California Eastern Laboratories ZICM900P2 MeshConnect Sub-G Extended Range Module User Manual Exhibit D Users Manual per 2 1033 b3

California Eastern Laboratories MeshConnect Sub-G Extended Range Module Exhibit D Users Manual per 2 1033 b3

Exhibit D Users Manual per 2 1033 b3

Download: California Eastern Laboratories ZICM900P2 MeshConnect Sub-G Extended Range Module User Manual Exhibit D Users Manual per 2 1033 b3
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PRELIMINARY DATA SHEET
MeshConnect™ Sub-G Module Series
ZICM0868Px
ZICM0900Px
868 / 900 MHz Transceiver Based Modules
Development Kits Available:
ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1
DESCRIPTION
MeshConnect™ Sub-G Modules
CEL's MeshConnect™ Module Series provides high performance
and low cost Sub-G modules for a broad range of wireless networks. The MeshConnect certified and qualified modules enable
customers to accelerate time to market by greatly reducing design
and certification phases of development.
CEL's MeshConnect™ Sub-G modules (868/900MHz) are based
on the Silicon Labs SoC ICs (single-chip solutions). Each IC consists of an RF transceiver with baseband modem, a hard-wired
MAC and an embedded 8051 microcontroller with internal RAM
(4kB) and Flash (64kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as
timers and UARTs.
The MeshConnect Sub-G modules have 2 different output powers
(+12dBm and +19dBm). They provide a reliable transmission, to
reduce the number of nodes in a network. They are especially
useful for open outdoor applications where the nodes are physically far apart. The higher power Modules have an outstanding
118dB link budget ensuring high quality connections even in
harsh environments.
APPLICATIONS
•
•
•
•
Metering
RFID
Remote Keyless Entry
Home Automation
ZICM0868Px
Best Reliable Performance
• Good sensitivity providing longer range for Non-line-of-site
		aplications
• Low operating (receive) current
FEATURES
• Frequency Range:
902- 928 MHz		
868 MHz
• Sensitivity:  -99 dBm
• Max Output Power:
+ 12 dBm @ 3.6 VDC (ZICM0xxxP0)
•
•
•
•
Security
Irrigation
Weather Stations
And more...
ZICM0900Px
+ 19 dBm @ 3.6 VDC (ZICM0xxxP2)
• Data Rate: 0.123 to 150 kbps
• Up to 21 GPIO Pins
• High Speed 8051 MCU:
30 MHz
4kB RAM / 64 kB Flash
• RF Power Consumption
24 mA Receive
18 mA @ + 1 dBm transmit
30 mA @ + 12 dBm transmit		
90 mA @ + 19 dBm transmit
• Auto-Frequency Calibration (AFC)
• Frequency Hopping Capability
• Up to 12 miles of range
• Operating Temperature Range:
-40 to +85ºC
•Software  Support:
Synapse SNAP Embedded Firmware
Wireless M-Bus (868MHz Only)
• 10-Bit ADC:
Silicon Labs EZMac
300 ksps, 18-ch inputs
CEL Protocol
• Serial Communication:
UARTs, SPI (Master/Slave)
SMBus, PCA
• Modulation:
FSK
The information in this document is subject to change without notice, please confirm data is current
Document No: 0009-00-07-00-000 (Issue ES)
Date Published: December 7, 2010
• FCC, CE and IC certifications in
Progress
• ROHS compliant
Page 1
MeshConnect™ Sub-G Module Series
ORDERING INFORMATION
Part Number
MeshConnect™ Sub-G
(Eruope Only)
MeshConnect™ Sub-G
MeshConnect™ Sub-G
Development Kits
Order Number
Description
ZICM0868P0-1CU
868 MHz Module, +12dBm output power with U.FL connector for external antenna
ZICM0868P2-1CU
868 MHz Module, +19dBm output power with U.FL connector for external antenna
ZICM0868P0-1CS
868 MHz Module, +12dBm output power with RP-SMA connector for external antenna
ZICM0868P2-1CS
868 MHz Module, +19dBm output power with RP-SMA connector for external antenna
ZICM0868P0-1C
868 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0868P2-1C
868 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0868P0-1CU-SN
868 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P2-1CU-SN
868 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P0-1CS-SN
868 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P2-1CS-SN
868 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0868P0-1C-SN
868 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0868P2-1C-SN
868 MHz Module, +19dBm output power for 1/4 wave wire antenna(in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0900P0-1CU
900 MHz Module, +12dBm output power with U.FL connector for external antenna
ZICM0900P2-1CU
900 MHz Module, +19dBm output power with U.FL connector for external antenna
ZICM0900P0-1CS
900 MHz Module, +12dBm output power with RP-SMA connector for external antenna
ZICM0900P2-1CS
900 MHz Module, +19dBm output power with RP-SMA connector for external antenna
ZICM0900P0-1C
900 MHz Module, +12dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0900P2-1C
900 MHz Module, +19dBm output power with a connection for 1/4 wave wire antenna
(in place of RP-SMA)
ZICM0900P0-1CU-SN
900 MHz Module, +12dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P2-1CU-SN
900 MHz Module, +19dBm output power with U.FL connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P0-1CS-SN
900 MHz Module, +12dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P2-1CS-SN
900 MHz Module, +19dBm output power with RP-SMA connector for external antenna
with SNAP Operating System software and MAC address
ZICM0900P0-1C-SN
900 MHz Module, +12dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0900P2-1C-SN
900 MHz Module, +19dBm output power for 1/4 wave wire antenna (in place of
RP-SMA) with SNAP Operating System software and MAC address
ZICM0868P2-KIT1-1
868 MHz Evaluation board for +19 dBm module
ZICM0900P2-KIT1-1
900 MHz Evaluation board for +19 dBm module
Page 2
MeshConnect™ Sub-G Module Series
MODULE BLOCK DIAGRAM
Sub-G
SI100x
T/R
Switch
ANT
Low Pass
Filter
External
Memory
Optional
DEVELOPMENT KIT
CEL's Development Kit assist users in both evaluation and
development. As a stand-alone radio system, the kit allows
users to place the modules into the target environment
and evaluate performance on-site. The Development Kit
also serves as an invaluable aid in application development. Through the many interface headers on the board,
the user has access to all of the MeshConnect module
pins, enabling easy connection to target systems for application development.
MeshConnect™
Sub-G Module Development Kit
The interface board features a serial communication
interface, a power management module, and peripherals
such as a buzzer, push-button switches, LEDs, and GPIO
headers.
For more detail information regarding MeshConnect
Development Kits, refer to the respective development
kit user guides documents. (Available at CEL’s website
http://www.cel.com)
Kit Contents:
• Evaluation Boards w/Module (2)
• USB Cables (1)
• AA Batteries (4)
• Software & Technical Information CD (1)
DEVELOPMENT KIT ORDERING INFORMATION
Part Number
MeshConnect™ Sub-G
Development Kits
Order Number
Description
ZICM0868P2-KIT1-1
868 MHz Evaluation board for +19dBm module
ZICM0900P2-KIT1-1
900 MHz Evaluation board for +19dBm module
Page 3
MeshConnect™ Sub-G Module Series
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features..................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information.............................................................................................................................................................................
Module Block Diagram...........................................................................................................................................................................
Development Kit.....................................................................................................................................................................................
System Level Function
Transceiver IC.........................................................................................................................................................................................
Antenna....................................................................................................................................................................................
Additional Flash Memory.......................................................................................................................................................................
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
Recommended (Operating Condition)..................................................................................................................................................
DC Characteristics..................................................................................................................................................................................
RF Characteristics..................................................................................................................................................................................
Pin Signal & Interfaces
Pin Signals I/O Configuration................................................................................................................................................................
I/O Pin Assignment.................................................................................................................................................................................
Software/Firmware..................................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
10
Module Footprint....................................................................................................................................................................................
11
Processing.........................................................................................................................................................................................
12
Agency Certifications...................................................................................................................................................................
13
Shipment, Storage & Handling.................................................................................................................................................
14
References & Revision History.................................................................................................................................................
15
Page 4
MeshConnect™ Sub-G Module Series
TRANSCEIVER IC
The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs
incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller,
offering a high performance solution for all Sub-G applications.
For more information about the Silicon Labs ICs, visit http://www.silabs.com.
ANTENNA
The MeshConnect Sub-G modules include RF connectors for external antenna options only (There is no trace antenna
option). The following options are supported by CEL:
•
U.FL connector
•
RP-SMA connector
•
A Connection for 1/4 wave wire antenna in place of RP-SMA
Here are some design guidelines to help ensure antenna performance:
•
Never place the antenna close to metallic objects.
•
In the overall design, ensure that wiring and other components are not placed near the antenna.
•
Do not place the antenna in a metallic or metalized plastic enclosure.
•
Keep plastic enclosures 1cm or more from the antenna in any direction.
ADDITIONAL FLASH MEMORY (Optional)
The Silicon Labs Transceiver ICs (Si1000 and Si1002) have an embedded 64kB of flash. Additional memory (1MB) can be
mounted on the module (as an option) to enable Over The Air (OTA) programming capability.
This is a custom solution as an option for all part numbers.
Page 5
MeshConnect™ Sub-G Module Series
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™ Sub-G Module
Unit
Min
Max
Power Supply Voltage (VDD)
-0.3
3.6
VDC
Voltage on any I/O Line
-0.3
VDD + 0.3
VDC
–
10
dBm
-40
125
°C
–
260
°C
RF Input Power
Storage Temperature Range
Reflow Soldering Temperature
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
Power Supply Voltage (VDD)
MeshConnect™ Sub-G Module
Min
Typ
Max
Unit
1.8/2.7*
3.3
3.6
Input Frequency
863
–
870
MHz
Input Frequency
902
–
928
MHz
Ambient Temperature Range
-40
25
85
°C
Note: * 2.7v is the min voltage if an additional memory IC was placed on the module.
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min
Typ
Max
Transmit Mode Current
–
90
–
mA
Receive Mode Current
–
24
–
mA
Sleep Mode Current
–
TBD
–
µA
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min
Typ
Max
Transmit Mode Current
–
35
–
mA
Receive Mode Current
–
24
–
mA
Sleep Mode Current
–
TBD
–
µA
Page 6
MeshConnect™ Sub-G Module Series
RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2)
Description
MeshConnect™ Sub-G Module
Unit
Min
Typ
Max
863
–
928
MHz
–
19
–
dBm
General Characteristics
RF Frequency Range
Transmitter
Maximum Output Power
Minimum Output Power
–
-5
–
dBm
FSK Error
TBD
–
TBD
Carrier Offset
TBD
–
TBD
KHz
–
75
–
KHz
Sensitivity (1% PER, 156kbps)
–
-99
TBD
dBm
Saturation (maximum input level)
–
–
10
dBm
Deviation
Receiver
RF CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0)
Description
MeshConnect™ Sub-G Module
Unit
Min
Typ
Max
863
–
928
MHz
–
12
–
dBm
dBm
General Characteristics
RF Frequency Range
Transmitter
Maximum Output Power
Minimum Output Power
–
-12
–
FSK Error
TBD
–
TBD
Carrier Offset
TBD
–
TBD
KHz
–
75
–
KHz
Sensitivity (1% PER, 156kbps)
–
-99
TBD
dBm
Saturation (maximum input level)
–
–
10
dBm
Deviation
Receiver
Page 7
MeshConnect™ Sub-G Module Series
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions
shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
Number
Name
GND
GND
GND
GND
GND
GND
GND
NC
ANTA
10
GPIO0
11
GPIO2
12
P0.7/IREF
P0.6/
13
CNVSTR
14
P0.5/RXD
15
P0.4/TXD
16
WP
17
NC
18
GND
19
GND
20
NC
21
NC
22
NC
23
P0.3
24
P0.2
25
P0.1
26
P0.0
27
GND
28
VCC
29
RST/C2CK
30
P2.7/C2D
31
P2.6
32
P2.5
33
P2.4
34
P2.3
Notes
Available: Not used for any module functionality
Available: Not used for any module functionality
Available: Not used for any module functionality
Must be connected to SDN for SNAP firmware
Used as Chip Select for Memory on CEL Eval. Board
UART TXD
UART RXD
Write Protect Pin of Memory Chip on Module
Used as Chip Select for Memory IC on the CEL Module
Memory IC MISO signal pin
Must be connected to NIRQ for SNAP firmware
Memory IC Clock Signal
Debug Clock
Debug Data
GPIO connected to Buzzer on CEL Eval Board
GPIO connected to Switch 3 on CEL Eval board
GPIO connected to LED3 on CEL Eval board
GPIO connected to Switch 2 on CEL Eval Board
Page 8
MeshConnect™ Sub-G Module Series
MeshConnect I/O PIN ASSIGNMENTS (Continued)
Number
Name
Notes
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
NC
NC
GND
GND
GND
GND
GND
P2.2
P2.1
P2.0
P1.7
P1.6
P1.5
NIRQ
SDN
GND
GND
GND
GND
GND
GND
GND
GPIO connected to LED2 on CEL Eval board
GPIO connected to Switch 1 on CEL Eval Board
GPIO connected to LED1 on CEL Eval board
GPIO connected to Switch 0 on CEL Eval Board
GPIO connected to LED0 on CEL Eval board
Memory IC MOSI
External Interrupt Request
Radio Shutdown (Active High)
SOFTWARE/FIRMWARE
The Sub-G modules support the following software:
•
•
•
•
Synapse SNAP Embedded Firmware
Wireless M-Bus (868MHz Only)
Silicon Labs EZMac
CEL Protocol
The MeshConnect Sub-G Development Kit provides a guide on how to access the Si100x IC and utilize the Silicon Labs
software development environment. It also provides a set of demo applications to conduct several tests. Below is the list of
the demo software features:
Page 9
MeshConnect™ Sub-G Module Series
SOFTWARE/FIRMWARE (Continued)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Self Healing (Orphan handling)
Point-to-Point network formation
Point-to-Multipoint (Star) network formation
Self Healing (Orphan handling)
Point-to-Point network formation
Point-to-Multipoint (Star) network formation
ACK
Wakeup Modes (Si100X) – most likely software will just use one of the wakeup modes
Frequency Hopping
Unicast Addressing using 16-bit device IDs
Broadcast Addressing
Packet Forwarding (Master node only)
Forwarding Table Aging (Master node only)
Promiscuous Mode (TBD – later release)
Listen Before Talk (LBT)
RSSI
Packet Filtering
Pairing/Joining
Network Synchronization through beacon messages to coordinate sleep/wake cycles
- Master node needs to send out beacon as well as figure out when to go to sleep and when to wake up
- End node wakes up and looks for beacon to figure out when to go to sleep and wake up
Command line interface for debug/testing/configuration
Push buttons for Range or PER packet test on a Eval board
Save configuration to flash
Save configuration to external flash
Over-the-air programming of the image to another device (TBD – later release)
Low Battery detection
MODULE DIMENSIONS
MeshConnect™ Sub-G Module with U.FL Connector for external antenna
MeshConnect™ Sub-G Module with RPSMA Connector for external Antenna
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
Page 10
MeshConnect™ Sub-G Module Series
MODULE LAND FOOTPRINT
Note: Unless otherwise specified. Dimensions are in Inches [mm].
EVALUATION BOARD
CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via:
•
•
•
•
AA cell batteries
USB
AC Adapter regulated down to 3.3VDC
External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of
the module under various modes of operation).
Also included on the evaluation board are four momentary push button switches and four LEDs, a piezo buzzer, a potentiometer, and a SPI memory IC. The peripherals are connected to GPIO of the module (see notes in Pin definitions) through
slide switches. If the user would wants to connect user specific circuits to the GPIO, slide switches can be used to disconnect the evaluation board peripherals.
The purpose of the evaluation board is to demonstrate simple applications of using GPIO, communicating with the device
and also allow flexibility for user specific needs.
Page 11
MeshConnect™ Sub-G Module Series
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TL
60-150 sec
Tpeak
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp down rate
6ºC/sec max
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
•
•
•
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Page 12
MeshConnect™ Sub-G Module Series
PROCESSING (Continued)
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating
from underneath is recommended. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
AGENCY CERTIFICATIONS
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or
certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the
information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is
labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC
ID: W7Z-ICP0”
The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified
with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
Page 13
MeshConnect™ Sub-G Module Series
AGENCY CERTIFICATIONS (Continued)
IC Certification — Industry Canada Statement
The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications
were met.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
CE Certification — Europe
The MeshConnect 868MHz RF modules has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to
make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
·
·
·
If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
The CE mark must be a minimum of 5mm in height
The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz
band is not harmonized by a few countries throughout Europe, the Restriction sign must be
placed to the right of the “CE” marking as shown in the picture
SHIPMENT, HANDLING, AND STORAGE
Shipment
The MeshConnect Modules are delivered in trays of 28.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
Page 14
MeshConnect™ Sub-G Module Series
REFERENCES & REVISION HISTORY
Previous Versions
0008-00-07-00-000
(Issue ES) December 7, 2010
Changes to Current Version
Initial preliminary datasheet.
Page(s)
N/A
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please 		
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written 		
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative 		
purposes in semiconductor product operation and application examples. The incorporation of these circuits, 		
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and 		
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.
Page 15

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xmp.iid:D6188D7C0A2068118C149B78DCA94B9B, xmp.iid:9E2F9ED80D2068118C149B78DCA94B9B, xmp.iid:8FF3671C0F2068118C149B78DCA94B9B, xmp.iid:C9DB7F94292068118C149B78DCA94B9B, xmp.iid:502253982A2068118C149B78DCA94B9B, xmp.iid:1A0880B52A2068118C149B78DCA94B9B, xmp.iid:A5CF78232B2068118C149B78DCA94B9B, xmp.iid:556739332B2068118C149B78DCA94B9B, xmp.iid:4ED1685A2B2068118C149B78DCA94B9B, xmp.iid:CE43719F2B2068118C149B78DCA94B9B, xmp.iid:279EF2BC382068118C149B78DCA94B9B, xmp.iid:81F11474072068118083DFC3B4EC98E6, xmp.iid:D3E51474072068118083E4615411BBFD
History When                    : 2009:04:20 13:14:11-07:00, 2009:04:20 13:14:11-07:00, 2009:04:20 13:20:30-07:00, 2009:04:20 13:58:29-07:00, 2009:05:14 13:29:23-07:00, 2009:05:14 13:29:55-07:00, 2009:05:14 13:32:20-07:00, 2009:05:14 13:56:56-07:00, 2009:06:03 14:34:24-07:00, 2009:06:09 16:29:52-07:00, 2009:06:09 16:31:25-07:00, 2009:06:09 16:34:01-07:00, 2009:06:09 16:34:45-07:00, 2009:06:09 16:35-07:00, 2009:06:09 16:39:41-07:00, 2009:06:09 16:40:39-07:00, 2009:06:09 16:57:55-07:00, 2009:06:09 16:58-07:00, 2009:06:09 16:59:24-07:00, 2009:06:09 17:00:09-07:00, 2009:06:09 17:02:16-07:00, 2009:06:09 17:02:50-07:00, 2009:06:09 17:03:04-07:00, 2009:06:09 17:03:33-07:00, 2009:06:09 17:04:54-07:00, 2009:06:09 17:05:07-07:00, 2009:06:09 17:07:05-07:00, 2009:06:09 17:07:19-07:00, 2009:06:09 17:08:04-07:00, 2009:06:09 17:08:52-07:00, 2009:06:09 17:09:58-07:00, 2009:06:09 17:11:51-07:00, 2009:06:09 17:28:56-07:00, 2009:06:09 17:30:14-07:00, 2009:06:09 17:30:56-07:00, 2009:06:09 17:32:27-07:00, 2009:06:09 17:33:25-07:00, 2009:06:09 17:33:49-07:00, 2009:06:09 17:34:34-07:00, 2009:06:09 17:36:59-07:00, 2009:06:09 17:37:38-07:00, 2009:06:09 17:38:28-07:00, 2009:06:10 11:36:55-07:00, 2009:06:11 08:23:25-07:00, 2009:06:12 07:52:50-07:00, 2009:06:12 07:53:30-07:00, 2009:09:17 13:10:10-07:00, 2009:09:17 13:15:19-07:00, 2009:09:17 13:23:17-07:00, 2009:09:17 13:24:12-07:00, 2009:09:17 13:29:33-07:00, 2009:09:17 14:46:46-07:00, 2009:09:17 14:51:07-07:00, 2009:09:17 14:52:45-07:00, 2009:09:17 14:55:26-07:00, 2009:09:17 14:56-07:00, 2009:09:17 14:58:14-07:00, 2009:09:17 15:40:33-07:00, 2009:09:17 16:04:16-07:00, 2009:09:18 09:07:25-07:00, 2009:09:18 09:16:05-07:00, 2009:09:18 09:17:10-07:00, 2009:09:18 09:46:44-07:00, 2009:09:18 10:22:42-07:00, 2009:09:18 10:37:51-07:00, 2009:09:18 10:52:31-07:00, 2009:09:18 10:53:49-07:00, 2009:09:18 10:54:08-07:00, 2009:09:18 10:55:01-07:00, 2009:09:18 10:57:41-07:00, 2009:09:18 11:05:04-07:00, 2009:09:18 11:05:37-07:00, 2009:09:18 11:07:11-07:00, 2009:09:18 11:14:55-07:00, 2009:09:18 13:41:43-07:00, 2009:09:18 13:50:24-07:00, 2009:09:18 14:06:38-07:00, 2009:09:18 14:09:57-07:00, 2009:09:18 14:12:11-07:00, 2009:09:18 14:13:09-07:00, 2009:09:24 15:29:16-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:48:32-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:57:19-07:00, 2009:09:28 09:59:19-07:00, 2009:09:28 10:00:22-07:00, 2009:09:28 10:00:33-07:00, 2009:09:28 10:00:52-07:00, 2009:09:28 10:03:50-07:00, 2009:09:28 10:05:45-07:00, 2009:09:28 10:10:45-07:00, 2009:09:28 10:15:40-07:00, 2009:09:28 10:16:37-07:00, 2009:09:28 10:18:03-07:00, 2009:09:28 10:18:18-07:00, 2009:09:28 10:22:13-07:00, 2009:09:28 10:24:50-07:00, 2009:09:28 10:25:51-07:00, 2009:09:28 10:36:44-07:00, 2009:09:28 10:38:28-07:00, 2009:09:28 10:40:35-07:00, 2009:09:28 10:48:42-07:00, 2009:09:28 10:49:34-07:00, 2009:09:28 10:50:24-07:00, 2009:09:28 10:51:27-07:00, 2009:09:28 10:51:40-07:00, 2009:09:28 10:52:17-07:00, 2009:09:28 11:13:07-07:00, 2009:09:28 11:18:34-07:00, 2009:09:28 11:18:56-07:00, 2009:09:28 11:43:38-07:00, 2009:09:28 11:44:08-07:00, 2009:09:28 11:44:56-07:00, 2009:09:28 11:46:56-07:00, 2009:09:28 11:48:46-07:00, 2009:09:28 11:54:19-07:00, 2009:09:28 11:55:25-07:00, 2009:09:28 11:59:25-07:00, 2009:09:28 12:04:12-07:00, 2009:10:02 09:52:40-07:00, 2009:10:02 09:58:12-07:00, 2009:10:02 10:17:22-07:00, 2009:10:02 10:18:23-07:00, 2009:10:02 10:35:31-07:00, 2009:10:02 10:39:25-07:00, 2009:10:02 10:51:34-07:00, 2009:10:02 10:58:08-07:00, 2009:10:02 10:58:49-07:00, 2009:10:02 10:59-07:00, 2009:10:02 11:03:27-07:00, 2009:10:02 11:20:01-07:00, 2009:10:02 11:20:23-07:00, 2009:10:02 11:24:08-07:00, 2009:10:02 12:20:32-07:00, 2009:10:02 12:21:14-07:00, 2009:10:02 12:22:16-07:00, 2009:10:06 08:45:11-07:00, 2009:10:06 08:45:34-07:00, 2009:10:06 08:45:47-07:00, 2009:10:06 08:47:57-07:00, 2009:10:06 08:49:08-07:00, 2010:01:14 09:41:06-08:00, 2010:01:14 09:43:12-08:00, 2010:01:14 09:44:02-08:00, 2010:01:14 09:47:32-08:00, 2010:01:29 14:18:23-08:00, 2010:01:29 14:22:10-08:00, 2010:01:29 14:23-08:00, 2010:01:29 14:27:26-08:00, 2010:01:29 14:28:18-08:00, 2010:01:29 14:46:38-08:00, 2010:01:29 14:48:22-08:00, 2010:01:29 14:51:38-08:00, 2010:02:04 09:40:25-08:00, 2010:03:24 11:02:41-07:00, 2010:03:24 11:28:08-07:00, 2010:03:24 13:02:35-07:00, 2010:03:24 13:14:52-07:00, 2010:03:24 13:16:49-07:00, 2010:03:24 13:18:26-07:00, 2010:03:24 13:33:27-07:00, 2010:03:24 13:42:01-07:00, 2010:03:24 13:43:51-07:00, 2010:03:24 13:44:24-07:00, 2010:03:31 11:41:21-07:00, 2010:03:31 11:43:35-07:00, 2010:03:31 11:45:23-07:00, 2010:03:31 11:45:31-07:00, 2010:03:31 11:46:13-07:00, 2010:03:31 14:52:31-07:00, 2010:04:01 10:10:07-07:00, 2010:04:07 10:04:53-07:00, 2010:04:07 10:05:17-07:00, 2010:04:08 07:46:18-07:00, 2010:04:08 07:51:16-07:00, 2010:04:08 11:44:59-07:00, 2010:04:08 11:45:28-07:00, 2010:04:08 11:45:49-07:00, 2010:05:24 09:49:45-07:00, 2010:05:24 09:50:36-07:00, 2010:05:24 09:50:36-07:00, 2010:05:24 10:24:42-07:00, 2010:05:24 10:26:11-07:00, 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Create Date                     : 2010:12:08 11:56:30-08:00
Modify Date                     : 2010:12:08 11:56:40-08:00
Metadata Date                   : 2010:12:08 11:56:40-08:00
Creator Tool                    : Adobe InDesign CS5 (7.0)
Page Image Page Number          : 1, 2
Page Image Format               : JPEG, JPEG
Page Image Width                : 256, 256
Page Image Height               : 256, 256
Page Image                      : (Binary data 11135 bytes, use -b option to extract), (Binary data 11414 bytes, use -b option to extract)
Doc Change Count                : 11954
Format                          : application/pdf
Producer                        : Adobe PDF Library 9.9
Trapped                         : False
Page Count                      : 15
Creator                         : Adobe InDesign CS5 (7.0)
EXIF Metadata provided by EXIF.tools
FCC ID Filing: W7ZZICM900P2

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