CHIPSEN BOT-NLE521 BLE Module User Manual BoT nLE512

CHIPSEN. Co., Ltd BLE Module BoT nLE512

User Manual

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BoT-nLE521
Ver 1.0 2018/03/06
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BoT-nLE521
List of Contents
1. General ............................................................................................................................................. 3
1.1 Overview ...................................................................................................................................................................3
1.2 Block Diagram ........................................................................................................................................................3
1.3 Features .....................................................................................................................................................................4
1.4 Application ...............................................................................................................................................................4
1.5 Pin Configuration ..................................................................................................................................................5
1.6 PIN Description ......................................................................................................................................................6
1.7 Dimensions ..............................................................................................................................................................7
1.8 Land Pattern ............................................................................................................................................................8
2. Characteristics ................................................................................................................................ 9
2.1 Electrical Characteristics .....................................................................................................................................9
2.2 RF Characteristics ............................................................................................................................................... 11
3.1 Regulator ............................................................................................................................................................... 12
3.2 32.768KHz Crystal Oscillator .......................................................................................................................... 13
4. Application Schematic ............................................................................................................... 15
5. Antenna ......................................................................................................................................... 16
5.1 Antenna Layout Guide ..................................................................................................................................... 16
6. Certification .................................................................................................................................. 17
6.1 FCC Statement ..................................................................................................................................................... 17
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BoT-nLE521
1. General
1.1 Overview
The BoT-nLE521 module is a cost-effective, low-power, true system-on-chip (SoC) for
Bluetooth Smart (Bluetooth low energy) applications. It enables robust BLE master or slave
nodes to be built with very low total bill-of-material costs. BoT-nLE521 combines an
excellent RF transceiver with an industry-standard enhanced Cortec-M4 CPU, in-system
programmable flash memory, 24kB RAM, and many other powerful supporting features
and peripherals. The BoT-nLE521 is suitable for systems where very low power
Consumption is required. Very low-power sleep modes are available. Short transition times
between operating modes further enable low power consumption.
1.2 Block Diagram
Filter
Radio
Multiprotocol
2.4GHz
Balun
Processor
64 MHz ARM
Cortex-M4 CPU
192kB Flash
with cache
24kB RAM
AHB Lite bus
APB bus
Timers / Counters
Analog I/O
Digital I/O
System Peripherals
Oscillators Power
supply
GPIO
32 MHz
Crystal
Internal
Antenna
&
Matching
Network
PIO
SWDCLK
SWDIO
DCC
DEC4
VDD
RF
INT_ANT
BoT-nLE521 Block Diagram
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BoT-nLE521
1.3 Features
■ Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module.
■ ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz
■ Memory: 192 kB Flash / 24 kB RAM
■ RF Output Power: MAX +4 dBm (-20 ~ 4 dBm)
■ RF Receive Sensitivity: -96 dBm
■ Type 2 near field communication (NFC-A) tag with wakeup-on-field and touch to-pair capabilities
■ Fully automatic LDO and DC/DC regulator system (Used LDO by Default)
■ Temperature Sensor
■ UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces.
■ 12-Bit 200 ksps ADC with - 8 configurable channels with programmable gain
■ Size: 15 mm x 8 mm x 1.8 mm
■ Operating Voltage: 1.7V to 3.6V
■ Operating Temperature: -40 to +85℃
■ RoHS compliant
1.4 Application
■· Computer peripherals and I/O devices
· Mouse
· Keyboard
· Multi-touch trackpad
·■ Interactive entertainment devices
·■ Remote control
· Gaming controller
·■ Beacons
·■ Personal Area Networks
· Health/fitness sensor and monitor devices
· Medical devices
· Key-fobs + wrist watches
■· Remote control toys
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BoT-nLE521
1.5 Pin Configuration
11
2
12
3
4
5
6
7
8
9
10
1613 17 1918 20
30
29
28
27
26
25
24
23
22
21
3132
33
14 15
1
GND
GND
GND
GND
P0.28/AIN4
P0.25
P0.30/AIN6
DCC
DEC4
VDD_nRF
SWDIO
GND
GND
SWDCLK
P0.20
P0.21/RESET
P0.18
P0.15
P0.16
P0.14
GND
P0.00/XL1
P0.01/XL2
P0.04/AIN2
P0.05/AIN3
P0.06
P0.09
P0.10
P0.12
GND
ANT
RF
GND
TOP VIEW
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BoT-nLE521
1.6 PIN Description
Pin Name
Pin Function
Description
GND
GROUND
Ground Pin.
GND
GROUND
Ground Pin.
GND
GROUND
Ground Pin.
GND
GROUND
Ground Pin.
P0.25
DIGITAL I/O
General purpose I/O pin.
P0.28
DIGITAL I/O
General purpose I/O pin.
AIN4
ANALOG INPUT
SAADC/COMP input
P0.30
DIGITAL I/O
General purpose I/O pin.
AIN6
ANALOG INPUT
COMP input
DEC4
POWER
1.3 V regulator supply decoupling Input from DC/DC
converter. Output from 1.3 V LDO
DCC
POWER
DC/DC regulator output
VDD_nRF
POWER
Power supply pin.
GND
GROUND
Ground Pin.
P0.00
DIGITAL I/O
General purpose I/O pin.
XL1
ANALOG INPUT
Connection for 32.768 kHz crystal (LFXO)
P0.01
DIGITAL I/O
General purpose I/O pin.
XL2
ANALOG INPUT
Connection for 32.768 kHz crystal (LFXO)
P0.04
DIGITAL I/O
General purpose I/O pin.
AIN2
ANALOG INPUT
SAADC/COMP input
P0.05
DIGITAL I/O
General purpose I/O pin.
AIN3
ANALOG INPUT
SAADC/COMP input
P0.06
DIGITAL I/O
General purpose I/O pin.
RXD
DIGITAL INPUT
UART RXD
P0.09
DIGITAL I/O
General purpose I/O pin.
TXD
DIGITAL OUTPUT
UART TXD
P0.10
DIGITAL I/O
General purpose I/O pin.
CTS
DIGITAL OUTPUT
UART CTS
P0.12
DIGITAL I/O
General purpose I/O pin.
RTS
DIGITAL INPUT
UART RTS
GND
GROUND
Ground Pin.
P0.14
DIGITAL I/O
General purpose I/O pin.
P0.15
DIGITAL I/O
General purpose I/O pin.
P0.16
DIGITAL I/O
General purpose I/O pin.
P0.18
DIGITAL I/O
General purpose I/O pin.
P0.20
DIGITAL I/O
General purpose I/O pin.
P0.21
DIGITAL I/O
General purpose I/O pin.
RESET
nRESET
Configurable as system RESET pin.
SWDCLK
DIGITAL INPUT
Serial Wire Debug clock input for debug and programming
SWDIO
DIGITAL I/O
Serial Wire Debug I/O for debug and programming
GND
GROUND
Ground Pin.
GND
GROUND
Ground Pin.
RF
RF IN / OUT PORT
Bluetooth 50Ω transmitter output / receiver input
ANT
INTERNAL
ANTENNA IN / OUT
Internal antenna. It should be connected to Pin 32 RF for
normal operation.
GND
GROUND
Ground Pin.
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BoT-nLE521
1.7 Dimensions
11
2
12
8.0mm
4.0
3
4
5
6
7
8
9
10
0.8
1613 17 1918 20
30
29
28
27
26
25
24
23
22
21
3132
0.8
0.35
11.7mm
33
3.45
0.6
3.0 3.0
0.8
0.6
0.5 0.8
14 15
0.35
0.3 0.3 0.3 0.3
0.825
0.5
0.4
3.3mm
0.8 0.5
1
0.5
0.5
0.5
0.5
0.5
2.0
2.0
0.2
0.20
15.0mm
0.3
TOP VIEW
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BoT-nLE521
2
12
4.0
3
4
5
6
7
8
9
0.8
1613 17 1918 20
30
29
28
27
26
25
24
23
22
21
3132
0.8
11.7mm
3.45
0.4
3.0 3.0
0.8
0.4
0.5 0.8
14 15
0.35
0.3 0.3 0.3 0.3
0.825
0.50
0.4
3.3mm
0.8 0.5
1
0.5
0.7
0.5
0.9
1.2
33
2.0
2.0
0.2
0.2
8.0mm
15.0mm
0.3
0.35
10
0.3
1.2
11
0.3
6.2
4.0
0.3
1.8 Land Pattern
Land Pattern (TOP VIEW)
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BoT-nLE521
2. Characteristics
2.1 Electrical Characteristics
Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Units
VDD
-0.3
+3.9
V
GND
0
V
VI/O, VDD≤3.6V
-0.3
VDD + 0.3
V
VI/O, VDD >3.6V
-0.3
+3.9
V
Storage temperature
-40
+125
°C
Radio
ra
RF Input Level
10
dBm
MSL
Moisture Sensitivity Level
2
ESD HBM
Human Body Model
4
kV
ESD CDM
Charged Device Model
1000
V
Endurance
Flash Memory Endurance
10000
write/erase
cycles
Retention
Flash Memory Retention
10 years
At 40 °C
Recommended Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Units
VDD
LDO Regulator Operation (Default Mode)
1.7
3.0
3.6
V
VDD
DC/DC Regulator Oprtation
2.1
3.0
3.6
V
tR_VDD
Supply rise time (0V to 1.7V)
60
ms
TA
Operation temperature
-40
25
85
°C
DC Characteristics
Symbol
Parameter (condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.7 X VDD
VDD
V
VIL
Input low voltage
VSS
0.3 X VDD
V
VOH,SD
Output high voltage, standard drive, 0.5 mA, VDD ≥1.7
VDD-0.4
VDD
V
VOH,HDH
Output high voltage, high drive, 5 mA, VDD ≥ 2.7 V
VDD-0.4
VDD
V
VOH,HDL
Output high voltage, high drive, 3 mA, VDD ≥ 1.7 V
VDD-0.4
VDD
V
VOL,SD
Output low voltage, standard drive, 0.5 mA, VDD ≥1.7
VSS
VSS +0.4
V
VOL,HDH
Output low voltage, high drive, 5 mA, VDD ≥ 2.7 V
VSS
VSS +0.4
V
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BoT-nLE521
VOL,HDL
Output low voltage, high drive, 3 mA, VDD ≥ 1.7 V
VSS
VSS +0.4
V
RPU
Pull-up resistance
11
13
16
kΩ
RPD
Pull-down resistance
11
13
16
kΩ
ITX,+4dBm,DCDC
TX only run current (DCDC, 3V) PRF=+4 dBm
7.0
mA
ITX,+4dBm
TX only run current PRF=+4 dBm
15.4
mA
IRX,1M,DCDC
RX only run current (DCDC, 3V) 1Msps
4.6
mA
IRX,1M
RX only run current 1Msps
10.0
mA
IRX,2M,DCDC
RX only run current (DCDC, 3V) 2Msps
5.2
mA
IRX,2M
RX only run current 2Msps
11.2
mA
ION_RAMOFF_EVENT
System ON, No RAM retention, Wake on any event
0.6
μA
ION_RAMON_EVENT
System ON, Full 24 kB RAM retention, Wake on any event
0.8
μA
ION_RAMON_POF
System ON, Full 24 kB RAM retention, Wake on any event,
Power fail comparator enabled
0.8
μA
ION_RAMON_GPIOTE
System ON, Full 24 kB RAM retention, Wake on GPIOTE input
(Event mode)
3.3
μA
ION_RAMON_GPIOTEPORT
System ON, Full 24 kB RAM retention, Wake on GPIOTE PORT
event
0.8
μA
ION_RAMON_RTC
System ON, Full 24 kB RAM retention, Wake on RTC
(running from LFRC clock)
1.5
μA
IOFF_RAMOFF_RESET
System OFF, No RAM retention, Wake on reset
0.3
μA
IOFF_RAMON_RESET
System OFF, Full 24 kB RAM retention, Wake on reset
0.5
μA
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BoT-nLE521
2.2 RF Characteristics
Symbol
Description
Min.
Typ.
Max.
Units
fOP
Operating frequencies
2402
2480
MHz
fPLL,PROG,RES
PLL programming resolution
2
kHz
fPLL,CH,SP
PLL channel spacing
1
MHz
fDELTA,BLE,1M
Frequency deviation @ BLE 1Msps
±250
kHz
fDELTA,BLE,2M
Frequency deviation @ BLE 2Msps
±500
kHz
PRF
Maximum output power
0
4
dBm
PRFC
RF power control range
24
dB
PRFCR
RF power accuracy
±4
dB
PRF1,1
1st Adjacent Channel Transmit Power 1 MHz (1 Msps)
-25
dBc
PRF2,1
2nd Adjacent Channel Transmit Power 2 MHz (1 Msps)
-50
dBc
PRF1,2
1st Adjacent Channel Transmit Power 2 MHz (2 Msps)
-25
dBc
PRF2,2
2nd Adjacent Channel Transmit Power 4 MHz (2 Msps)
-50
dBc
PRX,MAX
Maximum received signal strength at < 0.1% PER
0
dBm
PSENS,IT,SP,1M,BLE
Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes
BER=1E-3
-96
dBm
PSENS,IT,SP,2M,BLE
Sensitivity, 2Msps BLE ideal transmitter, <=37 bytes
-93
dBm
RSSIACC
RSSI Accuracy Valid range -90 to -20 dBm
±2
dB
RSSIRESOLUTION
RSSI resolution
1
dB
RSSIPERIOD
Sample period
8
us
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BoT-nLE521
3. Terminal Description
3.1 Regulator
The following internal power regulator alternatives are supported:
• Internal LDO regulator
• Internal DC/DC regulator
The LDO is the default regulator.
Using the DC/DC regulator will reduce current consumption compared to when using the LDO
regulator, but the DC/DC regulator requires an external LC filter to be connected, as shown in Figure.
LDO Regulator Setup
DC/DC Regulator Setup
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BoT-nLE521
3.2 32.768KHz Crystal Oscillator
The BoT-nLE521 external 32.768KHz Crystal does not required for BLE mode
If you choose to use an internal 32.768kHz oscillator, an average of 10uA of current is consumed
compared to an external crystal.
The ANT specification requires ± 50ppm accuracy for a 32.768kHz clock. The internal 32.768kHz
oscillator may not meet specifications.
BoT-nLE521 F/W does not yet support ANT Mode.
Clock control
Circuit diagram of the 32.768 kHz crystal oscillator
The load capacitance (CL) is the total capacitance seen by the crystal across its terminals and is given by:
C1 and C2 are ceramic SMD capacitors connected between each crystal terminal and ground. Cpcb1 and
Cpcb2 are stray capacitances on the PCB.
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BoT-nLE521
32.768 kHz RC oscillator (LFRC)
Symbol
Description
Min.
Typ.
Max.
Units
fNOM_LFRC
Nominal frequency
32.768
kHz
fTOL_LFRC
Frequency tolerance
±2
%
fTOL_CAL_LFRC
Frequency tolerance for LFRC after calibration
±500
ppm
32.768 kHz crystal oscillator (LFXO)
Symbol
Description
Min.
Typ.
Max.
Units
fNOM_LFXO
Crystal frequency
32.768
kHz
fTOL_LFXO_BLE
Frequency tolerance requirement for BLE stack
±250
ppm
fTOL_LFXO_ANT
Frequency tolerance requirement for ANT stack
±50
ppm
CL_LFXO
Load capacitance
12.5
pF
C0_LFXO
Shunt capacitance
2
pF
RS_LFXO
Equivalent series resistance
100
kohm
PD_LFXO
Drive level
1
uW
Cpin
Input capacitance on XL1 and XL2 pads
4
pF
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BoT-nLE512
4. Application Schematic
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BoT-nLE512
5. Antenna
5.1 Antenna Layout Guide
2
12
3
4
5
6
7
8
9
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30
29
28
27
26
25
24
23
22
21
3132
14 15
1
33
10
11
5.0 5.0
In order to use the built-in
antenna on the module, please
connect PAD31 and PAD32 as
short as possible.
3.10
PCB OUTLINE
0.30
Clearance Area
8.0mm
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BoT-nLE512
6. Certification
6.1 FCC Statement
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation. Changes or modifications not expressly approved
by the party responsible for compliance could void the user's authority to operate the equipment.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This
transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the
enclosed module.
This exterior label can use wording such as the following: “Contains Transmitter Module
FCC ID: 2APB6-BoT-nLE521 Or Contains FCC ID: 2APB6-BoT-nLE521
When the module is installed inside another device, the user manual of the host must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described
in the user documentation that comes with the product
Any company of the host device which install this modular with limit modular approval should perform the
test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement,
Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement then the host can be sold
legally.

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