CHIPSEN BOT-NLE521 BLE Module User Manual BoT nLE512
CHIPSEN. Co., Ltd BLE Module BoT nLE512
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User Manual
2018/03/06 Ver 1.0 BoT-nLE521 페이지 1 / 17 BoT-nLE521 List of Contents 1. 2. General ............................................................................................................................................. 3 1.1 Overview ...................................................................................................................................................................3 1.2 Block Diagram ........................................................................................................................................................3 1.3 Features .....................................................................................................................................................................4 1.4 Application ...............................................................................................................................................................4 1.5 Pin Configuration ..................................................................................................................................................5 1.6 PIN Description ......................................................................................................................................................6 1.7 Dimensions ..............................................................................................................................................................7 1.8 Land Pattern ............................................................................................................................................................8 Characteristics ................................................................................................................................ 9 2.1 Electrical Characteristics .....................................................................................................................................9 2.2 RF Characteristics ............................................................................................................................................... 11 3.1 Regulator ............................................................................................................................................................... 12 3.2 32.768KHz Crystal Oscillator .......................................................................................................................... 13 4. Application Schematic ............................................................................................................... 15 5. Antenna ......................................................................................................................................... 16 5.1 6. Antenna Layout Guide ..................................................................................................................................... 16 Certification .................................................................................................................................. 17 6.1 FCC Statement ..................................................................................................................................................... 17 페이지 2 / 17 BoT-nLE521 1. General 1.1 Overview The BoT-nLE521 module is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth Smart (Bluetooth low energy) applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. BoT-nLE521 combines an excellent RF transceiver with an industry-standard enhanced Cortec-M4 CPU, in-system programmable flash memory, 24kB RAM, and many other powerful supporting features and peripherals. The BoT-nLE521 is suitable for systems where very low power Consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. 1.2 Block Diagram RF Filter Balun Radio Multiprotocol 2.4GHz Processor 64 MHz ARM Cortex-M4 CPU 192kB Flash with cache 24kB RAM Internal Antenna Matching Network Oscillators Power supply 32 MHz Crystal APB bus INT_ANT AHB Lite bus Timers / Counters GPIO Analog I/O Digital I/O System Peripherals PIO SWDCLK SWDIO DCC DEC4 VDD BoT-nLE521 Block Diagram 페이지 3 / 17 BoT-nLE521 1.3 Features ■ Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module. ■ ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz ■ Memory: 192 kB Flash / 24 kB RAM ■ RF Output Power: MAX +4 dBm (-20 ~ 4 dBm) ■ RF Receive Sensitivity: -96 dBm ■ Type 2 near field communication (NFC-A) tag with wakeup-on-field and touch to-pair capabilities ■ Fully automatic LDO and DC/DC regulator system (Used LDO by Default) ■ Temperature Sensor ■ UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces. ■ 12-Bit 200 ksps ADC with - 8 configurable channels with programmable gain ■ Size: 15 mm x 8 mm x 1.8 mm ■ Operating Voltage: 1.7V to 3.6V ■ Operating Temperature: -40 to +85℃ ■ RoHS compliant 1.4 Application ■· Computer peripherals and I/O devices · Mouse · Keyboard · Multi-touch trackpad ·■ Interactive entertainment devices ·■ Remote control · Gaming controller ·■ Beacons ·■ Personal Area Networks · Health/fitness sensor and monitor devices · Medical devices · Key-fobs + wrist watches ■· Remote control toys 페이지 4 / 17 BoT-nLE521 Pin Configuration GND GND GND 30 GND 29 GND 28 SWDIO GND 27 SWDCLK P0.25 26 P0.21/RESET P0.28/AIN4 25 P0.20 P0.30/AIN6 24 P0.18 23 P0.16 32 RF ANT 31 33 DEC4 GND 12 13 14 15 16 17 18 19 20 GND 11 P0.12 P0.14 P0.10 21 P0.09 10 P0.06 VDD_nRF P0.05/AIN3 P0.15 P0.04/AIN2 22 P0.01/XL2 P0.00/XL1 DCC GND 1.5 TOP VIEW 페이지 5 / 17 BoT-nLE521 1.6 Pin No. 01 02 03 04 05 PIN Description Pin Name Pin Function GND GND GND GND P0.25 P0.28 AIN4 P0.30 AIN6 GROUND GROUND GROUND GROUND DIGITAL I/O DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT 08 DEC4 POWER 09 10 11 27 28 29 30 31 DCC VDD_nRF GND P0.00 XL1 P0.01 XL2 P0.04 AIN2 P0.05 AIN3 P0.06 RXD P0.09 TXD P0.10 CTS P0.12 RTS GND P0.14 P0.15 P0.16 P0.18 P0.20 P0.21 RESET SWDCLK SWDIO GND GND RF 32 ANT 33 GND 06 07 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 POWER POWER GROUND DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O ANALOG INPUT DIGITAL I/O DIGITAL INPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL OUTPUT DIGITAL I/O DIGITAL INPUT GROUND DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O DIGITAL I/O nRESET DIGITAL INPUT DIGITAL I/O GROUND GROUND RF IN / OUT PORT INTERNAL ANTENNA IN / OUT GROUND Description Ground Pin. Ground Pin. Ground Pin. Ground Pin. General purpose I/O pin. General purpose I/O pin. SAADC/COMP input General purpose I/O pin. COMP input 1.3 V regulator supply decoupling Input from DC/DC converter. Output from 1.3 V LDO DC/DC regulator output Power supply pin. Ground Pin. General purpose I/O pin. Connection for 32.768 kHz crystal (LFXO) General purpose I/O pin. Connection for 32.768 kHz crystal (LFXO) General purpose I/O pin. SAADC/COMP input General purpose I/O pin. SAADC/COMP input General purpose I/O pin. UART RXD General purpose I/O pin. UART TXD General purpose I/O pin. UART CTS General purpose I/O pin. UART RTS Ground Pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. General purpose I/O pin. Configurable as system RESET pin. Serial Wire Debug clock input for debug and programming Serial Wire Debug I/O for debug and programming Ground Pin. Ground Pin. Bluetooth 50Ω transmitter output / receiver input Internal antenna. It should be connected to Pin 32 RF for normal operation. Ground Pin. 페이지 6 / 17 BoT-nLE521 Dimensions 8.0mm 0.5 0.5 0.8 0.5 30 0.4 32 0.8 0.8 0.5 3.3mm 4.0 31 29 28 27 26 25 0.8 0.20 3.0 33 2.0 23 22 3.45 0.5 0.5 0.6 10 0.2 24 3.0 0.3 0.3 12 13 11 0.35 0.825 0.5 14 15 21 16 0.8 TOP VIEW 17 0.3 0.3 18 19 0.6 0.3 2.0 11.7mm 15.0mm 1.7 20 0.5 0.35 페이지 7 / 17 BoT-nLE521 Land Pattern 8.0mm 6.2 4.0 0.5 0.8 0.5 30 0.8 0.4 1.2 32 0.8 0.5 3.3mm 4.0 31 29 0.3 0.8 28 27 26 25 3.0 33 24 3.0 2.0 15.0mm 11.7mm 0.2 0.3 23 1.2 22 3.45 0.9 0.7 0.4 10 0.3 0.3 12 13 14 15 16 17 0.3 18 19 20 0.2 11 21 0.3 0.4 0.3 2.0 0.3 1.8 0.35 0.825 0.5 0.8 0.50 0.35 Land Pattern (TOP VIEW) 페이지 8 / 17 BoT-nLE521 2. Characteristics 2.1 Electrical Characteristics Absolute Maximum Ratings Symbol Parameter VDD Min. Max. Units -0.3 +3.9 GND VI/O, VDD≤3.6V -0.3 VI/O, VDD >3.6V -0.3 +3.9 -40 +125 °C 10 dBm kV 1000 Storage temperature VDD + 0.3 Radio ra MSL RF Input Level ESD HBM Human Body Model ESD CDM Charged Device Model Endurance Flash Memory Endurance 10000 write/erase cycles Retention Flash Memory Retention 10 years At 40 °C Moisture Sensitivity Level Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Units VDD LDO Regulator Operation (Default Mode) 1.7 3.0 3.6 VDD DC/DC Regulator Oprtation 2.1 3.0 3.6 tR_VDD Supply rise time (0V to 1.7V) 60 ms TA Operation temperature 85 °C -40 25 DC Characteristics Symbol Parameter (condition) Min. Typ. Max. Units VIH Input high voltage 0.7 X VDD VDD VIL Input low voltage VSS 0.3 X VDD VOH,SD Output high voltage, standard drive, 0.5 mA, VDD ≥1.7 VDD-0.4 VDD VOH,HDH Output high voltage, high drive, 5 mA, VDD ≥ 2.7 V VDD-0.4 VDD VOH,HDL Output high voltage, high drive, 3 mA, VDD ≥ 1.7 V VDD-0.4 VDD VOL,SD Output low voltage, standard drive, 0.5 mA, VDD ≥1.7 VSS VSS +0.4 VOL,HDH Output low voltage, high drive, 5 mA, VDD ≥ 2.7 V VSS VSS +0.4 페이지 9 / 17 BoT-nLE521 VOL,HDL Output low voltage, high drive, 3 mA, VDD ≥ 1.7 V VSS RPU Pull-up resistance 11 RPD Pull-down resistance 11 ITX,+4dBm,DCDC TX only run current (DCDC, 3V) PRF=+4 dBm 7.0 mA ITX,+4dBm TX only run current PRF=+4 dBm 15.4 mA IRX,1M,DCDC RX only run current (DCDC, 3V) 1Msps 4.6 mA IRX,1M RX only run current 1Msps 10.0 mA IRX,2M,DCDC RX only run current (DCDC, 3V) 2Msps 5.2 mA IRX,2M RX only run current 2Msps 11.2 mA ION_RAMOFF_EVENT System ON, No RAM retention, Wake on any event 0.6 μA ION_RAMON_EVENT System ON, Full 24 kB RAM retention, Wake on any event 0.8 μA 0.8 μA 3.3 μA 0.8 μA ION_RAMON_RTC System ON, Full 24 kB RAM retention, Wake on GPIOTE PORT event System ON, Full 24 kB RAM retention, Wake on RTC (running from LFRC clock) 1.5 μA IOFF_RAMOFF_RESET System OFF, No RAM retention, Wake on reset 0.3 μA IOFF_RAMON_RESET System OFF, Full 24 kB RAM retention, Wake on reset 0.5 μA System ON, Full 24 kB RAM retention, Wake on any event, ION_RAMON_POF Power fail comparator enabled System ON, Full 24 kB RAM retention, Wake on GPIOTE input ION_RAMON_GPIOTE (Event mode) ION_RAMON_GPIOTEPORT VSS +0.4 13 16 kΩ 13 16 kΩ 페이지 10 / 17 BoT-nLE521 2.2 RF Characteristics Symbol Description Min. Typ. Units 2480 MHz fOP Operating frequencies fPLL,PROG,RES PLL programming resolution kHz fPLL,CH,SP PLL channel spacing MHz fDELTA,BLE,1M Frequency deviation @ BLE 1Msps ±250 kHz fDELTA,BLE,2M Frequency deviation @ BLE 2Msps ±500 kHz PRF Maximum output power PRFC RF power control range 24 PRFCR RF power accuracy PRF1,1 1st Adjacent Channel Transmit Power 1 MHz (1 Msps) -25 dBc PRF2,1 2nd Adjacent Channel Transmit Power 2 MHz (1 Msps) -50 dBc PRF1,2 1st Adjacent Channel Transmit Power 2 MHz (2 Msps) -25 dBc PRF2,2 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps) -50 dBc PRX,MAX Maximum received signal strength at < 0.1% PER dBm PSENS,IT,SP,1M,BLE Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes BER=1E-3 -96 dBm PSENS,IT,SP,2M,BLE Sensitivity, 2Msps BLE ideal transmitter, <=37 bytes -93 dBm RSSIACC RSSI Accuracy Valid range -90 to -20 dBm ±2 dB RSSIRESOLUTION RSSI resolution dB RSSIPERIOD us Sample period 2402 Max. dBm dB ±4 dB 페이지 11 / 17 BoT-nLE521 3. Terminal Description 3.1 Regulator The following internal power regulator alternatives are supported: • Internal LDO regulator • Internal DC/DC regulator The LDO is the default regulator. Using the DC/DC regulator will reduce current consumption compared to when using the LDO regulator, but the DC/DC regulator requires an external LC filter to be connected, as shown in Figure. LDO Regulator Setup DC/DC Regulator Setup 페이지 12 / 17 BoT-nLE521 3.2 32.768KHz Crystal Oscillator The BoT-nLE521 external 32.768KHz Crystal does not required for BLE mode If you choose to use an internal 32.768kHz oscillator, an average of 10uA of current is consumed compared to an external crystal. The ANT specification requires ± 50ppm accuracy for a 32.768kHz clock. The internal 32.768kHz oscillator may not meet specifications. BoT-nLE521 F/W does not yet support ANT Mode. Clock control Circuit diagram of the 32.768 kHz crystal oscillator The load capacitance (CL) is the total capacitance seen by the crystal across its terminals and is given by: C1 and C2 are ceramic SMD capacitors connected between each crystal terminal and ground. Cpcb1 and Cpcb2 are stray capacitances on the PCB. 페이지 13 / 17 BoT-nLE521 32.768 kHz RC oscillator (LFRC) Symbol Description Min. Typ. Max. Units fNOM_LFRC Nominal frequency 32.768 kHz fTOL_LFRC Frequency tolerance fTOL_CAL_LFRC Frequency tolerance for LFRC after calibration ±2 ±500 ppm 32.768 kHz crystal oscillator (LFXO) Symbol Description Min. Typ. Max. Units 32.768 kHz Frequency tolerance requirement for BLE stack ±250 ppm Frequency tolerance requirement for ANT stack ±50 fNOM_LFXO Crystal frequency fTOL_LFXO_BLE fTOL_LFXO_ANT ppm Load capacitance 12.5 C0_LFXO Shunt capacitance pF RS_LFXO Equivalent series resistance 100 kohm PD_LFXO Drive level uW Cpin Input capacitance on XL1 and XL2 pads CL_LFXO pF pF 페이지 14 / 17 BoT-nLE512 4. Application Schematic 페이지 15 / 17 BoT-nLE512 5. Antenna 5.1 Antenna Layout Guide 5.0 8.0mm PCB OUTLINE 3.10 0.30 5.0 Clearance Area 30 32 31 29 In order to use the built-in antenna on the module, please connect PAD31 and PAD32 as short as possible. 28 27 26 25 24 33 23 22 10 21 11 12 13 14 15 16 17 18 19 20 페이지 16 / 17 BoT-nLE512 6. Certification 6.1 FCC Statement FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2APB6-BoT-nLE521 Or Contains FCC ID: 2APB6-BoT-nLE521 When the module is installed inside another device, the user manual of the host must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product Any company of the host device which install this modular with limit modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement then the host can be sold legally. 페이지 17 / 17
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