AirM2M Communication Technology AIR208 GSM/GPRS Module User Manual

Shanghai AirM2M Communication Technology Co., Ltd GSM/GPRS Module

User Manual

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Air208_Hardware Design Manual_V1.03
Air208 Hardware Design Manual
Version
number
Modify record
Date
Date
V1.0
Newly build
2017‐8‐10
jinyi
V1.01
Modifies the main serial port on baud rate training content
2017‐9‐16
Guowen
V1.02
Adds pin description of the boot key booting and shutdown
2017‐11‐03
Guowen
2017‐12‐13
Loukanghua
machine
V1.03
Updates pin diagram
Page2
Totally 57 pages
Air208 Hardware Design Manual
Catalog
1. TABLE CATALOG ............................................................................................................................................................ 6
2.1. RELATED DOCUMENTS.............................................................................................................................................................7
3. SUMMARY................................................................................................................................................................................ 8
3.1. FUNCTION CHART.................................................................................................................................................................10
3.2. EVALUATION BOARD.......................................................................................................................................................11
4. APPLICATION INTERFACE....................................................................................................................................................... 11
4.1. PIN DESCRIPTION..................................................................................................................................................................12
4.2. WORKING MODE..................................................................................................................................................................18
4.3. POWER SUPPLY....................................................................................................................................................................19
4.3.1. Module power supply working characteristics........................................................................................................19
4.3.2. Reduce voltage drop................................................................................................................................................ 19
4.3.3. Power supply reference circuit.................................................................................................................................20
4.4. BOOT AND SHUTDOWN......................................................................................................................................................... 21
4.4.1. Boot..........................................................................................................................................................................21
4.4.2. Shutdown.................................................................................................................................................................22
4.5. POWER SAVING TECHNOLOGY.................................................................................................................................................24
4.5.1. Least functional mode............................................................................................................................................. 24
4.5.2. Sleep Mode (Slow Clock Mode).............................................................................................................................24
4.5.3. Sleep wake............................................................................................................................................................... 25
4.6. MODE SWITCHING SUMMARY................................................................................................................................................25
4.7. SERIAL PORT....................................................................................................................................................................... 25
4.7.1. Main serial port....................................................................................................................................................... 27
4.7.2. Debug serial port..................................................................................................................................................... 29
4.7.3. Serial port application............................................................................................................................................. 30
4.8. AUDIO INTERFACE................................................................................................................................................................ 32
4.8.1. Preventing TDD noise and other noises...................................................................................................................32
4.8.2. Microphone interface reference circuit................................................................................................................... 33
4.8.3. Audio output interface reference circuit..................................................................................................................33
4.8.4. Audio Electrical characteristics................................................................................................................. 34
4.9. SIM CARD INTERFACE..................................................................................................................................................... 35
4.9.1. SIM INTERFACE....................................................................................................................................................... 35
4.9.2. 6-pin SIM card holder.............................................................................................................................................36
4.10. RI SIGNAL ACTION........................................................................................................................................................ 38
4.11. NETWORK STATUS INDICATION............................................................................................................................................. 40
4.12. PWM............................................................................................................................................................................. 41
5. RADIO INTERFACE...................................................................................................................................................................41
5.1. RF REFERENCE CIRCUIT..........................................................................................................................................................42
5.2. RF CONDUCTION SENSITIVITY........................................................................................................................................ 44
Page3
Totally 57 pages
Air208 Hardware Design Manual
5.3. RECOMMENDED RF WELDING METHOD....................................................................................................................................45
6. ELECTRICAL CHARACTERISTICS, RELIABILITY, RF CHARACTERISTICS.................................................................................... 46
6.1. ABSOLUTE MAXIMUM...........................................................................................................................................................46
6.2. WORKING TEMPERATURE....................................................................................................................................................... 46
6.3. VOLTAGE LIMIT VALUE...........................................................................................................................................................47
6.4. CURRENT CONSUMPTION.......................................................................................................................................................49
6.5. STATIC PROTECTION............................................................................................................................................................. 50
7. PHYCIAL DIMENSION..............................................................................................................................................................51
7.1. MODULE PHYCIAL DIMENSION................................................................................................................................................ 52
7.2. RECOMMENDED PCB ENCAPSULATION.................................................................................................................................... 53
7.3. MODULE FRONT VIEW...........................................................................................................................................................54
7.4. MODULE BOTTOM VIEW........................................................................................................................................................55
8. STORAGE AND PRODUCTION.................................................................................................................................................55
8.1. STORAGE............................................................................................................................................................................ 55
8.2. PRODUCTION WELDING......................................................................................................................................................... 56
Page4
Totally 57 pages
Air208 Hardware Design Manual
Chart Catalog
CHART 1 :FUNCTIONAL BLOCK DIAGRAM.................................................................................................10
CHART 2 :PIN ARRANGEMENT (FRONT VIEW)................................................................................. ...............12
CHART 3 :VOLTAGE AND CURRENT WAVEFORM SOF M ODULE EMISSION........................................................... 19
CHART 4 :VBAT INPUT REFERENCE CIRCUIT.............................................................................................20
CHART 5 :POWER INPUT REFERENCE DESIGN....................................................................................................21
CHART 6 :OPEN SET DRIVER REFERENCE BOOT CIRCUIT........................................................................................22
CHART 7 :BUTTON BOOTREFERENCE CIRCUIT............................................................................................... ......22
CHART 8 :OPEN DRIVER REFERENCE EMERGENCY SHUTDOWN CIRCUIT.....................................................................23
CHART 9 :BUTTON EMERGENCY SHUTDOWNREFERENCE CIRCUIT.............................................................................24
CHART 10 :FULL‐FEATURED SERIAL PORT CONNECTION DIAGRAM ...........................................................................28
CHART 11 :SERIAL THREE‐WIRE CONNECTION DIAGRAM.........................................................................................28
CHART 12 :SCHEMATIC DIAGRAM OF SERIAL CONNECTION MODE WITH FLOW CONTROL...............................................29
CHART 13 :SOFTWARE DEBUGGING CONNECTION DIAGRAM....................................................................................29
CHART 14 :3.3V LEVEL CONVERSION CIRCUIT......................................................................................................30
CHART 15 :5VLEVEL CONVERSION CIRCUIT...........................................................................................................31
CHART 16 :RS232 LEVEL CONVERSION CIRCUIT....................................................................................................31
CHART 17 :AIN MICROPHONE CHANNEL INTERFACE CIRCUIT.......................................................................33
CHART 18 :REFERENCE LINE................................................................................................................................34
CHART 19 :USING A 6PIN SIM CARD REFERENCE SCHEMATIC (SIM).........................................................................35
CHART 20 :WITH THE DETECTION OF PIN SIM CARD REFERENCE CIRCUIT DIAGRAM....................................36
CHART 21 :AMPHENOL C707 10M006 512 2 SIMCASSETTE..............................................................................37
CHART 22 :THE MODULE IS USED AS CALLED PARTY RI TIMING FOR VOICE CALL............................................................38
CHART 23 :THE MODULE IS USED AS CALLED PARTY RI TIMING FOR DATA CALL.............................................................39
CHART 24 :RI TIMING OF MODULE CALLING...........................................................................................................39
CHART 25 :RI TIMING WHEN RECEIVING URC MESSAGE OR SMS...............................................................................39
CHART 26 :NETLIGHTREFERENCE CIRCUIT.........................................................................................................40
CHART 27 :RF REFERENCE CIRCUIT.........................................................................................................................42
CHART 28 :SUGGESTION ON RF WELDING METHOD...................................................................................................45
CHART 29 :AIR208 FRONT VIEW (UNIT: MM).......................................................................................................52
CHART 30 :RECOMMENDED ENCAPSULATION (UNIT: MM)..........................................................................................53
CHART 31 :MODULE FRONT VIEW...........................................................................................................................54
CHART 32 :MODULE BOTTOM VIEW.........................................................................................................................55
CHART 33 :PASTE MAP.................................................................................................................................... ......56
CHART 34 :FURNACE TEMPERATURE CURVE................................................................................................................57
Page5
Totally 57 pages
Air208 Hardware Design Manual
1.
Table
Catalog
TABLE 1 :RELATED DOCUMENTS..................................................................................................................................................... 7
TABLE 2 :MAIN FEATURES OF THE MODULE......................................................................................................................................8
TABLE 3 :AIR208 PIN ALLOCATION..............................................................................................................................................13
TABLE 4 :PIN DESCRIPTIO............................................................................................................................................................ 14
TABLE5 :GPIO CONFIGURATION TABLE............................................................................................................................................17
TABLE 6 :WORK MODE............................................................................................................................................................... 18
TABLE 7 :MODE SWITCHING SUMMARY......................................................................................................................................... 25
TABLE8 :SERIAL LOGIC LEVEL.......................................................................................................................................................... 26
TABLE 9 :DEFINITION OF SERIAL PORT PINS.....................................................................................................................................26
TABLE10 :AUDIO INTERFACEPIN DEFINITION..................................................................................................................................... 32
TABLE 11 :TYPICAL CHARACTERISTICS OF ELECTRET MICROPHONES..................................................................................................... 34
TABLE 12 :AUDIO INTERFACETYPICAL CHARACTERISTIC PARAMETERS.................................................................................................. 34
TABLE13 :SIM CARD INTERFACEPIN DEFINITION...........................................................................................................................35
TABLE 14 :RI SIGNAL ACTION................................................................................................................................................. 38
TABLE 15 :NET_LED WORKING STATUS.....................................................................................................................................40
TABLE 16 :RF_ANTPIN DEFINITION........................................................................................................................................... 41
TABLE 17 :RFCONDUCTION POWER............................................................................................................................................. 44
TABLE 18 :RF CONDUCTION SENSITIVITY...............................................................................................................................44
TABLE 19 :MODULE WORKING FREQUENCY.................................................................................................................................... 45
TABLE20 :ABSOLUTE MAXIMUM.................................................................................................................................................... 46
TABLE 21 :WORKING TEMPERATURE..............................................................................................................................................46
TABLE 22 :MODULE POWER LIMIT VALUE...................................................................................................................................... 47
TABLE 23 :MODULE'S CURRENT CONSUMPTION.............................................................................................................................. 49
TABLE 24 :ESDP ERFORMANCE PARAMETERS (TEMPERATURE: 2 5 C , HUMIDITY: 4 5 % ) )................................................................50
Page6
Totally 57 pages
Air208 Hardware Design Manual
2. Introduction
This document defines the Air208 module and hardware interface specification, electrical and mechanical details.
With the help of this document, combining with the application manual and user guide, customers can quickly apply
Air208 module for wireless applications.
2.1. Related documents
Table 1:Related documents
Item
File name
Remarks
Detailed explanation of Air208_AT instruction set
Has been published
Air208 Reference design
Has been published
Air208 module encapsulation
Has been published
Luat_AIR2XX upgrading tool1.1
Has been published
Trace Reference design
Has been published
LuaForWindows_v5.1.5‐51
Has been published
Coolwatcher debugging tools and instructions _V1.1
Has been published
Platform compilation environment and installation steps
Has been published
CSDTK3.7_Cygwin1.5.25_Svn_1.5.4_Full_Setup
Has been published
Page7
Totally 57 pages
Air208 Hardware Design Manual
3. Summary
Air208 module is the two band GSM/GPRS module, its working frequency bands are:
GSM850MHz, WC^ϭ900MHz. Air208
CS‐1, CS‐2, CS‐3 and CS‐4.
supports GPRS multi slot level 12 and GPRS encoding formats
With the ultra small size of 17.6mm * 15.7mm * 2.3mm, Air208 is able to meet all the needs of M2M,
including cars and personal tracking services, wireless POS, smart metering, industrial PDA and other M2M
applications.
Air208 is built‐in 32MbNorFlash + 32MbSRAM.
Air208 is a chip‐on‐module, with a LCC package that can be embedded in customer applications with its
pin‐on‐land, providing a rich hardware interface between the module and the customer's motherboard.
Air208 module uses a power‐saving technology, current consumption in sleep mode DRX = 5, as low as 1.14mA.
Air208 embeds protocols such as TCP UDP PPP HTTPS SSL and built‐in extended AT commands to make it easier
for users to use these Internet protocols.
Air208 complies with the RoHS standard.
Table 2:Main features of the module
Feature
Description
Band
♦
♦
♦
♦
Quad‐band:GSM850,3CSϭϵϬϬ
Automatic frequency band search
Band selection can be set by AT command
Meets GSM Phase 2/2+
Transmitting power
♦
♦
Class 4 (2W):GSM850
Class 1 (1W): WCS1ϵ00
Power supply
♦
DC 3.8V
Power saving mode
current consumption
♦
♦
♦
1.40mA@DRX=2
1.14 mA@ DRX=5
1.03 mA@ DRX=9
GPRS Connection
characteristic
♦
♦
GPRS multi slot level is 12 (default)
GPRS mobile level B
Page8
Totally 57 pages
Air208 Hardware Design Manual
♦
♦
♦
♦
♦
Downlink GPRS data transmission: maximum 85.6 kbps
GPRS data uplink transmission: maximum 85.6 kbps
Coding format:CS‐1,CS‐2,CS‐3 and CS‐4
Support PAP (cryptographic authentication protocol) protocols commonly used for
PPP connections
Embedded protocol:TCP/UDP/FTP/PPP and so on
Temperature range
♦
♦
Normal working temperature:‐40°C ~ +85°C
storagetemperature:‐45°C ~ +90°C
SMS
Text and PDU modes
SIM CARD INTERFACE
SupportsSIM/USIM card:1.8V,3V
Characteristic
50 Ω
Audio interface
Supports call, recording and playback function, can directly drive 8 ohm horn
GPRS Data
characteristics
♦
Full function serial port
„ For AT command and GPRS data
„ Adaptive baud rate:From 2400 bps to 921600 bps
Debug serial port
„ For software upgrade
„ For software debugging
Serial port
♦
Real time clock
Real time clock
Dimension
17.6×15.7×2.3mm
Weight:1.25g
Page9
Totally 57 pages
Air208 Hardware Design Manual
3.1. Function Chart
Following is Air208Functional block diagram,describing its main function:
♦ storage
♦ GSM RF
♦ Power Management
♦ Interface section
— SIM card interface
—Audio interface
— UART interface
— Power supply
—RF interface
— Boot and shutdown
Chart 1:Functional block diagram
Page10 Totally 57 pages
Air208 Hardware Design Manual
3.2. Evaluation Board
In order to help test and use Air208, Airm2m provides a set of evaluation boards. They includes Air208 module,
EVB_Air208, UART to USB cable and so on.
4. Application interface
The module uses LCC package, 42 SMT welding coil pins, and the following chapter details the functions of the
following interfaces:
♦ power supply (refer to power supply section)
♦ Switch machine (refer to switch section)
♦ power saving technology (refer to power saving technology section)
♦ Serial port (refer to serial section)
♦ Audio interface(refer to audio section)
♦ SIM CARD INTERFACE(refer to SIM card section)
Page11 Totally 57 pages
Air208 Hardware Design Manual
VBAT
34
GND
36
35 VBAT
GND
37
38 ADC
PWRKEY
39
40 VDDIO
41 NET_LED
42 STATUS
4.1. Pin description
UART1_TXD
33 GND
UART1_RXD
32 ANT
UART1_RTS
31 GND
UART1_CTS
30 GND
UART1_DCD
29 GPIO_6
UART1_DTR
UART1_RI
GND
26
HOST_TXD
MICP
25
HOST_RXD
Air208
28 VRTC
27 GND
MICN 10
24 CHG_DET
UART2_RXD
GND 21
RESET 20
GND 19
SIM_VDD 18
22 UART2_TXD
SIM_RST 17
12
SIM_CLK 16
SPKN
SIM_DAT 15
23
SIM_DET 14
11
GND 13
SPKP
Chart 2:Pin arrangement (front view)
Page12 Totally 57 pages
Air208 Hardware Design Manual
Table 3:Air208 Pin allocation
Pin
Pin name
Input/Output
Pin No.
Pin name
Input/Output
UART1_TXD/GPIO_1
22
UART2_TXD/GPIO_5
UART1_RXD/GPIO_0
23
UART2_RXD/GPIO_4
UART1_RTS/GPIO_2
24
CHG_DET
UART1_CTS/GPIO_3
25
HOST_RXD
UART1_DCD/GPIO_31
26
HOST_TXD
UART1_DTR/GPIO_29
27
GND
UART1_RI/GPIO_30
28
GPIO_6
I/O
GND
29
VRTC
MICP
30
GND
10
MICN
31
GND
11
SPKP
32
ANT
12
SPKN
33
GND
13
GND
34
VBAT
14
SIM_DET/GPIO_7
35
VBAT
15
SIM_DAT
I/O
36
GND
16
SIM_CLK
I/O
37
GND
17
SIM_RST
38
ADC
18
SIM_VDD
39
PWRKEY
19
GND
40
VDDIO
20
RESET
41
NET_LED/GPIO_33
21
GND
42
STATUS/GPIO_11
I/O
Page13 Totally 57 pages
Air208 Hardware Design Manual
Table 4:Pin descriptio
ower Supply
Pin name
Pin No.
I/O
Pin description
Electrical characteristics
Remark
VBAT
34 35
Module's main power
supplyVBAT=3.4V~4.2
Vmax= 4.2V
Vmin=3.4V
Vnorm=3.8V
The module has a
maximum load current
of 1.6A in burst mode
1.Hang when not in
usage
2. If this pin is used for
external power supply,
VDDIO
41
Output 2.8V,10mA
Vmax=2.95V
it is recommended to
shunt a 2~4.7uF
decoupling capacitor,
and the load current
should not exceed
10mA
8 13 19
21 27
GND
Module GND
30 31
33 36
Power button
Pin name
Pin no.
I/O
Pin description
Electrical characteristics
PWRKEY
39
Internal pull‐up, pull the pin
lower than 1.5s module
boot
VILmax=0.4V
20
Hardware shutdown pin,
active low。The module
shutdown after pulldown
more than 200ms
Vmax= 1.5V
Vmin=1.1V
Vnorm=1.35V
No external pull‐ups are
required
Pin name
Pin no.
Pin description
Electrical characteristics
Remark
MICP
MICN
10
Differential audio input
SPKP
SPKN
11 12
Differential audio output,
you can directly drive the 8
ohm speaker
I/O
Pin description
Electrical characteristics
Remark
RESET
Remark
Audio interface
The main serial port
Pin name
Pin no.
Page14 Totally 57 pages
Air208 Hardware Design Manual
UART1_TXD
(GPIO_1)
(SPI2_CS0)
Module to send data
UART1_RXD
(GPIO_0)
(SPI2_CLK)
The module receives the
data
UART1_CTS
(GPIO_3)
(SPI2_DO)
Clear send
UART1_RTS
(GPIO_2)
(SPI2_CS1)
The DTE requests to send
data to the module
UART1_DTR
(GPIO_29)
DTE is ready
UART1_DCD
(GPIO_31)
Carrier detection (this pin
represents the
communication link)
UART1_RI
(GPIO_30)
Module output ringing hint
Pin name
Pin no.
I/O
UART2_RXD
(GPIO_4)
(SPI2_DI)
(LPG)
23
UART2_TXD
(GPIO_5)
(PWM)
22
Pin name
Pin no.
I/O
HOST_RXD
25
VILmin=-0.3V
VILmax=0.25×VDDIO
VIHmin=0.75×VDDIO
VIHmax=VDDIO+0.3
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
RXD needs external 10K
ohm resistor to pull to
VDDIO.
If communication is
used only in TXD, RXD
and GND, it is
recommended that RTS
be grounded through
10K ohm resistance;
The module defaults to
sleep and power saving.
If you want to send AT
instructions to the
module during
hibernation, you need
to lower the DTR to
wake up the module;
If you do not want the
module to go to sleep,
you can ground the DTR
through a 10K resistor.
Other pins can be hang
when is not in usage.
Pin description
Electrical characteristics
Remark
Hardeare UART2
VILmin=-0.3V
VILmax=0.25×VDDIO
VIHmin=0.75×VDDIO
VIHmax=VDDIO+0.3
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in usage
Pin description
Electrical characteristics
Remark
For software debugging and
firmware download
VILmin=-0.3V
VILmax=0.25×VDDIO
VIHmin=0.75×VDDIO
VIHmax=VDDIO+0.3
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in usage
Pin description
Electrical characteristics
Remark
The module automatically
selects 1.8V or 3.0V
SIM CARD INTERFACEIt
is recommended to use
TVS tube for ESD
UART2
Debug serial port
HOST_TXD
26
SIM CARD INTERFACE
Pin name
SIM_VDD
Pin no.
18
I/O
Power supply voltage of
SIM card
Page15 Totally 57 pages
Air208 Hardware Design Manual
3V:
VOLmax=0.36
SIM_RST
SIM_DAT
17
15
I/O
SIM card Reset
SIM card data cable
VOHmin=0.9×SIM_VDD
1.8V:
VOLmax=0.2×SIM_VDD
VOHmin=0.9×SIM_VDD
3V:
VOLmax=0.4
VOHmin= SIM_VDD-0.4
1.8V:
VOLmax=0.15×SIM_VDD
VOHmin=SIM_VDD-0.4
3V:
VOLmax=0.4
VOHmin=0.9×SIM_VDD
16
SIM card clock cable
14
SIM card in position
detection
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in usage
Pin name
Pin no.
I/O
Pin description
Electrical characteristics
Remark
ADC0
38
Analog to digital
converter
Input range 0~1.85V
10bit
tolerance scope +—20mv
Hang when not in usage
Pin name
Pin no.
I/O
Pin description
Electrical characteristics
Remark
NET_LED
(GPIO_33)
(32K_OUT)
41
Network status
indication
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in
usage
STATUS
(GPIO_11)
42
Operating status
detection
VOHmin=0.85×VMMC
VOLmax=0.15×VMMC
Hang when not in
usage
GPIO_6
(UART2_RTS)
(I2C_CLK)
29
I/O
Reserved
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in
usage
Pin name
Pin no.
I/O
Pin description
Electrical characteristics
Remark
ANT
32
I/O
GPRS RF signal input and
output
50 ohm characteristic
impedance
SIM_CLK
1.8V:
VOLmax=0.12×SIM_VDD
VOHmin=0.9×SIM_VDD
SIM_DET
(GPIO_7)
(UART2_CTS)
(I2C_SDA)
ADC
GPIO
Radio interface
Page16 Totally 57 pages
Table5:GPIO Configuration table
Air208
GPIO
PINNO.
number
Name.
Power
Pull‐
Domain
Up
Pull‐
At Reset
After Reset
Function0
Function1
Function2
Function3
Up/Down
Resistor
H/L/Hiz
pull
PinState
H/L/Hiz
pull
PinState
Function0
Type
PULL
ADDRESS
Function1
Type
PULL
ADDRESS
Function2
Type
PULL
ADDRESS
Function3
Type
PULL
ADDRESS
GPIO0
GPIO_0/UART1_RXD
2.8V,
166K
UP
INPUT
UP
INPUT
GPIO_0
I/O
UP
0x01A2A090(0x0)
UART1_RXD
UP
0x01A2A090(0x1)
SPI2_CLK
I/O
UP
0x01A2A090(0x2)
GPIO1
GPIO_1/UART1_TXD
2.8V,
166K
DN
INPUT
DN
INPUT
GPIO_1
I/O
DN
0x01A2A094(0x0)
UART1_TXD
OFF
0x01A2A094(0x1)
SPI2_CS_0
I/O
UP
0x01A2A094(0x2)
GPIO2
GPIO_2/UART1_RTS
2.8V,
166K
DN
INPUT
DN
INPUT
GPIO_2
I/O
DN
0x01A2A098(0x0)
UART1_RTS
UP
0x01A2A098(0x1)
SPI2_CS_1
I/O
UP
0x01A2A098(0x2)
PWL_1
OFF
0x01A2A098(0x3)
GPIO_3
GPIO_3/UART1_CTS
VDDIO
2.8V,
166K
DN
INPUT
DN
INPUT
GPIO_3
I/O
DN
0x01A2A09C(0x0)
UART1_CTS
OFF
0x01A2A09C(0x1)
SPI2_DI_0
I/O
DN
0x01A2A09C(0x2)
LPSCO_1
OFF
0x01A2A09C(0x3)
23
GPIO_4
GPIO_4/UART2_RXD
2.8V
2.8V,
166K
UP
INPUT
UP
INPUT
GPIO_4
I/O
UP
0x01A2A0A0(0x0)
UART2_RXD
UP
0x01A2A0A0(0x1)
SPI2_DI_1
UP
0x01A2A0A0(0x2)
LPG
UP
0x01A2A0A0(0x3)
22
GPIO_5
GPIO_5/UART2_TXD
2.8V,
166K
DN
INPUT
DN
INPUT
GPIO_5
I/O
DN
0x01A2A0A4(0x0)
UART2_TXD
OFF
0x01A2A0A4(0x1)
LCD_TE
DN
0x01A2A0A4(0x2)
PWT
OFF
0x01A2A0A4(0x3)
29
GPIO_6
GPIO_6/UART2_RTS/I2C3_SCL
2.8V,
33K
DN
INPUT
DN
INPUT
GPIO_6
I/O
DN
0x01A2A0A8(0x0)
UART2_RTS
UP
0x01A2A0A8(0x1)
I2C3_SCL
I/O
UP
0x01A2A0A8(0x2)
TCO_3
OFF
0x01A2A0A8(0x3)
14
GPIO_7
GPIO_7/UART2_CTS/I2C3_SDA
2.8V,
33K
DN
INPUT
DN
INPUT
GPIO_7
I/O
DN
0x01A2A0AC(0x0)
UART2_CTS
OFF
0x01A2A0AC(0x1)
I2C3_SDA
I/O
UP
0x01A2A0AC(0x2)
TCO_4
OFF
0x01A2A0AC(0x3)
GPIO_8
SSD_CLK/SPI1_CLK
1.9V,
166K
OFF
OUTPUT
26MHz
OFF
OUTPUT
SDMMC_CLK
OFF
0x01A2A04C(0x0)
GPIO_8
I/O
DN
0x01A2A04C(0x1)
SPI1_CLK
I/O
DN
0x01A2A04C(0x2)
I2C1_SCL
I/O
UP
0x01A2A04C(0x3)
GPIO_9
SSD_CMD/SPI1_CS0
1.9V,
50K
UP
INPUT
UP
INPUT
SDMMC_CMD
I/O
UP
0x01A2A050(0x0)
GPIO_9
I/O
DN
0x01A2A050(0x1)
SPI1_CS_0
I/O
UP
0x01A2A050(0x2)
I2C1_SDA
I/O
UP
0x01A2A050(0x3)
GPIO_10
SSD_DATA0/SPI1_CS1
VMMC
1.9V,
50K
UP
INPUT
UP
INPUT
SDMMC_DATA_0
I/O
UP
0x01A2A054(0x0)
GPIO_10
I/O
DN
0x01A2A054(0x1)
SPI1_CS_1
I/O
UP
0x01A2A054(0x2)
42
GPIO_11
SSD_DATA1/SPI1_DI_O
1.8/1.9/2.0/2.6/2.8/3.0/3.3V
1.9V,
50K
UP
INPUT
UP
INPUT
SDMMC_DATA_1
I/O
UP
0x01A2A058(0x0)
GPIO_11
I/O
DN
0x01A2A058(0x1)
SPI1_DI_0
I/O
DN
0x01A2A058(0x2)
GPIO_12
SSD_DATA2/SPI1_DI_1
1.9V,
50K
UP
INPUT
UP
INPUT
SDMMC_DATA_2
I/O
UP
0x01A2A05C(0x0)
GPIO_12
I/O
DN
0x01A2A05C(0x1)
SPI1_DI_1
DN
0x01A2A05C(0x2)
GPIO_13
SSD_DATA3
1.9V,
50K
UP
INPUT
UP
INPUT
SDMMC_DATA_3
I/O
UP
0x01A2A060(0x0)
GPIO_13
I/O
DN
0x01A2A060(0x1)
GPIO_14
GPIO_14/I2S_BCK
1.9V,
166K
OFF
OUTPUT
OFF
OUTPUT
LCD_RSTB
OFF
0x01A2A064(0x0)
GPIO_14
I/O
DN
0x01A2A064(0x1)
DAI_RST
DN
0x01A2A064(0x2)
I2S_BCK
I/O
DN
0x01A2A064(0x3)
GPIO_15
GPIO_15/I2S_LRCK
1.9V,
166K
OFF
OUTPUT
OFF
OUTPUT
SPI_LCD_CS
OFF
0x01A2A068(0x0)
GPIO_15
I/O
DN
0x01A2A068(0x1)
DAI_CLK
OFF
0x01A2A068(0x2)
I2S_LRCK
I/O
DN
0x01A2A068(0x3)
1.9V,
166K
OFF
OUTPUT
OFF
OUTPUT
SPI_LCD_SCK
OFF
0x01A2A06C(0x0)
GPIO_16
I/O
DN
0x01A2A06C(0x1)
DAI_DI
DN
0x01A2A06C(0x2)
I2S_DI
DN
0x01A2A06C(0x3)
DAI_DO
OFF
0x01A2A070(0x2)
I2S_DO
OFF
0x01A2A070(0x3)
SPI_CAM_SSN
I/O
DN
0x01A2A08C(0x3)
VLCD
GPIO_16
GPIO_16/I2S_DI
GPIO_17
GPIO_17/I2S_DO
1.9V,
166K
DN
OUTPUT
DN
OUTPUT
SPI_LCD_DIO
I/O
DN
0x01A2A070(0x0)
GPIO_17
I/O
DN
0x01A2A070(0x1)
GPIO_18
GPIO_18
1.9V,
166K
OFF
OUTPUT
OFF
OUTPUT
SPI_LCD_SDC
OFF
0x01A2A074(0x0)
GPIO_18
I/O
DN
0x01A2A074(0x1)
GPIO_19
GPIO_19/I2C2_SCL
1.9V,
33K
OFF
OUTPUT
OFF
OUTPUT
CAM_PWDN
OFF
0x01A2A078(0x0)
GPIO_19
I/O
DN
0x01A2A078(0x1)
I2C2_SCL
I/O
UP
0x01A2A078(0x2)
GPIO_20
GPIO_20/I2C2_SDA
1.9V,
33K
OFF
OUTPUT
OFF
OUTPUT
CAM_RSTB
OFF
0x01A2A07C(0x0)
GPIO_20
I/O
DN
0x01A2A07C(0x1)
I2C2_SDA
I/O
UP
0x01A2A07C(0x2)
GPIO_21
GPIO_21
VCAM
1.9V,
166K
OFF
OUTPUT
OFF
OUTPUT
CAM_CLK
OFF
0x01A2A080(0x0)
GPIO_21
I/O
DN
0x01A2A080(0x1)
GPIO_22
GPIO_22
1.8/2.8V
1.9V,
166K
DN
OUTPUT
DN
OUTPUT
SPI_CAM_SCK
I/O
DN
0x01A2A084(0x0)
GPIO_22
I/O
DN
0x01A2A084(0x1)
GPIO_23
GPIO_23
1.9V,
166K
DN
INPUT
DN
INPUT
SPI_CAM_DI_0
DN
0x01A2A088(0x0)
GPIO_23
I/O
DN
0x01A2A088(0x1)
SPI_CAM_DI_1
DN
0x01A2A088(0x2)
GPIO_24
GPIO_24
1.9V,
166K
DN
INPUT
DN
INPUT
SPI_CAM_DI_1
DN
0x01A2A08C(0x0)
GPIO_24
I/O
DN
0x01A2A08C(0x1)
SPI_CAM_DI_0
DN
0x01A2A08C(0x2)
GPIO_25
GPIO_25
2.8V,
166K
DN
INPUT
DN
INPUT
KEYIN_0
DN
0x01A2A0B0(0x0)
GPIO_25
I/O
DN
0x01A2A0B0(0x1)
GPIO_26
GPIO_26
2.8V,
166K
DN
INPUT
DN
INPUT
KEYIN_1
DN
0x01A2A0B4(0x0)
GPIO_26
I/O
DN
0x01A2A0B4(0x1)
GPIO_27
GPIO_27
2.8V,
166K
DN
INPUT
DN
INPUT
KEYIN_2
DN
0x01A2A0B8(0x0)
GPIO_27
I/O
DN
0x01A2A0B8(0x1)
GPIO_28
GPIO_28
2.8V,
166K
DN
INPUT
DN
INPUT
KEYIN_3
DN
0x01A2A0BC(0x0)
GPIO_28
I/O
DN
0x01A2A0BC(0x1)
GPIO_29
GPIO_29
VDDIO
2.8V,
166K
DN
INPUT
DN
INPUT
KEYIN_4
DN
0x01A2A0C0(0x0)
GPIO_29
I/O
DN
0x01A2A0C0(0x1)
GPIO_30
GPIO_30
2.8V
2.8V,
166K
DN
INPUT
DN
INPUT
KEYOUT_0
I/O
DN
0x01A2A0C4(0x0)
GPIO_30
I/O
DN
0x01A2A0C4(0x1)
GPIO_31
GPIO_31
2.8V,
166K
DN
INPUT
DN
INPUT
KEYOUT_1
I/O
DN
0x01A2A0C8(0x0)
GPIO_31
I/O
DN
0x01A2A0C8(0x1)
GPIO_32
GPIO_32
2.8V,
166K
DN
INPUT
DN
INPUT
KEYOUT_2
I/O
DN
0x01A2A0CC(0x0)
GPIO_32
I/O
DN
0x01A2A0CC(0x1)
41
GPIO_33
GPIO_33/32K_OUT
2.8V,
166K
DN
INPUT
DN
INPUT
KEYOUT_3
I/O
DN
0x01A2A0D0(0x0)
GPIO_33
I/O
DN
0x01A2A0D0(0x1)
DBG_CLK(32Kclockout)
OFF
0x01A2A0D0(0x5)
GPIO_34
GPIO_34
2.8V,
166K
DN
INPUT
DN
INPUT
KEYOUT_4
I/O
DN
0x01A2A0D4(0x0)
GPIO_34
I/O
DN
0x01A2A0D4(0x1)
HST_CLK
DN
0x01A2A0D4(0x5)
25
GPIO_35
HST_RXD/GPIO_35
VDDIO
2.8V,
166K
UP
INPUT
UP
INPUT
HST_RXD
UP
0x01A2A0D8(0x0)
GPIO_35
I/O
DN
0x01A2A0D8(0x1)
26
GPIO_36
HST_TXD/GPIO_36
2.8V
2.8V
166K
UP
OUTPUT
UP
OUTPUT
HST_TXD
I/O
UP
0x01A2A0DC(0x0)
GPIO_36
I/O
DN
0x01A2A0DC(0x1)
1.8/2.8V
4.2. Working mode
The table below briefly describes the various modes of work mentioned in the next few chapters.
Table 6:Work mode
Mode
Function
GSM/GPRS SLEEP
GSM IDLE
If the DTR pin is high and there is no interrupt (for example, GPIO interrupt or serial
data wake‐up interrupt), the module will automatically enter the sleep mode. Sleep
mode, the module is still able to receive packets, short messages and calls.
Software running normally. Module registration on GSM network, no data, voice
and SMS interaction.
GSM connection to work properly. Have data or voice or SMS interaction. In this
GSM TALK
mode, the power consumption of the module depends on the strength of the
environmental signal, dynamic DTX control and the working frequency of the radio.
Normal work
GPRS IDLE
GPRS STANDBY
GPRS READY
Module is not registered to GPRS network. Modules cannot be accessed through
GPRS channels.
The module registers on the GPRS network, but does not activate the PDP context
(the module does not get the IP address).
The PDP context is successfully activated (the module has acquired the IP address),
but no data is transferred. In this state, the module can send or receive data.
GPRS data transfer. In this mode, the power dissipation of the module depends on
GPRS DATA
the power control level, the working RF frequency band and the GPRS multi slot
configuration.
Shutdown mode
By sending the "AT+CPOWD=1" command, using the PWRKEY pin or using "RESET" 1 "pins to achieve the
normal shutdown. The Power Supply management chip turns off the baseband power supply and retains only
the RTC power supply. The software is not running, the serial port can not access. Maintain VBATPower Supply
power supply.
Minimum
function mode
(keep power
supply voltage)
Without power down, the "AT+CFUN" command can be used to set the module into the least functional mode.
In this mode, the radio doesn't work, or the SIM card doesn't work, or both of them don't work, but the serial
port is still accessible. The power consumption is very low in this mode.
Air208 Hardware Design Manual
4.3. Power Supply
4.3.1.
Module power supply working characteristics
Power Supply design is a very important part of GSM / GPRS module design. Since there is a burst of 577us (ie
1/8 TDMA cycle (4.615ms)) every 4.615ms when GSM is transmitting. During the burst phase, Power Supply must be
able to provide high peak currents to ensure that the voltage does not drop to the module's minimum operating
voltage.
For the Air202 module, the peak current of the module will reach 1.6A at the maximum transmit power level,
which will cause the VBAT terminal voltage to drop. In order to ensure stable and normal operation of the module, it
is recommended that the maximum voltage drop at the module VBAT terminal should not exceed 400mV.
Chart 3:Voltage and current waveforms of module emission
4.3.2.
Reduce voltage drop
Module's power supply VBAT input voltage range is 3.4V~4.2V, but in the RF module usually produces Power
Supply voltage drop phenomenon in VBATPower Supply, this is due to the impedance of the Power Supply and
routing path, is difficult to avoid. Therefore, special attention must be paid to the power supply design of the module
to ensure that the VBAT voltage will not drop below 3.0V. When the voltage drops below 3.0V, the power‐down may
be shut down or restarted. At the VBAT input, it is recommended to connect a 100uF tantalum capacitor with low ESR
(ESR = 0.7Ω) and a 100nF, 33pF, 10pF filter capacitor (0603 package) in parallel with the VBAT input reference circuit.
And recommend that VBAT PCB traces as short and wide enough, the equivalent impedance decreases VBAT line,
ensuring the maximum transmit power at high current will not produce too big voltage drop, voltage drop generally
controlled within 400mV. Recommended VBAT alignment width of not less than 2mm, and the longer the alignment,
the wider the line width.
Note: The module's hardware shutdown voltage is 3.0V.
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Air208 Hardware Design Manual
Chart 4:VBAT INPUT REFERENCE CIRCUIT
4.3.3.
Power supply reference circuit
The power supply design is crucial to the power supply to the module and must be selected with Power Supply
capable of delivering at least 2A current capability. If the input voltage and the voltage difference between the supply
voltage of the module is not very large, it is recommended to select the LDO as the Power Supply Supply. If there is a
large pressure difference between the input and output, then use the switch Power Supply converter.
LDO power supply:
The following figure is +5V Reference design powered by Micrel's LDO, model MIC29302WU. Its output voltage is
4.16V, and the peak load current is 3A. In order to ensure the stability of the output Power Supply, it is recommended
to reserve a voltage regulator at the output terminal, and close to the module VBAT pin. It is suggested that the
voltage regulator with reverse breakdown voltage of 5.1V and dissipation power of more than 1W is selected.
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Air208 Hardware Design Manual
Chart 5:Power Input Reference Design
DC-DC power supply:
Below is the DCDC Power Supply Reference design switch, the JW5033H switch is Power Supply chip Jiehuate
company, its maximum output current at 2A, while the input voltage range. Note that the selection of C25
depends on the input voltage to select the withstand voltage.
Chart 6:DCDCPower Input Reference Design
4.4. Boot and shutdown
4.4.1.
Boot
Air208 module can be powered on via the PWRKEY pin. The off state long press the power button above 2S
module will enter the boot process, the software will detect the VBAT pin voltage if VBAT pin voltage is greater than
the software set the boot voltage (default 3.55V), will continue to boot up until the system boot is complete;
otherwise, will stop the execution of the boot operation, the system will shut down.
By default, the AT command version is adaptive baud rate (AT + IPR = 0). In adaptive baud rate mode,
the boot initialization message "RDY" will not be sent back to the master. After the module is powered on, you
can send an AT command to the module to train the baud rate to be the same as the master. The master
needs to send the "at" character to the module to train it (be careful to lower the "at"). Generally send a at the
baud rate can be trained over, the module will be reported initialization information. Since then you can use
the normal AT command, uppercase and lowercase can be.
4.4.1.1 PWRKEY Pin boot
After VBAT is powered on, the PWRKEY pin can start the module. After PWRKEY pin is pulled low for 2s, the
PWRKEY pin can be released. You can determine whether the module is powered on by detecting the level of the
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Air208 Hardware Design Manual
VDDIO pin. It is recommended to use an open collector driver to control the PWRKEY pin. The picture below is
Reference circuit:
Chart 6:Open set driver reference boot circuit
Another way to control the PWRKEY pin is to use a button switch directly. A TVS should be placed near the
button to protect the ESD.The picture below is Reference circuit:
Chart 7:Button bootReference circuit
4.4.2.
Shutdown
The following ways can shut down the module:
♦ Normal shutdown: Use the PWRKEY pin to shut down.
♦ Low‐voltage automatic shutdown: shutdown when the module detects low voltage.
♦ Emergency shutdown: shut down by RESET pin.
♦ AT command shutdown.
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Air208 Hardware Design Manual
4.4.2.1 PWRKEY Pin shutdown
When the PWRKEY pin is pulled down for more than 2S, the module will perform shutdown operation.
During the shutdown process, the module needs to log off the GSM network. The logout time is related to the
current network status. The measured time is about 2s ~ 12s. Therefore, it is recommended to extend the system by
12s before powering off or restarting, so as to ensure that the software to save important data before complete
power‐off.
4.4.2.2 Low voltage automatic shutdown
When the module is in running state When the VBAT pin voltage is lower than the software set shutdown
voltage (the default setting is 3.0V), the software will shut down the module to prevent various abnormal running
under the condition of low voltage.
4.4.2.3 AT command shutdown
The user can close the module with "AT + CPOWD = 1". After the module is shut down, the module
enters shutdown mode and no further AT commands can be executed. Power-down mode can be used to
indicate VDDIO pin, low indicates that the module has entered shutdown mode
4.4.2.4 RESET mergency shutdown
The thirty‐fourth pin of Air208 module is reset pin, and its function is hardware shutdown.
It can be shutdown by pulling down the RESET pin 200ms or so. The OC driver circuit is recommended to control
the RESET pin. The picture below is Reference circuit:
Chart 8:Open driver reference emergency shutdown circuit
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Air208 Hardware Design Manual
Another way to control the RESET pin for emergency shutdown is to use a pushbutton switch directly. Place a
TVS tube near the button for ESD protection. The picture below is Reference circuit:
Chart 9:Button emergency shutdownReference circuit
4.5. Power saving technology
According to the system requirements, there are two ways to make the module into a low power state. For the
AT version, the "AT+CFUN" command enables the module to enter the least functional state.
4.5.1.
Least functional mode
Minimal function mode can minimize the module function, this mode can be set by sending "AT + CFUN = "
command.  parameters can choose 0,1,4
♦ 0:Minimum function (turn off RF and SIM card);
♦ 1:Full function (default);
♦ 4:Turn off the RF sending and receiving functions;
If the module is set to the least functional mode with "AT + CFUN = 0", the functions of the radio section and the
SIM card section will be switched off. The serial port is still valid, but the RF part and the SIM card part related to the
AT command is not available.
If the module is set using "AT + CFUN = 4", the RF section will be turned off and the serial port will still be active.
All RF commands related to the RF section are not available.
After the module is set by "AT + CFUN = 0" or "AT + CFUN = 4", the module can be returned to the full function
by the "AT + CFUN = 1".
4.5.2.
Sleep Mode (Slow Clock Mode)
Air202 Supports sleep mode. For AT version, the sleep mode is controlled by the DTR pin. When DTR is high level,
the module is allowed to sleep. When DTR is high, the module enters sleep mode at about 30s when no action is
taken. DTR is high level When the module goes low, the module wakes up. At the same time, the AT command can be
woken up continuously by the main serial port, but some AT commands will be lost.
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Air208 Hardware Design Manual
4.5.3.
♦
♦
♦
Sleep wake
When the module is in sleep mode, the following method can wake up the module.
The AT version pulls the DTR pin down and wakes the module. The 20ms port is activated after the DTR pin is
pulled down
Receive calls or GPRS data to wake up the module.
Receive SMS to wake up module.
4.6. Mode switching summary
Table 7:Mode switching summary
Current mode
Next mode
Shutdown
Shutdown
Normal mode
Sleep mode
Normal mode
Sleep mode
Use PWRKEY boot
Use the PWRKEY pin, or use the
Software call sleep interface, AT
RESET pin, or the VBAT voltage is
version does not do action for
lower than the shutdown voltage
30s it will sleep automatically
Use PWRKEY or RESET pin or VBAT
GPIO pin interrupt, timer, receive
voltage is lower than shutdown
SMS or GPRS data
voltage
4.7. Serial port
The module provides two general asynchronous transceivers: the main serial port UART1 and the auxiliary serial
port UART2. Module Supports fixed baud rate and adaptive baud rate. Adaptive baud rate Supports range 4800bps to
115200bps.
Main serial port
♦ UART1_TXD:Send data to the RXD end of the DTE device
♦ UART1_RXD:Receive data from the TXD end of the DTE device
♦ UART1_RTS:The DTE requests to send data to DCE
♦ UART1_CTS:Clear send
♦ UART1_DTR:DTE is ready and notify DCE (this pin can be used to wake up the module)
♦ UART1_RI:Ringing (DCE has incoming call or URC or short message will send signal to notify DTE)
♦ UART1_DCD:Carrier detection (when the communication link between DCE and DTE is established)
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Air208 Hardware Design Manual
♦
By default, the hardware flow control of the module is closed. When the client needs hardware flow control, pins
RTS, CTS must be connected to the client, and the AT command "AT+IFC=2,2" can be used to open the hardware
flow control. The AT command "AT+IFC=0,0" can be used to shut down the flow control. Please refer to
document [AT])
Auxiliary serial port UART2
♦
♦
♦
UART2_TXD:Send data to the serial port of DTE
UART2_RXD:Receive data from serial port of DTE
Serial logic level is shown as the following table:
Table8:Serial logic level
Parameter
Minimum value
Maximum value
Unit
VIL
0.25×VDDIO
VIH
0.75×VDDIO
VDDIO +0.3
VOL
0.15×VDDIO
VOH
0.85×VDDIO
VDDIO
Table 9:Definition of serial port pins
Interface
Name
pin
Function
UART1_DTR
12
DTE is ready
UART1_TXD
Send data by serial port
UART1_RXD
Serial port receives data
UART1_CTS
Clear send
UART1_RTS
DTE requests to send data
UART1_DCD
10
Carrier detection
UART1_RI
11
Ringing indication
Auxiliary
serial port
UART2_RXD
27
Serial port receives data
UART2
UART2_TXD
28
Serial port sends data
Main serial port
UART1
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Air208 Hardware Design Manual
4.7.1.
Main serial port
4.7.1.1 Main serial port features
♦
♦
♦
♦
♦
♦
It includes data line TXD and RXD, hardware flow control line RTS and CTS, other control lines DTR, DCD and RI.
8 data bits, no parity, a stop bit.
Hardware flow control is turned off by default。
To send AT commands, GPRS data transmission, CSD fax and so on.
Supports baud rate as follows:
1200,2400,4800,9600,14400,19200,28800,38400,57600,115200,230400,460800,921600
AT command version By default, the module is adaptive baud rate (AT + IPR = 0). In adaptive baud rate mode,
initialization information (beginning with "RDY") will not be sent back to the master after booting. 2‐3 seconds
after the module is powered on, AT commands can be sent to the module. The host computer needs to send the
"AT" character to the module to train the baud rate of the host computer first. At this moment, the module will
report the initialization information indicating that the training is successful. The user can send an "AT + IPR = x:
& W" command to the module (x is the baud rate, such as 9600). The function of this command is to set a fixed
baud rate and save it. After completing these configurations, Module boot, the serial port will automatically
return URC initialization information (beginning with "RDY")。
Synchronization between the module and the host computer: :
When the module is powered on with adaptive baud rate turned on, it is best to wait 2 ~ 3 seconds before sending
"AT" character. When the module reports the initialization information, it indicates that the training of baud rate is
successful and the synchronization is completed with the host computer.
In adaptive baud rate mode, the master must first synchronize if it needs a power‐on message. Otherwise, the
initialization information will be omitted:
♦
♦
♦
♦
♦
♦
Serial port configuration is 8 data bits, no parity, 1 stop bit (factory configuration)
Only the string "AT" when the module is switched on can train the baud rate. ("At", "At" or "aT" can not be
recognized).
Baud rate training is successful, you can identify the uppercase, lowercase or uppercase and lowercase AT
command combination.
In adaptive baud rate mode, URC information such as "RDY", "+ CFUN: 1" and "+ CPIN: READY" will not be
reported if the module is powered on without synchronization.
It is not recommended to switch to adaptive baud rate mode when fixed baud rate mode.
In adaptive baud rate mode, it is not recommended to switch to software multiplex mode
4.7.1.2 Main serial port connection mode
Main serial portThe main serial port connection mode is more flexible, as follows are three commonly used
connection mode.
Full‐featured serial port in accordance with the following connection, this mode is mainly used in modem mode
(PPP dial‐up).
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Air208 Hardware Design Manual
Chart 10:Full‐featured serial port connection diagram
Please refer to the following connection mode for three wire serial port:
Chart 11:Serial three‐wire connection diagram
Please refer to the following circuit connection with flow control serial port connection, this connection can
increase the reliability of large amounts of data transmission, to prevent data loss.
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Chart 12:Schematic diagram of serial connection mode with flow control
4.7.2.
♦
♦
♦
Debug serial port
Data cable:HOST_TXD and HOST_RXD
Debug port is for software debugging only, baud rate is configured to 921600bps
The serial port will automatically output log information to the outside
Please refer to following ways to debug serial port connection:
Chart 13:Software debugging connection diagram
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4.7.3.
Serial port application
For the 3.3V voltage system in the case of the serial port level matching circuit reference is as follows, it is
strongly recommended to use RXD modules such as the input port on the resistor divider, the voltage is divided to
2.8V.
If it is 3V system, according to the principle of partial pressure, it is recommended to change the 5.6K resistance
to the 10K resistor. It is also suggested that 1K resistors must be connected in series when customers don't allow
partial pressure.
Chart 14:3.3V Level conversion circuit
5V system level matching, level matching between the module and peripherals can refer to the following
connections, the dotted line below can refer to the above solid line circuit (the dotted line module to send the
reference module TXD circuit design, the dotted line module Receive reference module RXD circuit design).
VCC_MCU is the client's I / O voltage level. VDDIO is the module output I / O voltage level.
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Chart 15:5VLevel conversion circuit
When the module communicates with the PC, you need to add an RS232Level conversion circuit between them.
Because the module's serial port configuration is not RS232 level, only SupportsCMOS level. The following figure
shows the module with PC communication, serial port level conversion circuit.
Chart 16:RS232 Level conversion circuit
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4.8. Audio interface
The module provides an analog audio input channel and a channel analog output channel, Supports call,
recording and playback functions。
Table10:Audio interfacePin definition
Interface
Interface name
Interface no.
Function
MICP
Audio input positive end
MICN
10
Audio input negative end
SPKP
11
Audio output positive end
SPKN
12
Audio output negative end
AIN
AOUT
AIN can be used as a microphone input or an analog audio signal input. Microphones usually use electret
microphones. AIN1 is a differential input.
AOUT channels can directly drive 8 ohm speakers. The AOUT channel is differential output.
4.8.1.
Preventing TDD noise and other noises
As for handheld speakerphone and handsfree microphones It is recommended to use a built‐in RF filter dual
capacitor (such as 10pF and 33pF) electret microphone to filter out radio frequency interference from the
interference source will greatly improve the coupling TDD noise. The 33pF capacitor is used to filter out
high‐frequency interference when the module is operating at 900MHz. If you do not add this capacitor, you may hear
TDD noise during the call. At the same time 10pF capacitor is used to filter out the work in the 1800MHz frequency
high frequency interference. It should be noted that, because the capacitance of the resonance point depends largely
on the material of the capacitor and the manufacturing process, so the choice of capacitor, you need to consult the
capacitor suppliers, select the most suitable value to filter out work in GSM900MHz, High frequency
noise at DCS1800MHz.
The severity of high frequency interference at GSM transmission usually depends mainly on the customer
application design. In some cases, GSM900 TDD noise is more serious, and in some cases, DCS1800 TDD noise is more
serious. Therefore, customers can filter the results of the election according to the needs of the filter capacitor, and
sometimes do not need to paste this type of filter capacitor.
PCB RF filter capacitor placed on the position as close as possible to Audio devices or Audio interface, alignment
as short as possible, to go through the filter capacitor and then to other points.
Position the antenna away from the Audio component and the Audio traces as far as possible to reduce radiated
interference. The Power Supply traces should not be parallel to the Audio traces. The Power Supply traces should be
as far away as possible from the Audio lines.
Differential Audio traces must follow the Layout rules for differential signals.
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4.8.2.
Microphone interface reference circuit
AIN channel built‐in electret microphone bias voltage. Microphone channel reference circuit shown below:
Chart 17:AIN MICROPHONE CHANNEL INTERFACE CIRCUIT
4.8.3.
Audio output interface reference circuit
SPKAudio Output Interface can be directly driven with 8 ohm speaker.
Chart 18:Reference line
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4.8.4.
Audio Electrical characteristics
Table 11:Typical characteristics of electret microphones
Parameter
Minimum
Typical
Maximum
Unit
Working voltage
1.0
1.25
2.0
500
Ma
Working current
Impedance
2.2
KΩ
Table 12:Audio interfaceTypical characteristic parameters
Parameter
Minimum
Single‐ended
output
Load
Differential
output
Load
AOUT
Reference level
Reference level
Typical
Maximum
Ω
2.4
Unit
Vpp
Ω
4.8
Vpp
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4.9. SIM CARD INTERFACE
The SIM card interface supports the functions of the GSM Phase1 specification, as well as the functions of the
GSM Phase 2+ specification and the FAST64 kbps SIM card (used in the SIM application toolkit).
The SIM card is powered by the internal power supply of the module to support 1.8V and 3.0V power supply.
4.9.1.
SIM INTERFACE
The following table describes the SIM interface pin definitions.
Table13:SIM CARD INTERFACEPin definition
Pin name
Pin no.
Function
SIM_VDD
18
SIM card power supply automatic detects SIM card operating voltage. The
accuracy is 3.0V ± 10% and 1.8V ± 10%. The maximum supply current is
10mA.
SIM_RST
17
SIM card Reset pin
SIM_DATA
15
SIM card data cable
SIM_CLK
16
SIM card clock line
SIM_DET
14
SIM card in position detection
The figure below is the reference circuit SIM interface, using of 6pin SIM card connector.
Chart 19:Using a 6pin SIM Card Reference Schematic (SIM)
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If you need to use sim card in place detection, the recommended circuit is as follows.
Chart 20:With the detection of PIN SIM card reference circuit diagram
In SIM CARD INTERFACE circuit design, in order to ensure the SIM card's good functional performance and is not
damaged, the circuit design is recommended to follow the following design principles:
♦ SIM card holder and the module can not be too far away from the ornaments, the closer the better, try to ensure
that SIM card signal cable is not exceed 20cm.
♦ The SIM card signal cable is routed away from the RF cable and the VBAT power cable.
♦ The wiring width of SIM_VDD is not less than 0.3mm and the bypass circuit between SIM_VDD and SIM_GND
should not exceed 1uF and be placed close to the SIM card holder.
♦ In order to prevent possible SIM_CLK signal crosstalk on the SIM_DATA signal, the two wiring should not be too
close, increase the shielding between the two traces. And SIM_RST signal also needs protection.
♦ In order to ensure good ESD protection, it is recommended to add TVS tube, and placed near SIMcassette. The
selected ESD device has a parasitic capacitance of no more than 50pF, such as WILL (http://www.willsemi.com)
ESDA6V8AV6. A 22 ohm resistor can be connected in series between the module and the SIM card to suppress
stray EMI and enhance ESD protection. The SIM card's peripheral circuitry must be as close as possible to
SIMcassette.
4.9.2.
6-pin SIM card holder
Using a 6‐pin SIM card holder, Amphenol's C70710M0065122 is recommended. Visit http://www.amphenol.com
for more information.
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Chart 21:Amphenol C707 10M006 512 2 SIM cassette
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4.10. RI SIGNAL ACTION
Table 14:RI SIGNAL ACTION
Status
RI response
Standby
High level
Voice call
Data
transmission
After switching to low level:
(1) When the call is switched on to a high level
(2) Use the AT command ATH hang up the voice, RI goes high
(3) The caller hangs up, RI first goes high, then pulls low for 120ms, receives an auto‐reply URC message
"NO CARRIER" and then goes high
(4) When SMS is received, it becomes high level
After switching to low level:
(1) It changes to high level when data connection is set up.
(2) Use the AT command ATH to suspend data connections, and RI to a high level
(3) The caller hangs up, RI first into high level, then pull to a low level for 120ms, received automatic
reply message "NO URC CARRIER", and then into high level
(4) When SMS is received, it becomes high level
SMS
When a new message is received, RI goes low for 120ms and then goes high.
URC
Some URC information can trigger RI to pull low 120ms
If the module is used as a calling party, the RI remains high except when receiving URC messages or text
messages. When the module is used as the called party, the timing of RI is as follows:
Chart 22:The module is used as called party RI timing for voice call
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Chart 23:The module is used as called party RI timing for data call
Chart 24:RI timing of module calling
Chart 25:RI timing when receiving URC message or SMS
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4.11. Network status indication
NET_LEDpin signal can be used to indicate the status of the network lights. The working status of this pin is shown in
the following table:
Table 15:NET_LED working status
Status
Module function
Shutdown
The module is not running
Bright 64ms,off 800ms
Can not find the network
Bright 64ms,off 3000ms
Registered on network
Bright 64ms,off 300ms
GPRS cimmunication
not registered on the GSM network:
Chart 26:NETLIGHTReference circuit
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4.12. PWM
Air208supports 2 PWM outputs: PWM, LPG, multiplexed by UART2_RX and UART2_TXD respectivel.
UART2
Pin name
Pin no.
I/O
UART2_RXD
(LPG)
23
UART2_TXD
(PWM)
22
Pin description
Electrical characteristics
Remark
Hardware UART2
VILmin=-0.3V
VILmax=0.25×VDDIO
VIHmin=0.75×VDDIO
VIHmax=VDDIO+0.3
VOHmin=0.85×VDDIO
VOLmax=0.15×VDDIO
Hang when not in
usage
LPG (Light Pulse Generation) For low frequency applications such as driving LED flashes, only a fixed seven
kinds of cycle (Unitms) can be set: 125,250,500,1000,1500,2000,2500,3000. And 15 kinds of high time.
PWM, frequency range (80‐65535HZ), and various duty cycles can be set.
Please refer to the corresponding AT command document.
5. Radio interface
pin 32 is the RF antenna input. RFInterface50 ohm impedance matching.
Table 16:RF_ANTPin definition
Pin name
Pin no.
Function
RF_ANT
32
RF pad
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Air208 Hardware Design Manual
5.1. RF reference circuit
Chart 27:RF reference circuit
Air208 pads must be microstrip or other types of RF traces and the impedance must be controlled to about 50
ohms. For better RF performance, ground pads are on each side of the RF input port.
Care must be taken to minimize the losses on the RF traces or RF cables. The recommended insertion loss must
meet the following conditions:
♦ EGSM850<1dB
♦ DCS1900<1.5dB
Air208 also built an RF connector to facilitate users to directly connect the module RF coaxial antenna, and save
the board on the RF routing:
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Corresponding coaxial connector as shown below:
5.2. RF CONDUCTION SENSITIVITY
Table 18:RF CONDUCTION SENSITIVITY
Band
Receiving sensitivity
EGSM850
< -108.5dBm
DCS1900
< -108.5dBm
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5.3. Recommended RF welding method
If the RF connector for connecting the external antenna is connected to the module by soldering, be sure to
pay attention to the stripping method and soldering method of the connecting wire. In particular, if the soldering is
sufficient, follow the correct soldering method shown in the figure below, In order to avoid due to poor welding
caused by line loss increases.
Chart 28:Suggestion on RF welding method
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6. Electrical characteristics, reliability, RF characteristics
6.1. Absolute Maximum
The following table shows the module digital, analog pin Power Supply supply voltage and current Maximum
tolerance value.
Table20:Absolute Maximum
Parameter
Minimum
Maximum
Unit
VBAT
‐0.3
4.2
Power supply peak current
Power supply average current (TDMA one
0.7
Digital pin voltage
‐0.3
3.3
Analog pin voltage
‐0.3
3.0
Off / Off mode digital / analog pin voltage
‐0.25
0.25
frame time)
6.2. working temperature
Table 21:working temperature
Temperature
Minimum
Typical
Maximum
Unit
Nornal working
temperature
‐40
25
85
℃
storagetemperature
‐45
90
℃
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6.3. Voltage limit value
Table 22:Module power limit value
Paramet
Description
Condition
Minimum
Typical
Maximum
Unit
Supply voltage
The voltage must be within this range,
including voltage drops, ripple, and
spikes
3.4
3.8
4.2
Burst voltage
GSM900 MaximumTransmit
400
mV
drop at launch
power level
VBAT
Shutdown
mode
Power on for the
first time
34
Shutdown after
boot(RTC works
normally)
101
Flight Mode
IVBAT
Average
supply
current
mA
DRX=2
1.4
mA
DRX=5
1.14
mA
DRX=9
1.03
mA
0.896
mA
AT+CFUN=0
(2 send,2
receive)
GPRS mose
(4 receive,1
send)
Peak current
/ GSM900 transmit
AT+CFUN=4
Minimum function mode
GPRS mode
mA
0.763
EGSM 900 1)
315.9
mA
DCS1800 2)
208.7
mA
EGSM 900 1)
203.5
mA
DCS1800 2)
150.1
mA
GSM900 MaximumTransmit
power level
uA
0.8
Bottom current
Standby current
uA
1.8
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time slot)
1)
1)
power level 5
2) power level 0
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6.4. Current consumption
Table 23:Module's current consumption
Condition
Current consumption
GPRS data transmission
Data transmission mode, GPRS ( 2 receive, 2 send) CLASS8 & CLASS 12
EGSM850
@Power level5,<550mA,Typicalvalue 315.9mA
@Power level10,Typicalvalue 158.2mA
@Power level19,Typicalvalue 83.5mA
DCS1900
@Power level0,<450mA,Typicalvalue208.7mA
@Power level5,Typicalvalue125mA
@Power level15,Typicalvalue78.4mA
Data transfer mode, GPRS ( 4 receive, 1send) CLASS8 & CLASS 12
EGSM850
DCS1900
@Power level5,<350mA,Typicalvalue203.5mA
@Power level10,Typicalvalue101.3mA
@Power level19,Typicalvalue62.4mA
@Power level0,<300mA,Typicalvalue150.1mA
@Power level5,Typicalvalue79.4mA
@Power level15,Typicalvalue55.8mA
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6.5. Static Protection
In the module application, due to the human body static electricity, static electricity generated between the
microelectronic electrostatic friction, through various means of discharge to the module, may cause some damage to
the module, so ESD protection must pay attention to, whether in the production assembly, testing , R & D process,
especially in product design, should take ESD protection measures. For example ESD protection should be added in
circuit design at the Interface or vulnerable to ESD point. To wear anti‐ESD gloves in production and so on.
The following table shows the ESD withstand voltage of the module PIN pin.
Table 24:ESDP erformance parameters (temperature: 25 C, humidity: 45%))
Pin name
Contact discharge
Air discharge
VBAT,GND
±5KV
±10KV
RF_ANT
±5KV
±10KV
TXD, RXD
±2KV
±4KV
Others
±0.5KV
±1KV
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7. phycial dimension
This section describes the module's phycial dimension and the recommended package dimensions for the
customer's design using the module.
Page51 Totally 57 pages
Air208 Hardware Design Manual
7.1. Module phycial dimension
Chart 29:Air208 Front view (unit: mm)
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Air208 Hardware Design Manual
7.2. Recommended PCB encapsulation
Chart 30:Recommended encapsulation (Unit: mm)
Note: make sure the spacing between module on the PCB and other components is 3mm at least.
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Air208 Hardware Design Manual
7.3. Module front view
Chart 31:Module front view
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Air208 Hardware Design Manual
7.4. Module bottom view
Chart 32:Module bottom view
8. Storage and production
8.1. Storage
Air208 shipped in vacuum sealed bags. The storage of the module needs to follow the following conditions:
The module can be stored in a vacuum‐sealed bag for 12 months at ambient temperatures below 40 ° C and air
humidity less than 90%.
When the vacuum sealed bags open, if the following conditions are met, the module can be directly reflow or other
high‐temperature processes:
♦ Module ambient temperature below 30 degrees Celsius, air humidity less than 60%, the factory completed patch
within 72 hours.
Air humidity is less than 10%.
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♦
♦
If the module is in the following conditions, it is necessary to bake before the patch:
When the ambient temperature is 23 degrees Celsius (5 degrees Celsius allowed fluctuations), the humidity
indicator shows humidity greater than 10%
When the vacuum sealed bag is opened, the module ambient temperature is below 30 degrees Celsius and the
air humidity is less than 60%, but the factory failed to complete the patch within 72 hours
When the vacuum sealed bag is opened, the module storage air humidity is greater than 10%.
If the module needs to be baked, please bake for 48 hours at 125 degrees Celsius (allowing 5 degrees Celsius
fluctuation).
Note: The module packaging can not withstand such a high temperature, remove the module package before the
module is baked. If you only need a short baking time, please refer to the IPC / JEDECJ‐STD‐033 specification.
8.2. Production welding
Printed scraper on the screen printing solder paste, solder paste through the screen openings to the PCB on the
leakage, printing scraper strength needs to be adjusted properly, in order to ensure the quality of module paste,
Air202 module pad part of the corresponding stencil thickness should be 0.2mm.
Chart 33:Paste map
To avoid repeated heating damage to the module, it is recommended that the customer PCB board be reflowed
after the first side of the module. The recommended Furnace temperature curve is shown below:
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Chart 34:Furnace temperature curve
FCC Statement
Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may
cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment .This equipment should be installed and operated with
minimum distance 20cm between the radiator& your body.
FCC Label Instructions
The outside of final products that contains this module device must display a label referring to the
enclosed module. This exterior label can use wording such as: "Contains Transmitter Module FCC
ID: 2AEGG-AIR208 or “Contains FCC ID:2AEGG-AIR208 , Any similar wording that expresses
the same meaning may be used.
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