California Eastern Laboratories ZICM900P2 MeshConnect Sub-G Extended Range Module User Manual Exhibit D Users Manual per 2 1033 b3
California Eastern Laboratories MeshConnect Sub-G Extended Range Module Exhibit D Users Manual per 2 1033 b3
Exhibit D Users Manual per 2 1033 b3
PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series ZICM0868Px ZICM0900Px 868 / 900 MHz Transceiver Based Modules Development Kits Available: ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1 DESCRIPTION MeshConnect™ Sub-G Modules CEL's MeshConnect™ Module Series provides high performance and low cost Sub-G modules for a broad range of wireless networks. The MeshConnect certified and qualified modules enable customers to accelerate time to market by greatly reducing design and certification phases of development. CEL's MeshConnect™ Sub-G modules (868/900MHz) are based on the Silicon Labs SoC ICs (single-chip solutions). Each IC consists of an RF transceiver with baseband modem, a hard-wired MAC and an embedded 8051 microcontroller with internal RAM (4kB) and Flash (64kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect Sub-G modules have 2 different output powers (+12dBm and +19dBm). They provide a reliable transmission, to reduce the number of nodes in a network. They are especially useful for open outdoor applications where the nodes are physically far apart. The higher power Modules have an outstanding 118dB link budget ensuring high quality connections even in harsh environments. APPLICATIONS • • • • Metering RFID Remote Keyless Entry Home Automation ZICM0868Px Best Reliable Performance • Good sensitivity providing longer range for Non-line-of-site aplications • Low operating (receive) current FEATURES • Frequency Range: 902- 928 MHz 868 MHz • Sensitivity: -99 dBm • Max Output Power: + 12 dBm @ 3.6 VDC (ZICM0xxxP0) • • • • Security Irrigation Weather Stations And more... ZICM0900Px + 19 dBm @ 3.6 VDC (ZICM0xxxP2) • Data Rate: 0.123 to 150 kbps • Up to 21 GPIO Pins • High Speed 8051 MCU: 30 MHz 4kB RAM / 64 kB Flash • RF Power Consumption 24 mA Receive 18 mA @ + 1 dBm transmit 30 mA @ + 12 dBm transmit 90 mA @ + 19 dBm transmit • Auto-Frequency Calibration (AFC) • Frequency Hopping Capability • Up to 12 miles of range • Operating Temperature Range: -40 to +85ºC •Software Support: Synapse SNAP Embedded Firmware Wireless M-Bus (868MHz Only) • 10-Bit ADC: Silicon Labs EZMac 300 ksps, 18-ch inputs CEL Protocol • Serial Communication: UARTs, SPI (Master/Slave) SMBus, PCA • Modulation: FSK The information in this document is subject to change without notice, please confirm data is current Document No: 0009-00-07-00-000 (Issue ES) Date Published: December 7, 2010 • FCC, CE and IC certifications in Progress • ROHS compliant Page 1 MeshConnect™ Sub-G Module Series ORDERING INFORMATION Part Number MeshConnect™ Sub-G (Eruope Only) MeshConnect™ Sub-G MeshConnect™ Sub-G Development Kits Order Number Description ZICM0868P0-1CU 868 MHz Module, +12dBm output power with U.FL connector for external antenna ZICM0868P2-1CU 868 MHz Module, +19dBm output power with U.FL connector for external antenna ZICM0868P0-1CS 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna ZICM0868P2-1CS 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna ZICM0868P0-1C 868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA) ZICM0868P2-1C 868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA) ZICM0868P0-1CU-SN 868 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address ZICM0868P2-1CU-SN 868 MHz Module, +19dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address ZICM0868P0-1CS-SN 868 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address ZICM0868P2-1CS-SN 868 MHz Module, +19dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address ZICM0868P0-1C-SN 868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address ZICM0868P2-1C-SN 868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of RP-SMA) with SNAP Operating System software and MAC address ZICM0900P0-1CU 900 MHz Module, +12dBm output power with U.FL connector for external antenna ZICM0900P2-1CU 900 MHz Module, +19dBm output power with U.FL connector for external antenna ZICM0900P0-1CS 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna ZICM0900P2-1CS 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna ZICM0900P0-1C 900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA) ZICM0900P2-1C 900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna (in place of RP-SMA) ZICM0900P0-1CU-SN 900 MHz Module, +12dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address ZICM0900P2-1CU-SN 900 MHz Module, +19dBm output power with U.FL connector for external antenna with SNAP Operating System software and MAC address ZICM0900P0-1CS-SN 900 MHz Module, +12dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address ZICM0900P2-1CS-SN 900 MHz Module, +19dBm output power with RP-SMA connector for external antenna with SNAP Operating System software and MAC address ZICM0900P0-1C-SN 900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address ZICM0900P2-1C-SN 900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of RP-SMA) with SNAP Operating System software and MAC address ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19 dBm module ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19 dBm module Page 2 MeshConnect™ Sub-G Module Series MODULE BLOCK DIAGRAM Sub-G SI100x T/R Switch ANT Low Pass Filter External Memory Optional DEVELOPMENT KIT CEL's Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application development. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for application development. MeshConnect™ Sub-G Module Development Kit The interface board features a serial communication interface, a power management module, and peripherals such as a buzzer, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website http://www.cel.com) Kit Contents: • Evaluation Boards w/Module (2) • USB Cables (1) • AA Batteries (4) • Software & Technical Information CD (1) DEVELOPMENT KIT ORDERING INFORMATION Part Number MeshConnect™ Sub-G Development Kits Order Number Description ZICM0868P2-KIT1-1 868 MHz Evaluation board for +19dBm module ZICM0900P2-KIT1-1 900 MHz Evaluation board for +19dBm module Page 3 MeshConnect™ Sub-G Module Series TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Antenna.................................................................................................................................................................................... Additional Flash Memory....................................................................................................................................................................... Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Software/Firmware.................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ 10 Module Footprint.................................................................................................................................................................................... 11 Processing......................................................................................................................................................................................... 12 Agency Certifications................................................................................................................................................................... 13 Shipment, Storage & Handling................................................................................................................................................. 14 References & Revision History................................................................................................................................................. 15 Page 4 MeshConnect™ Sub-G Module Series TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance solution for all Sub-G applications. For more information about the Silicon Labs ICs, visit http://www.silabs.com. ANTENNA The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna option). The following options are supported by CEL: • U.FL connector • RP-SMA connector • A Connection for 1/4 wave wire antenna in place of RP-SMA Here are some design guidelines to help ensure antenna performance: • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction. ADDITIONAL FLASH MEMORY (Optional) The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of flash. Additional memory (1MB) can be mounted on the module (as an option) to enable Over The Air (OTA) programming capability. This is a custom solution as an option for all part numbers. Page 5 MeshConnect™ Sub-G Module Series ABSOLUTE MAXIMUM RATINGS Description MeshConnect™ Sub-G Module Unit Min Max Power Supply Voltage (VDD) -0.3 3.6 VDC Voltage on any I/O Line -0.3 VDD + 0.3 VDC – 10 dBm -40 125 °C – 260 °C RF Input Power Storage Temperature Range Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage (VDD) MeshConnect™ Sub-G Module Min Typ Max Unit 1.8/2.7* 3.3 3.6 Input Frequency 863 – 870 MHz Input Frequency 902 – 928 MHz Ambient Temperature Range -40 25 85 °C Note: * 2.7v is the min voltage if an additional memory IC was placed on the module. DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2 TX power max) Description MeshConnect™ Sub-G Module Unit Min Typ Max Transmit Mode Current – 90 – mA Receive Mode Current – 24 – mA Sleep Mode Current – TBD – µA DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0 TX power max) Description MeshConnect™ Sub-G Module Unit Min Typ Max Transmit Mode Current – 35 – mA Receive Mode Current – 24 – mA Sleep Mode Current – TBD – µA Page 6 MeshConnect™ Sub-G Module Series RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2) Description MeshConnect™ Sub-G Module Unit Min Typ Max 863 – 928 MHz – 19 – dBm General Characteristics RF Frequency Range Transmitter Maximum Output Power Minimum Output Power – -5 – dBm FSK Error TBD – TBD Carrier Offset TBD – TBD KHz – 75 – KHz Sensitivity (1% PER, 156kbps) – -99 TBD dBm Saturation (maximum input level) – – 10 dBm Deviation Receiver RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0) Description MeshConnect™ Sub-G Module Unit Min Typ Max 863 – 928 MHz – 12 – dBm dBm General Characteristics RF Frequency Range Transmitter Maximum Output Power Minimum Output Power – -12 – FSK Error TBD – TBD Carrier Offset TBD – TBD KHz – 75 – KHz Sensitivity (1% PER, 156kbps) – -99 TBD dBm Saturation (maximum input level) – – 10 dBm Deviation Receiver Page 7 MeshConnect™ Sub-G Module Series PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Name GND GND GND GND GND GND GND NC ANTA 10 GPIO0 11 GPIO2 12 P0.7/IREF P0.6/ 13 CNVSTR 14 P0.5/RXD 15 P0.4/TXD 16 WP 17 NC 18 GND 19 GND 20 NC 21 NC 22 NC 23 P0.3 24 P0.2 25 P0.1 26 P0.0 27 GND 28 VCC 29 RST/C2CK 30 P2.7/C2D 31 P2.6 32 P2.5 33 P2.4 34 P2.3 Notes Available: Not used for any module functionality Available: Not used for any module functionality Available: Not used for any module functionality Must be connected to SDN for SNAP firmware Used as Chip Select for Memory on CEL Eval. Board UART TXD UART RXD Write Protect Pin of Memory Chip on Module Used as Chip Select for Memory IC on the CEL Module Memory IC MISO signal pin Must be connected to NIRQ for SNAP firmware Memory IC Clock Signal Debug Clock Debug Data GPIO connected to Buzzer on CEL Eval Board GPIO connected to Switch 3 on CEL Eval board GPIO connected to LED3 on CEL Eval board GPIO connected to Switch 2 on CEL Eval Board Page 8 MeshConnect™ Sub-G Module Series MeshConnect I/O PIN ASSIGNMENTS (Continued) Number Name Notes 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 NC NC GND GND GND GND GND P2.2 P2.1 P2.0 P1.7 P1.6 P1.5 NIRQ SDN GND GND GND GND GND GND GND GPIO connected to LED2 on CEL Eval board GPIO connected to Switch 1 on CEL Eval Board GPIO connected to LED1 on CEL Eval board GPIO connected to Switch 0 on CEL Eval Board GPIO connected to LED0 on CEL Eval board Memory IC MOSI External Interrupt Request Radio Shutdown (Active High) SOFTWARE/FIRMWARE The Sub-G modules support the following software: • • • • Synapse SNAP Embedded Firmware Wireless M-Bus (868MHz Only) Silicon Labs EZMac CEL Protocol The MeshConnect Sub-G Development Kit provides a guide on how to access the Si100x IC and utilize the Silicon Labs software development environment. It also provides a set of demo applications to conduct several tests. Below is the list of the demo software features: Page 9 MeshConnect™ Sub-G Module Series SOFTWARE/FIRMWARE (Continued) • • • • • • • • • • • • • • • • • • • • • • • • • Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation ACK Wakeup Modes (Si100X) – most likely software will just use one of the wakeup modes Frequency Hopping Unicast Addressing using 16-bit device IDs Broadcast Addressing Packet Forwarding (Master node only) Forwarding Table Aging (Master node only) Promiscuous Mode (TBD – later release) Listen Before Talk (LBT) RSSI Packet Filtering Pairing/Joining Network Synchronization through beacon messages to coordinate sleep/wake cycles - Master node needs to send out beacon as well as figure out when to go to sleep and when to wake up - End node wakes up and looks for beacon to figure out when to go to sleep and wake up Command line interface for debug/testing/configuration Push buttons for Range or PER packet test on a Eval board Save configuration to flash Save configuration to external flash Over-the-air programming of the image to another device (TBD – later release) Low Battery detection MODULE DIMENSIONS MeshConnect™ Sub-G Module with U.FL Connector for external antenna MeshConnect™ Sub-G Module with RPSMA Connector for external Antenna For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 10 MeshConnect™ Sub-G Module Series MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via: • • • • AA cell batteries USB AC Adapter regulated down to 3.3VDC External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of the module under various modes of operation). Also included on the evaluation board are four momentary push button switches and four LEDs, a piezo buzzer, a potentiometer, and a SPI memory IC. The peripherals are connected to GPIO of the module (see notes in Pin definitions) through slide switches. If the user would wants to connect user specific circuits to the GPIO, slide switches can be used to disconnect the evaluation board peripherals. The purpose of the evaluation board is to demonstrate simple applications of using GPIO, communicating with the device and also allow flexibility for user specific needs. Page 11 MeshConnect™ Sub-G Module Series PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle. Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.” Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • • • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 12 MeshConnect™ Sub-G Module Series PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711. Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC ID: W7Z-ICP0” The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 13 MeshConnect™ Sub-G Module Series AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php CE Certification — Europe The MeshConnect 868MHz RF modules has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with the following form: · · · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the “CE” marking as shown in the picture SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. Page 14 MeshConnect™ Sub-G Module Series REFERENCES & REVISION HISTORY Previous Versions 0008-00-07-00-000 (Issue ES) December 7, 2010 Changes to Current Version Initial preliminary datasheet. Page(s) N/A Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 15
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xmp.iid:AB6A0D42352068118DBBD174B03CCC81, xmp.iid:FA7F117407206811994CAB9E59E5E98B, xmp.iid:F77F117407206811B959D8FE4B9777DE, xmp.iid:F87F117407206811B959D8FE4B9777DE, xmp.iid:F97F117407206811B959D8FE4B9777DE, xmp.iid:FA7F117407206811B959D8FE4B9777DE, xmp.iid:FB7F117407206811B959D8FE4B9777DE, xmp.iid:FC7F117407206811B959D8FE4B9777DE, xmp.iid:FD7F117407206811B959D8FE4B9777DE, xmp.iid:FE7F117407206811B959D8FE4B9777DE, xmp.iid:FF7F117407206811B959D8FE4B9777DE, xmp.iid:0080117407206811B959D8FE4B9777DE, xmp.iid:CA3D04AF0B206811B959D8FE4B9777DE, xmp.iid:CB3D04AF0B206811B959D8FE4B9777DE, xmp.iid:CC3D04AF0B206811B959D8FE4B9777DE, xmp.iid:CD3D04AF0B206811B959D8FE4B9777DE, xmp.iid:CE3D04AF0B206811B959D8FE4B9777DE, xmp.iid:CF3D04AF0B206811B959D8FE4B9777DE, xmp.iid:D03D04AF0B206811B959D8FE4B9777DE, xmp.iid:D13D04AF0B206811B959D8FE4B9777DE, xmp.iid:D23D04AF0B206811B959D8FE4B9777DE, xmp.iid:D33D04AF0B206811B959D8FE4B9777DE, xmp.iid:D43D04AF0B206811B959D8FE4B9777DE, xmp.iid:840DCA0D0D206811B959D8FE4B9777DE, xmp.iid:850DCA0D0D206811B959D8FE4B9777DE, xmp.iid:860DCA0D0D206811B959D8FE4B9777DE, xmp.iid:870DCA0D0D206811B959D8FE4B9777DE, xmp.iid:880DCA0D0D206811B959D8FE4B9777DE, xmp.iid:890DCA0D0D206811B959D8FE4B9777DE, xmp.iid:8A0DCA0D0D206811B959D8FE4B9777DE, xmp.iid:8B0DCA0D0D206811B959D8FE4B9777DE, xmp.iid:8C0DCA0D0D206811B959D8FE4B9777DE, xmp.iid:8D0DCA0D0D206811B959D8FE4B9777DE, xmp.iid:8E0DCA0D0D206811B959D8FE4B9777DE, xmp.iid:D49B7D0911206811B959D8FE4B9777DE, xmp.iid:01801174072068118098D3A5C2DDAD41, xmp.iid:F77F117407206811B699B159C3C4FE94, xmp.iid:F77F1174072068118DBBD6375C577149, xmp.iid:F87F1174072068118DBBD6375C577149, xmp.iid:FFC89D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:00C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:01C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:02C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:03C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:04C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:05C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:06C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:07C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:08C99D5E0D2068118DBBF3DE4F16C6B4, xmp.iid:A6F8BAE03B2068118DBBF3DE4F16C6B4, xmp.iid:A7F8BAE03B2068118DBBF3DE4F16C6B4, xmp.iid:A8F8BAE03B2068118DBBF3DE4F16C6B4, xmp.iid:F77F1174072068118DBBF94E78B66A27, xmp.iid:F87F1174072068118DBBF94E78B66A27, xmp.iid:F97F1174072068118DBBF94E78B66A27, xmp.iid:FA7F1174072068118DBBF94E78B66A27, xmp.iid:FB7F1174072068118DBBF94E78B66A27, xmp.iid:FC7F1174072068118DBBF94E78B66A27, xmp.iid:FD7F1174072068118DBBF94E78B66A27, xmp.iid:FE7F1174072068118DBBF94E78B66A27, xmp.iid:FF7F1174072068118DBBF94E78B66A27, xmp.iid:00801174072068118DBBF94E78B66A27, xmp.iid:E8D381DB162068118DBBF94E78B66A27, xmp.iid:E9D381DB162068118DBBF94E78B66A27, xmp.iid:EAD381DB162068118DBBF94E78B66A27, xmp.iid:EBD381DB162068118DBBF94E78B66A27, xmp.iid:ECD381DB162068118DBBF94E78B66A27, xmp.iid:EDD381DB162068118DBBF94E78B66A27, xmp.iid:EFD381DB162068118DBBF94E78B66A27, xmp.iid:F0D381DB162068118DBBF94E78B66A27, xmp.iid:F1D381DB162068118DBBF94E78B66A27, xmp.iid:F2D381DB162068118DBBF94E78B66A27, xmp.iid:7C732A2A322068118DBBF94E78B66A27, xmp.iid:F77F11740720681197A584855489CD5D, xmp.iid:0180117407206811AB0889CA268578FC, xmp.iid:0280117407206811AB0889CA268578FC, xmp.iid:018011740720681192B0D6AAC875143D, xmp.iid:028011740720681192B0D6AAC875143D, xmp.iid:018011740720681192B0C7D7EDE3A055, xmp.iid:0180117407206811871FF6957AE86290, xmp.iid:0280117407206811871FF6957AE86290, xmp.iid:0380117407206811871FF6957AE86290, xmp.iid:0480117407206811871FF6957AE86290, xmp.iid:0580117407206811871FF6957AE86290, xmp.iid:0680117407206811871FF6957AE86290, xmp.iid:0780117407206811871FF6957AE86290, xmp.iid:0880117407206811871FF6957AE86290, xmp.iid:0980117407206811871FF6957AE86290, xmp.iid:0A80117407206811871FF6957AE86290, xmp.iid:B4D880810A206811871FF6957AE86290, xmp.iid:B5D880810A206811871FF6957AE86290, xmp.iid:B6D880810A206811871FF6957AE86290, xmp.iid:B7D880810A206811871FF6957AE86290, xmp.iid:B8D880810A206811871FF6957AE86290, xmp.iid:B9D880810A206811871FF6957AE86290, xmp.iid:BAD880810A206811871FF6957AE86290, xmp.iid:BBD880810A206811871FF6957AE86290, xmp.iid:BCD880810A206811871FF6957AE86290, xmp.iid:BDD880810A206811871FF6957AE86290, xmp.iid:BED880810A206811871FF6957AE86290, xmp.iid:A6EBF8B40E206811871FF6957AE86290, xmp.iid:A7EBF8B40E206811871FF6957AE86290, xmp.iid:A8EBF8B40E206811871FF6957AE86290, xmp.iid:A9EBF8B40E206811871FF6957AE86290, xmp.iid:AAEBF8B40E206811871FF6957AE86290, xmp.iid:ABEBF8B40E206811871FF6957AE86290, xmp.iid:ACEBF8B40E206811871FF6957AE86290, xmp.iid:ADEBF8B40E206811871FF6957AE86290, xmp.iid:AEEBF8B40E206811871FF6957AE86290, xmp.iid:AFEBF8B40E206811871FF6957AE86290, xmp.iid:B0EBF8B40E206811871FF6957AE86290, xmp.iid:E873AB1518206811871FF6957AE86290, xmp.iid:E973AB1518206811871FF6957AE86290, xmp.iid:018011740720681188C6EFA9B5D3A278, xmp.iid:028011740720681188C6EFA9B5D3A278, xmp.iid:038011740720681188C6EFA9B5D3A278, xmp.iid:048011740720681188C6EFA9B5D3A278, xmp.iid:058011740720681188C6EFA9B5D3A278, xmp.iid:068011740720681188C6EFA9B5D3A278, xmp.iid:078011740720681188C6EFA9B5D3A278, xmp.iid:088011740720681188C6EFA9B5D3A278, xmp.iid:098011740720681188C6EFA9B5D3A278, xmp.iid:0A8011740720681188C6EFA9B5D3A278, xmp.iid:36BBA3571120681188C6EFA9B5D3A278, xmp.iid:37BBA3571120681188C6EFA9B5D3A278, xmp.iid:38BBA3571120681188C6EFA9B5D3A278, xmp.iid:39BBA3571120681188C6EFA9B5D3A278, xmp.iid:3ABBA3571120681188C6EFA9B5D3A278, xmp.iid:3BBBA3571120681188C6EFA9B5D3A278, xmp.iid:3CBBA3571120681188C6EFA9B5D3A278, xmp.iid:F77F117407206811994CA83D6BC696B2, xmp.iid:F87F117407206811994CA83D6BC696B2, xmp.iid:F97F117407206811994CA83D6BC696B2, xmp.iid:FA7F117407206811994CA83D6BC696B2, xmp.iid:FB7F117407206811994CA83D6BC696B2, xmp.iid:FB7F11740720681192B0A1C0D078067A, xmp.iid:FC7F11740720681192B0A1C0D078067A, xmp.iid:FD7F11740720681192B0A1C0D078067A, xmp.iid:FE7F11740720681192B0A1C0D078067A, xmp.iid:0780117407206811AB08EFCE28ED4A39, xmp.iid:0880117407206811AB08EFCE28ED4A39, xmp.iid:0980117407206811AB08EFCE28ED4A39, xmp.iid:0A80117407206811AB08EFCE28ED4A39, xmp.iid:FC6D2DBF3D206811AB08EFCE28ED4A39, xmp.iid:FD6D2DBF3D206811AB08EFCE28ED4A39, xmp.iid:FE6D2DBF3D206811AB08EFCE28ED4A39, xmp.iid:FF6D2DBF3D206811AB08EFCE28ED4A39, xmp.iid:0180117407206811A7BAB1A66DB1B7E8, xmp.iid:FD7F117407206811A961ACF9CFBFB453, xmp.iid:FE7F117407206811A961ACF9CFBFB453, xmp.iid:FF7F117407206811A961ACF9CFBFB453, xmp.iid:0080117407206811A961ACF9CFBFB453, xmp.iid:40A1114728206811A961ACF9CFBFB453, xmp.iid:41A1114728206811A961ACF9CFBFB453, xmp.iid:42A1114728206811A961ACF9CFBFB453, xmp.iid:43A1114728206811A961ACF9CFBFB453, xmp.iid:44A1114728206811A961ACF9CFBFB453, xmp.iid:45A1114728206811A961ACF9CFBFB453, xmp.iid:FA7F1174072068119109E3B66E996E6D, xmp.iid:FB7F1174072068119109E3B66E996E6D, xmp.iid:FC7F1174072068119109E3B66E996E6D, xmp.iid:FD7F1174072068119109E3B66E996E6D, xmp.iid:FE7F1174072068119109E3B66E996E6D, xmp.iid:FF7F1174072068119109E3B66E996E6D, xmp.iid:01801174072068119457F9DAE603CB65, xmp.iid:0980117407206811871FBA4AAFE977CD, xmp.iid:0A80117407206811871FBA4AAFE977CD, xmp.iid:0180117407206811A961EC2A5F0BE9D7, xmp.iid:0280117407206811A961EC2A5F0BE9D7, xmp.iid:0380117407206811A961EC2A5F0BE9D7, xmp.iid:0480117407206811A961EC2A5F0BE9D7, xmp.iid:0580117407206811A961EC2A5F0BE9D7, xmp.iid:01801174072068119109AFD98B30143E, xmp.iid:02801174072068119109AFD98B30143E, xmp.iid:03801174072068119109AFD98B30143E, xmp.iid:04801174072068119109AFD98B30143E, xmp.iid:05801174072068119109AFD98B30143E, xmp.iid:018011740720681194579E10AEEEAFD6, xmp.iid:01801174072068119457BB25BBD11B99, xmp.iid:02801174072068119457BB25BBD11B99, xmp.iid:03801174072068119457BB25BBD11B99, xmp.iid:04801174072068119457BB25BBD11B99, xmp.iid:05801174072068119457BB25BBD11B99, xmp.iid:06801174072068119457BB25BBD11B99, xmp.iid:07801174072068119457BB25BBD11B99, xmp.iid:08801174072068119457BB25BBD11B99, xmp.iid:09801174072068119457BB25BBD11B99, xmp.iid:0A801174072068119457BB25BBD11B99, xmp.iid:28D053CD1B2068119457BB25BBD11B99, xmp.iid:29D053CD1B2068119457BB25BBD11B99, xmp.iid:2AD053CD1B2068119457BB25BBD11B99, xmp.iid:2BD053CD1B2068119457BB25BBD11B99, xmp.iid:F77F117407206811994CBDB34F61EF31, xmp.iid:F87F117407206811994CBDB34F61EF31, xmp.iid:F97F117407206811994CBDB34F61EF31, xmp.iid:018011740720681197A5AA3B83CA1C4C, xmp.iid:028011740720681197A5AA3B83CA1C4C, xmp.iid:01801174072068118F6280C9DE3D4BD1, xmp.iid:02801174072068118F6280C9DE3D4BD1, xmp.iid:03801174072068118F6280C9DE3D4BD1, xmp.iid:04801174072068118F6280C9DE3D4BD1, xmp.iid:05801174072068118F6280C9DE3D4BD1, xmp.iid:06801174072068118F6280C9DE3D4BD1, xmp.iid:07801174072068118F6280C9DE3D4BD1, xmp.iid:08801174072068118F6280C9DE3D4BD1, xmp.iid:09801174072068118F6280C9DE3D4BD1, xmp.iid:0A801174072068118F6280C9DE3D4BD1, xmp.iid:C4152A32272068118F6280C9DE3D4BD1, xmp.iid:C5152A32272068118F6280C9DE3D4BD1, xmp.iid:C6152A32272068118F6280C9DE3D4BD1, xmp.iid:C7152A32272068118F6280C9DE3D4BD1, xmp.iid:C8152A32272068118F6280C9DE3D4BD1, xmp.iid:C9152A32272068118F6280C9DE3D4BD1, xmp.iid:CA152A32272068118F6280C9DE3D4BD1, xmp.iid:CB152A32272068118F6280C9DE3D4BD1, xmp.iid:CC152A32272068118F6280C9DE3D4BD1, xmp.iid:CD152A32272068118F6280C9DE3D4BD1, xmp.iid:CE152A32272068118F6280C9DE3D4BD1, xmp.iid:588565762B2068118F6280C9DE3D4BD1, xmp.iid:598565762B2068118F6280C9DE3D4BD1, xmp.iid:5A8565762B2068118F6280C9DE3D4BD1, xmp.iid:5B8565762B2068118F6280C9DE3D4BD1, xmp.iid:5C8565762B2068118F6280C9DE3D4BD1, xmp.iid:0180117407206811871FBACA2881D689, xmp.iid:0280117407206811871FBACA2881D689, xmp.iid:0380117407206811871FBACA2881D689, xmp.iid:0480117407206811871FBACA2881D689, xmp.iid:0580117407206811871FBACA2881D689, xmp.iid:0680117407206811871FBACA2881D689, xmp.iid:0780117407206811871FBACA2881D689, xmp.iid:0880117407206811871FBACA2881D689, xmp.iid:0980117407206811871FBACA2881D689, xmp.iid:0A80117407206811871FBACA2881D689, xmp.iid:01801174072068119457B25828FF1492, xmp.iid:02801174072068119457B25828FF1492, xmp.iid:03801174072068119457B25828FF1492, xmp.iid:04801174072068119457B25828FF1492, xmp.iid:05801174072068119457B25828FF1492, xmp.iid:06801174072068119457B25828FF1492, xmp.iid:07801174072068119457B25828FF1492, xmp.iid:08801174072068119457B25828FF1492, xmp.iid:09801174072068119457B25828FF1492, xmp.iid:0A801174072068119457B25828FF1492, xmp.iid:6403AC36182068119457B25828FF1492, xmp.iid:6503AC36182068119457B25828FF1492, xmp.iid:6603AC36182068119457B25828FF1492, xmp.iid:6703AC36182068119457B25828FF1492, xmp.iid:6803AC36182068119457B25828FF1492, xmp.iid:6903AC36182068119457B25828FF1492, xmp.iid:6A03AC36182068119457B25828FF1492, xmp.iid:6B03AC36182068119457B25828FF1492, xmp.iid:0180117407206811AB08BF4AC449EF31, xmp.iid:0180117407206811871FAB0C119F0D2D, 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xmp.iid:D6E1F8082C2068118C14DDA51C419200, xmp.iid:D7E1F8082C2068118C14DDA51C419200, xmp.iid:2B80D8802C2068118C14DDA51C419200, xmp.iid:98CC69B32C2068118C14DDA51C419200, xmp.iid:CB851D74072068118C149B78DCA94B9B, xmp.iid:D2437877072068118C149B78DCA94B9B, xmp.iid:E62FABCA072068118C149B78DCA94B9B, xmp.iid:2DFC14E4072068118C149B78DCA94B9B, xmp.iid:2D8AAD75082068118C149B78DCA94B9B, xmp.iid:E0C0048A082068118C149B78DCA94B9B, xmp.iid:165EEFED082068118C149B78DCA94B9B, xmp.iid:9F062374092068118C149B78DCA94B9B, xmp.iid:E10C47A2092068118C149B78DCA94B9B, xmp.iid:5A970AEA092068118C149B78DCA94B9B, xmp.iid:0A52BAFB092068118C149B78DCA94B9B, xmp.iid:7779EE1E0A2068118C149B78DCA94B9B, xmp.iid:D6188D7C0A2068118C149B78DCA94B9B, xmp.iid:9E2F9ED80D2068118C149B78DCA94B9B, xmp.iid:8FF3671C0F2068118C149B78DCA94B9B, xmp.iid:C9DB7F94292068118C149B78DCA94B9B, xmp.iid:502253982A2068118C149B78DCA94B9B, xmp.iid:1A0880B52A2068118C149B78DCA94B9B, xmp.iid:A5CF78232B2068118C149B78DCA94B9B, xmp.iid:556739332B2068118C149B78DCA94B9B, xmp.iid:4ED1685A2B2068118C149B78DCA94B9B, xmp.iid:CE43719F2B2068118C149B78DCA94B9B, xmp.iid:279EF2BC382068118C149B78DCA94B9B, xmp.iid:81F11474072068118083DFC3B4EC98E6, xmp.iid:D3E51474072068118083E4615411BBFD History When : 2009:04:20 13:14:11-07:00, 2009:04:20 13:14:11-07:00, 2009:04:20 13:20:30-07:00, 2009:04:20 13:58:29-07:00, 2009:05:14 13:29:23-07:00, 2009:05:14 13:29:55-07:00, 2009:05:14 13:32:20-07:00, 2009:05:14 13:56:56-07:00, 2009:06:03 14:34:24-07:00, 2009:06:09 16:29:52-07:00, 2009:06:09 16:31:25-07:00, 2009:06:09 16:34:01-07:00, 2009:06:09 16:34:45-07:00, 2009:06:09 16:35-07:00, 2009:06:09 16:39:41-07:00, 2009:06:09 16:40:39-07:00, 2009:06:09 16:57:55-07:00, 2009:06:09 16:58-07:00, 2009:06:09 16:59:24-07:00, 2009:06:09 17:00:09-07:00, 2009:06:09 17:02:16-07:00, 2009:06:09 17:02:50-07:00, 2009:06:09 17:03:04-07:00, 2009:06:09 17:03:33-07:00, 2009:06:09 17:04:54-07:00, 2009:06:09 17:05:07-07:00, 2009:06:09 17:07:05-07:00, 2009:06:09 17:07:19-07:00, 2009:06:09 17:08:04-07:00, 2009:06:09 17:08:52-07:00, 2009:06:09 17:09:58-07:00, 2009:06:09 17:11:51-07:00, 2009:06:09 17:28:56-07:00, 2009:06:09 17:30:14-07:00, 2009:06:09 17:30:56-07:00, 2009:06:09 17:32:27-07:00, 2009:06:09 17:33:25-07:00, 2009:06:09 17:33:49-07:00, 2009:06:09 17:34:34-07:00, 2009:06:09 17:36:59-07:00, 2009:06:09 17:37:38-07:00, 2009:06:09 17:38:28-07:00, 2009:06:10 11:36:55-07:00, 2009:06:11 08:23:25-07:00, 2009:06:12 07:52:50-07:00, 2009:06:12 07:53:30-07:00, 2009:09:17 13:10:10-07:00, 2009:09:17 13:15:19-07:00, 2009:09:17 13:23:17-07:00, 2009:09:17 13:24:12-07:00, 2009:09:17 13:29:33-07:00, 2009:09:17 14:46:46-07:00, 2009:09:17 14:51:07-07:00, 2009:09:17 14:52:45-07:00, 2009:09:17 14:55:26-07:00, 2009:09:17 14:56-07:00, 2009:09:17 14:58:14-07:00, 2009:09:17 15:40:33-07:00, 2009:09:17 16:04:16-07:00, 2009:09:18 09:07:25-07:00, 2009:09:18 09:16:05-07:00, 2009:09:18 09:17:10-07:00, 2009:09:18 09:46:44-07:00, 2009:09:18 10:22:42-07:00, 2009:09:18 10:37:51-07:00, 2009:09:18 10:52:31-07:00, 2009:09:18 10:53:49-07:00, 2009:09:18 10:54:08-07:00, 2009:09:18 10:55:01-07:00, 2009:09:18 10:57:41-07:00, 2009:09:18 11:05:04-07:00, 2009:09:18 11:05:37-07:00, 2009:09:18 11:07:11-07:00, 2009:09:18 11:14:55-07:00, 2009:09:18 13:41:43-07:00, 2009:09:18 13:50:24-07:00, 2009:09:18 14:06:38-07:00, 2009:09:18 14:09:57-07:00, 2009:09:18 14:12:11-07:00, 2009:09:18 14:13:09-07:00, 2009:09:24 15:29:16-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:59:19-07:00, 2009:09:28 10:00:22-07:00, 2009:09:28 10:00:33-07:00, 2009:09:28 10:00:52-07:00, 2009:09:28 10:03:50-07:00, 2009:09:28 10:05:45-07:00, 2009:09:28 10:10:45-07:00, 2009:09:28 10:15:40-07:00, 2009:09:28 10:16:37-07:00, 2009:09:28 10:18:03-07:00, 2009:09:28 10:18:18-07:00, 2009:09:28 10:22:13-07:00, 2009:09:28 10:24:50-07:00, 2009:09:28 10:25:51-07:00, 2009:09:28 10:36:44-07:00, 2009:09:28 10:38:28-07:00, 2009:09:28 10:40:35-07:00, 2009:09:28 10:48:42-07:00, 2009:09:28 10:49:34-07:00, 2009:09:28 10:50:24-07:00, 2009:09:28 10:51:27-07:00, 2009:09:28 10:51:40-07:00, 2009:09:28 10:52:17-07:00, 2009:09:28 11:13:07-07:00, 2009:09:28 11:18:34-07:00, 2009:09:28 11:18:56-07:00, 2009:09:28 11:43:38-07:00, 2009:09:28 11:44:08-07:00, 2009:09:28 11:44:56-07:00, 2009:09:28 11:46:56-07:00, 2009:09:28 11:48:46-07:00, 2009:09:28 11:54:19-07:00, 2009:09:28 11:55:25-07:00, 2009:09:28 11:59:25-07:00, 2009:09:28 12:04:12-07:00, 2009:10:02 09:52:40-07:00, 2009:10:02 09:58:12-07:00, 2009:10:02 10:17:22-07:00, 2009:10:02 10:18:23-07:00, 2009:10:02 10:35:31-07:00, 2009:10:02 10:39:25-07:00, 2009:10:02 10:51:34-07:00, 2009:10:02 10:58:08-07:00, 2009:10:02 10:58:49-07:00, 2009:10:02 10:59-07:00, 2009:10:02 11:03:27-07:00, 2009:10:02 11:20:01-07:00, 2009:10:02 11:20:23-07:00, 2009:10:02 11:24:08-07:00, 2009:10:02 12:20:32-07:00, 2009:10:02 12:21:14-07:00, 2009:10:02 12:22:16-07:00, 2009:10:06 08:45:11-07:00, 2009:10:06 08:45:34-07:00, 2009:10:06 08:45:47-07:00, 2009:10:06 08:47:57-07:00, 2009:10:06 08:49:08-07:00, 2010:01:14 09:41:06-08:00, 2010:01:14 09:43:12-08:00, 2010:01:14 09:44:02-08:00, 2010:01:14 09:47:32-08:00, 2010:01:29 14:18:23-08:00, 2010:01:29 14:22:10-08:00, 2010:01:29 14:23-08:00, 2010:01:29 14:27:26-08:00, 2010:01:29 14:28:18-08:00, 2010:01:29 14:46:38-08:00, 2010:01:29 14:48:22-08:00, 2010:01:29 14:51:38-08:00, 2010:02:04 09:40:25-08:00, 2010:03:24 11:02:41-07:00, 2010:03:24 11:28:08-07:00, 2010:03:24 13:02:35-07:00, 2010:03:24 13:14:52-07:00, 2010:03:24 13:16:49-07:00, 2010:03:24 13:18:26-07:00, 2010:03:24 13:33:27-07:00, 2010:03:24 13:42:01-07:00, 2010:03:24 13:43:51-07:00, 2010:03:24 13:44:24-07:00, 2010:03:31 11:41:21-07:00, 2010:03:31 11:43:35-07:00, 2010:03:31 11:45:23-07:00, 2010:03:31 11:45:31-07:00, 2010:03:31 11:46:13-07:00, 2010:03:31 14:52:31-07:00, 2010:04:01 10:10:07-07:00, 2010:04:07 10:04:53-07:00, 2010:04:07 10:05:17-07:00, 2010:04:08 07:46:18-07:00, 2010:04:08 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