u blox LISAU201 3.75G HSPA Wireless Module User Manual LISA U2 series

u-blox AG 3.75G HSPA Wireless Module LISA U2 series

Contents

Installation Instructions

    LISA-U2 series 3.75G HSPA / HSPA+ Cellular Modules System Integration Manual                   Abstract This document describes the features and the system integration of LISA-U2 series HSPA+ cellular modules. These  modules  are  complete  and  cost  efficient  3.75G  solutions offering up to six-band HSDPA/HSUPA and quad-band GSM/EGPRS voice and/or data transmission technology in a compact form factor.  www.u-blox.com UBX-13001118 - R19
LISA-U2 series - System Integration Manual   UBX-13001118 - R19    Page 2 of 175  Document Information Title LISA-U2 series Subtitle 3.75G HSPA / HSPA+ Cellular Modules  Document type System Integration Manual  Document number UBX-13001118 Revision, date R19 09-Sep-2015 Document status Early Production Information   Document status explanation Objective Specification Document contains target values. Revised and supplementary data will be published later. Advance Information Document contains data based on early testing. Revised and supplementary data will be published later. Early Production Information Document contains data from product verification. Revised and supplementary data may be published later. Production Information Document contains the final product specification.  This document applies to the following products: Product name Type number Modem version Application version PCN / IN LISA-U200 LISA-U200-01S-00 22.40  UBX-TN-12040  LISA-U200-02S-00 22.90  UBX-13003492  LISA-U200-03S-00 23.41 A01.01 UBX-15020745  LISA-U200-52S-00 22.86  UBX-13004628  LISA-U200-62S-00 22.90  UBX-13003492 LISA-U200 FOTA LISA-U200-82S-00 22.92  UBX-13004629  LISA-U200-83S-00 23.41 A01.01 UBX-15020745 LISA-U201 LISA-U201-03S-00 23.41 A01.01 UBX-15020745 LISA-U230 LISA-U230-01S-00 22.40  UBX-TN-12040 LISA-U260 LISA-U260-01S-00 22.61  UBX-TN-12061  LISA-U260-02S-00 22.90  UBX-13003492 LISA-U270 LISA-U270-01S-00 22.61  UBX-TN-12061  LISA-U270-02S-00 22.90  UBX-13003492  LISA-U270-62S-00 22.90  UBX-13003492  LISA-U270-68S-00 22.93 A01.03 UBX-15019240      u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited. The information  contained  herein  is provided  “as  is”  and  u-blox  assumes no  liability  for the  use  of  the  information. No  warranty,  either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.  Copyright © 2015, u-blox AG. u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in the EU and other countries.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Preface      Page 3 of 175 Preface How to use this Manual The LISA-U2 series System Integration Manual provides the necessary information to successfully design in and configure these u-blox cellular modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT  Commands  Manual:  This  document  provides  the  description  of  the  supported  AT  commands  by  the  LISA-U2 modules to verify all implemented functionalities. System  Integration  Manual: This Manual provides hardware design instructions and information on how to set up production and final product tests. Application  Note:  document  provides  general  design  instructions  and  information  that  applies  to  all  u-blox Cellular modules. See Related documents for a list of Application Notes related to your Cellular Module.  Questions If you have any questions about u-blox Cellular Integration, please:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com  Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com  Technical Support Worldwide Web Our  website  (www.u-blox.com)  is  a  rich  pool  of  information.  Product  information,  technical  documents  and helpful FAQ can be accessed 24h a day. By E-mail Contact  the  closest  Technical  Support  office  by  email.  Use  our  service  pool  email  addresses  rather  than  any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support, have the following information ready:  Module type (e.g. LISA-U200) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Contents      Page 4 of 175 Contents Preface ........................................................................................................................................... 3 Contents ........................................................................................................................................ 4 1 System description .................................................................................................................. 7 1.1 Overview .............................................................................................................................................................. 7 1.2 Architecture.......................................................................................................................................................... 9 1.2.1 Functional blocks .......................................................................................................................................... 9 1.3 Pin-out ............................................................................................................................................................... 11 1.4 Operating modes ................................................................................................................................................ 15 1.5 Power management ........................................................................................................................................... 17 1.5.1 Power supply circuit overview ..................................................................................................................... 17 1.5.2 Module supply (VCC) .................................................................................................................................. 18 1.5.3 Current consumption profiles ...................................................................................................................... 27 1.5.4 RTC Supply (V_BCKP) .................................................................................................................................. 32 1.5.5 Interface supply (V_INT) .............................................................................................................................. 35 1.6 System functions ................................................................................................................................................ 36 1.6.1 Module power-on ....................................................................................................................................... 36 1.6.2 Module power-off ...................................................................................................................................... 40 1.6.3 Module reset .............................................................................................................................................. 42 1.7 RF connection ..................................................................................................................................................... 44 1.8 (U)SIM interface .................................................................................................................................................. 45 1.8.1 (U)SIM application circuits ........................................................................................................................... 46 1.9 Serial communication ......................................................................................................................................... 52 1.9.1 Serial interfaces configuration ..................................................................................................................... 53 1.9.2 Asynchronous serial interface (UART) .......................................................................................................... 54 1.9.3 USB interface .............................................................................................................................................. 73 1.9.4 SPI interface ................................................................................................................................................ 78 1.9.5 MUX Protocol (3GPP 27.010) ...................................................................................................................... 83 1.10 DDC (I2C) interface .............................................................................................................................................. 84 1.10.1 Overview .................................................................................................................................................... 84 1.10.2 DDC application circuits .............................................................................................................................. 84 1.11 Audio Interface ................................................................................................................................................... 89 1.11.1 I2S interface - PCM mode ............................................................................................................................ 90 1.11.2 I2S interface - Normal I2S mode .................................................................................................................... 91 1.11.3 I2S interface application circuits ................................................................................................................... 91 1.11.4 Voiceband processing system ...................................................................................................................... 94 1.12 General Purpose Input/Output (GPIO) .................................................................................................................. 96 1.13 Reserved pins (RSVD) ........................................................................................................................................ 103 1.14 Schematic for LISA-U2 module integration ........................................................................................................ 104 1.15 Approvals ......................................................................................................................................................... 105 1.15.1 R&TTED and European Conformance CE mark .......................................................................................... 106 1.15.2 US Federal Communications Commission notice ....................................................................................... 106 1.15.3 Industry Canada notice ............................................................................................................................. 108 1.15.4 ACMA Certification .................................................................................................................................. 110
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Contents      Page 5 of 175 1.15.5 ICASA Certification ................................................................................................................................... 110 1.15.6 KCC Certification ...................................................................................................................................... 111 1.15.7 Anatel Certification ................................................................................................................................... 111 1.15.8 CCC Certification ..................................................................................................................................... 112 1.15.9 TELEC / JATE Certification ......................................................................................................................... 112 2 Design-In ............................................................................................................................. 113 2.1 Design-in checklist ............................................................................................................................................ 113 2.1.1 Schematic checklist ................................................................................................................................... 113 2.1.2 Layout checklist ........................................................................................................................................ 114 2.1.3 Antenna checklist ..................................................................................................................................... 114 2.2 Design Guidelines for Layout............................................................................................................................. 115 2.2.1 Layout guidelines per pin function ............................................................................................................ 115 2.2.2 Footprint and paste mask.......................................................................................................................... 124 2.2.3 Placement ................................................................................................................................................. 125 2.3 Thermal guidelines ............................................................................................................................................ 126 2.4 Antenna guidelines ........................................................................................................................................... 128 2.4.1 Antenna termination ................................................................................................................................ 130 2.4.2 Antenna radiation ..................................................................................................................................... 131 2.4.3 Examples of antennas ............................................................................................................................... 132 2.4.4 Antenna detection functionality ................................................................................................................ 134 2.5 ESD guidelines .................................................................................................................................................. 135 2.5.1 ESD immunity test overview ...................................................................................................................... 135 2.5.2 ESD immunity test of u-blox LISA-U2 series reference designs .................................................................... 136 2.5.3 ESD application circuits ............................................................................................................................. 137 3 Features description ........................................................................................................... 140 3.1 Network indication ........................................................................................................................................... 140 3.2 Antenna detection ............................................................................................................................................ 140 3.3 Jamming Detection ........................................................................................................................................... 140 3.4 TCP/IP and UDP/IP ............................................................................................................................................. 141 3.4.1 Multiple PDP contexts and sockets ............................................................................................................ 141 3.5 FTP ................................................................................................................................................................... 141 3.6 HTTP ................................................................................................................................................................ 141 3.7 SSL/TLS ............................................................................................................................................................. 142 3.8 Dual stack IPv4/IPv6 .......................................................................................................................................... 143 3.9 AssistNow clients and GNSS integration ............................................................................................................ 144 3.10 Hybrid positioning and CellLocate® .................................................................................................................... 144 3.10.1 Positioning through cellular information: CellLocate® ................................................................................. 144 3.10.2 Hybrid positioning .................................................................................................................................... 146 3.11 Control Plane Aiding / Location Services (LCS) ................................................................................................... 146 3.12 Firmware (upgrade) Over AT (FOAT) .................................................................................................................. 146 3.12.1 Overview .................................................................................................................................................. 146 3.12.2 FOAT procedure ....................................................................................................................................... 147 3.13 In-Band modem (eCall / ERA-GLONASS) ............................................................................................................ 147 3.14 SIM Access Profile (SAP) .................................................................................................................................... 147 3.15 Smart Temperature Management ..................................................................................................................... 149 3.15.1 Smart Temperature Supervisor (STS) .......................................................................................................... 149
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Contents      Page 6 of 175 3.15.2 Threshold Definitions ................................................................................................................................ 151 3.16 Bearer Independent Protocol ............................................................................................................................. 151 3.17 Multi-Level Precedence and Pre-emption Service ............................................................................................... 151 3.18 Network Friendly Mode .................................................................................................................................... 152 3.19 Power saving .................................................................................................................................................... 152 4 Handling and soldering ...................................................................................................... 153 4.1 Packaging, shipping, storage and moisture preconditioning .............................................................................. 153 4.2 Soldering .......................................................................................................................................................... 153 4.2.1 Soldering paste ......................................................................................................................................... 153 4.2.2 Reflow soldering ....................................................................................................................................... 153 4.2.3 Optical inspection ..................................................................................................................................... 155 4.2.4 Cleaning ................................................................................................................................................... 155 4.2.5 Repeated reflow soldering ........................................................................................................................ 155 4.2.6 Wave soldering ......................................................................................................................................... 155 4.2.7 Hand soldering ......................................................................................................................................... 155 4.2.8 Rework ..................................................................................................................................................... 155 4.2.9 Conformal coating .................................................................................................................................... 155 4.2.10 Casting ..................................................................................................................................................... 156 4.2.11 Grounding metal covers ............................................................................................................................ 156 4.2.12 Use of ultrasonic processes ....................................................................................................................... 156 5 Product Testing ................................................................................................................... 157 5.1 u-blox in-series production test ......................................................................................................................... 157 5.2 Test parameters for OEM manufacturer ............................................................................................................ 157 5.2.1 ‘Go/No go’ tests for integrated devices...................................................................................................... 158 5.2.2 Functional tests providing RF operation ..................................................................................................... 158 Appendix ................................................................................................................................... 161 A Migration from LISA-U1 to LISA-U2 series ......................................................................... 161 A.1 Checklist for migration ..................................................................................................................................... 161 A.2 Software migration ........................................................................................................................................... 161 A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules ............................................................ 161 A.3 Hardware migration .......................................................................................................................................... 162 A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules .......................................................... 162 A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series ................................................................................. 163 A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series .................................................................................. 170 B Glossary ............................................................................................................................... 171 Related documents .................................................................................................................... 173 Revision history ......................................................................................................................... 174 Contact ....................................................................................................................................... 175
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 7 of 175 1 System description 1.1 Overview LISA-U2  cellular modules integrate full-feature 3G  UMTS/HSxPA and  2G  GSM/GPRS/EDGE protocol  stack  with Assisted  GPS  support.  These  SMT  modules  come  in  the  compact  LISA  form  factor,  featuring  Leadless  Chip Carrier (LCC) packaging technology.  3G UMTS/HSDPA/HSUPA Characteristics 2G GSM/GPRS/EDGE Characteristics Class A User Equipment1 Class B Mobile Station2 UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD)  3GPP Release 7 (HSPA+)   Rx Diversity for LISA-U230 GSM EDGE Radio Access (GERA)  3GPP Release 7   Rx Diversity for LISA-U230 2-band support for LISA-U260:  Band II (1900 MHz), Band V (850 MHz) 2-band support for LISA-U270:  Band I (2100 MHz), Band VIII (900 MHz) 5-band support for LISA-U201:  Band I (2100 MHz), Band II (1900 MHz), Band V (850 MHz), Band VI (800 MHz), Band VIII (900 MHz) 6-band support for LISA-U200 and LISA-U230:  Band I (2100 MHz), Band II (1900 MHz), Band IV (1700 MHz), Band V (850 MHz), Band VI (800 MHz), Band VIII (900 MHz)  4-band support  GSM 850 MHz, E-GSM 900 MHz,  DCS 1800 MHz, PCS 1900 MHz WCDMA/HSDPA/HSUPA Power Class  Power Class 3 (24 dBm) for WCDMA/HSDPA/HSUPA mode GSM/GPRS Power Class  Power Class 4 (33 dBm) for GSM/E-GSM bands  Power Class 1 (30 dBm) for DCS/PCS bands EDGE Power Class  Power Class E2 (27 dBm) for GSM/E-GSM bands  Power Class E2 (26 dBm) for DCS/PCS bands PS (Packet Switched) Data Rate  HSUPA category 6, up to 5.76 Mb/s UL  HSDPA category 8 up to 7.2 Mb/s DL for LISA-U200, LISA-U201, LISA-U260 and LISA-U270  HSDPA category 14 up to 21.1 Mb/s DL for LISA-U230  WCDMA PS data up to 384 kb/s DL/UL PS (Packet Switched) Data Rate  GPRS multislot class 123, coding scheme CS1-CS4,  up to 85.6 kb/s DL/UL   EDGE multislot class 123, coding scheme MCS1-MCS9,  up to 236.8 kb/s DL/UL  CS (Circuit Switched) Data Rate  WCDMA CS data up to 64 kb/s DL/UL CS (Circuit Switched) Data Rate  GSM CS data up to 9.6 kb/s DL/UL  supported in transparent/non transparent mode Table 1: LISA-U2 series UMTS/HSDPA/HSUPA and GSM/GPRS/EDGE characteristics Operation  modes  I  to III  are  supported  on  GSM/GPRS  networks,  with allowing  users  to  define their  preferred service  from  GSM  to  GPRS.  Paging  messages  for  GSM  calls  may  be  monitored  (optional)  during  GPRS  data transfer in non-coordinating NOM II-III.                                                        1 Device  can  work  simultaneously in  Packet  Switch and  Circuit  Switch mode:  voice  calls are  possible  while  the  data  connection  is  active without any interruption in service. 2 Device can  be attached to both GPRS and GSM services (i.e. Packet  Switch and Circuit Switch mode) using one service at  a time. If  for example during data transmission an incoming call occurs, the data connection is suspended to allow the voice communication. Once the voice call has terminated, the data service is resumed. 3 GPRS/EDGE multislot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 8 of 175 3G  Transmission  and  Receiving: LISA-U2 modules implement 3G High-Speed Uplink Packet Access (HSUPA) category  6.  LISA-U200,  LISA-U201,  LISA-U260  and  LISA-U270  modules  implement  3G  High  Speed  Downlink Packet  Access  (HSDPA)  category  8.  LISA-U230  modules  implement  the  3G  HSDPA  category  14.  HSUPA  and HSDPA categories  determine the maximum speed at which  data  can be  respectively transmitted and received. Higher categories allow faster data transfer rates, as indicated in Table 1. The  3G  network  automatically  performs  adaptive  coding  and  modulation  using  a  choice  of  forward  error correction  code  rate  and  choice  of  modulation  type,  to  achieve  the  highest  possible  data  rate  and  data transmission robustness according to the quality of the radio channel.  2G Transmission and Receiving: LISA-U2 series modules implement GPRS/EGPRS multislot class 12. GPRS and EGPRS  multislot  classes determine the  maximum number of  timeslots  available  for upload  and download  and thus the speed at which data can be transmitted and received. Higher classes typically allow faster data transfer rates, as indicated in Table 1.  The 2G network automatically configures the number of timeslots used for reception or transmission (voice calls take precedence over GPRS/EGPRS traffic) and channel encoding (from Coding Scheme 1 up to Modulation and Coding Scheme 9), performing link adaptation to achieve the highest possible data rate. Table 2 summarizes the interfaces and features provided by LISA-U2 modules.  Model UMTS Bands Interfaces Audio Functions Grade  HSUPA [Mb/s] HSDPA [Mb/s] UMTS/HSPA [MHz] GSM/GPRS/EDGE quad-band UART SPI  USB DDC (I2C) GPIO Analog Audio Digital Audio Network indication Antenna detection Jamming detection Embedded TCP/UDP  Embedded FTP, HTTP Embedded SSL/TLS AssistNow software CellLocate® FOTA FW update via serial eCall / ERA-GLONASS Rx diversity GNSS via Modedm Standard Professional Automotive LISA-U200 5.76 7.2 800/850/900 1700/1900/2100 • 1 1 1 1 14  2 • • • • • • • •  • •4  •    LISA-U200 FOTA 5.76 7.2 800/850/900 1700/1900/2100 • 1 1 1 1 14  2 • • • • • • • • • • •  •    LISA-U201 5.76 7.2 800/850/900 1900/2100 • 1 1 1 1 14  2 • • • • • • • •  • •  •    LISA-U230 5.76 21.1 800/850/900 1700/1900/2100 • 1 1 1 1 14  2 • • • • • • • •  •  • •    LISA-U260 5.76 7.2 850/1900 • 1 1 1 1 14  2 • • • • • • • •  • •4  •    LISA-U270 5.76 7.2 900/2100 • 1 1 1 1 14  2 • • • • • • • •  • •4  •    LISA-U200-52S module product version is approved by SKT Korean network operator. LISA-U200-62S module product version is approved by NTT DoCoMo Japanese network operator LISA-U270-62S and LISA-U270-68S modules product versions are approved and locked for SoftBank Japanese network operator. Table 2: LISA-U2 series summary of interfaces and features                                                        4 Not supported by ”01” product version
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 9 of 175 1.2 Architecture WirelessBase-bandProcessorMemoryPower Management Unit26 MHz32.768 kHzANTSwitch & Multi band & mode PADDC (for GNSS)(U)SIM cardUARTSPIUSBGPIO(s)Power onExternal resetV_BCKP (RTC)Vcc (supply)V_INT (I/O)Digital audio (I2S)RFSWITCHRF TransceiverDuplexers& FiltersANT_DIVRFSWITCHFilterBankPA PMUTransceiver PMU Figure 1: LISA-U2 series block diagram (for available options see Table 2)  1.2.1 Functional blocks LISA-U2  modules  consist  of  the  following  internal  functional  blocks:  RF  section,  Baseband  and  Power Management Unit section. LISA-U2 series RF section A shielding box contains the RF high-power signal circuitry, including:  Multimode Single Chain Power Amplifier Module used for 3G HSPA/WCDMA and 2G EDGE/GSM operations  Power Management Unit with integrated DC/DC converter for the Power Amplifier Module The RF antenna pad  (ANT) is  directly  connected to  the  main antenna switch,  which dispatches  the  RF  signals according to the active mode. For time-duplex 2G operation, the incoming signal at the active Receiver (RX) slot is applied by the main antenna switch to the duplexer SAW filter bank for out-of-band rejection and then sent to the  appropriate  receiver  port  of  the  RF  transceiver.  During  the  allocated  Transmitter  (TX)  slots,  the  low  level signal coming from the RF transceiver is enhanced by the power amplifier and then directed to the antenna  pad through the main antenna switch. The 3G transmitter and receiver are active at the same time due to frequency-domain duplex operation. The switch integrated in the  main antenna switch connects the antenna port to the duplexer SAW filter bank which separates the TX and RX signal paths. The duplexer itself provides front-end RF filtering for RX band selection while combining the amplified TX signal coming from the power amplifier. A separated shielding box contains all the other analog RF components, including:  Antenna Switch and duplexer SAW filter bank for main paths  Antenna Switch and SAW filter bank for diversity receiver  Up to six-band HSPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 10 of 175  Power Management Unit with integrated DC/DC converter for the Power Amplifier Module  Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO) While  operating  in  3G  mode,  the  RF  transceiver  performs  direct  up-conversion  and  down-conversion  of  the baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the downlink path, the integrated LNA enhances the RX sensitivity while discrete inter-stage SAW filters additionally improve  the  rejection  of  out-of-band  blockers.  An  internal  programmable  gain  amplifier  optimizes  the  signal levels before delivering to the analog I/Q to baseband for further digital processing. For  2G  operations,  a  constant  gain  direct  conversion  receiver  with  integrated  LNAs  and  highly  linear  RF quadrature demodulator are used to provide the same I/Q signals to the baseband as well. In transmission mode, the up-conversion is implemented by means of a digital sigma-delta transmitter or polar modulator depending on the modulation to be transmitted. The RF antenna pad for the diversity receiver (ANT_DIV) available on LISA-U230 modules is directly connected to the antenna switch for the diversity receiver, which  dispatches  the  incoming  RF signals to  the  dedicated SAW filter bank for out-of-band rejection and then to the diversity receiver port of the RF transceiver. In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.296-4.340 GHz voltage controlled oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation circuits while operating in active mode. LISA-U2 series modulation techniques Modulation techniques related to radio technologies supported by LISA-U2 modules, are listed as follows:  GSM      GMSK  GPRS      GMSK  EDGE      GMSK / 8-PSK  WCDMA      QPSK  HSDPA      QPSK / 16-QAM  HSUPA      QPSK / 16-QAM LISA-U2 series Baseband and Power Management Unit section Another shielding box of LISA-U2 modules includes all the digital circuitry and the power supplies, basically  the following functional blocks:  Cellular baseband processor, a mixed signal ASIC which integrates:  Microprocessor for controller functions, 2G & 3G upper layer software  DSP core for 2G Layer 1 and audio processing  3G coprocessor and HW accelerator for 3G Layer 1 control software and routines  Dedicated HW for interfaces management  Memory system in a Multi-Chip Package (MCP) integrating two devices:  NOR flash non-volatile memory  DDR SRAM volatile memory  Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC  32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or power-off mode
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 11 of 175 1.3 Pin-out Table 3 lists the pin-out of the LISA-U2 modules, with pins grouped by function.  Function Pin Module No I/O Description Remarks Power VCC All 61, 62, 63 I Module supply input Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range. Consider that there are large current spikes in connected mode, when a GSM call is enabled. VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize power loss due to series resistance. See section 1.5.2  GND All 1, 3, 6, 7, 8, 17, 25, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 60, 64, 65, 66, 67, 69, 70, 71, 72, 73, 75, 76 N/A Ground GND pins are internally connected but a good (low impedance) external ground connection can improve RF performance: all GND pins must be externally connected to ground.  V_BCKP All 2 I/O Real Time Clock supply input/output V_BCKP = 1.8 V (typical) generated by the module when VCC supply voltage is within valid operating range. See section 1.5.4  V_INT All 4 O Digital Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. See section 1.5.5  VSIM All 50 O SIM supply output VSIM = 1.80 V typical or 2.90 V typical generated by the module according to the SIM card type. See section 1.8 RF ANT All 68 I/O RF input/output for main Tx/Rx antenna 50  nominal impedance. See section 1.7, section 2.4 and section 2.2.1.1  ANT_DIV LISA-U230 74 I RF input for Rx diversity antenna 50 Ω nominal impedance See section 1.7, section 2.4 and section 2.2.1.1 SIM SIM_IO All 48 I/O SIM data Internal 4.7 k pull-up to VSIM. Must meet SIM specifications. See section 1.8  SIM_CLK All 47 O SIM clock Must meet SIM specifications. See section 1.8  SIM_RST All 49 O SIM reset Must meet SIM specifications. See section 1.8
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 12 of 175 Function Pin Module No I/O Description Remarks SPI SPI_MISO All 57 O SPI Data Line Output Module Output: module runs as an SPI slave. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). Idle high. See section 1.9.4  SPI_MOSI All 56 I SPI Data Line Input Module Input: module runs as an SPI slave. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). Idle high. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.4  SPI_SCLK All 55 I SPI Serial Clock Input Module Input: module runs as an SPI slave. Idle low (CPOL=0). Internal active pull-down to GND enabled. See section 1.9.4  SPI_SRDY All 58 O SPI Slave Ready Output Module Output: module runs as an SPI slave. Idle low. See section 1.9.4  SPI_MRDY All 59 I SPI Master Ready Input Module Input: module runs as an SPI slave. Idle low. Internal active pull- down to GND enabled. See section 1.9.4 DDC SCL All 45 O I2C bus clock line Fixed open drain. External pull-up required. See section 1.10  SDA All 46 I/O I2C bus data line Fixed open drain. External pull-up required. See section 1.10 UART RxD All 16 O UART data output Circuit 104 (RxD) in ITU-T V.24. Provide access to the pin for FW update and debugging if the USB interface is connected to the application processor. See section 1.9.2  TxD All 15 I UART data input Circuit 103 (TxD) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide access to the pin for FW update and debugging if the USB interface is connected to the application processor. See section 1.9.2  CTS All 14 O UART clear to send output Circuit 106 (CTS) in ITU-T V.24. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2  RTS All 13 I UART ready to send input Circuit 105 (RTS) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2  DSR All 9 O UART data set ready output Circuit 107 (DSR) in ITU-T V.24. See section 1.9.2  RI All 10 O UART ring indicator output Circuit 125 (RI) in ITU-T V.24. See section 1.9.2  DTR All 12 I UART data terminal ready input Circuit 108/2 (DTR) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.2  DCD All 11 O UART data carrier detect output Circuit 109 (DCD) in ITU-T V.24. See section 1.9.2
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 13 of 175 Function Pin Module No I/O Description Remarks GPIO GPIO1 All 20 I/O GPIO See section 1.12  GPIO2 All 21 I/O GPIO See section 1.12  GPIO3 All 23 I/O GPIO See section 1.12  GPIO4 All 24 I/O GPIO See section 1.12  GPIO5 All 51 I/O GPIO See section 1.12  GPIO6 All 39 I/O GPIO See section 1.12  GPIO7 All 40 I/O GPIO See section 1.12  GPIO8 All 53 I/O GPIO See section 1.12  GPIO9 All 54 I/O GPIO See section 1.12  GPIO10 All 55 I/O GPIO See section 1.12  GPIO11 All 56 I/O GPIO See section 1.12  GPIO12 All 57 I/O GPIO See section 1.12  GPIO13 All 58 I/O GPIO See section 1.12  GPIO14 All 59 I/O GPIO See section 1.12 USB VUSB_DET All 18 I USB detect input Input for VBUS (5 V typical) USB supply sense to enable USB interface. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3  USB_D- All 26 I/O USB Data Line D- 90 Ω nominal differential impedance (Z0) 30 Ω nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by USB 2.0 specifications [7] are part of the USB pad driver and need not be provided externally. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3  USB_D+ All 27 I/O USB Data Line D+ 90 Ω nominal differential impedance (Z0) 30 Ω nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by USB 2.0 specifications [7] are part of the USB pad driver and need not be provided externally. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3 System PWR_ON All 19 I Power-on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required. See section 1.6.1  RESET_N All 22 I External reset input Internal 10 kΩ pull-up to V_BCKP. See section 1.6.3
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 14 of 175 Function Pin Module No I/O Description Remarks Digital Audio  I2S_CLK All 43 I/O First I2S clock Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S_RXD All 44 I First I2S receive data Internal active pull-down to GND enabled. Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S_TXD All 42 O First I2S transmit data Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S_WA All 41 I/O First I2S word alignment Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S1_CLK All 53 I/O Second I2S clock Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S1_RXD All 39 I Second I2S receive data Internal active pull-down to GND enabled. Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S1_TXD All 40 O Second I2S transmit data Check device specifications to ensure compatibility to module supported modes. See section 1.11.  I2S1_WA All 54 I/O Second I2S word alignment Check device specifications to ensure compatibility to module supported modes. See section 1.11.  CODEC_CLK All 52 O Clock output Digital clock output for external audio codec See section 1.11. Reserved RSVD All 5 N/A RESERVED pin This pin must be connected to ground See section 1.13  RSVD LISA-U200 LISA-U201 LISA-U260 LISA-U270 74 N/A RESERVED pin Do not connect See section 1.13 Table 3: LISA-U2 modules pin definition, grouped by function
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 15 of 175 1.4 Operating modes LISA-U2  series  modules  have  several  operating  modes.  The  operating  modes  are  defined  in  Table  4  and described in details in Table 5, providing general guidelines for operation.  General Status Operating Mode Definition Power-down Not-Powered Mode VCC supply not present or below operating range: module is switched off.  Power-Off Mode VCC supply within operating range and module is switched off. Normal Operation Idle-Mode Module processor core runs with 32 kHz as reference oscillator.  Active-Mode Module processor core runs with 26 MHz as reference oscillator.  Connected-Mode Voice or data call enabled and processor core runs with 26 MHz as reference oscillator. Table 4: Module operating modes definition  Operating Mode Description Transition between operating modes Not-Powered Module is switched off. Application interfaces are not accessible. Internal RTC timer operates only if a valid voltage is applied to V_BCKP pin. When VCC supply is removed, the module enters not-powered mode. When in not-powered mode, the module cannot be switched on by a low pulse on PWR_ON input, by a rising edge on RESET_N input, or by a preset RTC alarm. When in not-powered mode, the module can be switched on applying VCC supply (see 1.6.1) so that the module switches from not-powered to active-mode. Power-Off Module is switched off: normal shutdown by an appropriate power-off event (see 1.6.2). Application interfaces are not accessible. Only the internal RTC timer in operation. When the module is switched off by an appropriate power-off event (see 1.6.2), the module enters power-off mode from active-mode. When in power-off mode, the module can be switched on by a low pulse on PWR_ON input, by a rising edge on RESET_N input, or by a preset RTC alarm (see 1.6.1): module switches from power-off to active-mode. When VCC supply is removed, the module switches from power-off mode to not-powered mode. Idle Application interfaces are disabled: the module does not accept data signals from an external device connected to the module. The module automatically enters idle-mode whenever possible if power saving is enabled by AT+UPSV (see u-blox AT Commands Manual [2]), reducing current consumption (see 1.5.3.3). If HW flow control is enabled (default setting) and AT+UPSV=1 or AT+UPSV=3 has been set, the UART CTS line indicates when the UART is enabled (see 1.9.2.2, 1.9.2.3). If HW flow control is disabled by AT&K0, the UART CTS line is fixed to ON state (see 1.9.2.2). Power saving configuration is not enabled by default: it can be enabled by AT+UPSV (see the u-blox AT Commands Manual [2]). The module automatically switches from active-mode to idle-mode whenever possible if power saving is enabled (see 1.5.3.3, 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [2], AT+UPSV). The module wakes up from idle-mode to active-mode in these events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see 1.5.3.3, 1.9.2.3)  Automatic periodic enable of the UART interface to receive and send data, if AT+UPSV=1 has been set (see 1.9.2.3)  RTC alarm occurs (see u-blox AT Commands Manual [2], AT+CALA)  Data received on UART interface, if HW flow control has been disabled by AT&K0 and AT+UPSV=1 has been set (see 1.9.2.3)  RTS input set ON by the DTE if HW flow control has been disabled by AT&K0 and AT+UPSV=2 has been set (see 1.9.2.3)  DTR input set ON by DTE if AT+UPSV=3 has been set (see 1.9.2.3)  USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.3)  The connected USB host forces a remote wakeup of the module as USB device (see 1.9.3)  The connected SPI master indicates by the SPI_MRDY input signal that it is ready for transmission or reception (see 1.9.4)  The connected u-blox GNSS receiver indicates by the GPIO3 pin that it is ready to send data (see 1.10, 1.12)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 16 of 175 Operating Mode Description Transition between operating modes Active The module is ready to accept data signals from an external device unless power saving configuration is enabled by AT+UPSV (see sections 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [2]). When the module is switched on by an appropriate power-on event (see 1.6.1), the module enters active-mode from not-powered or power-off mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from active to idle-mode whenever possible and the module wakes up from idle to active-mode in the events listed above (see the idle to active transition description). When a voice call or a data call is initiated, the module switches from active-mode to connected-mode. Connected A voice call or a data call is in progress. When a voice or a data call is enabled, the application interfaces are kept enabled and the module is prepared to accept data from an external device unless power saving configuration is enabled by AT+UPSV (see 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [2]). When a voice call or a data call is initiated, the module enters connected-mode from active-mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from connected to idle-mode whenever possible in case of PSD data call with internal context activation, and then it wakes up from idle to connected mode in the events listed above (see the idle to active transition description). When a voice call or a data call is terminated, the module returns to the active-mode. Table 5: Module operating modes description  Figure 2 describes the transition between the different operating modes. Switch ON:•Apply VCCIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationCall terminated, communication droppedRemove VCCSwitch ON:•PWR_ON•RESET_N•RTC AlarmNot poweredPower offActiveConnected IdleSwitch OFF:•AT+CPWROFF•PWR_ON Figure 2: Operating modes transition
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 17 of 175 1.5 Power management 1.5.1 Power supply circuit overview LISA-U2 series modules feature a power management concept optimized for the most efficient use of supplied power. This is achieved by hardware design utilizing a power efficient circuit topology (Figure 3), and by power management software controlling the module’s power saving mode.  Baseband Processor2G/3G Power Amplifier(s)Switching Step-Down5 x 10 µF61VCC62VCC63VCC50VSIM2V_BCKP4V_INTLinear LDOLinear LDOSwitching Step-DownLinear LDOLinear LDOLinear LDOI/OEBUCOREAnalogSIMRTCNOR FlashDDR SRAMRF TransceiverMemoryPower Management Unit22 µF 220 nF 220 nF2G/3G PA PMUTransceiverPMU Figure 3: LISA-U2 series power management simplified block diagram
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 18 of 175 Pins with supply function are reported in Table 6, Table 12 and Table 15. LISA-U2 series modules must be supplied via the VCC pins. There is only one main power supply input, available on the three VCC pins that must be all connected to the external power supply. The VCC pins are directly connected to the RF power amplifiers and to the integrated Power Management Unit (PMU)  within  the  module:  all  supply  voltages  needed  by  the  module  are  generated  from  the  VCC  supply  by integrated voltage regulators. V_BCKP  is  the  Real Time  Clock  (RTC)  supply.  When the  VCC  voltage  is  within the  valid operating range,  the internal PMU supplies the Real Time Clock and the same supply voltage will be available to the V_BCKP pin. If the VCC voltage is under the minimum operating limit (for example, during not powered mode), the Real Time Clock can be externally supplied via the V_BCKP pin (see section 1.5.4). When a 1.8 V or a 3 V SIM card type is connected, LISA-U2 series modules automatically supply the SIM card via the VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is implemented, in accordance to the ISO-IEC 7816-3 specifications. The same voltage domain used internally to supply the digital interfaces is also available  on the V_INT pin, to allow more economical and efficient integration of the LISA-U2 series modules in the final application. The integrated Power Management Unit also provides the control state machine for system start up and system reset control.  1.5.2 Module supply (VCC) The LISA-U2 series modules must  be supplied through the VCC pins by a DC  power  supply. Voltages must be stable: during operation, the current drawn from VCC can vary by some orders of magnitude, especially due to surging consumption profile of the GSM system (described in the section 1.5.3). It is important that the system power  supply  circuit  is  able  to  support  peak  power  (see  LISA-U2  series  Data  Sheet [1]  for  the  detailed specifications).  Name Description Remarks VCC Module power supply input VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize the power loss due to series resistance. Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided must always be above the minimum limit of the operating range. Consider that during a GSM call there are large current spikes in connected mode. GND Ground GND pins are internally connected but a good (low impedance) external ground can improve RF performance: all available pads must be connected to ground. Table 6: Module supply pins   VCC  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F).  Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved  by  mounting an ESD protection  (e.g. EPCOS  CA05P4S14THSG  varistor array) on the line connected to this pin, close to accessible point.  The  voltage  provided  to  the  VCC  pins  must  be  within  the  normal  operating  range  limits  as  specified  in  the LISA-U2  series  Data  Sheet [1].  Complete  functionality  of  the  module  is  only  guaranteed  within  the  specified minimum and maximum VCC voltage normal operating range.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 19 of 175  The  module  cannot  be  switched  on  if  the  VCC  voltage  value  is  below  the  specified  normal  operating range minimum limit. Ensure that the input voltage at VCC pins is above the minimum limit of the normal operating range for more than 3 s after the start of the module switch-on sequence.  When  LISA-U2  series  modules are in  operation, the  voltage  provided  to  VCC  pins  can  go  outside  the  normal operating range limits but must be within the extended operating range limits specified in LISA-U2 series  Data Sheet [1]. Occasional  deviations from the ETSI specifications may  occur when the  input voltage at  VCC pins is outside the normal operating range and is within the extended operating range.   LISA-U2 series modules switch off when VCC voltage value drops below the specified extended operating range minimum limit: ensure that the input voltage at VCC pins never drops below the minimum limit of the extended operating range when the module is switched on, not  even during a GSM transmit burst, where the current consumption can rise up to maximum peaks of 2.5 A in case of a mismatched antenna load.   Operation above the normal operating range maximum limit is not recommended and extended exposure beyond it may affect device reliability.  Stress beyond the VCC absolute maximum ratings can cause permanent damage to the module: if necessary, voltage spikes beyond VCC absolute maximum ratings must be restricted to values within the specified limits by using appropriate protection.   When  designing  the  power  supply  for  the  application,  pay  specific  attention  to  power  losses  and transients.  The  DC  power  supply  must  be  able  to  provide  a  voltage  profile  to  the  VCC  pins  with  the following characteristics: o Voltage drop during transmit slots must be lower than 400 mV  o No undershoot or overshoot at the start and at the end of transmit slots  o Voltage ripple during transmit slots must be minimized: lower than 70 mVpp if fripple ≤ 200 kHz lower than 10 mVpp if 200 kHz < fripple ≤ 400 kHz lower than 2 mVpp if fripple > 400 kHz   TimeundershootovershootripplerippledropVoltage3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 4: Description of the VCC voltage profile versus time during a GSM call
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 20 of 175  Any degradation in power supply performance (due to losses, noise or transients) will directly affect the RF performance of the module since the single external DC power source indirectly supplies all the digital and analog interfaces, and also directly supplies the RF power amplifier (PA).  The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms. This VCC slope allows a proper switch on of the module when the voltage rises to the VCC normal operating range from a voltage of less than 2.25 V. If the external supply circuit cannot raise the  VCC voltage from 2.5 V to 3.2 V within 1 ms, the RESET_N pin should be kept low during VCC rising edge, so that the module will switch on releasing the RESET_N pin when the VCC voltage stabilizes at its nominal value within the normal operating range.  1.5.2.1 VCC application circuits LISA-U2  series  modules must  be  supplied  through the  VCC  pins  by  a  proper  DC  power supply, which  can  be selected according to the application requirements (see  Figure 5) between the different possible supply sources types, which most common ones are the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery  Primary (disposable) battery  Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage > 5V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 5: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the LISA-U2 series modules operating supply voltage. The use of  switching  step-down  provides  the  best  power  efficiency  for  the  overall  application  and  minimizes  current drawn from the main supply source. The use of an LDO linear regulator becomes convenient for  a primary supply with a relatively low voltage (e.g. less  than  5  V).  In  this  case  the  typical  90%  efficiency  of  the  switching regulator  will  diminish  the  benefit  of voltage step-down and no true advantage will be gained  in input current savings. On the opposite side, linear regulators  are  not  recommended  for  high  voltage  step-down  as  they  will  dissipate a  considerable  amount  of energy in thermal power. If LISA-U2 series modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected to  VCC  is  the  usual  choice  for  battery-powered  devices.  During  charging,  batteries  with  Ni-MH  chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. The use of primary (not rechargeable) battery is uncommon, since the most cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance. Keep in mind that the use of batteries requires the implementation of a suitable charger circuit (not included in LISA-U2 series modules). The charger circuit should be designed in order to prevent over-voltage on VCC beyond the upper limit of the absolute maximum rating. The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply source characteristics, different DC supply systems can result as mutually exclusive.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 21 of 175  The usage of a regulator or a battery not able to withstand the maximum VCC peak current consumption stated in LISA-U2 series Data Sheet [1] is generally not recommended. However, if the selected regulator or battery is not  able  to  withstand  the  maximum  VCC  peak  current,  it  must  be  able  to  withstand  at  least  the  maximum average current consumption value specified in the module data sheet Error! Reference source not found.. The additional energy required by the module during a GSM/GPRS Tx slot (when in the worst case the current consumption can rise up to 2.5 A, as described in section 1.5.3.1) can be provided by an appropriate bypass tank capacitor or supercapacitor with very large capacitance and very low ESR placed close to the module  VCC pins. Depending  on  the  actual  capability  of  the  selected  regulator  or  battery,  the  required  capacitance  can  be considerably larger than 1 mF and the required ESR can be in the range of few  tens of m. Carefully evaluate the  implementation  of  this  solution  since  aging  and  temperature  conditions  significantly  affect  the  actual capacitor characteristics.  The following sections highlight some design aspects for each of the supplies listed above.  Switching regulator The characteristics of the switching regulator connected to VCC pins should meet the following requirements:  Power  capability:  the  switching regulator with  its  output  circuit  must  be  capable of  providing  a  voltage value to the VCC pins within the specified operating range and must be capable of delivering 2.5 A current pulses with 1/8 duty cycle to the VCC pins  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC voltage profile  High switching frequency: for best performance and for smaller applications select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency  or with a  switching  frequency  lower  than  600  kHz  must be carefully evaluated since this can produce noise in the VCC voltage profile and therefore negatively impact GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output  to  VCC  supply  pins  can  mitigate  the  ripple  on  VCC,  but  adds  extra  voltage  drop  due  to  resistive losses on series inductors  PWM  mode  operation: select preferably regulators with Pulse  Width Modulation (PWM) mode.  While in connected mode Pulse Frequency Modulation (PFM) mode and PFM/PWM mode transitions must be avoided to  reduce  the  noise  on  the  VCC  voltage  profile.  Switching  regulators  able  to  switch  between  low  ripple PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs when the module changes status from idle/active mode to connected mode (where current consumption increases to a value greater than 100 mA): it is permissible to use a regulator that switches from the PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulator  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module   Figure 6 and the components listed in Table 7 show an example of a high reliability power supply circuit, where the module VCC is supplied by a step-down switching regulator capable of delivering 2.5 A current pulses with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz. The use of a switching  regulator  is  suggested  when the  difference  from  the  available supply  rail  to  the  VCC  value  is  high: switching regulators provide good efficiency transforming a 12 V supply to the  typical 3.8 V value of the VCC supply.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 22 of 175 LISA-U2 series12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R4R5L1C3U162 VCC63 VCC61 VCCGND Figure 6: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C4 22 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H220JZ01 - Murata C5 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C6 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics R1 470 kΩ Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 kΩ Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 kΩ Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 kΩ Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 kΩ Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo U1 Step Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 7: Suggested components for the VCC voltage supply application circuit using a step-down regulator  Figure 7 and the components listed in Table 8 show an example of a low cost power supply circuit, where the VCC module supply is provided by a step-down switching regulator capable of delivering  2.5 A current pulses, transforming a 12 V supply input. LISA-U2 series12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1 R1R2L1U1GNDFBCOMP54R3C4R4C562 VCC63 VCC61 VCC Figure 7: Suggested low cost solution for the VCC voltage supply application circuit using step-down regulator
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 23 of 175 Reference Description Part Number - Manufacturer C1 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 – Murata C2 100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 – Kemet C3 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 – Murata C4  6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 – Murata C5 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 – Murata C6 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 – Murata D1 Schottky Diode 25V 2 A STPS2L25 – STMicroelectronics L1 5.2 µH Inductor 30% 5.28A 22 m MSS1038-522NL – Coilcraft R1 4.7 k Resistor 0402 1% 0.063 W RC0402FR-074K7L – Yageo R2 910  Resistor 0402 1% 0.063 W RC0402FR-07910RL – Yageo R3 82  Resistor 0402 5% 0.063 W RC0402JR-0782RL – Yageo R4 8.2 k Resistor 0402 5% 0.063 W RC0402JR-078K2L – Yageo R5 39 k Resistor 0402 5% 0.063 W RC0402JR-0739KL – Yageo U1 Step-Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR – ST Microelectronics Table 8: Suggested components for low cost solution VCC voltage supply application circuit using a step-down regulator  Low Drop-Out (LDO) linear regulator The  characteristics  of  the  LDO  linear  regulator  connected  to  the  VCC  pins  should  meet  the  following requirements:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a proper voltage value to the VCC pins and of delivering 2.5 A current pulses with 1/8 duty cycle  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the min output voltage to evaluate the power dissipation of the regulator)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulators  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module   Figure  8  and  the  components  listed  in  Table  9  show  an  example  of  a  power  supply  circuit,  where  the  VCC module  supply  is  provided  by an  LDO linear  regulator  capable  of  delivering 2.5 A  current pulses,  with  proper power  handling  capability.  The  use  of  a  linear  regulator  is  suggested  when  the  difference  from  the available supply rail and the VCC value is low: linear regulators provide high efficiency when transforming a 5 V supply to a voltage value within the module VCC normal operating range. It  is  recommended  to  configure  the  LDO  linear  regulator  so  that  it  generates  a  voltage  supply  value  slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V as in the circuit described in Figure 8 and Table 9). This reduces the power on the linear regulator and  improves the thermal design of the supply circuit.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 24 of 175 5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNLISA-U2 series62 VCC63 VCC61 VCCGNDC3 Figure 8: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 9.1 kΩ Resistor 0402 5% 0.1 W RC0402JR-079K1L - Yageo Phycomp R3 3.9 kΩ Resistor 0402 5% 0.1 W RC0402JR-073K9L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 9: Suggested components for VCC voltage supply application circuit using an LDO linear regulator  Rechargeable Li-Ion or Li-Pol battery Rechargeable Li-Ion or Li-Pol batteries connected to the VCC pins should meet the following requirements:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption to VCC pins. The maximum  pulse  discharge  current  and  the  maximum  DC  discharge  current  are  not  always  reported  in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour  DC series  resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts   Primary (disposable) battery The  characteristics  of  a  primary (non-rechargeable)  battery  connected  to  VCC  pins  should meet the  following requirements:  Maximum pulse and DC discharge current: the non-rechargeable battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption at the VCC pins. The maximum pulse and the maximum DC discharge current is not always reported in battery data sheets, but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour  DC  series  resistance: the  non-rechargeable battery  with its  output circuit  must be capable of avoiding  a VCC voltage drop greater than 400 mV during transmit bursts
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 25 of 175 Additional recommendations for the VCC supply application circuits To  reduce  voltage  drops,  use  a  low  impedance  power  source.  The  resistance  of  the  power  supply  lines (connected to the VCC and GND pins of the module) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible in order to minimize power losses. It is recommended to properly connect all three VCC pins and all twenty GND pins of the module to the supply source to minimize series resistance losses. To  avoid  voltage  drop undershoot and overshoot  at  the  start  and  end  of  a  transmit  burst  during  a  GSM call (when current consumption on the VCC supply can rise up to as much as 2.5 A in the worst case), place a bypass capacitor with large capacitance (more than 100 µF) and low ESR near the VCC pins, for example:  330 µF capacitance, 45 mΩ ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) The use of very large capacitors (i.e. greater then 1000 µF) on the VCC line and the use of the soft start function provided by some voltage regulators must be carefully evaluated, since the voltage at the  VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch on of the module. To reduce voltage ripple and noise, which should improve RF performance if the application device integrates an internal antenna, place the following series ferrite bead and bypass capacitors near the VCC pins of the module:  Ferrite bead for GHz band noise (e.g. Murata BLM18EG221SN1) as close as possible to the VCC pins of the module, implementing the circuit described in Figure 9, to filter EMI in all the GSM / UMTS bands.  68 pF capacitor with Self-Resonant Frequency in the 800/900 MHz range (e.g. Murata GRM1555C1H680J) at the VCC line where it narrows close to the module (see Figure 9), to filter EMI in lower bands  15 pF capacitor with Self-Resonant Frequency in  1800/1900 MHz range  (e.g.  Murata  GRM1555C1H150J)  at the VCC line where it narrows close to the module (see Figure 9), to filter EMI in higher bands  10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  100 nF capacitor (e.g. Murata GRM155R61A104K) to filter digital logic noise from clocks and data sources  Figure  9  shows  the  complete  configuration,  but  keep  in  mind  that  the  mounting  of  each  single component depends on the application design. It is highly recommended to provide the series ferrite bead and all the VCC bypass capacitors as described in Figure 9 and Table 10 if the application device integrates an internal antenna.  C1GNDC2 C4LISA-U2 series62VCC63VCC61VCC3V8C5+LISA-U seriesC5GND plane VCC lineCapacitor with SRF ~900 MHzFB1C1 C3 C4FB1Ferrite Bead for GHz noiseC2C3Capacitor with SRF ~1900 MHz Figure 9: Suggested schematic and layout design for the VCC line; highly recommended when using an integrated antenna Reference Description Part Number - Manufacturer C1 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C2 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET FB1 Chip Ferrite Bead EMI Filter for GHz Band Noise  220  at 100 MHz, 260  at 1 GHz, 2000 mA BLM18EG221SN1 - Murata Table 10: Suggested components for VCC circuit close to module’ pins; highly recommended when using an integrated antenna
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 26 of 175 External battery charging application circuit LISA-U2  series  modules  do  not  have  an  on-board  charging  circuit.  An  example  of  a  battery  charger  design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell, is provided in Figure 10. In the  application  circuit, a  rechargeable  Li-Ion  (or  Li-Polymer) battery cell, that  features  proper  pulse  and  DC discharge current capabilities and proper DC series resistance, is directly connected to the  VCC supply input of LISA-U2  series  module.  Battery  charging  is  completely  managed  by  the  STMicroelectronics  L6924U  Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA)  Constant  voltage:  when  the  battery  voltage  reaches  the  regulated  output  voltage  (4.2  V),  the  L6924U starts  to  reduce  the  current  until  the  charge  termination  is  done.  The  charging  process  ends  when  the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Alternatively the L6924U, providing input voltage range up to 12 V, can charge from an AC wall adapter. When a current-limited adapter is used, it can operate in quasi-pulse mode, reducing power dissipation. GNDLISA-U2 series62 VCC63 VCC61 VCCC8C7C6C5+USB SupplyC3 R4θU1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer    Battery Charger ICC9FB1 Figure 10: Li-Ion (or Li-Polymer) battery charging application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 470  NTC Various manufacturer C1, C4 1 µF Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata C2, C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C7 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C8 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata C9 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata D1 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX FB1 Chip Ferrite Bead EMI Filter for GHz Band Noise  220  at 100 MHz, 260  at 1 GHz, 2000 mA BLM18EG221SN1 - Murata R1, R2 24 k Resistor 0402 5% 0.1 W RC0402JR-0724KL - Yageo Phycomp R3 3.3 k Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R4 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp U1 Single Cell Li-Ion (or Li-Polymer) Battery Charger IC for USB port and AC Adapter L6924U - STMicroelectronics Table 11: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 27 of 175 1.5.3 Current consumption profiles During operation,  the current drawn  by the  LISA-U2 series modules through the VCC pins can vary by  several orders of magnitude. This ranges from the high peak of current consumption during GSM transmitting bursts at maximum power level in 2G connected mode, to continuous high current drawn in UMTS connected mode, to the low current consumption during power saving in idle-mode. 1.5.3.1 2G connected mode When a GSM call is established, the VCC consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which is regulated by the network. If the module is transmitting in GSM talk mode in the GSM 850 or in the E-GSM 900 band and at the maximum RF power control level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach up to 2500 mA (with a highly unmatched antenna) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is in GSM connected mode in the DCS 1800 or in the PCS 1900 band, the current consumption figures are lower than the one in the GSM 850 or  in  the  E-GSM  900  band,  due  to  3GPP  transmitter  output  power  specifications  (see  LISA-U2  series  Data Sheet [1]). During a GSM call, current consumption is  in the order of 60-130 mA in receiving or in monitor bursts and  is about 10-40 mA in the inactive unused bursts (low current period). The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot. An example of current consumption profile of the data module in GSM talk mode is shown in Figure 11.  Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]Peak current depends on TX power and actual antenna loadGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.0 Figure 11: VCC current consumption profile versus time during a GSM call (1 TX slot, 1 RX slot)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 28 of 175 When a GPRS connection is established there is a different VCC current consumption profile also determined by the transmitting and receiving bursts. In contrast to a GSM call, during a GPRS connection more than one slot can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on network  conditions,  which  set  the  peak  current  consumption,  but  following  the  GPRS  specifications  the maximum transmitted RF power is reduced if more than one slot is used to transmit, so the maximum peak of current consumption is not as high as can be in case of a GSM call. If the  module  transmits  in GPRS class  12 connected  mode  in the GSM  850 or  in  the  E-GSM 900 band at the maximum power control level, the current consumption can reach up to 1600 mA (with unmatched antenna). This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/2 duty cycle, according to GSM TDMA. If the module is in GPRS connected mode in the DCS 1800 or in the PCS 1900 band, the current consumption figures are lower than in the GSM 850 or in the E-GSM 900 band, due to 3GPP transmitter output power specifications (see LISA-U2 series Data Sheet [1]). Figure 12 reports the current consumption profiles in GPRS class 12 connected mode, in the GSM 850 or in the E-GSM 900 band, with 4 slots used to transmit and 1 slot used to receive.  Time [ms]RX   slotunused slotTX              slotTX   slotTX           slotTX                        slotMON       slotunused slotRX  slotunused slotTX                              slotTX   slotTX             slotTX                                slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]GSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.0Peak current depends on TX power and actual antenna load Figure 12: VCC current consumption profile versus time during a GPRS/EDGE connection (4TX slots, 1 RX slot) In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 12, representing the current consumption profile in GPRS class 12 connected mode, is valid for the EDGE class 12 connected mode as well.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 29 of 175 1.5.3.2 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends  again  on  output  RF  power,  which  is  always  regulated  by  network  commands.  These  power  control commands are logically divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of  1.5  kHz.  There  are  no  high  current  peaks  as  in  the  2G  connection,  since  transmission  and  reception  are continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the  2G  case.  In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum output power (approximately 250 mW or 24 dBm), the current drawn by the module at the VCC pins is in the order of continuous 500-800 mA (see LISA-U2 series Data Sheet [1] for detailed values). Even at lowest output RF power (approximately 0.01 µW or -50 dBm), the current still remains in the order of 200 mA due to  module baseband processing and transceiver activity.  An example of current consumption profile of the data module in UMTS/HSxPA continuous transmission mode is shown in Figure 13.  Time [ms]3G frame  10 ms                                       (1 frame = 15 slots)Current [mA]Current consumption depends on TX power and actual antenna load170 mA1 slot  666 µs850 mA0300200100500400600700800 Figure 13: VCC current consumption profile versus time during a UMTS/HSPA connection When a packet data connection is established, the actual current profile depends on the amount of transmitted packets;  there might be  some  periods of  inactivity  between  allocated  slots  where  current  consumption  drops about 100 mA. Alternatively, at higher data rates the transmitted power is likely to increase due to the higher quality signal required by the network to cope with enhanced data speed.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 30 of 175 1.5.3.3 2G and 3G cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command (see  the  u-blox AT  Commands  Manual [2],  AT+UPSV  command).  When  power saving is  enabled, the  module automatically enters idle-mode whenever possible. When power saving is enabled, the module is registered or attached to a network and a voice or data call is not enabled,  the  module  automatically  enters  idle-mode  whenever  possible,  but  it  must  periodically  monitor  the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. When the module monitors the paging channel, it wakes up to active mode, to enable the reception of paging block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The time period between two paging block receptions is defined by the network (2G or 3G). This is the paging period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. In case of 2G network, the time interval between two paging block receptions can be from 470.76 ms (DRX = 2, i.e. width of 2 GSM multiframes = 2 x 51 GSM frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (DRX = 9, i.e. width of 9 GSM multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms).  In case of 3G network, the principle is similar but time interval changes from 640 ms (DRX = 6, i.e. the width of 26 x 3G frames = 64 x 10 ms = 640 ms) up to 5120 ms (DRX = 9, i.e. width of 29 x 3G frames = 512 x 10 ms = 5120 ms). An example of a module current consumption profile is shown in Figure 14: the module is registered with the network  (2G or  3G),  automatically enters  idle-mode  and  periodically  wakes up to  active  mode to  monitor  the paging channel for paging block reception.  20-30 msIDLE MODE ACTIVE MODE IDLE MODEActive Mode EnabledIdle Mode Enabled2G case: 0.44-2.09 s    3G case: 0.61-5.09 sIDLE MODE20-30 msACTIVE MODETime [s]Current [mA]100500Time [ms]Current [mA]100500RX EnabledDSP Enabled Figure 14: Description of VCC current consumption profile versus time when the module is registered with 2G or 3G networks: the module is in idle-mode and periodically wakes up to active mode to monitor the paging channel for paging block reception
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 31 of 175 1.5.3.4 2G and 3G fixed active mode (power saving disabled) Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (see the u-blox AT  Commands  Manual  [2], AT+UPSV command). When power saving is disabled, the module does not automatically enter idle-mode whenever possible: the module remains in active mode. The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used. An example of the current consumption profile of the data module when power saving is disabled is shown in Figure 15: the module is registered with the network, active-mode is maintained, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception.  ACTIVE MODE2G case: 0.47-2.12 s    3G case: 0.64-5.12 sPaging periodTime [s]Current [mA]100500Time [ms]Current [mA]100500RX EnabledDSP Enabled Figure 15: Description of the VCC current consumption profile versus time when power saving is disabled:  the active-mode is always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 32 of 175 1.5.4 RTC Supply (V_BCKP) The  V_BCKP  pin connects the  supply for the  Real  Time  Clock (RTC)  and  Power-On /  Reset  internal  logic. This supply  domain  is  internally  generated  by  a  linear  regulator  integrated  in  the  Power  Management  Unit.  The output of this linear regulator is always enabled when the main voltage supply provided to the module through VCC is within the valid operating range, with the module switched-off or powered-on. V_BCKP  supply  output  pin  provides  internal  short  circuit  protection  to  limit  start-up  current  and  protect  the device in short circuit situations. No additional external short circuit protection is required.  Name Description Remarks V_BCKP Real Time Clock supply V_BCKP output voltage = 1.8 V (typical)  Generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range. Table 12: Real Time Clock supply pin  The V_BCKP pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved  by  mounting an ESD protection  (e.g. EPCOS  CA05P4S14THSG  varistor array) on the line connected to this pin, close to accessible point.  The RTC provides the time reference (date and time) of the module, also in power-off mode, when the V_BCKP voltage is within its valid range (specified in the Input characteristics of Supply/Power pins table in LISA-U2 series Data Sheet [1]). The RTC timing is normally used to set the wake-up interval during idle-mode periods between network  paging,  but  is  able  to  provide  programmable  alarm  functions  by  means  of  the  internal  32.768  kHz clock. The RTC can be supplied from an external back-up battery through the V_BCKP, when the main voltage supply is not provided to the module through VCC. This lets the time reference (date and time) run until the V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. The RTC oscillator does not necessarily  stop  operation (i.e.  the  RTC  counting  does  not  necessarily  stop)  when V_BCKP voltage value drops  below  the specified  operating range  minimum  limit (1.00  V): the RTC  value read after a system restart could be not reliable, as explained in Table 13.  V_BCKP voltage value RTC value reliability Notes 1.00 V < V_BCKP < 1.90 V RTC oscillator does not stop operation RTC value read after a restart of the system is reliable V_BCKP within operating range 0.05 V < V_BCKP < 1.00 V RTC oscillator does not necessarily stop operation RTC value read after a restart of the system is not reliable V_BCKP below operating range 0.00 V < V_BCKP < 0.05 V RTC oscillator stops operation RTC value read after a restart of the system is reliable V_BCKP below operating range Table 13: RTC value reliability as function of V_BCKP voltage value  Consider  that  the  module  cannot  switch  on  if  a  valid  voltage  is  not  present  on  VCC  even  when  the  RTC  is supplied through V_BCKP (meaning that VCC is mandatory to switch-on the module). The RTC has very low power consumption, but is highly temperature dependent. For example at 25°C, with the V_BCKP voltage equal to the typical output value, the power consumption is approximately 2 µA (see the Input characteristics  of  Supply/Power  pins  table  in  the  LISA-U2  series  Data  Sheet [1]  for  the  detailed  specification), whereas at 70°C and an equal voltage the power consumption increases to 5-10 µA.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 33 of 175  The  internal  regulator  for  V_BCKP  is  optimized  for  low  leakage  current  and  very  light  loads.  It  is  not recommended to use V_BCKP to supply external loads. If V_BCKP is left unconnected and the module main voltage supply is removed from VCC, the RTC is supplied from  the  bypass  capacitor  mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1 V min). This has no impact on cellular connectivity, as all the functionalities of the module do not rely on date and time setting.   Leave  V_BCKP unconnected  if the RTC is not required when  the VCC supply is removed. The date and time will not be updated when VCC is disconnected. If VCC is always supplied, then the internal regulator is supplied from the main supply and there is no need for an external component on V_BCKP.  If RTC is required to run for a time interval of T [s] at 25°C when VCC supply is removed, place a capacitor with a nominal capacitance of C [µF] at the V_BCKP pin. Choose the capacitor using the following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 2.50 x T [s] for LISA-U2 series  For example, a 100 µF capacitor (such as the Murata GRM43SR60J107M) can be placed at V_BCKP to provide a long buffering time. This capacitor will hold V_BCKP voltage within its valid range for around 50 s at 25°C, after the  VCC  supply  is  removed.  If  a  very  long  buffering  time  is  required,  a  70  mF  super-capacitor  (e.g.  Seiko Instruments XH414H-IV01E) can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 10 hours at 25°C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors will allow the time reference to run during battery disconnection.  LISA-U2 seriesC1(a)2V_BCKPR2LISA-U2 seriesC2(superCap)(b)2V_BCKPD3LISA-U2 seriesB3(c)2V_BCKP Figure 16: Real time clock supply (V_BCKP) application circuits: (a) using a 100 µF capacitor to let the RTC run for ~50 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~10 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 14: Example of components for V_BCKP buffering  If longer buffering time is required to allow the time reference to run during a disconnection of the  VCC supply, then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a  proper nominal  voltage  and  must  never  exceed  the  maximum  operating  voltage  for  V_BCKP  (specified  in  the  Input characteristics  of  Supply/Power  pins  table  in  LISA-U2  series  Data  Sheet [1]).  The  connection  of  the  battery  to V_BCKP should be done with a suitable series resistor for a rechargeable battery, or with an appropriate series diode for a non-rechargeable battery. The purpose of the series resistor is to limit the battery charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the V_BCKP pin after
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 34 of 175 the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery. Combining a LISA-U2 series cellular module with a u-blox GNSS receiver, the VCC supply of the GNSS receiver is controlled by the cellular module by means of the “GNSS supply enable” function provided by the GPIO2 of the cellular module. In this case the V_BCKP supply output of the LISA-U2 series cellular module can be connected to the V_BCKP backup supply input pin of the GNSS receiver to provide the supply for the GNSS real time clock and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either  a  hotstart  or  a  warmstart  (depending  on  the  duration  of  the  GNSS  VCC  outage)  and  to  maintain  the configuration settings saved in the backup RAM. See the section 1.10 for more details regarding the application circuit with a u-blox GNSS receiver.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 35 of 175 1.5.5 Interface supply (V_INT) The same voltage domain used internally to supply the digital interfaces is also available  on the V_INT pin. The internal regulator that generates the  V_INT supply is a  switching  step down converter that is directly supplied from VCC. The voltage regulator output is set to 1.8 V (typical) when the module is switched on and is disabled when  the  module  is  switched  off or  when  the  RESET_N  pin  is  forced  the  low  level.  The  switching regulator operates in Pulse  Width  Modulation  (PWM) for high output current mode but automatically switches  to  Pulse Frequency Modulation (PFM)  at  low output loads  for  greater efficiency,  e.g. when the module is in  idle-mode between paging periods. V_INT supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required.  Name Description Remarks V_INT Digital Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. V_INT is the internal supply for digital interfaces. The user may draw limited current from this supply rail. Table 15: Interface supply pin  The  V_INT  pin  ESD  sensitivity  rating  is 1  kV (Human  Body  Model according  to  JESD22-A114F).  Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved  by  mounting an ESD protection  (e.g. EPCOS  CA05P4S14THSG  varistor array) on the line connected to this pin, close to accessible point.  Since it supplies internal digital circuits (see Figure 3), V_INT is not suited to directly supply any sensitive analog circuit: the voltage ripple can range from 15 mVpp during active mode (PWM), to 70 mVpp in idle-mode (PFM).   V_INT  can  be  used  to  supply  external  digital  circuits  operating  at  the  same  voltage  level  as  the  digital interface  pins,  i.e.  1.8  V  (typical).  It  is  not  recommended  to  supply  analog  circuitry  without  adequate filtering for digital noise.   Do not  apply loads which  might  exceed  the  limit for  maximum  available current from  V_INT  supply, as this  can  cause  malfunctions  in  internal  circuitry  supplies  to  the  same  domain.  The  detailed  electrical characteristics are described in LISA-U2 series Data Sheet [1].   V_INT can only be used as an output; do not connect any external regulator on V_INT. If not used, this pin should be left unconnected.  The V_INT digital interfaces supply output is mainly used to:  Pull-up DDC (I2C) interface signals (see section 1.10.2 for more details)  Pull-up SIM detection signal (see section 1.8 for more details)  Supply voltage translators to connect digital interfaces of the module to a 3.0 V device (see sections 1.9.2.4, 1.9.4.4 for more details)  Supply a 1.8 V u-blox 6 or subsequent GNSS receiver (see section 1.10.2 for more details)  Indicate when the module is switched on and the RESET_N external hardware reset input is not forced low (see sections 1.6.1.5, 1.6.2 and 1.6.3 for more details)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 36 of 175 1.6 System functions 1.6.1 Module power-on When the LISA-U2 series modules are in the not-powered mode (i.e. switched off with the VCC module supply not applied), they can be switched on by:  Rising edge on the VCC pin to a valid voltage as module supply (i.e. applying module supply)  Alternately, the RESET_N pin can be held to the low level during the VCC rising edge, so that the module switches on releasing the RESET_N pin when the VCC module supply voltage stabilizes at its proper nominal value within the normal operating range The status of the PWR_ON input pin of LISA-U2  series modules while applying the VCC module supply is not relevant: during this phase the PWR_ON pin can be set high or low by the external circuit.  When the LISA-U2 series modules are in the power-off mode (i.e. switched off by means of the AT+CPWROFF command, with valid VCC module supply applied), they can be switched on by:  Low pulse on the PWR_ON pin (i.e. forcing to the low level the pin normally high by external pull-up)  Rising edge on the RESET_N pin (i.e. releasing from low level the pin, normally high by internal pull-up)  RTC alarm (i.e. pre-programmed scheduled time by AT+CALA command)  Name Description Remarks  PWR_ON Power-on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required. Table 16: Power-on pin  The PWR_ON pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved  by  mounting an ESD protection  (e.g. EPCOS  CA05P4S14THSG  varistor array) on the line connected to this pin, close to accessible point.  1.6.1.1 Rising edge on VCC Applying a proper supply to VCC pins, the module supply supervision circuit controls the subsequent activation of  the  power  up  state  machines:  the  module  is  switched  on  when  the  voltage  rises  up  to  the  VCC  normal operating  range  minimum  limit  starting  from  a  voltage  value  lower  than  2.25  V  (see  LISA-U2  series  Data Sheet [1] for the VCC normal operating range minimum limit).   The voltage at VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to properly switch on the module.  If the external supply circuit is not  able to provide this VCC voltage slope, keep the  RESET_N input low during the VCC rising edge, so that the module switches on, releasing the RESET_N pin when the VCC voltage stabilizes at its nominal value within the normal operating range.  The status of  the PWR_ON input pin during the VCC apply phase is not relevant: LISA-U2 modules  switch on when a proper rising edge on the VCC pin is applied, during this phase the PWR_ON pin can be set high or low by the external circuit.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 37 of 175 1.6.1.2 Low pulse on PWR_ON When the module is in power-off mode, i.e. it has been properly switched off as described in the section 1.6.2 (e.g. by the AT+CPWROFF command) and a voltage within the operating range is maintained at the VCC pins, the module can be switched on by means  of the  PWR_ON input pin: a falling edge  must be  provided on the PWR_ON pin, which must be then held low for an appropriate time period as specified in LISA-U2 series Data Sheet [1]. The  electrical  characteristics of  the  PWR_ON input  pin  are  different from the other digital I/O interfaces; the detailed electrical characteristics are described in LISA-U2 series Data Sheet [1].   The PWR_ON pin has high input impedance and is weakly pulled to the high level on the module. Avoid keeping it floating in a noisy environment. To hold the high logic level stable, the PWR_ON pin must be connected to a pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module.  Following are some typical examples of application circuits to turn the module on using the PWR_ON input pin. Connecting the PWR_ON input to an external device (e.g. application processor), use an open drain output on the external device with an external pull-up resistor (e.g. 100 kΩ) biased by V_BCKP supply pin of the module. A push-pull output of an application processor can also be used: in this case the pull-up can be used to pull the PWR_ON  level  high  when  the  application  processor  is switched off.  If  the  high-level  voltage  of  the  push-pull output  pin  of  the  application  processor  is  greater  than  the  maximum  input  voltage  operating  range  of  the V_BCKP pin (see the V_BCKP Input characteristics of Supply/Power pins table in LISA-U2 series Data Sheet [1]), the V_BCKP supply cannot be used to bias the pull-up resistor: the supply rail of the application processor or the VCC  supply  could  be  used,  but  this  will  increase  the  V_BCKP  (RTC  supply)  current  consumption  when  the module is in not-powered mode (VCC supply not present). Using a push-pull output of the external device, take care to fix the proper level in all the possible scenarios to avoid an inappropriate switch-on of the module.  Open Drain OutputApplication processorLISA-U2 seriesRext2V_BCKP19 PWR_ON Figure 17: PWR_ON application circuits using an open drain output of an application processor Reference Description Remarks Rext 100 kΩ Resistor 0402 5% 0.1 W External pull-up resistor Table 17: Example of pull-up resistor for the PWR_ON application circuit
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 38 of 175 1.6.1.3 Rising edge on RESET_N When the module is in power-off mode (i.e. switched off with VCC maintained), the module can be switched on by means of the RESET_N input pin alternatively to the PWR_ON input pin: the RESET_N signal must be forced low for at least 50 ms and then released to generate a rising edge that starts the module power-on sequence. RESET_N input pin can also be used to perform an “external” or “hardware” reset of the module, as described in the section 1.6.3. Electrical  characteristics  of  the  LISA-U2  series  RESET_N  input  are  slightly  different  from  the  other  digital  I/O interfaces: the pin provides different input voltage thresholds. Detailed electrical characteristics are described in LISA-U2 series Data Sheet [1]. RESET_N  is  pulled  high  to  V_BCKP  by  an  integrated  pull-up  resistor  also  when  the  module  is  in  power-off mode. Therefore an external pull-up is not required on the application board. The simplest way to  switch on the module  by  means  of  the  RESET_N  input  pin  is  to  use  a  push  button  that shorts the RESET_N pin to ground: the module will be switched on at the release of the push button, since the RESET_N will be forced to the high level by the integrated pull-up resistor, generating a rising edge. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case  make  sure  that  the  high  level  voltage  of  the  push-pull  circuit  is  below  the  maximum  voltage  operating range of the RESET_N pin (specified in the RESET_N pin characteristics table in LISA-U2 series Data Sheet [1]). To avoid unwanted power-on or reset of the module make sure to fix the proper level at the RESET_N input pin in all possible scenarios. Some typical examples of application circuits using the RESET_N input pin are described in the section 1.6.3.  1.6.1.4 Real Time Clock (RTC) alarm When the module is in power-off mode (i.e. switched off with VCC maintained), it can be switched on by means of  an  RTC  alarm  previously  programmed  (see  the  u-blox  AT  Commands  Manual  [2],  AT+CALA  command) alternatively to the PWR_ON and RESET_N pins: the RTC system will initiate the power-on sequence.  1.6.1.5 Additional considerations The module is switched on when the VCC voltage rises up to the normal operating range (i.e. applying supply properly, as described in  section  1.6.1.1): the  module  is  commonly  switched  on  in  this  way for  the  first  time. Then, the module must be properly switched off as described in section 1.6.2, e.g. by AT+CPWROFF command. When the module is in power-off mode, i.e. it has been properly switched off as described in the section  1.6.2 (e.g. by the AT+CPWROFF command) and a voltage within the operating range is maintained at the VCC pins, the  module  can  be  switched  on  by  a  proper  start-up  event  (i.e.  by  PWR_ON  as  described  in  Figure  18  and section 1.6.1.2, or by RESET_N as described in section 1.6.1.3, or by RTC alarm as described in section 1.6.1.4).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 39 of 175 Figure 18 shows the modules power-on sequence from the power-off mode, describing the following phases:  The external supply is still applied to the  VCC inputs as it is assumed that the module has been previously switched off by means of the AT+CPWROFF command: the V_BCKP output is internally enabled as proper VCC is present, the RESET_N of LISA-U2 series is set to high logic level due to internal pull-up to V_BCKP, the PWR_ON is set to high logic level due to external pull-up connected to V_BCKP or VCC.  The PWR_ON input pin is set low for a valid time period, representing the start-up event.  All the generic digital pins of the modules are tri-stated until the switch-on of their supply source (V_INT): any  external  signal  connected  to  the  generic  digital  pins  must  be  tri-stated  or  set  low  at  least  until  the activation of the V_INT supply output to avoid latch-up of circuits and allow a proper boot of the module.  The V_INT generic digital interfaces supply output is enabled by the integrated power management unit.  The internal reset signal is held low by the integrated power management unit: the baseband processor core and all the digital pins of the modules are held in reset state, which is reported for each pin of the module in the pin description table of LISA-U2 series Data Sheet [1].  When  the  internal  reset  signal  is  released  by  the  integrated  power  management  unit,  the  processor  core starts to configure the digital pins of the modules to each default operational state.  The duration of these pins’ configuration phase differs within generic digital interfaces (3 s typical) and USB interface  due  to specific host /  device  enumeration  timings (5  s  typical,  see the  section  1.9.3.1). The  host application processor should not send any AT command over the AT interfaces (USB, UART) of the modules until the end of these interfaces’ configuration phase to allow a proper boot of the module.  After the interfaces’ configuration phase, the application can start sending AT commands, and the following starting  procedure  is  suggested to  check the  effective completion of  the  module  internal  boot  sequence: send AT and wait for the response with a 30 s timeout, iterate it 4 times without resetting or removing the VCC supply of the module, and then run the application.  VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFONStart-up event0 ms~35 ms~3 sPWR_ON can be set highStart of  interface configurationGeneric digital interfaces are configured Figure 18: LISA-U2 series power-on sequence description  The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the start of the power-on sequence.  Any external signal connected to the  UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and let a proper boot of the module. If the external signals connected to the  cellular module cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power on sequence.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 40 of 175 1.6.2 Module power-off The  power-off  sequence  of  LISA-U2  series  modules  can  be  correctly  started,  so  that  the  current  parameter settings are saved  in the  module’s  non-volatile memory  and a proper network detach is  performed, in  one  of these ways:  AT+CPWROFF command (more details in u-blox AT Commands Manual [2])  Low pulse on the PWR_ON pin for at least 1 s   An  over-temperature  or  an  under-temperature  shutdown  occurs  when  the  temperature  measured  within  the cellular module reaches the dangerous area, if the optional Smart Temperature Supervisor feature is enabled and configured  by  the  dedicated  AT  command.  For  more  details  see  the  section  3.15  and  to  the  u-blox  AT Commands Manual [2], +USTS AT command.  An abrupt  under-voltage  shutdown occurs on LISA-U2 modules  when the  VCC  supply is  removed,  but  in this case the current parameter settings are  not saved in the module’s non-volatile memory and a proper network detach cannot be performed.   It is highly recommended to avoid an abrupt removal of the VCC supply: the power off sequence of the module must be properly started as described above (e.g. by means of the AT+CPWROFF command), and a proper VCC supply must be maintained at least until the end of the power off sequence, which occurs when the generic digital interfaces supply output (V_INT) is switched off by the module.  An abrupt hardware shutdown occurs on LISA-U2 series modules when a low level is applied to the  RESET_N pin. In this case, the current parameter settings are not saved in the module’s non-volatile memory and a proper network detach is not performed.   It is highly recommended to avoid an abrupt hardware shutdown of the module by forcing a low level on the RESET_N input pin during module normal operation: the RESET_N line should be set low only if reset or shutdown via AT commands fails or if the module does not reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [2].
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 41 of 175 Figure 19 describes the module’s power-off sequence, properly started by sending the AT+CPWROFF command, allowing  storage  of  current  parameter  settings  in  the  module’s  non-volatile  memory  and  a  proper  network detach:  When the +CPWROFF AT command is sent, the module starts the switch-off routine.  The module replies OK on the AT interface: the switch-off routine is in progress.  At the end of the switch-off routine, all the digital pins are tri-stated and all the internal voltage regulators are turned off, including the generic digital interfaces supply (V_INT), except the RTC supply (V_BCKP).  Then, the module remains in power-off mode as long as a switch on event does not occur (e.g. applying a proper low level to the PWR_ON input, or applying a proper low level to the  RESET_N input), and enters not-powered mode if the supply is removed from the VCC pins.  VCC V_BCKPPWR_ONRESET_N V_INTInternal ResetSystem StateBB Pins State OperationalOFFTristate / FloatingONOperational → TristateAT+CPWROFFsent to the module0 s~50 ms~400 msOKreplied by the moduleVCC                can be removed Figure 19: LISA-U2 series Power-off sequence description  The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the end of the LISA-U2 series power-off sequence.  The duration of each phase in the  LISA-U2 series modules’ switch-off routines can largely vary  from the values  reported in  Figure  19  (e.g.  from  tens  of  milliseconds  up  to  tens  of  seconds),  depending  on  the application / network settings and the concurrent module activities.  If  the  AT  command  +CPWROFF  is  issued  to  switch  off  the  module  over  a  multiplexer  channel,  the completion of the module power-off sequence could require additionally up to 2.5 s, after the module OK reply. Therefore, if the Application Processor (AP) controls the VCC supply of the module, the AP should disable the multiplexer protocol and then issue the AT+CPWROFF command over the used AT interface, or  otherwise  the  AP  should  issue  the  AT+CPWROFF  command  over  a  multiplexer  channel  and  wait additionally 2.5 s after OK reception before removing the module VCC supply.  Tristated pins are always subject to floating caused by noise: to prevent unwanted effects, fix them with proper pull-up or pull down resistors to stable voltage rails to fix their level when the module is in Power down state.  Any external signal connected to the  UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module  power-on  sequence  (at  least  for  3  s  after  the start-up event),  to avoid  latch-up  of  circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated,  insert  a  multi  channel  digital  switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or TS5A63157) between the two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 42 of 175 1.6.3 Module reset LISA-U2 series modules can be properly reset (rebooted) by:  AT+CFUN command (see the u-blox AT Commands Manual [2] for more details). This command  causes an “internal” or “software” reset of  the module, causing an  asynchronous  reset of the module baseband processor, excluding the integrated Power Management Unit and the RTC internal block. The V_INT  interfaces  supply  is  enabled  and  each  digital  pin  is  set  in  its  internal  reset  state  (reported  in  the  pin description table in LISA-U2 series Data Sheet [1]), the V_BCKP supply and the RTC block are enabled. Forcing an “internal” or “software” reset, the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed: this is the proper way to reset the modules.  An abrupt hardware reset occurs on LISA-U2 series modules when a low level is applied on the RESET_N input pin  for  a  specific  time  period.  In  this  case,  the  current  parameter  settings  are  not  saved  in  the  module’s non-volatile memory and a proper network detach is not performed.   It is highly recommended to avoid an abrupt “external” or “hardware” reset of the module by forcing a low level on the RESET_N input pin during the module normal operation: the RESET_N line should be set low only if reset or shutdown via AT commands fails or if the module does not provide a reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [2].  When a low level is applied to the RESET_N input, it causes an “external” or “hardware” reset of the module, with  an  asynchronous  abrupt  reset  of  the  entire  module,  including  the  integrated  Power  Management  Unit, except  for  the  RTC  internal  block. The  V_INT  interfaces  supply  is  switched  off  and  all  the  digital  pins  of  the modules are tri-stated, but the V_BCKP supply and the RTC block are enabled. Forcing  an  “external”  or  “hardware”  reset,  the  current  parameter  settings  are  not  saved  in  the  module’s non-volatile memory and a proper network detach is not performed.  When RESET_N is released from the low level, the module automatically starts its power-on sequence from the reset state. The same procedure is followed for the module reset via AT command after having performed the network detach and the parameter saving in non-volatile memory.  Name Description Remarks RESET_N External reset input Internal 10 k pull-up to V_BCKP Table 18: Reset pin  The RESET_N pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved  by  mounting an ESD protection  (e.g. EPCOS  CA05P4S14THSG  varistor array) on the line connected to this pin, close to accessible point.  For more details about RESET_N circuit precautions for ESD immunity, see section 2.5.3.  The electrical characteristics of RESET_N are different from the other digital I/O interfaces. The detailed electrical characteristics are described in LISA-U2 series Data Sheet [1]. RESET_N is pulled high by an integrated 10 k pull-up resistor to V_BCKP. Therefore an external pull-up is not required on the application board. Following are some typical examples of application circuits using the RESET_N input pin. The simplest way to reset the module is to use a push button that shorts the RESET_N pin to ground.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 43 of 175 If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case  make  sure  that  the  high  level  voltage  of  the  push-pull  circuit  is  below  the  maximum  voltage  operating range of the RESET_N pin (specified in the RESET_N pin characteristics table in LISA-U2 series Data Sheet [1]). To avoid unwanted reset of the module make sure to fix the proper level at the RESET_N input pin in all possible scenarios. As ESD immunity test precaution, a 47 pF bypass capacitor (e.g. Murata GRM1555C1H470JA01), a proper series chip ferrite bead noise/EMI suppression filter (e.g. Murata BLM15HD182SN1) and a 220 nF bypass capacitor (e.g. Murata  GRM155R60J224KE01)  must  be  added  as  close  as  possible  to  the  RESET_N  pin  of  LISA-U2  series modules to avoid a module reset caused by an electrostatic discharge applied to the application board (for more details, see section 2.5.3). LISA-U2 series2V_BCKP22 RESET_NReset     push buttonESDOpen Drain OutputApplication processorLISA-U2 series2V_BCKP22 RESET_NRintRintEMI1C1EMI2C3C2C4 Figure 20: RESET_N application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection. CT0402S14AHSG - EPCOS C1, C3 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C2, C4 220 nF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J224KE01 - Murata EMI1, EMI2 Chip Ferrite Bead Noise/EMI Suppression Filter 1800 Ω at 100 MHz, 2700 Ω at 1 GHz BLM15HD182SN1 - Murata Rint 10 kΩ Resistor 0402 5% 0.1 W Internal pull-up resistor Table 19: Example of ESD protection components for the RESET_N application circuit   Any external signal connected to the  UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module  power-on  sequence  (at  least  for  3  s  after  the start-up event),  to avoid  latch-up  of  circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated,  insert  a  multi  channel  digital  switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or TS5A63157) between the two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 44 of 175 1.7 RF connection The ANT pin, provided by all LISA-U2 modules, represents the main RF input/output used to transmit and receive the  2G  and  3G  RF  signal:  the  main  antenna  must  be  connected  to  this  pad.  The  ANT  pin  has  a  nominal characteristic impedance of 50   and must  be connected to the antenna through a 50   transmission line to allow transmission and reception of radio frequency (RF) signals in the 2G and 3G operating bands. The ANT_DIV pin, provided by LISA-U230 modules, represents the RF input for the integrated diversity receiver implemented for  both  2G and 3G cases: the  antenna  for  the Rx  diversity  must  be  connected to this  pad. The ANT_DIV pin has a nominal characteristic impedance of 50  and must be connected to the antenna for the Rx diversity  through  a  50    transmission  line  to  allow  reception  of  radio  frequency  (RF)  signals,  improving  the cellular link quality and reliability on all 2G and 3G operating bands except the 2G DCS 1800.  Name Module Description Remarks ANT All RF input/output for main Tx/Rx antenna Zo = 50  nominal characteristic impedance. ANT_DIV LISA-U230 RF input for Rx diversity antenna Zo = 50  nominal characteristic impedance. Table 20: Antenna pins   ESD immunity rating of ANT port is 1000 V (according to IEC 61000-4-2). Higher protection level could be required if the line is externally accessible on the application board (for further details see section 2.5.3).  Choose an antenna with optimal radiating characteristics for the best electrical performance and overall module functionality. An internal antenna, integrated on the application board, or an external antenna, connected to the application board through a proper 50  connector, can be used. See section 2.4 and section 2.2.1.1 for further details regarding antenna guidelines.   The  recommendations  of  the  antenna  producer  for  correct  installation  and  deployment  (PCB layout and matching circuitry) must be followed.  If an external antenna is used, the PCB-to-RF-cable transition must be implemented using either a suitable 50  connector, or an RF-signal solder pad (including GND) that is optimized for 50  characteristic impedance. If antenna supervisor functionality is required, the main antenna connected to the ANT pin should have a built in DC diagnostic resistor to ground to get proper detection functionality (See section 2.4.4).   Connect the Rx diversity  antenna to the  ANT_DIV pin of  LISA-U230 modules unless the 2G  and 3G  Rx diversity  feature  is  disabled  by  AT  command  (see  the  u-blox  AT  Commands  Manual  [2],  +URXDIV command). The same pin (74) is marked RSVD (reserved) on the other modules that do not implement Rx diversity: in this case the RSVD pin can be left unconnected.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 45 of 175 1.8 (U)SIM interface High-speed  SIM/ME  interface  is  implemented  as  well  as  automatic  detection  of  the  required  SIM  supporting voltage. Both 1.8  V  and  3  V  SIM  types  are  supported:  activation and deactivation with  automatic  voltage  switch from 1.8 V  to  3  V  is  implemented,  according  to  ISO-IEC  7816-3  specifications.  The  SIM  driver  supports  the  PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM Card. The VSIM supply output  pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required.  Name Description Remarks VSIM SIM supply 1.80 V typical or 2.90 V typical  Automatically generated by the module SIM_CLK SIM clock 3.25 MHz clock frequency SIM_IO SIM data Open drain, internal 4.7 k pull-up resistor to VSIM SIM_RST SIM reset  Table 21: SIM Interface pins  A low capacitance (i.e. less than 10 pF) ESD protection (e.g. Infineon ESD8V0L2B-03L or AVX USB0002RP) must  be  placed  near  the  SIM  card  holder  on  each  line  (VSIM,  SIM_IO,  SIM_CLK,  SIM_RST).  The  SIM interface  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F):  higher protection level is required if the lines are connected to an SIM card connector, since they are externally accessible on the application board.  For more details  about  the  general precautions for ESD  immunity  about  SIM  interface  pins,  see section 2.5.3.  The following SIM services are supported:  Abbreviated Dialing Numbers (ADN)  Fixed Dialing Numbers (FDN)  Last Dialed Numbers (LDN)  Service Dialing Numbers (SDN) SIM Application Toolkit and USIM Application Toolkit (USAT) are supported.  The GPIO5 pin is configured as an external interrupt to detect the SIM card mechanical / physical presence. The pin is configured as input with an internal active pull-down enabled, and it can sense SIM card presence only if properly connected to the mechanical switch of a SIM card holder as described in section 1.8.1.4 and 1.8.1.5:  Low logic level at GPIO5 input pin is recognized as SIM card not present  High logic level at GPIO5 input pin is recognized as SIM card present The SIM card detection function provided by GPIO5 pin is an optional feature that can be implemented / used or not according  to the application requirements. An  Unsolicited Result Code (URC) can be generated each time that there is a change of status (for more details see the “simind” value of the <descr> parameter of +CIND and +CMER commands in the u-blox AT Commands Manual [2]). All the LISA-U2 series modules provide the additional function “SIM card hot insertion/removal” on the  GPIO5 pin, which can be enabled using the AT+UDCONF=50 command. For more details  on  SIM  detection function  see section  1.12  as  well  as  the  u-blox  AT  Commands  Manual [2], +UGPIOC, +UDCONF=50 commands.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 46 of 175 1.8.1 (U)SIM application circuits 1.8.1.1 SIM cards, SIM connectors and SIM chips selection The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and functional characteristics of Universal Integrated Circuit Cards (UICC) which contains the Subscriber Identification Module  (SIM)  integrated  circuit  that  securely  stores  all  the  information  needed  to  identify  and  authenticate subscribers over the GSM network.  Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221as follows:  Contact C1 = VCC (Supply)              It must be connected to VSIM  Contact C2 = RST (Reset)              It must be connected to SIM_RST  Contact C3 = CLK (Clock)              It must be connected to SIM_CLK  Contact C4 = AUX1 (Auxiliary contact)         It must be left not connected  Contact C5 = GND (Ground)            It must be connected to GND  Contact C6 = VPP (Programming supply)         It must be connected to VSIM  Contact C7 = I/O (Data input/output)          It must be connected to SIM_IO  Contact C8 = AUX2 (Auxiliary contact)         It must be left not connected A removable SIM card can have 6 contacts (C1 = VCC, C2 = RST, C3 = CLK, C5 = GND, C6 = VPP, C7 = I/O) or 8 contacts, providing also the auxiliary contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses. Only 6 contacts are required and must be connected to the module SIM card interface as described above, since LISA-U2 modules do not support the additional auxiliary features (contacts C4 = AUX1 and C8 = AUX2). Removable  SIM  cards  are  suitable  for  applications  where  the  SIM  changing  is  required  during  the  product lifetime.  A SIM  card  holder can  have  6 or  8 positions  if a mechanical card presence detector  is not  provided,  or  it can have  6+2  or  8+2  positions  if  two  additional  pins  corresponding  to  the  normally-open  mechanical  switch integrated in the SIM connector for the mechanical card presence detection are provided: select a SIM connector providing  6+2  or  8+2  positions  if  the  optional  SIM  detection  feature  is  required  by  the  custom  application, otherwise a connector without integrated mechanical presence switch can be selected.  Solderable UICC / SIM chip contacts mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as follows:  Package Pin 8 = UICC Contact C1 = VCC (Supply)        It must be connected to VSIM  Package Pin 7 = UICC Contact C2 = RST (Reset)        It must be connected to SIM_RST  Package Pin 6 = UICC Contact C3 = CLK (Clock)        It must be connected to SIM_CLK  Package Pin 5 = UICC Contact C4 = AUX1 (Auxiliary contact)      It must be left not connected  Package Pin 1 = UICC Contact C5 = GND (Ground)       It must be connected to GND  Package Pin 2 = UICC Contact C6 = VPP (Programming supply)   It must be connected to VSIM  Package Pin 3 = UICC Contact C7 = I/O (Data input/output)      It must be connected to SIM_IO  Package Pin 4 = UICC Contact C8 = AUX2 (Auxiliary contact)      It must be left not connected A solderable SIM chip has 8 contacts and can provide also the auxiliary contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses, but only 6 contacts are required and must be connected to the module SIM card interface as described above, since LISA-U2 modules do not support the additional auxiliary features (contacts C4 = AUX1 and C8 = AUX2). Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 47 of 175 1.8.1.2 Single SIM card without detection A  removable SIM  card placed  in  a  SIM  card holder  must  be  connected  to  the SIM  card  interface  of  LISA-U2 modules as described in Figure 21, where the optional SIM detection feature is not implemented (see the circuit described in Figure 23 if the SIM detection feature is required). Follow these guidelines connecting the module to a SIM connector without the SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the corresponding pad of the SIM connector, to prevent digital noise  Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H330J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO, SIM_RST), very close to each specific pad of the SIM  connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each specific pad of the SIM connector: ESD sensitivity rating of the  SIM interface pins is 1  kV  (Human Body Model according  to  JESD22-A114),  so  that,  according  to  the EMC/ESD  requirements of  the custom  application, higher  protection level  can be  required  if  the  lines  are externally accessible on the application device  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  LISA-U2 series50VSIM48SIM_IO47SIM_CLK49SIM_RST4V_INT51GPIO5SIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4C8C4 Figure 21: Application circuit for the connection to a single removable SIM card, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 33 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3, D4 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  J1 SIM Card Holder 6 positions, without card presence switch Various Manufacturers, C707 10M006 136 2 - Amphenol Table 22: Example of components for the connection to a single removable SIM card, with SIM detection not implemented
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 48 of 175 1.8.1.3 Single SIM chip A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of LISA-U2 modules as described in Figure 22, where the optional SIM detection feature is not implemented (see the circuit described in Figure 23 if the SIM detection feature is required). Follow these guidelines connecting the module to a solderable SIM chip without the SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM) close to the specific pad of the SIM chip, to prevent digital noise  Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H330J)  on  each  SIM  line (VSIM, SIM_CLK,  SIM_IO,  SIM_RST), to prevent RF  coupling especially in  case  the RF  antenna  is  placed closer than 10 - 30 cm from the SIM card holder  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  LISA-U2 series50VSIM48SIM_IO47SIM_CLK49SIM_RST4V_INT51GPIO5 SIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5U1C4283671C1 C5C2 C6C3 C7C4 C887651234 Figure 22: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 33 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata U1 SIM chip (M2M UICC Form Factor) Various Manufacturers Table 23: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented  1.8.1.4 Single SIM card with detection A  removable SIM  card placed  in  a  SIM  card holder  must  be  connected  to  the  SIM  card  interface  of  LISA-U2 modules as  described  in Figure  23, where  the optional SIM  card detection feature is implemented so that the module detects by means of the GPIO5 if a SIM card is present in the connector. The SW1 and SW2 pins of the SIM  card  holder  are  connected  to  a  normally-open  mechanical  switch  integrated  in  the  SIM  connector.  The following cases are available:  SIM card not present: the GPIO5 signal is forced low by the pull-down resistor connected to ground (i.e. the switch integrated in the SIM connector is open)  SIM card present: the GPIO5 signal is forced high by the pull-up resistor connected to V_INT (i.e. the switch integrated in the SIM connector is closed)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 49 of 175 Follow these guidelines connecting the module to a SIM connector implementing the SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module  Connect the UICC / SIM contact C5 (GND) to ground  Connect one pin of the mechanical switch integrated in the SIM connector (e.g. the SW2 pin as described in Figure 23) to the GPIO5 input pin of the module  Connect  the  other  pin  of  the  mechanical  switch  integrated  in  the  SIM  connector  (e.g.  the  SW1  pin  as described in Figure 23) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 23  Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 23  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the specific pad of the SIM connector, to prevent digital noise  Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H330J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO, SIM_RST), very close to each specific pad of the SIM  connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each specific pad of the SIM connector: ESD sensitivity rating of the  SIM interface pins is 1  kV  (Human Body Model according  to  JESD22-A114),  so  that,  according  to  the EMC/ESD  requirements of  the custom  application, higher  protection level  can be  required  if  the lines  are externally accessible on the application device  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines)  LISA-U2 series50VSIM48SIM_IO47SIM_CLK49SIM_RST4V_INT51GPIO5SIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4SW1SW2D1 D2 D3 D4 D5 D6R2R1C8C4 Figure 23: Application circuit for the connection to a single removable SIM card, with SIM detection implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 33 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3,  D4, D5, D6 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 1 k Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 k Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder 6 + 2 positions, with card presence switch Various Manufacturers, CCM03-3013LFT R102 - C&K Components Table 24: Example of components for the connection to a single removable SIM card, with SIM detection implemented
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 50 of 175 1.8.1.5 Dual SIM card connection Two SIM cards / chips can be connected to the module’s SIM interface, as described in the circuit of Figure 24. LISA-U2 modules do not support the usage of two SIMs at the same time, but two SIMs can be populated on the application board providing a proper switch to connect only the first SIM or only the second SIM per time to the SIM interface of the modules as described in Figure 24. All LISA-U2 series modules support SIM hot insertion / removal on the GPIO5 pin: if the feature is enabled using the specific AT commands, the switch from first SIM to the second SIM can be properly done when a Low logic level is  present on the  GPIO5 pin (‘SIM  not inserted’ =  SIM interface not enabled), without the necessity of a module re-boot, so that the SIM interface will be re-enabled by the module to use the second SIM when an High logic  level  will  be  re-applied  on  the  GPIO5  pin.  (For  more  details  see  section  1.12  and  to  the  u-blox  AT Commands Manual [2], +UGPIOC, +UDCONF=50 commands.) In the application circuit represented in  Figure 24, the  application  processor will drive the SIM switch using its own GPIO to properly select the SIM that is used by the module. Another GPIO may be used to handle the SIM hot insertion / removal function of LISA-U2 series modules, which can also be handled by other external circuits or by the cellular module GPIO according to the application requirements. The  dual  SIM  connection  circuit  described  in  Figure  24  can  be  implemented  for  SIM  chips  as  well, providing proper connection between SIM switch and SIM chip as described in Figure 22.  If it is required to switch between more than two SIMs, a circuit similar to the one described in Figure 24 can be implemented: for example, in case of four SIM circuits, using a proper 4-pole 4-throw switch (or, alternatively, four 1-pole 4-throw switches) instead of the suggested 4-pole 2-throw switch.  Follow these guidelines connecting the module to two SIM connectors:  Use a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) 2-throw analog switch (e.g. Fairchild FSA2567) as SIM switch to ensure high-speed data transfer according to SIM requirements.  Connect  the  contacts C1  (VCC)  and C6  (VPP) of  the  two  UICC  /  SIM to  the  VSIM pin  of  the  module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C7 (I/O) of the two UICC / SIM to the SIM_IO pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact  C3 (CLK) of  the  two UICC  / SIM  to the  SIM_CLK  pin  of  the  module by  means  of  a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect  the contact C2  (RST) of  the  two  UICC  /  SIM to the  SIM_RST pin  of  the  module  by  means  of  a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C5 (GND) of the two UICC / SIM to ground.  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line (VSIM), close to the related pad of the two SIM connectors, to prevent digital noise.  Provide  a  bypass  capacitor  of  about  22  pF  to  47  pF  (e.g.  Murata  GRM1555C1H470J)  on  each  SIM  line (VSIM, SIM_CLK, SIM_IO, SIM_RST), very close to each related pad of the two SIM connectors, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holders.  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each related pad of the two SIM connectors, according to the EMC/ESD requirements of the custom application.  Limit  capacitance  and  series  resistance  on  each  SIM  signal  (SIM_CLK,  SIM_IO,  SIM_RST)  to  match  the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 51 of 175 LISA-U2 seriesC1FIRST             SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4GNDU150VSIM VSIM 1VSIM2VSIMVCCC114PDT Analog Switch3V848SIM_IO DAT 1DAT2DAT47SIM_CLK CLK 1CLK2CLK49SIM_RST RST 1RST2RSTSELSECOND   SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6 C7 C8 C10C9 D5 D6 D7 D8Application ProcessorGPIOR1 Figure 24: Application circuit for the connection to two removable SIM cards, with SIM detection implemented  Reference Description Part Number - Manufacturer C1 – C4, C6 – C9 33 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5, C10, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1 – D8 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL- Yageo Phycomp J1, J2 SIM Card Holder 6 positions, without card presence switch Various Manufacturers, C707 10M006 136 2 - Amphenol U1 4PDT Analog Switch,  with Low On-Capacitance and Low On-Resistance FSA2567 - Fairchild Semiconductor Table 25: Example of components for the connection to two removable SIM cards, with SIM detection implemented
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 52 of 175 1.9 Serial communication LISA-U2  modules  provide  the  following  serial  communication  interfaces  where  AT  command  interface  and Packet-Switched / Circuit-Switched Data communication are concurrently available:  One  asynchronous  serial  interface  (UART)  that  provides  complete  RS-232  functionality  conforming  to ITU-T V.24 Recommendation [3], with limited data rate  One  Inter  Processor  Communication  (IPC)  interface  that  includes  a  synchronous  SPI-compatible  interface, with maximum data rate of 26 Mb/s  One high-speed USB 2.0 compliant interface, with maximum data rate of 480 Mb/s.   The  LISA-U2  modules are  designed to  operate  as  an  HSPA  cellular modem,  which represents  the  data circuit-terminating  equipment  (DCE)  as  described  by  the  ITU-T  V.24  Recommendation [3].  A  customer  application processor connected to the module through one of the interfaces represents the data terminal equipment (DTE).  All the interfaces listed above are controlled and operated with:  AT commands according to 3GPP TS 27.007 [4]  AT commands according to 3GPP TS 27.005 [5]  AT commands according to 3GPP TS 27.010 [6]  u-blox AT commands   For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [2].  The module firmware can be upgraded over all the serial interfaces listed above by means of AT command (for more details see section 3.1 as well as the u-blox AT Commands Manual [2], +UFWUPD command). The module firmware can be upgraded over the following serial interfaces using the u-blox EasyFlash tool:  The UART interface (only the RxD and TxD lines are needed)  The USB interface (all the provided lines VUSB_DET, USB_D+ and USB_D- are needed)   To  directly  enable  PC  (or  similar)  connection  to  the  module  for  firmware  upgrade  using  the  u-blox EasyFlash tool, provide direct access  on the  application  board to  the  VUSB_DET, USB_D+ and USB_D- lines of the module (or to the RxD and TxD lines). Also provide access to the PWR_ON or the RESET_N pins,  or  enable  the  DC  supply  connected  to  the  VCC  pin  to  start  the  module  firmware  upgrade  (see Firmware Update Application Note [17]).  The following sub-sections describe the serial interfaces configuration and provide a detailed description of each interface for the application circuits.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 53 of 175 1.9.1 Serial interfaces configuration UART, USB and SPI/IPC serial interfaces are available as AT command interface and for Packet-Switched / Circuit-Switched  Data  communication.  The  serial  interfaces  are  configured  as  described  in  Table  26  (for  information about further settings, see the u-blox AT Commands Manual [2]).  Interface AT Settings Comments UART interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling  Channel 7: SAP (SIM Access Profile) AT+IPR=0 One-shot autobauding enabled by default AT+ICF=0 One-shot frame format recognition enabled by default AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode5 AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command mode and issues an OK result code5 AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise USB interface Enabled 6 CDCs are available, configured as described in the following list:  USB1: AT commands / data connection  USB2: AT commands / data connection  USB3: AT commands / data connection  USB4: GPS tunneling  USB5: Primary TraceLog  USB6: Secondary TraceLog  USB7: SAP (SIM Access Profile) AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode5 AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command mode and issues an OK result code5 AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise SPI interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling  Channel 7: SAP (SIM Access Profile) AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode5 AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command mode and issues an OK result code5 AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise Table 26: Default serial interfaces configuration                                                        5 Refer to the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 54 of 175 1.9.2 Asynchronous serial interface (UART) The UART interface is a 9-wire unbalanced asynchronous serial interface that provides AT commands interface, PSD and CSD data communication. The module firmware can be upgraded over the UART interface using the u-blox EasyFlash tool or by means of AT command (for more details see section 3.1 and Firmware update application note [17]). UART  interface  provides  RS-232  functionality  conforming  to  the  ITU-T  V.24  Recommendation  (more  details available in ITU Recommendation [3]), with CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state. For detailed electrical characteristics see LISA-U2 series Data Sheet [1]. The  LISA-U2  modules are  designed to operate as  an HSPA  cellular modem,  which represents the  data  circuit-terminating  equipment  (DCE)  as  described  by  the  ITU-T  V.24  Recommendation  [3].  A  customer  application processor connected to the module through the UART interface represents the data terminal equipment (DTE).   The signal names of the LISA-U2 modules UART interface conform to the ITU-T V.24 Recommendation [3].  UART interfaces include the following lines:  Name Description Remarks DSR Data set ready Module output Circuit 107 (Data set ready) in ITU-T V.24 RI Ring Indicator Module output Circuit 125 (Calling indicator) in ITU-T V.24 DCD Data carrier detect Module output Circuit 109 (Data channel received line signal detector) in ITU-T V.24 DTR Data terminal ready Module input Circuit 108/2 (Data terminal ready) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RTS Ready to send Module hardware flow control input Circuit 105 (Request to send) in ITU-T V.24  Internal active pull-up to V_INT (1.8 V) enabled. CTS Clear to send Module hardware flow control output  Circuit 106 (Ready for sending) in ITU-T V.24 TxD Transmitted data Module data input Circuit 103 (Transmitted data) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RxD Received data Module data output Circuit 104 (Received data) in ITU-T V.24 GND Ground  Table 27: UART interface signals   The UART interface pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  lines  are  externally accessible  on  the  application  board. Higher  protection level can be  achieved  by  mounting  an  ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 55 of 175 1.9.2.1 UART features All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [2], &K, +IFC, \Q AT commands): hardware flow control (RTS/CTS), software flow control (XON/XOFF), or none flow control.  Hardware flow control is enabled by default.  One-shot autobauding is supported: the baud rate detection is performed  once, at module start up. Then the module  works  at  the  fixed  baud  rate  (the  detected  one)  and  the  baud  rate  can  only  be  changed  via  the appropriate AT command (+IPR, for more details see the u-blox AT Commands Manual [2]). In particular:  If automatic baud rate detection is configured in the active memory profile, the baud rate is detected once at the module power-on  The factory-programmed setting enables the automatic baud rate detection (<rate> value is 0) Since autobauding is  implemented as  “one  shot”  autobauding,  any  setting of  +IPR=0  should  be  avoided;  the only exception is if the baud rate is fixed  in the stored NVRAM profile.  In this case, the module starts without autobauding and the host needs to reactivate it. If the system starts in autobauding (i.e. the +IPR is 0), the first “at” sequence provided to the module detects the baud rate. For example the first command sent from the DTE at any rate can be: AT+CPIN="1234".Characters different than “AT” are  ignored during  the  baud  rate detection since the  “at”  or “AT”  sequence  triggers  the hardware detection sequence. “At” or “aT” sequences are invalid: both detection characters must be lowercase or uppercase. The  module  generates  a  response  for  the  DTE  once  autobauding  detection  is  successful,  the  command  is accepted and the command response is available. Therefore, even if the detection was previously successful, it is only possible to assume that the detection phase was successful after a response. If the DTE does not receive any response after some time, it must retry (the timeout value should be adjustable inside  the  DTE  application).  In  any  case,  use  a  very  simple  command  as  the  first  command,  for  which  the execution time is short and almost constant (e.g. ATE). Note that the only way to recover from a detection failure is the detection reattempt, since the AT interface is only available after a successful detection.   One-shot autobauding is enabled by factory programmed setting.  The only way to recover from a detection failure is the detection reattempt, since the AT interface is only available after a successful detection.  The following baud rates can be configured by AT command:  1200 b/s  2400 b/s  4800 b/s  9600 b/s  19200 b/s  38400 b/s  57600 b/s  115200 b/s, default value when the one-shot autobauding is disabled  230400 b/s  460800 b/s  921600 b/s   460800 b/s and 921600 b/s baud rates cannot be automatically detected by one-shot autobauding.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 56 of 175 One-shot  automatic  frame  recognition  is  supported  and  enabled  in  conjunction  with  the  one-shot  automatic baud rate detection only: when the one-shot autobauding is active, the one-shot automatic frame recognition is enabled overruling the frame format  setting. The  frame  format recognition  is performed once and then, after the successful recognition  of  the frame format, the automatic  frame  recognition is disabled,  as  the automatic baud rate detection.   One-shot automatic frame recognition is enabled by default, as the one-shot autobauding.  The following frame formats can be configured by AT command:  8N1 (8 data bits, No parity, 1 stop bit), default frame configuration with fixed baud rate  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  8N2 (8 data bits, No parity, 2 stop bits)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit)   The 8N2 frame format cannot be automatically detected by one-shot automatic frame recognition.  The 8N1frame format, which is the default configuration with fixed baud rate, is described in the Figure 25. D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 25: Description of UART default frame format (8N1) with fixed baud rate
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 57 of 175 1.9.2.2 UART signal behavior  See Table 5 for a description of operating modes and states referred to in this section. At the  switch  on  of the  module, before the initialization of the UART interface,  as described in the  power-on sequence reported in the Figure 18, each pin is first tri-stated and then is set to its  specific internal reset state that is reported in the pin description table in LISA-U2 series Data Sheet [1]. At the end of the boot sequence, the UART interface is initialized, the module is by default in active mode and the UART interface is enabled. The configuration and the behavior of the UART signals after the boot sequence are described below.   For a complete description of data and command mode, see the u-blox AT Commands Manual [2].  RxD signal behavior The module data output line (RxD) is set by default to OFF state (high level) at UART initialization. The module holds RxD in OFF state until no data is transmitted by the module.  TxD signal behavior The module data input line (TxD) is set by default to OFF state (high level) at UART initialization. The TxD line is then held by  the  module  in the  OFF  state  if  the  line  is  not  activated  by the  DTE:  an  active  pull -up  is  enabled inside the module on the TxD input.  CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the  hardware flow  control is enabled, as  it is  by  default,  the  CTS line  indicates  when the  UART interface is enabled (data can  be  sent and received).  The  module drives the  CTS  line  to the ON  state  or  to  the OFF  state when it is either able or not able to accept data from the DTE over the UART (see 1.9.2.3 for more details).   If hardware flow control is enabled, then when the CTS line is OFF it does not necessarily mean that the module is in low power idle-mode, but only that the UART is not enabled, as the module could be forced to stay in active-mode for other activities, e.g. related to the network or related to other interfaces.   When the multiplexer protocol is active, the CTS line state is mapped to FCon / FCoff MUX command for flow  control  issues  outside  the  power saving  configuration while  the  physical  CTS  line  is  still  used as  a power state indicator. For more details, see Mux Implementation Application Note [15].  The  CTS hardware  flow  control  setting  can  be  configured  by  AT  commands  (for  more  details,  see  u-blox  AT Commands Manual [2], AT&K, AT\Q, AT+IFC, AT+UCTS AT command). If the hardware flow control is not enabled, the CTS line after the UART initialization behaves as follows:  on LISA-U2 modules "01", "x2" and "68" product versions, the CTS line is always held in the ON state  on LISA-U2 modules "03" product version onward, the CTS line is by default set in the ON state, but can be configured in the OFF state by the AT+UCTS command   When the power saving configuration is enabled and the hardware flow-control is not implemented in the DTE/DCE connection, data sent by the DTE can be lost: the first character sent when the module is in the low power idle-mode will not be a valid communication character (see 1.9.2.3 for more details).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 58 of 175 RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The RTS line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If  the  HW  flow  control  is  enabled  (for  more  details  see  the  u-blox  AT  Commands  Manual  [2]  AT&K,  AT\Q, AT+IFC command description)  the  RTS line  is monitored by the module to  detect permission from the DTE  to send data to the DTE itself. If the RTS line is set to OFF state, any on-going data transmission from the module is immediately interrupted or any subsequent transmission forbidden until the RTS line changes to ON state.  The DTE must be able to still accept a certain number of characters after the RTS line has been set to OFF state: the module guarantees the transmission interruption within 2 characters from RTS state change.  If AT+UPSV=2 is set and HW flow control is disabled, the RTS line is monitored by the module to manage the power saving configuration:  When an OFF-to-ON transition occurs on the RTS input line, the UART is enabled and the module is forced to active-mode: after 20 ms from the transition the  switch is completed and data can be received without loss. The module cannot enter idle-mode and the UART is keep enabled as long as the RTS input line is held in the ON state  If RTS is set to OFF state by the DTE, the UART is immediately disabled (held in low power mode) and the module automatically enters idle-mode whenever possible  For  more  details  on  the  power  saving  configuration controlled  by  the  RTS  input line  see  section 1.9.2.3  and u-blox AT Commands Manual [2], AT+UPSV command.  DSR signal behavior If AT&S0 is set, the DSR module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&S1 is set, the DSR module output line is set by default to OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode or in online command mode and is set  to  the  ON  state  when  the  module  is  in  data  mode  (see  the  u-blox  AT  Commands  Manual  [2]  for  the definition of the interface data mode, command mode and online command mode).   The above behavior is valid for both Packet-Switched and Circuit-Switched Data transfer.  DTR signal behavior The DTR module input line is set by default to OFF state (high level) at UART initialization. The DTR line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module  on  the  DTR  input.  Module  behavior  according  to  DTR  status  depends  on  the  AT  command configuration (see u-blox AT Commands Manual [2], &D AT command). Except for “01” product version, if AT+UPSV=3 is set, the DTR line is monitored by the module to manage the power saving configuration:  When an OFF-to-ON transition occurs on the DTR input line, the UART is enabled and the module is forced to active-mode: after 20 ms from the transition the switch is completed and data can be received without loss. The module cannot enter idle-mode and the UART is keep enabled as long as the DTR input line is held in the ON state  If DTR is set to OFF state by the DTE, the UART is immediately disabled (held in low power mode) and the module automatically enters idle-mode whenever possible For  more  details on the  power  saving  configuration  controlled  by  the  DTR  input  line see section  1.9.2.3  and u-blox AT Commands Manual [2], AT+UPSV command.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 59 of 175 DCD signal behavior If AT&C0 is set, the DCD module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&C1 is set, the DCD module output line is set by default to OFF state (high level) at UART initialization. The DCD line is then set by the module in accordance with the carrier detect status: ON if the carrier is detected, OFF otherwise. In case of voice call DCD is set to ON state when the call is established. For a data call there are the following  scenarios  (see  the  u-blox  AT  Commands  Manual  [2]  for  the  definition  of  the  interface  data  mode, command mode and online command mode):   PSD  data  call:  Before  activating  the  PPP  protocol  (data  mode)  a  dial-up  application  must  provide  the ATD*99***<context_number>#  to  the  module:  with this  command the  module  switches from  command mode  to  data  mode  and  can  accept  PPP  packets.  The  module  sets  the  DCD  line  to  the  ON  state,  then answers  with  a  CONNECT  to  confirm  the  ATD*99  command.  The  DCD  ON  is  not  related  to  the  context activation but with the data mode  CSD data call: To establish a data call the DTE can send the ATD<number> command to the module which sets  an  outgoing  data  call  to  a  remote  modem  (or  another  data  module).  Data  can  be  transparent  (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the data call, the module  DCD  line  is  set  to  ON  and  the  CONNECT  <communication  baudrate>  string  is  returned  by  the module. At this stage the DTE can send characters through the serial line to the data module which sends them through the network to the remote DCE attached to a remote DTE   In case of a voice call DCD is set to ON state on all the serial communication interfaces supporting the AT command interface. (including MUX virtual channels, if active).  DCD  is  set  to  ON  during  the  execution  of  a  command  requiring  input  data  from  the  DTE  (all  the commands  where  a  prompt  is  issued;  see  AT  commands  +CMGS,  +CMGW,  +USOWR,  +USODL, +UDWNFILE in u-blox AT Commands Manual [2]). The DCD line is set to ON state as soon as the switch to binary/text input mode is completed and the prompt is issued; DCD line is set to OFF as soon as the input mode is interrupted or completed.  DCD line is kept to ON state even during the online command mode to indicate that the data call is still established even if suspended, while if the module enters command mode DSR line is set to OFF state. For more details see the DSR signal behavior description.  In case  of  scenarios  for  which  the  DCD  line setting is  requested  for  different reasons (e.g. SMS  texting during  online  command  mode),  the  DCD  line  changes  to  guarantee  the  correct  behavior  for  all  the scenarios. For instance, in case of SMS texting in online command mode, if the data call is released, the DCD line will be kept to ON till the SMS command execution is completed (even if the data call release would request the DCD setting to OFF).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 60 of 175 RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization. Then, during an incoming call, the RI line is switched from OFF state to ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s,  OFF  for  4 s,  see  Figure  26),  until  the  DTE  attached  to  the  module sends the ATA  string and  the module accepts  the  incoming  data  call. The  RING  string  sent by the  module  (DCE) to the  serial  port  at  constant time intervals is not correlated with the switch of the RI line to the ON state.  Figure 26: RI behavior during an incoming call The RI line can notify an SMS arrival. When the SMS arrives, the  RI line switches from OFF to ON for 1 s (see Figure  27),  if  the  feature  is  enabled  by  the  proper  AT  command  (see  the  u-blox  AT  Commands  Manual [2], AT+CNMI command).  Figure 27: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. In case of SMS arrival, if several events occur coincidently or in quick succession each event triggers the RI line independently, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more than 1 s. If an incoming call is answered within less than 1 s (with ATA or if autoanswering is set to ATS0=1) than the RI line will be set to OFF earlier. As a result:  RI line monitoring cannot be used by the DTE to determine the number of received SMSes.  In case of multiple events (incoming call plus SMS received), the RI line cannot be used to discriminate the two  events,  but  the  DTE  must  rely  on  the  subsequent  URCs  and  interrogate  the  DCE  with  the  proper commands.  The RI line can additionally notify all the URCs and all the incoming data (PPP, Direct Link, sockets, FTP)  on all LISA-U2 series  modules except for “01” product version, if the feature is enabled by the proper  AT command (see  the  u-blox  AT  Commands  Manual [2],  AT+URING  command):  the  RI  line  is  asserted  when  one  of  the configured events occur and it remains asserted for 1 s unless another configured event will happen, with the same behavior described in Figure 27. SMS arrives time [s] 0 RI ON RI OFF 1s SMS  time [s] 0 RI ON RI OFF 1s 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 61 of 175 1.9.2.3 UART and power-saving The power saving configuration is controlled by the AT+UPSV command (for the  complete description  see the u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters low power idle-mode whenever possible; otherwise the active-mode is  maintained by the module (see section 1.4 for the definition and description of module operating modes). The AT+UPSV command configures both the module power saving and also the UART behavior in relation to the power  saving.  The  conditions  for  the  module  entering  idle-mode  also  depend  on  the  UART  power  saving configuration.  The AT+UPSV command can set these different power saving configurations:  AT+UPSV=0, power saving disabled: module forced on active-mode and UART interface enabled (default)  AT+UPSV=1, power saving enabled: module cyclic active / idle-mode and UART enabled / disabled  AT+UPSV=2, power saving enabled and controlled by the UART RTS input line  AT+UPSV=3, power saving enabled and controlled by the UART DTR input line   The AT+UPSV=3 power saving configuration is not supported by “01” product version  The different power saving configurations that can be set by the +UPSV AT command are described in details in the following subsections. UART interface communication process in the different power saving configurations, in relation with HW flow control settings and RTS input line status, is summarized in Table 28. For more details on the +UPSV AT command description, see the u-blox AT commands Manual [2].  AT+UPSV HW flow control RTS line DTR line Communication during idle-mode and wake up  0 Enabled (AT&K3) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 0 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE should be buffered by the DTE and will be correctly received by the module when RTS is set to ON. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 0 Disabled (AT&K0) ON or OFF ON or OFF Data sent by the DTE is correctly received by the module.  Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise the data is lost. 1 Enabled (AT&K3) ON ON or OFF Data sent by the DTE should be buffered by the DTE and will be correctly received by the module when active-mode is entered. Data sent by the module is correctly received by the DTE. 1 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when active-mode is entered. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON or OFF ON or OFF The first character sent by the DTE is lost, but after ~20 ms the UART and the module are waked up: recognition of subsequent characters is guaranteed after the complete UART / module wake-up. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 62 of 175 AT+UPSV HW flow control RTS line DTR line Communication during idle-mode and wake up  2 Enabled (AT&K3) ON or OFF ON or OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 2 Disabled (AT&K0) OFF ON or OFF Data sent by the DTE is lost by LISA-U2 modules. The first character sent by the DTE is lost by LISA-U2 modules, but after ~20 ms the UART and the module are waked up: recognition of subsequent characters is guaranteed after the complete UART / module wake-up. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 3 Enabled (AT&K3) ON ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) ON OFF Data sent by the DTE is lost by the module. Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Enabled (AT&K3) OFF OFF Data sent by the DTE is lost by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Disabled (AT&K0) ON or OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 3 Disabled (AT&K0) ON or OFF OFF Data sent by the DTE is lost by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. Table 28: UART and power-saving summary  AT+UPSV=0: power saving disabled, fixed active-mode The module  does not enter idle-mode and the UART interface is enabled (data can be sent and received):  the CTS line is always held in the ON state after UART initialization. This is the default configuration.  AT+UPSV=1: power saving enabled, cyclic idle/active mode When the DTE issues the AT+UPSV=1 command, the UART is immediately disabled. Afterwards, the UART of LISA-U2 series modules is periodically enabled to receive or send data and, if data has not been received or sent over the UART, the interface is automatically disabled whenever possible according to the timeout configured by the second parameter of the +UPSV AT command. The module  automatically  enters  the low power idle-mode  whenever possible but  it wakes up to  active-mode according to the UART periodic wake up so that the module cyclically enters the low power idle-mode and the active-mode. Additionally, the module wakes up to active-mode according to any required activity related to the network or any other required activity related to the functions / interfaces of the module. The UART is enabled, and the module does not enter low power idle-mode, in the following cases:  During the periodic UART wake up to receive or send data  If the module needs to transmit some data over the UART (e.g. URC)  If a character is sent by the DTE with HW flow control  disabled, the first character sent causes the system wake-up  due to the “wake up via  data  reception” feature described in the following subsection,  and the UART  will  be  then  kept  enabled  after  the  last  data received  according  to  the  timeout  set  by  the  second parameter of the AT+UPSV=1 command The module, outside an active call, periodically wakes up from idle-mode to active-mode to monitor the paging channel  of  the  current  base  station (paging  block  reception),  according  to  2G  or  3G  discontinuous  reception (DRX) specification.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 63 of 175 The time period between two paging receptions is defined by the current base station (i.e. by the network):  If the module is registered with a 2G network, the paging reception period can vary from ~0.47 s (DRX = 2, i.e. 2 x 51 2G-frames) up to ~2.12 s (DRX = 9, i.e. 9 x 51 2G-frames)  If the module is registered with a 3G network, the paging reception period can vary from 0.64 s (DRX = 6, i.e. 26 3G-frames) up to 5.12 s (DRX = 9, i.e. 29 3G-frames)  The time period of the UART enable/disable cycle is configured differently when the module is registered with a 2G network compared to when the module is registered with a 3G network:  2G: the  UART is  enabled  concurrently to  a  paging  reception,  and  then,  as  data has  not been received  or sent, the UART is disabled until the first paging reception that occurs after a timeout of 2.0 s, and therefore the interface is enabled again  3G: the UART is asynchronously enabled to paging receptions, as the UART is enabled for ~20 ms, and then, if data are not received or sent, the UART is disabled for 2.5 s, and afterwards the interface is enabled again  Not registered: when a module is not registered with a network, the UART is enabled for ~20 ms, and then, if data has not been received or sent, the UART is disabled for 2.5 s and afterwards the interface is enabled again  The module active-mode duration outside an active call depends on:  Network parameters, related to the time interval for the paging block reception (minimum of ~11 ms)  Duration of UART enable time in absence of data reception (~20 ms)  The time period from the last data received at the serial port during the active-mode: the module does not enter idle-mode until a timeout expires. The second parameter of the +UPSV AT command configures this timeout, from 40 2G-frames (i.e. 40 x 4.615 ms = 184 ms) up to 65000 2G-frames (i.e. 65000 x 4.615 ms = 300 s). Default value is 2000 2G-frames (i.e. 2000 x 4.615 ms = 9.2 s) The active-mode duration can be extended indefinitely since every subsequent character received during the active-mode, resets and restarts the timer. The timeout is ignored immediately after AT+UPSV=1 has been sent, so that the UART interface is disabled and the module may enter idle-mode immediately after the AT+UPSV=1 is sent  The hardware flow-control output (CTS line) indicates when the UART interface is enabled (data can be sent and received over the UART), if HW flow control is enabled, as illustrated in Figure 28. time [s]CTS ONCTS OFFUART disabled~10 ms (min)UART enabled~9.2 s (default)UART enabledData input0.47- 2.10 s Figure 28: CTS behavior with power saving enabled (AT+UPSV=1) and HW flow control enabled: the CTS output line indicates when the UART interface of the module is enabled (CTS = ON = low level) or disabled (CTS = OFF = high level)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 64 of 175 AT+UPSV=2: power saving enabled and controlled by the RTS line This configuration can only be enabled with the module hardware flow control disabled by AT&K0 command. The UART interface is immediately disabled after the DTE sets the RTS line to OFF.  Then, the module automatically enters idle-mode whenever possible according to any required activity related to the network or any other required activity related to the functions / interfaces of the module. The UART is disabled as long as the RTS line is held to OFF, but the UART is enabled in case the module needs to transmit some data over the UART (e.g. URC). When an OFF-to-ON transition occurs on the RTS input line, the UART is re-enabled and the module, if it was in idle-mode, switches from idle to active-mode after ~20 ms: this is the UART and module “wake up time”. If the  RTS line  is set to ON by the  DTE the module is  not allowed to enter the low power idle-mode and the UART is kept enabled.  AT+UPSV=3: power saving enabled and controlled by the DTR line The AT+UPSV=3 configuration can be enabled regardless the flow control setting on UART. In particular, the HW flow control can be enabled (AT&K3) or disabled (AT&K0) on UART during this configuration. The UART interface is immediately disabled after the DTE sets the DTR line to OFF. Then, the module automatically enters idle-mode whenever possible according to any required activity related to the network or any other required activity related to the functions / interfaces of the module. The UART is disabled as long as the DTR line is set to OFF, but the UART is enabled in case the module needs to transmit some data over the UART (e.g. URC). When an OFF-to-ON transition occurs on the DTR input line, the UART is re-enabled and the module, if it was in idle-mode, switches from idle to active mode after 20 ms: this is the UART and module “wake up time”. If the  DTR line is  set  to ON  by  the  DTE,  the  module  is  not allowed  to  enter  idle-mode and the UART  is  kept enabled until the DTR line is set to OFF.  When the AT+UPSV=3 configuration is enabled, the DTR input line can still be used by the DTE to control the module behavior according to AT&D command configuration (see u-blox AT Commands Manual [2]).   The CTS output line indicates the UART power saving state as illustrated in Figure 28, if HW flow control is enabled with AT+UPSV=3.  The AT+UPSV=3 power saving configuration is not supported by “01” product version.  Wake up via data reception The  UART  wake  up  via data  reception  consists  of  a  special  configuration  of  the  module  TXD  input  line  that causes the system wake-up when a low-to-high transition occurs on the TXD input line. In particular, the UART is enabled and the module switches from the low power idle-mode to active-mode within ~20 ms from the first character received: this is the system “wake up time”. As a consequence, the first character sent by the DTE when the UART is disabled (i.e. the wake up character) is not a valid communication character even if the wake up via data reception configuration is active, because it cannot be recognized, and the recognition of the subsequent characters is guaranteed only after the complete system wake-up (i.e. after ~20 ms).  The UART wake up via data reception configuration is active in the following case:  the TXD  input line  is configured to wake up  the system via  data  reception only  if  AT+UPSV=1 is set  with hardware flow control disabled
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 65 of 175 The UART wake up via data reception configuration is not active on the  TXD input, and therefore all the data sent by the DTE is lost, if: o AT+UPSV=2 is set with HW flow control disabled, and the RTS line is set OFF o AT+UPSV=3 is set, regardless HW flow control setting, and the DTR line is set OFF  Figure 29 and Figure 30 show examples of common scenarios and timing constraints:  AT+UPSV=1 power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000)  Hardware flow control is disabled  Figure 29 shows the case where the module UART is disabled and only a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE module UART is disabled when the timeout from last data received expires (2000 frames without data reception, as the default case).  OFFONDCE UART is enabled for 2000 GSM frames (~9.2 s)time Wake up time: ~20 mstime TXD inputWake up character        Not recognized by DCEUARTOFFON Figure 29: Wake-up via data reception without further communication DCE UART is enabled for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: ~20 mstime Wake up character        Not recognized by DCEValid characters          Recognized by DCEOFFONTXD inputUARTOFFON Figure 30: Wake-up via data reception with further communication
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 66 of 175 Figure  30  shows  the  case  where  in  addition to the  wake-up character  further (valid)  characters are  sent.  The wake up character wakes-up the module UART. The other characters must be sent after the “wake up time” of ~20 ms. If this condition is satisfied, the module (DCE) recognizes characters. The module will disable the UART after 2000 GSM frames from the latest data reception.   The “wake-up via data reception” feature cannot be disabled.  In command mode6, if autobauding is enabled and the DTE does not implement HW flow control, the DTE must  always  send  a  character  to  the  module  before  the  “AT”  prefix  set  at  the  beginning  of  each command line: the first character is ignored if the module is in active-mode, or it represents the wake-up character if the module is in idle-mode.  In command  mode6,  if autobauding is  disabled,  the DTE  must always send  a dummy  “AT”  before  each command line: the  first character is not ignored if the  module is in active-mode  (i.e. the  module replies “OK”), or it represents the wake up character if the module is in low power idle-mode (i.e. the module does not reply).  No  wake-up  character  or  dummy  “AT”  is  required  from  the  DTE during  a  voice  or  data  call since  the module UART interface continues to be enabled and does not need to be woken-up. Furthermore in data mode6 a dummy “AT” would affect the data communication.  Additional considerations The LISA-U2 series modules are forced to stay in active-mode if the USB is connected and not suspended, and therefore the AT+UPSV=1, AT+UPSV=2 or AT+UPSV=3 settings are overruled but they have effect on the UART behavior:  they  configure  UART  interface  power  saving,  so  that  UART  is  enabled  /  disabled  according  to  the AT+UPSV=1, AT+UPSV=2 or AT+UPSV=3 settings.  To set the AT+UPSV=1, AT+UPSV=2 or AT+UPSV=3 configuration over the USB interface of  LISA-U2 modules, the autobauding must be previously disabled on the UART by the +IPR AT command over the used AT interface (the  USB),  and  this +IPR  AT  command  configuration  must  be  saved in  the  module’  non-volatile  memory  (see u-blox  AT  Commands  Manual  [2]).  Then,  after  the  subsequent  module  re-boot,  AT+UPSV=1,  AT+UPSV=2  or AT+UPSV=3 can be issued over the used AT interface (the USB): all the AT profiles are updated accordingly.                                                        6 Refer to the u-blox AT Commands Manual [2] for the definition of the interface data mode, command mode and online command mode.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 67 of 175 1.9.2.4 UART application circuits Providing the full RS-232 functionality (using the complete V.24 link) If RS-232 compatible signal levels are needed, to provide full RS-232 (9 lines) functionality two different external voltage  translators  (e.g.  Maxim  MAX3237E  and  Texas  Instruments  SN74AVC4T774)  can  be  used.  The  Texas Instruments  chips  provide  the  translation from  1.8 V  to  3.3  V, while the  Maxim  chip  provides  the  translation from 3.3 V to RS-232 compatible signal level. If a 1.8V application processor is used, for complete RS-232 functionality conforming to ITU Recommendation [3] in DTE/DCE serial communication, the complete UART  interface of the  module  (DCE)  must  be connected to  a 1.8V DTE as described in Figure 31. TxDApplication processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP Figure 31: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 32. 4V_INTTxDApplication processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR1DIR3 OEB2 A2B4A4DIR4DIR2 Figure 32: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 29: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 68 of 175 Providing the TxD, RxD, RTS, CTS and DTR lines only (not using the complete V.24 link) If the functionality of the DSR, DCD and RI lines is not required, or the lines are not available:  Leave DSR, DCD and RI lines of the module unconnected and floating  If RS-232 compatible signal levels are needed, two different external voltage translators (e.g. Maxim MAX3237E and Texas Instruments SN74AVC4T774) can be used. The Texas Instruments chips provide the translation from 1.8 V to 3.3 V, while the Maxim chip provides the translation from 3.3 V to RS-232 compatible signal level.  Figure 35 describes the circuit that should be implemented as if a 1.8 V Application Processor is used, given that the DTE will behave properly regardless DSR input setting. TxDApplication processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP Figure 33: UART interface application circuit with partial V.24 link (6-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output pin as 1.8  V supply, as described  in  Figure  34,  given that the  DTE will behave properly regardless DSR input setting. 4V_INTTxDApplication processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2VCCBVCCAUnidirectionalVoltage TranslatorC33V0DIR1OEB2 A2DIR2 C4 Figure 34: UART interface application circuit with partial V.24 link (6-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments U2 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 30: Component for UART application circuit with partial V.24 link (6-wire) in DTE/DCE serial communication (3.0 V DTE)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 69 of 175 If only TxD, RxD, RTS, CTS and DTR lines are provided (as implemented in Figure  33 and in Figure 34) and if HW flow-control is enabled (AT&K3, default setting), the power saving can be activated as it can be done when the complete UART link is provided (9-wire, as implemented in Figure 31 and in Figure 32), i.e. in these ways:  AT+UPSV=1:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is periodically enabled, as described in section 1.9.2.3, reaching low current consumption. With this configuration, when the module is in idle-mode, the data transmitted by the DTE will be buffered by the DTE and will be correctly received by the module when active-mode is entered.  AT+UPSV=3:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is enabled by the DTR line, as described in section 1.9.2.3, reaching very low current consumption. With this configuration, not supported by “01” product version, when the module is in idle-mode, the UART is re-enabled 20 ms after DTR has been set ON, and the recognition of subsequent characters is guaranteed until the module is in active-mode If the HW flow-control is disabled (AT&K0), it is recommended to enable the power saving in one of these ways:  AT+UPSV=2:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is enabled by the RTS line, as described in section 1.9.2.3, reaching very low current consumption. With this configuration, when the module is in idle-mode, the UART is re-enabled 20 ms after RTS has been set ON, and the recognition of subsequent characters is guaranteed until the module is in active-mode.  AT+UPSV=3:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is enabled by the DTR line, as described in section 1.9.2.3, reaching very low current consumption. With this configuration, not supported by “01” product version, when the module is in idle-mode, the UART is re-enabled 20 ms after DTR has been set ON, and the recognition of subsequent characters is guaranteed until the module is in active-mode.  Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required, or the lines are not available:  Connect the module DTR input line to GND, to robustly fix the logic level  Leave DSR, DCD and RI lines of the module unconnected and floating  If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.  Figure 35 describes the circuit that should be implemented as if a 1.8 V Application Processor is used. TxDApplication processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP Figure 35: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 70 of 175 If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 36. 4V_INTTxDApplication processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR4 Figure 36: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 31: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE)  If only  TxD, RxD, RTS and  CTS  lines are provided, as  implemented  in  Figure  35  and in Figure 36, and  if  HW flow-control is enabled (AT&K3, default setting), the power saving can be activated in this way:  AT+UPSV=1:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is periodically enabled, as described in section 1.9.2.3, reaching low current consumption. With this configuration, when the module is in idle-mode, data transmitted by the DTE will be buffered by the DTE and will be correctly received by the module when active-mode is entered. If the HW flow-control is disabled (AT&K0), it is recommended to enable the power saving in this way:  AT+UPSV=2:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is enabled by the RTS line, as described in section 1.9.2.3, reaching very low current consumption. With this configuration, when the module is in idle-mode, the UART is re-enabled 20 ms after RTS has been set ON, and the recognition of subsequent characters is guaranteed until the module is in active-mode.  Providing the TxD and RxD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available:  Connect  the  module  RTS  input  line  to  GND  or  to the  CTS  output  line  of  the  module:  since  the module requires RTS active (low electrical level)  if HW flow-control is enabled (AT&K3, that is the default setting), the pin can be connected using a 0 Ω series resistor to GND or to the active module CTS (low electrical level) when the module is in active mode, the UART interface is enabled and the HW flow-control is enabled  Connect the module DTR input line to GND, to robustly fix the logic level  Leave DSR, DCD and RI lines of the module unconnected and floating
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 71 of 175 If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.  Figure 37 describes the circuit that should be implemented as if a 1.8 V Application Processor is used. TxDApplication processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 ΩTPTP Figure 37: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE)  If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 38. 4V_INTTxDApplication processor(3.0V DTE)RxDDTRDSRRIDCDGNDLISA-U2 series (1.8V DCE)15 TXD12 DTR16 RXD9DSR10 RI11 DCDGND0 Ω0 ΩTPTP1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2 OEVCCB2 A2RTSCTS13 RTS14 CTS0 ΩTPTP Figure 38: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 32: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) If  only  TxD  and  RxD  lines  are  provided,  as  described  in  Figure  37  or  in  Figure  38,  and  HW  flow-control  is disabled (AT&K0), the power saving must be enabled in this way:  AT+UPSV=1:  the  module  automatically enters  the  low  power  idle-mode  whenever possible  and  the  UART interface is periodically enabled, as described in section 1.9.2.3, reaching low current consumption. With this configuration, when the module is in idle-mode, the UART is re-enabled 20 ms after the first data reception, and the recognition of subsequent characters is guaranteed until the module is in active-mode.  If only TxD and RxD lines are provided, data delivered by the DTE can be lost with these settings: o HW flow-control enabled in the module (AT&K3, that is the default setting) o Module power saving enabled by AT+UPSV=1 o HW flow-control disabled in the DTE
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 72 of 175  In this case the first character sent when the module is in idle-mode will be a wake-up character and will not be a valid communication character (see section 1.9.2.3 for the complete description).  If power saving is enabled the application circuit with the TxD and RxD lines only is not recommended. During command mode the DTE must send to the module a wake-up character or a dummy “AT” before each command line (see section 1.9.2.3 for the complete description), but during data mode the wake-up character or the dummy “AT” would affect the data communication.  Additional considerations If  a  3.0 V  Application  Processor  (DTE)  is  used,  the  voltage  scaling  from  any  3.0 V  output  of  the  DTE  to  the apposite 1.8 V input of the module (DCE) can be implemented, as an alternative low-cost solution, by means of an appropriate voltage divider. Consider the value of the pull-up integrated at the input of the module (DCE) for the  correct  selection  of  the  voltage  divider  resistance  values  and  mind  that  any  DTE  signal  connected  to  the module has to be tri-stated or set low when the module is in power-down mode and during the module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module (see  the remark below).Moreover, the  voltage scaling from any 1.8 V output  of  the  cellular  module  (DCE)  to  the  apposite  3.0 V  input  of  the  Application  Processor  (DTE)  can  be implemented  by  means  of  an  appropriate  low-cost  non-inverting  buffer  with  open  drain  output.  The  non-inverting buffer should be supplied by the V_INT supply output of the cellular module. Consider the value of the pull-up  integrated  at  each  input  of  the  DTE  (if  any)  and  the  baud  rate  required  by  the  application  for  the appropriate selection of the resistance value for the external pull-up biased by the application processor supply rail.  If the module USB interface is connected to the application processor, it is highly recommended to provide direct  access to  RxD,  TxD,  CTS and  RTS  lines of  the  module  for  execution  of  firmware upgrade  over UART  using  the  u-blox EasyFlash  tool  and  for debug  purpose:  testpoints  can  be  added  on  the  lines  to accommodate the access and a 0 Ω series resistor must be mounted on each line to detach the module pin from any other connected device. Otherwise, if the USB interface is not connected to the  application processor, it  is  highly  recommended  to provide direct access  to  VUSB_DET, USB_D+, USB_D-  lines  for execution of firmware upgrade over USB and for debug purpose. In both cases, provide as well access to RESET_N pin, or  to  the  PWR_ON  pin,  or enable  the DC supply connected  to the  VCC pin to start the module firmware upgrade (see Firmware Update Application Note [17]).  If  the  UART interface is  not  used,  all  the  UART  interface pins  can  be  left  unconnected, but  it  is  highly recommended  to  provide direct  access  to  the  RxD,  TxD,  CTS  and  RTS  lines  for  execution  of  firmware upgrade using the u-blox EasyFlash tool and for debug purpose.  Any  external  signal  connected  to  the  UART  interface  must  be  tri-stated  when  the  module  is  in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated, insert a multi channel digital switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 73 of 175 1.9.3 USB interface LISA-U2  modules  provide  a  high-speed  USB  interface  at  480  Mb/s  compliant  with  the  Universal  Serial  Bus Revision 2.0 specification [7]. It acts as a USB device and can be connected to any USB host such as a PC or other Application Processor. The USB-device shall look for all upper-SW-layers like any other serial device. This means that LISA-U2 modules emulate all serial control logical lines.  Name Description Remarks VUSB_DET USB detect input Apply 5 V typical to enable USB USB_D+ USB Data Line D+ 90 Ω nominal differential characteristic impedance (Z0) 30 Ω nominal common mode characteristic impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [7] are part of the USB pad driver and need not be provided externally. USB_D- USB Data Line D- 90 Ω nominal differential characteristic impedance (Z0) 30 Ω nominal common mode characteristic impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [7] are part of the USB pad driver and need not be provided externally. Table 33: USB pins  The  USB  interface pins  ESD  sensitivity  rating  is  1  kV (Human  Body  Model according to  JESD22-A114F). Higher protection  level  could  be  required  if  the  lines  are  externally accessible  on  the  application  board. Higher protection level can be achieved by mounting a very low capacitance (i.e. less or equal to 1 pF) ESD protection  (e.g.  Tyco  Electronics PESD0402-140  ESD  protection device)  on  the  lines connected to these pins, close to accessible points.  1.9.3.1 USB features LISA-U2  modules  include  a  High-Speed  USB  2.0  compliant  interface  with  maximum  data  rate  of  480 Mb/s between the module and a host processor. The module itself acts as a USB device and can be connected to any USB host such as a Personal Computer or an embedded  application microprocessor  for  AT  commands,  data  communication, FW  upgrade by  means  of  the FOAT feature, FW upgrade by means of the u-blox EasyFlash tool and for diagnostic purpose. The USB_D+/USB_D- lines  carry  the USB  serial bus data and signaling, while the VUSB_DET  input pin senses the  VBUS  USB  supply  presence  (nominally +5 V at the  source)  to  detect  the  host  connection  and enable the interface. The USB interface of the module is enabled only if a valid voltage is detected by the VUSB_DET input (see the LISA–U2 series Data Sheet [1]). Neither the USB interface, nor the whole module is supplied by the  VUSB_DET input: the VUSB_DET senses the USB supply voltage and absorbs few microamperes.  LISA-U2 series modules can provide the following functions over the USB interface:  CDC-ACM for AT commands and data communication  CDC-ACM for GNSS tunneling  CDC-ACM for diagnostic  CDC-ACM for SAP (SIM Access Profile)  CDC-ECM for Ethernet-over-USB   CDC-ECM for Ethernet-over-USB function is not supported by "01", "x2" and "68" product versions.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 74 of 175 Each  USB  profile  of  LISA-U2  module identifies  itself  by  its  VID  (Vendor  ID)  and  PID  (Product  ID)  combination, included in the USB device descriptor according to the USB 2.0 specifications [7]. If the USB interface is connected to the host before the module switch on, or if the module is reset with the USB interface connected to  the  host, the  VID  and PID are automatically updated  runtime,  after  the  USB detection. First, VID and PID are the following:  VID = 0x058B  PID = 0x0041 This VID and PID combination identifies a USB profile where no USB functions are available: AT commands must not be sent to the module over the USB profile identified by this VID and PID combination. Then, after a time period (roughly 5 s, depending on the host / device enumeration timings), the VID and PID are updated to the following ones, which are related to the LISA-U2 module default USB profile:  VID = 0x1546  PID = 0x1102   The default configuration of the USB interface provides 7 USB CDC-ACM modem COM ports:  USB1: AT and data  USB2: AT and data  USB3: AT and data  USB4: GNSS tunneling  USB5: Primary Log (diagnostic purpose)  USB6: Secondary Log (diagnostic purpose)  USB7: SAP (SIM Access Profile) The user can concurrently use the AT command interface on one CDC, and Packet-Switched / Circuit-Switched Data communication on another CDC. Figure 39 (left side) summarizes the USB end-points available with the default USB profile configuration.  The USB interface of the LISA-U2 series can be configured by the AT+UUSBCONF command (for more details see the u-blox AT Commands Manual [2]) to select a different set of USB functions, available in a mutually exclusive way,  and  including  1  CDC-ECM  for  Ethernet-over-USB  and  4  CDC-ACM  modem  COM  ports  enumerated  as follows:  USB1: AT and data  USB2: GNSS tunneling  USB3: Primary Log (diagnostic purpose)  USB4: SAP (SIM Access Profile)  The default profile of the USB interface cannot be changed on "01", "x2" and "68" product versions  In the  case of  the  USB  profile with  the  set  of  functions described  above, the  VID  and PID  combination  is  the following:  VID = 0x1546  PID = 0x1104 Figure 39 (right side) summarizes the USB end-points available with this alternative USB profile configuration.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 75 of 175 Default profile configurationInterface 0 Abstract Control ModelEndPoint Transfer: InterruptInterface 1 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 2 Abstract Control ModelEndPoint Transfer: InterruptInterface 3 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 4 Abstract Control ModelEndPoint Transfer: InterruptInterface 5 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 6 Abstract Control ModelEndPoint Transfer: InterruptInterface 7 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction GNSS tunnelingInterface 8 Abstract Control ModelEndPoint Transfer: InterruptInterface 9 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction Primary LogInterface 10 Abstract Control ModelEndPoint Transfer: InterruptInterface 11 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction Secondary LogInterface 12 Abstract Control ModelEndPoint Transfer: InterruptInterface 13 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction SAPAlternative profile configurationInterface 0 Abstract Control ModelEndPoint Transfer: InterruptInterface 1 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction AT and DataInterface 2 Abstract Control ModelEndPoint Transfer: InterruptInterface 3 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction GNSS tunnelingInterface 4 Abstract Control ModelEndPoint Transfer: InterruptInterface 5 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction Primary LogInterface 6 Abstract Control ModelEndPoint Transfer: InterruptInterface 7 DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction SAPEthernet Networking Control ModelEndPoint Transfer: InterruptFunction EthernetInterface 8Interface 9 Data On / OffEndPoint Transfer: BulkEndPoint Transfer: Bulk Figure 39: LISA-U2 series end-points summary for the default and alternative USB profile configuration   For  more  details  on  the  configuration  of  the  USB  interface  of  LISA-U2  modules,  see  the  u-blox  AT Commands Manual [2], +UUSBCONF AT command.  The module firmware can be upgraded over the USB interface using the u-blox EasyFlash tool or by means of AT command (for more details see section 3.12 and Firmware update application note [17]).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 76 of 175 The USB drivers are available for the following operating system platforms:  Windows XP   Windows Vista   Windows 7   Windows 8   Windows 8.1   Windows CE 5.0   Windows Embedded CE 6.0   Windows Embedded Compact 7   Windows Embedded Automotive 7   Windows Mobile 5   Windows Mobile 6   Windows Mobile 6.1   Windows Mobile 6.5  LISA-U2 modules are compatible with standard Linux/Android USB kernel drivers.  1.9.3.2 USB and power saving The modules  automatically enter the  USB  suspended  state when the  device  has  observed no  bus  traffic for  a specific time period  according  to  the  USB  2.0  specification [7].  In  suspended  state, the  module  maintains  any USB  internal  status  as  device.  In  addition,  the  module  enters  the  suspended  state  when  the  hub  port  it  is attached to is disabled. This is referred to as USB selective suspend. If the  USB is  suspended  and a power saving configuration is enabled by  the  AT+UPSV  command,  the module automatically enters the low power idle-mode whenever possible but it wakes up to active-mode according to any required activity related to the network (e.g. the periodic paging reception described in section  1.5.3.3) or any other required activity related to the functions / interfaces of the module. The USB exits suspend mode when there is bus activity. If the USB is connected and not suspended, the module is forced to stay in active-mode, therefore the AT+UPSV settings are overruled but they have effect on the power saving configuration of the other interfaces. The modules are capable of USB remote wake-up signaling: i.e. it may request the host to exit suspend mode or selective  suspend  by  using  electrical  signaling  to indicate  remote  wake-up, for example due  to  incoming  call, URCs, data reception on a socket. The remote wake-up signaling notifies the host that it should resume from its suspended mode, if necessary, and service the external event. Remote wake-up is accomplished using electrical signaling described in the USB 2.0 specifications [7]. For the module current consumption description with power saving enabled and USB suspended, or with power saving disabled and USB not suspended, see the sections 1.5.3.3 and 1.5.3.4 and LISA-U2 series Data Sheet [1].  1.9.3.3 USB application circuit Since  the  module  acts  as  a  USB  device,  the  USB  supply  (5.0  V  typ.)  must  be  provided  to  VUSB_DET  by  the connected USB host. The USB interface is enabled only when a valid voltage as USB supply is detected by the VUSB_DET  input.  Neither  the USB  interface,  nor  the  whole module is  supplied  by the  VUSB_DET  input:  the VUSB_DET senses the USB supply voltage and absorbs few microamperes. The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake, as well as in differential mode for fast signaling and data transfer. USB pull-up or pull-down resistors on pins USB_D+ and USB_D- as required by the Universal Serial Bus Revision 2.0 specification [7] are part of the USB pad driver and do not need to be externally provided.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 77 of 175 External  series  resistors  on  pins  USB_D+  and  USB_D-  as  required  by  the  Universal  Serial  Bus  Revision  2.0 specification [7] are also  integrated: characteristic impedance of  USB_D+ and  USB_D- lines is specified  by the USB  standard.  The  most  important  parameter  is  the  differential  characteristic  impedance  (Z0)  applicable  for odd-mode electromagnetic field, which should be as close as possible to 90  differential: signal integrity may be degraded if the PCB layout is not optimal, especially when the USB signaling lines are very long. The common mode characteristic impedance (ZCM) of each USB data line should be as close as possible to 30 .  LISA-U2 series VBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GNDC1USB DEVICE CONNECTORD1 D2 D3 Figure 40: USB Interface application circuit Reference Description Part Number - Manufacturer D1, D2, D3 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata Table 34: Component for USB application circuit   If the  USB  interface  is not  connected to the application  processor,  it  is highly recommended to provide direct  access  to  the  VUSB_DET,  USB_D+,  USB_D-  lines  for  execution  of  firmware  upgrade  over  USB using  the  u-blox  EasyFlash  tool  and  for  debug  purpose:  testpoints  can  be  added  on  the  lines  to accommodate the access. Otherwise, if the USB interface is connected to the application processor, it is highly  recommended  to  provide  direct  access  to  the  RxD,  TxD,  CTS  and  RTS  lines  for  execution  of firmware upgrade over UART and for debug purpose. In both cases, provide as well access to  RESET_N pin,  or  to  the  PWR_ON  pin,  or  enable  the  DC  supply  connected  to  the  VCC  pin  to  start  the  module firmware upgrade (see Firmware Update Application Note [17]).  If the USB interface is not used, the USB_D+, USB_D- and VUSB_DET pins can be left unconnected, but it is highly recommended to provide direct access to the lines for FW upgrade and debug purpose.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 78 of 175 1.9.4 SPI interface SPI is a master-slave protocol: the module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The SPI-compatible synchronous serial interface cannot be used for FW upgrade. The standard 3-wire SPI interface includes two signals to transmit and receive data (SPI_MOSI and SPI_MISO) and a clock signal (SPI_SCLK). LISA-U2 modules provide two handshake signals (SPI_MRDY and SPI_SRDY), added to the standard 3-wire SPI interface, implementing the 5-wire Inter Processor Communication (IPC) interface. The  purpose  of  the  IPC  interface  is  to  achieve  high  speed  communication  (up  to  26  Mb/s)  between  two processors  following  the  same  IPC  specifications:  the  module  baseband  processor  and  an  external  processor. High speed communication is possible only  if both sides follow the same Inter Processor  Communication  (IPC) specifications. The module firmware can be  upgraded over the SPI interface by means of  AT command (for more details  see section 3.1 and Firmware Update application note [17]).  Name Description Remarks SPI_MISO SPI Data Line. Master Input, Slave Output Module Output. Idle high. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). MSB is shifted first. SPI_MOSI SPI Data Line. Master Output, Slave Input Module Input. Idle high. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). MSB is shifted first. Internal active pull-up to V_INT (1.8 V) enabled. SPI_SCLK SPI Serial Clock. Master Output, Slave Input Module Input. Idle low (CPOL=0). Supported clock frequency: from 260 kHz up to 26 MHz. Internal active pull-down to GND enabled. SPI_MRDY SPI Master Ready to transfer data control line. Master Output, Slave Input Module Input. Idle low. Internal active pull-down to GND enabled. SPI_SRDY SPI Slave Ready to transfer data control line. Master Input, Slave Output Module Output. Idle low. Table 35: SPI interface signals   The  SPI  interface  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F). Higher protection  level  could  be  required  if  the  lines  are  externally accessible  on  the  application  board. Higher  protection  level  can  be  achieved  by  mounting  a  low  capacitance  (i.e.  less  than  10  pF)  ESD protection  (e.g.  AVX  USB0002  varistor  array)  on  the  lines  connected  to  these  pins,  close  to  accessible points.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 79 of 175 1.9.4.1 IPC communication protocol overview The module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The SPI-device shall  look for all upper-SW-layers like any other serial device. This means that  LISA-U2  modules emulate  all  serial  logical  lines:  the  transmission  and  the  reception  of  the data  are  similar  to  an  asynchronous device. Two  additional  signals  (SPI_MRDY  and  SPI_SRDY)  are  added  to  the  SPI  lines  to  communicate  the  state  of readiness of the two processors: they are used as handshake signals to implement the data flow. The function of the SPI_MRDY and SPI_SRDY signals is twofold:  For transmitting data the signal indicates to the data receiver that data is available to be transmitted  For receiving data the signal indicates to the transmitter that the receiver is ready to receive data Due to  this setup  it is  possible  to use  the control signals  as interrupt lines waking up the  receiving part when data  is  available  for transfer.  When  the  handshaking  has  taken  place,  the  transfer  occurs  just  as  if  it  were  a standard SPI interface without chip select functionality (i.e. one master - one slave setup). SPI_MRDY is used by the application processor (i.e. the master) to indicate to the module baseband processor (i.e.  the  slave)  that  it  is  ready  to  transmit  or  receive  (IPC  master  ready  signal),  and  can  also  be  used  by  the application processor to wake up the module baseband processor if it is in idle-mode. SPI_SRDY line is used by the module baseband processor (i.e. the slave) to indicate to the application processor (i.e. the master) that it is ready to transmit or receive (IPC slave ready signal), and can also be used by the module baseband processor to wake up the application processor if it is in hibernation. SPI_MRDYSPI_SRDYDATA_EXCHANGESPI_MOSISPI_MISOHeader  DataSPI_SCLK Figure 41: IPC Data Flow: SPI_MRDY and SPI_SRDY line usage combined with the SPI protocol For  the  correct  implementation  of  the  SPI  protocol,  the  frame  size  is  known  by  both  sides  before  a  packet transfer of each packet. The frame is composed by a header with fixed size (always 4 bytes) and a payload with variable length (must be a multiple of 4 bytes). The  same  amount of  data  is  exchanged in  both  directions  simultaneously.  Both  sides  set  their  readiness  lines (SPI_MRDY / SPI_SRDY) independently when they are ready to transfer data. For the correct transmission of the data the other side must wait for the activating interrupt to allow the transfer of the other side. The  master  starts  the  clock  shortly  after  SPI_MRDY  and  SPI_SRDY  are  set  to  active.  The  number  of  clock periods sent by the master is exactly that one of the frame-size to be transferred. The SPI_SRDY line will be set low after the master sets the clock line to idle state. The SPI_MRDY line is also set inactive after the clock line is set idle, but in case of a big transfer containing multiple packets, the SPI_MRDY line stays active.  1.9.4.2 IPC communication and power saving If  power  saving  is  enabled  by  AT  command  (AT+UPSV=1,  AT+UPSV=2  or  AT+UPSV=3),  the  LISA-U2  module automatically  enters  idle-mode  whenever  possible,  if  the  master  indicates  that  it  is  not  ready  to  transmit  or receive by the SPI_MRDY signal, or if the LISA-U2 series module itself does not transfer data.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 80 of 175 1.9.4.3 IPC communication examples In the following, three IPC communication scenarios are described:  Slave initiated data transfer, with a sleeping master  Master initiated data transfer, with a sleeping slave  Slave ended data transfer  Slave initiated transfer with a sleeping master  Figure 42: Data transfer initiated by LISA-U2 module (slave), with a sleeping application processor (master) When the master is sleeping (idle-mode), the following actions happen: 1. The slave indicates the master that is ready to send data by activating SPI_SRDY 2. When the master becomes ready to send, it signalizes this by activating SPI_MRDY 3. The master activates the clock and the two processors exchange the communication header and data 4. If the  data  has been  exchanged, the slave  deactivates  SPI_SRDY to process  the received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all the data is transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Master initiated transfer with a sleeping slave  Figure 43: Data transfer initiated by application processor (master) with a sleeping LISA-U2 module (slave) When the slave is sleeping (idle-mode), the following actions happen: 1. The Master wakes the slave by setting the SPI_MRDY line active 2. As soon as the slave is awake, it signals it by activating SPI_SRDY 3. The master activates the clock and the two processors exchange the communication header and data SPI_MRDY SPI_SRDY DATA EXCHG 1 2 4 5 Header Data Header 3 SPI_MRDY SPI_SRDY DATA EXCHG 2 4 5 Header Data Header 3 1
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 81 of 175 4. If the  data  has been  exchanged,  the  slave deactivates SPI_SRDY to process  the received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all data is transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Slave ended transfer  Figure 44: Data transfer terminated and then restarted by LISA-U2 module (slave) Starting from the state where data transfer is ongoing, the following actions will happen: 1. In case of the last transfer, the master will lower its  SPI_MRDY line. After the data-transfer is finished the line must be low. If the slave has already set its SPI_SRDY line, the master must raise its line to initiate the next transfer (slave-waking-procedure) 2. If the data has been exchanged, the slave will deactivate SPI_SRDY to process the received information. This is the normal behavior 3. The slave will indicate the master that is ready to send data by activating SPI_SRDY 4. When  the  master  is  ready  to  send,  it  will  signalize  this  by  activating  SPI_MRDY.  This  is  optional,  when SPI_MRDY is low before 5. The slave indicates immediately after a transfer termination that it is ready to start transmission again. In this case the slave will raise SPI_SRDY again. The SPI_MRDY line can be either high or low: the master has only to ensure that the SPI_SRDY change will be detected correctly via interrupt   For more details regarding IPC communication protocol, see the SPI Application Note [18].  1.9.4.4 IPC application circuits SPI_MOSI is the data line input for the module since it runs as SPI slave: it must be connected to the data line output (MOSI) of the application processor that runs as an SPI master. SPI_MISO is the data line output for the module since it runs as SPI slave: it must be connected to the data line input (MISO) of the application processor that runs as an SPI master. SPI_SCLK  is  the  clock  input  for  the  module  since it  runs as SPI slave:  it  must  be  connected to the  clock  line output (SCLK) of the application processor that runs as an SPI master. SPI_MRDY is an input for the module able to detect an external interrupt which comes from the SPI master: it must be connected to a GPIO of the application processor that runs as an SPI master. SPI_SRDY is an output for the module that must be connected to a pin of the application processor that runs as an SPI master able to detect an external interrupt which comes from the module. Signal integrity of the high speed data lines may be degraded if the PCB layout is not optimal, especially when the SPI lines are very long: keep routing short and minimize parasitic capacitance to preserve signal integrity. It is recommended to match the length of SPI signals. SPI_MRDY SPI_SRDY DATA EXCHG 5 2 1 Header Data 3 4
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 82 of 175 If a 1.8 V Application Processor is used, the SPI Master pins can be directly connected to the  specific LISA-U2 SPI slave pins as described in Figure 45. It is recommended to tri-state the output pins of the SPI Master (i.e. set in high impedance mode)  when  LISA-U2  module is in  power-down mode,  when  the external reset is forced  low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module.  MOSIApplication processor(1.8V SPI master)MISOSCLKInterruptGNDLISA-U2 series (1.8V SPI slave)56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDGPIO Figure 45: IPC / SPI Interface application circuit connecting LISA-U2 series 1.8V SPI slave to a 1.8V SPI master If a 3.0 V SPI Master Application Processor is used,  implement a circuit with appropriate unidirectional voltage translators  with  tri-state  (i.e.  high  impedance)  mode  controlled  by  the  application  processor,  as  described  in Figure 46.  4V_INTMOSIApplication processor(3.0V SPI master)MISOSCLKInterruptGNDLISA-U2 series (1.8V SPI slave)56 SPI_MOSI57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDU1VCCGPIOGPIO 59 SPI_MRDY1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2OEDIR1B2 A2B4A4DIR41V8B1 A1GNDU2VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR2DIR1OEB2 A2 Figure 46: IPC / SPI Interface application circuit connecting LISA-U2 series 1.8V SPI slave to a 3.0V SPI master Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments U2 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 36: Components for IPC / SPI Interface application circuit connecting LISA-U2 series 1.8V SPI slave to a 3.0V SPI master
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 83 of 175  If the SPI/IPC interface is not used, the SPI_MOSI, SPI_MISO, SPI_SCLK, SPI_MRDY, SPI_SRDY pins can be left unconnected.  Any  external  signal  connected  to  the  SPI  /  IPC  interface  must  be  tri-stated  when  the  module  is  in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated, insert a multi channel digital switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.  1.9.5 MUX Protocol (3GPP 27.010) LISA-U2  modules  have  a  software  layer  with  MUX  functionality,  3GPP  TS  27.010  Multiplexer  Protocol  [6], available  either  on  the  UART  or  on  the  SPI  physical  link.  The  USB  interface  does  not  support  the  multiplexer protocol. This  is  a  data  link  protocol  (layer  2  of  OSI  model)  which  uses  HDLC-like  framing  and  operates  between  the module (DCE) and the application processor (DTE) and allows a number of simultaneous sessions over the used physical  link  (UART  or  SPI):  the  user  can  concurrently  use  AT  command  interface  on  one  MUX  channel  and Packet-Switched / Circuit-Switched Data communication on another MUX channel. The multiplexer protocol can be used on one serial interface (UART or SPI) at a time. Each session consists of a stream of bytes transferring various kinds of data such as SMS, CBS, PSD, GNSS, AT commands in general. This permits, for example, SMS to be transferred to the DTE when a data connection is in progress. The following virtual channels are defined:  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling  Channel 7: SAP (SIM Access Profile) For more details see the Mux implementation Application Note [15].   If the module switch off AT command +CPWROFF is issued over a multiplexer channel, the completion of the module  power off sequence could require up to 2.5 s, after the module OK reply. Therefore, if the Application Processor (AP) controls the VCC supply of the module, the AP should disable the multiplexer protocol  and  then  issue  the  AT+CPWROFF  command  over  the  used  AT  interface,  or  otherwise  the  AP should issue  the  AT+CPWROFF command  over a multiplexer channel and wait 2.5 s  after  OK  reception before removing the module VCC supply.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 84 of 175 1.10 DDC (I2C) interface 1.10.1 Overview An I2C bus compatible  Display Data  Channel (DDC) interface for communication with u-blox GNSS receivers is available on LISA-U2 modules. The communication between a u-blox cellular module and a u-blox GNSS receiver is only provided by this DDC (I2C) interface.  Name Description Remarks SCL I2C bus clock line Open drain. External pull-up required. SDA I2C bus data line Open drain. External pull-up required. Table 37: DDC pins   The  DDC  (I2C)  interface  pins  ESD  sensitivity  rating  is  1  kV  (HBM  according  to  JESD22-A114F).  Higher protection level could  be  required  if the  lines  are  externally  accessible  on  the  application board.  Higher protection level can be achieved  by  mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  u-blox has implemented special features in LISA-U2 series cellular modules to ease the design effort required for the integration of a u-blox cellular module with a u-blox GNSS receiver. Combining a u-blox cellular module with a u-blox GNSS receiver allows designers to have full access to the GNSS receiver directly via the cellular module: it relays control messages to the GNSS receiver via a dedicated DDC (I2C) interface. A 2nd interface connected to the GNSS receiver is not necessary: AT commands via the serial interfaces (UART, USB, SPI) of the cellular module allows a fully control of the GNSS receiver from any host processor. LISA-U2 modules feature embedded GPS aiding that is a set of specific features developed by u-blox to enhance GNSS performance, decreasing Time To First Fix (TTFF), thus allowing to calculate the position in a shorter time with higher accuracy. The DDC (I2C) interface of all LISA-U2 series modules can be used to communicate with u-blox GNSS receivers and  with  external  I2C  devices  as  an  audio  codec:  the  cellular  module  acts  as  an  I2C  master  which  can communicate to more I2C slaves as allowed by the I2C bus specifications [8]. See section 1.11 for an application circuit with an external audio codec.   For more details regarding the handling of the DDC (I2C) interface and the GPS aiding features, see the u-blox  AT  Commands  Manual  [2]  (AT+UGPS,  AT+UGPRF,  AT+UGPIOC,  +UI2CO,  +UI2CW,  +UI2CR, +UI2CREGR, +UI2CC AT commands) and GNSS Implementation Application Note [16].   1.10.2 DDC application circuits 1.10.2.1 General considerations The  DDC  I2C-bus  master  interface of  LISA-U2  series modules  can  be  used  to  communicate with  u-blox  GNSS receivers and with other external  I2C-bus slaves as an audio  codec:  beside the general considerations reported below, see the section 1.10.2.2 for specific guidelines and application circuit examples for the connection to u-blox GNSS receivers and see the section 1.11 for an application circuit example with an external audio codec I2C-bus slave.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 85 of 175 To be compliant to the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be mounted externally. Resistor values must conform to the I2C bus specifications [8]: for example, 4.7 k resistors can be commonly used. Pull-ups must be connected to a supply voltage of 1.8 V (typical), since this is the voltage domain of the DDC pins which are not tolerant to higher voltage values (e.g. 3.0 V).  Connect the DDC (I2C) pull-ups to the V_INT 1.8 V supply source, or another 1.8 V supply source enabled after V_INT (e.g., as the GNSS 1.8 V supply present in Figure 47 application circuit), as any external signal connected to  the  DDC  (I2C) interface  must not  be  set  high  when  the  module  is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least until the switch on of the V_INT supply of DDC pins), to avoid latch-up of circuits and let a proper boot of the module. See Figure 18 for power-on sequence description and timings.  DDC Slave-mode operation is not supported, the module can act as master only. Two lines, serial data (SDA) and serial clock (SCL), carry information on the bus. SCL is used to synchronize data transfers, and SDA is the data line. Since both lines are open drain outputs, the DDC devices can only drive them low  or leave them open. The pull-up resistor  pulls the  line up to  the  supply rail  if  no DDC  device is pulling it down to GND. If the pull-ups are missing, SCL and SDA lines are undefined and the DDC bus will not work. The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase the  capacitance.  If  the  bus capacitance  is  increased,  use  pull-up  resistors with  nominal  resistance value lower than 4.7 k, to match the I2C bus specifications [8] regarding rise and fall times of the signals.  Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible.  If the pins are not used as DDC bus interface, they can be left unconnected.  1.10.2.2 Connection with u-blox GNSS receivers General considerations LISA-U2 modules support these GPS aiding types:  Local aiding  AssistNow Online  AssistNow Offline  AssistNow Autonomous The  embedded  GPS  aiding  features  can  be  used  only  if  the  DDC  (I2C)  interface  of  the  cellular  module  is connected to the u-blox GNSS receivers. The GPIO pins of LISA-U2 series modules can handle:  GNSS receiver power-on/off (“GNSS supply enable” function provided by GPIO2)  The wake  up from idle-mode when the  GNSS receiver is ready to send data  (“GNSS data ready” function provided by GPIO3)  The RTC synchronization signal to the GNSS receiver (“GNSS RTC sharing” function provided by GPIO4)  The GPIO2 is by default configured to provide the “GNSS supply enable” function (parameter <gpio_mode> of AT+UGPIOC  command  set  to  3  by  default),  to  enable  or  disable  the  supply  of  the  u-blox  GNSS  receiver connected to the cellular module by the AT+UGPS command. The pin is set a  Output /  High, to switch on the u-blox GNSS receiver, if the parameter <mode> of AT+UGPS command is set to 1  Output / Low, to switch off the u-blox GNSS receiver, if the parameter <mode> of AT+UGPS command is set to 0 (default setting) The  pin  must  be  connected  to  the  active-high  enable  pin  (or  the  active-low  shutdown  pin)  of  the  voltage regulator that supplies the u-blox GNSS receiver on the application board.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 86 of 175 The  “GNSS  supply  enable”  function improves  the  power consumption  of  the  GNSS receiver. When the  GNSS functionality  is  not  required, the GNSS receiver can  be  completely  switched off  by the  cellular module that  is controlled by the application processor with AT commands.  The  GPIO3 is  by default configured  to  provide the  “GNSS data  ready”  function  (parameter  <gpio_mode>  of AT+UGPIOC command set to 4 by default), to sense when the u-blox  GNSS receiver connected to the  cellular module is ready to send data by the DDC (I2C) interface. The pin will be set as  Input, to sense the line status, waking up the cellular module from idle-mode when the u-blox GNSS receiver is ready to send data by the DDC (I2C) interface, if the parameter <mode> of +UGPS AT command is set to 1 and the parameter <GPS_IO_configuration> of +UGPRF AT command is set to 16  Tri-state with an internal active pull-down enabled, otherwise (default setting) The pin that provides the “GNSS data ready” function must be connected to the data ready output of the u-blox GNSS receiver (i.e. the pin TxD1 of the u-blox GNSS receiver) on the application board. The “GNSS data  ready”  function  provides an  improvement  in the  power consumption of the cellular  module. When power saving is enabled in the cellular module by the AT+UPSV command and the GNSS receiver does not send data  by the DDC (I2C) interface,  the module automatically enters idle-mode  whenever possible. With the “GNSS data ready” function the  GNSS receiver can indicate to the cellular module that it is ready to send data by the DDC (I2C) interface: the GNSS receiver can wake up the cellular module if it is in idle-mode, so that data sent by the GNSS receiver will not be lost by the cellular module even if power saving is enabled.  The GPIO4 is by  default configured to  provide  the “GNSS RTC sharing” function (parameter <gpio_mode> of +UGPIOC AT command set to 5), to provide an RTC (Real Time Clock) synchronization signal at the power up of the u-blox GNSS receiver connected to the cellular module. The pin will be set as  Output,  to  provide  an  RTC  synchronization  signal  to  the  u-blox  GNSS  receiver  for  RTC  sharing  if  the parameter  <mode>  of  AT+UGPS  command  is  set  to  1  and  the  parameter  <GPS_IO_configuration>  of +UGPRF AT command is set to 32  Output / Low, otherwise (default setting) The pin that provides the “GNSS RTC sharing” function must be connected to the RTC synchronization signal of the u-blox GNSS receiver (i.e. the pin EXTINT0 of the u-blox GNSS receiver) on the application board. The “GNSS RTC sharing” function provides improved GNSS receiver performance, decreasing the Time To First Fix (TTFF),  and  thus  allowing to calculate the position in a shorter time with higher accuracy. When GPS  local aiding  is enabled,  the  cellular module  automatically  uploads data such  as  position,  time, ephemeris,  almanac, health and ionospheric parameter from the GNSS receiver into its local memory, and restores this to the GNSS receiver at the next power up of the GNSS receiver.  Connection with u-blox 1.8 V GNSS receivers Figure 47 shows an application circuit for connecting a LISA-U2 cellular module to a u-blox 1.8 V GNSS receiver.  SDA and SCL pins of the LISA-U2 cellular module are directly connected to the relative I2C pins of the u-blox 1.8 V GNSS receiver, with appropriate pull-up resistors connected to the 1.8 V GNSS supply enabled after the V_INT supply of the I2C pins of the LISA-U2 cellular module.  GPIO3  and GPIO4  pins  are  directly  connected  respectively  to  the  TxD1  and  EXTINT0  pins  of  the  u-blox 1.8 V GNSS receiver to provide “GNSS data ready” and “GNSS RTC sharing” functions.  A pull-down resistor is mounted on GPIO4 line for correct “GNSS RTC sharing” function implementation.  A pull-down resistor is mounted on the GPIO2 line to avoid a switch on of the u-blox GNSS receiver when the LISA-U2 module is in the internal reset state.  The V_BCKP supply output of the LISA-U2 cellular module is connected to the V_BCKP backup supply input pin of the GNSS receiver to provide the supply for the GNSS real time clock and backup RAM when the  VCC supply  of  the  cellular  module  is  within  its  operating  range  and  the  VCC  supply  of  the  GNSS  receiver  is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either a hot start
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 87 of 175 or a  warm  start  (depending on  the duration of  the  GNSS VCC  outage) and to  maintain  the configuration settings saved in the backup RAM.   “GNSS  data  ready”  and  “GNSS RTC  sharing”  functions are not  supported  by  all  u-blox GNSS receivers HW  or  ROM/FW  versions.  See  the  GNSS  Implementation  Application  Note  [16]  or  to  the  Hardware Integration Manual of the u-blox GNSS receivers for the supported features.  LISA-U2 series R1INOUTGNDGPS LDORegulatorSHDNu-blox GNSS1.8 V receiverSDA2SCL2R21V8 1V8VMAIN1V8U121 GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO446452324VCCR3V_BCKP V_BCKP2R4 Figure 47: DDC Application circuit for u-blox 1.8 V GNSS receiver Reference Description Part Number - Manufacturer R1, R2, R4 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp U1 Voltage Regulator for GNSS receiver See GNSS receiver Hardware Integration Manual Table 38: Components for DDC application circuit for u-blox 1.8 V GNSS receiver  As an alternative to using an external voltage regulator,  the  V_INT supply output of  LISA-U2  cellular modules can be used to supply a u-blox 1.8 V GNSS receiver of the u-blox 6 generation (or later u-blox generation). The V_INT supply is able to withstand the maximum current consumption of these positioning receivers. The V_INT supply output provides low voltage ripple (up to 15 mVpp) when the module is in active-mode or in connected-mode, but it provides higher voltage ripple (up to 70 mVpp) when the module is in the low power idle-mode with power saving configuration enabled by AT+UPSV (see the u-blox AT Commands Manual [2]). According to the voltage ripple characteristic of the V_INT supply output:  The power saving configuration cannot be enabled to use V_INT output to properly supply any 1.8 V GNSS receiver of the u-blox 6 generation and any 1.8 V GNSS receiver of the u-blox 7 generation or any newer u-blox GNSS receiver generation with TCXO.  The power  saving configuration  can  be  enabled  to use  V_INT output  to  properly supply  any 1.8  V  GNSS receiver of the u-blox 7 generation or any newer u-blox GNSS receiver generation without TCXO.  Additional filtering may be needed to properly supply an external LNA, depending on the characteristics  of the used LNA, adding a series ferrite bead and a bypass capacitor (e.g. the Murata BLM15HD182SN1 ferrite bead and the Murata GRM1555C1H220J 22 pF capacitor) at the input of the external LNA supply line. See the GNSS Implementation Application Note [16] for additional guidelines using the V_INT supply output of LISA-U2 cellular modules to supply a u-blox 1.8 V GNSS receiver.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 88 of 175 Connection with u-blox 3.0 V GNSS receivers Figure 48 shows an application circuit for connecting a LISA-U2 cellular module to a u-blox 3.0 V GNSS receiver:  As the SDA and SCL pins of the LISA-U2 cellular module are not tolerant up to 3.0 V, the connection to the related  I2C  pins  of  the  u-blox 3.0  V  GNSS  receiver  must  be  provided  using  a proper  I2C-bus  Bidirectional Voltage Translator (e.g. TI TCA9406, which additionally provides the partial power down feature so that the GNSS 3.0 V supply can be ramped up before the V_INT 1.8 V cellular supply), with proper pull-up resistors.  As the GPIO3 and GPIO4 pins of the LISA-U2 cellular module are not tolerant up to 3.0 V, the connection to the related pins of the u-blox 3.0 V GNSS receiver must be provided using a proper Unidirectional General Purpose  Voltage  Translator  (e.g.  TI  SN74AVC2T245,  which  additionally  provides  the  partial  power  down feature so that the 3.0 V GNSS supply can be also ramped up before the V_INT 1.8 V cellular supply).  The V_BCKP supply output of the cellular module can be directly connected to the V_BCKP backup supply input pin of the GNSS receiver as in the application circuit for a u-blox 1.8 V GNSS receiver.  LISA-U2 seriesu-blox GNSS 3.0 V receiver23 GPIO324 GPIO41V8B1 A1GNDU3B2A2VCCBVCCAUnidirectionalVoltage TranslatorC4 C53V0TxD1EXTINT0R1INOUTGNDGPS LDORegulatorSHDNR2VMAIN3V0U121 GPIO246 SDA45 SCLR4 R51V8SDA_A SDA_BGNDU2SCL_ASCL_BVCCAVCCBI2C-bus Bidirectional Voltage Translator4V_INTC1C2 C3R3SDA2SCL2VCCDIR1DIR22V_BCKPV_BCKPOE R7OE Figure 48: DDC Application circuit for u-blox 3.0 V GNSS receiver Reference Description Part Number - Manufacturer R1, R2, R4, R5, R7 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1, C1 Voltage Regulator for GNSS receiver and related output bypass capacitor See GNSS receiver Hardware Integration Manual U2 I2C-bus Bidirectional Voltage Translator TCA9406DCUR - Texas Instruments U3 Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 39: Components for DDC application circuit for u-blox 3.0 V GNSS receiver
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 89 of 175 1.11 Audio Interface All LISA-U2 series modules provide two bidirectional 4-wire I2S digital audio interfaces for connecting to remote digital audio devices:  First 4-wire I2S digital audio interface (I2S_CLK, I2S_RXD, I2S_TXD and I2S_WA)  Second 4-wire I2S digital audio interface (I2S1_CLK, I2S1_RXD, I2S1_TXD and I2S1_WA)  Audio signal routing  can  be  controlled  by  the  dedicated  AT command +USPM  (see  the  u-blox  AT  Commands Manual  [2]). This command allows  setting the audio path  mode, composed by the uplink audio path and the downlink audio path. Each uplink and downlink path mode defines the physical input  / output, the set of parameters to process the uplink audio signal (uplink gains, uplink digital filters, echo canceller parameters) and the set of parameters to process the downlink audio signal (downlink gains, downlink digital filters and sidetone).  The set of parameters to  process  the  uplink  or the  downlink audio signal  can  be  changed  with dedicated  AT commands for each uplink or downlink path and then stored in two profiles in the non volatile memory (see the u-blox AT Commands Manual [2] for audio parameters tuning commands).  LISA-U2 series modules can act as I2S master or I2S slave. In master mode the word alignment and clock signals of the I2S digital audio interface are generated by the module. In slave mode these signal must be generated by the remote device. Table 40 lists the signals related to digital audio function.  Name Description Remarks I2S_TXD I2S transmit data Module output I2S_RXD I2S receive data Module input  I2S_CLK I2S clock Module output in master mode Module input in slave mode I2S_WA I2S word alignment Module output in master mode Module input in slave mode I2S1_TXD Second I2S transmit data Module output  I2S1_RXD Second I2S receive data Module input  I2S1_CLK Second I2S clock Module output in master mode Module input in slave mode I2S1_WA Second I2S word alignment Module output in master mode Module input in slave mode CODEC_CLK Digital clock output Digital clock output for external audio codec Configurable to 26 MHz or 13 MHz Table 40: Digital audio interface pins  The I2S interfaces and CODEC_CLK pins ESD sensitivity rating is  1 kV (Human Body Model according to JESD22-A114F).  Higher  protection  level  could  be  required  if  the  lines  are  externally  accessible  on  the application board. Higher protection level can be achieved by mounting a general purpose ESD protection (e.g.  EPCOS CA05P4S14THSG  varistor  array)  on  the  lines  connected  to  the  I2S  interfaces  pins, close  to accessible points, and a low capacitance (i.e. less than 10 pF) ESD protection (e.g. AVX USB0002) on the line connected to CODEC_CLK pin, close to accessible point.  The I2S interface can be set to two modes, by the <I2S_mode> parameter of the AT+UI2S command:  PCM mode  Normal I2S mode
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 90 of 175 The I2S interface can be set to two configurations, by the <I2S_Master_Slave> parameter of AT+UI2S:  Master mode  Slave mode  The sample rate of transmitted/received words can be set, by the <I2S_sample_rate> parameter of AT+UI2S, to:  8 kHz  11.025 kHz  12 kHz  16 kHz  22.05 kHz  24 kHz  32 kHz  44.1 kHz  48 kHz  The <main_uplink> and <main_downlink> parameters of the AT+USPM command must be properly configured to select the I2S digital audio interfaces paths (for more details see the u-blox AT Commands Manual [2]):  <main_uplink> has to be properly set to select: o the first I2S interface (using I2S_RXD module input) o the second I2S interface (using I2S1_RXD module input)  <main_downlink> has to be properly set to select:  o the first I2S interface (using I2S_TXD module output) o the second I2S interface (using I2S1_TXD module output) Parameters  of  digital  path  can  be  configured  and  saved  as  the  normal  analog  paths,  using  appropriate  path parameter as described in the u-blox AT Commands Manual [2], +USGC, +UMGC, +USTN AT command. Analog gain parameters are not used. The I2S receive data input and the I2S transmit data output signals can use the following resources:  Digital  filters  and  digital  gains  are  available  in  both  uplink  and  downlink  direction.  They  can  be  properly configured by the AT commands  Ringer tone and service tone are mixed on the TX path when active (downlink)  The HF algorithm acts on I2S path   See the u-blox AT Commands Manual [2] (AT+UI2S command) for the possible settings of I2S interface.  1.11.1 I2S interface - PCM mode Main features of the I2S interface in PCM mode:  I2S runs in PCM - short alignment mode (configurable by AT commands)  I2S word alignment signal can be configured to 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48 kHz  I2S word alignment toggles high for 1 or 2 CLK cycles of synchronization (configurable), then toggles low for 16 CLK cycles of sample width. Frame length can be 1 + 16 = 17 bits or 2 + 16 = 18 bits  I2S  clock  frequency  depends  on  frame  length  and  <sample_rate>.  Can  be  17  x  <sample_rate>  or  18  x <sample_rate>  I2S transmit and I2S receive data are 16 bit words long with the same sampling rate as I2S word alignment, mono. Data is in 2’s complement notation. MSB is transmitted first
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 91 of 175  When I2S word alignment toggles high, the first synchronization bit is always low. Second synchronization bit (present only in case of 2 bit long I2S word alignment configuration) is MSB of the transmitted word (MSB is transmitted twice in this case)  I2S transmit data changes on I2S clock rising edge, I2S receive data changes on I2S clock falling edge  1.11.2 I2S interface - Normal I2S mode Normal I2S supports:  16 bits word  Mono interface  Configurable sample rate: 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48 kHz Main features of I2S interface in normal I2S mode:  I2S  word alignment  signal  always  runs  at  <sample_rate>  and  synchronizes  2  channels  (timeslots  on  word alignment high, word alignment low)  I2S transmit data  is composed of 16 bit words, dual mono (the words are written on both channels). Data are in  2’s complement notation. MSB  is transmitted first.  The  bits are written  on  I2S clock  rising  or falling edge (configurable)  I2S receive data is read as 16 bit words, mono (words are read only on the timeslot with WA high). Data is read in 2’s complement notation. MSB is read first. The bits are read on the  I2S clock edge opposite to I2S transmit data writing edge (configurable)  I2S clock frequency is 16 bits x 2 channels x <sample_rate> The modes are configurable through a specific AT command (see the u-blox AT Commands Manual [2], +UI2S AT command) and the following parameters can be set:  MSB can be 1 bit delayed or non-delayed on I2S word alignment edge  I2S transmit data can change on rising or falling edge of I2S clock signal (rising edge in this example)  I2S receive data are read on the opposite front of I2S clock signal  1.11.3 I2S interface application circuits LISA-U2 I2S digital audio interfaces can be connected to an external digital audio device for voice applications.  Any  external  digital  audio  device  compliant  to  the  configuration  of  the  digital  audio  interface  of  the  cellular module can be used, given that the external digital audio device has to provide:  The opposite role: slave or master for LISA-U2 modules that may act as master or slave  The same mode and frame format: PCM / short alignment or Normal I2S mode / long alignment mode with o data in 2’s complement notation o MSB transmitted first o word length = 16-bit o frame  length = 17-bit or  18-bit  in  PCM  /  short  alignment mode  (16 +  1 or 16 +  2 clock cycles, with Word Aligment / Synchronization signal set high for 1 clock cycle or 2 clock cycles), or o frame length = 32-bit in Normal I2S mode / long alignment mode (16 x 2 clock cycles)  The same sample rate and serial clock frequency: as the clock frequency depends on the frame length and the sample rate, the clock frequency can be o 17 x <I2S_sample_rate> or 18 x <I2S_sample_rate> in PCM / short alignment mode, or  o 16 x 2 x <I2S_sample_rate> in Normal I2S mode / long alignment mode  Compatible  voltage  levels  (1.80  V  typ.),  otherwise  it  is  recommended  to  connect  the  1.8 V  digital  audio interface  of  the  module  to  the  external  3.0  V  (or  similar)  digital  audio  device  by  means  of  appropriate
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 92 of 175 unidirectional  voltage  translators  (e.g.  Texas  Instruments  SN74AVC4T774  or  SN74AVC2T245),  using  the module V_INT output as 1.8 V supply for the voltage translators on the module side  For the appropriate selection of a compliant external digital audio device, see +UI2S AT command description in the u-blox AT Commands Manual [2] for further details regarding the capabilities and the possible settings of I2S digital audio interface of LISA-U2 series modules.  Figure 49 shows an application circuit with a generic digital audio device. 43I2S_CLK41I2S_WAI2S ClockI2S Word AlignmentLISA-U2 series42I2S_TXD44I2S_RXDI2S Data InputI2S Data OutputGND GND1.8 V digital audio device Figure 49: I2S interface application circuit with a generic digital audio device As in general any external digital audio device compliant to the configuration of the digital audio interface of the cellular module can be  used  with  LISA-U2 series  modules,  an appropriate specific  application circuit has to  be implemented and configured according to the particular external digital audio device or audio codec used and according to the application requirements.  Examples of manufacturers offering compatible audio codec parts, suitable to provide basic analog audio voice capability on the application device, are the following:   Maxim Integrated (as the MAX9860, MAX9867, MAX9880A audio codecs)   Texas Instruments / National Semiconductor   Cirrus Logic / Wolfson Microelectronics   Nuvoton Technology   Asahi Kasei Microdevices   Realtek Semiconductor   Figure 50 and Table 41 describe an application circuit for I2S digital audio interfaces of LISA-U2 series modules, providing voice capability  using an external audio voice  codec. DAC and ADC integrated in the external audio codec respectively converts an incoming digital  data stream to analog  audio  output through a mono amplifier and converts the microphone input signal to the digital bit stream over the digital audio interface. An I2S digital audio interface of the LISA-U2 series modules that acts as an I2S master is connected to the digital audio interface of the external audio codec (that acts as an I2S slave). The first I2S interface can be used as well as the second I2S interface of the cellular module. The CODEC_CLK digital output clock of the cellular module is connected to the clock input of the external audio codec to provide clock reference. Signal integrity of the high speed lines may be  degraded if the PCB layout is not optimal, especially when the CODEC_CLK clock line or also the I2S digital audio interface lines are very long: keep routing short and minimize parasitic capacitance to preserve signal integrity. The external audio codec is controlled by the cellular module using the DDC (I2C) interface: this interface can be used to communicate with u-blox GNSS receivers and at the same time to control an external audio codec on all LISA-U2 series modules. The  V_INT  supply  output  of  the  cellular  module  provides  the  supply  to  the  external  audio  codec,  defining  a proper voltage level for the digital interfaces.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 93 of 175 Additional components are provided  for EMC and ESD immunity conformity according to European Norms for R&TTE Directive (99/5/EC) and  EMC  Directive  (89/336/EEC) compliance.  The  recommended  parts  for  EMC and ESD immunity conformity are: a 10 nF bypass capacitor (e.g. Murata GRM155R71C103KA88) and a proper series chip ferrite bead noise/EMI suppression filter (e.g. Murata BLM15HD182SN1) provided on each microphone line input and speaker line output of the external codec as described in Figure 50 and Table 41.  53I2S1_CLK54I2S1_WAR2R1BCLKGNDU1LRCLKLISA-U2 seriesAudio   Codec40I2S1_TXD39I2S1_RXDSDINSDOUT46SDA45SCLSDASCL52CODEC_CLK MCLKGNDIRQnR3 C3C2C14V_INTVDD1V8MICBIASC4 R4C5C6EMI1MICLNMICLPD1Microphone ConnectorEMI2MICC12 C11J1MICGND R5 C8 C7D2SPKSpeaker ConnectorOUTPOUTNJ2C10 C9C14 C13EMI3EMI4 Figure 50: I2S interface application circuit with an external audio codec to provide voice capability Reference Description Part Number – Manufacturer C1 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 – Murata C2, C4, C5, C6 1 µF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J105KE19 – Murata C3 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C7, C8, C9, C10 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 – Murata C11, C12, C13, C14 10 nF Capacitor Ceramic X5R 0402 10% 50V GRM155R71C103KA88 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX EMI1, EMI2, EMI3, EMI4 Chip Ferrite Bead Noise/EMI Suppression Filter 1800 Ohm at 100 MHz, 2700 Ohm at 1 GHz BLM15HD182SN1 – Murata J1 Microphone Connector Various manufacturers  J2 Speaker Connector Various manufacturers  MIC 2.2 k Electret Microphone Various manufacturers R1, R2  4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 10 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R4, R5 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp SPK 32  Speaker Various manufacturers  U1 16-Bit Mono Audio Voice Codec MAX9860ETG+ - Maxim Table 41: Example of components for audio voice codec application circuit  Any external signal connected to the digital audio interface must be tri-stated or set low when the module is in power-down mode and  during the module power-on sequence (at least  until  the activation of  the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module. If  the  external  signals  connected  to  the  cellular  module  cannot  be  tri-stated  or  set  low,  insert  a  multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set it to high impedance during module power down mode and during the module power-on sequence.  If the I2S digital audio pins are not used, they can be left unconnected on the application board.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 94 of 175 1.11.4 Voiceband processing system  The voiceband processing on the LISA-U2 modules is implemented in the DSP core inside the baseband chipset.  The external digital audio devices can be interfaced directly to the DSP digital processing part via the I2S digital interface. With exception of the speech encoder/decoder, audio processing can be controlled by AT commands.  The audio processing is implemented within the different blocks of the voiceband processing system:   Sample-based  Voice-band  Processing  (single  sample  processed  at  16  kHz  for  Wide  Band  AMR  codec  or 8 kHz for all other speech codecs)  Frame-based Voice-band Processing (frames of 320 samples for Wide Band AMR codec or 160 samples for all other speech codecs are processed every 20 ms) These blocks are connected by buffers (circular buffer and voiceband sample buffer) and sample rate converters (for 8 / 16 to 47.6 kHz conversion). The voiceband audio processing implemented in the DSP core of LISA-U2 series modules is summarized in Figure 51.  I2S_RXDSwitchI2S1_RXD UBF 2/6UBF 1/5Hands-freeTo Radio TXUplinkDigital GainI2S1_TXDSwitchI2S_TXDScal_Rec Digital GainTone GeneratorI2Sx RX UBF 4/8UBF 3/7DBF 3/7DBF 4/8DBF 1/5DBF 2/6Legend:UBF= Uplink Biquad FilterDBF = Downlink Biquad FilterI2Sx TXSidetoneFrom Radio RXSpeech levelPCM PlayerMix_Afe Figure 51: Audio processing system of LISA-U2 series modules  LISA-U2 modules audio signal processing algorithms are:   Speech encoding (uplink) and decoding (downlink).The following speech codecs are supported in firmware on the DSP for speech encoding and decoding: GERAN GMSK codecs o GSM HR (GSM Half Rate) o GSM FR (GSM Full Rate) o GSM EFR (GSM Enhanced Full Rate) o HR AMR (GSM Half Rate Adaptive Multi Rate - Narrow Band) o FR AMR (GSM Full Rate Adaptive Multi Rate - Narrow Band) o FR AMR-WB (GSM Full Rate Adaptive Multi Rate - Wide Band)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 95 of 175 UTRAN codecs: o UMTS AMR2 (UMTS Adaptive Multi Rate version 2 – Narrow Band) o UMTS AMR-WB (UMTS Adaptive Multi Rate – Wide Band)  Mandatory sub-functions: o Discontinuous transmission, DTX (GSM 46.031, 46.041, 46.081 and 46.093 standards) o Voice activity detection, VAD (GSM 46.032, 46.042, 46.082 and 46.094 standards) o Background noise calculation (GSM 46.012, 46.022, 46.062 and 46.092 standards)  Function configurable via specific AT commands (see the u-blox AT Commands Manual [2]) o Signal routing: +USPM command o Analog amplification, Digital amplification: +USGC, +CLVL, +CRSL, +CMUT command o Digital filtering: +UUBF, +UDBF commands o Hands-free  algorithms  (echo  cancellation,  Noise  suppression,  Automatic  Gain  control)  +UHFP command o Sidetone generation (feedback of uplink speech signal to downlink path): +USTN command o Playing/mixing of alert tones: Service tones: Tone generator with 3 sinus tones +UPAR command User generated tones: Tone generator with a single sinus tone +UTGN command PCM audio files (for prompting): The storage format of PCM audio files is 8 kHz sample rate, signed 16 bits, little endian, mono
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 96 of 175 1.12 General Purpose Input/Output (GPIO) LISA-U2 series modules provide up to 14 pins (GPIO1-14) which can be configured as general purpose input or output, or  can be  configured to provide special functions via u-blox AT  commands (for further details see the u-blox AT Commands Manual [2], +UGPIOC, +UGPIOR, +UGPIOW, +UGPS, +UGPRF, +USPM).  The following functions are available in the LISA-U2 modules:   GSM Tx burst indication: GPIO1  pin  can  be  configured  by  AT+UGPIOC  to  indicate  when  a  GSM  Tx  burst/slot  occurs,  setting  the parameter <gpio_mode> of AT+UGPIOC command to 9. No GPIO pin is by default configured to provide the “GSM Tx burst indication” function. The pin configured to provide the “GSM Tx burst indication” function is set as o Output / High, since ~10 µs before the start of first Tx slot, until ~5 µs after the end of last Tx slot o Output / Low, otherwise The pin configured to provide the “GSM Tx burst indication” function can be connected on the application board to an input pin of an application processor to indicate when a GSM Tx burst/slot occurs.   GNSS supply enable: The GPIO2 is by default configured by AT+UGPIOC command to enable or disable the supply of the u-blox GNSS receiver connected to the cellular module. The GPIO1, GPIO3, GPIO4 or GPIO5 pins can be configured to provide the “GNSS supply enable” function, alternatively to the default GPIO2 pin, setting the parameter <gpio_mode> of AT+UGPIOC command to 3. The  “GNSS  supply  enable”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “GNSS supply enable” function is set as o Output  /  High,  to  switch  on  the  u-blox  GNSS  receiver,  if  the  parameter  <mode>  of  AT+UGPS command is set to 1 o Output  /  Low,  to  switch  off  the  u-blox  GNSS  receiver,  if  the  parameter  <mode>  of  AT+UGPS command is set to 0 (default setting) The  pin  configured  to  provide  the  “GNSS  supply enable”  function  must  be  connected  to  the  active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GNSS receiver on the application board.   GNSS data ready: Only  the  GPIO3  pin  provides  the  “GNSS  data  ready”  function,  to  sense  when  a  u-blox  GNSS  receiver connected to the cellular module  is ready  to send  data  via  the  DDC  (I2C)  interface, setting  the  parameter <gpio_mode> of AT+UGPIOC command to 4. The pin configured to provide the “GNSS data ready” function will be set as o Input,  to  sense  the  line  status,  waking  up  the  cellular  module  from  idle-mode  when  the  u-blox GNSS  receiver is ready  to  send  data  via  the  DDC  (I2C)  interface;  this  is  possible  if  the  parameter <mode>  of  AT+UGPS  command  is  set  to  1  and  the  parameter  <GPS_IO_configuration>  of AT+UGPRF command is set to 16 o Tri-state with an internal active pull-down enabled, otherwise (default setting) The pin that provides the “GNSS data ready” function must be connected to the data ready output of the u-blox GNSS receiver (i.e. the pin TxD1 of the u-blox GNSS receiver) on the application board.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 97 of 175  GNSS RTC sharing: Only  the  GPIO4 pin  provides  the  “GNSS  RTC  sharing”  function,  to  provide  an  RTC  (Real  Time  Clock) synchronization signal to the u-blox GNSS receiver connected to the cellular module, setting the parameter <gpio_mode> of AT+UGPIOC command to 5. The pin configured to provide the “GNSS RTC sharing” function will be set as o Output, to provide an RTC (Real Time Clock) synchronization signal to the u-blox GNSS receiver if the parameter <mode> of AT+UGPS command is set to 1 and parameter <GPS_IO_configuration> of AT+UGPRF command is set to 32 o Output / Low, otherwise (default setting) The  pin  that  provides  the  “GNSS  RTC  sharing”  function  must  be  connected  to  the  RTC  synchronization input  of  the  u-blox  GNSS  receiver  (i.e.  the  pin  EXTINT0  of  the  u-blox  GNSS  receiver)  on  the  application board.   SIM card detection: The GPIO5 pin is by default configured by AT+UGPIOC command to detect SIM card presence. Only the GPIO5 pin can be configured to provide the “SIM card detection” function, setting the parameter <gpio_mode> of AT+UGPIOC command to 7 (default setting). The pin configured to provide the “SIM card detection” function is set as o Input with an internal active pull-down enabled, to sense SIM card presence The pin must be connected on the application board to SW2 pin of the SIM card holder, which must provide 2 pins for the mechanical card presence detection, with a  470 kΩ pull-down resistor. SW1 pin of  the SIM card holder must be connected to V_INT pin of the module, by a 1 kΩ pull-up resistor. See Figure 52 and section 1.8 for the application circuit. The  GPIO5  signal  will  be  pulled  low  by  the  pull-down when  a  SIM card is not inserted in the holder, and will be pulled high by the pull-up when a SIM card is present. The  GPIO5  pin  is  configured  as an  external  interrupt  to  detect  SIM  card  presence.  An  Unsolicited Result Code (URC) can be generated each time that there is a change of status (for more details see the “simind” value of the <descr> parameter of +CIND and +CMER commands in the u-blox AT Commands Manual [2]). All LISA-U2 series modules provide the additional function “SIM card hot insertion/removal” on the GPIO5 pin,  which  can  be  enabled  using  the  AT+UDCONF=50  command  (for  more  details  see  the  u-blox  AT Commands Manual [2]).   Network status indication: GPIO1,  GPIO2,  GPIO3,  GPIO4  or  GPIO5  can  be  configured  to  indicate  network  status  (i.e.  no  service, registered home 2G network, registered home 3G network, registered visitor 2G network, registered visitor 3G  network,  voice  or  data  2G/3G  call  enabled),  setting  the  parameter  <gpio_mode>  of  AT+UGPIOC command to 2. No GPIO pin is by default configured to provide the “Network status indication” function.  The  “Network  status  indication”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “Network status indication” function is set as o Continuous Output / Low, if no service (no network coverage or not registered) o Cyclic Output / High for 100 ms, Output / Low for 2 s, if registered home 2G network o Cyclic Output / High for 50 ms, Output / Low for 50 ms, Output / High for 50 ms, Output / Low for 2 s, if registered home 3G network o Cyclic Output / High for 100 ms, Output / Low for 100 ms, Output / High for 100 ms, Output / Low for 2 s, if registered visitor 2G network (roaming) o Cyclic Output / High for 50 ms, Output / Low for 50 ms, Output / High for 50 ms, Output / Low for 100 ms, if registered visitor 3G network (roaming) o Continuous Output / High, if voice or data 2G/3G call enabled
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 98 of 175 The pin configured to provide the “Network status indication” function can be connected on the application board to an input pin of an application processor or can drive a LED by a transistor with integrated resistors to indicate network status.   Module status indication: The  GPIO1  and  GPIO13  pins  can  be  configured  to  indicate  module  status  (power-off  mode,  i.e.  module switched  off,  versus  idle,  active  or  connected  mode,  i.e.  module  switched  on),  properly  setting  the parameter <gpio_mode> of AT+UGPIOC command to 10. No GPIO pin is by default configured to provide the “Module status indication”. The pin configured to provide the “Module status indication” function is set as o Output  /  High,  when  the  module  is  switched  on  (any  operating  mode  during  module  normal operation: idle, active or connected mode) o Output / Low, when the module is switched off (power off mode) The  “Module  status  indication”  mode  can  be  provided  only  on  one  pin  at  a  time:  it  is  not  possible  to simultaneously set the same mode on another pin.   Module operating mode indication: The GPIO14 and GPIO5 pins can be configured to indicate module operating mode (idle-mode versus active or connected mode), properly setting the parameter <gpio_mode> of AT+UGPIOC command to 11. No GPIO pin is by default configured to provide the “Module operating mode indication”. The pin configured to provide the “Module operating mode indication” function is set as o Output / High, when the module is in active or connected mode o Output / Low, when the module is in idle-mode (that can be reached if power saving is enabled by +UPSV AT command: for further details see the u-blox AT Commands Manual [2]) The “Module operating mode indication” mode can be provided only on one pin at a time: it is not possible to simultaneously set the same mode on another pin.    I2S digital audio interface: The GPIO6, GPIO7, GPIO8, GPIO9 pins are by default configured as the second I2S digital audio interface (I2S1_RXD, I2S1_TXD, I2S1_CLK, I2S1_WA respectively). Only these pins can be configured as the second I2S digital audio interface, correctly setting the parameter <gpio_mode> of AT+UGPIOC command to 12 (default setting).   SPI serial interface: GPIO10,  GPIO11,  GPIO12,  GPIO13  and  GPIO14  pins  are  by  default  configured  as  the  SPI  /  IPC  serial interface (SPI_SCLK, SPI_MOSI, SPI_MISO, SPI_SRDY and SPI_MRDY respectively). Only  these  pins  can  be  configured  as  the  SPI  /  IPC  serial  interface,  correctly  setting  the  parameter <gpio_mode> of AT+UGPIOC command to 13 (default setting).   General purpose input: All the GPIOs can be configured as input to sense high or low digital level through AT+UGPIOR command, setting the parameter <gpio_mode> of AT+UGPIOC command to 1. The  “General  purpose  input”  mode  can  be  provided  on  more  than  one  pin  at  a  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose input”. The pin configured to provide the “General purpose input” function is set as o Input, to sense high or low digital level by AT+UGPIOR command.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 99 of 175 The pin can be connected on the application board to an output pin of an application processor to sense the digital signal level.   General purpose output: All  the  GPIOs  can  be  configured  as  output  to  set  the  high  or  the  low  digital  level through  AT+UGPIOW command, setting the parameter <gpio_mode> of +UGPIOC AT command to 0. The  “General  purpose  output”  mode  can  be  provided  on  more  than  one  pin  per  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose output”. The pin configured to provide the “General purpose output” function is set as o Output / Low, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 0 o Output / High, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 1 The pin can be connected on the application board to an input pin of an application  processor to provide a digital signal.   Pad disabled: All the GPIOs  can  be  configured  in  tri-state  with  an  internal active pull-down enabled,  as  a  not used pin, setting the parameter <gpio_mode> of +UGPIOC AT command to 255. The “Pad disabled” mode can be  provided on more than one pin per time: it is possible to simultaneously set the same mode on another pin (also on all the GPIOs). The pin configured to provide the “Pad disabled” function is set as o Tri-state with an internal active pull-down enabled  Table 42 describes the configurations of all the GPIO pins. Pin Name Description Remarks 20 GPIO1 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the AT+UGPIOC command as  Output  Input  Network Status Indication  GNSS Supply Enable  GSM Tx Burst Indication  Module Status Indication 21 GPIO2 GPIO By default, the pin is configured to provide GNSS Supply Enable function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  Pad disabled 23 GPIO3 GPIO By default, the pin is configured to provide GNSS Data Ready function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GNSS Supply Enable  Pad disabled 24 GPIO4 GPIO By default, the pin is configured to provide GNSS RTC sharing function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GNSS Supply Enable  Pad disabled
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 100 of 175 Pin Name Description Remarks 51 GPIO5 GPIO By default, the pin is configured to provide SIM card detection function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GNSS Supply Enable  Module Operating Mode Indication   Pad disabled 39 I2S1_RXD / GPIO6 2nd I2S receive data / GPIO By default, the pin is configured as 2nd I2S receive data input. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 40 I2S1_TXD / GPIO7 2nd I2S transmit data / GPIO  By default, the pin is configured as 2nd I2S transmit data output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 53 I2S1_CLK / GPIO8 2nd I2S clock / GPIO By default, the pin is configured as 2nd I2S clock input/output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 54 I2S1_WA / GPIO9 2nd I2S word alignment / GPIO By default, the pin is configured as 2nd I2S word alignment input/output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 55 SPI_SCLK / GPIO10 SPI Serial Clock / GPIO By default, the pin is configured as SPI Serial Clock Input:   Idle low (CPOL=0)  Internal active pull-down to GND enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 56 SPI_MOSI / GPIO11 SPI Data Line / GPIO By default, the pin is configured as SPI Data Line Input:  Shift data on rising clock edge (CPHA=1)  Latch data on falling clock edge (CPHA=1)  Idle high  Internal active pull-up to V_INT enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 57 SPI_MISO / GPIO12 SPI Data Line Output / GPIO By default, the pin is configured as SPI Data Line Output:  Shift data on rising clock edge (CPHA=1)  Latch data on falling clock edge (CPHA=1)  Idle high Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 58 SPI_SRDY / GPIO13 SPI Slave Ready / GPIO By default, the pin is configured as SPI Slave Ready Output:  Idle low Can be alternatively configured by the +UGPIOC command as  Output  Input  Module Status Indication  Pad disabled
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 101 of 175 Pin Name Description Remarks 59 SPI_MRDY / GPIO14 SPI Master Ready / GPIO By default, the pin is configured as SPI Master Ready Input:  Idle low  Internal active pull-down to GND enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Module Operating Mode Indication  Pad disabled Table 42: GPIO pins configurations   The  GPIO  pins  ESD  sensitivity  rating is  1  kV  (Human  Body  Model  according  to  JESD22-A114F).  Higher protection level could  be  required  if the  lines  are  externally  accessible  on  the  application board.  Higher protection level can be achieved  by mounting an ESD  protection  (e.g.  EPCOS  CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  An application circuit for a typical GPIOs usage is described in Figure 52:  Network indication function provided by the GPIO1 pin  GNSS supply enable function provided by the GPIO2 pin   GNSS data ready function provided by the GPIO3 pin   GNSS RTC sharing function provided by the GPIO4 pin   SIM card detection function provided by the GPIO5 pin   Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 kΩ resistor on the board in series to the GPIO.  If the GPIO pins are not used, they can be left unconnected on the application board.  Any  external  signal  connected  to  GPIOs  must  be  tri-stated  when the  module is in  power-down  mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the module cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit  connections  and  set  to  high impedance during module  power  down mode, when external  reset  is  forced  low and during power-on sequence.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 102 of 175 SIM card holderSW1 SW2 4V_INT51GPIO5R4R3OUTINGNDLDO RegulatorSHDN3V8 1V8GPIO3GPIO4TxD1EXTINT02324R1VCCGPIO2 21LISA-U2 series u-blox GNSS1.8 V receiverU1J1C1R5R73V8Network IndicatorR6GPS Supply EnableGPS Data ReadyGPS RTC SharingSIM Detection20GPIO1DL1T1D1R2 Figure 52: GPIO application circuit Reference Description Part Number - Manufacturer R1 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers U1 Voltage Regulator for GNSS receiver See GNSS Module Hardware Integration Manual R2 4.7 kΩ Resistor 0402 5% 0.1 W Various manufacturers R3 1 kΩ Resistor 0402 5% 0.1 W Various manufacturers R4 470 kΩ Resistor 0402 5% 0.1 W Various manufacturers D1 ESD Transient Voltage Suppressor USB0002RP or USB0002DP - AVX J1 SIM Card Holder CCM03-3013LFT R102 - C&K Components (or equivalent) R5 10 kΩ Resistor 0402 5% 0.1 W Various manufacturers R6 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R7 820 Ω Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor  BC847 - Infineon Table 43: Components for GPIO application circuit
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 103 of 175 The  recommended  application  circuit  for  the  module  status  indication  function,  provided  by  LISA-U2  series module GPIO1 and GPIO13 pins to indicate module status (power-off mode,  i.e. module switched off, versus idle, active or connected mode, i.e. module switched on), is described in Figure 53. The logic level of  the pin configured to  provide module  status indication, that  is set high when  the module is switched on (with interfaces configured)  and  low  when the module is switched off, is inverted by a  transistor biased by the V_BCKP supply, which is generated by the module when a valid VCC is applied. A pull-down resistor is provided at the GPIO1 output (which provides module status indication) to fix a low level at inverting transistor input when GPIO1 is floating, i.e. when the module is switched off, so that high logic level is  present  at  the  application  processor  input  when  the  module  is  switched  off  and  low  logic  level  when  the module is switched on (i.e. the opposite logic level of the GPIO).  Input (1.8V)V_BCKP 2LISA-U2 series Application processorR1R3Module Status IndicationR220GPIO1 T1 Figure 53: Module status indication application circuit Reference Description Part Number - Manufacturer R1, R3 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R2 100 kΩ Resistor 0402 5% 0.1 W Various manufacturers T1 NPN BJT Transistor  BC847 - Infineon Table 44: Components for module status indication application circuit   1.13 Reserved pins (RSVD) LISA-U2  modules  have  pins  reserved  for  future  use.  All  the  RSVD  pins,  except  pin  number  5,  can  be  left unconnected on the application board.   Pin 5 (RSVD) must be connected to GND.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 104 of 175 1.14 Schematic for LISA-U2 module integration Figure 54 is an example of a schematic diagram where LISA-U2 series module is integrated into an application board, using all the interfaces of the module. TXDRXDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND3V8GNDLISA-U2 series62 VCC63 VCC61 VCC+100µF2V_BCKPMOSIMISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDVBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GND100nF5RSVD74ANT_DIVGNDRTC back-upu-blox GNSS1.8V Receiver4.7kOUTINGNDLDO RegulatorSHDNSDASCL4.7k3V8 1V8_GPSSDA2SCL2GPIO3GPIO4TxD1EXTINT04645232447kVCCGPIO2 21ANT 68Main Tx/Rx  Antenna1.8V DTE1.8V SPI MasterUSB 2.0 Host20 GPIO13V8Network Indicator22 RESET_NFerrite Bead47pFApplication ProcessorOpen Drain Output19 PWR_ON100kΩOpen Drain Output0Ω0ΩTPTP0Ω0ΩTPTP1.8V Digital Audio DeviceI2S_RXDI2S_CLKI2S Data OutputI2S ClockI2S_TXDI2S_WAI2S Data InputI2S Word Alligment44434241Rx Diversity Antenna LISA-U230 only47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF50VSIM48SIM_IO47SIM_CLK49SIM_RST47pFSW1 SW24V_INT51GPIO5470k1kESD ESD ESD ESD ESD ESDV_INT220nF V_INTBCLKLRCLK10µF1µFAudio Codec MAX9860SDINSDOUTSDASCL53I2S1_CLK54I2S1_WA40I2S1_TXD39I2S1_RXD52CODEC_CLK MCLKIRQn10k100nFVDDSPKOUTPOUTNMICMICBIAS 1µF 2.2k1µF1µFMICLNMICLPMICGND2.2kESD ESD27pF27pFV_INTEMIEMI10nF10nFEMIEMIESD ESD27pF27pF10nF10nF330µF 10nF100nF 15pF 68pFFerrite Bead Figure 54: Example of schematic diagram to integrate LISA-U2 series modules in an application board, using all the interfaces
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 105 of 175 1.15 Approvals  For  all  the  certificates  of  compliancy  and  for  the  complete  list  of  approvals  (including  countries’  and network  operators’  approvals)  of  LISA-U2  series  modules,  see  our  website  (http://www.u-blox.com/)  or contact the u-blox office or sales representative nearest you.  Product certification approval is the process of certifying that a product has passed all tests and criteria required by specifications, typically called “certification schemes” that can be divided into three distinct categories:  Regulatory certification o Country specific approval required by local government in most regions and countries, as:  CE (Conformité Européenne) marking for European Union  FCC (Federal Communications Commission) approval for United States  Industry certification o Telecom industry specific approval verifying the interoperability between devices and networks:  GCF  (Global  Certification  Forum),  partnership  between  European  device  manufacturers  and network operators to ensure and verify global interoperability between devices and networks  PTCRB  (PCS  Type  Certification Review  Board),  created  by  United States  network  operators  to ensure and verify interoperability between devices and North America networks  Operator certification o Operator specific approval required by some mobile network operator, as:  AT&T network operator in United States  Even  if  LISA-U2  modules  are  approved  under  all  major  certification  schemes,  the  application  device  that integrates  LISA-U2  modules  must  be  approved  under  all  the  certification  schemes  required  by  the  specific application device to be deployed in the market. The  required  certification  scheme  approvals  and  the  related  testing  specifications  differ  depending  on  the country  or  the  region  where  the  device  that  integrates  LISA-U2  modules  must  be  deployed,  on  the corresponding  vertical  market  of  the  device,  on  type,  features  and  functionalities  of  the  whole  application device, and on the network operators where the device must operate.   The certification  of  the  application  device  that  integrates  a  LISA-U2 module  and  the compliance  of  the application  device  with  all  the  applicable  certification  schemes,  directives  and  standards  are  the  sole responsibility of the application device manufacturer.  LISA-U2  modules  are  certified  according  to  all  capabilities  and  options  stated in the  Protocol  Implementation Conformance  Statement  document  (PICS)  of  the  module.  The  PICS,  according  to  3GPP  TS  51.010-2  [9]  and 3GPP TS 34.121-2 [10], is a statement of the implemented and supported capabilities and options of a device.   The PICS document of the application device integrating LISA-U2 series modules must be updated from the module PICS statement if any feature stated as supported by the module in its PICS document is not implemented or disabled in the application device. For more details regarding the AT commands settings that affect the PICS, see the u-blox AT Commands Manual [2].  Check the specific settings required for mobile network operators approvals as they may differ from the AT commands settings defined in the module as integrated in the application device.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 106 of 175 1.15.1 R&TTED and European Conformance CE mark Products bearing the CE  marking  comply with the R&TTE Directive  (99/5/EC),  EMC  Directive (89/336/EEC)  and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms:  Radio Frequency spectrum efficiency: o EN 301 511 o EN 301 908-1 o EN 301 908-2  Electromagnetic Compatibility: o EN 301 489-1 o EN 301 489-7 o EN 301 489-24  Safety o EN 60950-1: 2006 o EN 62311: 2008 Notified Body identification numbers for LISA-U2 series modules are 0682 and 1588; see the LISA-U2 series Data Sheet [1] for a complete list of the Notified Body numbers used in the certification of each module.   1.15.2 US Federal Communications Commission notice The Federal Communications Commission (FCC) IDs for the LISA-U2 modules are:  LISA-U200: XPYLISAU200  LISA-U201: XPYLISAU201  LISA-U230: XPYLISAU230  LISA-U260: XPYLISAU200  LISA-U270: XPYLISAU200  1.15.2.1 Safety warnings review the structure  Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product  The  clearance  and  creepage  current  distances  required  by  the  end  product  must  be  withheld  when  the module is installed  The cooling of the end product shall not negatively be influenced by the installation of the module  Excessive sound pressure from earphones and headphones can cause hearing loss  No natural rubbers, no hygroscopic materials nor materials containing asbestos are employed
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 107 of 175 1.15.2.2 Declaration of conformity This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:  this device may not cause harmful interference  this device must accept any interference received, including interference that may cause undesired operation   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  FCC  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed and operated with  a minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be co-located  or  operating  in  conjunction  with  any  other  antenna  or  transmitter  except  in accordance with FCC procedures and as authorized in the module certification filing.   The  gain  of  the  system  antenna(s)  used  for  LISA-U200  (i.e.  the  combined  transmission  line, connector, cable losses and radiating element gain) must not exceed 4.25 dBi (in 850  MHz, i.e. GSM  850  or  UMTS  FDD-5  band),  7.30 dBi  (in  1700  MHz,  i.e.  AWS  or  UMTS  FDD-4  band)  and 2.74 dBi  (in  1900  MHz,  i.e.  GSM  1900  or  UMTS  FDD-2  band)  for  mobile  and  fixed  or  mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U201  (i.e.  the  combined  transmission  line, connector,  cable losses  and  radiating  element  gain)  must not  exceed  4.0 dBi  (in  850  MHz,  i.e. GSM 850 or UMTS FDD-5 band) and 3.5 dBi (in 1900 MHz, i.e. GSM 1900 or UMTS FDD-2 band) for mobile and fixed or mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U230  (i.e.  the  combined  transmission  line, connector, cable losses and radiating element gain) must not exceed 4.78 dBi (in 850 MHz, i.e. GSM  850  or  UMTS  FDD-5  band),  7.55 dBi  (in  1700  MHz,  i.e.  AWS  or  UMTS  FDD-4  band)  and 3.95 dBi  (in  1900  MHz,  i.e.  GSM  1900  or  UMTS  FDD-2  band)  for  mobile  and  fixed  or  mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U260  and  LISA-U270  (i.e.  the  combined transmission line, connector, cable losses and radiating element gain) must not exceed 4.88 dBi (in 850 MHz, i.e.  GSM  850  or  UMTS  FDD-5  band) and  4.08  dBi  (in  1900  MHz, i.e.  GSM  1900  or UMTS FDD-2 band) for mobile and fixed or mobile operating configurations.  1.15.2.3 Modifications The  FCC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers of mobile or fixed devices incorporating the LISA-U2 modules are authorized to use  the  FCC  Grants  of  the  LISA-U2  modules  for  their  own  final  products  according  to  the conditions referenced in the certificates.  The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: LISA-U200: "Contains FCC ID: XPYLISAU200" resp. LISA-U201: "Contains FCC ID: XPYLISAU201" resp. LISA-U230: "Contains FCC ID: XPYLISAU230" resp. LISA-U260: "Contains FCC ID: XPYLISAU200" resp. LISA-U270: "Contains FCC ID: XPYLISAU200" resp.  IMPORTANT:  Manufacturers  of  portable  applications  incorporating  the  LISA-U2  modules  are required to have their final product certified and apply for their own FCC Grant related to the specific portable device. This is mandatory to meet the SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 108 of 175 1.15.3 Industry Canada notice The Industry Canada (IC) Certification Numbers for the LISA-U2 modules are:  LISA-U200: 8595A-LISAU200N  LISA-U201: 8595A-LISAU201  LISA-U230: 8595A-LISAU230N  LISA-U260: 8595A-LISAU200N  LISA-U270: 8595A-LISAU200N  1.15.3.1 Declaration of conformity   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  IC  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed and operated with  a minimum distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be co-located  or  operating  in  conjunction  with  any  other  antenna  or  transmitter  except  in accordance with IC procedures and as authorized in the module certification filing.   The  gain  of  the  system  antenna(s)  used  for  LISA-U200  (i.e.  the  combined  transmission  line, connector, cable losses and radiating element gain) must not exceed  4.25 dBi (in 850  MHz, i.e. GSM  850  or  UMTS  FDD-5  band),  7.30 dBi  (in  1700  MHz,  i.e.  AWS  or  UMTS  FDD-4  band)  and 2.74 dBi  (in  1900  MHz,  i.e.  GSM  1900  or  UMTS  FDD-2  band)  for  mobile  and  fixed  or  mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U201  (i.e.  the  combined  transmission  line, connector,  cable losses  and  radiating  element  gain)  must not  exceed  0.7 dBi  (in 850 MHz,  i.e. GSM 850 or UMTS FDD-5 band) and 3.5 dBi (in 1900 MHz, i.e. GSM 1900 or UMTS FDD-2 band) for mobile and fixed or mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U230  (i.e.  the  combined  transmission  line, connector, cable losses and radiating element gain) must not exceed 4.78  dBi (in 850 MHz, i.e. GSM  850  or  UMTS  FDD-5  band),  7.55 dBi  (in  1700  MHz,  i.e.  AWS  or  UMTS  FDD-4  band)  and 3.95 dBi  (in  1900  MHz,  i.e.  GSM  1900  or  UMTS  FDD-2  band)  for  mobile  and  fixed  or  mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U260  and  LISA-U270  (i.e.  the  combined transmission line, connector, cable losses and radiating element gain) must not exceed 4.88 dBi (in 850 MHz, i.e.  GSM  850  or  UMTS  FDD-5  band) and  4.08 dBi  (in  1900  MHz, i.e.  GSM  1900  or UMTS FDD-2 band) for mobile and fixed or mobile operating configurations.  1.15.3.2 Modifications The  IC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers of mobile or fixed devices incorporating the LISA-U2 modules are authorized to use  the  Industry  Canada  Certificates  of  the  LISA-U2  modules  for  their  own  final  products according to the conditions referenced in the certificates.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 109 of 175  The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: LISA-U200: "Contains IC: 8595A-LISAU200N" resp. LISA-U201: "Contains IC: 8595A-LISAU201" resp. LISA-U230: "Contains IC: 8595A-LISAU230" resp. LISA-U260: "Contains IC: 8595A-LISAU200N" resp. LISA-U270: "Contains IC: 8595A-LISAU200N" resp.   Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian CAN ICES-3(B) / NMB-3(B) and RSS-210. Operation is subject to the following two conditions: o this device may not cause interference o this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The  radiated  output  power  of  the  u-blox  Cellular  Module  is  below  the  Industry  Canada  (IC) radio frequency exposure limits.  The u-blox Cellular Module should  be used in such a manner such that the potential for human contact during normal operation is minimized. This  device  has  been  evaluated  and  shown  compliant  with  the  IC  RF  Exposure  limits  under mobile exposure conditions (antennas are greater than 20cm from a person's body). This device has been certified  for use in Canada. Status  of the listing in the Industry Canada’s REL  (Radio  Equipment  List)  can  be  found  at  the  following  web  address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional  Canadian  information  on  RF  exposure  also  can  be  found  at  the  following  web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT:  Manufacturers  of  portable  applications  incorporating  the  LISA-U2  modules  are required  to  have  their  final  product  certified  and  apply  for  their  own  Industry  Canada Certificate  related  to  the  specific  portable  device.  This  is  mandatory  to  meet  the  SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   Canada, avis d'Industrie Canada (IC) Cet appareil numérique de classe B est conforme aux normes canadiennes CAN ICES-3(B) / NMB-3(B) et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: o cet appareil ne doit pas causer d'interférence o cet  appareil  doit  accepter  toute  interférence,  notamment  les  interférences  qui  peuvent affecter son fonctionnement Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil u-blox Cellular Module est inférieure à la limite  d'exposition  aux  fréquences  radio  d'Industrie  Canada  (IC).  Utilisez  l’appareil  de  sans  fil u-blox  Cellular  Module  de  façon  à  minimiser  les  contacts  humains  lors  du  fonctionnement normal. Ce  périphérique  a  été  évalué  et  démontré  conforme  aux  limites  d'exposition  aux  fréquences radio  (RF)  d'IC  lorsqu'il  est  installé dans  des  produits  hôtes particuliers  qui  fonctionnent  dans des  conditions  d'exposition  à  des  appareils  mobiles  (les  antennes  se  situent  à  plus  de  20 centimètres du corps d'une personne).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 110 of 175 Ce  périphérique  est  homologué  pour  l'utilisation  au  Canada.  Pour  consulter  l'entrée correspondant  à  l’appareil  dans  la  liste  d'équipement  radio  (REL  -  Radio  Equipment  List) d'Industrie Canada rendez-vous sur: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplémentaires concernant l'exposition aux RF au  Canada rendez-vous sur : http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT:  les  fabricants  d'applications  portables  contenant  les  modules  LISA-U2  series doivent  faire  certifier  leur  produit  final  et  déposer  directement  leur  candidature  pour  un certificat  Industrie Canada  délivré par l'organisme  chargé de  ce  type  d'appareil portable.  Ceci est obligatoire afin d'être en accord avec les exigences SAR pour les appareils portables. Tout changement ou modification non expressément approuvé par la partie responsable de la certification peut annuler le droit d'utiliser l'équipement.  1.15.4 ACMA Certification   LISA-U200 and LISA-U230 modules are certified by the Australian Communications and Media Authority     The ACMA recommends that telephones be able to support access to emergency numbers (such as 000) for at least  30  minutes  during  a  power  failure.  For  telephones  that  do  not  function  during  a  power  failure,  the technical standard suggests that a warning notice be included in the instructions, advising users that the phone will not operate if there is a power failure.   It  is  the  customer's  responsibility  to  determine  if  their  product  is  subject  to  such recommendations and apply the warning notice requirement as appropriate.  1.15.5 ICASA Certification   LISA-U200 and LISA-U270 modules are certified by the Independent Communications Authority of South Africa (ICASA).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 111 of 175 1.15.6 KCC Certification   LISA-U200 and LISA-U270 modules are certified by the Korea Communications Commission (KCC).    KCC ID for LISA-U2 modules:  LISA-U200: KCC-CRM-ULX-LISA-U200  LISA-U270: KCC-CRM-ULX-LISA-U270  1.15.7 Anatel Certification   LISA-U200  modules  are  certified  by  the  Brazilian  Agency  of  Telecommunications  (Agência  Nacional  de Telecomunicações in Portuguese) (Anatel).  LISA-U200(01)0 789 8941 57508 33309-12-8459  Anatel IDs for LISA-U200 modules:  EAN barcode: (01)0 789 8941 57508 3  Homologation number 3309-12-8459
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  System description      Page 112 of 175 1.15.8 CCC Certification LISA-U200 and LISA-U230 modules are CCC certified        1.15.9 TELEC / JATE Certification LISA-U200-62S, LISA-U270-62S and LISA-U270-68S are TELEC / JATE certified and have the Giteki mark placed on the product label.   LISA-U200-62S: o Technical Conditions certified type number = AD120274003 o Technical Requirements certified type number = 003-120375  LISA-U270-62S and LISA-U270-68S: o Technical Conditions certified type number = AD120274003 o Technical Requirements certified type number = 003-120377  0682LISA-U200 xxS-xxAD120274003TR003-1203750682LISA-U270 xxS-xxAD120274003TR003-120377
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 113 of 175 2 Design-In 2.1 Design-in checklist This section provides a design-in checklist. 2.1.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC pin above the minimum operating range limit.  DC supply must be capable of providing 2.5 A current pulses, providing a voltage at VCC pin above the minimum operating range limit and with a maximum 400 mV voltage drop from the nominal value.  VCC supply should be clean, with very low ripple/noise:  provide the  suggested series ferrite bead and bypass capacitors, in particular if the application device integrates an internal antenna.  VCC voltage must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module.  Do not leave PWR_ON floating: add a pull-up resistor to V_BCKP.  Do not apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the specific operating range.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested low capacitance ESD protection and passive filtering parts on each SIM signal.  Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation [3].  Provide  appropriate  access  to USB  interface  and/or  to  UART  RxD,  TxD  lines  and  access  to  PWR_ON and/or RESET_N lines to flash/upgrade the module firmware using the u-blox EasyFlash tool.  Provide appropriate access to USB interface and/or to UART RxD, TxD, CTS, RTS lines for debugging.  Capacitance and series resistance must be limited on each line of the SPI / IPC interface.  Add a proper pull-up resistor to a proper supply on each DDC (I2C) interface line, if the interface is used.  Capacitance and series resistance must be limited on each line of the DDC interface.  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10  kΩ resistor on the board in series to the GPIO when those are used to drive LEDs.  Connect the pin number 5 (RSVD) to ground.  Check the digital audio interface specifications to connect a proper device.  Capacitance and series resistance must be limited on CODEC_CLK line and each I2S interface line.  Provide proper precautions for ESD immunity as required on the application board.  Any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module  power-on sequence  (at  least for 3 s after the start-up event), to avoid  latch-up  of circuits and let a proper boot of the module.  All  unused  pins  can  be  left  floating  on  the  application  board  except  the  PWR_ON  pin  (must  be connected to V_BCKP by a pull-up resistor) and the RSVD pin number 5 (must be connected to GND).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 114 of 175 2.1.2 Layout checklist The following are the most important points for a simple layout check:  Check 50   nominal characteristic impedance  of the RF  transmission  line connected to  the  ANT pad (main RF input/output) and to the ANT_DIV pad (RF input for Rx diversity).  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure no coupling occurs with other noisy or sensitive signals (e.g. SIM signals).  VCC line should be as wide and as short as possible.  Provide the suggested series ferrite bead and bypass capacitors close to the VCC pins implementing the recommended layout and placement, especially if the application device integrates an internal antenna.  Route VCC supply line away from sensitive analog signals.  The high-power audio outputs lines on the application board must be wide enough to minimize series resistance.  Ensure proper grounding.  Consider “No-routing” areas for the Data Module footprint.  Optimize placement for minimum length of RF line and closer path from DC source for VCC.  Design USB_D+ / USB_D- connection as 90  differential pair, with 30  common mode impedance.  Keep routing short and minimize parasitic capacitance on the SPI lines to preserve signal integrity.  Keep routing short and minimize parasitic capacitance on CODEC_CLK line to preserve signal integrity.  2.1.3 Antenna checklist  Antenna should have 50  impedance, V.S.W.R less than 3:1 (recommended 2:1) on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Follow the additional guidelines for products marked with the FCC logo (United States only) reported in section 1.15.2.2  The  antenna  connected  to  the  ANT  pad  should  have  built  in  DC  resistor  to  ground  to  get  proper antenna detection functionality.  The antenna for the Rx diversity connected to the ANT_DIV pin should be carefully separated from the main Tx/Rx antenna connected to the  ANT pin: the  distance between the two antennas should  be  at least greater than half a wavelength of the lowest used frequency (i.e. distance greater than ~20 cm, for 2G/3G  low  bands)  to  distinguish  between  different  multipath  channels,  for  proper  spatial  diversity implementation.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 115 of 175 2.2 Design Guidelines for Layout The following design guidelines must be met for optimal integration of LISA-U2 modules on the final application board.  2.2.1 Layout guidelines per pin function This  section  groups  LISA-U2  modules  pins  by  signal  function  and  provides  a  ranking  of  importance  in  layout design. V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GNDUSB_D-USB_D+234567891011121131415161718192021222324252627GNDVCCVCCVCCGNDSPI_MRDY / GPIO14SPI_SRDY / GPIO13SPI_MISO / GPIO12SPI_MOSI / GPIO11SPI_SCLK / GPIO10GPIO9 / I2S1_WAGNDGPIO8 / I2S1_CLKRSVD / CODEC_CLKGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WAGPIO7 / I2S1_TXDGPIO6 / I2S1_RXD6463626160595857565554655352515049484746454443424140392930313233343536373828GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND7574737271706968676676GNDGNDGNDGNDGNDGNDANTGNDGNDGND/ RSVDANT_DIVLISA-U2 series(Top View)Very ImportantCareful LayoutCommon PracticeLegend: Figure 55: LISA-U2 series modules pin-out (top view) with ranked importance for layout design
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 116 of 175 Rank Function Pin(s) Layout Remarks 1st RF Antenna     Main RF input/output  Very Important Design for 50  characteristic impedance. See section 2.2.1.1  RF input for Rx diversity  Very Important Design for 50  characteristic impedance. See section 2.2.1.1 2nd Main DC Supply  Very Important VCC line should be wide and short. Route away from sensitive analog signals. See section 2.2.1.2 3rd USB Signals   Very Important Route USB_D+ and USB_D- as differential lines: design for 90  differential impedance (Z0) and design for 30  common mode impedance (ZCM). See section 2.2.1.3 4th Ground GND Careful Layout Provide proper grounding. See section 2.2.1.4 5th Sensitive Pin:  Careful Layout Avoid coupling with noisy signals. See section 2.2.1.5 Backup Voltage V_BCKP Power-On PWR_ON 6th High-speed digital pins:  Careful Layout Avoid coupling with sensitive signals. See section 2.2.1.6 SPI Signals SPI_SCLK, SPI_MISO, SPI_MOSI, SPI_SRDY, SPI_MRDY  Clock Output CODEC_CLK   7th Digital pins and supplies:  Common Practice Follow common practice rules for digital pin routing. See section 2.2.1.7 SIM Card Interface VSIM, SIM_CLK, SIM_IO, SIM_RST Digital Audio  I2S_CLK, I2S_RXD, I2S_TXD, I2S_WA I2S1_CLK, I2S1_RXD, I2S1_TXD, I2S1_WA DDC SCL, SDA UART TXD, RXD, CTS, RTS, DSR, RI, DCD, DTR External Reset RESET_N General Purpose I/O GPIO1, GPIO2, GPIO3, GPIO4, GPIO5 GPIO6, GPIO7, GPIO8, GPIO9, GPIO10, GPIO11, GPIO12, GPIO13, GPIO14 USB detection VUSB_DET Supply for Interfaces V_INT Table 45: Pin list in order of decreasing importance for layout design  USB_D- USB_D+ VCC ANT ANT_DIV
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 117 of 175 2.2.1.1 RF antenna connection The ANT pin (main RF input/output) and the ANT_DIV pin (RF input for diversity receiver provided by LISA-U230 modules) are very critical in layout design. Proper transition between ANT and ANT_DIV pads and the application board must be provided, implementing the following design-in guidelines for the layout of the application PCB close to the ANT and ANT_DIV pads:  On a multi layer board, the whole layer stack below the RF connection should be free of digital lines  Increase GND keep-out (i.e. clearance) for ANT and ANT_DIV pads to at least 250 µm up to adjacent pads metal definition and up to 500 µm on the area below the module, as described in Figure 56  Add GND  keep-out  (i.e. clearance)  on buried  metal  layers  below  ANT and ANT_DIV pads and below  any other  pad  of  component  present  on  the  RF  line,  if  top-layer  to  buried  layer  dielectric  thickness  is  below 200 µm, to reduce parasitic capacitance to ground (see Figure 56 for the description of the GND keep-out area below ANT and ANT_DIV pads) Min. 500 umMin. 250 umTop layer Buried metal layerGND planeMicrostrip50 ohm Figure 56: GND keep-out area on top layer around ANT and ANT_DIV pads and on buried layer below ANT and ANT_DIV pads  The transmission line from the ANT pad and the ANT_DIV pad up to antenna connector(s) or up to the internal antenna(s) pad must be designed so that the characteristic impedance is as close as possible to 50 .  The transmission line  up  to  antenna  connector  or  pad  may  be a  microstrip  (consists of  a conducting strip separated from a ground plane by a dielectric material) or a strip line (consists of a flat strip of metal which is sandwiched between two parallel ground planes within a dielectric material). In any case must be designed to achieve 50 Ω characteristic impedance  Microstrip lines are usually easier to implement and the reduced number of layer transitions up to antenna connector simplifies the design and diminishes reflection losses. However, the electromagnetic field extends to the free air interface above the stripline and may interact with other circuitry  Buried striplines exhibit better shielding to external and internally generated interferences. They are therefore preferred for sensitive application. In case a stripline is implemented, carefully check that the via pad-stack does not couple with other signals on the crossed and adjacent layers Figure  57  and  Figure  58  provide  two  examples  of  proper  50   coplanar  waveguide  designs.  The  first transmission line can be implemented in case of 4-layer PCB stack-up herein described, the second transmission line can be implemented in case of 2-layer PCB stack-up herein described.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 118 of 175 35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric380 µm 500 µm500 µm Figure 57: Example of 50  coplanar waveguide transmission line design for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric1200 µm 400 µm400 µm Figure 58: Example of 50  coplanar waveguide transmission line design for the described 2-layer board layup  If the two examples do not match the application PCB layup, the 50  characteristic impedance calculation can be  made  using  the  HFSS  commercial  finite  element  method  solver for  electromagnetic  structures  from  Ansys Corporation, or using freeware tools like AppCAD from Agilent or TXLine from Applied Wave Research, taking care of the approximation formulas used by the tools for the impedance computation. To achieve a 50  characteristic impedance, the width of the transmission line must be chosen depending on:  the thickness of the transmission line itself (e.g. 35 µm in the example of Figure 57 and Figure 58)  the thickness of the dielectric material between the top layer (where the transmission line is routed) and the inner closer layer implementing the ground plane (e.g. 270 µm in Figure 57, 1510 µm in Figure 58)  the  dielectric  constant  of  the  dielectric  material  (e.g.  dielectric  constant  of  the  FR-4  dielectric  material  in Figure 57 and Figure 58)  the gap from the transmission line to the adjacent ground plane on the same layer of the transmission line (e.g. 500 µm in Figure 57, 400 µm in Figure 58)  If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the microstrip, use the “Coplanar Waveguide” model for the 50  calculation.  Additionally to the 50  impedance, the following guidelines are recommended for the RF line design:  Minimize  the  transmission  line  length; the  insertion loss  should be  minimized  as  much  as  possible, in the order of a few tenths of a dB
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 119 of 175  The transmission line should not have abrupt change to thickness and spacing to GND, but must be uniform and routed as smoothly as possible  The transmission line must be routed in a section of the PCB where minimal interference from noise sources can be expected  Route RF transmission line far from other sensitive circuits as it is a source of electromagnetic interference  Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer  Add GND vias around transmission line  Ensure no other signals are routed parallel to transmission line, or that other signals cross on adjacent metal layer  If  the  distance  between  the  transmission  line  and  the  adjacent  GND  area  (on  the  same  layer)  does  not exceed  5  times  the  track  width  of  the  microstrip,  use  the  “Coplanar  Waveguide”  model  for  50  Ω characteristic impedance calculation  Do not route microstrip line below discrete component or other mechanics placed on top layer  When terminating transmission  line  on  antenna  connector (or  antenna  pad)  it  is  very important  to strictly follow the connector manufacturer’s recommended layout  GND  layer  under  RF  connectors  and  close  to  buried  vias  should  be  cut  out  in  order  to  remove  stray capacitance and thus keep the RF line 50 Ω. In most cases the large active pad of the integrated antenna or antenna  connector  needs  to  have  a  GND  keep-out  (i.e.  clearance)  at  least  on  first  inner  layer  to  reduce parasitic  capacitance  to  ground.  Note  that  the  layout  recommendation  is  not  always  available  from connector  manufacturer:  e.g.  the  classical  SMA  Pin-Through-Hole  needs  to  have  GND  cleared  on  all  the layers around the central pin up to annular pads of the four GND posts. Check 50 Ω impedance of ANT and ANT_DIV lines  Ensure no coupling occurs with other noisy or sensitive signals  The antenna for the Rx diversity should be carefully separated from the main Tx/Rx antenna to ensure that uncorrelated signals are received at each antenna, because signal improvement is dependent  on the cross correlation and the signal strength levels between the two received signals. The distance between the two antennas should be greater than half a wavelength of the lowest used frequency (i.e. distance greater than ~20  cm,  for  2G/3G  low  bands)  to  distinguish  between  different  multipath  channels,  for  proper  spatial diversity implementation   Any RF transmission line on PCB should be designed for 50 Ω characteristic impedance.  Ensure no coupling occurs with other noisy or sensitive signals.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 120 of 175 2.2.1.2 Main DC supply connection The  DC  supply  of  LISA-U2  modules  is  very  important  for  the  overall  performance  and  functionality  of  the integrated  product.  For  detailed  description,  check  the  design  guidelines  in  section  1.5.2.  Some  main characteristics are:  VCC pins are internally connected, but it is recommended to use all the available pins in order to minimize the power loss due to series resistance  VCC  connection  may  carry  a  maximum  burst  current  in  the  order  of  2.5  A.  Therefore,  it  is  typically implemented as a wide PCB line with short routing from DC supply (DC-DC regulator, battery pack, etc)  The  module  automatically  initiates  an  emergency  shutdown  if  supply  voltage  drops  below  hardware threshold. In addition, reduced supply voltage can set a worst case operation point for RF circuitry that may behave incorrectly. It follows that each voltage drop in the DC supply track will restrict the operating margin at the main DC source output. Therefore, the PCB connection must exhibit a minimum or zero voltage drop. Avoid any series component with Equivalent Series Resistance (ESR) greater than a few milliohms  Given  the  large  burst  current,  VCC  line  is  a  source  of  disturbance  for  other signals.  Therefore route  VCC through a PCB area separated from sensitive analog signals. Typically it is good practice to interpose at least one layer of PCB ground between VCC track and other signal routing  The  VCC  supply  current  supply  flows  back  to  main  DC  source  through  GND  as  ground  current:  provide adequate return path with suitable uninterrupted ground plane to main DC source  A tank bypass capacitor with low ESR is recommended to smooth current spikes. This is most effective when placed  close  to  the  VCC  pins.  If  the  main  DC  source  is  a  switching  DC-DC  converter,  place  the  large capacitor close to the DC-DC output and minimize the VCC track length. Otherwise consider using separate capacitors for DC-DC converter and LISA-U2 module tank capacitor. Note that the capacitor voltage rating may  be  adequate  to  withstand  the  charger  over-voltage  if  battery-pack  is  used.  The  use  of  very  large capacitors (i.e. greater then 1000 µF) must be carefully evaluated, since the voltage at the  VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch on of the module  VCC is directly connected to the RF power amplifiers. It is highly recommended to place a series ferrite bead for GHz band noise, a bypass capacitor with Self-Resonant Frequency in 800/900 MHz range and a bypass capacitor  with  self-resonant  frequency  in  1800/1900  MHz  range  as  close  as  possible  to  the  VCC  pins, especially if the application device integrates an internal antenna. This is described in Figure 9 and Table 10.  Since  VCC  is  directly  connected  to  RF  Power  Amplifiers,  voltage  ripple  at  high  frequency  may  result  in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which  case it is better to select the highest operating frequency for the  switcher and add  a large L-C filter before connecting to the LISA-U2 modules in the worst case  The large current generates a magnetic field that is not well isolated by PCB ground layers and which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In this case route VCC away from other sensitive functional units  The typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range. Avoid coupling between VCC and audio lines (especially microphone inputs)  If  VCC  is  protected  by  transient  voltage  suppressor  /  reverse  polarity  protection  diode  to  ensure  that  the voltage maximum ratings are not exceeded, place the protecting device along the path from the DC source toward  the  LISA-U2  module,  preferably  closer  to  the  DC  source  (otherwise  functionality  may  be compromised)   VCC line should be as wide and as short as possible.  Route away from sensitive analog signals.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 121 of 175 2.2.1.3 USB signal The  LISA-U2  modules  include  a  high-speed  USB  2.0  compliant  interface with  a  maximum  throughput  of  480 Mb/s (see Section 1.9.3). Signals USB_D+ / USB_D- carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake, as well as in differential mode for fast signaling and data transfer. Characteristic impedance of  USB_D+ / USB_D- lines is specified by USB standard. The most important parameter is the differential characteristic impedance applicable for odd-mode electromagnetic field, which should be as close as possible to 90  differential: signal integrity may be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long.  Route USB_D+ / USB_D- lines as a differential pair  Ensure the differential characteristic impedance (Z0) is as close as possible to 90   Ensure the common mode characteristic impedance (ZCM) is as close as possible to 30   Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area  Figure  59  and  Figure  60  provide  two  examples  of  coplanar  waveguide  designs  with  differential  characteristic impedance close to 90  and common mode characteristic impedance close to 30 . The first transmission line can  be  implemented  in  case  of  4-layer  PCB  stack-up  herein  described,  the  second  transmission  line  can  be implemented in case of 2-layer PCB stack-up herein described.  35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric350 µm 400 µm400 µm350 µm400 µm Figure 59: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric740 µm 410 µm410 µm740 µm410 µm Figure 60: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 2-layer board layup
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 122 of 175 2.2.1.4 Module grounding Good  connection  of  the  module  with  application  board  solid  ground  layer  is  required  for  correct  RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each  GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer  If  the  application  board  is  a multilayer  PCB,  then  it  is  required  to  connect  together each  GND  area  with complete via stack down to main board ground layer  It is recommended to implement one layer of the application board as ground plane  Good grounding of GND pads will also ensure thermal heat sink. This is critical during call connection, when the real network  commands  the module to  transmit  at maximum power:  proper grounding helps  prevent module overheating  2.2.1.5 Other sensitive pins A few other pins on the LISA-U2 modules requires careful layout.  RTC supply (V_BCKP): avoid injecting noise on this voltage domain as it may affect RTC oscillator stability  Power-On (PWR_ON): is the digital input to switch-on the LISA-U2 modules. Ensure that the voltage level is well defined during operation and  no transient  noise is coupled on this line, otherwise the  module  might detect a spurious power-on request  2.2.1.6 High-speed digital pins The following high speed digital pins require careful layout:  Serial  Peripheral  Interface  (SPI):  can  be  used  for  high  speed  data  transfer  (UMTS/HSPA)  between  the LISA-U2 modules and the host processor, with a data rate up to 26 Mb/s (see Section 1.9.3). The high-speed data rate is carried by signals SPI_SCLK, SPI_MISO and SPI_MOSI, while SPI_SRDY and SPI_MRDY behave as handshake signals with relatively low activity  Digital  Clock  Output  (CODEC_CLK):  can  be  used  to  provide  a  26  MHz  or  13  MHz  digital  clock  to  an external audio codec Follow these hints for high speed digital pins layout:  High-speed signals become sources of digital noise, route away from RF and other sensitive analog signals  Keep routing short and minimize parasitic capacitance to preserve digital signal integrity  It is recommended to match the length of SPI signals  2.2.1.7 Digital pins and supplies  External Reset (RESET_N): input for external reset, a logic low voltage will reset the module  SIM Card Interface (VSIM, SIM_CLK, SIM_IO, SIM_RST): the SIM layout may be critical if the SIM card is placed far away from the LISA-U2 modules or in close proximity to the RF antenna. In the first case the long connection can cause the radiation of some harmonics of the digital data frequency. In the second case the same  harmonics  can  be  picked  up  and  create  self-interference  that  can  reduce  the  sensitivity  of  GSM Receiver channels whose carrier frequency is coincidental with harmonic frequencies. The latter case, placing the RF bypass capacitors, suggested in the section 1.8, near the SIM connector will mitigate the problem. In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges: add adequate ESD protection to protect module SIM pins near the SIM connector  Digital  Audio  (I2S_CLK, I2S_RX, I2S_TX, I2S_WA and I2S1_CLK, I2S1_RXD, I2S1_TXD, I2S1_WA): the I2S interface requires the same consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 123 of 175  DDC  (SCL,  SDA):  the  DDC  interface  requires  the  same  consideration  regarding  electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  UART  (TXD,  RXD,  CTS,  RTS,  DSR,  RI,  DCD,  DTR):  the  serial  interface  requires  the  same  consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  General Purpose I/O (GPIOx): the general purpose input/output pins are generally not critical for layout  Reserved pins: these pins are reserved for future use. Leave them unconnected on the baseboard  USB  detection (VUSB_DET):  this  input  will  generate  an  interrupt  to  the  baseband  processor  for  USB detection. The USB supply (5.0 V typ.) must be provided to VUSB_DET by the connected USB host to enable the USB interface of the module  Interfaces  Supply (V_INT):  this  supply  output  is  generated  by  an  integrated  switching  step  down converter, used internally to supply the digital interfaces. Because of this, it can be a source of noise: avoid coupling with sensitive signals
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 124 of 175 2.2.2 Footprint and paste mask The  following  figure  describes  the  footprint  and  provides  recommendations  for  the  paste  mask  for  LISA-U2 modules. These are recommendations only and not specifications. Note that the copper and solder masks have the same size and position. 33.2 mm [1307.1  mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]0.8 mm [31.5 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]1.0 mm [39.3 mil]5.7 mm [224.4 mil]33.2 mm [1307.1  mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]1.2 mm [47.2 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]0.9 mm [35.4 mil]5.7 mm [224.4 mil]0.6 mm [23.6 mil]Stencil: 150 µm Figure 61: LISA-U2 modules suggested footprint and paste mask To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent) extending beyond the copper mask. The solder paste should have a total thickness of 150 µm.   The  paste  mask  outline  needs  to  be  considered  when  defining  the  minimal  distance  to  the  next component.  The  exact  geometry,  distances,  stencil  thicknesses  and  solder  paste  volumes  must  be  adapted  to  the specific production processes (e.g. soldering etc.) of the customer.  The implemetation of a step stencil (a stencil  with different  material  thicknesses)  should be considered  if very different  sized  components  must  be  soldered on  the  same application  PCB:  while  high  density  chip  housings with small pitch need small solder paste quantities for the avoidance of short-circuits and therefore require thin stencils, large components need more solder paste for a safe connection and thus thicker stencils.  The bottom layer of LISA-U2 series modules has two unprotected copper areas for GND, shown in Figure 62.   Consider “No-routing” areas  for  the  LISA-U2 modules footprint as follows: signal keep-out area  on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer (see Figure 62).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 125 of 175 33.2 mm5.25 mm22.4 mm5.3 mm 5.25 mm5.3 mm1.3 mm1.4 mm1.0 mmPIN 1LISA-U2 bottom side (through module view)Exposed GND on LISA-U module bottom layerSignals keep-out areas on application board Figure 62: Signals keep-out areas on the top layer of the application board, below LISA-U2 series modules  2.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. Make sure that RF and analog circuits are clearly separated from any other digital circuits on the system board. Provide enough clearance between the module and any external part due to solder and paste masks design. Milled edges that are present at module PCB corners, away from module pins metallization, can slightly increase module dimensions from the width and the height described in the mechanical specifications sections of LISA-U2 series  Data  Sheet [1]:  provide  enough  clearance  between  module  PCB  corners  and  any  other  external  part mounted on the application board.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature  of  the  application  base-board  below  the  LISA-U2  modules:  avoid  placing  temperature sensitive devices (e.g. GNSS receiver) close to the module.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 126 of 175 2.3 Thermal guidelines  LISA-U2 module operating temperature range and module thermal resistance are specified in the LISA-U2 series Data Sheet [1].  The  most  critical  condition  concerning  module  thermal  performance  is  the  uplink  transmission  at  maximum power  (data  upload or voice  call  in  connected  mode),  when the  baseband  processor runs  at  full  speed,  radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks; however the application should be correctly designed to cope with it. During transmission at maximum RF power the LISA-U2 modules generate thermal power that can exceed 2 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the number  of  allocated TX slot and modulation (GMSK or  8PSK)  or  data  rate (WCDMA), transmitting  frequency band,  etc.  The  generated  thermal  power  must  be  adequately dissipated through  the  thermal  and  mechanical design of the application. The  spreading  of  the  Module-to-Ambient  thermal  resistance  (Rth,M-A)  depends  on  the  module  operating condition  (e.g.  2G  or  3G  mode,  transmit  band):  the  overall  temperature  distribution  is  influenced  by  the configuration  of  the  active  components  during  the  specific  mode  of  operation  and  their  different  thermal resistance toward the case interface.  Mounting a LISA-U2 module on a 90 mm x 70 mm x 1.46 mm 4-Layers PCB with a high coverage of copper in still  air  conditions7, the  increase  of  the  module  temperature8 in different  modes  of  operation,  referred  to  idle state initial condition9, can be summarized as following:  7°C during a GSM voice call at max TX power  19°C during GPRS data transfer with 4 TX slots at max TX power  16°C during EDGE data transfer with 4 TX slots at max TX power  25°C in UMTS/HSxPA connection at max TX power   The Module-to-Ambient thermal resistance value and the related increase of module temperature will be different  for  other  mechanical  deployments  of  the  module,  e.g.  PCB  with  different  dimensions  and characteristics, mechanical shells enclosure, or forced air flow. The increase of thermal dissipation, i.e. the Module-to-Ambient thermal resistance reduction, will decrease the temperature for internal circuitry of LISA-U2 modules for a given operating ambient temperature. This improves the device long-term reliability for applications operating at high ambient temperature.  Recommended hardware techniques to be used to improve heat dissipation in the application:  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete via stack down to main ground layer  Provide a ground plane as wide as possible on the application board  Optimize antenna return loss, to optimize overall electrical performance of the module including a decrease of module thermal power  Optimize the thermal design of any high-power component included in the application, as linear regulators and amplifiers, to optimize overall temperature distribution in the application device  Select the material, the thickness and the surface of the box (i.e. the mechanical enclosure of the application device that integrates the module) so that it provides good thermal dissipation                                                       7 Refer to LISA-U2 series Data Sheet [1] for the Rth,M-A value in this application condition 8 Temperature is measured by internal sensor of wireless module 9 Steady state thermal equilibrium is assumed. The module’s temperature in idle state can be considered equal to ambient temperature
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 127 of 175 Further hardware techniques to be used to improve heat dissipation in the application:  Force ventilation air-flow within mechanical enclosure  Provide a  heat  sink component attached  to the module  top side, with electrically insulated / high thermal conductivity adhesive, or on the backside of the application board, below the cellular module, as a large part of the heat is transported through the GND pads and dissipated over the backside of the application board  For example, after the installation of a robust aluminum heat-sink with forced air ventilation on the back of the same  application  board  described  above,  the  Module-to-Ambient  thermal  resistance  (Rth,M-A)  is  reduced  to 1.5 ÷ 3.5 °C/W. The effect of lower Rth,M-A can be seen from the module temperature increase, which now can be summarized as following:  1.5°C during a GSM voice call at max TX power  3°C during GPRS data transfer with 4 TX slots at max TX power  2.5°C during EDGE data transfer with 4 TX slots at max TX power  5.5°C in UMTS/HSxPA connection at max TX power  Beside the reduction of the Module-to-Ambient thermal resistance implemented by the hardware design of the application device integrating a LISA-U2 module, the increase of module temperature can be moderated by the software implementation of the application. Since  the  most  critical  condition  concerning  module  thermal  power  occurs  when  module  connected  mode  is enabled, the actual module thermal power depends, as module current consumption, on the radio access mode (GERAN / UTRA), the operating band and the average TX power. A few software techniques may be implemented to reduce the module temperature increase in the application:  Select  the  radio  access  mode  which  provides  lower  temperature  increase  (see  the  module  temperature increase values summarized above) by means of AT command (see the u-blox AT  Commands Manual  [2], +COPS command)   Select the operating band which provides lower current consumption in the selected radio access mode (see current consumption values  reported  in the  LISA-U2 series Data Sheet [1]) by  means  of AT command  (see the u-blox AT Commands Manual [2], +UBANDSEL command)  Enable module connected mode for a given time period and then disable it for a time period enough long to properly mitigate temperature increase
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 128 of 175 2.4 Antenna guidelines Antenna characteristics are essential for  good functionality of the module.  Antenna radiating performance has direct impact on the reliability of connections over the Air Interface. A bad termination of the ANT pin (main RF input/output) and the ANT_DIV pin (RF input for diversity receiver provided by LISA-U230 modules) can result in poor performance of the module. The following parameters should be checked:  Item Recommendations  Impedance 50 Ω nominal characteristic impedance  Frequency Range Depends on the LISA-U2 module HW version and on the Mobile Network used. LISA-U260:  824..960 MHz (GSM 850, GSM 900, UMTS B5)  1710..1990 MHz (GSM 1800, GSM 1900, UMTS B2) LISA-U270:  824..960 MHz (GSM 850, GSM 900, UMTS B8)  1710..2170 MHz (GSM 1800, GSM 1900, UMTS B1) LISA-U200, LISA-U201, LISA-U230:  824..960 MHz (GSM 850, GSM 900, UMTS B5, UMTS B6, UMTS B8)  1710..2170 MHz (GSM 1800, GSM 1900, UMTS B1, UMTS B2, UMTS B4)  Input Power >2 W peak  V.S.W.R <2:1 recommended, <3:1 acceptable  Return Loss S11<-10 dB recommended, S11<-6 dB acceptable Table 46: General recommendation for GSM antenna  The antenna gain shall remain below the levels reported in the section 1.15.2.2 to preserve the original u-blox FCC ID.  Some  2G  and  3G  bands are  overlapping. This  depends  on  worldwide  band  allocation for telephony  services, where different bands are deployed for different geographical regions.  If LISA-U2 series modules are planned for use on the entire supported bands, then an antenna that supports the 824..960 MHz and the 1710..2170 MHz frequency range should be selected. Otherwise, for fixed applications in specific geographical region, antenna requirements can be relaxed for non-deployed frequency bands. See the operating  RF  frequency  bands  table  in  LISA-U2  series  Data  Sheet [1]  for  the  detailed  uplink  and  downlink frequency ranges of each supported band. LISA-U230 modules provide 2G and 3G dynamic receive diversity (Rx diversity) capability to improve the quality and  reliability  of  the  cellular  link.  This  feature  can  be  optionally  used  connecting  a  second  antenna  to  the ANT_DIV pin, to receive an RF input signal that is processed by the module to increase the performance.   It  is  recommended  to  properly  connect  the  Rx  diversity  antenna  to  the  ANT_DIV  pin  of  LISA-U230 modules  unless  the  2G  and  3G  Rx  diversity  feature  is  disabled  by  AT  command  (see  the  u-blox  AT Commands Manual [2], +URXDIV command).  All the antenna guidelines and recommendations reported for the main Tx/Rx antenna design are applicable also to the Rx diversity antenna design, even if the antenna for the Rx diversity is not used to transmit.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 129 of 175 GSM antennas are typically available as:  Linear  monopole:  typical  for  fixed  applications.  The  antenna  extends  mostly  as  a  linear  element  with  a dimension comparable to lambda/4 of the lowest frequency of the operating band. Magnetic base may be available.  Cable  or  direct  RF  connectors  are  common  options.  The  integration  normally  requires  the fulfillment of some minimum guidelines suggested by antenna manufacturer  Patch-like antenna: better suited for  integration  in compact designs (e.g. mobile phone).  These are mostly custom designs  where the  exact  definition  of  the  PCB  and  product  mechanical design  is  fundamental for tuning of antenna characteristics For integration observe these recommendations:  Ensure 50 Ω  antenna termination, minimize the V.S.W.R. or return loss, as this will optimize the electrical performance of the module. See sections 2.2.1.1 and 2.4.1  Select antenna with best radiating performance. See section 2.4.2  If a cable is used to connect the antenna radiating element to application board, select a short cable with minimum insertion loss. The higher the additional insertion loss due to low quality or long cable, the lower the connectivity  Follow the recommendations of the antenna manufacturer for correct installation and deployment  Do not include antenna within closed metal case  Do not place  the main antenna in close vicinity to end user since the emitted radiation in  human tissue is limited by S.A.R. regulatory requirements  Do not use directivity antenna since the electromagnetic field radiation intensity is limited in some countries  Take care of interaction between co-located RF systems since the GSM transmitted power may interact or disturb the performance of companion systems  Place  antenna  far  from  sensitive  analog  systems  or  employ  countermeasures  to  reduce  electromagnetic compatibility issues that may arise  The antenna for the Rx diversity should be carefully separated from the main Tx/Rx antenna, because signal improvement is dependent on the cross correlation and the signal strength levels between the two received signals. The  distance between the  two antennas should  be  at  least  greater  than half a  wavelength  of the lowest  used  frequency  (i.e.  distance  greater  than  ~20  cm,  for  2G/3G  low  bands)  to  distinguish  between different multipath channels
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 130 of 175 2.4.1 Antenna termination The LISA-U2 modules are designed to work on a 50  load. However, real antennas have no perfect 50  load on all the supported frequency bands. Therefore, to reduce as much as possible performance degradation due to antenna mismatch, the following requirements should be met: Measure the antenna termination with a network analyzer: connect the antenna  through a coaxial cable to the measurement device, the |S11| indicates which portion of the power is delivered to antenna and which portion is reflected by the antenna back to the module output. A  good  antenna  should  have  an  |S11|  below  -10  dB  over  the  entire  frequency  band.  Due  to  miniaturization, mechanical constraints and other design issues, this value will not be achieved. An |S11| value of about -6 dB - (in the worst case) - is acceptable. Figure 63 shows an example of this measurement:  Figure 63:  |S11| sample measurement  of  a  penta-band  antenna  that covers in a small form factor the 4 GSM  bands (850 MHz, 900 MHz, 1800 MHz and 1900 MHz) and the UMTS Band I Figure 64 shows comparable measurements performed on a wideband antenna. The termination is better, but the size of the antenna is considerably larger.  Figure 64: |S11| sample measurement of a wideband antenna
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 131 of 175 2.4.2 Antenna radiation An indication of the antenna’s radiated power can be approximated by measuring the |S21| from a target antenna to  the  measurement  antenna,  using  a  network  analyzer  with  a wideband  antenna.  Measurements  should  be done at a fixed distance and orientation, and results compared to measurements performed on a known good antenna.  Figure  65  through  Figure  66  show  measurement  results.  A  wideband  log  periodic-like  antenna  was used, and the comparison was done with a half lambda dipole tuned at 900 MHz frequency. The measurements show both the |S11| and |S21| for the penta-band internal antenna and for the wideband antenna.    Figure 65: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole (green/purple) and a penta-band internal antenna (yellow/cyan) The half lambda dipole tuned  at  900  MHz  is known and  has  good radiation performance  (both  for gain  and directivity). Then, by comparing the |S21| measurement with antenna under investigation for the frequency where the half dipole is tuned (e.g. marker 3 in Figure 65) it is possible to make a judgment on the antenna under test: if the performance is similar then the target antenna is good.  Figure  66:  |S11|  and  |S21|  comparison  between  a  900  MHz  tuned  half  wavelength  dipole  (green/purple)  and  a  wideband commercial antenna (yellow/cyan) Instead if |S21| values for the tuned dipole are much better than the antenna under evaluation (like for marker 1/2 area of Figure 66, where dipole is 5 dB better), then it can be argued that the radiation of the target antenna (the wideband dipole in this case) is considerably less. The same procedure should be repeated on other bands with half wavelength dipole re-tuned to the band under investigation.   For good antenna radiation performance, antenna dimensions should be comparable to a quarter of the wavelength.  Different  antenna types can  be used  for  the  module,  many of  them (e.g.  patch  antennas, monopole)  are  based  on  a  resonating  element  that  works  in  combination  with  a  ground  plane.  The ground plane, ideally infinite, can be reduced down to a minimum size that must be similar to one quarter of the wavelength of  the  minimum  frequency  that  has  to  be  radiated (transmitted/received). Numerical sample: frequency = 1 GHz  wavelength = 30 cm  minimum ground plane (or antenna size) = 7.5 cm. Below this size, the antenna efficiency is reduced.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 132 of 175 2.4.3 Examples of antennas Table 47 lists some examples of possible internal on-board surface-mount antennas Manufacturer Part Number Product Name Description Taoglas PA.25.A Anam GSM / WCDMA SMD Antenna 824..960 MHz, 1710..2170 MHz 36.0 x 6.0 x 5.0 mm Taoglas PA.710.A Warrior GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PA.711.A Warrior II GSM / WCDMA / LTE SMD Antenna Pairs with the Taoglas PA.710.A Warrior for LTE MIMO applications 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PCS.06.A Havok GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2500..2690 MHz 42.0 x 10.0 x 3.0 mm Antenova A10340 Calvus GSM / WCDMA SMD Antenna 824..960 MHz, 1710..2170 MHz 28.0 x 8.0 x 3.2 mm Ethertronics P522304 Prestta GSM / WCDMA SMD Antenna 824..960 MHz, 1710..2170 MHz 35.0 x 9.0 x 3.2 mm 2J 2JE04  GSM / WCDMA SMD Antenna 824..960 MHz, 1710..2170 MHz 24.0 x 5.5 x 4.4 mm Yaego ANT3505B000TWPENA  GSM / WCDMA SMD Antenna 824..960 MHz, 1710..2170 MHz 35.0 x 5.0 x 6.0 mm Table 47: Examples of internal surface-mount antennas Table 48 lists some examples of possible internal off-board PCB-type antennas with cable and connector. Manufacturer Part Number Product Name Description Taoglas FXP14.A.07.0100A  GSM / WCDMA PCB Antenna with cable and U.FL connector 824..960 MHz, 1710..2170 MHz 70.4 x 20.4 mm Taoglas FXP14R.A.07.0100A  GSM / WCDMA PCB Antenna with cable and U.FL connector Integrated 10k shunt diagnostic resistor 824..960 MHz, 1710..2170 MHz 80.0 x 20.8 mm Taoglas PC29.09.0100A TheStripe GSM / WCDMA PCB Antenna with cable and MMCX(M)RA connector 824..960 MHz, 1710..2170 MHz 80.4 x 29.4 mm Taoglas FXUB63.07.0150C  GSM / WCDMA / LTE PCB Antenna with cable and U.FL connector 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 96.0 x 21.0 mm Ethertronics P522310 Prestta GSM / WCDMA PCB Antenna with cable and U.FL connector 824..960 MHz, 1710..2170 MHz 41.0 x 15.0 mm EAD FSQS35241-UF-10 SQ7 GSM / WCDMA / LTE PCB Antenna with cable and U.FL connector 690..960 MHz, 1710..2170 MHz, 2500..2700 MHz 110.0 x 21.0 mm Yaego ANTX100P001BWPEN3  GSM / WCDMA PCB Antenna with cable and I-PEX connector 824..960 MHz, 1710..2170 MHz 50.0 x 20.0 mm Table 48: Examples of internal antennas with cable and connector
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 133 of 175 Table 49 lists some examples of possible external antennas. Manufacturer Part Number Product Name Description Taoglas GSA.8827.A.101111 Phoenix GSM / WCDMA / LTE low-profile adhesive-mount Antenna with cable and SMA(M) connector 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2490..2690 MHz 105 x 30 x 7.7 mm Taoglas GSA.8821.A.301721 I-Bar GSM / WCDMA low-profile adhesive-mount Antenna with cable and Fakra (code-D) connector 824..960 MHz, 1710..2170 MHz 106.7 x 14.7 x 5.8 mm Taoglas TG.30.8112  GSM / WCDMA / LTE swivel dipole Antenna with SMA(M) connector  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz  148.6 x 49 x 10 mm Taoglas OMB.8912.03F21  GSM / WCDMA pole-mount Antenna with N-type (F) connector  824..960 MHz, 1710..2170 MHz 527 x Ø 26 mm Taoglas FW.92.RNT.M  GSM / WCDMA whip monopole Antenna with RP-N-type(M) connector  824..960 MHz, 1710..2170 MHz 274 x Ø 20 mm Nearson T6150AM  GSM / WCDMA swivel monopole Antenna with SMA(M) connector  824..960 MHz, 1710..2170 MHz 179.3 x 22 x 6.5 mm Laird Tech. MAF94300 HEPTA-SM GSM / WCDMA swivel monopole Antenna with SMA(M) connector  824..960 MHz, 1575.42 MHz,1710..2170 MHz, 2400..2500 MHz 161 x 9.3 mm Laird Tech. TRA806/171033P  GSM / WCDMA screw-mount Antenna with N-type(F) connector  824..960 MHz, 1710..2170 MHz 69.8 x Ø 38.1  mm Laird Tech. CMS69273  GSM / WCDMA / LTE ceiling-mount Antenna with N-type(F) connector 698..960 MHz, 1575.42 MHz, 1710..2700 MHz  86 x Ø 199 mm Laird Tech. OC69271-FNM  GSM / WCDMA / LTE pole-mount Antenna with N-type(M) connector 698..960 MHz, 1710..2690 MHz 248 x Ø 24.5 mm Abracon APAMS-102  GSM / WCDMA low-profile adhesive-mount Antenna with cable and SMA(M) connector 824..960 MHz, 1710..2170 MHz 138 x 21 x 6 mm Table 49: Examples of external antennas
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 134 of 175 2.4.4 Antenna detection functionality The internal antenna detect circuit is based on ADC measurement at ANT: the RF port is DC coupled to the ADC unit in the baseband chip which injects a DC current (10 µA for 128 µs) on ANT and measures the resulting DC voltage to evaluate the resistance from ANT pad to GND. The  antenna  detection  is  forced by  the  +UANTR  AT  command:  see the  u-blox  AT  Commands  Manual  [2]  for more details on how to access this feature. To achieve antenna detection functionality, use an RF antenna with built-in resistor from ANT signal to GND, or implement  an  equivalent  solution  with  a  circuit  between  the  antenna  cable  connection  and  the  radiating element as shown in Figure 67. Application Board Antenna AssemblyDiagnostic CircuitLISA-U2 seriesADCCurrent SourceRF ChokeDC BlockingFront-End RF ModuleRF ChokeDC BlockingRadiating ElementZo=50 ΩResistor for DiagnosticCoaxial Antenna CableANT Figure 67: Antenna detection circuit and antenna with diagnostic resistor Examples of components for the antenna detection diagnostic circuit are reported in the following table:  Description Part Number - Manufacturer DC Blocking Capacitor  Murata GRM1555C1H220JA01 or equivalent RF Choke Inductor Murata LQG15HS68NJ02, LQG15HH68NJ02 or equivalent (Self Resonance Frequency ~1GHz) Resistor for Diagnostic  15 k 5%, various Manufacturers Table 50: Example of components for the antenna detection diagnostic circuit The DC impedance at  RF port for  some antennas may be a  DC  open  (e.g. linear  monopole)  or  a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 67, the measured DC resistance will always be at the limits of the measurement range (respectively open or short), and there will be no mean to distinguish between a defect on antenna path with similar characteristics (respectively: removal of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC  signal injected to the  RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.  It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 kΩ to 30 kΩ to assure good antenna detection functionality and to avoid a reduction of module RF performance. The choke inductor should exhibit a parallel Self Resonance Frequency (SRF) in the range of 1 GHz to improve the RF isolation of load resistor.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 135 of 175 For example: Consider a GSM antenna with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from ANT connector to GND:  Reported values close to  the  used  diagnostic  resistor  nominal value  (i.e.  values  from  13  kΩ to 17  kΩ  if a 15 kΩ diagnostic resistor is used) indicate that the antenna is properly connected  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  kΩ)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [2]) means that that the antenna is not connected or the RF cable is broken  Reported  values  below  the  measurement  range  minimum  limit  (1  kΩ)  will  highlight  a  short  to  GND  at antenna or along the RF cable  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method  2.5 ESD guidelines 2.5.1 ESD immunity test overview The  immunity  of  devices  integrating  LISA-U2  modules  to  Electro-Static  Discharge  (ESD)  is  part  of  the Electro-Magnetic  Compatibility  (EMC)  conformity  which  is  required  for  products  bearing  the  CE  marking, compliant  with  the R&TTE  Directive  (99/5/EC),  the  EMC Directive (89/336/EEC)  and  the  Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 [11] and the radio equipment standards ETSI EN 301 489-1 [12], ETSI EN 301 489-7 [13], ETSI EN 301 489-24 [14], which requirements are summarized in Table 51. The ESD immunity test is performed at the enclosure port, defined by  ETSI  EN  301 489-1 [12]  as the physical boundary through which  the  electromagnetic  field  radiates. If the  device  implements  an  integral  antenna,  the enclosure port is defined as all insulating and conductive surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of the ESD immunity test to the whole device depends on the device classification as defined by ETSI  EN  301  489-1  [12].  Applicability  of  the  ESD  immunity  test  to  the  specific  device  ports  or  the  specific interconnecting  cables  to  auxiliary  equipments,  depends  on  device  accessible  interfaces  and  manufacturer requirements, as defined by ETSI EN 301 489-1 [12]. Contact  discharges  are  performed  at  conductive  surfaces,  while  air  discharges  are  performed  at  insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [11].   For the definition of integral antenna, removable antenna, antenna port, device classification see the ETSI EN 301 489-1 [12].  The contact and air discharges are defined in CENELEC EN 61000-4-2 [11]. Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 51: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 136 of 175 2.5.2 ESD immunity test of u-blox LISA-U2 series reference designs Although  Electro-Magnetic  Compatibility  (EMC)  certification  is  required  for  customized  devices  integrating  LISA-U2 modules for R&TTED and European Conformance CE mark, EMC certification (including ESD immunity) has  been  successfully  performed  on  LISA-U2  series  modules  reference  designs  according  to  the  CENELEC  EN 61000-4-2 [11], ETSI EN 301 489-1 [12], ETSI EN 301 489-7 [13] and ETSI EN 301 489-24 [14] European Norms. The  EMC  /  ESD  approved  u-blox  reference  designs  consist  of  a  LISA-U2  series  module  soldered  onto a motherboard which provides supply interface, SIM card, headset and communication port. An external antenna is  connected  to  an  SMA  connector  provided  on  the  motherboard  for  the  main  Tx/Rx antenna.  An  additional external antenna is connected to an additional SMA connector provided on the motherboard for the Rx diversity antenna of LISA-U230 modules. Since an  external  antenna  is used, the antenna  port  can be separated from the enclosure port. The reference design is  not  enclosed  in a  box  so that the enclosure port  is not indentified with  physical surfaces. Therefore, some test cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure.   The u-blox LISA-U2 series reference designs implement all the ESD precautions described in section 2.5.3.  u-blox LISA-U2 series reference designs ESD immunity test results are reported in the Table 52, according to test requirements stated in the  CENELEC EN  61000-4-2  [11], ETSI EN 301 489-1 [12], ETSI EN 301 489-7 [13] and ETSI EN 301 489-24 [14].  Category Application Ref. Design Immunity Level Remarks Contact Discharge  to coupling planes  (indirect contact discharge) Enclosure All +4 kV / -4 kV  Contact Discharges  to conducted surfaces  (direct contact discharge) Enclosure port All Not Applicable Test not applicable to u-blox reference design because it does not provide enclosure surface.  The test is applicable only to equipments providing conductive enclosure surface. Main Antenna port All +4 kV / -4 kV Test applicable to u-blox reference design because it provides antenna with conductive & insulating surfaces. The test is applicable only to equipments providing antenna with conductive surface. Rx Div Antenna port LISA-U230 +4 kV / -4 kV Test applicable to u-blox reference design because it provides antenna with conductive & insulating surfaces. The test is applicable only to equipments providing antenna with conductive surface. Air Discharge  at insulating surfaces Enclosure port All Not Applicable Test not applicable to the u-blox reference design because it does not provide an enclosure surface.  The test is applicable only to equipments providing insulating enclosure surface. Main Antenna port All +8 kV / -8 kV  Test applicable to u-blox reference design because it provides antenna with conductive & insulating surfaces. The test is applicable only to equipments providing antenna with insulating surface. Rx Div Antenna port LISA-U230 +8 kV / -8 kV Test applicable to u-blox reference design because it provides antenna with conductive & insulating surfaces. The test is applicable only to equipments providing antenna with insulating surface. Table 52: Enclosure ESD immunity level of u-blox LISA-U2 series modules reference designs
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 137 of 175 2.5.3 ESD application circuits The  application  circuits  described  in  this  section  are  recommended  and  should be  implemented  in  any  device that integrates a LISA-U2 module, according to the application board classification (see ETSI EN 301 489-1 [12]), to satisfy the requirements for ESD immunity test summarized in Table 51.  Antenna interface  The ANT pin of LISA-U2 modules provides ESD immunity up to 1000 V (contact and air discharge according to IEC 61000-4-2):  higher  protection  level  is  required  if  the  line  is  externally  accessible  on  the  device  (i.e.  the application board where LISA-U2 series module is mounted). The  following  precautions  are  suggested  for  satisfying  ESD  immunity  test  requirements  using  LISA-U2  series modules:  If the device implements an embedded antenna, the device insulating enclosure should provide protection to direct  contact  discharge up to  +4 kV  /  -4  kV and  protection to  air  discharge up  to  +8  kV  /  -8  kV  to  the antenna interface  If  the  device  implements  an  external  antenna,  the  antenna  and  its  connecting  cable  should  provide  a completely insulated enclosure able to provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces  If the  device  implements  an  external antenna and  the  antenna  and  its connecting cable do  not  provide  a completely insulated enclosure able to provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces, an external high pass filter, consisting of  a  series  15  pF  capacitor  (Murata GRM1555C1H150JA01) and a shunt 39  nH  coil (Murata  LQG15HN39NJ02)  should  be  implemented  at  the  antenna  port  as  described  in  Figure  68,  as implemented in the EMC / ESD approved reference design LISA-U2 series modules  Antenna  detection  functionality  is  not  provided  when  implementing  the  high  pass  filter  described  in Figure 68 and Table 53 as ESD protection for the antenna port of LISA-U2 series modules.  External Antenna EnclosureApplication BoardLISA-U2 seriesANTRadiating ElementZo = 50 OhmCoaxial  Antenna CableAntenna PortEnclosure PortCL Figure 68: Antenna port ESD immunity protection application circuit for LISA-U2 series modules Reference Description Part Number - Manufacturer C 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata L 39 nH Multilayer Chip Inductor L0G 0402 5% LQG15HN39NJ02 - Murata Table 53: Example of components for Antenna port ESD immunity protection application circuit for LISA-U2 series modules
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 138 of 175 With  LISA-U230  modules,  the  ANT_DIV  pin  provides  ESD  immunity  up  to  +4  kV  /  -4  kV  for  direct  Contact Discharge and up to +8 kV / -8 kV for Air Discharge: no further precaution to ESD immunity test is needed, as implemented in the EMC / ESD approved reference design of LISA-U230 modules.  RESET_N pin The  following  precautions  are  suggested  for  the  RESET_N  line  of  LISA-U2  modules,  depending  on  the application board handling, to satisfy ESD immunity test requirements:  A 47  pF  bypass capacitor  (e.g.  Murata GRM1555C1H470JA01)  must  be  mounted  on the  line  termination connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board enclosure  A proper series chip ferrite bead noise/EMI suppression filter (e.g. Murata BLM15HD182SN1) must be added on  the  line  connected  to  the  RESET_N  pin  to  avoid  a module  reset  caused  by  an  electrostatic  discharge applied to the application board enclosure  A 220 nF bypass capacitor (e.g. Murata GRM155R60J224KE01) must be mounted as close as possible to the RESET_N pin of LISA-U2 series modules to avoid a module reset caused by an electrostatic discharge applied to the application board enclosure  It is recommended to keep the connection line to RESET_N as short as possible Maximum ESD sensitivity rating of the RESET_N pin is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if the RESET_N pin is externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  general  purpose  ESD  protection  device  (e.g.  EPCOS  CA05P4S14THSG  varistor  array  or  EPCOS CT0402S14AHSG varistor) should be mounted on the RESET_N line, close to accessible point The RESET_N application circuit implemented in  the EMC / ESD approved reference designs  of  LISA-U2 series moduels is described in Figure 20 and Table 19 (section 1.6.3).  SIM interface The  following  precautions  are  suggested  for  LISA-U2  modules  SIM  interface  (VSIM,  SIM_RST,  SIM_IO, SIM_CLK pins), depending on the application board handling, to satisfy ESD immunity test requirements:  A  47  pF  bypass  capacitor  (e.g.  Murata  GRM1555C1H470J)  must  be  mounted  on  the  lines  connected  to VSIM,  SIM_RST,  SIM_IO  and  SIM_CLK  pins  to  assure  SIM  interface  functionality  when  an  electrostatic discharge is applied to the application board enclosure  It is suggested to use as short as possible connection lines at SIM pins Maximum ESD sensitivity rating of SIM interface pins is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if SIM interface pins are externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  device  (e.g.  Infineon  ESD8V0L2B-03L  or  AVX USB0002)  should  be  mounted on  each  SIM  interface  line,  close  to  accessible  points  (i.e.  close  to the  SIM card holder) The SIM interface application circuit implemented in the EMC / ESD approved reference designs of LISA-U2 series modules versions is described in the section 1.8.1.  Other pins and interfaces All the module pins that are externally accessible on the device integrating LISA-U2 module should be included in the ESD immunity test since they are considered to be a port as defined in ETSI EN 301 489-1 [12]. Depending on applicability, to satisfy ESD immunity test requirements according to ESD category level, all the module pins that are externally accessible  should  be protected up to +4 kV  / -4  kV  for direct Contact Discharge and up to +8 kV / -8 kV for Air Discharge applied to the enclosure surface.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Design-In      Page 139 of 175 The maximum ESD sensitivity rating of all the other pins of the module is 1 kV (Human Body Model according to JESD22-A114F).  Higher  protection  level  could  be  required  if  the  relevant  pin  is  externally  accessible  on  the application board. The following precautions are suggested to achieve higher protection level:  USB interface: a very low capacitance (i.e. less or equal to 1 pF) ESD protection device (e.g. Tyco Electronics PESD0402-140 ESD protection device) should be mounted on the USB_D+ and USB_D- lines, close to the accessible points (i.e. close to the USB connector)  SPI interface: a low capacitance (i.e. less than 10 pF) ESD protection device (e.g. Infineon ESD8V0L2B-03L or  AVX  USB0002)  should  be  mounted  on  the  SPI_MISO,  SPI_MOSI,  SPI_SCLK,  SPI_MRDY,  SPI_SRDY lines, close to accessible points  CODEC_CLK: a low capacitance (i.e. less than 10 pF) ESD protection device (e.g. Infineon ESD8V0L2B-03L or AVX USB0001) should be mounted on the CODEC_CLK line, close to accessible point  Other pins: a general purpose ESD protection device (e.g. EPCOS CA05P4S14THSG varistor array or EPCOS CT0402S14AHSG varistor) should be mounted on the related line, close to accessible point
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 140 of 175 3 Features description  3.1 Network indication The  GPIO1,  GPIO2,  GPIO3,  GPIO4  or  GPIO5  alternatively  from  their  default  settings,  can  be  configured  to indicate network status (i.e. no service, registered home network, registered visitor network, voice or data call enabled), by means of the AT+UGPIOC command. For the detailed description, see section 1.12 and to u-blox AT Commands Manual [2], GPIO commands.  3.2 Antenna detection Antenna presence detection capability is provided, evaluating the resistance from the ANT pin to GND by means of an internal antenna detection circuit. The external antenna assembly must be provided with a built-in resistor (diagnostic circuit) to be detected. The antenna detection feature can be enabled through the +UANTR AT command. For  more  details  regarding  feature  description  and  diagnostic  circuit  design-in  see  the  section  2.4.4, and  the u-blox AT Commands Manual [2].  3.3 Jamming Detection In  real  network  situations  modules  can  experience  various  kind  of  out-of-coverage  conditions:  limited  service conditions  when  roaming  to  networks  not  supporting  the  specific  SIM,  limited  service  in  cells  which  are  not suitable or barred due to operators’ choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operator’s carriers entitled to give access to the GSM/UMTS service. The  Jamming  Detection  Feature  detects  such  “artificial”  interference  and  reports  the  start  and  stop  of  such conditions  to  the  client,  which  can  react  appropriately  by  e.g.  switching  off  the  radio transceiver in  order  to reduce power consumption and monitoring the environment at constant periods. The feature consists of detecting, at radio resource level, an anomalous source of interference and signaling it to the client with an unsolicited indication when the detection is entered or released. The jamming condition occurs when:  The module has lost synchronization with the serving cell and cannot select any other cell  The band scan reveals at least n carriers with power level equal or higher than threshold  On all such carriers, no synchronization is possible The number  of  minimum  disturbing  carriers and the power  level threshold can be  configured by the  client  by using the AT+UCD command [2]. The jamming condition is cleared when any of the above mentioned statements does not hold. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command (for more details see the u-blox AT Commands Manual [2]).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 141 of 175 3.4 TCP/IP and UDP/IP Via the AT commands it is possible to access the TCP/IP and UDP/IP functionalities over the Packet Switched data connection. For more details about AT commands see the u-blox AT Commands Manual [2]. LISA-U2 modules support the Direct Link mode for TCP and UDP sockets. Sockets can be set in Direct Link mode to establish a  transparent  end-to-end communication  with  an  already  connected  TCP  or  UDP  socket  via serial interface.  In  Direct  Link  mode,  data  sent  to  the  serial  interface  from  an  external  application  processor  is forwarded to the network and vice-versa. To avoid data loss while using Direct Link, enable HW flow control on the serial interface. 3.4.1 Multiple PDP contexts and sockets Two PDP context types are defined:  “external” PDP context: IP packets are built by the DTE, the MT’s IP instance runs the IP relay function only  “internal”  PDP  context: the  PDP  context  (relying  on the MT’s TCP/IP  stack) is  configured, established and handled  via  the  data  connection  management  packet  switched  data  commands  described  in  u-blox  AT commands manual [2] Multiple  PDP  contexts  are  supported.  The  DTE  can  access  these  PDP  contexts either  alternatively  through  the physical  serial  port,  or  simultaneously  through  the  virtual  serial  ports  of  the  multiplexer  (multiplexing  mode MUX), with the following constraints:  Using the MT’s embedded TCP/IP stack, only 1 internal PDP context is supported. This IP instance supports up to 7 sockets  Using only external PDP contexts, it is possible to have at most 3 IP instances (with 3 different IP addresses) simultaneously.  If  in  addition  the  internal  PDP  context  is  used,  at  most  2  external  PDP  contexts  can  be activated Secondary  PDP  contexts  (PDP  contexts  sharing  the  IP  address  of  a  primary  PDP  context)  are  also  supported. Traffic Flow Filters for such secondary contexts shall be specified according to 3GPP TS 23.060 [19]. At most 2 secondary PDP contexts can be activated, since the maximum number of PDP contexts, both normal and secondary, is always 3. 3.5 FTP  LISA-U2  modules  support  the  File  Transfer  Protocol  and  Secure  File  Transfer  Protocol  functionalities  via  AT commands. Files are read and stored in the local file system of the module. For more details about AT commands see u-blox AT Commands Manual [2]. FTP files can also be transferred using FTP Direct Link:  FTP download: the data coming from the FTP server is forwarded to the application processor via the serial interface (for FTP without Direct Link mode the data is always stored in the module’s FFS)  FTP upload: the data coming from the application processor via the serial interface is forwarded to the FTP server (for FTP without Direct Link mode the data is read from the module’s FFS) When Direct Link is used for a FTP file transfer, only the file content pass through the serial interface, whereas all the FTP commands handling is managed internally by the FTP application. Due to the limited size of module FFS, FTP direct link is useful to transfer files with size greater than FFS. To avoid data loss while using direct link, enable HW flow control on the serial interface. 3.6 HTTP  LISA-U2  modules  support  Hyper-Text  Transfer  Protocol  (HTTP/1.0)  functionalities  as  an  HTTP  client  is implemented:  HEAD,  GET,  POST,  DELETE  and  PUT  operations  are  available.  The  file  size  to  be  uploaded  / downloaded depends on the free space available in the local file system (FFS) at the moment of the operation. Up to 4 HTTP client contexts can simultaneously be used.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 142 of 175 LISA-U2 modules support also Secure Hyper-Text Transfer Protocol functionalities providing SSL encryption. For more details about AT commands see the u-blox AT Commands Manual [2].  3.7 SSL/TLS The modules support the Secure Sockets Layer (SSL) / Transport Layer Security (TLS) with certificate key sizes up to 4096 bits to provide security over the FTP and HTTP protocols. The SSL/TLS support provides different connection security aspects:  Server  authentication10:  use  of  the  server  certificate  verification  against  a  specific  trusted  certificate  or  a trusted certificates list  Client authentication10: use of the client certificate and the corresponding private key  Data security and integrity: data encryption and Hash Message Authentication Code (HMAC) generation The security aspects used during a connection depend on the SSL/TLS configuration and features supported.  Table 55 contains the settings of the default SSL/TLS profile and Table  55 to Table 59 report the main SSL/TLS supported  capabilities  of  the  products.  For  a  complete  list  of  supported  configurations  and  settings  see  the u-blox AT Commands Manual [2].  Settings Value  Meaning Certificates validation level Level 0 The server certificate will not be checked or verified Minimum SSL/TLS version Any The server can use any of the TLS1.0/TLS1.1/TLS1.2 versions for the connection Cipher suite Automatic The cipher suite will be negotiated in the handshake process Trusted root certificate internal name None No certificate will be used for the server authentication Expected server host-name None No server host-name is expected Client certificate internal name None No client certificate will be used Client private key internal name None No client private key will be used Client private key password None No client private key password will be used Pre-shared key None No pre-shared key password will be used Table 54: Default SSL/TLS profile  SSL/TLS Version Supported feature SSL 2.0 NO SSL 3.0 YES TLS 1.0 YES TLS 1.1 YES10 TLS 1.2 YES10  Table 55: SSL/TLS version support  Algorithm Supported feature RSA YES10 PSK YES Table 56: Authentication                                                        10 Not supported by "01", "x2" and "68" product versions
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 143 of 175 Algorithm Supported feature RC4 NO11  DES YES 3DES YES10  AES128 YES AES256 YES10  Table 57: Encryption  Algorithm Supported feature MD5 NO11   SHA/SHA1 YES SHA256 YES10  SHA384 YES10 Table 58: Message digest  Description Registry value Supported feature TLS_RSA_WITH_AES_128_CBC_SHA 0x00,0x2F YES10 TLS_RSA_WITH_AES_128_CBC_SHA256 0x00,0x3C YES10 TLS_RSA_WITH_AES_256_CBC_SHA 0x00,0x35 YES10 TLS_RSA_WITH_AES_256_CBC_SHA256 0x00,0x3D YES10 TLS_RSA_WITH_3DES_EDE_CBC_SHA 0x00,0x0A YES10 TLS_RSA_WITH_RC4_128_MD5 0x00,0x04 NO11   TLS_RSA_WITH_RC4_128_SHA 0x00,0x05 NO11   TLS_PSK_WITH_AES_128_CBC_SHA 0x00,0x8C YES10 TLS_PSK_WITH_AES_256_CBC_SHA 0x00,0x8D YES10 TLS_PSK_WITH_3DES_EDE_CBC_SHA 0x00,0x8B YES10 TLS_RSA_PSK_WITH_AES_128_CBC_SHA 0x00,0x94 YES10 TLS_RSA_PSK_WITH_AES_256_CBC_SHA 0x00,0x95 YES10 TLS_RSA_PSK_WITH_3DES_EDE_CBC_SHA 0x00,0x93 YES10 TLS_PSK_WITH_AES_128_CBC_SHA256 0x00,0xAE YES10 TLS_PSK_WITH_AES_256_CBC_SHA384 0x00,0xAF YES10 TLS_RSA_PSK_WITH_AES_128_CBC_SHA256 0x00,0xB6 YES10 TLS_RSA_PSK_WITH_AES_256_CBC_SHA384 0x00,0xB7 YES10 Table 59: TLS cipher suite registry  3.8 Dual stack IPv4/IPv6  Not supported by "01", "x2" and "68" product versions.  LISA-U2 modules support both Internet Protocol version 4 and Internet Protocol version 6. For more details about dual stack IPv4/IPv6 see the u-blox AT Commands Manual [2].                                                        11 Supported only by "01", "x2" and "68" product versions
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 144 of 175 3.9 AssistNow clients and GNSS integration For  customers  using  u-blox  GNSS  receivers,  LISA-U2  cellular  modules  feature  embedded  AssistNow  clients. AssistNow A-GPS provides better GNSS performance and faster Time-To-First-Fix. The clients can be enabled and disabled with an AT command (see the u-blox AT Commands Manual [2]). LISA-U2  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no  additional requirements  for  resources  or  software  integration  on  an  external  host  micro  controller.  Full  access  to  u-blox GNSS receivers is available  via  the  LISA-U2 series, through a dedicated DDC (I2C) interface, while the available GPIOs can handle the positioning chipset / module power-on/off. This means that GSM/WCDMA and GNSS can be controlled through a single serial port from any host processor.  3.10 Hybrid positioning and CellLocate® Although GNSS is a widespread technology, its reliance on the visibility of extremely weak GNSS satellite signals means that positioning is not always possible. Especially difficult environments for GNSS are indoors, in enclosed or underground parking  garages, as  well as in  urban  canyons  where  GNSS  signals  are  blocked  or  jammed  by multipath interference. The situation can be improved by augmenting GNSS receiver data with cellular network information to provide positioning information even when GNSS reception is degraded or absent. This additional information can benefit numerous applications. 3.10.1 Positioning through cellular information: CellLocate® u-blox CellLocate® enables the estimation of device position based on the parameters of the mobile network cells visible to the specific device. To estimate its position the u-blox cellular module sends the CellLocate® server the parameters  of  network  cells  visible  to  it  using  a  UDP  connection.  In  return the  server  provides  the  estimated position based  on the  CellLocate® database. The u-blox cellular module can either send the parameters of  the visible home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators (deep scan).  Normal scan is only possible in 2G mode.  The CellLocate® database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:  1. Several devices reported their position to the CellLocate® server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 145 of 175 2. CellLocate® server defines the area of Cell A visibility    3. If a new device reports the observation of Cell A  CellLocate® is able to provide the estimated position from the area of visibility    4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility.    CellLocate® is implemented using a set of two AT commands that allow configuration of the CellLocate® service (AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy.   The accuracy of the position estimated by CellLocate® depends on the availability of historical observations in the specific area.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 146 of 175 3.10.2 Hybrid positioning With  u-blox  Hybrid  positioning  technology,  u-blox  cellular  devices  can  be  triggered  to  provide  their  current position using either a u-blox GNSS receiver or the position estimated from CellLocate®. The choice depends on which positioning method provides the best and fastest solution according to the user configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid positioning  is implemented through a set of three AT commands that allow configuration of the GNSS receiver (AT+ULOCGNSS), configuration of the CellLocate® service (AT+ULOCCELL), and requesting the position according  to  the  user  configuration  (AT+ULOC).  The  answer  is  provided  in  the  form  of  an  unsolicited  AT command  including  latitude,  longitude  and  estimated  accuracy  (if  the  position  has  been  estimated  by CellLocate®), and additional parameters if the position has been computed by the GNSS receiver. The  configuration  of  mobile  network  cells  does  not  remain  static  (e.g.  new  cells  are  continuously  added  or existing cells are reconfigured by the network operators). For this reason, when a Hybrid positioning method has been  triggered  and  the  GNSS  receiver  calculates  the  position,  a  database  self-learning  mechanism  has  been implemented so that these positions are sent to the server to update the database and maintain its accuracy.  The use of hybrid positioning requires a connection via the DDC (I2C) bus between the LISA-U2 cellular module and the u-blox GNSS receiver (see section 1.10). See the GNSS Implementation Application Note [16] for the complete description of the feature.   u-blox  is  extremely  mindful  of  user  privacy.  When  a position  is  sent  to  the  CellLocate®  server u-blox  is unable to track the SIM used or the specific device.  3.11 Control Plane Aiding / Location Services (LCS)  Not supported by "01", "x2" and "68" product versions With  the  Assisted  GPS  feature,  a  location  server  provides  the  module  with  the  GPS  system  information  that otherwise has to be downloaded from satellites. The feature allows faster position fixes, increases sensitivity and reduces module power consumption. The feature is invoked by the module through LCS Supplementary Services or by the Network during emergency calls. The assisted GPS Location Services feature is based on the Radio Resources Location Protocol (RRLP), according to 3GPP TS 44.031 [27], and Radio Resource Control (RRC) according to 3GPP TS 25.331 [28]. For more details, see the u-blox AT Commands Manual [2].  3.12 Firmware (upgrade) Over AT (FOAT) 3.12.1 Overview This feature allows upgrading the module Firmware over UART, USB and SPI interfaces, using AT Commands.  AT Command AT+UFWUPD triggers a reboot followed by the upgrade procedure at specified a baud rate (see the u-blox AT Commands Manual [2] for more details)  The Xmodem-1k protocol is used for downloading the new Firmware image via a terminal application  A special boot loader on the module performs firmware installation, security verifications and module reboot  Firmware authenticity verification is performed via a security signature during the download. The firmware is then  installed,  overwriting  the  current  version.  In  case  of  power  loss  during  this  phase,  the  boot  loader detects a fault at the next wake-up, and restarts the firmware download from the Xmodem-1k handshake. After completing the upgrade, the module is reset again and wakes-up in normal boot
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 147 of 175 3.12.2 FOAT procedure The application processor must proceed in the following way:  Send the AT+UFWUPD command through the UART or over the USB interface, specifying the file type and the desired baud rate  Reconfigure the serial communication at the selected baud rate, without flow control with the Xmodem-1k protocol  Send the new FW image via Xmodem-1k  3.13 In-Band modem (eCall / ERA-GLONASS)  Not supported by supported by "01", "x2" and "68" product versions.  LISA-U2 module supports an In-Band modem solution for eCall and ERA-GLONASS emergency call applications over cellular networks, implemented according to 3GPP TS 26.267 [24], BS EN 16062:2011 [25] and ETSI TS 122 101 [26] specifications. eCall  (European)  and  ERA-GLONASS  (Russian)  are  initiatives  to  combine  mobile  communications  and  satellite positioning  to  provide  rapid  assistance  to  motorists  in  the  event  of  a  collision,  implementing  automated emergency response system based the first on GPS the latter on GLONASS positioning system. When activated, the in-vehicle systems (IVS) automatically initiate an emergency call carrying both voice and data (including  location  data)  directly  to  the  nearest  Public  Safety  Answering  Point  (PSAP)  to  determine  whether rescue services should be dispatched to the known position.  Figure 69: eCall and ERA-GLONASS automated emergency response systems diagram flow  3.14 SIM Access Profile (SAP) SIM access profile (SAP) feature allows LISA-U2 modules to access and use a remote (U)SIM card instead of the local SIM card directly connected to the module (U)SIM interface. LISA-U2 modules provide a dedicated USB SAP channel and dedicated multiplexer SAP channel over UART and SPI for communication with the remote (U)SIM card. The  communication  between  LISA-U2  modules  and  the  remote  SIM  is  conformed  to  client-server  paradigm: LISA-U2  module  is  the  SAP  client  establishing  a  connection and  performing  data  exchange  to  an  SAP  server directly connected to the remote SIM that is used by LISA-U2 module for GSM/UMTS network operations. SAP communication protocol is based on the SIM Access Profile Interoperability Specification [22].   LISA-U2 modules do not support SAP server role: the module acts as SAP client only.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 148 of 175 A typical application using the SAP feature is the scenario where a device such as an embedded car-phone with an  integrated LISA-U2  module  uses  a remote SIM  included  in  an  external  user  device  (e.g.  a  simple SIM card reader  or  a  portable  phone), which  is  brought  into  the  car.  The  car-phone  accesses  the  GSM/UMTS network using the remote SIM in the external device. LISA-U2 modules, acting as an SAP client, can be connected to an SAP server by a completely wired connection, as shown in Figure 70.  Device including LISAGSM/UMTS InterfaceSAP             Serial Interface(USB SAP channel,   or MUX SAP channel  over UART or SPI)Local SIM(optional)LISA moduleSAP ClientApplicationProcessorDevice including SIMSAP                   Serial InterfaceRemote SIMMobileEquipmentSAP Server Figure 70: Remote SIM access via completely wired connection As stated in the SIM Access Profile Interoperability Specification [22], the SAP client can be connected to the SAP server by means of a Bluetooth cellular link, using additional Bluetooth transceivers. In this case, the application processor  wired to  LISA-U2  modules  establishes  and  controls the  Bluetooth  connection using  the  SAP  profile, and routes data received over a serial interface channel to data transferred over a Bluetooth interface and vice versa, as shown in Figure 71.  Device including LISASAP              Serial Interface(USB SAP channel,      or MUX SAP channel over UART or SPI)GSM/UMTS InterfaceLocal SIM(optional)LISA moduleSAP ClientApplicationProcessorSAP  Bluetooth InterfaceBluetoothTransceiverDevice including SIMRemote SIMMobileEquipmentSAP ServerBluetoothTransceiver Figure 71: Remote SIM access via Bluetooth and wired connection The application processor can start an SAP connection negotiation between LISA-U2 module SAP client and an SAP server using custom AT command (for more details see the u-blox AT Commands Manual [2]). While the connection with the SAP server is not fully established, the LISA-U2 module continues to operate with the  attached  (local)  SIM,  if  present.  Once  the  connection  is  established  and  negotiated,  the  LISA-U2  module performs a detach operation from the local SIM followed by an attach operation to the remote one. Then the remotely attached SIM is used for any GSM/UMTS network operation. URC indications are provided to inform the user about the state of both the local and remote SIM. The insertion and the removal of the local SIM card are notified if a proper card presence detection circuit using the GPIO5 of LISA-U2  modules is  implemented as  shown in  the  section  1.8.1,  and  if  the  related “SIM card detection”  and “SIM  hot  insertion/removal”  functions  are  enabled  by  AT  commands  (for  more  details  see  the  u-blox  AT Commands Manual [2], +UGPIOC, +UDCONF=50 AT commands). Upon SAP deactivation, the LISA-U2 modules perform a detach operation from the remote SIM followed by an attach operation to the local one, if present.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 149 of 175 3.15 Smart Temperature Management Cellular modules – independent of the specific model – always have a well defined operating temperature range. This range should be respected to guarantee full device functionality and long life span. Nevertheless  there  are  environmental  conditions  that  can  affect  operating  temperature,  e.g.  if  the  device  is located near a heating/cooling source, if there is/isn’t air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security  mechanism  embedded  into  the  module  is  a  good  solution  to  prevent  operation  of  the  device outside of the specified range. 3.15.1 Smart Temperature Supervisor (STS) The  Smart  Temperature  Supervisor  is  activated  and  configured  by  a  dedicated  AT+USTS  command.  See  the u-blox AT Commands Manual [2] for more details. The cellular module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range.   Temperature measurement is done inside the cellular module: the measured value could be different from the environmental temperature (Ta). Warningareat-1 t+1 t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea Figure 72: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 72) named t-2, t-1, t+1 and t+2.  Within the first limit, (t-1 < Ti < t+1), the cellular module is in the normal working range, the Safe Area  In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the cellular module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition  Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and  represents a  dangerous  working condition.  This  condition is  indicated  and  the  device  shuts  down to avoid damage   For security reasons the  shutdown is  suspended  in case an  emergency call  in  progress. In  this  case the device will switch off at call termination.  The user can decide at anytime to enable/disable the Smart Temperature Supervisor feature. If the feature is disabled there is no embedded protection against disallowed temperature conditions.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 150 of 175 Figure 73 shows the flow diagram implemented in LISA-U2 modules for the Smart Temperature Supervisor.  IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)Wait emergencycall terminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is  within normal operating rangeYesTempetature  is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled  in  indication only mode:no  further actionsSend notification (safe)Previously outside of Safe AreaTempetature  is back to safe areaNoNo furtheractionsYes Figure 73: Smart Temperature Supervisor (STS) flow diagram
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 151 of 175 3.15.2 Threshold Definitions When the application of cellular module operates at extreme temperatures with Smart Temperature Supervisor enabled, the user should note that outside the valid temperature range the device will automatically shut down as described above. The input  for  the  algorithm is always  the  temperature measured  within the  cellular module  (Ti,  internal).  This value  can  be  higher  than  the  working  ambient  temperature  (Ta,  ambient),  since  (for  example)  during transmission at maximum power a significant fraction of DC input power is dissipated as heat This behavior  is partially  compensated  by  the  definition  of  the  upper  shutdown  threshold  (t+2)  that  is  slightly  higher  than  the declared environmental temperature limit. The temperature thresholds are defined according the Table 60. Symbol Parameter Temperature Remarks t-2 Low temperature shutdown –40 °C Equal to the absolute minimum temperature rating for the cellular module (the lower limit of the extended temperature range) t-1 Low temperature warning –30 °C 10°C above t-2 t+1 High temperature warning +77 °C 20°C below t+2. The higher warning area for upper range ensures that any countermeasures used to limit the thermal heating will become effective, even considering some thermal inertia of the complete assembly. t+2 High temperature shutdown +97 °C Equal to the internal temperature Ti measured in the worst case operating condition at typical supply voltage when the ambient temperature Ta in the reference setup (*) equals the absolute maximum temperature rating (upper limit of the extended temperature range) (*)LISA-U2 module mounted on a 90 mm x 70 mm x 1.46 mm 4-Layers PCB with a high coverage of copper within climatic chamber Table 60: Thresholds definition for Smart Temperature Supervisor on the LISA-U2 modules   The sensor measures board temperature inside the shields, which can differ from ambient temperature.  3.16 Bearer Independent Protocol  Not supported by "01", "x2" and "68" product versions. The Bearer Independent Protocol is a mechanism by which a cellular module provides a SIM with access to the data  bearers  supported  by  the  network.  With  the  Bearer  Independent  Protocol  (BIP)  for  Over-the-Air  SIM provisioning,  the  data  transfer  from  and  to  the  SIM  uses  either an  already  active  PDP  context  or  a  new  PDP context established with the APN provided by the SIM card. For more details, see the u-blox AT Commands Manual [2].  3.17 Multi-Level Precedence and Pre-emption Service  Not supported by "01", "x2" and "68" product versions. The Multi-Level Precedence and Pre-emption Service (eMLPP) permits to handle the call priority. The maximum priority associated to a user is set in the SIM: within this threshold, the user can assign different priorities to the calls. This  results  in a differentiated  treatment of the  calls by  the network  in case  of  abnormal  events  such as handovers to congested cells. For more details, see the u-blox AT Commands Manual [2].
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Features description      Page 152 of 175 3.18 Network Friendly Mode  Not supported by "01", "x2" and "68" product versions. The Network Friendly Mode (NFM) feature provides a more efficient access to the network since it regulates the number of network accesses per service type over a configurable amount of time, avoiding scenarios in which the cellular module continuously retries a registration or a PDP context activation procedure until it is successful. In case of appropriate network rejection errors, a back-off timer can be started: when the timer is running or the number of allowed accesses is reached, further attempts are denied and an URC may be enabled to indicate the time  remaining  before  a  further  attempt  can  be  served.  The  back-off  timer  controls  the  temporal  spread  of successive attempts to register to CS or PS services, to activate a PDP context and to send SMS messages. For more details, see the u-blox AT Commands Manual [2].  3.19 Power saving The  power  saving  configuration  is  by  default  disabled,  but  it  can  be  enabled  using  the  AT+UPSV  command. When power saving  is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During the low power idle-mode, the module is not ready to communicate with an external device by means of the application interfaces, since it is configured to reduce power consumption. The module wakes up from the low power idle-mode to the active-mode in these events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see sections 1.5.3.3, 1.9.2.3)  Automatic periodic enable of the UART interface to receive and send data, if AT+UPSV=1 has been set (see section 1.9.2.3)  Data received on UART interface, if HW flow control has been disabled by AT&K0 and AT+UPSV=1 has been set (see section 1.9.2.3)  RTS input set ON by the DTE if HW flow control has been disabled by AT&K0 and AT+UPSV=2 has been set (see section 1.9.2.3)  DTR input set ON by DTE if AT+UPSV=3 has been set (not supported by “01” product versions, see section 1.9.2.3)  USB detection, applying 5 V (typ.) to VUSB_DET input (see section 1.9.3)  The connected USB host forces a remote wakeup of the module as USB device (see section 1.9.3)  The connected SPI master indicates by means of the SPI_MRDY input signal of the module that it is ready for transmission or reception over the SPI interface (see section 1.9.4)  The  connected  u-blox  GNSS  receiver  indicates  by  means  of  the  GPIO3  pin  previously  configured  for  the “GNSS  data  ready”  function  that  it is  ready  to  send  data  over  the  I2C / DDC  interface (see sections 1.10, 1.12)  RTC alarm previously configured by AT command (see u-blox AT Commands Manual [2], AT+CALA)  For the complete description of the AT+UPSV command, see the u-blox AT Commands Manual [2]. For the definition and the description of LISA-U2 series modules operating modes, including the events forcing transitions between the different operating modes, see section 1.4. For the description of current consumption in idle and active operating modes, see sections 1.5.3.3, 1.5.3.4. For the description of the UART behavior related to module power saving configuration, see section 1.9.2.3. For the description of the USB behavior related to module power saving configuration, see section 1.9.3.2. For the description of the SPI behavior related to module power saving configuration, see section 1.9.4.2.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Handling and soldering      Page 153 of 175 4 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  4.1 Packaging, shipping, storage and moisture preconditioning For  information  pertaining  to  reels  and  tapes,  Moisture  Sensitivity  levels  (MSD),  shipment  and  storage information,  as  well  as  drying  for  preconditioning  see  the  LISA-U2  series  Data  Sheet [1]  and  u-blox  Package Information Guide [21]. The LISA-U2 modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  4.2 Soldering 4.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217°C Stencil Thickness:  150 µm for base boards  The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.2.2  The  quality  of  the  solder  joints  on  the  connectors  (’half  vias’)  should  meet  the  appropriate  IPC specification.  4.2.2 Reflow soldering A  convection  type-soldering  oven  is  strongly  recommended  over  the  infrared  type  radiation  oven. Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be  heated  up  evenly, regardless of material properties, thickness of components and surface color. Consider  the  "IPC-7530  Guidelines for  temperature profiling for  mass  soldering  (reflow  and  wave) processes, published 2001".  Reflow profiles are to be selected according to the following recommendations.  Failure to observe these recommendations can result in severe damage to the device!  Be aware that IPC/JEDEC J-STD-020 applies to integrated circuits, cannot be properly applied to module devices.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Handling and soldering      Page 154 of 175 Preheat phase Initial  heating  of  component leads  and balls. Residual  humidity  will be  dried out.  This  preheat  phase will  not replace prior baking procedures.  Temperature rise rate: max 3°C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated.  Conversely,  if  performed excessively,  fine  balls and  large balls will be generated in clusters.  End Temperature: 150 - 200°C  If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump of the paste could become worse.  Limit time above 217°C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245°C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4°C / s  To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  soldering  temperature  profile  chosen  at the  factory  depends  on  additional  external  factors  like  choice  of soldering paste, size, thickness and properties of the base board, etc.   Exceeding  the  maximum  soldering  temperature  and  the  maximum  liquidus  time  limit  in  the recommended soldering profile may permanently damage the module. Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50Elapsed time [s] Figure 74: Recommended soldering profile  LISA-U2 modules must not be soldered with a damp heat process.  When soldering lead-free LISA-U2 series modules in a leaded process, check the following temperatures:
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Handling and soldering      Page 155 of 175 4.2.3 Optical inspection After soldering the LISA-U2 modules, inspect the modules optically to verify that the module is properly aligned and centered. 4.2.4 Cleaning Cleaning  the  soldered  modules  is  not  recommended.  Residues  underneath  the  modules  cannot  be  easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol or other organic  solvents can result in soldering flux residues  flooding  into the  two housings, areas that are not accessible for post-wash inspections. The  solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. 4.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LISA-U2 module populated on it.  4.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components.  Only a single wave soldering process is encouraged for boards populated with LISA-U2 modules. 4.2.7 Hand soldering Hand soldering is not recommended. 4.2.8 Rework The LISA-U2 modules can be unsoldered from the baseboard using a hot air gun.  Avoid overheating the module. After the module is removed, clean the pads before placing.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such actions immediately terminate the warranty.  4.2.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These  materials  affect  the  HF  properties  of  the  LISA-U2  modules  and  it  is  important  to  prevent  them  from flowing into the module. The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Handling and soldering      Page 156 of 175 4.2.10 Casting If casting is required, use viscose or another type of silicone-pottant. The OEM is strongly advised to qualify such processes in combination with the LISA-U2 modules before implementing this in the production.  Casting will void the warranty. 4.2.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox gives  no warranty for  damages to  the LISA-U2 modules caused  by  soldering  metal cables or  any other forms of metal strips directly onto the EMI covers. 4.2.12 Use of ultrasonic processes LISA-U2 modules contain components which are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox gives no warranty against damages to the LISA-U2 modules caused by any Ultrasonic Processes.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Product Testing      Page 157 of 175 5 Product Testing 5.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following measurements are done:  Digital self-test (firmware download, Flash firmware verification, IMEI programming)  Measurement of voltages and currents  Adjustment of ADC measurement interfaces  Functional  tests  (Serial  interface  communication,  real  time  clock,  battery  charger,  temperature  sensor, antenna detection, SIM card communication)  Digital tests (GPIOs, digital interfaces)  Measurement and calibration of RF characteristics in all supported bands (Receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels)  Verification  of  RF  characteristics  after  calibration  (modulation  accuracy,  power  levels  and  spectrum performance are checked to be within tolerances when calibration parameters are applied)   Figure 75: Automatic test equipment for module tests  5.2 Test parameters for OEM manufacturer Because of the testing done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. An OEM manufacturer should focus on:  Module assembly on the device; it should be verified that: o Soldering and handling process did not damaged the module components o All module pins are well soldered on device board o There are no short circuits between pins
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Product Testing      Page 158 of 175  Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna  Dedicated  tests  can  be  implemented  to  check  the  device.  For  example,  the  measurement  of  module  current consumption when set in a specified status can detect a short circuit if compared with a “Golden Device” result. Module AT commands are used to perform functional tests (communication with host controller, check SIM card interface, check communication between module and GNSS, GPIOs, etc.) and to perform RF performance tests.  5.2.1 ‘Go/No go’ tests for integrated devices A ‘Go/No go’ test  is to  compare the  signal quality with a “Golden  Device” in a  position with excellent 2G/3G network coverage and after having dialed a call (see the u-blox AT Commands Manual [2], AT+CSQ command: <rssi>, <ber> parameters).   These kinds of test may be useful as a ‘go/no go’ test but not for RF performance measurements.  This test is suitable to check the communication with host controller and SIM card, the audio and power supply functionality and verify if components at antenna interface are well soldered.  5.2.2 Functional tests providing RF operation Overall RF performance test of the device including antenna can be performed with basic instruments such as a spectrum analyzer (or an RF power meter) and a signal generator using AT+UTEST command over AT interface. The AT+UTEST command gives a  simple interface to set the  module  to  Rx and  Tx  test modes ignoring 2G/3G signaling protocol. The command can set the module:  In transmitting mode in a specified channel and power level in all supported modulation schemes (single slot GMSK, single slot 8PSK, WCDMA) and bands 2G, 3G  In receiving mode in a specified channel to returns the measured power level in all supported bands 2G, 3G   See the u-blox AT Commands Manual [2], for AT+UTEST command syntax description.  See the End user test Application Note [20], for AT+UTEST command user guide, limitations and examples of use.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Product Testing      Page 159 of 175 Application BoardLISA-U2 seriesANTApplication Processor AT   CommandsWireless AntennaSpectrum  AnalyzerorPower MeterINWideband AntennaTXApplication BoardLISA-U2 seriesANTApplication Processor AT   CommandsWireless AntennaSignalGeneratorOUTWideband AntennaRX Figure 76: Setup with spectrum analyzer and signal generator for radiated measurement   This feature allows the measurement of the transmitter and receiver power levels to check component assembly related  to  the  module  antenna  interface  and  to  check  other  device  interfaces  from  which  depends  the  RF performance.   To  avoid  module  damage  during  transmitter  test,  a  proper  antenna  according  to  module specifications or a 50 Ω termination must be connected to ANT pin.  To  avoid  module damage  during receiver test the maximum  power  level  received  at  ANT  pin must meet module specifications.  The  AT+UTEST  command  sets  the  module  to  emit  RF  power  ignoring  2G/3G  signalling  protocol.  This emission  can  generate  interference  that  can  be  prohibited  by  law  in  some  countries.  The  use  of  this feature is intended for testing purpose in controlled environments by qualified user and must not be used during  the  normal  module  operation.  Follow  instructions  suggested  in  u-blox  documentation.  u-blox assumes no responsibilities for the inappropriate use of this feature. Example of production tests for OEM manufacturer:  1. Trigger TX GMSK burst at low Power Control Level (lower than 15) or a RX measure reporting to check: o If ANT pin is soldered o If ANT pin is in short circuit o If module was damaged during soldering process or during handling (ESD, mechanical shock…) o If antenna matching components on application board are soldered o If integrated antenna is correctly connected
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Product Testing      Page 160 of 175  To  avoid  module  damage  during  transmitter  test  when  good  antenna  termination  is  not guaranteed, use a low Power  Control  Level (i.e.  PCL lower or equal  to 15). u-blox assumes  no responsibilities for module damaging caused by an inappropriate use of this feature.  2. Trigger TX GMSK burst at maximum PCL: o To check if the power supply is correctly assembled and is able to deliver the required current  3. Trigger TX GMSK and 8PSK burst and WCDMA signal: o To measure current consumption o To check if module components was damaged during soldering process or during handling (ESD, mechanical shock…)  4. Trigger RX measurement: o To test receiver signal level. Assuming that there are no losses between ANT pin or ANT_DIV pin and  input  power  source,  be  aware  that  the  power  level  estimated  by  the  module  can  vary approximately within 3GPP tolerances for the average value o To  check  if  module  was damaged  during  soldering process or during  handling  (ESD, mechanical shock…)  5. Trigger TX GMSK and 8PSK burst and WCDMA signal and RX measurement to check: o Overall RF performance of the device including antenna measuring TX and RX power levels
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 161 of 175 Appendix A Migration from LISA-U1 to LISA-U2 series Migrating LISA-U1 series designs to LISA-U2 series modules is a straight forward procedure. Nevertheless there are some points to be considered during the migration. A.1 Checklist for migration Have you chosen the optimal module?  For HSDPA category 14, 6-band 3G, Digital Audio Interfaces support, select a LISA-U230 module.  For HSDPA category 8, 6-band 3G, Digital Audio Interfaces support, select a suitable LISA-U200 module.  For HSDPA category 8, 5-band 3G, Digital Audio Interfaces support, select LISA-U201 module.  For HSDPA category 8, 2-band 3G 850/1900 (North America), Digital Audio Interfaces support, select a suitable LISA-U260 module.  For  HSDPA  category  8,  2-band  3G  900/2100  (Europe,  Asia,  Middle-East  and  Africa),  Digital  Audio Interfaces support, select a suitable LISA-U270 module. Check LISA-U2 series Hardware Requirements  Check  the  supported  3G  bands  for  proper  antenna  circuit  development,  since  LISA-U2  supports different 3G bands in comparison to LISA-U1 series cellular modules.  Check audio requirements, since Analog Audio Interfaces are not supported by LISA-U2 series.  Check audio requirements, since Digital Audio Interfaces are supported by LISA-U2 series modules.  Check the PWR_ON low pulse time specified to switch-on the module, since PWR_ON low pulse time requirement is different in comparison to LISA-U1 series modules.  Check the PWR_ON behavior, since LISA-U2 series modules can be switched off forcing PWR_ON pin to the low level for at least 1 s.  Check the PWR_ON input voltage thresholds, since they are slightly changed in comparison to LISA-U1 series modules. By the  way, this is not relevant driving the  PWR_ON  input by  an open drain  or open collector driver as recommended.  Check the RESET_N input voltage thresholds, since they are slightly changed in comparison to LISA-U1 series modules. By  the way, this  is not relevant driving the  RESET_N  input  by an open drain  or open collector driver as recommended.  Check the V_BCKP operating characteristics, since they are slightly changed in comparison to LISA-U1 series modules.  Check internal active pull-up / down values at digital interface input pins and the current capability of digital interface output pins, since they are slightly changed in comparison to LISA-U1 series modules.  Check board layout, since additional signals keep-out area must be implemented on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer. A.2 Software migration A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules Software migration from LISA-U1 to LISA-U2 series cellular modules is a straightforward procedure. Nevertheless there  are  some  differences  to  be  considered  with  firmware  version.  Like  predecessors,  LISA-U2  series  cellular module supports AT commands according to 3GPP standards: TS 27.007 [4], TS 27.005 [5], TS 27.010 [6] and the u-blox AT command extension. Backward compatibility has been maintained as far as possible.  For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [2].
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 162 of 175 A.3 Hardware migration A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules LISA-U2  series  modules  have been  designed  with  backward compatibility  in  mind  but some minor  differences were unavoidable. These minor differences will however not be relevant for the majority of the  LISA-U1 series designs.  Clean and stable supply is required by LISA-U2 as by LISA-U1 series: low ripple and low voltage  drop must  be guaranteed  at  VCC  pins.  The  voltage  provided  has  to  be  within  the  normal  operating  range  limits  to  allow module switch-on  and  has to be  above  the  minimum limit  of  the  extended  operating range  to  avoid  module switch-off. Consider that there are large current spikes in connected mode, when a GSM call is enabled. LISA-U2 series provide wider VCC input voltage range compared to LISA-U1 series.  The ANT pin has 50 Ω nominal characteristic impedance and must be connected to the antenna through a 50 Ω transmission line to allow transmission and reception of radio frequency (RF) signals in the 2G and 3G operating bands. The recommendations of the antenna producer for correct installation and deployment (PCB layout and matching circuitry) must be followed. The  antenna  and  the  whole  RF  circuit  must  provide  optimal  radiating  characteristics  on  the  entire  supported bands: note that LISA-U2 supports different 3G bands in comparison to LISA-U1 series modules. An external application circuit can be implemented on the application device integrating LISA-U2 series modules to satisfy  ESD immunity test  requirements at the  antenna  interface,  as described in  Figure 68  and Table 53 in section 2.5.3. The same application circuit is not applicable for LISA-U1 series. LISA-U230  modules  provide the  RF  antenna  input  for  Rx diversity  on  the  pin  74  (named  ANT_DIV): it  has  an impedance of 50 Ω. The same pad is a reserved pin on LISA-U1 series and on the other LISA-U2 series modules. Analog  audio  interfaces  are  not  supported  by  LISA-U2  series  modules,  but  a  second  4-wire  I2S  digital  audio interface is provided instead of the 4 analog audio pins. The same 4 pins can be configured as GPIO on LISA-U2 series modules. Analog audio can be provided with an external audio codec connected to LISA-U2 series modules, implementing the application circuit described in Figure 50. An external audio codec can be connected to the I2S digital audio interface of LISA-U1 series modules as shown in the same application circuit described in Figure 50. In this case the application processor should properly control the audio codec by  I2C interface and should properly provide clock reference to the audio codec. This circuit allows migration from LISA-U1 series to LISA-U2 series, providing analog audio with the same application circuit.  PWR_ON low pulse time required to switch-on the module is different in comparison to LISA-U1 series modules. LISA-U2 series can be switched off forcing PWR_ON pin to the low level for at least 1 s. PWR_ON and RESET_N input voltage thresholds are slightly changed in comparison to LISA-U1 series modules, but this is not relevant driving PWR_ON and RESET_N inputs by open drain / collector drivers as recommended.  V_BCKP operating characteristics are slightly changed in comparison to LISA-U1 series modules.  The voltage level of all the digital interfaces of LISA-U2 series modules is 1.8 V as for LISA-U1 series modules. The internal active pull-up / pull-down values at digital interface input pins and the current capability of digital interface output pins LISA-U2 series modules are slightly changed in comparison to LISA-U1 series modules.  UART of LISA-U2 series supports autobauding (default setting) and 921600 b/s baud rate.  LISA-U2 series provide one additional USB CDC for remote SIM Access Profile (SAP).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 163 of 175  The 5 pins of the SPI / IPC Serial Interface can be configured as GPIOs on LISA-U2 series.  The DDC (I2C) interface of LISA-U2 series modules can be used to communicate with u-blox GNSS receivers and at the same time to control an external audio codec. The LISA-U2 series module acts as an I2C master which can communicate to two I2C slaves as allowed by I2C bus specifications [8].  LISA-U2 modules provide additional GPIO functions: Module Status and Operating Mode Indications.  LISA-U2  modules  are SMT modules  and  share  the  same compact  form  factor as  the  LISA-U1  series,  featuring Leadless Chip Carrier (LCC) packaging technology. An  additional  signal  keep-out  area  must  be  implemented  on  the  top  layer  of  the  application  board,  below LISA-U2 modules, due to the GND opening on module bottom layer.  Detailed pinout and layout comparisons between LISA-U1 series and LISA-U2 series modules, with remarks for migration, are provided in the subsections A.3.2 and A.3.3. For  more  information  about  the  electrical  characteristics  of  the  LISA-U1  and  LISA-U2  series  modules,  see  the LISA-U1 series Data Sheet [29] and LISA-U2 series Data Sheet [1].  A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series 65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDYSPI_SRDYSPI_MISOSPI_MOSISPI_SCLKRSVD / SPK_NGNDRSVD / SPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039RSVD / MIC_PRSVD / MIC_N28293031323334353637387675747372717069686766GNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGNDLISA-U1Top ViewPin 28…38 = GNDRSVDAnalog AudioSPIRSVD Figure 77: LISA-U1 series pin assignment 65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDY / GPIO14SPI_SRDY / GPIO13SPI_MISO / GPIO12SPI_MOSI / GPIO11SPI_SCLK / GPIO10GPIO9 / I2S1_WAGNDGPIO8 / I2S1_CLKRSVD / CODEC_CLKGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039GPIO7 / I2S1_TXDGPIO6 / I2S1_RXD28293031323334353637387675747372717069686766GNDRSVD / ANT_DIVGNDGNDGNDGNDGNDANTGNDGNDGNDLISA-U2Top ViewPin 28…38 = GNDClock OutDigital Audio or GPIORx DivSPI or GPIO Figure 78: LISA-U2 series pin assignment  (highlighted name/function changes)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 164 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 1 GND Ground GND Ground  2 V_BCKP RTC supply input/output V_BCKP RTC supply input/output V_BCKP operating characteristics difference:  LISA-U1 series: o V_BCKP output = 2.3V typ. o V_BCKP input = 1.0V min / 2.5V max  LISA-U2 series: o V_BCKP output = 1.8V typ. o V_BCKP input = 1.0V min / 1.9V max 3 GND Ground GND Ground  4 V_INT Digital Interfaces supply output V_INT Digital Interfaces supply output No difference: V_INT output = 1.8V typ., 70 mA max. 5 RSVD RESERVED pin RSVD RESERVED pin No difference: This pin must be connected to GND  6…8 GND Ground GND Ground  9 DSR UART data set ready output DSR UART data set ready output Circuit 107 (DSR) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 1 mA 10 RI UART ring indicator output RI UART ring indicator output Circuit 125 (RI) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 2 mA 11 DCD UART data carrier detect output DCD UART data carrier detect output Circuit 109 (DCD) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 2 mA 12 DTR UART data terminal ready input DTR UART data terminal ready input Circuit 108/2 (DTR) in ITU-T V. 24, 1.8V typ.  LISA-U1 series: o Internal active pull-up = -110 µA  LISA-U2 series: o Internal active pull-up = -125 µA 13 RTS UART ready to send input RTS UART ready to send input Circuit 105 (RTS) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Internal active pull-up = -60 µA  LISA-U2 series: o Internal active pull-up = -240 µA 14 CTS UART clear to send output CTS UART clear to send output Circuit 106 (CTS) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 6 mA 15 TXD UART transmitted data input TXD UART transmitted data input Circuit 103 (TxD) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Internal active pull-up = -60 µA  LISA-U2 series: o Internal active pull-up = -240 µA 16 RXD UART received data output RXD UART received data output Circuit 104 (RxD) in ITU-T V.24, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 6 mA 17 GND Ground GND Ground  18 VUSB_DET USB detect input VUSB_DET USB detect input No difference
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 165 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 19 PWR_ON Power-on input PWR_ON Power-on input PWR_ON switch-on low pulse time difference:  LISA-U1 series: o L-level pulse time = 5 ms min  LISA-U2 series: o L-level pulse time = 50 µs min / 80 µs max PWR_ON switch-off low pulse time difference:  LISA-U1 series: o Switch-off by PWR_ON not supported  LISA-U2 series: o L-level pulse time = 1 s min PWR_ON operating voltage difference:  LISA-U1 series: o L-level input = -0.30 V min / 0.65 V max o H-level input = 2.00 V min / 4.20 V max o External pull-up (e.g. to V_BCKP) required  LISA-U2 series: o L-level input = -0.30 V min / 0.65 V max o H-level input = 1.50 V min / 4.40 V max o External pull-up (e.g. to V_BCKP) required 20 GPIO1 GPIO  GPIO1 GPIO Configurable GPIO, 1.8V typ.  LISA-U1 series: o Output driver strength = 1 mA  LISA-U2 series: o Output driver strength = 6 mA Functions on all LISA-U series: o Pad disabled (default) o Input / Output o Network Status Indication o GNSS Supply Enable o GSM Tx Burst Indication Function on LISA-U2 series: o Module Status Indication 21 GPIO2 GPIO GPIO2 GPIO Configurable GPIO, 1.8V typ.  LISA-U1 series: o Output driver strength = 1 mA  LISA-U2 series: o Output driver strength = 1 mA Functions on all LISA-U series: o Pad disabled  o Input / Output o Network Status Indication o GNSS Supply Enable (default) 22 RESET_N External reset input RESET_N External reset input RESET_N hardware reset or switch-on low pulse time:  LISA-U1 series: o L-level pulse time = 50 ms min  LISA-U2 series: o L-level pulse time = 50 ms min RESET_N operating voltage difference:  LISA-U1 series: o L-level input = -0.30 V min / 0.65 V max o H-level input = 1.69 V min / 2.48 V max o Internal 10kΩ pull-up to V_BCKP (2.3V typ)  LISA-U2 series: o L-level input = -0.30 V min / 0.51 V max o H-level input = 1.32 V min / 2.01 V max o Internal 10 kΩ pull-up to V_BCKP (1.8V typ)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 166 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 23 GPIO3 GPIO GPIO3 GPIO Configurable GPIO, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 6 mA Functions on all LISA-U series: o Pad disabled  o Input / Output o Network Status Indication o GNSS Supply Enable o GNSS Data Ready (default) 24 GPIO4 GPIO GPIO4 GPIO Configurable GPIO, 1.8V typ.  LISA-U1 series: o Output driver strength = 4 mA  LISA-U2 series: o Output driver strength = 6 mA  Functions on all LISA-U series: o Pad disabled  o Input / Output o Network Status Indication o GNSS Supply Enable o GNSS RTC Sharing (default) 25 GND Ground GND Ground  26 USB_D- USB Data Line D- input/output USB_D- USB Data Line D- input/output No difference 27 USB_D+ USB Data Line D+ input/output USB_D+ USB Data Line D+ input/output No difference 28...38 GND Ground GND Ground  39 MIC_N LISA-U120,  LISA-U130: Differential analog audio input (neg.) LISA-U100,  LISA-U110: RESERVED pin I2S1_RXD / GPIO6 LISA-U2 series,  2nd I2S Rx data input / GPIO LISA-U120, LISA-U130:  Differential analog audio input (neg.) LISA-U2 series:  I2S1_RXD and configurable GPIO, 1.8V typ. o Output driver strength = 1 mA o Internal active pull-down = 150 µA  Functions: o I2S1_RXD (default) o Pad disabled o Input / Output 40 MIC_P LISA-U120,  LISA-U130: Differential analog audio input (pos.) LISA-U100,  LISA-U110: RESERVED pin I2S1_TXD / GPIO7 LISA-U2 series: 2nd I2S Tx data output / GPIO  LISA-U120, LISA-U130:  Differential analog audio input (pos.) LISA-U2 series:  I2S1_TXD and configurable GPIO, 1.8V typ. o Output driver strength = 1 mA  Functions: o I2S1_TXD (default) o Pad disabled o Input / Output 41 I2S_WA LISA-U120,  LISA-U130: I2S word alignment  LISA-U100,  LISA-U110: RESERVED pin I2S_WA LISA-U2 series: 1st I2S word alignment input/output I2S_WA, 1.8V typ.  LISA-U120, LISA-U130: o Output driver strength = 2.5 mA o Internal active pull-down = 100 µA  LISA-U2 series: o Output driver strength = 2 mA o Internal active pull-down = 200 µA
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 167 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 42 I2S_TXD LISA-U120,  LISA-U130: I2S Tx data output LISA-U100,  LISA-U110: RESERVED pin I2S_TXD LISA-U2 series: 1st I2S Tx data output I2S_TXD, 1.8V typ.  LISA-U120, LISA-U130: o Output driver strength = 2.5 mA  LISA-U2 series: o Output driver strength = 2 mA 43 I2S_CLK LISA-U120,  LISA-U130: I2S clock LISA-U100,  LISA-U110: RESERVED pin I2S_CLK LISA-U2 series: 1st I2S clock input/output I2S_CLK, 1.8V typ.  LISA-U120, LISA-U130: o Output driver strength = 2.5 mA o Internal active pull-down = 100 µA  LISA-U2 series: o Output driver strength = 2 mA  o Internal active pull-down = 200 µA 44 I2S_RXD LISA-U120,  LISA-U130: I2S Rx data input LISA-U100,  LISA-U110: RESERVED pin I2S_RXD LISA-U2 series: 1st I2S Rx data input I2S_RXD, 1.8V typ.  LISA-U120, LISA-U130: o Output driver strength = 2.5 mA o Internal active pull-down = 100 µA  LISA-U2 series: o Output driver strength = 2 mA o Internal active pull-down = 200 µA 45 SCL I2C bus clock line output SCL I2C bus clock line output LISA-U1 series:  I2C SCL for GNSS, 1.8V typ. o Fixed open drain o External pull-up (e.g. to V_INT) required LISA-U2 series:  I2C SCL for GNSS and other I2C devices, 1.8V typ. o Fixed open drain o External pull-up (e.g. to V_INT) required 46 SDA I2C bus data line input/output SDA I2C bus data line input/output LISA-U1 series:  I2C SDA for GNSS, 1.8V typ. o Fixed open drain o External pull-up (e.g. to V_INT) required LISA-U2 series:  I2C SDA for GNSS and other I2C devices, 1.8V typ o Fixed open drain o External pull-up (e.g. to V_INT) required 47 SIM_CLK SIM clock output SIM_CLK SIM clock output No difference: 3.25 MHz clock frequency for SIM card 48 SIM_IO SIM data input/output SIM_IO SIM data input/output No difference:  Internal 4.7 kΩ pull-up resistor to VSIM. 49 SIM_RST SIM reset output SIM_RST SIM reset output No difference: Reset output for SIM card 50 VSIM SIM supply output VSIM SIM supply output No difference: VSIM output = 1.80 V typ or 2.90 V typ 51 GPIO5 GPIO GPIO5 GPIO Configurable GPIO, 1.8V typ.  LISA-U1 series: o Output driver strength = 2.5 mA  LISA-U2 series: o Output driver strength = 6 mA Functions on all LISA-U series: o Pad disabled o Input / Output o SIM card detection (default) o Network Status Indication o GNSS Supply Enable Functions on LISA-U2 series only: o Module Operating Mode Indication o SIM card hot insertion/removal (+UDCONF)
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 168 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 52 RSVD RESERVED pin CODEC_CLK LISA-U2 series: Clock output LISA-U2 series:  Digital clock output for external audio codec  Output driver strength = 4 mA 53 SPK_P LISA-U120,  LISA-U130: Differential analog audio output (pos.) LISA-U100,  LISA-U110: RESERVED pin I2S1_CLK / GPIO8 LISA-U2 series: 2nd I2S clock input/output / GPIO LISA-U120, LISA-U130:  Differential analog audio output (pos.) LISA-U2 series:  I2S1_CLK and configurable GPIO, 1.8V typ. o Output driver strength = 1 mA o Internal active pull-down = 150 µA  Functions: o I2S1_CLK (default) o Pad disabled o Input / Output 54 SPK_N LISA-U120,  LISA-U130: Differential analog audio output (neg.) LISA-U100,  LISA-U110: RESERVED pin I2S1_WA / GPIO9 LISA-U2 series: 2nd I2S word alignment input/output / GPIO LISA-U120, LISA-U130:  Differential analog audio output (neg.) LISA-U2 series:  I2S1_WA and configurable GPIO, 1.8V typ. o Output driver strength = 1 mA o Internal active pull-down = 150 µA  Functions: o I2S1_WA (default) o Pad disabled o Input / Output 55 SPI_SCLK SPI Serial Clock Input SPI_SCLK / GPIO10 SPI Serial Clock Input / GPIO LISA-U1 series:  SPI_CLK, 1.8V typ o Internal active pull-down = 100 µA LISA-U2 series:  SPI_CLK and configurable GPIO, 1.8V typ. o Internal active pull-down = 200 µA o Output driver strength = 6 mA  Functions: o SPI_CLK (default) o Pad disabled o Input / Output 56 SPI_MOSI SPI Data Line Input SPI_MOSI / GPIO11 SPI Data Line Input / GPIO LISA-U1 series:  SPI_MOSI, 1.8V typ o Internal active pull-up = -110 µA LISA-U2 series:  SPI_MOSI and configurable GPIO, 1.8V typ. o Internal active pull-up = -240 µA o Output driver strength = 6 mA  Functions: o SPI_MOSI (default) o Pad disabled o Input / Output 57 SPI_MISO SPI Data Line Output SPI_MISO / GPIO12 SPI Data Line Output / GPIO LISA-U1 series:  SPI_MISO, 1.8V typ o Output driver strength = 2.5 mA LISA-U2 series:  SPI_MISO and configurable GPIO, 1.8V typ. o Output driver strength = 6 mA  Functions: o SPI_MISO (default) o Pad disabled  o Input / Output
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 169 of 175  LISA-U1 series LISA-U2 series  No Name Description Name Description Remarks for Migration 58 SPI_SRDY SPI Slave Ready Output SPI_SRDY / GPIO13 SPI Slave Ready Output / GPIO LISA-U1 series:  SPI_SRDY, 1.8V typ o Output driver strength = 4 mA LISA-U2 series:  SPI_SRDY and configurable GPIO, 1.8V typ. o Output driver strength = 6 mA  Functions: o SPI_SRDY (default) o Pad disabled o Input / Output o Module Status Indication 59 SPI_MRDY SPI Master Ready Input SPI_MRDY / GPIO14 SPI Master Ready Input / GPIO LISA-U1 series:  SPI_MRDY, 1.8V typ o Internal active pull-down = 55 µA LISA-U2 series:  SPI_MRDY and configurable GPIO, 1.8V typ. o Internal active pull-down = 200 µA o Output driver strength = 6 mA  Functions: o SPI_MRDY (default) o Pad disabled o Input / Output o Module Operating Mode Indication 60 GND Ground GND Ground  61…63 VCC Module supply input VCC Module supply input VCC operating voltage difference:  LISA-U1 series: o VCC normal range = 3.4 V min / 4.2 V max o VCC extended range = 3.1 V min / 4.2 V max  LISA-U2 series: o VCC normal range = 3.3 V min / 4.4 V max o VCC extended range = 3.1 V min / 4.5 V max 64…67 GND Ground GND Ground  68 ANT RF antenna ANT RF input/output for main Tx/Rx antenna 3G band support difference:  LISA-U100, LISA-U120, LISA-U260: o Band II (1900), Band V (850)  LISA-U110, LISA-U130, LISA-U270: o Band I (2100), Band VIII (900)  LISA-U200-00S: o Band I (2100), Band II (1900),  Band V (850), Band VI (800)   All LISA-U2 series except LISA-U200-00S: o Band I (2100), Band II (1900), Band IV (1700), Band V (850), Band VI (800), Band VIII (900) 69…73 GND Ground GND Ground  74 RSVD RESERVED pin RSVD All except LISA-U230: RESERVED pin LISA-U1 series and all LISA-U2 series except LISA-U230:  RESERVED pin o Leave unconnected    ANT_DIV LISA-U230: RF input for  Rx diversity antenna LISA-U230:  RF antenna input for Rx diversity o 50 Ω nominal impedance 75 GND Ground GND Ground  76 GND Ground GND Ground  Table 61: Pinout comparison LISA-U1 series vs. LISA-U2 series
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 170 of 175 A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series Additional signals keep-out area must be implemented on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer, as described in Figure 79 and Figure 80.  33.2 mm11.85 mm22.4 mm5.3 mm 5.25 mm1.4 mm1.0 mmPIN 1LISA-U1 bottom side (through module view)Exposed GND on LISA-U1 module bottom layerSignals keep-out area on application board Figure 79: Signals keep-out area on the top layer of the application board, below LISA-U1 series modules 33.2 mm5.25 mm22.4 mm5.3 mm 5.25 mm5.3 mm1.3 mm1.4 mm1.0 mmPIN 1LISA-U2 bottom side (through module view)Exposed GND on LISA-U2 module bottom layerSignals keep-out areas on application board Figure 80: Signals keep-out areas on the top layer of the application board, below LISA-U2 series modules
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 171 of 175 B Glossary  ADC Analog to Digital Converter AP Application Processor AT AT Command Interpreter Software Subsystem, or attention CBCH Cell Broadcast Channel CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC Direct Current  DCD Data Carrier Detect DCE Data Communication Equipment DCS Digital Cellular System DDC Display Data Channel DSP Digital Signal Processing DSR Data Set Ready DTE Data Terminal Equipment DTM Dual Transfer Mode DTR Data Terminal Ready  EBU External Bus Interface Unit EDGE Enhanced Data rates for GSM Evolution E-GPRS Enhanced GPRS FDD Frequency Division Duplex FEM Front End Module FOAT Firmware Over AT commands FTP File Transfer Protocol FTPS FTP Secure GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication HF Hands-free HSDPA High Speed Downlink Packet Access HTTP HyperText Transfer Protocol  HTTPS Hypertext Transfer Protocol over Secure Socket Layer HW Hardware I/Q In phase and Quadrature I2C Inter-Integrated Circuit I2S Inter IC Sound IP Internet Protocol
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Appendix      Page 172 of 175 IPC Inter Processor Communication LNA Low Noise Amplifier MCS Modulation Coding Scheme  NOM Network Operating Mode PA Power Amplifier PBCCH Packet Broadcast Control Channel  PCM Pulse Code Modulation PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit RF Radio Frequency RI Ring Indicator RTC Real Time Clock RTS Request To Send RXD RX Data SAW Surface Acoustic Wave SIM Subscriber Identification Module SMS Short Message Service SMTP Simple Mail Transfer Protocol SPI Serial Peripheral Interface SRAM Static RAM TCP Transmission Control Protocol TDMA Time Division Multiple Access  TXD TX Data UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UMTS Universal Mobile Telecommunications System USB Universal Serial Bus UTRA UMTS Terrestrial Radio Access  VC-TCXO Voltage Controlled - Temperature Compensated Crystal Oscillator WCDMA Wideband CODE Division Multiple Access
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Related documents      Page 173 of 175 Related documents [1] u-blox LISA-U2 series Data Sheet, Docu No UBX-13001734 [2] u-blox AT Commands Manual, Docu No UBX-13002752 [3] ITU-T Recommendation V.24, 02-2000. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE).  http://www.itu.int/rec/T-REC-V.24-200002-I/en [4] 3GPP TS 27.007 - AT command set for User Equipment (UE) (Release 1999) [5] 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) (Release 1999) [6] 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999) [7] Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/  [8] I2C-Bus specification and user manual - Rev. 5 - 9 October 2012 - NXP Semiconductors, http://www.nxp.com/documents/user_manual/UM10204.pdf [9] 3GPP TS 51.010-2 - Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS)  [10] 3GPP TS 34.121-2 - Technical Specification Group Radio Access Network; User Equipment (UE) conformance specification; Radio transmission and reception (FDD); Part 2: Implementation Conformance Statement (ICS) [11] CENELEC EN 61000-4-2 (2001): "Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test". [12] ETSI EN 301 489-1 V1.8.1: “Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements” [13] ETSI EN 301 489-7 V1.3.1: “Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)“ [14] ETSI EN 301 489-24 V1.4.1: "Electromagnetic compatibility and Radio spectrum Matters (ERM); Electro-Magnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment" [15] u-blox Multiplexer Implementation Application Note, Docu No UBX-13001887 [16] u-blox GNSS Implementation Application Note, Docu No UBX-13001849 [17] u-blox Firmware Update Application Note, Docu No UBX-13001845 [18] u-blox SPI Interface Application Note, Docu No UBX-13001919  [19] 3GPP TS 23.060 - Technical Specification Group Services and System Aspects; General Packet Radio Service (GPRS); Service description [20] u-blox End user test Application Note, Docu No WLS-CS-12002 [21] u-blox Package Information Guide, Docu No GPS-X-11004 [22] SIM Access Profile Interoperability Specification, Revision V11r00, http://www.bluetooth.org [23] u-blox LISA-U1 / LISA-U2 Audio Application Note, Docu No UBX-13001835 [24] 3GPP TS 26.267 V10.0.0 – eCall Data Transfer; In-band modem solution; General description (Rel. 10) [25] BS EN 16062:2011 – Intelligent transport systems – eSafety – eCall high level application requirements [26] ETSI TS 122 101 V8.7.0 – Service aspects; Service principles (3GPP TS 22.101 v.8.7.0 Rel. 8) [27] 3GPP TS 44.031 Location Services (LCS); Mobile Station (MS) - Serving Mobile Location Centre (SMLC) Radio Resource LCS Protocol (RRLP) [28] 3GPP TS 25.331 Radio Resource Control (RRC); Protocol specification [29] u-blox LISA-U1 series Data Sheet, Docu No UBX-13002048  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com).
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Revision history      Page 174 of 175 Revision history Revision Date Name Status / Comments - 21-Oct-2010 sses Initial Release 1 11-Jan-2011 sses Thickness information added. GPIO description improved 2 26-Apr-2011 lpah Update to Advance Information status 3 07-Jul-2011 lpah Update to Preliminary status A 26-Oct-2011 sses Changed status to Objective Specification  Initial  release  for  LISA-U series:  From LISA-U1x0-00S system  integration  manual,  added  the description and the integration of LISA-U1x0-01S, LISA-U200-00S, LISA-U2x0-01S Added  notes  regarding  VCC  normal  and  extended  operating  ranges.  Added  RTC  value reliability  as  function  of  V_BCKP  voltage  value.  Added  recommendation  regarding  any external signal connected to the UART interface, SPI/IPC interface, I2S  interfaces and GPIOs when the module is in power-down mode, when the external reset is forced low and during the  module  power-on  sequence:  must  be  tri-stated  to  avoid  latch-up  of  circuits  and  let  a proper boot of the module. A1 22-Nov-2011 sses Update to Advance Information status Updated module behavior during power-off sequence. Added LISA-U200-00S ESD application circuit for antenna port. Added application circuit for the module status indication function. A2 02-Feb-2012 sses Update to Preliminary status Updated Federal Communications Commission notice. Updated  LISA-U2  features in module power off and GPIO sections A3 25-May-2012 gcom Updated values for antenna gain A4 20-Jun-2012 sses Update to Advance Information status Updated PWR_ON behavior. Updated UART and power saving behavior. Added 3V / 1.8V SPI application circuit.  Updated  GPS  RTC sharing  application  circuit.  Added  remote  SIM access profile description A5 24-Aug-2012 sses Update to Preliminary status Updated Federal  Communications  Commission  notice. Updated  recommended  VCC  bypass capacitors. Added LISA-U110-60S and LISA-U130-60S  A6 04-Oct-2012 lpah / sses Update to Advance Information status Added LISA-U260 and LISA-U270 A7 26-Nov-2012 lpah / sses Update to Preliminary status Removed document applicability to LISA-U1x0-00S versions Added document applicability to LISA-U110-50S versions A8 29-Mar-2013 sses Updated additional recommendations for VCC application circuits (Last revision with old doc number, 3G.G2-HW-10002) B 15-Jul-2013 sses Update status to Advance Information  First release for LISA-U200-02S, LISA-U200-61S, LISA-U200-62S, LISA-U260-02S, LISA-U270-02S, LISA-U270-62S B1 21-Aug-2013 lpah Update status to Preliminary R16 20-Mar-2014 lpah / sses Extended document applicability to LISA-U200-52S and LISA-U200-82S (LISA-U200 FOTA) Updated recommended I2C voltage translator and clarified I2C application circuits remarks Clarified and improved power-on, power-off and reset timings and procedures descriptions R17 26-Jun-2015 sfal Extended document applicability to LISA-U200-03S and LISA-U201-03S R18 10-Aug-2015 sfal Early Production Information status Removed LISA-U1 series modules and LISA-U200-00S Extended applicability to LISA-U200-83S and LISA-U270-68S Comment [smos1]: I would remove this to make space on the page for further revision history. This is old and very detailed, so unnecessary.
LISA-U2 series - System Integration Manual UBX-13001118 - R19  Early Production Information  Contact      Page 175 of 175 Contact For complete contact information visit us at www.u-blox.com  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 703 483 3180 E-mail:  info_us@u-blox.com Regional Office West Coast: Phone:  +1 408 573 3640 E-mail:  info_us@u-blox.com Technical Support: Phone:  +1 703 483 3185 E-mail:  support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com Support:   support@u-blox.com  Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com Regional Office Australia: Phone:  +61 2 8448 2016 E-mail:  info_anz@u-blox.com Support:  support_ap@u-blox.com Regional Office China (Beijing): Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office China (Chongqing): Phone:  +86 23 6815 1588 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office China (Shanghai): Phone:  +86 21 6090 4832 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office China (Shenzhen): Phone:  +86 755 8627 1083 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office India: Phone:  +91 959 1302 450 E-mail:  info_in@u-blox.com  Support:  support_in@u-blox.com  Regional Office Japan (Osaka): Phone:  +81 6 6941 3660 E-mail:  info_jp@u-blox.com  Support:  support_jp@u-blox.com  Regional Office Japan (Tokyo): Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com  Support:  support_jp@u-blox.com  Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com

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