AMPAK Technology WSDT752BSC BLE SiP User Manual Manual
AMPAK Technology Inc. BLE SiP Manual
Manual
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| Document ID | 3949476 |
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| Document Description | Manual |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 170.47kB (2130818 bits) |
| Date Submitted | 2018-08-03 00:00:00 |
| Date Available | 2018-08-05 00:00:00 |
| Creation Date | 2018-07-16 15:43:26 |
| Producing Software | doPDF Ver 7.3 Build 382 (Windows 7 Business Edition (SP 1) - Version: 6.1.7601 (x64)) |
| Document Lastmod | 0000-00-00 00:00:00 |
| Document Title | Manual |
兆福科技股份有限公司 SPECIFICATION SPEC. NO.： DATE： REV： 2.0 2018, July.-16 PRODUCT NAME： APPROVED WSDT-752B_SC CHECKED PREPARED DCC ISSUE NAME 兆福科 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information GIGAFU WSDT-752B_SC ARM Cortex M3 + Bluetooth Low Energy with Antenna Module Product Specification Sheet Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information Revision History Date 2015/03/31 Revision Content Revised By Version Original release R&D 1.0 Modify voltages ratings Add power consumption Ander 1.1 Replace outline dimension Modify RF Specification May 1.2 Add Antenna keep out area size Ander 1.3 Update Operating Temperature Ander 1.4 Update Power Consumption Modify 7.1 schematic Peter 1.5 2015/10/21 2015/11/04 - Renamed 2015/07/08 2015/07/08 2015/07/13 2015/09/09 2015/12/30 2018/05/14 2018/07/12 2018/07/16 - Modify temperature of operation and storage - Modify General Specification - Add FCC/IC Statement - Add Label Drawing Gigafu Technology Inc. May-14/2018 Peter 1.6 Peter 1.7 Geoffrey Geoffrey Geoffrey 1.8 1.9 2.0 http://www.gigafu.com.tw/ Proprietary & Confidential Information Contents Revision History........................................................................................................ i Contents ................................................................................................................... ii 1. Introduction .......................................................................................................... 1 1.1 DESCRIPTION......................................................................................................................1 1.2 APPLICATIONS....................................................................................................................1 2. FEATURES............................................................................................................ 2 3. General Specification .......................................................................................... 4 3.1 General Specification ..........................................................................................................4 3.2 Voltages ............................................................................................................................... 4 3.2.1 Absolute Maximum Ratings .......................................................................................4 3.2.2 Recommended Operating Ratings ............................................................................4 3.3 Power Consumption............................................................................................................5 3.3.1 BLE Power Consumption...........................................................................................5 4. Main CPU Overview ............................................................................................. 6 4.1 CM3 Features.......................................................................................................................6 5. RF Specification................................................................................................... 7 5.1 BLE Specification ................................................................................................................7 6. Ceramic Chip Antenna Specification ............................................................... 10 6.1 Description Value .............................................................................................................. 10 7. Pinout Information ............................................................................................. 11 7.1 Schematic Diagram ........................................................................................................... 11 7.2 Pin Descriptions ................................................................................................................ 11 7.3 Pin Number Define............................................................................................................. 13 8. Software Overview ............................................................................................. 14 8.1 Software tool installation................................................................................................... 14 8.2 WSDT-752B_SC board GPIO configuration file path........................................................ 14 8.3 PIN define in header file Board.h ...................................................................................... 14 9. Module Dimensions ........................................................................................... 15 9.1 Outline Dimension (Unit: mm) ...................................................................................... 15 9.2 Recommended Footprint (Unit: mm)............................................................................ 18 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 ii 10. Recommended Reflow Profile ........................................................................ 19 11. Label Drawing................................................................................................... 20 12. Packing Information ........................................................................................ 21 12.1 Packing Dimension.......................................................................................................... 21 13.Statement........................................................................................................... 22 13.1 FCC Statement:................................................................................................................ 22 13.2 ISED Statement:............................................................................................................... 22 13.3 FCC Label Instructions.................................................................................................... 23 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 iii 1. Introduction GIGAFU Technology would like to announce a low-cost and low-power consumption module which has of the BLE functionalities. The highly integrated WSDT-752B_SC with RF front end BLE module makes the possibilities of Bluetooth Low Energy HID and other applications. 1.1 DESCRIPTION The WSDT-752B_SC is very low active and low power mode current consumption as well as fast mode transitions provide excellent battery lifetime and allows operation on small coin cell batteries and in energy harvesting applications. Integrated a powerful 32-bit Cortex M3 running at 48 MHz has more than 30% more processing power per MHz than Cortex M0 based systems and significantly more than 8 and 16-bit processors. The Bluetooth Low Energy Controller is embedded into ROM and are partly running on a separate ARM Cortex M0 dedicated for radio purpose. This improves overall system performance and power consumption as well as frees up FLASH memory for the application. 1.2 APPLICATIONS Consumer electronics Mobile phone accessories Sports & Fitness equipment HID applications Home Automation and Lighting Control Alarm and Security Electronic Shelf Labeling Proximity Tags Medical and Healthcare Remote Controls Wireless Sensor Networks Gigafu Technology Inc. May-14/2018 http://www.gigafu.com.tw/ Proprietary & Confidential Information 2. FEATURES Lead Free design which is compliant with RoHS requirements. Integrated Ceramic Chip Antenna Integrated Power Inductor 10uH for DC/DC converter - 2.4 GHz RF transceiver compatible with Bluetooth 4.2 low energy and proprietary communication protocols - Programmable GFSK modulation mode. - Supports data rates between 50 kbps and 5 Mbps - Programmable output power up to +5 dBm - Suitable for systems targeting compliance with worldwide radio frequency regulations - All Digital Peripheral Pins can be Routed to any GPIO - 4 General-purpose Timer Modules (8x 16-bit or 4x 32 bit-timer, PWM each) - 12-bit ADC, 200-ksamples/s, 8 channel analog MUX - Continuous Time Comparator - Ultra-low-power analog comparator - Programmable Current Source - UART - SPI - I2C - I2S - 10 GPIO - True Random Number Generator (TRNG) - Real-time clock - AES-128 security module - Support for 8 capacitive sensing channels - Integrated Temperature Sensor - Very few external components - Low-speed clock can be derived from high-speed crystal Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 System Block Diagram Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 3. General Specification 3.1 General Specification Model Name WSDT-752B_SC Product Description BLE module Dimension 10.0 mm x 10.0 mm x 1.5 mm (W*L*T) Operating temperature -10°C to +65°C Storage temperature -20°C to +85°C Humidity Operating Humidity 10% to 80% Non-Condensing Storage Humidity 5% to 95% (Non-Condensing) Weight 0.023 g +/- 10g 3.2 Voltages 3.2.1 Absolute Maximum Ratings Symbol Description Min. Max. Unit VDDS Module Voltage -0.2 4.0 VDDS2 Module Voltage -0.2 4.0 VDDS_DCDC Module Voltage -0.2 4.0 3.2.2 Recommended Operating Ratings Test conditions: At room temperature 25°C Symbol Min. Typ. Max. Unit VDD 2.16 3.3 3.465 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 3.3 Power Consumption 3.3.1 BLE Power Consumption Test conditions: TX mode @VDD=3.3V; Temp=25°C Current@VDD Test at 25℃/3.3V (Default FW@ROM) Power Mode Current Description (Peak ) Initialize DUT link to Smart RF Studio 2.7mA Tx Continuous Transmit Packet Continously@1.82dBm 8.1mA Rx Continuous Receive Packet Continuously 7.2mA Tx Packet Transmit Packet to Golden Sample 3.5mA RX Packet Receive Packet From Golden Sample 7.5mA After Press Reset Button ,enter 238uA advertising state for 10 sec then enter Standby Mode(Specific FW) 10uA Broadcast 1.4uA (Typical) Deep Sleep mode (timer on) 3.3V Typ. Max. Unit Broadcast -- 238 uA Srandby Mode 1.4 10 uA Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 4. Main CPU Overview The WSDT-752B_SC contains an ARM® Cortex™ M3 (CM3) 32-bit CPU, which runs the application and protocol stack in the product, and the protocol stack in the wireless network processor (WNP) products. 4.1 CM3 Features 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications Outstanding processing performance combined with fast interrupt handling Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications: –Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral control –Unaligned data access, enabling data to be efficiently packed into memory Fast code execution permits slower processor clock or increases sleep mode time Harvard architecture characterized by separate buses for instruction and data Efficient process core, system and memories Hardware division and fast digital-signal-processing oriented multiply accumulate Saturating arithmetic for signal processing Deterministic, high-performance interrupt handling for time-critical applications Enhanced system debug with extensive breakpoint and trace capabilities Serial wire trace reduce the number of pins required for debugging and tracing Migration from the ARM7™ processor family for better performance and power efficiency Optimized for single-cycle flash memory use Ultra-low power consumption with integrated sleep modes 48 MHz operation – the operating frequency can be dynamically altered to minimize power requirements. 1.25 DMIPS / MHz Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 5. RF Specification 5.1 BLE Specification 1 Mbps GFSK (Bluetooth low energy) Conditions : VDD=3.3V ; Temp:25°C. Using Anisu CombiTest with MT8852B TX Output Power TX PARAMETER limit Output power @2402MHz MIN TYP MAX UNIT >-20 <+10 0.92 2.4 dBm Peak to Average Power @2402MHz <3dB 0.14 dB Output power @2440MHz >-20 <+10 0.74 dBm Peak to Average Power @2440MHz <3dB 0.13 dB Output power @2480MHz >-20 <+10 0.39 dBm Peak to Average Power @2480MHz <3dB 0.14 dB Carrier Frequency Offset and Drift TX PARAMETER limit MIN TYP MAX UNIT Frequency Offset @2402MHz ≦±150 kHz -0.9 5.7 10.6 KHz Drift Rate / 50 µs @2402MHz ≦20 kHz / 50 µs Max Drift @2402MHz ≦50 kHz Frequency Offset @2440MHz ≦±150 kHz Drift Rate / 50 µs @2440MHz 2.5 ≦20 kHz / 50 µs Max Drift @2440MHz ≦50 kHz Frequency Offset @2480MHz ≦±150 kHz -0.2 10.65 KHz -10 KHz 6.5 9.9 -7.37 KHz -7 KHz 5.1 7.1 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 KHz KHz Drift Rate / 50 µs @2480MHz Max Drift @2480MHz ≦20 kHz / 50 µs ≦50 kHz -8.85 KHz -11 KHz Modulation Characteristics TX PARAMETER limit F1avg @2402MHz MIN TYP MAX UNIT 225 kHz < F1avg < 275 kHz 252 263 KHz F2max @2402MHz >= 185 kHz 201 KHz 'F2max' Pass Rate @2402MHz > 99.9 % 100 ％ F1/F2 ratio @2402MHz >= 0.80 20 F1avg @2440MHz 225 kHz < F1avg < 275 kHz 261.2 F2max @2440MHz >= 185 kHz 214.4 KHz 'F2max' Pass Rate @2440MHz > 99.9 % 100 ％ F1/F2 ratio @2440MHz >= 0.80 20 F1avg @2480MHz 225 kHz < F1avg < 275 kHz 262 F2max @2480MHz >= 185 kHz 210 KHz 'F2max' Pass Rate @2480MHz > 99.9 % 100 ％ F1/F2 ratio @2480MHz >= 0.80 20 271.4 273.7 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 KHz KHz RX Receiver sensitivity(Power Level: -90.0 dBm, Dirty Tx Status: On) RX PARAMETER limit MIN TYP MAX UNIT Frame Error Rate@2402MHz <= 30.800 % 12.6 ％ Frame Error Rate@2440MHz <= 30.800 % 21.07 ％ Frame Error Rater @2480MHz <= 30.800 % 14.74 ％ PER Report Integrity(Power Level: -30.0 dBm, Packet Number Mode: Random) RX PARAMETER limit Frame Error Rate@2402MHz 50.0 % <= PER <= 65.4 Frame Error Rate@2440MHz 50.0 % <= PER <= 65.4 Frame Error Rate@2480MHz 50.0 % <= PER <= 65.4 MIN TYP MAX UNIT ％ 50.4 ％ 50.4 ％ 50.3 Maximum Input Signal Level(Power Level: -10.0 dBm) RX PARAMETER limit Fame Error Rate @2402MHz <= 30.800 % Frame Error Rate@2440MHz <= 30.800 % Frame Error Rate@2480MHz <= 30.800 % MIN TYP MAX UNIT 0.8 0.8 0.733 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 ％ ％ ％ 6. Ceramic Chip Antenna Specification 6.1 Description Value DESCRIPTION VALUE Working Frequency 2.45 GHz Bandwidth 170 MHz ( Typ. ) VSWR 2.0 (Max.) Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 5.88 dBi (Typ.) Impedance 50 Ω Maximum Power 1W Termination Ni / Sn (Environmentally-Friendly Leadless) Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 10 7. Pinout Information 7.1 Schematic Diagram VDDS2 GND 19 20 21 22 23 24 25 26 27 31 29 GND NC GND VDDS_DCDC nRESET DIO_5 DIO_6 DIO_7 DIO_8 NC H1 H2 H3 H4 H5 H6 H7 H8 H9 H1 H2 H3 H4 H5 H6 H7 H8 H9 GND nRESET DIO_5 DIO_6 DIO_7 DIO_8 GND 28 VDDS_DCDC 10 11 12 13 14 15 16 17 18 DIO_9 GND VDDS GND NC GND VDDR GND ANT_SMA 30 DIO_4 DIO_3 JTAG_TCK JTAG_TMS VDDS2 GND DIO_2 DIO_1 DIO_0 U1 DIO_2 DIO_1 DIO_0 JTAG_TMS JTAG_TCK DIO_3/JTAG_TDO DIO_4/JTAG_TDI DIO_9 VDDS 7.2 Pin Descriptions PIN NAME PIN PIN TYPE DESCRIPTION DIO_0 Digital I/O GPIO, ULP Sensor Interface, LED driving capability , 2mA / 4mA / 8mA DIO_1 Digital I/O GPIO, ULP Sensor Interface, LED driving capability , 2mA / 4mA / 8mA , UART_TX DIO_2 Digital I/O GPIO, ULP Sensor Interface, LED driving capability , 2mA / 4mA / 8mA , UART_RX GND Power Ground VDDS2 Power 3.3V DIO supply JTAG_TMSC Digital I/O JTAG TMSC JTAG_TCKC Digital I/O JTAG TCKC DIO_3 Digital I/O JTAG_TDO , High drive capability , 2mA / 4mA / 8mA DIO_4 Digital I/O JTAG_TDI , High drive capability , 2mA / 4mA / 8mA NC 10 No Connector Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 11 GND 11 Power Ground VDDS_DCDC 12 Power RESET_N 13 Digital input DIO_5 14 Digital/Analog I/O GPIO, ULP Sensor Interface, Analog DIO_6 15 Digital/Analog I/O GPIO, ULP Sensor Interface, Analog DIO_7 16 Digital/Analog I/O GPIO, ULP Sensor Interface, Analog / I2C_SCL DIO_8 17 Digital/Analog I/O GPIO, ULP Sensor Interface, Analog / I2C_SDA NC 18 DIO_9 19 GND 20 Power Ground VDDS 21 Power 3.3V main chip supply GND 22 Power Ground NC 23 GND 24 NC 25 GND 26 NC 27 GND 28 Power Ground GND 29 Power Ground GND 30 Power Ground GND 31 Power Ground GND H1~H9 Power Ground 3.3V DC/DC supply. Reset, active-low. No internal pull-up No Connector Digital/Analog I/O GPIO, ULP Sensor Interface, Analog No Connector Power Ground No Connector Power Ground No Connector Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 12 7.3 Pin Number Define Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 13 8. Software Overview 8.1 Software tool installation Follow TI document “CC2640 BLE Software Developer's Guide” to setup compiler tool, BSP and related tools. 8.2 WSDT-752B_SC board GPIO configuration file path ...\Projects\ble\common\cc26xx\boards\WSDT-752B_SC Source files: ...\CC2640EM_4XS\board.h ...\CC2640EM_4XS\board.c 8.3 PIN define in header file Board.h // UART Board #define Board_UART_TX #define Board_UART_RX #define Board_UART_CTS #define Board_UART_RTS IOID_1 IOID_2 PIN_UNASSIGNED PIN_UNASSIGNED // I2C Board #define Board_I2C_SCL #define Board_I2C_SDA IOID_7 IOID_8 //Customer Define #define Board_DIO_0 #define Board_DIO_5 #define Board_DIO_6 #define Board_DIO_9 IOID_0 IOID_5 IOID_6 IOID_9 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 14 9. Module Dimensions 9.1 Outline Dimension (Unit: mm) Note1 : 3.018mm * 10mm, This is antenna keep out area in the your application. Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 15 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 16 Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 17 9.2 Recommended Footprint (Unit: mm) < TOP VIEW > Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 18 10. Recommended Reflow Profile 1. Referred to IPC/JEDEC standard 2. Peak Temperature : <260°C 3. Cycle of Reflow : 2 times max. 4. Nitrogen reflow is recommended, less than 2000ppm of oxygen concentration. 5. If the shelf time is exceeded, be sure baking step to remove the moisture from the component. Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 19 11. Label Drawing (Unit: mm) Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 20 12. Packing Information 12.1 Packing Dimension TBD Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 21 13.Statement 13.1 FCC Statement: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. 13.2 ISED Statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. In accordance with FCC Part 15C and RSP-100, this module is listed as a Modular Transmitter device. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 22 The antenna of this transmitter must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multitransmitter product approval procedures. 13.3 FCC Label Instructions The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: ZQ6-WSDT752BSC” or “Contains FCC ID: ZQ6-WSDT752BSC.” Any similar wording that expresses the same meaning may be used. Additionally, there must be the following sentence on the device, unless it is too small to carry it: “This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.” If the final product is to be sold in Canada, then this exterior label should use wording such as the following: “Contains Transmitter Module IC: 11956A-WSDT752BSC” Gigafu Technology Inc. http://www.gigafu.com.tw/ Proprietary & Confidential Information May-14/2018 23
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