California Eastern Laboratories ZIC2410P0 MeshConnect Module User Manual Revised
California Eastern Laboratories MeshConnect Module Users Manual Revised
Users Manual Revised
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| Date Submitted | 2009-06-14 00:00:00 |
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PRELIMINARY DATA SHEET MeshConnect™ Module ZICM2410P0 Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Evaluation Kit available: ZICM2410P0-KIT1-1 DESCRIPTION CEL's MeshConnect™ Module Platform CEL's MeshConnect™ modules provide a high performance and low cost RF transceiver solution for 2.4 GHz IEEE 802.15.4 / ZigBee data links and wireless networks. CEL's MeshConnect radio module leverages the advanced features of CEL’s ZIC2410 transceiver platform. The ZIC2410 is a true single-chip solution, compliant with ZigBee specifications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The ZIC2410 consists of an RF transceiver with baseband modem, a hardwired MAC and an embedded 8051 microcontroller with internal Flash memory. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UART and is one of the first devices to provide an embedded Voice CODEC. This device is also ideal for low power applications. Unique in the market, the ZIC2410 offers extended data rates, supporting 500 kbps and 1 Mbps modes of operation. When combined with the voice codec the ZICM2410’s high speed modes offers an excellent voice platform. The high level of integration reduces component count, lowers power consumption, and reduces overall system costs. • 96 kB FLASH Memory • 8 kB SRAM • 8051 compatible single-cycle microcontroller core • 22 GPIO Ports • SPI (Master/Slave) + UART • I2S/PCM Interface with two 128-byte FIFOs • µ-law/a-law/ADPCM Voice Codec • 4-channel 8-bit ADC APPLICATIONS Industrial Controls • Food processing controls • Traffic Management • Sensor Networks • Asset Management • Barcode reader • Patient Monitoring • Glucose monitor Home & Building Automation • Security • HVAC control • Lighting control • Thermostats FEATURES • High RF performance • 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3µA) - 103dB RF Link Budget • Integrated PCB trace antenna - RX Sensitivity: -97 dBm @1.5V • 16 RF channels - RF TX Power: +6dBm @1.5V • Scalable Data Rate: 250kbps for ZigBee, 500kbps and 1Mbps • Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm) • Voice Codec Support: µ-law/a-law/ADPCM • Over 3000 feet of range • AES 128-bit encryption • FCC, CE and IC certifications (pending) • ROHS compliant ORDERING INFORMATION Part Number ZICM2410P0 Series MeshConnect™ Module Order Number Supplying Form ZICM2410P0-1 4 mW Output power, PCB Trace Antenna ZICM2410P0-1C 4 mW Output power, with U.FL Connector for external antenna ZICM2410P0-KIT1-1 Engineering Development Kit The information in this document is subject to change without notice, please confirm data is current Document No: 0007-00-07-00-000 (Issue B) Date Published: May 14, 2009 Page 1 MeshConnect™ Module MODULE BLOCK DIAGRAM 16 MHz XTAL PWR Reg Castellation Edge Connector ANT MeshConnect ZIC2410 Micro processor 32.768 kHz XTAL Radio MeshConnect™ Module DEVELOPMENT KIT CEL's MeshConnect Development Kit (ZICM2410P0-KIT1-1) assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. The MeshConnect Development Kit also serves as an invaluable aid in application development. Through the many interface headers on the board, the user has access to all the MeshConnect module pins enabling easy connection to target systems for application development. The key components of the MeshConnect Development Kits are the CEL’s MeshConnect radio module and the interface board. The MeshConnect module contains the CEL ZIC2410 transceiver IC, XTALs, Power Regulator and an integrated PCB antenna and connectors for an external antenna (optional). The interface board features a serial communication interface, a power management module, and peripherals such as potentiometers, LEDs, and GPIO headers. The Development Kit also contains four AA batteries and two USB cables. For more detail information regarding MeshConnect Development Kit, refer to the ZICM2410P0-KIT1-1 Development Kit User Guide document. (Available at CEL’s website http://www.cel.com) Kit Contents: • Evaluation Boards w/Module (3) • Network Analyzer (1) • USB Cables (2) • Jumpers (10) • AA Batteries (4) • AC Adapter (2) • Technical Information CD (1) Order Number ZICM2410P0-KIT1-1 Description Engineering Development Kit Page 2 MeshConnect™ Module TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... Power Amplifier....................................................................................................................................................................................... Interface.................................................................................................................................................................................................. Software Tools........................................................................................................................................................................................ Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ 11 Processing 13 Agency Certifications 14 Shipment, Storage & Handling 15 References & Revision History 16 Page 3 MeshConnect™ Module TRANSCEIVER IC A true monolithic solution, the CEL ZIC2410 IEEE 802.15.4/ZigBee IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. PS/2 ADPCM Voice FIFFO RF TX MAC RF RX UART/2 MODEM SPI a-law μ-law DMA AES Engine PLL WDT Temp. Sensor GPIO/24 Timer/4 PWM/2 MCU (8051) DATA 8KB ROM Quad Key Scan Digital Regulator Bat Monitor FLASH 96KB RC Oscillator Clock PLL POR 3V Ciruitry ADC (4CH) Analog Regulator With an industry best +6 dBm output power, the ZIC2410 will support a wide a variety of applications without the need for external amplification. Combined with a highly sensitive -97 dBm receiver the ZICM2410P0 leads the industry with 103 dB link budget. In addition to excellent RF performance at ZigBee (250 kbps) data rates, the ZIC2410 adds high speed modes, Turbo (500 kbps) and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous generalpurpose I/O pins, peripheral functions such as timers and UART and is one of the first devices to provide an embedded Voice CODEC. CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware & software tools required to develop custom applications. The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the ZIC2410 a truly distinct single chip solution. Page 4 MeshConnect™ Module ANTENNA CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB (but not directly under the F-Antenna). Correctly positioned, the ground plane on the host PCB board under the module will contribute significantly to the antenna performance. The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module. • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. MODES OF OPERATION There are three power down modes in the ZIC2410. Each mode can be set using the PDMODE [1:0] bits in the PDCON register and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption and wake-up sources, please refer to the ZIC2410 datasheet for further information on the available power down modes.. Table 8 describes the three power down modes. Table 8 – Power Down Modes PDMODE [1:0] Description Wake-Up Source Regulator for Digital block Active (Normal Operation) PM1 mode Hardware Reset, Sleep Timer interrupt, External interrupt ON PM2 mode Hardware Reset, Sleep Timer interrupt, External interrupt OFF (After wake-up, register configuration is required) PM3 mode Hardware Reset, External interrupt OFF (After wake-up, register configuration is required) Page 5 MeshConnect™ Module POWER AMPLIFIER The MeshConnect module does not incorporate an external Power Amplifier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL’s ZIC2410 IEEE 802.15.4 / ZigBee transceiver already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain wireless connection over long distance (3000 ft line-of-sight). INTERFACE The MeshConnect has all major communication interfaces routed from the ZIC2410 to the module edge connectors: • UART1 & UART 2 • I2S • SPI VOICE CODEC ZIC2410 includes three voice codec algorithms: μ-law, a-law and ADPCM. The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for small signals. Adaptive DPCM (ADPCM) is a variant of DPCM (Differential (or Delta) pulse-code modulation) that varies the size of the quantization step, to allow further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes the PCM values as differences between the current and the previous value. For audio this type of encoding reduces the number of bits required per sample by about 25% compared to PCM. SOFTWARE TOOLS CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application. PROFILE BUILDER • Profile Builder allows for easy creation of custom ZigBee profiles for use in end-user applications. • Uses the input requirements to modify a set of ‘C’ source files which include the necessary ZigBee functions. • Output files will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Profile (ZDP) descriptors. • The ZDO and ZDP define the ZigBee node and functionality. The output files can be seamlessly integrated with the CEL ZigBee stack libraries. Page 6 MeshConnect™ Module SOFTWARE TOOLS (Continued) DEVICE PROGRAMMER • Device Programmer is used to program the application firmware to the on-chip Flash program memory of the ZIC2410 device. • Device Programmer supports: • ISP Mode: Download the firmware from the host PC via serial communication through the ZIC2410’s UART1 interface. • The evaluation boards utilize a USB -> Serial converter • OTA Mode: Download the firmware from the host PC using wireless communication (Over-The-Air) • Requires two nodes, the host (connected to a PC) and the target device to be programmed Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the aforementioned communication modes. PROFILE SIMULATOR • Profile Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices. • Profile Simulator includes: • Device Manager: Setting parameters of a ZigBee node. • Bind Manager: Managing “bindings” in a ZigBee network. • ZStack manager: Setting parameters of a ZigBee network. • ZigBee Device Wizard: Selects network configuration during ZigBee network formation. Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP. PACKET ANALYZER AND WIRELESS NETWORK ANALYZER • Packet Analyzer monitors traffic over a wireless network channel by capturing RF packet data in real-time. • Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets. • Also includes diagnostic tools: • Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel yielding available channels. • Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame. • Packet Analyzer is capable of displaying network configuration (i.e. tree vs. star), network nodes, packet details, etc. • Can be used in conjunction with any IEEE 802.15.4 or ZigBee network. KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit). • Supports all 8051 derivatives and variants. • Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle. • Supports memory banking for CODE and variables beyond the 64 kbyte threshold. Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density. Page 7 MeshConnect™ Module ABSOLUTE MAXIMUM RATINGS Description Min Max Unit Power Supply Voltage (Vcc) -0.3 3.3 VDC Voltage on any digital pin -0.3 3.3 VDC 10 dBm 125 °C 260 °C Input RF Level Storage Temperature -55 Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Min Typ Operating ambient temperature range, TA -40 25 Operating Supply Voltage 2.1 Crystal Reference Oscillator Max Unit 85 °C 3.0 VDC 16 MHz DC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted) Description Min Typ Vcc Supply (Vcc) 2.1 RX mode Current (Vcc = 3.0V) 33 35 TX mode Current (Vcc = 3.0V) 40 44 Sleep Mode (Deep) Current Max Unit 3.3 VDC 38 mA 48 mA < 1.0 µA RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted) Description Min Frequency Band (16 – 5MHz wide channels) 2.405 RX Sensitivity for 1% PER TX Output Power 4.8 Typ Max Unit 2.480 GHz -97 -90 dBm 6.1 6.8 dBm Error Vector Magnitude 17 35 Adjacent Channel Rejection +/- 5 MHz +/- 10 MHz 47 51 Frequency Error Tolerance Output Power Control Range Over the Air Data Rate Harmonics (2nd & 3rd) dB 40 30 ppm dB 250 kbps -41.2 dBm/MHz Page 8 MeshConnect™ Module PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Pin # Name Type GND4 RF GND RF Ground Description GND3 RF GND RF Ground Mode Select, Bit #1. Active Low Internal Voltage Regulator Enable: 0: Internal Voltage Regulator Enabled 1: Internal Voltage Regulator Disabled, Supply Analog and Digital Supply Voltages Externally IC Pin # MS1 Control Input GND0 RF GND MS0 Control Input NC2 N/C No Connect GND20 GND Digital Ground 49 GND12 GND Digital Ground 49 GND13 GND Digital Ground 49 10 GND17 GND Digital Ground 49 11 GND5 GND Digital Ground 49 12 ACH0 Analog Input A/D Channel #0 Input, 0 - 1.5 Volts. 13 ACH1 Analog Input A/D Channel #1 Input, 0 - 1.5 Volts. 14 ACH2 Analog Input A/D Channel #2 Input, 0 - 1.5 Volts. 10 15 ACH3 Analog Input A/D Channel #3 Input, 0 - 1.5 Volts. 11 Digital Output 8051 GPIO P1.7 (Output Only) Alternate Functions: P0AND 20 Digital I/O 8051 GPIO P1.6 Alternate Functions: N/A 21 16 17 P1_7 P1_6 14 RF Ground Mode Select, Bit #0. This pin should be connected to Ground externally. 13 18 P1_4 Digital I/O 8051 GPIO P1.4 Alternate Functions: QUADZB / Sleep Timer Oscillator Input 22 19 P1_3 Digital I/O 8051 GPIO P1.3 Alternate Functions: QUADZA / Sleep Timer Oscillator Output / RTCLKOUT 23 20 GND9 GND Digital Ground 49 21 GND8 GND Digital Ground 49 22 GND7 GND Digital Ground 49 8051 GPIO P1.1 Alternate Functions: TXD1 24 Power Supply Input for Internal Voltage Regulators and Digital I/ Os. VCC = 3.0 Volts 23 P1_1 Digital I/O 24 VCC_3V Power Input 25 P1_0 Digital I/O 8051 GPIO P1.0 Alternate Functions: RXD1 26 26 P3_7 Digital I/O 8051 GPIO P3.7 (12 mA Drive) Alternate Functions: PWM3 / CTS1 / SPICSN 27 27 P3_6 Digital I/O 8051 GPIO P3.6 (12 mA Drive) Alternate Functions: PWM2 / RTS1 / SPICLK 28 28 P3_5 Digital I/O 8051 GPIO P3.5 Alternate Functions: T1 / CTS0 / QUADYB / SPIDO 29 29 P3_4 Digital I/O 8051 GPIO P3.4 Alternate Functions: T0 / RTS0 / QUADYA / SPIDI 30 30 GND10 GND Digital Ground 49 Page 9 MeshConnect™ Module MeshConnect I/O PIN ASSIGNMENTS (Continued) Pin # Name Type Description IC Pin # 31 P3_3 Digital I/O 8051 GPIO P3.3 Alternate Functions: INT1 (Active Low) 31 32 P3_2 Digital I/O 8051 GPIO P3.2 Alternate Functions: INT0 (Active Low) 32 33 GND11 GND Digital Ground 49 33 34 P3_1 Digital I/O 8051 GPIO P3.1 Alternate Functions: TXD0 / QUADXB 35 P3_0 Digital I/O 8051 GPIO P3.0 Alternate Functions: RXD0 / QUADXA 35 36 GND6 GND Digital Ground 49 36 37 P0_7 Digital I/O 8051 GPIO P0.7 Alternate Functions: I2STX_MCLK 38 P0_6 Digital I/O 8051 GPIO P0.6 Alternate Functions: I2STX_BCLK 37 39 P0_5 Digital I/O 8051 GPIO P0.5 Alternate Functions: I2STX_LRCLK 38 40 P0_4 Digital I/O 8051 GPIO P0.4 Alternate Functions: I2STX_DO 39 41 P0_3 Digital I/O 8051 GPIO P0.3 Alternate Functions: I2SRX_MCLK 40 42 P0_2 Digital I/O 8051 GPIO P0.2 Alternate Functions: I2SRX_BCLK 41 43 P0_1 Digital I/O 8051 GPIO P0.1 Alternate Functions: I2SRX_LRCLK 42 44 P0_0 Digital I/O 8051 GPIO P0.0 Alternate Functions: I2SRX_DI 43 Power I/O Digital Power Supply I/O Input: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied high this pin functions as the 1.5 Volt power supply input for the Digital Core. Output: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied low this pin functions as the output of the Internal Digital Voltage Regulator (1.5 Volts). 19 Mode Select, Bit #2. Active High In-System Programming (ISP) Input: 0: Normal Mode 1: ISP Mode 15 Reset (Active Low) 17 Analog Power Supply I/O Input: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied high this pin functions as the 1.5 Volt power supply input for the Mixer, VGA and LPF. Output: When the Mode Select Bit #1 (MS1, Module Pin #3) is tied low this pin functions as the output of the Internal Analog Voltage Regulator (1.5 Volts). 45 DVDD_1_5 46 ISP Control Input 47 RESET# Control 48 AVDD_1_5 Power I/O 49 GND14 GND Digital Ground 49 50 GND15 GND Digital Ground 49 51 GND16 GND Digital Ground 49 52 GND18 GND Digital Ground 49 53 GND19 GND Digital Ground 49 54 NC1 N/C No Connect 55 GND1 RF GND RF Ground 56 GND2 RF GND RF Ground Page 10 MeshConnect™ Module MODULE DIMENSIONS MeshConnect ZICM2410P0-1C 0.111” ZICM2410P0 0007000000001 J2 0R C25 Pin 1 RF Shield R1 R7 U1 C14 L2 C24 C5B C6A C1 L6 C6B C6 R2 ZIC2410 QN48 C9 C10 R5 C4A C17 C2 R4 C16 R9 R6 C22 R8 L5 C11 L3 C13 L4 R11 C23 1.350” R10 0.895” C7B C20 Pin 56 C21 C7 XTAL1 C15 Pin 38 Pin 19 1.000” 0.193” 0.062” MeshConnect ZICM2410P0-1 ZICM2410P0 0007000000001 J2 0R C25 Pin 1 RF Shield U1 C14 L2 C6A C1 L6 C6B C6 R2 ZIC2410 QN48 C10 R6 R9 C22 R8 C5B C4A C17 R5 C2 R4 1.350” R7 C24 L5 R1 C9 R10 C11 L3 C13 L4 R11 C23 0.895” C7B C20 Pin 56 C21 C7 C16 XTAL1 C15 Pin 38 Pin 19 1.000” 0.193” 0.062” For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 11 MeshConnect™ Module MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. 1.100 [27.94] 1.000 [25.41] 0.050 [1.27] COPPER KEEPOUT 0.298 [27.94] 0.050 [1.27] Pitch 0.940 [23.88] 1.055 [26.80] 56 x 0.040 [1.02] 56 x 0.100 [2.54] 0.105 [2.67] 0.990 [22.61] Page 12 MeshConnect™ Module PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 260 + 0ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle. Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.” Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • • • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 13 MeshConnect™ Module PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711. Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ZIC2410P0” or “Contains FCC ID: W7Z-ZIC2410P0” The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 14 MeshConnect™ Module AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php CE Certification — Europe The MeshConnect RF module has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with the following form: · · · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the `CE' marking as shown in the picture SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. Page 15 MeshConnect™ Module REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0007-00-07-00-000 (Issue A) February 05, 2009 Initial preliminary datasheet. 0007-00-07-00-000 (Issue B) May 14, 2009 Agency Certification Page(s) N/A 14, 15 • The information in this document is current as of May, 2009. The information is subject to change without Disclaimer notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 16
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.4 Linearized : No Create Date : 2009:05:14 14:08:32-07:00 Creator : Adobe InDesign CS4 (6.0.1) Modify Date : 2009:05:15 09:24:33-05:00 Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-20:48:00 Instance ID : uuid:3326d59c-083d-4c92-9dbb-35d319f1ef7b Document ID : adobe:docid:indd:73734b91-6080-11dd-83bc-b1143d1dc262 Original Document ID : adobe:docid:indd:73734b91-6080-11dd-83bc-b1143d1dc262 Rendition Class : proof:pdf Derived From Instance ID : 004f95b9-1e01-11dd-9693-88bd15baab36 Derived From Document ID : adobe:docid:indd:aacfcaa9-6c19-11dc-9fff-f321126ab89d History Action : saved, saved, saved, saved, saved, saved, saved, saved History Instance ID : xmp.iid:F77F117407206811BF30F2D8566FA17F, xmp.iid:F87F117407206811BF30F2D8566FA17F, xmp.iid:F97F117407206811BF30F2D8566FA17F, xmp.iid:F77F1174072068118F62CAC254271E83, xmp.iid:09801174072068118DBBD174B03CCC81, xmp.iid:0A801174072068118DBBD174B03CCC81, xmp.iid:AA6A0D42352068118DBBD174B03CCC81, xmp.iid:AB6A0D42352068118DBBD174B03CCC81 History When : 2009:04:20 13:14:11-07:00, 2009:04:20 13:14:11-07:00, 2009:04:20 13:20:30-07:00, 2009:04:20 13:58:29-07:00, 2009:05:14 13:29:23-07:00, 2009:05:14 13:29:55-07:00, 2009:05:14 13:32:20-07:00, 2009:05:14 13:56:56-07:00 History Software Agent : Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0 History Changed : /, /metadata, /, /, /, /, /, / Manifest Link Form : ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream Manifest Placed X Resolution : 72.00, 300.00, 72.00, 72.00, 72.00, 300.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00 Manifest Placed Y Resolution : 72.00, 300.00, 72.00, 72.00, 72.00, 300.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00, 72.00 Manifest Placed Resolution Unit : Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches Manifest Reference Instance ID : uuid:CD64BA9EA160DD11A8CDD1E5C3F585E7, uuid:E4266E66A8E7DD11BBC8CC0F072C016E, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:57F28AED6AF4DD118FB4BF5883E62C33, uuid:7EDEED01E7E2DD11B2D99F301DC726DB, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:01A3F9323DE9DD118679FB8ADF5C8B78, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:DA37E08AF8F4DD1193D2DA34824D8F7A, uuid:DB37E08AF8F4DD1193D2DA34824D8F7A, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:A24EF6326BF0DD11AC57D2DC4EEDB57F, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, xmp.iid:F77F117407206811B1A4CFEE8D7D83D1, xmp.iid:F87F117407206811B1A4CFEE8D7D83D1, uuid:9D977BA6F965DD119137B6FC631E0728 Manifest Reference Document ID : uuid:8019EF4DBEE3DD11B23EC81B5E9CC1EB, uuid:CE64BA9EA160DD11A8CDD1E5C3F585E7, uuid:0BB9DA9DE3CDDD118228C3D767C4015E, uuid:00A3F9323DE9DD118679FB8ADF5C8B78, uuid:FCA2F9323DE9DD118679FB8ADF5C8B78, uuid:D737E08AF8F4DD1193D2DA34824D8F7A, uuid:5501B76A3EF0DD11AC57D2DC4EEDB57F, xmp.did:F77F117407206811B1A4CFEE8D7D83D1, xmp.did:F87F117407206811B1A4CFEE8D7D83D1 Metadata Date : 2009:05:15 09:24:33-05:00 Creator Tool : Adobe InDesign CS4 (6.0.1) Thumbnail Format : JPEG Thumbnail Width : 256 Thumbnail Height : 256 Thumbnail Image : (Binary data 12129 bytes, use -b option to extract) Doc Change Count : 141 Format : application/pdf Producer : Adobe PDF Library 9.0 Trapped : False Page Count : 16EXIF Metadata provided by EXIF.tools