Bionime BM300 BLE module User Manual BT SPEC

Bionime Corporation BLE module BT SPEC

OEM Installation Manual

華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 1   OF    Effective Date:    Change    History CICN NO# Page Rev. Effective Date Reason For Release   0   First Released Copy to (all contents):    Copy to(cover sheet): Reviewed    By Dep. Manager  Executor  Dep. Manager  Executor Approved By  : □SL     □QA     □MK     □LM     □CT      ■PO     ■PD     □AU     Prepare By: □PM     □RO     ■PE       ■QC     □TW       □
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 2   OF    Effective Date:     NCC  警語  「減少電磁波影響,請妥善使用」。  依據低功率電波輻射性電機管理辦法   第十二條  經型式認證合格之低功率射頻電機,非經許可,公司、商號或使用者均  不得擅自變更頻率、加大功率或變更原設計之特性及功能。   第十四條  低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干  擾現象時,應立即停用,並改善至無干擾時方得繼續使用。   前項合法通信,指依電信法規定作業之無線電通信。  低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機  設備之干擾。」
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 3   OF    Effective Date:    FCC Statement:  This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:   (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance  with  the instructions,  may cause harmful  interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.   If  this  equipment  does  cause  harmful  interference  to  radio  or  television  reception,  which  can  be determined  by  turning  the  equipment  off  and  on,  the  user  is  encouraged  to  try  to  correct  the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect  the  equipment  into  an  outlet  on  a  circuit  different  from  that  to  which  the  receiver  is connected. —Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.   FCC Label Instructions: The  outside  of  final  products  that  contains  this  module  device  must  display  a  label  referring  to  the enclosed  module.  This  exterior  label  can  use  wording  such  as  the  following:  “Contains  Transmitter Module FCC ID: [put FCC ID here]” or “Contains FCC ID: [put FCC ID here].” Any similar wording that expresses the same meaning may be used.
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 4   OF    Effective Date:    Feature:  Item  Specification  Remark Chip    DA14580   Standard    Bluetooth V4.1   RF band  2402 ~ 2480MHz  ISM band Interface    UART     RF Output Power    -20dBm ~0 dBm   Sensitivity    >-93 dBm     Mechanical Specifications Item  Standard Value  Unit Outline Dimension  12.25 (W) * 15.26 (L) * 1.9 (H)  mm
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 5   OF    Effective Date:    Absolute Maximum Ratings Module Item  Symbol  Condition  Min.  Max.  Unit System Power Supply Voltage  VDD  -  -0.1  +3.6  V Operating Temperature  TOP  -  -0  +50  °C Storage Temperature  TST  -  -20  +70  °C Storage Humidity  HD  Ta  ≦  40 °C  20  80  %RH    DC Electrical Characteristics Module                                                                                                                                            GND = 0V, Ta = 25°C Item  Symbol Condition  Min.  Typ.  Max.  Unit Power Supply Voltage  VDD  -  2.5  3.0  3.3  V Input Signal Voltage  VIH  -  0.84  -  -  V VIL  -  -  -  0.36  V Output Signal Voltage  VOH  -  1.88  -  -  V VOL  -  -  -  0.47  V Supply Current  IDD  VCC =3.0V    *1  -      mA VCC =3.0V    *2        uA
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 6   OF    Effective Date:    Pin Definition:  Pin No  Symbol  Function Description  Note 1  BLE_ PCL    BLE_ PCL  ,ON = L、OFF = H   2  BLE_STATUS  BLE_STATUS  ,ON = L、OFF = H   3  P0.5  GPIO   4  P0.4  GPIO   5  BLE_RST  INPUT.  Reset signal (active high).  Must be connected to GND if not used.  6  P1.2  GPIO   7  SWDIO  This signal is the JTAG data I/O by default   8  SWDCLK  This signal is the JTAG clock by default   9  ---  Dummy   10  Wake up BLE  Wake up BLE  ,ON = L、OFF = H   11  VDD  Power supply for BLE. supply of 2.0V ~ 3.3V.   12  GND  Ground   13  ---  Dummy   14  ---  Dummy   15  BT_TX  UART data output pin,MCU data to BLE   16  ---  Dummy   17  BT_RX  UART data input pin,BLE data to MCU   18  GND  Ground   19  P0.7  GPIO   20  GND  Ground   21  ---  Dummy   22  GND  Ground   23  ---  Dummy   24  ---  Dummy   25  VPP INPUT. This pin is used while OTP programming and testing. OTP programming: VPP = 6.8 V  ±  0.25 V OTP Normal operation: leave VPP floating  26  GND  Ground
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 7   OF    Effective Date:    Mechanical Diagram
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 8   OF    Effective Date:    Block Diagram
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 9   OF    Effective Date:    Module Application Circuit:
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 10   OF    Effective Date:    Module Bill of Material:  Item  Part No.  Designator  Comment 1  503-040000-0P0  U1  DA14580 / QFN 40 2  503-040000-0Q0  U2  MX25V1006E / USON 8L 3  502-021057-010  C1,C2,C3,C4  1uF / 10V / X5R /±10% / 0402 4  501-011032-020  R4, R5  10KΩ  /  ±5% / 0402 5  505-040000-2K0  L1  2.2uH±10%-1608 6  505-040000-2L0  L2  3.9nH±0.3nH-1005 7  505-020000-0B0  Y1  16 MHz/ FA-128 8  505-040000-0E0  E1  AT5020-B2R8HAA 9
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 11   OF    Effective Date:    Software & Operation Mode   UART Configuration Baud Rate  9600 bps Start Bit 1 Data Bits 8 Stop Bits 1 Parity Bit None Timeout : 500 ms
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 12   OF    Effective Date:     Instruction Set  Function  Instruction Set  BGM  Device  ID Command “ {“  LEN  ID-1  ID-2 … ID-n  CS   “ } ”  LEN  ID-1  ID-2 … ID-n  CS   Pairing [  0x27  White List  CS         ]  0xD8  Status Byte  CS         Pair Completion [  0x28  CS           ]  0xD7  CS           White List Full [  0x29  CS           ]  0xD6  CS           Check BLE ]  0x5F  CS           [  0xA0  CS           Clear White List ]  0x5B  CS           [  0xA4  Status Byte  CS         Read BLE Flash ]  0x5A  indexL  indexH  CS       [  0xA5  indexL  indexH  data0 … data9  CS Write BLE Flash ]  0x59  indexL  indexH  data0 … data9  CS [  0xA6  indexL  indexH  data0 … data9  CS BLE  Flash  writing area setting ]  0x58  Section Index CS         [  0xA7  Section Index CS         Write BLE Flash End ]  0x57  CS           [  0xA8  CS
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 13   OF    Effective Date:    Set BGM Device ID Command: Byte Index  0  1  2  3  …  LEN+1 LEN+2 MCU to BLE Command  ‘ } ’  LEN  ID-1  ID-2  …  ID-n  CS BLE to MCU Return Data  ‘ { ’  LEN  ID-1  ID-2  …  ID-n  CS ‘ } ’  :  Header of MCU set command, ASCII Format. ‘ { ’  :  Header of BLE return data. ASCII Format. LEN     :  Length of BGM ID. HEX value. ID-1 ~ ID-n  :  Unique ID of BGM. ASCII format.   Range    0x01 ~ 0x14 (1~20) CS      :    Checksum.   Checksum Byte = (Byte[0] + byte[1] + …. Byte[n])    &    0xFF   Pairing: Byte Index  0  1  2  3 BLE to MCU Command  ‘ [ ’ 0x27 White List  CS MCU to BLE Return Data  ‘ ] ’ 0xD8 Status Byte CS ‘ [ ’:  Header of BLE set command, ASCII Format. ‘ ] ’:  Header of MCU return data. ASCII Format. White List  :    paired quantity Status Byte:    0x00:Agree               0x01:Deny               0x02:Wait  Pair Completion Byte Index  0  1  2 BLE to MCU Command  ‘ [ ’ 0x28  CS MCU to BLE Return Data  ‘ ] ’ 0xD7  CS BLE module pairing is completed  White List Full Byte Index  0  1  2 BLE to MCU Command  ‘ [ ’ 0x29  CS MCU to BLE Return Data  ‘ ] ’ 0xD6  CS Whitelist is full and can no longer new pairing
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 14   OF    Effective Date:    Check BLE Byte Index  0  1  2 MCU to BLE Command  ‘ ] ’ 0x5F  CS BLE to MCU Return Data  ‘ [ ’ 0xA0  CS MCU tested for BLE module function test BLE normal operation, reply to 0xA0  Clear White List Byte Index  0  1  2  3 MCU to BLE Command  ‘ ] ’ 0x5B  CS   BLE to MCU Return Data  ‘ [ ’ 0xA4  Status Byte CS MCU command BLE clear Whitelist Status Byte:    0x00:BLE reply, Whitelist Clear Completed                             0x01:BLE reply, Whitelist Cleanup failed    Read BLE Flash Byte Index  0  1  2  3  4  …  13  14 MCU to BLE Command  ‘ ] ’ 0x5A  indexL indexH CS  …    BLE to MCU Return Data ‘ [ ’ 0xA5  indexL indexH data0  …  Data9  CS Read BLE Flash BLE 模組內可儲存資料 1200 筆 Flash 可存 1200 筆資料,每筆 10byte,index 範圍 0x0000~0x04AF  Write BLE Flash Byte Index  0  1  2  3  4  …  13  14 MCU to BLE Command  ‘ ] ’ 0x59  indexL indexH data0  …  Data9  CS BLE to MCU Return Data ‘ [ ’ 0xA6  indexL indexH data0  …  Data9  CS  BLE Flash writing area setting Byte Index  0  1  2  3 MCU to BLE Command  ‘ ] ’ 0x58 Section Index CS BLE to MCU Return Data ‘ [ ’ 0xA7 Section Index CS
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 15   OF    Effective Date:    Section Index:    0:                1:                2:  Write BLE Flash End Byte Index  0  1  2  3 MCU to BLE Command  ‘ ] ’ 0x57  CS   BLE to MCU Return Data  ‘ [ ’ 0xA8 CS
華  廣  生  技  股  份  有  限  公  司 Check List  Form No:FT-73-01-10D Subject:工程規格書/Engineering Specification  Project Code:              Model Name:  BM300   Doc. No.:    Rev.:   0 Page: 16   OF    Effective Date:

Navigation menu