Barrot Technology IVTI410E Bluetooth module 4.0 LE User Manual
IVT Corporation Bluetooth module 4.0 LE
User Manual
oSy lei Blu Blu oSy lei i410e Datasheet April 12, 2013 Blu Version 1.7 oSy lei lu oSy i410e Datasheet VERSION HISTORY REVISION AMENDMENT 1.0 Initial version 1.1 1.2 oSy lei Blu Modify 3, 8, 10 section 1. Update power consumption; DATE AUTHOR 2012-10-7 Zhu Yong 2012-10-9 Wan Zhifu Huang Ruixue 2012-10-29 Li Li 2012-11-29 Li Li 2012-12-12 Li Li 2012-12-22 Li Li 2013-4-3 Li Li 2013-4-12 Wan zhifu 2. Change PIO4 to GND. 1.3 1. Update power consumption; Sy 2. Update format. 1.4 Update package information. Refer eil to the chapter 10. 1.5 Update Figure 1 BlueSoleil i410e lue and Figure 8 i410e Footprint. 1.6 Add FCC, IC, CE certificate 1.7 Add external antenna interface. Blu Li Li oSy lei lu oSy 2 / 28 i410e Datasheet Contents oSy Block Diagram ........................................................................................................................... 6 Electrical Characteristics ........................................................................................................... 7 lei 2.1 Absolute Maximum Ratings .......................................................................................... 7 2.2 Recommended Operating Conditions ........................................................................... 8 2.3 Input/output Terminal Characteristics.......................................................................... 8 Blu 2.3.1 Switch-mode Regulator ..................................................................................... 8 2.3.2 Low-voltage Linear Regulator ............................................................................ 9 2.3.3 Digital Terminals ................................................................................................ 9 2.3.4 AIO..................................................................................................................... 9 2.3.5 ESD Protection ................................................................................................. 10 oSy 2.4 Current Consumption.................................................................................................. 10 2.5 Radio Characteristics ................................................................................................... 10 lei 2.5.1 RF Ports ........................................................................................................... 10 2.5.2 RF Receiver ...................................................................................................... 11 2.5.3 RF Transmitter ................................................................................................. 11 2.5.4 Bluetooth Radio Synthesizer ............................................................................ 11 2.5.5 Baseband ......................................................................................................... 11 Blu Pin Description ........................................................................................................................ 12 Physical Interfaces ................................................................................................................... 15 oSy 4.1 UART Interface ............................................................................................................ 15 4.2 SPI Interface ................................................................................................................ 15 lei Software Stacks ....................................................................................................................... 16 Blu 5.1 BlueSoleil Stack ........................................................................................................... 17 Re-flow Temperature-time Profile........................................................................................... 17 Reliability and Environmental Specification ............................................................................ 19 7.1 Temperature test ........................................................................................................ 19 7.2 Vibration Test .............................................................................................................. 19 7.3 Desquamation Test ..................................................................................................... 19 7.4 Drop Test ..................................................................................................................... 19 7.5 Packaging Information ................................................................................................ 19 lu oSy Layout and Soldering Considerations ...................................................................................... 20 8.1 Soldering Recommendations ...................................................................................... 20 8.2 Layout Guidelines ........................................................................................................ 20 Physical Dimensions ................................................................................................................ 21 10 Package............................................................................................................................ 23 11 Certification ..................................................................................................................... 25 11.1 Bluetooth ................................................................................................................ 25 11.2 CE 0700.................................................................................................................... 25 3 / 28 i410e Datasheet 11.3 FCC .......................................................................................................................... 25 11.4 IC ............................................................................................................................. 25 12 Bluetooth Technology Best Developed Corporation ....................................................... 27 13 Contact Information ........................................................................................................ 27 14 Copyright ......................................................................................................................... 28 oSy lei Blu Blu oSy lei Blu oSy lei lu oSy 4 / 28 i410e Datasheet FEATURES i410e Fully Qualified Bluetooth system v4.0 oSy DESCRIPTION BlueSoleil i410e is a Bluetooth 4.0 single-mode module. It provides a Bluetooth Low Energy fully compliant system for data communication with IVT BlueSoleil stack. It Low energy Support Master or Slave roles Integrated layout antenna Industrial temperature range from -400C to +850C RoHS Compliant allows your target devices to send and receive data via Bluetooth 4.0 without connecting a APPLICATIONS serial cable to your computer. Cable replacement Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices By default, i410e module is equipped with powerful and easy-to-use BlueSoleil firmware. BlueSoleil enables users to access Bluetooth Blu functionality with simple ASCII commands delivered to the module over serial interface it's just like a Bluetooth modem. oSy lei It’s easy-to-use and completely encapsulated. Therefore, BlueSoleil i410e provides an ideal solution for developers who want to integrate oSy Bluetooth wireless technology into their design. Blu lei Figure 1 BlueSoleil i410e lu oSy 5 / 28 i410e Datasheet 1 Block Diagram oSy BlueSoleil i410e’s block diagram is illustrated in Figure 2 below. lei CSR1000 Blu Low Pass Filter Bluetooth LE Radio and Modem WAKE UART UART LED PWM PWM MCU PIO Sy ROM RAM Blu AIO Eco Clock Generation 32.768K Crystal 16M Crystal PIO AIO Debug I2C EEPROM/ Flash SPI SPI i8002 oSy Figure 2 i410e Block Diagram CSR1000 Blu lei CSR1000 is a single chip Bluetooth 4.0 solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. CSR1000 implements Bluetooth 4.0 and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on CSR1000 acts as interrupt controller and event timer run the BlueSoleil stack and control the radio and host interfaces. A 16-bit RISC microcontroller is used for low power consumption and efficient use of memory. oSy CSR1000 has 64Kbytes of on-chip RAM. it supports the RISC MCU and is shared between the lu ring buffers used to hold data for each active connection and the general-purpose memory required by the BlueSoleil stack. Crystal The crystal oscillates include 16MHz and 32.768 KHz. 16MHz is external reference clock source. 32.768 KHz is used during deep sleep and in other low-power modes. EEPROM/Flash/i8002 6 / 28 i410e Datasheet Flash /EEPROM is used for storing the Bluetooth protocol stack, profile and applications. Low Pass Filter oSy The filter is a band pass filter (ISM band). Antenna lei The antenna is meander PCB antenna. Blu Synchronous Serial Interface This is a synchronous serial port interface (SPI) for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory. oSy UART This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for lei communicating with other serial devices. Blu Programmable I/O I410e has one digital programmable I/O terminal. It is controlled by firmware running on the device. AIO oSy I410e has 3 general-purpose analogue interface pins, AIO[2:0]. PWM lei I410e contains a PWM module that works in sleep modes. WAKE Blu Wake up input. It wakes i410e from hibernate. 2 Electrical Characteristics lu 2.1 Absolute Maximum Ratings oSy The module should not continuously run under extreme conditions. The absolute maximum ratings are summarized in Table 1 below. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Table 1 Absolute Maximum Ratings Rating Min Max Unit 7 / 28 i410e Datasheet Storage temperature -40 85 ℃ Battery (VDD_BAT)operation 1.8 3.6 I/O supply voltage -0.4 3.6 VSS-0.4 VDD+0.4 oSy Other terminal voltages lei Blu 2.2 Recommended Operating Conditions Recommended operating conditions are summarized in Table 2 below. Table 2 Recommended Operating Conditions Min Typ Operating temperature -30 20 Battery(VDD_BAT) Operation 1.8 I/O supply 1.2 voltage(VDD_PADS) Max Unit 85 °C 3.6 3.6 stem 2.3 Input/output Terminal Characteristics oSy 2.3.1 Switch-mode Regulator Table 3 Switch-mode Regulator input voltage Output voltage Typ. Max Unit 1.8 3.6 0.65 1.35 1.35 -200 200 ppm/0C Blu Switch-mode Regulator Temperature coefficient lei Min Normal Operation Output noise, Frequency range 100Hz to 100KHz Setting time, setting to within eSo 10% of final value Output current(Imax) Blu Quiescent current(excluding load, Iload<1mA) Ec 0.4 mV rms 30 µs 50 mA 20 µA Ultra Low-power Mode Output current(Imax) 100 µA 8 / 28 i410e Datasheet Quiescend current 2.3.2 Low-voltage Linear Regulator Table 4 Switch-mode Regulator Normal Operation oSy Min µA Typ. Max Unit 1.35 1.20 Input voltage 0.65 Output voltage 0.65 Min Typ. Max Unit VIL input Logic level low -0.4 0.4 VIH input logic level high 0.7*VDD VDD+0.4 25 ns 0.4 0.75*VDD 2.3.3 Digital Terminals oSy Table 5 Digital Terminals Input Voltage Levels Blu Tr/Tf lei Output Voltage Levels VOL output logic level low, IOL = 4.0mA VOH output logic level high, IOH=-4.0mA Tf/Tf eil Input and Tristate Currents With strong pull-up Sy ns -150 -40 -10 µA -250 µA 10 40 150 µA With weak pull-up -5.0 -1.0 -0.33 µA With weak pull-down 0.33 1.0 5.0 µA CI input capacitance 1.0 Blu I C with strong pull-up With strong pull-down lu 2.3.4 AIO Table 6 AIO Input Voltage Levels Input voltage oSy 5.0 pF Min Typ. Max Unit 1.3 9 / 28 i410e Datasheet 2.3.5 ESD Protection oSy Apply ESD static handling precautions during manufacturing. ESD handling maximum ratings are summarized in Table 7 below. lei Table 7 ESD Handling Maximum Ratings Condition Blu Max Unit 2000V(all pins) 200V 200V(all pings) III 500V(all pins) Human body model contact discharge per JEDEC EIA/JESD22-A114 Machine model contact Discharge per JEDEC EIA/JESD22-A115 Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 oSy lei 2.4 Current Consumption Blu Table 8 Current Consumption Operation Mode Dormant Description Average All functions are shutdown. To wake up toggle the wake pin. stem VDD_PADS=ON, REFCLK=OFF, SLEEPCLK+ON, Hibernate VDD_BAT=ON 5~6uA Ec 5~6µA VDD_PADS=ON, REFCLK=OFF, SLEEPCLK=ON, Deep Sleep eSo VDD_BAT=ON, RAM=ON, digital circuits=ON, 7~8µA SMPs=ON(low-power mode), 1ms wake-up time Blu Connected Standby RX/TX active 2.5 Radio Characteristics 2.5.1 RF Ports lu ~1.2mA ~ 4mA oSy BlueSoleil i410e contains an integrated balun which provides a single-ended RF TX / RX port pin. No matching components are needed as the receive mode impedance is 50Ω and the transmitter has been optimized to deliver power in to a 50Ω load. 10 / 28 i410e Datasheet 2.5.2 RF Receiver oSy The receiver features a near-zero IF architecture that allows the channel filters to be integrated onto the die. Sufficient out-of-band blocking specification at the LNA input allows the receiver to be used in close proximity to GSM and W‑CDMA cellular phone transmitters without lei being significantly desensitized. Blu An ADC digitizes the IF received signal. Low Noise Amplifier The LNA operates in differential mode and takes its input from the balanced port of the integrated balun. oSy RSSI Analogue to Digital Converter The ADC samples the RSSI voltage on a packet-by-packet basis and implements a fast AGC. lei The front-end LNA gain is changed according to the measured RSSI value, keeping the first mixer input signal within a limited range. This improves the dynamic range of the receiver, improving Blu performance in interference-limited environments. 2.5.3 RF Transmitter oSy IQ Modulator The transmitter features a direct IQ modulator to minimize frequency drift during a transmit lei packet, which results in a controlled modulation index. Digital baseband transmit circuitry provides the required spectral shaping. Blu Power Amplifier The internal PA has a maximum 7.5dBm output power without needing an external RF PA. 2.5.4 Bluetooth Radio Synthesizer oSy The Bluetooth radio synthesizer is fully integrated onto the die with no requirement for an lu external VCO screening, can varactor tuning diodes, LC resonators or loop filter. The synthesizer is guaranteed to lock in sufficient time across the guaranteed temperature range to meet Bluetooth v4.0 specification. 2.5.5 Baseband Physical Layer Hardware Engine 11 / 28 i410e Datasheet The hardware supports all optional and mandatory features of Bluetooth v4.0 specification. It performs the following features: Cyclic redundancy check oSy Encryption lei Data whitening Blu Access code correlation 3 Pin Description oSy BlueSoleil i410e’s PIN descriptions are summarized in Figure 3 and Table 9 below. Blu lei EXT_ANT Top View AIO2 GND AIO1 WAKE oSy AIO0 PIO8/SPI_MISO TX PIO7/SPI_MOSI ei Rx PIO6/SPI_CSB PIO3 GND Blu GND SPI_EN PIO5/SPI_CLK VDD_BAT Figure 3 i410e PIN diagram Table 9 PIN Description PIN NO. lu Name AIO[2] AIO[1] AIO[0] GND Type oSy Function Bidirectional Analogue programmable I/O line. analogue General-purpose analogue interface pins. Bidirectional Analogue programmable I/O line. analogue General-purpose analogue interface pins. Bidirectional Analogue programmable I/O line. analogue General-purpose analogue interface pins. 12 / 28 i410e Datasheet Tx CMOS Output TXD is used to implement UART data transfer from i410e to another device. Rx CMOS Input RXD is used to implement UART data oSy transfer from another device to i410e. PIO3 Bidirectional with Programmable I/O line lei programmable strength internal Blu pull-up/down GND Ground Ground SPI_EN Input with strong This pin foot pulls high to SPI mode, pulled internal pull-down low for programmable I/O port mode. GND GND Ground 10 VDD_BAT POWER +1.8V To +3.3V Supply 11 PIO5 / Bidirectional with Programmable I/O line or debug SPI CLK SPI_CLK programmable selected by SPI_EN#. oSy lei strength internal pull-up/down 12 PIO6 / SPI_CSB 13 lu Bidirectional with Programmable I/O line or debug SPI CSB programmable selected by SPI_EN#. strength internal pull-up/down PIO7 / Bidirectional with Programmable I/O line or debug SPI MOSI SPI_MOSI programmable selected by SPI_EN#. oSy strength internal ei pull-up/down 14 PIO8 / Bidirectional with Programmable I/O line or debug SPI MISO SPI_MISO programmable selected by SPI_EN#. Blu strength internal pull-up/down 15 WAKE WAKE External wake-up function. When WAKE Pin pulled low(To Ground), wake-up module! 16 GND GND Ground 17 GND GND Ground 18 EXT_ANT GND lu EXT_ANT oSy The external antenna interface Connect GND pins to the ground plane of PCB. VDD_BAT 13 / 28 i410e Datasheet 3.3 V supply voltage connection. Battery input and regulator enables (active high). PIO3 oSy Programmable digital I/O line. AIO0 – AIO2 lei Analog programmable I/O lines. Rx Blu CMOS input with weak internal pull-down. RXD is used to implement UART data transfer from another device to i410e. Tx oSy CMOS output with weak internal pull-up. TXD is used to implement UART data transfer from i410e to another device. PIO6 / SPI_CSB Blu lei Programmable digital I/O lines. / CMOS input with weak internal pull-up. Active low chip select for SPI (serial peripheral interface). PIO5 / SPI_CLK Programmable digital I/O lines. / CMOS input for the SPI clock signal with weak internal oSy pull-down. I410e is the slave and receives the clock signal from the device operating as a master. PIO8 / SPI_MISO lei Programmable digital I/O lines. / SPI data output with weak internal pull-down. Blu PIO7 / SPI_MOSI Programmable digital I/O lines. / SPI data input with weak internal pull-down. WAKE Inputs to wake i410e from hibernate. Input has no internal pull-up or pull-down, use external pull-down. EXT_ANT lu oSy If use the external antenna interface, the on-board antenna need to be removed. 14 / 28 i410e Datasheet 4 Physical Interfaces oSy 4.1 UART Interface lei BlueSoleil i410e Universal Asynchronous Receiver Transmitter (UART) interface provides a Blu simple mechanism for communicating with other serial devices using the RS232 standard. The UART interface of I410E uses voltage levels of 0 to VDD and thus external transceiver IC is required to meet the voltage level specifications of UART. In order to communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC. oSy Table 10 Possible UART Settings Parameters Baud rate Minimum Maximum Flow control Parity Possible Values 1200 baud (≤2%Error) 9600 baud (≤1%Error) 2Mbaud (≤1%Error) RTS/CTS, none None, Odd, Even Number of stop bits 1 or 2 Bits per channel oSy NOTE: The maximum baud rate is 9600bps during deep sleep. 4.2 SPI Interface Blu lei The synchronous serial port interface (SPI) is for interfacing with other digital devices. The SPI port can be used for system debugging. SPI interface is connected using the MOSI, MISO, CSB and CLK pins. It uses a 16-bit data and 16-bit address programming and debug interface. Transaction occurs when the internal processor is running or is stopped. oSy The module operates as a slave and receives commands on MOSI and outputs data on MISO. Table 11 shows the instruction cycle for a SPI transaction. lu Table 11 Instruction Cycle for a SPI Transaction Step Operation Description Reset the SPI interface Hold CSB high for 2 CLK cycles Write the command word Take CSB low and clock in the 8-bit command Write the address Clock in the 16-bit address word Write or read data words Clock in or out 16-bit data words Termination Take CSB high 15 / 28 i410e Datasheet With the exception of reset, CSB must be held low during the transaction. Data on MOSI is clocked on the rising edge of the clock line CLK. When reading, i410e replies to the master on MISO with the data changing on the falling edge of the CLK. The master provides the clock on CLK. oSy The transaction is terminated by taking CSB high. The auto increment operation on the i410e cuts down on the overhead of sending a lei command word and the address of a register for each read or write, especially when large amounts of data are to be transferred. The auto increment offers increased data transfer Blu efficiency on the i410e. To invoke auto increment, CSB is kept low, which auto increments the address, while providing an extra 16 clock cycles for each extra word written or read. oSy 5 Software Stacks lei BlueSoleil i410e is supplied with Bluetooth v4.0 compliant stack firmware, which runs on the Blu internal RISC microcontroller. The i410e software architecture allows Bluetooth processing and the application program to be shared in different ways between the internal RISC microcontroller and an external host processor (if any). Blu oSy lei lu oSy 16 / 28 i410e Datasheet 5.1 BlueSoleil Stack oSy HID/HOGP lei BLP/BLS CSCP/CSCS Blu Application AT CMD GPIO GLP/GLS RSCP/RSCS SMP BlueSoleil Firmware ATT/GATT L2CAP/eL2CAP Link Manager UART ARM/MCU/ Any CPU HRP/HRS oSy I/O Debug Bl Analogue RAM MCU Hardware Radio i410e Solution oSy Figure 4 BlueSoleil Stack As illustrated in Figure 4 above, no host processor is required to run the Bluetooth protocol lei stack. All BlueSoleil stack layers, including application software, run on the internal RISC processor. Blu The MCU interfaces to BlueSoleil i410e via one or more of the physical interfaces, which are also shown in the figure 4. The most common interfacing is done via UART interface using the ASCII commands supported by the BlueSoleil stack. With these ASCII commands the user can access Bluetooth functionality without paying any attention to the complexity, which lies in the Bluetooth protocol stack. oSy The user may write applications code to run on the MCU to control BlueSoleil stack with ASCII commands and to develop Bluetooth powered applications. Please refer to 6 Re-flow Temperature-time Profile Blu BlueSoleil_i410e_Programming_Manual.pdf. The re-flow profiles are illustrated in Figure 5 and Figure 6 below. 17 / 28 i410e Datasheet Temp.( C) 40+20/-15s oSy 2300C~2450C lei Blu 2170C 1500C~1900C 90+30/-30s Ec stem Time(S) Figure 5 Typical Lead-Free Re-flow Solder Profile Blu 2170C 2420C Blu oSy lei lu oSy Figure 6 Typical Lead-free Re-flow The soldering profile depends on various parameters according to the use of different solder and material. The data here is given only for guidance on solder re-flow. i410e will withstand up to two re-flows to a maximum temperature of 245°C. 18 / 28 i410e Datasheet 7 Reliability and Environmental Specification oSy lei 7.1 Temperature test Blu Put the module in demo board which uses exit power supply, power on the module and connect to mobile. Then put the demo in the ‐40℃ space for 1 hour and then move to +85℃ space within 1minute, after 1 hour move back to ‐40℃ space within1 minute. This is 1 cycle. The cycles are 32 times and the units have to pass the testing. 7.2 Vibration Test oSy lei The module is being tested without package. The displacement requests 1.5mm and sample Blu is vibrated in three directions(X,Y,Z).Vibration frequency set as 0.5G , a sweep rate of 0.1 octave/min from 5Hz to 100Hz last for 90 minutes each direction. Vibration frequency set as 1.5G, a sweep rate of 0.25 octave/min from 100Hz to 500Hz last for 20 minutes each direction. 7.3 Desquamation Test oSy Use clamp to fix the module, measure the pull of the component in the module, make sure the module`s soldering is good. Blu 7.4 Drop Test lei Free fall the module (condition built in a wrapper which can defend ESD) from 150cm height to cement ground, each side twice, total twelve times. The appearance will not be damaged and all functions OK. 7.5 Packaging Information lu oSy After unpacking, the module should be stored in environment as follows: Temperature: 25℃ ± 2℃ Humidity: <60% No acidity, sulfur or chlorine environment The module must be used in four days after unpacking. 19 / 28 i410e Datasheet 8 Layout and Soldering Considerations oSy lei 8.1 Soldering Recommendations Blu BlueSoleil i410e is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. oSy IVT Corporation will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process lei and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Blu 8.2 Layout Guidelines It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on oSy the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding via separated max 3 mm apart at lei the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND via all around the PCB edges. Blu The mother board should have no bare conductors or via in this restricted area, because it is not covered by stop mask print. Also no copper (planes, traces or via) are allowed in this area, because of mismatching the on-board antenna. lu oSy 20 / 28 i410e Datasheet oSy lei Blu Blu oSy lei Figure 7 i410e Restricted Area Following recommendations helps to avoid EMC problems arising in the design. Note that oSy each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC problems caused by lei RF part of the module. Use good consideration to avoid problems arising from digital signals in the design. Blu Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a via, always use ground via around it. Locate them tightly and symmetrically around the signal via. Routing of any sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next to the signal line). 9 Physical Dimensions Blu oSy BlueSoleil i410e’s dimension is 16.6mm (L) *13.8mm (W)* 2.5mm (H). 21 / 28 i410e Datasheet oSy lei Blu Blu oSy lei Blu oSy lei lu oSy Figure 8 i410e Footprint 22 / 28 i410e Datasheet 10 Package oSy lei Blu Blu oSy lei Blu oSy lei Figure 9 Reel Information lu oSy 23 / 28 i410e Datasheet oSy lei Blu Blu oSy lei Blu oSy lei lu oSy Figure 10 Tape Information 24 / 28 i410e Datasheet 11 Certification oSy 11.1 Bluetooth lei BlueSoleil i410e module is qualified as a Bluetooth controller subsystem and it fulfills all the Blu mandatory requirements of Bluetooth 4.0 core specification. If not modified in any way, it is a complete Bluetooth entity, containing software and hardware functionality as well as the whole RF-part including the antenna. This practically translates to that if the module is used without modification of any kind, it does not need any Bluetooth approval work for evaluation on what needs to be tested. oSy i410e Qualified Design ID (QDID): B020729 11.2 CE 0700 Blu lei Hereby, IVT Corporation declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. oSy 11.3 FCC lei Host manufacturer: IVT Corporation Blu Host Brand name: BlueSoleil Host model number: i410e FCC ID: S78-IVTI410E 11.4 IC lu Host manufacturer: IVT Corporation Host Brand name: BlueSoleil oSy Host model number: i410e IC: 11004A-IVTI410E The output power of this device is less than 20mW. The SAR test is not required. When using it, ensure that the antenna of the device is at least 20cm away from all persons. 25 / 28 i410e Datasheet This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation oSy of the device. This device complies with Part 15 of the FCC Rules and with RSS-210 of Industry Canada. lei Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference Blu that may cause undesired operation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire oSy de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. lei This Class B digital apparatus complies with Canadian ICES-003. Blu Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B oSy digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment lei generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Blu However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. oSy - Increase the separation between the equipment and receiver. lu -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. 26 / 28 i410e Datasheet 12 Bluetooth Technology Best Developed oSy Corporation lei IVT Corporation is one of Bluetooth technology BEST developed together which is authenticated by The Bluetooth SIG. See Figure 11 below. Blu Blu oSy lei Figure 11 IVT is one of Bluetooth technology BEST developed together oSy 13 Contact Information Contacts: Mr. Zhu Yong Blu Mobile: +86 18910255873 Tel: +86 10 82898219 lei Fax: +86 10 62963059 Email: embedded@ivtcorporation.com oSy Address: IVT Corporation 5/F, Fa Zhan Building No.12, Shang Di Xin Xi Road, Beijing, 100085 P.R. China lu Company Site: www.ivtcorporation.com Support: support@ivtcorporation.com 27 / 28 i410e Datasheet 14 Copyright oSy Copyright © 1999-2013 IVT Corporation All rights reserved. lei IVT Corporation assumes no responsibility for any errors which may appear in the specification. Furthermore, IVT Corporation reserves the right to alter the hardware, software, and/or Blu specification detailed here at any time without notice and does not make any commitment to update the information contained here. BlueSoleil is a registered trademark of IVT Corporation for Bluetooth production. The Bluetooth trademark is owned by The Bluetooth SIG Inc., USA and is licensed to IVT Corporation. oSy All other trademarks listed herein are owned by their respective owners. Blu lei Blu oSy lei lu oSy 28 / 28
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Encryption : Standard V2.3 (128-bit) User Access : Print, Extract, Print high-res Author : JZ Modify Date : 2013:07:04 10:43:58+08:00 Create Date : 2013:07:01 15:26:30+08:00 PXC Viewer Info : PDF-XChange Viewer;2.0.55.0;Sep 10 2010;20:15:17;D:20130704104358+08'00' Language : zh-CN Page Count : 28 Tagged PDF : Yes XMP Toolkit : XMP Core 4.1.1 Creator Tool : Microsoft® Word 2010 Metadata Date : 2013:07:01 15:27:58+08:00 Format : application/pdf Creator : JZ Producer : Microsoft® Word 2010 Document ID : uuid:d69c2ec8-bae7-4f9a-8fc3-4178b2920641 Instance ID : uuid:74ccf5af-63fc-463c-97c8-48b4dce10a0aEXIF Metadata provided by EXIF.tools