u blox TOBYL280 GSM/UMTS/LTE Data Module User Manual TOBY L2 series

u-blox AG GSM/UMTS/LTE Data Module TOBY L2 series

System Integrators Manual

    TOBY-L2 and MPCI-L2 series LTE/DC-HSPA+/EGPRS modules System Integration Manual               Abstract This  document  describes  the  features  and  the  system  integration  of TOBY-L2 and MPCI-L2 series multi-mode cellular modules. These modules are a complete and cost  efficient  LTE/3G/2G  solution offering  up  to  150  Mb/s  download  and  50  Mb/s  upload  data  rates, covering  up  to  six  LTE  bands,  up  to  five  WCDMA/DC-HSPA+  bands and four GSM/EGPRS bands in the compact TOBY LGA form factor of TOBY-L2  modules  or  in  the  industry standard  PCI  Express Mini  Card form factor of MPCI-L2 modules. TOBY-L2 series  www.u-blox.com UBX-13004618 - R08 MPCI-L2 series
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08         Page 2 of 158  Document Information Title TOBY-L2 and MPCI-L2 series Subtitle LTE/DC-HSPA+/EGPRS modules  Document type System Integration Manual  Document number UBX-13004618 Revision and date R08 29-Jun-2015 Document status Early Production Information  Document status explanation Objective Specification Document contains target values. Revised and supplementary data will be published later. Advance Information Document contains data based on early testing. Revised and supplementary data will be published later. Early Production Information Document contains data from product verification. Revised and supplementary data may be published later. Production Information Document contains the final product specification.  This document applies to the following products: Name Type number Modem version Application version PCN / IN TOBY-L200 TOBY-L200-00S-00 09.71 A01.15 UBX-14044437  TOBY-L200-50S-00 09.71 A01.57 UBX-15004131 TOBY-L201 TOBY-L201-01S-00 09.87 A01.01 UBX-15016217 TOBY-L210 TOBY-L210-00S-00 09.71 A01.15 UBX-14044437  TOBY-L210-50S-00 09.71 A01.57 UBX-15004131 TOBY-L280 TOBY-L280-00S-00 09.90 A01.02 UBX-15016802 MPCI-L200 MPCI-L200-00S-00 09.71 A01.15 UBX-14044437 MPCI-L210 MPCI-L210-00S-00 09.71 A01.15 UBX-14044437           u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited. The  information contained  herein  is  provided “as is”  and  u-blox assumes no  liability  for  the  use  of  the  information. No  warranty,  either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com. Copyright © 2015, u-blox AG u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.  ARM®  is a  registered trademark of ARM  Limited in the EU and other countries.  All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Preface     Page 3 of 158 Preface u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development.  AT  Commands  Manual:  This  document  provides  the  description of the  AT  commands supported  by  the  u-blox cellular modules.  System  Integration  Manual:  This  document  provides  the  description  of  u-blox  cellular  modules’  system from the hardware and the software point of view, it provides hardware design guidelines for the optimal integration of the cellular modules in the application device and it provides information on how to set up production and final product tests on application devices integrating the cellular modules.  Application  Note:  These  documents  provide  guidelines  and  information  on  specific  hardware  and/or software topics on u-blox cellular modules. See Related documents for a list of Application Notes related to your Cellular Module.  How to use this Manual The TOBY-L2 and MPCI-L2 series System Integration Manual provides the necessary information to successfully design and configure the u-blox cellular modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  Questions If you have any questions about u-blox Cellular Integration:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com/  Technical Support Worldwide Web Our website (http://www.u-blox.com/)  is a rich pool of  information. Product  information,  technical documents can be accessed 24h a day. By E-mail Contact  the  closest  Technical  Support  office  by  email.  Use  our  service  pool  email  addresses  rather  than  any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support, have the following information ready:  Module type (TOBY-L200) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Contents     Page 4 of 158 Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1 System description ....................................................................................................... 8 1.1 Overview .............................................................................................................................................. 8 1.2 Architecture ........................................................................................................................................ 10 1.2.1 Internal blocks ............................................................................................................................. 11 1.3 Pin-out ............................................................................................................................................... 12 1.3.1 TOBY-L2 series pin assignment .................................................................................................... 12 1.3.2 MPCI-L2 series pin assignment .................................................................................................... 17 1.4 Operating modes ................................................................................................................................ 19 1.5 Supply interfaces ................................................................................................................................ 21 1.5.1 Module supply input (VCC or 3.3Vaux) ....................................................................................... 21 1.5.2 RTC supply input/output (V_BCKP) .............................................................................................. 28 1.5.3 Generic digital interfaces supply output (V_INT) ........................................................................... 29 1.6 System function interfaces .................................................................................................................. 30 1.6.1 Module power-on ....................................................................................................................... 30 1.6.2 Module power-off ....................................................................................................................... 32 1.6.3 Module reset ............................................................................................................................... 34 1.6.4 Module configuration selection by host processor ....................................................................... 34 1.7 Antenna interface ............................................................................................................................... 35 1.7.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 35 1.7.2 Antenna detection interface (ANT_DET) ...................................................................................... 38 1.8 SIM interface ...................................................................................................................................... 38 1.8.1 SIM interface ............................................................................................................................... 38 1.8.2 SIM detection interface ............................................................................................................... 38 1.9 Data communication interfaces .......................................................................................................... 39 1.9.1 Universal Serial Bus (USB) ............................................................................................................ 39 1.9.2 Asynchronous serial interface (UART)........................................................................................... 43 1.9.3 DDC (I2C) interface ...................................................................................................................... 54 1.9.4 Secure Digital Input Output interface (SDIO) ................................................................................ 55 1.10 Audio .............................................................................................................................................. 55 1.10.1 Digital audio over I2S interface ..................................................................................................... 55 1.11 General Purpose Input/Output ........................................................................................................ 56 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................. 57 1.13 Reserved pins (RSVD) ...................................................................................................................... 57 1.14 Not connected pins (NC) ................................................................................................................. 57 1.15 System features............................................................................................................................... 58 1.15.1 Network indication ...................................................................................................................... 58 1.15.2 Antenna supervisor ..................................................................................................................... 58
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Contents     Page 5 of 158 1.15.3 Jamming detection ...................................................................................................................... 58 1.15.4 IP modes of operation ................................................................................................................. 59 1.15.5 Dual stack IPv4/IPv6 ..................................................................................................................... 59 1.15.6 TCP/IP and UDP/IP ....................................................................................................................... 59 1.15.7 FTP .............................................................................................................................................. 59 1.15.8 HTTP ........................................................................................................................................... 60 1.15.9 SSL .............................................................................................................................................. 60 1.15.10 AssistNow clients and GNSS integration ................................................................................... 60 1.15.11 Hybrid positioning and CellLocate® .......................................................................................... 60 1.15.12 Wi-Fi integration ...................................................................................................................... 63 1.15.13 Firmware update Over AT (FOAT)............................................................................................. 63 1.15.14 Firmware update Over The Air (FOTA) ...................................................................................... 63 1.15.15 In-band Modem (eCall / ERA-GLONASS) .................................................................................. 64 1.15.16 SIM Access Profile (SAP) ........................................................................................................... 64 1.15.17 Smart temperature management ............................................................................................. 66 1.15.18 Power saving ........................................................................................................................... 68 2 Design-in ..................................................................................................................... 69 2.1 Overview ............................................................................................................................................ 69 2.2 Supply interfaces ................................................................................................................................ 70 2.2.1 Module supply (VCC or 3.3Vaux)................................................................................................. 70 2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 82 2.2.3 Generic digital interfaces supply output (V_INT) ........................................................................... 84 2.3 System functions interfaces ................................................................................................................ 85 2.3.1 Module power-on (PWR_ON) ...................................................................................................... 85 2.3.2 Module reset (RESET_N or PERST#) .............................................................................................. 86 2.3.3 Module configuration selection by host processor ....................................................................... 87 2.4 Antenna interface ............................................................................................................................... 88 2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 88 2.4.2 Antenna detection interface (ANT_DET) ...................................................................................... 96 2.5 SIM interface ...................................................................................................................................... 98 2.5.1 Guidelines for SIM circuit design.................................................................................................. 98 2.5.2 Guidelines for SIM layout design ............................................................................................... 104 2.6 Data communication interfaces ........................................................................................................ 105 2.6.1 Universal Serial Bus (USB) .......................................................................................................... 105 2.6.2 Asynchronous serial interface (UART)......................................................................................... 107 2.6.3 DDC (I2C) interface .................................................................................................................... 111 2.6.4 Secure Digital Input Output interface (SDIO) .............................................................................. 115 2.7 Audio interface ................................................................................................................................. 117 2.7.1 Digital audio interface ............................................................................................................... 117 2.8 General Purpose Input/Output .......................................................................................................... 119 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................... 120 2.10 Reserved pins (RSVD) .................................................................................................................... 121 2.11 Module placement ........................................................................................................................ 122
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Contents     Page 6 of 158 2.12 TOBY-L2 series module footprint and paste mask ......................................................................... 123 2.13 MPCI-L2 series module installation ................................................................................................ 124 2.14 Thermal guidelines ........................................................................................................................ 126 2.15 ESD guidelines .............................................................................................................................. 127 2.15.1 ESD immunity test overview ...................................................................................................... 127 2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 128 2.15.3 ESD application circuits .............................................................................................................. 128 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 130 2.16.1 Schematic for TOBY-L200-00S / TOBY-L210-00S ....................................................................... 130 2.16.2 Schematic for TOBY-L201-01S / TOBY-L280-00S ....................................................................... 131 2.16.3 Schematic for TOBY-L200-50S / TOBY-L210-50S ....................................................................... 132 2.16.4 Schematic for MPCI-L2 series ..................................................................................................... 133 2.17 Design-in checklist ........................................................................................................................ 134 2.17.1 Schematic checklist ................................................................................................................... 134 2.17.2 Layout checklist ......................................................................................................................... 135 2.17.3 Antenna checklist ...................................................................................................................... 135 3 Handling and soldering ........................................................................................... 136 3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 136 3.2 Handling ........................................................................................................................................... 136 3.3 Soldering .......................................................................................................................................... 137 3.3.1 Soldering paste.......................................................................................................................... 137 3.3.2 Reflow soldering ....................................................................................................................... 137 3.3.3 Optical inspection ...................................................................................................................... 138 3.3.4 Cleaning .................................................................................................................................... 138 3.3.5 Repeated reflow soldering ......................................................................................................... 139 3.3.6 Wave soldering.......................................................................................................................... 139 3.3.7 Hand soldering .......................................................................................................................... 139 3.3.8 Rework ...................................................................................................................................... 139 3.3.9 Conformal coating .................................................................................................................... 139 3.3.10 Casting ...................................................................................................................................... 139 3.3.11 Grounding metal covers ............................................................................................................ 139 3.3.12 Use of ultrasonic processes ........................................................................................................ 139 4 Approvals .................................................................................................................. 140 4.1 Product certification approval overview ............................................................................................. 140 4.2 Federal Communications Commission notice .................................................................................... 141 4.2.1 Safety warnings review the structure ......................................................................................... 141 4.2.2 Declaration of Conformity ......................................................................................................... 141 4.2.3 Modifications ............................................................................................................................ 142 4.3 Industry Canada notice ..................................................................................................................... 142 4.3.1 Declaration of Conformity ......................................................................................................... 143 4.3.2 Modifications ............................................................................................................................ 143 4.4 Anatel certification ........................................................................................................................... 144 4.5 R&TTED and European Conformance CE mark ................................................................................. 145
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Contents     Page 7 of 158 5 Product testing ......................................................................................................... 146 5.1 u-blox in-series production test ......................................................................................................... 146 5.2 Test parameters for OEM manufacturer ............................................................................................ 147 5.2.1 “Go/No go” tests for integrated devices .................................................................................... 147 5.2.2 RF functional tests ..................................................................................................................... 147 Appendix ........................................................................................................................ 149 A Glossary .................................................................................................................... 149 B Migration between TOBY-L1 and TOBY-L2 ............................................................ 151 B.1 Overview .......................................................................................................................................... 151 B.2 Pin-out comparison between TOBY-L1 and TOBY-L2 ........................................................................ 153 B.3 Schematic for TOBY-L1 and TOBY-L2 integration .............................................................................. 155 Related documents......................................................................................................... 156 Revision history .............................................................................................................. 157 Contact ............................................................................................................................ 158
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 8 of 158 1 System description 1.1 Overview TOBY-L2 and MPCI-L2  series comprises LTE/3G/2G multi-mode  modules supporting up to six LTE bands, up to five UMTS/DC-HSPA+ bands and up to four GSM/(E)GPRS bands for voice and/or data transmission as following:  TOBY-L200, TOBY-L201 and MPCI-L200 are designed primarily for operation in America  TOBY-L210 and MPCI-L210 are designed primarily for operation in Europe, Asia and other countries  TOBY-L280 is mainly designed for operation in Asia and Oceania TOBY-L2 and MPCI-L2 series are designed in two different form-factors suitable for applications as following:  TOBY-L2 modules are designed in the small TOBY  152-pin Land Grid Array form-factor (35.6 x 24.8  mm), easy to integrate in compact  designs and  form-factor compatible with the  u-blox cellular  module  families: this  allows  customers  to  take  the  maximum  advantage  of  their  hardware  and  software  investments,  and provides very short time-to-market.  MPCI-L2 modules are designed in the industry standard PCI Express Full-Mini Card form-factor (51 x 30 mm) easy to integrate into industrial and consumer applications and also ideal for manufacturing of small series. With LTE Category 4 data rates at up to 150 Mb/s (down-link) and 50 Mb/s (up-link), the TOBY-L2 and MPCI-L2 series modules are ideal for applications requiring the highest data-rates and high-speed internet access.   Table 1 summarizes the TOBY-L2 and MPCI-L2 series main features and interfaces.  Module LTE UMTS GSM Positioning Interfaces Audio Features Grade  LTE FDD category Bands HSDPA category HSUPA category Bands GPRS/EDGE multi-slot class Bands GNSS receiver GNSS via modem Assist Now Software CellLocate® UART USB 2.0 SDIO (Master) DCC (I2C) GPIOs Analog audio Digital audio  Network indication Antenna supervisor MIMO 2x2 / Rx Diversity Jamming detection Embedded TCP/UDP stack Embedded HTTP,FTP FOTA eCall / ERA GLONASS Dual stack IPv4/IPv6 Standard Professional Automotive TOBY-L200 4 2,4,5 7,17 24 6 850/900 AWS 1900/2100 12 Quad  F F F ○ ● ○ F F  F □ F ● F F F F F ●    TOBY-L201 4 2,4,5 13,17  24 6 850/1900    F F F ● ● F F F  F ● F ● F ● ● ● F ●    TOBY-L210 4 1,3,5 7,8,20 24 6 850/900 1900/2100 12 Quad  F F F ○ ● ○ F F  F □ F ● F F F F F ●    TOBY-L280 4 1,3,5, 7,8,28 24 6 850/900 1900/2100 12 Quad  F F F ● ● F F F  F ● F ● F F F F F ●    MPCI-L200 4 2,4,5 7,17 24 6 850/900 AWS 1900/2100 12 Quad      ●      ●  ● F F F F  ●    MPCI-L210 4 1,3,5 7,8,20 24 6 850/900 1900/2100 12 Quad      ●      ●  ● F F F F  ●    ●  = supported by all product versions  ○  = supported by product version “50” and future product versions □  = supported by all product versions except product version “50”  F  =  supported by future product versions Table 1: TOBY-L2 and MPCI-L2 series main features summary
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 9 of 158 Table 2 reports a summary of cellular radio access technologies characteristics and features of the modules.  4G LTE 3G UMTS/HSDPA/HSUPA 2G GSM/GPRS/EDGE 3GPP Release 9 Long Term Evolution (LTE) Evolved Uni.Terrestrial Radio Access (E-UTRA) Frequency Division Duplex (FDD) DL Multi-Input Multi-Output (MIMO) 2 x 2  3GPP Release 8 Dual-Cell HS Packet Access (DC-HSPA+) UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD) DL Rx diversity  3GPP Release 8 Enhanced Data rate GSM Evolution (EDGE) GSM EGPRS Radio Access (GERA) Time Division Multiple Access (TDMA) DL Advanced Rx Performance (DARP) Phase 1 Band support:  TOBY-L200:  Band 17 (700 MHz)  Band 5 (850 MHz)  Band 4 (AWS, i.e. 1700 MHz)  Band 2 (1900 MHz)  Band 7 (2600 MHz)  TOBY-L201:  Band 17 (700 MHz)  Band 13 (750 MHz)  Band 5 (850 MHz)  Band 4 (AWS, i.e. 1700 MHz)  Band 2 (1900 MHz)  TOBY-L210:  Band 20 (800 MHz)  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 3 (1800 MHz)  Band 1 (2100 MHz)  Band 7 (2600 MHz)  TOBY-L280:  Band 28 (750 MHz)  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 3 (1800 MHz)  Band 1 (2100 MHz)  Band 7 (2600 MHz) Band support:  TOBY-L200:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 4 (AWS, i.e. 1700 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz)  TOBY-L201:  Band 5 (850 MHz)  Band 2 (1900 MHz)     TOBY-L210:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz)    TOBY-L280:  Band 5 (850 MHz)  Band 8 (900 MHz)  Band 2 (1900 MHz)  Band 1 (2100 MHz) Band support  TOBY-L200:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz          TOBY-L210:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz     TOBY-L280:  GSM 850 MHz  E-GSM 900 MHz  DCS 1800 MHz  PCS 1900 MHz   LTE Power Class  Power Class 3 (23 dBm)  for LTE mode WCDMA/HSDPA/HSUPA Power Class  Power Class 3 (24 dBm)  for UMTS/HSDPA/HSUPA mode GSM/GPRS (GMSK) Power Class  Power Class 4 (33 dBm)  for GSM/E-GSM bands  Power Class 1 (30 dBm)  for DCS/PCS bands EDGE (8-PSK) Power Class  Power Class E2 (27 dBm)  for GSM/E-GSM bands  Power Class E2 (26 dBm)  for DCS/PCS bands Data rate  LTE category 4:  up to 150 Mb/s DL, 50 Mb/s UL  Data rate  TOBY-L200 / MPCI-L200:  HSDPA cat.14, up to 21 Mb/s DL1  HSUPA cat.6, up to 5.6 Mb/s UL  TOBY-L210 / MPCI-L210:  HSDPA cat.24, up to 42 Mb/s DL  HSUPA cat.6, up to 5.6 Mb/s UL Data rate2  GPRS multi-slot class 123, CS1-CS4,  up to 85.6 kb/s DL/UL   EDGE multi-slot class 123, MCS1-MCS9  up to 236.8 kb/s DL/UL  Table 2: TOBY-L2 and MPCI-L2 series LTE, 3G and 2G characteristics summary                                                        1 HSDPA category 24 capable 2 GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can be transmitted and received, with higher classes typically allowing faster data transfer rates. 3 GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 10 of 158 1.2 Architecture Figure 1 summarizes the internal architecture of TOBY-L2 series modules. CellularBase-bandProcessorMemoryPower Management Unit26 MHz32.768 kHzANT1RF TransceiverANT2V_INT (I/O)V_BCKP (RTC)VCC (Supply)SIMUSBGPIOPower OnExternal ResetPAsLNAs FiltersFiltersDuplexerFiltersPAsLNAs FiltersFiltersDuplexerFiltersLNAs FiltersFiltersLNAs FiltersFiltersSwitchSwitchDDC(I2C)SDIOUARTDigital audio (I2S)ANT_DETHost Select Figure 1: TOBY-L2 series block diagram As described in the Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module:  The MPCI-L200 integrates a TOBY-L200 module  The MPCI-L210 integrates a TOBY-L210 module The TOBY-L2 module represents the core of the device, providing the related LTE/3G/2G modem and processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and two UF.L connectors are available for easy antenna integration.  ANT1SIMUSBW_DISABLE#TOBY-L2seriesSignal ConditioningANT2PERST#LED_WWAN#U.FLU.FL3.3Vaux (Supply)Boost ConverterVCC Figure 2: MPCI-L2 series block diagram
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 11 of 158 1.2.1 Internal blocks As described in Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module, which consists of the following internal sections: RF, baseband and power management. RF section The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches. Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch. Dual receiving paths are implemented according to LTE Down-Link MIMO 2 x 2 and 3G Receiver Diversity radio technologies supported by the modules as LTE category  4 and HSDPA category 24  User Equipments: incoming signals  are  received  through  the  primary  (ANT1)  and  the  secondary  (ANT2)  antenna  input  ports  which  are connected to the RF transceiver via specific antenna switch, diplexer, duplexer, LNA, SAW band pass filters.   RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and demodulation of the dual RF signals for Rx. The RF transceiver contains: Automatically gain controlled direct conversion Zero-IF receiver, Highly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM, 64-QAM, Fractional-N Sigma-Delta RF synthesizer, VCO.  Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver   RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path  Low Noise Amplifiers (LNA) enhance the received sensitivity  SAW duplexers separate the Tx and Rx signal paths and provide RF filtering  SAW band pass filters enhance the rejection of out-of-band signals  26 MHz crystal oscillator generates the clock reference in active-mode or connected-mode.  Baseband and power management section The Baseband and Power Management section is composed of the following main elements:  A mixed signal ASIC, which integrates Microprocessor for control functions DSP core for LTE/3G/2G Layer 1 and digital processing of Rx and Tx signal paths Memory interface controller Dedicated peripheral blocks for control of the USB, SIM and GPIO digital interfaces Analog front end interfaces to RF transceiver ASIC  Memory system, which includes NAND flash and LPDDR  Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC  Voltage sources for external use: V_BCKP and V_INT (not available on MPCI-L2 series modules)  Hardware power on   Hardware reset  Low power idle-mode support  32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by enable power saving configuration using the AT+UPSV command.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 12 of 158 1.3 Pin-out 1.3.1 TOBY-L2 series pin assignment Table 3 lists the pin-out of the TOBY-L2 series modules, with pins grouped by function.  Function Pin Name Pin No I/O Description Remarks Power VCC 70,71,72 I Module supply input VCC pins are internally connected each other. VCC supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description and requirements for the VCC module supply. See section 2.2.1 for external circuit design-in.  GND 2, 30, 32, 44, 46, 69, 73, 74, 76, 78, 79, 80, 82, 83, 85, 86, 88-90, 92-152 N/A Ground GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.2.1 for external circuit design-in.  V_BCKP 3 I/O RTC supply input/output V_BCKP = 3.0 V (typical) generated by internal regulator when valid VCC supply is present. See section 1.5.2 for functional description. See section 2.2.2 for external circuit design-in.  V_INT 5 O Generic digital interfaces supply output V_INT = 1.8 V (typical) generated by internal regulator when the module is switched on. See section 1.5.3 for functional description. See section 2.2.3 for external circuit design-in. System PWR_ON 20 I Power-on input Internal active pull-up to the VCC enabled. See section 1.6.1 for functional description. See section 2.3.1 for external circuit design-in.  RESET_N 23 I External reset input Internal active pull-up to the VCC enabled. See section 1.6.3 for functional description. See section 2.3.2 for external circuit design-in.  HOST_SELECT0 26 I Selection of module configuration by the host processor Note: Not supported by “00”, “01”, “50” product versions. See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in.  HOST_SELECT1 62 I Selection of module configuration by the host processor Note: Not supported by “00”, “01”, “50” product versions. See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in. Antennas ANT1  81 I/O Primary antenna Main Tx / Rx antenna interface. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements. See section 2.4 for external circuit design-in.  ANT2 87 I Secondary antenna Rx only for MIMO 2x2 and Rx diversity. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements  See section 2.4 for external circuit design-in.  ANT_DET 75 I Antenna detection Note: not supported by “00”, “01”, “50” product versions. See section 1.7.2 for functional description. See section 2.4.2 for external circuit design-in.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 13 of 158 Function Pin Name Pin No I/O Description Remarks SIM VSIM 59 O SIM supply output VSIM = 1.8 V / 3 V output as per the connected SIM type. See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_IO 57 I/O SIM data Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to VSIM. See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_CLK 56 O SIM clock 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description.  See section 2.5 for external circuit design-in.  SIM_RST 58 O SIM reset Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description.  See section 2.5 for external circuit design-in. USB VUSB_DET 4 I USB detect input  Note: leave unconnected, as VBUS detect is not supported. Input for VBUS (5 V typical) USB supply sense. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  USB_D- 27 I/O USB Data Line D- USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.  USB_D+ 28 I/O USB Data Line D+ USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description.  See section 2.6.1 for external circuit design-in.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 14 of 158 Function Pin Name Pin No I/O Description Remarks UART RXD 17 O UART data output Note: not supported by TOBY-L200-00S, TOBY-L210-00S. 1.8 V output, Circuit 104 (RXD) in ITU-T V.24,  for AT command, data communication, FOAT. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  TXD 16 I UART data input Note: not supported by TOBY-L200-00S, TOBY-L210-00S. 1.8 V input, Circuit 103 (TXD) in ITU-T V.24,  for AT command, data communication, FOAT. Internal active pull-up to V_INT. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  CTS 15 O UART clear to send output Note: not supported by TOBY-L200-00S, TOBY-L210-00S. 1.8 V output, Circuit 106 (CTS) in ITU-T V.24. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  RTS 14 I UART ready to send input Note: not supported by TOBY-L200-00S, TOBY-L210-00S. 1.8 V input, Circuit 105 (RTS) in ITU-T V.24. Internal active pull-up to V_INT. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 for functional description.  See section 2.6.2 for external circuit design-in.  DSR 10 O / I/O UART data set ready output / GPIO Note: UART DSR not supported by TOBY-L200-00S, TOBY-L210-00S, TOBY-L200-50S, TOBY-L210-50S;  GPIO not supported by “00”, “01”, “50” product versions. 1.8 V, Circuit 107 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 and 1.11 for functional description.  See section 2.6.2 and 2.8 for external circuit design-in.  RI 11 O / I/O UART ring indicator output / GPIO Note: RI not supported by TOBY-L200-00S, TOBY-L210-00S;  GPIO not supported by “00”, “01”, “50” product versions. 1.8 V, Circuit 125 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 and 1.11 for functional description.  See section 2.6.2 and 2.8 for external circuit design-in.  DTR 13 I / I/O UART data terminal ready input / GPIO Note: UART DTR not supported by TOBY-L200-00S, TOBY-L210-00S, TOBY-L200-50S, TOBY-L210-50S;  GPIO not supported by “00”, “01”, “50” product versions. 1.8 V, Circuit 108/2 in ITU-T V.24, configurable as GPIO. Internal active pull-up to V_INT when configured as DTR. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 and 1.11 for functional description.  See section 2.6.2 and 2.8 for external circuit design-in.  DCD 12 O / I/O UART data carrier detect output / GPIO Note: UART DCD not supported by TOBY-L200-00S, TOBY-L210-00S, TOBY-L200-50S, TOBY-L210-50S;  GPIO not supported by “00”, “01”, “50” product versions. 1.8 V, Circuit 109 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0  to access for diagnostic. See section 1.9.2 and 1.11 for functional description.  See section 2.6.2 and 2.8 for external circuit design-in.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 15 of 158 Function Pin Name Pin No I/O Description Remarks DDC SCL 54 O I2C bus clock line Note: not supported by “00”, “01”, “50” product versions. 1.8 V open drain, for communication with u-blox GNSS receivers and other I2C-slave devices as an audio codec. External pull-up required. See section 1.9.3 for functional description.  See section 2.6.3 for external circuit design-in.  SDA 55 I/O I2C bus data line Note: not supported by “00”, “01”, “50” product versions. 1.8 V open drain, for communication with u-blox GNSS receivers and other I2C-slave devices as an audio codec. External pull-up required. See section 1.9.3 for functional description.  See section 2.6.3 for external circuit design-in. SDIO SDIO_D0 66 I/O SDIO serial data [0] Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D1 68 I/O SDIO serial data [1] Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D2 63 I/O SDIO serial data [2] Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_D3 67 I/O SDIO serial data [3] Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_CLK 64 O SDIO serial clock Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in.  SDIO_CMD 65 I/O SDIO command Note: not supported by “00”, “01” product versions. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description.  See section 2.6.4 for external circuit design-in. Audio I2S_TXD 51 O / I/O I2S transmit data / GPIO Note: not supported by “00”, “01”, “50” product versions. I2S transmit data output, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_RXD 53 I / I/O I2S receive data / GPIO Note: not supported by “00”, “01”, “50” product versions. I2S receive data input, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_CLK 52 I/O / I/O I2S clock / GPIO Note: not supported by “00”, “01”, “50” product versions. I2S serial clock, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.  I2S_WA 50 I/O / I/O I2S word alignment / GPIO Note: not supported by “00”, “01”, “50” product versions. I2S word alignment, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 16 of 158 Function Pin Name Pin No I/O Description Remarks GPIO GPIO1 21 I/O GPIO Note: not supported by “00”, “01”, “50” product versions.  WWAN status indication set on “00”, “01” product versions.  Wi-Fi enable function set on “50” product version. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO2 22 I/O GPIO Note: not supported by “00”, “01”, “50” product versions. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO3 24 I/O GPIO Note: not supported by “00”, “01”, “50” product versions. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO4 25 I/O GPIO Note: not supported by “00”, “01”, “50” product versions. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO5 60 I/O GPIO Note: not supported by “00”, “01”, “50” product versions. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in.  GPIO6 61 I/O GPIO Note: not supported by “00”, “01”, “50” product versions. 1.8 V GPIO with alternatively configurable functions  See section 1.11 for functional description. See section 2.8 for external circuit design-in. Reserved RSVD 6 N/A Reserved pin This pin must be connected to ground. See section 2.10  RSVD 1, 7-9, 18, 19, 29, 31, 33-43, 45, 47-49, 77, 84, 91 N/A Reserved pin Leave unconnected. See section 2.10 Table 3: TOBY-L2 series module pin definition, grouped by function
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 17 of 158 1.3.2 MPCI-L2 series pin assignment Table 4 lists the pin-out of the MPCI-L2 series modules, with pins grouped by function.  Function Pin Name Pin No I/O Description Remarks Power 3.3Vaux 2, 24, 39,  41, 52 I Module supply input 3.3Vaux pins are internally connected each other. 3.3Vaux supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description and requirements for the 3.3Vaux module supply. See section 2.2.1 for external circuit design-in.  GND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 N/A Ground GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.2.1 for external circuit design-in. Auxiliary Signals PERST# 22 I External reset input Internal 45 k pull-up to 3.3 V supply. See section 1.6.3 for functional description. See section 2.3.2 for external circuit design-in. Antennas ANT1  U.FL I/O Primary antenna Main Tx / Rx antenna interface. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.7 for functional description / requirements. See section 2.4 for external circuit design-in.  ANT2 U.FL I Secondary antenna Rx only for MIMO 2x2 and Rx diversity. 50  nominal characteristic impedance. Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.7 for functional description / requirements  See section 2.4 for external circuit design-in. SIM UIM_PWR 8 O SIM supply output UIM_PWR = 1.8 V / 3 V automatically generated according to the connected SIM type. See section 1.8 for functional description. See section 2.5 for external circuit design-in.  UIM_DATA 10 I/O SIM data Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to UIM_PWR. See section 1.8 for functional description. See section 2.5 for external circuit design-in.  UIM_CLK 12 O SIM clock 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in.  UIM_RESET 14 O SIM reset Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 18 of 158 Function Pin Name Pin No I/O Description Remarks USB USB_D- 36 I/O USB Data Line D- USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in.  USB_D+ 38 I/O USB Data Line D+ USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90  nominal differential impedance (Z0) 30  nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. Specific Signals LED_WWAN# 42 O LED indicator output Open drain active low output. See section 1.12 for functional description. See section 2.9 for external circuit design-in.  W_DISABLE# 20 I Wireless radio disable input Internal 22 k pull-up to 3.3Vaux. See section 1.12 for functional description. See section 2.9 for external circuit design-in. Not Connected NC 1, 3, 5-7, 11, 13, 16, 17, 19, 23, 25, 28, 30-33, 44-46, 47-49, 51 N/A Not connected Internally not connected. See section 1.14 for the description. Table 4: MPCI-L2 series module pin definition, grouped by function
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 19 of 158 1.4 Operating modes TOBY-L2 and MPCI-L2 series modules have several operating modes. The operating modes are defined in Table 5 and described in detail in Table 6, providing general guidelines for operation.  General Status Operating Mode Definition Power-down Not-Powered Mode VCC or 3.3Vaux supply not present or below operating range: module is switched off.  Power-Off Mode VCC or 3.3Vaux supply within operating range and module is switched off. Normal Operation Idle-Mode  Module processor core runs with 32 kHz reference generated by the internal oscillator.  Active-Mode Module processor core runs with 26 MHz reference generated by the internal oscillator.  Connected-Mode RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference. Table 5: TOBY-L2 and MPCI-L2 series modules operating modes definition  Operating Mode Description Transition between operating modes Not-Powered Mode Module is switched off. Application interfaces are not accessible. When VCC or 3.3Vaux supply is removed, the modules enter not-powered mode. When in not-powered mode, TOBY-L2 modules cannot be switched on by PWR_ON, RESET_N or RTC alarm and enter active-mode after applying VCC supply (see 1.6.1). When in not-powered mode, MPCI-L2 modules cannot be switched on by RTC alarm and enter active-mode after applying 3.3Vaux supply (see 1.6.1). Power-Off Mode Module is switched off: normal shutdown by an appropriate power-off event (see 1.6.2). Application interfaces are not accessible. MPCI-L2 modules do not support Power-Off Mode but halt mode (see 1.6.2 and u-blox AT Commands Manual [3], AT+CFUN=127 command).  When the modules are switched off by an appropriate power-off event (see 1.6.2), the modules enter power-off mode from active-mode. When in power-off mode, TOBY-L2 modules can be switched on by PWR_ON, RESET_N or an RTC alarm. When in power-off mode, TOBY-L2 modules enter the not-powered mode after removing VCC supply. Idle-Mode Module is switched on with application interfaces disabled or suspended: the module is temporarily not ready to communicate with an external device by means of the application interfaces as configured to reduce the current consumption. The module enters the low power idle-mode whenever possible if power saving is enabled by AT+UPSV (see u-blox AT Commands Manual [3]) reducing current consumption (see 1.5.1.5). With HW flow control enabled and AT+UPSV=1 or AT+UPSV=3, the UART CTS line indicates when the UART is enabled (see 1.9.2.3, 1.9.2.4). With HW flow control disabled, the UART CTS line is fixed to ON state (see 1.9.2.3).  Power saving configuration is not enabled by default: it can be enabled by the AT+UPSV command (see the u-blox AT Commands Manual [3]). The modules automatically switch from active-mode to low power idle-mode whenever possible if power saving is enabled (see sections 1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3], AT+UPSV). The modules wake up from idle-mode to active-mode in the following events:  Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see 1.5.1.5)  The connected USB host forces a remote wakeup of the module as USB device (see 1.9.1.4)  Automatic periodic enable of the UART interface to receive / send data, with AT+UPSV=1 (see 1.9.2.4)   Data received on UART interface, with HW flow control disabled and AT+UPSV=1 (see 1.9.2.4)   RTS input set ON by the host DTE, with HW flow control disabled and AT+UPSV=2 (see 1.9.2.4)   DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.2.4)   The connected SDIO device forces a wakeup of the module as SDIO host (see 1.9.4)  A preset RTC alarm occurs (see u-blox AT Commands Manual [3], AT+CALA)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 20 of 158 Operating Mode Description Transition between operating modes Active-Mode Module is switched on with application interfaces enabled or not suspended: the module is ready to communicate with an external device by means of the application interfaces unless power saving configuration is enabled by AT+UPSV (see 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3]). When the modules are switched on by an appropriate power-on event (see 1.6.1), the module enter active-mode from power-off mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from active to idle-mode whenever possible and the module wakes up from idle to active-mode in the events listed above (see idle-mode to active-mode transition description above). When a RF Tx/Rx data connection is initiated or when RF Tx/Rx is required due to a connection previously initiated, the module switches from active to connected-mode. Connected-Mode RF Tx/Rx data connection is in progress. The module is prepared to accept data signals from an external device unless power saving configuration is enabled by AT+UPSV (see sections 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3]). When a data connection is initiated, the module enters connected-mode from idle-mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from connected to active and then idle-mode whenever possible and the module wakes up from idle to active and then connected mode if RF Transmission/Reception is necessary. When a data connection is terminated, the module returns to the active-mode. Table 6: TOBY-L2 and MPCI-L2 series modules operating modes description  Figure 3 describes the transition between the different operating modes.  TOBY-L2 Switch ON:•Apply VCCMPCI-L2 Switch ON:•Apply 3.3VauxIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationNo RF Tx/Rx in progress,       Call terminated, Communication droppedTOBY-L2 Switch ON:•PWR_ON•RESET_N•RTC alarmNot poweredPower offActiveConnected IdleTOBY-L2   Switch OFF:•AT+CPWROFF•RESET_NMPCI-L2:•AT+CFUN=127 and then remove 3.3VauxTOBY-L2:•Remove VCC Figure 3: TOBY-L2 and MPCI-L2 series modules operating modes transition
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 21 of 158 1.5 Supply interfaces 1.5.1 Module supply input (VCC or 3.3Vaux) TOBY-L2 modules are supplied via the three VCC pins, and MPCI-L2 modules are supplied via the five 3.3Vaux pins. All supply voltages used inside the modules are generated from the  VCC or the 3.3Vaux supply input by integrated voltage regulators, including the V_BCKP RTC supply, the V_INT generic digital interface supply, and the VSIM or UIM_PWR SIM interface supply. The current drawn by the TOBY-L2 and MPCI-L2 series modules through the VCC or 3.3Vaux pins can vary by several orders of magnitude depending on radio access  technology,  operation  mode and  state.  It is important that the supply source is able to support both the high peak of current consumption during 2G transmission at maximum RF power level (as described in the section 1.5.1.2) and the high average current consumption during 3G and LTE transmission at maximum RF power level (as described in the sections 1.5.1.3 and 1.5.1.4).  1.5.1.1 VCC or 3.3Vaux supply requirements Table 7 summarizes the requirements for the VCC or 3.3Vaux modules supply. See section 2.2.1 for suggestions to properly design a VCC or 3.3Vaux supply circuit compliant with the requirements listed in Table 7.   The  supply  circuit  affects  the  RF  compliance  of  the  device  integrating  TOBY-L2  and  MPCI-L2 series modules with applicable required certification schemes as well as antenna circuit design. Compliance is guaranteed if the requirements summarized in the Table 7 are fulfilled.  Item Requirement Remark VCC or 3.3Vaux nominal voltage Within VCC or 3.3Vaux normal operating range: See “Supply/Power pins” section in the TOBY-L2 Data Sheet [1] or in the MPCI-L2 Data Sheet [2]. The modules cannot be switched on if the supply voltage is below the normal operating range minimum limit. VCC or 3.3Vaux voltage during normal operation Within VCC or 3.3Vaux extended operating range: See “Supply/Power pins” section in the TOBY-L2 Data Sheet [1] or in the MPCI-L2 Data Sheet [2]. The modules may switch off if the supply voltage drops below the extended operating range minimum limit. VCC or 3.3Vaux average current Support with adequate margin the highest averaged current consumption value in connected-mode conditions specified for VCC in TOBY-L2 Data Sheet [1] or specified for 3.3Vaux in MPCI-L2 Data Sheet [2]. The maximum average current consumption can be greater than the specified value according to the actual antenna mismatching, temperature and supply voltage. Sections  1.5.1.2,  1.5.1.3  and  1.5.1.4  describe  current consumption profiles in 2G, 3G and LTE connected-mode. VCC or 3.3Vaux peak current Support with margin the highest peak current consumption value in 2G connected-mode conditions specified for VCC in TOBY-L2 Data Sheet [1] or specified for 3.3Vaux in MPCI-L2 Data Sheet [2]. The specified maximum peak of current consumption occurs during GSM single transmit slot in 850/900 MHz connected-mode, in case of mismatched antenna. Section 1.5.1.2 describes 2G Tx peak/pulse current. VCC or 3.3Vaux voltage drop during  2G Tx slots Lower than 400 mV Supply voltage drop values greater than recommended during 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage drop during 2G Tx slots. VCC or 3.3Vaux voltage ripple during  RF transmission Noise in the supply has to be minimized  High supply voltage ripple values during LTE/3G/2G RF transmissions in connected-mode directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage ripple during RF Tx. VCC or 3.3Vaux under/over-shoot at start/end of Tx slots Absent or at least minimized Supply  voltage  under-shoot  or  over-shoot  at  the  start  or the end of 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage under/over-shoot  Table 7: Summary of VCC or 3.3Vaux modules supply requirements
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 22 of 158 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode When a GSM call is established, the VCC or 3.3Vaux module current consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The peak of current consumption during a transmission slot is strictly dependent on the RF transmitted power, which is regulated by the network. The transmitted power in the transmit slot is also the more relevant factor for determining the average current consumption. If the module is transmitting in 2G single-slot mode in the 850 or 900 MHz bands, at the maximum RF power level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach an high peak (see the “Current consumption” section in the TOBY-L2 Data Sheet [1] or the MPCI-L2 Data Sheet [2]) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is transmitting in 2G single-slot mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications. During a GSM call, current consumption is not so significantly high in receiving or in monitor bursts and is low in the inactive unused bursts.  Figure 4 shows an example of the module current consumption profile versus time in 2G single-slot mode.  Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200 mA60-120 mA1900 mAPeak current depends on TX power and actual antenna loadGSM frame             4.615 ms                                       (1 frame = 8 slots)60-120 mA10-40 mA0.01.51.00.52.02.5 Figure 4: VCC or 3.3Vaux current consumption profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot) Figure  5  illustrates  VCC  or  3.3Vaux  voltage  profile  versus  time  during  a  2G  single-slot  call,  according  to  the relative VCC or 3.3Vaux current consumption profile described in Figure 4.  Time [ms]undershootovershootrippledropVoltage [mV]3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 5: VCC or 3.3Vaux voltage profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 23 of 158 When a GPRS connection is established, more than one slot can be used to transmit and/or more than one slot can  be  used  to  receive.  The  transmitted  power  depends  on  network  conditions,  which  set  the  peak  current consumption, but following the 3GPP specifications the maximum Tx RF power is reduced if more than one slot is used to transmit, so the maximum peak of current is not as high as can be in case of a 2G single-slot call. If the module transmits in GPRS class 12 in the 850 or 900 MHz bands, at the maximum RF power control level, the current consumption can reach a quite high peak but lower than the one achievable in 2G single-slot mode. This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/2 duty cycle, according to 2G TDMA.  If the module is in GPRS connected mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications.  Figure  6  reports  the  current  consumption  profiles  in  GPRS  class  12  connected  mode,  in  the  850  or  900 MHz bands, with 4 slots used to transmit and 1 slot used to receive.   Time [ms]RX   slotunused slotTX              slotTX   slotTX           slotTX                        slotMON       slotunused slotRX  slotunused slotTX                              slotTX   slotTX             slotTX                                slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200mA60-130mAPeak current depends on TX power and actual antenna loadGSM frame             4.615 ms                                       (1 frame = 8 slots)1600 mA0.01.51.00.52.02.5 Figure 6: VCC or 3.3Vaux current consumption profile during a 2G GPRS/EDGE multi-slot connection (4 TX slots, 1 RX slot)  In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 6, representing the current consumption profile in GPRS class 12 connected mode, is valid for the EDGE class 12 connected mode as well.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 24 of 158 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends again on output RF power, which is always regulated by network commands. These power control commands are logically divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of 1.5 kHz. There  are  no  high  current  peaks  as  in  the  2G  connection,  since  transmission  and  reception  are  continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the 2G case. In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum  output  power (approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is high  (see the “Current consumption” section in TOBY-L2 Data Sheet [1] or in MPCI-L2 Data Sheet [2]). Even at lowest output RF  power  (approximately  0.01  µW  or  -50  dBm),  the  current  is  still  not  so  low  due  to  module  baseband processing and transceiver activity.  Figure 7 shows an example of current consumption profile of the module in 3G WCDMA/DC-HSPA+ continuous transmission mode.  Time [ms]3G frame  10 ms                                       (1 frame = 15 slots)Current [mA]Current consumption value depends on TX power and actual antenna load170 mA1 slot  666 µs850 mA0300200100500400600700 Figure 7: VCC or 3.3Vaux current consumption profile versus time during a 3G connection (TX and RX continuously enabled)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 25 of 158 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode During a LTE connection, the module can transmit and receive continuously due to LTE radio access technology. The current consumption is strictly dependent on the transmitted RF output power, which is always regulated by network commands. These power control commands are logically divided into a slot of 0.5 ms (time length of one Resource Block), thus the rate of power change can reach a maximum rate of 2 kHz.   Figure  8  shows  an  example  of  the  module  current  consumption  profile  versus  time  in  LTE  connected-mode. Detailed current consumption values can be found in TOBY-L2 Data Sheet [1] and in MPCI-L2 Data Sheet [2].  Time [ms]Current [mA]Current consumption value depends on TX power and actual antenna load1 Slot1 Resource Block (0.5 ms) 1 LTE Radio Frame (10 ms)0300200100500400600700 Figure 8: VCC or 3.3Vaux current consumption profile versus time during LTE connection (TX and RX continuously enabled)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 26 of 158 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During low power idle-mode, the module processor runs with 32 kHz reference clock frequency. When  the  power  saving  configuration  is  enabled  and  the  module  is registered  or  attached  to  a  network, the module automatically enters the low power idle-mode whenever possible,  but it must periodically monitor the paging  channel  of  the  current  base  station  (paging  block  reception),  in  accordance  to  the  2G/3G/LTE  system requirements, even if connected-mode is not enabled by the application. When the module monitors the paging channel,  it  wakes  up  to  the  active-mode,  to  enable  the  reception  of  paging  block.  In  between,  the  module switches to low power idle-mode. This is known as discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The  time  period  between  two  paging  block  receptions  is  defined  by  the  network.  This  is  the  paging  period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell:  In case of 2G radio access technology, the paging period can vary from 470.8 ms (DRX = 2, length of 2 x 51 2G frames = 2 x 51 x 4.615 ms) up to 2118.4 ms (DRX = 9, length of 9 x 51 2G frames = 9 x 51 x 4.615 ms)  In case of 3G radio access technology, the paging period can vary from 640 ms (DRX = 6, i.e. length of 26 3G frames = 64 x 10 ms) up to 5120 ms (DRX = 9, length of 29 3G frames = 512 x 10 ms).  In case of LTE radio access technology, the paging period can vary from 320 ms (DRX = 5, i.e. length of 25 LTE frames = 32 x 10 ms) up to 2560 ms (DRX = 8, length of 28 LTE frames = 256 x 10 ms). Figure 9 illustrates a typical example of the module current consumption profile when power saving is enabled. The module is registered with network, automatically enters the low power idle-mode and periodically wakes up to  active-mode  to  monitor  the  paging  channel  for  the  paging  block  reception.  Detailed  current  consumption values can be found in TOBY-L2 Data Sheet [1] and in MPCI-L2 Data Sheet [2].  ~50 msIDLE MODE ACTIVE MODE IDLE MODEActive Mode EnabledIdle Mode Enabled2G case: 0.44-2.09 s    3G case: 0.61-5.09 s LTE case: 0.27-2.51 sIDLE MODE~50 msACTIVE MODETime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 Figure  9:  VCC  or  3.3Vaux current consumption profile with  power saving  enabled  and  module registered with  the network:  the module is in idle-mode and periodically wakes up to active-mode to monitor the paging channel for paging block reception
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 27 of 158 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled) When power saving is disabled, the  module does not  automatically enter the low power  idle-mode  whenever possible: the module remains in  active-mode. Power saving configuration is  by default  disabled. It can  also be disabled using the AT+UPSV command (see u-blox AT Commands Manual [3] for detail usage). The module processor core is activated during idle-mode, and the 26 MHz reference clock frequency is used. It would draw more current during the paging period than that in the power saving mode. Figure 10 illustrates a typical example of the module current consumption profile when power saving is disabled. In  such  case,  the  module  is  registered  with  the  network  and  while  active-mode  is  maintained,  the  receiver  is periodically activated to monitor the paging channel for paging block reception. Detailed current consumption values can be found in TOBY-L2 Data Sheet [1] and in MPCI-L2 Data Sheet [2].  ACTIVE MODE2G case: 0.44-2.09 s    3G case: 0.61-5.09 sLTE case: 0.32-2.56 sPaging periodTime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 Figure 10: VCC or 3.3Vaux current consumption profile with power saving disabled and module registered with the network: active-mode is always held and the receiver is periodically activated to monitor the paging channel for paging block reception
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 28 of 158 1.5.2 RTC supply input/output (V_BCKP)   The RTC supply V_BCKP pin is not available on MPCI-L2 series modules.  The V_BCKP  pin  of  TOBY-L2 series  modules connects  the supply for the  Real Time Clock (RTC). A linear LDO regulator integrated in the Power Management Unit internally generates this supply, as shown in Figure 11, with low current  capability  (see  the  TOBY-L2  series  Data  Sheet  [1]).  The  output  of  this  regulator  is  always  enabled when the main module voltage supply applied to the VCC pins is within the valid operating range.  Baseband Processor70VCC71VCC72VCC3V_BCKPLinear LDOPower ManagementTOBY-L2 series32 kHzRTC Figure 11: TOBY-L2 series RTC supply (V_BCKP) simplified block diagram The RTC provides the module time reference (date and time) that is used to set the wake-up interval during the low power idle-mode periods, and is able to make available the programmable alarm functions. The RTC functions are available also in power-down  mode  when  the  V_BCKP  voltage is within its  valid range (specified in the “Input characteristics of  Supply/Power pins” table in  TOBY-L2  series Data Sheet [1]). The  RTC can be supplied from an external back-up battery through the V_BCKP, when the main module voltage supply is not applied to the VCC pins. This lets the time reference (date and time) run until the V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. Consider  that  the  module  cannot  switch  on  if  a  valid  voltage  is  not  present  on  VCC  even  when  the  RTC  is supplied through V_BCKP (meaning that VCC is mandatory to switch on the module). The RTC has very low current consumption, but is highly temperature dependent. For example, V_BCKP current consumption at the maximum operating temperature can be higher than the typical value at 25 °C specified in the “Input characteristics of Supply/Power pins” table in the TOBY-L2 series Data Sheet [1]. If V_BCKP is left unconnected and the module main supply is not applied to the VCC pins, the RTC is supplied from  the  bypass  capacitor  mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1.4 V min). This has no impact on cellular connectivity, as all the module functionalities do not rely on date and time setting.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 29 of 158 1.5.3 Generic digital interfaces supply output (V_INT)   The generic digital interfaces supply V_INT pin is not available on MPCI-L2 series modules.  The  V_INT  output  pin  of  the  TOBY-L2  series modules  is  connected  to  an  internal  1.8  V  supply  with  current capability specified in the TOBY-L2 series Data Sheet [1]. This supply is internally generated by a switching step-down regulator integrated in the Power Management Unit and it is internally used to source the generic digital I/O interfaces of the TOBY-L2 module, as described in Figure 12. The output of this regulator is enabled when the module is switched on and it is disabled when the module is switched off.  Baseband Processor70VCC71VCC72VCC5V_INTSwitchingStep-DownPower ManagementTOBY-L2 seriesDigital I/O Figure 12: TOBY-L2 series generic digital interfaces supply output (V_INT) simplified block diagram The switching regulator operates in Pulse Width Modulation (PWM)  mode for greater efficiency at high output loads and it automatically switches to Pulse Frequency Modulation (PFM) power save mode for greater efficiency at low output loads. The V_INT output voltage ripple is specified in the TOBY-L2 series Data Sheet [1].
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 30 of 158 1.6 System function interfaces 1.6.1 Module power-on  The PWR_ON input pin is not available on MPCI-L2 series modules.  When  the  TOBY-L2  and  MPCI-L2  series  modules are  in  the  not-powered  mode  (switched  off,  i.e.  the  VCC  or 3.3Vaux module supply is not applied), they can be switched on as following:  Rising edge on the VCC or 3.3Vaux supply input to a valid voltage for module supply, so that the module switches on applying a proper VCC or 3.3Vaux supply within the normal operating range.  Alternately,  the  RESET_N  or  PERST#  pin  can  be  held  to  the  low  level  during  the  VCC  or  3.3Vaux  rising edge,  so  that  the  module  switches  on  releasing  the  RESET_N  or  PERST# pin  when  the  VCC or  3.3Vaux module supply voltage stabilizes at its proper nominal value within the normal operating range. The status of the PWR_ON input pin of TOBY-L2 modules while applying the VCC module supply is not relevant: during this phase the PWR_ON pin can be set high or low by the external circuit.  When the TOBY-L2 modules are in the power-off mode (i.e. switched off with valid VCC module supply applied), they can be switched on as following:  Low level on the PWR_ON pin, which is normally set high by an internal pull-up, for a valid time period.  Low level on the RESET_N pin, which is normally set high by an internal pull-up, for a valid time period.  RTC alarm, i.e. pre-programmed alarm by AT+CALA command (see u-blox AT Commands Manual [3]).  As described in Figure 13, the TOBY-L2 series PWR_ON input is equipped with an internal active pull-up resistor to the VCC module supply:  the  PWR_ON input voltage thresholds are  different  from the  other  generic digital interfaces. Detailed electrical characteristics are described in TOBY-L2 series Data Sheet [1].  Baseband Processor20PWR_ONTOBY-L2 seriesVCCPower-onPower ManagementPower-on50k Figure 13: TOBY-L2 series PWR_ON input description
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 31 of 158 Figure 14 shows the module power-on sequence from the not-powered mode, describing the following phases:  The external supply is applied to the VCC or 3.3Vaux module supply inputs, representing the start-up event.  The PWR_ON and the RESET_N or PERST# pins suddenly rise to high logic level due to internal pull-ups.  The V_BCKP RTC supply output is suddenly enabled by the module as VCC reaches a valid voltage value.  All the generic digital pins of the module are tri-stated until the switch-on of their supply source (V_INT).  The internal reset signal  is held low: the  baseband core and all the digital pins  are held in the reset state.  The reset state of all the digital pins is reported in the pin description table of TOBY-L2 Series Data Sheet [1].  When the internal reset signal is released, any digital pin is set in a proper sequence from the reset state to the default operational configured state. The duration of this pins’ configuration phase differs within generic digital interfaces and the USB interface due to host / device enumeration timings (see section 1.9.1).  The module is fully ready to operate after all interfaces are configured.   VCC or 3.3VauxV_BCKPPWR_ONRESET_N or PERST#V_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFON0 ms~10 ms~20 sStart of interface configurationModule interfaces are configuredStart-up event~5 ms Figure 14: TOBY-L2 and MPCI-L2 series power-on sequence description   The Internal Reset signal is not available on a module pin, but the host application can monitor:  The V_INT pin to sense the start of the TOBY-L2 module power-on sequence.  The USB interface to sense the start of the MPCI-L2 module power-on sequence: the module, as USB device,  informs  the  host  of  the  attach  event  via  a  reply  on  its  status  change  pipe  for  proper  bus enumeration process according to Universal Serial Bus Revision 2.0 specification [6].  Before  the  switch-on  of  the  generic  digital  interface  supply  source  (V_INT)  of  the  module,  no  voltage driven by an external application should be applied to any generic digital interface of TOBY-L2 module.  Before the TOBY-L2 and MPCI-L2 series module is fully ready to operate, the  host application processor should not send any AT command over the AT communication interfaces (USB, UART) of the module.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 32 of 158 1.6.2 Module power-off TOBY-L2 series can be properly switched off by:  AT+CPWROFF command (see u-blox AT Commands Manual [3]). The current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.   The MPCI-L2 series modules do not switch off by the AT+CPWROFF command as the TOBY-L2 modules, but  the  AT+CPWROFF  command  causes  a  reset  (reboot)  of  the  module  due  to  the  MPCI-L2  module’s internal configuration: the command stores the actual parameter settings in the non-volatile memory of MPCI-L2 modules and performs a network detach, with a subsequent reset (reboot) of the module.  An abrupt under-voltage shutdown occurs on TOBY-L2 and MPCI-L2 series modules when the VCC or 3.3Vaux module  supply  is  removed.  If  this  occurs,  it  is  not  possible  to  perform  the  storing  of  the  current  parameter settings in the module’s non-volatile memory or to perform the proper network detach.   It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY-L2 modules normal operations:  the  power  off  procedure  must  be  started  by  the  AT+CPWROFF  command,  waiting  the command response for a proper time period (see  u-blox AT Commands Manual [3]), and then a proper VCC  supply  has  to  be  held  at  least  until  the  end  of  the  modules’  internal  power  off  sequence,  which occurs when the generic digital interfaces supply output (V_INT) is switched off by the module.  It  is  highly  recommended  to  avoid  an  abrupt  removal  of  the  3.3Vaux  supply  during  MPCI-L2  modules normal operations: the power off  procedure must be started by setting the MPCI-L2 module in the halt mode  by  the  AT+CFUN=127  command  (which  stores  the  actual  parameter  settings  in  the  non-volatile memory  of  the  module  and  performs  a  network  detach),  waiting  the  command  response  for  a  proper time period (see the u-blox AT Commands Manual [3]), and then the 3.3Vaux supply can be removed.  An abrupt hardware shutdown occurs on TOBY-L2 series modules when a low level is applied on the RESET_N pin  for  a  specific  time  period.  In  this  case,  the  current  parameter  settings  are  not  saved  in  the  module’s non-volatile memory and a proper network detach is not performed.   It is highly recommended to avoid an abrupt hardware shutdown of the module by forcing a low level on the RESET_N input pin during module normal operation: the RESET_N line should be set low only if reset or shutdown via AT commands fails or if the module does not reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [3].  An over-temperature or an under-temperature shutdown occurs on TOBY-L2 and MPCI-L2 series modules when the  temperature  measured  within  the  cellular  module  reaches  the  dangerous  area,  if  the  optional  Smart Temperature Supervisor feature is enabled and configured by the dedicated AT command. For more details  see u-blox AT Commands Manual [3], +USTS AT command.   The  Smart  Temperature  Supervisor  feature  is  not  supported  by  the  “00”,  “01”, and  “50”  product versions.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 33 of 158 Figure 15 describes the TOBY-L2 power-off sequence by means of AT+CPWROFF with the following phases:  When the +CPWROFF AT command is sent, the module starts the switch-off routine.  The module replies OK on the AT interface: the switch-off routine is in progress.   At the end of the switch-off routine, all the digital pins are tri-stated and all the internal voltage regulators are turned off, including the generic digital interfaces supply (V_INT), except the RTC supply (V_BCKP).  Then, the module remains in power-off mode as long as a switch on event does not occur (e.g. applying a proper low level to the PWR_ON input, or applying a proper low level to the RESET_N input), and enters not-powered mode if the supply is removed from the VCC pins.  VCC V_BCKPPWR_ONRESET_N V_INTInternal ResetSystem StateBB Pads State OperationalOFFTristate / FloatingONOperational → TristateAT+CPWROFFsent to the module0 s~2.5 s~5 sOKreplied by the moduleVCC                can be removed Figure 15: TOBY-L2 series power-off sequence description  The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the end of the power-off sequence.  Figure 16 describes the MPCI-L2 power-off procedure with the following phases:  When the AT+CFUN=127 command is issued, the module starts the halt mode setting routine.  The module replies OK on the AT interface: after this, the module is set in the halt mode.  Then, the module remains in the Halt mode and enters not-powered mode if the supply is removed from the 3.3Vaux pins.  3.3VauxPERST#Internal ResetSystem StateBB Pads StateOFFONTristate / FloatingOperationalAT+CFUN=127sent to the module0 s~2.5 s~5 sOKreplied by the module3.3Vaux         can be removed Figure 16: MPCI-L2 series power-off procedure description  The duration of each phase in the TOBY-L2 and MPCI-L2 series modules’ switch-off routines can largely vary depending on the application / network settings and the concurrent module activities.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 34 of 158 1.6.3 Module reset TOBY-L2 and MPCI-L2 series modules can be properly reset (rebooted) by:  AT+CFUN command (see u-blox AT Commands Manual [3]). MPCI-L2 series modules can be additionally properly reset (rebooted) by:  AT+CPWROFF command (see u-blox AT Commands Manual [3]): the behavior differs than TOBY-L2 series, as MPCI-L2 modules will reboot rather than remain switched off due to modules’ internal configuration. In the  cases listed  above  an  “internal”  or  “software”  reset  of the  module  is executed: the  current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.  An abrupt hardware reset occurs on  TOBY-L2 and MPCI-L2 series modules when a low level is applied on the RESET_N  or  PERST#  input  pin  for  a  specific  time  period.  In this  case,  the  current  parameter  settings are  not saved in the module’s non-volatile memory and a proper network detach is not performed.   It is highly recommended to avoid an abrupt hardware reset of the module by forcing a low level on the RESET_N or PERST# input during modules normal operation: the RESET_N or PERST# line should be set low only if reset or shutdown via AT commands fails or if the module does not provide a reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [3].  As described  in  Figure  17,  the  RESET_N  and  PERST#  input pins  are  equipped  with  an  internal  pull-up to the VCC supply in the TOBY-L2 series and to the 3.3 V in the MPCI-L2 series.  Baseband Processor23RESET_NTOBY-L2 seriesVCCResetPower ManagementReset50kBaseband Processor22PERST#MPCI-L2 seriesResetPower ManagementReset45k3.3 V Figure 17: TOBY-L2 and MPCI-L2 series RESET_N and PERST# input equivalent circuit description  For more electrical characteristics details see TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2].  1.6.4 Module configuration selection by host processor  The HOST_SELECT0 and HOST_SELECT1 pins are not available on MPCI-L2 series modules.  The selection of the module configuration by the host application processor over the HOST_SELECT0 and HOST_SELECT1 pins is not supported by TOBY-L2 “00”, “01”, and “50” product versions.  TOBY-L2 series modules include two input pins (HOST_SELECT0 and HOST_SELECT1) for the selection of the module configuration by the host application processor.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 35 of 158 1.7 Antenna interface 1.7.1 Antenna RF interfaces (ANT1 / ANT2) TOBY-L2 and MPCI-L2 series modules provide two RF interfaces for connecting the external antennas:  The ANT1 represents the primary RF input/output for transmission and reception of LTE/3G/2G RF signals.  The  ANT1  pin  of  TOBY-L2  series  modules  has  a  nominal  characteristic  impedance  of  50   and  must  be connected to the primary Tx / Rx antenna through a 50  transmission line to allow proper RF transmission and reception. The  ANT1  Hirose  U.FL-R-SMT  coaxial  connector  receptacle  of  MPCI-L2  series  modules  has  a  nominal characteristic impedance of 50  and must be connected to the primary Tx / Rx antenna through a mated RF plug with a 50  coaxial cable assembly to allow proper RF transmission and reception.  The  ANT2  represents  the  secondary  RF  input  for  the  reception  of  the  LTE  RF  signals  for  the  Down-Link MIMO 2 x 2 radio technology supported by TOBY-L2 and MPCI-L2 series modules as required feature for LTE category 4 UEs, and for the reception of the 3G RF signals for the Down-Link Rx diversity radio technology supported by TOBY-L2 and MPCI-L2 series modules as additional feature for 3G DC-HSDPA category 24 UEs.  The  ANT2  pin  of  TOBY-L2  series  modules  has  a  nominal  characteristic  impedance  of  50   and  must  be connected to the secondary Rx antenna through a 50  transmission line to allow proper RF reception. The  ANT2  Hirose  U.FL-R-SMT  coaxial  connector  receptacle  of  MPCI-L2  series  modules  has  a  nominal characteristic impedance of 50  and must be connected to the secondary Rx antenna through a mated RF plug with a 50  coaxial cable assembly to allow proper RF reception.  The  Multiple  Input  Multiple  Output  (MIMO)  radio  technology  is  an  essential  component  of  LTE  radio  systems based  on  the  use  of  multiple  antennas  at  both  the  transmitter  and  receiver  sides  to  improve  communication performance and achieve highest possible bit rate. A MIMO m x n system consists of m transmit and n receive antennas,  where the  data  to be  transmitted  is  divided into m independent  data streams.  Note  that the  terms Input and Output refer to the radio channel carrying the signal, not to the devices having antennas, so that in the Down-Link MIMO 2 x 2 system supported by TOBY-L2 and MPCI-L2 series modules:  The LTE data stream is divided into 2 independent streams by the Tx-antennas of the base station  The cellular modules, at the receiver side, receives both LTE data streams by 2 Rx-antennas (ANT1 / ANT2)  Base StationTx-1 AntennaTx-2 AntennaTOBY-L2 seriesMPCI-L2 seriesANT1Rx-1 AntennaANT2Rx-2 AntennaData Stream 1Data Stream 2 Figure 18: Description of the LTE Down-Link MIMO 2 x 2 radio technology supported by TOBY-L2 and MPCI-L2 series modules TOBY-L2 and MPCI-L2 series modules support the LTE MIMO 2 x 2 radio technology in the Down-Link path only (from the base station to the module): the ANT1 port is the only one RF interface that is used by the module to transmit the RF signal in the Up-Link path (from the module to the base station).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 36 of 158 1.7.1.1 Antenna RF interfaces requirements Table 8, Table 9 and Table 10 summarize the requirements for the antennas RF interfaces (ANT1 / ANT2). See section 2.4.1 for suggestions to properly design antennas circuits compliant with these requirements.   The  antenna  circuits  affect  the  RF  compliance  of  the  device  integrating  TOBY-L2  and  MPCI-L2 series  modules  with  applicable  required  certification  schemes  (for more  details  see  section  4). Compliance is guaranteed if the antenna RF interfaces (ANT1 / ANT2) requirements summarized in Table 8, Table 9 and Table 10 are fulfilled.  Item Requirements Remarks Impedance  50  nominal characteristic impedance The impedance of the antenna RF connection must match the 50  impedance of the ANT1 port. Frequency Range See  the  TOBY-L2  series  Data  Sheet [1]  and  the MPCI-L2 series Data Sheet [2] The required frequency range of the antenna connected to ANT1 port depends on the operating bands of the used cellular module and the used mobile network. Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the primary antenna RF connection matches the 50  characteristic impedance of the ANT1 port. The impedance of the antenna termination must match as much as possible the 50  nominal impedance of the ANT1 port over the operating frequency range, reducing as much as possible the amount of reflected power. Efficiency > -1.5 dB ( > 70% ) recommended > -3.0 dB ( > 50% ) acceptable The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT1 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as Total Radiated Power (TRP) and the Total Isotropic Sensitivity (TIS), specified by applicable related certification schemes. Maximum Gain  According to radiation exposure limits The power gain of an antenna is the radiation efficiency multiplied by the directivity: the gain describes how much power is transmitted in the direction of peak radiation to that of an isotropic source.  The maximum gain of the antenna connected to ANT1 port must not exceed the herein stated value to comply with regulatory agencies radiation exposure limits. For additional info see the section 4.2.2. Input Power  > 33 dBm ( > 2 W ) The antenna connected to the ANT1 port must support with adequate margin the maximum power transmitted by the modules. Table 8: Summary of primary Tx/Rx antenna RF interface (ANT1) requirements
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 37 of 158 Item Requirements Remarks Impedance  50  nominal characteristic impedance The impedance of the antenna RF connection must match the 50  impedance of the ANT2 port. Frequency Range  See  the  TOBY-L2  series  Data  Sheet [1]  and  the MPCI-L2 series Data Sheet [2] The required frequency range of the antennas connected to ANT2 port depends on the operating bands of the used cellular module and the used Mobile Network. Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the secondary antenna RF connection matches the 50  characteristic impedance of the ANT2 port. The impedance of the antenna termination must match as much as possible the 50  nominal impedance of the ANT2 port over the operating frequency range, reducing as much as possible the amount of reflected power. Efficiency > -1.5 dB ( > 70% ) recommended > -3.0 dB ( > 50% ) acceptable The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT2 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as the TIS, specified by applicable related certification schemes. Table 9: Summary of secondary Rx antenna RF interface (ANT2) requirements  Item Requirements Remarks Efficiency imbalance  < 0.5 dB recommended < 1.0 dB acceptable The radiation efficiency imbalance is the ratio of the primary (ANT1) antenna efficiency to the secondary (ANT2) antenna efficiency: the efficiency imbalance is a measure of how much better an antenna receives or transmits compared to the other antenna. The radiation efficiency of the secondary antenna needs to be roughly the same of the radiation efficiency of the primary antenna for good RF performance. Envelope Correlation Coefficient  < 0.4 recommended < 0.5 acceptable The Envelope Correlation Coefficient (ECC) between the primary (ANT1) and the secondary (ANT2) antenna is an indicator of 3D radiation pattern similarity between the two antennas: low ECC results from antenna patterns with radiation lobes in different directions. The ECC between primary and secondary antenna needs to be enough low to comply with radiated performance requirements specified by related certification schemes. Isolation  > 15 dB recommended > 10 dB acceptable The antenna to antenna isolation is the loss between the primary (ANT1) and the secondary (ANT2) antenna: high isolation results from low coupled antennas. The isolation between primary and secondary antenna needs to be high for good RF performance. Table 10: Summary of primary (ANT1) and secondary (ANT2) antennas relationship requirements
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 38 of 158 1.7.2 Antenna detection interface (ANT_DET)  Antenna detection (ANT_DET) is not available on MPCI-L2 series modules.  Antenna detection (ANT_DET) is not supported by TOBY-L2 “00”, “01”, and “50” product versions.  The  antenna  detection  is  based  on  ADC  measurement.  The  ANT_DET  pin  is  an  Analog  to  Digital  Converter (ADC) provided to sense the antenna presence. The antenna detection function provided by ANT_DET pin is an optional feature that can be implemented if the application  requires  it.  The  antenna  detection  is  forced  by  the  +UANTR  AT  command.  See  the  u-blox  AT Commands Manual [3] for more details on this feature. The ANT_DET pin generates a DC current (for detailed characteristics see the TOBY-L2 series Data Sheet [1]) and measures the resulting DC voltage, thus determining the resistance from the antenna connector provided on the application board to GND. So, the requirements to achieve antenna detection functionality are the following:  an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used  an antenna detection circuit must be implemented on the application board See section 2.4.2 for antenna detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines.  1.8 SIM interface 1.8.1 SIM interface TOBY-L2  and MPCI-L2 series  modules provide high-speed SIM/ME interface  including automatic detection  and configuration of the voltage required by the connected SIM card or chip. Both 1.8  V and 3  V SIM types are  supported.  Activation  and deactivation with automatic voltage  switch from 1.8 V  to  3  V  are  implemented,  according  to  ISO-IEC  7816-3  specifications.  The  VSIM  or  UIM_PWR  supply output provides internal short circuit protection to limit start-up current and protect the SIM to short circuits. The SIM driver supports the PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM card or chip.  1.8.2 SIM detection interface  SIM detection (GPIO5) is not available on MPCI-L2 series modules.  SIM detection (GPIO5) is not supported by TOBY-L2 “00”, “01”, and “50” product versions.  The  GPIO5  pin  is  by  default  configured  to  detect  the  SIM  card  mechanical  /  physical  presence.  The  pin  is configured  as  input  with  an  internal  active  pull-down  enabled,  and  it  can  sense  SIM  card  presence  only  if properly connected to the mechanical switch of a SIM card holder as described in section 2.5:  Low logic level at GPIO5 input pin is recognized as SIM card not present  High logic level at GPIO5 input pin is recognized as SIM card present The SIM card detection function provided by GPIO5 pin is an optional feature that can be implemented / used or not  according  to  the  application  requirements:  an  Unsolicited  Result  Code  (URC)  is  generated  each  time  that there is a change of status (for more details see the u-blox AT Commands Manual [3]). The optional function “SIM card hot insertion/removal” can be additionally enabled on the GPIO5 pin by specific AT command (see the u-blox AT Commands Manual [3]).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 39 of 158 1.9 Data communication interfaces TOBY-L2 and MPCI-L2 series modules provide the following serial communication interface:  USB  interface:  High-Speed  USB  2.0  compliant  interface  available  for  the  communication  with  an  external host  application  processor,  for  AT  commands,  data  communication,  FW  upgrade  by  means  of  the  FOAT feature, FW upgrade by means of the u-blox EasyFlash tool and for diagnostic purpose (see section 1.9.1 for functional description) TOBY-L2 series modules additionally provide the following serial communication interfaces:  UART  interface:  asynchronous  serial  interface  available  for  the  communication  with  an  external  host application processor, for AT commands, data communication, FW upgrade by means of the FOAT feature (see section 1.9.2 for functional description)  DDC interface: I2C bus compatible interface available for the communication with u-blox GNSS positioning chips/modules and with external I2C devices as an audio codec (see section 1.9.3 for functional description)  SDIO interface: Secure Digital Input Output interface available for the communication with an external Wi-Fi chip or module (see section 1.9.4 for functional description)  1.9.1 Universal Serial Bus (USB) 1.9.1.1 USB features TOBY-L2  and  MPCI-L2  series  modules  include  a  High-Speed  USB  2.0  compliant  interface  with  maximum  data rate  of  480 Mb/s,  representing  the  main  interface  for  transferring  high  speed  data  with  a  host  application processor: the USB interface is available for AT commands, data communication, FW upgrade by means of  the FOAT feature, FW upgrade by means of the u-blox EasyFlash tool and for diagnostic purpose. The module itself acts as a USB device and can be connected to a USB host such as a Personal Computer or an embedded application microprocessor equipped with compatible drivers. The USB_D+ / USB_D- lines carry the USB serial bus data and signaling, providing all the functionalities for the bus attachment, configuration, enumeration, suspension or remote wakeup according to the Universal Serial Bus Revision 2.0 specification [6] The additional VUSB_DET input is available as an optional feature to sense the host VBUS voltage (5.0 V typical).   The VUSB_DET functionality is not supported by  TOBY-L2 “00”, “01”,  and “50” product versions: the pin should  be  left  unconnected or it  should  not  be driven high  by  any  external device,  because  a  high logic  level  applied  to  the  pin  will  represent  a  module  switch-on  event  (additional  to  the  ones  listed  in section 1.6.1) and will prevent reaching the minimum possible consumption with power saving enabled.  The VUSB_DET pin is not available on MPCI-L2 series modules.  The USB interface is controlled and operated with:  AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]  u-blox AT commands   For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [3].
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 40 of 158 TOBY-L2 and MPCI-L2 modules provide by default the following USB profile with the listed set of USB functions:  1 RNDIS for Ethernet-over-USB connection  1 CDC-ACM for AT commands and data communication  The  USB  profile of TOBY-L2  and MPCI-L2  modules  identifies itself  by  its VID  (Vendor ID)  and  PID (Product  ID) combination, included in the USB device descriptor according to the USB 2.0 specifications [6]. The VID and PID of the default USB profile configuration with the set of functions described above (1 RNDIS for Ethernet-over-USB and 1 CDC-ACM for AT commands and data) are the following:  VID = 0x1546  PID = 0x1146  Figure 19 summarizes the USB end-points available with the default USB profile configuration.   Default profile configurationInterface 0 Wireless Controller –Remote NDISInterface 1 Communication DataEndPoint Transfer: InterruptEndPoint Transfer: BulkEndPoint Transfer: BulkInterface 2 Communication Control –AT commandsEndPoint Transfer: InterruptInterface 3 Communication DataEndPoint Transfer: BulkEndPoint Transfer: BulkFunction RNDISFunction CDC Serial Figure 19: TOBY-L2 and MPCI-L2 series USB End-Points summary for the default USB profile configuration  The USB of the modules can be configured by the AT+UUSBCONF command (for more details see the u-blox AT Commands Manual [3]) to select different sets of USB functions available in mutually exclusive way, selecting the active USB profile consisting of a specific set of functions with various capabilities and purposes, such as:  CDC-ACM for AT commands and data  CDC-ACM for GNSS tunneling  CDC-ACM for SIM Access Profile (SAP)  CDC-ACM for diagnostic   RNDIS for Ethernet-over-USB  CDC-ECM for Ethernet-over-USB  CDC-NCM for Ethernet-over-USB  MBIM for Ethernet-over-USB   CDC-ACM  for  GNSS  tunneling,  CDC-ACM  for  SIM  Access  Profile  (SAP),  and  CDC-NCM  and  MBIM functions are not supported by TOBY-L2 “00”, “01”, and “50” product versions.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 41 of 158 For example, the default  USB profile configuration which  provides  2  functions  (1 RNDIS for Ethernet-over-USB and  1  CDC-ACM  for  AT  commands  and  data)  can  be  changed  by  means  of  the  AT+UUSBCONF  command switching to a USB profile configuration which provides the following 6 functions:  3 CDC-ACM for AT commands and data  1 CDC-ACM for GNSS tunneling  1 CDC-ACM for SIM Access Profile (SAP)  1 CDC-ACM for diagnostic  As each USB  profile  of TOBY-L2 and MPCI-L2 modules  identifies itself by  its  specific VID  and PID combination included in the USB device descriptor according to the  USB 2.0 specifications [6], the VID and PID combination changes as following by switching the active USB profile configuration to the set of 6 functions described above:  VID = 0x1546  PID = 0x1141  Alternatively,  as  another  example,  the  USB  profile  configuration  can  be  changed  by  means  of  the AT+UUSBCONF command switching to a USB profile configuration which provides the following 4 functions:  1 CDC-ECM for Ethernet-over-USB   3 CDC-ACM for AT commands and data In case of this USB profile with the set of 4 functions described above, the VID and PID are the following:  VID = 0x1546  PID = 0x1143  The  switch  of  the active  USB  profile  selected by  the  AT+UUSBCONF  command  is  not  performed  immediately. The settings are saved in the non-volatile memory of the module at the power off, and the new configuration is effective at the subsequent reboot of the module.  If the USB is connected to the host before the module  is switched on, or if the module is reset (rebooted) with the USB connected to the host, the VID and PID are automatically updated during the boot of the module. First, VID and PID are the following:  VID = 0x1546  PID = 0x1140 This VID  and PID combination  identifies  a USB profile where  no USB function described above  is available:  AT commands must not be sent to the module over the USB profile identified by this VID and PID combination. Then, after a time period (roughly 20 s, depending on the host / device enumeration timings), the VID and PID are updated to the ones related to the USB profile selected by the AT+UUSBCONF command.   For more details regarding the TOBY-L2 and MPCI-L2 series modules USB configurations and capabilities, see the u-blox AT Commands Manual [3], +UUSBCONF AT command.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 42 of 158 1.9.1.2 USB in Windows The USB drivers (INF files) are provided for Windows systems and should be installed properly by following the step-by-step instruction in EVK-L20 / EVK-L21 User Guide [4]. USB drivers are available for the following operating system platforms:  Windows Vista  Windows 7  Windows 8  Windows 8.1  Windows Embedded Compact 7 The module firmware can be upgraded over the USB interface by means of the FOAT feature, or using the u-blox EasyFlash tool (for more details see Firmware Update Application Note [4]).  1.9.1.3 USB in Linux/Android It is not required to install a specific driver for each Linux-based or Android-based operating system (OS) to use the module USB interface, which is compatible with standard Linux/Android USB kernel drivers. The full capability and configuration of the module USB interface can be reported by running “lsusb –v” or an equivalent command available in the host operating system when the module is connected.  1.9.1.4 USB and power saving The  modules  automatically  enter  the  USB  suspended  state  when the  device  has  observed  no  bus  traffic for  a specific time  period  according  to the  USB  2.0  specification  [6].  In  suspended  state, the  module  maintains  any USB  internal  status  as  device.  In  addition,  the  module  enters  the  suspended  state  when  the  hub  port  it  is attached to is disabled. This is referred to as USB selective suspend. If the  USB is suspended and  a power saving configuration  is enabled  by the AT+UPSV  command,  the module automatically enters the low power idle-mode whenever possible but it wakes up to  active-mode according to any required activity related to the network (e.g. the periodic paging reception described in section  1.5.1.5) or any other required activity related to the functions / interfaces of the module. The USB exits suspend mode when there is bus activity. If the USB is connected and not suspended, the module is forced to stay in active-mode, therefore the AT+UPSV settings are overruled but they have effect on the power saving configuration of the other interfaces. The modules are capable of USB remote wake-up signaling: i.e. it may request the host to exit suspend mode or selective  suspend  by  using  electrical  signaling  to  indicate  remote  wake-up,  for  example  due  to  incoming  call, URCs, data reception on a socket. The remote wake-up signaling notifies the host that it should resume from its suspended mode, if necessary, and service the external event. Remote wake-up is accomplished using electrical signaling described in the USB 2.0 specifications [6]. For the module current consumption description with power saving enabled and USB suspended, or with power saving disabled and USB not suspended, see the sections 1.5.1.5, 1.5.1.6 and the TOBY-L2 Data Sheet [1] or the MPCI-L2 Data Sheet [2].
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 43 of 158 1.9.2 Asynchronous serial interface (UART)  The UART interface is not available on MPCI-L2 series modules.  The UART interface is not supported by TOBY-L200-00S and TOBY-L210-00S modules versions.   The DTR, DSR and DCD signals are not supported by TOBY-L200-50S, TOBY-L210-50S modules versions.  1.9.2.1 UART features The UART interface is a 9-wire 1.8 V unbalanced asynchronous serial interface (UART) that can be connected to an application host processor for AT commands and data communication. The  module  firmware  can  be  upgraded  over  the  UART  interface  by  means  of  the  Firmware  upgrade  over  AT (FOAT) feature only: for more details see section 1.15 and Firmware update application note [4]. UART  interface provides  RS-232  functionality  conforming  to  the  ITU-T  V.24  Recommendation [7], with  CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state (for detailed electrical characteristics see TOBY-L2 Data Sheet [1]), providing:  data lines (RXD as output, TXD as input),   hardware flow control lines (CTS as output, RTS as input),   modem status and control lines (DTR as input, DSR as output, DCD as output, RI as output). TOBY-L2  modules  are  designed  to  operate  as  LTE/3G/2G  cellular  modems,  i.e.  as  the  data  circuit-terminating equipment (DCE) according to the ITU-T V.24 Recommendation [7]. A host application processor connected to the module through the UART interface represents the data terminal equipment (DTE).   UART signal names of TOBY-L2 modules conform to the ITU-T V.24 Recommendation [7]: e.g. TXD line represents data transmitted by the DTE (host processor output) and received by the DCE (module input).  The UART interface is controlled and operated with:  AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]  u-blox AT commands   For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [3], and in particular for the UART configuration see the +IPR, +ICF, +IFC, &K, \Q, +UPSV AT commands.  Flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [3], &K, +IFC, \Q AT commands): hardware flow control (over the RTS / CTS lines), software flow control (XON/XOFF), or none flow control.   Hardware flow control is enabled by default.  Software flow control is not supported by “00”, “01” and “50” module product versions.  The one-shot autobauding is supported: the automatic baud rate detection is performed only once, at module start  up.  After  the  detection,  the  module  works  at  the  detected  baud  rate  and  the  baud  rate  can  only  be changed by AT command (see u-blox AT Commands Manual [3], +IPR).   One-shot automatic baud rate recognition (autobauding) is enabled by default.  The automatic baud rate recognition (autobauding) is not supported by “50” product version.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 44 of 158  The following baud rates can be configured by AT command (see u-blox AT Commands Manual [3], +IPR):  9600 b/s  19200 b/s  38400 b/s  57600 b/s  115200 b/s, default value for “50” modules product version or when one-shot autobauding is disabled  230400 b/s  460800 b/s  921600 b/s  The following frame formats can be configured by AT command (see u-blox AT Commands Manual [3], +ICF):  8N2 (8 data bits, no parity, 2 stop bits)  8N1 (8 data bits, no parity, 1 stop bit), default frame format  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  7N2 (7 data bits, no parity, 2 stop bits)  7N1 (7 data bits, no parity, 1 stop bit)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit)   Automatic frame format recognition is not supported by “00”, “01” and “50” module product versions.  Figure 20 describes the 8N1 frame format, which is the default frame format configuration. D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 20: Description of UART default frame format (8N1, i.e. 8 data bits, no parity, 1 stop bit)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 45 of 158 1.9.2.2 UART interface configuration The  UART  interface  of  TOBY-L2  series  modules  is  available  as  AT  command  interface  with  the  default configuration described in Table 11 (for more details and information about further settings, see the u-blox AT Commands Manual [3]).  Interface AT Settings Comments UART interface AT interface: enabled AT command interface is enabled by default on the UART physical interface  AT+IPR=0 AT+IPR=115200 One-shot autobauding enabled by default on the modules, except “50” product version. 115200 b/s baud rate enabled by default on “50” modules product version.  AT+ICF=3,1 8N1 frame format enabled by default  AT&K3 HW flow control enabled by default  AT&S1 DSR line (Circuit 107 in ITU-T V.24) set ON in data mode4 and set OFF in command mode7  AT&D1 Upon an ON-to-OFF transition of DTR line (Circuit 108/2 in ITU-T V.24), the module (DCE) enters online command mode7 and issues an OK result code  AT&C1 DCD line (Circuit 109 in ITU-T V.24) changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise  MUX protocol: disabled Multiplexing mode is disabled by default and it can be enabled by AT+CMUX command. For more details, see the Mux Implementation Application Note [11]. The following virtual channels are defined:  Channel 0: Control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling (not supported by “00”, “01”, “50” product versions)  Channel 7: SIM Access Profile (not supported by “00”, “01”, “50” product versions) Table 11: Default UART interface configuration  1.9.2.3 UART signals behavior At  the  module  switch-on,  before  the  UART  interface  initialization  (as  described  in  the  power-on  sequence reported in Figure 14), each pin is first tri-stated and then is set to its relative internal reset state5. At the end of the  boot  sequence,  the  UART  interface  is  initialized,  the  module  is  by  default  in  active-mode,  and  the  UART interface is enabled as AT commands interface. The  configuration  and  the  behavior  of  the  UART  signals  after  the  boot  sequence  are  described  below.  See section 1.4 for definition and description of module operating modes referred to in this section.  RXD signal behavior The  module  data  output  line  (RXD)  is  set  by  default  to  the  OFF  state  (high  level)  at  UART  initialization.  The module holds RXD in the OFF state until the module does not transmit some data.  TXD signal behavior The module data input line (TXD) is set by default to the OFF state (high level) at UART initialization. The  TXD line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the TXD input.                                                        4 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [3] 5 See the pin description table in the TOBY-L2 series Data Sheet [1]
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 46 of 158 CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the  hardware  flow  control is enabled,  as  it  is by default,  the  CTS  line  indicates when  the  UART  interface  is enabled  (data  can  be sent and received).  The  module drives  the  CTS  line  to  the  ON  state  or to the  OFF  state when  it  is  either  able  or  not  able  to  accept  data  from  the  DTE  over  the  UART  interface  (for  more  details  see section 1.9.2.4 and in particular Figure 22).    If hardware flow control is enabled, then when the CTS line is OFF it does not necessarily mean that the module is in low power idle-mode, but only that the UART is not enabled, as the module could be forced to stay in active-mode for other activities, e.g. related to the network or related to other interfaces.  If  hardware  flow  control  is  enabled  and  the  multiplexer  protocol  is  active,  then  the  CTS  line  state  is mapped to FCon / FCoff MUX command for flow control matters outside the power saving configuration while the  physical CTS  line  is still used as a  UART power  state indicator.  For  more  details, see  the Mux Implementation Application Note [11].  The CTS  hardware flow control setting can be changed by AT commands (for more details, see the  u-blox AT Commands Manual [3], AT&K, AT\Q, AT+IFC AT commands). If the hardware flow control is not enabled, the CTS line still indicates when the UART interface is enabled, as it does when hardware flow control is enabled. The module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE over the UART interface, as described in Figure 22.    When the power saving configuration is enabled by AT+UPSV command and the hardware flow-control is not implemented  in the DTE/DCE connection,  data  sent by  the DTE can be lost: the first character  sent when  the  module  is  in  low  power  idle-mode  will  not  be  a  valid  communication  character  (see  section 1.9.2.4 and in particular the sub-section “Wake up via data reception” for further details).  RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The module then holds the RTS line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If the HW flow control is enabled, as it is by default, the module monitors the RTS line to detect permission from the DTE to send  data to the DTE itself. If the  RTS line is set  to the OFF state, any on-going data transmission from the module is interrupted until the RTS line changes to the ON state.   The DTE must still be able to accept a certain number  of characters after the  RTS line is set to the OFF state: the module guarantees the transmission interruption within two characters from RTS state change.  The module behavior  according to  the  RTS  hardware flow control  status can be configured by AT  commands (for more details, see the u-blox AT Commands Manual [3], AT&K, AT\Q, AT+IFC AT commands). If AT+UPSV=2 is set and HW flow control is disabled, the module monitors the  RTS line to manage the power saving configuration (for more details, see section 1.9.2.4 and u-blox AT Commands Manual [3], AT+UPSV):  When an OFF-to-ON transition occurs on the RTS input, the UART is enabled and the module is forced to active-mode; after ~5 ms from the transition the switch is completed and data can be received without loss. The module cannot enter low power idle-mode and the UART is keep enabled as long as the RTS input line is held in the ON state  If the RTS input line is set to the OFF state by the DTE, the UART is disabled (held in low power mode) and the module automatically enters low power idle-mode whenever possible
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 47 of 158 DSR signal behavior If AT&S1 is set, as it is by default, the DSR module output line is set by default to the OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode6 or in online command mode6 and is set to the ON state when the module is in data mode6. If AT&S0 is set, the DSR module output line is set by default to the ON state (low level) at UART initialization and is then always held in the ON state.  DTR signal behavior The DTR module input line is set by default to the OFF state (high level) at UART initialization. The module then holds the DTR line in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the DTR input.  Module behavior according to DTR status can be changed by AT command configuration (for more details see the u-blox AT Commands Manual [3], &D AT command description). If AT+UPSV=3 is set, the DTR line is monitored by the module to manage the power saving configuration (for more details, see section 1.9.2.4 and u-blox AT Commands Manual [3], AT+UPSV):   When an OFF-to-ON transition occurs on the DTR input, the UART is enabled and the module is forced to active-mode; after ~5 ms from the transition, the switch is completed and data can be received without loss. The module cannot enter low power idle-mode and the UART is keep enabled as long as the DTR input line is held in the ON state  If the DTR input line is set to the OFF state by the DTE, the UART is disabled (held in low power mode) and the module automatically enters low power idle-mode whenever possible  DCD signal behavior If AT&C1 is set, as it is by default, the DCD module output line is set by default to the OFF state (high level) at UART initialization. The module then sets the DCD line according to the carrier detect status: ON if the carrier is detected, OFF otherwise.  If a Packet Switched Data call occurs before activating the PPP protocol (data mode), a dial-up application must provide  the  ATD*99***<context_number>#  to  the  module:  with  this  command  the  module  switches  from command  mode6  to  data mode6  and  can  accept  PPP  packets. The  module sets  the  DCD  line  to  the  ON state, then answers with a  CONNECT  to confirm the  ATD*99  command.  The  DCD ON is not related to the  context activation but with the data mode.    The DCD is set to ON during the execution of the +CMGS, +CMGW, +USOWR, +USODL AT commands requiring input data from the DTE: the DCD line is set to the ON state as soon as the switch to binary/text input mode is completed and the prompt is issued; DCD line is set to OFF as soon as the input mode is interrupted or completed (for more details see the u-blox AT Commands Manual [3]).   The DCD line is kept in the ON state, even during the online command mode6, to indicate that the data call is still established even if suspended, while if the module enters command mode6, the DSR line is set to the OFF state. For more details see DSR signal behavior description.   For scenarios when the DCD line setting is requested for different reasons (e.g. SMS texting during online command  mode6),  the  DCD  line  changes  to  guarantee  the  correct  behavior  for  all  the  scenarios.  For example, in case of SMS texting in online command mode6, if the data call is released, DCD is kept ON till the SMS command execution is completed (even if the data call release would request DCD set OFF).   If AT&C0 is set, the DCD module output line is set by default to the ON state (low level) at UART initialization and is then always held in the ON state.                                                        6 For the definition of the interface data mode, command mode and online command mode see the u-blox AT Commands Manual [3]
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 48 of 158 RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization.  The RI output line can notify an SMS arrival. When the SMS arrives, the RI line switches from OFF to ON for 1 s (see Figure 21), if the feature is enabled by the proper AT command (see the u-blox AT Commands Manual [3], AT+CNMI command).   Figure 21: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. For SMS arrival, if several events coincidently occur or in quick succession each event independently triggers the RI line, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more than 1 s, so that:  RI line monitoring cannot be used by the DTE to determine the number of received SMSes.  For multiple events, the RI line cannot be used to discriminate the two events, but the DTE must rely on the subsequent URCs and interrogate the DCE with the proper commands.  1.9.2.4 UART and power-saving  The power saving configuration is controlled by the AT+UPSV command (for the complete description,  see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters low power idle-mode whenever possible, and otherwise the active-mode is maintained by the module (see section  1.4 for definition and description of module operating modes referred to in this section). The AT+UPSV command configures both the module power saving and also the UART behavior in relation to the power saving. The  conditions for  the  module entering  low power idle-mode  also  depend  on the UART power saving configuration, as the module does not enter the low power idle-mode according to any required activity related to the network (within or outside an active call) or any other required concurrent activity related to the functions and interfaces of the module, including the UART interface.  The AT+UPSV command can set these different power saving configurations:  AT+UPSV=0, power saving disabled (default configuration)   AT+UPSV=1, power saving enabled cyclically   AT+UPSV=2, power saving enabled and controlled by the UART RTS input line  AT+UPSV=3, power saving enabled and controlled by the UART DTR input line  The different power saving configurations that can be set by the +UPSV AT command are described in details in the  following  subsections.  Table  12  summarizes  the  UART  interface  communication  process  in  the  different power saving configurations, in relation with the hardware flow control settings and the RTS input line status. For more details on the +UPSV AT command description, see u-blox AT commands Manual [3]. SMS arrives time [s] 0 RI ON RI OFF 1s time [s] 0 RI ON RI OFF 1s
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 49 of 158  AT+UPSV HW flow control RTS line DTR line Communication during idle-mode and wake up  0 Enabled (AT&K3) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 0 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 0 Disabled (AT&K0) ON or OFF ON or OFF Data sent by the DTE is correctly received by the module.  Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise the data is lost. 1 Enabled (AT&K3) ON ON or OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is correctly received by the DTE. 1 Enabled (AT&K3) OFF ON or OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON or OFF ON or OFF The first character sent by the DTE is lost by the module, but after ~5 ms the UART and the module are woken up: recognition of subsequent characters is guaranteed only after the UART / module complete wake-up (i.e. after ~5 ms). Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise the data is lost. 2 Enabled (AT&K3) ON or OFF ON or OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON ON or OFF Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 2 Disabled (AT&K0) OFF ON or OFF The first character sent by the DTE is lost by the module, but after ~5 ms the UART and the module are woken up. Recognition of subsequent characters is guaranteed only after the UART / module complete wake-up (i.e. after ~5 ms). Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 3 Enabled (AT&K3) ON ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) ON OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is correctly received by the DTE. 3 Enabled (AT&K3) OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Enabled (AT&K3) OFF OFF Data sent by the DTE is buffered by the DTE and will be correctly received by the module when it is ready to receive data (when the UART is enabled). Data sent by the module is buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 3 Disabled (AT&K0) ON or OFF ON Data sent by the DTE is correctly received by the module. Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. 3 Disabled (AT&K0) ON or OFF OFF The first character sent by the DTE is lost by the module, but after ~5 ms the UART and the module are woken up. Recognition of subsequent characters is guaranteed only after the UART / module complete wake-up (i.e. after ~5 ms). Data sent by the module is correctly received by the DTE if it is ready to receive data, otherwise data is lost. Table 12: UART and power-saving summary
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 50 of 158 AT+UPSV=0: power saving disabled, fixed active-mode The  module  does  not  enter  low  power  idle-mode  and  the  UART  interface  is  enabled  (data  can  be  sent  and received): the CTS line is always held in the ON state after UART initialization. This is the default configuration.  AT+UPSV=1: power saving enabled, cyclic idle/active-mode When the AT+UPSV=1 command is issued by the DTE, then the UART is immediately disabled by the module.  Afterwards, the UART is enabled again, and the module does not enter low power idle-mode, as following:   Periodically, during each paging reception (see section 1.5.1.5), to temporarily receive or send data over the UART, e.g. data buffered by the DTE with HW flow control enabled will be correctly received by the module  If the module needs to transmit some data over the UART (e.g. URC), the UART is temporarily enabled   If a data call with external context is activated, the UART is kept enabled  If the DTE send data with HW flow control disabled,  the  first character sent causes the  UART and module wake-up after ~5 ms: recognition of subsequent characters is guaranteed only after the complete wake-up (see the following subsection “wake up via data reception”)  The module automatically enters  the low power idle-mode whenever  possible but it wakes up  to active-mode according to the UART periodic wake up so that the module cyclically enters the low power idle-mode and the active-mode. Additionally, the module wakes up to active-mode according to any required activity related to the network (e.g. for the periodic paging reception described in section 1.5.1.5, or for any other required RF Tx / Rx) or any other required activity related to module functions / interfaces (including the UART itself).   When  the  UART  interface  is  enabled,  data  can  be  received.  When  a  character  is  received,  it  forces  the  UART interface to stay enabled for a longer time and it forces the module to stay in the active-mode for a longer time, according to the timeout configured by the second parameter of the +UPSV AT command. The timeout can be set from 40 2G-frames (i.e. 40 x 4.615 ms = 184 ms) up to 65000 2G-frames (i.e. 65000 x 4.615 ms = 300 s). Default value is 2000 2G-frames (i.e. 2000 x 4.615 ms = 9.2 s). Every subsequent character received during the active-mode, resets and restarts the timer; hence the active-mode duration can be extended indefinitely. The hardware flow-control output (CTS line) indicates when the UART interface is enabled (data can be sent and received), as illustrated in Figure 22. time [s]UART disabled~ 20 msUART enabled~9.2 s (default)UART enabledData inputCTS ONCTS OFF2G: 0.45-2.10 s    3G: 0.62-5.10 s LTE: 0.30-2.52 s Figure 22: CTS output pin indicates when module’s UART is enabled (CTS = ON = low level) or disabled (CTS = OFF = high level)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 51 of 158 AT+UPSV=2: power saving enabled and controlled by the RTS line This configuration can only be enabled with the module hardware flow control disabled (i.e. AT&K0 setting). The UART interface is immediately disabled after the DTE sets the RTS line to OFF. Afterwards, the UART is enabled again, and the module does not enter low power idle-mode, as following:   If an OFF-to-ON transition occurs on the RTS input line, this causes the UART / module wake-up after ~5 ms: recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART is kept enabled as long as the RTS input line is set to ON.  If the module needs to transmit some data over the UART (e.g. URC)   If a data call with external context is activated  If  the  DTE  sends  data,  the  first  character  sent  causes  the  UART  and  module  wake-up  after  ~5  ms:  the recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART will be then kept enabled after the last data received according to the timeout previously set with the AT+UPSV=1 configuration (see the following subsection “wake up via data reception”) The module automatically enters  the low power idle-mode whenever  possible but it wakes up  to active-mode according  to  any  required  activity  related  to  the  network  (e.g.  for  the  periodic  paging  reception  described  in section 1.5.1.5, or for any other required RF transmission / reception) or any other required activity related to the module functions / interfaces (including the UART itself).   The hardware flow-control output (CTS line) indicates when the UART interface is enabled (data can be sent and received) as illustrated in Figure 22, even if hardware flow control is disabled with AT+UPSV=2 configuration.  AT+UPSV=3: power saving enabled and controlled by the DTR line The UART interface is immediately disabled after the DTE sets the DTR line to OFF. Afterwards, the UART is enabled again, and the module does not enter low power idle-mode, as following:   If an OFF-to-ON transition occurs on the DTR input line, this causes the UART / module wake-up after ~5 ms: recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART is kept enabled as long as the DTR input line is set to ON  If the module needs to transmit some data over the UART (e.g. URC)   If a data call with external context is activated  If  the  DTE  sends  data,  the  first  character  sent  causes  the  UART  and  module  wake-up  after  ~5  ms: recognition of subsequent characters is guaranteed only after the complete wake-up, and the UART will be then kept enabled after the last data received according to the timeout previously set with the AT+UPSV=1 configuration (see the following subsection “wake up via data reception”) The module automatically enters  the low power idle-mode whenever  possible but it wakes up  to active-mode according  to  any  required  activity  related  to  the  network  (e.g.  for  the  periodic  paging  reception  described  in section  1.5.1.5,  or  for  any  other  required  RF  signal  transmission  or  reception)  or  any  other  required  activity related to the functions / interfaces of the module.  The AT+UPSV=3 configuration can be enabled regardless the flow control setting on UART. In particular, the HW flow control can be enabled (AT&K3) or disabled (AT&K0) on UART during this configuration.  In both cases, the CTS line indicates the UART power saving state as illustrated in Figure 22. When the AT+UPSV=3 configuration is enabled, the DTR input line can still be used by the DTE to control the module behavior according to AT&D command configuration (see u-blox AT commands Manual [3]).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 52 of 158 Wake up via data reception The  UART  wake  up  via  data  reception  consists  of  a  special  configuration  of  the  module  TXD  input  line  that causes the system wake-up when a low-to-high transition occurs on the TXD input line. In particular, the UART is enabled and the module switches from the low power idle-mode to active-mode within ~5 ms from the first character received: this is the system “wake up time”. As a consequence, the first character sent by the DTE when the UART is disabled (i.e. the wake up character) is not a valid communication character even if the wake up via data reception configuration is active, because it cannot be recognized, and the recognition of the subsequent characters is guaranteed only after the complete system wake-up (i.e. after ~5 ms).  The TXD input line is configured to wake up the system via data reception in the following cases:  AT+UPSV=1 is set with HW flow control disabled  AT+UPSV=2 is set with HW flow control disabled, and the RTS line is set OFF  AT+UPSV=3 is set with HW flow control disabled, and the DTR line is set OFF  Figure 23 and Figure 24 show examples of common scenarios and timing constraints:  AT+UPSV=1 power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000)  Hardware flow control is disabled  Figure 23 shows the case where the module UART is disabled and only a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE module UART is disabled when the timeout from last data received expires (2000 frames without data reception, as the default case). Wake up character        Not recognized by DCEOFFONDCE UART is enabled  for 2000 GSM frames (~9.2 s)time Wake up time: ~5 mstime TXD inputUARTOFFON Figure 23: Wake-up via data reception without further communication Figure  24  shows  the  case  where  in  addition  to  the  wake-up  character  further  (valid) characters  are  sent.  The wake up character wakes-up the module UART. The other characters must be sent after the “wake up time” of ~5 ms. If this condition is satisfied, the module (DCE) recognizes characters. The module will disable the UART after 2000 GSM frames from the latest data reception. Wake up character        Not recognized by DCEValid characters          Recognized by DCEDCE UART is enabled for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: ~5 mstime OFFONTXD inputUARTOFFON Figure 24: Wake-up via data reception with further communication
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 53 of 158   The “wake-up via data reception” feature cannot be disabled.  In command mode7, if autobauding is enabled and the DTE does not implement HW flow control, the DTE must  always  send  a  character  to  the  module  before  the  “AT”  prefix  set  at  the  beginning  of  each command line: the first character is ignored if the module is in active-mode, or it represents the wake-up character if the module is in idle-mode.  In  command  mode7,  the  DTE  should  always  send  a  dummy  “AT”  before  each  command  line:  the  first character is not ignored if the module is in active-mode (i.e. the module replies “OK”), or it represents the wake up character if the module is in low power idle-mode (i.e. the module does not reply).  No wake-up character or dummy “AT” is required from the DTE during a  data call with external context since  the  module  UART  interface  continues  to  be  enabled  and  does  not  need  to  be  woken-up. Furthermore in data mode7 a dummy “AT” would affect the data communication.  Additional considerations If the USB is connected and not suspended, the module is forced to stay in active-mode, therefore the AT+UPSV settings are overruled but they have effect on the UART behavior (they configure UART power saving, so that UART is enabled / disabled according to the AT+UPSV settings).  1.9.2.5 UART multiplexer protocol TOBY-L2 series modules include multiplexer functionality as per 3GPP TS 27.010 [10], on the UART physical link.  This  is  a  data  link  protocol  which  uses  HDLC-like  framing  and  operates  between  the  module  (DCE)  and  the application processor (DTE) and allows a number of simultaneous sessions over the used physical link (UART): the user can concurrently use AT interface on one MUX channel and data communication on another MUX channel.  The following virtual channels are defined (for more details, see Mux implementation Application Note [11]):  Channel 0: control channel  Channel 1 – 5: AT commands / data connection  Channel 6: GNSS tunneling (not supported by “00”, “01”, “50” product versions)  Channel 7: SIM Access Profile (SAP, not supported by “00”, “01”, “50” product versions)                                                        7 See the u-blox AT Commands Manual [3] for the definition of the interface data mode, command mode and online command mode.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 54 of 158 1.9.3 DDC (I2C) interface  The I2C bus compatible Display Data Channel interface is not available on the MPCI-L2 series modules, as AssistNow embedded  GNSS  positioning  aiding,  CellLocate® positioning  through  cellular information and custom functions over GPIOs for the integration with u-blox positioning chips / modules.  The I2C bus compatible Display  Data Channel interface is  not  supported by the TOBY-L2 series modules “00”, “01” and “50” product versions, as the AssistNow embedded GNSS positioning aiding, CellLocate® positioning through cellular information and custom functions over GPIOs for the integration with u-blox positioning chips / modules.  The SDA and SCL pins of TOBY-L2 series modules represent an I2C bus compatible Display Data Channel (DDC) interface for the communication with u-blox GNSS receivers and with other external I2C devices as audio codecs: an I2C master can communicate with more I2C slaves in accordance to the I2C bus specifications [12]. The DDC (I2C) interface is the only one interface dedicated for communication between u-blox cellular module and u-blox positioning receivers. The AT commands interface is not available on the DDC (I2C) interface. The DDC (I2C) interface pads of the module, serial data (SDA) and serial clock (SCL), are open drain output and external pull up resistors must be used conforming to the I2C bus specifications [12].  u-blox has implemented special features in the cellular modules to ease the design effort for the integration of a u-blox cellular module with a u-blox GNSS receiver (details in GNSS Implementation Application Note [13]). Combining a u-blox cellular module with a u-blox GNSS receiver allows designers to full access the GNSS receiver directly  via  the  cellular  module:  it  relays  control  messages  to  the  GNSS  receiver  via  a  dedicated  DDC  (I2C) interface. A 2nd interface connected to the GNSS receiver is not necessary: AT commands via the AT interfaces of the cellular module (UART, USB) allows a full control of the GNSS receiver from any host processor. u-blox cellular modules feature embedded GNSS aiding that is a set of specific features developed by u-blox to enhance  GNSS  performance,  decreasing  Time  To  First  Fix  (TTFF),  thus  allowing  to  calculate  the  position  in  a shorter time with higher accuracy.  Additional custom functions over GPIO pins are designed to improve the integration with u-blox GNSS receivers:  GNSS receiver power-on/off: “GNSS supply enable” function over the GPIO2 pin improves the positioning receiver power consumption. When the  GNSS functionality is not required, the positioning receiver can be completely switched off by the cellular module controlled by the application processor over AT commands  The wake up from idle-mode when the GNSS receiver is ready to send data: “GNSS data ready” function over the GPIO3 pin improves the cellular module power consumption. When power saving is enabled in the cellular  module  by  the  AT+UPSV  command  and  the  GNSS  receiver  does  not  send  data  by  the  DDC  (I2C) interface,  the  module  automatically  enters  idle-mode  whenever  possible.  With  the  “GNSS  data  ready” function the GNSS receiver can indicate to the cellular module that it is ready to send data: the positioning receiver can wake up the cellular module to avoid data loss even if power saving is enabled.  The  RTC  synchronization  signal  to  the  GNSS  receiver:  “GNSS  RTC  sharing”  function  over  the  GPIO4  pin improves GNSS receiver performance, decreasing the Time To First Fix (TTFF), and thus allowing to calculate the position in a shorter time with higher accuracy. When GNSS local aiding is enabled, the cellular module automatically  uploads  data  such  as position,  time,  ephemeris, almanac,  health and  ionospheric  parameter from the positioning receiver into its local memory, and restores this to the GNSS receiver at the next power up of the positioning receiver
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 55 of 158 1.9.4 Secure Digital Input Output interface (SDIO)  Secure Digital Input Output interface is not available on MPCI-L2 series modules.  Secure Digital Input Output interface is not supported by TOBY-L2 “00” and “01” product versions.  TOBY-L2  series modules include  a 4-bit Secure  Digital Input  Output  interface  (SDIO_D0,  SDIO_D1,  SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) designed to communicate with an external u-blox short range Wi-Fi module: the TOBY-L2 cellular module acts as an SDIO host controller which can communicate over the SDIO bus with a compatible u-blox short range Wi-Fi module acting as SDIO device. The SDIO interface is the only one interface  of TOBY-L2 series modules dedicated for communication between the u-blox cellular module and the u-blox short range Wi-Fi module. The AT commands interface is not available on the SDIO interface of TOBY-L2 series modules. The SDIO interface supports 50 MHz bus clock frequency, which allows a data throughput of 200 Mb/s.  Combining a u-blox cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not necessary. AT commands via the AT interfaces of the cellular module (UART, USB) allows a full control of the Wi-Fi module from any host processor, because Wi-Fi control messages are relayed to the Wi-Fi module via the dedicated SDIO interface (for more details, see the Wi-Fi AT commands in the u-blox AT Commands Manual [3]). u-blox has implemented special features in the cellular modules to ease the design effort for the integration of a u-blox cellular module with a u-blox short range Wi-Fi module to provide both Bridge and Router functionality (for more details, see the Wi-Fi / Cellular Integration Application Note [14]). Additional custom functions over GPIO pins are designed to improve the integration with u-blox Wi-Fi modules:  Wi-Fi enable  Switch-on / switch-off the Wi-Fi   Wi-Fi reset  Reset the Wi-Fi   Wi-Fi data ready  Cellular module wake-up when the Wi-Fi is ready for sending data over SDIO  Wi-Fi power saving  Enable/disable the low power mode of the Wi-Fi   32 kHz output  Clock for the Wi-Fi   26 MHz output  Clock for the Wi-Fi    GPIOs are not supported by TOBY-L2 “00”, “01”, and “50” product versions, except for:   Wireless  Wide  Area  Network  status  indication  configured  on  GPIO1  of  “00”,  “01”  product versions  Wi-Fi enable function configured on the GPIO1 of “50“ product version  GPIOs are not available on MPCI-L2 series modules.  1.10 Audio 1.10.1 Digital audio over I2S interface  Digital audio over I2S interface is not available on MPCI-L2 series modules.  Digital audio over I2S interface is not supported by TOBY-L2 modules ”00”, “01”, “50” product versions.  TOBY-L2 series modules include a 4-wire I2S digital audio interface (I2S_TXD, I2S_RXD, I2S_CLK, I2S_WA) that can be configured by AT command to transfer digital audio data with an external device as an audio codec (for more details see u-blox AT Commands Manual [3]).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 56 of 158 1.11 General Purpose Input/Output  GPIOs are not supported by TOBY-L2 series modules “00”, “01” and “50” product versions, except for:   Wireless  Wide  Area  Network  status  indication  configured  on  GPIO1  of  “00”,  “01”  product versions  Wi-Fi enable function configured on the GPIO1 of “50” product version  GPIOs are not available on MPCI-L2 series modules.  TOBY-L2  series  modules  include  14  pins  (GPIO1-GPIO6,  I2S_TXD,  I2S_RXD,  I2S_CLK,  I2S_WA,  DTR,  DSR, DCD, RI) that can be configured as General Purpose Input/Output or to provide custom functions via u-blox AT commands (see the u-blox AT Commands Manual [3]), as summarized in Table 13.  Function Description Default GPIO Configurable GPIOs Network status indication Network status: registered home network, registered roaming, data transmission, no service GPIO1 GPIO1 GNSS supply enable Enable/disable the supply of u-blox GNSS receiver connected to cellular module GPIO2 GPIO2 GNSS data ready Sense when u-blox GNSS receiver connected to the module is ready for sending data by the DDC (I2C) GPIO3 GPIO3 GNSS RTC sharing Real Time Clock synchronization signal to u-blox GNSS receiver connected to cellular module GPIO4 GPIO4 SIM card detection SIM card physical presence detection GPIO5 GPIO5 SIM card hot insertion/removal SIM card hot insertion/removal  -- GPIO5 I2S digital audio interface I2S digital audio interface I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA 26 MHz clock output 26 MHz clock output for an external audio codec or an external Wi-Fi chip/module GPIO6 GPIO6 Wi-Fi enable Enable/disable the supply of the external Wi-Fi chip or module connected to the cellular module -- GPIO1, GPIO4, DSR Wi-Fi data ready Sense when the external Wi-Fi chip/module connected to the cellular module is ready for sending data by the SDIO, waking up the cellular module from low power idle mode -- GPIO3, DTR Wi-Fi reset Reset the external Wi-Fi chip or module connected to the cellular module -- GPIO3, DCD Wi-Fi power saving Enable/disable the low power mode of the external Wi-Fi chip/module connected to the cellular module -- GPIO2, RI 32 kHz clock output 32 kHz clock output for an external Wi-Fi chip or module -- GPIO6 Antenna tuning 4-bit tunable antenna control signals mapping the actual operating RF band over a 4-pin interface provided for the implementation of external antenna tuning solutions -- I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA DSR, DTR, DCD, RI DSR UART data set ready output DSR DSR DTR UART data terminal ready input  DTR DTR DCD UART data carrier detect output DCD DCD RI UART ring indicator output RI RI General purpose input Input to sense high or low digital level -- All General purpose output Output to set the high or the low digital level -- All Pin disabled Tri-state with an internal active pull-down enabled -- All Table 13: TOBY-L2 series GPIO custom functions configuration
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 57 of 158 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)  Mini PCI Express specific signals (W_DISABLE#, LED_WWAN#) are not available on TOBY-L2 series.  MPCI-L2  series  modules  include  the  W_DISABLE#  active-low  input  signal  to  disable  the  radio  operations  as specified by the PCI Express Mini Card Electromechanical Specification [15]. As described in Figure 25, the W_DISABLE# input is equipped with an internal pull-up to the 3.3Vaux supply. The W_DISABLE# input detailed electrical characteristics are described in the MPCI-L2 series Data Sheet [2].  Baseband Processor20W_DISABLE#MPCI-L2 series3.3VauxW_DISABLE#22k Figure 25: MPCI-L2 series modules W_DISABLE# input circuit description  MPCI-L2 series modules include the  LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [15].   For more electrical characteristics details see the MPCI-L2 Data Sheet [2].   1.13 Reserved pins (RSVD)  Pins reserved for future use, marked as RSVD, are not available on MPCI-L2 series.  TOBY-L2 series modules have pins reserved for future use, marked as RSVD: they can all be left unconnected on the application board, except the RSVD pin number 6 that must be externally connected to ground.   1.14 Not connected pins (NC)  Pins internally not connected, marked as NC, are not available on TOBY-L2 series.  MPCI-L2 series modules have pins internally not connected, marked as NC: they can be left unconnected or they can be connected on the application board according to any application requirement, given that none function is provided by the modules over these pins.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 58 of 158 1.15 System features 1.15.1 Network indication  Network  status  indication  over  GPIO1  is  not  available  on  MPCI-L2  series  modules  which  include  the LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [15].  GPIOs are not supported by TOBY-L2 modules “00”, “01”, “50” product versions, but the Wireless Wide Area Network status indication is by default configured on the GPIO1 of “00”, “01” product version.  The GPIO1 can be configured by the AT+UGPIOC command (for further details see the u-blox AT Commands Manual [3]), to indicate network status as described below:  No service (no network coverage or not registered)  Registered 2G / 3G / LTE home network  Registered 2G / 3G / LTE visitor network (roaming)  Call enabled (RF data transmission / reception)  1.15.2 Antenna supervisor  Antenna supervisor (i.e. antenna detection) is not available on MPCI-L2 series.  Antenna supervisor (i.e. antenna detection) is not supported by TOBY-L2 series modules “00”, “01” and “50” product versions.  The  antenna  detection function provided  by  the  ANT_DET  pin  is  based on an  ADC  measurement  as  optional feature that can be implemented if the application requires it. The antenna  supervisor is forced by the +UANTR AT command (see the u-blox AT Commands Manual [3] for more details). The requirements to achieve antenna detection functionality are the following:  an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used  an antenna detection circuit must be implemented on the application board See  section  1.7.2  for  detailed  antenna  detection  interface  functional  description  and  see  section  2.4.2  for detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines.  1.15.3 Jamming detection  Congestion detection (i.e. jamming detection) is not supported by “00”, “01” and “50” product versions.  In  real  network  situations  modules  can  experience  various  kind  of  out-of-coverage  conditions:  limited  service conditions  when  roaming  to  networks  not  supporting  the  specific  SIM,  limited  service  in  cells  which  are  not suitable or barred due to operators’ choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operator’s carriers entitled to give access to the LTE/3G/2G service. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command: the feature  consists  of  detecting  an  anomalous  source  of  interference  and  signaling  the  start  and  stop  of  such conditions to the host application processor with an unsolicited indication, which can react appropriately by e.g. switching off the radio transceiver of the module (i.e. configuring the module in “airplane mode” by means of the +CFUN AT command) in order to reduce power consumption and monitoring the environment at constant periods (for more details see the u-blox AT Commands Manual [3]).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 59 of 158 1.15.4 IP modes of operation IP modes of operation refer to the TOBY-L2 and MPCI-L2 series modules configuration related to the network IP termination and network interfaces settings in general. IP modes of operation are the following:  Bridge  mode:  In  bridge  mode  the  module  acts  as  a  cellular  modem  dongle  connected  to  the  host  over serial interface. The IP termination of the network is placed on the host IP stack. The module is configured as a bridge which means the network IP address is assigned to the host (host IP termination).   Router mode: In router mode the module acts as a cellular modem router which means the IP termination of the network is placed on the internal IP stack of the module (on-target IP termination). In particular, in this  configuration the  application  processor  belongs to  a  private  network and  is  not  aware  of  the  mobile connectivity setup of the module. For more details about IP modes of operation see the u-blox AT Commands Manual [3].  1.15.5 Dual stack IPv4/IPv6 TOBY-L2 and MPCI-L2 series support both Internet Protocol version 4 and Internet Protocol version 6 in parallel. For more details about dual stack IPv4/IPv6 see the u-blox AT Commands Manual [3].  1.15.6 TCP/IP and UDP/IP  Embedded TCP/IP and UDP/IP stack as well as Direct Link mode are not supported by the “00” and “50” product versions.  TOBY-L2 and MPCI-L2 series modules provide embedded TCP/IP and UDP/IP protocol stack: a PDP context can be configured, established and handled via the data connection management packet switched data commands.  TOBY-L2  and  MPCI-L2  series  modules  provide  Direct  Link  mode  to  establish  a  transparent  end-to-end communication  with an  already  connected  TCP  or UDP  socket via  serial  interfaces (USB,  UART).  In  Direct  Link mode, data sent to the serial interface from an external application processor is forwarded  to the network and vice-versa. For more details about embedded TCP/IP and UDP/IP functionalities see the u-blox AT Commands Manual [3].  1.15.7 FTP   Embedded FTP services as well as Direct Link mode are not supported by “00” and “50” product versions.  TOBY-L2 and MPCI-L2 series provide embedded File Transfer Protocol (FTP) services. Files are read and stored in the local file system of the module. FTP files can also be transferred using FTP Direct Link:  FTP download: data coming from the FTP server is forwarded to the host processor via USB / UART serial interfaces (for FTP without Direct Link mode the data is always stored in the module’s Flash File System)  FTP  upload: data coming from the host processor via USB / UART serial interface is forwarded to the FTP server (for FTP without Direct Link mode the data is read from the module’s Flash File System) When Direct Link is used for a FTP file transfer, only the file content pass through  USB / UART serial interface, whereas all the FTP commands handling is managed internally by the FTP application. For more details about embedded FTP functionalities see u-blox AT Commands Manual [3].
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 60 of 158 1.15.8 HTTP   Embedded HTTP services are not supported by “00” and “50” product versions.  TOBY-L2 and MPCI-L2 series modules provide the embedded Hyper-Text Transfer Protocol (HTTP) services via AT commands for sending requests to a remote HTTP server, receiving the server response and transparently storing it in the module’s Flash File System (FFS).  For more details about embedded HTTP functionalities see the u-blox AT Commands Manual [3].  1.15.9 SSL  Embedded Transport Layer Security (TLS) / Secure Sockets Layer (SSL) protocols are not supported by the “00”, “01” and “50” product versions.  TOBY-L2  and  MPCI-L2  series  modules  provide  the  Transport  Layer  Security  (TLS)  /  Secure  Sockets  Layer  (SSL) encryption protocols to enable security over the FTP and HTTP protocols via AT commands, implementing Secure File Transfer Protocol (FTPS, i.e. FTP with TLS / SSL encryption) and Secure Hyper-Text Transfer Protocol (HTTPS, i.e. HTTP with TLS / SSL encryption) services.  For more details about embedded TLS / SSL functionalities see the u-blox AT Commands Manual [3].  1.15.10 AssistNow clients and GNSS integration  AssistNow clients and u-blox GNSS receiver integration are not available on the MPCI-L2 series modules.  AssistNow clients and u-blox GNSS receiver integration are not supported by the TOBY-L2 series modules “00”, “01” and “50” product versions.  For customers using u-blox GNSS receivers, TOBY-L2 series cellular modules feature embedded AssistNow clients. AssistNow A-GPS provides better GNSS performance and faster Time-To-First-Fix. The clients can be enabled and disabled with an AT command (see the u-blox AT Commands Manual [3]). TOBY-L2  series  cellular  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no additional requirements for resources or software integration on an external host micro controller. Full access to u-blox GNSS receivers is available via the TOBY-L2 series cellular module, through the DDC (I2C) interface, while the available GPIOs can handle the positioning chipset / module power-on/off. This means that cellular module and GNSS receiver can be controlled through a single serial port from any host processor.  1.15.11 Hybrid positioning and CellLocate®  Hybrid positioning and CellLocate® are not available on MPCI-L2 series.  Hybrid  positioning  and  CellLocate®  are  not  supported  by  the  TOBY-L2  series  modules  “00”,  “01” and “50” product versions.  Although GNSS is a widespread technology, its reliance on the visibility of extremely weak GNSS satellite signals means that positioning is not always possible. Especially difficult environments for GNSS are indoors, in enclosed or underground  parking garages, as well  as  in  urban  canyons  where  GNSS signals  are  blocked  or  jammed  by multipath interference. The situation can be improved by augmenting GNSS receiver data with cellular network information to provide positioning information even when GNSS reception is degraded or absent. This additional information can benefit numerous applications.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 61 of 158  Positioning through cellular information: CellLocate® u-blox CellLocate® enables the estimation of device position based on the parameters of the mobile network cells visible to the specific device. To estimate its position the u-blox cellular module sends the CellLocate® server the parameters  of  network  cells  visible  to  it  using  a  UDP  connection.  In  return  the  server  provides  the  estimated position based on the CellLocate® database. The u-blox cellular  module can either  send the parameters of the visible home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators (deep scan).  The CellLocate® database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:  1. Several devices reported their position to the CellLocate® server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A)    2. CellLocate® server defines the area of Cell A visibility
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 62 of 158 3. If a new device reports the observation of Cell A CellLocate® is able to provide the estimated position from the area of visibility    4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility.    CellLocate® is implemented using a set of two AT commands that allow configuration of the CellLocate® service (AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy.   The accuracy of the position estimated by CellLocate® depends on the availability of historical observations in the specific area.  Hybrid positioning With  u-blox  Hybrid  positioning  technology,  u-blox  cellular  devices  can  be  triggered  to  provide  their  current position using either a u-blox GNSS receiver or the position estimated from CellLocate®. The choice depends on which positioning method provides the best and fastest solution according to the user configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid positioning  is implemented through a set of three AT commands that allow configuration of the GNSS receiver (AT+ULOCGNSS), configuration of the CellLocate® service (AT+ULOCCELL), and requesting the position according  to  the  user  configuration  (AT+ULOC).  The  answer  is  provided  in  the  form  of  an  unsolicited  AT command  including  latitude,  longitude  and  estimated  accuracy  (if  the  position  has  been  estimated  by CellLocate®), and additional parameters if the position has been computed by the GNSS receiver. The  configuration  of  mobile  network  cells  does  not  remain  static  (e.g.  new  cells  are  continuously  added  or existing cells are reconfigured by the network operators). For this reason, when a Hybrid positioning method has been  triggered  and  the  GNSS  receiver  calculates  the  position,  a  database  self-learning  mechanism  has  been implemented so that these positions are sent to the server to update the database and maintain its accuracy.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 63 of 158 The use of hybrid positioning requires  a connection via the DDC (I2C) bus between the TOBY-L2 series cellular module and the u-blox GNSS receiver (see sections 1.9.3 and 2.6.3). See GNSS Implementation Application Note [13] for the complete description of the feature.   u-blox  is  extremely  mindful  of  user  privacy.  When  a  position  is  sent  to  the  CellLocate®  server  u-blox  is unable to track the SIM used or the specific device.  1.15.12 Wi-Fi integration  u-blox short range communication Wi-Fi modules integration is not available for MPCI-L2 series modules.  u-blox  short  range  communication  Wi-Fi  modules  integration  is  not  supported  by  the  TOBY-L2  series modules “00” and “01” product versions.  Full access to u-blox short range communication Wi-Fi modules is available through a dedicated SDIO interface (see sections 1.9.4 and 2.6.4). This means that combining a TOBY-L2 series cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not necessary.  AT commands via the AT interfaces of the cellular module (UART, USB) allows a full control of the Wi-Fi module from any host processor, because Wi-Fi control messages are relayed to the Wi-Fi module via the dedicated SDIO interface (for more details, see the Wi-Fi AT commands in the u-blox AT Commands Manual [3]). All the management software for Wi-Fi module operations runs inside the cellular module in addition to those required for cellular-only operation: Wi-Fi driver, Web User Interface (WebUI), Connection Config Manager. For more details, see the Wi-Fi / Cellular Integration Application Note [14].  1.15.13 Firmware update Over AT (FOAT) This feature allows upgrading the module firmware over USB / UART serial interfaces, using AT commands.  The +UFWUPD AT command triggers a reboot followed by the upgrade procedure at specified a baud rate  A special boot loader on the module performs firmware installation, security verifications and module reboot  Firmware authenticity verification is performed via a security signature during the download. The firmware is then  installed,  overwriting  the  current  version.  In  case  of  power  loss  during  this  phase,  the  boot  loader detects a fault at the next wake-up, and restarts the firmware download. After completing the upgrade, the module is reset again and wakes-up in normal boot For more details about Firmware update Over AT procedure  see the Firmware Update Application Note [4] and the u-blox AT Commands Manual [3], +UFWUPD AT command.  1.15.14 Firmware update Over The Air (FOTA)  Firmware update Over The Air (FOTA) is not supported by “00” and “50” product versions.  This feature allows upgrading the module firmware over the LTE/3G/2G air interface.  In order to reduce the amount of data to be transmitted over the air, the implemented FOTA feature requires downloading only a “delta file” instead of the full firmware. The delta file contains only the differences between the two firmware versions (old and new), and is compressed. The firmware update procedure can be triggered using dedicated AT command with the delta file stored in the module file system via over the air FTP. For more details about Firmware update Over The Air procedure  see the Firmware Update Application Note [4] and the u-blox AT Commands Manual [3], +UFWINSTALL AT command.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 64 of 158 1.15.15 In-band Modem (eCall / ERA-GLONASS)  In-band  modem  for  eCall  /  ERA-GLONASS  emergency  applications  is  not  supported  by  TOBY-L2  series modules “00”, “01”, and “50” product versions and by MPCI-L2 series modules.  In-band  Modem  solution  for  eCall  and  ERA-GLONASS  emergency  call  applications  over  cellular  networks  is implemented according to 3GPP TS 26.267 [16], BS EN 16062:2011 [17] and ETSI TS 122 101 [18] specifications. eCall  (European)  and  ERA-GLONASS  (Russian)  are  initiatives  to  combine  mobile  communications  and  satellite positioning  to  provide  rapid  assistance  to  motorists  in  the  event  of  a  collision,  implementing  automated emergency response system based the first on GPS the latter on GLONASS positioning system. When activated, the in-vehicle systems (IVS) automatically initiate an emergency call carrying both voice and data (including  location  data)  directly  to  the  nearest  Public  Safety  Answering  Point  (PSAP)  to  determine  whether rescue services should be dispatched to the known position.   Figure 26: eCall and ERA-GLONASS automated emergency response systems diagram flow For more details regarding the In-band Modem solution for the European eCall and the Russian ERA-GLONASS emergency call applications, see the u-blox eCall / ERA-GLONASS Application Note [19].  1.15.16 SIM Access Profile (SAP)  SIM Access Profile (SAP) is not supported by TOBY-L2 “00”, “01”, and “50” product versions or by MPCI-L2 series modules.  SIM access profile (SAP) feature allows accessing and using a remote SIM card / chipping instead of the local SIM directly connected to the module SIM interface. A dedicated SAP channel  over USB  and a dedicated  multiplexed SAP channel over  UART  are implemented  for communication with the remote SIM card/chip. Communication  between TOBY-L2  series  module  and  the remote SIM is conformed to  client-server  paradigm: The module is the SAP client establishing a connection and performing data exchange to a SAP server directly connected to the remote SIM that is used  by the  module for LTE/3G/2G network-related  operations.  The  SAP communication protocol is based on the SIM Access Profile Interoperability Specification [20]. A typical application using the SAP feature is the scenario where a device such as an embedded car-phone with an integrated TOBY-L2 series module uses a remote SIM included in an external user device (e.g. a simple SIM card reader or a portable phone), which is brought into the car. The car-phone accesses the LTE/3G/2G network using the remote SIM in the external device.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 65 of 158 TOBY-L2  series  modules,  acting  as  an  SAP  client,  can  be  connected  to  an  SAP  server  by  a  completely  wired connection, as shown in Figure 27.  Device including TOBY-L2LTE/3G/2G InterfaceLocal SIM(optional)TOBY-L2SAP ClientApplicationProcessorDevice including SIMSAP                   Serial InterfaceRemote SIMMobileEquipmentSAP ServerSAP              Serial Interface(SAP channel over USB or UART) Figure 27: Remote SIM access via completely wired connection As stated in the SIM Access Profile Interoperability Specification [20], the SAP client can be connected to the SAP server by means of a Bluetooth wireless link, using additional Bluetooth transceivers. In this case, the application processor  wired  to  TOBY-L2  series  module  establishes  and  controls  the  Bluetooth  connection  using  the  SAP profile, and routes  data  received  over  a serial  interface channel to data  transferred over  a  Bluetooth  interface and vice versa, as shown in Figure 28.  Device including TOBY-L2SAP              Serial Interface(SAP channel over USB or UART)LTE/3G/2G InterfaceLocal SIM(optional)TOBY-L2SAP ClientApplicationProcessorSAP  Bluetooth InterfaceBluetoothTransceiverDevice including SIMRemote SIMMobileEquipmentSAP ServerBluetoothTransceiver Figure 28: Remote SIM access via Bluetooth and wired connection The application processor can start an SAP connection negotiation between  TOBY-L2 series  module SAP client and an SAP server using custom AT command (for more details see u-blox AT Commands Manual [3]). While  the  connection  with  the  SAP  server  is  not  fully  established,  the  TOBY-L2  series  module  continues  to operate with the attached (local) SIM, if present. Once the connection is established and negotiated, the module performs a detach operation from the local SIM followed by an attach operation to the remote one. Then the remotely attached SIM is used for any LTE/3G/2G network operation. URC indications are provided to inform the user about the state of both the local and remote SIM. The insertion and the removal of the local SIM card are notified if a proper card presence detection circuit using the GPIO5 of TOBY-L2  series modules is implemented as shown  in  section 2.5, and  if  the  related “SIM card detection” and “SIM hot insertion/removal” functions described in section 1.8.2 are enabled by AT commands (for more details see u-blox AT Commands Manual [3]). Upon SAP deactivation, the TOBY-L2 series modules perform a detach operation from the remote SIM followed by an attach operation to the local one, if present.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 66 of 158 1.15.17 Smart temperature management  Smart temperature management is not supported by “00”, “01”, and “50” product versions.  Cellular modules – independent of the specific model – always have a well defined operating temperature range. This range should be respected to guarantee full device functionality and long life span. Nevertheless  there  are  environmental  conditions  that  can  affect  operating  temperature,  e.g.  if  the  device  is located near a heating/cooling source, if there is/isn’t air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security  mechanism  embedded  into  the  module  is  a  good  solution  to  prevent  operation  of  the  device outside of the specified range.  Smart Temperature Supervisor (STS) The  Smart  Temperature  Supervisor  is  activated  and  configured  by  a  dedicated  AT+USTS  command.  See  the u-blox AT Commands Manual [3] for more details. The cellular module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range.   Temperature measurement is done inside the cellular module: the measured value could be different from the environmental temperature (Ta). Warningareat-1 t+1 t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea Figure 29: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 29) named t-2, t-1, t+1 and t+2.  Within the first limit, (t-1 < Ti < t+1), the cellular module is in the normal working range, the Safe Area  In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the cellular module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition  Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and  represents  a  dangerous  working  condition.  This  condition  is  indicated  and  the  device  shuts  down  to avoid damage   For security  reasons  the  shutdown  is  suspended  in case  an  emergency  call in  progress.  In this  case the device will switch off at call termination.  The user can decide at anytime to enable/disable the Smart Temperature Supervisor feature. If the feature is disabled there is no embedded protection against disallowed temperature conditions.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 67 of 158 Figure 30 shows the flow diagram implemented for the Smart Temperature Supervisor.  IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)Wait emergencycall terminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is  within normal operating rangeYesTempetature  is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled in  indication only mode:no  further actionsSend notification (safe)Previously outside of Safe AreaTempetature  is back to safe areaNoNo furtheractionsYes Figure 30: Smart Temperature Supervisor (STS) flow diagram
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  System description     Page 68 of 158 Threshold Definitions When the application of  cellular module operates at extreme temperatures with Smart Temperature Supervisor enabled, the user should note that outside the valid temperature range the device will automatically shut down as described above. The  input  for  the algorithm  is  always  the temperature  measured within  the  cellular  module (Ti,  internal). This value can be higher than the working ambient temperature (Ta, ambient), as (for example) during transmission at  maximum  power  a  significant  fraction  of  DC  input  power  is  dissipated  as  heat  This  behavior  is  partially compensated  by  the  definition  of  the  upper  shutdown  threshold  (t+2)  that  is  slightly  higher  than  the  declared environmental temperature limit.   The sensor measures board temperature inside the shields, which can differ from ambient temperature.  1.15.18 Power saving The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (for the complete description of the AT+UPSV command, see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters the  low power idle-mode whenever possible, reducing current consumption (see section 1.5.1.5, TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2]). During  the  low  power  idle-mode,  the  module  is  not  ready  to  communicate  with  an  external  device,  as  it  is configured to reduce power consumption. The module wakes up from low power idle-mode to active-mode in the following events:  Automatic periodic monitoring of the paging channel for the reception of the paging block sent by the base station according to network conditions (see section 1.5.1.5)  The connected USB host forces a remote wakeup of the module as USB device (see section 1.9.1.4)  Automatic periodic enable of the UART interface to receive / send data, with AT+UPSV=1 (see 1.9.2.4)  Data received on UART interface, with HW flow control disabled and AT+UPSV=1 (see 1.9.2.4)  RTS input set ON by the host DTE, with HW flow control disabled and AT+UPSV=2 (see 1.9.2.4)  DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.2.4)  The connected SDIO device forces a wakeup of the module as SDIO host (see 1.9.4)  A preset RTC alarm occurs (see u-blox AT Commands Manual [3], AT+CALA)  For the definition and the description of TOBY-L2 and MPCI-L2 series modules operating modes, including the events forcing transitions between the different operating modes, see the section 1.4.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 69 of 158 2 Design-in 2.1 Overview For  an  optimal  integration  of  TOBY-L2  and  MPCI-L2  series  modules  in  the  final  application  board  follow  the design guidelines stated in this section. Every  application  circuit  must  be  properly  designed  to  guarantee  the  correct  functionality  of  the  relative interface, however a number of points require high attention during the design of the application device.  The following list provides a rank of importance in the application design, starting from the highest relevance:  1. Module antenna connection: ANT1, ANT2 and ANT_DET. Antenna circuit directly affects the RF compliance  of the device integrating  a TOBY-L2 and MPCI-L2 series module with applicable certification schemes. Very carefully follow the suggestions provided in the relative section 2.4 for schematic and layout design. 2. Module supply: VCC or 3.3Vaux and GND pins.  The supply circuit affects the RF compliance of the device integrating a TOBY-L2 and MPCI-L2 series module with  applicable  required  certification  schemes  as  well  as  antenna  circuit  design.  Very  carefully  follow  the suggestions provided in the relative section 2.2.1 for schematic and layout design.  3. USB interface: USB_D+, USB_D- pins.  Accurate  design  is  required  to  guarantee  USB  2.0  high-speed  interface  functionality.  Carefully  follow  the suggestions provided in the relative section 2.6.1 for schematic and layout design. 4. SIM interface: VSIM, SIM_CLK, SIM_IO, SIM_RST or UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET pins. Accurate design is required to guarantee SIM card functionality reducing the risk of RF coupling. Carefully follow the suggestions provided in the relative section 2.5 for schematic and layout design. 5. SDIO interface: SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD pins.  Accurate  design  is  required  to  guarantee  SDIO  interface  functionality.  Carefully  follow  the  suggestions provided in the relative section 2.6.4 for schematic and layout design. 6. System functions: RESET_N or PERST#, PWR_ON pins. Accurate design  is required  to guarantee  that  the  voltage  level  is  well  defined  during  operation. Carefully follow the suggestions provided in the relative section 2.3 for schematic and layout design.  7. Other supplies: V_BCKP RTC supply and V_INT generic digital interfaces supply. Accurate  design  is  required  to  guarantee  proper  functionality.  Follow  the  suggestions  provided  in  the corresponding sections 2.2.2 and 2.2.3 for schematic and layout design. 8. Other digital interfaces: UART, I2C, I2S, Host Select, GPIOs, Mini PCIe specific signals and Reserved pins. Accurate design is required to guarantee  proper functionality. Follow the suggestions provided  in sections 2.6.2, 2.6.3, 2.7.1, 2.3.3, 2.8, 2.9 and 2.10 for schematic and layout design.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 70 of 158 2.2 Supply interfaces 2.2.1 Module supply (VCC or 3.3Vaux) 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design VCC  or  3.3Vaux  pins  are  internally  connected.  Application  design  shall  connect  all  the  available  pads  to  the external supply to minimize the power loss due to series resistance. GND pins are internally connected. Application design shall connect all the available pads to solid ground on the application board,  since  a good (low  impedance)  connection to external  ground can minimize power  loss and improve RF and thermal performance.  TOBY-L2 and MPCI-L2 series modules must be sourced through the VCC or the 3.3Vaux pins with a proper DC power  supply  that  should  meet  the  following  prerequisites  to  comply  with  the  modules’ VCC  or  3.3Vaux requirements summarized in Table 7. The proper DC power supply can be selected according to the application requirements (see Figure 31) between the different possible supply sources types, which most common ones are the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery, for TOBY-L2 series only  Primary (disposable) battery, for TOBY-L2 series only  Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage > 5V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 31: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the operating supply voltage of TOBY-L2 and MPCI-L2 series. The  use  of  switching  step-down  provides  the  best  power  efficiency  for  the  overall  application  and  minimizes current drawn from the main supply source. See 2.2.1.2, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. The use of an LDO linear regulator becomes convenient for  a primary supply with a relatively low voltage (e.g. less or equal than 5 V). In this case the typical 90% efficiency of the switching regulator diminishes the benefit of  voltage  step-down  and  no  true  advantage  is  gained  in  input  current  savings.  On  the  opposite  side,  linear regulators are not recommended for high voltage step-down as they dissipate a considerable amount of energy in thermal power. See 2.2.1.3, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. If TOBY-L2 modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected to VCC is the usual choice for battery-powered devices. During charging, batteries with Ni-MH chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. See 2.2.1.4, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. Keep  in  mind  that  the  use  of  rechargeable  batteries  requires  the  implementation  of  a  suitable  charger  circuit which is not  included  in the modules. The charger  circuit has to be  designed to  prevent  over-voltage on  VCC pins  of  the  module,  and  it  should  be  selected  according  to  the  application  requirements:  a  DC/DC  switching
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 71 of 158 charger  is  the  typical  choice  when  the  charging  source  has  an  high  nominal  voltage  (e.g.  ~12  V),  whereas  a linear charger is the typical choice when the charging source has a relatively low nominal voltage (~5 V). If both a permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at the same time in the application as possible supply source, then a proper charger / regulator with integrated  power path  management  function can  be  selected  to  supply  the  module  while  simultaneously and independently charging the battery. See 2.2.1.7, 2.2.1.8 and 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. The use of a primary (not rechargeable) battery is in general uncommon, but appropriate parts can be selected given that the most cells available are seldom capable of delivering the maximum current specified in  TOBY-L2 series Data Sheet [1] during connected-mode. Carefully evaluate the usage of super-capacitors as supply source since aging and temperature conditions significantly affect the actual capacitor characteristics. See 2.2.1.5 and 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. Rechargeable  3-cell Li-Ion or Li-Pol and Ni-MH chemistry  batteries reach a maximum voltage  that  is above the maximum  rating  for  the  3.3Vaux  supply  of  MPCI-L2  modules,  and  should  therefore  be  avoided.  The  use  of rechargeable, not-rechargeable battery or super-capacitors is very uncommon for Mini PCI Express applications, so that these supply sources types are not considered for MPCI-L2 modules. The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply source characteristics, different DC supply systems can result as mutually exclusive.  The following sections highlight some design aspects for each of the supplies listed above providing application circuit design-in compliant with the module VCC requirements summarized in Table 7.  2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator The use of a switching regulator is suggested when the difference from the available supply rail to the VCC or the  3.3Vaux  value  is  high,  since  switching  regulators  provide  good  efficiency  transforming  a  12  V  or  greater voltage supply to the typical 3.8 V value of the VCC supply or the typical 3.3 V value of the 3.3Vaux supply. The  characteristics  of  the  switching  regulator  connected  to  VCC  or  3.3Vaux  pins  should  meet  the  following prerequisites to comply with the module VCC or 3.3Vaux requirements summarized in Table 7:  Power  capability:  the  switching  regulator with  its  output circuit  must  be capable  of  providing  a  voltage value to the VCC or 3.3Vaux pins within the specified operating range and must be capable of delivering to VCC  or  3.3Vaux  pins  the  maximum  peak  /  pulse  current  consumption  during  Tx  burst  at  maximum  Tx power specified in the TOBY-L2 series Data Sheet [1] or in the MPCI-L2 series Data Sheet [2].  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC or 3.3Vaux voltage profile.  High switching frequency: for best performance and for smaller applications it is recommended to select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be carefully evaluated since this can produce noise in the VCC or 3.3Vaux voltage profile and therefore negatively impact LTE/3G/2G modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output to VCC or 3.3Vaux supply pins can mitigate the ripple at the input of the module, but adds extra voltage drop due to resistive losses on series inductors.  PWM  mode  operation:  it  is  preferable  to  select  regulators  with  Pulse  Width  Modulation  (PWM)  mode. While in connected-mode,  the  Pulse  Frequency Modulation  (PFM)  mode and PFM/PWM  modes  transitions must be avoided to reduce  the noise on the  VCC or 3.3Vaux voltage profile. Switching regulators  can be used that are able to switch between low ripple PWM mode and high ripple PFM mode, provided that the mode transition occurs when the module changes status from the idle/active-modes to connected-mode. It is  permissible  to  use  a  regulator  that  switches  from  the  PWM  mode  to  the  burst  or  PFM  mode  at  an appropriate current threshold.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 72 of 158 Figure 32 and Table 14 show an example of a high reliability power supply circuit, where the module VCC or 3.3Vaux input is supplied by a step-down switching regulator capable of delivering maximum current with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz.  12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R4R5L1C3U1TOBY-L2 series71 VCC72 VCC70 VCCGND12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R6R5L1C3U1MPCI-L2 series24 3.3Vaux39 3.3Vaux23.3VauxGND41 3.3Vaux52 3.3Vaux Figure 32: Example of high reliability VCC and 3.3Vaux supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C4 22 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H220JZ01 - Murata C5 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C6 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics R1 470 k Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 k Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 k Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 k Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 k Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo R6 330 k Resistor 0402 1% 0.063 W RC0402FR-07330KL - Yageo U1 Step-Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 14: Components for high reliability VCC and 3.3Vaux supply application circuit using a step-down regulator
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 73 of 158 Figure 33 and the components listed in Table 15 show an example of a low cost power supply circuit, where the VCC  module  supply  is  provided  by  a  step-down  switching  regulator  capable  of  delivering  to  VCC  pins  the specified maximum peak / pulse current, transforming a 12 V supply input.  TOBY-L2 series12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1 R1R2L1U1GNDFBCOMP54R3C4R4C571 VCC72 VCC70 VCC12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1 R6R7L1U1GNDFBCOMP54R3C4R4C5MPCI-L2 series24 3.3Vaux39 3.3Vaux23.3Vaux41 3.3Vaux52 3.3Vaux Figure 33: Example of low cost VCC and 3.3Vaux supply application circuit using step-down regulator Reference Description Part Number - Manufacturer C1 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 – Murata C2 100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 – Kemet C3 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 – Murata C4  6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 – Murata C5 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 – Murata C6 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 – Murata D1 Schottky Diode 25V 2 A STPS2L25 – STMicroelectronics L1 5.2 µH Inductor 30% 5.28A 22 m MSS1038-522NL – Coilcraft R1 4.7 k Resistor 0402 1% 0.063 W RC0402FR-074K7L – Yageo R2 910  Resistor 0402 1% 0.063 W RC0402FR-07910RL – Yageo R3 82  Resistor 0402 5% 0.063 W RC0402JR-0782RL – Yageo R4 8.2 k Resistor 0402 5% 0.063 W RC0402JR-078K2L – Yageo R5 39 k Resistor 0402 5% 0.063 W RC0402JR-0739KL – Yageo R6 1.5 k Resistor 0402 1% 0.063 W RC0402FR-071K5L – Yageo R7 330  Resistor 0402 1% 0.063 W RC0402FR-07330RL – Yageo U1 Step-Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR – ST Microelectronics Table 15: Components for low cost VCC and 3.3Vaux supply application circuit using a step-down regulator
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 74 of 158 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator The use of a linear regulator is suggested when the difference from the available supply rail and the  VCC or the 3.3Vaux  value  is  low.  The  linear  regulators  provide  high  efficiency  when  transforming  a  5  VDC  supply  to  a voltage value within the module VCC or 3.3Vaux normal operating range. The characteristics of the Low Drop-Out (LDO) linear regulator connected to VCC or 3.3Vaux pins should meet the following prerequisites to comply with the module VCC or 3.3Vaux requirements summarized in Table 7:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a voltage value to the VCC or 3.3Vaux pins within the specified operating range and must be capable of delivering to VCC  or  3.3Vaux  pins  the  maximum  peak  /  pulse  current  consumption  during  Tx  burst  at  maximum  Tx power specified in TOBY-L2 series Data Sheet [1] or in MPCI-L2 series Data Sheet [2].  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the minimum output voltage to evaluate the power dissipation of the regulator).  Figure 34 and the components listed in Table 16 show an example of a power supply circuit, where the VCC or 3.3Vaux module supply is provided by an LDO linear regulator capable of delivering the required current, with proper power handling capability. It is recommended to configure the LDO linear regulator  to generate a voltage supply value slightly below the maximum limit of the module VCC or 3.3Vaux normal operating range (e.g. ~4.1 V for the VCC and ~3.44 V for the 3.3Vaux  as  in the circuits described  in  Figure 34 and  Table  16). This reduces  the  power on the  linear regulator and improves the thermal design of the circuit.  5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNTOBY-L2 series71 VCC72 VCC70 VCCGNDC35VC1 R1IN OUTADJGND12453C2R4R5U1SHDNMPCI-L2 seriesGNDC324 3.3Vaux39 3.3Vaux23.3Vaux41 3.3Vaux52 3.3Vaux Figure 34: Suggested schematic design for the VCC and 3.3Vaux supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET R1 47 k Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 9.1 k Resistor 0402 5% 0.1 W RC0402JR-079K1L - Yageo Phycomp R3 3.9 k Resistor 0402 5% 0.1 W RC0402JR-073K9L - Yageo Phycomp R4 3.3 k Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R5 1.8 k Resistor 0402 5% 0.1 W RC0402JR-071K8L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 16: Suggested components for VCC and 3.3Vaux supply application circuit using an LDO linear regulator
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 75 of 158 Figure 35 and the components listed in Table 17 show an example of a low cost power supply circuit, where the VCC  module  supply  is  provided  by  an  LDO  linear  regulator  capable  of  delivering  the  specified  highest  peak  / pulse current, with proper power handling capability. The regulator described in this example supports a limited input voltage range and it includes internal circuitry for current and thermal protection. It is recommended to configure the LDO linear regulator to generate a voltage supply value slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V as in the circuit described in Figure 35 and  Table  17).  This reduces  the  power  on  the linear regulator and  improves  the  whole thermal  design  of  the supply circuit.  5VC1IN OUTADJGND12453C2R1R2U1ENTOBY-L2 series71 VCC72 VCC70 VCCGNDC35VC1IN OUTADJGND12453C2R3R4U1ENMPCI-L2 seriesGNDC324 3.3Vaux39 3.3Vaux23.3Vaux41 3.3Vaux52 3.3Vaux Figure 35: Suggested schematic design for the VCC and 3.3Vaux supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET R1 27 k Resistor 0402 5% 0.1 W RC0402JR-0727KL - Yageo Phycomp R2 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp R3 12 k Resistor 0402 5% 0.1 W RC0402JR-0712KL - Yageo Phycomp R4 2.7 k Resistor 0402 5% 0.1 W RC0402JR-072K7L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LP38501ATJ-ADJ/NOPB - Texas Instrument Table 17: Suggested components for VCC voltage supply application circuit using an LDO linear regulator  2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery Rechargeable  Li-Ion  or  Li-Pol  batteries  connected  to  the  VCC  pins  should  meet  the  following  prerequisites  to comply with the module VCC requirements summarized in Table 7:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its related output circuit connected  to  the  VCC  pins  must  be  capable  of  delivering  a  pulse  current  as  the  maximum  peak  current consumption during Tx burst at maximum Tx power specified in TOBY-L2 series Data Sheet [1] and must be capable  of  extensively  delivering  a  DC  current  as  the  maximum  average  current  consumption  specified  in TOBY-L2 series Data Sheet [1]. The maximum discharge current is not always reported in battery data sheets, but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour.  DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop below the operating range summarized in Table 7 during transmit bursts.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 76 of 158 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery The  characteristics  of  a  primary  (non-rechargeable)  battery  connected  to  VCC  pins  should  meet  the  following prerequisites to comply with the module VCC requirements summarized in Table 7:  Maximum  pulse  and DC  discharge  current: the non-rechargeable battery with its related output circuit connected  to  the  VCC  pins  must  be  capable  of  delivering  a  pulse  current  as  the  maximum  peak  current consumption during Tx burst at maximum Tx power specified in TOBY-L2 series Data Sheet [1] and must be capable  of  extensively  delivering  a  DC  current  as  the  maximum  average  current  consumption  specified  in TOBY-L2 series Data Sheet [1]. The maximum discharge current is not always reported in battery data sheets, but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour.  DC  series  resistance: the non-rechargeable battery  with its output circuit must  be capable of  avoiding a VCC voltage drop below the operating range summarized in Table 7 during transmit bursts.  2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design To reduce  voltage  drops, use  a  low  impedance  power  source.  The  series resistance  of  the  power  supply  lines (connected to the modules’  VCC / 3.3Vaux and GND  pins) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible to minimize power losses. Three pins are allocated to VCC supply and five pins to  3.3Vaux supply. Several pins are designated for GND connection. Even if all the VCC / 3.3Vaux pins and all the GND pins are internally connected within the module, it is recommended to properly connect all of them to supply the module to minimize series resistance losses. To  avoid  voltage  drop  undershoot  and  overshoot  at  the  start  and  end  of  a  transmit  burst  during  a  GSM  call (when  current  consumption  on  the  VCC  or  3.3Vaux  supply  can  rise  up  as  specified  in  TOBY-L2  series  Data Sheet [1] or in MPCI-L2 series Data Sheet [2]), place a bypass capacitor with large capacitance (at least 100 µF) and low ESR near the VCC pins, for example:  330 µF capacitance, 45 m ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) To reduce voltage ripple and noise, improving RF performance especially if the application device integrates an internal antenna, place the following bypass capacitors near the VCC / 3.3Vaux pins:  68 pF capacitor with Self-Resonant Frequency in the 800/900 MHz range (e.g. Murata GRM1555C1H680J) to filter EMI in the RF low frequencies bands  15  pF  capacitor  with  Self-Resonant  Frequency  in  1800/1900  MHz  range  (e.g.  Murata  GRM1555C1E150J)  to filter EMI in the RF high frequencies bands  8.2 pF capacitor with Self-Resonant Frequency in 2500/2600 MHz range (e.g. Murata GRM1555C1H8R2D)  to filter EMI in the RF very high frequencies band  10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  100 nF capacitor (e.g. Murata GRM155R61C104K) to filter digital logic noise from clocks and data sources A suitable series ferrite bead can be properly placed on the  VCC / 3.3Vaux line for additional noise filtering if required by the specific application according to the whole application board design.   The necessity of each part depends on the specific design, but it is recommended to provide all the bypass capacitors described in Figure 36 / Table 18 if the application device integrates an internal antenna.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 77 of 158 C2GNDC3 C4TOBY-L2 series71VCC72VCC70VCCC1 C5 C63V8C2GNDC3 C4MPCI-L2 seriesC1 C5 C63V3243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux Figure 36: Suggested schematic for the VCC / 3.3Vaux bypass capacitors to reduce ripple / noise on supply voltage profile  Reference Description Part Number - Manufacturer C1 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C2 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata C3 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata C4 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata C6 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET Table 18: Suggested components to reduce ripple / noise on VCC / 3.3Vaux   ESD sensitivity rating of the VCC / 3.3Vaux supply pins is 1 kV (HBM according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if accessible  battery  connector  is  directly  connected  to  the  supply  pins.  Higher  protection  level  can  be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 78 of 158 2.2.1.7 Guidelines for external battery charging circuit TOBY-L2 modules do not have an on-board charging circuit. Figure 37 provides an example of a battery charger design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell. In  the  application  circuit,  a  rechargeable  Li-Ion  (or  Li-Polymer)  battery  cell, that  features  proper  pulse  and  DC discharge current capabilities and proper DC series resistance, is directly connected to the  VCC supply input of TOBY-L2 module. Battery charging is completely managed by the STMicroelectronics L6924U Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA)  Constant  voltage:  when  the  battery  voltage  reaches  the  regulated  output  voltage  (4.2  V),  the  L6924U starts  to  reduce  the  current  until  the  charge  termination  is  done.  The  charging  process  ends  when  the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Alternatively the L6924U, providing input voltage range up to 12 V, can charge from an AC wall adapter. When a current-limited adapter is used, it can operate in quasi-pulse mode, reducing power dissipation. C5 C8C7C6 C9GNDTOBY-L2 series71 VCC72 VCC70 VCC+USB SupplyC3 R4θU1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer    Battery Charger ICC10 Figure 37: Li-Ion (or Li-Polymer) battery charging application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 470  NTC Various manufacturer C1, C4 1 µF Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata C2, C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C7 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C8 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C9 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata C10 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata D1 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX R1, R2 24 k Resistor 0402 5% 0.1 W RC0402JR-0724KL - Yageo Phycomp R3 3.3 k Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R4 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp U1 Single Cell Li-Ion (or Li-Polymer) Battery Charger IC  L6924U - STMicroelectronics Table 19: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 79 of 158 2.2.1.8 Guidelines for external battery charging and power path management circuit Application devices where both a permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at the same time as possible supply source should implement a suitable  charger  /  regulator  with  integrated  power  path  management  function  to  supply  the  module  and  the whole device while simultaneously and independently charging the battery. Figure 38 reports a simplified block diagram circuit showing the working principle of a charger / regulator with integrated power path management function. This component allows the system to be powered by a permanent primary  supply  source  (e.g.  ~12  V)  using  the  integrated  regulator  which  simultaneously  and  independently recharges the battery (e.g. 3.7 V Li-Pol) that represents the back-up supply source of the system: the power path management  feature  permits  the  battery  to  supplement  the  system  current  requirements  when  the  primary supply source is not available or cannot deliver the peak system currents. A power management IC should meet the following prerequisites to comply with the module VCC requirements summarized in Table 7:  High efficiency internal step down converter, compliant with the performances specified in section 2.2.1.2  Low internal resistance in the active path Vout – Vbat, typically lower than 50 m  High efficiency switch mode charger with separate power path control  GNDPower path management ICVoutVinθLi-Ion/Li-Pol Battery PackGNDSystem12 V Primary SourceCharge controllerDC/DC converter and battery FET control logicVbat Figure 38: Charger / regulator with integrated power path management circuit block diagram  Figure 39 and the components listed in Table 20 provide an application circuit example where the MPS MP2617 switching  charger  /  regulator  with  integrated  power  path  management  function  provides  the  supply  to  the cellular  module  while  concurrently  and  autonomously  charging  a  suitable  Li-Ion  (or  Li-Polymer)  battery  with proper pulse and DC discharge current capabilities and proper DC series resistance according to the rechargeable battery recommendations described in section 2.2.1.4. The MP2617 IC  constantly  monitors the battery  voltage and selects whether to use the external main  primary supply / charging source or the battery as supply source for the module, and starts a charging phase accordingly.  The  MP2617  IC  normally  provides  a  supply  voltage  to  the  module  regulated  from  the  external  main  primary source  allowing  immediate  system  operation  even  under  missing  or  deeply  discharged  battery:  the  integrated switching step-down regulator is capable to provide up to 3 A output current with low output ripple and fixed 1.6  MHz  switching  frequency  in  PWM  mode  operation.  The  module  load  is  satisfied  in  priority,  then  the integrated switching charger will take the remaining current to charge the battery. Additionally, the power path control allows an internal connection from battery to the module with a low series internal ON resistance (40 m typical), in order to supplement additional power to the module when the current demand increases over the external main primary source or when this external source is removed.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 80 of 158 Battery charging is managed in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for the application  Constant  voltage: when the  battery voltage reaches the regulated output voltage (4.2  V), the  current  is progressively reduced until the charge termination is done. The charging process ends when the charging current reaches the 10% of the fast-charge current or when the charging timer reaches the value configured by an external capacitor  Using a battery pack with an internal NTC resistor, the MP2617 can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Several parameters as the charging current, the charging timings, the input current limit, the input voltage limit, the  system  output  voltage  can  be  easily  set  according  to  the  specific  application  requirements,  as  the  actual electrical characteristics of the battery and the external supply / charging source: proper resistors or capacitors have to be accordingly connected to the related pins of the IC.  C10 C13GNDC12C11 C14TOBY-L2 series71 VCC72 VCC70 VCC+Primary SourceR3U1ENILIMISETTMRAGNDVINC2C112VNTCPGNDSWSYSBATC4R1R2D1θLi-Ion/Li-Pol Battery PackB1C5Li-Ion/Li-Polymer Battery   Charger / Regulator with Power Path ManagmentVCCC3 C6L1BSTD2VLIMR4R5C7 C8 C9C15 Figure 39: Li-Ion (or Li-Polymer) battery charging and power path management application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 10 k NTC Various manufacturer C1, C5, C6 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C2, C4, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C3 1 µF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E105KA12 - Murata C7, C13 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata C8, C14 15 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E150JA01 - Murata C9, C15 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata C10 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET C12 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata D1, D2 Low Capacitance ESD Protection CG0402MLE-18G - Bourns R1, R3, R5 10 k Resistor 0402 5% 1/16 W RC0402JR-0710KL - Yageo Phycomp R2 1.0 k Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp R4 22 k Resistor 0402 5% 1/16 W RC0402JR-0722KL - Yageo Phycomp L1 1.2 µH Inductor 6 A 21 m 20% 7447745012 - Wurth U1 Li-Ion/Li-Polymer Battery DC/DC Charger / Regulator with integrated Power Path Management function MP2617 - Monolithic Power Systems (MPS) Table 20: Suggested components for Li-Ion (or Li-Polymer) battery charging and power path management application circuit
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 81 of 158 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design Good  connection  of  the  module  VCC  or  3.3Vaux  pins  with  DC  supply  source  is  required  for  correct  RF performance. Guidelines are summarized in the following list:  All the available VCC / 3.3Vaux pins must be connected to the DC source  VCC / 3.3Vaux connection must be as wide as possible and as short as possible  Any series component with Equivalent Series Resistance (ESR) greater than few milliohms must be avoided  VCC /  3.3Vaux  connection  must  be  routed  through  a  PCB  area  separated  from  RF  lines  /  parts,  sensitive analog signals and sensitive functional units: it is good practice to interpose at least one layer of PCB ground between the VCC / 3.3Vaux track and other signal routing  Coupling between VCC / 3.3Vaux and digital lines, especially USB, must be avoided.  The tank bypass capacitor with low ESR for current spikes smoothing described in section 2.2.1.6 should be placed close to the VCC / 3.3Vaux pins. If the main DC source is a switching DC-DC converter, place the large capacitor close to  the DC-DC  output  and minimize  VCC / 3.3Vaux track length. Otherwise consider using separate capacitors for DC-DC converter and module tank capacitor  The  bypass  capacitors  in  the  pF  range  described  in  Figure  36  and  Table  18  should  be  placed  as  close  as possible  to  the  VCC /  3.3Vaux  pins.  This  is  highly  recommended  if  the  application  device  integrates  an internal antenna  Since VCC / 3.3Vaux input provide the supply to RF Power Amplifiers, voltage ripple at high frequency may result in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case it is better to select the highest operating frequency for the switcher and add a large L-C filter before connecting to the TOBY-L2 and MPCI-L2 series modules in the worst case  If VCC / 3.3Vaux is protected by transient voltage suppressor to ensure that the voltage maximum ratings are  not  exceeded,  place  the  protecting  device  along  the  path  from  the  DC  source  toward  the  module, preferably closer to the DC source (otherwise protection functionality may be compromised)  2.2.1.10 Guidelines for grounding layout design Good connection of the module GND pins with application board solid ground layer is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer  The VCC supply current flows back to main DC source through GND as ground current: provide adequate return path with suitable uninterrupted ground plane to main DC source  It is recommended to implement one layer of the application board as ground plane as wide as possible  If  the  application  board  is  a  multilayer  PCB,  then  all the  board  layers  should  be  filled  with  GND  plane  as much as possible and each GND area should be connected  together with complete via stack down to  the main ground layer of the board  If the whole application device is composed by more than one PCB, then it is required to provide a good and solid ground connection between the GND areas of all the different PCBs  Good grounding of GND pads also ensures thermal heat sink. This is critical during connection, when the real  network  commands  the  module  to  transmit  at  maximum  power:  proper  grounding  helps  prevent module overheating.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 82 of 158 2.2.2 RTC supply output (V_BCKP)  The RTC supply V_BCKP pin is not available on MPCI-L2 series modules.  2.2.2.1 Guidelines for V_BCKP circuit design TOBY-L2 series modules provide the V_BCKP RTC supply input/output, which can be mainly used to:   Provide RTC back-up when VCC supply is removed  If RTC timing is required to run for a time interval of T [s] when VCC supply is removed, place a capacitor with a nominal capacitance of C [µF] at the V_BCKP pin. Choose the capacitor using the following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 1.25 x T [s]  For example, a 100 µF capacitor can be placed at V_BCKP to provide RTC backup holding the V_BCKP voltage within its valid range for around  80 s at 25 °C, after the VCC supply is removed.  If a longer buffering time is required, a 70 mF super-capacitor can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 15 hours at 25 °C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to  let  a  fast  rise  time  of  the  voltage  value  at  the  V_BCKP  pin  after  VCC  supply  has  been  provided.  These capacitors allow the time reference to run during battery disconnection.  TOBY-L2 seriesC1(a)3V_BCKPR2TOBY-L2 seriesC2(superCap)(b)3V_BCKPD3TOBY-L2 seriesB3(c)3V_BCKP Figure 40: Real time clock supply (V_BCKP) application circuits: (a) using a 100 µF capacitor to let the RTC run for ~80 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~15 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 21: Example of components for V_BCKP buffering  If very long buffering time is required to allow the RTC time reference to run during a disconnection of the VCC supply,  then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a proper  nominal  voltage and  must  never  exceed the  maximum  operating voltage  for  V_BCKP  (specified  in  the Input characteristics of Supply/Power pins table in TOBY-L2 series Data Sheet [1]). The connection of the battery to  V_BCKP  should  be  done  with  a  suitable  series  resistor  for  a  rechargeable  battery,  or  with  an  appropriate series diode  for  a  non-rechargeable  battery. The  purpose  of  the  series resistor  is to limit  the  battery  charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the  V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 83 of 158  If  the  RTC  timing  is  not  required  when  the  VCC  supply  is  removed,  it  is  not  needed  to  connect  the V_BCKP pin to an external capacitor or battery. In this case the date and time are not updated when VCC is disconnected.  If  VCC is always supplied,  then the  internal regulator  is supplied from the main supply and there is no need for an external component on V_BCKP.  Combining  a  cellular  module  with  a  u-blox  GNSS  positioning  receiver,  the  positioning  receiver  VCC  supply  is controlled by the cellular module by means of the “GNSS supply enable” function provided by the GPIO2 of the cellular module. In this case the V_BCKP supply output of the cellular module can be connected to the V_BCKP backup  supply  input  pin  of  the  GNSS  receiver  to  provide  the  supply  for  the  positioning  real  time  clock  and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either a hot start or a warm start (depending on the duration of the  positioning VCC outage) and to maintain the configuration settings saved in the backup RAM. See section 2.6.3 for more details regarding the application circuit with a u-blox GNSS receiver.  V_BCKP  supply  output  pin  provides  internal  short  circuit  protection  to  limit  start-up  current  and  protect  the device in short circuit situations. No additional external short circuit protection is required.   Do not apply loads which might exceed the limit for maximum available current from V_BCKP supply (see TOBY-L2 series Data Sheet [1]) as this can cause malfunctions in internal circuitry.  ESD sensitivity rating of the V_BCKP supply pin is 1 kV (Human Body Model according to JESD22-A114). Higher  protection  level  could  be  required  if  the  line  is  externally  accessible  and  it  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point.  2.2.2.2 Guidelines for V_BCKP layout design V_BCKP supply requires careful layout: avoid injecting noise on this voltage domain as it may affect the stability of the internal circuitry.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 84 of 158 2.2.3 Generic digital interfaces supply output (V_INT)   The generic digital interfaces supply V_INT pin is not available on MPCI-L2 series modules.  2.2.3.1 Guidelines for V_INT circuit design TOBY-L2 series provide the V_INT generic digital interfaces 1.8 V supply output, which can be mainly used to:  Indicate when the module is switched on (as described in sections 1.6.1, 1.6.2)  Pull-up SIM detection signal (see section 2.5 for more details)  Supply voltage translators to connect 1.8 V module generic digital interfaces to 3.0 V devices (e.g. see 2.6.2)  Pull-up DDC (I2C) interface signals (see section 2.6.3 for more details)  Supply a 1.8 V u-blox 6 or subsequent u-blox GNSS receiver generation (see section 2.6.3 for more details)  V_INT supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required.   Do not apply loads which might exceed the limit for maximum available current from  V_INT supply (see the TOBY-L2 series Data Sheet [1]) as this can cause malfunctions in internal circuitry.  Since  the  V_INT  supply  is  generated  by  an  internal  switching  step-down  regulator,  the  V_INT  voltage ripple  can  range  as  specified  in  the  TOBY-L2  series  Data  Sheet [1]:  it  is  not  recommended  to  supply sensitive analog circuitry without adequate filtering for digital noise.  V_INT can only be used as an output: do not connect any external supply source on V_INT.  ESD sensitivity rating of the  V_INT  supply pin is 1  kV  (Human Body Model according  to JESD22-A114). Higher  protection  level  could  be  required  if  the  line  is  externally  accessible  and  it  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point.  It is recommended to  provide direct  access  to  the  V_INT pin  on  the  application  board by  means  of  an accessible test point directly connected to the V_INT pin.  2.2.3.2 Guidelines for V_INT layout design V_INT supply output is generated by an integrated switching step-down converter. Because of this, it can be a source of noise: avoid coupling with sensitive signals.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 85 of 158 2.3 System functions interfaces 2.3.1 Module power-on (PWR_ON)  The PWR_ON input pin is not available on MPCI-L2 series modules.  2.3.1.1 Guidelines for PWR_ON circuit design TOBY-L2 series PWR_ON input is equipped with an internal active pull-up resistor to the VCC module supply as described in Figure 41: an external pull-up resistor is not required and should not be provided.  If  connecting  the  PWR_ON  input  to  a  push  button,  the  pin  will  be  externally  accessible  on  the  application device. According to EMC/ESD requirements of the application, an additional ESD protection should be provided close to the accessible point, as described in Figure 41 and Table 22.   ESD sensitivity rating of the PWR_ON pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if  an accessible push button is directly connected to PWR_ON pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to the accessible point.  An open drain or open collector output is suitable to drive the PWR_ON input from an application processor as PWR_ON input is equipped with an internal active pull-up resistor to the VCC supply, as described in Figure 41. A compatible  push-pull output  of an application processor  can  also be  used. In  any  case,  take care to  set the proper level in all the possible scenarios to avoid an inappropriate module switch-on.  TOBY-L2 series50 kVCC20 PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-L2 series50 kVCC20 PWR_ONTP TP Figure 41: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 22: Example ESD protection component for the PWR_ON application circuit   It is recommended to provide direct access to the PWR_ON pin on the application board by means of an accessible test point directly connected to the PWR_ON pin.  2.3.1.2 Guidelines for PWR_ON layout design The power-on circuit (PWR_ON) requires careful layout since it is the sensitive input available to switch on the TOBY-L2 modules. It is required to ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious power-on request.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 86 of 158 2.3.2 Module reset (RESET_N or PERST#) 2.3.2.1 Guidelines for RESET_N and PERST# circuit design The  TOBY-L2  series  RESET_N  is  equipped  with  an  internal  pull-up  to  the  VCC  supply  and  the  MPCI-L2  series PERST#  is  equipped  with  an  internal  pull-up  to  the  3.3  V  rail,  as  described  in  Figure  42.  An  external  pull-up resistor is not required and should not be provided. If  connecting  the  RESET_N  or  PERST#  input  to  a  push  button,  the  pin  will  be  externally  accessible  on  the application device. According to EMC/ESD requirements of the application, an additional ESD protection device (e.g. the EPCOS CA05P4S14THSG varistor) should be provided close to accessible point on the line connected to this pin, as described in Figure 42 and Table 23.   ESD sensitivity rating of the RESET_N and PERST# pins is 1 kV (HBM according to JESD22-A114). Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board,  e.g.  if  an accessible push button is  directly connected to the RESET_N or  PERST#  pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.  An open drain output is suitable to drive the RESET_N and PERST# inputs from an application processor as they are equipped with an internal pull-up to VCC supply and to the 3.3 V rail respectively, as described in Figure 42. A compatible push-pull output of an application processor can also be used. In any  case,  take care to  set the proper level in all the possible scenarios to avoid an inappropriate module reset, switch-on or switch-off.  TOBY-L2 seriesVCC23 RESET_NPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-L2 seriesVCC23 RESET_NTP TP50 k50 kMPCI-L2 series22 PERST#Power-on push buttonESDOpen Drain OutputApplication ProcessorMPCI-L2 series22 PERST#45 k45 k3V3 3V3 Figure 42: RESET_N and PERST# application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 23: Example of ESD protection component for the RESET_N and PERST# application circuits   If the external reset function is not required by the customer application, the  RESET_N input pin can be left  unconnected  to  external  components,  but  it  is  recommended  providing  direct  access  on  the application board by means of an accessible test point directly connected to the RESET_N pin.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 87 of 158 2.3.2.2 Guidelines for RESET_N and PERST# layout design The RESET_N and PERST# circuits require careful layout due to the pin function: ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious reset request. It is recommended to keep the connection line to RESET_N and PERST# pins as short as possible.  2.3.3 Module configuration selection by host processor  The HOST_SELECT0 and HOST_SELECT1 pins are not available on MPCI-L2 series modules.  2.3.3.1 Guidelines for HOST_SELECTx circuit design  The functionality of the HOST_SELECT0 and HOST_SELECT1 pins is not supported by the TOBY-L2 “00”, “01”,  and  “50”  product  versions:  the  two  input  pins  should  not  be  driven  by  the  host  application processor or any other external device.  TOBY-L2 series modules include two input pins (HOST_SELECT0 and HOST_SELECT1) for the selection of the module configuration by the host application processor.   Guidelines  for  HOST_SELECT0  and  HOST_SELECT1  pins  circuit  design  will  be  described  in  detail  in  a successive release of the document.   Do not apply voltage to  HOST_SELECT0 and HOST_SELECT1  pins before the switch-on of their supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit  connections  and  set  to  high impedance before V_INT switch-on.  ESD sensitivity rating of the HOST_SELECT0 and HOST_SELECT1 pins is 1 kV (HBM as per JESD22-A114). Higher protection level could be required if  the lines are  externally accessible and it  can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points  If  the  HOST_SELECT0  and  HOST_SELECT1  pins  are  not  used,  they  can  be  left  unconnected  on  the application board.  2.3.3.2 Guidelines for HOST_SELECTx layout design The input pins for the selection of the module configuration by the host application processor (HOST_SELECT0 and HOST_SELECT1) are generally not critical for layout.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 88 of 158 2.4 Antenna interface TOBY-L2 and MPCI-L2 series modules provide two RF interfaces for connecting the external antennas:  The ANT1 pin represents the primary RF input/output for LTE/3G/2G RF signals transmission and reception.   The ANT2 pin represents the secondary RF input for LTE MIMO 2 x 2 or 3G Rx diversity RF signals reception.  Both the ANT1 and the ANT2 pins have a nominal characteristic impedance of 50  and must be connected to the related antenna through a 50  transmission line to allow proper transmission / reception of RF signals.   Two antennas (one connected to ANT1 pin and one connected to ANT2 pin) must be used to support the Down-Link MIMO 2 x 2 radio technology. This is a required feature for LTE category 4 User Equipments (up to 150 Mb/s Down-Link data rate) according to 3GPP specifications.  2.4.1 Antenna RF interfaces (ANT1 / ANT2) 2.4.1.1 General guidelines for antenna selection and design The antenna is the most critical component to be evaluated. Designers must take care of the antennas from all perspective  at  the  very  start  of  the  design  phase  when  the  physical  dimensions  of  the  application  board  are under analysis/decision, since the RF compliance of the device integrating TOBY-L2 and MPCI-L2 series modules with all the applicable required certification schemes depends on antennas radiating performance.  LTE/3G/2G antennas are typically available in the types of linear monopole or PCB antennas such as patches or ceramic SMT elements.  External antennas (e.g. linear monopole) o External  antennas  basically  do  not  imply  physical  restriction  to  the  design  of  the  PCB  where  the TOBY-L2 and MPCI-L2 series module is mounted. o The radiation performance mainly depends on the antennas. It is required to select antennas with optimal radiating performance in the operating bands. o RF cables should  be  carefully  selected  to have minimum insertion  losses. Additional  insertion loss will  be  introduced  by  low  quality  or  long  cable.  Large  insertion  loss  reduces  both  transmit  and receive radiation performance. o A high quality 50  RF connector provides proper PCB-to-RF-cable transition. It is recommended to strictly follow the layout and cable termination guidelines provided by the connector manufacturer.  Integrated antennas (e.g. patch-like antennas): o Internal integrated antennas imply physical restriction to the design of the PCB:  Integrated antenna excites RF currents  on its counterpoise, typically the PCB ground plane  of the device that becomes part of the antenna: its dimension defines the minimum frequency that can be radiated.  Therefore,  the  ground  plane  can  be  reduced  down  to  a  minimum  size  that  should  be similar to the quarter of the wavelength of the minimum frequency that has to be  radiated, given that the orientation of the ground plane relative to the antenna element must be considered. The isolation between the primary and the secondary antennas has to be as high as possible and the correlation between the 3D radiation patterns of the two antennas has to be as low as possible. In general, a separation of at least a quarter wavelength between the two antennas is required to achieve a good isolation and low pattern correlation. As numerical example, the physical restriction to the PCB design can be considered as following:   Frequency = 750 MHz  Wavelength = 40 cm  Minimum GND plane size = 10 cm
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 89 of 158 o Radiation performance depends on the whole PCB  and antenna system design, including product mechanical design and usage. Antennas should be selected with optimal radiating performance in the operating bands according to the mechanical specifications of the PCB and the whole product. o It is recommended to select a pair of custom antennas designed by an antennas’ manufacturer if the required ground plane dimensions are very small (e.g. less than 6.5 cm long and 4 cm wide). The antenna design process should begin at the start of the whole product design process o It  is  highly  recommended  to  strictly  follow  the  detailed  and  specific  guidelines  provided  by  the antenna  manufacturer  regarding  correct  installation  and  deployment  of  the  antenna  system, including PCB layout and matching circuitry o Further  to  the  custom  PCB  and  product  restrictions,  antennas  may  require  tuning  to  obtain  the required  performance  for  compliance  with  all  the  applicable  required  certification  schemes.  It  is recommended  to  consult  the  antenna  manufacturer  for  the  design-in  guidelines  for  antenna matching relative to the custom application  In both of cases, selecting external or internal antennas, these recommendations should be observed:  Select antennas providing optimal return loss (or V.S.W.R.) figure over all the operating frequencies.  Select antennas providing optimal efficiency figure over all the operating frequencies.  Select antennas providing similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna.  Select antennas providing appropriate gain figure (i.e. combined antenna directivity and efficiency figure) so that  the  electromagnetic  field  radiation  intensity  do  not  exceed  the  regulatory  limits  specified  in  some countries (e.g. by FCC in the United States, as reported in the section 4.2.2).  Select antennas capable to provide low Envelope Correlation Coefficient between the primary (ANT1) and the secondary (ANT2) antenna: the 3D antenna radiation patterns should have lobes in different directions.  2.4.1.2 Guidelines for antenna RF interface design Guidelines for TOBY-L2 series ANT1 / ANT2 pins RF connection design Proper transition between ANT1 / ANT2 pads and the application board PCB must be provided, implementing the following design-in guidelines for the layout of the application PCB close to the ANT1 / ANT2 pads:  On a multilayer board, the whole layer stack below the RF connection should be free of digital lines  Increase GND keep-out (i.e. clearance, a void area) around the  ANT1 / ANT2 pads, on the top layer of the application  PCB,  to  at  least  250 µm  up  to  adjacent  pads  metal  definition  and  up  to  400 µm  on  the  area below the module, to reduce parasitic capacitance to ground, as described in the left picture in Figure 43  Add GND keep-out (i.e. clearance, a void area) on the buried metal layer below the ANT1 / ANT2 pads if the top-layer to buried layer dielectric thickness is below 200 µm, to reduce parasitic capacitance to ground, as described in the right picture in Figure 43  Min. 250 µmMin. 400 µm GNDANT1GND clearance on very close buried layerbelow ANT1 padGND clearance on top layer around ANT1 padMin. 250 µmMin. 400 µmGNDANT2GND clearance on very close buried layerbelow ANT2 padGND clearance on top layer around ANT2 pad Figure 43: GND keep-out area on top layer around ANT1 / ANT2 pads and on very close buried layer below ANT1 / ANT2 pads
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 90 of 158 Guidelines for MPCI-L2 series ANT1 / ANT2 receptacles RF connection design The  Hirose  U.FL-R-SMT  RF  receptacles  implemented  on  the  MPCI-L2  series  modules  for  ANT1 /  ANT2  ports require a suitable mated RF plug from the same connector series. Due to its wide usage in the industry, several manufacturers offer compatible equivalents. Table 24 lists some RF connector plugs that fit MPCI-L2 series modules RF connector receptacles, based on the declaration of the respective manufacturers. Only the Hirose has been qualified for the MPCI-L2 series modules; contact other producers to verify compatibility.  Manufacturer Series Remarks Hirose U.FL® Ultra Small Surface Mount Coaxial Connector Recommended I-PEX MHF® Micro Coaxial Connector  Tyco UMCC® Ultra-Miniature Coax Connector  Amphenol RF AMC® Amphenol Micro Coaxial  Lighthorse Technologies, Inc IPX ultra micro-miniature RF connector  Table 24: MPCI-L2 series U.FL compatible plug connector Typically the RF plug is available as a cable assembly: several kinds are available and the user should select the cable assembly best suited to the application. The key characteristics are:  RF plug type: select U.FL or equivalent  Nominal impedance: 50   Cable thickness: typically from 0.8 mm to 1.37 mm. Select thicker cables to minimize insertion loss  Cable length: standard length is typically 100 mm or 200 mm, custom lengths may be available on request. Select shorter cables to minimize insertion loss  RF connector on the  other side  of the  cable: for example another U.FL (for  board-to-board connection) or SMA (for panel mounting)  For  applications  requiring  an  internal  integrated  SMT  antenna,  it  is  suggested  to  use  a  U-FL-to-U.FL  cable  to provide RF path from the MPCI-L2 series module to PCB strip line or micro strip connected to antenna pads as shown in Figure 44. Take care that the PCB-to-RF-cable transition, strip line and antenna pads must be designed so that  the  characteristic impedance  is  as  close  as possible  to  50 :  see  the  following  subsections for  specific guidelines regarding RF transmission line design and RF termination design. If an external antenna is required, consider that the connector is typically rated for a limited number of insertion cycles. In addition, the RF coaxial cable may be relatively fragile compared to other types of cables. To increase application  ruggedness,  connect  U.FL  to a  more  robust  connector  (e.g. SMA  or  MMCX)  fixed  on panel  or  on flange as shown in Figure 44.  MPCI-L2 seriesBaseboardStripline/Microstrip Internal AntennaBaseboardApplication  Chassis Connector  to External AntennaMPCI-L2 seriesLatch for Mini PCIeLatch for Mini PCIe Figure 44: Example of RF connections, U.FL-to-U.FL cable for internal antenna and U.FL-to-SMA for external antenna
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 91 of 158 Guidelines for RF transmission line design Any RF transmission line, such as the ones from the ANT1 and ANT2 pads up to the related antenna connector or up to the related internal antenna pad, must be designed so that the characteristic impedance is as close as possible to 50 . RF transmission lines can be designed as a micro strip (consists of a conducting strip separated from a ground plane by a dielectric material) or a strip line (consists of a flat strip of metal which is sandwiched between two parallel ground planes within a dielectric material). The micro strip, implemented as a coplanar waveguide, is the most common configuration for printed circuit board.  Figure 45 and Figure 46 provide two examples of proper 50  coplanar waveguide designs. The first example of RF  transmission  line  can  be  implemented  in  case  of  4-layer  PCB  stack-up  herein  described,  and  the  second example of RF transmission line can be implemented in case of 2-layer PCB stack-up herein described. 35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric380 µm 500 µm500 µm Figure 45: Example of 50  coplanar waveguide transmission line design for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric1200 µm 400 µm400 µm Figure 46: Example of 50  coplanar waveguide transmission line design for the described 2-layer board layup If the  two  examples do not match the application PCB  stack-up the 50  characteristic impedance calculation can be made using the HFSS commercial finite element method solver for electromagnetic structures from Ansys Corporation,  or  using  freeware  tools  like  AppCAD  from  Agilent  (www.agilent.com)  or  TXLine  from  Applied Wave  Research  (www.mwoffice.com),  taking  care  of  the  approximation  formulas  used  by  the  tools  for  the impedance computation. To achieve a 50  characteristic impedance, the width of the transmission line must be chosen depending on:  the thickness of the transmission line itself (e.g. 35 µm in the example of Figure 45 and Figure 46)  the thickness of the dielectric material between the top layer (where the transmission line is routed) and the inner closer layer implementing the ground plane (e.g. 270 µm in Figure 45, 1510 µm in Figure 46)  the  dielectric  constant  of  the  dielectric  material  (e.g.  dielectric  constant  of  the  FR-4  dielectric  material  in Figure 45 and Figure 46)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 92 of 158  the gap from the transmission line to the adjacent ground plane on the same layer of the transmission line (e.g. 500 µm in Figure 45, 400 µm in Figure 46) If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the micro strip, use the “Coplanar Waveguide” model for the 50  calculation.  Additionally to the 50  impedance, the following guidelines are recommended for transmission lines design:  Minimize  the  transmission  line length: the  insertion  loss  should  be  minimized  as  much as  possible,  in  the order of a few tenths of a dB,  Add GND keep-out (i.e. clearance, a void area) on buried metal layers below any pad of component present on  the  RF  transmission  lines,  if  top-layer  to  buried  layer  dielectric  thickness  is  below  200 µm,  to  reduce parasitic capacitance to ground,  The transmission lines width and spacing to GND must be uniform and routed as smoothly as possible: avoid abrupt changes of width and spacing to GND,  Add GND stitching vias around transmission lines, as described in Figure 47,  Ensure  solid  metal  connection  of  the  adjacent  metal  layer  on  the  PCB  stack-up  to  main  ground  layer, providing enough vias on the adjacent metal layer, as described in Figure 47,  Route RF transmission lines far from any noise source (as switching supplies and digital lines) and from any sensitive circuit (as USB),  Avoid stubs on the transmission lines,  Avoid signal routing in parallel to transmission lines or crossing the transmission lines on buried metal layer,  Do not route microstrip lines below discrete component or other mechanics placed on top layer  An  example  of  proper  RF  circuit  design  is  reported  in  Figure  47.  In  this  case,  the  ANT1  and  ANT2  pins  are directly connected to SMA connectors by means of proper 50  transmission lines, designed with proper layout.  SMA Connector Primary AntennaSMA Connector Secondary AntennaTOBY-L2 series Figure 47: Suggested circuit and layout for antenna RF circuits on application board
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 93 of 158 Guidelines for RF termination design RF terminations must provide a characteristic impedance of 50  as well as the RF transmission lines up to the RF terminations themselves, to match the characteristic impedance of the ANT1 / ANT2 ports of the modules. However,  real  antennas  do  not  have  perfect  50   load  on  all  the  supported  frequency  bands.  Therefore,  to reduce as much as possible performance degradation due to antennas mismatch, RF terminations must provide optimal return loss (or V.S.W.R.) figure over all the operating frequencies, as summarized in Table 8 and Table 9.  If external antennas are used, the antenna connectors represent the RF termination on the PCB:  Use suitable 50  connectors providing proper PCB-to-RF-cable transition.  Strictly follow the connector manufacturer’s recommended layout, for example:  o SMA  Pin-Through-Hole  connectors  require  GND  keep-out  (i.e.  clearance,  a  void  area)  on  all  the layers around the central pin up to annular pads of the four GND posts, as shown in Figure 47 o U.FL surface mounted  connectors  require  no conductive traces  (i.e. clearance, a  void area) in the area below the connector between the GND land pads.  Cut out the GND layer under RF connectors and close to buried vias, to remove stray capacitance and thus keep the RF line 50 , e.g. the active pad of UFL connectors needs to have a GND keep-out (i.e. clearance, a void area) at least on first inner layer to reduce parasitic capacitance to ground.  If integrated antennas are used, the RF terminations are represented by the integrated antennas themselves. The following guidelines should be followed:  Use antennas designed by an antenna manufacturer, providing the best possible return loss (or V.S.W.R.).  Provide a ground plane large enough according to the relative integrated antenna requirements. The ground plane of the application PCB can be reduced down to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated. As numerical example,   Frequency = 750 MHz  Wavelength = 40 cm  Minimum GND plane size = 10 cm  It  is  highly  recommended  to  strictly  follow  the  detailed  and  specific  guidelines  provided  by  the  antenna manufacturer  regarding  correct  installation  and  deployment  of  the  antenna  system,  including  PCB  layout and matching circuitry.  Further to the custom PCB and product restrictions, antennas may require a tuning to comply with all the applicable  required  certification  schemes.  It  is  recommended  to  consult  the antenna  manufacturer  for  the design-in guidelines for the antenna matching relative to the custom application.  Additionally, these recommendations regarding the antenna system placement must be followed:  Do not place antennas within closed metal case.  Do not place the antennas in close vicinity to end user since the emitted radiation in human tissue is limited by regulatory requirements.  Place the antennas far from sensitive analog systems or employ countermeasures to reduce EMC issues.  Take care of interaction between co-located RF systems since the LTE/3G/2G transmitted power may interact or disturb the performance of companion systems.  Place  the  two  LTE/3G  antennas  providing  low  Envelope  Correlation  Coefficient  (ECC)  between  primary (ANT1)  and  secondary  (ANT2)  antenna:  the  antenna  3D  radiation  patterns  should  have lobes  in  different directions. The ECC between primary and secondary antenna needs to be enough low to comply with the radiated performance requirements specified by related certification schemes, as indicated in Table 10.  Place the two LTE/3G antennas providing enough high isolation (see Table 10) between primary (ANT1) and secondary (ANT2) antenna. The isolation depends on the distance between antennas (separation of at least a quarter wavelength required for good isolation), antenna type (using antennas with different polarization improves isolation), antenna 3D radiation patterns (uncorrelated patterns improve isolation).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 94 of 158 Examples of antennas Table 25 lists some examples of possible internal on-board surface-mount antennas.  Manufacturer Part Number Product Name Description Taoglas PA.710.A Warrior GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PA.711.A Warrior II GSM / WCDMA / LTE SMD Antenna Pairs with the Taoglas PA.710.A Warrior for LTE MIMO applications 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz  40.0 x 6.0 x 5.0 mm Taoglas PCS.06.A Havok GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2500..2690 MHz 42.0 x 10.0 x 3.0 mm Table 25: Examples of internal surface-mount antennas  Table 26 lists some examples of possible internal off-board PCB-type antennas with cable and connector.  Manufacturer Part Number Product Name Description Taoglas FXUB63.07.0150C  GSM / WCDMA / LTE PCB Antenna with cable and U.FL  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 96.0 x 21.0 mm Taoglas FXUB66.07.0150C Maximus GSM / WCDMA / LTE PCB Antenna with cable and U.FL  698..960 MHz, 1390..1435 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz, 3400..3600 MHz, 4800..6000 MHz 120.2 x 50.4 mm Taoglas FXUB70.A.07.C.001  GSM / WCDMA / LTE PCB MIMO Antenna with cables and U.FL  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 182.2 x 21.2 mm Ethertronics 5001537 Prestta GSM / WCDMA / LTE PCB Antenna with cable  704..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2500..2690 MHz 80.0 x 18.0 mm EAD FSQS35241-UF-10 SQ7 GSM / WCDMA / LTE PCB Antenna with cable and U.FL  690..960 MHz, 1710..2170 MHz, 2500..2700 MHz 110.0 x 21.0 mm Table 26: Examples of internal antennas with cable and connector
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 95 of 158 Table 27 lists some examples of possible external antennas.  Manufacturer Part Number Product Name Description Taoglas GSA.8827.A.101111  Phoenix GSM / WCDMA / LTE adhesive-mount antenna with cable and SMA(M)  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2490..2690 MHz 105 x 30 x 7.7 mm Taoglas TG.30.8112  GSM / WCDMA / LTE swivel dipole antenna with SMA(M)  698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz  148.6 x 49 x 10 mm Taoglas MA241.BI.001 Genesis GSM / WCDMA / LTE MIMO 2in1 adhesive-mount combination antenna waterproof IP67 rated with cable and SMA(M) 698..960 MHz, 1710..2170 MHz, 2400..2700 MHz  205.8 x 58 x 12.4 mm Laird Tech. TRA6927M3PW-001  GSM / WCDMA / LTE screw-mount antenna with N-type(F)  698..960 MHz, 1710..2170 MHz, 2300..2700 MHz  83.8 x Ø 36.5 mm Laird Tech. CMS69273  GSM / WCDMA / LTE ceiling-mount antenna with cable and N-type(F)  698..960 MHz, 1575.42 MHz, 1710..2700 MHz  86 x Ø 199 mm Laird Tech. OC69271-FNM  GSM / WCDMA / LTE pole-mount antenna with N-type(M)  698..960 MHz, 1710..2690 MHz 248 x Ø 24.5 mm Laird Tech. CMD69273-30NM  GSM / WCDMA / LTE ceiling-mount MIMO antenna with cables & N-type(M)  698..960 MHz, 1710..2700 MHz  43.5 x Ø 218.7 mm Pulse Electronics WA700/2700SMA  GSM / WCDMA / LTE clip-mount MIMO antenna with cables and SMA(M)  698..960 MHz,1710..2700 MHz 149 x 127 x 5.1 mm Table 27: Examples of external antennas
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 96 of 158 2.4.2 Antenna detection interface (ANT_DET)  Antenna detection (ANT_DET) is not available on MPCI-L2 series modules  Antenna detection (ANT_DET) is not supported by TOBY-L2 ”00”, “01”, and “50” product versions  2.4.2.1 Guidelines for ANT_DET circuit design Figure 48 and Table 28 describe the recommended schematic / components for the antennas detection circuit that  must  be  provided  on  the  application  board  and  for  the  diagnostic  circuit  that  must  be  provided  on  the antennas’ assembly to achieve primary and secondary antenna detection functionality.  Application BoardAntenna CableTOBY-L2 series81ANT175ANT_DET R1C1 D1C2 J1Z0= 50 ohm Z0= 50 ohm Z0= 50 ohmPrimary Antenna AssemblyR2C4L3Radiating ElementDiagnostic CircuitL2L1Antenna Cable87ANT2C3 J2Z0= 50 ohm Z0= 50 ohm Z0= 50 ohmSecondary Antenna AssemblyR3C5L4Radiating ElementDiagnostic Circuit Figure 48: Suggested schematic for antenna detection circuit on application board and diagnostic circuit on antennas assembly Reference Description Part Number - Manufacturer C1 27 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H270J - Murata C2, C3 33 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H330J - Murata D1 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics L1, L2 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R1 10 k Resistor 0402 1% 0.063 W RK73H1ETTP1002F - KOA Speer J1, J2 SMA Connector 50  Through Hole Jack SMA6251A1-3GT50G-50 - Amphenol C4, C5 22 pF Capacitor Ceramic C0G 0402 5% 25 V  GRM1555C1H220J - Murata L3, L4 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata R2, R3 15 k Resistor for Diagnostic Various Manufacturers Table 28: Suggested components for antenna detection circuit on application board and diagnostic circuit on antennas assembly  The antenna detection circuit and diagnostic circuit suggested in Figure 48 and Table 28 are explained here:  When antenna detection is forced by AT+UANTR command, ANT_DET generates a DC current measuring the resistance (R2 // R3) from antenna connectors (J1, J2) provided on the application board to GND.  DC blocking capacitors are needed at the ANT1 / ANT2 pins (C2, C3) and at the antenna radiating element (C4, C5) to decouple the DC current generated by the ANT_DET pin.  Choke inductors with a Self Resonance Frequency (SRF) in the range of 1 GHz are needed in series at the ANT_DET  pin  (L1,  L2)  and  in  series  at  the  diagnostic  resistor  (L3,  L4),  to  avoid  a  reduction  of  the  RF performance of the system, improving the RF isolation of the load resistor.   Additional components (R1, C1 and D1 in Figure 48) are needed at the ANT_DET pin as ESD protection  The ANT1 / ANT2 pins must be connected to the antenna connector by means of a transmission line with nominal characteristics impedance as close as possible to 50 .
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 97 of 158 The DC impedance at  RF port for some antennas  may be  a  DC  open  (e.g.  linear monopole) or  a DC  short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 48, the measured DC  resistance  is  always  at  the  limits  of  the  measurement  range  (respectively  open  or  short),  and  there  is  no means  to  distinguish  between  a  defect  on  antenna  path  with  similar  characteristics  (respectively:  removal  of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other  DC signal injected to the RF connection from  ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.   It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 k to 30 k to  assure  good  antenna  detection  functionality  and  avoid  a  reduction  of  module  RF  performance.  The choke inductor should exhibit a parallel Self Resonance Frequency (SRF) in the range of 1 GHz to improve the RF isolation of load resistor.  For example: Consider  an  antenna  with  built-in  DC  load  resistor  of  15  k.  Using  the  +UANTR  AT  command,  the  module reports the resistance value evaluated from the antenna connector provided on the application board to GND:  Reported  values  close  to  the  used  diagnostic resistor  nominal  value  (i.e.  values from  13  k  to  17  k  if  a 15 k diagnostic resistor is used) indicate that the antenna is properly connected.  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  k)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [3]) means that that the antenna is not connected or the RF cable is broken.  Reported values below the measurement range minimum limit (1 k) highlights a short to GND at antenna or along the RF cable.  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic.  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method.   If  the  primary  /  secondary  antenna  detection  function  is  not  required  by  the  customer  application,  the ANT_DET  pin  can  be  left  not  connected  and  the  ANT1 /  ANT2  pins  can  be  directly  connected  to  the related antenna connector by means of a 50  transmission line as described in Figure 47.  2.4.2.1 Guidelines for ANT_DET layout design The recommended layout for the primary antenna detection circuit to be provided on the application board to achieve  the  primary  antenna  detection  functionality,  implementing  the  recommended  schematic  described  in Figure 48 and Table 28, is explained here:  The ANT1 / ANT2 pins have to be connected to the antenna connector by means of a  50  transmission line, implementing the design guidelines described in section  2.4.1 and the recommendations of the SMA connector manufacturer.  DC blocking capacitor at ANT1 / ANT2 pins (C2, C3) has to be placed in series to the 50  RF line.  The ANT_DET pin has to be connected to the 50  transmission line by means of a sense line.  Choke inductors in series at the  ANT_DET pin (L1, L2) have to be placed so that one pad is on the  50  transmission line and the other pad represents the start of the sense line to the ANT_DET pin.  The additional components (R1, C1 and D1) on the ANT_DET line have to be placed as ESD protection.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 98 of 158 2.5 SIM interface  SIM detection interface (GPIO5) is not available on the MPCI-L2 series modules.  SIM detection interface (GPIO5) is not supported by the TOBY-L2 “00”, “01”, and “50” product versions: the pin should not be driven by any external device.  2.5.1 Guidelines for SIM circuit design Guidelines for SIM cards, SIM connectors and SIM chips selection The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and functional  characteristics  of  Universal  Integrated  Circuit  Cards  (UICC),  which  contains  the  Subscriber Identification  Module  (SIM)  integrated  circuit  that  securely  stores  all  the  information  needed  to  identify  and authenticate subscribers over the LTE/3G/2G network.  Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221 as follows:  Contact C1 = VCC (Supply)           It must be connected to VSIM or UIM_PWR  Contact C2 = RST (Reset)           It must be connected to SIM_RST or UIM_RESET  Contact C3 = CLK (Clock)           It must be connected to SIM_CLK or UIM_CLK  Contact C4 = AUX1 (Auxiliary contact)       It must be left not connected  Contact C5 = GND (Ground)          It must be connected to GND  Contact C6 = VPP (Programming supply)       It must be connected to VSIM or UIM_PWR  Contact C7 = I/O (Data input/output)        It must be connected to SIM_IO or UIM_DATA  Contact C8 = AUX2 (Auxiliary contact)       It must be left not connected A removable SIM card can have 6 contacts (C1, C2, C3, C5, C6, C7) or 8 contacts, also including the auxiliary contacts C4 and C8 . Only 6 contacts are required and must be connected to the module SIM interface. Removable SIM cards are suitable for applications requiring a change of SIM card during the product lifetime.  A SIM card holder can have 6 or  8 positions  if a mechanical card presence  detector  is not provided,  or it can have 6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch integrated in the SIM connector for the mechanical card presence detection are provided. Select a SIM connector providing 6+2 or 8+2 positions if the optional SIM detection feature (not available on MPCI-L2 series) is required by the custom application, otherwise a connector without integrated mechanical presence switch can be selected.  Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as:  Case Pin 8 = UICC Contact C1 = VCC (Supply)     It must be connected to VSIM or UIM_PWR  Case Pin 7 = UICC Contact C2 = RST (Reset)       It must be connected to SIM_RST or UIM_RESET  Case Pin 6 = UICC Contact C3 = CLK (Clock)       It must be connected to SIM_CLK or UIM_CLK  Case Pin 5 = UICC Contact C4 = AUX1 (Aux.contact)     It must be left not connected  Case Pin 1 = UICC Contact C5 = GND (Ground)     It must be connected to GND  Case Pin 2 = UICC Contact C6 = VPP (Progr. supply)    It must be connected to VSIM or UIM_PWR  Case Pin 3 = UICC Contact C7 = I/O (Data I/O)    It must be connected to SIM_IO or UIM_DATA  Case Pin 4 = UICC Contact C8 = AUX2 (Aux. contact)    It must be left not connected A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses, but only 6 contacts are required and must be connected to the module SIM card interface as described above. Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 99 of 158 Guidelines for single SIM card connection without detection A removable SIM card placed in a SIM card holder must be connected to the SIM card interface of TOBY-L2 and MPCI-L2 series modules as described in Figure 49, where the optional SIM detection feature is not implemented. Follow these guidelines to connect the module to a SIM connector without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM / UIM_PWR pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO / UIM_DATA pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK / UIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST / UIM_RESET pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) on SIM supply line, close to the relative pad of the SIM connector, to prevent digital noise.  Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder.  Provide  a  very  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Tyco  PESD0402-140)  on  each externally accessible SIM line, close to each relative pad of the SIM connector. ESD sensitivity rating of the SIM interface pins is 1 kV (HBM). So that, according to EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device.  Limit capacitance  and  series  resistance  on each  SIM  signal to  match  the  SIM requirements  (27.7  ns  is the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-L2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4C8C4MPCI-L2 series8UIM_PWR10UIM_DATA12UIM_CLK14UIM_RESETSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4C8C4 Figure 49: Application circuits for the connection to a single removable SIM card, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3, D4 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  J1 SIM Card Holder, 6 p, without card presence switch Various manufacturers, as C707 10M006 136 2 - Amphenol Table 29: Example of components for the connection to a single removable SIM card, with SIM detection not implemented
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 100 of 158 Guidelines for single SIM chip connection A  solderable  SIM  chip  (M2M  UICC  Form  Factor)  must  be  connected  the  SIM  card  interface  of  TOBY-L2  and MPCI-L2 series modules as described in Figure 50. Follow these guidelines to connect the module to a solderable SIM chip without SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM / UIM_PWR pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO / UIM_DATA pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK / UIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST / UIM_RESET pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Provide  a  100  nF  bypass  capacitor  (e.g.  Murata  GRM155R71C104K)  at  the  SIM  supply  line  close  to  the relative pad of the SIM chip, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line,  to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM lines.  Limit capacitance  and  series  resistance  on each  SIM  signal to match  the  SIM requirements (27.7  ns  is  the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-L2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5U1C4283671C1 C5C2 C6C3 C7C4 C887651234MPCI-L2 series8UIM_PWR10UIM_DATA12UIM_CLK14UIM_RESETSIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5U1C4283671C1 C5C2 C6C3 C7C4 C887651234 Figure 50: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata U1 SIM chip (M2M UICC Form Factor) Various Manufacturers Table 30: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 101 of 158 Guidelines for single SIM card connection with detection A  removable  SIM  card  placed  in  a  SIM  card  holder  must  be  connected  to  the  SIM  card  interface  of  TOBY-L2 modules as described in Figure 51, where the optional SIM card detection feature is implemented. Follow these guidelines to connect the module to a SIM connector implementing SIM presence detection:  Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module.  Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.  Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.  Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.  Connect the UICC / SIM contact C5 (GND) to ground.  Connect one pin of the mechanical switch integrated in the SIM connector (e.g. the SW2 pin as described in Figure 51) to the GPIO5 input pin of the module.  Connect  the  other  pin  of  the  mechanical  switch  integrated  in  the  SIM  connector  (e.g.  the  SW1  pin  as described in Figure 51) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 51.  Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 51  Provide  a  100  nF  bypass  capacitor  (e.g.  Murata  GRM155R71C104K)  at  the  SIM  supply  line,  close  to  the related pad of the SIM connector, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder.  Provide  a  very  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Tyco  PESD0402-140)  on  each externally accessible SIM line, close to each  related pad of the SIM connector: ESD sensitivity rating of the SIM interface pins is 1 kV (HBM), so that, according to the EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device.  Limit capacitance  and  series  resistance  on each  SIM  signal to match  the  SIM requirements (27.7  ns  is  the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).  TOBY-L2 series5V_INT60GPIO5SIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4SW1SW2D1 D2 D3 D4 D5 D6R2R1C8C4TP59VSIM57SIM_IO56SIM_CLK58SIM_RST Figure 51: Application circuit for the connection to a single removable SIM card, with SIM detection implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, … , D6 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 1 k Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 k Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder, 6 + 2 p, with card presence switch Various manufacturers, as CCM03-3013LFT R102 - C&K  Table 31: Example of components for the connection to a single removable SIM card, with SIM detection implemented
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 102 of 158 Guidelines for dual SIM card / chip connection  Two SIM card / chip can be connected to the SIM interface of TOBY-L2 and MPCI-L2 series modules as described in the application circuits of Figure 52. TOBY-L2 and MPCI-L2 series modules do not support the usage of two SIM at the same time, but two SIM can be populated on the application board, providing a proper switch to connect only the first or only the second SIM at a time to the SIM interface of the modules, as described in Figure 52. TOBY-L2    “00”,  “01”,  and  “50”  product  versions  and  MPCI-L2  modules  do  not  support  SIM  hot  insertion  / removal  functionality:  the  physical  connection  between  the  external  SIM  and  the  module  has  to  be  provided before the module boot and then held for normal operation. Switching from one SIM to another can only be properly done within one of these two time periods:  after module switch-off by the AT+CPWROFF and before module switch-on by PWR_ON  after network deregistration by AT+COPS=2 and before module reset by AT+CFUN=16  TOBY-L2 modules (except “00”, “01”, “50” product versions) support SIM hot insertion / removal on the GPIO5 pin:  if  the  feature  is  enabled  using  the  specific  AT  commands  (see  sections  1.8.2  and  1.11,  and  u-blox  AT Commands Manual [3], +UGPIOC, +UDCONF commands), the switch from first SIM to the second SIM can be properly  done  when  a  Low  logic  level  is  present  on  the  GPIO5  pin  (“SIM  not  inserted”  =  SIM  interface  not enabled), without the necessity of a module re-boot, so that the SIM interface will be re-enabled by the module to use the second SIM when a high logic level is re-applied on the GPIO5 pin. In the  application circuit example represented  in Figure 52,  the application processor will drive the SIM switch using its own GPIO to properly select the SIM that is used by the module. Another GPIO may be used to handle the  SIM  hot  insertion  /  removal  function  of  TOBY-L2  modules,  which  can  also  be  handled  by  other  external circuits or by the cellular module GPIO according to the application requirements. The  dual  SIM  connection  circuit  described  in  Figure  52  can  be  implemented  for  SIM  chips  as  well,  providing proper connection between SIM switch and SIM chip as described in Figure 50. If it is required to switch between more than  2 SIM, a circuit similar to the one described in  Figure 52 can be implemented: in case of 4 SIM circuit, using proper 4-throw switch instead of the suggested 2-throw switches.  Follow these guidelines to connect the module to two external SIM connectors:  Use a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) 2-throw analog switch (e.g. Fairchild FSA2567) as SIM switch to ensure high-speed data transfer according to SIM requirements.  Connect the contacts C1 (VCC) and C6 (VPP) of the two UICC / SIM to the  VSIM / UIM_PWR pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect  the  contact  C7  (I/O)  of  the  two  UICC  /  SIM  to  the  SIM_IO /  UIM_DATA  pin  of  the  module  by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect  the  contact  C3  (CLK)  of  the  two  UICC  /  SIM  to  the  SIM_CLK /  UIM_CLK pin  of  the  module  by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C2 (RST) of the two UICC / SIM to the  SIM_RST / UIM_RESET pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567).  Connect the contact C5 (GND) of the two UICC / SIM to ground.  Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply (VSIM / UIM_PWR), close to the related pad of the two SIM connectors, to prevent digital noise.   Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close  to  each  related  pad  of  the  two  SIM  connectors,  to  prevent  RF  coupling  especially  in  case  the  RF antenna is placed closer than 10 - 30 cm from the SIM card holders.  Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each pad of the two SIM connectors, according to the EMC/ESD requirements of the custom application.  Limit capacitance  and  series  resistance  on each  SIM  signal to match  the  SIM requirements (27.7  ns  is  the maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 103 of 158 TOBY-L2 seriesC1FIRST             SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4GNDU159VSIM VSIM 1VSIM2VSIMVCCC114PDT Analog Switch3V857SIM_IO DAT 1DAT2DAT56SIM_CLK CLK 1CLK2CLK58SIM_RST RST 1RST2RSTSELSECOND   SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6 C7 C8 C10C9 D5 D6 D7 D8Application ProcessorGPIOR1MPCI-L2 seriesC1FIRST             SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2 C3 C5J1C4 D1 D2 D3 D4GNDU18UIM_PWR VSIM 1VSIM2VSIMVCCC114PDT Analog Switch3V810UIM_DATA DAT 1DAT2DAT12UIM_CLK CLK 1CLK2CLK14UIM_RESET RST 1RST2RSTSELSECOND   SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6 C7 C8 C10C9 D5 D6 D7 D8Application ProcessorGPIOR1 Figure 52: Application circuit for the connection to two removable SIM cards, with SIM detection not implemented Reference Description Part Number – Manufacturer C1 – C4, C6 – C9 33 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H330JZ01 – Murata C5, C10, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 – Murata D1 – D8 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL- Yageo Phycomp J1, J2 SIM Card Holder, 6 + 2 p., with card presence switch CCM03-3013LFT R102 - C&K Components U1 4PDT Analog Switch,  with Low On-Capacitance and Low On-Resistance FSA2567 - Fairchild Semiconductor Table 32: Example of components for the connection to two removable SIM cards, with SIM detection not implemented
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 104 of 158 2.5.2 Guidelines for SIM layout design The  layout  of  the  SIM  card  interface  lines  (VSIM,  SIM_CLK,  SIM_IO,  SIM_RST  or  UIM_PWR,  UIM_DATA, UIM_CLK, UIM_RESET) may be critical if the SIM card is placed far away from the TOBY-L2 and MPCI-L2 series modules  or  in  close  proximity  to  the  RF  antenna:  these  two  cases  should  be  avoided  or  at  least  mitigated  as described below.  In the first case, the long connection can cause the radiation of some harmonics of the digital data frequency as any  other  digital  interface.  It  is  recommended  to  keep  the  traces  short  and  avoid  coupling  with  RF  line  or sensitive analog inputs. In  the  second  case,  the  same  harmonics  can  be  picked  up  and  create  self-interference  that  can  reduce  the sensitivity of LTE/3G/2G receiver channels whose carrier frequency is coincidental with harmonic frequencies. It is strongly recommended to place the RF bypass capacitors suggested in Figure 49 near the SIM connector. In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges. Add adequate ESD protection as suggested to protect module SIM pins near the SIM connector. Limit  capacitance  and  series  resistance  on  each  SIM  signal  to  match  the  SIM  specifications.  The  connections should always be kept as short as possible. Avoid coupling with any sensitive analog circuit, since the SIM signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 105 of 158 2.6 Data communication interfaces 2.6.1 Universal Serial Bus (USB) 2.6.1.1 Guidelines for USB circuit design The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for full speed signaling handshake, as well as in differential mode for high speed signaling and data transfer. USB pull-up or pull-down resistors and external series resistors on USB_D+ and USB_D- lines as required by the USB 2.0 specification [6] are part of the module USB pin driver and do not need to be externally provided. The additional VUSB_DET input is available as optional feature to sense the host VBUS voltage (5.0 V typical).   The VUSB_DET functionality is not supported by TOBY-L2 “00”, “01”, and “50” product versions: the pin should be left unconnected or it should not be driven high (for more details, see section 1.9.1.1).  The VUSB_DET pin is not available on MPCI-L2 series modules.  Routing the USB pins to a connector, they will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection device with very low capacitance should be provided close to accessible point on the line connected to this pin, as described in Figure 53 and Table 33.   The  USB  interface  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F). Higher protection level could be required if  the lines are  externally accessible  and  it can be achieved by mounting  a  very  low  capacitance  (i.e.  less  or  equal  to  1  pF)  ESD  protection  (e.g.  Tyco  Electronics PESD0402-140 ESD protection device) on the lines connected to these pins, close to accessible points.  The USB_D+ and USB_D- pins of the modules can be directly connected to the USB host application processor without additional ESD protections if they are not externally accessible or according to EMC/ESD requirements.  D+D-GND28 USB_D+27 USB_D-GNDUSB DEVICE CONNECTORVBUSD+D-GND28 USB_D+27 USB_D-GNDUSB HOST PROCESSORD+D-GND38 USB_D+36 USB_D-GNDUSB DEVICE CONNECTORVBUSTOBY-L2 series  TOBY-L2 series MPCI-L2 series  MPCI-L2 series D+D-GND38 USB_D+36 USB_D-GNDUSB HOST PROCESSORVBUS 4VUSB_DET4VUSB_DETD1 D2D1 D2VBUS Figure 53: USB Interface application circuits Reference Description Part Number - Manufacturer D1, D2 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  Table 33: Component for USB application circuits
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 106 of 158  If the  USB interface pins are  not used, they  can be left  unconnected on the application  board, but it  is recommended providing accessible test points directly connected to USB_D+ and USB_D- pins.  2.6.1.2 Guidelines for USB layout design The USB_D+ / USB_D- lines require accurate layout design to achieve reliable signaling at the high speed data rate (up to 480 Mb/s) supported by the USB serial interface.  The characteristic impedance of the USB_D+ / USB_D- lines is specified by the Universal Serial Bus Revision 2.0 specification  [6].  The  most  important  parameter  is  the  differential  characteristic  impedance  applicable  for  the odd-mode electromagnetic field, which should be as close as possible to 90  differential. Signal integrity may be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long. Use the following general routing guidelines to minimize signal quality problems:  Route USB_D+ / USB_D- lines as a differential pair  Route USB_D+ / USB_D- lines as short as possible  Ensure the differential characteristic impedance (Z0) is as close as possible to 90   Ensure the common mode characteristic impedance (ZCM) is as close as possible to 30   Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area  Figure  54  and  Figure  55  provide  two  examples  of  coplanar  waveguide  designs  with  differential  characteristic impedance close to 90  and common mode characteristic impedance close to 30 . The first transmission line can  be  implemented  in  case  of  4-layer  PCB  stack-up  herein  described,  the  second  transmission  line  can  be implemented in case of 2-layer PCB stack-up herein described.  35 µm35 µm35 µm35 µm270 µm270 µm760 µmL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric350 µm 400 µm400 µm350 µm400 µm Figure 54: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 4-layer board layup 35 µm35 µm1510 µmL2 CopperL1 CopperFR-4 dielectric740 µm 410 µm410 µm740 µm410 µm Figure 55: Example of USB line design, with Z0 close to 90  and ZCM close to 30 , for the described 2-layer board layup
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 107 of 158 2.6.2 Asynchronous serial interface (UART)  The UART interface is not available on MPCI-L2 series modules.  2.6.2.1 Guidelines for UART circuit design  The  UART  interface  is  not  supported  by  TOBY-L200-00S  and  TOBY-L210-00S  product  versions:  all  the UART pins should not be driven by any external device.  The DTR, DSR and DCD signals are not supported by TOBY-L200-50S, TOBY-L210-50S product versions: the pins should not be driven by any external device.  Providing the full RS-232 functionality (using the complete V.24 link) If RS-232 compatible signal levels are needed, two different external voltage translators  can be used to provide full RS-232 (9 lines) functionality: e.g. using the Texas Instruments SN74AVC8T245PW for the translation from 1.8 V to 3.3 V, and the Maxim MAX3237E for the translation from 3.3 V to RS-232 compatible signal level. If a 1.8 V Application Processor (DTE) is used and complete RS-232 functionality is required, then the complete 1.8 V UART interface of the module (DCE) should be connected to a 1.8 V DTE, as described in Figure 56. TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP Figure 56: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 57. 5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR1DIR3 OEB2 A2B4A4DIR4DIR2TP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTP Figure 57: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 34: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 108 of 158 Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required in, or the lines are not available:  Connect the module DTR input line to GND using a 0  series resistor, since the module requires DTR active  Leave DSR, DCD and RI lines of the module unconnected and floating  If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.  If a 1.8 V Application Processor is used, the circuit should be implemented as described in Figure 58.  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTP0ΩTP0ΩTPTPTPTP Figure 58: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 59.  5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR4TP0ΩTP0ΩTP0ΩTP0ΩTP0ΩTPTPTPTP Figure 59: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 35: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 109 of 158 Providing the TXD and RXD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, then:  Connect  the  module  RTS  input  line  to  GND  or  to  the  CTS  output  line  of  the  module:  since  the  module requires RTS active (low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), the pin can be connected using a 0  series resistor to GND or to the active-module CTS (low electrical level) when the module is in active-mode, the UART interface is enabled and the HW flow-control is enabled  Connect the module DTR input line to GND using a 0  series resistor, as the module requires DTR active  Leave DSR, DCD and RI lines of the module unconnected and floating  If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard.   If a 1.8 V Application Processor (DTE) is used, the circuit that should be implemented as described in Figure 60  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD14 RTS15 CTS10 DSR11 RI12 DCDGND0ΩTP0ΩTP0ΩTPTP0ΩTPTPTPTP Figure 60: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor (DTE) is used, then it is recommended to connect the 1.8 V UART interface of the module  (DCE)  by  means  of  appropriate  unidirectional  voltage  translators  using  the  module  V_INT  output  as 1.8 V supply for the voltage translators on the module side, as described in Figure 61.  5V_INTTxDApplication Processor(3.0V DTE)RxDDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16 TXD13 DTR17 RXD10 DSR11 RI12 DCDGND1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2 OEVCCB2 A2RTSCTS14 RTS15 CTSTP0ΩTP0ΩTP0ΩTPTP0ΩTPTPTPTP Figure 61: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 36: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 110 of 158 Additional considerations If  a  3.0  V  Application  Processor  (DTE)  is  used,  the  voltage  scaling  from  any  3.0  V  output  of  the  DTE  to  the corresponding  1.8  V  input  of  the  module  (DCE)  can  be  implemented  as  an  alternative  low-cost  solution,  by means of an appropriate voltage divider. Consider the value of the pull-up integrated at the input of the module (DCE) for the correct selection of the voltage divider resistance values and mind that any DTE signal connected to the  module  must  be  tri-stated  or  set  low  when  the  module  is  in  power-down  mode  and  during  the  module power-on sequence (at least until the activation of the V_INT supply output of the module), to avoid latch-up of circuits and allow a proper boot of the module (see the remark below).  Moreover, the voltage scaling from any 1.8 V output of the cellular module (DCE) to the  corresponding 3.0 V input of the Application Processor (DTE) can be implemented by means of an appropriate low-cost non-inverting buffer with open drain output. The non-inverting buffer should be supplied by the V_INT supply output of the cellular module. Consider the value of the pull-up integrated at each input of the DTE (if any) and the baud rate required by the application for the appropriate selection of the resistance value for the external pull-up biased by the application processor supply rail.   If power saving is enabled the application circuit with the TXD and RXD lines only is not recommended. During command mode the DTE must send to the module a wake-up character or a dummy “AT” before each command line (see section 1.9.2.4 for the complete description), but during data mode the wake-up character or the dummy “AT” would affect the data communication.   Do not apply voltage to any UART interface pin before the switch-on of the UART supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the  cellular  module  cannot  be  tri-stated  or  set  low,  insert  a  multi  channel  digital  switch  (e.g.  TI SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit  connections  and  set  to  high impedance before V_INT switch-on.   ESD  sensitivity  rating  of  UART  interface  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher protection level could be required if  the lines are  externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.   If the UART interface pins are not used, they can be left unconnected on the application board, but  it is recommended providing accessible test points directly connected to all the UART pins (TXD, RXD,  RTS, CTS, DTR, DSR, DCD, RI) for diagnostic purpose, in particular providing a 0  series jumper on each line to detach each UART pin of the module from the DTE application processor.  2.6.2.2 Guidelines for UART layout design The UART serial interface requires the same consideration regarding electro-magnetic interference as any other digital  interface.  Keep  the  traces  short  and  avoid  coupling  with  RF  line  or  sensitive  analog  inputs,  since  the signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 111 of 158 2.6.3 DDC (I2C) interface  The I2C bus compatible Display Data Channel interface is not available on MPCI-L2 series modules.  2.6.3.1 Guidelines for DDC (I2C) circuit design  I2C bus function is not supported by TOBY-L2 “00”, “01”, and “50” product versions: the pins should not be driven by any external device.  General considerations The DDC  I2C-bus master interface can be used to communicate with u-blox GNSS receivers and other external I2C-bus slaves as an audio codec. Beside the general considerations reported below, see:  the following parts of this section for specific guidelines for the connection to u-blox GNSS receivers  the section 2.7.1 for an application circuit example with an external audio codec I2C-bus slave To be compliant with the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be mounted externally. Resistor values must conform to  I2C bus specifications [12]: for example, 4.7 k resistors can be commonly used. Pull-ups must be connected to a supply voltage of 1.8 V (typical), since this is the voltage domain of the DDC pins which are not tolerant to higher voltage values (e.g. 3.0 V).   Connect the DDC (I2C) pull-ups to the V_INT 1.8 V supply source, or another 1.8 V supply source enabled after V_INT (e.g., as the GNSS 1.8 V supply present in Figure 62 application circuit), as any external signal connected to the DDC (I2C) interface must not be set high before the switch-on of the V_INT supply of DDC pins, to avoid latch-up of circuits and let a proper boot of the module.  The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase  the  capacitance.  If  the  bus capacitance  is  increased, use pull-up resistors  with  nominal resistance value lower than 4.7 k, to match the I2C bus specifications [12] regarding rise and fall times of the signals.   Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible.  If the pins are not used as DDC bus interface, they can be left unconnected.  ESD  sensitivity  rating  of  the  DDC  (I2C)  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114). Higher protection level could be required if  the lines are  externally accessible  and  it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 112 of 158 Connection with u-blox 1.8 V GNSS receivers Figure 62 shows an application circuit for connecting TOBY-L2 cellular modules to a u-blox 1.8 V GNSS receiver.  SDA / SCL pins of the TOBY-L2 cellular module are directly connected to the relative I2C pins of the u-blox 1.8 V GNSS receiver, with appropriate pull-up resistors connected to the 1.8 V GNSS supply enabled after the V_INT supply of the I2C pins of the TOBY-L2 cellular module.  GPIO3  and  GPIO4  pins  are  directly  connected  respectively  to  the  TxD1  and  EXTINT0  pins  of  the  u-blox 1.8 V GNSS receiver to provide “GNSS data ready” and “GNSS RTC sharing” functions.  GPIO2  pin  is  connected  to  the  shutdown  input  pin  (SHDNn)  of  the  LDO  regulators  providing  the  1.8  V supply rail for the u-blox 1.8 V GNSS receiver implementing the “GNSS enable” function, with appropriate pull-down resistor mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver.  The V_BCKP output of the cellular module is connected to the V_BCKP input pin of the GNSS receiver to provide the supply for the GNSS RTC and backup RAM when the VCC supply of the cellular module is within its  operating  range  and  the  VCC  supply  of  the  GNSS  receiver  is  disabled.  This  enables  the  u-blox  GNSS receiver  to  recover  from  a  power  breakdown  with  either  a  hot  start  or  a  warm  start  (depending  on  the duration of the GNSS VCC outage) and to maintain the configuration settings saved in the backup RAM.  TOBY-L2 series(except ’00’, ‘01’, ‘50’ versions)R1INOUTGNDGNSS LDORegulatorSHDNnu-blox GNSS1.8 V receiverSDA2SCL2R21V8 1V8VMAIN1V8U122 GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO455542425VCCR3V_BCKP V_BCKP3GNSS data readyGNSS RTC sharingGNSS supply enabled Figure 62: Application circuit for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers Reference Description Part Number - Manufacturer R1, R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp U1, C1 Voltage Regulator for GNSS receiver and capacitor See GNSS receiver Hardware Integration Manual Table 37: Components for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 113 of 158 Figure 63 illustrates an alternative application circuit solution in which the TOBY-L2 supplies a u-blox 1.8 V GNSS receiver.  The  V_INT  1.8  V  regulated  supply  output  of  a  TOBY-L2  module  can  be  used  as  supply  source  for  a u-blox  1.8  V  GNSS  receiver  (u-blox  6  generation  receiver  or  newer)  instead  of  using  an  external  voltage regulator,  as  shown  in  Figure  62.  The  V_INT  supply is  able  to  support  the  maximum  current  consumption  of these positioning receivers. The internal switching step-down regulator that generates the  V_INT supply is set to 1.8 V (typical) when the cellular module is switched on and it is disabled when the module is switched off. The supply of the u-blox 1.8 V GNSS receiver can be switched off using an external p-channel MOS controlled by the  GPIO2  pin of  TOBY-L2  cellular modules  by  means  of a  proper  inverting transistor  as shown  in  Figure  63, implementing the “GNSS supply enable” function. If this feature is not required, the V_INT supply output can be directly connected to the u-blox 1.8 V GNSS receiver, so that it will switch on when V_INT output is enabled. According to the V_INT supply output voltage ripple characteristic specified in the TOBY-L2 Data Sheet [1]:  Additional filtering may be needed to properly supply an external LNA, depending on the characteristics of the used LNA, adding a series ferrite bead and a bypass capacitor (e.g. the Murata BLM15HD182SN1 ferrite bead and the Murata GRM1555C1H220J 22 pF capacitor) at the input of the external LNA supply line  u-blox GNSS1.8 V receiverTxD1EXTINT0V_BCKP V_BCKP3SDA2SCL2VCC1V8C1R35V_INTR5R4TPT2T1R1 R21V8 1V8GNSS data readyGNSS RTC sharingGNSS supply enabled 22 GPIO2SDASCLGPIO3GPIO455542425TOBY-L2 series(except ‘00’, ‘01’, ‘50’ versions) Figure 63: Application circuit for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers using V_INT as supply Reference Description Part Number - Manufacturer R1, R2 4.7 k Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 k Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp R4 10 k Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R5 100 k Resistor 0402 5% 0.1 W  RC0402JR-07100KL - Yageo Phycomp T1 P-Channel MOSFET Low On-Resistance IRLML6401 - International Rectifier or NTZS3151P - ON Semi T2 NPN BJT Transistor BC847 - Infineon C1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata Table 38: Components for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers using V_INT as supply  For additional  guidelines regarding  the  design of applications with  u-blox  1.8  V  GNSS  receivers  see  the  GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 114 of 158 Connection with u-blox 3.0 V GNSS receivers Figure 64 shows an application circuit for connecting TOBY-L2 cellular modules to a u-blox 3.0 V GNSS receiver:  As the SDA and SCL pins of the TOBY-L2 cellular module are not tolerant up to 3.0 V, the connection to the related  I2C  pins  of  the  u-blox  3.0  V  GNSS  receiver  must  be  provided  using  a  proper  I2C-bus  Bidirectional Voltage Translator with proper pull-up resistors (e.g. the TI TCA9406 additionally provides the partial power down feature so that the GNSS 3.0 V supply can be ramped up before the V_INT 1.8 V cellular supply).  As the GPIO3 and GPIO4 pins of the TOBY-L2 cellular module are not tolerant up to 3.0 V, the connection to the related pins of the u-blox 3.0 V GNSS receiver must be provided using a proper Unidirectional General Purpose  Voltage  Translator  (e.g.  TI  SN74AVC2T245,  which  additionally  provides  the  partial  power  down feature so that the 3.0 V GNSS supply can be also ramped up before the V_INT 1.8 V cellular supply).  GPIO2  pin  is  connected  to  the  shutdown  input  pin  (SHDNn)  of  the  LDO  regulators  providing  the  3.0  V supply rail for the u-blox 3.0 V GNSS receiver implementing the “GNSS enable” function, with appropriate pull-down resistor mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver.  The V_BCKP supply output of the cellular module can be directly connected to the V_BCKP backup supply input pin of the GNSS receiver as in the application circuit for a u-blox 1.8 V GNSS receiver. u-blox GNSS 3.0 V receiver24 GPIO325 GPIO41V8B1 A1GNDU3B2A2VCCBVCCAUnidirectionalVoltage TranslatorC4 C53V0TxD1EXTINT0R1INOUTGNSS LDO RegulatorSHDNnR2VMAIN3V0U122 GPIO255 SDA54 SCLR4 R51V8SDA_A SDA_BGNDU2SCL_ASCL_BVCCAVCCBI2C-bus Bidirectional Voltage Translator2V_INTC1C2 C3R3SDA2SCL2VCCDIR1DIR23V_BCKPV_BCKPOEnOEGNSS data readyGNSS RTC sharingGNSS supply enabledTOBY-L2 series       (except ‘00’, ‘01’, ‘50’ versions)GND Figure 64: Application circuit for connecting TOBY-L2 modules to u-blox 3.0 V GNSS receivers Reference Description Part Number - Manufacturer R1, R2, R4, R5 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1, C1 Voltage Regulator for GNSS receiver and capacitor  See GNSS receiver Hardware Integration Manual U2 I2C-bus Bidirectional Voltage Translator TCA9406DCUR - Texas Instruments U3 Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 39: Components for connecting TOBY-L2 modules to u-blox 3.0 V GNSS receivers For additional  guidelines regarding  the  design of applications with  u-blox  3.0  V  GNSS  receivers  see  the  GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers.  2.6.3.2 Guidelines for DDC (I2C) layout design The  DDC  (I2C)  serial  interface  requires  the  same  consideration  regarding  electro-magnetic  interference  as  any other digital interface. Keep the traces short and avoid coupling with RF line or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 115 of 158 2.6.4 Secure Digital Input Output interface (SDIO)  The SDIO Secure Digital Input Output interface is not available on MPCI-L2 series modules.  2.6.4.1 Guidelines for SDIO circuit design  The functionality of the SDIO Secure Digital Input Output interface pins is not supported by TOBY-L2 “00” and “01” product versions: the pins should not be driven by any external device.   TOBY-L2  series modules include a 4-bit Secure  Digital Input  Output  interface (SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) designed to communicate with an external u-blox short range Wi-Fi module. Combining a u-blox cellular module with a u-blox short range communication module gives designers full access to the Wi-Fi module directly via the cellular module, so that a second interface connected to the Wi-Fi module is not necessary. AT commands via the AT interfaces of the cellular module (UART, USB) allows full control of the Wi-Fi module from any host processor, because Wi-Fi control messages are relayed to the Wi-Fi module via the dedicated SDIO interface (for more details, see the Wi-Fi AT commands in the u-blox AT Commands Manual [3] and see the Wi-Fi / Cellular Integration Application Note [14]).  Figure 65 and Table 40 show an application circuit for connecting TOBY-L2 series cellular modules “50” product version to u-blox ELLA-W1 series short range Wi-Fi 802.11 b/g/n modules:  The SDIO pins of the cellular module are connected to the related SDIO pins of the u-blox ELLA-W1 series short range Wi-Fi module, with appropriate low value series damping resistors to avoid reflections and other losses in signal integrity, which may create ringing and loss of a square wave shape.  The most appropriate value for the series damping resistors on the  SDIO lines depends on the specific line lengths  and  layout  implemented.  In  general,  the  SDIO  series  resistors  are  not  strictly  required,  but  it  is recommended  to  slow  the  SDIO  signal,  for  example  with  22    or  33    resistors,  and  avoid  any  possible ringing problem without violating the rise / fall time requirements.   The V_INT supply output pin of the cellular module is connected to the shutdown input pin (SHDNn) of the two LDO regulators providing the 3.3 V and 1.8 V supply rails for the u-blox ELLA-W1 series Wi-Fi module, with appropriate pull-down resistors to avoid an improper switch on of the Wi-Fi module before the switch-on of the V_INT supply source of the cellular module SDIO interface pins.  The GPIO1 pin of the cellular module is connected to the active low full power down input pin (PDn) of the u-blox ELLA-W1 series Wi-Fi module, implementing the Wi-Fi enable function.  The configuration pin (CFG) of the u-blox ELLA-W1 series Wi-Fi module is connected to ground by means of a proper pull-down resistor for operation without sleep clock The  sleep  clock  input  pin  (SLEEP_CLK)  of  the  u-blox  ELLA-W1  series  Wi-Fi  module  is  left  not  connected, because an external clock source is not required for full power mode and automotive use.  The WLAN LED open drain output pin (LED_0) of the u-blox ELLA-W1 series Wi-Fi module is connected to an LED with appropriate current limiting resistor, indicating Wi-Fi activity as additional optional feature.  The WLAN antenna  RF  input/output  (ANT1) of the u-blox ELLA-W1 series  Wi-Fi module is  connected to  a Wi-Fi  antenna  with  an  appropriate  series  Wi-Fi  band-pass  filter  specifically  designed  for  the  coexistence between the Wi-Fi RF signals (2402...2482 MHz) and the LTE band 7 RF signals (2500...2690 MHz), as for example the Wi-Fi BAW band-pass filter TDK EPCOS B9604, or the TriQuint 885071, or the TriQuint 885032 or the Avago ACPF-7424, or the Taiyo Yuden F6HF2G441AF46.  All GND pins of the cellular module and the u-blox ELLA-W1 series Wi-Fi module are connected to ground.  All the other pins of the u-blox ELLA-W1 series Wi-Fi module are intended to be not connected.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 116 of 158 R2LDO regulatorELLA-W1 seriesWi-Fi module3V3VCCU1C1R1Wi-Fi enableSD_D015SD_D116SD_D211SD_D312SD_CLK14SD_CMD13PDn9OUTINSENSEBYPSHDNnGNDTOBY-L2xx-50S cellular module SDIO_D0 66SDIO_D1 68SDIO_D2 63SDIO_D3 67SDIO_CLK 64SDIO_CMD 65V_INT 5GPIO1 21C33V34C5LDO regulator 1V8VCCU2C2OUTINSENSEBYPSHDNnGND C4VIO5C61V86R3R4R5R6R7RESETn10SLEEP_CLK19CFG20LED_02R9 GNDANT1 29ANT2 26R8DL1GNDBand-Pass filterL1Wi-Fi antennaFL1 Figure 65: Application circuit for connecting TOBY-L2xx-50S cellular modules to u-blox ELLA-W1 series Wi-Fi modules Reference Description Part Number - Manufacturer C1, C2 1 µF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E105KA12 - Murata C3, C4 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C5, C6 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata DL1 LED Green SMT 0603 LTST-C190KGKT - Lite-on Technology Corporation FL1 WLAN band-pass filter with LTE Band 7 coexistence B39242B9604P810 - TDK EPCOS L1 15 nH Multilayer Inductor 0603 3% 0.25 A  MLG0603P15NHT000 - TDK R1 470 k Resistor 0402 5% 0.1 W  RK73B1ETTD474J - KOA R2, R3, R4, R5, R6, R7 22  Resistor 0402 5% 0.1 W  RK73B1ETTP220J - KOA R8 470  Resistor 0402 5% 0.1 W RK73B1ETTP471J - KOA R9 47 k Resistor 0402 5% 0.1 W  RK73B1ETTD473J - KOA  U1 LDO Linear Regulator 3.0 V 0.3 A LT1962EMS8-3.3 - Linear Technology U2 LDO Linear Regulator 1.8 V 0.3 A LT1962EMS8-1.8 - Linear Technology Table 40: Components for connecting TOBY-L2xx-50S cellular modules to u-blox ELLA-W1 series Wi-Fi modules   Do  not  apply  voltage  to  any  SDIO  interface  pin  before  the  switch-on  of  SDIO  interface  supply  source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module.  ESD sensitivity rating of SDIO interface pins is 1 kV (HMB according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a very low capacitance ESD protection (e.g. Tyco Electronics PESD0402-140 ESD), close to accessible points.  If the SDIO interface pins are not used, they can be left unconnected on the application board.  2.6.4.2 Guidelines for SDIO layout design The SDIO serial interface requires the same consideration regarding electro-magnetic interference as any other high speed digital interface. Keep the traces short, avoid stubs and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. Consider the usage of low value series damping resistors (see the application circuit in Figure 65 / Table 40) to avoid reflections and other losses in signal integrity, which may create ringing and loss of a square wave shape.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 117 of 158 2.7 Audio interface 2.7.1 Digital audio interface  The I2S interface is not available on MPCI-L2 series modules.  2.7.1.1 Guidelines for digital audio circuit design  The I2S interface is not supported by TOBY-L2 “00”, “01”, and “50” product versions: the pins should not be driven by any external device.  I2S digital audio interface can be connected to an external digital audio device for voice applications. The external digital  audio  device  must  be  properly  configured  according  to  the  cellular  module  configuration,  with  the opposite role, the same mode, the same sample rate and voltage level.  Any external digital audio device compliant with the configuration of the  digital audio interface of the TOBY-L2 cellular module can be used. Examples of compatible audio codec parts, suitable to provide analog audio voice capability on the application device, are the following:  Marvell 88PM805  Maxim MAX9860  Maxim MAX9867  Maxim MAX9880A  An  appropriate  specific  application  circuit  has  to  be  implemented  and  configured  according  to  the  particular external digital audio device or audio codec used and according to the application requirements.  Figure 66 and Table 41 describe an application circuit for the I2S digital audio interface providing voice capability using an external audio voice codec. DAC and ADC integrated in the external audio codec respectively converts an incoming digital data stream to analog audio output through a mono amplifier and converts the microphone input signal to the digital bit stream over the digital audio interface. The module’s I2S interface (I2S master) is connected to the related pins of the external audio codec (I2S slave). The GPIO6 of the TOBY-L2 series module (that provides a suitable digital output clock) is connected to the clock input of the external audio codec to provide clock reference. The external audio codec is controlled by the wireless module using the DDC (I2C) interface: this interface can be concurrently used to communicate with u-blox GNSS receivers and to control an external audio codec. The V_INT output supplies the external audio codec, defining proper digital interfaces voltage level. Additional  components  are  provided  for  EMC  and  ESD  immunity  conformity:  a  10  nF  bypass  capacitor  and  a series  chip  ferrite  bead  noise/EMI  suppression  filter  provided  on  each  microphone  line  input  and  speaker  line output of the external codec as described in Figure 66 and Table 41. The necessity of these or other additional parts for EMC improvement may depend on the specific application board design.  As various external audio codecs other than the one described  in Figure 66 / Table 41 can be used to provide voice capability, the appropriate specific application circuit has to be implemented and configured according to the particular external digital audio device or audio codec used and according to the application requirements.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 118 of 158 TOBY-L2 series        (except ‘00’, ‘01’, ‘50’ versions)GPIO6R2R1BCLKGNDU1LRCLKAudio   CodecSDINSDOUT55SDA54SCLSDASCL61 MCLKGNDIRQnR3 C3C2C15V_INTVDD1V8MICBIASC4 R4C5C6EMI1MICLNMICLPD1Microphone ConnectorEMI2MICC12 C11J1MICGND R5 C8 C7D2SPKSpeaker ConnectorOUTPOUTNJ2C10 C9C14 C13EMI3EMI452I2S_CLK50I2S_WA51I2S_TXD53I2S_RXD Figure 66: I2S interface application circuit with an external audio codec to provide voice capability Reference Description Part Number – Manufacturer C1 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 – Murata C2, C4, C5, C6 1 µF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J105KE19 – Murata C3 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C7, C8, C9, C10 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 – Murata C11, C12, C13, C14 10 nF Capacitor Ceramic X5R 0402 10% 50V GRM155R71C103KA88 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX EMI1, EMI2, EMI3, EMI4 Chip Ferrite Bead Noise/EMI Suppression Filter 1800 Ohm at 100 MHz, 2700 Ohm at 1 GHz BLM15HD182SN1 – Murata J1 Microphone Connector Various manufacturers  J2 Speaker Connector Various manufacturers  MIC 2.2 k Electret Microphone Various manufacturers R1, R2  4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 10 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R4, R5 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp SPK 32  Speaker Various manufacturers  U1 16-Bit Mono Audio Voice Codec MAX9860ETG+ - Maxim Table 41: Example of components for audio voice codec application circuit  Do not apply voltage to any I2S pin before the switch-on of I2S supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the  external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on.  ESD sensitivity rating of I2S interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a general purpose ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.  If the I2S digital audio pins are not used, they can be left unconnected on the application board.  2.7.1.2 Guidelines for digital audio layout design I2S  interface  and  clock  output  lines  require  the  same  consideration  regarding  electro-magnetic  interference  as any other high speed digital interface. Keep the traces short and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 119 of 158 2.8 General Purpose Input/Output  GPIOs  are  not  supported  by  TOBY-L2  “00”,  “01”, and  “50”  product  versions,  except  for  the  WWAN status  indication  configured  on  GPIO1 of  “00”,  “01”  product  versions  and  the  Wi-Fi  enable  function configured on GPIO1 of “50” product version: the pins should not be driven by any external device.  GPIOs are not available on MPCI-L2 series modules. 2.8.1.1 Guidelines for TOBY-L2 series GPIO circuit design A typical usage of TOBY-L2 modules’ GPIOs can be the following:  Network indication provided over GPIO1 pin (see Figure 67 / Table 42 below)  GNSS supply enable provided over GPIO2 (see Figure 62 / Table 37 or Figure 64 / Table 39 in section 2.6.3)  GNSS data ready provided over GPIO3 (see Figure 62 / Table 37 or Figure 64 / Table 39 in section 2.6.3)  GNSS RTC sharing provided over GPIO4 (see Figure 62 / Table 37 or Figure 64 / Table 39 in section 2.6.3)  SIM card detection provided over GPIO5 (see Figure 51 / Table 31 or Figure 52 / Table 32 in section 2.5)  Clock output provided over GPIO6 (see Figure 66 / Table 41 in section 2.7.1)  TOBY-L2 seriesGPIO1R1R33V8Network IndicatorR221DL1T1 Figure 67: Application circuit for network indication provided over GPIO1 Reference Description Part Number - Manufacturer R1 10 k Resistor 0402 5% 0.1 W Various manufacturers R2 47 k Resistor 0402 5% 0.1 W Various manufacturers R3 820  Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor BC847 - Infineon Table 42: Components for network indication application circuit  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 k resistor on the board in series to the GPIO of TOBY-L2 modules.  Do not apply voltage to any GPIO of TOBY-L2 before the switch-on of the GPIOs supply (V_INT), to avoid latch-up  of  circuits  and  allow  a  proper  module  boot.  If  the  external  signals  connected  to  the  module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on.  ESD  sensitivity  rating  of  the  GPIO  pins  is  1  kV  (Human  Body  Model  according  to  JESD22-A114).  Higher protection level could be required if  the lines are  externally  accessible  and it can  be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points.  If the GPIO pins are not used, they can be left unconnected on the application board.  2.8.1.2 Guidelines for general purpose input/output layout design The general purpose inputs / outputs pins are generally not critical for layout.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 120 of 158 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#)  Mini PCI Express specific signals (W_DISABLE#, LED_WWAN#) are not available on TOBY-L2 series.  2.9.1.1 Guidelines for W_DISABLE# circuit design As described in Figure 68, the MPCI-L2 series modules W_DISABLE# wireless disable input is equipped with an internal pull-up to the 3.3Vaux supply: an external pull-up resistor is not required and should not be provided. If connecting the W_DISABLE# input to a push button, the pin will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD  protection device should be provided close to accessible point, as described in Figure 68 and Table 43.   ESD sensitivity rating of the W_DISABLE# pin is 1 kV (HBM according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible push button  is  directly  connected  to  the  W_DISABLE#  pin,  and  it  can  be  achieved  by  mounting  an  ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.  An open drain output is suitable to drive the W_DISABLE# input from an application processor as it is equipped with an internal pull-up to the 3.3Vaux supply as described in Figure 68. A compatible push-pull output of an application processor can also be used. In any  case,  take care to  set the proper level in all the possible scenarios to avoid an inappropriate disabling of the radio operations.  MPCI-L2 series3.3Vaux20 W_DISABLE#Power-on push buttonESDOpen Drain OutputApplication ProcessorMPCI-L2 series3.3Vaux20 W_DISABLE#TP TP22 k22 k Figure 68: W_DISABLE# application circuit using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 43: Example of ESD protection component for the W_DISABLE# application circuit   If the W_DISABLE# functionality is not required by the application, the pin can be left unconnected.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 121 of 158 2.9.1.2 Guidelines for LED_WWAN# circuit design As described in Figure 69 and Table 44, the MPCI-L2 series modules LED_WWAN# active-low open drain output can be directly connected to a system-mounted LED to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [15].  Open Drain OutputR3V3DL42LED_WWAN#MPCI-L2 series Figure 69: LED_WWAN# application circuit Reference Description Remarks DL LED Green SMT 0603 LTST-C190KGKT - Lite-on Technology Corporation R 470  Resistor 0402 5% 0.1 W Various manufacturers Table 44: Example of components for the LED_WWAN# application circuit  ESD sensitivity rating of the LED_WWAN# pin is 1 kV (Human Body Model according to JESD22-A114).  Higher  protection  level  could  be  required  if  the  line  is  externally  accessible  and  it  can  be  achieved  by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point.  If the LED_WWAN# functionality is not required by the application, the pin can be left unconnected.  2.9.1.3 Guidelines for W_DISABLE# and LED_WWAN# layout design The W_DISABLE# and LED_WWAN# circuits are generally not critical for layout.   2.10 Reserved pins (RSVD)  Pins reserved for future use, marked as RSVD, are not available on MPCI-L2 series.  TOBY-L2 series modules have pins reserved for future use. All the RSVD pins are to be left unconnected on the application board except the RSVD pin number 6 which must be connected to ground as described in Figure 70.  TOBY-L2 seriesRSVD6RSVD Figure 70: Application circuit for the reserved pins (RSVD)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 122 of 158 2.11 Module placement An optimized placement allows a minimum RF line’s length and closer path from DC source for VCC / 3.3Vaux. Make  sure  that  the  module,  analog  parts  and  RF  circuits  are  clearly  separated  from  any  possible  source  of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which can produce Electro-Magnetic  Interference  that  affects  the  module,  analog  parts  and  RF  circuits’  performance.  Implement  proper countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly separated from  any  sensitive  part  /  circuit  which  may  be  affected  by  Electro-Magnetic  Interference,  or  employ countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Provide enough clearance between the module and any external part.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature of the application base-board below the TOBY-L2 and MPCI-L2 series modules: avoid placing temperature sensitive devices close to the module.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 123 of 158 2.12 TOBY-L2 series module footprint and paste mask Figure 71 and Table 45 describe the suggested footprint (i.e. copper mask) layout for TOBY-L2 series modules. The  proposed  land  pattern  layout  slightly  reflects  the  modules’  pads  layout,  with  most  of  the  lateral  pads designed wider on the application board (1.8 x 0.8 mm) than on the module (1.5 x 0.8 mm).  I1AG H J1DF2KM1 M1 M2 P2BGHJOOLNM1 M1 M3I1I1OHJJJEP3F1P1HI1OI2I2F2Module placement outline Figure 71: TOBY-L2 series module suggest footprint (application board top view) Parameter Value  Parameter Value  Parameter Value A 35.6 mm  H 0.80 mm  M2 5.20 mm B 24.8 mm  I1 1.50 mm  M3 4.50 mm D 2.40 mm  I2 1.80 mm  N 2.10 mm E 2.25 mm  J 0.30 mm  O 1.10 mm F1 1.45 mm  K 3.15 mm  P1 1.10 mm F2 1.30 mm  L 7.15 mm  P2 1.25 mm G 1.10 mm  M1 1.80 mm  P3 2.85 mm Table 45: TOBY-L2 series module suggest footprint dimensions The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, implementing the solder mask opening 50 µm larger per side than the corresponding copper pad. The suggested paste mask layout for TOBY-L2 series modules slightly reflects the copper mask layout described in Figure 71 and Table 45, as different stencil apertures layout for any specific pad is recommended:   Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout  Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout  Purple marked pads: Paste layout one to one to Copper layout The recommended solder paste thickness is 150 µm, according to application production process requirements.   These are recommendations only and not specifications. The exact mask geometries, distances and stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.) of the customer.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 124 of 158 2.13 MPCI-L2 series module installation MPCI-L2 series modules are fully compliant with the 52-pin PCI Express Full-Mini Card Type F2 form factor, i.e., top-side and bottom-side keep-out areas, 50.95 mm nominal length, 30 mm  nominal width, and all the other dimensions  as  defined  by  the  PCI  Express  Mini  Card  Electromechanical  Specification [15],  except  for  the  card thickness (which nominal value is 3.7 mm), as described in Figure 72.  3.7 mmSide ViewPin 1 Pin 51ANT1ANT2Top ViewHole GND HoleGND 30 mmPin 52 Pin 2Bottom ViewHole GND HoleGND50.95 mm Figure 72: MPCI-L2 series mechanical description (top, side and bottom views)  MPCI-L2  series  modules  are  fully  compliant  with  the  52-pin  PCI  Express  Full-Mini  card  edge  type  system connector as defined by the PCI Express Mini Card Electromechanical Specification [15]. Table 46 describes some examples of 52-pin mating system connectors for the MPCI-L2 series PCI Express Full-Mini card modules.  Manufacturer Part Number Description JAE Electronics MM60 series 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector Molex 67910 series 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector TE Connectivity / AMP 2041119 series 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector FCI 10123824 series 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector Table 46: MPCI-L2 series PCI Express Full-Mini card compatible connector   It  is  recommended  to  use  the  two  mounting  holes  described  in  Figure  72  to  fix  (ground)  the  MPCI-L2 module to the main ground of the application board with suitable screws and fasteners.  Follow the recommendations provided by the connector manufacturer and the guidelines available in the PCI Express Mini Card Electromechanical Specification [15] for the development of the footprint (i.e. the copper  mask)  PCB  layout  for  the  mating  edge  system  connector.  The  exact  geometries,  distances  and stencil thicknesses should be adapted to the specific production processes (e.g. soldering etc.).  Follow the recommendations provided by the connector manufacturer to properly insert and remove the MPCI-L2 series modules.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 125 of 158 MPCI-L2 series modules are equipped with two Hirose U.FL-R-SMT RF receptacles for ANT1 / ANT2 ports, which require a suitable mated RF plug from the same connector series as the examples listed in Table 24. To mate the connectors, the mating axes of both connectors must be aligned. The "click" will confirm  the fully mated connection. Do not attempt to insert on an extreme angle: insert the  RF plug connectors vertically into the ANT1 / ANT2 RF receptacles of the modules, as described in Figure 73. Correct Wrong Figure 73: Precautions during RF connector mating  To unplug the RF cable assembly it is encouraged to use a suitable extraction tool for the RF connector, such as the  Hirose  U.FL-LP-N  or  the  Hirose  U.FL-LP(V)-N  extraction  jig,  according  to  the  RF  cable  assembly  type  used. Hook the end portion of the extraction jig onto the connector cover and pull off vertically in the direction of the connector mating axis, as described in Figure 74.  Extraction JigRF Cable AssemblyU.FL Receptacle Figure 74: Precautions during RF connector extraction  Any attempt to unplug the RF connectors  by pulling on the cable assembly without using a suitable extraction tool may result in damage and affect the RF performance. Do not forcefully twist, deform, or apply any excessive pull force to the RF cables or damage the RF connectors, otherwise the RF performance may be reduced.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 126 of 158 2.14 Thermal guidelines  Modules’ operating temperature range is specified in TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2].  The  most  critical  condition  concerning  module  thermal  performance  is  the  uplink  transmission  at  maximum power (data upload in connected-mode), when the baseband processor runs at full speed, radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks (for example, see the Terminal Tx Power distribution for WCDMA, taken from operation on a live network,  described  in  the  GSMA  TS.09  Battery  Life  Measurement  and  Current  Consumption  Technique  [21]); however the application should be correctly designed to cope with it. During transmission at maximum RF  power the  TOBY-L2 and MPCI-L2 series modules generate thermal power that may exceed 3 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the actual antenna return loss, the number of allocated TX resource blocks, the transmitting frequency  band,  etc.  The  generated  thermal  power  must  be  adequately  dissipated  through  the  thermal  and mechanical design of the application. The  spreading  of  the  Module-to-Ambient  thermal  resistance  (Rth,M-A)  depends  on  the  module  operating condition.  The  overall  temperature  distribution  is  influenced  by  the  configuration  of  the  active  components during the specific mode of operation and their different thermal resistance toward the case interface.   The  Module-to-Ambient  thermal  resistance  value  and  the  relative  increase  of  module  temperature  will differ according to the specific mechanical deployments of the module, e.g. application PCB with different dimensions and characteristics, mechanical shells enclosure, or forced air flow.  The  increase  of  the  thermal  dissipation,  i.e.  the  reduction  of  the  Module-to-Ambient  thermal  resistance,  will decrease  the  temperature  of  the  modules’  internal  circuitry  for  a  given  operating  ambient  temperature.  This improves the device long-term reliability in particular for applications operating at high ambient temperature.  A few hardware techniques may be used to reduce the Module-to-Ambient thermal resistance in the application:  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete thermal via stacked down to main ground layer.  Use the two mounting holes described in Figure 72 to fix (ground) the MPCI-L2 modules to the main ground of the application board with suitable screws and fasteners.  Provide a ground plane as wide as possible on the application board.  Optimize antenna return loss, to optimize overall electrical performance of the module including a decrease of module thermal power.  Optimize  the  thermal  design  of  any  high-power  components  included  in  the  application,  such  as  linear regulators and amplifiers, to optimize overall temperature distribution in the application device.  Select  the  material,  the  thickness  and  the  surface  of  the  box  (i.e.  the  mechanical  enclosure)  of  the application device that integrates the module so that it provides good thermal dissipation.  Force ventilation air-flow within mechanical enclosure.  Provide a heat sink  component  attached to  the  module top side, with electrically insulated  / high thermal conductivity adhesive, or on the backside of the application board, below the cellular module, as a large part of the heat is transported through the GND pads of the TOBY-L2 series LGA modules and dissipated over the backside of the application board.  Follow the thermal guidelines for integrating wireless wide area network mini card add-in cards, such as the MPCI-L2 series modules, as provided in the PCI Express Mini Card Electromechanical Specification [15]
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 127 of 158 For example, the Module-to-Ambient thermal resistance (Rth,M-A) is strongly reduced with forced air ventilation and a heat-sink installed on the back of the application board, decreasing the module temperature variation. Beside the reduction of the Module-to-Ambient thermal resistance implemented by proper application hardware design, the increase of module temperature can be moderated by proper application software implementation:  Enable power saving configuration using the AT+UPSV command (see section 1.15.18).   Enable module connected-mode for a given time period and then disable it for a time period enough long to properly mitigate temperature increase.  2.15 ESD guidelines The sections 2.15.1 and 2.15.2 are related to EMC / ESD immunity. The modules are ESD sensitive devices. The ESD sensitivity for  each  pin (as Human Body Model according to JESD22-A114F)  is specified in  TOBY-L2  series Data  Sheet [1]  or  MPCI-L2 series Data  Sheet [2]. Special  precautions are  required  when  handling  the pins;  for ESD handling guidelines see section 3.2.  2.15.1 ESD immunity test overview The  immunity  of  devices  integrating  TOBY-L2  and  MPCI-L2  series  modules  to  Electro-Static  Discharge  (ESD)  is part  of  the  Electro-Magnetic  Compatibility  (EMC)  conformity  which  is  required  for  products  bearing  the  CE marking, compliant  with  the R&TTE  Directive  (99/5/EC),  the EMC  Directive  (89/336/EEC)  and  the  Low  Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 [22] and the radio equipment standards ETSI EN 301 489-1 [23], ETSI EN 301 489-7 [24], ETSI EN 301 489-24 [25], which requirements are summarized in Table 47. The ESD immunity test is performed  at the enclosure  port, defined by  ETSI EN  301 489-1  [23]  as  the  physical boundary through which  the electromagnetic field  radiates. If  the  device  implements an integral  antenna,  the enclosure port  is seen as all insulating and conductive  surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1 [23]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting cables  to  auxiliary  equipment,  depends  on  device  accessible  interfaces  and  manufacturer  requirements,  as defined by ETSI EN 301 489-1 [23]. Contact  discharges  are  performed  at  conductive  surfaces,  while  air  discharges  are  performed  at  insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [22].   For the definition of integral antenna, removable antenna, antenna port and device classification see ETSI EN 301 489-1 [23]. For the contact / air discharges definitions see CENELEC EN 61000-4-2 [22].  Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 47: EMC / ESD immunity requirements as defined by CENELEC EN 61000-4-2 and ETSI EN 301 489-1, 301 489-7, 301 489-24
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 128 of 158 2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs Although  EMC  /  ESD  certification  is  required  for  customized  devices  integrating  TOBY-L2  and  MPCI-L2  series modules for R&TTED and European Conformance CE mark, EMC certification (including ESD immunity) has been successfully performed on TOBY-L2 and MPCI-L2 series modules reference design according to European Norms summarized in Table 47. The  EMC  /  ESD  approved  u-blox  reference  designs consist  of  a  TOBY-L2  and  MPCI-L2  series  module  installed onto  a  motherboard  which  provides  supply  interface,  SIM  card  and  communication  port.  External  LTE/3G/2G antennas are connected to the provided connectors. Since  external  antennas  are  used,  the  antenna  port  can  be  separated  from  the  enclosure  port.  The  reference design  is  not  enclosed  in  a  box  so  that  the  enclosure  port  is  not  identified  with  physical  surfaces.  Therefore, some test cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure.  Table 48 reports the u-blox TOBY-L2 and MPCI-L2 series reference designs ESD immunity test results, according to test requirements stated in the CENELEC EN 61000-4-2 [22], ETSI EN 301 489-1 [23], ETSI EN 301 489-7 [24] and ETSI EN 301 489-24 [25].  Category Application Immunity Level Remarks Contact Discharge  to coupling planes  (indirect contact discharge) Enclosure +4 kV / -4 kV  Contact Discharges  to conducted surfaces  (direct contact discharge) Enclosure port Not Applicable Test not applicable to u-blox reference design because it does not provide enclosure surface. The  test  is  applicable  only  to  equipment  providing conductive enclosure surface. Antenna ports +4 kV / -4 kV Test  applicable  to  u-blox  reference  design  because  it provides antennas with conductive & insulating surfaces. The  test  is  applicable  only  to  equipment  providing antennas with conductive surface. Air Discharge  at insulating surfaces Enclosure port Not Applicable Test  not  applicable  to  the  u-blox  reference  design because it does not provide an enclosure surface. The  test  is  applicable  only  to  equipment  providing insulating enclosure surface. Antenna ports +8 kV / -8 kV Test  applicable  to  u-blox  reference  design  because  it provides antennas with conductive & insulating surfaces. The  test  is  applicable  only  to  equipment  providing antennas with insulating surface. Table 48: Enclosure ESD immunity level of u-blox TOBY-L2 and MPCI-L2 series modules reference designs   TOBY-L2 and MPCI-L2 reference design implement all the ESD precautions described in section 2.15.3.  2.15.3 ESD application circuits The  application  circuits  described  in  this  section  are  recommended  and  should  be  implemented  in  the  device integrating TOBY-L2 and MPCI-L2 series modules, according to the application device classification (see ETSI EN 301 489-1 [23]), to satisfy the requirements for ESD immunity test summarized in Table 47.  Antenna interface  The  ANT1  and  ANT2  ports  of  TOBY-L2  and  MPCI-L2  series  modules  provide  ESD  immunity  up  to  ±4  kV  for direct  Contact  Discharge  and  up  to  ±8  kV  for  Air  Discharge:  no  further  precaution  to  ESD  immunity  test  is needed, as implemented in the EMC / ESD approved reference design of TOBY-L2 and MPCI-L2 series modules.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 129 of 158 The antenna interface application circuit implemented in the EMC / ESD approved reference designs of TOBY-L2 and MPCI-L2 series modules is described in Figure 47 in case of antennas detection circuit not implemented, and is described in Figure 48 and Table 28 in case of antennas detection circuit implemented (section 2.4).  RESET_N and PERST# pin The following precautions are suggested for the RESET_N and the PERST# line of TOBY-L2 and MPCI-L2 series modules, depending on the application board handling, to satisfy ESD immunity test requirements:  It is recommended to keep the connection line to RESET_N and PERST# as short as possible Maximum ESD sensitivity rating of the RESET_N and the PERST# pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the  RESET_N or PERST# pin is externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  general  purpose  ESD  protection  device  (e.g.  EPCOS  CA05P4S14THSG  varistor  array  or  EPCOS CT0402S14AHSG varistor) should be mounted on the RESET_N or PERST# line, close to accessible point The  RESET_N  and  PERST#  application  circuit  implemented  in  the  EMC  /  ESD  approved  reference  designs  of TOBY-L2 and MPCI-L2 series modules is described in Figure 42 and Table 23 (section 2.3.2).  SIM interface The following precautions are suggested for TOBY-L2 and MPCI-L2 series modules SIM interface, depending on the application board handling, to satisfy ESD immunity test requirements:  A bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) must be mounted on the lines connected to the SIM interface pins to assure SIM interface functionality when an electrostatic discharge is applied to the application board enclosure  It is suggested to use as short as possible connection lines at SIM pins Maximum ESD sensitivity rating of SIM interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if SIM interface pins are externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A low capacitance (i.e. less than 10 pF) ESD protection device (e.g. Tyco Electronics PESD0402-140) should be mounted on each SIM interface line, close to accessible points (i.e. close to the SIM card holder) The SIM interface application circuit implemented in the EMC / ESD approved reference designs of TOBY-L2 and MPCI-L2 series modules is described in Figure 49 and Table 29 (section 2.5).  Other pins and interfaces All the module pins that are externally accessible on the device integrating TOBY-L2 and MPCI-L2 series module should be included in the ESD immunity test since they are considered to be a port as defined in  ETSI EN 301 489-1  [23].  Depending  on  applicability,  to  satisfy  ESD  immunity  test  requirements  according  to  ESD  category level,  all  the  module  pins  that  are  externally  accessible  should  be  protected  up  to  ±4  kV  for  direct  Contact Discharge and up to ±8 kV for Air Discharge applied to the enclosure surface. The maximum ESD sensitivity rating of all the other pins of the module is 1 kV (Human Body Model according to JESD22-A114).  Higher  protection  level  could  be  required  if  the  relative  pin  is  externally  accessible  on  the application board. The following precautions are suggested to achieve higher protection level:  USB interface: a very low capacitance (i.e. less or equal to 1 pF) ESD protection device (e.g. Tyco Electronics PESD0402-140 ESD protection device) should be mounted on the  USB_D+ and USB_D- lines, close to the accessible points (i.e. close to the USB connector)  Other pins: a general purpose ESD protection device (e.g. EPCOS CA05P4S14THSG varistor array or EPCOS CT0402S14AHSG varistor) should be mounted on the related line, close to accessible point
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 130 of 158 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration 2.16.1 Schematic for TOBY-L200-00S / TOBY-L210-00S Figure 75 is an example of a schematic diagram where a TOBY-L200-00S / TOBY-L210-00S module is integrated into an application board, using all the available interfaces and functions of the module.  3V8GND330µF 100nF 10nFTOBY-L200-00S / TOBY-L210-00S71 VCC72 VCC70 VCC3V_BCKP23 RESET_NApplication processorOpen drain output20 PWR_ONOpen drain output68pF47pFSIM card connectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pF ESD ESD ESD ESD81ANT187ANT2Primary   cellular antennaTPTPSecondary cellular antenna5V_INT TP15pF 8.2pF+100µF+75ANT_DETGNDRTC back-up26 HOST_SELECT062 HOST_SELECT1SDASCL2627RSVDRSVD661GPIO622GPIO224GPIO325GPIO460GPIO521GPIO153I2S_RXD51I2S_TXD52I2S_CLK50I2S_WAV_INT16 TXD17 RXD12 DCD14 RTS15 CTS13 DTR10 DSR11 RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 hostD-D+27 USB_D-28 USB_D+VBUS 4VUSB_DETGND GND 65SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLKGND3V8WWANindicator Figure 75: Example of schematic diagram to integrate a TOBY-L200-00S / TOBY-L210-00S in an application, using all interfaces
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 131 of 158 2.16.2 Schematic for TOBY-L201-01S / TOBY-L280-00S Figure 76 is an example of a schematic diagram where a TOBY-L201-01S / TOBY-L280-00S module is integrated into an application board, using all the available interfaces and functions of the module.  3V8GND330µF 100nF 10nFTOBY-L201-01S / TOBY-L280-00S71 VCC72 VCC70 VCC3V_BCKP23 RESET_NApplication ProcessorOpen drain output20 PWR_ONOpen drain output68pF47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pF ESD ESD ESD ESD81ANT187ANT2Primary   cellular antennaTPTPSecondary cellular antenna5V_INT TP15pF 8.2pF+100µF+75ANT_DETGNDRTC back-up26 HOST_SELECT062 HOST_SELECT1SDASCL2627RSVDRSVD661GPIO622GPIO224GPIO325GPIO460GPIO521GPIO153I2S_RXD51I2S_TXD52I2S_CLK50I2S_WAV_INT16 TXD17 RXD12 DCD14 RTS15 CTS13 DTR10 DSR11 RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 hostD-D+27 USB_D-28 USB_D+VBUS 4VUSB_DETTPTPGND GND 65SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLKGND0Ω0Ω0Ω0Ω0Ω0Ω0Ω0Ω0Ω0Ω3V8WWANindicator Figure 76: Example of schematic diagram to integrate a TOBY-L201-01S / TOBY-L280-00S in an application, using all interfaces
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 132 of 158 2.16.3 Schematic for TOBY-L200-50S / TOBY-L210-50S Figure 77 is an example of a schematic diagram where a TOBY-L200-50S / TOBY-L210-50S module is integrated into an application board, using all the available interfaces and functions of the module.  3V8GND330µF 100nF 10nFTOBY-L200-50S / TOBY-L210-50S71 VCC72 VCC70 VCC3V_BCKP23 RESET_NApplication ProcessorOpen drain output20 PWR_ONOpen drain output68pF47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pF ESD ESD ESD ESD81ANT187ANT2Primary   cellular antennaTPTPSecondary cellular antenna5V_INT TP15pF 8.2pF+100µF+75ANT_DETGNDRTC back-up26 HOST_SELECT062 HOST_SELECT1SDASCL2627RSVDRSVD661GPIO622GPIO224GPIO325GPIO460GPIO521GPIO1 Wi-Fi enableELLA-W1 seriesWi-Fi moduleANT1 29ANT2 26BPF53I2S_RXD51I2S_TXD52I2S_CLK50I2S_WAV_INT16 TXD17 RXD12 DCD14 RTS15 CTS13 DTR10 DSR11 RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 hostD-D+27 USB_D-28 USB_D+VBUS 4VUSB_DETTPTPLDO regulator3V8OUTIN VIO51V86LDO regulator 3V33V8OUTINGNDSHDNn3V341V8OUTINGNDSHDNnV_INT470kGND GND 65SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLK22Ω22Ω22Ω22Ω22Ω22ΩSD_D015SD_D116SD_D211SD_D312SD_CLK14SD_CMD13GNDPDn9RESETn10SLEEP_CLK19CFG20GND47kWi-Fi antenna0Ω0Ω0Ω0Ω0Ω0Ω0Ω Figure 77: Example of schematic diagram to integrate a TOBY-L200-50S / TOBY-L210-50S in an application, using all interfaces
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 133 of 158 2.16.4 Schematic for MPCI-L2 series Figure 78 is an example of a schematic diagram where a MPCI-L2 series module is integrated into an application board, using all the available interfaces and functions of the module.  3V3GND330uF 100nF 10nFMPCI-L2 seriesApplication ProcessorOpen Drain Output22 PERST #GND GNDUSB 2.0 HostD-D+27 USB_D-28 USB_D+68pFPrimary AntennaSecondary Antenna42 LED_WWAN#15pF 8.2pF+20 W_DISABLE #Open Drain Output24 3.3Vaux39 3.3Vaux23.3Vaux41 3.3Vaux52 3.3Vaux3V3NC47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF47pF100nF8UIM_PWR10 UIM_DATA12 UIM_CLK14 UIM_RESET47pFESDESDESDESDWWAN IndicatorANT1ANT2 Figure 78: Example of schematic diagram to integrate a MPCI-L2 series module in an application board, using all the interfaces
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 134 of 158 2.17 Design-in checklist This section provides a design-in checklist. 2.17.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC / 3.3Vaux pin within the operating range limits.  DC  supply  must  be  capable  of  supporting  both  the  highest  peak  and  the  highest  averaged  current consumption  values  in  connected-mode,  as  specified  in  the  TOBY-L2  series  Data  Sheet [1]  or  in  the MPCI-L2 series Data Sheet [2].  VCC / 3.3Vaux voltage supply should be clean, with very low ripple/noise: provide the suggested bypass capacitors, in particular if the application device integrates an internal antenna.  Do not apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the relative operating range.  Check USB_D+ / USB_D- signal lines as well as very low capacitance ESD protections if accessible.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested capacitors on each SIM signal and low capacitance ESD protections if accessible.  Check UART signals direction, as the TOBY-L2 signal names follow the ITU-T V.24 Recommendation [7].  Consider providing appropriate low value series damping resistors on SDIO lines to avoid reflections.  Provide accessible  test  points directly connected to the following  pins  of the TOBY-L2  series  modules: V_INT, PWR_ON and RESET_N for diagnostic purpose.  Provide  accessible  test  points  directly  connected  to  all  the  UART  pins  of  the  TOBY-L2  series  modules (TXD, RXD, RTS, CTS, DTR, DSR, DCD, RI) for diagnostic purpose, in particular providing a 0  series jumper on each line to detach each UART pin of the module from the DTE application processor.  If the USB is not used, provide accessible test points directly connected to the USB_D+ and USB_D- pins  Provide proper precautions for EMC / ESD immunity as required on the application board.  Do not apply voltage to any generic digital interface pin of TOBY-L2 series modules before the switch-on of the generic digital interface supply source (V_INT).  All unused pins  can  be left  unconnected except  the  RSVD  pin  number  6  of TOBY-L2 series  modules, which must be connected to GND.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Design-in     Page 135 of 158 2.17.2 Layout checklist The following are the most important points for a simple layout check:  Check 50  nominal characteristic impedance of the RF transmission  line connected to the ANT1 and the ANT2 ports (antenna RF interfaces).  Ensure no coupling occurs between the RF interface and noisy or sensitive signals (primarily USB signals, digital input/output signals, SIM signals, high-speed digital lines such as SDIO and other data lines).  Optimize placement for minimum length of RF line.  Check the footprint and paste mask designed for TOBY-L2 module as illustrated in section 2.12.  VCC / 3.3Vaux line should be wide and as short as possible.  Route VCC / 3.3Vaux supply line away from RF lines / parts and other sensitive analog lines / parts.  The VCC / 3.3Vaux bypass capacitors in the picoFarad range should be placed as close as possible to the VCC / 3.3Vaux pins, in particular if the application device integrates an internal antenna.  Ensure an optimal grounding connecting each GND pin with application board solid ground layer.  Use as many vias as possible to connect the ground planes on multilayer application board, providing a dense line of vias at the edges of each ground area, in particular along RF and high speed lines.  Keep routing short and minimize parasitic capacitance on the SIM lines to preserve signal integrity.  USB_D+ / USB_D- traces should meet the characteristic impedance requirement (90  differential and 30  common mode) and should not be routed close to any RF line / part.  Keep the SDIO traces short, avoid stubs, avoid coupling with any RF line / part and consider low value series damping resistors to avoid reflections and other losses in signal integrity.  Ensure  appropriate  RF  precautions  for  the  Wi-Fi  and  Cellular  technologies  coexistence  as  described  in section 2.6.4 and in the Wi-Fi / Cellular Integration Application Note [14].  Ensure appropriate  RF  precautions for  the GNSS  and  Cellular  technologies coexistence as described  in the GNSS Implementation Application Note [13].  2.17.3 Antenna checklist  Antenna termination should provide 50  characteristic impedance with V.S.W.R at least less than 3:1 (recommended 2:1) on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure compliance with any regulatory agency RF radiation requirement, as reported in section 4.2.2 for products marked with the FCC.  Ensure high and similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna.  Ensure high isolation between the primary (ANT1) and the secondary (ANT2) antenna.  Ensure  low  Envelope  Correlation  Coefficient  between  the  primary  (ANT1)  and  the  secondary  (ANT2) antenna: the 3D antenna radiation patterns should have radiation lobes in different directions.  Ensure high isolation between the cellular antennas and any other antenna or transmitter.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Handling and soldering     Page 136 of 158 3 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  3.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to TOBY-L2 series reels / tapes, MPCI-L2 series trays, Moisture Sensitivity levels (MSD), shipment and storage information, as well as drying for preconditioning, see the TOBY-L2 series Data Sheet [1], the MPCI-L2 series Data Sheet [2] and the u-blox Package Information Guide [31].  3.2 Handling The TOBY-L2 and MPCI-L2 series modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  Electrostatic  discharge  (ESD)  is the  sudden  and  momentary electric current  that flows  between  two  objects  at different  electrical  potentials  caused  by  direct  contact  or  induced  by  an  electrostatic  field.  The  term  is  usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment. The ESD sensitivity for each pin of  TOBY-L2 and MPCI-L2 series modules (as Human Body Model according to JESD22-A114F) is specified in the TOBY-L2 series Data Sheet [1] or the MPCI-L2 series Data Sheet [2]. ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on  ESD  sensitive  electronics  is  prevented.  International  standards  are  used  to  define  typical  EPA  and  can  be obtained  for  example  from  International  Electrotechnical  Commission  (IEC)  or  American  National  Standards Institute (ANSI). In  addition  to  standard  ESD  safety  practices,  the  following  measures  should  be  taken  into  account  whenever handling the TOBY-L2 and MPCI-L2 series modules:  Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the first point of contact when handling the PCB must always be between the local GND and PCB GND.  Before mounting an antenna patch, connect ground of the device.  When  handling the  module,  do  not  come  into  contact  with any  charged  capacitors and  be  careful  when contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron,…).  To prevent electrostatic  discharge through the  RF pin, do not  touch  any exposed  antenna  area.  If there is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design.  When soldering the module and patch antennas to the RF pin, make sure to use an ESD safe soldering iron. For more robust designs, employ additional ESD protection measures on the application device integrating the TOBY-L2 and MPCI-L2 series modules, as described in section 2.15.3.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Handling and soldering     Page 137 of 158 3.3 Soldering 3.3.1 Soldering paste "No Clean" soldering paste is strongly recommended for TOBY-L2 series modules, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217 °C Stencil Thickness:  150 µm for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.12.  The  quality  of  the  solder  joints  on  the  connectors  (“half  vias”)  should  meet  the  appropriate  IPC specification.  3.3.2 Reflow soldering A convection type-soldering oven is strongly recommended for TOBY-L2 series modules over the infrared type  radiation  oven.  Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be heated up evenly, regardless of material properties, thickness of components and surface color. Consider the  ”IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes”, published 2001. Reflow profiles are to be selected according to the following recommendations.  Failure to observe these recommendations can result in severe damage to the device!  Preheat phase Initial heating of component leads and balls. Residual humidity will be dried  out.  Note that this preheat phase will not replace prior baking procedures.  Temperature rise rate: max 3 °C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated.  Conversely,  if  performed  excessively,  fine  balls  and  large balls will be generated in clusters.  End Temperature: 150 - 200 °C If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The  temperature  rises  above  the  liquidus  temperature  of  217  °C.  Avoid  a  sudden  rise  in  temperature  as  the slump of the paste could become worse.  Limit time above 217 °C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245 °C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4 °C/s
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Handling and soldering     Page 138 of 158   To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  soldering  temperature  profile  chosen  at  the  factory  depends  on  additional  external  factors  like  choice  of soldering paste, size, thickness and properties of the base board, etc.   Exceeding  the  maximum  soldering  temperature  and  the  maximum  liquidus  time  limit  in  the recommended soldering profile may permanently damage the module.  Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50Elapsed time [s] Figure 79: Recommended soldering profile  The modules must not be soldered with a damp heat process.  3.3.3 Optical inspection After soldering the  TOBY-L2 series modules, inspect the modules optically to verify that the module is properly aligned and centered. 3.3.4 Cleaning Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol or other organic  solvents can result in soldering flux residues  flooding  into the two housings, areas that are not accessible for post-wash inspections. The  solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Handling and soldering     Page 139 of 158 3.3.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a module populated on it. 3.3.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components.  Only a single wave soldering process is encouraged for boards populated with the modules. 3.3.7 Hand soldering Hand soldering is not recommended. 3.3.8 Rework Rework is not recommended.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such  actions immediately terminate the warranty. 3.3.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the cellular modules and it is important to prevent them from flowing into the module.  The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty. 3.3.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the cellular modules before implementing this in the production.  Casting will void the warranty. 3.3.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox  gives  no  warranty  for  damages  to  the  cellular  modules  caused  by  soldering  metal  cables  or  any other forms of metal strips directly onto the EMI covers. 3.3.12 Use of ultrasonic processes The  cellular  modules  contain  components  which  are  sensitive  to  Ultrasonic  Waves.  Use  of  any  Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox gives no warranty against damages to the cellular modules caused by any Ultrasonic Processes.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 140 of 158 4 Approvals   For the complete  list of  all  the  certification schemes approvals  of  TOBY-L2 and MPCI-L2 series  modules and the corresponding declarations of conformity, see the u-blox web-site (http://www.u-blox.com/).  4.1 Product certification approval overview Product certification approval is the process of certifying that a product has passed all tests and criteria  required by specifications, typically called “certification schemes” that can be divided into three distinct categories:  Regulatory certification o Country specific approval required by local government in most regions and countries, such as:  CE (Conformité Européenne) marking for European Union  FCC (Federal Communications Commission) approval for United States  Industry certification o Telecom industry specific approval verifying the interoperability between devices and networks:  GCF  (Global  Certification  Forum),  partnership  between  European  device  manufacturers  and network operators to ensure and verify global interoperability between devices and networks  PTCRB  (PCS  Type  Certification  Review  Board),  created  by  United  States  network  operators  to ensure and verify interoperability between devices and North America networks  Operator certification o Operator specific approval required by some mobile network operator, such as:  AT&T network operator in United States  Even if TOBY-L2 and MPCI-L2 series modules are approved under all major certification schemes, the application device  that  integrates  TOBY-L2  and  MPCI-L2  series  modules  must  be  approved  under  all  the  certification schemes required by the specific application device to be deployed in the market. The required certification scheme approvals and relative testing specifications differ depending on the country or the  region  where  the  device  that  integrates  TOBY-L2  and  MPCI-L2  series  modules  must  be  deployed,  on  the relative vertical market of the device, on type, features and functionalities of the whole application device, and on the network operators where the device must operate.   The certification of the application device that integrates a  TOBY-L2  module and the compliance of the application  device  with  all  the  applicable  certification  schemes,  directives  and  standards  are  the  sole responsibility of the application device manufacturer.  TOBY-L2 and MPCI-L2 series modules are certified according to all capabilities and options stated in the Protocol Implementation Conformance Statement document (PICS) of the module. The PICS, according to the  3GPP TS 51.010-2 [26], 3GPP TS 34.121-2 [27], 3GPP TS 36.521-2 [28] and 3GPP TS 36.523-2 [29], is a statement of the implemented and supported capabilities and options of a device.   The PICS document of the application device integrating  TOBY-L2 and MPCI-L2 series modules must  be updated  from  the  module  PICS  statement  if  any  feature  stated  as  supported  by  the  module  in  its  PICS document  is  not  implemented  or  disabled  in  the  application  device.  For  more  details  regarding  the  AT commands settings that affect the PICS, see the u-blox AT Commands Manual [3].  Check the specific settings required for mobile network operators approvals as they may differ from the AT commands settings defined in the module as integrated in the application device.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 141 of 158 4.2 US Federal Communications Commission notice  United States Federal Communications Commission (FCC) IDs:  u-blox TOBY-L200 cellular modules:  XPYTOBYL200  u-blox TOBY-L201 cellular modules:  XPYTOBYL201  u-blox TOBY-L210 cellular modules:  XPYTOBYL210  u-blox TOBY-L280 cellular modules:  XPYTOBYL280  u-blox MPCI-L200 cellular modules:  Contains FCC ID XPYTOBYL200  u-blox MPCI-L210 cellular modules:  Contains FCC ID XPYTOBYL210  4.2.1 Safety warnings review the structure  Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product  The  clearance  and  creepage  current  distances  required  by  the  end  product  must  be  withheld  when  the module is installed  The cooling of the end product shall not negatively be influenced by the installation of the module  Excessive sound pressure from earphones and headphones can cause hearing loss  No natural rubbers, hygroscopic materials, or materials containing asbestos are employed  4.2.2 Declaration of Conformity  This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:  this device may not cause harmful interference  this device must accept any interference received, including interference that may cause undesired operation   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed and  operated  with  a minimum  distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The gain of the  system antenna(s)  used for  the  TOBY-L200,  TOBY-L210,  MPCI-L200,  MPCI-L210 modules  (i.e.  the  combined  transmission  line,  connector,  cable  losses  and  radiating  element gain) must not exceed 9.8 dBi (in 700 MHz, i.e. LTE FDD-17 band), 4.3 dBi (in 850 MHz, i.e. GSM 850 or UMTS FDD-5 or LTE FDD-5 band), 5.5 dBi (in 1700 MHz, i.e. AWS or UMTS FDD-4 or LTE FDD-4 band), 2.8 dBi (in 1900 MHz, i.e. GSM 1900 or UMTS FDD-2 or LTE FDD-2 band), 6.0 dBi (in 2500 MHz, i.e. LTE FDD-7 band) for mobile and fixed or mobile operating configurations.  The gain of the system antenna(s) used for TOBY-L201 modules (i.e. the combined transmission line, connector, cable losses and radiating element gain) must not exceed 9.8 dBi (700 MHz, i.e. LTE FDD-17 band), 10.2 dBi (750 MHz, i.e. LTE FDD-13 band), 10.0 dBi (850 MHz, i.e. UMTS FDD-5 or  LTE  FDD-5  band),  6.8  dBi  (1700  MHz,  i.e.  AWS  or  LTE  FDD-4  band),  8.5  dBi  (1900  MHz,  i.e. UMTS FDD-2 or LTE FDD-2 band) for mobile and fixed or mobile operating configurations.  The gain of the system antenna(s) used for TOBY-L280 modules (i.e. the combined transmission line, connector, cable losses and radiating element gain) must not exceed 4.3 dBi (850 MHz, i.e. GSM 850 or UMTS FDD-5 or LTE FDD-5 band), 3.4 dBi (1900 MHz, i.e. GSM 1900 or UMTS FDD-2 or  LTE  FDD-2  band),  10.8  dBi  (2500  MHz,  i.e.  LTE  FDD-7  band)  for  mobile  and  fixed  or mobile operating configurations.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 142 of 158 4.2.3 Modifications The  FCC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers  of  mobile  or  fixed  devices  incorporating  the  TOBY-L2  and  MPCI-L2  series modules are authorized to use the FCC Grants of the TOBY-L2 series modules for their own final products according to the conditions referenced in the certificates.  The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains FCC ID: XPYTOBYL200" resp. "Contains FCC ID: XPYTOBYL201" resp. "Contains FCC ID: XPYTOBYL210" resp. "Contains FCC ID: XPYTOBYL280" resp.   IMPORTANT:  Manufacturers  of  portable  applications  incorporating  the  TOBY-L2  and  MPCI-L2 series  modules  are  required  to  have  their  final  product  certified  and  apply  for  their  own  FCC Grant related to  the specific portable device. This is mandatory to meet the SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   Additional Note: as per 47CFR15.105 this equipment has been tested and found to comply with the  limits  for  a  Class  B  digital  device,  pursuant  to  part  15  of  the  FCC  Rules.  These  limits  are designed  to  provide  reasonable  protection  against  harmful  interference  in  a  residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: o Reorient or relocate the receiving antenna o Increase the separation between the equipment and receiver o Connect  the  equipment  into  an  outlet  on  a  circuit  different  from  that  to  which  the receiver is connected o Consultant the dealer or an experienced radio/TV technician for help   4.3 Industry Canada notice  Industry Canada (IC) Certification Numbers:  u-blox TOBY-L200 cellular modules:  8595A-TOBYL200  u-blox TOBY-L201 cellular modules:  8595A-TOBYL201  u-blox TOBY-L210 cellular modules:  8595A-TOBYL210  u-blox TOBY-L280 cellular modules:  8595A-TOBYL280  u-blox MPCI-L200 cellular modules:  Contains IC 8595A-TOBYL200  u-blox MPCI-L210 cellular modules:  Contains IC 8595A-TOBYL210
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 143 of 158 4.3.1 Declaration of Conformity   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed  and operated  with a minimum distance  of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The gain of the  system antenna(s)  used for  the  TOBY-L200,  TOBY-L210,  MPCI-L200,  MPCI-L210 modules  (i.e.  the  combined  transmission  line,  connector,  cable  losses  and  radiating  element gain) must not exceed 9.8 dBi (700 MHz, i.e. LTE FDD-17 band), 4.3 dBi (850 MHz, i.e. GSM 850 or UMTS  FDD-5  or  LTE  FDD-5  band),  5.5  dBi  (1700  MHz,  i.e.  AWS  or  UMTS  FDD-4  or  LTE  FDD-4 band), 2.8 dBi (1900 MHz, i.e. GSM 1900 or UMTS FDD-2 or LTE FDD-2 band), 6.0 dBi (2500 MHz, i.e. LTE FDD-7 band) for mobile and fixed or mobile operating configurations.  The gain of the system antenna(s) used for TOBY-L201 modules (i.e. the combined transmission line, connector, cable losses and radiating element gain) must not exceed 6.7 dBi (700 MHz, i.e. LTE FDD-17 band), 6.9 dBi (750 MHz, i.e. LTE FDD-13 band), 6.7 dBi (850 MHz, i.e. UMTS FDD-5 or LTE FDD-5 band), 6.8 dBi (1700 MHz, i.e. AWS or LTE FDD-4 band), 8.5 dBi (1900 MHz, i.e. UMTS FDD-2 or LTE FDD-2 band) for mobile and fixed or mobile operating configurations.  .  4.3.2 Modifications The  IC  requires  the  user  to  be  notified  that  any  changes  or  modifications  made  to  this  device  that  are  not expressly approved by u-blox could void the user's authority to operate the equipment.   Manufacturers  of  mobile  or  fixed  devices  incorporating  the  TOBY-L2  and  MPCI-L2  series modules are authorized to use the Industry Canada Certificates of the TOBY-L2 series modules for their own final products according to the conditions referenced in the certificates.  The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: "Contains IC: 8595A-TOBYL200" resp. "Contains IC: 8595A-TOBYL201" resp. "Contains IC: 8595A-TOBYL210" resp. "Contains IC: 8595A-TOBYL280" resp.   Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian CAN ICES-3(B) / NMB-3(B) and RSS-210. Operation is subject to the following two conditions: o this device may not cause interference o this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The  radiated  output  power  of  the  u-blox  Cellular  Module  is  below  the  Industry  Canada  (IC) radio frequency exposure limits. The  u-blox  Cellular Module should be used in such a  manner such that the potential for human contact during normal operation is minimized. This  device  has  been  evaluated  and  shown  compliant  with  the  IC  RF  Exposure  limits  under mobile exposure conditions (antennas are greater than 20 cm from a person's body).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 144 of 158 This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL (Radio Equipment List) can be found at the following web address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional  Canadian  information  on  RF  exposure  also  can  be  found  at  the  following  web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT:  Manufacturers  of  portable  applications  incorporating  the  TOBY-L2  and  MPCI-L2 series  modules  are  required  to  have  their  final  product  certified  and  apply  for  their  own Industry  Canada  Certificate  related  to  the  specific  portable  device.  This  is  mandatory  to  meet the SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   Canada, avis d'Industrie Canada (IC) Cet  appareil  numérique  de  classe  B  est  conforme  aux  normes  canadiennes  CAN  ICES-3B)  / NMB-3(B) et CNR-210. Son fonctionnement est soumis aux deux conditions suivantes: o cet appareil ne doit pas causer d'interférence o cet  appareil  doit  accepter  toute  interférence,  notamment  les  interférences  qui  peuvent affecter son fonctionnement Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil u-blox Cellular Module est inférieure à la limite  d'exposition  aux  fréquences  radio  d'Industrie  Canada  (IC).  Utilisez  l’appareil  de  sans  fil u-blox  Cellular  Module  de  façon  à  minimiser  les  contacts  humains  lors  du  fonctionnement normal. Ce  périphérique  a  été  évalué  et  démontré  conforme  aux  limites  d'exposition  aux  fréquences radio  (RF)  d'IC  lorsqu'il  est  installé  dans  des  produits  hôtes  particuliers  qui  fonctionnent  dans des  conditions  d'exposition  à  des  appareils  mobiles  (les  antennes  se  situent  à  plus  de  20 centimètres du corps d'une personne). Ce  périphérique  est  homologué  pour  l'utilisation  au  Canada.  Pour  consulter  l'entrée correspondant  à  l’appareil  dans  la  liste  d'équipement  radio  (REL  -  Radio  Equipment  List) d'Industrie Canada rendez-vous sur:  http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplémentaires concernant l'exposition aux RF au  Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/fra/sf08792.html   IMPORTANT: les fabricants d'applications portables contenant les modules TOBY-L2 and MPCI-L2 series doivent faire certifier leur produit final et déposer directement leur candidature pour une certification FCC ainsi que pour un certificat Industrie Canada délivré par l'organisme chargé de ce  type  d'appareil  portable.  Ceci  est  obligatoire  afin  d'être  en  accord  avec  les  exigences  SAR pour les appareils portables. Tout changement ou modification non expressément approuvé par la partie responsable de la certification peut annuler le droit d'utiliser l'équipement.  4.4 Anatel certification TOBY-L200-00S  and  MPCI-L200-00S  modules  are  certified  by  the  Brazilian  Agency  of  Telecommunications (Agência Nacional de Telecomunicações in Portuguese) (Anatel).  Anatel IDs for the TOBY-L200-00S modules:
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Approvals     Page 145 of 158  EAN barcode: (01)07898941575236  Homologation number 0806-15-5903  Anatel IDs for the MPCI-L200-00S modules:  EAN barcode: (01)07898941575243  Homologation number 3420-13-5903  4.5 R&TTED and European Conformance CE mark The modules have been evaluated against the essential requirements of the 1999/5/EC Directive. In  order  to  satisfy  the  essential  requirements  of  the  1999/5/EC  Directive,  the  modules are  compliant  with  the following standards:  Radio Frequency spectrum use (R&TTE art. 3.2): o EN 301 511 V9.0.2 o EN 301 908-1 V6.2.1 o EN 301 908-2 V6.2.1 o EN 301 908-13 (V6.2.1)  Electromagnetic Compatibility (R&TTE art. 3.1b): o EN 301 489-1 V1.9.2 o EN 301 489-7 V1.3.1 o EN 301 489-24 V1.5.1  Health and Safety (R&TTE art. 3.1a) o EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 o EN 62311:2008   Radiofrequency  radiation  exposure  Information:  this  equipment  complies  with  radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed and  operated  with  a minimum  distance of 20 cm between the  radiator  and  the  body  of  the  user  or  nearby  persons.  This  transmitter  must  not  be  co-located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product.  The  conformity  assessment  procedure  for  the  modules,  referred  to  in  Article  10  and  detailed  in  Annex  IV  of Directive 1999/5/EC, has been followed with the involvement of the following Notified Body number: 1588 Thus, the following marking is included in the product:  1588
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Product testing     Page 146 of 158 5 Product testing 5.1 u-blox in-series production test u-blox focuses  on  high quality  for  its  products.  All  units  produced are  fully  tested  automatically  in  production line. Stringent quality control process has been implemented in the production line. Defective units are analyzed in detail to improve the production quality. This  is  achieved  with  automatic  test  equipment  (ATE)  in  production  line,  which  logs  all  production  and measurement data. A detailed test report for each unit can be generated from the system. Figure 80 illustrates typical automatic test equipment (ATE) in a production line.  The following typical tests are among the production tests.   Digital self-test (firmware download, Flash firmware verification, IMEI programming)  Measurement of voltages and currents  Adjustment of ADC measurement interfaces  Functional tests (USB interface communication, SIM card communication)  Digital tests (GPIOs and other interfaces)  Measurement and calibration of RF characteristics in all supported bands (such as receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels, etc.)  Verification of RF characteristics after calibration (i.e. modulation accuracy, power levels, spectrum, etc. are checked to ensure they are all within tolerances when calibration parameters are applied)    Figure 80: Automatic test equipment for module tests
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Product testing     Page 147 of 158 5.2 Test parameters for OEM manufacturer Because of the testing  done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. However, an OEM manufacturer should focus on:  Module assembly on the device; it should be verified that: o Soldering and handling process did not damage the module components o All module pins are well soldered on device board o There are no short circuits between pins  Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna  Dedicated  tests  can  be  implemented  to  check  the  device.  For  example,  the  measurement  of  module  current consumption when set in a specified status can detect a short circuit if compared with a “Golden Device” result. In addition, module AT commands can be used to perform functional tests (communication with host controller, check SIM interface, GPIOs, etc.) and to perform RF performance tests: see the following two sections for details.  5.2.1 “Go/No go” tests for integrated devices A “Go/No go” test is typically to compare the signal quality with a “Golden Device” in a location with excellent network  coverage  and  known  signal  quality.  This  test  should  be  performed  after  data  connection  has  been established. AT+CSQ is the typical AT command used to check signal quality in term of RSSI.  See the u-blox AT Commands Manual [3] for detail usage of the AT command.    These kinds of test may be useful as a “go/no go” test but not for RF performance measurements.  This test is suitable to check the functionality of communication with host controller, SIM card as well as power supply. It is also a means to verify if components at antenna interface are well soldered.  5.2.2 RF functional tests  The overall RF functional test of the device including the antenna can be performed with basic instruments such as  a  spectrum  analyzer  (or  an  RF  power  meter)  and  a  signal  generator  with  the  assistance  of  AT+UTEST command over AT command user interface. The  AT+UTEST  command  provides  a  simple  interface  to  set  the  module  to  Rx  or  Tx  test  modes  ignoring  the LTE/3G/2G signaling protocol. The command can set the module into:  transmitting mode in a specified channel and power level in all supported modulation schemes and bands  receiving mode in a specified channel to returns the measured power level in all supported bands    See the u-blox AT Commands Manual [3] and the End user test Application Note [26], for the AT+UTEST command syntax description and detail guide of usage.
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Product testing     Page 148 of 158 This feature allows the measurement of the transmitter and receiver power levels to check component assembly related  to  the  module  antenna  interface  and  to  check  other  device  interfaces  from  which  depends  the  RF performance.   To  avoid  module  damage  during  transmitter  test,  a  proper  antenna  according  to  module specifications or a 50  termination must be connected to ANT1 port.  To avoid module damage during receiver test the maximum power  level received at ANT1 and ANT2 ports must meet module specifications.   The AT+UTEST command sets the module to emit RF power ignoring  LTE/3G/2G signaling protocol. This emission  can  generate  interference  that  can  be  prohibited  by  law  in  some  countries.  The  use  of  this feature is intended for testing purpose in controlled environments by qualified user and must not be used during  the  normal  module  operation.  Follow  instructions  suggested  in  u-blox  documentation.  u-blox assumes no responsibilities for the inappropriate use of this feature.  Figure 81 illustrates a typical test setup for such RF functional test.  Application BoardTOBY-L2 seriesMPCI-L2 seriesANT1Application ProcessorAT   commandsCellular antennaSpectrumAnalyzerorPowerMeterINWideband antennaTXApplication BoardTOBY-L2 seriesMPCI-L2 seriesANT1Application ProcessorAT   commandsCellular antennasSignalGeneratorOUTWideband antennaRXANT2 Figure 81: Setup with spectrum analyzer or power meter and signal generator for radiated measurements
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 149 of 158 Appendix A Glossary  3GPP 3rd Generation Partnership Project 8-PSK 8 Phase-Shift Keying modulation 16QAM 16-state Quadrature Amplitude Modulation 64QAM 64-state Quadrature Amplitude Modulation ACM Abstract Control Model  ADC Analog to Digital Converter AP Application Processor ASIC Application-Specific Integrated Circuit AT AT Command Interpreter Software Subsystem, or attention BAW Bulk Acoustic Wave  CSFB Circuit Switched Fall-Back  DC Direct Current  DCE Data Communication Equipment DDC Display Data Channel interface DL Down-Link (Reception) DRX Discontinuous Reception DSP Digital Signal Processing DTE Data Terminal Equipment ECM Ethernet networking Control Model EDGE Enhanced Data rates for GSM Evolution EMC Electro-Magnetic Compatibility EMI Electro-Magnetic Interference ESD Electro-Static Discharge ESR Equivalent Series Resistance E-UTRA Evolved Universal Terrestrial Radio Access  FDD Frequency Division Duplex  FEM Front End Module FOAT Firmware Over AT commands FOTA Firmware Over The Air FTP File Transfer Protocol FW Firmware GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System HBM Human Body Model HSIC High Speed Inter Chip  HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HTTP HyperText Transfer Protocol  HW Hardware I/Q In phase and Quadrature I2C Inter-Integrated Circuit interface I2S Inter IC Sound interface
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 150 of 158 IP Internet Protocol LDO Low-Dropout LGA Land Grid Array LNA Low Noise Amplifier LPDDR Low Power Double Data Rate synchronous dynamic RAM memory LTE Long Term Evolution  M2M Machine-to-Machine MBIM Mobile Broadband Interface Model MIMO Multi-Input Multi-Output N/A Not Applicable N.A. Not Available NCM Network Control Model OTA Over The Air PA Power Amplifier PCM Pulse Code Modulation PCN / IN Product Change Notification / Information Note PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit PWM Pulse Width Modulation QPSK  Quadrature Phase Shift Keying  RF Radio Frequency RMII Reduced Media Independent Interface RNDIS Remote Network Driver Interface Specification RSE Radiated Spurious Emission RTC Real Time Clock SAW Surface Acoustic Wave SDIO Secure Digital Input Output  SIM Subscriber Identification Module SMS Short Message Service SRF Self Resonant Frequency SSL Secure Socket Layer TBD To Be Defined TCP Transmission Control Protocol TDD Time Division Duplex  TDMA Time Division Multiple Access TIS Total Isotropic Sensitivity TP Test-Point TRP Total Radiated Power UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UICC Universal Integrated Circuit Card UL Up-Link (Transmission) UMTS Universal Mobile Telecommunications System USB Universal Serial Bus VCO Voltage Controlled Oscillator VoLTE Voice over LTE VSWR Voltage Standing Wave Ratio Wi-Fi Wireless Local Area Network (IEEE 802.11 short range radio technology) WLAN Wireless Local Area Network (IEEE 802.11 short range radio technology) WWAN Wireless Wide Area Network (GSM / UMTS / LTE cellular radio technology)
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 151 of 158 B Migration between TOBY-L1 and TOBY-L2 B.1 Overview TOBY-L1 and TOBY-L2  series cellular modules have exactly the same TOBY form factor (35.6 x 24.8 mm LGA) with  exactly  the  same  152-pin  layout  as  described  in  Figure  82,  so  that  the  modules  can  be  alternatively mounted on a single application board using exactly the same copper mask, solder mask and paste mask.  11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167RSVDRSVDGNDVCCVCCGNDRSVDRSVDSIM_IOSIM_RSTGPIO5GPIO6RSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDVCCGNDRSVDSIM_CLKVSIMRSVDRSVDRSVDRSVDRSVDRSVDRSVDV_INTRSVDGNDRSVDGPIO1RSVDRSVDRSVDRSVDRSVDRSVDRSVDUSB_D-RSVDGPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRSVDRSVDUSB_D+GPIO4RSVD90 91 927877769310079 80 83 85 86 88 8982 84 8781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT132 31 3044454614515243 42 39 37 36 34 3340 38 3541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD99 98 97 96 95 94106 105 104 103 102 101108 107124 123130 129 128 127 126 125136 135 134 133 132 131138 137144 143 142 141 140 139151 150 149 148 147 146114 113 112 111 110 109120 119 118 117 116 115122 121Pin 93-152: GNDTOBY-L1Top view11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167SDIO_CMDSDIO_D0GNDVCCVCCGNDANT_DETSDASIM_IOSIM_RSTGPIO5GPIO6SDIO_D2SDIO_CLKRSVDRSVDI2S_WAI2S_CLKI2S_RXDSDIO_D1VCCGNDSCLSIM_CLKVSIMHOST_SELECT1RSVDI2S_TXDSDIO_D3RIDSRRSVDV_INTVUSB_DETGNDRSVDGPIO1RSVDRSVDTXDCTSDTRDCDRSVDUSB_D-HOST_SELECT0GPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRXDRTSUSB_D+GPIO4RSVD90 91 927877769310079 80 83 85 86 88 8982 84 8781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT132 31 3044454614515243 42 39 37 36 34 3340 38 3541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD99 98 97 96 95 94106 105 104 103 102 101108 107124 123130 129 128 127 126 125136 135 134 133 132 131138 137144 143 142 141 140 139151 150 149 148 147 146114 113 112 111 110 109120 119 118 117 116 115122 121Pin 93-152: GNDTOBY-L2Top view Figure 82: TOBY-L1 and TOBY-L2 series modules pad layout and pin assignment TOBY modules are also form-factor compatible with the u-blox LISA and SARA cellular module families: although TOBY modules, LISA modules (33.2 x 22.4 mm, 76-pin LCC) and SARA modules (26.0 x 16.0 mm, 96-pin LGA) each have different form factors, the footprints for the TOBY, LISA and SARA modules have been developed to ensure layout compatibility. With the u-blox “nested design” solution, any TOBY, LISA or SARA module can be alternatively mounted on the same space of a single “nested” application board as described in Figure 83. Guidelines in order to implement a nested application board, description of the u-blox reference design as nested application board and comparison between TOBY, LISA and SARA modules are provided in the Nested Design Application Note [32].  TOBY cellular moduleLISA cellular moduleSARA cellular moduleNested application board Figure 83: TOBY, LISA, SARA modules’ layout compatibility: the nested design accommodates all modules on the same footprint
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 152 of 158 Table 49 summarizes the interfaces provided: TOBY-L2 series modules make available additional interfaces over pins remarked as reserved on TOBY-L1 series modules (highlighted in blue in Figure 82).  Module Radio Access Technology Power System SIM Serial Audio GPIO  LTE category LTE bands HSDPA category HSUPA category 3G bands GPRS/EDGE class 2G bands MIMO 2x2 / Rx diversity Antenna Detection VCC module supply in V_BCKP V_INT 1.8 V supply out PWR_ON RESET_N Host select SIM 1.8 V / 3.0 V SIM detection UART 1.8 V USB 2.0 High-Speed SDIO 1.8 V DCC (I2C) 1.8 V Analog audio Digital audio  GPIOs 1.8 V Network indication GNSS supply enable  GNSS Tx data ready  GNSS RTC sharing  Clock output Wi-Fi control Antenna tuning TOBY-L100 3 4,13      ●  ● ● ● ● ●  ●   ●     F ●       TOBY-L200 4 2,4,5 7,17 24 6 1,2,4 5,8 12 Quad ● F ● ● ● ● ● F ● F ○ ● ○ F  F F □ F F F F ○ F TOBY-L201 4 2,4,5 13,17 24 6 2,5   ● F ● ● ● ● ● F ● F ● ● F F  F F ● F F F F F F TOBY-L210 4 1,3,5 7,8,20 24 6 1,2 5,8 12 Quad ● F ● ● ● ● ● F ● F ○ ● ○ F  F F □ F F F F ○ F TOBY-L280 4 1,3,5 7,8,28 24 6 1,2 5,8 12 Quad ● F ● ● ● ● ● F ● F ● ● F F  F F ● F F F F F F ●  = supported by all product versions  ○ = supported by product version “50” and future product versions □  = supported by all product versions except product version “50”  F  =  supported by future product versions Table 49: Summary of TOBY-L1 series and TOBY-L2 series modules interfaces  Figure 84 summarizes the LTE, 3G and 2G operating frequency bands of TOBY-L1 and TOBY-L2 series modules.  = WCDMA bands= GSM bands= LTE FDD bandsLEGENDTOBY-L100TOBY-L200TOBY-L280TOBY-L210TOBY-L201VVIIIVIIIV800 850 900 950746 787750700704 960800 850 900 95075070013131717 55850900850900VVIIIVIIIV800 850 900 95070375070096028285588850900850900II IIIIIV IV1700 1750 1800 1850 1900 1950 2000 2050 2100 21501710 21551710 21701700 1750 1800 1850 1900 1950 2000 2050 2100 21504 44 42 22200220018001900 19001800IIII II1700 1750 1800 1850 1900 1950 2000 2050 2100 21501710 21703 3 112500 2550 2600 2650 27002500 26902500 2550 2600 2650 27007 72500 26902500 2550 2600 2650 27007 7220018001900 19001800VVIIIVIIIV800 850 900 950791750V96070020 205588850900850900II IIII1700 1750 1800 1850 1900 1950 2000 2050 2100 21501710 21703 3 11220018001900 190018002500 2550 2600 2650 27002500 26907 7VV704800 850 900 9507507008941717 551313II II17101700 1750 1800 1850 1900 1950 2000 2050 2100 215021554 42 22200 2500 2550 2600 2650 2700 Figure 84: Summary of TOBY-L1 and TOBY-L2 series modules LTE, 3G and 2G operating frequency bands
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 153 of 158 B.2 Pin-out comparison between TOBY-L1 and TOBY-L2   TOBY-L1  TOBY-L2   Pin No Pin Name Description Pin Name Description Remarks for migration 1 RSVD Reserved RSVD Reserved  2 GND Ground GND Ground  3 V_BCKP RTC Supply Output 2.5 V output only RTC backup function not available V_BCKP RTC Supply Input/Output 3.0 V output 1.4 V – 4.2 V input (RTC backup) RTC back-up: No  Yes 4 RSVD Reserved VUSB_DET VBUS USB supply (5 V) detection8 No difference: leave unconnected as reserved or not supported 5 V_INT Interfaces Supply Output 1.8 V output V_INT Interfaces Supply Output 1.8 V output No functional difference 6 RSVD Reserved RSVD Reserved This pin must be connected to GND No connect  Connect to GND 7-9 RSVD Reserved RSVD Reserved  10 RSVD Reserved DSR UART DSR Output9 / GPIO8 Reserved  UART / GPIO 11 RSVD Reserved RI UART RI Output10 / GPIO8 Reserved  UART / GPIO 12 RSVD Reserved DCD UART DCD Output9 / GPIO8 Reserved  UART / GPIO 13 RSVD Reserved DTR UART DTR Input9 / GPIO8 Reserved  UART / GPIO 14 RSVD Reserved RTS UART RTS Input10  Reserved  UART 15 RSVD Reserved CTS UART CTS Output10  Reserved  UART 16 RSVD Reserved TXD UART Data Input10  Reserved  UART 17 RSVD Reserved RXD UART Data Output10  Reserved  UART 18-19 RSVD Reserved RSVD Reserved  20 PWR_ON Power-on Input No internal pull-up PWR_ON Power-on Input Internal 50k pull-up to VCC Pull-up: External  Internal 21 GPIO1 GPIO11 WWAN status indication on “00” product version GPIO1 GPIO8  WWAN status indication on ”00” and “01” product versions Wi-Fi enable on “50” version No functional difference 22 GPIO2 GPIO11 GPIO2 GPIO8  23 RESET_N Reset signal Input Internal 10k pull-up to V_BCKP Switch-off function only RESET_N Reset signal Input Internal 50k pull-up to VCC Reset, Switch-on, Switch-off Internal pull-up: V_BCKP  VCC Switch-off  Reset, Switch-on/off 24 GPIO3 GPIO11  GPIO3 GPIO8  25 GPIO4 GPIO11  GPIO4 GPIO8  26 RSVD Reserved HOST_SELECT0 Input for selection of module configuration by the host8  Reserved  HOST_SELECT0 27 USB_D- USB Data I/O (D-) USB_D- USB Data I/O (D-) No functional difference 28 USB_D+ USB Data I/O (D+) USB_D+ USB Data I/O (D+) No functional difference 29 RSVD Reserved RSVD Reserved  30 GND Ground GND Ground  31 RSVD Reserved RSVD Reserved  32 GND Ground GND Ground  33-43 RSVD Reserved RSVD Reserved  44 GND Ground GND Ground  45 RSVD Reserved RSVD Reserved  46 GND Ground GND Ground  47-49 RSVD Reserved RSVD Reserved  50 RSVD Reserved I2S_WA I2S Word Alignment8 / GPIO8 Reserved  I2S / GPIO 51 RSVD Reserved I2S_TXD I2S Data Output8 / GPIO8  Reserved  I2S / GPIO 52 RSVD Reserved I2S_CLK I2S Clock8 / GPIO8  Reserved  I2S / GPIO 53 RSVD Reserved I2S_RXD I2S Data Input8 / GPIO8  Reserved  I2S / GPIO                                                        8 Not supported by “00”, “01”, “50” product versions 9 Not supported by TOBY-L200-00S, TOBY-L210-00S, TOBY-L200-50S, TOBY-L210-50S 10 Not supported by TOBY-L200-00S, TOBY-L210-00S 11 Not supported by “00” product version
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 154 of 158  TOBY-L1  TOBY-L2   Pin No Pin Name Description Pin Name Description Remarks for migration 54 RSVD Reserved SCL I2C Clock Output12  Reserved  I2C 55 RSVD Reserved SDA I2C Data I/O12  Reserved  I2C 56 SIM_CLK SIM Clock Output SIM_CLK SIM Clock Output No functional difference 57 SIM_IO SIM Data I/O SIM_IO SIM Data I/O No functional difference 58 SIM_RST SIM Reset Output SIM_RST SIM Reset Output No functional difference 59 VSIM SIM Supply Output VSIM SIM Supply Output No functional difference 60 GPIO5 GPIO13  GPIO5 GPIO12 SIM detection  61 GPIO6 GPIO13  GPIO6 GPIO12  62 RSVD Reserved HOST_SELECT1 Input for selection of module configuration by the host12  Reserved  HOST_SELECT1 63 RSVD Reserved SDIO_D2 SDIO serial data [2]14  Reserved  SDIO 64 RSVD Reserved SDIO_CLK SDIO serial clock14  Reserved  SDIO 65 RSVD Reserved SDIO_CMD SDIO command14  Reserved  SDIO 66 RSVD Reserved SDIO_D0 SDIO serial data [0]14  Reserved  SDIO 67 RSVD Reserved SDIO_D3 SDIO serial data [3]14  Reserved  SDIO 68 RSVD Reserved SDIO_D1 SDIO serial data [1]14  Reserved  SDIO 69 GND Ground GND Ground  70-72 VCC Module Supply Input  3.40 V – 4.50 V normal range No 2G current pulses No switch-on applying VCC VCC Module Supply Input 3.40 V – 4.35 V normal range High 2G current pulses  Switch-on applying VCC No VCC functional difference 73-74 GND Ground GND Ground  75 RSVD Reserved ANT_DET Antenna Detection Input12 Reserved  ANT_DET 76 GND Ground GND Ground  77 RSVD Reserved RSVD Reserved  78-80 GND Ground GND Ground  81 ANT1 RF Antenna Input/Output Two LTE bands No 3G bands No 2G bands ANT1 RF Antenna Input/Output Up to six LTE bands Up to five 3G bands Four 2G bands No RF functional difference Different operating bands support 82-83 GND Ground GND Ground  84 RSVD Reserved RSVD Reserved  85-86 GND Ground GND Ground  87 ANT2 RF Antenna Input LTE MIMO 2x2 No 3G Rx diversity ANT2 RF Antenna Input  LTE MIMO 2x2 3G Rx diversity No RF functional difference  Different operating bands support 88-90 GND Ground GND Ground  91 RSVD Reserved RSVD Reserved  92-152 GND Ground GND Ground  Table 50: TOBY-L1 and TOBY-L2 pin assignment with remarks for migration                                                        12 Not supported by “00”, “01”, “50” product versions 13 Not supported by “00” product version 14 Not supported by “00”, “01” product versions
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Appendix      Page 155 of 158 B.3 Schematic for TOBY-L1 and TOBY-L2 integration Figure  85  shows  an  example  schematic  diagram  where  a  TOBY-L1  series  module  (“00”  product  version)  or  a TOBY-L2  series  module  (“00”,  “01” or  “50”  product  versions)  can  be  integrated  into  the  same  application board,  using  all  the  available  interfaces  and  functions  of  the  module.  The  different  mounting  options  for  the external  parts  are  highlighted  in  different  colors  as  described  in  the  legend,  according  to  the  interfaces supported by the different module product versions.  3V8GND330uF 100nF 10nF71 VCC72 VCC70 VCC3V_BCKP23 RESET_NApplication ProcessorOpen Drain Output20 PWR_ONOpen Drain Output68pF47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pF ESD ESD ESD ESD81ANT187ANT2Primary   Cellular AntennaTPTPSecondary Cellular Antenna5V_INT TP15pF 8.2pF+100uF+75RSVD / ANT_DETGNDRTCback-up26 RSVD / HOST_SELECT062 RSVD / HOST_SELECT1RSVD / SDARSVD / SCL2627RSVDRSVD661GPIO622GPIO224GPIO325GPIO460GPIO521GPIO1 Wi-Fi enableELLA-W1 seriesWi-Fi ModuleANT1 29ANT2 26BPF53RSVD / I2S_RXD51RSVD / I2S_TXD52RSVD / I2S_CLK50RSVD / I2S_WAV_INT16 RSVD / TXD17 RSVD / RXD12 RSVD / DCD14 RSVD / RTS15 RSVD / CTS13 RSVD / DTR10 RSVD / DSR11 RSVD / RITPTPTPTPTPTPTPTPTXDRXDDCDRTSCTSDTRDSRRI1.8 V DTEGND GNDUSB 2.0 HostD-D+27 USB_D-28 USB_D+VBUS 4RSVD / VUSB_DETTPTPLDO Regulator3V8OUTIN VIO51V86LDO Regulator 3V33V8OUTINGNDSHDNn3V341V8OUTINGNDSHDNnV_INT470kGND GND 65RSVD / SDIO_CMD66RSVD / SDIO_D068RSVD / SDIO_D163RSVD / SDIO_D267RSVD / SDIO_D364RSVD / SDIO_CLK22Ω22Ω22Ω22Ω22Ω22ΩSD_D015SD_D116SD_D211SD_D312SD_CLK14SD_CMD13GNDPDn9RESETn10SLEEP_CLK19CFG20GND47kWi-Fi Antenna0Ω0Ω0Ω0Ω0Ω0Ω0ΩRSVD49TP0Ω100k3V8WWAN Indicator0Ω0Ω0ΩLEGENDTOBY-L100-00TOBY-L2xx-00TOBY-L2xx-01Mount forTOBY-L100-00TOBY-L2xx-xxMount forTOBY-L280-00TOBY-L2xx-01Mount forMount for TOBY-L100-00Mount for TOBY-L2xx-xxTOBY-L280-00TOBY-L2xx-01TOBY-L2xx-50Mount forMount for TOBY-L2xx-50TOBY-L1 series (’00’ product version)TOBY-L2 series (’00’, ‘01’, ‘50’ versions) Figure 85: Example of complete schematic diagram to integrate TOBY-L1 modules (“00” product version) and TOBY-L2 modules (“00”, “01” or “50” product versions) on the same application board, using all the available interfaces / functions of the modules
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Related documents      Page 156 of 158 Related documents [1] u-blox TOBY-L2 series Data Sheet, Docu No UBX-13004573 [2] u-blox MPCI-L2 series Data Sheet, Docu No UBX-13004749 [3] u-blox AT Commands Manual, Docu No UBX-13002752 [4] u-blox EVK-L20 / EVK-L21 User Guide, Docu No UBX-14000422 [5] u-blox Firmware Update Application Note, Docu No UBX-13001845 [6] Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/usb20_docs/  [7] ITU-T Recommendation V.24 - 02-2000 - List of definitions for interchange circuits between Data Terminal Equipment (DTE) and Data Circuit-terminating Equipment (DCE), http://www.itu.int/rec/T-REC-V.24-200002-I/en [8] 3GPP TS 27.007 - AT command set for User Equipment (UE)  [9] 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)  [10] 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol [11] u-blox Mux Implementation Application Note, Docu No UBX-13001887 [12] I2C-bus specification and user manual - Rev. 5 - 9 October 2012 - NXP Semiconductors, http://www.nxp.com/documents/user_manual/UM10204.pdf [13] u-blox GNSS Implementation Application Note, Docu No UBX-13001849  [14] u-blox Wi-Fi / Cellular Integration Application Note, Docu No UBX-14003264 [15] PCI Express Mini Card Electromechanical Specification, Revision 2.0, April 21, 2012 [16] 3GPP TS 26.267 – eCall Data Transfer; In-band modem solution; General description [17] BS EN 16062:2011 – Intelligent transport systems – eSafety – eCall high level application requirements [18] ETSI TS 122 101 – Service aspects; Service principles (3GPP TS 22.101) [19] u-blox eCall / ERA-GLONASS Application Note, Docu No UBX-13001924 [20] SIM Access Profile Interoperability Specification, http://www.bluetooth.org/ [21] GSM Association TS.09 - Battery Life Measurement and Current Consumption Technique http://www.gsma.com/newsroom/wp-content/uploads/2013/09/TS.09-v7.6.pdf  [22] CENELEC EN 61000-4-2 (2001): "Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement techniques – Electrostatic discharge immunity test". [23] ETSI EN 301 489-1 V1.8.1: “Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 1: Common technical requirements” [24] ETSI EN 301 489-7 V1.3.1 “Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems“ [25] ETSI EN 301 489-24 V1.4.1 "Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment" [26] 3GPP TS 51.010-2 - Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) [27] 3GPP TS 34.121-2 - Technical Specification Group Radio Access Network; User Equipment (UE) conformance specification; Radio transmission and reception (FDD); Part 2: Implementation Conformance Statement (ICS) [28] 3GPP TS 36.521-2 - Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment conformance specification; Radio transmission and reception; Part 2: Implementation Conformance Statement (ICS) [29] 3GPP TS 36.523-2 - Evolved Universal Terrestrial Radio Access (E-UTRA) and Evolved Packet Core (EPC); User Equipment conformance specification; Part 2: Implementation Conformance Statement (ICS) [30] u-blox End user test Application Note, Docu No UBX-13001922 [31] u-blox Package Information Guide, Docu No UBX-14001652 [32] u-blox Nested Design Application Note, Docu No UBX-13002795  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com/).
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Revision history      Page 157 of 158 Revision history Revision Date Name Status / Comments R01 20-Dec-2013 sses Initial release for TOBY-L2 series R02 21-Mar-2014 sses Initial release including MPCI-L2 series UART and GPIOs remarked as not supported by TOBY-L2x0-00S R03 23-Jul-2014 sses Advance Information document status  Updated MPCI-L2 descriptions Updated USB description and design-in, including VUSB_DET pin previously RSVD  Updated MPCI-L2 thickness and installation guidelines Updated MPCI-L2 power-off procedure Updated MPCI-L2 pins 3, 5, 44, 46 definition: Not Connected instead of GPI/GPO Updated GPIOs definition and description  Additional design-in examples, minor corrections and improvements R04 30-Sep-2014 lpah Updated FW version for Engineering Samples Additional design-in and minor corrections  R05 28-Nov-2014 lpah / sses Changed status to Early Production Information Updated VUSB_DET description and application circuits: the VUSB_DET functionality is not supported, and the pin should be left unconnected or it should not be driven high Added maximum antenna gain requirements as per FCC RF radiation exposure limits Corrected MPCI-L2 pinout Additional design-in and minor corrections  R06 28-Jan-2015 sses Added description and design-in for TOBY-L2xx-50S, i.e. the “50” product version:  updated UART, SDIO, GPIO sections R07 29-May-2015 sses Added description and design-in for TOBY-L280-00S and TOBY-L201-01S:  updated UART, FTP, HTTP, FOTA sections and any other applicable section R07 29-Jun-2015 sses
TOBY-L2 and MPCI-L2 series - System Integration Manual UBX-13004618 - R08  Early Production Information  Contact      Page 158 of 158 Contact For complete contact information visit us at http://www.u-blox.com/  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 703 483 3180 E-mail:  info_us@u-blox.com Regional Office West Coast: Phone:  +1 408 573 3640 E-mail:  mailto:info_us@u-blox.com Technical Support: Phone:  +1 703 483 3185 E-mail:  mailto:support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com Support:  mailto:support@u-blox.com  Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com Regional Office Australia: Phone:  +61 2 8448 2016 E-mail:  info_anz@u-blox.com Support:  support_ap@u-blox.com Regional Office China (Beijing): Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office China (Shenzhen): Phone:  +86 755 8627 1083 E-mail:  info_cn@u-blox.com Support:  support_cn@u-blox.com Regional Office India: Phone:  +91 959 1302 450 E-mail:  mailto:info_in@u-blox.com Support:  mailto:support_in@u-blox.com Regional Office Japan: Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com Support:  support_jp@u-blox.com Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com

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