California Eastern Laboratories ZICM357P2 MeshConnect™ EM357 Zigbee Module User Manual Manual

California Eastern Laboratories MeshConnect™ EM357 Zigbee Module Manual

Manual

Page 1MeshConnect™ EM357 ModuleDESCRIPTION CEL’s MeshConnect™ EM357 Module combines high perfor-mance RF solution with the market's premier ZigBee stack. The addition of on board memory enables Over-The-Air (OTA) programming without the need for additional in system memory. The integrated power amplier maximizes range and perfor-mance. The small module footprint makes it suitable for a wide range of ZigBee applications. The MeshConnect EM357 mod-ule is certied and qualied enabling customers to accelerate time to market by greatly reducing the design and certicationphases of development.CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is based on the Ember EM357 Zigbee compliant SOC IC. The IC is a single-chip solution, compliant with ZigBee specications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with the baseband modem, a hardwired MAC and an embedded 32-bit ARM® Cortex™-M3 microcontroller with internal RAM (12kB) and Flash (192kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect EM357 module adds a power amplier (PA) to increase range up to 2.5 miles, provide more reliable trans-mission, and reduce the number of nodes in your network. It is especially useful for open outdoor applications where the nodes are physically far apart or for indoor use where the nodes have to operate in a noisy RF environment. The Module’s outstand-ing 120dB link budget ensures high quality connections even in such harsh environments. The MeshConnect EM357 module also integrates an 1MB Flash memory for Over-The-Air program updates, making this device ready for Smart Energy Applications. Integrated Transceiver Modules for ZigBee/IEEE 802.15.4Development Kit available: ZICM357P2-KIT1-1The information in this document is subject to change without notice, please conrm data is currentDocument No: 0008-00-07-00-000 (Issue A)Date Published: January 21, 2011DATA SHEETORDERING INFORMATIONPart Number Order Number DescriptionMeshConnect™ EM357 ModuleZICM357P2-1 +20 dBm Output power, PCB Trace antennaZICM357P2-1C +20 dBm Output power, with U.FL Connector for external antennaZICM357P2-KIT1-1 +20 dBm Engineering Development Kit• FLASHMemory: 192 kB (EM357 internal) 1MB (on module board)• 12kBSRAM• 32-bitARM®Cortex™-M3• Upto23GPIOPins• SPI(Master/Slave),TWI,UART• Timers,SerialWire/JTAGInterface• 5-channel14-bitADCMeshConnect™ EM357 ModuleZICM357P2-1 Ember EM357 Transceiver Based Module•HighRFperformance:  Up to 120 dB RF Link Budget RX Sensitivity: -100 dBm RF TX Power: +20 dBm•DataRate:250kbps•Smallfootprint:1”x1.41” (25.4 mm x 35.9 mm)•AdvancedPowerManagement Scheme w/ Deep Sleep Mode FEATURES•IntegratedPCBtraceantenna Optional U.FL external Antenna•15RFchannels•Upto13,000feetofrange•AESencryption•FCC,CEandICcertications•ROHScompliantAPPLICATIONS• SmartEnergy/GridMarkets Smart Meters• Buildingautomationandcontrol• Homeautomationandcontrol Thermostats Displays Energy Management Security Devices HVAC control Lighting control• GeneralZigBeewireless sensornetworking • Transmit power +20dBm • 1MB additional ash for Over-The-Air programming • +120 dB RF link budget • Range up to 2.5 miles
MeshConnect™ EM357 ModulePage 2MODULEBLOCKDIAGRAM24 MHz XTALRadioMicroprocessor ANTCastellation Edge ConnectorPWR RegFlash1MBEmber EM357EM357 ModuleBalun PABalunSPIBusDEVELOPMENTKITCEL's Development Kit assists users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environ-ment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application develop-ment. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for ap-plication development. The interface board features a serial communication inter-face, a power management module, and peripherals such as a buzzer, a temperature sensor, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website http://www.cel.com)Kit Contents:•EvaluationBoardsw/Module(2)•USBCables(1)•AABatteries(4)•Software&TechnicalInformationCD(1)MeshConnect™ EM357 Module Development KitDEVELOPMENTKITORDERINGINFORMATIONPart Number Order Number DescriptionMeshConnect™ EM357 Module Development KitZICM357P2-KIT1-1 +20 dBm Engineering Development Kit
MeshConnect™ EM357 ModulePage 3IntroductionandOverviewDescription.............................................................................................................................................................................................. 1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information............................................................................................................................................................................. 1ModuleBlockDiagram........................................................................................................................................................................... 2Development Kit..................................................................................................................................................................................... 2SystemLevelFunctionTransceiver IC......................................................................................................................................................................................... 4AdditionalFlashMemory....................................................................................................................................................................... 4Antenna................................................................................................................................................................................................... 4PowerAmplier....................................................................................................................................................................................... 4ElectricalSpecicationAbsoluteMaximumRatings................................................................................................................................................................... 5Recommended(OperatingCondition).................................................................................................................................................. 5DCCharacteristics.................................................................................................................................................................................. 5RFCharacteristics.................................................................................................................................................................................. 5PinSignal&InterfacesPinSignalsI/OConguration................................................................................................................................................................ 6I/O Pin Assignment................................................................................................................................................................................. 6Software/Firmware.................................................................................................................................................................................. 8Module Dimensions................................................................................................................................................................................ 9Module Footprint.................................................................................................................................................................................... 9Processing......................................................................................................................................................................................... 11AgencyCertications................................................................................................................................................................... 12Shipment,Storage&Handling................................................................................................................................................. 14References&RevisionHistory................................................................................................................................................. 15TABLEOFCONTENTS
MeshConnect™ EM357 ModulePage 4TRANSCEIVER IC The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications.For more information about the Ember EM357 IC, visit http://www.ember.comADDITIONALFLASHMEMORYThe MeshConnect EM357 module incorporates an additional 1MB external Flash memory for Over-The-Air program up-dates. The Flash memory communicates over the EM357’s second serial controller using SPI. The ash memory is wired to the following castellation pins: PA0 - SC2MOSIPA1 - SC2MISOPA2 - SC2SCLKPA3 - SC2nSSELWP - Flash memory Write Protect line (has internal pull-up resistor, but not connected to the EM357)The instruction set for the Flash memory is similar to the Micron M25P80. Note that in order to achieve the specied sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory. See http://www.micron.com for more information on the instruction set. ANTENNACEL’s MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional U.FL connec-tor can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efcient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute signicantly to the antenna performance (it should not be directly under the Inverted F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module.  • Never place the antenna close to metallic objects.  • In the overall design, ensure that wiring and other components are not placed near the antenna.  • Do not place the antenna in a metallic or metalized plastic enclosure.  • Keep plastic enclosures 1cm or more from the antenna in any direction.For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.POWERAMPLIFIERThe MeshConnect EM357 Module includes a Power Amplier (PA). This PA delivers high efciency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a network. The PA is connected to the alternate EM357 IC TX output, so EM357 TX power modes 2 or 3 must be used to achieve the specied output power.
MeshConnect™ EM357 ModulePage 5ABSOLUTEMAXIMUMRATINGSDescription MeshConnect™ EM357 Module UnitMin MaxPower Supply Voltage (VDD) -0.3 3.6 VDCVoltage on any I/O Line -0.3 VDD + 0.3 VDCRF Input Power – 15 dBmStorage Temperature Range -40 125 °CReow Soldering Temperature – 260 °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.RECOMMENDED(OPERATINGCONDITIONS) Description MeshConnect™ EM357 Module UnitMin Typ MaxPower Supply Voltage (VDD) 2.7 3.3 3.6 VInput Frequency 2405 – 2475 MHzAmbient Temperature Range -40 25 85 °CDCCHARACTERISTICS(@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)Description MeshConnect™ EM357 Module UnitMin Typ MaxTransmit Mode Current – 170 – mAReceive Mode Current – 28 – mASleep Mode Current – 6 – µA RFCHARACTERISTICS(@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)Description MeshConnect™ EM357 Module UnitMin Typ MaxGeneralCharacteristicsRF Frequency Range 2405 –2475 MHzRF Channels 11 – 25 –Frequency Error Tolerance -96.2 – 96.2 kHzTransmitterMaximum Output Power – 20 – dBmMinimum Output Power – -40 – dBmOffset Error Vector Magnitude – 15 35 %ReceiverSensitivity (1% PER, boost mode) – -100 -94 dBmSensitivity (1% PER, normal mode) – -98 -92 dBmSaturation (maximum input level) 0 – – dBm
MeshConnect™ EM357 ModulePage 6PINSIGNALSI/OPORTCONFIGURATIONMeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnectI/OPINASSIGNMENTSCEL MeshConnect EM357 Module PIN NumberEmber EM357 IC Pin NumberName Notes1 49 GROUND2 N/C WP Flash memory write protect (internal pull-up)3 21 PA0 Dedicated as SC2MOSI due to Flash memory4 22 PA1 Dedicated as SC2MISO due to Flash memory5 24 PA2 Dedicated as SC2SCLK due to Flash memory6 25 PA3 Reserved as SC2nSSEL for Flash memory7 49 GROUND8 16, 23, 28, 37 VCC9 12 RESET Acve Low (Input)10 13 PC6Digital I/O OSC32B - 32.768 kHz crystal oscillator nTX_ACTIVE - Inverted TX_ACTIVE signal11 14 PC7Digital I/O OSC32A - 32.768 kHz crystal oscillator OSC32_EXT - Digital 32.768 kHz clock input source12 18 PA7Digital I/O TIM1C4 - Timer 1 Channel 4 output TIM1C4 - Timer 1 Channel 4 input REG_EN - External regulator open drain output13 19 PB3Digital I/O TIM2C3 - Timer 2 channel 3 output TIM2C3 - Timer 2 channel 3 input SC1nCTS - UART CTS handshake of Serial Controller 1 SC1SCLK - SPI master/slave clock of Serial Controller 114 20 PB4Digital I/O TIM2C4 - Timer 2 channel 4 output TIM2C4 - Timer 2 channel 4 input SC1nRTS - UART RTS handshake of Serial Controller 1 SC1nSSEL - SPI slave select of Serial Controller 115 26 PA4Digital I/O ADC4 - ADC Input 4 PTI_EN - Frame signal of Packet Trace Interface (PTI) TRACEDATA2 - Synchronous CPU trace data bit 216 27 PA5Digital I/O ADC5 - ADC Input 5 PTI_DATA - Data signal of Packet Trace Interface (PTI) nBOOTMODE - Embedded serial bootloader acvaon out of rest TRACEDATA3 - Synchronous CPU trace data bit 317 29 PA6Digital I/O TIM1C3 - Timer 1 channel 3 output TIM1C3 - Timer 1 channel 3 input
MeshConnect™ EM357 ModulePage 718 30 PB1Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data of Serial Controller 1 SC1TXD - UART transmit data of Serial Controller 1 TIM2C1 - Timer 2 channel 1 output TIM2C1 - Timer 2 channel 1 input19 49 GROUND20 49 GROUND21 49 GROUND22 31 PB2Digital I/O SCIMISO - SPI master data in of Serial Controller 1 SC1MOSI - SPI slave data in of Serial Controller 1 SC1SCL - TWI clock of Serial Controller 1 SC1RXD - UART receive data of Serial Controller 1 TIM2C2 - Timer 2 channel 2 output TIM2C2 - Timer 2 channel 2 input23 32 JTCK JTAG clock input from debugger SWCLK - Serial Wire clock input/output with debugger24 33 PC2Digital I/O JTDO - JTAG data out to debugger SWO - Serial Wire Output asynchronous trace output to debugger25 NC No connect26 34 PC3 Digital I/O JTDI - JTAG data in from debugger27 35 PC4Digital I/O JTMS - JTAG mode select from debugger SWDIO - Serial Wire bidireconal data to/from debugger28 49 GROUND29 36 PB0Digital I/O VREF - ADC reference output VREF - ADC reference input IRQA - External interrupt source A TRACECLK - Synchronous CPU trace clock TIM1CLK - Timer 1 external clock input TIM2MSK - Timer 2 external clock mask input30 38 PC1 cc31 40 PC0Digital I/O JRST - JTAG reset input from debugger IRQD - Default external interrupt source D TRACEDATA1 - Synchronous CPU trace data bit 132 NC No connect33 41 PB7Digital I/O ADC2 - ADC Input 2 IRQC - Default external interrupt source C TIM1C2 - Timer 1 channel 2 output TIM1C2 - Timer 1 channel 2 inputMeshConnectI/OPINASSIGNMENTS(Continued)CEL MeshConnect EM357 Module PIN NumberEmber EM357 IC Pin NumberName Notes
MeshConnect™ EM357 ModulePage 8SOFTWARE/FIRMWAREThe MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO, the industry’s most deployed and eld proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol software package containing all the elements required for mesh networking applications. For more information regarding the software development for this IC, visit http://www.ember.comThe MeshConnect Development Kit provides a guide on how to access the EM357 IC and utilize the Ember software devel-opment environment. It also provides a point to point demo application (transfer data between 2 devices) to conduct a range test and supports low level peripheral tests.34 42 PB6Digital I/O ADC1 - ADC Input 1 IRQB - External interrupt source B TIM1C1 - Timer 1 channel 1 output TIM1C1 - Timer 1 channel 1 input35 43 PB5Digital I/O ADC0 - ADC Input 0 TIM2CLK - Timer 2 external clock input TIM1MSK - Timer 1 external clock mask input36 49 GROUND37 49 GROUND38 49 GROUND39 NC No connect40 NC No connect41 NC No connect42 NC No connect43 NC No connect44 NC No connect45 49 GROUND46 49 GROUND47 49 GROUND48 49 GROUND49 49 GROUND50 49 GROUND51 49 GROUND52 49 GROUND53 49 GROUND54 49 GROUND55 49 GROUND56 49 GROUNDNote: PC5 is not brought out to a castellation since it is required to control the PA. For additional Pin-out details please reference Ember's EM357 IC Data sheet.CEL MeshConnect EM357 Module PIN NumberEmber EM357 IC Pin NumberName NotesMeshConnectI/OPINASSIGNMENTS(Continued)
MeshConnect™ EM357 ModulePage 9MODULEDIMENSIONS1.000”0.195”0.903”1.413”0.062”0.120”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1Pin 1Pin 19 Pin 38Pin 56EM357SeriesARM0000000000000EM357 ModuleZICM357P2For layout recommendation for optimum antenna performance, refer to Antenna section in this document.1.000”0.195”0.903”1.413”0.062”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1Pin 1Pin 19 Pin 38Pin 56EM357SeriesARMR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1EM357SeriesARM0000000000000EM357 ModuleZICM357P2MeshConnect™ EM357 Module w/PCB Trace AntennaMeshConnect™ EM357 Module w/U.FL Connector for external antenna
MeshConnect™ EM357 ModulePage 10MODULELANDFOOTPRINTNote: Unless otherwise specied. Dimensions are in Inches [mm].
MeshConnect™ EM357 ModulePage 11PROCESSINGRecommendedReowProleParameters ValuesRamp up rate (from Tsoakmax to Tpeak) 3º/sec maxMinimum Soak Temperature 150ºC Maximum Soak Temperature 200ºCSoak Time 60-120 secTLiquidus 217ºC Time above TL 60-150 secTpeak 250ºCTime within 5º of Tpeak 20-30 secTime from 25º to Tpeak 8 min maxRamp down rate 6ºC/sec maxPb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-cation. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias.RepeatingReowSoldering Only a single reow soldering process is encouraged for host boards.WaveSoldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
MeshConnect™ EM357 ModulePage 12PROCESSING (Continued)AGENCYCERTIFICATIONSHandSolderingHand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711)Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC. Caution If temperature ramps exceed the reow temperature prole, module and component damage may occur due to thermal shock. Avoid overheating. WarningNever attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.FCCComplianceStatement(Part15.19)Section7.15ofRSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning(Part15.21)Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEMResponsibilitytotheFCCRulesandRegulationsThe MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC ID: W7Z-ICP0”The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ EM357 ModulePage 13AGENCYCERTIFICATIONS(Continued)ICCertication—IndustryCanadaStatementThe term "IC" before the certication / registration number only signies that the Industry Canada technical specications were met.CerticationIC-Déclarationd'IndustrieCanadaLe terme "IC" devant le numéro de certication / d'enregistrement signie seulement que les spécications techniques Industrie Canada ont été respectées.Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpL'article14duCNR-210Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpCECertication—Europe The MeshConnect RF module has been tested and certied for use in the European Union. OEMResponsibilitytotheEuropeanUnionComplianceRulesIf the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEMLabelingRequirementsThe `CE' mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials “CE” with the following form: · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. · The CE mark must be a minimum of 5mm in height · The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the “CE” marking as shown in the picture
MeshConnect™ EM357 ModulePage 14SHIPMENT,HANDLING,ANDSTORAGEShipmentThe MeshConnect Modules are delivered in trays of 28.HandlingThe MeshConnect Modules are designed and packaged to be processed in an automated assembly line.WarningThe MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. WarningThe MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. MoistureSensitivityLevel(MSL)MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
MeshConnect™ EM357 ModulePage 15REFERENCES&REVISIONHISTORYPrevious Versions ChangestoCurrentVersion Page(s)0008-00-07-00-000 (Issue ES) October 14, 2010 Initial preliminary datasheet. N/A0008-00-07-00-000 (Issue A) January 21, 2011Updated RF Channels to 15 for FCC Certication. Updated Pin out table. Updated processing guidelines. 1, 5Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

Navigation menu