Broadcom BRCM1067 802.11 abgn WLAN+Bluetooth Card User Manual

Broadcom Corporation 802.11 abgn WLAN+Bluetooth Card

User Manual

COMPANY CONFIDENTIAL BCM4330 WLAN+BT Combo Module (Foxconn T77H360.00) Product Specification Rev 1.9 Prepared by Reviewed by Approved by Gallon Tao Robin-Xu Chang-Fu Lin
COMPANY CONFIDENTIAL Index 1. REVISION HISTORY...................................................................................................................................................3 2. INTRODUCTION ..........................................................................................................................................................4 2.1 SCOPE ......................................................................................................................................................................4 2.2 FUNCTION.................................................................................................................................................................4 3. PRODUCT SPECIFICATION .....................................................................................................................................5 3.1 HARDWARE CHARACTERISTIC .................................................................................................................................5 3.2 HARDWARE ARCHITECTURE ....................................................................................................................................5 3.3 ELECTRICAL SPECIFICATION ....................................................................................................................................6 3.4 WLAN RF CHARACTERISTICS ................................................................................................................................7 3.4.1 IEEE802.11b..................................................................................................................................................7 3.4.2 IEEE802.11g..................................................................................................................................................8 3.4.3 IEEE802.11n HT20(2.4GHz) .......................................................................................................................9 3.4.4 IEEE802.11a ................................................................................................................................................10 3.4.5 IEEE802.11n HT20 (5GHz) .......................................................................................................................11 3.5 BLUETOOTH STANDARD SPECIFICATIONS .............................................................................................................11 3.6 LGA PIN DEFINITION .............................................................................................................................................14 4. MECHANICAL DRAWING .......................................................................................................................................16 5. PERIPHERAL SCHEMATIC REFERENCE DESIGN ..........................................................................................18 6. PCB LAYOUT.............................................................................................................................................................19 7. SOFTWARE REQUIREMENT .................................................................................................................................19 8. REGULATORY...........................................................................................................................................................19 9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.......................................................................19 9.1 TEMPERATURE .......................................................................................................................................................19 9.2 PCB BENDING ........................................................................................................................................................19 9.3 HANDLING ENVIRONMENT.......................................................................................................................................20 9.4 STORAGE CONDITION.............................................................................................................................................20 9.5 BAKING CONDITION ................................................................................................................................................20 9.6 SOLDERING AND REFLOW CONDITION....................................................................................................................20
COMPANY CONFIDENTIAL 1. Revision History Date Change Note REV Note 2011-10-12 Initial release 1.0 2011-10-13 Update module mechanical 2D drawing in section 5 1.1 2011-11-25 1. Update product specification 2. Add description for 5G enable and disable 3. FM is optional in this product. 1.2 2011-11-30 1. Update product specification to add product IDs 2. Add mother board and test jig reference schematic 3. Update Environmental Requirements and Specifications: 1) Add handling environment; 2) Add baking condition; 3) Add soldering and reflow condition 1.3 2011-12-14 1. Update mother board and test jig reference design schematic: Add remark on the schematic. 1.4 2011-12-26 1. Update section 3: product specification 1.5 2012-02-11 1. Update section 3.3, Current consumption 2. Update section 3.4, 11bg Tx emission result for EVT3 modules 3. Update section 3.5, complete Bluetooth specification 4. Update section 4, module mechanical drawing since shielding cover changed. 1.6 2012-03-16 1. Update section 3.4 for 2.4GHz TX emission for EVT4 modules 2. Update section 3.4 for add RX emission 3. Update section 3.4 for 11a/11an target power for middle and high band 4. Update section 3.4 for 11a/11an power limit 1.7 2012-03-17 1. Update 5GHz LO leakage level and RX SEN 2. Update module dimension 3. Update module block-diagram 4. Update section 4 for mechanical drawing 1.8 2012-03-17 1. Update 5GHz LO leakage level and RX SEN 2. Update module dimension 3. Update module block-diagram 4. Update section 4 for mechanical drawing 1.8
COMPANY CONFIDENTIAL 2. Introduction Project Name: 802.11abgn (1X1) + BT4.0 combo module This documentation describes the product specification of the WLAN+BT combo Module. WLAN is Compliant with IEEE Std. 802.11b-1999, IEEE Std. 802.11g-2003 and IEEE Std. 802.11n-2009, Bluetooth is compliant with Bluetooth 4.0+HS. It is a confidential document of Foxconn. * For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and driver to enable or disable 5GHz 2.1 Scope This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow user to switch to different vendors’ Access Points through the wireless networks and to prevent from eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS7(HT20) with PHY data rate to 72Mbps. Bluetooth is compliant to Core Specification version 4.0 2.2 Function  Single stream 802.11n support for 20MHz channels provide PHY layer rates up to 72Mbps.  Bluetooth supports Class 1.5 and Class 2 output power.  Provides a small form factor solution and ultra low power consumption to support low cost requirement.  Host interface supports: WLAN: SDIO; BT data: UART BT digital audio: PCM
COMPANY CONFIDENTIAL 3. Product Specification 3.1 Hardware Characteristic Form factor 14mmx13mm LGA Host Interface WLAN: SDIO BT: UART for data, PCM for Audio FM: UART for data, I2S for Audio PCB 6-layer HDI design RF connector Two MHF RF connectors 3.2 Hardware Architecture The WLAN+BT combo module is designed base on BROADCOM BCM4330 chip, the Broadcom BCM4330 is a highly integrated single chip solution for single stream dual-band WLAN and BT4.0, use two RF connector for 2.4GHz and 5GHz RF each, use a chip BPF for 2.4GHz and external LNA for 5GHz, a 26MHz crystal is used for reference clock generation, see the block diagram as below:
COMPANY CONFIDENTIAL 3.3 Electrical Specification Absolute Maximum Ratings These specification indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Recommended Operating Condition Value Element Symbol Minimum Typical Maximum Unit DC supply voltage for the device VBAT_3.3V 2.3 3.3 4.8 V VDDIO for WL_VDDIO and BT_VDDIO VIO_1.8V 1.2 1.8 2.9 V Function operation is not guaranteed outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the device. Power-Up Sequence Timing Current Consumption Typical Current@3.3V WLAN: Mode Tx Rx 11b@15.5dBm 180mA 105mA 11g @14.5dBm 150mA 100mA 11n(2.4G)@13.5dBm 160mA 100mA Active Rating Symbol Value Unit DC supply voltage for the device VBAT_3.3V -0.5 to +6.0 V VDDIO VIO -0.5 to 2.98 V
COMPANY CONFIDENTIAL 11a @13dBm 200mA 135mA 11n(5G) @12dBm 220mA 138mA BT: 26mA @0dBm(CLASS II) 48mA @7dBm(CLASS1.5) 22mA WiFi&BT Idle (RF on, WiFi no association; BT no inquiry, scan/page scan) 40mA WiFi Associated with AP; BT Idle 90mA Product ID Definition Vendor ID: 0x14e4 Device ID: 0x4360 3.4 WLAN RF Characteristics 3.4.1 IEEE802.11b Items Contents Specification IEEE802.11b Mode DSSS / CCK Channel CH1 to CH13,CH14 Data rate 1, 2, 5.5, 11Mbps -TX Characteristics- Min. Typ. Max. Unit 1. Power Levels Target Power 13.5 15.5 16.5 dBm 2. Spectrum Mask @16.5dBm (Max.) 1) fc-33MHz ＜ f ＜ fc-22MHz - - -50 dBr 2) fc-22MHz ＜ f ＜ fc-11MHz - - -30 dBr 3) fc+11MHz ＜ f ＜ fc+22MHz - - -30 dBr 4) fc+22MHz ＜ f ＜ fc+33MHz - - -50 dBr 3. Frequency Error -15 - +15 ppm 4 Modulation Accuracy(EVM)@16.5dBm (Max.) 1) 1Mbps - -10 dB 2) 2Mbps - -10 dB 3) 5.5Mbps - -10 dB 4) 11Mbps - -10 dB -RX Characteristics- Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 11Mbps (FER≦8%) - -86 -82 dBm 6. ≦ Maximum Input Level (FER 8%) 1) 1,2Mbps (FER≦8%) -4 - dBm 2) 5.5,11Mbps (FER≦8%) -10 - dBm -Spurious Emission(TX)- Min. Typ. Max. Unit (30MHz- 1GHz) - - -41.3 (1GHz – 12.75GHz) - -46.5 * -41.3 dBm -Spurious Emission(RX)- Min. Typ. Max. Unit (30MHz- 1GHz) -57 dBm
COMPANY CONFIDENTIAL (1GHz – 12.75GHz) -54 *This spurious is 3rd harmonic, the worst case for 2.4G Tx, and the harmonic was degrade by add 0603 BPF and notch file when transmit max. output power on 16.5dBm (1Mbps). 3.4.2 IEEE802.11g Items Contents Specification IEEE802.11g Mode OFDM Channel CH1 to CH13 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels 1) Target Power@6Mbps 12.5 14.5 15.5 dBm 2) Target Power@9Mbps 12.5 14.5 15.5 dBm 3) Target Power@12Mbps 12.5 14.5 15.5 dBm 4) Target Power@18Mbps 12.5 14.5 15.5 dBm 5) Target Power@24Mbps 12.5 14.5 15.5 dBm 6) Target Power@36Mbps 12.5 14.5 15.5 dBm 7) Target Power@48Mbps 12.5 14.5 15.5 dBm 8) Target Power@54Mbps 12.5 14.5 15.5 dBm 2. Spectrum Mask @15.5dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -40 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@15.5dBm 1) 6Mbps - - -5 dB 2) 9Mbps - - -8 dB 3) 12Mbps - - -10 dB 4) 18Mbps - - -13 dB 5) 24Mbps - - -16 dB 6) 36Mbps - - -19 dB 7) 48Mbps - - -22 dB 8) 54Mbps - - -25 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) - -89 -86 dBm 2) 9Mbps (PER < 10%) - -87 -83 dBm 3) 12Mbps (PER < 10%) - -85 -80 dBm 4) 18Mbps (PER < 10%) - -83 -78 dBm 5) 24Mbps (PER < 10%) - -80 -75 dBm 6) 36Mbps (PER < 10%) - -78 -73 dBm 7) 48Mbps (PER < 10%) - -76 -71 dBm 8) 54Mbps (PER < 10%) - -74 -69 dBm 6. Maximum Input Level (PER < 10%) -15 - - dBm -Spurious Emission(TX)- Min. Typ. Max. Unit (30MHz- 1GHz) - - -41.3 dBm (1GHz – 12.75GHz) - -58 -41.3 dBm -Spurious Emission(RX)- Min. Typ. Max. Unit (30MHz- 1GHz) -57 (1GHz – 12.75GHz) -54 dBm
COMPANY CONFIDENTIAL 3.4.3 IEEE802.11n HT20(2.4GHz) -Spurious Emission(RX)- Min. Typ. Max. Unit (30MHz- 1GHz) -57 (1GHz – 12.75GHz) -54 dBm Items Contents Specification IEEE802.11n HT20 Mode OFDM Channel CH1 to CH13 Data rate (MCS index) MCS0～MCS7 - TX Characteristics - Min. Typ. Max. Unit 1. PowerLevels 1) Target Power@MCS0 11.5 13.5 14.5 dBm 2) Target Power@ MCS1 11.5 13.5 14.5 dBm 3) Target Power@ MCS2 11.5 13.5 14.5 dBm 4) Target Power@ MCS3 11.5 13.5 14.5 dBm 5) Target Power@ MCS4 11.5 13.5 14.5 dBm 6) Target Power@ MCS5 11.5 13.5 14.5 dBm 7) Target Power@ MCS6 11.5 13.5 14.5 dBm 8) Target Power@ MCS7 11.5 13.5 14.5 dBm 2. Spectrum Mask @14.5dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -45 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@14.5dBm 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - - -28 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) - -88 -84 dBm 2) MCS1 (PER < 10%) - -85 -81 dBm 3) MCS2 (PER < 10%) - -83 -79 dBm 4) MCS3 (PER < 10%) - -80 -76 dBm 5) MCS4 (PER < 10%) - -78 -74 dBm 6) MCS5 (PER < 10%) - -76 -72 dBm 7) MCS6 (PER < 10%) - -74 -70 dBm 8) MCS7 (PER < 10%) - -71 -67 dBm 6. Maximum Input Level (PER < 10%) -15 - - dBm -Spurious Emission(TX)- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 FCC Average(1GHz – 12.75GHz) - -60 -41.3 dBm
COMPANY CONFIDENTIAL 3.4.4 IEEE802.11a Items Contents Specification IEEE802.11a Mode OFDM Channel lower band:5.15GHz～5.35GHz middle band:5.500GHz～5.700GHz upper band:5.745GHz～5.825GHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels Low Band(5.15GHz~5.35GHz) 11 13 14 dBm Middle Band(5.500GHz～5.700GHz) 11 13 14 dBm Upper Band(5.745GHz～5.825GHz) 11 13 14 dBm 2. Spectrum Mask @ Type power@14dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -40 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@ Type power@14dBm 1) 6Mbps - - -5 dB 2) 9Mbps - - -8 dB 3) 12Mbps - - -10 dB 4) 18Mbps - - -13 dB 5) 24Mbps - - -16 dB 6) 36Mbps - - -19 dB 7) 48Mbps - - -22 dB 8) 54Mbps - - -25 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) - -91 -87 dBm 2) 9Mbps (PER < 10%) - -89 -85 dBm 3) 12Mbps (PER < 10%) - -87 -83 dBm 4) 18Mbps (PER < 10%) - -85 -81 dBm 5) 24Mbps (PER < 10%) - -82 -78 dBm 6) 36Mbps (PER < 10%) - -80 -76 dBm 7) 48Mbps (PER < 10%) - -78 -74 dBm 8) 54Mbps (PER < 10%) - -76 -72 dBm 6. Maximum Input Level (PER < 10%) -15 - - dBm -Spurious Emission(TX)- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm -Spurious Emission(RX)- Min. Typ. Max. Unit (30MHz- 1GHz) -57 (1GHz – 12.75GHz)* -58 -54 dBm * the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit.
COMPANY CONFIDENTIAL 3.4.5 IEEE802.11n HT20 (5GHz) 7) MCS6 (PER < 10%) - -75 -71 dBm 8) MCS7 (PER < 10%) - -73 -69 dBm 6. Maximum Input Level (PER < 10%) -20 - - dBm -Spurious Emission(TX)- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm -Spurious Emission(RX)- Min. Typ. Max. Unit (30MHz- 1GHz) -57 (1GHz – 12.75GHz)* -58 -54 dBm * the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit. 3.5 Bluetooth Standard Specifications Bluetooth Core Specification version 4.0: Host interface: UART, baud rates up to 4Mbps Support all Bluetooth 4.0+HS packet types. Operating frequency range: 2400MHz ~2483.5MHz Modulation type: Basic rate 1Mbps: GFSK, Enhanced data rate 2Mbps: DQPSK Items Contents Specification IEEE802.11n HT20 Mode OFDM Channel lower band:5.15GHz～5.35GHz middle band:5.500GHz～5.700GHz upper band:5.745GHz～5.825GHz Data rate (MCS index) MCS0～MCS7 - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels Low Band(5.15GHz~5.35GHz) 10 12 13 dBm Middle Band(5.500GHz～5.700GHz) 10 12 13 dBm Upper Band(5.745GHz～5.825GHz) 10 12 13 dBm 2. Spectrum Mask @Type power@13dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -45 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@Type power@13dBm 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - - -28 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) - -91 -87 dBm 2) MCS1 (PER < 10%) - -88 -84 dBm 3) MCS2 (PER < 10%) - -85 -81 dBm 4) MCS3 (PER < 10%) - -82 -78 dBm 5) MCS4 (PER < 10%) - -79 -75 dBm 6) MCS5 (PER < 10%) - -77 -73 dBm
COMPANY CONFIDENTIAL Enhanced data rate 3Mbps: 8DPSK Items Contents Specification BT4.0+EDR Frequency range 2.4GHz~2.4835GHz Data rate 1Mbps, 2Mbps, 3Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels BT Output Power 4 7 10 dBm 2. Initial Carrier Frequency Tolerance Average Offset -75 6 75 kHz 3. Carrier Drift Drift Rate DH1 -20 3 20 kHz/50us DH3 -20 -3 20 kHz/50us DH5 -20 0 20 kHz/50us Average Drift DH1 -25 -1 25 kHz DH3 -40 0 40 kHz DH5 -40 0 40 kHz 4. Modulation Characteristic F1avg 140 153 175 kHz F2max 115 133 kHz F1/F2 Ratio 0.8 0.93 5. EDR Relative Transmit Power 2Mbps: P[DQPSK]-P[GFSK] -4 0.25 1 dB 3Mbps: P[8DPSK]-P[GFSK] -4 0.25 1 dB 6. EDR Carrier Frequency Stability and Modulation Accuracy 2Mbps: π/4 DQPSK Initial Frequency Error: ωi -75 5 75 kHz Frequency Error: ω0 -10 1 10 kHz Block Frequency Error: ωi + ω0 -75 6 75 kHz RMS DEVM - - 0.2 Peak DEVM - - 0.35 99% DEVM (% Symbols <=0.3) 99% 100% 3Mbps: 8DPSK Initial Frequency Error: ωi -75 6 75 kHz Frequency Error: ω0 -10 0.9 10 kHz Block Frequency Error: ωi + ω0 -75 6.3 75 kHz RMS DEVM - - 0.13 Peak DEVM - - 0.25 99% DEVM (% Symbols <=0.13) 99% 100% 7. Tx Spurious Emission 30MHz- 1GHz - - -41.3 dBm 1GHz – 12.75GHz - -51 -41.3 dBm
COMPANY CONFIDENTIAL Items Contents Specification BT4.0+EDR Frequency range 2.4GHz~2.4835GHz Data rate 1Mbps, 2Mbps, 3Mbps - RX Characteristics - Min. Typ. Max. Unit 1. Minimum Input Level Sensitivity GFSK (1Mbps) - -90 -83 dBm π/4 DQPSK (2Mbps) - -92 -84 dBm 8DPSK (3Mbps) - -86 -77 dBm 2. Maximum Input Level GFSK (1Mbps) -20 0 dBm π/4 DQPSK (2Mbps) -20 5 dBm 8DPSK (3Mbps) -20 5 dBm 3. Rx Emission 30MHz- 1GHz - - -57 dBm 1GHz – 12.75GHz - - -54 dBm
COMPANY CONFIDENTIAL 3.6 LGA Pin Definition TOP View
COMPANY CONFIDENTIAL Pin No. Pin Name Type Description B1 RF_A_LGA I/O 5GHz RF pin (WLAN 5GHz Tx/Rx) B9 RF_G_LGA I/O 2.4GHz RF pin (for WLAN2.4GHz Tx/Rx and BT Tx/Rx) C3 UART_CTS_N I UART clear to Send, active low (for BT data) C4 UART_RTS_N O UART request to Send, active low (for BT data) C5 UART_RXD I UART signal input C6 UART_TXD O UART signal output C7 FM_AUDIO_L O FM analog audio output channel L (Not used) C8 FM_AUDIO_R O FM analog audio output channel R (Not used) D2 VBAT_3.3V_L I Main power supply for the module, (3.3V+/-10%, together with pin G8 to supply the module), please consider reserve for 300mA current consumption, need place a 4.7uF decoupling CAP close to this pin on main board. G8 VBAT_3.3V_R I Main power supply for the module, (3.3V+/-10%, together with pin D2 to supply the module ), please consider reserve for 300mA current consumption, need place a 4.7uF decoupling CAP close to this pin on main board. D6 BT_GPIO0_BTWAKE I BT wake up, signal from the host to module to require BT device wake-up or remain awake D7 BT_GPIO1_HOSTWAKE O Signal from module to host to require Host wake up D8 BT_RST_N I External reset for BT, active low, please pull-up on host side (not left floating) D9 FM_TX_LGA O FM Radio output (Not used) E9 FM_RX_LGA I FM Radio input (Not used) E6 SDIO_SPI_SEL I Host interface mode selection, internal pull down, work with SDIO_DATA_1 and SDIO_DATA_2 together to select the host interface E7 LPO I 32.768kHz LPO clock, need for device auto frequency detection E8 BT_CLK_REQ_OUT O BT/WLAN reference clock request out, active high, need an external 100kohm pull-down resistor to ensure the signal is deasserted when BCM43330 powers up. F4 GPIO0_WL_HOST_WAKE O Signal from WLAN device to awake the host. F6 FM_I2S_DO I/O I2S data output F7 FM_I2S_DI I/O I2S data input F8 FM_I2S_SCK I I2S reference clock F9 FM_I2S_WS I/O I2S word select G3 BT_PCM_IN I/O PCM data input
COMPANY CONFIDENTIAL G4 BT_PCM_OUT I/O PCM data output H2 BT_PCM_CLK I PCM Clock H3 BT_PCM_SYNC I/O PCM sync signal G6 SDIO_DATA3 I/O SDIO data line 3 H5 SDIO_DATA2 I/O SDIO data line 2 H6 SDIO_DATA0 I/O SDIO data line 0 H7 SDIO_CMD I/O SDIO command line H8 SDIO_CLK I SDIO clock G7 BT_REG_ON I Power up or power down BCM4330 internal regulators used for BT, Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (internal 200K pull-down) G9 WL_REG_ON I Power up or power down BCm4330 internal regulators used for WLAN, this pin is also a low active reset for WLAN only (not for BT)Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (inertnal 200K pull-down) H4 VIO_1.8V I VDDIO for BCM4330 I/O supply, range from 1.2V~2.9V, select 1.8V here, please consider reserve for 100mA current consumption A2,A3,A4,A5,A6,A7,A8,A9,B2,B3,B4,B5,B6,B7,B8,C1,C2,C9,D1,D3,D4,D5,E1,E2,E3,E4,E5,F1,F2,F3,F5,G1,G2,G5,H1 GND Ground 4. Mechanical Drawing * The on board RF connector and plug mating height would be 1.2mm max.
COMPANY CONFIDENTIAL * The holes represent the LGA pins on bottom side of the module.
COMPANY CONFIDENTIAL 5. Peripheral Schematic Reference Design
COMPANY CONFIDENTIAL 6. PCB Layout 6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.6+/-0.1mm Stack-up 7. Software Requirement  Nvram file for RF parameters configuration.  If use dual-band WLAN, platform need to load dual-band firmware and install dual-band driver.  If use single-band WLAN, platform need to load single-band firmware and install single-band driver. 8. Regulatory TBD 9. Environmental Requirements and Specifications 9.1 Temperature 9.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0 to +℃70 .℃ 9.1.2 Non-Operating Temperature Conditions Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -10 t℃o +85 .℃ 9.2 PCB bending The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly customer.
COMPANY CONFIDENTIAL 9.3 Handling environment 9.3.1. ESD The product ESD immunity is HBM>= +/- 450 (V), MM >= +/- 100 (V). Please handle it under ESD protection environment. Note: HBM: Human Body Model/MM: Mechanical Model This device is ESD sensitive device, it must be protected at all times from ESD, industry-standard ESD precautions should be used at all times. 9.3.2. Terminals The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering, please do not touch LGA portion by hand. 9.3.3. Falling It will cause damage on the mounted components when the product is falling or receiving drop shock. It may cause the product mal-function. 9.4 Storage Condition 9.4.1 Moisture barrier bag before opened Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. 9.4.2. Moisture barrier bag open Humidity indicator cards must be blue, <30%. 9.5 Baking Condition Products require baking before mounting if a) humidity indicator cards reads >30% b) temp <30 degree C, humidity < 70% RH, over 96 hours Baking condition: 90 degree C, 12-22 hours Baking times: 1 time 9.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method. 3) Solder paste composition Sn/3.0Ag/0.5Cu 4) Allowable reflow soldering times: 2 times based on the below reflow soldering profile 5) Temperature profile Reflow soldering shall be done according to the below temperature profile. 6) Peak temp: 245 degree C
COMPANY CONFIDENTIAL Temperature profile for evaluation of solder heat resistance of a component (at solder joint)

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