ALE BTMOD02 Bluetooth module User Manual BTDB user s manual

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Table of Content

GENERALITIES ............................................................................................................... 2

1.1

NTRODUCTION

............................................................................................................................................. 2

1.1.1

Overview .................................................................................................................................................. 2

1.1.2

Aim of the document ................................................................................................................................. 3

1.2

ERVICES PROVIDED BY THE FEATURE OR EQUIPMENT

................................................................................. 3

1.3

XTERNAL

NTERFACES

................................................................................................................................ 3

1.4

ERMINOLOGY

BBREVIATIONS

................................................................................................................. 5

1.5

ELATED

OCUMENTS

................................................................................................................................. 6

GENERAL REQUIREMENTS ........................................................................................ 7

2.1

EATURES

..................................................................................................................................................... 7

2.2

TANDARDS

.................................................................................................................................................. 7

2.2.1

BT related certification ............................................................................................................................ 7

2.3

NVIRONMENTAL REQUIREMENTS

................................................................................................................ 8

GENERAL DESCRIPTION ............................................................................................. 9

3.1

FUNCTION GLOBAL LOGICAL BLOC DIAGRAM

......................................................................................... 9

3.2

DAUGHTER BOARD BLOC DIAGRAM

......................................................................................................... 9

3.3

ECHANICAL ASPECTS AND INTEGRATION

................................................................................................. 10

3.4

PECIFICATION

............................................................................................................................................ 11

DETAILED TECHNICAL DESCRIPTION .................................................................. 12

4.1

LECTRONIC

............................................................................................................................................... 12

4.1.1

BT chip solution to be implemented ....................................................................................................... 12

4.1.2

Schematic ............................................................................................................................................... 13

4.2

ADIOFREQUENCY

...................................................................................................................................... 14

4.2.1

Antenna choice ....................................................................................................................................... 14

4.2.2

Immunity to external spurious and interferences ................................................................................... 15

4.2.3

Quality of supply .................................................................................................................................... 15

4.3

AYOUT

...................................................................................................................................................... 16

4.3.1

BTDB layout ........................................................................................................................................... 16

4.3.2

Place requirements of BTDB on mainboard .......................................................................................... 16

4.4

OFTWARE

.................................................................................................................................................. 16

4.5

ERTIFICATION

........................................................................................................................................... 17

4.5.1

General aspects on the “module” concept ............................................................................................ 17

THERMAL MANAGEMENT ........................................................................................ 18

RELIABILITY ................................................................................................................ 18

INDUSTRIAL CONSIDERATIONS .............................................................................. 18

7.1

ANUFACTURING

....................................................................................................................................... 18

7.2

EQUIREMENTS

.......................................................................................................................................... 18

7.3

ESTABILITY

............................................................................................................................................... 18

7.3.1

Testpoints................................................................................................................................................ 18

7.3.2

Test strategy ........................................................................................................................................... 19

7.3.3

Test method ............................................................................................................................................. 20

7.4

ECHANICAL ASSEMBLY

NDUSTRIAL FEASIBILITY

.................................................................................. 23

7.4.1

Board outline .......................................................................................................................................... 23

7.4.2

Board technology ................................................................................................................................... 23

7.4.3

Connections ............................................................................................................................................ 24

7.4.4

Mounting on the main board .................................................................................................................. 24

7.4.5

Shielding Mounting ................................................................................................................................ 26

use and communication of its contents

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without written authorization from Alcatel.

Generalities

1.1 Introduction

1.1.1 Overview

The main objectives for this board, discussed also with the marketing are:

• Get lowest cost solution to enable BT for a maximum of IP terminals

• Enable new usages like

o The phone is seen as a carkit for a smartphone

o The phone can exchange phonebook with a smartphone

o The phone can support tags through BT Low Energy

• From R&D point of view:

o The board must be small enough to be integrated easily into our ID.

o The board must integrate the antenna to avoid a re-certification for each phone

which would use it.

For this project, a pre-study has been done. See reference [1].

The choice is to do a daughter board with the chip CC2564C from Texas Instruments, with an

integrated antenna on the layout (Printed antenna).

This device complies with part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause

undesired operation.

Please note that changes or modifications not expressly approved by the party responsible for

compliance could void the user’s authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable

protection against harmful interference in a residential installation. This equipment generates, uses

and can radiate radio frequency energy and, if not installed and used in accordance with the

instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to correct the interference by one or more of the

following measures:

—Reorient or relocate the receiving antenna.

—Increase the separation between the equipment and receiver.

use and communication of its contents

not permitted

without written authorization from Alcatel.

—Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

—Consult the dealer or an experienced radio/TV technician for help.

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the

following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage;

(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le fonctionnement.

CAN ICES-3 (B)/NMB-3(B)

1.1.2 Aim of the document

A pre-study has been done, in order to define the best choices for the whole solution, going from

antenna to the BT management software in the phone.

This document is intended to give all the technical inputs in order to make a BT daughter board

which will be used on the Alcatel-Lucent IP Phones.

A first step will be to use it on 8068s and 8078s, but we should care to make it possible to be used

also on nextgen phones and other projects.

1.2 Services provided by the feature or equipment

The BTDB will give a BT4.2 connectivity to the product where it is mounted into. The main reasons

of this daughter board are to have:

• A common function usable on several phones without the need of RF expertise and full

BT qualification

• A cost effective solution

1.3 External Interfaces

The interface signals are listed hereafter:

use and communication of its contents

not permitted

without written authorization from Alcatel.

Pin N° Name Function Type Voltage

1 GND Keep feet on the ground. Power 0V

2 VDD_IO Direct path supply for 1.8V I/O pads. Power 1.8V

3 GND Keep feet on the ground. Power 0V

4 SLOW_CLK 32.768KHz +/- 250ppm I 1.8V

GND

Keep feet on the ground.

Power

HCI_RX

HS UART Receive up to

4Mbps

/PU

1.8V

7 TX_DBG TI internal debug messages. Not used. O /PU 1.8V

8 HCI_CTS HS UART flow control: data from BTDB to

Host allowed when low I /PU 1.8V

9 GND Keep feet on the ground. Power 0V

10 GND Keep feet on the ground. Power 0V

11 HCI_RTS HS UART flow control: data from host to

BTDB allowed when low O /PU* 1.8V

12 HCI_TX HS UART Transmit up to 4Mbps O/PU* 1.8V

13 GND Keep feet on the ground. Power 0V

14 PCM_SYNC Frame synchro for audio data I/O /PD 1.8V

15 PCM_CLK Clock for audio data I/O /PD 1.8V

16 PCM_OUT Output of audio data. Maybe in tristate O /PD 1.8V

17 PCM_IN Input of audio data I 1.8V

18-23 GND Keep feet on the ground. Power 0V

24 ENABLE

Disables BT chip when low (Pull down)

and performs internal reset of CC2564.

Minimum low state duration: 5ms

I /PD 1.8V

25 GND Keep feet on the ground. Power 0V

26 VDD_IN General supply I 2.2V-4.8V

27 GND Keep feet on the ground. Power 0V

PU* : Pull-Up enabled only during ShutDown and DeepSleep phases (.

These correspond to the metal cut-holes. See chapter 7.4.3.

The VDD_IN pin can accept 2.2V to 4.8V. Typical value is 2.5V or 3.3V, but this depends on the

motherboard.

Check the CC2564C datasheet for more information.

The UART has by default the following characteristics (can be reprogrammed to up to 4Mbps)

use and communication of its contents

not permitted

without written authorization from Alcatel.

Check the CC2564C datasheet for more information.

This cabling supposes that the Host is in DTE mode. In case of DCE host, RTS and CTS are

straight, and not crossed.

CAUTION:

Only the following interfaces are fail safe (can stand an applied voltage when the device interface, or

the device is not powered (VDDio or VDDin not provided):

AUD_FSYNC, AUD_CLK, AUD_IN, AUD_OUT, SLOW_CLK

This means that the motherboard must not apply a voltage on HCI_RX, HCI_TX, HCI_CTS or

HCI_RTS pins before the VDDio is supplied. Even when VDDio is present, it is not allowed to

ENABLE the chip if VDDin is not present. See specification of CC2564 for more details.

The SLOW_CLK source must be stable within 2ms after the ENABLE LOW to HIGH transition.

Note: FAST CLOCK must be stable within 20ms of nSHUTD(ENABLE) going high. But according to TI FAE’s feedback,

the 20ms limit only applies to TCXO. Crystal is used in BTDB, which doesn’t need to follow the 20ms limit.

1.4 Terminology / Abbreviations

BTDB: BlueTooth Daughter Board

BT: BlueTooth

ENABLE

use and communication of its contents

not permitted

without written authorization from Alcatel.

LE: Low Energy

1.5 Related Documents

Document Reference number

Alcatel documents

[1]

Bluetooth: Pre-study of a low cost solution for

BT in Desktop Phones

3AK_29000_0041_BEZZA

[2]

8088 Hardware external specification 3AK_29000_0080_EDZZA

[3]

ESD CSBU R&D - PB Design/Layout rules 8AL 51074 0003 DSZZA

[4]

NOE3G INDUSTRIAL REQUIREMENTS

3BN 69030 1403 MCASA

External documents

[5]

All TI documents for CC2564 (upload) 3AK_29_CC256X_BLUETOOTH_02278

[6]

use and communication of its contents

not permitted

without written authorization from Alcatel.

2. General Requirements

2.1 Features

The board must provide the following features:

• Give dual mode BT connectivity (Classic & Low Energy), so BT4.1

• Integrate the antenna, done with copper tracks on the PCB

• Interface to the motherboard with UART and PCM, USB not required.

• Permit a very low cost solution.

• Give ease of re-use for other products (simple process, no RF expertise).

2.2 Standards

2.2.1 BT related certification

On the Bluetooth.org website, the existing certifications of BT solutions are listed.

The certification strategy will be as follows:

• Make a certification for the board, with embedded low part of the BT stack, and antenna

• Make a product certification, where the BTDB is in the Phone. Here we can take benefit

of the module certification

• Following the first product certification (ex: NOE3GEE), the next products which use the

BTDB will need minimum or no certification, on condition that the used upper BT stack (in

host processor) is the same as the one of NOE3GEE.

It is necessary to make a BT qualification for the BTDB with its antenna.

This will qualify:

• The hardware, radio parts

• The Lower part of the BT stack (below HCI interface) located in the BT chip

• The Upper part of the BT stack, which runs on the Host processor.

This is why, if we re-use this board, a big part of the certification does not need to be done.

See chapter 4.5.1 for discussion about the “module” aspect for BT certification.

use and communication of its contents

not permitted

without written authorization from Alcatel.

2.3 Environmental requirements

These are the same as for the terminal for which this board is intended. The tests are made on the

daughter board mounted in a final product, so they are part of the product qualification.

This BTDB board cannot be co-located with other transmitters. If mount this board on final product,

Should add FCC ID and IC information in the product label (FCC ID: OL3BTMOD02, IC: 1737D-

BTMOD02).

For a host manufacture’s using a certified modular, if (1) the module’s FCC ID is not visible when

installed in the host, or (2) if the host is marketed so that end users do not have straightforward

commonly used methods for access to remove the module so that the FCC ID of the module is

visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter

Module FCC ID: OL3BTMOD02, IC: 1737D-BTMOD02” or “Contains FCC ID: OL3BTMOD02,

Contains IC: 1737D-BTMOD02” must be used. The host OEM user manual must also contain clear

instructions on how end users can find and/or access the module and the FCC ID.

This equipment complies with radio frequency exposure limits set forth by the Innovation, Science

and Economic Development Canada for an uncontrolled environment.

This equipment should be installed and operated with a minimum distance of 15mm between the

device and the user or bystanders.

This device must not be co-located or operating in conjunction with any other antenna or transmitter.

Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par la

Innovation, Sciences et Développement économique Canada pour un environnement non contrôlé.

Cet équipement doit être installé et utilisé avec un minimum de 15mm de distance entre le dispositif

et l'utilisateur ou des tiers.

Ce dispositif ne doit pas être utilisé à proximité d’une autre antenne ou d’un autre émetteur.

For details see for example the Smart Deskphone 8088 HW external specification (see ref [2])

use and communication of its contents

not permitted

without written authorization from Alcatel.

3. General Description

3.1 BT function global logical bloc diagram

3.2 BT daughter board bloc diagram

Crystal

26MHz

Bandpass

filter

2.4GHz Antenna

VDD Vdd I/O LDO_out

UART

PCM/I2S

SlowClock

Enable TI CC2564C

32.768KHz

1.8V

< 20ppm

2.2V

4.8V

DC/DC

1.8V

UART

PCM

GPIO

Daughter Board PC

use and communication of its contents

not permitted

without written authorization from Alcatel.

The CC2564C communicates with a standard HCI through the UART interface.

Here is a representation of the lower part of the stack, which is inside the CC2564C:

This means that the upper part of the stack must be hosted in the mother board cpu.

3.3 Mechanical aspects and integration

This board will be mounted on a IP Phone CPU board or BT handset CPU board.

For radiofrequency propagation reasons, the antenna area must not cover any copper plane.

For industrial reasons, the board must lay on the CPU board on at least 2/3 of it’s surface.

Examples of implementation follow:

= +

Another alternative, best is:

= +

CPU PCB

Copper OK

CPU PCB

No copper

under

antenna

max

use and communication of its contents

not permitted

without written authorization from Alcatel.

3.4 Specification

Parameter

Value

Standard support Bluetooth 2.1 + EDR, BLE 4.2

Host interface

HCI UART

BAT

Min, Max 1.7 Volts, 4.8 Volts

DD_IO

Min, Max 1.62 Volts, 1.92 Volts

Temperature range (board) -5 to +65°C

Frequency range 2402 MHz to 2480 MHz

Transmit power GFSK, and

EDR

+4 dBm typ +6dBm max

Transmit power BLE -6dBm typ -4dBm max

RX Sensitivity BR -91.5 dBm, GFSK at 0.1%

BER

Max

RX Sensitivity EDR -81 dBm, 8DPSK at 0.01%

BER

Max

RX Sensitivity BLE -93 dBm, PER=30.8% Max

Full throughput current 42 mA, GFSK or EDR Max

SCO link HV3 15 mA Max

Idle current BR and EDR 5 mA Max

BLE Scanning 310 uA Max

BLE Advertising 150 uA Max

Shutdown current 10 uA Max

use and communication of its contents

not permitted

without written authorization from Alcatel.

4. Detailed Technical Description

4.1 Electronic

4.1.1 BT chip solution to be implemented

The chosen chip to implement BT4.2 compliant connectivity is the Texas Instruments CC2564C

chip.

This is a dual mode (Classic + Low Energy) one chip solution.

This chip comes in several versions:

• Version A (CC2564A) which is on the market already a while, and for which it is

necessary to download a patch to implement mSBC codec.

• Version B (CC2564B) which will be in mass production in Q4/2013. It integrates all

patches for mSBC and other bug corrections in ROM.

• Version C (CC2564C) which is BT4.2 compliant.

This chip integrates the baseband, the RF amplifier, balun, and power regulator.

It needs externally:

• a bandpass filter (SAW filter) + antenna

• an accurate 26MHz source (crystal with less than 20ppm initial+ temperature+aging)

• a standard slow clock at 32.768KHz for low power modes (100ppm), which will be

provided by the CPU

• Some passive components.

We will implement the reference design from Texas Instrument, with minor adaptation to our needs

(no level shifters, or test probe headers…).

use and communication of its contents

not permitted

without written authorization from Alcatel.

4.1.2 Schematic

use and communication of its contents

not permitted

without written authorization from Alcatel.

4.2 Radiofrequency

4.2.1 Antenna choice

Two major types of antennas could be implemented:

• Ceramic antenna: very compact, these are easy to mount, but have a cost of around 13

cents. Their performance is medium.

• PCB antenna: this uses a track of copper on the PCB. It gives good performance at

2.4GHz, very low cost, but needs more surface and may need some tuning. The PCB

antenna designs are well known.

The BTDB will use the PCB antenna.

In this type, we have for BT two main choices:

• The inverted F antenna, well known, good performance, very low dependence to the

environment . It has a large bandwidth. Typical size is 26mm x 8mm. This is too large for

our module.

• The meandered inverted F antenna, which is a variant to have more compacity: 16mm x

6mm. This one is good for our design. This antenna is sensitive to small dimension

changes, and has a narrow bandwidth. So an exact copy of the reference dimensions

must be done. This antenna is typically used in BT USB dongle designs.

The meandered inverted F antenna will be used for the design.

Check the following document for the antenna specification and implementation:

http://www.ti.com/litv/pdf/swra117d (also available in doc ref [3]).

To improve the antenna efficiency, we changed the antenna shape data as the following figure and

table: GND move to feed line 0.59mm (D5, L3), cut antenna 0.80mm (L1).

The antenna gain is 5.1dBi.

use and communication of its contents

not permitted

without written authorization from Alcatel.

4.2.2 Immunity to external spurious and interferences

The BT radio can be perturbed by external high amplitude radiofrequency fields. In this case, the BT

may show high bit error rate for example.

To improve the immunity of the BTDB, we will foresee a soldered shield, for risk mitigation. In our

application, there are no nearby emitters (like WIFI or GSM a few centimeters far from the BT radio).

Neither TI, nor Broadcom put a shield by default in their implementations.

The shield will be the one which is on the reference design (16.5 x 16.5mm), if this is not limiting

size reduction.

4.2.3 Quality of supply

The radio is sensitive to wideband noise on the power supply.

The CC2564 integrates high rejection linear regulators, able to provide a clean supply from typically

battery voltage with high voltage dips.

Voltage dips are allowed up to 400mV for a duration less than 2.3ms. This means that no special

care needs to be taken when feeding the board with 3.3V (on mother board).

use and communication of its contents

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without written authorization from Alcatel.

An 1.8V feed is provided for the I/O. This is not a sensitive supply and no special care is needed for

this in terms of noise (the typical noise level found on digital boards on 1.8V is acceptable).

4.3 Layout

4.3.1 BTDB layout

The layout recommendations from Texas Instruments must be followed.

Refer to document:

http://www.ti.com/lit/an/swra420/swra420.pdf (also available in doc ref [3]).

The layout MUST be based on the evaluation kit of TI. The main page for this follows:

http://processors.wiki.ti.com/index.php/CC256x

4.3.2 Place requirements of BTDB on mainboard

To make the BTDB on mainboard has similar antenna resonant frequency as BTDB alone, there are

some BTDB place requirements:

1. The under space of the BTDB antenna need to be empty, at least 5.5mm empty space.

2. The right side of BTDB antenna need to be at least 3mm empty space.

3. The left side of BTDB antenna need to be at least 5mm empty space.

4.4 Software

A set of patches and features improvements must be downloaded to the CC2564 chip. This is

named as “service pack”.

It depends on the device version (A, B or C), and MUST be downloaded when the device is powered

up, before any RF usage.

use and communication of its contents

not permitted

without written authorization from Alcatel.

4.5 Certification

4.5.1 General aspects on the “module” concept

This gives some clarifications about the “module” definition given by FCC.

Single-modular

transmitter has to comply with all eight following requirements:

i. The radio elements must have the radio frequency circuitry shielded. Physical components

and tuning capacitor(s) may be located external to the shield, but must be on the module

assembly;

ii. The module must have buffered modulation/data inputs to ensure that the device will comply

with Part 15 requirements with any type of input signal;

iii. The module must contain power supply regulation on the module;

iv. The module must contain a permanently attached antenna, or contain a unique antenna

connector, and be marketed and operated only with specific antenna(s), per Sections

15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b);

v. The module must demonstrate compliance in a stand-alone configuration;

vi. The module must be labelled with its permanently affixed FCC ID label, or use an electronic

display (See KDB Publication 784748 about labelling requirements);

vii. The module must comply with all specific rules applicable to the transmitter including all the

conditions provided in the integration instructions by the grantee;

viii. The module must comply with RF exposure requirements (see discussions below).

Single-modular transmitter can demonstrate compliance (EMC, SAR, HAC) independent of

the host.

Limited single-modular

transmitter:

Limited single-modular transmitter is a transmitter that does not meet all eight requirements, but may

rely on a specific host and applicable operating conditions for compliance. For instance, the

shielding, buffered I/O or power regulation may be provided by a specific host. In these cases the

module would be “Limited” to the specific host providing those requirements.

A modular is designated as “limited” when compliance is demonstrated in a particular product

configuration. For example, it may be installed in a specific host for demonstrating compliance for

EMC, SAR or HAC requirements.

For Limited single- modular transmitter, compliance with EMC, SAR, HAC can only be demonstrated

for particular product configurations. Certification must be tested in the particular host.

Check the document

996369.pdf

from FCC for more details.

use and communication of its contents

not permitted

without written authorization from Alcatel.

5. Thermal management

No thermal issue is foreseen for this board, as power levels are low (about 130mW in EDR full

throughput). So no special thermal care must be taken.

6. Reliability

It can be calculated with CADRE tool according to the reliability database user guide.

http://alda.web.alcatel-lucent.com/transition_docs/CADRE_SR332/SR332-CADRE-main.html

Usually the calculation is done within the final product (the phone)

7. Industrial Considerations

7.1 Manufacturing

Trimming

The radio has an auto-calibration feature. This means that once the radio parameters have been

defined by engineering, and stored in the chip, there is

no need of trimming in manufacturing.

During engineering, care must be taken to define the right RF level output taking into account the

losses in the bandpass filter and potential impedance adaptation cells.

7.2 Requirements

The module is considered as a component for the manufacturing, and must be stores in a reel, in

vacuum packing until is mounted on the mother board.

Refer to doc: [3] and [4] for more information

7.3 Testability

This proposal is based on a discussion with NPI. This may be refined in a second step.

7.3.1 Testpoints

There is no need of having one test-point per trace, as the board will not use ICT.

The AOI (automatic vision) test is foreseen to be made before the shield is put on the board, but

before the soldering.

For the RF track to antenna, there will be a pad in series, in order to disconnect the PCB antenna by

cutting the track. The pad will then be used to get the RF signal, and the GND surrounding for the

shield. See other IP-Phones CPUs for reference.

use and communication of its contents

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without written authorization from Alcatel.

This is used during certification where conducted tests are done.

The RF test point will be at top side, with the center point on the RF wire.

This is TP 8

Note: After the tuning, matching circuits are reduced from PI filter(2 capacitors and 1 resistor) to single

0402 size inductor L100 3nH.

7.3.2 Test strategy

The board is simple enough to be tested in functional, without ICT.

The other point is that the shield may be mounted, so we have no access to the possible test points

under it. On the other PCB side, there must be no test point, as this side is in direct contact with the

CPU board.

7.3.2.1 Test of the daughter board alone

So the test on the daughter board will be done by functional checks:

• Each interface is activated (see chapter 7.3.3)

• The RF is checked through a tester antenna (through the air or on the RF testpoint)

• Some test points will be available on the bottom side for the integrated power regulators.

These tests will validate the solders of components on the daughter board

As usual, two tests are done:

• Radiated test (with tester antenna) for the RF power which covers emission

• Conducted test (the signal is taken on TP8) for BER, which covers reception

Remark

: the conducted test means that the RF tester is in parallel of the printed antenna, which

cannot be disconnected without unsoldering a component (which can’t be done in production).

We look for GO/NOGO test and not radio setting. A basic calculation shows that the Voltage

Standing Wave Ration (VSWR) will be around 2, which gives a maximum of 9.5dB reflected RF

power in worst case.

To Antenna

L100

Antenna

Matching

RF Test

point

TP 8

Cut here for BT

certification in

conduction

Ground

plane

Gold

plating

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without written authorization from Alcatel.

In consequence, the generated RF signal at the tester must be increased to compensate this. The

best reliable solution is to take a golden sample of the board to setup the RF level for conducted

BER measurement. This will simplify the procedure in manufacturing.

Radiated test: RF power (High level signal)

Conducted test: BER (low level signal)

7.3.2.2 Test of the daughter board mounted in a phone

For the tests of the BTDB on the mother board, we must consider it as a component.

• The connections to the BTDB are checked by functional test of the interfaces

• The RF is tested through the air.

Only the RF radiated test is done to check:

• RF power level

• BT connection (for example by pairing a device)

7.3.3 Test method

Here is an overview of the means to test the connections within the BTDB.

The board can be individually tested (no need of mounting it on the CPU).

Many functions of the chip can be driven through UART Vendor Specific commands.

The list is given in the following document:

http://processors.wiki.ti.com/index.php/CC256x_VS_HCI_Commands (also available in doc ref [3]).

Some test method can also be taken from the following page:

http://processors.wiki.ti.com/index.php/CC256x_Testing_Guide (also available in doc ref [3]).

Before any RF is activated, the Service Pack (SP) must be downloaded to the CC2564C. For

manufacturing, this ServicePack will be stored in PDM.

It may evolve with time, but the manufacturing tools do not need to have the latest version, because

the phone software will have it integrated, and download it at phone start-up.

Only if there is an identified but which could impact the manufacturing tests, the SP will be updated.

Both antenna

and tester are

connected:

mismatch with

about 9.5dB

reflected

power max.

use and communication of its contents

not permitted

without written authorization from Alcatel.

Here is a table that gives examples of tests for each feature:

Function Nbr of

connections

Method Test OK if On test

Point:

Power

and

power-up

VDD_IN

VDD_IO

Slow_CLK

Fast_CLK

Enable must be LOW. Start VDD_IN,

then VDD_IO. Apply Slow Clock.

Apply Fast Clock. Make a transition

LOW to HIGH on Enable.

HCI_RTS goes

from HIGH to

LOW.

Pin 11

download

The service pack must be

downloaded before any RF test is

possible. Check testing guide.

This patch will be stored in PDM,

associated to the board.

HCI

UART

HCI_TX

HCI_RX

HCI_RTS

HCI_CTS

Setup the tester UART to 115.2k

8N1, with HW flow control. Read the

Local version info (send 0x01 0x01

0x10 0x00). Other commands are

available

The chip

replies with the

version.

Pin 12

Pin 6

Pin 11

Pin 8

PCM

PCM_IN

PCM_OUT

PCM_FSYNC

PCM_CLK

Make a loop back of PCM with

HCI_VS_Set_Pcm_Loopback_Enabl

e (0xFE28) command, and send

PCM data to bus

The received

PCM data is

same as sent

data

Pin 17

Pin 16

Pin 14

Pin 15

Slow_Clk

SLOW_CLK

If this is not provided, no way to boot

the device, after enable. The

HCI_RTS signal will stay high.

HCI_RTS goes

from HIGH to

LOW.

Pin 11

Fast_Clk

FREFP/FREFN

If this is not running, no way to make

a communication through UART.

If the PCM is put in master mode,

the clock is 4096kHz and is based

on the Fast_Clk. This permits to

measure the precision.

UART test is

OK.

The PCM_CLK

generated is at

+/- 15ppm.

Pin 15

Enable

nSHUTD

Make a transition LOW to HIGH on

Enable, and check the HCI_RTS

state

HCI_RTS goes

from HIGH to

LOW.

Pin 11

Debug

TX_DBG

Check state of the test point when

the chip is shutdown.

Level should

be “1” ie close

to 1.8V.

Pin 7

Clock

request CLK_REQ_OUT Not used, no need to test. No test NA

use and communication of its contents

not permitted

without written authorization from Alcatel.

Function Nbr of

connections

Method Test OK if On test

Point:

Power

regulators

DIG_LDO_OUT

MLDO_OUT

SRAM_LDO_OUT

ADCPPA_LDO_OUT

CL1.5_LDO_OUT

DCO_LDO_OUT

The 6 testpoints will be available on

the bottom side of the board. Test

the value, and the ripple (in AC).

Voltages are

close to those

on a golden

sample.

TP 1

TP 2

TP 3

TP 4

TP 5

TP 6

Power IN VDD_IO

CL1.5_LDO_IN

MLDO_IN

If one of these supplies are not

available, the BT emission will not

pass the test.

BT emission is

compliant. NA

BT RF

BT RF IN

RF ANT

Check the emitted RF level and

frequency with a tester antenna.

Second test for reception (optional):

put the chip in continuous reception,

emit RF with the tester, and check

the level of RSSI with

HCI_VS_Read_RSSI (0xFDFC)

command

RF is present

and at the right

level.

RF is received

at the right

RSSI level.

TP 8

One option could be to use the development kit from TI as test tool, which is composed of:

• The CPU board MSP430F5438, connected through USB to a computer

• The BTDB which makes the BT function and is connected to the MSP430 CPU

Therefore, see the wiki about the test tool available:

http://processors.wiki.ti.com/index.php/CC256x_Bluetooth_Hardware_Evaluation_Tool

The associated PC software provides the following features;

• Configuration download, service pack download

• Sleep mode activation

• Output power setting

• Radio testing through test modes (see below)

• Debug Traces monitor

The individual test modes are:

Test

Mode

Description

Continuous TX

BT device continously transmits at a particular frequency, modulation,

and power

Continuous RX

Sets BT

device to receive continuously at a particular channel

Packet TX/RX

device continously transmits packets at

particular frequency, packet

type, etc...

SIG

Mode

Put the device into Device Under Test mode to be used with

Bluetooth

Tester

Of course, all the commands are available through a standard UART, connected to a Tester.

use and communication of its contents

not permitted

without written authorization from Alcatel.

7.4 Mechanical assembly / Industrial feasibility

7.4.1 Board outline

The board must be as small as possible.

Nevertheless, this depends on the antenna type implemented, and to routing optimizations that

could be done. This size may be changed if smaller.

Provision is also made for a soldered shield, in case of high interferers.

See chapter 7.4.4 for size of the module.

7.4.2 Board technology

The board is based on the development kit from Texas instrument.The files related to this contain

the schematics, the layout, and the BOM.

We will change the TI reference design PCB thickness from 1.7mm to 0.8mm. Nevertherless the

thickness of the prepreg layers will stay the same, so the layout can be unchanged.

This was checked with Elec&Eltek PCB vendor . Their answer is:

“We are ok with the customer original stackup. We also recommend a 1.0mm thickness

stackup as per your requiement. Materials will be PIC FL170 instead of IT180.

Please note that the gold plating is mandatory, we need to know the gold plating

area (with location) for our cost and process capability evaluation.

Yes, we propose to use 16mil of the core to meet total thickness 0.8mm.”

The proposed stackup for 0.8mm thickness is:

Type Thickness

L1: Cupper 0.5oz + ENIG plating

2116 pp 4.4 mil

L2: Cupper 1oz

core 16 mil

L3: Cupper 1oz

2116 pp 4.4 mil

L4: Cupper 0.5oz + ENIG plating

Finished board thickness 0.8+/-0.1mm

The PCB is a 4 Layers FR4 controlled impedance with 50 Ohms tracks for the 2.45 GHz radio

signals between layers L1 and P2.

use and communication of its contents

not permitted

without written authorization from Alcatel.

7.4.3 Connections

To reduce cost, we want to avoid a board to board connector.

The daughter board will use the technique of the cut metal holes on the board edge (top view):

Before milling During milling Resulting connections

The connections number is 27, spread over three sides of the board as following:

7.4.4 Mounting on the main board

The daughter board is mounted flat directly on the CPU board.

This means that:

• There is no component on the bottom side of the BTDB

PCB

Metal holes

Gold plating

use and communication of its contents

not permitted

without written authorization from Alcatel.

o Also signal vias shall be prohibited to avoid risks of short-circuit with main board

GND.

• There is no component on top of the CPU

Care must be taken in order to equilibrate the layout, to avoid that the PCB becomes curved during

soldering process (due to differential thermal expansion of the copper layers).

The cut-hole size must be defined big enough in order to get a solid solder area, and to avoid that

the copper of the hole is snatched during milling process.

The solder is

put here

CPU

Daughter board

use and communication of its contents

not permitted

without written authorization from Alcatel.

On Main board, the recommended footprint is as follows:

The GND pins must be connected to the GND plane as short as possible, with enough vias. Dotted line is the board

outline.

7.4.5 Shielding Mounting

The target is to deliver a BTDB without shielding. All modules on the market have a shielding. It is required when

the chip and sensitive RF parts are exposed to strong perturbations (WIFI, Cellular,..). It is not yet clear if our

products using the BTHS will be exposed to such conditions. Also for full Bluetooth and RF certification of this

board, the shield may be required.

Therefore we have foreseen provision to equip a one-piece surface mount shield. It is preferred to a two pieces

part for manufacturing reasons. The following reference shall be used:

END OF DOCUMENT

ALE BTMOD02 Bluetooth module User Manual BTDB user s manual

ALE International Bluetooth module BTDB user s manual

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