California Eastern Laboratories ZICM357P2 MeshConnect™ EM357 Zigbee Module User Manual Manual

California Eastern Laboratories MeshConnect™ EM357 Zigbee Module Manual

Manual

Page 1
MeshConnect™ EM357 Module
DESCRIPTION
CEL’s MeshConnect™ EM357 Module combines high perfor-
mance RF solution with the market's premier ZigBee stack.
The addition of on board memory enables Over-The-Air (OTA)
programming without the need for additional in system memory.
The integrated power amplier maximizes range and perfor-
mance. The small module footprint makes it suitable for a wide
range of ZigBee applications. The MeshConnect EM357 mod-
ule is certied and qualied enabling customers to accelerate
time to market by greatly reducing the design and certication
phases of development.
CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is
based on the Ember EM357 Zigbee compliant SOC IC. The IC
is a single-chip solution, compliant with ZigBee specications
and IEEE 802.15.4, a complete wireless solution for all ZigBee
applications. The IC consists of an RF transceiver with the
baseband modem, a hardwired MAC and an embedded 32-bit
ARM® Cortex™-M3 microcontroller with internal RAM (12kB)
and Flash (192kB) memory. The device provides numerous
general-purpose I/O pins and peripheral functions such as
timers and UARTs.
The MeshConnect EM357 module adds a power amplier (PA)
to increase range up to 2.5 miles, provide more reliable trans-
mission, and reduce the number of nodes in your network. It is
especially useful for open outdoor applications where the nodes
are physically far apart or for indoor use where the nodes have
to operate in a noisy RF environment. The Module’s outstand-
ing 120dB link budget ensures high quality connections even in
such harsh environments.
The MeshConnect EM357 module also integrates an 1MB
Flash memory for Over-The-Air program updates, making this
device ready for Smart Energy Applications.
Integrated Transceiver Modules for ZigBee/IEEE 802.15.4
Development Kit available: ZICM357P2-KIT1-1
The information in this document is subject to change without notice, please conrm data is current
Document No: 0008-00-07-00-000 (Issue A)
Date Published: January 21, 2011
DATA SHEET
ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™
EM357 Module
ZICM357P2-1 +20 dBm Output power, PCB Trace antenna
ZICM357P2-1C +20 dBm Output power, with U.FL Connector for external antenna
ZICM357P2-KIT1-1 +20 dBm Engineering Development Kit
• FLASHMemory:
192 kB (EM357 internal)
1MB (on module board)
• 12kBSRAM
• 32-bitARM®Cortex™-M3
• Upto23GPIOPins
• SPI(Master/Slave),TWI,UART
• Timers,SerialWire/JTAGInterface
• 5-channel14-bitADC
MeshConnect™ EM357 Module
ZICM357P2-1
Ember EM357 Transceiver Based Module
•HighRFperformance:
  Up to 120 dB RF Link Budget
RX Sensitivity: -100 dBm
RF TX Power: +20 dBm
•DataRate:250kbps
•Smallfootprint:1”x1.41” 
(25.4 mm x 35.9 mm)
•AdvancedPowerManagement 
Scheme w/ Deep Sleep Mode
FEATURES
•IntegratedPCBtraceantenna
Optional U.FL external Antenna
•15RFchannels
•Upto13,000feetofrange
•AESencryption
•FCC,CEandICcertications
•ROHScompliant
APPLICATIONS
• SmartEnergy/GridMarkets
Smart Meters
• Buildingautomationandcontrol
• Homeautomationandcontrol
Thermostats
Displays
Energy Management
Security Devices
HVAC control
Lighting control
• GeneralZigBeewireless
 sensornetworking
• Transmit power +20dBm
• 1MB additional ash for Over-The-Air programming
• +120 dB RF link budget
• Range up to 2.5 miles
MeshConnect™ EM357 Module
Page 2
MODULEBLOCKDIAGRAM
24 MHz
XTAL
Radio
Micro
processor
ANT
Castellation Edge
Connector
Reg
Flash
1MB
Ember EM357
EM357 Module
Balun PA
Balun
SPI
Bus
DEVELOPMENTKIT
CEL's Development Kit assists users in both evaluation
and development. As a stand-alone radio system, the kit
allows users to place the modules into the target environ-
ment and evaluate performance on-site. The Development
Kit also serves as an invaluable aid in application develop-
ment. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for ap-
plication development.
The interface board features a serial communication inter-
face, a power management module, and peripherals such
as a buzzer, a temperature sensor, push-button switches,
LEDs, and GPIO headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)Kit Contents:
•EvaluationBoardsw/Module(2)
•USBCables(1)
•AABatteries(4)
•Software&TechnicalInformationCD(1)
MeshConnect™
EM357 Module Development Kit
DEVELOPMENTKITORDERINGINFORMATION
Part Number Order Number Description
MeshConnect™
EM357 Module
Development Kit
ZICM357P2-KIT1-1 +20 dBm Engineering Development Kit
MeshConnect™ EM357 Module
Page 3
IntroductionandOverview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
Ordering Information............................................................................................................................................................................. 1
ModuleBlockDiagram........................................................................................................................................................................... 2
Development Kit..................................................................................................................................................................................... 2
SystemLevelFunction
Transceiver IC......................................................................................................................................................................................... 4
AdditionalFlashMemory....................................................................................................................................................................... 4
Antenna................................................................................................................................................................................................... 4
PowerAmplier....................................................................................................................................................................................... 4
ElectricalSpecication
AbsoluteMaximumRatings................................................................................................................................................................... 5
Recommended(OperatingCondition).................................................................................................................................................. 5
DCCharacteristics.................................................................................................................................................................................. 5
RFCharacteristics.................................................................................................................................................................................. 5
PinSignal&Interfaces
PinSignalsI/OConguration................................................................................................................................................................ 6
I/O Pin Assignment................................................................................................................................................................................. 6
Software/Firmware.................................................................................................................................................................................. 8
Module Dimensions................................................................................................................................................................................ 9
Module Footprint.................................................................................................................................................................................... 9
Processing......................................................................................................................................................................................... 11
AgencyCertications................................................................................................................................................................... 12
Shipment,Storage&Handling................................................................................................................................................. 14
References&RevisionHistory................................................................................................................................................. 15
TABLEOFCONTENTS
MeshConnect™ EM357 Module
Page 4
TRANSCEIVER IC
The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the
baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent low cost
high performance solution for all IEEE 802.15.4 / ZigBee applications.
For more information about the Ember EM357 IC, visit http://www.ember.com
ADDITIONALFLASHMEMORY
The MeshConnect EM357 module incorporates an additional 1MB external Flash memory for Over-The-Air program up-
dates. The Flash memory communicates over the EM357’s second serial controller using SPI. The ash memory is wired
to the following castellation pins:
PA0 - SC2MOSI
PA1 - SC2MISO
PA2 - SC2SCLK
PA3 - SC2nSSEL
WP - Flash memory Write Protect line (has internal pull-up resistor, but not connected to the EM357)
The instruction set for the Flash memory is similar to the Micron M25P80. Note that in order to achieve the specied sleep
current for the module, it is necessary to send a Deep Power-Down command to the Flash memory.
See http://www.micron.com for more information on the instruction set.
ANTENNA
CEL’s MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional U.FL connec-
tor can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on
page 1.
The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efcient. To maximize range, an
adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will
contribute signicantly to the antenna performance (it should not be directly under the Inverted F-Antenna). The position of
the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design
affects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted signal.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board
under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the
module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
POWERAMPLIFIER
The MeshConnect EM357 Module includes a Power Amplier (PA). This PA delivers high efciency, high gain, and high
output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a
network.
The PA is connected to the alternate EM357 IC TX output, so EM357 TX power modes 2 or 3 must be used to achieve the
specied output power.
MeshConnect™ EM357 Module
Page 5
ABSOLUTEMAXIMUMRATINGS
Description MeshConnect™ EM357 Module Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power – 15 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED(OPERATINGCONDITIONS)
Description MeshConnect™ EM357 Module Unit
Min Typ Max
Power Supply Voltage (VDD) 2.7 3.3 3.6 V
Input Frequency 2405 – 2475 MHz
Ambient Temperature Range -40 25 85 °C
DCCHARACTERISTICS(@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description MeshConnect™ EM357 Module Unit
Min Typ Max
Transmit Mode Current – 170 – mA
Receive Mode Current – 28 – mA
Sleep Mode Current – 6 – µA
RFCHARACTERISTICS(@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description MeshConnect™ EM357 Module Unit
Min Typ Max
GeneralCharacteristics
RF Frequency Range 2405 –2475 MHz
RF Channels 11 – 25 –
Frequency Error Tolerance -96.2 – 96.2 kHz
Transmitter
Maximum Output Power – 20 – dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 15 35 %
Receiver
Sensitivity (1% PER, boost mode) – -100 -94 dBm
Sensitivity (1% PER, normal mode) – -98 -92 dBm
Saturation (maximum input level) 0 – – dBm
MeshConnect™ EM357 Module
Page 6
PINSIGNALSI/OPORTCONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions
shows the layout of the 56 edge castellations.
MeshConnectI/OPINASSIGNMENTS
CEL
MeshConnect
EM357 Module
PIN Number
Ember
EM357 IC Pin
Number
Name Notes
1 49 GROUND
2 N/C WP Flash memory write protect (internal pull-up)
3 21 PA0 Dedicated as SC2MOSI due to Flash memory
4 22 PA1 Dedicated as SC2MISO due to Flash memory
5 24 PA2 Dedicated as SC2SCLK due to Flash memory
6 25 PA3 Reserved as SC2nSSEL for Flash memory
7 49 GROUND
8 16, 23, 28, 37 VCC
9 12 RESET Acve Low (Input)
10 13 PC6
Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal
11 14 PC7
Digital I/O
OSC32A - 32.768 kHz crystal oscillator
OSC32_EXT - Digital 32.768 kHz clock input source
12 18 PA7
Digital I/O
TIM1C4 - Timer 1 Channel 4 output
TIM1C4 - Timer 1 Channel 4 input
REG_EN - External regulator open drain output
13 19 PB3
Digital I/O
TIM2C3 - Timer 2 channel 3 output
TIM2C3 - Timer 2 channel 3 input
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1
14 20 PB4
Digital I/O
TIM2C4 - Timer 2 channel 4 output
TIM2C4 - Timer 2 channel 4 input
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1
15 26 PA4
Digital I/O
ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2
16 27 PA5
Digital I/O
ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader acvaon out of rest
TRACEDATA3 - Synchronous CPU trace data bit 3
17 29 PA6
Digital I/O
TIM1C3 - Timer 1 channel 3 output
TIM1C3 - Timer 1 channel 3 input
MeshConnect™ EM357 Module
Page 7
18 30 PB1
Digital I/O
SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1
SC1SDA - TWI data of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1
TIM2C1 - Timer 2 channel 1 output
TIM2C1 - Timer 2 channel 1 input
19 49 GROUND
20 49 GROUND
21 49 GROUND
22 31 PB2
Digital I/O
SCIMISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1
TIM2C2 - Timer 2 channel 2 output
TIM2C2 - Timer 2 channel 2 input
23 32 JTCK JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger
24 33 PC2
Digital I/O
JTDO - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger
25 NC No connect
26 34 PC3 Digital I/O
JTDI - JTAG data in from debugger
27 35 PC4
Digital I/O
JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidireconal data to/from debugger
28 49 GROUND
29 36 PB0
Digital I/O
VREF - ADC reference output
VREF - ADC reference input
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input
30 38 PC1 cc
31 40 PC0
Digital I/O
JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1
32 NC No connect
33 41 PB7
Digital I/O
ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 output
TIM1C2 - Timer 1 channel 2 input
MeshConnectI/OPINASSIGNMENTS(Continued)
CEL
MeshConnect
EM357 Module
PIN Number
Ember
EM357 IC Pin
Number
Name Notes
MeshConnect™ EM357 Module
Page 8
SOFTWARE/FIRMWARE
The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO, the industry’s most deployed and eld
proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol
software package containing all the elements required for mesh networking applications. For more information regarding the
software development for this IC, visit http://www.ember.com
The MeshConnect Development Kit provides a guide on how to access the EM357 IC and utilize the Ember software devel-
opment environment. It also provides a point to point demo application (transfer data between 2 devices) to conduct a range
test and supports low level peripheral tests.
34 42 PB6
Digital I/O
ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 output
TIM1C1 - Timer 1 channel 1 input
35 43 PB5
Digital I/O
ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input
36 49 GROUND
37 49 GROUND
38 49 GROUND
39 NC No connect
40 NC No connect
41 NC No connect
42 NC No connect
43 NC No connect
44 NC No connect
45 49 GROUND
46 49 GROUND
47 49 GROUND
48 49 GROUND
49 49 GROUND
50 49 GROUND
51 49 GROUND
52 49 GROUND
53 49 GROUND
54 49 GROUND
55 49 GROUND
56 49 GROUND
Note: PC5 is not brought out to a castellation since it is required to control the PA.
For additional Pin-out details please reference Ember's EM357 IC Data sheet.
CEL
MeshConnect
EM357 Module
PIN Number
Ember
EM357 IC Pin
Number
Name Notes
MeshConnectI/OPINASSIGNMENTS(Continued)
MeshConnect™ EM357 Module
Page 9
MODULEDIMENSIONS
1.000”0.195”
0.903”
1.413”
0.062”
0.120”
RF Shield
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
Pin 1
Pin 19 Pin 38
Pin 56
EM357
Series
ARM
0000000000000
EM357 Module
ZICM357P2
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
1.000”0.195”
0.903”
1.413”
0.062”
RF Shield
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
Pin 1
Pin 19 Pin 38
Pin 56
EM357
Series
ARM
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
EM357
Series
ARM
0000000000000
EM357 Module
ZICM357P2
MeshConnect™ EM357 Module w/PCB Trace Antenna
MeshConnect™ EM357 Module w/U.FL Connector for external antenna
MeshConnect™ EM357 Module
Page 10
MODULELANDFOOTPRINT
Note: Unless otherwise specied. Dimensions are in Inches [mm].
MeshConnect™ EM357 Module
Page 11
PROCESSING
RecommendedReowProle
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 250ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
cation. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
RepeatingReowSoldering
Only a single reow soldering process is encouraged for host boards.
WaveSoldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
MeshConnect™ EM357 Module
Page 12
PROCESSING (Continued)
AGENCYCERTIFICATIONS
HandSoldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711)
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable
and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC.
Caution If temperature ramps exceed the reow temperature prole, module and component damage may occur due to
thermal shock. Avoid overheating.
WarningNever attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
FCCComplianceStatement(Part15.19)Section7.15ofRSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning(Part15.21)
Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEMResponsibilitytotheFCCRulesandRegulations
The MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or
certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC
ID: W7Z-ICP0”
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied
with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-
tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ EM357 Module
Page 13
AGENCYCERTIFICATIONS(Continued)
ICCertication—IndustryCanadaStatement
The term "IC" before the certication / registration number only signies that the Industry Canada technical specications
were met.
CerticationIC-Déclarationd'IndustrieCanada
Le terme "IC" devant le numéro de certication / d'enregistrement signie seulement que les spécications techniques
Industrie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
L'article14duCNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il
ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de
sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/
index-eng.php
CECertication—Europe
The MeshConnect RF module has been tested and certied for use in the European Union.
OEMResponsibilitytotheEuropeanUnionComplianceRules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
OEMLabelingRequirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
· The CE mark must be a minimum of 5mm in height
· The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture
MeshConnect™ EM357 Module
Page 14
SHIPMENT,HANDLING,ANDSTORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
WarningThe MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
WarningThe MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are
summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
MoistureSensitivityLevel(MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
MeshConnect™ EM357 Module
Page 15
REFERENCES&REVISIONHISTORY
Previous Versions ChangestoCurrentVersion Page(s)
0008-00-07-00-000
(Issue ES) October 14, 2010 Initial preliminary datasheet. N/A
0008-00-07-00-000
(Issue A) January 21, 2011
Updated RF Channels to 15 for FCC Certication. Updated Pin out table.
Updated processing guidelines. 1, 5
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

Navigation menu