California Eastern Laboratories ZIC2410P2 MeshConnect Extended Range ZigBee Module User Manual Exhibit D Users Manual per 2 1033 b3
California Eastern Laboratories MeshConnect Extended Range ZigBee Module Exhibit D Users Manual per 2 1033 b3
Exhibit D Users Manual per 2 1033 b3
Page 1
MeshConnect™ Module Series
DESCRIPTION
CEL's MeshConnect™ Module Series provides high performance
and low cost 2.4 GHz IEEE 802.15.4 / ZigBee modules for a broad
range of wireless networks. The MeshConnect certied and quali-
ed modules, enable customer to accelerate time to market by
greatly reducing design and certication phases of development.
CEL's MeshConnect™ radio modules leverage the advanced
features of the MeshConnect™ Integrated Circuit (IC). The IC is
a true single-chip solution, compliant with ZigBee specications
and IEEE 802.15.4, a complete wireless solution for all ZigBee
applications. The IC consists of an RF transceiver with baseband
modem, a hardwired MAC and an embedded 8051 microcon-
troller with internal Flash memory. The device provides numerous
general-purpose I/O pins, peripheral functions such as timers and
UARTs and is one of the rst devices to provide an embedded
Voice CODEC. This device is also ideal for low power applications.
The original MeshConnect module delivers excellent performance
at a surprisingly low cost. The module’s +6dBm output power
means better range, more reliable transmission and fewer nodes
in your network. It also makes these modules ideal for applica-
tions where cost and power constraints do not allow for external
power ampliers or peripheral range extension components.
The MeshConnect Extended Range module adds a power ampli-
er (PA) and low noise amplier (LNA) to increase range to over
two miles - plus more reliable transmission and fewer nodes in
your network. It is especially useful for open outdoor applica-
tions where the nodes are physically far apart, or for indoor use
where the nodes have to operate in a noisy RF environment. The
Extended Range Module’s outstanding +123 dBm budget link
ensures high quality connections even in such harsh environments.
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1
The information in this document is subject to change without notice, please conrm data is current
Document No: 0007-00-07-00-000 (Issue C)
Date Published: October 6, 2009
PRELIMINARY DATA SHEET
ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™
Module
ZICM2410P0-1 +6 dBm Output power,
PCB Trace Antenna
ZICM2410P0-1C
+6 dBm Output power,
with U.FL Connector for
external antenna
ZICM2410P0-KIT2-1 +6 dBm Engineering
Development Kit
MeshConnect™
Extended Range
Module
ZICM2410P2-1 +20 dBm Output power,
PCB Trace Antenna
ZICM2410P2-1C
+20 dBm Output power,
with U.FL Connector for
external antenna
ZICM2410P2-KIT1-1 Evaluation board for +20
dBm module
APPLICATIONS
Home &
Building Automation
• Security
• HVAC control
• Lighting control
• Thermostats
Industrial Controls
• Food processing controls
• Trafc Management
• Sensor Networks
• Asset Management
• Barcode reader
• Patient Monitoring
• Glucose monitor
• High RF performance:
- Up to 123.5 dB RF Link Budget
- RX Sensitivity: -97 dBm and -103.5 dBm
- RF TX Power:+6 dBm and +20 dBm
• Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps
• Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm)
• Voice Codec Support: µ-law/a-law/ADPCM
• 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 µA)
• Integrated PCB trace antenna
• 16 RF channels
• Up to 12,000 feet of range
• AES 128-bit encryption
• FCC, CE and IC certications
• ROHS compliant
FEATURES
• 96 kB FLASH Memory
• 8 kB SRAM
• 8051 MCU core
• up to 22 GPIO Pins
• SPI (Master/Slave) + UARTs
• I2S/PCM Interface with two
128-byte FIFOs
• µ-law/a-law/ADPCM Voice Codec
• 4-channel 8-bit ADC
MeshConnect™ Module Series
Module and Extended Range Module
MeshConnect™ Module Series
Page 2
MODULE BLOCK DIAGRAM
16 MHz
XTAL
Radio
Micro
processor
ANT
Castellation Edge
Connector
PWR
Reg
MeshConnect™ IC
Module
16 MHz
XTAL
Radio
Micro
processor
ANT
Castellation Edge
Connector
PWR
Reg
MeshConnect™ IC
LNA
Extended Range Module
PA
DEVELOPMENT KIT
CEL's MeshConnect Development Kit assist users in
both evaluation and development. As a stand-alone radio
system, the kit allows users to place the modules in to the
target environment and evaluate performance on-site. The
MeshConnect Development Kit also serves as an invalu-
able aid in application development. Through the many
interface headers on the board, the user has access to all
the MeshConnect module pins enabling easy connection
to target systems for application development. The key
components of the MeshConnect Development Kits are
the CEL’s MeshConnect radio module and the interface
board.
The MeshConnect module contains the CEL transceiver
IC, Crystals, Power Regulator and an integrated PCB
antenna with a connector for an external antenna
(optional). The interface board features a serial com-
munication interface, a power management module, and
peripherals such as potentiometers, LEDs, and GPIO
headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)
Order Number Description
ZICM2410P0-KIT2-1 +6 dBm Engineering Development Kit
ZICM2410P2-KIT1 Evaluation board for +20 dBm module
Kit Contents:
• Evaluation Boards w/Module (3)
• Network Analyzer (1)
• Antennas (1)
• USB Cables (2)
• Jumpers (10)
• AA Batteries (4)
• Universal AC/DC Power Supply (2)
• Software & Technical Information CD (2)
MeshConnect™ Module Development Kit
Kit Contents:
• Evaluation Boards w/Module (1)
• USB Cables (1)
• Jumpers (2)
• Software & Technical Information CD (2)
MeshConnect™ Extended Range Module Development Kit
MeshConnect™ Module Series
Page 3
Introduction and Overview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
Ordering Information............................................................................................................................................................................. 1
Module Block Diagram........................................................................................................................................................................... 2
Development Kit..................................................................................................................................................................................... 3
System Level Function
Transceiver IC......................................................................................................................................................................................... 4
Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... 5
Power Amplier....................................................................................................................................................................................... 6
Interface.................................................................................................................................................................................................. 6
Software Tools........................................................................................................................................................................................ 6
Electrical Specication
Absolute Maximum Ratings................................................................................................................................................................... 8
Recommended (Operating Condition).................................................................................................................................................. 8
DC Characteristics.................................................................................................................................................................................. 8
RF Characteristics.................................................................................................................................................................................. 8
Pin Signal & Interfaces
Pin Signals I/O Conguration................................................................................................................................................................ 9
I/O Pin Assignment................................................................................................................................................................................. 9
Module Dimensions................................................................................................................................................................................ 11
Processing 13
Agency Certications 14
Shipment, Storage & Handling 15
References & Revision History 16
TABLE OF CONTENTS
MeshConnect™ Module Series
Page 4
TRANSCEIVER IC
A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC,
and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 /
ZigBee applications.
With an industry best +8 dBm output power, the MeshConnect IC will support a wide a variety of applications without the
need for external amplication. Combined with a highly sensitive -98 dBm receiver the MeshConnect IC leads the industry
with 106 dB link budget.
In addition to excellent RF performance at ZigBee (250 kbps) data rates, the IC adds high speed modes, Turbo (500 kbps)
and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O
pins, peripheral functions such as timers and UARTs and is one of the rst devices to provide an embedded Voice CODEC.
CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware &
software tools required to develop custom applications.
The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinct
single chip solution.
The Extended Range module adds both an PA and LNA to maximize RF performance. The NEC uPG2250 PA enable the
Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA
boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm
enabling a line of sight range over 2 miles.
PS/2
UART/2
SPI
WDT
GPIO/24
Timer/4
PWM/2
Quad
Key Scan
Digital
Regulator
RC
Oscillator
Clock
PLL POR
RF TX
RF RX
PLL
Temp.
Sensor
Bat
Monitor
ADC
(4CH)
Analog
Regulator
3V
Ciruitry
MCU
(8051) FLASH
96KB
MODEM
MAC
DMA
ADPCM Voice
FIFFO
AES
Engine
a-law
μ-law
DATA
8KB
ROM
MeshConnect™ Module Series
Page 5
CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector
can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on
page 1.
The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern.
To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the
ground plane on the host PCB will contribute signicantly to the antenna performance (it should not be directly under
the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to
antenna perfor mance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the
transmitted signal.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board
under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the
module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register
and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption
and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8
describes the three power down modes.
Table 8 – Power Down Modes
PDMODE [1:0] Description Wake-Up Source Regulator for Digital
block
0 Active (Normal Operation) - -
1 PM1 mode
Hardware Reset,
Sleep Timer interrupt,
External interrupt
ON
2 PM2 mode
Hardware Reset,
Sleep Timer interrupt,
External interrupt
OFF
(After wake-up, register
conguration is required)
3 PM3 mode Hardware Reset,
External interrupt
OFF
(After wake-up, register
conguration is required)
ANTENNA
MODES OF OPERATION
MeshConnect™ Module Series
Page 6
POWER AMPLIFIER
VOICE CODEC
SOFTWARE TOOLS
The orginal MeshConnect module does not incorporate an external Power Amplier and therefore the RF output port is
connected directly (through matching components) to the RF antenna. As CEL’s IC IEEE 802.15.4 / ZigBee transceiver
already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain
wireless connection over long distance (3,000 ft line-of-sight).
The Extended Range module adds both an PA and LNA to optimize RF performance. The NEC uPG2250 PA enable the
Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA
boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm
enabling a line of sight range over 2 miles.
INTERFACE
The MeshConnect has all major communication interfaces routed from the IC to the module edge connectors:
• UART1 & UART 2
• I2S
• SPI
The MeshConnect IC includes three voice codec algorithms: μ-law, a-law and ADPCM.
The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America
and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the
analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it
can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be
traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in
European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing.
The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for
small signals.
Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the
quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes
the PCM values as differences between the current and the previous value. For audio applications this type of encoding
reduces the number of bits required per sample by about 25% compared to PCM.
CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application.
PROFILE BUILDER
• Prole Builder allows for easy creation of custom ZigBee proles for use in end-user applications.
• Uses the input requirements to modify a set of ‘C’ source les which include the necessary ZigBee functions.
• Output les will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Prole (ZDP) descriptors.
• The ZDO and ZDP dene the ZigBee node and functionality.
The output les can be seamlessly integrated with the CEL ZigBee stack libraries.
MeshConnect™ Module Series
Page 7
SOFTWARE TOOLS (Continued)
DEVICE PROGRAMMER
• Device Programmer is used to program the application rmware to the on-chip Flash program memory of the
IC device.
• Device Programmer supports:
• ISP Mode: Download the rmware from the host PC via serial communication through the IC’s
UART1 interface.
• The evaluation boards utilize a USB -> Serial converter.
• OTA Mode: Download the rmware from the host PC using wireless communication (Over-The-Air).
• This requires two nodes, the host (connected to a PC) and the target device to be programmed.
Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the
aforementioned communication modes.
PROFILE SIMULATOR
• Prole Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices.
• Prole Simulator includes:
• Device Manager: Setting parameters of a ZigBee node.
• Bind Manager: Managing “bindings” in a ZigBee network.
• ZStack manager: Setting parameters of a ZigBee network.
• ZigBee Device Wizard: Selects network conguration during ZigBee network formation.
Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP.
PACKET ANALYZER AND WIRELESS NETWORK ANALYZER
• Packet Analyzer monitors trafc over a wireless network channel by capturing RF packet data in real-time.
• Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets.
• Packet Analyzer also includes diagnostic tools:
• Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel
yielding available channels.
• Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame.
• Packet Analyzer is capable of displaying network conguration (i.e. tree vs. star), network nodes, packet details, etc.
• Can be used in conjunction with any IEEE 802.15.4 or ZigBee network.
KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit).
• Supports all 8051 derivatives and variants.
• Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle.
• Supports memory banking for CODE and variables beyond the 64 kbyte threshold.
Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.
MeshConnect™ Module Series
Page 8
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™
Module
MeshConnect™
Extended Range Module Unit
Min Max Min Max
Power Supply Voltage (Vcc) -0.3 3.3 -0.3 3.3 VDC
Voltage on any digital pin -0.3 3.3 -0.3 3.3 VDC
Input RF Level 10 -6 dBm
Storage Temperature -55 125 -55 125 °C
Reow Soldering Temperature 260 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
MeshConnect™ Module
MeshConnect™ Extended Range Module Unit
Min Typ Max
Operating ambient temperature range, TA-40 25 85 °C
Operating Supply Voltage 2.1 3.0 VDC
Input Frequency 2.405 2.48 GHz
DC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)
Description
MeshConnect™
Module
MeshConnect™
Extended Range Module Unit
Min Typ Max Min Typ Max
Vcc Supply (Vcc) 2.1 3.3 2.1 3.3 VDC
RX mode Current (Vcc = 3.0V) 35 38 38 42 mA
TX mode Current (Vcc = 3.0V) 44 48 175 mA
TX mode Current (Vcc = 2.1V) 44 48 120 mA
Sleep Mode (Deep) Current 1 4 µA
RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)
Description
MeshConnect™
Module
MeshConnect™
Extended Range Module Unit
Min Typ Max Min Typ Max
Frequency Band (16 – 5MHz wide channels) 2.405 2.480 2.405 2.480 GHz
RX Sensitivity for 1% PER -97 -85 -103.5 -85 dBm
Saturation (maximum input level) 5 -11 dBm
TX Output Power (VCC = 3.0V) 4.5 6.0 20 dBm
TX Output Power (VCC = 2.1V) 4.5 6.0 15.5 dBm
Error Vector Magnitude 17 35 15 35 %
Adjacent Channel Rejection
+/- 5 MHz
+/- 10 MHz
35
35
47
51
35
35
47
51
dB
Frequency Error Tolerance -96.2 96.2 -96.2 96.2 kHz
Output Power Control Range 55 55 dB
Over the Air Data Rate 250 1000 250 1000 kbps
Harmonics (2nd & 3rd) -41.2 -41.2 dBm/MHz
MeshConnect™ Module Series
Page 9
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect I/O PIN ASSIGNMENTS
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module
Dimensions shows the layout of the 56 edge castellations.
Pin
#
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Type Description Functionality
IC
Pin
#
1 GND GND GND-RF Ground Ground N/A
2 GND GND GND-RF Ground Ground N/A
3 MS1 NC static control
line
Mode Select, Bit #1. Active Low Internal
Voltage Regulator Enable:
0: Internal Voltage Regulator Enabled
1: Internal Voltage Regulator Disabled, Supply
Analog and Digital Supply Voltages Externally
No connect 14
4 GND GND GND-RF Ground Ground N/A
5 GND NC GND GND Ground 13
6 NC NC NC no connect No connect N/A
7 GND GND GND-Logic Ground Ground 49
8 GND GND GND-Logic Ground Ground 49
9 GND GND GND-Logic Ground Ground 49
10 GND GND GND-Logic Ground Ground 49
11 GND GND GND-Logic Ground Ground 49
12 ACH0 ACH0 Analog Input 1.5V Level Analog ADC0 Input ADC input 8
13 ACH1 ACH1 Analog Input 1.5V Level Analog ADC1 Input ADC input 9
14 ACH2 ACH2 Analog Input 1.5V Level Analog ADC2 Input ADC input 10
15 ACH3 ACH3 Analog Input 1.5V Level Analog ADC3 Input ADC input 11
16 P1_7(1) NC digital I/O Port P1.7 Digital I/O 20
17 P1_6(1) NC digital I/O Port P1.6 Digital I/O 21
18 P1_4 P1_4 digital I/O Port P1.4 / QUADZB / Sleep Timer OSC
Buffer Input
digital I/O or
dedicated function
port
22
19 P1_3 P1_3 digital I/O Port P1.3 / QUADZA / Sleep Timer OSC
Buffer Output / RTCLKOUT
digital I/O or dedicated
function port 23
20 GND GND GND-Logic Ground Ground 49
21 GND GND GND-Logic Ground Ground 49
22 GND GND GND-Logic Ground Ground 49
23 P1_1 P1_1 digital I/O Port P1.1 / TXD1
digital I/O or
dedicated function
port
24
24 VCC_3V VCC_3V Power 3.0V Power supply for Analog Internal
Voltage Regulator Power Input 7
25 P1_0 P1_0 digital I/O Port P1.0 / RXD1 digital I/O or dedicated
function port 26
26 P3_7 P3_7 digital I/O Port P3.7 / 12mA Drive capability / PWM3 /
CTS1 / SPICSN
digital I/O with high
current capability 27
27 P3_6 P3_6 digital I/O Port P3.6 / 12mA Drive capability /PWM2 /
RTS1 / SPICLK
digital I/O with high
current capability 28
Note:
1. Pin used on extended range module to control on board power amplier.
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
MeshConnect™ Module Series
Page 10
MeshConnect I/O PIN ASSIGNMENTS (Continued)
28 P3_5 P3_5 digital I/O Port P3.5 / T1 / CTS0 / QUADYB / SPIDO digital I/O or dedicated
function port 29
29 P3_4 P3_4 digital I/O Port P3.4 / T0 / RTS0 / QUADYA / SPIDI digital I/O or dedicated
function port 30
30 GND GND GND-Logic Ground Ground 49
31 P3_3 P3_3 digital I/O Port P3.3 / INT1 (active low) digital I/O or dedicated
function port 31
32 P3_2 P3_2 digital I/O Port P3.2 / INT0 (active low) digital I/O or dedicated
function port 32
33 GND GND GND-Logic Ground Ground 49
34 P3_1 P3_1 digital I/O Port P3.1 / TXD0 / QUADXB digital I/O or dedicated
function port 33
35 P3_0 P3_0 digital I/O Port P3.0 / RXD0 / QUADXA digital I/O or dedicated
function port 35
36 GND GND GND-Logic Ground Ground 49
37 P0_7 P0_7 digital I/O GPIO 8051 Port P0.7 / I2STX_MCLK digital I/O 36
38 P0_6 P0_6 digital I/O GPIO 8051 Port P0.6 / I2STX_BCLK digital I/O 37
39 P0_5 P0_5 digital I/O GPIO 8051 Port P0.5 / I2STX_LRCLK digital I/O 38
40 P0_4 P0_4 digital I/O GPIO 8051 Port P0.4 / I2STX_DO digital I/O 39
41 P0_3 P0_3 digital I/O GPIO 8051 Port P0.3 / I2SRX_MCLK digital I/O 40
42 P0_2 P0_2 digital I/O GPIO 8051 Port P0.2 / I2SRX_BCLK digital I/O 41
43 P0_1 P0_1 digital I/O GPIO 8051 Port P0.1 / I2SRX_LRCK digital I/O 42
44 P0_0 P0_0 digital I/O GPIO 8051 Port P0.0 / I2SRX_DI digital I/O 43
45 DVDD_1_5(2) NC Power
Output of Digital Internal Voltage Regulator
(1.5V) / 1.5V Power supply for Digital
Core(input mode @ No REG)
Selected as Internal
Regulator output or
Regulated Voltage
supply Input
19
46 ISP ISP Digital Input
Mode Select, Bit #2. Active High In-System
Programming (ISP) Input:
0: Normal Mode
1: ISP Mode
Programming 15
47 RESET RESET Control Reset (Active Low) Hardware Reset 17
48 AVDD_1_5(2) NC Power
Output of Analog Internal Voltage Regulator
(1.5V) / 1.5V Power supply for Mixer, VGA,
and LPF (input mode @ No REG)
Selected as Internal
Regulator output or
Regulated Voltage
supply Input
6
49 GND GND GND-Logic Ground Ground 49
50 GND GND GND-Logic Ground Ground 49
51 GND GND GND-Logic Ground Ground 49
52 GND GND GND-Logic Ground Ground 49
53 GND GND GND-Logic Ground Ground 49
54 NC NC NC No Connect No connect N/A
55 GND GND GND-RF Ground Ground N/A
56 GND GND GND-RF Ground Ground N/A
Pin
#
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Type Description Functionality
IC
Pin
#
Note:
1. Pin used on extended range module to control on board power amplier.
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
MeshConnect™ Module Series
Page 11
Pin
#
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Type Description Functionality
IC
Pin
#
MODULE DIMENSIONS
1.000” 0.195”
0.895”
1.413”
0.062”
0.120”
RF Shield
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
ZICM2410P0
0007-00-00-00-001
J2
Pin 1
Pin 19 Pin 38
Pin 56
0R
C25
ZIC2410
QN48
1.000” 0.195”
0.895”
1.413”
0.062”
RF Shield
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
ZICM2410P0
0007-00-00-00-001
J2
Pin 1
Pin 19 Pin 38
Pin 56
0R
C25
ZIC2410
QN48
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
MeshConnect™ Module / MeshConnect™ Extended Range Module
w/PCB Trace Antenna
MeshConnect™ Module / MeshConnect™ Extended Range Module
w/U.FL Connector for external antenna
MeshConnect™ Module Series
Page 12
MODULE LAND FOOTPRINT
Note: Unless otherwise specied. Dimensions are in Inches [mm].
1.100 [27.94]
1.000 [25.41]
0.990 [22.61]
0.105 [2.67]
0.050 [1.27]
COPPER KEEPOUT 0.361 [9.17]
0.940 [23.88]
1.055 [26.80]
0.050 [1.27] Pitch
56 x 0.040 [1.02]
56 x 0.100 [2.54]
MeshConnect™ Module Series
Page 13
PROCESSING
Recommended Reow Prole
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 260 + 0ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Achieve the brightest possible solder llets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
cation. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Repeating Reow Soldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
MeshConnect™ Module Series
Page 14
Pending
PROCESSING (Continued)
AGENCY CERTIFICATIONS
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating
from underneath is recommended. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or
certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC
ID: W7Z-ICP0”
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied
with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-
tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ Module Series
Page 15
Pending
AGENCY CERTIFICATIONS (Continued)
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instruc-
tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
IC Certication — Industry Canada Statement
The term "IC" before the certication / registration number only signies that the Industry Canada technical specications
were met.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
CE Certication — Europe
The MeshConnect RF module has been tested and certied for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
· The CE mark must be a minimum of 5mm in height
· The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture
MeshConnect™ Module Series
Page 16
REFERENCES & REVISION HISTORY
Previous Versions Changes to Current Version Page(s)
0007-00-07-00-000
(Issue A) February 05, 2009 Initial preliminary datasheet. N/A
0007-00-07-00-000
(Issue B) June 11, 2009 Updated Development Kit and Agency Certication 2, 14, 15
0007-00-07-00-000
(Issue C) October 6, 2009 Added New MeshConnect Extended Range Module All
Disclaimer
• The information in this document is current as of October, 2009. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.