is 1 kV (contact discharge). A higher protection level could be required if the lines  are  externally  accessible  on  the  application  board.  A  higher  protection  level  can  be  achieved mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG  varistor  array)  on  the  lines  connected  to these pins. An application circuit for a typical GPIO usage (GPS supply enable, GPS aiding synch, GPS data ready, SIM card detection, Network indication) is described in Figure 43.   Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 kΩ resistor on the board in series to the GPIO.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 76 of 116 SIM card holderSW1 SW2 4V_INT51GPIO5R3R2OUTINGNDLDO RegulatorSHDN3V8 1V8GPIO3GPIO4TxD1EXTINT02324R1VCCGPIO2 21LISA-U1/LISA-H1 seriesu-blox1.8 V GPS receiverU1J1C1R4R63V8Network IndicatorR5GPS Supply EnableGPS Data ReadyGPS Aiding SynchSIM Detection20GPIO1DL1T1D1 Figure 43: GPIO application circuit Reference Description Part Number - Manufacturer R1 4.7 kΩ Resistor 0402 5% 0.1 W Various manufacturers U1 Voltage Regulator for GPS Receiver See GPS Module Hardware Integration Manual R2 1 kΩ Resistor 0402 5% 0.1 W Various manufacturers R3 470 kΩ Resistor 0402 5% 0.1 W Various manufacturers D1 ESD Transient Voltage Suppressor USB0002RP or USB0002DP - AVX J1 SIM Card Holder Various Manufacturers, CCM03-3013LFT R102 - C&K Components R4 10 kΩ Resistor 0402 5% 0.1 W Various manufacturers R5 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R6 820 Ω Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor  BC847 - Infineon Table 33: Components for GPIO application circuit   If the GPIO pins are not used, they can be left unconnected on the application board.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 77 of 116 1.13 Reserved pins (RSVD) LISA-U1/LISA-H1 series modules have some pins reserved for future use. All the RSVD pins, except pin number 5, can be left unconnected on the application board. The application circuit is illustrated in Figure 44.   Pin 5 (RSVD) must be connected to GND.  LISA-U120/U1305RSVD52RSVD74RSVDLISA-U100/U110 LISA-H100/H1105RSVD52RSVD74RSVD39RSVD40RSVD41RSVD42RSVD43RSVD44RSVD53RSVD53RSVD Figure 44: Application circuit for the reserved pins (RSVD)
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 78 of 116 1.14 Schematic for LISA-U1/LISA-H1 series module integration Figure 45 is  an example of  a schematic  diagram where a  LISA-U1/LISA-H1 series  module  is integrated  into an application board, using all the interfaces of the module. 47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF50VSIM48SIM_IO47SIM_CLK49SIM_RST47pFSW1 SW24V_INT51GPIO5470k1kESD ESD ESD ESD ESD ESDTXDRXDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND3V8330µF 39pF GND10nF100nF 10pFLISA-U1/LISA-H1 series62 VCC63 VCC61 VCC+100µF2V_BCKPMOSIMISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDVBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GND100nF5RSVD52RSVD74RSVDGNDRTC back-up27pF 27pF 27pF82nH54SPK_N53SPK_P39MIC_N40MIC_PESDHeadset ConnectorESDINOUTGNDLow Noise LDO Regulator 3V82.2k2.2k10µF2.2k2.2k 10µF2V5Sense lines connected  to GND in one star point82nH27pF10µFESD ESDu-blox1.8V GPS Receiver4.7kOUTINGNDLDO RegulatorSHDNSDASCL4.7k3V8 1V8_GPSSDA2SCL2GPIO3GPIO4TxD1EXTINT0464523244.7kVCCGPIO2 21ANT 68 Antenna1.8V DTE1.8V SPI MasterUSB 2.0 Host1.8V Digital Audio DeviceI2S_RXDI2S_CLKI2S_TXDI2S_CLKI2S_TXDI2S_WAI2S_RXDI2S_WA44434241LISA-U120/U130 only20 GPIO13V8Network Indicator22 RESET_NFerrite Bead47pFApplication ProcessorOpen Drain Output19 PWR_ON100kΩOpen Drain Output0Ω0ΩTPTP Figure 45: Example of schematic diagram to integrate LISA module in an application board, using all the interfaces
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  System description      Page 81 of 116  IMPORTANT: Manufacturers of portable applications incorporating the LISA-U1/LISA-H1 series modules are required to have their final product certified and apply for their own FCC Grant and  Industry  Canada Certificate  related  to  the  specific  portable  device.  This  is  mandatory  to meet the SAR requirements for portable devices. Changes  or  modifications  not  expressly  approved  by  the  party  responsible  for  compliance could void the user's authority to operate the equipment.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 82 of 116 2 Design-In 2.1 Design-in checklist This section provides a design-in checklist. 2.1.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC pin above the minimum operating range limit.  DC supply must be capable of providing 2.5 A current pulses, providing a voltage at VCC pin above the minimum operating range limit and with a maximum 400 mV voltage drop from the nominal value.   VCC supply should be clean, with very low ripple/noise: suggested passive filtering parts can be inserted.  VCC voltage must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module.  Connect only one DC supply to VCC: different DC supply systems are mutually exclusive.  Do not leave PWR_ON floating: add a pull-up resistor to V_BCKP.  Don’t apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the relative operating range.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested low capacitance ESD protection and passive filtering parts on each SIM signal.  Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation [3].  Provide  appropriate  access  to  USB  interface  and/or  to  UART  RxD,  TxD  lines  and  access  to  PWR_ON and/or RESET_N lines on the application board in order to flash/upgrade the module firmware.  Provide appropriate access to USB interface and/or to UART RxD, TxD, CTS, RTS lines for debugging.  Add a proper pull-up resistor to a proper supply on each DDC (I2C) interface line, if the interface is used.  Capacitance and series resistance must be limited on each line of the DDC interface.  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10  kΩ resistor on the board in series to the GPIO when those are used to drive LEDs.  Connect the pin number 5 (RSVD) to ground.  Insert the suggested passive filtering parts on each used analog audio line.  Check the digital audio interface specifications to connect a proper device.  Provide proper precautions for ESD immunity as required on the application board.  All  unused  pins  can  be  left  floating  on  the  application  board  except  the  PWR_ON  pin  (must  be connected to V_BCKP by a pull-up resistor) and the RSVD pin number 5 (must be connected to GND). 2.1.2 Layout checklist The following are the most important points for a simple layout check:  Check 50  nominal characteristic impedance of the RF transmission line connected to ANT pad.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure  no  coupling  occurs  with  other  noisy  or  sensitive  signals  (primarily  MIC  signals,  audio  output signals, SIM signals).  VCC line should be wide and short.  Route VCC supply line away from sensitive analog signals.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 83 of 116  The high-power audio outputs lines on the application board must be wide enough to minimize series resistance.  Ensure proper grounding.  Consider “No-routing” areas for the Data Module footprint.  Optimize placement for minimum length of RF line and closer path from DC source for VCC.  Design USB_D+ / USB_D- connection as 90  differential pair.  Keep routing short and minimize parasitic capacitance on the SPI lines to preserve signal integrity. 2.1.3 Antenna checklist  Antenna should have 50  impedance, V.S.W.R less then 3:1, recommended 2:1 on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Antenna should have built in DC resistor to ground to get proper Antenna detection functionality.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 84 of 116 2.2 Design Guidelines for Layout The following design guidelines must be met for optimal integration of LISA-U1/LISA-H1 series modules on the final application board.  2.2.1 Layout guidelines per pin function This section groups LISA-U1/LISA-H1 series modules pins by signal function and provides a ranking of importance in layout design. Very ImportantCareful LayoutCommon PracticeLegend:V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GNDUSB_D-USB_D+234567891011121131415161718192021222324252627GNDVCCVCCVCCGNDSPI_MRDYSPI_SRDYSPI_MISOSPI_MOSISPI_SCLKSPK_NGNDSPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLI2S_RXDI2S_CLKI2S_TXDI2S_WAMIC_PMIC_N6463626160595857565554655352515049484746454443424140392930313233343536373828GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND7574737271706968676676GNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGND Figure 46: Module pin-out with ranked importance for layout design (LISA top view)
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 85 of 116 Rank Function Pin(s) Layout Remarks 1st RF Antenna In/out  Very Important Design for 50  characteristic impedance. See section 2.2.1.1 2nd Main DC Supply  Very Important VCC line should be wide and short. Route away from sensitive analog signals.  See section 2.2.1.2 3rd USB Signals    Very Important Route USB_D+ and USB_D- as differential lines: design for 90  differential impedance. See section 2.2.1.3 4th Analog Audio  Careful Layout Avoid coupling with noisy signals. See section 2.2.1.4 Audio Inputs MIC_P, MIC_N Audio Outputs SPK_P, SPK_N 5th Ground GND Careful Layout Provide proper grounding. See section 2.2.1.5 6th Sensitive Pin :  Careful Layout Avoid coupling with noisy signals. See section 2.2.1.6 Backup Voltage V_BCKP Power On PWR_ON 7th High-speed digital pins:  Careful Layout Avoid coupling with sensitive signals. See section 2.2.1.7 SPI Signals SPI_SCLK, SPI_MISO, SPI_MOSI, SPI_SRDY, SPI_MRDY 8th Digital pins and supplies:  Common Practice Follow common practice rules for digital pin routing. See section 2.2.1.8 SIM Card Interface VSIM, SIM_CLK, SIM_IO, SIM_RST Digital Audio (If implemented) I2S_CLK, I2S_RXD, I2S_TXD, I2S_WA DDC SCL, SDA UART TXD, RXD, CTS, RTS, DSR, RI, DCD, DTR External Reset RESET_N General Purpose I/O GPIO1, GPIO2, GPIO3, GPIO4, GPIO5 USB detection VUSB_DET Supply for Interfaces V_INT Table 34: Pin list in order of decreasing importance for layout design  2.2.1.1 RF antenna connection  The RF antenna connection pin ANT is very critical in layout design. The PCB line must be designed to provide  50  nominal characteristic impedance and minimum loss up to radiating element.  Provide proper transition between the ANT pad to application board PCB  Increase GND keep-out (i.e. clearance) for ANT pad to at least 250 µm up to adjacent pads metal definition and up to 500 µm on the area below the Data Module, as described in Figure 47.  Add  GND  keep-out  (i.e.  clearance)  on  buried  metal  layers  below  ANT  pad  and  below  any  other  pad  of component present on the RF line, if top-layer to buried layer dielectric thickness is below 200 µm, to reduce parasitic capacitance to ground (see Figure 47 for the description keep-out area below ANT pad)  The transmission line up to antenna connector or pad may be a micro strip or a stripline. In any case must be designed to achieve 50 Ω characteristic impedance  Microstrip lines are usually easier to implement and the reduced number of layer transitions up to antenna connector simplifies the design and diminishes reflection losses. However, the electromagnetic field extends to the free air interface above the stripline and may interact with other circuitry USB_D- USB_D+ VCC ANT
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 86 of 116  Buried striplines exhibit better shielding to external and internally generated interferences. They are therefore preferred for sensitive application. In case a stripline is implemented, carefully check that the via pad-stack does not couple with other signals on the crossed and adjacent layers  Minimize  the  transmission  line  length;  the  insertion  loss  should  be  minimized  as much  as  possible,  in  the order of a few tenths of a dB  The transmission line should not have abrupt change to thickness and spacing to GND, but must be uniform and routed as smoothly as possible  The transmission line must be routed in a section of the PCB where minimal interference from noise sources can be expected  Route RF transmission line far from other sensitive circuits as it is a source of electromagnetic interference  Avoid coupling with VCC routing and analog audio lines  Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer  Add GND vias around transmission line  Ensure no other signals are routed parallel to transmission line, or that other signals cross on adjacent metal layer  If  the  distance  between  the  transmission  line  and  the  adjacent  GND  area  (on  the  same  layer)  does  not exceed  5  times  the  track  width  of  the  micro  strip,  use  the  “Coplanar  Waveguide”  model  for  50  Ω characteristic impedance calculation  Don’t route microstrip line below discrete component or other mechanics placed on top layer  When terminating transmission line  on antenna  connector (or  antenna  pad) it is  very important  to strictly follow the connector manufacturer’s recommended layout  GND  layer  under  RF  connectors  and  close  to  buried  vias  should  be  cut  out  in  order  to  remove  stray capacitance and thus keep the RF line 50 Ω. In most cases the large active pad of the integrated antenna or antenna  connector  needs  to  have  a  GND  keep-out  (i.e.  clearance)  at  least  on  first  inner  layer  to  reduce parasitic  capacitance  to  ground.  Note  that  the  layout  recommendation  is  not  always  available  from connector  manufacturer:  e.g.  the  classical  SMA  Pin-Through-Hole  needs  to  have  GND  cleared  on  all  the layers around the central pin up to annular pads of the four GND posts. Check 50 Ω impedance of ANT line  Ensure no coupling occurs with other noisy or sensitive signals Min. 500 umMin. 250 umTop layer Buried metal layerGND planeMicrostrip50 ohm Figure 47: GND keep-out area on the top layer around the ANT pad and on the buried metal layer below the ANT pad   Any RF transmission line on PCB should be designed for 50 Ω characteristic impedance.  Ensure no coupling occurs with other noisy or sensitive signals.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 87 of 116 Additional guidelines for products marked with the FCC logo - United States only LISA-U1/LISA-H1  series modules can  only be used  with a host antenna circuit trace layout according  to  below guidelines and a host system designer must follow the guidelines to keep the original Grant of LISA-U1/LISA-H1 series modules.   Strict compliance to the layout reference design already approved (described in the following guidelines) is required to ensure that only approved antenna shall be used in the host system.  If in a host system there is any difference from the trace layout already approved, it requires a Class II permissive change or a new grant as appropriate as FCC defines. Compliance of this device in all final host configurations is the responsibility of the Grantee.  The approved reference design for LISA-U1/LISA-H1 series modules has a structure of four layers described in the following. The Layer 1 (top layer, see Figure 48) provides a micro strip line to connect the ANT pin of the LISA-U1/LISA-H1 series module to the antenna connector. The ANT pin of the LISA-U1/LISA-H1 series module has to be soldered on the designed pad which is connected to the  antenna connector by a micro strip.  The characteristics of the micro strip line (coplanar wave guide) are the following:   Thickness = 0.035 mm  Width = 0.26 mm  Length = 7.85 mm  Gap (signal to GND) = 0.5 mm  The  micro strip line  must be designed  to  achieve  50  Ω characteristic  impedance:  the dimensions  of the  micro strip line have to be calculated in a host system according to PCB characteristics provided by PCB manufacturer. Pad designed for the ANT pinAntenna connectorMicrostrip line Figure 48: Layer 1 (top layer) of u-blox approved interface board for LISA-U1/LISA-H1 series modules The thickness of the dielectric (FR4 Prepreg 1080) from Layer 1 (top layer) to Layer 2 (inner layer) is 0.27 mm. The Layer 2 (inner layer, described in Figure 49) provides a GND plane.  Layer 2 thickness is 0.035 mm.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 88 of 116  Figure 49: Layer 2 (inner layer) of u-blox approved interface board for LISA-U1/LISA-H1 series modules The thickness of the dielectric (FR4 Laminate 7628) from Layer 2 (inner layer) to Layer 3 (inner layer) is 0.76 mm. The Layer 3 (inner layer, described in Figure 50) is designed for signals routing and GND plane.  Layer 3 thickness is 0.035 mm.  Figure 50: Layer 3 (inner layer) of u-blox approved interface board for LISA-U1/LISA-H1 series modules The thickness of the dielectric (FR4 Prepreg 1080) from Layer 3 (inner layer) to Layer 4 (bottom layer) is 0.27 mm. The Layer 4 (bottom layer, described in Figure 51) is designed for signals routing, components placement and GND plane.  Layer 4 thickness is 0.035 mm.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 89 of 116  Figure 51: Layer 4 (bottom layer) of u-blox approved interface board for LISA-U1/LISA-H1 series modules  The antenna must not exceed 3dBi gain to preserve the original u-blox FCC ID.  The antenna must be installed and operated with a minimum distance of 20 cm  from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.  Under the requirements of FCC Section 15.212(a)-iv, the module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s).  In accordance  with  FCC  Section  15.203,  the  antenna  should  use  a  unique  coupling  connector  to  the approved reference design for LISA-U1/LISA-H1 series modules, in order to ensure that the design will not be deployed with antenna of different characteristic from the approved type.  The use of standard SMA type connector is not permitted, as its standard usage allows easy replacement of the attached antenna. However RP-SMA (Reverse-Polarized-SMA) connector type fulfills the minimum requirements to prevent exchangeability of antenna on the reference design.  2.2.1.2 Main DC supply connection The DC supply of LISA-U1/LISA-H1 series modules is very important for the overall performance and functionality of  the  integrated  product.  For  detailed  description,  check  the  design  guidelines  in  section  1.5.2.  Some  main characteristics are:  VCC pins are internally connected, but it is recommended to use all the available pins in order to minimize the power loss due to series resistance  VCC  connection  may  carry  a  maximum  burst  current  in  the  order  of  2.5  A.  Therefore,  it  is  typically implemented as a wide PCB line with short routing from DC supply (DC-DC regulator, battery pack, etc)  The  module  automatically  initiates  an  emergency  shutdown  if  supply  voltage  drops  below  hardware threshold. In addition, reduced supply voltage can set a worst case operation point for RF circuitry that may behave incorrectly. It follows that each voltage drop in the DC supply track will restrict the operating margin at the main DC source output. Therefore, the PCB connection must exhibit a minimum or zero voltage drop. Avoid any series component with Equivalent Series Resistance (ESR) greater than a few milliohms  Given  the  large  burst  current,  VCC  line  is  a  source  of  disturbance  for  other  signals.  Therefore  route  VCC through a PCB area separated from sensitive analog signals. Typically it is good practice to interpose at least one layer of PCB ground between VCC track and other signal routing  The  VCC  supply  current  supply  flows  back  to  main  DC  source  through  GND  as  ground  current:  provide adequate return path with suitable uninterrupted ground plane to main DC source
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 90 of 116  A tank capacitor with low ESR is often used to smooth current spikes. This is most effective when placed as close as possible to VCC. From main DC source, first connect the capacitor and then  VCC. If the main DC source is a switching DC-DC converter, place the large capacitor close to the DC-DC output and minimize the VCC track length. Otherwise consider using separate capacitors for DC-DC converter and LISA-U1/LISA-H1 series module tank capacitor. Note that the capacitor voltage rating may be adequate to withstand the charger over-voltage if battery-pack is used  VCC is directly connected to the RF power amplifiers. Add capacitor in the pF range from VCC to GND along the supply path  Since  VCC  is  directly  connected  to  RF  Power  Amplifiers,  voltage  ripple  at  high  frequency  may  result  in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case it is better  to  select the  highest operating frequency for the switcher and add a large L-C filter before connecting to the LISA-U1/LISA-H1 series modules in the worst case  The large current generates a magnetic field that is not well isolated by PCB ground layers and which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In this case route VCC away from other sensitive functional units  The typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range. Avoid coupling between VCC and audio lines (especially microphone inputs)  If  VCC  is  protected  by  transient  voltage  suppressor  /  reverse  polarity  protection  diode  to  ensure  that  the voltage maximum ratings are not exceeded, place the protecting device along the path from the DC source toward the LISA-U1/LISA-H1 series module, preferably closer to the DC source (otherwise functionality may be compromised)   VCC line should be wide and short.   Route away from sensitive analog signals.  2.2.1.3 USB signal The  LISA-U1/LISA-H1  series  modules  include  a  high-speed  USB  2.0  compliant  interface  with  a  maximum throughput of 480 Mb/s (see Section 1.9.3). Signals USB_D+ / USB_D- carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake,  as well as in differential mode for fast signaling and data transfer. Characteristic impedance of  USB_D+ / USB_D- lines is specified by USB  standard.  The  most  important  parameter  is  the  differential  characteristic  impedance  applicable  for  odd-mode electromagnetic field,  which should be  as close  as possible  to  90    differential: signal integrity may  be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long.  Route USB_D+ / USB_D- lines as a differential pair  Ensure the differential characteristic impedance is as close as possible to 90   Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area 2.2.1.4 Analog audio (LISA-U120 / LISA-U130 only) Accurate analog audio design is very important to obtain clear and high quality audio. The GSM signal burst has a repetition rate of 217 Hz that lies in the audible range. A careful layout is required to reduce the risk of noise from audio lines due to both VCC burst noise coupling and RF detection. Analog audio is separated in the two paths, 1. Audio Input (uplink path): MIC_P / MIC_N 2. Audio Outputs (downlink path): SPK_P / SPK_N  The most sensitive is the uplink path, since the analog input signals are in the microVolts range.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 91 of 116  Avoid coupling of any noisy signals to microphone input lines  It is strongly recommended  to route MIC signals away from battery and RF antenna  lines.  Try to skip fast switching digital lines as well  Keep ground separation from other noisy signals. Use an intermediate GND layer or vias wall for  coplanar signals  MIC_P  and  MIC_N  are  sensed  differentially  within  the  module.  Therefore  they  should  be  routed  as  a differential pair up to the audio signal source  Cross other signals lines on adjacent layers with 90° crossing  Place bypass capacitor for RF very close to active microphone. The preferred microphone should be designed for GSM applications which typically have internal built-in bypass capacitor for RF very close to active device. If  the  integrated  FET  detects  the  RF  burst,  the  resulting  DC  level  will  be  in  the  pass-band  of  the  audio circuitry and cannot be filtered by any other device  The bias for an external electret active microphone is not provided by the module. Verify that microphone is properly biased from an external low noise supply and verify that the supply noise is properly filtered  Output audio lines have two separated configurations.  SPK_P /  SPK_N  are  high  level  balanced  output.  They  are  DC  coupled  and  must  be  used  with  a  speaker connected in bridge configuration  Route SPK_P / SPK_N as differential pair, to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise  Consider enlarging PCB lines, to reduce series resistive losses, when the audio output is directly connected to low impedance speaker transducer  Use twisted pair cables for balanced audio usage  If  DC  decoupling  is  required,  a  large  capacitor  needs  to  be  used,  typically  in  the  microFarad  range, depending on the load impedance, in order to not increase the lower cut-off frequency of its High-Pass RC filter response  2.2.1.5 Module grounding Good  connection  of  the  module  with  application  board  solid  ground  layer  is  required  for  correct  RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer  The  shielding  metal  tabs  are  connected  to  GND,  and  are  a  fundamental  part  of  electrical  grounding  and thermal  heat-sink.  Connect  them to  board  solid  ground  layer,  by  soldering  them  on  the  baseboard  using PCB plated through holes connected to GND net  If  the  application  board  is  a  multilayer  PCB,  then  it  is  required  to  connect  together  each  GND  area  with complete via stack down to main board ground layer  It is recommended to implement one layer of the application board as ground plane  Good grounding of GND pads will also ensure thermal heat sink. This is critical during call connection, when the real network commands the  module to  transmit at maximum power: proper  grounding helps  prevent module overheating  2.2.1.6 Other sensitive pins A few other pins on the LISA-U1/LISA-H1 series modules requires careful layout.  RTC supply (V_BCKP): avoid  injecting noise on this  voltage domain as  it may affect  the stability of sleep oscillator
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 92 of 116  Power On (PWR_ON): is the digital input to switch-on the LISA-U1/LISA-H1 series modules. Ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious power on request  2.2.1.7 High-speed digital pins The Serial Peripheral Interface Bus (SPI) interface can be used for high speed data transfer (UMTS/HSPA) between the LISA-U1/LISA-H1 series modules and the host processor, with a data rate up to 20 Mb/s (see Section 1.9.3). The  high-speed  data  rate  is  carried  by  signals  SPI_SCLK,  SPI_MISO  and  SPI_MOSI,  while  SPI_SRDY  and SPI_MRDY behave as handshake signals with relatively low activity.  High-speed signals become sources of digital noise, route away from RF and other sensitive analog signals  Keep routing short and minimize parasitic capacitance to preserve digital signal integrity  2.2.1.8 Digital pins and supplies  External Reset (RESET_N): input for external reset, a logic low voltage will reset the module  SIM Card Interface (VSIM, SIM_CLK, SIM_IO, SIM_RST): the SIM layout may be critical if the SIM card is placed far away from the LISA-U1/LISA-H1 series modules or in close proximity to the RF antenna. In the first case the long connection  can cause  the radiation of some harmonics of the  digital data frequency. In the second case the same harmonics can be picked up and create self-interference that can reduce the sensitivity of  GSM  Receiver  channels  whose  carrier  frequency  is  coincidental  with  harmonic  frequencies.  The  latter case,  placing  the  RF  bypass  capacitors,  suggested  in  Figure  20,  near  the  SIM  connector  will  mitigate  the problem. In  addition,  since  the  SIM card  is  typically  accessed  by  the  end user,  it  can be  subjected  to  ESD discharges: add adequate ESD protection to protect module SIM pins near the SIM connector.  Digital  Audio  (I2S_CLK,  I2S_RX,  I2S_TX,  I2S_WA):  the  I2S  interface  requires  the  same  consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  DDC  (SCL,  SDA):  the  DDC  interface  requires  the  same  consideration  regarding  electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  UART  (TXD,  RXD,  CTS,  RTS,  DSR,  RI,  DCD,  DTR):  the  serial  interface  requires  the  same  consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  General Purpose I/O (GPIOx): the general purpose input/output pins are generally not critical for layout  Reserved pins: these pins are reserved for future use. Leave them unconnected on the baseboard  USB  detection  (VUSB_DET):  this  input  will  generate  an  interrupt  to  the  baseband  processor  for  USB detection. The USB supply (5.0 V typ.) must be provided to VUSB_DET by the connected USB host to enable the USB interface of the module  Interfaces Supply (V_INT): this supply output is generated by an integrated switching step down converter, used internally to supply the digital interfaces. Because of this, it can be a source of noise: avoid coupling with sensitive signals
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 93 of 116 2.2.2 Footprint and paste mask The following figure describes the footprint and provides recommendations for the paste mask for LISA-U1/LISA-H1  series  modules.  These  are  recommendations  only  and  not  specifications.  Note  that  the  copper  and  solder masks have the same size and position. 33.2 mm [1307.1 mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]0.8 mm [31.5 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]1.0 mm [39.3 mil]5.7 mm [224.4 mil]33.2 mm [1307.1 mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]1.2 mm [47.2 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]0.9 mm [35.4 mil]5.7 mm [224.4 mil]0.6 mm [23.6 mil]Stencil: 120 µm Figure 52: LISA-U1/LISA-H1 series modules suggested footprint and paste mask To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the volume outside of the module by defining the dimensions of the  paste mask to form a T-shape (or equivalent) extending beyond the copper mask. The solder paste should have a total thickness of 120 µm.   The  paste  mask  outline  needs  to  be  considered  when  defining  the  minimal  distance  to  the  next component.  The  exact  geometry,  distances,  stencil  thicknesses  and  solder  paste  volumes  must  be  adapted  to  the specific production processes (e.g. soldering etc.) of the customer.  The bottom layer of  LISA-U1/LISA-H1 series modules  shows an unprotected copper area for GND described in Figure 53.   Consider “No-routing” area for the LISA-U1/LISA-H1 series modules footprint as follows: signals keep-out area on the top layer of the application board, below LISA-U1/LISA-H1 series modules, due to GND opening on module bottom layer (see Figure 53).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 94 of 116 5.3 mm11.85 mm33.2 mm 1.0 mm1.4 mmPIN 1Bottom side (through module view)22.40 mmExposed GND on LISA module bottom layerSignals keep-out area on application board Figure 53: Signals keep-out area on the top layer of the application board, below LISA-U1/LISA-H1 series modules  2.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature  of  the  application  base-board  below  the  LISA-U1/LISA-H1  series  modules:  avoid  placing temperature sensitive devices (e.g. GPS receiver) close to the module.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 95 of 116 2.3 Thermal aspects The operating temperature range is specified in the LISA-U1/LISA-H1 series Data Sheet [1]. The most critical condition concerning thermal performance is the uplink transmission at maximum power (data upload or voice call in connected mode), when the baseband processor runs at full speed, radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks; however the application should be correctly designed to cope with it. During  transmission  at  maximum  RF  power  the  LISA-U1/LISA-H1  series  modules  generate  thermal  power  that can  exceed  2  W:  this  is  an  indicative  level  since  the  exact  generated  power  strictly  depends  on  operating condition  such  as  the  number  of  allocated  TX  slot  and  modulation  (GMSK  or  8PSK)  or  data  rate  (WCDMA), transmitting  frequency  band,  etc.  The  generated  thermal  power  must  be  adequately  dissipated  through  the thermal and mechanical design of the application. The increase of thermal dissipation, i.e. reducing the thermal resistance, will reduce the operating temperature for  internal  circuitry  of  LISA-U1/LISA-H1  series  modules  for  the  same  operating  ambient  temperature.  This improves the device long-term reliability for applications operating at high ambient temperature. A few techniques may be used to reduce the thermal resistance in the application:  Forced ventilation air-flow within mechanical enclosure  Usage of thermal transfer material (e.g. greases and pastes)  Heat sink attached to the module top side, with electrically insulated / high thermal conductivity adhesive  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete via stack down to main ground layer
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 96 of 116 2.4 Antenna guidelines Antenna characteristics are essential for good functionality of the module.  Antenna radiating performance has direct impact on the reliability of connections over the Air Interface. A bad termination of ANT can result in poor performance of the module. The following parameters should be checked:  Item Recommendations  Impedance 50 Ω nominal characteristic impedance  Frequency Range Depends on the LISA-U1/LISA-H1 series module version and on the Mobile Network used. LISA-U100/U120/H100: - GSM 850: 824..894 MHz = UMTS B5: 824..894 MHz - GSM 1900: 1850..1990 MHz = UMTS B2: 1850..1990 MHz LISA-U110/U130/H110: - GSM 900: 880..960 MHz = UMTS B8: 880..960 MHz - GSM 1800: 1710..1880 MHz - UMTS B1: 1920..2170 MHz  Input Power >2 W peak  V.S.W.R <2:1 recommended, <3:1 acceptable  Return Loss S11<-10 dB recommended, S11<-6 dB acceptable  Gain <3 dBi Table 35: General recommendation for GSM antenna  To preserve the original u-blox FCC ID antenna gain shall remain below 3 dBi.  Please  note  that  some  2G  and  3G  bands  are  overlapping.  This  depends  on  worldwide  band  allocation  for telephony services, where different bands are deployed for different geographical regions.  If  the  LISA-U110/U130  modules  are  planned  for  use  on  the  entire  supported  bands,  then  a  tri-band  antenna (880..960  MHz,  1710..1880  MHz,  1920..2170  MHz)  should  be  selected.  If  the  LISA-U100/U120  modules  are planned for  use  on the  entire  supported bands, then  a  dual-band antenna  (824..894 MHz, 1850..1990  MHz) should be selected. Otherwise, for fixed applications in specific geographical region, antenna requirements can be relaxed for non-deployed frequency bands.  GSM antennas are typically available as:  Linear  monopole:  typical  for  fixed  applications.  The  antenna  extends  mostly  as  a  linear  element  with  a dimension comparable to lambda/4 of the lowest frequency of the operating band. Magnetic base may be available.  Cable  or  direct  RF  connectors  are  common  options.  The  integration  normally  requires  the fulfillment of some minimum guidelines suggested by antenna manufacturer  Patch-like antenna: better suited for integration in compact designs (e.g. mobile phone).  These are mostly custom  designs where the  exact definition  of  the  PCB  and product  mechanical design is  fundamental  for tuning of antenna characteristics For integration observe these recommendations:  Ensure 50 Ω antenna termination, minimize the  V.S.W.R. or return loss, as this will optimize the electrical performance of the module. See section 2.4.1  Select antenna with best radiating performance. See section 2.4.2  If a cable is used to connect the antenna radiating element to application board, select a short cable with minimum insertion loss. The higher the additional insertion loss due to low quality or long cable, the lower the connectivity  Follow the recommendations of the antenna manufacturer for correct installation and deployment  Do not include antenna within closed metal case
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 97 of 116  Do not place antenna in close vicinity to end user since the emitted radiation in human tissue is limited by S.A.R. regulatory requirements  Do not use directivity antenna since the electromagnetic field radiation intensity is limited in some countries  Take care of interaction between co-located RF systems since the GSM transmitted power may interact or disturb the performance of companion systems  Place  antenna  far  from  sensitive  analog  systems  or  employ  countermeasures  to  reduce  electromagnetic compatibility issues that may arise 2.4.1 Antenna termination The  LISA-U1/LISA-H1  series  modules  are  designed  to  work  on  a  50    load.  However,  real  antennas  have  no perfect  50    load  on  all  the  supported  frequency  bands.  Therefore,  in  order  to  as  much  as  possible  reduce performance degradation due to antenna mismatch, the following requirements should be met: Measure the antenna termination with a network analyzer: connect the antenna through a coaxial cable to the measurement device, the |S11| indicates which portion of the power is delivered to antenna and which portion is reflected by the antenna back to the module output. A  good  antenna  should  have  an  |S11|  below  -10  dB  over  the  entire  frequency  band.  Due  to  miniaturization, mechanical constraints and other design issues, this value will not be achieved. An |S11| value of about -6 dB - (in the worst case) - is acceptable. Figure 54 shows an example of this measurement:  Figure 54: |S11| sample measurement of a penta-band antenna that covers in a small form factor the 4 GSM bands (850 MHz, 900 MHz, 1800 MHz and 1900 MHz) and the UMTS Band I Figure 55 shows comparable measurements performed on a wideband antenna. The termination is better, but the size of the antenna is considerably larger.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 98 of 116  Figure 55: |S11| sample measurement of a wideband antenna 2.4.2 Antenna radiation An indication of the antenna’s radiated power can be approximated by measuring the |S21| from a target antenna to  the  measurement  antenna,  using  a  network  analyzer  with  a  wideband  antenna.  Measurements  should  be done at a fixed distance and orientation, and results compared to measurements performed on a known good antenna.  Figure  56  through  Figure  57  show  measurement  results.  A  wideband  log  periodic-like  antenna  was used, and the comparison was done with a half lambda dipole tuned at 900 MHz frequency. The measurements show both the |S11| and |S21| for the penta-band internal antenna and for the wideband antenna.     Figure 56: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole (green/purple) and a penta-band internal antenna (yellow/cyan) The  half  lambda  dipole  tuned  at  900  MHz  is  known  and  has  good  radiation  performance  (both  for  gain  and directivity). Then, by comparing the |S21| measurement with antenna under investigation for the frequency where the half dipole is tuned (e.g. marker 3 in Figure 56) it is possible to make a judgment on the antenna under test: if the performance is similar then the target antenna is good.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 99 of 116  Figure  57:  |S11|  and  |S21|  comparison  between  a  900  MHz  tuned  half  wavelength  dipole  (green/purple)  and  a  wideband commercial antenna (yellow/cyan) Instead if |S21| values for the tuned dipole are much better than the antenna under evaluation (like for marker 1/2 area of Figure 57, where dipole is 5 dB better), then it can be argued that the radiation of the target antenna (the wideband dipole in this case) is considerably less. The same procedure should be repeated on other bands with half wavelength dipole re-tuned to the band under investigation.   For good antenna radiation performance, antenna dimensions should be comparable to a quarter of the wavelength. Different antenna types can be used for the module, many of them (e.g. patch antennas, monopole)  are  based  on  a  resonating  element  that  works  in  combination  with  a  ground  plane.  The ground  plane,  ideally  infinite,  can  be  reduced  down  to  a  minimum  size  that  must  be  similar  to  one quarter  of  the  wavelength  of  the  minimum  frequency  that  has  to  be  radiated  (transmitted/received). Numerical sample: frequency = 1 GHz  wavelength = 30 cm  minimum ground plane (or antenna size) = 7.5 cm. Below this size, the antenna efficiency is reduced.  2.4.3 Antenna detection functionality The internal antenna detect circuit is based on ADC measurement at ANT: the RF port is DC coupled to the ADC unit in the baseband chip which injects a DC current (10 µA for 128 µs) on ANT and measures the resulting DC voltage to evaluate the resistance from ANT pad to GND. The antenna detection is forced by the +UANTR AT command: refer to the u-blox AT Commands Manual [2] for more details on how to access this feature. To achieve antenna detection functionality, use an RF antenna with built-in resistor from ANT signal to GND, or implement  an  equivalent  solution  with  a  circuit  between  the  antenna  cable  connection  and  the  radiating element as shown in Figure 58.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 100 of 116 Application Board Antenna AssemblyDiagnostic CircuitLISA-U1/LISA-H1 seriesADCCurrent SourceRF ChokeDC BlockingFront-End RF ModuleRF ChokeDC BlockingRadiating ElementZo=50 ΩResistor for DiagnosticCoaxial Antenna CableANT Figure 58: Antenna detection circuit and antenna with diagnostic resistor Examples of components for the antenna detection diagnostic circuit are reported in the following table:  Description Part Number - Manufacturer DC Blocking Capacitor  Murata GRM1555C1H220JA01 or equivalent RF Choke Inductor Murata LQG15HS68NJ02, LQG15HH68NJ02 or equivalent (Self Resonance Frequency ~1GHz) Resistor for Diagnostic  15 k 5%, various Manufacturers Table 36: Example of components for the antenna detection diagnostic circuit Please note that the DC impedance at RF port for some antennas may be a DC open (e.g. linear monopole) or a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of  Figure 58, the measured DC resistance will always be at the limits of the measurement range (respectively open or short), and  there  will  be  no  mean  to  distinguish  between  a  defect  on  antenna  path  with  similar  characteristics (respectively: removal of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.  It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 kΩ to 30 kΩ to assure good antenna detection functionality and to avoid a reduction of module RF performance. The choke  inductor  should  exhibit  a  parallel  Self  Resonance  Frequency  (SRF)  in  the  range  of  1  GHz  to improve the RF isolation of load resistor.  For example: Consider a GSM antenna with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from ANT connector to GND:
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 101 of 116  Reported values  close  to the  used diagnostic resistor  nominal  value (i.e. values  from  13  kΩ  to  17 kΩ  if a 15 kΩ diagnostic resistor is used) indicate that the antenna is properly connected  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  kΩ)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [2]) means that that the antenna is not connected or the RF cable is broken  Reported  values  below  the  measurement  range  minimum  limit  (1  kΩ)  will  highlight  a  short  to  GND  at antenna or along the RF cable  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 102 of 116 2.5 ESD immunity test precautions The immunity to the  EMS phenomenon Electrostatic Discharge  of  the device (i.e. the application board  where the LISA-U1/LISA-H1 series module is mounted) must be certified complying the testing requirements standard [10] and the requirements for radio and digital cellular radio telecommunications system equipments standards [11] [12]. The ESD test is performed at the enclosure port [11] referred as the physical boundary through which EM field radiates.  If  the  device implements an  integral  antenna  [11] the  enclosure  is  intended  as  all  insulating  surfaces housing  the  device.  If  the  device  implements  a  removable  antenna  [11]  the  enclosure  port  is  limited  to  the antenna  port  [11]  hence  the  enclosure  port  comprises  the  antenna  element  and  its  interconnecting  cable surfaces. The applicability of the ESD test depends to the device classification [11], as well the test on other ports [11] or on interconnecting cables to auxiliary equipments depends to the device accessible interfaces and manufacturer requirements. Contact  discharges  [10]  are  performed  at  conductive  surfaces  whereas  air  discharges  [10]  are  performed  at insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes [10].  Some precautions should be implemented as described in the following sections in order to satisfy ESD immunity test requirements [10] [11] [12] performed at device enclosure complying the category level [11] and shown in the following table.  Category Immunity Level Contact Discharge to coupling planes (indirect contact discharge) +2 kV / -2 kV +4 kV / -4 kV Contact Discharges to conducted surfaces (direct contact discharge) Not Applicable2* Air Discharge at insulating surfaces +2 kV / -2 kV +4 kV / -4 kV +8 kV / -8 kV Table 37: Enclosure ESD immunity level, standards “EN 61000-4-2, EN 301 489-1 V1.8.1, EN 301 489-7 V1.3.1”  2.5.1 General precautions The  following  module  interfaces  could  be  involved  in  the  ESD  immunity  test  criticality  depending  on  the application board handling. Some precautions are herein suggested.  Sensitive interface is the reset line (RESET_N pin):  A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470JA01) have to be mounted on the line termination connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board  A series ferrite bead (e.g. Murata BLM15HD182SN1) must be added on the line connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board                                                       2 LISA mounted on application reference design: Applicability -> EUT with insulating surfaces, air discharges on interconnecting cables between EUT and antenna and auxiliary equipments Not Applicability -> EUT with conductive surface, direct contact discharge
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 103 of 116  It is recommended to keep the connection line to RESET_N as short as possible  LISA-U1/LISA-H1 series2V_BCKP22 RESET_NReset     push buttonESDOpen Drain OutputApplication ProcessorLISA-U1/LISA-H1 series2V_BCKP22 RESET_NRintRintFB1C1FB2C2 Figure 59: RESET_N application circuits for ESD immunity test Reference Description Remarks ESD Varistor for ESD protection. CT0402S14AHSG - EPCOS C1, C2 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata FB1, FB2 Chip Ferrite Bead for Noise/EMI Suppression BLM15HD182SN1 - Murata Rint 10 kΩ Resistor 0402 5% 0.1 W Internal pull-up resistor Table 38: Example of components as ESD immunity test precautions for the RESET_N line  Sensitive interface is the SIM interface (VSIM pin, SIM_RST pin, SIM_IO pin, SIM_CLK pin):  A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470J) have to be mounted on the lines connected to VSIM, SIM_RST, SIM_IO and SIM_CLK to assure SIM interface functionality when an electrostatic discharge is applied to the application board  It is suggested to use as short as possible connection lines at SIM pins  2.5.2 Antenna interface precautions The antenna interface ANT could be involved in the ESD immunity test criticality depending on the application board handling. Antenna precaution is herein suggested.   If the device implements an embedded antenna and the device insulating enclosure avoids air discharge up to +8 kV / -8 kV to the antenna interface, no further precautions to ESD immunity test should be needed  If the device implements an external antenna and the antenna and its connecting cable are provided with  a completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces, no further precautions to ESD immunity test should be needed
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Design-In      Page 104 of 116  If the device implements an external antenna and the antenna or its connecting cable are not provided with completely insulating enclosure to avoid air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces, precautions to ESD immunity test should be implemented on the application board  A higher protection level is required at the ANT port if the line is externally accessible on the application board.  2.5.3 Module interfaces precautions All  the  module  pins  that  are  externally  accessible  should  be  included  in  the  ESD  immunity  test  since  they  are considered to be a port [11]. Depending on applicability, and in order to satisfy ESD immunity test requirements and ESD category level, pins connected to the port should be protected up to +4 kV /  -4 kV for direct Contact Discharge, and up to +8 kV / -8 kV for Air Discharge applied to the enclosure. The  maximum ESD  rating of all  the pins of  the module,  except the  ANT  pin, is 1  kV (HBM according  MIL-Std 883D, method 3015.7, EOS/ESD Standard S5.1-1993). A higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array).
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Handling and soldering      Page 105 of 116 3 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  3.1 Packaging, shipping, storage and moisture preconditioning For  information  pertaining  to  reels  and  tapes,  Moisture  Sensitivity  levels  (MSD),  shipment  and  storage information, as well as drying for preconditioning see the LISA-U1/LISA-H1 series Data Sheet [1]. The LISA-U1/LISA-H1 series modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  3.2 Soldering  3.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217°C Stencil Thickness:  120 µm for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.2.2   The  quality  of  the  solder  joints  on  the  connectors  (’half  vias’)  should  meet  the  appropriate  IPC specification.  3.2.2 Reflow soldering A  convection  type-soldering  oven  is  strongly  recommended  over  the  infrared  type  radiation  oven. Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be  heated  up  evenly, regardless of material properties, thickness of components and surface color. Consider  the  "IPC-7530  Guidelines  for  temperature  profiling  for  mass  soldering  (reflow  and  wave)  processes, published 2001". Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this preheat phase will not replace prior baking procedures.  Temperature rise rate: max 3°C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated. Conversely,  if  performed  excessively,  fine  balls and  large balls will be generated in clusters.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Handling and soldering      Page 106 of 116  End Temperature: 150 - 200°C  If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump of the paste could become worse.  Limit time above 217°C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245°C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4°C / s   To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  final  soldering  temperature  chosen  at  the  factory  depends  on  additional  external  factors  like  choice  of soldering  paste,  size,  thickness  and  properties  of  the  base  board,  etc.  Exceeding  the  maximum  soldering temperature in the recommended soldering profile may permanently damage the module. Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50050 100 150 200 250 300Elapsed time [s] Figure 60: Recommended soldering profile  When  soldering  lead-free  LISA-U1/LISA-H1  series  modules  in  a  leaded  process,  check  the  following temperatures: PB- Technology Soaktime:   40-80 s Time above Liquidus:   40-90 s Peak temperature:     225-235°C  LISA-U1/LISA-H1 series modules must not be soldered with a damp heat process.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Handling and soldering      Page 107 of 116 3.2.3 Optical inspection After  soldering  the  LISA-U1/LISA-H1  series  modules,  inspect  the  modules  optically  to  verify  that  he  module  is properly aligned and centered. 3.2.4 Cleaning Cleaning  the  soldered  modules  is  not  recommended.  Residues  underneath  the  modules  cannot  be  easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol or other  organic solvents can result in soldering flux  residues flooding  into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. 3.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LISA-U1/LISA-H1 series module populated on  it.  The  reason  for  this  is  the  risk  of  the  module  falling  off  due  to high  weight  in  relation  to  the  adhesive properties of the solder. 3.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with LISA-U1/LISA-H1 series modules. 3.2.7 Hand soldering Hand soldering is not recommended. 3.2.8 Rework The LISA-U1/LISA-H1 series modules can be unsoldered from the baseboard using a hot air gun.  Avoid overheating the module. After the module is removed, clean the pads before placing.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such actions immediately terminate the warranty.  3.2.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These  materials affect the HF properties of the  LISA-U1/LISA-H1 series  modules  and  it is  important to  prevent them from flowing into the module.  The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Handling and soldering      Page 108 of 116 3.2.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the LISA-U1/LISA-H1 series modules before implementing this in the production.  Casting will void the warranty. 3.2.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox gives no warranty for damages to the LISA-U1/LISA-H1 series modules caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers. 3.2.12 Use of ultrasonic processes Some  components  on  the  LISA-U1/LISA-H1  series  modules  are  sensitive  to  Ultrasonic  Waves.  Use  of  any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox  gives  no  warranty  against  damages  to  the  LISA-U1/LISA-H1  series  modules  caused  by  any Ultrasonic Processes.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Product Testing      Page 109 of 116 4 Product Testing 4.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following measurements are done:  Digital self-test (Software Download, verification of FLASH firmware, etc.)  Measurement of voltages and currents  Measurement of RF characteristics   Figure 61: Automatic test equipment for module tests 4.2 Test parameters for OEM manufacturer  The chapter will be completed in the next releases.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Appendix      Page 110 of 116 Appendix A Extra Features A.1 TCP/IP Via  the  AT  commands  it’s  possible  to  access  the  TCP/IP  functionalities  over  the  GPRS  connection.  For  more details about AT commands see the u-blox AT Commands Manual [2]. A.1.1 Multiple IP addresses and sockets Using LISA’s embedded TCP/IP or UDP/IP stack, only 1 IP instance (address) is supported. The IP instance supports up  to  16  sockets.  Using  an  external  TCP/IP  stack  (on  the  application  processor),  it  is  possible  to  have  2  IP instances (addresses). A.2 FTP LISA-U1/LISA-H1 series modules will support this feature in the upcoming version. A.3 FTPS LISA-U1/LISA-H1 series modules will support this feature in the upcoming version. A.4 HTTP LISA-U1/LISA-H1 series modules will support this feature in the upcoming version. A.5 HTTPS LISA-U1/LISA-H1 series modules will support this feature in the upcoming version. A.6 SMTP LISA-U1/LISA-H1 series modules will support this feature in the upcoming version. A.7 AssistNow clients and GPS integration For customers using u-blox GPS receivers, LISA-U1/LISA-H1 series modules feature embedded AssistNow Online and AssistNow  Offline  clients.  AssistNow  A-GPS  provides  better  GPS  performance and faster Time-To-First-Fix. The clients can be enabled / disabled with an AT command. LISA-U1/LISA-H1  series  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no additional requirements for resources or software integration on an external host micro controller. Full access to u-blox GPS receivers is available via the LISA-U1/LISA-H1 series, through a dedicated DDC (I2C) interface, while the  available  GPIOs  can  handle  the  GPS  device  power  on/off.  This  means  that  GSM/EDGE  and  GPS  can  be controlled through a single serial port from any host processor. A.8 In-Band modem (LISA-U130 only) LISA-U130 Automotive grade version implements the in-Band modem solution for eCall according to the 3GPP TS 26.267 specification [13]. According to the eCall (Pan-European automatic in-vehicle emergency call system) specification,  an  eCall must be  generated  automatically  or  manually  following  an  car  accident  using  GSM  cellular  service  “112”.  When activated, the in-vehicle eCall system (IVS) creates an emergency call carrying both voice and data (e.g. vehicle GPS position) directly to the nearest 112 Public Safety Answering Point (PSAP) to quickly decide upon detaching rescue services to the known position.
    LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Appendix      Page 111 of 116  Figure 62: In-Band modem diagram flow In-band modem allows the fast and reliable transmission of vehicle Minimum Set of Data (MSD - 140 bytes) and the  establishment  of  a  voice  emergency  call  using  the  same  physical  channel  (voice  channel)  without  any modifications of the existing cellular network architecture. In-Band modem is a mandatory feature to meet the eCall requirements and to develop in vehicle devices fully supporting eCall. The in-Band modem functionality is delivered upon request. A.9 Smart temperature supervision An internal sensor is used to constantly monitor the board temperature of the LISA-U1/LISA-H1 series modules. The measured value is compared with the internally predefined thresholds and it proceeds accordingly. A warning notification is reported by the module when the temperature value is still inside the valid range (i.e. the module is still in a valid and good working condition) but it is close to the limit (upper or lower). A  shutdown  is  notified  and  automatically  forced  by  the  module  when  the  temperature  value  is  outside  the specified  range  (i.e.  the  module  is  in  a  dangerous  working  condition).  For  security  reasons  the  shutdown  is suspended in case of emergency call in progress: in this case the device will switch off at call termination. The Smart Temperature Supervisor feature can be enabled or disabled through an AT command (for more details please to u-blox AT commands manual [2], +USTS AT command). If the feature is disabled there is no embedded protection against not allowed temperature working conditions.   The sensor measures board temperature inside the shields, which can differ from ambient temperature.
LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Appendix      Page 112 of 116 B Glossary ADC Analog to Digital Converter AP Application Processor AT AT Command Interpreter Software Subsystem, or attention CBCH Cell Broadcast Channel CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC Direct Current  DCD Data Carrier Detect DCE Data Communication Equipment DCS Digital Cellular System DDC Display Data Channel DSP Digital Signal Processing DSR Data Set Ready DTE Data Terminal Equipment DTM Dual Transfer Mode DTR Data Terminal Ready  EBU External Bus Interface Unit EDGE Enhanced Data rates for GSM Evolution E-GPRS Enhanced GPRS FDD Frequency Division Duplex FEM Front End Module FOAT Firmware Over AT commands FTP File Transfer Protocol FTPS FTP Secure GND Ground GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication HF Hands-free HSDPA High Speed Downlink Packet Access HTTP HyperText Transfer Protocol  HTTPS Hypertext Transfer Protocol over Secure Socket Layer HW Hardware I/Q In phase and Quadrature I2C Inter-Integrated Circuit I2S Inter IC Sound IP Internet Protocol IPC Inter Processor Communication LNA Low Noise Amplifier
LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Appendix      Page 113 of 116 MCS Modulation Coding Scheme  NOM Network Operating Mode PA Power Amplifier PBCCH Packet Broadcast Control Channel  PCM Pulse Code Modulation PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit RF Radio Frequency RI Ring Indicator RTC Real Time Clock RTS Request To Send RXD RX Data SAW Surface Acoustic Wave SIM Subscriber Identification Module SMS Short Message Service SMTP Simple Mail Transfer Protocol SPI Serial Peripheral Interface SRAM Static RAM TCP Transmission Control Protocol TDMA Time Division Multiple Access  TXD TX Data UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UMTS Universal Mobile Telecommunications System USB Universal Serial Bus UTRA UMTS Terrestrial Radio Access  VC-TCXO Voltage Controlled - Temperature Compensated Crystal Oscillator WCDMA Wideband CODE Division Multiple Access
LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Related documents      Page 114 of 116 Related documents [1] u-blox LISA-U1/LISA-H1 series Data Sheet, Docu No 3G.G1-HW-10001 [2] u-blox AT Commands Manual, Docu No WLS-SW-11000 [3] ITU-T Recommendation V.24, 02-2000. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE).  http://www.itu.int/rec/T-REC-V.24-200002-I/en [4] 3GPP TS 27.007 - AT command set for User Equipment (UE) (Release 1999) [5] 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) (Release 1999) [6] 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999) [7] Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/  [8] I2C-Bus Specification Version 2.1 Philips Semiconductors (January 2000), http://www.nxp.com/acrobat_download/literature/9398/39340011_21.pdf [9] RFC3267 - Real-Time Transport Protocol (RTP) Payload Format and File Storage, Format for the Adaptive Multi-Rate (AMR) and Adaptive Multi-Rate Wideband (AMR-WB) Audio Codecs [10] CENELEC  EN  61000-4-2  (2001):  "Electromagnetic  compatibility  (EMC)  -  Part  4-2:  Testing  and measurement techniques - Electrostatic discharge immunity test". [11] ETSI  EN  301  489-1  V1.8.1:  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  1:  Common technical requirements” [12] ETSI  EN  301  489-7  V1.3.1  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  7:  Specific conditions  for  mobile  and  portable  radio  and  ancillary  equipment  of  digital  cellular  radio telecommunications systems (GSM and DCS)“ [13] 3GPP TS 26.267 - Technical Specification Group Services and System Aspects; eCall Data Transfer; In-band modem solution; General description (Release 9) [15] GSM Mux Implementation Application Note, Docu No WLS-CS-11002 [17] Firmware Update Application Note, Docu No WLS-CS-11001 [18] SPI Interface application Note, Docu No 3G.G2-CS-11000  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com).  Revision history Revision Date Name Status / Comments - 21/10/2010 sses Initial Release 1 11/01/2011 sses Thickness information added GPIO description improved 2 26/04/2011 lpah Update to Advance Information status     and paste mask
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LISA-U1/LISA-H1 series - System Integration Manual 3G.G2-HW-10002-2  Advance Information  Contact      Page 116 of 116 Contact For complete contact information visit us at www.u-blox.com  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 (703) 483 3180 E-mail:  info_us@u-blox.com  Regional Office West Coast: Phone:  +1 (703) 483 3184 E-mail:  info_us@u-blox.com Technical Support: Phone:  +1 (703) 483 3185 E-mail:  support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com  Support:   support @u-blox.com   Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com  Regional Office China: Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office Japan: Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com  Support:  support_jp@u-blox.com  Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com       and paste mask   and paste mask

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