California Eastern Laboratories ZIC2410P2 MeshConnect Extended Range ZigBee Module User Manual Exhibit D Users Manual per 2 1033 b3

California Eastern Laboratories MeshConnect Extended Range ZigBee Module Exhibit D Users Manual per 2 1033 b3

Exhibit D Users Manual per 2 1033 b3

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PRELIMINARY DATA SHEET
MeshConnect™ Module Series
Module and Extended Range Module
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1
DESCRIPTION
CEL's MeshConnect™ Module Series provides high performance
and low cost 2.4 GHz IEEE 802.15.4 / ZigBee modules for a broad
range of wireless networks. The MeshConnect certified and qualified modules, enable customer to accelerate time to market by
greatly reducing design and certification phases of development.
CEL's MeshConnect™ radio modules leverage the advanced
features of the MeshConnect™ Integrated Circuit (IC). The IC is
a true single-chip solution, compliant with ZigBee specifications
and IEEE 802.15.4, a complete wireless solution for all ZigBee
applications. The IC consists of an RF transceiver with baseband
modem, a hardwired MAC and an embedded 8051 microcontroller with internal Flash memory. The device provides numerous
general-purpose I/O pins, peripheral functions such as timers and
UARTs and is one of the first devices to provide an embedded
Voice CODEC. This device is also ideal for low power applications.
The original MeshConnect module delivers excellent performance
at a surprisingly low cost. The module’s +6dBm output power
means better range, more reliable transmission and fewer nodes
in your network. It also makes these modules ideal for applications where cost and power constraints do not allow for external
power amplifiers or peripheral range extension components.
The MeshConnect Extended Range module adds a power amplifier (PA) and low noise amplifier (LNA) to increase range to over
two miles - plus more reliable transmission and fewer nodes in
your network. It is especially useful for open outdoor applications where the nodes are physically far apart, or for indoor use
where the nodes have to operate in a noisy RF environment. The
Extended Range Module’s outstanding +123 dBm budget link
ensures high quality connections even in such harsh environments.
ORDERING INFORMATION
Part Number
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Order Number
MeshConnect™ Module Series
•
•
•
•
•
•
96 kB FLASH Memory
8 kB SRAM
8051 MCU core
up to 22 GPIO Pins
SPI (Master/Slave) + UARTs
I2S/PCM Interface with two
128-byte FIFOs
• µ-law/a-law/ADPCM Voice Codec
• 4-channel 8-bit ADC
FEATURES
• High RF performance:
- Up to 123.5 dB RF Link Budget
- RX Sensitivity: -97 dBm and -103.5 dBm
- RF TX Power:+6 dBm and +20 dBm
• Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps
• Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm)
• Voice Codec Support: µ-law/a-law/ADPCM
• 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 µA)
• Integrated PCB trace antenna
• 16 RF channels
• Up to 12,000 feet of range
• AES 128-bit encryption
• FCC, CE and IC certifications
Description
ZICM2410P0-1
+6 dBm Output power,
PCB Trace Antenna
ZICM2410P0-1C
+6 dBm Output power,
with U.FL Connector for
external antenna
ZICM2410P0-KIT2-1
+6 dBm Engineering
Development Kit
ZICM2410P2-1
+20 dBm Output power,
PCB Trace Antenna
ZICM2410P2-1C
+20 dBm Output power,
with U.FL Connector for
external antenna
ZICM2410P2-KIT1-1
Evaluation board for +20
dBm module
• ROHS compliant
APPLICATIONS
Industrial Controls
• Food processing controls
• Traffic Management
• Sensor Networks
• Asset Management
• Barcode reader
• Patient Monitoring
• Glucose monitor
The information in this document is subject to change without notice, please confirm data is current
Document No: 0007-00-07-00-000 (Issue C)
Date Published: October 6, 2009
Home &
Building Automation
• Security
• HVAC control
• Lighting control
• Thermostats
Page 1
MeshConnect™ Module Series
MODULE BLOCK DIAGRAM
Module
Extended Range Module
16 MHz
XTAL
PWR
Reg
16 MHz
XTAL
PWR
Reg
MeshConnect™ IC
Micro
processor
ANT
Castellation Edge
Connector
Castellation Edge
Connector
ANT
Radio
MeshConnect™ IC
Micro
processor
Radio
PA
LNA
DEVELOPMENT KIT
CEL's MeshConnect Development Kit assist users in
both evaluation and development. As a stand-alone radio
system, the kit allows users to place the modules in to the
target environment and evaluate performance on-site. The
MeshConnect Development Kit also serves as an invaluable aid in application development. Through the many
interface headers on the board, the user has access to all
the MeshConnect module pins enabling easy connection
to target systems for application development. The key
components of the MeshConnect Development Kits are
the CEL’s MeshConnect radio module and the interface
board.
The MeshConnect module contains the CEL transceiver
IC, Crystals, Power Regulator and an integrated PCB
antenna with a connector for an external antenna
(optional). The interface board features a serial communication interface, a power management module, and
peripherals such as potentiometers, LEDs, and GPIO
headers.
MeshConnect™ Module Development Kit
Kit Contents:
• Evaluation Boards w/Module (3)
• AA Batteries (4)
• Network Analyzer (1)
• Universal AC/DC Power Supply (2)
• Antennas (1)
• Software & Technical Information CD (2)
• USB Cables (2)
• Jumpers (10)
MeshConnect™ Extended Range Module Development Kit
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)
Order Number
ZICM2410P0-KIT2-1
ZICM2410P2-KIT1
Description
Kit Contents:
+6 dBm Engineering Development Kit
• Evaluation Boards w/Module (1)
• Jumpers (2)
Evaluation board for +20 dBm module
• USB Cables (1)
• Software & Technical Information CD (2)
Page 2
MeshConnect™ Module Series
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features..................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information.............................................................................................................................................................................
Module Block Diagram...........................................................................................................................................................................
Development Kit.....................................................................................................................................................................................
System Level Function
Transceiver IC.........................................................................................................................................................................................
Modes of Operation (TX, RX, Sleep)......................................................................................................................................................
Power Amplifier.......................................................................................................................................................................................
Interface..................................................................................................................................................................................................
Software Tools........................................................................................................................................................................................
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
Recommended (Operating Condition)..................................................................................................................................................
DC Characteristics..................................................................................................................................................................................
RF Characteristics..................................................................................................................................................................................
Pin Signal & Interfaces
Pin Signals I/O Configuration................................................................................................................................................................
I/O Pin Assignment.................................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
11
Processing
13
Agency Certifications
14
Shipment, Storage & Handling
15
References & Revision History
16
Page 3
MeshConnect™ Module Series
TRANSCEIVER IC
A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC,
and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 /
ZigBee applications.
PS/2
ADPCM
Voice
FIFFO
RF TX
MAC
RF RX
UART/2
MODEM
SPI
a-law
μ-law
DMA
AES
Engine
PLL
WDT
Temp.
Sensor
GPIO/24
Timer/4
PWM/2
MCU
(8051)
DATA
8KB
ROM
Quad
Key Scan
Digital
Regulator
Bat
Monitor
FLASH
96KB
RC
Oscillator
Clock
PLL
POR
3V
Ciruitry
ADC
(4CH)
Analog
Regulator
With an industry best +8 dBm output power, the MeshConnect IC will support a wide a variety of applications without the
need for external amplification. Combined with a highly sensitive -98 dBm receiver the MeshConnect IC leads the industry
with 106 dB link budget.
In addition to excellent RF performance at ZigBee (250 kbps) data rates, the IC adds high speed modes, Turbo (500 kbps)
and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O
pins, peripheral functions such as timers and UARTs and is one of the first devices to provide an embedded Voice CODEC.
CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware &
software tools required to develop custom applications.
The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinct
single chip solution.
The Extended Range module adds both an PA and LNA to maximize RF performance. The NEC uPG2250 PA enable the
Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA
boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm
enabling a line of sight range over 2 miles.
Page 4
MeshConnect™ Module Series
ANTENNA
CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector
can be specified, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on
page 1.
The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern.
To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the
ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under
the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to
antenna perfor­mance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the
transmitted signal.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board
under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the
module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
MODES OF OPERATION
There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register
and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption
and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8
describes the three power down modes.
Table 8 – Power Down Modes
PDMODE [1:0]
Description
Wake-Up Source
Regulator for Digital
block
Active (Normal Operation)
PM1 mode
Hardware Reset,
Sleep Timer interrupt,
External interrupt
ON
PM2 mode
Hardware Reset,
Sleep Timer interrupt,
External interrupt
OFF
(After wake-up, register
configuration is required)
PM3 mode
Hardware Reset,
External interrupt
OFF
(After wake-up, register
configuration is required)
Page 5
MeshConnect™ Module Series
POWER AMPLIFIER
The orginal MeshConnect module does not incorporate an external Power Amplifier and therefore the RF output port is
connected directly (through matching components) to the RF antenna. As CEL’s IC IEEE 802.15.4 / ZigBee transceiver
already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain
wireless connection over long distance (3,000 ft line-of-sight).
The Extended Range module adds both an PA and LNA to optimize RF performance. The NEC uPG2250 PA enable the
Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA
boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm
enabling a line of sight range over 2 miles.
INTERFACE
The MeshConnect has all major communication interfaces routed from the IC to the module edge connectors:
• UART1 & UART 2
• I2S
• SPI
VOICE CODEC
The MeshConnect IC includes three voice codec algorithms: μ-law, a-law and ADPCM.
The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America
and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the
analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it
can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be
traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in
European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing.
The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for
small signals.
Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the
quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes
the PCM values as differences between the current and the previous value. For audio applications this type of encoding
reduces the number of bits required per sample by about 25% compared to PCM.
SOFTWARE TOOLS
CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application.
PROFILE BUILDER
		 • Profile Builder allows for easy creation of custom ZigBee profiles for use in end-user applications.
		 • Uses the input requirements to modify a set of ‘C’ source files which include the necessary ZigBee functions.
		 • Output files will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Profile (ZDP) descriptors.
		 • The ZDO and ZDP define the ZigBee node and functionality.
The output files can be seamlessly integrated with the CEL ZigBee stack libraries.
Page 6
MeshConnect™ Module Series
SOFTWARE TOOLS (Continued)
DEVICE PROGRAMMER
• Device Programmer is used to program the application firmware to the on-chip Flash program memory of the
		 IC device.
• Device Programmer supports:
					 • ISP Mode: Download the firmware from the host PC via serial communication through the IC’s
						 UART1 interface.
									 • The evaluation boards utilize a USB -> Serial converter.
					 • OTA Mode: Download the firmware from the host PC using wireless communication (Over-The-Air).
									 • This requires two nodes, the host (connected to a PC) and the target device to be programmed.
Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the
aforementioned communication modes.
PROFILE SIMULATOR
• Profile Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices.
• Profile Simulator includes:
					 • Device Manager: Setting parameters of a ZigBee node.
					 • Bind Manager: Managing “bindings” in a ZigBee network.
					 • ZStack manager: Setting parameters of a ZigBee network.
					 • ZigBee Device Wizard: Selects network configuration during ZigBee network formation.
Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP.
PACKET ANALYZER AND WIRELESS NETWORK ANALYZER
• Packet Analyzer monitors traffic over a wireless network channel by capturing RF packet data in real-time.
• Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets.
• Packet Analyzer also includes diagnostic tools:
					 • Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel
						 yielding available channels.
					 • Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame.
• Packet Analyzer is capable of displaying network configuration (i.e. tree vs. star), network nodes, packet details, etc.
• Can be used in conjunction with any IEEE 802.15.4 or ZigBee network.
KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit).
• Supports all 8051 derivatives and variants.
• Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle.
• Supports memory banking for CODE and variables beyond the 64 kbyte threshold.
Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.
Page 7
MeshConnect™ Module Series
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™
Module
MeshConnect™
Extended Range Module
Unit
Min
Max
Min
Max
Power Supply Voltage (Vcc)
-0.3
3.3
-0.3
3.3
VDC
Voltage on any digital pin
-0.3
3.3
-0.3
3.3
VDC
-6
dBm
-55
125
-55
125
°C
260
°C
Input RF Level
10
Storage Temperature
Reflow Soldering Temperature
260
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
MeshConnect™ Module
MeshConnect™ Extended Range Module
Min
Typ
-40
25
Operating ambient temperature range, TA
Unit
85
°C
2.1
3.0
VDC
2.405
2.48
GHz
Operating Supply Voltage
Input Frequency
Max
DC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)
Description
Vcc Supply (Vcc)
MeshConnect™
Module
Min
Typ
2.1
MeshConnect™
Extended Range Module
Max
Min
3.3
2.1
Typ
Max
Unit
3.3
VDC
42
mA
RX mode Current (Vcc = 3.0V)
35
38
38
TX mode Current (Vcc = 3.0V)
44
48
175
mA
TX mode Current (Vcc = 2.1V)
44
48
120
mA
Sleep Mode (Deep) Current
µA
RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)
Description
Frequency Band (16 – 5MHz wide channels)
MeshConnect™
Module
Min
Typ
2.405
RX Sensitivity for 1% PER
-97
Saturation (maximum input level)
MeshConnect™
Extended Range Module
Max
Min
2.480
2.405
-85
Typ
-103.5
Max
Unit
2.480
GHz
-85
dBm
-11
dBm
TX Output Power (VCC = 3.0V)
4.5
6.0
20
dBm
TX Output Power (VCC = 2.1V)
4.5
6.0
15.5
dBm
Error Vector Magnitude
17
Adjacent Channel Rejection
+/- 5 MHz
+/- 10 MHz
35
35
Frequency Error Tolerance
-96.2
47
51
55
Over the Air Data Rate
250
15
35
35
96.2
Output Power Control Range
Harmonics (2nd & 3rd)
35
35
47
51
-96.2
dB
96.2
55
1000
-41.2
250
kHz
dB
1000
kbps
-41.2
dBm/MHz
Page 8
MeshConnect™ Module Series
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module
Dimensions shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
Pin
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Type
GND
GND
GND-RF
GND
GND
GND-RF
MS1
NC
static control
line
GND
GND
GND-RF
GND
NC
GND
NC
NC
NC
GND
GND
GND-Logic
GND
GND
Functionality
IC
Pin
Ground
Ground
N/A
Ground
Ground
N/A
No connect
14
Ground
N/A
Description
Mode Select, Bit #1. Active Low Internal
Voltage Regulator Enable:
0: Internal Voltage Regulator Enabled
1: Internal Voltage Regulator Disabled, Supply
Analog and Digital Supply Voltages Externally
Ground
GND
Ground
13
No connect
N/A
Ground
Ground
49
GND-Logic
Ground
Ground
49
no connect
GND
GND
GND-Logic
Ground
Ground
49
10
GND
GND
GND-Logic
Ground
Ground
49
11
GND
GND
GND-Logic
Ground
Ground
49
12
ACH0
ACH0
Analog Input
1.5V Level Analog ADC0 Input
ADC input
13
ACH1
ACH1
Analog Input
1.5V Level Analog ADC1 Input
ADC input
14
ACH2
ACH2
Analog Input
1.5V Level Analog ADC2 Input
ADC input
10
15
ACH3
1.5V Level Analog ADC3 Input
ADC input
11
ACH3
Analog Input
16
P1_7
(1)
NC
digital I/O
Port P1.7
Digital I/O
20
17
P1_6(1)
NC
digital I/O
Port P1.6
Digital I/O
21
18
P1_4
P1_4
digital I/O
Port P1.4 / QUADZB / Sleep Timer OSC
Buffer Input
19
P1_3
P1_3
digital I/O
20
GND
GND
GND-Logic
Port P1.3 / QUADZA / Sleep Timer OSC
Buffer Output / RTCLKOUT
21
GND
GND
GND-Logic
Ground
22
GND
GND
GND-Logic
Ground
23
P1_1
P1_1
digital I/O
24
VCC_3V
VCC_3V
Power
25
P1_0
P1_0
digital I/O
Port P1.0 / RXD1
26
P3_7
P3_7
digital I/O
27
P3_6
P3_6
digital I/O
Ground
Port P1.1 / TXD1
3.0V Power supply for Analog Internal
Voltage Regulator
digital I/O or
dedicated function
port
digital I/O or dedicated
function port
22
23
Ground
49
Ground
49
Ground
49
digital I/O or
dedicated function
port
24
Power Input
digital I/O or dedicated
function port
26
Port P3.7 / 12mA Drive capability / PWM3 /
CTS1 / SPICSN
digital I/O with high
current capability
27
Port P3.6 / 12mA Drive capability /PWM2 /
RTS1 / SPICLK
digital I/O with high
current capability
28
Note:
1. Pin used on extended range module to control on board power amplifier.							
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
Page 9
MeshConnect™ Module Series
MeshConnect I/O PIN ASSIGNMENTS (Continued)
Pin
MeshConnect™
Module
MeshConnect™
Extended Range
Module
Type
28
P3_5
P3_5
digital I/O
Port P3.5 / T1 / CTS0 / QUADYB / SPIDO
29
P3_4
P3_4
digital I/O
Port P3.4 / T0 / RTS0 / QUADYA / SPIDI
30
GND
GND
GND-Logic
31
P3_3
P3_3
digital I/O
Port P3.3 / INT1 (active low)
32
P3_2
P3_2
digital I/O
Port P3.2 / INT0 (active low)
33
GND
GND
GND-Logic
34
P3_1
P3_1
digital I/O
Port P3.1 / TXD0 / QUADXB
35
P3_0
P3_0
digital I/O
Port P3.0 / RXD0 / QUADXA
Description
Ground
Ground
digital I/O or dedicated
function port
digital I/O or dedicated
function port
Ground
digital I/O or dedicated
function port
digital I/O or dedicated
function port
Ground
digital I/O or dedicated
function port
digital I/O or dedicated
function port
IC
Pin
29
30
49
31
32
49
33
35
36
GND
GND
GND-Logic
Ground
49
37
P0_7
P0_7
digital I/O
GPIO 8051 Port P0.7 / I2STX_MCLK
digital I/O
36
38
P0_6
P0_6
digital I/O
GPIO 8051 Port P0.6 / I2STX_BCLK
digital I/O
37
39
P0_5
P0_5
digital I/O
GPIO 8051 Port P0.5 / I2STX_LRCLK
digital I/O
38
40
P0_4
P0_4
digital I/O
GPIO 8051 Port P0.4 / I2STX_DO
digital I/O
39
41
P0_3
P0_3
digital I/O
GPIO 8051 Port P0.3 / I2SRX_MCLK
digital I/O
40
42
P0_2
P0_2
digital I/O
GPIO 8051 Port P0.2 / I2SRX_BCLK
digital I/O
41
43
P0_1
P0_1
digital I/O
GPIO 8051 Port P0.1 / I2SRX_LRCK
digital I/O
42
44
P0_0
P0_0
digital I/O
GPIO 8051 Port P0.0 / I2SRX_DI
digital I/O
43
Power
Output of Digital Internal Voltage Regulator
(1.5V) / 1.5V Power supply for Digital
Core(input mode @ No REG)
Selected as Internal
Regulator output or
Regulated Voltage
supply Input
19
Mode Select, Bit #2. Active High In-System
Programming (ISP) Input:
0: Normal Mode
1: ISP Mode
Programming
15
Hardware Reset
17
45
DVDD_1_5(2)
NC
Ground
Functionality
46
ISP
ISP
Digital Input
47
RESET
RESET
Control
48
AVDD_1_5(2)
NC
Power
49
GND
GND
GND-Logic
Ground
50
GND
GND
GND-Logic
51
GND
GND
GND-Logic
52
GND
GND
53
GND
GND
Reset (Active Low)
Output of Analog Internal Voltage Regulator
(1.5V) / 1.5V Power supply for Mixer, VGA,
and LPF (input mode @ No REG)
Selected as Internal
Regulator output or
Regulated Voltage
supply Input
Ground
49
Ground
Ground
49
Ground
Ground
49
GND-Logic
Ground
Ground
49
GND-Logic
Ground
Ground
49
54
NC
NC
NC
No connect
N/A
55
GND
GND
GND-RF
No Connect
Ground
Ground
N/A
56
GND
GND
GND-RF
Ground
Ground
N/A
Note:
1. Pin used on extended range module to control on board power amplifier.							
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
Page 10
MeshConnect™ Module Series
MODULE DIMENSIONS
MeshConnect™ Module / MeshConnect™ Extended Range Module
w/U.FL Connector for external antenna
0.120”
ZICM2410P0
0007-00-00-00-001
J2
0R
C25
Pin 1
RF Shield
R1
R7
U1
C14
L2
C24
C5B
C6A C1
L6
C6B
C6
R2
ZIC2410
QN48
C9
C10
R5
C4A
C17
C2
R4
C16
R9
R6
C22
R8
L5
C11
L3
C13
L4
R11 C23
1.413”
R10
0.895”
C7B
C20
Pin 56
C21
C7
XTAL1
C15
Pin 38
Pin 19
1.000”
0.195”
0.062”
MeshConnect™ Module / MeshConnect™ Extended Range Module
w/PCB Trace Antenna
ZICM2410P0
0007-00-00-00-001
J2
0R
C25
Pin 1
RF Shield
U1
C14
L2
C6A C1
L6
C6B
C6
R2
ZIC2410
QN48
C10
R6
R9
C22
R8
C5B
C4A
C17
R5
C2
R4
1.413”
R7
C24
R11 C23
L5
C11
L3
C13
L4
R1
C9
R10
0.895”
C7B
C20
Pin 56
C21
C7
C16
XTAL1
C15
Pin 38
Pin 19
1.000”
0.195”
0.062”
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
Page 11
MeshConnect™ Module Series
MODULE LAND FOOTPRINT
Note: Unless otherwise specified. Dimensions are in Inches [mm].
1.100 [27.94]
1.000 [25.41]
0.050 [1.27]
COPPER KEEPOUT
0.361 [9.17]
0.050 [1.27] Pitch
0.940 [23.88]
1.055 [26.80]
56 x 0.040 [1.02]
56 x 0.100 [2.54]
0.105 [2.67]
0.990 [22.61]
Page 12
MeshConnect™ Module Series
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TL
60-150 sec
Tpeak
260 + 0ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp down rate
6ºC/sec max
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
•
•
•
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Page 13
MeshConnect™ Module Series
PROCESSING (Continued)
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating
from underneath is recommended. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
AGENCY CERTIFICATIONS
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or
certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC
ID: W7Z-ICP0”
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified
with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
Page 14
MeshConnect™ Module Series
AGENCY CERTIFICATIONS (Continued)
IC Certification — Industry Canada Statement
The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications
were met.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
CE Certification — Europe
The MeshConnect RF module has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to
make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
·
·
·
If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
The CE mark must be a minimum of 5mm in height
The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
Page 15
MeshConnect™ Module Series
REFERENCES & REVISION HISTORY
Previous Versions
Changes to Current Version
Page(s)
0007-00-07-00-000
(Issue A) February 05, 2009
Initial preliminary datasheet.
0007-00-07-00-000
(Issue B) June 11, 2009
Updated Development Kit and Agency Certification
2, 14, 15
0007-00-07-00-000
(Issue C) October 6, 2009
Added New MeshConnect Extended Range Module
All
N/A
Disclaimer
• The information in this document is current as of October, 2009. The information is subject to change without 		
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please 		
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written 		
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative 		
purposes in semiconductor product operation and application examples. The incorporation of these circuits, 		
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and 		
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.
Page 16

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History When                    : 2009:04:20 13:14:11-07:00, 2009:04:20 13:14:11-07:00, 2009:04:20 13:20:30-07:00, 2009:04:20 13:58:29-07:00, 2009:05:14 13:29:23-07:00, 2009:05:14 13:29:55-07:00, 2009:05:14 13:32:20-07:00, 2009:05:14 13:56:56-07:00, 2009:06:03 14:34:24-07:00, 2009:06:09 16:29:52-07:00, 2009:06:09 16:31:25-07:00, 2009:06:09 16:34:01-07:00, 2009:06:09 16:34:45-07:00, 2009:06:09 16:35-07:00, 2009:06:09 16:39:41-07:00, 2009:06:09 16:40:39-07:00, 2009:06:09 16:57:55-07:00, 2009:06:09 16:58-07:00, 2009:06:09 16:59:24-07:00, 2009:06:09 17:00:09-07:00, 2009:06:09 17:02:16-07:00, 2009:06:09 17:02:50-07:00, 2009:06:09 17:03:04-07:00, 2009:06:09 17:03:33-07:00, 2009:06:09 17:04:54-07:00, 2009:06:09 17:05:07-07:00, 2009:06:09 17:07:05-07:00, 2009:06:09 17:07:19-07:00, 2009:06:09 17:08:04-07:00, 2009:06:09 17:08:52-07:00, 2009:06:09 17:09:58-07:00, 2009:06:09 17:11:51-07:00, 2009:06:09 17:28:56-07:00, 2009:06:09 17:30:14-07:00, 2009:06:09 17:30:56-07:00, 2009:06:09 17:32:27-07:00, 2009:06:09 17:33:25-07:00, 2009:06:09 17:33:49-07:00, 2009:06:09 17:34:34-07:00, 2009:06:09 17:36:59-07:00, 2009:06:09 17:37:38-07:00, 2009:06:09 17:38:28-07:00, 2009:06:10 11:36:55-07:00, 2009:06:11 08:23:25-07:00, 2009:06:12 07:52:50-07:00, 2009:06:12 07:53:30-07:00, 2009:09:17 13:10:10-07:00, 2009:09:17 13:15:19-07:00, 2009:09:17 13:23:17-07:00, 2009:09:17 13:24:12-07:00, 2009:09:17 13:29:33-07:00, 2009:09:17 14:46:46-07:00, 2009:09:17 14:51:07-07:00, 2009:09:17 14:52:45-07:00, 2009:09:17 14:55:26-07:00, 2009:09:17 14:56-07:00, 2009:09:17 14:58:14-07:00, 2009:09:17 15:40:33-07:00, 2009:09:17 16:04:16-07:00, 2009:09:18 09:07:25-07:00, 2009:09:18 09:16:05-07:00, 2009:09:18 09:17:10-07:00, 2009:09:18 09:46:44-07:00, 2009:09:18 10:22:42-07:00, 2009:09:18 10:37:51-07:00, 2009:09:18 10:52:31-07:00, 2009:09:18 10:53:49-07:00, 2009:09:18 10:54:08-07:00, 2009:09:18 10:55:01-07:00, 2009:09:18 10:57:41-07:00, 2009:09:18 11:05:04-07:00, 2009:09:18 11:05:37-07:00, 2009:09:18 11:07:11-07:00, 2009:09:18 11:14:55-07:00, 2009:09:18 13:41:43-07:00, 2009:09:18 13:50:24-07:00, 2009:09:18 14:06:38-07:00, 2009:09:18 14:09:57-07:00, 2009:09:18 14:12:11-07:00, 2009:09:18 14:13:09-07:00, 2009:09:24 15:29:16-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:59:19-07:00, 2009:09:28 10:00:22-07:00, 2009:09:28 10:00:33-07:00, 2009:09:28 10:00:52-07:00, 2009:09:28 10:03:50-07:00, 2009:09:28 10:05:45-07:00, 2009:09:28 10:10:45-07:00, 2009:09:28 10:15:40-07:00, 2009:09:28 10:16:37-07:00, 2009:09:28 10:18:03-07:00, 2009:09:28 10:18:18-07:00, 2009:09:28 10:22:13-07:00, 2009:09:28 10:24:50-07:00, 2009:09:28 10:25:51-07:00, 2009:09:28 10:36:44-07:00, 2009:09:28 10:38:28-07:00, 2009:09:28 10:40:35-07:00, 2009:09:28 10:48:42-07:00, 2009:09:28 10:49:34-07:00, 2009:09:28 10:50:24-07:00, 2009:09:28 10:51:27-07:00, 2009:09:28 10:51:40-07:00, 2009:09:28 10:52:17-07:00, 2009:09:28 11:13:07-07:00, 2009:09:28 11:18:34-07:00, 2009:09:28 11:18:56-07:00, 2009:09:28 11:43:38-07:00, 2009:09:28 11:44:08-07:00, 2009:09:28 11:44:56-07:00, 2009:09:28 11:46:56-07:00, 2009:09:28 11:48:46-07:00, 2009:09:28 11:54:19-07:00, 2009:09:28 11:55:25-07:00, 2009:09:28 11:59:25-07:00, 2009:09:28 12:04:12-07:00, 2009:10:02 09:52:40-07:00, 2009:10:02 09:58:12-07:00, 2009:10:02 10:17:22-07:00, 2009:10:02 10:18:23-07:00, 2009:10:02 10:35:31-07:00, 2009:10:02 10:39:25-07:00, 2009:10:02 10:51:34-07:00, 2009:10:02 10:58:08-07:00, 2009:10:02 10:58:49-07:00, 2009:10:02 10:59-07:00, 2009:10:02 11:03:27-07:00, 2009:10:02 11:20:01-07:00, 2009:10:02 11:20:23-07:00, 2009:10:02 11:24:08-07:00, 2009:10:02 12:20:32-07:00, 2009:10:02 12:21:14-07:00, 2009:10:02 12:22:16-07:00, 2009:10:06 08:45:11-07:00, 2009:10:06 08:45:34-07:00, 2009:10:06 08:45:47-07:00, 2009:10:06 08:47:57-07:00, 2009:10:06 08:49:08-07:00
History Software Agent          : Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0, Adobe InDesign 6.0
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Manifest Link Form              : ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream, ReferenceStream
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Manifest Placed Resolution Unit : Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches
Manifest Reference Instance ID  : uuid:CD64BA9EA160DD11A8CDD1E5C3F585E7, xmp.iid:028011740720681188C68C7A136BBD20, uuid:c173b5be-5591-f24d-944b-d2839434bef2, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:50c821bd-69df-a34f-93cb-940a7db6ed00, uuid:57F28AED6AF4DD118FB4BF5883E62C33, xmp.iid:88FF03423F2068119B4ACD44AE791B04, xmp.iid:068011740720681192B0C8AF152FFB05, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:01A3F9323DE9DD118679FB8ADF5C8B78, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:DA37E08AF8F4DD1193D2DA34824D8F7A, uuid:DB37E08AF8F4DD1193D2DA34824D8F7A, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:A24EF6326BF0DD11AC57D2DC4EEDB57F, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, uuid:9D977BA6F965DD119137B6FC631E0728, xmp.iid:F77F117407206811B1A4CFEE8D7D83D1, xmp.iid:F87F117407206811B1A4CFEE8D7D83D1, uuid:9D977BA6F965DD119137B6FC631E0728
Manifest Reference Document ID  : xmp.did:0180117407206811A961CDDB8602307D, xmp.did:F77F11740720681191098BA89EC9F96E, xmp.did:FB7F11740720681191098E001D0A51F2, uuid:CE64BA9EA160DD11A8CDD1E5C3F585E7, xmp.did:46F2AF7A2E206811B302ECC270134B5E, uuid:0BB9DA9DE3CDDD118228C3D767C4015E, uuid:00A3F9323DE9DD118679FB8ADF5C8B78, uuid:FCA2F9323DE9DD118679FB8ADF5C8B78, uuid:D737E08AF8F4DD1193D2DA34824D8F7A, uuid:5501B76A3EF0DD11AC57D2DC4EEDB57F, xmp.did:F77F117407206811B1A4CFEE8D7D83D1, xmp.did:F87F117407206811B1A4CFEE8D7D83D1
Create Date                     : 2009:10:06 09:11:36-07:00
Modify Date                     : 2009:10:06 09:11:45-07:00
Metadata Date                   : 2009:10:06 09:11:45-07:00
Creator Tool                    : Adobe InDesign CS4 (6.0.4)
Thumbnail Format                : JPEG
Thumbnail Width                 : 256
Thumbnail Height                : 256
Thumbnail Image                 : (Binary data 12997 bytes, use -b option to extract)
Doc Change Count                : 2927
Format                          : application/pdf
Producer                        : Adobe PDF Library 9.0
Trapped                         : False
Page Count                      : 16
Creator                         : Adobe InDesign CS4 (6.0.4)
EXIF Metadata provided by EXIF.tools
FCC ID Filing: W7Z-ZIC2410P2

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