Delta Electronics orporated DFBM-NW726 Bluetooth Low Energy Module User Manual Preliminary

Delta Electronics Incorporated Bluetooth Low Energy Module Preliminary

Users Manual

DFBM-NW726-DT0R Preliminary Data Sheet Sheet 1 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Data sheet BLE Module DFBM-NW726-DT0R A Bluetooth Low Energy module with Antenna on Package.
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 2 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Contents 1. Features ........................................................................................................................................... 5 1-1. General ......................................................................................................................................... 5 1-2. Bluetooth...................................................................................................................................... 5 2. Block Diagram ................................................................................................................................ 6 2-1. Use Antenna on Package ............................................................................................................. 6 2-2. Use RF connector or External Antenna ....................................................................................... 6 3. General Specification ...................................................................................................................... 7 4. Electrical Characteristics ................................................................................................................. 8 4-1. Absolute Maximum Rating .......................................................................................................... 8 4-2. Recommended Operating Conditions & Power Consumption .................................................... 8 5. RF Characteristics ........................................................................................................................... 9 5-1. Bluetooth RF characteristics ........................................................................................................ 9 5-2. Antenna characteristics ................................................................................................................ 9 6. Pin Description .............................................................................................................................. 10 7. Reference Circuit .......................................................................................................................... 13 7-1. Use Antenna on Package ........................................................................................................... 13 7-2. Use RF connector or External Antenna ..................................................................................... 14 8. Module Dimensions (mm) ............................................................................................................ 15 9. Recommend Soldering Conditions ............................................................................................... 17 10. Layout Guide (mm) ....................................................................................................................... 18 10-1. Use Antenna on Package ......................................................................................................... 18 10-2. Use RF connector or External Antenna ................................................................................... 18 11. Recommended Stencil Aperture .................................................................................................... 19 12. Packages ........................................................................................................................................ 21 12-1. Tape and Reel Specification .................................................................................................... 21 12-2. Storage Specification ............................................................................................................... 22 13. Required End Product Labeling .................................................................................................... 23
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 3 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 14. Manual Information to the End User ............................................................................................ 23 15. Federal Communications Commission (FCC) Statement ............................................................. 23
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 4 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Revision History Rev. Date Reason of change Maker Approval S01 2018/01/22 Update FCC / NCC / TELEC Certification Number Ryan Josh 0.6 2018/01/10 1. Modify description in 6.Pin Description section Pin3  P0.20 / TRACECLK Pin5  P0.18 / TRACEDATA[0] / SWO Pin11  P0.16 / TRACEDATA[1] Pin13  P0.15 / TRACEDATA[2] Pin15  SWDIO, remove reset description Pin16  P0.14 / TRACEDATA[3] 2.Update detail dimension of footprint in 11.Recommended Stencil Aperture section 3.Modify C3 from 10UF to NC in 7.Reference Design section Ryan Josh 0.5 2017/12/14 Certification based on BT4.2 Ryan Josh 0.4 2017/12/08 Modify Laser marking information Ryan Josh 0.3 2017/11/07 Update Package information Ryan Josh 0.2 2017/10/20 Modify ESD (HBM/CDM) specification Ryan Josh 0.1 2017/07/03 Initial release Ryan Josh
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 5 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change DFBM-NW726-DT0R BLE Module with Antenna on Package his document describes the DFBM-NW726-DT0R wireless BLE module hardware specification. The modules provide cost effective, low power, and flexible platform to add BLE for embedded devices for a variety of applications, such as wireless sensors and thermostats. It uses BLE SoC, which integrating the 2.4GHz transceiver, a 32 bit ARM® Cortex M4F CPU, flash memory, and analog and digital peripherals. 1. Features 1-1. General  BLE chip with a single chip antenna or an external RF connector  Integrate a 32 bit ARM® Cortex M4F CPU,512KB flash memory and 64KB RAM  12-bit 200kspc ADC - 8 configurable channels with programmable gain  30 General Purpose I/O Pins  Two-wire Master (I2C compatible) support 100K bps and 400K bps  UART baud rate up to 921600 bps  SPI bit rate up to 4M bps  Quadrature Decoder (QDEC)  LGA 48 pin package  Dimension 6.5mm(L) x 6.5mm(W) x 1.5 mm(H)  RoHS compliant 1-2. Bluetooth  Bluetooth 4.2 specification compliant  AES HW encryption T
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 6 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 2. Block Diagram 2-1. Use Antenna on Package Figure 2-1. DFBM-NW726-DT0R Block Diagram (AOP) 2-2. Use RF connector or External Antenna Figure 2-2. DFBM-NW726-DT0R Block Diagram (External RF) ADC Bluetooth ANT On Package UART/SPI/I2C GPIO VDD: 1.7V ~ 3.6V 32MHz Crystal Bluetooth SOC Matching Network (Optional) ADC External Antenna UART/SPI/I2C GPIO VDD: 1.7V ~ 3.6V 32MHz Crystal Bluetooth SOC Matching Network (Optional) Bluetooth ANT On Package
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 7 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 3. General Specification MCU ARM® Cortex® -M4 32-bit processor with FPU, 64MHz Standard Bluetooth: V4.2 Frequency 2.402 ~ 2.48 GHz Modulation GFSK Data Rate BLE: 0.25, 1, 2 Mbps Operating Temperature -40℃ ~ +85 ℃ Storage Temperature -40℃ ~ +85 ℃ Antenna Impedance 50 ohm Package Size 6.5 x 6.5 x 1.5 mm3 Host Interface UART, SPI, I2C, ADC Certification FCC: H79DFBM-NW726 CE Compliant NCC: CCAM18LP0130T8 TELEC: 201-180008 Table 3-1. General Specification
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 8 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 4. Electrical Characteristics 4-1. Absolute Maximum Rating Symbol Min. Max. Units VDD_3V3 -0.3 3.9 V VGPIO -0.3 3.9 V ESD-HBM 2 KV ESD-CDM 500 V Table 4-1. Absolute Maximum Rating 4-2. Recommended Operating Conditions & Power Consumption Symbol Parameter Min. Typ. Max. Unit VDD_3V3 Supply Voltage 1.7 3.3 3.6 V System On, Standby mode 50 uA TX Current at POUT = +0 dBm (LDO) 11.6 mA TX Current at POUT = +0 dBm (DCDC) 5.3 mA RX Current (LDO) 12.9 mA RX Current (DCDC) 5.8 mA Current in SYSTEM OFF, no RAM retention. 0.7 1.2 1.9 uA Current in SYSTEM OFF mode 32 kB RAM retention. 1.0 uA SYSTEM-ON base current with 32 kB RAM enabled. 1.5 uA Table 4-2. Bluetooth Power Consumption
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 9 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 5. RF Characteristics 5-1. Bluetooth RF characteristics Condition: VDD_3V3=VIO=3.3V, T=25℃ Item Condition Min. Typ. Max. Unit RF Characteristics Output Power -20 0 4 dBm Initial Frequency Offset -75 75 KHz Carrier Frequency Offset and Drift CFOD -150 150 KHz Modulation Characteristics Modulation Index (F1 / F2) 0.8 N/A F1 Average 225 275 KHz F2 Maximum 185 KHz Sensitivity PER < 30.8% -96 dBm Maximum Input Level PER < 30.8% -10 dBm Table 5-1. Bluetooth RF Characteristics 5-2. Antenna characteristics There is no antenna on module. Only RF pad is used for antenna. Below table shows antenna list used for certification testing. Antenna Designation for Certification 1. Dipole Antenna, Gain: 2.23dBi Part No.:RFDPA8780900SMAB801, Supplier: Walsin 2. Chip Antenna, Gain: 2.12dBi Part No.:RFANT3216120A5T, Supplier: Walsin 3. PCB Antenna, Gain: 2dBi Part No.:DFAM-NW726-DT0R, Supplier: Delta
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 10 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 6. Pin Description Pin Definition Function Description 1 GND Gnd Ground 2 P0.21 nRESET Digital I/O Bluetooth general purpose I/O pin Configurable as pin reset 3 P0.20 TRACECLK Digital I/O Bluetooth general purpose I/O pin Trace port clock output 4 P0.19 Digital I/O Bluetooth general purpose I/O pin 5 P0.18 TRACEDATA[0] / SWO Digital I/O Bluetooth general purpose I/O pin Single wire output Trace port output 6 GND Gnd Ground 7 RF_OUT RF_OUT Bluetooth RF input/output from IC 8 AOP AOP_IN Bluetooth RF input/output to antenna on package 9 GND Gnd Ground 10 P0.17 Digital I/O Bluetooth general purpose I/O pin 11 P0.16 TRACEDATA[1] Digital I/O Bluetooth general purpose I/O pin Trace port output 12 GND Gnd Ground 13 P0.15 TRACEDATA[2] Digital I/O Bluetooth general purpose I/O pin Trace port output 14 SWDCLK Digital input Serial wire debug clock input for debug and programming 15 SWDIO Digital I/O Serial wire debug I/O for debug and programming 16 P0.14 TRACEDATA[3] Digital I/O Bluetooth general purpose I/O pin Trace port output 17 P0.13 Digital I/O Bluetooth general purpose I/O pin
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 11 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Pin Definition Function Description 18 P0.12 Digital I/O Bluetooth general purpose I/O pin 19 P0.11 Digital I/O Bluetooth general purpose I/O pin 20 P0.10 NFC2 Digital I/O NFC input Bluetooth general purpose I/O pin NFC antenna connection 21 P0.09 NFC1 D Digital I/O NFC input Bluetooth general purpose I/O pin NFC antenna connection 22 P0.08 Digital I/O Bluetooth general purpose I/O pin 23 GND Gnd Ground 24 P0.07 Digital I/O Bluetooth general purpose I/O pin 25 P0.06 Digital I/O Bluetooth general purpose I/O pin 26 P0.05 AIN3 Digital I/O Analog input Bluetooth general purpose I/O pin SAADC/COMP/LPCOMP input 27 P0.04 AIN2 Digital I/O Analog input Bluetooth general purpose I/O pin SAADC/COMP/LPCOMP input 28 P0.03 AIN1 Digital I/O Analog input Bluetooth general purpose I/O pin SAADC/COMP/LPCOMP input 29 VDD Power Power supply input 30 DCC Power DC/DC regulator output 31 DEC4 Power 1.3 V regulator supply decoupling Input from DC/DC regulator Output from 1.3 V LDO 32 P0.02 AIN0 Digital I/O Analog input Bluetooth general purpose I/O pin SAADC/COMP/LPCOMP input 33 P0.01 XL2 Digital I/O Analog input Bluetooth general purpose I/O pin Connection for 32.768 kHz crystal (LFXO) 34 P0.00 XL1 Digital I/O Analog input Bluetooth general purpose I/O pin Connection for 32.768 kHz crystal (LFXO) 35 P0.31 Digital I/O Bluetooth general purpose I/O pin 36 P0.30 Digital I/O Bluetooth general purpose I/O pin
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 12 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Pin Definition Function Description 37 P0.29 Digital I/O Bluetooth general purpose I/O pin 38 P0.28 Digital I/O Bluetooth general purpose I/O pin 39 P0.27 Digital I/O Bluetooth general purpose I/O pin 40 P0.26 Digital I/O Bluetooth general purpose I/O pin 41 P0.25 Digital I/O Bluetooth general purpose I/O pin 42 P0.24 Digital I/O Bluetooth general purpose I/O pin 43 P0.23 Digital I/O Bluetooth general purpose I/O pin 44 P0.22 Digital I/O Bluetooth general purpose I/O pin 45 GND Gnd Ground 46 GND Gnd Ground 47 GND Gnd Ground 48 GND Gnd Ground
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 13 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 7. Reference Circuit 7-1. Use Antenna on Package C3NCL210UHL315nHOptional:DCDC ModeTest PointP0.21 / nRESETTest PointSWDIOSWDCLKTest PointRF_OUTAOP_INC5NC_0402R10R_0402ModuleDFBM-NW726-DT0RGND1P0.21 / nRESET2P0.203P0.194P0.185GND6RF_OUT7AOP8GND9P0.1710GND12P0.10 / NFC220P0.09 / NFC121P0.0822GND 23P0.31 35P0.00 / XL1 34DEC4 31DCC 30VDD 29P0.03 / AIN1 28P0.04 / AIN2 27P0.07 24P0.30 36P0.02 / AIN0 32P0.01 / XL2 33P0.1416P0.1317P0.06 25P0.05 / AIN3 26P0.1218P0.1119P0.1513SWDCLK14SWDIO15P0.1611P0.29 37P0.28 38P0.27 39P0.26 40P0.25 41P0.24 42P0.23 43P0.22 44GND45GND46GND47GND48C12.2UFC4NC_0402VDDP0.29P0.28P0.23P0.31P0.30P0.22P0.25P0.24P0.06P0.05P0.04P0.15P0.07P0.13P0.14P0.09P0.10P0.11P0.12P0.16P0.17P0.08P0.20P0.18 / SWOP0.19AOP INOptional:Real Time ClockRF OUTDebugPOWERReserve for ExternalMatching NetworkP0.02P0.03P0.27P0.26C612pFY2RTCC712pF Figure 7-1. Reference Design Circuit for DFBM-NW726-DT0R (AOP)
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 14 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 7-2. Use RF connector or External Antenna L315nHC3NCL210UHOptional:DCDC ModeC12.2UFVDDDebugTest PointTest PointAOP INP0.18 / SWOTest PointP0.04P0.05P0.06P0.07P0.15SWDCLKP0.14SWDIOP0.13P0.12P0.11P0.10P0.09P0.08POWERRF OUTConnect to RF connector orAntennaAOP_INRF_OUTP0.17P0.16P0.19P0.20P0.21 / nRESETRF_OUTP0.02P0.03ModuleDFBM-NW726-DT0RGND1P0.21 / nRESET2P0.203P0.194P0.185GND6RF_OUT7AOP8GND9P0.1710GND12P0.10 / NFC220P0.09 / NFC121P0.0822GND 23P0.31 35P0.00 / XL1 34DEC4 31DCC 30VDD 29P0.03 / AIN1 28P0.04 / AIN2 27P0.07 24P0.30 36P0.02 / AIN0 32P0.01 / XL2 33P0.1416P0.1317P0.06 25P0.05 / AIN3 26P0.1218P0.1119P0.1513SWDCLK14SWDIO15P0.1611P0.29 37P0.28 38P0.27 39P0.26 40P0.25 41P0.24 42P0.23 43P0.22 44GND45GND46GND47GND48P0.28P0.29P0.30P0.31P0.23P0.24P0.25P0.22P0.26Optional:Real Time ClockP0.27C612pFY3RTCC712pF Figure 7-2. Reference Design Circuit for DFBM-NW726-DT0R (External Antenna)
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 15 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 8. Module Dimensions (mm) Figure 8-1. DFBM-NW726-DT0R Module Dimension Top View Side View
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 16 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Figure 8-2. DFBM-NW726-DT0R Module Pin Number Top View
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 17 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 9. Recommend Soldering Conditions Figure 9-1. Reflow temperature Profile No. Item Temperature (°C) Time (sec) 1 Pre-heat Tsmin: 150 °C ~ Tsmax: 200°C ts: 60 ~ 120 2 Soldering TL: >= 217°C tL: 60~150 3 Peak-Temp. Tp: 260 °C tp: 30 Table 9-1. Reflow temperature Profile Parameters
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 18 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 10. Layout Guide (mm) 10-1. Use Antenna on Package Figure 10-1. Layout Guide 10-2. Use RF connector or External Antenna Trace of RF_OUT should be controlled as 50 Ohm stripline or mirco-stripline design. 6.7mm 5.5mm 4.8mm 4.8mm 3mm 3.8mm 1.8mm 2.5mm 6.7mm 8.1mm Matching Circuit Top Layer Bottom Layer 10mm
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 19 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 11. Recommended Stencil Aperture Figure 11-1. Recommended Stencil Aperture Top View
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 20 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change Figure 11-2. Recommended Stencil Aperture Top View
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 21 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 12. Packages 12-1. Tape and Reel Specification Figure 12-1. Information of Tape specification Figure 12-2. Information of Reel specification
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 22 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 12-2. Storage Specification LEVEL3 CAUTION This bag contains MOISTURE-SENSITIVE DEVICES1. Calculated shelf life in sealed bag: 12 months at < 40 °C and< 90 % relative humidity (RH)2. Peak package body temperature: 260 °C3. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must a) Mounted within: 168 hours of factory conditions ? 30°C/60 % RH .OR b) Stored at <10% RH4. Devices require bake, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23±5°C b) 3a or 3b not met.5. If baking is required, devices may be baked for 48 hours at 125± 5°C Note: If device containers cannot be subjected to high temperature or shorter bake times are desired, reference IPC/JEDEC J-STD-033 for bake procedureBag Seal Date: . If Blank, see adjacent bar code labelNote: Level and body temperature defined by IPC/JEDEC J-STD-02020121204 Note 7 Figure 12-4. MSL3 definition
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 23 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change 13. Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states: “Contains FCC ID: H79DFBM-NW726.” 14. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warming as shown in this manual. 15. Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
DFBM-NW726-DT0R Preliminary Data Sheet Sheet 24 of 24 Jan. 22, 2018 Proprietary Information and Specifications are Subject to Change -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: 1) this device may not cause interference and 2) this device must accept any interference, including interference that may cause undesired operation of the device. RF Radiation Exposure Statement: This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.

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