Delta Electronics orporated DFBM-NW726 Bluetooth Low Energy Module User Manual Preliminary

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Document ID	3722056
Application ID	h8Of72QbgeZB3hNBicJlRg==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Filesize	85.36kB (1066955 bits)
Date Submitted	2018-01-22 00:00:00
Date Available	2018-07-22 00:00:00
Creation Date	2018-01-22 11:14:46
Producing Software	Microsoft® Word 2010
Document Lastmod	2018-01-22 11:14:46
Document Title	Preliminary
Document Creator	Microsoft® Word 2010
Document Author:	jw.wu

DFBM-NW726-DT0R
Data sheet
BLE Module
DFBM-NW726-DT0R
A Bluetooth Low Energy module with Antenna
on Package.
Preliminary Data Sheet
Sheet 1 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Contents
1.
Features ........................................................................................................................................... 5
1-1. General ......................................................................................................................................... 5
1-2. Bluetooth...................................................................................................................................... 5
2.
Block Diagram ................................................................................................................................ 6
2-1. Use Antenna on Package ............................................................................................................. 6
2-2. Use RF connector or External Antenna ....................................................................................... 6
General Specification ...................................................................................................................... 7
Electrical Characteristics................................................................................................................. 8
4-1. Absolute Maximum Rating .......................................................................................................... 8
4-2. Recommended Operating Conditions & Power Consumption .................................................... 8
RF Characteristics ........................................................................................................................... 9
3.
4.
5.
5-1. Bluetooth RF characteristics ........................................................................................................ 9
5-2. Antenna characteristics ................................................................................................................ 9
6.
Pin Description .............................................................................................................................. 10
7.
Reference Circuit .......................................................................................................................... 13
7-1. Use Antenna on Package ........................................................................................................... 13
7-2. Use RF connector or External Antenna ..................................................................................... 14
8.
Module Dimensions (mm) ............................................................................................................ 15
9.
Recommend Soldering Conditions ............................................................................................... 17
10.
Layout Guide (mm) ....................................................................................................................... 18
10-1. Use Antenna on Package ......................................................................................................... 18
10-2. Use RF connector or External Antenna ................................................................................... 18
11.
Recommended Stencil Aperture .................................................................................................... 19
12.
Packages ........................................................................................................................................ 21
12-1. Tape and Reel Specification .................................................................................................... 21
12-2. Storage Specification ............................................................................................................... 22
13.
Required End Product Labeling .................................................................................................... 23
Preliminary Data Sheet
Sheet 2 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
14.
15.
Manual Information to the End User ............................................................................................ 23
Federal Communications Commission (FCC) Statement ............................................................. 23
Preliminary Data Sheet
Sheet 3 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Revision History
Rev.
S01
Date
Reason of change
2018/01/22 Update FCC / NCC / TELEC Certification Number
Maker
Approval
Ryan
Josh
Ryan
Josh
1. Modify description in 6.Pin Description section
Pin3  P0.20 / TRACECLK
Pin5  P0.18 / TRACEDATA[0] / SWO
0.6
Pin11  P0.16 / TRACEDATA[1]
Pin13  P0.15 / TRACEDATA[2]
2018/01/10
Pin15  SWDIO, remove reset description
Pin16  P0.14 / TRACEDATA[3]
2.Update detail dimension of footprint in 11.Recommended
Stencil Aperture section
3.Modify C3 from 10UF to NC in 7.Reference Design section
0.5
2017/12/14 Certification based on BT4.2
Ryan
Josh
0.4
2017/12/08 Modify Laser marking information
Ryan
Josh
0.3
2017/11/07 Update Package information
Ryan
Josh
0.2
2017/10/20 Modify ESD (HBM/CDM) specification
Ryan
Josh
0.1
2017/07/03 Initial release
Ryan
Josh
Preliminary Data Sheet
Sheet 4 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
DFBM-NW726-DT0R
BLE Module with Antenna on Package
his document describes the DFBM-NW726-DT0R wireless BLE module hardware specification. The
modules provide cost effective, low power, and flexible platform to add BLE for embedded devices for
a variety of applications, such as wireless sensors and thermostats. It uses BLE SoC, which integrating the
2.4GHz transceiver, a 32 bit ARM® Cortex M4F CPU, flash memory, and analog and digital peripherals.
1. Features
1-1. General

BLE chip with a single chip antenna or an external RF connector

Integrate a 32 bit ARM® Cortex M4F CPU,512KB flash memory and 64KB RAM

12-bit 200kspc ADC - 8 configurable channels with programmable gain

30 General Purpose I/O Pins

Two-wire Master (I2C compatible) support 100K bps and 400K bps

UART baud rate up to 921600 bps

SPI bit rate up to 4M bps

Quadrature Decoder (QDEC)

LGA 48 pin package

Dimension 6.5mm(L) x 6.5mm(W) x 1.5 mm(H)

RoHS compliant
1-2. Bluetooth


Bluetooth 4.2 specification compliant
AES HW encryption
Preliminary Data Sheet
Sheet 5 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
2. Block Diagram
2-1. Use Antenna on Package
Bluetooth ANT
On Package
Matching
VDD: 1.7V ~ 3.6V
Network
(Optional)
Bluetooth
SOC
UART/SPI/I2C
GPIO
ADC
32MHz Crystal
Figure 2-1. DFBM-NW726-DT0R Block Diagram (AOP)
2-2. Use RF connector or External Antenna
Bluetooth ANT
On Package
External Antenna
Matching
Network
(Optional)
VDD: 1.7V ~ 3.6V
Bluetooth
SOC
UART/SPI/I2C
GPIO
ADC
32MHz Crystal
Figure 2-2. DFBM-NW726-DT0R Block Diagram (External RF)
Preliminary Data Sheet
Sheet 6 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
3. General Specification
MCU
ARM® Cortex® -M4 32-bit processor with FPU, 64MHz
Standard
Bluetooth: V4.2
Frequency
2.402 ~ 2.48 GHz
Modulation
GFSK
Data Rate
BLE: 0.25, 1, 2 Mbps
Operating Temperature
-40℃ ~ +85 ℃
Storage Temperature
-40℃ ~ +85 ℃
Antenna Impedance
50 ohm
Package Size
6.5 x 6.5 x 1.5 mm3
Host Interface
UART, SPI, I2C, ADC
FCC: H79DFBM-NW726
Certification
CE Compliant
NCC: CCAM18LP0130T8
TELEC: 201-180008
Table 3-1. General Specification
Preliminary Data Sheet
Sheet 7 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
4. Electrical Characteristics
4-1. Absolute Maximum Rating
Symbol
Min.
Max.
Units
VDD_3V3
-0.3
3.9
VGPIO
-0.3
3.9
ESD-HBM
KV
ESD-CDM
500
Table 4-1. Absolute Maximum Rating
4-2. Recommended Operating Conditions & Power Consumption
Symbol Parameter
Min.
Typ.
Max.
Unit
1.7
3.3
3.6
Supply Voltage
System On, Standby mode
50
uA
TX Current at POUT = +0 dBm (LDO)
11.6
mA
TX Current at POUT = +0 dBm (DCDC)
5.3
mA
12.9
mA
5.8
mA
VDD_3V3 RX Current (LDO)
RX Current (DCDC)
Current in SYSTEM OFF, no RAM retention.
0.7
1.2
1.9
uA
Current in SYSTEM OFF mode 32 kB RAM retention.
1.0
uA
SYSTEM-ON base current with 32 kB RAM enabled.
1.5
uA
Table 4-2. Bluetooth Power Consumption
Preliminary Data Sheet
Sheet 8 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
5. RF Characteristics
5-1. Bluetooth RF characteristics
Condition: VDD_3V3=VIO=3.3V, T=25℃
Item
Condition
Min.
Typ.
Max.
Unit
Output Power
-20
dBm
Initial Frequency Offset
-75
75
KHz
-150
150
KHz
RF Characteristics
Carrier Frequency Offset and Drift
Modulation Characteristics
CFOD
Modulation Index (F1 / F2)
0.8
F1 Average
225
F2 Maximum
185
N/A
275
KHz
KHz
Sensitivity
PER < 30.8%
-96
dBm
Maximum Input Level
PER < 30.8%
-10
dBm
Table 5-1. Bluetooth RF Characteristics
5-2. Antenna characteristics
There is no antenna on module. Only RF pad is used for antenna. Below table shows antenna list used
for certification testing.
1. Dipole Antenna, Gain: 2.23dBi
Part No.:RFDPA8780900SMAB801, Supplier: Walsin
Antenna Designation for
Certification
2. Chip Antenna, Gain: 2.12dBi
Part No.:RFANT3216120A5T, Supplier: Walsin
3. PCB Antenna, Gain: 2dBi
Part No.:DFAM-NW726-DT0R, Supplier: Delta
Preliminary Data Sheet
Sheet 9 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
6. Pin Description
Pin
Definition
Function
GND
Gnd
P0.21
nRESET
P0.20
TRACECLK
P0.19
Digital I/O
Digital I/O
Digital I/O
P0.18
TRACEDATA[0] /
Description
Ground
Bluetooth general purpose I/O pin
Configurable as pin reset
Bluetooth general purpose I/O pin
Trace port clock output
Bluetooth general purpose I/O pin
Bluetooth general purpose I/O pin
Digital I/O
SWO
Single wire output
Trace port output
GND
Gnd
RF_OUT
RF_OUT
Bluetooth RF input/output from IC
AOP
AOP_IN
Bluetooth RF input/output to antenna on package
GND
Gnd
10
P0.17
Digital I/O
11
12
13
P0.16
TRACEDATA[1]
GND
P0.15
TRACEDATA[2]
Digital I/O
Gnd
Digital I/O
14
SWDCLK
Digital input
15
SWDIO
Digital I/O
16
17
P0.14
TRACEDATA[3]
P0.13
Preliminary Data Sheet
Digital I/O
Digital I/O
Ground
Ground
Bluetooth general purpose I/O pin
Bluetooth general purpose I/O pin
Trace port output
Ground
Bluetooth general purpose I/O pin
Trace port output
Serial wire debug clock input for debug and programming
Serial wire debug I/O for debug and programming
Bluetooth general purpose I/O pin
Trace port output
Bluetooth general purpose I/O pin
Sheet 10 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Pin
Definition
Function
18
P0.12
Digital I/O
Bluetooth general purpose I/O pin
19
P0.11
Digital I/O
Bluetooth general purpose I/O pin
P0.10
Digital I/O
Bluetooth general purpose I/O pin
NFC2
NFC input
NFC antenna connection
20
21
P0.09
Description
D Digital I/O Bluetooth general purpose I/O pin
NFC1
NFC input
NFC antenna connection
22
P0.08
Digital I/O
Bluetooth general purpose I/O pin
23
GND
Gnd
24
P0.07
Digital I/O
Bluetooth general purpose I/O pin
25
P0.06
Digital I/O
Bluetooth general purpose I/O pin
P0.05
Digital I/O
Bluetooth general purpose I/O pin
26
27
28
AIN3
P0.04
AIN2
P0.03
AIN1
Ground
Analog input SAADC/COMP/LPCOMP input
Digital I/O
Bluetooth general purpose I/O pin
Analog input SAADC/COMP/LPCOMP input
Digital I/O
Bluetooth general purpose I/O pin
Analog input SAADC/COMP/LPCOMP input
29
VDD
Power
Power supply input
30
DCC
Power
DC/DC regulator output
31
DEC4
Power
P0.02
Digital I/O
32
33
34
AIN0
P0.01
XL2
P0.00
XL1
1.3 V regulator supply decoupling Input from DC/DC
regulator Output from 1.3 V LDO
Bluetooth general purpose I/O pin
Analog input SAADC/COMP/LPCOMP input
Digital I/O
Bluetooth general purpose I/O pin
Analog input Connection for 32.768 kHz crystal (LFXO)
Digital I/O
Bluetooth general purpose I/O pin
Analog input Connection for 32.768 kHz crystal (LFXO)
35
P0.31
Digital I/O
Bluetooth general purpose I/O pin
36
P0.30
Digital I/O
Bluetooth general purpose I/O pin
Preliminary Data Sheet
Sheet 11 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Pin
Definition
Function
37
P0.29
Digital I/O
Bluetooth general purpose I/O pin
38
P0.28
Digital I/O
Bluetooth general purpose I/O pin
39
P0.27
Digital I/O
Bluetooth general purpose I/O pin
40
P0.26
Digital I/O
Bluetooth general purpose I/O pin
41
P0.25
Digital I/O
Bluetooth general purpose I/O pin
42
P0.24
Digital I/O
Bluetooth general purpose I/O pin
43
P0.23
Digital I/O
Bluetooth general purpose I/O pin
44
P0.22
Digital I/O
Bluetooth general purpose I/O pin
45
GND
Gnd
Ground
46
GND
Gnd
Ground
47
GND
Gnd
Ground
48
GND
Gnd
Ground
Preliminary Data Sheet
Description
Sheet 12 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
7. Reference Circuit
7-1. Use Antenna on Package
Optional:
Real Time Clock
Y2
C7
C6
P0.31
P0.30
P0.29
P0.28
P0.27
P0.26
P0.25
P0.24
P0.23
P0.22
12pF
12pF
RTC
35
P0.31
36
P0.30
37
P0.29
38
P0.28
P0.27
39
40
P0.26
41
P0.25
42
43
P0.07
C3
NC
33
32
L2
10UH
VDD
P0.02
31
30
29
28
27
26
25
24
P0.03
C1
2.2UF
P0.04
P0.05
P0.06
P0.07
23
22
P0.08
GND
34
P0.08
21
P0.09
P0.15
SWDCLK
20
GND
GND
P0.10
Debug
GND
P0.09 / NFC1
P0.16
P0.10 / NFC2
P0.06
47
48
45
46
P0.17
P0.11
12
VDD
P0.05 / AIN3
P0.12
11
GND
19
P0.16
DCC
P0.04 / AIN2
P0.11
P0.17
10
AOP
DEC4
P0.03 / AIN1
18
C5
NC_0402
RF_OUT
RF OUT
AOP IN
P0.12
GND
P0.13
AOP_IN
POWER
17
P0.18
P0.13
RF_OUT
DFBM-NW726-DT0R
P0.14
R1
0R_0402
P0.19
16
P0.02 / AIN0
P0.14
P0.18 / SWO
P0.20
SWDIO
P0.01 / XL2
15
P0.00 / XL1
SWDCLK
P0.19
15nH
P0.21 / nRESET
P0.15
P0.20
L3
GND
14
Test Point
C4
NC_0402
P0.21 / nRESET
13
P0.24
Test Point
GND
GND
Reserve for
External
Matching Network
P0.22
Module
P0.23
44
Optional:
DCDC Mode
SWDIO
Test Point
Figure 7-1. Reference Design Circuit for DFBM-NW726-DT0R (AOP)
Preliminary Data Sheet
Sheet 13 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
7-2. Use RF connector or External Antenna
Optional:
Real Time Clock
Y3
C7
C6
P0.31
P0.30
P0.29
P0.28
P0.27
P0.26
P0.25
P0.24
P0.23
P0.22
12pF
12pF
RTC
35
P0.31
36
P0.30
37
P0.29
38
P0.28
P0.27
39
40
P0.26
41
P0.25
42
P0.16
P0.07
C3
NC
33
32
L2
10UH
VDD
P0.02
31
30
29
28
27
26
25
24
P0.03
C1
2.2UF
P0.04
P0.05
P0.06
P0.07
23
22
P0.08
GND
34
P0.08
21
P0.09
P0.11
19
20
P0.10
P0.15
SWDCLK
P0.11
GND
GND
P0.12
Debug
GND
P0.09 / NFC1
P0.06
P0.10 / NFC2
P0.17
47
48
45
46
P0.05 / AIN3
18
12
P0.04 / AIN2
GND
P0.12
11
VDD
P0.03 / AIN1
P0.13
P0.16
AOP
RF OUT
AOP IN
17
P0.17
10
RF_OUT
P0.13
POWER
GND
P0.14
DEC4
DCC
16
AOP_IN
P0.02 / AIN0
P0.18
P0.14
DFBM-NW726-DT0R
P0.19
SWDIO
RF_OUT
P0.20
15
P0.01 / XL2
SWDCLK
P0.18 / SWO
RF_OUT
P0.00 / XL1
P0.15
P0.19
15nH
P0.21 / nRESET
14
Test Point
Connect to
RF connector or
Antenna
P0.20
L3
GND
13
GND
GND
P0.24
Test Point
P0.21 / nRESET
43
P0.22
Module
P0.23
44
Optional:
DCDC Mode
SWDIO
Test Point
Figure 7-2. Reference Design Circuit for DFBM-NW726-DT0R (External Antenna)
Preliminary Data Sheet
Sheet 14 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
8. Module Dimensions (mm)
Top View
Side View
Figure 8-1. DFBM-NW726-DT0R Module Dimension
Preliminary Data Sheet
Sheet 15 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Top View
Figure 8-2. DFBM-NW726-DT0R Module Pin Number
Preliminary Data Sheet
Sheet 16 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
9. Recommend Soldering Conditions
Figure 9-1. Reflow temperature Profile
No.
Item
1 Pre-heat
2 Soldering
3 Peak-Temp.
Temperature (°C)
Tsmin: 150 °C ~ Tsmax: 200°C
TL: >= 217°C
Tp: 260 °C
Time (sec)
ts: 60 ~ 120
tL: 60~150
tp: 30
Table 9-1. Reflow temperature Profile Parameters
Preliminary Data Sheet
Sheet 17 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
10.
Layout Guide (mm)
10-1. Use Antenna on Package
10mm
Matching
8.1mm
3.8mm
Circuit
1.8mm
3mm
4.8mm
2.5mm
6.7mm
4.8mm
5.5mm
6.7mm
Top Layer
Bottom Layer
Figure 10-1. Layout Guide
10-2. Use RF connector or External Antenna
Trace of RF_OUT should be controlled as 50 Ohm stripline or mirco-stripline design.
Preliminary Data Sheet
Sheet 18 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
11.
Recommended Stencil Aperture
Top View
Figure 11-1. Recommended Stencil Aperture
Preliminary Data Sheet
Sheet 19 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
Top View
Figure 11-2. Recommended Stencil Aperture
Preliminary Data Sheet
Sheet 20 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
12.
Packages
12-1. Tape and Reel Specification
Figure 12-1. Information of Tape specification
Figure 12-2. Information of Reel specification
Preliminary Data Sheet
Sheet 21 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
12-2. Storage Specification
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
LEVEL
1. Calculated shelf life in sealed bag: 12 months at < 40 °C and< 90 %
relative humidity (RH)
2. Peak package body temperature:
260
°C
3. After bag is opened, devices that will be subjected to reflow solder
or other high temperature process must
a) Mounted within:
168
hours of factory
conditions ? 30°C/60 % RH .OR
b) Stored at <10% RH
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card is > 10% when read at 23±5°C
b) 3a or 3b not met.
5. If baking is required, devices may be baked for 48 hours at 125± 5°C
Note: If device containers cannot be subjected to high temperature
or shorter bake times are desired,
reference IPC/JEDEC J-STD-033 for bake procedure
Bag Seal Date:
20121204
Note 7
If Blank, see adjacent bar code label
Note: Level and body temperature defined by IPC/JEDEC J-STD-020
Figure 12-4. MSL3 definition
Preliminary Data Sheet
Sheet 22 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
13.
Required End Product Labeling
Any device incorporating this module must include an external, visible, permanent marking or label
which states: “Contains FCC ID: H79DFBM-NW726.”
14.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module. The end user manual shall include all required regulatory information/warming as shown in
this manual.
15.
Federal Communications Commission (FCC)
Statement
15.21
You are cautioned that changes or modifications not expressly approved by the part responsible for
compliance could void the user’s authority to operate the equipment.
15.105(b)
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Preliminary Data Sheet
Sheet 23 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018
DFBM-NW726-DT0R
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1) this device may not cause interference and
2) this device must accept any interference, including interference that may cause undesired
operation of the device.
RF Radiation Exposure Statement:
This Transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with a minimum distance of 20
centimeters between the radiator and your body.
Preliminary Data Sheet
Sheet 24 of 24
Proprietary Information and Specifications are Subject to Change
Jan. 22, 2018

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Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 24
Language                        : zh-TW
Tagged PDF                      : Yes
Title                           : Preliminary
Author                          : jw.wu
Creator                         : Microsoft® Word 2010
Create Date                     : 2018:01:22 11:14:46+08:00
Modify Date                     : 2018:01:22 11:14:46+08:00
Producer                        : Microsoft® Word 2010

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