Connect One MDLWMGMR09 C1 Wireless b/g baseband User Manual Product specification of WM G MR 09

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Document ID	2202657
Application ID	4QwPXwXkSpcfAVAOBH6AjA==
Document Description	User manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	205.18kB (2564775 bits)
Date Submitted	2014-02-27 00:00:00
Date Available	2014-02-27 00:00:00
Creation Date	2011-12-09 09:44:02
Producing Software	Microsoft® Office Word 2007
Document Lastmod	2014-02-27 18:37:51
Document Title	Product specification of WM-G-MR-09
Document Creator	Microsoft® Office Word 2007
Document Author:	Camus

Communication Products BU
Document No.
Product Code
Product No.
Rev.
WM-G-MR-09-Ref2
Product Specification
of WM-G-MR-09-Ref2
Wireless LAN Module
SOURCE ORGANIZATION: USI WP/RD/WM/HW1
HW Prepared by︰ Ven
Checked by︰
Erico Yang
Date: 2010/04/16
Date: 2010/04/16
Approved by︰
Date:
Concurrence (MD):
Date:
Concurrence (PM):
Date:
1.4
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
Page
1.4
REVISION HISTORY
Version
No.
Revised
Date
Revised by
1.0
2009-09-28
Camus Chen
1.1
2009-11-4
Ven Chen
1.2
2010-01-07
Ven Chen
1.3
2010-04-16
Ven Chen
1.4
2011-12-09
Robert CHANG
Description
First released
10.1.3 orderable P/N
Add 3.1 block diagram(page 4)
Change 8 Mechanical Specification(page 19)
Change 10.1.2 Laser mark(page 22)
Change 8 Mechanical Specification(page 19)
Change 10.1.2 Laser mark(page 22)
Model Name Correction
Notes
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
Page
1.4
INDEX
REVISION HISTORY ................................................................................................................................... 2
PURPOSE ..................................................................................................................................................... 4
SCOPE .......................................................................................................................................................... 4
3.1 BLOCK DIAGRAM ......................................................................................................................................... 4
GENERAL FEATURES .............................................................................................................................. 5
ELECTRICAL SPECIFICATION................................................................................................................ 6
5.1
5.2
SUPPLY VOLTAGE ....................................................................................................................................... 6
RECOMMENDED OPERATION CONDITIONS ................................................................................................. 6
5.2.1
Temperature, humidity ................................................................................................................. 6
5.2.2
DC Electrical .................................................................................................................................. 6
5.3
POWER CONSUMPTION (SDIO MODE) ...................................................................................................... 7
5.4
WIRELESS SPECIFICATIONS ....................................................................................................................... 7
5.5
RADIO SPECIFICATION ................................................................................................................................. 8
6.1
INTERFACE .................................................................................................................................................. 9
PIN DEFINITION ........................................................................................................................................... 9
6.1.1 RECOMMENDED FOOTPRINT ............................................................................................................ 12
6.2
SPEIFICATIONS AND TIMING DIAGRAM ........................................................................................................13
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
External sleep clock specification ............................................................................................ 13
SDIO protocol timing .................................................................................................................. 13
G-SPI protocol timing ................................................................................................................. 15
Networking Coexistence ............................................................................................................ 16
Reset and configuration timing ................................................................................................. 16
LED Interface .............................................................................................................................. 18
Antenna Interface ....................................................................................................................... 18
REGULATORY ........................................................................................................................................... 18
MECHANICAL SPECIFICATION ............................................................................................................ 19
RECOMMENDED REFLOW PROFILE .................................................................................................. 20
10 PACKAGE AND STORAGE CONDITION ............................................................................................. 21
10.1.1
10.1.2
10.1.3
10.1.4
Package Dimension ................................................................................................................... 21
Laser Mark ................................................................................................................................... 22
Part Order Numbering................................................................................................................ 22
ESD Level .................................................................................................................................... 22
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
Page
1.4
PURPOSE
The purpose of this document is to define the product specification for 802.11b/g
WiFi module WM-G-MR-09-Ref2.
SCOPE










High speed for wireless LAN connection: IEEE802.11b/g up to 54Mbps data
rate by incorporating Direct Sequence Spread Spectrum (DSSS) and OFDM
data modulation.
Provide seamless roaming within the IEEE 802.11b/g WLAN infrastructure.
IEEE 802.11b/g compatible: allow inter-operation among multiple vendors.
Auto fallback: 54M, 48M, 36M, 24M, 18M, 12M, 9M, 6M (802.11g); 11M, 5.5M,
2M, 1M (802.11b) data rate with auto fallback.
WPA (Wi-Fi Protected Access)
Support 802.11i Security standard through implementation of AES / CCMP
and WEP with TKIP security mechanism.
Support 802.11e Quality of Service (QoS)
Interoperability – Complying with WECA WiFi.
3-wire, hardware signaling BT WiFi co-existence supported
Compliant with RoHS
3.1
BLOCK DIAGRAM
The figure is WM-G-MR-09-Ref2 simple block diagram which provide WIFI B/G function. This module
consists of Marvell 8686 chip and use simple antenna design concept. To avoid CDMA, GSM, PCS
and WCDMA interfering signal, the blocking filter implemented in this module. Otherwise there is
embedded 38.4MHz crystal in this module for WiFi chip.
Fig. WM-G-MR-09-Ref2 Block Diagram
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
Page
1.4
GENERAL FEATURES
Item
Description
Standard
Complies with the latest IEEE802.11b/g
wireless LAN Physical Layer Specification
(IEEE 802.11g dated 12/6/2003)
Chip Set
Marvell 88W8686
Module Interface Type
SDIO (1bit and 4 bit) , SDIO_SPI , G-SPI
Module Connection
36pin LGA
Co-existence
Supports 3-wire BT coexistence scheme for an
external BT solution
802.11b/g Data Rate
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps, auto
rate
802.11b: 11, 5.5, 2, 1Mbps, auto rate
OFDM (54, 48, 36, 24, 18, 12, 9, 6Mbps)
Modulation
CCK (11Mbps, 5.5Mbps)
DQPSK (2Mbps)
DBPSK (1Mbps)
Operating Frequency
2.4GHz ISM band
Operating Channels
IEEE Channels 1–11 depending on Regulatory
Domain settings
Others
Compliance with FCC Class B Part 15.247,
R&TTE, TELEC major RF regulatory
requirements
Notes
Universal Scientific Industrial Corp.
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
Description
Symbol
VDD_33
VDD_SHI
VDD_18
VDD18A
SUPPLY VOLTAGE
Parameter
TR SW, ANT SW, PA_PE
SDIO, G-SPI, GPIO, RESETn,
SLEEP_CLK, EEPROM
PDn,
BT_STATE, WL_ACTIVE, BT_PRIORITY
Analog Power Supply
Voltage
Ripple
Min
3.0
1.62
2.97
Typ
3.3
1.8
3.3
Max
3.6
1.98
3.63
Unit
1.71
1.8
1.89
+/- 2%, 0~100kHz (Max. values not
exceeding operating voltage)
5.2
RECOMMENDED OPERATION CONDITIONS
TEMPERATURE, HUMIDITY
Symbol
Ta
Ts
Humidity
5.2.2
1.4
Rev
Page
ELECTRICAL SPECIFICATION
5.1
5.2.1
2011/12/09
Parameter
Ambient Operation Temperature
Storage Temperature
Relative Humidity
Min
-10
-40
Typ
Max
65
85
95
Unit
DC ELECTRICAL
Symbol
VDD_33
VDD_SHI
VDD_18
VDD18A
Parameter
Power supply voltage with respect to
GND
Power supply voltage with respect to
GND
Power supply voltage with respect to
GND
Min
Typ
Max
Units
3.0
3.3
3.6
1.62
2.97
1.8
3.3
1.98
3.63
1.71
1.8
1.89
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
Rev
Page
2011/12/09
1.4
5.3
POWER CONSUMPTION (SDIO MODE)
The power consumption is typical value measured at 25oC temperature
Voltage : VDD3.3
Operating Voltage
Current
Condition
Transmit(54Mbps, 12 dBm)
Transmit(11Mbps, 14 dBm)
Receive(54Mbps, -70 dBm)
Receive(11Mbps, -70 dBm)
Deep Sleep
(Use Labtool command 26 1)
5.4
3.0~3.6 Volt
Typical
(3.3V, 25 degree C)
Maximum
(3.3V, 25 degree C)
270mA
270mA
180mA
180mA
0.5mA
300mA
300mA
210mA
210mA
1.0mA
WIRELESS SPECIFICATIONS
The WM-G-MR-09-Ref2 module complies with the following features and standards:
Features
WLAN Standards
Antenna Port
Coexistence
Frequency Band
Description
IEEE 802 Part 11b/g (802.11b/g)
One antenna port support 802.11b/g
Hardware signaling
2.4GHz ISM Band
Maximum
(Full temperature and
voltage range)
400mA
400mA
250mA
250mA
1.5mA
Universal Scientific Industrial Corp.
Description
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Product Specification – WM-G-MR-09-Ref2
5.5
2011/12/09
Rev
Page
1.4
RADIO SPECIFICATION
Over full range of values specified in the “Recommended Operation Condition” unless specified
otherwise.
Features
Frequency Band
Number of selectable Sub
channels
Modulation
Description
2.4 GHz ISM Band
11 channels
OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK,
DQPSK, CCK , 16QAM, 64QAM
1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps
- 10dBm (with PER < 8%)
+/- 25ppm
(crystal: 38.4MHz +/-5ppm in 25 C)
Supported rates
Maximum receive level
Carrier Frequency Accuracy
Output Power
Data Rate
1, 2, 5.5, 11Mbps
6, 9 and >12Mbps
Typical (3.3V, 25
degree C)
Maximum (3.3V, 25
degree C)
12 dBm
12 dBm
12 dBm +1.0 /-2.0
12 dBm +1.0 /-2.0
802.11g EVM Requirement
Item
Data Rate (Mbps)
6 (BPSK)
9 (BPSK)
12 (QPSK)
18 (QPSK)
24 (16-QAM)
36 (16-QAM)
48 (64-QAM)
54 (64-QAM)
802.11b EVM
Item
Relative Constellation Error (dB)
-5
-8
-10
-13
-16
-19
-22
-25
Data Rate (Mbps)
1 (BPSK)
2 (QPSK)
5.5 (QPSK)
11 (QPSK)
Sensitivity
Receiver Characteristics
Maximum (Full temperature and
voltage range)
12 dBm +1.0 /-2.0
12 dBm +1.0 /-2.0
EVM (%RMS)
56.2
39.8
31.6
22.4
15.8
11.2
7.9
5.6
EVM (%RMS)
35%
35%
35%
35%
Typical
(3.3V, 25
degree C)
Maximum
(3.3V, 25
degree C)
Maximum (Full
temperature and
voltage range)
Unit
PER <8%, Rx Sensitivity @ 11 Mbps
-85
-83
-81
dBm
PER <8%, Rx Sensitivity @ 1 Mbps
-91
-89
-87
dBm
PER <10% Rx Sensitivity @ 6 Mbps
-86
-84
-82
dBm
PER <10%, Rx Sensitivity @ 54 Mbps
-70
-68
-66
dBm
( 3.3V, 25 degree C )
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
Page
1.4
INTERFACE
6.1
PIN DEFINITION
No
Pin Name
GND
RF PORT
GND
NC
Type
GND
GND
Description
Ground
Antenna Port (50ohm)
Ground
NC
SD_D1
I/O
SCLK
ECSn
GND
GND
VDD_SHI
10
11
12
13
GPIO_6
GPIO_5
SD_D3
GPIO_2
I/O
I/O
I/O
I/O
14
SD_CLK
I/O
SDIO 4-bit Mode: Clock Input
G-SPI Mode: G-SPI Clock Input
15
GPIO_4
I/O
General I/O Port , leave open if no use.
16
GPIO_1
17
VDD_18
18
VDD_12
19
GND
20
SD_CMD
I/O
21
SD_D0
22
SD_D2
I/O
SDIO 4-bit Mode: Data Line Bit [1]
G-SPI Mode: G-SPI Data Output
NC
This is for Boot setting of ROM.
Boot from SPI EEPROM: Pull down by
100kohm
Boot from host Interface: NC
Ground
Host I/F Voltage: 3.3V
Connect to 3.3V power supply
Host I/F Voltage: 1.8V
Connect to 1.8V power supply
Not need to prepare external 1.8V power supply
by connecting #9 and #17 (1.8V terminal)
General I/O Port , leave open if no use.
General I/O Port , leave open if no use.
SDIO 4-bit Mode: Data Line Bit [3]
General I/O Port , leave open if no use.
General I/O Port t , leave open if no use.
Default function : LED indicate.
1.8V DC monitor terminal , need 1uF
POWER
decoupling capacitor
1.2V DC monitor terminal , need 1uF
POWER
decoupling capacitor
GND
Ground
I/O
SDIO 4-bit Mode: Command / Response
G-SPI Mode: G-SPI Data Input
SDIO 4-bit Mode: Data Line Bit [0]
G-SPI Mode: G-SPI Chip Select Input (Active
Low)
SDIO 4-bit Mode: Data Line Bit [2]
G-SPI Mode: G-SPI Interrupt Output (Active
Low)
Universal Scientific Industrial Corp.
Description
23
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
IF_SEL_1
2011/12/09
Rev
Page
Select Interface Mode Pin
SDIO Mode: No Connect
G-SPI Mode: Pull Down by 100kohm
Select Interface Mode Pin
SDIO Mode: No Connect
G-SPI Mode: Pull Down by 100kohm
24
IF_SEL_2
25
VDD18A
POWER
26
27
28
GND
VDD_33
VDD_33
1.4
10
1.8V Analog DC monitor terminal , need 1uF
decoupling capacitor
GND
Ground
POWER Connect to 3.3V DC supply
POWER Connect to 3.3V DC supply
29
WL_ACTIVE
30
PDn
31
RESETn
WLAN Active (Active Low)
2-Wire BCA Mode
When high, WLAN is transmitting or receiving
packets.
3-Wire BCA Mode
0 = Bluetooth device is allowed to transmit
1 = Bluetooth device is not allowed to transmit
Internal 50kohm pull-down. This pin drives low
when PDn
is asserted. In WLAN Sleep mode, all I/O Pads
are
powered down. This Pad must stay at a low
state even in
power down mode.
Please make it open when do not use it.
Pull up by 100kohm, Full Power Down (Active
Low)
Reset (Active Low) , leave open if no use.
Universal Scientific Industrial Corp.
Description
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Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
Rev
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1.4
11
32
GPIO_0
I/O
General I/O Port , leave open if no use.
33
SLEEP_CLK
Clock Input for External Sleep Clock , leave
open if no use.
34
PW_SEL
NC
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
6.2
6.2.1
2011/12/09
Rev
Page
1.4
13
SPEIFICATIONS AND TIMING DIAGRAM
EXTERNAL SLEEP CLOCK SPECIFICATION
The WM-G-MR-09-Ref2 external sleep clock pin (SLEEP_CLK) is powered from VDD_SHI Voltage
Supply.
Protocol Timing
Symbol
CLK
THIGH
TLOW
TRISE
TFALL
Parameter
Condition
Min
Typ
Max
Units
--
10
100
1000
KHz
-----
40
40
---
-----
--5
ns
ns
ns
ns
Clock Frequency
Range
Clock high time
Clock low time
Clock rise time
Clock fall time
NOTE: Over full range of values specified in the Recommended Operating Conditions unless
otherwise specified.
6.2.2
SDIO PROTOCOL TIMING
SDIO Protocol Timing Diagram
Universal Scientific Industrial Corp.
Description
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Product Specification – WM-G-MR-09-Ref2
2011/12/09
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1.4
14
SDIO Protocol Timing Diagram – High Speed Mode
SDIO Timing Data
Symbol
Parameter
Fpp
Clock Frequency
TWL
Clock Low Time
TWH
Clock High Time
TISU
Input Setup Time
TIH
Input Hold Time
TODLY
TOH
Condition
Normal
High Speed
Normal
High Speed
Normal
High Speed
Normal
High Speed
Normal
High Speed
-Normal
Min
10
10
2.5
Typ
-------------
Max
25
50
--------14
--
Units
MHz
MHz
ns
ns
ns
ns
ns
ns
Output Delay Time
ns
Output Hold Time
ns
NOTE: Over full range of values specified in the Recommended Operating Condition unless
Otherwise specified.
Universal Scientific Industrial Corp.
Description
6.2.3
Doc No.
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1.4
15
G-SPI PROTOCOL TIMING
G-SPI Host Interface Transaction Timing
G-SPI Host Interface Inter-Transaction Timing
SPI Interface Timing Data
Symbol
Parameter
TSCLK
Clock Period
TWH
Clock High
TWL
Clock Low
TWR
Clock Rise Time
TWF
Clock Fall Time
TH
SDI Hold Time
TSU
SDI Setup Time
TV
SDO Hold Time
TCSS
SCSn Fall to Clock
TCSH
Clock to SCSn Rise
TCRF
SCSn Rise to SCSn Fall
Min
20
--2.5
2.5
400
Typ
------------
Max
---1
-------
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTE: Over full range of values specified in the Recommended Operating Condition unless
Otherwise specified.
Universal Scientific Industrial Corp.
Description
6.2.4
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
2011/12/09
RESET AND CONFIGURATION TIMING
Notes
RESETn is not needed for proper operation due to internal power-on reset logic.
Rev
Page
1.4
16
Universal Scientific Industrial Corp.
Description
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Product Specification – WM-G-MR-09-Ref2
2011/12/09
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1.4
17
External Timing Requirement (RESETn Pin)
Symbol
TPU-RESET
TRPW1
NOTE:
Parameter
Valid power to RESETn
de-asserted
RESETn pulse width
Condition
Min
Typ
Max
Units
--
--
--
ms
--
10^2
100
--
ns
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
1. For external reset, the device reset time is TRPW +300μs
2. Minimum value guaranteed for a valid reset smaller values may trigger the reset circuit.
Internal Reset Timing
Symbol
-NOTE:
Parameter
Condition
--
Min
100
Typ
100
Max
--
Units
Negative internal reset pulse width
μ s
Over full range of values specified in the Recommended Operating Conditions unless otherwise
specified.
Universal Scientific Industrial Corp.
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
Description
2011/12/09
1.4
18
Rev
Page
6.2.5 LED INTERFACE
Pin No.
16
Pin description
GPIO_1
Function description
WLAN status LED (Tx power or Rx ready LED
NOTE: Over full range of values specified in the Recommended Operating Conditions unless
otherwise specified.
Symbol
LOH
IOL
Parameter
Switching current high
Condition
Typ
Tristate on pad (requires
Tristate when driving high
pull-up on board)
Switching current low
@0.4V
10
Units
mA
mA
INFORMATION
6.2.6 ANTENNA INTERFACE
Antenna Part No. :W1030
Gain [dBi] :2.0
mark: Pulse
Antenna diversity is not Trade
supported
on the Wireless Module.
Impedance [Nom]:50 Ω
Manufacture: A TECHNITROL COMPANY
The output impedance of the antenna port is 50 Ohms.
VSWR<=2.0
Electrical Length :1/4, dipole
Radiation: Omni
Connector Options-Reverse SMA
REGULATORY
The WM-G-MR-09-Ref2 module is tested on module level to comply with following
standards (pre-test):
• US/CAN: FCC CFR47 Part 15.247
• Europe: ETS 300-328 V1.6.1
Test setup: laptop plus adaptor card with Marvell Lab tool in SDIO mode
Final certification should be completed on system level.
Universal Scientific Industrial Corp.
Description
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
RECOMMENDED REFLOW PROFILE
2011/12/09
Rev
Page
1.4
20
Universal Scientific Industrial Corp.
Description
10
10.1.1
Doc No.
Date.
Product Specification – WM-G-MR-09-Ref2
PACKAGE AND STORAGE CONDITION
PACKAGE DIMENSION
2011/12/09
Rev
Page
1.4
21
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment.
FCC Radiation Exposure Statement
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be
installed in any portable device, for example, USB dongle like transmitters is forbidden.
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter. This modular must be installed and operated with a minimum distance of
20 cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: XM5-MDLWMGMR09
when the module is installed inside another device, the user manual of this device must contain
below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions
as describe

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Title                           : Product specification of WM-G-MR-09
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