Broadcom BRCM1067 802.11 abgn WLAN+Bluetooth Card User Manual
Broadcom Corporation 802.11 abgn WLAN+Bluetooth Card
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User Manual
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| Document ID | 1756201 |
| Application ID | zovHs57kvlZro0sRiOUM8w== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 34.71kB (433909 bits) |
| Date Submitted | 2012-07-31 00:00:00 |
| Date Available | 2013-01-28 00:00:00 |
| Creation Date | 2017-10-30 20:00:08 |
| Producing Software | GPL Ghostscript 9.18 |
| Document Lastmod | 2017-10-30 20:00:08 |
| Document Title | Microsoft Word - T77H360_BCM4330__user manual_RemoveFM.doc |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | VeraHsu |
COMPANY CONFIDENTIAL BCM4330 WLAN+BT Combo Module (Foxconn T77H360.00) Product Specification Rev 1.9 Prepared by Gallon Tao Reviewed by Robin-Xu Approved by Chang-Fu Lin COMPANY CONFIDENTIAL Index 1. REVISION HISTORY...................................................................................................................................................3 2. INTRODUCTION ..........................................................................................................................................................4 2.1 SCOPE ......................................................................................................................................................................4 2.2 FUNCTION .................................................................................................................................................................4 3. PRODUCT SPECIFICATION .....................................................................................................................................5 3.1 HARDWARE CHARACTERISTIC .................................................................................................................................5 3.2 HARDWARE ARCHITECTURE ....................................................................................................................................5 3.3 ELECTRICAL SPECIFICATION ....................................................................................................................................6 3.4 WLAN RF CHARACTERISTICS ................................................................................................................................7 3.4.1 IEEE802.11b ..................................................................................................................................................7 3.4.2 IEEE802.11g ..................................................................................................................................................8 3.4.3 IEEE802.11n HT20(2.4GHz) .......................................................................................................................9 3.4.4 IEEE802.11a ................................................................................................................................................10 3.4.5 IEEE802.11n HT20 (5GHz) .......................................................................................................................11 3.5 BLUETOOTH STANDARD SPECIFICATIONS .............................................................................................................11 3.6 LGA PIN DEFINITION .............................................................................................................................................14 4. MECHANICAL DRAWING .......................................................................................................................................16 5. PERIPHERAL SCHEMATIC REFERENCE DESIGN ..........................................................................................18 6. PCB LAYOUT.............................................................................................................................................................19 7. SOFTWARE REQUIREMENT .................................................................................................................................19 8. REGULATORY...........................................................................................................................................................19 9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.......................................................................19 9.1 TEMPERATURE .......................................................................................................................................................19 9.2 PCB BENDING ........................................................................................................................................................19 9.3 HANDLING ENVIRONMENT.......................................................................................................................................20 9.4 STORAGE CONDITION.............................................................................................................................................20 9.5 BAKING CONDITION ................................................................................................................................................20 9.6 SOLDERING AND REFLOW CONDITION ....................................................................................................................20 COMPANY CONFIDENTIAL 1. Revision History Date Change Note REV Note 2011-10-12 Initial release 1.0 2011-10-13 Update module mechanical 2D drawing in section 5 1.1 2011-11-25 1. Update product specification 2. Add description for 5G enable and disable 3. FM is optional in this product. 1.2 2011-11-30 1. Update product specification to add product IDs 2. Add mother board and test jig reference schematic 3. Update Environmental Requirements and Specifications: 1) Add handling environment; 2) Add baking condition; 3) Add soldering and reflow condition 1.3 2011-12-14 1. Update mother board and test jig reference design schematic: Add remark on the schematic. 1.4 2011-12-26 1. Update section 3: product specification 1.5 2012-02-11 2012-03-16 2012-03-17 2012-03-17 1. Update section 3.3, Current consumption 2. Update section 3.4, 11bg Tx emission result for EVT3 modules 3. Update section 3.5, complete Bluetooth specification 1.6 4. Update section 4, module mechanical drawing since shielding cover changed. 1. Update section 3.4 for 2.4GHz TX emission for EVT4 modules 2. Update section 3.4 for add RX emission 3. Update section 3.4 for 11a/11an target power for middle and 1.7 high band 4. Update section 3.4 for 11a/11an power limit 1. Update 5GHz LO leakage level and RX SEN 2. Update module dimension 3. Update module block-diagram 4. Update section 4 for mechanical drawing 1. Update 5GHz LO leakage level and RX SEN 2. Update module dimension 3. Update module block-diagram 4. Update section 4 for mechanical drawing 1.8 1.8 COMPANY CONFIDENTIAL 2. Introduction Project Name: 802.11abgn (1X1) + BT4.0 combo module This documentation describes the product specification of the WLAN+BT combo Module. WLAN is Compliant with IEEE Std. 802.11b-1999, IEEE Std. 802.11g-2003 and IEEE Std. 802.11n-2009, Bluetooth is compliant with Bluetooth 4.0+HS. It is a confidential document of Foxconn. * For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and driver to enable or disable 5GHz 2.1 Scope This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow user to switch to different vendors’ Access Points through the wireless networks and to prevent from eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS7(HT20) with PHY data rate to 72Mbps. Bluetooth is compliant to Core Specification version 4.0 2.2 Function Single stream 802.11n support for 20MHz channels provide PHY layer rates up to 72Mbps. Bluetooth supports Class 1.5 and Class 2 output power. Provides a small form factor solution and ultra low power consumption to support low cost requirement. Host interface supports: WLAN: SDIO; BT data: UART BT digital audio: PCM COMPANY CONFIDENTIAL 3. Product Specification 3.1 Hardware Characteristic Form factor Host Interface PCB RF connector 14mmx13mm LGA WLAN: SDIO BT: UART for data, PCM for Audio FM: UART for data, I2S for Audio 6-layer HDI design Two MHF RF connectors 3.2 Hardware Architecture The WLAN+BT combo module is designed base on BROADCOM BCM4330 chip, the Broadcom BCM4330 is a highly integrated single chip solution for single stream dual-band WLAN and BT4.0, use two RF connector for 2.4GHz and 5GHz RF each, use a chip BPF for 2.4GHz and external LNA for 5GHz, a 26MHz crystal is used for reference clock generation, see the block diagram as below: COMPANY CONFIDENTIAL 3.3 Electrical Specification Absolute Maximum Ratings These specification indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Rating DC supply voltage for the device VDDIO Symbol VBAT_3.3V VIO Value -0.5 to +6.0 -0.5 to 2.98 Unit Recommended Operating Condition Element Value Symbol Minimum DC supply voltage for the device VDDIO for WL_VDDIO and BT_VDDIO VBAT_3. 3V VIO_1.8V Typical Unit Maximum 2.3 3.3 4.8 1.2 1.8 2.9 Function operation is not guaranteed outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the device. Power-Up Sequence Timing Current Consumption Typical Current@3.3V Active WLAN: Mode Tx Rx 11b@15.5dBm 180mA 105mA 11g @14.5dBm 150mA 100mA 11n(2.4G)@13.5dBm 160mA 100mA COMPANY CONFIDENTIAL 11a @13dBm 200mA 135mA 11n(5G) @12dBm 220mA 138mA BT: 26mA @0dBm(CLASS II) 48mA @7dBm(CLASS1.5) 22mA WiFi&BT Idle (RF on, WiFi no association; BT no inquiry, scan/page scan) 40mA WiFi Associated with AP; BT Idle 90mA Product ID Definition Vendor ID: 0x14e4 Device ID: 0x4360 3.4 WLAN RF Characteristics 3.4.1 IEEE802.11b Items Contents Specification Mode Channel Data rate -TX Characteristics1. Power Levels Target Power 2. Spectrum Mask @16.5dBm (Max.) 1) fc-33MHz ＜ f ＜ fc-22MHz 2) fc-22MHz ＜ f ＜ fc-11MHz 3) fc+11MHz ＜ f ＜ fc+22MHz 4) fc+22MHz ＜ f ＜ fc+33MHz 3. Frequency Error 4 Modulation Accuracy(EVM)@16.5dBm (Max.) 1) 1Mbps 2) 2Mbps 3) 5.5Mbps 4) 11Mbps -RX Characteristics5. Minimum Input Level Sensitivity 1) 11Mbps (FER≦8%) 6. Maximum Input Level (FER≦8%) 1) 1,2Mbps (FER≦8%) 2) 5.5,11Mbps (FER≦8%) -Spurious Emission(TX)(30MHz- 1GHz) (1GHz – 12.75GHz) -Spurious Emission(RX)(30MHz- 1GHz) Min. IEEE802.11b DSSS / CCK CH1 to CH13,CH14 1, 2, 5.5, 11Mbps Typ. Max. Unit 13.5 15.5 16.5 dBm -15 -50 -30 -30 -50 +15 dBr dBr dBr dBr ppm Min. Typ. -10 -10 -10 -10 Max. dB dB dB dB Unit -86 -82 dBm -4 -10 Min. Min. Typ. -46.5 * Typ. Max. -41.3 -41.3 Max. -57 dBm dBm Unit dBm Unit dBm COMPANY CONFIDENTIAL (1GHz – 12.75GHz) -54 *This spurious is 3rd harmonic, the worst case for 2.4G Tx, and the harmonic was degrade by add 0603 BPF and notch file when transmit max. output power on 16.5dBm (1Mbps). 3.4.2 IEEE802.11g Items Contents Specification Mode Channel Data rate - TX Characteristics 1. Power Levels 1) Target Power@6Mbps 2) Target Power@9Mbps 3) Target Power@12Mbps 4) Target Power@18Mbps 5) Target Power@24Mbps 6) Target Power@36Mbps 7) Target Power@48Mbps 8) Target Power@54Mbps 2. Spectrum Mask @15.5dBm 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency Error 4. Constellation Error(EVM)@15.5dBm 1) 6Mbps 2) 9Mbps 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps - RX Characteristics 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) 2) 9Mbps (PER < 10%) 3) 12Mbps (PER < 10%) 4) 18Mbps (PER < 10%) 5) 24Mbps (PER < 10%) 6) 36Mbps (PER < 10%) 7) 48Mbps (PER < 10%) 8) 54Mbps (PER < 10%) 6. Maximum Input Level (PER < 10%) -Spurious Emission(TX)(30MHz- 1GHz) (1GHz – 12.75GHz) -Spurious Emission(RX)(30MHz- 1GHz) (1GHz – 12.75GHz) Min. IEEE802.11g OFDM CH1 to CH13 6, 9, 12, 18, 24, 36, 48, 54Mbps Typ. Max. Unit 12.5 12.5 12.5 12.5 12.5 12.5 12.5 12.5 14.5 14.5 14.5 14.5 14.5 14.5 14.5 14.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 dBm dBm dBm dBm dBm dBm dBm dBm -20 -28 dBr dBr -15 -40 +15 dBr ppm Min. Typ. -5 -8 -10 -13 -16 -19 -22 -25 Max. dB dB dB dB dB dB dB dB Unit -15 Min. Min. -89 -87 -85 -83 -80 -78 -76 -74 Typ. -58 Typ. -86 -83 -80 -78 -75 -73 -71 -69 Max. -41.3 -41.3 Max. -57 -54 dBm dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm dBm Unit dBm COMPANY CONFIDENTIAL 3.4.3 IEEE802.11n HT20(2.4GHz) Items Specification Mode Channel Data rate (MCS index) - TX Characteristics 1. PowerLevels 1) Target Power@MCS0 2) Target Power@ MCS1 3) Target Power@ MCS2 4) Target Power@ MCS3 5) Target Power@ MCS4 6) Target Power@ MCS5 7) Target Power@ MCS6 8) Target Power@ MCS7 2. Spectrum Mask @14.5dBm 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency Error 4. Constellation Error(EVM)@14.5dBm 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 - RX Characteristics 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) 2) MCS1 (PER < 10%) 3) MCS2 (PER < 10%) 4) MCS3 (PER < 10%) 5) MCS4 (PER < 10%) 6) MCS5 (PER < 10%) 7) MCS6 (PER < 10%) 8) MCS7 (PER < 10%) 6. Maximum Input Level (PER < 10%) -Spurious Emission(TX)FCC(30MHz- 1GHz) FCC Average(1GHz – 12.75GHz) -Spurious Emission(RX)(30MHz- 1GHz) (1GHz – 12.75GHz) Contents IEEE802.11n HT20 OFDM CH1 to CH13 MCS0～MCS7 Min. Typ. Max. Unit 11.5 11.5 11.5 11.5 11.5 11.5 11.5 11.5 13.5 13.5 13.5 13.5 13.5 13.5 13.5 13.5 14.5 14.5 14.5 14.5 14.5 14.5 14.5 14.5 dBm dBm dBm dBm dBm dBm dBm dBm -15 -20 -28 -45 +15 dBr dBr dBr ppm Min. Typ. -5 -10 -13 -16 -19 -22 -25 -28 Max. dB dB dB dB dB dB dB dB Unit -15 Min. Min. -88 -85 -83 -80 -78 -76 -74 -71 Typ. -60 Typ. -84 -81 -79 -76 -74 -72 -70 -67 Max. -41.3 -41.3 Max. -57 -54 dBm dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm Unit dBm COMPANY CONFIDENTIAL 3.4.4 IEEE802.11a Items Contents Specification Mode Channel Data rate - TX Characteristics 1. Power Levels Low Band(5.15GHz~5.35GHz) Middle Band(5.500GHz～5.700GHz) Upper Band(5.745GHz～5.825GHz) 2. Spectrum Mask @ Type power@14dBm 1) at fc +/- 11MHz Min. 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency Error 4. Constellation Error(EVM)@ Type power@14dBm 1) 6Mbps 2) 9Mbps 3) 12Mbps 4) 18Mbps 5) 24Mbps 6) 36Mbps 7) 48Mbps 8) 54Mbps - RX Characteristics 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) 2) 9Mbps (PER < 10%) 3) 12Mbps (PER < 10%) 4) 18Mbps (PER < 10%) 5) 24Mbps (PER < 10%) 6) 36Mbps (PER < 10%) 7) 48Mbps (PER < 10%) IEEE802.11a OFDM lower band:5.15GHz～5.35GHz middle band:5.500GHz～5.700GHz upper band:5.745GHz～5.825GHz 6, 9, 12, 18, 24, 36, 48, 54Mbps Typ. Max. Unit 11 11 11 13 13 13 14 14 14 dBm dBm dBm -20 dBr -15 -28 -40 +15 dBr dBr ppm Min. Typ. -5 -8 -10 -13 -16 -19 -22 -25 Max. dB dB dB dB dB dB dB dB Unit -91 -89 -87 -85 -82 -80 -78 -87 -85 -83 -81 -78 -76 -74 dBm dBm dBm dBm dBm dBm dBm 8) 54Mbps (PER < 10%) 6. Maximum Input Level (PER < 10%) -Spurious Emission(TX)FCC(30MHz- 1GHz) -15 Min. -76 Typ. -72 Max. -41.3 dBm dBm Unit dBm FCC Average(1GHz – 12.75GHz) -Spurious Emission(RX)(30MHz- 1GHz) (1GHz – 12.75GHz)* Min. Typ. -41.3 Max. -57 -54 dBm Unit -58 * the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit. dBm COMPANY CONFIDENTIAL 3.4.5 IEEE802.11n HT20 (5GHz) Items Specification Mode Channel Data rate (MCS index) - TX Characteristics 1. Power Levels Low Band(5.15GHz~5.35GHz) Middle Band(5.500GHz～5.700GHz) Upper Band(5.745GHz～5.825GHz) 2. Spectrum Mask @Type power@13dBm 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency Error 4. Constellation Error(EVM)@Type power@13dBm 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 - RX Characteristics 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) 2) MCS1 (PER < 10%) 3) MCS2 (PER < 10%) 4) MCS3 (PER < 10%) 5) MCS4 (PER < 10%) 6) MCS5 (PER < 10%) 7) MCS6 (PER < 10%) 8) MCS7 (PER < 10%) 6. Maximum Input Level (PER < 10%) -Spurious Emission(TX)FCC(30MHz- 1GHz) Contents IEEE802.11n HT20 OFDM lower band:5.15GHz～5.35GHz middle band:5.500GHz～5.700GHz upper band:5.745GHz～5.825GHz MCS0～MCS7 Min. Typ. Max. FCC Average(1GHz – 12.75GHz) -Spurious Emission(RX)(30MHz- 1GHz) (1GHz – 12.75GHz)* 10 10 10 12 12 12 13 13 13 dBm dBm dBm -15 -20 -28 -45 +15 dBr dBr dBr ppm Min. Typ. -5 -10 -13 -16 -19 -22 -25 -28 Max. dB dB dB dB dB dB dB dB Unit -20 Min. -91 -88 -85 -82 -79 -77 -75 -73 Typ. -87 -84 -81 -78 -75 -73 -71 -69 Max. -41.3 dBm dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm Min. Typ. -41.3 Max. -57 -54 dBm Unit -58 * the LO leakage is decreased to under -54dBm since adding eLNA, can meet KCC regulatory limit. 3.5 Bluetooth Standard Specifications Bluetooth Core Specification version 4.0: Host interface: UART, baud rates up to 4Mbps Support all Bluetooth 4.0+HS packet types. Operating frequency range: 2400MHz ~2483.5MHz Modulation type: Basic rate 1Mbps: GFSK, Enhanced data rate 2Mbps: DQPSK Unit dBm COMPANY CONFIDENTIAL Enhanced data rate 3Mbps: 8DPSK Items Contents BT4.0+EDR Specification Frequency range Data rate - TX Characteristics 1. Power Levels BT Output Power 2.4GHz~2.4835GHz 1Mbps, 2Mbps, 3Mbps Min. Typ. Max. Unit 10 dBm -75 75 kHz DH1 DH3 -20 -20 -3 20 20 kHz/50us kHz/50us DH5 Average Drift -20 20 kHz/50us DH1 -25 -1 25 DH3 -40 40 kHz kHz DH5 -40 40 F1avg 140 153 175 F2max 115 133 kHz kHz F1/F2 Ratio 5. EDR Relative Transmit Power 0.8 0.93 2Mbps: P[DQPSK]-P[GFSK] -4 0.25 dB 3Mbps: P[8DPSK]-P[GFSK] -4 0.25 Initial Frequency Error: ωi -75 75 Frequency Error: ω0 Block Frequency Error: ωi + ω0 -10 -75 10 75 RMS DEVM 0.2 Peak DEVM 0.35 99% 100% Initial Frequency Error: ωi -75 75 Frequency Error: ω0 -10 0.9 10 Block Frequency Error: ωi + ω0 -75 6.3 75 RMS DEVM 0.13 Peak DEVM 0.25 99% 100% 30MHz- 1GHz -41.3 dBm 1GHz – 12.75GHz -51 -41.3 dBm 2. Initial Carrier Frequency Tolerance Average Offset 3. Carrier Drift Drift Rate kHz 4. Modulation Characteristic dB 6. EDR Carrier Frequency Stability and Modulation Accuracy 2Mbps: π/4 DQPSK 99% DEVM (% Symbols <=0.3) kHz kHz kHz 3Mbps: 8DPSK 99% DEVM (% Symbols <=0.13) kHz kHz kHz 7. Tx Spurious Emission COMPANY CONFIDENTIAL Items Specification Frequency range Data rate - RX Characteristics 1. Minimum Input Level Sensitivity GFSK (1Mbps) π/4 DQPSK (2Mbps) Contents BT4.0+EDR 2.4GHz~2.4835GHz 1Mbps, 2Mbps, 3Mbps Min. Typ. Max. Unit -90 -92 -83 -84 dBm dBm -86 -77 dBm GFSK (1Mbps) -20 dBm π/4 DQPSK (2Mbps) -20 dBm 8DPSK (3Mbps) -20 dBm 30MHz- 1GHz -57 dBm 1GHz – 12.75GHz -54 dBm 8DPSK (3Mbps) 2. Maximum Input Level 3. Rx Emission COMPANY CONFIDENTIAL 3.6 LGA Pin Definition TOP View COMPANY CONFIDENTIAL Pin Pin Name No. Type Description B1 B9 C3 C4 C5 C6 C7 C8 D2 RF_A_LGA RF_G_LGA UART_CTS_N UART_RTS_N UART_RXD UART_TXD FM_AUDIO_L FM_AUDIO_R VBAT_3.3V_L I/O I/O G8 VBAT_3.3V_R D6 BT_GPIO0_BTWAKE D7 BT_GPIO1_HOSTWAKE D8 BT_RST_N D9 FM_TX_LGA External reset for BT, active low, please pull-up on host side (not left floating) FM Radio output (Not used) E9 FM_RX_LGA FM Radio input (Not used) E6 SDIO_SPI_SEL E7 LPO Host interface mode selection, internal pull down, work with SDIO_DATA_1 and SDIO_DATA_2 together to select the host interface 32.768kHz LPO clock, need for device auto frequency detection E8 BT_CLK_REQ_OUT F4 GPIO0_WL_HOST_WAKE BT/WLAN reference clock request out, active high, need an external 100kohm pull-down resistor to ensure the signal is deasserted when BCM43330 powers up. Signal from WLAN device to awake the host. F6 FM_I2S_DO I/O I2S data output F7 FM_I2S_DI I/O I2S data input F8 FM_I2S_SCK I2S reference clock F9 FM_I2S_WS I/O I2S word select G3 BT_PCM_IN I/O PCM data input 5GHz RF pin (WLAN 5GHz Tx/Rx) 2.4GHz RF pin (for WLAN2.4GHz Tx/Rx and BT Tx/Rx) UART clear to Send, active low (for BT data) UART request to Send, active low (for BT data) UART signal input UART signal output FM analog audio output channel L (Not used) FM analog audio output channel R (Not used) Main power supply for the module, (3.3V+/-10%, together with pin G8 to supply the module), please consider reserve for 300mA current consumption, need place a 4.7uF decoupling CAP close to this pin on main board. Main power supply for the module, (3.3V+/-10%, together with pin D2 to supply the module ), please consider reserve for 300mA current consumption, need place a 4.7uF decoupling CAP close to this pin on main board. BT wake up, signal from the host to module to require BT device wake-up or remain awake Signal from module to host to require Host wake up COMPANY CONFIDENTIAL G4 H2 H3 BT_PCM_OUT BT_PCM_CLK BT_PCM_SYNC I/O I/O PCM data output PCM Clock PCM sync signal G6 SDIO_DATA3 I/O SDIO data line 3 H5 SDIO_DATA2 I/O SDIO data line 2 H6 SDIO_DATA0 I/O SDIO data line 0 H7 SDIO_CMD I/O SDIO command line H8 G7 SDIO_CLK BT_REG_ON G9 WL_REG_ON H4 VIO_1.8V SDIO clock Power up or power down BCM4330 internal regulators used for BT, Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (internal 200K pull-down) Power up or power down BCm4330 internal regulators used for WLAN, this pin is also a low active reset for WLAN only (not for BT) Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (inertnal 200K pull-down) VDDIO for BCM4330 I/O supply, range from 1.2V~2.9V, select 1.8V here, please consider reserve for 100mA current consumption Ground A2,A3,A4,A5,A6, GND A7,A8,A9,B2,B3, B4,B5,B6,B7,B8, C1,C2,C9,D1,D3 ,D4,D5,E1,E2,E3 ,E4,E5,F1,F2,F3, F5,G1,G2,G5,H1 4. Mechanical Drawing * The on board RF connector and plug mating height would be 1.2mm max. COMPANY CONFIDENTIAL * The holes represent the LGA pins on bottom side of the module. COMPANY CONFIDENTIAL 5. Peripheral Schematic Reference Design COMPANY CONFIDENTIAL 6. PCB Layout 6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.6+/-0.1mm Stack-up 7. Software Requirement Nvram file for RF parameters configuration. If use dual-band WLAN, platform need to load dual-band firmware and install dual-band driver. If use single-band WLAN, platform need to load single-band firmware and install single-band driver. 8. Regulatory TBD 9. Environmental Requirements and Specifications 9.1 Temperature 9.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0℃ to +70℃. 9.1.2 Non-Operating Temperature Conditions Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -10℃ to +85℃. 9.2 PCB bending The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly customer. COMPANY CONFIDENTIAL 9.3 Handling environment 9.3.1. ESD The product ESD immunity is HBM>= +/- 450 (V), MM >= +/- 100 (V). Please handle it under ESD protection environment. Note: HBM: Human Body Model/MM: Mechanical Model This device is ESD sensitive device, it must be protected at all times from ESD, industry-standard ESD precautions should be used at all times. 9.3.2. Terminals The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering, please do not touch LGA portion by hand. 9.3.3. Falling It will cause damage on the mounted components when the product is falling or receiving drop shock. It may cause the product mal-function. 9.4 Storage Condition 9.4.1 Moisture barrier bag before opened Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. 9.4.2. Moisture barrier bag open Humidity indicator cards must be blue, <30%. 9.5 Baking Condition Products require baking before mounting if a) humidity indicator cards reads >30% b) temp <30 degree C, humidity < 70% RH, over 96 hours Baking condition: 90 degree C, 12-22 hours Baking times: 1 time 9.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method. 3) Solder paste composition Sn/3.0Ag/0.5Cu 4) Allowable reflow soldering times: 2 times based on the below reflow soldering profile 5) Temperature profile Reflow soldering shall be done according to the below temperature profile. 6) Peak temp: 245 degree C COMPANY CONFIDENTIAL Temperature profile for evaluation of solder heat resistance of a component (at solder joint)
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