Broadcom BRCM1067 802.11 abgn WLAN+Bluetooth Card User Manual

Broadcom Corporation 802.11 abgn WLAN+Bluetooth Card

User Manual

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COMPANY CONFIDENTIAL
BCM4330 WLAN+BT Combo Module
(Foxconn T77H360.00)
Product Specification
Rev 1.9
Prepared by
Gallon Tao
Reviewed by
Robin-Xu
Approved by
Chang-Fu Lin
COMPANY CONFIDENTIAL
Index
1. REVISION HISTORY...................................................................................................................................................3
2. INTRODUCTION ..........................................................................................................................................................4
2.1 SCOPE ......................................................................................................................................................................4
2.2 FUNCTION .................................................................................................................................................................4
3. PRODUCT SPECIFICATION .....................................................................................................................................5
3.1 HARDWARE CHARACTERISTIC .................................................................................................................................5
3.2 HARDWARE ARCHITECTURE ....................................................................................................................................5
3.3 ELECTRICAL SPECIFICATION ....................................................................................................................................6
3.4 WLAN RF CHARACTERISTICS ................................................................................................................................7
3.4.1 IEEE802.11b ..................................................................................................................................................7
3.4.2 IEEE802.11g ..................................................................................................................................................8
3.4.3 IEEE802.11n HT20(2.4GHz) .......................................................................................................................9
3.4.4 IEEE802.11a ................................................................................................................................................10
3.4.5 IEEE802.11n HT20 (5GHz) .......................................................................................................................11
3.5 BLUETOOTH STANDARD SPECIFICATIONS .............................................................................................................11
3.6 LGA PIN DEFINITION .............................................................................................................................................14
4. MECHANICAL DRAWING .......................................................................................................................................16
5. PERIPHERAL SCHEMATIC REFERENCE DESIGN ..........................................................................................18
6. PCB LAYOUT.............................................................................................................................................................19
7. SOFTWARE REQUIREMENT .................................................................................................................................19
8. REGULATORY...........................................................................................................................................................19
9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.......................................................................19
9.1 TEMPERATURE .......................................................................................................................................................19
9.2 PCB BENDING ........................................................................................................................................................19
9.3 HANDLING ENVIRONMENT.......................................................................................................................................20
9.4 STORAGE CONDITION.............................................................................................................................................20
9.5 BAKING CONDITION ................................................................................................................................................20
9.6 SOLDERING AND REFLOW CONDITION ....................................................................................................................20
COMPANY CONFIDENTIAL
1. Revision History
Date
Change Note
REV
Note
2011-10-12
Initial release
1.0
2011-10-13
Update module mechanical 2D drawing in section 5
1.1
2011-11-25
1. Update product specification
2. Add description for 5G enable and disable
3. FM is optional in this product.
1.2
2011-11-30
1. Update product specification to add product IDs
2. Add mother board and test jig reference schematic
3. Update Environmental Requirements and Specifications:
1) Add handling environment;
2) Add baking condition;
3) Add soldering and reflow condition
1.3
2011-12-14
1. Update mother board and test jig reference design schematic:
Add remark on the schematic.
1.4
2011-12-26
1. Update section 3: product specification
1.5
2012-02-11
2012-03-16
2012-03-17
2012-03-17
1. Update section 3.3, Current consumption
2. Update section 3.4, 11bg Tx emission result for EVT3 modules
3. Update section 3.5, complete Bluetooth specification
1.6
4. Update section 4, module mechanical drawing since shielding
cover changed.
1. Update section 3.4 for 2.4GHz TX emission for EVT4 modules
2. Update section 3.4 for add RX emission
3. Update section 3.4 for 11a/11an target power for middle and
1.7
high band
4. Update section 3.4 for 11a/11an power limit
1. Update 5GHz LO leakage level and RX SEN
2. Update module dimension
3. Update module block-diagram
4. Update section 4 for mechanical drawing
1. Update 5GHz LO leakage level and RX SEN
2. Update module dimension
3. Update module block-diagram
4. Update section 4 for mechanical drawing
1.8
1.8
COMPANY CONFIDENTIAL
2. Introduction
Project Name: 802.11abgn (1X1) + BT4.0 combo module
This documentation describes the product specification of the WLAN+BT combo Module. WLAN is Compliant
with IEEE Std. 802.11b-1999, IEEE Std. 802.11g-2003 and IEEE Std. 802.11n-2009, Bluetooth is compliant
with Bluetooth 4.0+HS. It is a confidential document of Foxconn.
* For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and
driver to enable or disable 5GHz
2.1 Scope
This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data
rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS7(HT20) with PHY
data rate to 72Mbps. Bluetooth is compliant to Core Specification version 4.0
2.2 Function




Single stream 802.11n support for 20MHz channels provide PHY layer rates up to 72Mbps.
Bluetooth supports Class 1.5 and Class 2 output power.
Provides a small form factor solution and ultra low power consumption to support low cost requirement.
Host interface supports:
WLAN: SDIO;
BT data: UART
BT digital audio: PCM
COMPANY CONFIDENTIAL
3. Product Specification
3.1 Hardware Characteristic
Form factor
Host Interface
PCB
RF connector
14mmx13mm LGA
WLAN: SDIO
BT: UART for data, PCM for Audio
FM: UART for data, I2S for Audio
6-layer HDI design
Two MHF RF connectors
3.2 Hardware Architecture
The WLAN+BT combo module is designed base on BROADCOM BCM4330 chip, the Broadcom
BCM4330 is a highly integrated single chip solution for single stream dual-band WLAN and BT4.0, use
two RF connector for 2.4GHz and 5GHz RF each, use a chip BPF for 2.4GHz and external LNA for
5GHz, a 26MHz crystal is used for reference clock generation, see the block diagram as below:
COMPANY CONFIDENTIAL
3.3 Electrical Specification
Absolute Maximum Ratings
These specification indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for
extended can adversely affect long-term reliability of the device.
Rating
DC supply voltage for the device
VDDIO
Symbol
VBAT_3.3V
VIO
Value
-0.5 to +6.0
-0.5 to 2.98
Unit
Recommended Operating Condition
Element
Value
Symbol
Minimum
DC supply voltage for the device
VDDIO for WL_VDDIO and BT_VDDIO
VBAT_3.
3V
VIO_1.8V
Typical
Unit
Maximum
2.3
3.3
4.8
1.2
1.8
2.9
Function operation is not guaranteed outside this limit, and operation outside this limit for extended
periods can adversely affect long-term reliability of the device.
Power-Up Sequence Timing
Current Consumption
Typical Current@3.3V
Active
WLAN:
Mode
Tx
Rx
11b@15.5dBm
180mA
105mA
11g @14.5dBm
150mA
100mA
11n(2.4G)@13.5dBm
160mA
100mA
COMPANY CONFIDENTIAL
11a @13dBm
200mA
135mA
11n(5G) @12dBm
220mA
138mA
BT:
26mA @0dBm(CLASS II)
48mA @7dBm(CLASS1.5)
22mA
WiFi&BT Idle
(RF on,
WiFi no association;
BT no inquiry,
scan/page scan)
40mA
WiFi Associated with AP;
BT Idle
90mA
Product ID Definition
Vendor ID: 0x14e4
Device ID: 0x4360
3.4 WLAN RF Characteristics
3.4.1 IEEE802.11b
Items
Contents
Specification
Mode
Channel
Data rate
-TX Characteristics1. Power Levels
Target Power
2. Spectrum Mask @16.5dBm (Max.)
1) fc-33MHz < f < fc-22MHz
2) fc-22MHz < f < fc-11MHz
3) fc+11MHz < f < fc+22MHz
4) fc+22MHz < f < fc+33MHz
3. Frequency Error
4 Modulation Accuracy(EVM)@16.5dBm (Max.)
1) 1Mbps
2) 2Mbps
3) 5.5Mbps
4) 11Mbps
-RX Characteristics5. Minimum Input Level Sensitivity
1) 11Mbps (FER≦8%)
6. Maximum Input Level (FER≦8%)
1) 1,2Mbps (FER≦8%)
2) 5.5,11Mbps (FER≦8%)
-Spurious Emission(TX)(30MHz- 1GHz)
(1GHz – 12.75GHz)
-Spurious Emission(RX)(30MHz- 1GHz)
Min.
IEEE802.11b
DSSS / CCK
CH1 to CH13,CH14
1, 2, 5.5, 11Mbps
Typ.
Max.
Unit
13.5
15.5
16.5
dBm
-15
-50
-30
-30
-50
+15
dBr
dBr
dBr
dBr
ppm
Min.
Typ.
-10
-10
-10
-10
Max.
dB
dB
dB
dB
Unit
-86
-82
dBm
-4
-10
Min.
Min.
Typ.
-46.5 *
Typ.
Max.
-41.3
-41.3
Max.
-57
dBm
dBm
Unit
dBm
Unit
dBm
COMPANY CONFIDENTIAL
(1GHz – 12.75GHz)
-54
*This spurious is 3rd harmonic, the worst case for 2.4G Tx, and the harmonic was degrade by add 0603 BPF and notch
file when transmit max. output power on 16.5dBm (1Mbps).
3.4.2 IEEE802.11g
Items
Contents
Specification
Mode
Channel
Data rate
- TX Characteristics 1. Power Levels
1) Target Power@6Mbps
2) Target Power@9Mbps
3) Target Power@12Mbps
4) Target Power@18Mbps
5) Target Power@24Mbps
6) Target Power@36Mbps
7) Target Power@48Mbps
8) Target Power@54Mbps
2. Spectrum Mask @15.5dBm
1) at fc +/- 11MHz
2) at fc +/- 20MHz
3) at fc > +/-30MHz
3. Frequency Error
4. Constellation Error(EVM)@15.5dBm
1) 6Mbps
2) 9Mbps
3) 12Mbps
4) 18Mbps
5) 24Mbps
6) 36Mbps
7) 48Mbps
8) 54Mbps
- RX Characteristics 5. Minimum Input Level Sensitivity
1) 6Mbps (PER < 10%)
2) 9Mbps (PER < 10%)
3) 12Mbps (PER < 10%)
4) 18Mbps (PER < 10%)
5) 24Mbps (PER < 10%)
6) 36Mbps (PER < 10%)
7) 48Mbps (PER < 10%)
8) 54Mbps (PER < 10%)
6. Maximum Input Level (PER < 10%)
-Spurious Emission(TX)(30MHz- 1GHz)
(1GHz – 12.75GHz)
-Spurious Emission(RX)(30MHz- 1GHz)
(1GHz – 12.75GHz)
Min.
IEEE802.11g
OFDM
CH1 to CH13
6, 9, 12, 18, 24, 36, 48, 54Mbps
Typ.
Max.
Unit
12.5
12.5
12.5
12.5
12.5
12.5
12.5
12.5
14.5
14.5
14.5
14.5
14.5
14.5
14.5
14.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
-20
-28
dBr
dBr
-15
-40
+15
dBr
ppm
Min.
Typ.
-5
-8
-10
-13
-16
-19
-22
-25
Max.
dB
dB
dB
dB
dB
dB
dB
dB
Unit
-15
Min.
Min.
-89
-87
-85
-83
-80
-78
-76
-74
Typ.
-58
Typ.
-86
-83
-80
-78
-75
-73
-71
-69
Max.
-41.3
-41.3
Max.
-57
-54
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Unit
dBm
dBm
Unit
dBm
COMPANY CONFIDENTIAL
3.4.3 IEEE802.11n HT20(2.4GHz)
Items
Specification
Mode
Channel
Data rate (MCS index)
- TX Characteristics 1. PowerLevels
1) Target Power@MCS0
2) Target Power@ MCS1
3) Target Power@ MCS2
4) Target Power@ MCS3
5) Target Power@ MCS4
6) Target Power@ MCS5
7) Target Power@ MCS6
8) Target Power@ MCS7
2. Spectrum Mask @14.5dBm
1) at fc +/- 11MHz
2) at fc +/- 20MHz
3) at fc > +/-30MHz
3. Frequency Error
4. Constellation Error(EVM)@14.5dBm
1) MCS0
2) MCS1
3) MCS2
4) MCS3
5) MCS4
6) MCS5
7) MCS6
8) MCS7
- RX Characteristics 5. Minimum Input Level Sensitivity
1) MCS0 (PER < 10%)
2) MCS1 (PER < 10%)
3) MCS2 (PER < 10%)
4) MCS3 (PER < 10%)
5) MCS4 (PER < 10%)
6) MCS5 (PER < 10%)
7) MCS6 (PER < 10%)
8) MCS7 (PER < 10%)
6. Maximum Input Level (PER < 10%)
-Spurious Emission(TX)FCC(30MHz- 1GHz)
FCC Average(1GHz – 12.75GHz)
-Spurious Emission(RX)(30MHz- 1GHz)
(1GHz – 12.75GHz)
Contents
IEEE802.11n HT20
OFDM
CH1 to CH13
MCS0~MCS7
Min.
Typ.
Max.
Unit
11.5
11.5
11.5
11.5
11.5
11.5
11.5
11.5
13.5
13.5
13.5
13.5
13.5
13.5
13.5
13.5
14.5
14.5
14.5
14.5
14.5
14.5
14.5
14.5
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
-15
-20
-28
-45
+15
dBr
dBr
dBr
ppm
Min.
Typ.
-5
-10
-13
-16
-19
-22
-25
-28
Max.
dB
dB
dB
dB
dB
dB
dB
dB
Unit
-15
Min.
Min.
-88
-85
-83
-80
-78
-76
-74
-71
Typ.
-60
Typ.
-84
-81
-79
-76
-74
-72
-70
-67
Max.
-41.3
-41.3
Max.
-57
-54
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Unit
dBm
Unit
dBm
COMPANY CONFIDENTIAL
3.4.4 IEEE802.11a
Items
Contents
Specification
Mode
Channel
Data rate
- TX Characteristics 1. Power Levels
Low Band(5.15GHz~5.35GHz)
Middle Band(5.500GHz~5.700GHz)
Upper Band(5.745GHz~5.825GHz)
2. Spectrum Mask @ Type power@14dBm
1) at fc +/- 11MHz
Min.
2) at fc +/- 20MHz
3) at fc > +/-30MHz
3. Frequency Error
4. Constellation Error(EVM)@ Type power@14dBm
1) 6Mbps
2) 9Mbps
3) 12Mbps
4) 18Mbps
5) 24Mbps
6) 36Mbps
7) 48Mbps
8) 54Mbps
- RX Characteristics 5. Minimum Input Level Sensitivity
1) 6Mbps (PER < 10%)
2) 9Mbps (PER < 10%)
3) 12Mbps (PER < 10%)
4) 18Mbps (PER < 10%)
5) 24Mbps (PER < 10%)
6) 36Mbps (PER < 10%)
7) 48Mbps (PER < 10%)
IEEE802.11a
OFDM
lower band:5.15GHz~5.35GHz
middle band:5.500GHz~5.700GHz
upper band:5.745GHz~5.825GHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
Typ.
Max.
Unit
11
11
11
13
13
13
14
14
14
dBm
dBm
dBm
-20
dBr
-15
-28
-40
+15
dBr
dBr
ppm
Min.
Typ.
-5
-8
-10
-13
-16
-19
-22
-25
Max.
dB
dB
dB
dB
dB
dB
dB
dB
Unit
-91
-89
-87
-85
-82
-80
-78
-87
-85
-83
-81
-78
-76
-74
dBm
dBm
dBm
dBm
dBm
dBm
dBm
8) 54Mbps (PER < 10%)
6. Maximum Input Level (PER < 10%)
-Spurious Emission(TX)FCC(30MHz- 1GHz)
-15
Min.
-76
Typ.
-72
Max.
-41.3
dBm
dBm
Unit
dBm
FCC Average(1GHz – 12.75GHz)
-Spurious Emission(RX)(30MHz- 1GHz)
(1GHz – 12.75GHz)*
Min.
Typ.
-41.3
Max.
-57
-54
dBm
Unit
-58
* the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit.
dBm
COMPANY CONFIDENTIAL
3.4.5 IEEE802.11n HT20 (5GHz)
Items
Specification
Mode
Channel
Data rate (MCS index)
- TX Characteristics 1. Power Levels
Low Band(5.15GHz~5.35GHz)
Middle Band(5.500GHz~5.700GHz)
Upper Band(5.745GHz~5.825GHz)
2. Spectrum Mask @Type power@13dBm
1) at fc +/- 11MHz
2) at fc +/- 20MHz
3) at fc > +/-30MHz
3. Frequency Error
4. Constellation Error(EVM)@Type power@13dBm
1) MCS0
2) MCS1
3) MCS2
4) MCS3
5) MCS4
6) MCS5
7) MCS6
8) MCS7
- RX Characteristics 5. Minimum Input Level Sensitivity
1) MCS0 (PER < 10%)
2) MCS1 (PER < 10%)
3) MCS2 (PER < 10%)
4) MCS3 (PER < 10%)
5) MCS4 (PER < 10%)
6) MCS5 (PER < 10%)
7) MCS6 (PER < 10%)
8) MCS7 (PER < 10%)
6. Maximum Input Level (PER < 10%)
-Spurious Emission(TX)FCC(30MHz- 1GHz)
Contents
IEEE802.11n HT20
OFDM
lower band:5.15GHz~5.35GHz
middle band:5.500GHz~5.700GHz
upper band:5.745GHz~5.825GHz
MCS0~MCS7
Min.
Typ.
Max.
FCC Average(1GHz – 12.75GHz)
-Spurious Emission(RX)(30MHz- 1GHz)
(1GHz – 12.75GHz)*
10
10
10
12
12
12
13
13
13
dBm
dBm
dBm
-15
-20
-28
-45
+15
dBr
dBr
dBr
ppm
Min.
Typ.
-5
-10
-13
-16
-19
-22
-25
-28
Max.
dB
dB
dB
dB
dB
dB
dB
dB
Unit
-20
Min.
-91
-88
-85
-82
-79
-77
-75
-73
Typ.
-87
-84
-81
-78
-75
-73
-71
-69
Max.
-41.3
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Unit
dBm
Min.
Typ.
-41.3
Max.
-57
-54
dBm
Unit
-58
* the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit.
3.5 Bluetooth Standard Specifications
Bluetooth Core Specification version 4.0:
Host interface: UART, baud rates up to 4Mbps
Support all Bluetooth 4.0+HS packet types.
Operating frequency range: 2400MHz ~2483.5MHz
Modulation type:
Basic rate 1Mbps: GFSK,
Enhanced data rate 2Mbps: DQPSK
Unit
dBm
COMPANY CONFIDENTIAL
Enhanced data rate 3Mbps: 8DPSK
Items
Contents
BT4.0+EDR
Specification
Frequency range
Data rate
- TX Characteristics 1. Power Levels
BT Output Power
2.4GHz~2.4835GHz
1Mbps, 2Mbps, 3Mbps
Min.
Typ.
Max.
Unit
10
dBm
-75
75
kHz
DH1
DH3
-20
-20
-3
20
20
kHz/50us
kHz/50us
DH5
Average Drift
-20
20
kHz/50us
DH1
-25
-1
25
DH3
-40
40
kHz
kHz
DH5
-40
40
F1avg
140
153
175
F2max
115
133
kHz
kHz
F1/F2 Ratio
5. EDR Relative Transmit Power
0.8
0.93
2Mbps: P[DQPSK]-P[GFSK]
-4
0.25
dB
3Mbps: P[8DPSK]-P[GFSK]
-4
0.25
Initial Frequency Error: ωi
-75
75
Frequency Error: ω0
Block Frequency Error: ωi + ω0
-10
-75
10
75
RMS DEVM
0.2
Peak DEVM
0.35
99%
100%
Initial Frequency Error: ωi
-75
75
Frequency Error: ω0
-10
0.9
10
Block Frequency Error: ωi + ω0
-75
6.3
75
RMS DEVM
0.13
Peak DEVM
0.25
99%
100%
30MHz- 1GHz
-41.3
dBm
1GHz – 12.75GHz
-51
-41.3
dBm
2. Initial Carrier Frequency Tolerance
Average Offset
3. Carrier Drift
Drift Rate
kHz
4. Modulation Characteristic
dB
6. EDR Carrier Frequency Stability and Modulation Accuracy
2Mbps: π/4 DQPSK
99% DEVM (% Symbols <=0.3)
kHz
kHz
kHz
3Mbps: 8DPSK
99% DEVM (% Symbols <=0.13)
kHz
kHz
kHz
7. Tx Spurious Emission
COMPANY CONFIDENTIAL
Items
Specification
Frequency range
Data rate
- RX Characteristics 1. Minimum Input Level Sensitivity
GFSK (1Mbps)
π/4 DQPSK (2Mbps)
Contents
BT4.0+EDR
2.4GHz~2.4835GHz
1Mbps, 2Mbps, 3Mbps
Min.
Typ.
Max.
Unit
-90
-92
-83
-84
dBm
dBm
-86
-77
dBm
GFSK (1Mbps)
-20
dBm
π/4 DQPSK (2Mbps)
-20
dBm
8DPSK (3Mbps)
-20
dBm
30MHz- 1GHz
-57
dBm
1GHz – 12.75GHz
-54
dBm
8DPSK (3Mbps)
2. Maximum Input Level
3. Rx Emission
COMPANY CONFIDENTIAL
3.6 LGA Pin Definition
TOP View
COMPANY CONFIDENTIAL
Pin Pin Name
No.
Type Description
B1
B9
C3
C4
C5
C6
C7
C8
D2
RF_A_LGA
RF_G_LGA
UART_CTS_N
UART_RTS_N
UART_RXD
UART_TXD
FM_AUDIO_L
FM_AUDIO_R
VBAT_3.3V_L
I/O
I/O
G8
VBAT_3.3V_R
D6
BT_GPIO0_BTWAKE
D7
BT_GPIO1_HOSTWAKE
D8
BT_RST_N
D9
FM_TX_LGA
External reset for BT, active low, please pull-up on host side (not left
floating)
FM Radio output (Not used)
E9
FM_RX_LGA
FM Radio input (Not used)
E6
SDIO_SPI_SEL
E7
LPO
Host interface mode selection, internal pull down, work with
SDIO_DATA_1 and SDIO_DATA_2 together to select the host
interface
32.768kHz LPO clock, need for device auto frequency detection
E8
BT_CLK_REQ_OUT
F4
GPIO0_WL_HOST_WAKE
BT/WLAN reference clock request out, active high, need an
external 100kohm pull-down resistor to ensure the signal is
deasserted when BCM43330 powers up.
Signal from WLAN device to awake the host.
F6
FM_I2S_DO
I/O
I2S data output
F7
FM_I2S_DI
I/O
I2S data input
F8
FM_I2S_SCK
I2S reference clock
F9
FM_I2S_WS
I/O
I2S word select
G3
BT_PCM_IN
I/O
PCM data input
5GHz RF pin (WLAN 5GHz Tx/Rx)
2.4GHz RF pin (for WLAN2.4GHz Tx/Rx and BT Tx/Rx)
UART clear to Send, active low (for BT data)
UART request to Send, active low (for BT data)
UART signal input
UART signal output
FM analog audio output channel L (Not used)
FM analog audio output channel R (Not used)
Main power supply for the module, (3.3V+/-10%, together with pin
G8 to supply the module), please consider reserve for 300mA
current consumption, need place a 4.7uF decoupling CAP close to
this pin on main board.
Main power supply for the module, (3.3V+/-10%, together with pin
D2 to supply the module ), please consider reserve for 300mA
current consumption, need place a 4.7uF decoupling CAP close to
this pin on main board.
BT wake up, signal from the host to module to require BT device
wake-up or remain awake
Signal from module to host to require Host wake up
COMPANY CONFIDENTIAL
G4
H2
H3
BT_PCM_OUT
BT_PCM_CLK
BT_PCM_SYNC
I/O
I/O
PCM data output
PCM Clock
PCM sync signal
G6
SDIO_DATA3
I/O
SDIO data line 3
H5
SDIO_DATA2
I/O
SDIO data line 2
H6
SDIO_DATA0
I/O
SDIO data line 0
H7
SDIO_CMD
I/O
SDIO command line
H8
G7
SDIO_CLK
BT_REG_ON
G9
WL_REG_ON
H4
VIO_1.8V
SDIO clock
Power up or power down BCM4330 internal regulators used for BT,
Logic high level: 1.08V~3.6V
Need pull-up via a 10Kohm resistor or less (internal 200K
pull-down)
Power up or power down BCm4330 internal regulators used for
WLAN, this pin is also a low active reset for WLAN only (not for BT)
Logic high level: 1.08V~3.6V
Need pull-up via a 10Kohm resistor or less (inertnal 200K
pull-down)
VDDIO for BCM4330 I/O supply, range from 1.2V~2.9V, select 1.8V
here, please consider reserve for 100mA current consumption
Ground
A2,A3,A4,A5,A6, GND
A7,A8,A9,B2,B3,
B4,B5,B6,B7,B8,
C1,C2,C9,D1,D3
,D4,D5,E1,E2,E3
,E4,E5,F1,F2,F3,
F5,G1,G2,G5,H1
4. Mechanical Drawing
* The on board RF connector and plug mating height would be 1.2mm max.
COMPANY CONFIDENTIAL
* The holes represent the LGA pins on bottom side of the module.
COMPANY CONFIDENTIAL
5. Peripheral Schematic Reference Design
COMPANY CONFIDENTIAL
6. PCB Layout
6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.6+/-0.1mm
Stack-up
7. Software Requirement
 Nvram file for RF parameters configuration.
 If use dual-band WLAN, platform need to load dual-band firmware and install dual-band driver.
 If use single-band WLAN, platform need to load single-band firmware and install single-band driver.
8. Regulatory
TBD
9. Environmental Requirements and Specifications
9.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0℃ to +70℃.
9.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when
restored to the operating temperature when exposed to storage temperature in the range of -10℃ to +85℃.
9.2 PCB bending
The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly
customer.
COMPANY CONFIDENTIAL
9.3 Handling environment
9.3.1. ESD
The product ESD immunity is HBM>= +/- 450 (V), MM >= +/- 100 (V). Please handle it under ESD protection
environment.
Note: HBM: Human Body Model/MM: Mechanical Model
This device is ESD sensitive device, it must be protected at all times from ESD, industry-standard ESD
precautions should be used at all times.
9.3.2. Terminals
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
9.3.3. Falling
It will cause damage on the mounted components when the product is falling or receiving drop shock. It may
cause the product mal-function.
9.4 Storage Condition
9.4.1 Moisture barrier bag before opened
Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for
the dry packed product shall be a 12 months from the bag seal date.
9.4.2. Moisture barrier bag open
Humidity indicator cards must be blue, <30%.
9.5 Baking Condition
Products require baking before mounting if
a) humidity indicator cards reads >30%
b) temp <30 degree C, humidity < 70% RH, over 96 hours
Baking condition: 90 degree C, 12-22 hours
Baking times: 1 time
9.6 Soldering and reflow condition
1) Heating method
Conventional Convection or IR/convection
2) Temperature measurement
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3) Solder paste composition
Sn/3.0Ag/0.5Cu
4) Allowable reflow soldering times: 2 times based on the below reflow soldering profile
5) Temperature profile
Reflow soldering shall be done according to the below temperature profile.
6) Peak temp: 245 degree C
COMPANY CONFIDENTIAL
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)

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