Connect One MDLWMGMR09 C1 Wireless b/g baseband User Manual Product specification of WM G MR 09

Connect One Ltd. C1 Wireless b/g baseband Product specification of WM G MR 09

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MDLWMGMR09 User Manual

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Communication Products BU Product Specification of WM-G-MR-09-Ref2 Wireless LAN Module SOURCE ORGANIZATION: USI WP/RD/WM/HW1 Document No. Rev. 1.4 Product Code WM-G-MR-09-Ref2 Product No. HW Prepared by︰ Ven Date: 2010/04/16 Checked by︰ Erico Yang Date: 2010/04/16 Approved by︰ Date: Concurrence (MD): Date: Concurrence (PM): Date:

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 2 Description Product Specification – WM-G-MR-09-Ref2 1 REVISION HISTORY Version No. Revised Date Revised by Description Notes 1.0 2009-09-28 Camus Chen First released 1.1 2009-11-4 Ven Chen 10.1.3 orderable P/N 1.2 2010-01-07 Ven Chen Add 3.1 block diagram(page 4) Change 8 Mechanical Specification(page 19) Change 10.1.2 Laser mark(page 22) 1.3 2010-04-16 Ven Chen Change 8 Mechanical Specification(page 19) Change 10.1.2 Laser mark(page 22) 1.4 2011-12-09 Robert CHANG Model Name Correction

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 4 Description Product Specification – WM-G-MR-09-Ref2 2 PURPOSE The purpose of this document is to define the product specification for 802.11b/g WiFi module WM-G-MR-09-Ref2. 3 SCOPE  High speed for wireless LAN connection: IEEE802.11b/g up to 54Mbps data rate by incorporating Direct Sequence Spread Spectrum (DSSS) and OFDM data modulation.  Provide seamless roaming within the IEEE 802.11b/g WLAN infrastructure.  IEEE 802.11b/g compatible: allow inter-operation among multiple vendors.  Auto fallback: 54M, 48M, 36M, 24M, 18M, 12M, 9M, 6M (802.11g); 11M, 5.5M, 2M, 1M (802.11b) data rate with auto fallback.  WPA (Wi-Fi Protected Access)  Support 802.11i Security standard through implementation of AES / CCMP and WEP with TKIP security mechanism.  Support 802.11e Quality of Service (QoS)  Interoperability – Complying with WECA WiFi.  3-wire, hardware signaling BT WiFi co-existence supported  Compliant with RoHS 3.1 BLOCK DIAGRAM The figure is WM-G-MR-09-Ref2 simple block diagram which provide WIFI B/G function. This module consists of Marvell 8686 chip and use simple antenna design concept. To avoid CDMA, GSM, PCS and WCDMA interfering signal, the blocking filter implemented in this module. Otherwise there is embedded 38.4MHz crystal in this module for WiFi chip. Fig. WM-G-MR-09-Ref2 Block Diagram

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 5 Description Product Specification – WM-G-MR-09-Ref2 4 GENERAL FEATURES Item Description Notes 802.11b/g Standard Complies with the latest IEEE802.11b/g wireless LAN Physical Layer Specification (IEEE 802.11g dated 12/6/2003) Chip Set Marvell 88W8686 Module Interface Type SDIO (1bit and 4 bit) , SDIO_SPI , G-SPI Module Connection 36pin LGA Co-existence Supports 3-wire BT coexistence scheme for an external BT solution Data Rate 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps, auto rate 802.11b: 11, 5.5, 2, 1Mbps, auto rate Modulation OFDM (54, 48, 36, 24, 18, 12, 9, 6Mbps) CCK (11Mbps, 5.5Mbps) DQPSK (2Mbps) DBPSK (1Mbps) Operating Frequency 2.4GHz ISM band Operating Channels IEEE Channels 1–11 depending on Regulatory Domain settings Others Compliance with FCC Class B Part 15.247, R&TTE, TELEC major RF regulatory requirements

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 6 Description Product Specification – WM-G-MR-09-Ref2 5 ELECTRICAL SPECIFICATION 5.1 SUPPLY VOLTAGE Symbol Parameter Min Typ Max Unit VDD_33 TR SW, ANT SW, PA_PE 3.0 3.3 3.6 V VDD_SHI SDIO, G-SPI, GPIO, RESETn, PDn, SLEEP_CLK, EEPROM 1.62 1.8 1.98 V 2.97 3.3 3.63 V VDD_18 VDD18A BT_STATE, WL_ACTIVE, BT_PRIORITY Analog Power Supply 1.71 1.8 1.89 V Voltage Ripple +/- 2%, 0~100kHz (Max. values not exceeding operating voltage) 5.2 RECOMMENDED OPERATION CONDITIONS 5.2.1 TEMPERATURE, HUMIDITY Symbol Parameter Min Typ Max Unit Ta Ambient Operation Temperature -10 - 65 0C Ts Storage Temperature -40 85 0CHumidity Relative Humidity 95 % 5.2.2 DC ELECTRICAL Symbol Parameter Min Typ Max Units VDD_33 Power supply voltage with respect to GND 3.0 3.3 3.6 V VDD_SHI Power supply voltage with respect to GND 1.62 1.8 1.98 V 2.97 3.3 3.63 VDD_18 VDD18A Power supply voltage with respect to GND 1.71 1.8 1.89 V

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 7 Description Product Specification – WM-G-MR-09-Ref2 5.3 POWER CONSUMPTION (SDIO MODE) The power consumption is typical value measured at 25oC temperature Voltage : VDD3.3 Operating Voltage 3.0~3.6 Volt Current Condition Typical (3.3V, 25 degree C) Maximum (3.3V, 25 degree C) Maximum (Full temperature and voltage range) Transmit(54Mbps, 12 dBm) 270mA 300mA 400mA Transmit(11Mbps, 14 dBm) 270mA 300mA 400mA Receive(54Mbps, -70 dBm) 180mA 210mA 250mA Receive(11Mbps, -70 dBm) 180mA 210mA 250mA Deep Sleep (Use Labtool command 26 1) 0.5mA 1.0mA 1.5mA 5.4 WIRELESS SPECIFICATIONS The WM-G-MR-09-Ref2 module complies with the following features and standards: Features Description WLAN Standards IEEE 802 Part 11b/g (802.11b/g) Antenna Port One antenna port support 802.11b/g Coexistence Hardware signaling Frequency Band 2.4GHz ISM Band

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 8 Description Product Specification – WM-G-MR-09-Ref2 5.5 RADIO SPECIFICATION Over full range of values specified in the “Recommended Operation Condition” unless specified otherwise. Features Description Frequency Band 2.4 GHz ISM BandNumber of selectable Sub channels 11 channels Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM Supported rates 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps Maximum receive level - 10dBm (with PER < 8%) Carrier Frequency Accuracy +/- 25ppm (crystal: 38.4MHz +/-5ppm in 250C)Output Power Data Rate Typical (3.3V, 25 degree C) Maximum (3.3V, 25 degree C) Maximum (Full temperature and voltage range) 1, 2, 5.5, 11Mbps 12 dBm 12 dBm +1.0 /-2.0 6, 9 and >12Mbps 12 dBm 12 dBm +1.0 /-2.0 802.11g EVM Requirement Item Data Rate (Mbps) Relative Constellation Error (dB) EVM (%RMS) 1 6 (BPSK) -5 56.2 2 9 (BPSK) -8 39.8 3 12 (QPSK) -10 31.6 4 18 (QPSK) -13 22.4 5 24 (16-QAM) -16 15.8 6 36 (16-QAM) -19 11.2 7 48 (64-QAM) -22 7.9 8 54 (64-QAM) -25 5.6 802.11b EVM Item Data Rate (Mbps) EVM (%RMS) 1 1 (BPSK) 35% 2 2 (QPSK) 35% 3 5.5 (QPSK) 35% 4 11 (QPSK) 35% Sensitivity Receiver Characteristics ( 3.3V, 25 degree C ) Typical (3.3V, 25 degree C) Maximum (3.3V, 25 degree C) Maximum (Full temperature and voltage range) Unit PER <8%, Rx Sensitivity @ 11 Mbps -85 -83 -81 dBm PER <8%, Rx Sensitivity @ 1 Mbps -91 -89 -87 dBm PER <10%, Rx Sensitivity @ 6 Mbps -86 -84 -82 dBm PER <10%, Rx Sensitivity @ 54 Mbps -70 -68 -66 dBm 12 dBm +1.0 /-2.0 12 dBm +1.0 /-2.0

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 9 Description Product Specification – WM-G-MR-09-Ref2 6 INTERFACE 6.1 PIN DEFINITION No Pin Name Type Description 1 GND GND Ground 2 RF PORT O Antenna Port (50ohm) 3 GND GND Ground 4 NC O NC 5 SD_D1 I/O SDIO 4-bit Mode: Data Line Bit [1] G-SPI Mode: G-SPI Data Output 6 SCLK I NC This is for Boot setting of ROM. 7 ECSn O Boot from SPI EEPROM: Pull down by 100kohm Boot from host Interface: NC 8 GND GND Ground 9 VDD_SHI I Host I/F Voltage: 3.3V Connect to 3.3V power supply Host I/F Voltage: 1.8V Connect to 1.8V power supply Not need to prepare external 1.8V power supply by connecting #9 and #17 (1.8V terminal) 10 GPIO_6 I/O General I/O Port , leave open if no use. 11 GPIO_5 I/O General I/O Port , leave open if no use. 12 SD_D3 I/O SDIO 4-bit Mode: Data Line Bit [3] 13 GPIO_2 I/O General I/O Port , leave open if no use. 14 SD_CLK I/O SDIO 4-bit Mode: Clock Input G-SPI Mode: G-SPI Clock Input 15 GPIO_4 I/O General I/O Port , leave open if no use. 16 GPIO_1 I/O General I/O Port t , leave open if no use. Default function : LED indicate. 17 VDD_18 POWER 1.8V DC monitor terminal , need 1uF decoupling capacitor 18 VDD_12 POWER 1.2V DC monitor terminal , need 1uF decoupling capacitor 19 GND GND Ground 20 SD_CMD I/O SDIO 4-bit Mode: Command / Response G-SPI Mode: G-SPI Data Input 21 SD_D0 I SDIO 4-bit Mode: Data Line Bit [0] G-SPI Mode: G-SPI Chip Select Input (Active Low) 22 SD_D2 I/O SDIO 4-bit Mode: Data Line Bit [2] G-SPI Mode: G-SPI Interrupt Output (Active Low)

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 10 Description Product Specification – WM-G-MR-09-Ref2 23 IF_SEL_1 O Select Interface Mode Pin SDIO Mode: No Connect G-SPI Mode: Pull Down by 100kohm 24 IF_SEL_2 O Select Interface Mode Pin SDIO Mode: No Connect G-SPI Mode: Pull Down by 100kohm 25 VDD18A POWER 1.8V Analog DC monitor terminal , need 1uF decoupling capacitor 26 GND GND Ground 27 VDD_33 POWER Connect to 3.3V DC supply 28 VDD_33 POWER Connect to 3.3V DC supply 29 WL_ACTIVE O WLAN Active (Active Low) 2-Wire BCA Mode When high, WLAN is transmitting or receiving packets. 3-Wire BCA Mode 0 = Bluetooth device is allowed to transmit 1 = Bluetooth device is not allowed to transmit Internal 50kohm pull-down. This pin drives low when PDn is asserted. In WLAN Sleep mode, all I/O Pads are powered down. This Pad must stay at a low state even in power down mode. Please make it open when do not use it. 30 PDn I Pull up by 100kohm, Full Power Down (Active Low) 31 RESETn I Reset (Active Low) , leave open if no use.

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 11 Description Product Specification – WM-G-MR-09-Ref2 32 GPIO_0 I/O General I/O Port , leave open if no use. 33 SLEEP_CLK I Clock Input for External Sleep Clock , leave open if no use. 34 PW_SEL O NC

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 13 Description Product Specification – WM-G-MR-09-Ref2 6.2 SPEIFICATIONS AND TIMING DIAGRAM 6.2.1 EXTERNAL SLEEP CLOCK SPECIFICATION The WM-G-MR-09-Ref2 external sleep clock pin (SLEEP_CLK) is powered from VDD_SHI Voltage Supply. Protocol Timing Symbol Parameter Condition Min Typ Max Units CLK Clock Frequency Range -- 10 100 1000 KHz THIGH Clock high time -- 40 -- -- ns TLOW Clock low time -- 40 -- -- ns TRISE Clock rise time -- -- -- 5 ns TFALL Clock fall time -- -- -- 5 ns NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 6.2.2 SDIO PROTOCOL TIMING SDIO Protocol Timing Diagram

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 14 Description Product Specification – WM-G-MR-09-Ref2 SDIO Protocol Timing Diagram – High Speed Mode SDIO Timing Data Symbol Parameter Condition Min Typ Max Units Fpp Clock Frequency Normal 0 -- 25 MHz High Speed 0 -- 50 MHz TWL Clock Low Time Normal 10 -- -- ns High Speed 7 -- -- ns TWH Clock High Time Normal 10 -- -- ns High Speed 7 -- -- ns TISU Input Setup Time Normal 5 -- -- ns High Speed 6 -- -- TIH Input Hold Time Normal 5 -- -- ns High Speed 2 -- -- TODLY Output Delay Time -- 0 -- 14 ns TOH Output Hold Time Normal 2.5 -- -- ns NOTE: Over full range of values specified in the Recommended Operating Condition unless Otherwise specified.

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 15 Description Product Specification – WM-G-MR-09-Ref2 6.2.3 G-SPI PROTOCOL TIMING G-SPI Host Interface Transaction Timing G-SPI Host Interface Inter-Transaction Timing SPI Interface Timing Data Symbol Parameter Min Typ Max Units TSCLK Clock Period 20 -- -- ns TWH Clock High 5 -- -- ns TWL Clock Low 9 -- -- ns TWR Clock Rise Time -- -- 1 ns TWF Clock Fall Time -- -- 1 ns TH SDI Hold Time 2.5 -- -- ns TSU SDI Setup Time 2.5 -- -- ns TV SDO Hold Time 5 -- -- ns TCSS SCSn Fall to Clock 5 -- -- ns TCSH Clock to SCSn Rise 0 -- -- ns TCRF SCSn Rise to SCSn Fall 400 -- -- ns NOTE: Over full range of values specified in the Recommended Operating Condition unless Otherwise specified.

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 16 Description Product Specification – WM-G-MR-09-Ref2 6.2.4 RESET AND CONFIGURATION TIMING Notes RESETn is not needed for proper operation due to internal power-on reset logic.

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 17 Description Product Specification – WM-G-MR-09-Ref2 External Timing Requirement (RESETn Pin) Symbol Parameter Condition Min Typ Max Units TPU-RESET Valid power to RESETn de-asserted -- 0 -- -- ms TRPW1 RESETn pulse width -- 10^2 100 -- ns NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 1. For external reset, the device reset time is TRPW +300μs 2. Minimum value guaranteed for a valid reset smaller values may trigger the reset circuit. Internal Reset Timing Symbol Parameter Condition Min Typ Max Units -- Negative internal reset pulse width -- 100 100 -- μs NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 18 Description Product Specification – WM-G-MR-09-Ref2 6.2.5 LED INTERFACE Pin No. Pin description Function description 16 GPIO_1 WLAN status LED (Tx power or Rx ready LED NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Symbol Parameter Condition Typ Units LOH Switching current high Tristate on pad (requires pull-up on board) Tristate when driving high mA IOL Switching current low @0.4V 10 mA 6.2.6 ANTENNA INTERFACE Antenna diversity is not supported on the Wireless Module. The output impedance of the antenna port is 50 Ohms. 7 REGULATORY The WM-G-MR-09-Ref2 module is tested on module level to comply with following standards (pre-test): • US/CAN: FCC CFR47 Part 15.247 • Europe: ETS 300-328 V1.6.1 Test setup: laptop plus adaptor card with Marvell Lab tool in SDIO mode Final certification should be completed on system level. Antenna Part No. :W1030 Gain [dBi] :2.0 Impedance [Nom]:50 Ω VSWR<=2.0 Electrical Length :1/4, dipole Radiation: Omni Connector Options-Reverse SMA Trade mark: Pulse Manufacture: A TECHNITROL COMPANYINFORMATION

Universal Scientific Industrial Corp. Doc No. Rev 1.4 Date. 2011/12/09 Page 21 Description Product Specification – WM-G-MR-09-Ref2 10 PACKAGE AND STORAGE CONDITION 10.1.1 PACKAGE DIMENSION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: XM5-MDLWMGMR09 when the module is installed inside another device, the user manual of this device must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as describe 