Delta Electronics orporated DFZM-E8210 ZigBee Module User Manual DFZM E82xx S2

Delta Electronics Incorporated ZigBee Module DFZM E82xx S2

Users Manual

DFZM-E82xx Data Sheet Sheet 1 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Data sheet DFZM-E82xx An IEEE 802.15.4 System–On-Chip ZigBee module
DFZM-E82xx Data Sheet Sheet 2 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Contents 1.Features ............................................................................................................................................... 42.ZigBee Model No. Definition ............................................................................................................. 63.Architecture ......................................................................................................................................... 73-1.Block Diagram .............................................................................................................................. 73-2.Block Diagram Description .......................................................................................................... 83-2-1.Overview ........................................................................................................................... 83-2-2.CPU and Memory .............................................................................................................. 83-2-3.Clocks and Power Management ...................................................................................... 103-2-4.Peripherals ....................................................................................................................... 124.Pin-out and Signal Description ......................................................................................................... 154-1.Device Pin-out Diagram (Module top view) .............................................................................. 154-2.Module Pins Description ............................................................................................................ 165.Electrical Characteristics .................................................................................................................. 235-1.Absolute Maximum Rating......................................................................................................... 235-2.Recommended Operating Conditions ......................................................................................... 235-3.Power Consumption.................................................................................................................... 245-4.Digital I/O and nRESET Pin Specifications ............................................................................... 255-5.Wake-up and Timing ................................................................................................................... 265-6.Radio Parameters ........................................................................................................................ 275-7.ADC Parameters ......................................................................................................................... 286.Package and Layout Guidelines ........................................................................................................ 296-1.Recommended PCB Footprint and Dimensions ......................................................................... 296-2.Layout Guidelines ....................................................................................................................... 326-2-1.Surface Mount Assembly ................................................................................................ 336-3.Recommended Stencil Aperture ................................................................................................. 357.Ordering Information ........................................................................................................................ 368.Package ............................................................................................................................................. 368-1.Information of carrier tape direction&packaging dimension ..................................................... 368-2.Reel dimension ........................................................................................................................... 388-3.Total Package .............................................................................................................................. 39
DFZM-E82xx Data Sheet Sheet 3 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Revision History Version Date Reason of change Maker 0.1 2013/12/31 Initial release Monch 0.2 2014/06/27 1. Add RF exposure warning statement including FCC statement. 2. Modify 5.6 Radio Parameter for DFZM-E821x . Monch
DFZM-E82xx Data Sheet Sheet 4 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change DFZM-E82xx IEEE802.15.4 System-On-Chip ZigBee Module HIS DOCUMENT describes the DFZM-E82xx ZigBee module hardware specification. The EM3587 based modules provide cost effective, low power, and flexible platform to add ZigBee connectivity for embedded devices for a variety of applications, such as wireless sensors、energy and security monitoring、building( or home ) automation and control . It combines 32-bit ARM Cortex-M3 processor, in-system programable flash memory, 64-KB RAM, 512KB flash memory and off module certified antenna options, and various RF front end options for end customer range needs in order to provide a ZigBee and regulatory certified. The module has various operating modes, making it highly suit for system where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. 1. Features ► Family of modules with different antenna and output power options:  DFZM-E82xx 27 mm by 16 mm by 3.3 mm (Length * Width * Height) 28-pin Dual Flat pack PCB Surface Mount Package.  DFZM-E8220, DFZM-E8221, DFZM-E8210, and DFZM-E8211 are all pin to pin compatible (see section 7 Ordering Information), and the user has to account only for power consumption for various end applications.  Simple API for embedded markets covering large areas of applications. ► Compliant with IEEE 802.15.4-2003 and regulatory domains:  RoHS compliant. ► Microcontroller:  Industry-leading ARM Cortex-M3 processor.  512KB Flash with optional read protection.  64KB RAM memory. T
DFZM-E82xx Data Sheet Sheet 5 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change  Flexible nested vectored interrupt controller. ► Interfaces:  Internal antenna or external antenna options.  Flexible ADC, UART/SPI/TWI serial communications, and general purpose timers.  Up to 24 configurable general purpose I/Os.  Single voltage operation: 2.1~3.6V ► Embedded RTC (Real Time Clock) can run directly from battery.
DFZM-E82xx Data Sheet Sheet 6 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 2. ZigBee Model No. Definition D F Z M - E 8 2 2 0 -DT0 R1= High Power 2= Low Power E=Pb free R=RoHS N=NG L=Process with Lead Customer code Antenna Version Free-lead Power Version Frequency M= Module Z= ZigBee F= FR4 D= DELTA 2= 2.4GHz Chip Vendor Product-type Property Substrate Company E=Ember(Silicon Labs) 0= External Antenna 1=PCB printed Antenna DT= Delta DefineChip Type 8=EM3587 0~9 then A~Z Serial no.
DFZM-E82xx Data Sheet Sheet 7 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 3. Architecture 3-1.Block Diagram Figure 3-1: DFZM-E822x Block Diagram Figure 3-2: DFZM-E821x Block Diagram SE2432L ANT 24M X’tal VCC Digital I/O
DFZM-E82xx Data Sheet Sheet 8 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 3-2.Block Diagram Description 3-2-1.Overview DFZM-E82xx module is a highly integrated ZigBee system-on-chip (SOC) that contains the following:  The module includes Silicon Labs EM3587 SoC, which contains CPU- and memory-related, peripherals-related, clocks and power management-related in a single package.  The module features an IEEE802.15.4-compliant radio transceiver with onboard 24 MHz crystal circuitries, RF, and certified antenna or external antenna options. o The low power module option has a capability of +8dBm output power at the antenna (see Figure 3-1). o The high power module option has a capability of +18.5dBm output power at the antenna (see Figure 3-2).  Variety of interfaces are available such as UART, SPI, TIMER, ADC, Operational amperifier and GPIO.  DFZM-E82xx contains single power supply (VCC). 3-2-2.CPU and Memory The EM3587 integrates the ARM® Cortex-M3 microprocessor. The ARM® Cortex-M3 is an advanced 32-bit modified Harvard architecture processor that has separate internal program and data buses, but presents a unified program and data address space to software. The word width is 32 bits for both the program and data sides. The ARM® Cortex-M3 allows unaligned word and half-word data accesses to support efficiently-packed data structures. The ARM® Cortex-M3 clock speed is configurable to 6 , 12 , or 24 MHz. For normal operation 24 MHz is preferred over 12 MHz due to improved performance for all applications and improved duty cycling for applications using sleep modes. The 6 MHz operation can only be used when radio operations are not required since the radio requires an accurate 12 MHz clock. The ARM® Cortex-M3 in the EM3587 has also been enhanced to support two separate memory protection levels. Basic protection is available without using the MPU, but normal operation uses the MPU. The MPU allows for protecting unimplemented areas of the memory map to prevent common software bugs from interfering with software operation. The architecture could also allow for separation of the networking stack from the application code using a fine granularity RAM protection module. Errant writes are captured and details are reported to the
DFZM-E82xx Data Sheet Sheet 9 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change developer to assist in tracking down and fixing issues. Figure 3.3 shows the EM357 ARM® Cortex-M3 memory map. Figure 3-3: DFZM-E82xx memory map
DFZM-E82xx Data Sheet Sheet 10 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 3-2-3.Clocks and Power Management The DFZM-E82xx integrates three oscillators: 12 MHz RC oscillator 24 MHz crystal oscillator 10 kHz RC oscillator Figure 3-4 shows a block diagram of the clocks in the DFZM-E82xx. This simplified view shows all the clock sources and the general areas of the chip to which they are routed Figure 3-4: DFZM-E82xx block diagram of the clocks
DFZM-E82xx Data Sheet Sheet 11 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change The DFZM-E82xx’s power management system is designed to achieve the lowest deep sleep current consumption possible while still providing flexible wakeup sources, timer activity, and debugger operation. The DFZM-E82xx has four main sleep modes: Idle Sleep: Puts the CPU into an idle state where execution is suspended until any interrupt occurs. All power domains remain fully powered and nothing is reset. Deep Sleep 1: The primary deep sleep state. In this state, the core power domain is fully powered down and the sleep timer is active. Deep Sleep 2: The same as Deep Sleep 1 except that the sleep timer is inactive to save power. In this mode the sleep timer cannot wake up the DFZM-E82xx. Deep Sleep 0 (also known as Emulated Deep Sleep): The chip emulates a true deep sleep without powering down the core domain. Instead, the core domain remains powered and all peripherals except the system debug components (ITM, DWT, FPB, NVIC) are held in reset. The purpose of this sleep state is to allow DFZM-E82xx software to perform a deep sleep cycle while maintaining debug configuration such as breakpoints. The power management state diagram in Figure 3-5 shows the basic operation of the power management controller. Figure 3-5: DFZM-E82xx power management state diagram
DFZM-E82xx Data Sheet Sheet 12 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 3-2-4.Peripherals The DFZM-E82xx has 24 multipurpose GPIO pins, which may be individually configured as: General purpose output General purpose open-drain output Alternate output controlled by a peripheral device Alternate open-drain output controlled by a peripheral device Analog General purpose input General purpose input with pull-up or pull-down resistor The GPIO signal assignments are shown in Table 3-1. GPIO Analog Alternate Output Input Output Current DrivePA0 TIM2C31, SC2MOSI TIM2C31, SC2MOSI Standard PA1 TIM2C31, SC2MISO, SC2SDA TIM2C31, SC2MISO, SC2SDA Standard PA2 TIM2C41, SC2SCLK, SC2SCL TIM2C41, SC2SCLK, SC2SCL Standard PA3 TIM2C21 TIM2C21, SC2nSSEL Standard PA4 ADC4 PTI_EN, TRACEDATA2 Standard PA5 ADC5 PTI_DATA, TRACEDATA3 nBOOTMODE2 Standard PA6 TIM1C3 TIM1C3 High PA7 TIM1C4, REG_EN3 TIM1C4 High PB0 VREF TRACEDATA2 TRACEDATA2, TIM2MSK, IRQA,TIM1CLK Standard PB1 TIM2C14, SC1TXD, SC1MOSI, SC1MISO, SC1SDA TIM2C14, SC1SDA Standard PB2 TIM2C24, SC1SCL TIM2C24, SC1MISO, SC1MOSI, SC1SCL, SC1RXD Standard PB3 TIM2C34, SC1SCLK TIM2C34, SC1SCLK, SC1nCTS Standard PB4 TIM2C44, SC1nRTS TIM2C44, SC1nSSEL Standard PB5 ADC0 TIM2CLK, TIM1MSK Standard PB6 ADC1 TIM1C1 TIM1C1, IRQB High PB7 ADC2 TIM1C2 TIM1C2, IRQC High
DFZM-E82xx Data Sheet Sheet 13 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change PC0 TRACEDATA1 JRST, IRQD High PC1 ADC3 TRACEDATA3 Standard PC2 JTDO6, SWO , TRACEDATA0 Standard PC3 TRACECLK JTDI5 , TRACECLK Standard PC4 SWDIO7 SWDIO7, JTMS7 Standard PC5 TX_ACTIVE Standard Notes: 1.Default signal assignment (not remapped). 2. Overrides during reset as an input with pull up. 3. Overrides after reset as an open-drain output. 4. Alternate signal assignment (remapped). 5. Overrides in JTAG mode as a input with pull up. 6. Overrides in JTAG mode as a push-pull output. 7. Overrides in Serial Wire mode as either a push-pull output, or a floating input, controlled by the debugger. Table 3-1: DFZM-E82xx GPIO signal assignments The DFZM-E82xx has two serial controllers, SC1 and SC2, which provide several options for full-duplex synchronous and asynchronous serial communications. SPI (Serial Peripheral Interface), master or slave TWI (Two Wire serial Interface), master only UART (Universal Asynchronous Receiver/Transmitter), SC1 only Receive and transmit FIFOs and DMA channels, SPI and UART modes Before using a serial controller, configure and initialize it as follows: 1. Set up the parameters specific to the operating mode (master/slave for SPI, baud rate for UART, etc.). 2. Configure the GPIO pins used by the serial controller as shown in Tables 3-2 and 3-3. 3. If using DMA, set up the DMA and buffers. 4. If using interrupts, select edge- or level-triggered interrupts with the SCx_INTMODE register, enable the desired second-level interrupt sources in the INT_SCxCFG register, and finally enable the top-level SCx interrupt in the NVIC. 5. Write the serial interface operating mode (SPI, TWI, or UART) to the SCx_MODE register
DFZM-E82xx Data Sheet Sheet 14 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change PB1 PB2 PB3 PB4 SPI-Master SC1MOSI Alternate Output SC1MISO Input SC1SCLK Alternate Output (not used) SPI-Slave SC1MISO Alternate Output SC1MOSI Input SC1SCLK Input SC1nSSEL Input TWI-Master SC1SDA Alternate Output (open-drain) SC1SCL Alternate Output (open-drain) (not used) (not used) UART TXD Alternate Output RXD Input SC1nCTS Input SC1nRTS Alternate Output Table 3-2: DFZM-E82xx SC1 GPIO Usage and Configuration PA0 PA1 PA2 PA3 SPI-Master SC2MOSI Alternate Output SC2MISO Input SC2SCLK Alternate Output (not used) SPI-Slave SC2MOSI Input SC2MISO Alternate Output SC2SCLK Input SC2nSSEL Input TWI-Master (not used) SC2SDA Alternate Output (open-drain) SC2SCL Alternate Output (open-drain) (not used) Table 3-3: DFZM-E82xx SC2 GPIO Usage and Configuration
DFZM-E82xx Data Sheet Sheet 15 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 4. Pin-out and Signal Description 4-1.Device Pin-out Diagram (Module top view) Figure 4-1: DFZM-E82xx Device Pin-out Diagram (Module top view)
DFZM-E82xx Data Sheet Sheet 16 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 4-2.Module Pins Description Pins Name Pin Type Description 1 GND Ground Ground 2 PC5 I/O Digital I/O(Not available for DFZM-E821X-DT0R) TX_ACTIVE O Logic-level control for external Tx/Rx switch .The EM358 baseband controls Tx active and drives it high(VDD_PADS) when in Tx mode. Select alternate output function with GPIO_PCCFGH[7:4]. 3 nRESET I Active low chip reset(internal pull-up) 4 PA7 I/O Digital I/O, High current, Disable REG_EN with GPIO_DBGCFG[4] TIM1C4 O Timer 1 Channel 4 output, Enable timer output with TIM1_CCER Select alternate output function with GPIO_PACFGH[15:12] Disable REG_EN with GPIO_DBGCFG[4] TIM1C4 I Timer 1 Channel 4 input, Cannot be remapped REG_EN O External regulator open drain output, Enabled after reset 5 PB3 I/O Digital I/O TIM2C3 O Timer 2 channel 3 output, Enable remap with TIM2_OR[6] Enable timer output in TIM2_CCER Select alternate output function with GPIO_PBCFGL[15:12] TIM2C3 I Timer 2 channel 3 input, Enable remap with TIM2_OR[6] SC1nCTS I UART CTS handshake of Serial Controller 1 Enable with SC1_UARTCFG[5], Select UART with SC1_MODE SC1SCLK O SPI master clock of Serial Controller 1 Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[6] Enable master with SC1_SPICFG[4], Select SPI with SC1_MODE Select alternate output function with GPIO_PBCFGL[15:12] SC1SCLK I SPI slave clock of Serial Controller 1 Enable slave with SC1_SPICFG[4], Select SPI with SC1_MODE 6 PB4 I/O Digital I/O TIM2C4 O Timer 2 channel 4 output, Enable remap with TIM2_OR[7] Enable timer output in TIM2_CCER
DFZM-E82xx Data Sheet Sheet 17 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Select alternate output function with GPIO_PBCFGH[3:0] TIM2C4 I Timer 2 channel 4 input, Enable remap with TIM2_OR[7] SC1nRTS O UART RTS handshake of Serial Controller 1 Either disable timer output in TIM2_CCER,or disable remap with TIM2_OR[7] Enable with SC1_UARTCFG[5], Select UART with SC1_MODE Select alternate output function with GPIO_PBCFGH[3:0] SC1nSSEL I SPI slave select of Serial Controller 1 Enable slave with SC1_SPICFG[4], Select SPI with SC1_MODE 7 PA0 I/O Digital I/O TIM2C1 O Timer 2 channel 1 output, Disable remap with TIM2_OR[4] Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL[3:0] TIM2C1 I Timer 2 channel 1 input, Disable remap with TIM2_OR[4] SC2MOSI O SPI master data out of Serial Controller 2 Either disable timer output in TIM2_CCER, or enable remap with TIM2_OR[4] Enable master with SC2_SPICFG[4], Select SPI with SC2_MODE Select alternate output function with GPIO_PACFGL[3:0] SC2MOSI I SPI slave data in of Serial Controller 2 Enable slave with SC2_SPICFG[4], Select SPI with SC2_MODE 8 PA1 I/O Digital I/O TIM2C3 O Timer 2 channel 3 output, Disable remap with TIM2_OR[6] Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL[7:4] TIM2C3 I Timer 2 channel 3 input, Disable remap with TIM2_OR[6] SC2SDA I/O TWI data of Serial Controller 2, Either disable timer output in TIM2_CCER, or enable remap with TIM2_OR[6], Select TWI with SC2_MODE Select alternate open-drain output function with GPIO_PACFGL[7:4] SC2MISO O SPI slave data out of Serial Controller 2, Either disable timer output in TIM2_CCER, or enable remap with TIM2_OR[6], Enable slave with SC2_SPICFG[4], Select SPI with SC2_MODE, Select alternate output function with GPIO_PACFGL[7:4]SC2MISO I SPI master data in of Serial Controller 2
DFZM-E82xx Data Sheet Sheet 18 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Enable slave with SC2_SPICFG[4], Select SPI with SC2_MODE 9 PA2 I/O Digital I/O TIM2C4 O Timer 2 channel 4 output Disable remap with TIM2_OR[7], Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL[11:8] TIM2C4 I Timer 2 channel 4 input, Disable remap with TIM2_OR[7] SC2SCL I/O TWI clock of Serial Controller 2, Either disable timer output in TIM2_CCER, or enable remap with TIM2_OR[7], Select TWI with SC2_MODE Select alternate open-drain output function with GPIO_PACFGL[11:8] SC2SCLK O SPI master clock of Serial Controller 2 Either disable timer output in TIM2_CCER, or enable remap with TIM2_OR[7] Enable master with SC2_SPICFG[4], Select SPI with SC2_MODE Select alternate output function with GPIO_PACFGL[11:8] SC2SCLK I SPI slave clock of Serial Controller 2 Enable slave with SC2_SPICFG[4], Select SPI with SC2_MODE 10 PA3 I/O Digital I/O SC2nSSEL I SPI slave select of Serial Controller 2 Enable slave with SC2_SPICFG[4], Select SPI with SC2_MODE TIM2C2 O Timer 2 channel 2 output Disable remap with TIM2_OR[5], Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL[15:12] TIM2C2 I Timer 2 channel 2 input, Disable remap with TIM2_OR[5] 11 PA4 I/O Digital I/O ADC4 Analog ADC Input 4, Select analog function with GPIO_PACFGH[3:0] PTI_EN O Frame signal of Packet Trace Interface (PTI) Disable trace interface in ARM core, Enable PTI in Ember software Select alternate output function with GPIO_PACFGH[3:0] TRACEDATA2 O Synchronous CPU trace data bit 2 Select 4-wire synchronous trace interface in ARM core Enable trace interface in ARM core Select alternate output function with GPIO_PACFGH[3:0]
DFZM-E82xx Data Sheet Sheet 19 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 12 PA5 I/O Digital I/O ADC5 Analog ADC Input 5, Select analog function with GPIO_PACFGH[7:4] PTI_DATA O Data signal of Packet Trace Interface (PTI) Disable trace interface in ARM core, Enable PTI in Ember software Select alternate output function with GPIO_PACFGH[7:4] nBOOTMODE I Activate FIB monitor instead of main program or bootloader when coming out of reset. Signal is active during and immediately after a reset on nRESET. TRACEDATA3 O Synchronous CPU trace data bit 3 Select 4-wire synchronous trace interface in ARM core Enable trace interface in ARM core Select alternate output function with GPIO_PACFGH[7:4] 13 PA6 I/O Digital I/O, High current TIM1C3 O Timer 1 channel 3 output, Enable timer output in TIM1_CCER Select alternate output function with GPIO_PACFGH[11:8] TIM1C3 I Timer 1 channel 3 input, Cannot be remapped 14 GND Ground Ground 15 VCC Power Power Supply Input 16 PB1 I/O Digital I/O SC1MISO O SPI slave data out of Serial Controller 1 Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[4] Select SPI with SC1_MODE, Select slave with SC1_SPICR Select alternate output function with GPIO_PBCFGL[7:4] SC1MOSI O SPI master data out of Serial Controller 1 Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[4] Select SPI with SC1_MODE, Select master with SC1_SPICR Select alternate output function with GPIO_PBCFGL[7:4] SC1SDA I/O TWI data of Serial Controller 1, Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[4], Select TWI with SC1_MODE Select alternate open-drain output function with GPIO_PBCFGL[7:4] SC1TXD O UART transmit data of Serial Controller 1 Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[4]
DFZM-E82xx Data Sheet Sheet 20 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Select UART with SC1_MODE Select alternate output function with GPIO_PBCFGL[7:4] TIM2C1 O Timer 2 channel 1 output Enable remap with TIM2_OR[4], Enable timer output in TIM2_CCER Select alternate output function with GPIO_PACFGL[7:4] TIM2C1 I Timer 2 channel 1 input, Disable remap with TIM2_OR[4] 17 PB2 I/O Digital I/O SC1MISO I SPI master data in of Serial Controller 1 Select SPI with SC1_MODE, Select master with SC1_SPICR SC1MOSI I SPI slave data in of Serial Controller 1 Select SPI with SC1_MODE, Select slave with SC1_SPICR SC1SCL I/O TWI clock of Serial Controller 1, Either disable timer output in TIM2_CCER, or disable remap with TIM2_OR[5], Select TWI with SC1_MODE Select alternate open-drain output function with GPIO_PBCFGL[11:8] SC1RXD I UART receive data of Serial Controller 1, Select UART with SC1_MODE TIM2C2 O Timer 2 channel 2 output Enable remap with TIM2_OR[5], Enable timer output in TIM2_CCER Select alternate output function with GPIO_PBCFGL[11:8] TIM2C2 I Timer 2 channel 2 input, Enable remap with TIM2_OR[5] 18 SWCLK I/O Serial Wire clock input/output with debugger Selected when in Serial Wire mode (see JTMS description, Pin 35) JTCK I JTAG clock input from debugger Selected when in JTAG mode (default mode, see JTMS description, Pin 35) Internal pull-down is enabled 19 PC2 I/O Digital I/O, Enable with GPIO_DBGCFG[5] and GPIO_PCCFGH[1] clear JTDO O JTAG data out to debugger Selected when in JTAG mode (default mode, see JTMS description, Pin 35) SWO O Serial Wire Output asynchronous trace output to debugger Select asynchronous trace interface in ARM core, Enable trace interface in ARM core Select alternate output function with GPIO_PCCFGL[11:8] Enable Serial Wire mode (see JTMS description, Pin 35), Internal pull-up is enabled
DFZM-E82xx Data Sheet Sheet 21 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change TRACEDATA0 O Synchronous CPU trace data bit 3 , Select 4-wire synchronous trace interface in ARM core , Enable trace interface in ARM core , Select alternate output function with GPIO_PCCFGL[11:8]. 20 PC3 I/O Digital I/O, Either Enable with GPIO_DBGCFG[5] or enable Serial Wire mode (see JTMS description) JTDI I JTAG data in from debugger Selected when in JTAG mode (default mode, see JTMS description, Pin 35) Internal pull-up is enabled TRACECLK O Synchronous CPU trace clock , Enable trace interface in ARM core , Select alternate output function with GPIO_PCCFGL[15:12]. 21 PC4 I/O Digital I/O, Enable with GPIO_DBGCFG[5] JTMS I JTAG mode select from debugger, Selected when in JTAG mode (default mode) JTAG mode is enabled after power-up or by forcing nRESET low Select Serial Wire mode using the ARM-defined protocol through a debugger Internal pull-up is enabled SWDIO I/O Serial Wire bidirectional data to/from debugger Enable Serial Wire mode (see JTMS description) Select Serial Wire mode using the ARM-defined protocol through a debugger Internal pull-up is enabled 22 PB0 I/O Digital I/O(Not available for DFZM-E821X-DT0R) VREF Analog O ADC reference output, Enable analog function with GPIO_PBCFGL[3:0] VREF Analog I ADC reference input, Enable analog function with GPIO_PBCFGL[3:0] Enable reference output with an Ember system function IRQA I External interrupt source A TRACEDATA2 O Synchronous CPU trace data bit 2 Select 4-wire synchronous trace interface in ARM core Enable trace interface in ARM core, Select alternate output function with GPIO_PCCFGL[3:0] TIM1CLK I Timer 1 external clock input TIM2MSK I Timer 2 external clock mask input 23 PC1 I/O Digital I/O
DFZM-E82xx Data Sheet Sheet 22 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change ADC3 Analog ADC Input 3, Enable analog function with GPIO_PCCFGL[7:4] TRACEDATA3 O Synchronous CPU trace data bit 3 Select 1-, 2- or 4-wire synchronous trace interface in ARM core Enable trace interface in ARM core Select alternate output function with GPIO_PCCFGL[7:4] 24 PC0 I/O Digital I/O, High current, Either enable with GPIO_DBGCFG[5] or enable Serial Wire mode (see JTMS description, Pin 35) and disable TRACEDATA1 JRST I JTAG reset input from debugger Selected when in JTAG mode (default mode, see JTMS description) and TRACEDATA1 is disabled, Internal pull-up is enabled IRQD I Default external interrupt source D TRACEDATA1 O Synchronous CPU trace data bit 1 Select 2- or 4-wire synchronous trace interface in ARM core Enable trace interface in ARM core, Select alternate output function with GPIO_PCCFGL[3:0] 25 PB7 I/O Digital I/O, High current ADC2 Analog ADC Input 2, Enable analog function with GPIO_PBCFGH[15:12] IRQC I Default external interrupt source C TIM1C2 O Timer 1 channel 2 output, Enable timer output in TIM1_CCER Select alternate output function with GPIO_PBCFGH[15:12] TIM1C2 I Timer 1 channel 2 input, Cannot be remapped 26 PB6 I/O Digital I/O, High current ADC1 Analog ADC Input 1, Enable analog function with GPIO_PBCFGH[11:8] IRQB I External interrupt source B TIM1C1 O Timer 1 channel 1 output, Enable timer output in TIM1_CCER Select alternate output function with GPIO_PBCFGH[11:8] TIM1C1 I Timer 1 channel 1 input, Cannot be remapped 27 PB5 I/O Digital I/O(Not available for DFZM-E821X-DT0R) ADC0 Analog ADC Input 0, Enable analog function with GPIO_PBCFGH[7:4] TIM2CLK I Timer 2 external clock input TIM1MSK I Timer 1 external clock mask input
DFZM-E82xx Data Sheet Sheet 23 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 28 GND Ground Ground 5. Electrical Characteristics 5-1.Absolute Maximum Rating Conditions beyond those cited in Table 5-1 may cause permanent damage to the DFZM-E72xx, and must be avoided. Parameter Minimum Maximum Unit Supply voltage(VCC) -0.3 3.6 V Storage temperature range -40 125 ºC Voltage on any digitai I/O -0.3 VCC+0.3 V Table 5-1: Absolute Maximum Ratings 5-2.Recommended Operating Conditions Parameter Minimum Maximum Unit Operating supply voltage(VCC) 2.1 3.6 V Operating ambient temperature range(TA) -40 +85 ºC Table 5-2: Recommended Operating Conditions
DFZM-E82xx Data Sheet Sheet 24 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 5-3.Power Consumption Test Conditions: TA=25 ºC, VCC=3.0V Parameter Test conditions Mim Typ Max UnitDeep Sleep Current Quiescent current, internal RC oscillator disabled 1 uAQuiescent current, including internal RC oscillator 1.25 uASimulated deep sleep (debug mode) current With no debugger activity 500 uAReset Current Quiescent current, nRESET asserted 2 3 mAProcessor and Peripheral Currents ARM® Cortex-M3, RAM, and flash memory ARM® Cortex-M3 running at 24 MHz from crystal oscillator Radio and all peripherals off 8.5 mAARM® Cortex-M3, RAM, and flash memory sleep current ARM® Cortex-M3 sleeping, CPU clock set to 12 MHz from the crystal oscillator Radio and all peripherals off 7.5 mASerial controller current For each controller at maximum data rate 0.2 mAGeneral purpose timer current For each timer at maximum clock rate 0.25 mAGeneral purpose ADC current At maximum sample rate, DMA enabled 1.1 mARX Current Radio receiver, MAC, and baseband ARM® Cortex-M3 sleeping, CPU clock set to 12 MHz 22 mATotal RX current ( = IRadio receiver, MAC and baseband, CPU + IRAM, and Flash memory ) ARM® Cortex-M3 running at 24 MHz 26.531 mABoost mode total RX current ( = IRadio receiver, MAC and baseband, CPU+ IRAM, and flash memory ) ARM® Cortex-M3 running at 24 MHz 28.5 mA
DFZM-E82xx Data Sheet Sheet 25 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change TX current Radio transmitter, MAC, and baseband max. power out (+3 dBm typical) ARM® Cortex-M3 sleeping, CPU clock set to 12 MHz 26.0 mATotal TX current ( = IRadio transmitter, MAC and baseband, CPU + IRAM, and flash memory) maximum power setting (+8 dBm); ARM® Cortex-M3 running at 24 MHz 43.5 mAmaximum power setting (+18.5 dBm); ARM® Cortex-M3 running at 24 MHz 110 mATable 5-3: Poewr Consumption 5-4.Digital I/O and nRESET Pin Specifications Test Conditions: TA=25 ºC, VCC=3.0V Parameter Test conditions Min Typ Max UnitLow Schmitt switching threshold VSWIL, Schmitt input threshold going from high to low 0.42 x VCC 0.5 x VCC V High Schmitt switching threshold VSWIH, Schmitt input threshold going from low to high 0.62 x VCC 0.80 x VCC V Input current for logic 0 IIL -0.5 uAInput current for logic 1 IIH +0.5 uAInput pull-up resistor value RIPU 24 29 34 kΩInput pull-down resistor value RIPD 24 29 34 kΩOutput voltage for logic 0 VOL(IOL = 4 mA for standard pads, 8 mA for high current pads) 0 0.18 x VCC V >85 °C VOL(IOL = 2 mA for standard pads, 4 mA for high current pads) 0 0.18 x VCC V Output voltage for logic 1 VOH(IOH = 4 mA for standard pads, 8 mA for high current pads) 0.82 x VCC VCC V >85 °C VOH(IOH = 2 mA for standard pads, 4 mA for high current pads) 0.82 x VCC VCC V Output source current IOHS 4 mA
DFZM-E82xx Data Sheet Sheet 26 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Parameter Test conditions Min Typ Max Unit(standard current pad) Output sink current (standard current pad) IOLS 4 mAOutput source current high current pad: PA6, PA7, PB6, PB7, PC0 IOHH 8 mAOutput sink current high current pad: PA6, PA7, PB6, PB7, PC0 IOLH 8 mATotal output current (for I/O Pads) IOH + IOL 40 mATable 5-4: Digital I/O Specifications Parameter Test conditions Min Typ Max UnitLow Schmitt switching threshold VSWIL, Schmitt input threshold going from high to low 0.42 x VCC 0.5 x VCC V High Schmitt switching threshold VSWIH, Schmitt input threshold going from low to high 0.62 x VCC 0.68 x VCC V Input current for logic 0 IIL -0.5 uAInput current for logic 1 IIH +0.5 uAInput pull-up resistor value RIPU, Pull-up value while the chip is not reset 24 29 34 kΩInput pull-down resistor value RIPURESET, Pull-up value while the chip is reset 12 14.5 17 kΩTable 5-5: nRESET pin Specifications 5-5.Wake-up and Timing Test Conditions: TA=25 ºC, VCC=3.0V Parameter Test conditions Min Typ Max UnitSystem wake time from deep sleep From wakeup event to first ARM® Cortex-M3 instruction running from 6 MHz internal RC clock Includes supply ramp 110 us
DFZM-E82xx Data Sheet Sheet 27 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Parameter Test conditions Min Typ Max Unittime and oscillator startup time Shutdown time going into deep sleep From last ARM® Cortex-M3 instruction to deep sleep mode 5 us Table 5-6: Wake-up and Timing 5-6.Radio Parameters Test Conditions: TA=25 ºC, VCC=3.0V Parameter Min Typ Max Unit Notes RF Frequency range 2400 2500 MHz TX/RX specification for DFZM-E822x Output power(boost mode) 1 8 dBm Output power -3 5 dBm Error vector magnitude (EVM) 5 15 % Frequency error tolerance -30 0 30 ppm Receiver sensitivity(boost mode) -102 -96 dBm PER = 1% Receiver sensitivity -100 -94 dBm PER = 1% Saturation(Maximum input level) 0 dBm PER = 1%, TX/RX specification for DFZM-E821x Output power 16 17.5 23 dBm Error vector magnitude (EVM) 5 15 % Frequency error tolerance -30 0 30 ppm Receiver sensitivity(boost mode) -102 -96 dBm PER = 1%, Saturation(Maximum input level) 0 dBm PER = 1%, Table 5-7: Radio Parameters
DFZM-E82xx Data Sheet Sheet 28 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 5-7.ADC Parameters Test Conditions: TA=25 ºC, VCC=3.0V Parameter Min Typ Max Unit VREF 1.17 1.2 1.23 V VREF output current 1 mA VREF load capacitance 10 nF External VREF voltage range 1.1 1.2 1.3 V External VREF input impedance 1 MΩ Minimum input voltage 0 V Maximum input vlotage VREF V Single-ended signal range 0 VREF V Differential signal range -VREF +VREF V Common mode range 0 VREF V Input referred ADC offset -10 10 mV Input Impedence 1MHz sample clock 6MHz sample clock Not sample 1 0.5 10 MΩ *Note: The signal-ended ADC measurements are limited in their range and only guaranteed for accuracy within the limits shown in this table. The ADC's internal design allows for measurements outside of this range (±200 mV), but the accuracy of such measurements is not guaranteed. The maximum input voltage is of more interest to the differential sampling where a differential measurement might be small, but a common mode can push the actual input voltage on one of the signals towards the upper voltage limit. Table 5-8: ADC Parameters
DFZM-E82xx Data Sheet Sheet 29 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 6. Package and Layout Guidelines 6-1.Recommended PCB Footprint and Dimensions Figure 6-1: DFZM-E82xx Module Recommended PCB Footprint (in mm)
DFZM-E82xx Data Sheet Sheet 30 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Figure 6-2: DFZM-E821x Module Dimensions (in mm)
DFZM-E82xx Data Sheet Sheet 31 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change Figure 6-3: DFZM-E822x Module Dimensions (in mm)
DFZM-E82xx Data Sheet Sheet 32 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 6-2.Layout Guidelines Figure 6-4: DFZM-E82xx module onboard antenna keep-out layout guidelines (in mm) Notes: 1. All Dimensions are in mm. Tolerances shall be ±0.10 mm. 2. Absolutely no metal trace or ground layer underneath this area. 3. It is recommended not to run circuit traces underneath the module. 4. In performing SMT or manual soldering of the module to the base board, please align the two row of pins. In addition to the guidelines in Figure 6-4, note the following suggestions: DFZM-E82xx  External Bypass capacitors for all module supplies should be as close as possible to the module pins.  Never place the antenna very close to metallic objects.  The external dipole antennas need a reasonable ground plane area for antenna efficiency. DFZM-E8221; DFZM-E8211 onboard antenna specific Keep out area for onboard antenna. All layers on the PCB must be clear. (i.e. No GND, Power trace/plane, traces.) Note: If guidelines are not followed, DFZM-E72xx range with onboard antenna will be compromised.
DFZM-E82xx Data Sheet Sheet 33 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change  The onboard antenna keep out area, as shown in Figure 6-4, must be adhered to. In addition it is recommended to have clearance above and below the PCB trace antenna (Figure 6-4) for optimal range performance.  Do not use a metallic or metalized plastic for the end product enclosure.  Recommendation is to keep plastic enclosure clearance of 1cm from top and bottom of the DFZM-E82xx onboard antenna keep-out area, if possible. 5-mm (0.2 in) clearance shall be the minimum as shown in Figure 6-5. Figure 6-5 Recommended clearance above and below the PCB trace antenna 6-2-1.Surface Mount Assembly The reflow profile is shown in Figure 6-6.
DFZM-E82xx Data Sheet Sheet 34 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 60-180 secRoom temp.50 sec max150200245217(°C )60-150 secTimePeak temp250°c max 10 sec max245°c±5°c for 10 ~30 sec Figure 6-6: Reflow temperature profile Note: 1. Perform adequate test in advance as the reflow temperature profile will vary accordingly to the conditions of the parts and boards, and the specifications of the reflow furnace. 2. Be careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste. 3. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will generate in clusters at a time. 4. If the temperature is too low, non-melting tends to be caused in the area with large heat capacity after reflow. 5. Be careful about sudden rise in temperature as it may worsen the slump of solder paste. 6. Be careful about slow cooling as it may cause the positional shift of parts and decline in joining strength at times.
DFZM-E82xx Data Sheet Sheet 35 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 6-3.Recommended Stencil Aperture Note: The thickness of the stencil should be 0.15mm over this area. Figure 6-7: DFZM-E82xx recommended PCB footprint ( in mm )
DFZM-E82xx Data Sheet Sheet 36 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 7. Ordering Information DEVICE DESCRIPTION ORDERING NUMBER Extended range module using external antenna DFZM-E8210-DT0R Extended range module using onboard antenna DFZM-E8211-DT0R Low power module using external antenna DFZM-E8220-DT0R Low power module using onboard antenna DFZM-E8221-DT0R 8. Package 8-1.Information of carrier tape direction&packaging dimension
DFZM-E82xx Data Sheet Sheet 37 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 36PS5412687Protective Tape(width=56mm,Thickness=0.5mm)Adhesive TapeCarrier tapeAcceptedCUSTOMER:MODEL:Q'TY:DATE:FQC:RoHS Compliant PbComponents◆ Quantity:750pcsLeader20PCS minCover tape54Trailer20PCS(min)1ReelAcceptedCUSTOMER :MODEL:Q'TY:DATE:FQC:RoHS Compliant Pb236Unreeling directionZL:200620003605.7ZL:200620003605.7DFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNN10-DT0R H79DF ZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNNDFZM-TS210-DT0RFCC ID : H79DFZM-TS210YYWWNNNNN
DFZM-E82xx Data Sheet Sheet 38 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change W0W1ZL:200620003605.7規 格 品 名W1W0瑋鋒編號13" 100*44mm旋轉式圓盤 50.0±1.045.0±0.5RUR-26-3-XL* 代表顏色編碼 B 黑色 , C 寶藍色 ﹐L 藍色﹐W 白色 8-2.Reel dimension
DFZM-E82xx Data Sheet Sheet 39 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 8-3.Total Package
DFZM-E82xx Data Sheet Sheet 40 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change 8-4. RF exposure warning statement FCC Label Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not
DFZM-E82xx Data Sheet Sheet 41 of 41 Dec 31, 2013 Proprietary Information and Specifications are Subject to Change be co-located or operating in conjunction with any other antenna or transmitter.

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