California Eastern Laboratories ZICM357P2 MeshConnect™ EM357 Zigbee Module User Manual Manual

California Eastern Laboratories MeshConnect™ EM357 Zigbee Module Manual

Manual

Download: California Eastern Laboratories ZICM357P2 MeshConnect™ EM357 Zigbee Module User Manual Manual
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Date Submitted2011-04-11 00:00:00
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DATA SHEET
MeshConnect™ EM357 Module
ZICM357P2-1
Ember EM357 Transceiver Based Module
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kit available: ZICM357P2-KIT1-1
DESCRIPTION
CEL’s MeshConnect™ EM357 Module combines high performance RF solution with the market's premier ZigBee stack.
The addition of on board memory enables Over-The-Air (OTA)
programming without the need for additional in system memory.
The integrated power amplifier maximizes range and performance. The small module footprint makes it suitable for a wide
range of ZigBee applications. The MeshConnect EM357 module is certified and qualified enabling customers to accelerate
time to market by greatly reducing the design and certification
phases of development.
CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is
based on the Ember EM357 Zigbee compliant SOC IC. The IC
is a single-chip solution, compliant with ZigBee specifications
and IEEE 802.15.4, a complete wireless solution for all ZigBee
applications. The IC consists of an RF transceiver with the
baseband modem, a hardwired MAC and an embedded 32-bit
ARM® Cortex™-M3 microcontroller with internal RAM (12kB)
and Flash (192kB) memory. The device provides numerous
general-purpose I/O pins and peripheral functions such as
timers and UARTs.
The MeshConnect EM357 module adds a power amplifier (PA)
to increase range up to 2.5 miles, provide more reliable transmission, and reduce the number of nodes in your network. It is
especially useful for open outdoor applications where the nodes
are physically far apart or for indoor use where the nodes have
to operate in a noisy RF environment. The Module’s outstanding 120dB link budget ensures high quality connections even in
such harsh environments.
The MeshConnect EM357 module also integrates an 1MB
Flash memory for Over-The-Air program updates, making this
device ready for Smart Energy Applications.
MeshConnect™ EM357 Module
• FLASH Memory:
192 kB (EM357 internal)
		1MB (on module board)
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-channel 14-bit ADC
•
•
•
•
Transmit power +20dBm
1MB additional flash for Over-The-Air programming
+120 dB RF link budget
Range up to 2.5 miles
FEATURES
• High RF performance:
Up to 120 dB RF Link Budget
• Integrated PCB trace antenna
Optional U.FL external Antenna
		 RX Sensitivity: -100 dBm
• 15 RF channels
		 RF TX Power: +20 dBm
• Up to 13,000 feet of range
• Data Rate: 250 kbps
• AES encryption
• Small footprint: 1” x 1.41”
• FCC, CE and IC certifications
(25.4 mm x 35.9 mm)
• ROHS compliant
• Advanced Power Management
Scheme w/ Deep Sleep Mode
APPLICATIONS
• Smart Energy / Grid Markets
		 Smart Meters
• Building automation and control
• Home automation and control
		 Thermostats
		 Displays
		 Energy Management
		 Security Devices
		 HVAC control
		 Lighting control
• General ZigBee wireless
sensor networking
ORDERING INFORMATION
Part Number
MeshConnect™
EM357 Module
Order Number
Description
ZICM357P2-1
+20 dBm Output power, PCB Trace antenna
ZICM357P2-1C
+20 dBm Output power, with U.FL Connector for external antenna
ZICM357P2-KIT1-1
+20 dBm Engineering Development Kit
The information in this document is subject to change without notice, please confirm data is current
Document No: 0008-00-07-00-000 (Issue A)
Date Published: January 21, 2011
Page 1
MeshConnect™ EM357 Module
MODULE BLOCK DIAGRAM
EM357 Module
PWR
Reg
24 MHz
XTAL
Flash
1MB
Castellation Edge
Connector
SPI
Bus
ANT
Ember EM357
Micro
processor
Radio
Balun
PA
Balun
DEVELOPMENT KIT
CEL's Development Kit assists users in both evaluation
and development. As a stand-alone radio system, the kit
allows users to place the modules into the target environment and evaluate performance on-site. The Development
Kit also serves as an invaluable aid in application development. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for application development.
MeshConnect™
EM357 Module Development Kit
The interface board features a serial communication interface, a power management module, and peripherals such
as a buzzer, a temperature sensor, push-button switches,
LEDs, and GPIO headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)
Kit Contents:
• Evaluation Boards w/Module (2)
• USB Cables (1)
• AA Batteries (4)
• Software & Technical Information CD (1)
DEVELOPMENT KIT ORDERING INFORMATION
Part Number
MeshConnect™
EM357 Module
Development Kit
Order Number
ZICM357P2-KIT1-1
Description
+20 dBm Engineering Development Kit
Page 2
MeshConnect™ EM357 Module
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features..................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information.............................................................................................................................................................................
Module Block Diagram...........................................................................................................................................................................
Development Kit.....................................................................................................................................................................................
System Level Function
Transceiver IC.........................................................................................................................................................................................
Additional Flash Memory.......................................................................................................................................................................
Antenna...................................................................................................................................................................................................
Power Amplifier.......................................................................................................................................................................................
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
Recommended (Operating Condition)..................................................................................................................................................
DC Characteristics..................................................................................................................................................................................
RF Characteristics..................................................................................................................................................................................
Pin Signal & Interfaces
Pin Signals I/O Configuration................................................................................................................................................................
I/O Pin Assignment.................................................................................................................................................................................
Software/Firmware..................................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
Module Footprint....................................................................................................................................................................................
Processing.........................................................................................................................................................................................
11
Agency Certifications...................................................................................................................................................................
12
Shipment, Storage & Handling.................................................................................................................................................
14
References & Revision History.................................................................................................................................................
15
Page 3
MeshConnect™ EM357 Module
TRANSCEIVER IC
The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the
baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent low cost
high performance solution for all IEEE 802.15.4 / ZigBee applications.
For more information about the Ember EM357 IC, visit http://www.ember.com
ADDITIONAL FLASH MEMORY
The MeshConnect EM357 module incorporates an additional 1MB external Flash memory for Over-The-Air program updates. The Flash memory communicates over the EM357’s second serial controller using SPI. The flash memory is wired
to the following castellation pins:
PA0 - SC2MOSI
PA1 - SC2MISO
PA2 - SC2SCLK
PA3 - SC2nSSEL
WP - Flash memory Write Protect line (has internal pull-up resistor, but not connected to the EM357)
The instruction set for the Flash memory is similar to the Micron M25P80. Note that in order to achieve the specified sleep
current for the module, it is necessary to send a Deep Power-Down command to the Flash memory.
See http://www.micron.com for more information on the instruction set.
ANTENNA
CEL’s MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional U.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on
page 1.
The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize range, an
adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will
contribute significantly to the antenna performance (it should not be directly under the Inverted F-Antenna). The position of
the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design
affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal.
Here are some design guidelines to help ensure antenna performance:
•
Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
•
Never place the antenna close to metallic objects.
•
In the overall design, ensure that wiring and other components are not placed near the antenna.
•
Do not place the antenna in a metallic or metalized plastic enclosure.
•
Keep plastic enclosures 1cm or more from the antenna in any direction.
For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board
under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the
module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
POWER AMPLIFIER
The MeshConnect EM357 Module includes a Power Amplifier (PA). This PA delivers high efficiency, high gain, and high
output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a
network.
The PA is connected to the alternate EM357 IC TX output, so EM357 TX power modes 2 or 3 must be used to achieve the
specified output power.
Page 4
MeshConnect™ EM357 Module
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™ EM357 Module
Unit
Min
Max
Power Supply Voltage (VDD)
-0.3
3.6
VDC
Voltage on any I/O Line
-0.3
VDD + 0.3
VDC
–
15
dBm
-40
125
°C
–
260
°C
RF Input Power
Storage Temperature Range
Reflow Soldering Temperature
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
Power Supply Voltage (VDD)
Input Frequency
Ambient Temperature Range
MeshConnect™ EM357 Module
Min
Typ
Max
Unit
2.7
3.3
3.6
2405
–
2475
MHz
-40
25
85
°C
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description
MeshConnect™ EM357 Module
Unit
Min
Typ
Max
Transmit Mode Current
–
170
–
mA
Receive Mode Current
–
28
–
mA
Sleep Mode Current
–
–
µA
RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description
MeshConnect™ EM357 Module
Min
Typ
Max
2405
–
2475
Unit
General Characteristics
RF Frequency Range
RF Channels
MHz
11
–
25
–
-96.2
–
96.2
kHz
Maximum Output Power
–
20
–
dBm
Minimum Output Power
–
-40
–
dBm
Offset Error Vector Magnitude
–
15
35
Sensitivity (1% PER, boost mode)
–
-100
-94
dBm
Sensitivity (1% PER, normal mode)
–
-98
-92
dBm
Saturation (maximum input level)
–
–
dBm
Frequency Error Tolerance
Transmitter
Receiver
Page 5
MeshConnect™ EM357 Module
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions
shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
CEL
Ember
MeshConnect EM357
IC Pin
EM357 Module
Number
PIN Number
Name
Notes
49
N/C
21
22
24
25
49
16, 23, 28, 37
12
GROUND
WP
PA0
PA1
PA2
PA3
GROUND
VCC
RESET
10
13
PC6
11
14
PC7
Digital I/O
OSC32A - 32.768 kHz crystal oscillator
OSC32_EXT - Digital 32.768 kHz clock input source
PA7
Digital I/O
TIM1C4 - Timer 1 Channel 4 output
TIM1C4 - Timer 1 Channel 4 input
REG_EN - External regulator open drain output
12
18
13
19
PB3
14
20
PB4
15
26
PA4
16
27
PA5
17
29
PA6
Flash memory write protect (internal pull-up)
Dedicated as SC2MOSI due to Flash memory
Dedicated as SC2MISO due to Flash memory
Dedicated as SC2SCLK due to Flash memory
Reserved as SC2nSSEL for Flash memory
Active Low (Input)
Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal
Digital I/O
TIM2C3 - Timer 2 channel 3 output
TIM2C3 - Timer 2 channel 3 input
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1
Digital I/O
TIM2C4 - Timer 2 channel 4 output
TIM2C4 - Timer 2 channel 4 input
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1
Digital I/O
ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2
Digital I/O
ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader activation out of rest
TRACEDATA3 - Synchronous CPU trace data bit 3
Digital I/O
TIM1C3 - Timer 1 channel 3 output
TIM1C3 - Timer 1 channel 3 input
Page 6
MeshConnect™ EM357 Module
MeshConnect I/O PIN ASSIGNMENTS (Continued)
CEL
Ember
MeshConnect
EM357 IC Pin
EM357 Module
Number
PIN Number
Name
18
30
PB1
19
20
21
49
49
49
GROUND
GROUND
GROUND
22
31
PB2
23
32
JTCK
24
33
PC2
25
NC
26
34
PC3
27
35
PC4
28
49
GROUND
29
36
PB0
30
38
PC1
31
40
PC0
32
33
NC
41
PB7
Notes
Digital I/O
SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1
SC1SDA - TWI data of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1
TIM2C1 - Timer 2 channel 1 output
TIM2C1 - Timer 2 channel 1 input
Digital I/O
SCIMISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1
TIM2C2 - Timer 2 channel 2 output
TIM2C2 - Timer 2 channel 2 input
JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger
Digital I/O
JTDO - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger
No connect
Digital I/O
JTDI - JTAG data in from debugger
Digital I/O
JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidirectional data to/from debugger
Digital I/O
VREF - ADC reference output
VREF - ADC reference input
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input
cc
Digital I/O
JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1
No connect
Digital I/O
ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 output
TIM1C2 - Timer 1 channel 2 input
Page 7
MeshConnect™ EM357 Module
MeshConnect I/O PIN ASSIGNMENTS (Continued)
CEL
Ember
MeshConnect
EM357 IC Pin
EM357 Module
Number
PIN Number
Name
34
42
PB6
35
43
PB5
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
49
49
49
GROUND
GROUND
GROUND
NC
NC
NC
NC
NC
NC
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
49
49
49
49
49
49
49
49
49
49
49
49
Notes
Digital I/O
ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 output
TIM1C1 - Timer 1 channel 1 input
Digital I/O
ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input
No connect
No connect
No connect
No connect
No connect
No connect
Note: PC5 is not brought out to a castellation since it is required to control the PA.
For additional Pin-out details please reference Ember's EM357 IC Data sheet.
SOFTWARE/FIRMWARE
The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO, the industry’s most deployed and field
proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol
software package containing all the elements required for mesh networking applications. For more information regarding the
software development for this IC, visit http://www.ember.com
The MeshConnect Development Kit provides a guide on how to access the EM357 IC and utilize the Ember software development environment. It also provides a point to point demo application (transfer data between 2 devices) to conduct a range
test and supports low level peripheral tests.
Page 8
MeshConnect™ EM357 Module
MODULE DIMENSIONS
MeshConnect™ EM357 Module w/PCB Trace Antenna
EM357 Module
RF Shield
ZICM357P2 0000000000000
Pin 1
U1
C6A C1
L6
C6B
C6
R2
C9
ARM
R6
R5
C4A
C17
EM357
Series
C10
C22
R8
C5B
C2
R4
1.413”
C14
L2
R7
C24
R11 C23
0.903”
R1
R10
L5
C11
L3
C13
L4
C20
C20
Pin 56
C21
C7
C7B
C16
R9
XTAL1
C15
Pin 38
Pin 19
0.062”
1.000”
0.195”
MeshConnect™ EM357 Module w/U.FL Connector for external antenna
0.120”
EM357 Module
RF Shield
ZICM357P2 0000000000000
Pin 1
R1
C14
L2
R7
U1
C9
C24
C5B
C6A C1
L6
C6B
C6
R2
C4A
ARM
R6
EM357
Series
C10
R9
C22
R8
L5
C11
L3
C13
L4
R11 C23
C17
R5
C2
R4
1.413”
R10
0.903”
C7B
C20
Pin 56
C21
C7
C16
XTAL1
C15
Pin 38
Pin 19
1.000”
0.062”
0.195”
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
Page 9
MeshConnect™ EM357 Module
MODULE LAND FOOTPRINT
Note: Unless otherwise specified. Dimensions are in Inches [mm].
Page 10
MeshConnect™ EM357 Module
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TL
60-150 sec
Tpeak
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp down rate
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
•
•
•
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Page 11
MeshConnect™ EM357 Module
PROCESSING (Continued)
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711)
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable
and the solder joint and module should not exceed the maximum peak reflow temperature of 250 ºC.
Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
AGENCY CERTIFICATIONS
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or
certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC
ID: W7Z-ICP0”
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified
with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
Page 12
MeshConnect™ EM357 Module
AGENCY CERTIFICATIONS (Continued)
IC Certification — Industry Canada Statement
The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications
were met.
Certification IC - Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de certification / d'enregistrement signifie seulement que les spécifications techniques
Industrie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il
ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de
sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/
index-eng.php
CE Certification — Europe
The MeshConnect RF module has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to
make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
·
·
·
If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
The CE mark must be a minimum of 5mm in height
The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture
Page 13
MeshConnect™ EM357 Module
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are
summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
Page 14
MeshConnect™ EM357 Module
REFERENCES & REVISION HISTORY
Previous Versions
Changes to Current Version
Page(s)
0008-00-07-00-000
(Issue ES) October 14, 2010
Initial preliminary datasheet.
N/A
0008-00-07-00-000
(Issue A) January 21, 2011
Updated RF Channels to 15 for FCC Certification. Updated Pin out table.
Updated processing guidelines.
1, 5
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please 		
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written 		
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative 		
purposes in semiconductor product operation and application examples. The incorporation of these circuits, 		
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and 		
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.
Page 15

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History When                    : 2009:04:20 13:14:11-07:00, 2009:04:20 13:14:11-07:00, 2009:04:20 13:20:30-07:00, 2009:04:20 13:58:29-07:00, 2009:05:14 13:29:23-07:00, 2009:05:14 13:29:55-07:00, 2009:05:14 13:32:20-07:00, 2009:05:14 13:56:56-07:00, 2009:06:03 14:34:24-07:00, 2009:06:09 16:29:52-07:00, 2009:06:09 16:31:25-07:00, 2009:06:09 16:34:01-07:00, 2009:06:09 16:34:45-07:00, 2009:06:09 16:35-07:00, 2009:06:09 16:39:41-07:00, 2009:06:09 16:40:39-07:00, 2009:06:09 16:57:55-07:00, 2009:06:09 16:58-07:00, 2009:06:09 16:59:24-07:00, 2009:06:09 17:00:09-07:00, 2009:06:09 17:02:16-07:00, 2009:06:09 17:02:50-07:00, 2009:06:09 17:03:04-07:00, 2009:06:09 17:03:33-07:00, 2009:06:09 17:04:54-07:00, 2009:06:09 17:05:07-07:00, 2009:06:09 17:07:05-07:00, 2009:06:09 17:07:19-07:00, 2009:06:09 17:08:04-07:00, 2009:06:09 17:08:52-07:00, 2009:06:09 17:09:58-07:00, 2009:06:09 17:11:51-07:00, 2009:06:09 17:28:56-07:00, 2009:06:09 17:30:14-07:00, 2009:06:09 17:30:56-07:00, 2009:06:09 17:32:27-07:00, 2009:06:09 17:33:25-07:00, 2009:06:09 17:33:49-07:00, 2009:06:09 17:34:34-07:00, 2009:06:09 17:36:59-07:00, 2009:06:09 17:37:38-07:00, 2009:06:09 17:38:28-07:00, 2009:06:10 11:36:55-07:00, 2009:06:11 08:23:25-07:00, 2009:06:12 07:52:50-07:00, 2009:06:12 07:53:30-07:00, 2009:09:17 13:10:10-07:00, 2009:09:17 13:15:19-07:00, 2009:09:17 13:23:17-07:00, 2009:09:17 13:24:12-07:00, 2009:09:17 13:29:33-07:00, 2009:09:17 14:46:46-07:00, 2009:09:17 14:51:07-07:00, 2009:09:17 14:52:45-07:00, 2009:09:17 14:55:26-07:00, 2009:09:17 14:56-07:00, 2009:09:17 14:58:14-07:00, 2009:09:17 15:40:33-07:00, 2009:09:17 16:04:16-07:00, 2009:09:18 09:07:25-07:00, 2009:09:18 09:16:05-07:00, 2009:09:18 09:17:10-07:00, 2009:09:18 09:46:44-07:00, 2009:09:18 10:22:42-07:00, 2009:09:18 10:37:51-07:00, 2009:09:18 10:52:31-07:00, 2009:09:18 10:53:49-07:00, 2009:09:18 10:54:08-07:00, 2009:09:18 10:55:01-07:00, 2009:09:18 10:57:41-07:00, 2009:09:18 11:05:04-07:00, 2009:09:18 11:05:37-07:00, 2009:09:18 11:07:11-07:00, 2009:09:18 11:14:55-07:00, 2009:09:18 13:41:43-07:00, 2009:09:18 13:50:24-07:00, 2009:09:18 14:06:38-07:00, 2009:09:18 14:09:57-07:00, 2009:09:18 14:12:11-07:00, 2009:09:18 14:13:09-07:00, 2009:09:24 15:29:16-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:59:19-07:00, 2009:09:28 10:00:22-07:00, 2009:09:28 10:00:33-07:00, 2009:09:28 10:00:52-07:00, 2009:09:28 10:03:50-07:00, 2009:09:28 10:05:45-07:00, 2009:09:28 10:10:45-07:00, 2009:09:28 10:15:40-07:00, 2009:09:28 10:16:37-07:00, 2009:09:28 10:18:03-07:00, 2009:09:28 10:18:18-07:00, 2009:09:28 10:22:13-07:00, 2009:09:28 10:24:50-07:00, 2009:09:28 10:25:51-07:00, 2009:09:28 10:36:44-07:00, 2009:09:28 10:38:28-07:00, 2009:09:28 10:40:35-07:00, 2009:09:28 10:48:42-07:00, 2009:09:28 10:49:34-07:00, 2009:09:28 10:50:24-07:00, 2009:09:28 10:51:27-07:00, 2009:09:28 10:51:40-07:00, 2009:09:28 10:52:17-07:00, 2009:09:28 11:13:07-07:00, 2009:09:28 11:18:34-07:00, 2009:09:28 11:18:56-07:00, 2009:09:28 11:43:38-07:00, 2009:09:28 11:44:08-07:00, 2009:09:28 11:44:56-07:00, 2009:09:28 11:46:56-07:00, 2009:09:28 11:48:46-07:00, 2009:09:28 11:54:19-07:00, 2009:09:28 11:55:25-07:00, 2009:09:28 11:59:25-07:00, 2009:09:28 12:04:12-07:00, 2009:10:02 09:52:40-07:00, 2009:10:02 09:58:12-07:00, 2009:10:02 10:17:22-07:00, 2009:10:02 10:18:23-07:00, 2009:10:02 10:35:31-07:00, 2009:10:02 10:39:25-07:00, 2009:10:02 10:51:34-07:00, 2009:10:02 10:58:08-07:00, 2009:10:02 10:58:49-07:00, 2009:10:02 10:59-07:00, 2009:10:02 11:03:27-07:00, 2009:10:02 11:20:01-07:00, 2009:10:02 11:20:23-07:00, 2009:10:02 11:24:08-07:00, 2009:10:02 12:20:32-07:00, 2009:10:02 12:21:14-07:00, 2009:10:02 12:22:16-07:00, 2009:10:06 08:45:11-07:00, 2009:10:06 08:45:34-07:00, 2009:10:06 08:45:47-07:00, 2009:10:06 08:47:57-07:00, 2009:10:06 08:49:08-07:00, 2010:01:14 09:41:06-08:00, 2010:01:14 09:43:12-08:00, 2010:01:14 09:44:02-08:00, 2010:01:14 09:47:32-08:00, 2010:01:29 14:18:23-08:00, 2010:01:29 14:22:10-08:00, 2010:01:29 14:23-08:00, 2010:01:29 14:27:26-08:00, 2010:01:29 14:28:18-08:00, 2010:01:29 14:46:38-08:00, 2010:01:29 14:48:22-08:00, 2010:01:29 14:51:38-08:00, 2010:02:04 09:40:25-08:00, 2010:03:24 11:02:41-07:00, 2010:03:24 11:28:08-07:00, 2010:03:24 13:02:35-07:00, 2010:03:24 13:14:52-07:00, 2010:03:24 13:16:49-07:00, 2010:03:24 13:18:26-07:00, 2010:03:24 13:33:27-07:00, 2010:03:24 13:42:01-07:00, 2010:03:24 13:43:51-07:00, 2010:03:24 13:44:24-07:00, 2010:03:31 11:41:21-07:00, 2010:03:31 11:43:35-07:00, 2010:03:31 11:45:23-07:00, 2010:03:31 11:45:31-07:00, 2010:03:31 11:46:13-07:00, 2010:03:31 14:52:31-07:00, 2010:04:01 10:10:07-07:00, 2010:04:07 10:04:53-07:00, 2010:04:07 10:05:17-07:00, 2010:04:08 07:46:18-07:00, 2010:04:08 07:51:16-07:00, 2010:04:08 11:44:59-07:00, 2010:04:08 11:45:28-07:00, 2010:04:08 11:45:49-07:00, 2010:05:24 09:49:45-07:00, 2010:05:24 09:50:36-07:00, 2010:05:24 09:50:36-07:00, 2010:05:24 10:24:42-07:00, 2010:05:24 10:26:11-07:00, 2010:05:24 10:32:10-07:00, 2010:05:24 11:22:03-07:00, 2010:05:24 11:23:27-07:00, 2010:05:24 11:34:27-07:00, 2010:05:24 11:37:50-07:00, 2010:05:24 11:49:26-07:00, 2010:05:24 11:50:23-07:00, 2010:05:24 11:56:34-07:00, 2010:05:24 13:34:30-07:00, 2010:05:24 13:43:07-07:00, 2010:05:24 13:46:47-07:00, 2010:05:24 13:47:43-07:00, 2010:05:24 14:01:03-07:00, 2010:05:24 14:07:29-07:00, 2010:05:24 14:09:28-07:00, 2010:05:25 08:34:28-07:00, 2010:05:25 08:36:25-07:00, 2010:05:25 08:43:08-07:00, 2010:05:25 10:17:50-07:00, 2010:05:25 10:18:16-07:00, 2010:06:09 09:49:05-07:00, 2010:06:09 10:07:08-07:00, 2010:06:09 10:08:02-07:00, 2010:06:09 10:15:10-07:00, 2010:06:09 13:26:43-07:00, 2010:06:09 13:27:39-07:00, 2010:06:09 13:29:45-07:00, 2010:06:09 13:31:33-07:00, 2010:06:09 13:31:51-07:00, 2010:06:09 13:33:26-07:00, 2010:06:09 13:36:17-07:00, 2010:06:09 13:40:40-07:00, 2010:06:09 13:41:37-07:00, 2010:06:09 13:42:20-07:00, 2010:06:09 13:43:15-07:00, 2010:06:09 13:49:11-07:00, 2010:06:09 13:53:26-07:00, 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2010:07:14 16:45:57-07:00, 2010:07:15 14:04:56-07:00, 2010:07:15 14:06:01-07:00, 2010:07:15 14:06:50-07:00, 2010:07:15 14:07:40-07:00, 2010:07:15 14:31:11-07:00, 2010:07:15 14:41:43-07:00, 2010:07:15 14:44:58-07:00, 2010:07:15 14:47:57-07:00, 2010:07:15 15:26:22-07:00, 2010:07:16 11:18:51-07:00, 2010:07:16 11:23:17-07:00, 2010:07:16 11:29:16-07:00, 2010:07:16 11:30:59-07:00, 2010:07:16 11:31:46-07:00, 2010:07:16 11:32:03-07:00, 2010:07:16 11:35:18-07:00, 2010:07:16 11:45:53-07:00, 2010:07:16 15:14:32-07:00, 2010:07:16 15:27:27-07:00, 2010:09:28 09:36:30-07:00, 2010:09:28 09:36:30-07:00, 2010:09:28 09:37:33-07:00, 2010:09:28 09:39:38-07:00, 2010:09:28 09:40:41-07:00, 2010:09:28 09:42:11-07:00, 2010:09:28 09:47:34-07:00, 2010:09:28 09:48:02-07:00, 2010:09:28 09:53:46-07:00, 2010:09:28 09:54:05-07:00, 2010:09:28 10:01:35-07:00, 2010:09:28 10:07:12-07:00, 2010:10:14 14:08:13-07:00, 2010:10:14 14:09:02-07:00, 2010:10:14 14:09:36-07:00, 2010:10:14 14:10:27-07:00, 2010:10:14 14:11:01-07:00, 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Create Date                     : 2011:01:21 15:19:41-08:00
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Creator                         : Adobe InDesign CS5 (7.0)
EXIF Metadata provided by EXIF.tools
FCC ID Filing: W7Z-ZICM357P2

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