California Eastern Laboratories ZICM900P2 MeshConnect Sub-G Extended Range Module User Manual Exhibit D Users Manual per 2 1033 b3

California Eastern Laboratories MeshConnect Sub-G Extended Range Module Exhibit D Users Manual per 2 1033 b3

Exhibit D Users Manual per 2 1033 b3

Page 1MeshConnect™ Sub-G Module SeriesCEL's MeshConnect™ Module Series provides high performance and low cost Sub-G modules for a broad range of wireless net-works. The MeshConnect certied and qualied modules enable customers to accelerate time to market by greatly reducing design and certication phases of development.CEL's MeshConnect™ Sub-G modules (868/900MHz) are based on the Silicon Labs SoC ICs (single-chip solutions). Each IC con-sists of an RF transceiver with baseband modem, a hard-wired MAC and an embedded 8051 microcontroller with internal RAM (4kB) and Flash (64kB) memory. The device provides numer-ous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect Sub-G modules have 2 different output powers (+12dBm and +19dBm). They provide a reliable transmission, to reduce the number of nodes in a network. They are especially useful for open outdoor applications where the nodes are physi-cally far apart. The higher power Modules have an outstanding 118dB link budget ensuring high quality connections even in harsh environments. Development Kits Available: ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1The information in this document is subject to change without notice, please conrm data is currentDocument No: 0009-00-07-00-000 (Issue ES)Date Published: December 7, 2010PRELIMINARY DATA SHEETDESCRIPTIONZICM0868PxZICM0900Px 868 / 900 MHz Transceiver Based Modules•FrequencyRange: 902- 928 MHz 868 MHz•Sensitivity:-99dBm •MaxOutputPower: + 12 dBm @ 3.6 VDC (ZICM0xxxP0) + 19 dBm @ 3.6 VDC (ZICM0xxxP2)•DataRate:0.123to150kbps•Upto21GPIOPins•HighSpeed8051MCU: 30 MHz 4kB RAM / 64 kB Flash•10-BitADC: 300 ksps, 18-ch inputs•SerialCommunication: UARTs, SPI (Master/Slave) SMBus, PCA•Modulation:  FSK FEATURES•RFPowerConsumption 24 mA Receive 18 mA @ + 1 dBm transmit 30 mA @ + 12 dBm transmit 90 mA @ + 19 dBm transmit •Auto-FrequencyCalibration(AFC)•FrequencyHoppingCapability•Upto12milesofrange•OperatingTemperatureRange:-40 to +85ºC•SoftwareSupport:Synapse SNAP Embedded FirmwareWireless M-Bus (868MHz Only) Silicon Labs EZMac CEL Protocol•FCC,CEandICcerticationsin Progress•ROHScompliantMeshConnect™ Sub-G ModulesZICM0868Px ZICM0900PxAPPLICATIONS• Metering• RFID• RemoteKeylessEntry• HomeAutomation• Security• Irrigation• WeatherStations• Andmore...Best Reliable Performance • Good sensitivity providing longer range for Non-line-of-site aplications • Low operating (receive) current
MeshConnect™ Sub-G Module SeriesPage 2ORDERING INFORMATIONPart Number Order Number DescriptionMeshConnect™ Sub-G(Eruope Only)ZICM0868P0-1CU 868 MHz Module, +12dBm output power with U.FL connector for external antennaZICM0868P2-1CU 868 MHz Module, +19dBm output power with U.FL connector for external antennaZICM0868P0-1CS 868 MHz Module, +12dBm output power with RP-SMA connector for external antennaZICM0868P2-1CS 868 MHz Module, +19dBm output power with RP-SMA connector for external antennaZICM0868P0-1C 868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA)ZICM0868P2-1C 868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA)ZICM0868P0-1CU-SN 868 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC addressZICM0868P2-1CU-SN 868 MHz Module, +19dBm output power with U.FL connector for external antennawith SNAP Operating System software and MAC addressZICM0868P0-1CS-SN 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC addressZICM0868P2-1CS-SN 868 MHz Module, +19dBm output power with RP-SMA connector for external antennawith SNAP Operating System software and MAC addressZICM0868P0-1C-SN 868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC addressZICM0868P2-1C-SN 868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of RP-SMA) with SNAP Operating System software and MAC addressMeshConnect™ Sub-GZICM0900P0-1CU 900 MHz Module, +12dBm output power with U.FL connector for external antennaZICM0900P2-1CU 900 MHz Module, +19dBm output power with U.FL connector for external antennaZICM0900P0-1CS 900 MHz Module, +12dBm output power with RP-SMA connector for external antennaZICM0900P2-1CS 900 MHz Module, +19dBm output power with RP-SMA connector for external antennaZICM0900P0-1C 900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA)ZICM0900P2-1C 900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA)ZICM0900P0-1CU-SN 900 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC addressZICM0900P2-1CU-SN 900 MHz Module, +19dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC addressZICM0900P0-1CS-SN 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC addressZICM0900P2-1CS-SN 900 MHz Module, +19dBm output power with RP-SMA connector for external antennawith SNAP Operating System software and MAC addressZICM0900P0-1C-SN 900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC addressZICM0900P2-1C-SN 900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC addressMeshConnect™ Sub-GDevelopment KitsZICM0868P2-KIT1-1 868 MHz Evaluation board for +19 dBm moduleZICM0900P2-KIT1-1 900 MHz Evaluation board for +19 dBm module
MeshConnect™ Sub-G Module SeriesPage 3MODULE BLOCK DIAGRAMANTSI100xT/R SwitchExternalMemoryLow PassFilterSub-GOptionalDEVELOPMENT KITCEL's Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application develop-ment. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for ap-plication development. The interface board features a serial communication interface, a power management module, and peripherals such as a buzzer, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website http://www.cel.com)Kit Contents:• Evaluation Boards w/Module (2)• USB Cables (1)• AA Batteries (4)• Software & Technical Information CD (1)MeshConnect™ Sub-G Module Development KitDEVELOPMENT KIT ORDERING INFORMATIONPart Number Order Number DescriptionMeshConnect™ Sub-GDevelopment KitsZICM0868P2-KIT1-1 868 MHz Evaluation board for +19dBm moduleZICM0900P2-KIT1-1 900 MHz Evaluation board for +19dBm module
MeshConnect™ Sub-G Module SeriesPage 4Introduction and OverviewDescription.............................................................................................................................................................................................. 1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information............................................................................................................................................................................. 2Module Block Diagram........................................................................................................................................................................... 3Development Kit..................................................................................................................................................................................... 3System Level FunctionTransceiver IC......................................................................................................................................................................................... 5Antenna.................................................................................................................................................................................... 5Additional Flash Memory....................................................................................................................................................................... 5Electrical SpecicationAbsolute Maximum Ratings................................................................................................................................................................... 6Recommended (Operating Condition).................................................................................................................................................. 6DC Characteristics.................................................................................................................................................................................. 6RF Characteristics.................................................................................................................................................................................. 7Pin Signal & InterfacesPin Signals I/O Conguration................................................................................................................................................................ 8I/O Pin Assignment................................................................................................................................................................................. 8Software/Firmware.................................................................................................................................................................................. 9Module Dimensions................................................................................................................................................................................ 10Module Footprint.................................................................................................................................................................................... 11Processing......................................................................................................................................................................................... 12Agency Certications................................................................................................................................................................... 13Shipment, Storage & Handling................................................................................................................................................. 14References & Revision History................................................................................................................................................. 15TABLE OF CONTENTS
MeshConnect™ Sub-G Module SeriesPage 5TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance solution for all Sub-G applications. For more information about the Silicon Labs ICs, visit http://www.silabs.com. ANTENNA The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna option). The following options are supported by CEL: • U.FL connector • RP-SMA connector • A Connection for 1/4 wave wire antenna in place of RP-SMAHere are some design guidelines to help ensure antenna performance: • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction.ADDITIONAL FLASH MEMORY (Optional) The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of ash. Additional memory (1MB) can be mounted on the module (as an option) to enable Over The Air (OTA) programming capability. This is a custom solution as an option for all part numbers.
MeshConnect™ Sub-G Module SeriesPage 6ABSOLUTE MAXIMUM RATINGSDescription MeshConnect™ Sub-G Module UnitMin MaxPower Supply Voltage (VDD) -0.3 3.6 VDCVoltage on any I/O Line -0.3 VDD + 0.3 VDCRF Input Power – 10 dBmStorage Temperature Range -40 125 °CReow Soldering Temperature – 260 °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.RECOMMENDED (OPERATING CONDITIONS) Description MeshConnect™ Sub-G Module UnitMin Typ MaxPower Supply Voltage (VDD)1.8/2.7* 3.3 3.6 VInput Frequency 863 –870 MHzInput Frequency 902 – 928 MHzAmbient Temperature Range -40 25 85 °C Note: * 2.7v is the min voltage if an additional memory IC was placed on the module.DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2 TX power max)Description MeshConnect™ Sub-G Module UnitMin Typ MaxTransmit Mode Current – 90 – mAReceive Mode Current – 24 – mASleep Mode Current – TBD – µA DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0 TX power max)Description MeshConnect™ Sub-G Module UnitMin Typ MaxTransmit Mode Current – 35 – mAReceive Mode Current – 24 – mASleep Mode Current – TBD – µA
MeshConnect™ Sub-G Module SeriesPage 7 RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2)Description MeshConnect™ Sub-G Module UnitMin Typ MaxGeneral CharacteristicsRF Frequency Range 863 –928 MHzTransmitterMaximum Output Power – 19 – dBmMinimum Output Power – -5 – dBmFSK Error TBD – TBD %Carrier Offset TBD – TBD KHzDeviation – 75 – KHzReceiverSensitivity (1% PER, 156kbps) –-99 TBD dBmSaturation (maximum input level) ––10 dBmRF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0)Description MeshConnect™ Sub-G Module UnitMin Typ MaxGeneral CharacteristicsRF Frequency Range 863 – 928 MHzTransmitterMaximum Output Power – 12 – dBmMinimum Output Power – -12 – dBmFSK Error TBD – TBD %Carrier Offset TBD – TBD KHzDeviation – 75 – KHzReceiverSensitivity (1% PER, 156kbps) – -99 TBD dBmSaturation (maximum input level) – – 10 dBm
MeshConnect™ Sub-G Module SeriesPage 8PIN SIGNALS I/O PORT CONFIGURATIONMeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTSNumber Name Notes1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 NC9 ANTA Available: Not used for any module funconality10 GPIO0 Available: Not used for any module funconality11 GPIO2 Available: Not used for any module funconality12 P0.7/IREF Must be connected to SDN for SNAP rmware13P0.6/CNVSTR Used as Chip Select for Memory on CEL Eval. Board14 P0.5/RXD UART TXD15 P0.4/TXD UART RXD16 WP Write Protect Pin of Memory Chip on Module17 NC18 GND19 GND20 NC21 NC22 NC23 P0.3 Used as Chip Select for Memory IC on the CEL Module24 P0.2 Memory IC MISO signal pin25 P0.1 Must be connected to NIRQ for SNAP rmware26 P0.0 Memory IC Clock Signal27 GND28 VCC29 RST/C2CK Debug Clock30 P2.7/C2D Debug Data 31 P2.6 GPIO connected to Buzzer on CEL Eval Board32 P2.5 GPIO connected to Switch 3 on CEL Eval board33 P2.4 GPIO connected to LED3 on CEL Eval board34 P2.3 GPIO connected to Switch 2 on CEL Eval Board
MeshConnect™ Sub-G Module SeriesPage 935 NC36 NC37 GND38 GND39 GND40 GND41 GND42 P2.2 GPIO connected to LED2 on CEL Eval board43 P2.1 GPIO connected to Switch 1 on CEL Eval Board44 P2.0 GPIO connected to LED1 on CEL Eval board45 P1.7 GPIO connected to Switch 0 on CEL Eval Board46 P1.6 GPIO connected to LED0 on CEL Eval board47 P1.5 Memory IC MOSI48 NIRQ External Interrupt Request49 SDN Radio Shutdown (Acve High)50 GND51 GND52 GND53 GND54 GND55 GND56 GNDMeshConnect I/O PIN ASSIGNMENTS (Continued)Number Name NotesSOFTWARE/FIRMWAREThe Sub-G modules support the following software:  • SynapseSNAPEmbeddedFirmware• WirelessM-Bus(868MHzOnly)  • SiliconLabsEZMac  • CELProtocol The MeshConnect Sub-G Development Kit provides a guide on how to access the Si100x IC and utilize the Silicon Labs software development environment. It also provides a set of demo applications to conduct several tests. Below is the list of the demo software features:
MeshConnect™ Sub-G Module SeriesPage 10SOFTWARE/FIRMWARE (Continued)MODULE DIMENSIONSMeshConnect™ Sub-G Module with U.FL Connector for external antennaMeshConnect™ Sub-G Module with RPSMA Connector for external Antenna• Self Healing (Orphan handling) • Point-to-Point network formation • Point-to-Multipoint (Star) network formation • Self Healing (Orphan handling) • Point-to-Point network formation • Point-to-Multipoint (Star) network formation• ACK• Wakeup Modes (Si100X) – most likely software will just use one of the wakeup modes • Frequency Hopping • Unicast Addressing using 16-bit device IDs • Broadcast Addressing • Packet Forwarding (Master node only) • Forwarding Table Aging (Master node only) • Promiscuous Mode (TBD – later release) • Listen Before Talk (LBT) • RSSI • Packet Filtering • Pairing/Joining • Network Synchronization through beacon messages to coordinate sleep/wake cycles - Master node needs to send out beacon as well as gure out when to go to sleep and when to wake up - End node wakes up and looks for beacon to gure out when to go to sleep and wake up • Command line interface for debug/testing/conguration • Push buttons for Range or PER packet test on a Eval board • Save conguration to ash • Save conguration to external ash • Over-the-air programming of the image to another device (TBD – later release) • Low Battery detectionFor layout recommendation for optimum antenna performance, refer to Antenna section in this document.
MeshConnect™ Sub-G Module SeriesPage 11MODULE LAND FOOTPRINTNote: Unless otherwise specied. Dimensions are in Inches [mm].EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via: • AA cell batteries • USB • AC Adapter regulated down to 3.3VDC • External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of the module under various modes of operation). Also included on the evaluation board are four momentary push button switches and four LEDs, a piezo buzzer, a potenti-ometer, and a SPI memory IC. The peripherals are connected to GPIO of the module (see notes in Pin denitions) through slide switches. If the user would wants to connect user specic circuits to the GPIO, slide switches can be used to discon-nect the evaluation board peripherals. The purpose of the evaluation board is to demonstrate simple applications of using GPIO, communicating with the device and also allow exibility for user specic needs.
MeshConnect™ Sub-G Module SeriesPage 12PROCESSINGRecommended Reow ProleParameters ValuesRamp up rate (from Tsoakmax to Tpeak) 3º/sec maxMinimum Soak Temperature 150ºC Maximum Soak Temperature 200ºCSoak Time 60-120 secTLiquidus 217ºC Time above TL 60-150 secTpeak 250ºCTime within 5º of Tpeak 20-30 secTime from 25º to Tpeak 8 min maxRamp down rate 6ºC/sec maxAchieve the brightest possible solder llets with a good shape and low contact angle.Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-cation. See the latest IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias.Repeating Reow Soldering Only a single reow soldering process is encouraged for host boards.Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
MeshConnect™ Sub-G Module SeriesPage 13PROCESSING (Continued)AGENCY CERTIFICATIONSHand SolderingHand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711.Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21)Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEM Responsibility to the FCC Rules and RegulationsThe MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC ID: W7Z-ICP0”The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ Sub-G Module SeriesPage 14AGENCY CERTIFICATIONS (Continued)SHIPMENT, HANDLING, AND STORAGEShipmentThe MeshConnect Modules are delivered in trays of 28.HandlingThe MeshConnect Modules are designed and packaged to be processed in an automated assembly line.Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instruc-tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL)MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.IC Certication — Industry Canada Statement The term "IC" before the certication / registration number only signies that the Industry Canada technical specications were met.Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpCE Certication — Europe The MeshConnect 868MHz RF modules has been tested and certied for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEM Labeling RequirementsThe `CE' mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials “CE” with the following form: · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. · The CE mark must be a minimum of 5mm in height · The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the “CE” marking as shown in the picture
MeshConnect™ Sub-G Module SeriesPage 15REFERENCES & REVISION HISTORYPrevious Versions Changes to Current Version Page(s)0008-00-07-00-000 (Issue ES) December 7, 2010 Initial preliminary datasheet. N/ADisclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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