Digi 50M880 802.11b Wireless Module User Manual DC ME HWR

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Digi Connect ME® &
Digi Connect® Wi‐ME
Digi Connect ME® 9210
Hardware Reference
90000897_F
© Digi International Inc. 2004 -2007. All Rights Reserved.
The Digi logo is a registered trademark of Digi International, Inc.
Connectware and Digi Connect ME and Digi Connect Wi-ME are trademarks of Digi International, Inc.
NetSilicon, NET+Works, NET+OS, and NET+ are trademarks of NetSilicon, Inc.
All other trademarks mentioned in this document are the property of their respective owners.
Information in this document is subject to change without notice and does not represent a commitment on the part of Digi
International.
Digi provides this document “as is,” without warranty of any kind, either expressed or implied, including, but not limited to,
the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes
in this manual or in the product(s) and/or the program(s) described in this manual at any time.
This product could include technical inaccuracies or typographical errors. Changes are periodically made to the information
herein; these changes may be incorporated in new editions of the publication.
Contents
About This Document ................................................................................................................ 6
Related Documentation .................................................................................................... 6
Support Information ......................................................................................................... 7
Chapter 1:
About the Digi Connect ME Family of Embedded Modules ......................... 8
Overview .......................................................................................................................... 8
Types of Modules............................................................................................................. 9
Connectors: Power and Device Interface ....................................................................... 11
Connectors: Ethernet Interface....................................................................................... 14
Connectors: Antenna ...................................................................................................... 15
Module LEDs ................................................................................................................. 16
Chapter 2:
About the Development Board ....................................................................... 18
Overview ........................................................................................................................ 18
Basic Description ........................................................................................................... 19
Port Descriptions ............................................................................................................ 22
Connectors and Blocks................................................................................................... 25
Switches.......................................................................................................................... 31
Development Board LEDs ............................................................................................. 32
Power Jack...................................................................................................................... 35
Test Points ...................................................................................................................... 36
Chapter 3:
Programming Considerations......................................................................... 38
Overview ........................................................................................................................ 38
Module Pinout ................................................................................................................ 39
LEDs............................................................................................................................... 41
Reset ............................................................................................................................... 41
Memory .......................................................................................................................... 43
„„„„„„„
Appendix A Module Specifications.................................................................................... 46
Network Interface .......................................................................................................... 46
Serial Interface ............................................................................................................... 47
Data Rates (bps) ............................................................................................................. 47
Flow Control Options..................................................................................................... 47
DC Characteristics ......................................................................................................... 47
Power Management (Connect ME-9210 only) .............................................................. 50
Thermal Specifications .................................................................................................. 51
Mechanical ..................................................................................................................... 53
Bar Code ........................................................................................................................ 53
Dimensions..................................................................................................................... 53
Recommended PCB Layout........................................................................................... 59
Antenna Information ...................................................................................................... 61
RF Exposure Statement.................................................................................................. 65
Safety Statements........................................................................................................... 65
Appendix B
Certifications.................................................................................................. 68
FCC Part 15 Class B ...................................................................................................... 68
Industry Canada ............................................................................................................. 69
Declaration of Conformity ............................................................................................. 70
International EMC Standards......................................................................................... 71
Appendix C Sample Application: PoE Power Supply ..................................................... 74
Appendix D Sample Application: TTL Signals to EIA-232 ............................................ 76
Appendix E
Change Log .................................................................................................... 78
Revision F ...................................................................................................................... 78
Revision E ...................................................................................................................... 78
Revision D...................................................................................................................... 78
Revision C...................................................................................................................... 79
Revision B...................................................................................................................... 79
Revision 90000631_G>90000897_A ............................................................................ 79
Revision G...................................................................................................................... 79
Revision F ...................................................................................................................... 80
Revision E ...................................................................................................................... 80
„„„„„„„
About This Document
••••••••••••••••••••••••••••••••••••••••••••••••••••••••
Scope of the Reference Manual
The purpose of this document is to enable developers to integrate the Digi Connect ME,
Digi connect ME 9210, or Digi Connect Wi-ME embedded modules with other devices,
enabling these devices to make use of the module’s rich networking features.
Note:
Unless mentioned specifically by name, the products will be referred to as the
embedded modules or modules. Individual naming is used to differentiate
product specific features. Unless noted otherwise, all Digi Connect ME
related technical information provided in this document also applies to
the Digi Connect ME 9210 module.
Related Documentation
See the NS7520 Hardware Reference for information on the NS7520 chip.
See the NS9210 Hardware Reference for information on the NS9210 chip.
„„„„„„„
Support Information
To get help with a question or technical problem or make comments and recommendations
about Digi products and documentation, use the following contact information.
General
Digi International
United States: 1 877-912-3444
11001 Bren Road East
Other Locations: 1 952-912-3444
Minnetonka, MN 55343
www.digi.com/support/eservice/
eservicelogin.jsp
U.S.A.
„„„„„„„
Customer Service and Support
About the Digi Connect ME
Family of Embedded
Modules
Overview
The embedded modules provide fully transparent device connectivity over industrystandard Ethernet connections and allows both equipment manufacturers and systems
integrators to network-enable products at a fraction of the time and cost required to develop
a custom solution. It is a highly flexible and compact single component solution with a
serial port, GPIO, and a robust on-board TCP/IP stack and 10/100 BASE-T Ethernet
support or wireless interface.
Built on Digi's leading 32-bit NET+ARM processor technology, the Digi Connect ME
family of embedded modules offer serial-to-Ethernet functionality through Digi’s Plugand-Play Firmware firmware, or the freedom and flexibility of professional embedded
software development provided by the easy-to-use, cost-effective and complete Digi
JumpStart Kits™ for NET+OS and Microsoft .NET Micro Framework.
The Digi Connect ME and Digi Connect Wi-ME modules are utilizing the powerful Digi
NS7520 processor with an ARM7TDMI core running at 55 MHz. They provide integrated
wired or wireless networking and serial device connectivity in a compact connector-style
form factor. The Digi Connect ME 9210 module is the latest, fully form factor and pin
compatible, member of the Digi Connect ME family providing 75 MHz ARM9 core
performance based on the Digi NS9210 processor. In addition to higher performance with
integrated Ethernet connectivity, the Digi Connect ME 9210 offers higher serial data rates,
„„„„„„„
SPI functionality, as well as the unique option of application specific interfaces using the
programmable FIMs on the NS9210.
From medical systems to building control and industrial automation, in virtually any
application where embedded device connectivity over Ethernet or wireless connectivity is
needed, embedded modules are the ideal choice, delivering high-performance functionality.
Note:
Unless mentioned specifically by name, the products will be referred to as the
embedded modules or modules. Individual naming is used to differentiate product
specific features. Similarily, information about the Connect ME applies to the
Connect ME 9210 as well unless stated otherwise.
This chapter provides information about the modules hardware and contains the following
topics:
„
"Types of Modules" on page 9
„
"Connectors: Antenna" on page 15
„
"Connectors: Ethernet Interface" on page 14
„
"Module LEDs" on page 16
Types of Modules
There are two types of modules. One module utilizes Digi Plug-and-Play Firmware, while
the second is customizable with the option to develop a firmware applicaton in .NET MF or
NET+OS. If you are developing your firmware application in NET+OS, you will be using a
module with a JTAG interface.
Note:
JTAG is a commonly used term that is also referred to as IEEE 1149.1, an industry
standard test protocol. JTAG is an abbreviation for the European Joint Test Action
Group, which invented the first versions of the IEEE 1149.1 interface. The JTAG
interface, along with the other development tools, enables you to download, run
and debug programs on the module.
The following figures show the two types of modules.
„„„„„„„
Digi Connect ME Modules
Model
Description
Digi Connect ME
DC-ME-01T-JT
DC-ME4-01T-JT
Digi Connect ME 9210
DC-ME-Y401-JT
DC-ME-Y402-JT
Digi Connect ME
DC-ME-01T-S
DC-ME4-01T-S
DC-ME-01T-C
DC-ME4-01T-C
DC-ME-01T-MF
Digi Connect ME 9210
DC-ME-Y401-C
DC-ME-Y402-C
„
Used for development
purposes only
„
JTAG interface
„
No JTAG interface
„
Ordered
independently for use
in your
implementation
Figure
„„„„„„„
10
Digi Connect Wi-ME Modules
Model
Description
„
Used for development
purposes only
„
JTAG interface
„
No JTAG interface
„
Ordered
independently for use
in your
implementation.
DC-WME-01T-JT
DC-WME-01T-S
DC-WME-01T-C
Note:
Figure
-S: No JTAG for use with Digi Plug-and-Play Firmware
-C: No JTAG for use with custom NET+OS applications
-JT: With JTAG for use with custom firmware development-MF: No JTAG for use with Microsoft .NET Micro Framework
Connectors: Power and Device Interface
The module has a 20-pin male connector that supports a serial interface with data rates up
to 230,400 (Digi Connect ME)/ 921,600 bps (Digi Connect ME 9210) and full-modem
11
„„„„„„„
control, and GPIO ports. See the following figure for pin orientation and the table for pin
assignments.
Difference in pin assignments/availability
Pin assignments/availability for pins 1 and 2 depend on which module you are using. Pins 1
and 2 are available for Digi Connect ME; these pins are removed for Digi Connect Wi-ME.
The pin assignment table shows the appropriate values.
Power and Device Interface Connector
Pin 1
Pin 2
Pin 19
Pin 20
Bottom view
00000019
Module
front
Power and Device Interface Connector Pin Assignments
Signal
Pin
Description
ME
Wi-ME
VETH+
—
ME: Power Pass-Thru+
Wi-ME: Position Removed
VETH-
—
ME: Power Pass-ThruWi-ME: Position removed
—
—
Position removed
3-6
„„„„„„„
12
Power and Device Interface Connector Pin Assignments
Signal
Pin
Description
ME
Wi-ME
RXD
RXD
Receive Data (Input)
TXD
TXD
Transmit Data (Output)
RTS
RTS
Request to Send (Output)
10
DTR
DTR
Data Terminal Ready (Output)
11
CTS
CTS
Clear to Send (Input)
12
DSR
DSR
Data Set Ready (Input)
13
DCD
DCD
Data Carrier Detect (Input)
14
/RESET
/RESET
Reset
15
+3.3V
+3.3V
Power
16
GND
GND
Ground
Not accessible with Digi Plug-and-Play
Firmware. If using a development kit, see
"Module Pinout" on page 39 for detailed IO
configuration information.
17, 18
19
20
13
„„„„„„„
Reserved. Do not connect.
/INIT
/INIT
Software Reset
Note:
The development board provides connectors for an optional PoE application kit.
Note:
Any pins not used can be left floating.
Note:
See "Module Pinout" on page 39 for detailed IO configuration information.
Connectors: Ethernet Interface
The Ethernet connector is an 8-wire RJ-45 jack that meets the ISO 8877 requirements for
10/100BASE-T. See the following figure and table for pin orientation and pin assignments.
Note:
Pin orientation and assignments are the same for modules with or without a JTAG
connector.
Ethernet Interface Pin Orientation
Ethernet Interface Pin Assignments
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
TXD+
TXD-
RXD+
EPWR+
EPWR+
RXD-
EPWR-
EPWR-
Transmit
Data +
Transmit
Data -
Receive
Data +
Power
from
Switch +
Power
from
Switch +
Receive
Data -
Power
from
Switch -
Power
from
Switch -
„„„„„„„
14
Hard Reset
The embedded modules support a hardware reset on pin 14 of the 20-pin header. Pulling
pin 14 low with an open drain driver will force the module into a hard reset state. The
module will remain in the reset state as long and pin 14 is held low and will leave this reset
state ~250mS after pin 14 goes high. Do not actively drive pin 14 high and do not allow the
rise time of the pin 14 to be longer than 100uS. When used with the development board,
this pin is wired to reset button SW4, which means it acts as a hard reset button.
Connectors: Antenna
The Digi Connect Wi-ME is available with 1 RP-SMA connector. The antenna is
connected to the module with a reverse polarity SMA connector (sub-miniature size A).
The antenna only fits on the module one way to ensure a proper connection. Another option
for both signal reception and design flexibility is to use an antenna extension cord to
separate the antenna from the module. This allows the module to fit inside your product but
the antenna to be placed outside the device.
Caution: This Part 15 radio device operates on a non-interference basis
with other devices operating at this frequency when using the antennae
listed in the Antenna Specification table. Any changes or modification to
the product not expressly approved by Digi International could void the
user’s authority to operate the device.
Antenna Specifications
15
„„„„„„„
Type
Desktop
Dipole
30 cm
Antenna Extension Cord
Part number
DC-ANT-24DT
DG-ANT-20DP-BG
DG-EXT-300-RR
Gain
1.8 dBi
2 dBi
-.5dB
Module LEDs
The module has two LEDs that are located near the upper corners of the Ethernet port (see
the following figure). The following table describes the LEDs.
Note:
The LEDs are the same for a module with or without a JTAG connector.
LED Locations
„„„„„„„
16
LED Behaviors
LED
17
Pin
Header
EM
Digi Plug-and Play Firmware
Digi Connect ME
Digi Plug-and Play Firmware
Digi Connect Wi-ME
Customizable
Modules
Network link status:
On - unit is associated with an access
point.
Blinking slowly - unit is in ad hoc
mode.
Blinking quickly - unit is scanning
for a network.
Same as Digi Plugand Play Firmware
(Network link
status).
Top left
(yellow)
5 (+)
7 (-)
Network link status:
Off - no link has been detected.
On - a link has been detected.
Top
right
(green)
1 (+)
3 (-)
Network activity:
Blinking -network data is transmitted or received.
„„„„„„„
This LED is
software
programmable.
About the Development
Board
Overview
The development board is a hardware platform from which you can determine how to
integrate the embedded modules into your design. The board consists of the following main
features:
„
Socket for connecting the embedded modules
„
JTAG connection (for use with the development kit only)
„
GPIO switches
„
Serial and GPIO ports
„
Power input
This chapter provides information on development board components and contains the
topics listed below. For more detailed information on the development board, see the
schematic and mechanical drawings on the CD that accompanies your kit. Once you’ve
installed the software that comes with your kit, you can access the schematic from the Start
menu.
„
"Basic Description" on page 19
„
"Placement of Module" on page 22
„
"Connectors and Blocks" on page 25
„
"Switches" on page 31
„
"Development Board LEDs" on page 32
„
"Power Jack" on page 35
„
"Test Points" on page 36
„„„„„„„
18
Basic Description
The development board contains connectors, switches, and LEDs for use while integrating
the embedded module into your design. See the following figure for the location of the
connectors, switches, and LEDs. Additionally, the board provides test points (not shown on
the figure). For more information about test points, see "Test Points" on page 36.
Board Layout and Connector Locations:
TP6
P2
C2
U2
U1
C4
TP2
C3
C1
18
C5
U3
R1
CR1
CR3
CR2
CR4
TP3
CR17
P1
CR11
CR18
R2
CR15
CR9
TP7
TP8
CR5
CR7
CR13
CR16
CR12
CR10
TP5
TP4
CR6
CR8
CR14
TP9
TP10
RN1
RN2
C6
C7
P4
12
U5
SW3
R14
CR21
D1
C12
C11
C10
11
CR22
D2
CR23
C14
D3
C15
R5
C13
CR20
C9
R4
SW2
CR19
C8
R18
R16
R17
P3
SW1
P5
U4
R15
10
D4
U6
C16
D5
R6
15
C20
P7
C21
C18
RN3
D6
C17
D7
C19
C22
L1
P10
P11
C23
C26
U7
P13
P14
D9
19
C29
R8
R7 C30
L2
VR1
R10
R9
D10
R19
SW5
R12
C24
CR24
SW4
CR25
P15
P9
TP1
„„„„„„„
TP13
C27
C25
14
17
R13
TP12
P12
TP11
19
C31
R11
D8
C28
20
P8
13
21
16
Connectors, Switches and LEDs
Board Description Markers 1-5
Primary Port
Secondary
LEDs, CR5 Serial Port, P2
CR18
GPIO Switch
Bank, SW3
Prototyping
Area, P4
JTAG
Header, P12
Connectors, Switches and LEDs
Board Description (continued) Markers 6-10
232 Enable
Jumper
Block, P5
Embedded
Module
Connector,
P10
ME JTAG
Connector,
P11
10
Primary
Serial Port, P1
GPIO Port, P7
Connectors, Switches and LEDs
Board Description (continued) Markers 11-15
11
12
Digital I/O
Logic
LEDs, CR19 - Analyzer
CR23
header, P3
13
POE Source
LED, CR24
14
15
Reset Switch,
SW4
User
Pushbuttons,
SW1 & SW2
Connectors, Switches and LEDs
Board Description (continued) Markers 16-21
16
Power Jack,
P15
17
On/Off
switch, SW5
18
Secondary
Port LEDs
CR1-CR4
19
-48V DC
output from
ME module
P13
20
12V output
from PoE
module P14
21
Current
Measurement
Option P8
„„„„„„„
20
„
"Port Descriptions" on page 22
„
"Connectors and Blocks" on page 25
„
"Switches" on page 31
„
"Development Board LEDs" on page 32
„
"Power Jack" on page 35
See the following figures for placement of either module onto the development board.
21
„„„„„„„
Placement of Module
Caution: When handling the development board, wear a grounding wrist
strap to avoid ESD damage to the board.
Port Descriptions
The development board provides the following ports:
„
Primary Serial Port, P1
„
Secondary Serial Port, P2
„
GPIO Port, P7
See the figure titled "Board Layout and Connector Locations:" on page 19 for the location
of the ports. The following sections describe the ports.
„„„„„„„
22
Primary Serial Port, P1
The Primary Serial Port is a DB-9 male connector that is labeled as P1 on the development
board. See the following figure for pin orientation; see the following table for pin
assignments.
Primary Serial Port Pin Orientation
Pin 1
Pin 5
Pin 6 Pin 9
Primary Serial Port Pin Assignments
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
DCD
RXD
TXD
DTR
GND
DSR
RTS
CTS
—
Data
Carrier
Detect
Receive
Data
Transmit
Data
Data
Terminal
Ready
Signal/
Chassis
Ground
Data Set
Ready
Request
To Send
Clear To
Send
—
Secondary Serial Port, P2
The Secondary Serial Port is a DB-9 male connector that is labeled as P2 on the
development board. The port is used only with the Digi Connect ME modules with JTAG
interfaces for debugging purposes. See the following figure for pin orientation; see the
following table for pin assignments.
23
„„„„„„„
Secondary Serial Port Pin Orientation
Pin 1
Pin 5
Pin 6 Pin 9
Secondary Serial Port Pin Assignments
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
—
RXD
TXD
—
GND
—
—
—
—
—
Receive
Data
Transmit
Data
—
Signal/
Chassis
Ground
—
—
—
—
RS232-Enable Pin Header, P5
When enabled, P5 connects the TTL signals to the RS232 transceiver allowing for RS232
communication on Serial Port 1. When the jumper is removed, the transceiver is no longer
connected and the load is removed from the TTL lines.
GPIO Port, P7
The GPIO port is a 9-pin male right-angle connector that is labeled as P7 on the
development board. See the following figure for pin orientation; see the following tables
for pin assignments. For input and output threshold specifications, see "DC Characteristics"
on page 47.
„„„„„„„
24
The development board is shipped with a 9-pin screw-flange plug attached to
the GPIO port.
Note:
GPIO Port Pin Orientation
Pin 1
Pin 9
GPIO Port Pin Assignments
Signal
Pin
Pin
Pin
Pin
GPIO-1
GND
GPIO-2
GND
Pin
Pin
Pin
Pin
Pin
GPIO-3 TXD_TTL GPIO-4 RXD_TTL GPIO-5
Connectors and Blocks
The development board provides the following connectors and blocks:
25
„„„„„„„
„
Embedded Module Connector, P10
„
The Digi Connect Wi-ME module does not provide pins 1-6
„
JTAG Debugger Connector, P12.
„
-48V DC input to PoE module (ME must be connected to a Powering Device
for this feature.), P13
„
12V DC output from PoE module into Dev Board Power Supply, P14
„
Logic Analyzer Header, P3
See the figure titled "Board Layout and Connector Locations:" on page 19 for the location
of the connectors and blocks. The following sections describe the connectors and blocks.
Embedded Module Connector, P10
The Digi Connect ME embedded module Connector is a 20-pin female vertical header that
is labeled P10 on the development board. See the following figure for pin orientation; see
the following table for pin assignments.
The figure shows the connector using the same orientation as shown in the
figure titled "Board Layout and Connector Locations:" on page 19.
Note:
Embedded Module Connector Pin Orientation
Pin 19
Pin 20
Pin 1
Pin 2
Module Connector Pin Assignments
Signal
Pin
Description
ME
Wi-ME
VETH+
—
ME: Power Pass-Thru +
Wi-ME: Position removed
VETH-
—
ME: Power Pass-Thru Wi-ME: Position removed
3-6
Position Removed
RXD
RXD
Receive Data (Input)
TXD
TXD
Transmit Data (Output)
„„„„„„„
26
Module Connector Pin Assignments
Signal
Pin
Description
ME
Wi-ME
RTS
RTS
Request to Send (Output)
10
DTR
DTR
Data Terminal Ready (Output)
11
CTS
CTS
Clear to Send (Input)
12
DSR
DSR
Data Set Ready (Input)
13
DCD
DCD
Data Carrier Detect (Input)
14
/RESET
/RESET
Reset
15
+3.3V
+3.3V
Power
16
GND
GND
Ground
Not accessible with Digi Plug-and-Play
Firmware. If using a development kit, see
"Module Pinout" on page 39 for detailed
IO configuration information.
17, 18
19
20
27
„„„„„„„
Reserved
/INIT
/INIT
Digi Plug-and-Play Firmware Software
Reset
Note:
The Digi Connect Wi-ME module does not provide pins 1-6
Note:
See "Module Pinout" on page 39 for detailed IO configuration information.
Module JTAG Interface Connector, P11
The Module JTAG Interface Connector is a 14-pin female vertical header that is labeled
P11 on the development board. The connector mates with the JTAG connector on the Digi
Connect ME embedded module. The Module JTAG Connector pins are tied to the JTAG
debugger Connector (see “JTAG Debugger Connector, P12”).
Because there is no direct connection to the Module JTAG Interface
Connector, pin orientation and pin assignments are not described for the
connector.
Note:
JTAG Debugger Connector, P12
The JTAG debugger connector is a 20-pin male vertical header that is labeled P12 on the
development board. The connector mates with a JTAG debugger plug (for example, a Digi
JTAG Link). The connector is used with the development kit only. See the following figure
for pin orientation. See the following table for pin assignments.
The figure shows the connector using the same orientation as shown in the
figure titled "Board Layout and Connector Locations:" on page 19.
Note:
JTAG Debugger Connector Pin Orientation
Pin 19
Pin 1
Pin 20
Pin 2
JTAG Debugger Connector Pin Assignments
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
VCC+
VCC+
/TRST
GND
TDI
GND
TMS
GND
TCK
GND
„„„„„„„
28
JTAG Debugger Connector Pin Assignments
29
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Pin 11
Pin 12
Pin 13
Pin 14
Pin 15
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
RTCK
GNO
TDO
GND
/SRST
GNO
N/A
GND
N/A
GND
„„„„„„„
Logic Analyzer Header, P3
The Logic Analyzer Header is a 20-pin male vertical header that is labeled P3 on the
development board. The header is for connecting a digital signal analyzer (for example, a
logic analyzer) to the development board. See the following figure for pin orientation; see
the following table for pin assignments.
The figure shows the connector using the same orientation as shown in the
figure titled "Board Layout and Connector Locations:" on page 19.
Note:
Logic Analyzer Header Pin Orientation
Logic Analyzer Header Pin Assignments
Pin
Pin
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin
Pin
10
V_Ether+
V_Ether-
Not
Connected
Not Connected
Not
Connected
Not
Connected
RXD
TXD
GPIO-4
GPIO-5
Pin
11
Pin
12
Pin
13
Pin
14
Pin
15
Pin
16
Pin
17
Pin
18
Pin
19
Pin
20
Reserved
/INIT
GPIO-2
GPIO-3
GPIO-1
/RST
3.3v
GND
See "Power and
Device Interface
Connector Pin
Assignments" on
page 12 for details.
„„„„„„„
30
Switches
The development board provides the following switches:
„
GPIO Switch Bank 1, SW3
„
Reset, SW4
See the figure titled "Board Layout and Connector Locations:" on page 19 for the location
of the switches. The following sections describe the switches.
GPIO Switch Bank 1, SW3
GPIO Switch Bank 1, labeled SW3, is a set of five slide switches that allows the Digi
Connect ME embedded module to use either serial signals or GPIO signals to communicate
with a device.
GPIO Switch Bank 1 Settings
Left Position
Right Position
DCD
GPIO-1
CTS
GPIO-2
DSR
GPIO-3
RTS
GPIO-4
DTR
GPIO-5
Switch
Number
31
„„„„„„„
Reset, SW4
The Reset switch is a push button switch labeled SW4 on the development board. Pressing
the switch holds the Digi Connect ME embedded module in reset. When the push button is
released, the module reboots.
Development Board LEDs
The development board contains 25 LEDs that are labeled CR1 through CR25. The
following table lists and describes the LEDs.
Development Board LED Descriptions
Board
Label
CR1
CR2
CR3
CR4
CR5
Description
Color or
State
Indication
On
Logic 1 on TTL
Off
Logic 0 on TTL
On
Logic 0 on TTL
Off
Logic 1 on TTL
On
Logic 1 on TTL
Off
Logic 0 on TTL
On
Logic 0 on TTL
Off
Logic 1 on TTL
On
Logic 0 on line side
Off
Logic 1 on line side
TXD, Secondary Serial Port
TXD, Secondary Serial Port
RXD, Secondary Serial Port
RXD,Secondary Serial Port
DCD, Primary Serial Port
„„„„„„„
32
Development Board LED Descriptions
Board
Label
CR6
CR7
CR8
CR9
CR10
CR11
CR12
CR13
33
„„„„„„„
Description
Color or
State
Indication
On
Logic 1 on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1 on line side
On
Logic 1 on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1 on line side
On
Logic 1 on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1 on line side
On
Logic 1 on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1on line side
DCD, Primary Serial Port
DSR, Primary Serial Port
DSR, Primary Serial Port
CTS, Primary Serial Port
CTS, Primary Serial Port
RXD, Primary Serial Port
RXD, Primary Serial Port
DTR, Primary Serial Port
Development Board LED Descriptions
Board
Label
CR14
CR15
CR16
CR17
CR18
CR19
CR20
CR21
Description
Color or
State
Indication
On
Logic 1on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1on line side
On
Logic 1on line side
Off
Logic 0 on line side
On
Logic 0 on line side
Off
Logic 1 on line side
On
Logic 1 on line side
Off
Logic 0 on line side
On
Logic 1
Off
Logic 0
On
Logic 1
Off
Logic 0
On
Logic 1
Off
Logic 0
DTR, Primary Serial Port
RTS, Primary Serial Port
RTS, Primary Serial Port
TXD, Primary Serial Port
TXD Primary Serial Port
GPIO 1
GPIO 2
GPIO 3
„„„„„„„
34
Development Board LED Descriptions
Board
Label
CR22
CR23
CR24
CR25
Description
Color or
State
Indication
On
Logic 1
Off
Logic 0
On
Logic 1
Off
Logic 0
On
3.3v present from POE
Off
No POE present
On
3.3v present
Off
No 3.3v present
GPIO 4
GPIO 5
3.3v LED
3.3v LED
Power Jack
The Power Jack is a barrel connector that accepts 9 to 30 VDC +/- 5%. The jack is labeled
as P15 on the development board. The following table shows the polarity of the power jack.
Power Jack Polarity
Contact
Polarity
Center
+9 to +30 VDC
Outer
Ground
The following figure schematically represents the polarity of the power jack.
35
„„„„„„„
Power Jack Polarity, Schematic
Ground
00000014
+9 to +30 VDC
Test Points
The development board provides 13 test points that can be identified by a board label . The
test point numbers are in the development board schematic drawings. The following table
lists the test point number, board label, and a brief description of each test point.
Test Point Descriptions
Test
Point
Board Label
Description
TP2
TXD
TXD-2, Transmit,
Secondary Serial Port
TP3
RXD
RXD-2, Receive,
Secondary Serial Port
TP4
CTS
CTS, Primary Serial Port
TP5
DTR
DTR, Primary Serial Port
TP6
TXD
TXD, Primary Serial Port
TP7
RXD
RXD, Primary Serial Port
TP8
RTS
RTS, Primary Serial Port
„„„„„„„
36
Test Point Descriptions
37
„„„„„„„
Test
Point
Board Label
Description
TP9
DCD
DCD, Primary Serial Port
TP10
DSR
DSR, Primary Serial Port
TP12
Reset
Reset
TP13
POE 12v
POE 12v
TP14
3.3v
3.3v Supply
TP15
GND
Ground
Programming Considerations
Programming
Considerations
Overview
This chapter provides information programmers may require to make use of some Digi
Connect ME embedded module hardware resources. It provides programming information
on the following topics for the Digi Connect ME-9210, the Digi Connect ME and the Digi
Connect Wi-ME:
„
"Module Pinout" on page 39
„
"LEDs" on page 41
„
"Reset" on page 41
„
"Memory" on page 43
„
"SDRAM" on page 43
38
Module Pinout
Module Pinout
General Information
The NS7520/NS9210 processors support 16 General Purpose I/O (GPIO) lines, some of
which are reserved for specific functions and some of which can be customized. For Digi
Plug-and-Play Firmware users, see the Digi Connect Family Users Guide for details on
what Pin configurations are available to you.
Module Pinout
The following table provides signal header pinout information for the Digi Connect Me,
Digi Connect Wi-ME and Digi Connect ME 9210 modules. Please refer to the color key
below.
Key
Applies to Digi Connect
ME/Wi-ME modules.
Applies to Digi Connect
ME 9210 modules.
Applies to Digi Connect
ME/Wi-ME and ME 9210
modules.
39Digi Connect ME, Digi Connect Wi-ME & Digi Connect 9210 Hardware Reference
Programming Considerations
Pin
UART
GPIO
GPIO
[All]
[ME/
Wi-ME]
[ME 9210]
Ext
IRQ
Ext
IRQ
[ME/
Wi-ME]
[ME 9210]
I2C
SPI
FIM
Timer
Other
[ME 9210]
[ME 9210]
[ME 9210]
[ME 9210]
[All]
VETH+
VETH-
3-6
Positions Removed
RXD
A3
GPIO[3]
DATA IN
TXD
A7
GPIO[7]
DATA OUT
Timer Out 7
Timer In 8
RTS
A5
GPIO[5]
CLK
Timer Out 6
10
DTR
A6
GPIO[6]
11
CTS
A1
GPIO[1]
PIC[1]
12
DSR
A2
GPIO[2]
PIC[2]
13
DCD
A0
GPIO[0]
PIC [3]
Timer In 7
EN
PIC[0]
14
/RST
15
3.3V
16
GND
17
C4
GPIO[12]
18
C1
GPIO[9]
19
20
SDA
CLK
RESET_
DONE
SCL
Reserved
C5
GPIO [13]
CLK
Timer Out 9
/INIT
Note:
A special model of the Digi Connect ME 9210 is required for CAN bus 2.0
support. The CAN bus model does not support the 12C interface. Instead, it
makes GPIO[14] / PIC[0]_CAN_RXD available on pin 17, and GPIO [15]/
PIC[0]_CA_TXD on pin 18. Please contact Digi for availabilty information.
Note:
The Digi Connect Wi-ME module does not provide pins 1-6.
40
LEDs
LEDs
General Information
The embedded modules have two types of LEDs:
„
An LED connected directly to GPIO pins on the processor and controlled
directly in software
„
An LED connected to other hardware components (normally the Ethernet
hardware) and not directly programmable by the operating system
The development kit, by default, correctly configures the GPIO connected to the LED as an
output and then uses this LED to represent Ethernet activity.
LED
Description
Yellow
This is wired directly to Ethernet hardware and provides an indication of link.
Green
This software-programmable LED is wired to processor GPIO register bit C6/
GPIO[14] and is wired to be lit when low. The default behavior is to blink on
Ethernet activity.
Reset
Hard Reset
The embedded module supports a hardware reset via pin 14 of the 20-pin header. The unit
is forced into a hard reset when pulling the pin to ground, or less than 2.88v, for one
microsecond. When plugged into a development board, this pin is wired to the push button
at SW3. As a result, this switch acts as a hard reset button.
Reset Characteristics
Characteristic
Specification
Delay
250 milliseconds (typical)
Threshold
2.88 V
41Digi Connect ME, Digi Connect Wi-ME & Digi Connect 9210 Hardware Reference
Programming Considerations
Reset Characteristics
Characteristic
Specification
Minimum Hold Time
1 microsecond pulse
Rise Time
100 microseconds
42
Memory
Memory
Flash
The Digi Connect ME has 2 or 4 MB of flash memory. The Digi Connect Wi-ME has 4 MB
of flash memory.
On the ConnectME/ARM7 family, the flash memory is controlled by chip select 0, located
at 0x02000000.
On the ConnectME-9210/ARM9 family, the flash memory is controlled by chip select 2
(default=st_cs1) and is located at 0x50000000.
SDRAM
The Digi Connect ME and the Digi Connect Wi-ME’s SDRAM is controlled by chip
select 1 and is located at 0x00000000.
The Digi Connect ME 9210’s SDRAM is controlled by chip select 1 (default = dy_cs0)
and is mapped to 0x00000000.
The embedded modules have 8 MB of SDRAM memory.
43Digi Connect ME, Digi Connect Wi-ME & Digi Connect 9210 Hardware Reference
Programming Considerations
The following table illustrates typical power consumptions using these power management
mechanisms. These measurements were taken with all Digi NS9210 processor’s I/O clocks
disabled except UART A, UART C, Ethernet MAC, I/O Hub and Memory Clock0 with the
ethernet connected to a 100Mb network, using a standard module plugged into a Digi
JumpStart Kit development board, with nominal voltage applied:
Power Consumption 1
Mode
Normal Operational Mode2
1.14W (346mA)
Full Clock Scaling Mode
.613W (186mA)
Sleep Mode4
.113W (34mA)
Note 1: This measurement was taken from the R6 current sense resistor using a 0.025 ohm shunt on the
JumpStart Kit development board.
Note 2: This is the default power consumption mode when entering applicationStart(), as measured with the
napsave sample application. The value of the NS9210 Clock Configuration register (A090017C) is 0001200B
hexadecimal.
Note 3: This measurement was produced by selecting the “Clock Scale” menu option in the napsave sample
application.
Note 4: This measurement was produced by selecting the “Deep Sleep/Wakeup with an External IRA” menu
option in the napsave sample application.
44
Memory
45Digi Connect ME, Digi Connect Wi-ME & Digi Connect 9210 Hardware Reference
Module Specifications
Network Interface
Digi Connect ME/ME9210
Digi Connect Wi-ME
„
Standard: IEEE 802.3
„
Standard: IEEE 802.11b
„
Physical Layer: 10/100Base-T
„
Frequency: 2.4 GHz
„
Data Rate: 10/100Mbps (auto-sensing)
„
Data Rate: Up to 11 Mbps with automatic fallback
„
Mode: Half-duplex and full-duplex support
(auto-sensing)
„
„
Connector: RJ-45
Modulation: CCK (11/5 Mbps), DQPSK (2 Mbps),
DBPSK (1 Mbps)
„
Transmit Power: 16 dBm typical
„
Receive sensitivity:
„
–
1Mbps: -92 dBm
–
2Mbps: -89 dBm
–
5.5Mbps: -87 dBm
–
11Mbps: -82 dBm
Antenna Connector: 1 x RP-SMA
Caution: The Digi Connect ME and Digi Connect Wi-ME embedded
modules were designed for use in no clean flux wave soldering processes.
The product is not designed to support draining after a water-wash
process, which can lead to water residue inside the enclosure resulting
from direct entry or condensation after the wash process.
„„„„„„„
46
Serial Interface
One TTL serial interface (CMOS 3.3v) with full modem control signals (DTR, DSR, DCD,
RTS, CTS). The Connect ME 9210 also supports SPI and FIM-based application specific
interfaces.
Data Rates (bps)
50, 75, 110, 134, 150, 200, 300, 600, 1200, 1800, 2400, 4800, 9600, 14400,19200, 28800,
38400, 57600, 115200, 230400, 460800 (Connect ME 9210 only), 921600 (Connect ME
9210 only)
Flow Control Options
RTS/CTS, XON/XOFF, None
DC Characteristics
The following tables provide DC characteristics for operating conditions, inputs, and
outputs.
Operating Conditions
Symbol
47
„„„„„„„
Description
VCC
Supply Voltage
n/a
Power Supply Ripple
Min
Typ
Max
Unit
3.14
3.3
3.45
40
mVpp
Operating Conditions
Symbol
ICC
Description
Supply Current
Min
—
Typ
—
Max
Unit
Digi
Connect
ME
270
Digi
Connect
ME
9210
450
Digi
Connect
Wi-ME
400
mA
Input Current as “0”
(57K pull-up resistor)
—
—
57
μA
9210
(16K pull up resistor)
-10
—
200
μA
Input Current “1”
(57K pull-up resistor)
-10
—
10
μA
9210
(16K pull up resistor)
-10
—
10
μA
IOZ
HighZ Leakage
Current
-10
—
10
μA
IOD
Output Drive Strength
—
—
mA
CIO
Pin Capacitance
(VO=0)
—
—
pF
IIL
IIH
Warning: The rise time of the 3.3v power supply must be between 700 μS and 140ms
and the inrush current must be limited to less than 2 A. A rise time outside of these
limits may cause the device to malfunction and give a 3-1-3 diagnostic error.
„„„„„„„
48
Inputs
Symbol
Description
Min
Typ
Max
Unit
VIH
Input High Voltage
—
VCC+0.3
VIL
Input Low Voltage
VSS-0.3
—
0.2*VCC
Outputs
Note:
Symbol
Description
Min
Typ
Max
Unit
VOH
Output High Voltage
2.4
—
3.45
VOL
Output Low Voltage
—
0.4
The embedded modules provide an on board supervisor circuit with a 2.88V reset
threshold and an internal 5k pull-up resistor. When VCC falls to the threshold
voltage, a reset pulse is issued, holding the output in active state. When power
rises above 2.88V, the reset remains for approximately 250 ms to allow the system
clock and other circuits to stabilize.
Digi Connect ME
49
„„„„„„„
Digi Connect Wi-ME
Storage
Temperature
-40°F to 257°F
(-40°C to 125°C)
Humidity
5% to 90%
Altitude
12000 feet
(3657.60 meters)
Power Management (Connect ME-9210 only)
Using the Digi NET+OS development environment, applications on the Digi Connect ME
9210 are capable of operating the module in several reduced power consumption modes.
These reduced power operating modes utilize the power management mechanisms for the
Digi NS9210 processor for CPU clock scaling and sleep.
In the Clock Scaling mode, the system itself continues to execute instructions, but at a
different clock rate, which can be changed on-the-fly, using Digi’s patented circuitry inside
the NS9210 processor. The clock speed is changed programmatically to lower or raise the
system clock speed, thus reducing or increasing the module’s power footprint, respectively.
Additionally, a Sleep mode is available in which the system stops executing instructions.
Based on the application needs, wake-up triggers can be set up programmatically to
activate the processor back to wherever it left off. In this mode, a drastic power reduction is
realized by reducing the power consumption of the Digi NS9210 processor and the onmodule PHY.
For sample power consumption figures for normal (typical) and power management related
operation of the Digi Connect ME 9210, see below:
„
3.3VDC @ 346 mA typical (1.14W)
„
UART and Ethernet activated
Low Speed Idle Mode (approximate)
„
3.3VDC @ 186 mA (613 mW)
„
/16 clock scaling, Ethernet activated
Sleep Mode (approximate)
„
3.3VDC @ 34 mA (113 mW)
„
Wake-up on EIRQ, Ethernet PHY off
„„„„„„„
50
Thermal Specifications
The table below shows the standard operating temperature ranges for the entire Digi
Connect ME family of embedded modules.
Standard Operating Temperature Ranges
Product
Operating Temperature Range
Digi Connect ME
-40°C to +85°C
Digi Connect ME 9210
-40°C to +80°C
Digi Connect Wi-ME
-30°C to +75°C
The lower standard operating temperature ranges are specified without restrictions, except
condensation must not occur.
The upper operating temperature limit depends on the host PCB layout and surrounding
environmental conditions. To simplify the customer’s design process, a maximum case
temperature has been specified.
Maximum Case Temperature
Product
Maximum Case Temperature
Digi Connect ME
96°C
Digi Connect ME 9210
93°C
Digi Connect Wi-ME
85°C
The maximum case temperature must remain below the maximum, measured at the
location shown in the figure below.
51
„„„„„„„
Measure Temperature Here
Measure Temperature Here
Additional Design Recommendations
The following list provides additional design guidance with respect to thermal management
in applications with operating temperatures at the high end or beyond the specified standard
ambient temperature range.
„
Providing air movement will improve heat dissipation.
„
The host PCB plays a large part in dissipating the heat generated by the module.
A large copper plane located under the Digi Connect ME 9210 and soldered to
the module’s mounting tabs will improve the heat dissipation capabilities of the
PCB.
„
If the design allows, added buried PCB planes will also improve heat
dissipation. The copper planes create a larger surface to spread the heat into the
surrounding environment.
„
Adding a thermal pad or thermal compound, such as Sil-Pad®, Gap Pad® or
Gap Filler products made by the Bergquest Company
(www.bergquistcompany.com), between the host PCB and the underside of the
module will significantly increase the thermal transfer between the module’s
enclosure and the host PCB. Limit the fill area to the folded metal portion of the
module’s underside.
„„„„„„„
52
Mechanical
Dimensions
Digi Connect
ME
Digi Connect
Wi-ME
Length
1.445 in.
(36.703 mm)
1.85 in
(46.99 mm)
Width
0.75 in. (19.05 mm)
Height
0.854 in. (21.69 mm)
.616oz.
17.463g
Weight
Device/serial
interface connector
.696 oz.
19.731 g.
Antenna- .408 oz.
11.567 g
Total - 1.104 oz.
31.298 g
20-pin micro header (10-pin double row) with .05-inch (1.27-mm) pitch (Samtec
P/N FTS-110-01-F-DV-TR or similar). Positions 3 through 6 are removed.
Bar Code
The 50m PN is code 3 of 9 (39) and the MAC is code 128. All scanners are set up so if they
read code 3 of 9 they will automatically read 128. The reason for the two different code
types is to maximize the size of the bars within a given space to improved readability.
Dimensions
The following figures show the dimensions of Digi Connect Wi-ME and Digi Connect ME
embedded modules.
Note:
53
„„„„„„„
These are the tolerances for the drawings shown on this and the following pages:
Measure
Tolerance
.XX
± .02
.XXX
± .010
Angles
± 3°
Digi Connect Wi-ME Module
Front Wi-ME
„„„„„„„
54
Side Wi-ME
90˚ -+ 5˚
55
„„„„„„„
Bottom Wi-ME
„„„„„„„
56
Digi Connect ME Module
Front View
57
„„„„„„„
Side
„„„„„„„
58
Bottom
Recommended PCB Layout
The following figure shows the recommended PCB (printed circuit board) layout of the
Digi Connect Wi-ME and Digi Connect ME. It is strongly recommended that you consider
using the Digi Connect Wi-ME footprint for future flexibility.
59
„„„„„„„
Digi Connect ME and Wi-ME
„„„„„„„
60
Antenna Information
Antenna Strength
The following diagram demonstrates the strength of the signal received by the whip
antenna on both a horizontal and vertical plane. The diagram shows the magnetic field
when the antenna is in a vertical position. The outside line represents the horizontal plane
and the inside dotted line represents the vertical plane.
Radiation Patterns
61
„„„„„„„
Antenna Specifications
Antenna
Description
Dipole
Desktop
2.4~2.5 GHz
2.4~2.5 GHz
Power Output
2W
1W
DB Gain
2 dBi
1.8 dBi
< or = 2.0
1.92 max.
108.5 x 10.0 mm
105 x4.5 mm
10.5g
11 g
Frequency
VSWR
Dimension
Weight
Connector
Part Number
RP-SMA
DG-ANT-20DP-BG
DC-ANT-24DT
Any antenna matching the in-band and out-of-band signal patterns and strengths of the
antenna, whose characteristics are given in the Antenna Description table and the Radiation
Pattern graphic may be used with the Digi Connect Wi-ME.
„„„„„„„
62
Units: mm
Desktop Antenna Dimensions
63
„„„„„„„
1.200
(30.5)
1.010
(25.4)
.399
(10.1)
90.0˚
3.300
(83.8)
bOBITRON
SCALE 3.000
UNITS: mm
3.500
(88.9)
.360
(9.1)
R.125
(3.2)
Dipole Antenna Dimensions
„„„„„„„
64
RF Exposure Statement
The Digi Connect Wi-ME module complies with the RF exposure limits for humans as
called out in RSS-102. It is exempt from RF evaluation based on its operating frequency of
2.4 GHz, and effective radiated power less than the 3 watt requirement for a mobile device
(>20 cm separation) operating at 2.4 GHz.
Safety Statements
To avoid contact with electrical current:
65
„„„„„„„
„
Never install electrical wiring during an electrical storm.
„
Never install an ethernet connection in wet locations unless that connector is
specifically designed for wet locations.
„
Use caution when installing or modifying ethernet lines.
„
Use a screwdriver and other tools with insulated handles.
„
You and those around you should wear safety glasses or goggles.
„
Do not place ethernet wiring or connections in any conduit, outlet or junction
box containing electrical wiring.
„
Installation of inside wire may bring you close to electrical wire, conduit,
terminals and other electrical facilities. Extreme caution must be used to avoid
electrical shock from such facilities. You must avoid contact with all such
facilities.
„
Ethernet wiring must be at least 6 feet from bare power wiring or lightning rods
and associated wires, and at least 6 inches from other wire (antenna wires,
doorbell wires, wires from transformers to neon signs), steam or hot water
pipes, and heating ducts.
„
Do not place an ethernet connection where it would allow a person to use an
ethernet device while in a bathtub, shower, swimming pool, or similar
hazardous location.
„
Protectors and grounding wire placed by the service provider must not be
connected to, removed, or modified by the customer.
„
Do not touch un-insulated ethernet wiring if lightning is likely!
„
Do not touch or move the antenna(s) while the unit is transmitting or receiving.
„
Do not hold any component containing a radio such that the antenna is very
close to or touching any exposed parts of the body, especially the face or eyes,
while transmitting.
„
Do not operate a portable transmitter near unshielded blasting caps or in an
explosive environment unless it is a type especially qualified for such use
Any external communications wiring you may install needs to be constructed to all
relevant electrical codes. In the United States this is the National Electrical Code Article
800. Contact a licensed electrician for details.
„„„„„„„
66
67
„„„„„„„
Certifications
These products comply with the following standards.
FCC Part 15 Class B
Radio Frequency Interference (RFI)(FCC 15.105)
The Digi Connect ME and Digi Connect Wi-ME embedded modules have been tested and
found to comply with the limits for Class B digital devices pursuant to Part 15 Subpart B,
of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential environment. This equipment generates, uses, and can
radiate radio frequency energy, and if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try and correct
the interference by one or more of the following measures:
„
Reorient or relocate the receiving antenna.
„
Increase the separation between the equipment and the receiver.
„
Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
„
Consult the dealer or an experienced radio/TV technician for help.
„„„„„„„
68
Labeling Requirements (FCC 15.19)
This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
If the FCC ID is not visible when installed inside another device, then the outside of the
device into which the module is installed must also display a label referring to the enclosed
module FCC ID. This exterior label can use wording such as the following: “Contains
Transmitter Module FCC ID: MCQ-50M880/ IC: 1846A-50M880”.
Modifications (FCC 15.21)
Changes or modifications to this equipment not expressly approved by Digi may void the
user's authority to operate this equipment.
Industry Canada
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian Department
of Communications.
Le present appareil numerique n'emet pas de bruits radioelectriques depassant les limites
applicables aux appareils numeriques de la class B prescrites dans le Reglement sur le
brouillage radioelectrique edicte par le ministere des Communications du Canada."
69
„„„„„„„
Declaration of Conformity
(In accordance with FCC Dockets 96-208 and 95-19)
Manufacturer's Name:
Digi International
Corporate Headquarters:
11001 Bren Road East
Minnetonka MN 55343
Manufacturing Headquarters:
10000 West 76th Street
Eden Prairie MN 55344
Digi International declares, that the product:
Product Name:
Digi Connect ME embedded module
Model Number:
50001528-XX
Product Name:
Digi Connect Wi-ME embedded module
Model Number:
50000880-XX
to which this declaration relates, meets the requirements specified by the Federal
Communications Commission as detailed in the following specifications:
„
Part 15, Subpart B, for Class B Equipment
„
FCC Docket 96-208 as it applies to Class B personal
„
Computers and Peripherals
The product listed above has been tested at an External Test Laboratory certified per FCC
rules and has been found to meet the FCC, Part 15, Class B, Emission Limits.
Documentation is on file and available from the Digi International Homologation
Department.
„„„„„„„
70
International EMC Standards
The Digi Connect ME and Digi Connect Wi-ME embedded modules meet the following
standards:
Standards
Digi Connect
ME
Digi Connect
Wi-ME
AS/NZS 3548 CISPR 22
Japan IOH
003NY04115 0000
003GZ04064 0000
AS/NZS 3548
FCC Part 15 Subpart C
(FCC ID: MCQ-50M880)
IC RSS 210 (IC:1846A-50M880)
Emissions
Immunity
FCC Part 15 Subpart B
ICES-003
EN 55022
EN 61000-4-2
EN 61000-4-3
EN 61000-4-6
EN 301 489-3
EN 300 328
VCCI
EN 55024
UL 60950-1
Safety
CSA 22.2 No. 60950--1
EN 60950
71
„„„„„„„
Antenna configurations
This device has been designed to operate with the antennas listed below, and having a
maximum gain of [10] dBi. Antennas not included in this list or having a gain greater than
[10] dBi are strictly prohibited for use with this device. The required antenna impedance is
[50] ohms
The following antenna configurations that were tested with the Connect Wi-ME 802.11 b
module.
Digi 29000095, Bobbintron SA-006-1, +2 dBi dipole antenna (RP-SMA)
„„„„„„„
72
PCTEL, MLPV2400NGP, 2.4 GHz, 3dBi gain, no ground place, low profile antenna
MAXRAD, MFB24010, 2.4 GHz, 10 dBi Fiberglass OMNI antenna
To reduce potential radio interference to other users, the antenna type and its gain should be
so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
73
„„„„„„„
Sample Application: PoE
Power Supply
The following schematic is an example of PoE Power Supply:
„„„„„„„
74
A
POS
POS
NEG
D2
MB2S
NEG
D1
MB2S
R1
24K9
R2
1K
R6
100K
11
12
17
16
15
13
10
C33
1u/10V
14
U1
LM5070SD
L6
4,7uH
C36
2u2/100V
D14
12V/200mW
C39
220P/50V
P1
4p_R/A_TSM
AC
AC
AC
AC
C37
2u2/100V
R8
1K
C5
47n/100V
NC
C34
1u/10V
R7
53R6
R3
33K2
R4
590K
C3
220n/100V
C4
47n/100V
R5
15K
R27
1K
R10
100R
C32
1n/100V
U3
FDC2512
NOT POP
D11
56V
D4
LL4148
3 D12
Dual 100V
R11
18R
R9
47R
R12
0R33
NC
NC
C9
3.3u
U2
FOD2741ASDV
10
T1
C1586-ALD
C16
100n/100V R17
33R
D15
SS26
60V/2A
R29
1K8
R24
0R
R16
1K
C28
10u/10V
R14
10K
C29
10u/10V
C20
100n/100V
C11
47n/100V
C10
1n/50V
R30
4K7
R28
3K3
L5
4,7uH
CR1
RED
R21
1K
„„„„„„„
C30
100n/100V
C40
330u/35V
75
C15
100n/100V
C27
10u/10V
C12
1u/10V
C7
1u/10V
C6
1n/50V
C38
2u2/100V
D3
SMAJ60A-13-F
C2
100n/100V
P2
6p_R/A_TSM
Sample Application:
TTL Signals to EIA-232
The following schematic is an example of how to convert the modules’s TTL signals to
EIA-232.
„„„„„„„
76
77
„„„„„„„
Change Log
The following changes have been made since the last revision of this document.
Note: As of September 2007, the document number changed from 90000631 to
90000897.
Revision F
Added ME sketch to Thermal Specifications.
Added antenna configurations.
Revision E
Changed schematics in appendix A to reflect correct measurements.
Revision D
Added a new section labeled “Thermal Specifications” to the book. This section outlines
the temperature ranges at which the devices specified can still function properly.
„„„„„„„
78
Revision C
Updates to schematics in Chapter 2.
Added/revised Module Pin-out table in Chapter 3.
Updated GPIO tables throughout book.
Revision B
Fixed page numbers to make them correspond in PDF form.
Added components to Development Board schematics. (#19 and 20)
Revision 90000631_G>90000897_A
Added Connect ME 9210 related information.
Updated schematics in development board chapter to reflect 9210 changes.
Revision G
Updated the Connectors: power and device interface section to say that pins 1 and 2 on the
connector are available if using Connect ME, not available if using Connect Wi-ME.
Updated the Embedded Module Connector table in Chapter 2 similarly.
Added tolerance information for dimension drawings
Updated Hard Reset section to clarify forcing the unit into hard reset
Updated the ambient (operating) temperature for Connect Wi-ME
Added information regarding reading the bar code
Added P12 Factory reset pin
79
„„„„„„„
Revision F
Updated Antenna drawing
Added product weights
Updated UL labeling description
Updated dimension drawings
Revision E
Added Japan certification
Improve dipole antenna drawing
Corrected imperial pitch measurement
Reformatted tables for easier reading
Added antenna extension cord information
Added more receive sensitivity information
Added Caution for soldering process
Added reset hold times
Added VCC *absolute max* ratings
Combined PCB layouts with improvements
„„„„„„„
80
81
„„„„„„„


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