California Eastern Laboratories ZIC2410P0 MeshConnect Module User Manual Revised

California Eastern Laboratories MeshConnect Module Users Manual Revised

Users Manual Revised

Page 1ZICM2410P0MeshConnect™ ModuleDESCRIPTION CEL's MeshConnect™ modules provide a high performance and low cost RF transceiver solution for 2.4 GHz IEEE 802.15.4 / ZigBee data links and wireless networks.CEL's MeshConnect radio module leverages the advanced features of CEL’s ZIC2410 transceiver platform. The ZIC2410 is a true single-chip solution, compliant with ZigBee specica-tions and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The ZIC2410 consists of an RF transceiv-er with baseband modem, a hardwired MAC and an embed-ded 8051 microcontroller with internal Flash memory. The device provides numerous general-purpose I/O pins, periph-eral functions such as timers and UART and is one of the rst devices to provide an embedded Voice CODEC. This device is also ideal for low power applications.Unique in the market, the ZIC2410 offers extended data rates, supporting 500 kbps and 1 Mbps modes of operation. When combined with the voice codec the ZICM2410’s high speed modes offers an excellent voice platform. The high level of integration reduces component count, lowers power consump-tion, and reduces overall system costs. Integrated Transceiver Modules for ZigBee / IEEE 802.15.4Evaluation Kit available: ZICM2410P0-KIT1-1The information in this document is subject to change without notice, please conrm data is currentDocument No: 0007-00-07-00-000 (Issue B)Date Published: May 14, 2009PRELIMINARY DATA SHEETCEL's MeshConnect™ Module PlatformAPPLICATIONSORDERING INFORMATIONPart Number Order Number Supplying FormZICM2410P0 Series MeshConnect™ ModuleZICM2410P0-1 4 mW Output power, PCB Trace AntennaZICM2410P0-1C 4 mW Output power, with U.FL Connector for external antennaZICM2410P0-KIT1-1 Engineering Development Kit• High RF performance - 103dB RF Link Budget - RX Sensitivity: -97 dBm @1.5V - RF TX Power: +6dBm @1.5V• Scalable Data Rate: 250kbps for ZigBee, 500kbps and 1Mbps• Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm)• Voice Codec Support: µ-law/a-law/ADPCM FEATURESHome & Building Automation • Security• HVAC control• Lighting control• ThermostatsIndustrial Controls• Food processing controls• Trafc Management• Sensor Networks• Asset Management• Barcode reader• Patient Monitoring• Glucose monitor• 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3µA)• Integrated PCB trace antenna• 16 RF channels• Over 3000 feet of range• AES 128-bit encryption• FCC, CE and IC certications (pending)• ROHS compliant• 96 kB FLASH Memory• 8 kB SRAM• 8051 compatible single-cycle microcontroller core• 22 GPIO Ports• SPI (Master/Slave) + UART• I2S/PCM Interface with two 128-byte FIFOs • µ-law/a-law/ADPCM Voice Codec• 4-channel 8-bit ADC
MeshConnect™ ModulePage 2MODULE BLOCK DIAGRAM16 MHz 32.768 kHz XTALXTALRadioMicroprocessorMeshConnect ZIC2410 ANTCastellation Edge ConnectorPWR RegMeshConnect™ ModuleDEVELOPMENT KITCEL's MeshConnect Development Kit (ZICM2410P0-KIT1-1) assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. The MeshConnect Development Kit also serves as an invaluable aid in application develop-ment. Through the many interface headers on the board, the user has access to all the MeshConnect module pins enabling easy connection to target systems for application development. The key components of the MeshConnect Development Kits are the CEL’s MeshConnect radio mod-ule and the interface board.The MeshConnect module contains the CEL ZIC2410 transceiver IC, XTALs, Power Regulator and an integrated PCB antenna and connectors for an external antenna (optional). The interface board features a serial com-munication interface, a power management module, and peripherals such as potentiometers, LEDs, and GPIO headers. The Development Kit also contains four AA batteries and two USB cables.For more detail information regarding MeshConnect Development Kit, refer to the ZICM2410P0-KIT1-1 Development Kit User Guide document. (Available at CEL’s website http://www.cel.com)Kit Contents:• Evaluation Boards w/Module (3)• Network Analyzer (1)• USB Cables (2)• Jumpers (10)• AA Batteries (4)• AC Adapter (2)• Technical Information CD (1)Order Number DescriptionZICM2410P0-KIT1-1 Engineering Development Kit
MeshConnect™ ModulePage 3Introduction and OverviewDescription.............................................................................................................................................................................................. 1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information............................................................................................................................................................................. 1Module Block Diagram........................................................................................................................................................................... 2Development Kit..................................................................................................................................................................................... 2System Level FunctionTransceiver IC......................................................................................................................................................................................... 4Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... 5Power Amplier....................................................................................................................................................................................... 6Interface.................................................................................................................................................................................................. 6Software Tools........................................................................................................................................................................................ 6Electrical SpecicationAbsolute Maximum Ratings................................................................................................................................................................... 8Recommended (Operating Condition).................................................................................................................................................. 8DC Characteristics.................................................................................................................................................................................. 8RF Characteristics.................................................................................................................................................................................. 8Pin Signal & InterfacesPin Signals I/O Conguration................................................................................................................................................................ 9I/O Pin Assignment................................................................................................................................................................................. 9Module Dimensions................................................................................................................................................................................ 11Processing 13Agency Certications 14Shipment, Storage & Handling 15References & Revision History 16TABLE OF CONTENTS
MeshConnect™ ModulePage 4TRANSCEIVER IC A true monolithic solution, the CEL ZIC2410 IEEE 802.15.4/ZigBee IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. With an industry best +6 dBm output power, the ZIC2410 will support a wide a variety of applications without the need for external amplication. Combined with a highly sensitive -97 dBm receiver the ZICM2410P0 leads the industry with 103 dB link budget. In addition to excellent RF performance at ZigBee (250 kbps) data rates, the ZIC2410 adds high speed modes, Turbo (500 kbps) and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UART and is one of the rst devices to provide an embedded Voice CODEC. CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware & software tools required to develop custom applications. The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the ZIC2410 a truly distinct single chip solution. PS/2UART/2SPIWDTGPIO/24Timer/4PWM/2QuadKey ScanDigital RegulatorRCOscillatorClockPLL PORRF TXRF RXPLLTemp.SensorBatMonitorADC(4CH)AnalogRegulator3VCiruitryMCU(8051) FLASH96KBMODEMMACDMAADPCM VoiceFIFFOAESEnginea-lawμ-lawDATA8KBROM
MeshConnect™ ModulePage 5CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB (but not directly under the F-Antenna). Correctly positioned, the ground plane on the host PCB board under the module will contribute signicantly to the antenna performance. The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor mance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module. • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction.For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.There are three power down modes in the ZIC2410. Each mode can be set using the PDMODE [1:0] bits in the PDCON register and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption and wake-up sources, please refer to the ZIC2410 datasheet for further information on the available power down modes.. Table 8 describes the three power down modes. Table 8 – Power Down Modes PDMODE [1:0] Description Wake-Up Source Regulator for Digital block0 Active (Normal Operation) - - 1 PM1 mode Hardware Reset, Sleep Timer interrupt, External interrupt ON 2 PM2 mode Hardware Reset, Sleep Timer interrupt, External interrupt OFF (After wake-up, register conguration is required) 3 PM3 mode Hardware Reset, External interrupt OFF (After wake-up, register conguration is required) ANTENNAMODES OF OPERATION
MeshConnect™ ModulePage 6POWER AMPLIFIERVOICE CODECSOFTWARE TOOLSThe MeshConnect module does not incorporate an external Power Amplier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL’s ZIC2410 IEEE 802.15.4 / ZigBee transceiver already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain wireless connection over long distance (3000 ft line-of-sight). INTERFACEThe MeshConnect has all major communication interfaces routed from the ZIC2410 to the module edge connectors: • UART1 & UART 2 • I2S • SPI ZIC2410 includes three voice codec algorithms: μ-law, a-law and ADPCM.The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for small signals. Adaptive DPCM (ADPCM) is a variant of DPCM (Differential (or Delta) pulse-code modulation) that varies the size of the quantization step, to allow further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes the PCM values as differences between the current and the previous value. For audio this type of encoding reduces the num-ber of bits required per sample by about 25% compared to PCM.CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application. PROFILE BUILDER • Prole Builder allows for easy creation of custom ZigBee proles for use in end-user applications. • Uses the input requirements to modify a set of ‘C’ source les which include the necessary ZigBee functions. • Output les will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Prole (ZDP) descriptors. • The ZDO and ZDP dene the ZigBee node and functionality.The output les can be seamlessly integrated with the CEL ZigBee stack libraries.
MeshConnect™ ModulePage 7SOFTWARE TOOLS (Continued)DEVICE PROGRAMMER • Device Programmer is used to program the application rmware to the on-chip Flash program memory of the ZIC2410 device. • Device Programmer supports: • ISP Mode: Download the rmware from the host PC via serial communication through the ZIC2410’s UART1 interface. • The evaluation boards utilize a USB -> Serial converter • OTA Mode: Download the rmware from the host PC using wireless communication (Over-The-Air) • Requires two nodes, the host (connected to a PC) and the target device to be programmedDevice Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the aforementioned communication modes. PROFILE SIMULATOR • Prole Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices. • Prole Simulator includes: • Device Manager: Setting parameters of a ZigBee node. • Bind Manager: Managing “bindings” in a ZigBee network. • ZStack manager: Setting parameters of a ZigBee network. • ZigBee Device Wizard: Selects network conguration during ZigBee network formation.Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP. PACKET ANALYZER AND WIRELESS NETWORK ANALYZER • Packet Analyzer monitors trafc over a wireless network channel by capturing RF packet data in real-time. • Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets. • Also includes diagnostic tools: • Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel yielding available channels. • Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame. • Packet Analyzer is capable of displaying network conguration (i.e. tree vs. star), network nodes, packet details, etc. • Can be used in conjunction with any IEEE 802.15.4 or ZigBee network. KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit). • Supports all 8051 derivatives and variants. • Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle. • Supports memory banking for CODE and variables beyond the 64 kbyte threshold.Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.
MeshConnect™ ModulePage 8ABSOLUTE MAXIMUM RATINGSDescription Min Max UnitPower Supply Voltage (Vcc) -0.3 3.3 VDCVoltage on any digital pin -0.3 3.3 VDCInput RF Level 10 dBmStorage Temperature -55 125 °CReow Soldering Temperature 260 °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.RECOMMENDED (OPERATING CONDITIONS) Description Min Typ Max UnitOperating ambient temperature range, TA-40 25 85 °COperating Supply Voltage 2.1 3.0 VDCCrystal Reference Oscillator 16 MHzDC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)Description Min Typ Max UnitVcc Supply (Vcc) 2.1 3.3 VDCRX mode Current (Vcc = 3.0V) 33 35 38 mATX mode Current (Vcc = 3.0V) 40 44 48 mASleep Mode (Deep) Current < 1.0 µA RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)Description Min Typ Max UnitFrequency Band (16 – 5MHz wide channels) 2.405 2.480 GHzRX Sensitivity for 1% PER -97 -90 dBmTX Output Power 4.8 6.1 6.8 dBmError Vector Magnitude 17 35 %Adjacent Channel Rejection +/- 5 MHz +/- 10 MHz4751dBFrequency Error Tolerance 40 ppmOutput Power Control Range 30 dBOver the Air Data Rate 250 kbpsHarmonics (2nd & 3rd) -41.2 dBm/MHz
MeshConnect™ ModulePage 9PIN SIGNALS I/O PORT CONFIGURATIONMeshConnect I/O PIN ASSIGNMENTSMeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations.Pin # Name Type Description IC Pin #1 GND4 RF GND RF Ground2 GND3 RF GND RF Ground3 MS1 Control InputMode Select, Bit #1. Active Low Internal Voltage Regulator Enable: 0: Internal Voltage Regulator Enabled 1: Internal Voltage Regulator Disabled, Supply Analog and Digital Supply Voltages Externally144 GND0 RF GND RF Ground5 MS0 Control Input Mode Select, Bit #0. This pin should be connected to Ground externally. 136 NC2 N/C No Connect7 GND20 GND Digital Ground 498 GND12 GND Digital Ground 499 GND13 GND Digital Ground 4910 GND17 GND Digital Ground 4911 GND5 GND Digital Ground 4912 ACH0 Analog Input A/D Channel #0 Input, 0 - 1.5 Volts. 813 ACH1 Analog Input A/D Channel #1 Input, 0 - 1.5 Volts. 914 ACH2 Analog Input A/D Channel #2 Input, 0 - 1.5 Volts. 1015 ACH3 Analog Input A/D Channel #3 Input, 0 - 1.5 Volts. 1116 P1_7 Digital Output 8051 GPIO P1.7 (Output Only)Alternate Functions: P0AND 2017 P1_6 Digital I/O 8051 GPIO P1.6Alternate Functions: N/A 2118 P1_4 Digital I/O 8051 GPIO P1.4Alternate Functions: QUADZB / Sleep Timer Oscillator Input 2219 P1_3 Digital I/O8051 GPIO P1.3Alternate Functions: QUADZA / Sleep Timer Oscillator Output / RTCLKOUT2320 GND9 GND Digital Ground 4921 GND8 GND Digital Ground 4922 GND7 GND Digital Ground 4923 P1_1 Digital I/O 8051 GPIO P1.1Alternate Functions: TXD1 2424 VCC_3V Power Input Power Supply Input for Internal Voltage Regulators and Digital I/Os. VCC = 3.0 Volts 725 P1_0 Digital I/O 8051 GPIO P1.0Alternate Functions: RXD1 2626 P3_7 Digital I/O 8051 GPIO P3.7 (12 mA Drive)Alternate Functions: PWM3 / CTS1 / SPICSN 2727 P3_6 Digital I/O 8051 GPIO P3.6 (12 mA Drive)Alternate Functions: PWM2 / RTS1 / SPICLK 2828 P3_5 Digital I/O 8051 GPIO P3.5Alternate Functions: T1 / CTS0 / QUADYB / SPIDO 2929 P3_4 Digital I/O 8051 GPIO P3.4Alternate Functions: T0 / RTS0 / QUADYA / SPIDI 3030 GND10 GND Digital Ground 49
MeshConnect™ ModulePage 10MeshConnect I/O PIN ASSIGNMENTS (Continued)Pin # Name Type Description IC Pin #31 P3_3 Digital I/O 8051 GPIO P3.3Alternate Functions: INT1 (Active Low) 3132 P3_2 Digital I/O 8051 GPIO P3.2Alternate Functions: INT0 (Active Low) 3233 GND11 GND Digital Ground 4934 P3_1 Digital I/O 8051 GPIO P3.1Alternate Functions: TXD0 / QUADXB 3335 P3_0 Digital I/O 8051 GPIO P3.0Alternate Functions: RXD0 / QUADXA 3536 GND6 GND Digital Ground 4937 P0_7 Digital I/O 8051 GPIO P0.7Alternate Functions: I2STX_MCLK 3638 P0_6 Digital I/O 8051 GPIO P0.6Alternate Functions: I2STX_BCLK 3739 P0_5 Digital I/O 8051 GPIO P0.5Alternate Functions: I2STX_LRCLK 3840 P0_4 Digital I/O 8051 GPIO P0.4Alternate Functions: I2STX_DO 3941 P0_3 Digital I/O 8051 GPIO P0.3Alternate Functions: I2SRX_MCLK 4042 P0_2 Digital I/O 8051 GPIO P0.2Alternate Functions: I2SRX_BCLK 4143 P0_1 Digital I/O 8051 GPIO P0.1Alternate Functions: I2SRX_LRCLK 4244 P0_0 Digital I/O 8051 GPIO P0.0Alternate Functions: I2SRX_DI 4345 DVDD_1_5 Power I/ODigital Power Supply I/O Input: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied high this pin functions as the 1.5 Volt power supply input for the Digital Core. Output: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied low this pin functions as the output of the Internal Digital Voltage Regulator (1.5 Volts).1946 ISP Control InputMode Select, Bit #2. Active High In-System Programming (ISP) Input: 0: Normal Mode 1: ISP Mode1547 RESET# Control Reset (Active Low) 1748 AVDD_1_5 Power I/OAnalog Power Supply I/O Input: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied high this pin functions as the 1.5 Volt power supply input for the Mixer, VGA and LPF. Output: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied low this pin functions as the output of the Internal Analog Voltage Regulator (1.5 Volts).649 GND14 GND Digital Ground 4950 GND15 GND Digital Ground 4951 GND16 GND Digital Ground 4952 GND18 GND Digital Ground 4953 GND19 GND Digital Ground 4954 NC1 N/C No Connect55 GND1 RF GND RF Ground56 GND2 RF GND RF Ground
MeshConnect™ ModulePage 11MODULE DIMENSIONS1.000” 0.193”0.895”1.350”0.062”0.111”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1ZICM2410P00007000000001J2Pin 1Pin 19 Pin 38Pin 560RC25ZIC2410QN481.000” 0.193”0.895”1.350”0.062”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1ZICM2410P00007000000001J2Pin 1Pin 19 Pin 38Pin 560RC25ZIC2410QN48For layout recommendation for optimum antenna performance, refer to Antenna section in this document.MeshConnect ZICM2410P0-1MeshConnect ZICM2410P0-1C
MeshConnect™ ModulePage 12MODULE LAND FOOTPRINTNote: Unless otherwise specied. Dimensions are in Inches [mm].1.100 [27.94]1.000 [25.41]0.990 [22.61]0.105 [2.67]0.050 [1.27]COPPER KEEPOUT 0.298 [27.94]0.940 [23.88]1.055 [26.80]0.050 [1.27] Pitch56 x 0.040 [1.02]56 x 0.100 [2.54]
MeshConnect™ ModulePage 13PROCESSINGRecommended Reow ProleParameters ValuesRamp up rate (from Tsoakmax to Tpeak) 3º/sec maxMinimum Soak Temperature 150ºC Maximum Soak Temperature 200ºCSoak Time 60-120 secTLiquidus 217ºC Time above TL 60-150 secTpeak 260 + 0ºCTime within 5º of Tpeak 20-30 secTime from 25º to Tpeak 8 min maxRamp down rate 6ºC/sec maxAchieve the brightest possible solder llets with a good shape and low contact angle.Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-cation. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias.Repeating Reow Soldering Only a single reow soldering process is encouraged for host boards.Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
MeshConnect™ ModulePage 14PROCESSING (Continued)AGENCY CERTIFICATIONSHand SolderingHand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711.Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21)Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEM Responsibility to the FCC Rules and RegulationsThe MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or certication. To fulll the FCC certication requirements the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ZIC2410P0” or “Contains FCC ID: W7Z-ZIC2410P0”The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ ModulePage 15AGENCY CERTIFICATIONS (Continued)SHIPMENT, HANDLING, AND STORAGEShipmentThe MeshConnect Modules are delivered in trays of 28.HandlingThe MeshConnect Modules are designed and packaged to be processed in an automated assembly line.Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture sensitive devices. Appropriate handling instruc-tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL)MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.IC Certication — Industry Canada Statement The term "IC" before the certication / registration number only signies that the Industry Canada technical specications were met.Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpCE Certication — Europe The MeshConnect RF module has been tested and certied for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEM Labeling RequirementsThe `CE' mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials “CE” with the following form: · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. · The CE mark must be a minimum of 5mm in height · The CE marking must be afxed visibly, legibly, and indelibly Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the `CE' marking as shown in the picture
MeshConnect™ ModulePage 16REFERENCES & REVISION HISTORYPrevious Versions Changes to Current Version Page(s)0007-00-07-00-000 (Issue A) February 05, 2009 Initial preliminary datasheet. N/A0007-00-07-00-000 (Issue B) May 14, 2009 Agency Certication 14, 15Disclaimer • The information in this document is current as of May, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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