FJBE2150D ESBC™ Rated NPN Silicon Transistor MOSFET QS2150
User Manual: MOSFET QS2150
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FJBE2150D ESBC™ Rated NPN Silicon Transistor Description ESBC Features (FDC655 MOSFET) VCS(ON) IC Equiv. RCS(ON) 0.131 V 0.5 A 0.261 Ω(1) • • • • • Low Equivalent On Resistance Very Fast Switch: 150 kHz Squared RBSOA: Up to 1500 V Avalanche Rated Low Driving Capacitance, No Miller Capacitance (Typ. 12 pF Capacitance at 200 V) • Low Switching Losses • Reliable HV Switch: No False Triggering due to High dv/dt Transients Applications The FJBE2150D is a low-cost, high-performance power switch designed to be used in an ESBC™ configuration in applications such as: power supplies, motor drivers, smart grid, or ignition switches. The power switch is designed to operate up to 1500 volts and up to 3 amps, while providing exceptionally low on-resistance and very low switching losses. The ESBC™ switch is designed to be driven using off-theshelf power supply controllers or drivers. The ESBC™ MOSFET is a low-voltage, low-cost, surface-mount device that combines low-input capacitance and fast switching. The ESBC™ configuration further minimizes the required driving power because it does not have Miller capacitance. The FJBE2150D provides exceptional reliability and a large operating range due to its square Reverse-BiasSafe-Operating-Area (RBSOA) and rugged design. The device is avalanche rated and has no parasitic transistors, so is not prone to static dv/dt failures. • High-Voltage and High-Speed Power Switches • Emitter-Switched Bipolar/MOSFET Cascode (ESBC™) • Smart Meters, Smart Breakers, HV Industrial Power Supplies • Motor Drivers and Ignition Drivers The power switch is manufactured using a dedicated high-voltage bipolar process and is packaged in high-voltage HV-D2PAK rated at 2500 V creepage and clearance. C 3 C (3) FJBE2150D B (1) B FDC655 1 1.Base 2 2.Emitter G D2-PAK 2L E 3.Collector Figure 1. Pin Configuration (2) S Figure 2. Internal Schematic Diagram Figure 3. ESBC Configuration(2) Ordering Information Part Number Marking Package Packing Method FJBE2150DTU J2150D D2-PAK 2L (TO-263 2L) Tube Notes: 1. Figure of Merit. 2. Other Fairchild MOSFETs can be used in this ESBC application. © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com FJBE2150D — ESBC™ Rated NPN Silicon Transistor January 2016 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. Symbol Parameter Value Unit VCBO Collector-Base Voltage 1500 V VCEO Collector-Emitter Voltage 800 V VEBO Emitter-Base Voltage 12 V IC Collector Current 2 A ICP Collector Current (Pulse) 3 A IB Base Current 1 A IBP Base Current (Pulse) 2 A PD Power Dissipation (TC = 25°C) 110 W TJ Operating and Junction Temperature Range - 55 to +125 °C TSTG Storage Temperature Range - 65 to +150 °C EAS Avalanche Energy (TJ = 25°C, 8 mH) 3.5 mJ Max. Unit Thermal Characteristics(3) Values are at TA = 25°C unless otherwise noted. Symbol Parameter Rθjc Thermal Resistance, Junction to Case 1.13 °C/W Rθja Thermal Resistance, Junction to Ambient 76.42 °C/W Note: 3. Device mounted on FR-4 PCB, board size = 76.2 mm x 114.3 mm, land pattern 12.70 mm x 9.45 mm, trace size = 10 mil. © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 2 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Absolute Maximum Ratings Values are at TA = 25°C unless otherwise noted. Symbol Parameter Conditions Min. Typ. Max. Unit BVCBO Collector-Base Breakdown Voltage IC = 0.5 mA, IE = 0 1500 1689 V BVCEO Collector-Emitter Breakdown Voltage IC = 5 mA, IB = 0 800 870 V BVEBO Emitter-Base Breakdown Voltage IE = 0.5 mA, IC = 0 12.0 14.8 V ICES Collector Cut-off Current VCE = 1500 V, VBE = 0 0.01 100 μA ICEO Collector Cut-off Current VCE = 800 V, IB = 0 0.01 100 μA IEBO Emitter Cut-off Current VEB = 12 V, IC = 0 0.05 500 μA hFE DC Current Gain 35 VCE(sat) VBE(sat) Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage VCE = 3 V, IC = 0.4 A 20 29 VCE = 10 V, IC = 5 mA 20 43 IC = 0.25 A, IB = 0.05 A 0.16 IC = 0.5 A, IB = 0.167 A 0.12 IC = 1 A, IB = 0.33 A 0.25 IC = 500 mA, IB = 50 mA 0.74 1.20 IC = 2 A, IB = 0.4 A 0.85 1.20 1000 V V CIB Input Capacitance VEB = 10 V, IC = 0, f = 1 MHz 745 COB Output Capacitance VCB = 200 V, IE = 0, f = 1 MHz 15 pF fT Current Gain Bandwidth Product IC = 0.1 A, VCE = 10 V 5 MHz VF Diode Forward Voltage IF = 0.4 A 0.76 1.20 IF = 1 A 0.83 1.50 pF V Note: 4. Pulse test: pulse width = 20 μs, duty cycle≤ 10%. © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 3 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Electrical Characteristics(4) Values are at TA = 25°C unless otherwise noted. Symbol fT Parameter Conditions tc Current Gain Bandwidth Product IC = 0.1 A,VCE = 10 V Inductive Current Fall Time VGS = 10 V, RG = 47 Ω, Inductive Storage Time VClamp = 500 V, Inductive Voltage Fall Time tp = 3.1 μs, IC = 0.3 A, IB = 0.03 A, LC = 1 mH, Inductive Voltage Rise Time SRF = 480 kHz Inductive Crossover Time Itf Inductive Current Fall Time ts Inductive Storage Time Vtf Inductive Voltage Fall Time Vtr Inductive Voltage Rise Time tc Inductive Crossover Time Itf ts Vtf Vtr Maximum Collector Source VolthFE = 5, IC = 2 A age at Turn-off without Snubber IGS(OS) Gate-Source Leakage Current Collector-Source On Voltage VGS = ±20 V Typ. Max. 25 VGS = 10 V, RG = 47 Ω, VClamp = 500 V, tp = 10 μs, IC = 1 A, IB = 0.2 A, LC = 1 mH, SRF = 480 kHz VCSW VCS(ON) Min. Unit MHz 137 ns 350 ns 120 ns 100 ns 137 ns 35 ns 980 ns 30 ns 195 ns 210 ns 1500 V 1.0 VGS = 10 V, IC = 2 A, IB = 0.67 A, hFE = 3 2.210 VGS = 10 V, IC = 1 A, IB = 0.33 A, hFE = 3 0.321 VGS = 10 V, IC = 0.5 A, IB = 0.17 A, hFE = 3 0.131 VGS = 10 V, IC = 0.3 A, IB = 0.06 A, hFE = 5 0.166 nA V Gate Threshold Voltage VBS = VGS, IB = 250 μA 1.9 V Input Capacitance (VGS = VCB = 0) VCS = 25 V, f = 1 MHz 470 pF QGS(tot) Gate-Source Charge VCB = 0 VGS = 10 V, IC = 8 A, VCS = 25 V 9 nC VGS = 10 V, ID = 6.3 A 21 rDS(ON) Static Drain-Source On Resistance VGS = 4.5 V, ID = 5.5 A 26 VGS = 10 V, ID = 6.3 A, TJ = 125°C 30 VGS(th) Ciss mΩ Note: 5. Used typical FDC655 MOSFET values in table. Values can vary if other Fairchild MOSFETs are used. © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 4 FJBE2150D — ESBC™ Rated NPN Silicon Transistor ESBC Configured Electrical Characteristics(5) FJBE2150D — ESBC™ Rated NPN Silicon Transistor Typical Performance Characteristics 3 V CE =10V 2 100 hFE, DC CURRENT GAIN IC[A], COLLECTOR CURRENT 1A 900m A 800m A 700m A 600m A 500m A 400m A 300m A 200m A IB = 1 0 0 m A 1 0 0 1 2 3 4 5 6 o T A =125 C o T A =25 C 10 1 7 1 10 100 1000 I C [mA], COLLECTOR CURRENT V C E [V ], C O L L E C T O R E M IT T E R V O L T A G E Figure 4. Static Characteristic Figure 5. DC Current Gain 100 100 IC = 5 IB VCE(sat) [V], SATURATION VOLTAGE VCE(sat) [V], SATURATION VOLTAGE IC = 3 IB 10 o TA = 125 C 1 o TA = 25 C 0.1 o TA = - 25 C 0.01 1E-3 0.01 0.1 1 10 o TA = 25 C 1 o TA = -25 C 0.1 1E-3 10 1 10 100 100 IC = 20 IB IC = 10 IB VCE(sat) [V], SATURATION VOLTAGE VCE(sat) [V], SATURATION VOLTAGE 0.1 Figure 7. Collector-Emitter Saturation Voltage hFE = 5 Figure 6. Collector-Emitter Saturation Voltage hFE = 3 10 o TA = 125 C o TA = 25 C 1 o TA = -25 C 0.01 0.1 1 10 o TA = 125 C o TA = 25 C 1 0.1 1E-3 10 o TA = -25 C 0.01 0.1 1 10 IC [A], COLLECTOR CURRENT IC [A], COLLECTOR CURRENT Figure 9. Collector-Emitter Saturation Voltage hFE = 20 Figure 8. Collector-Emitter Saturation Voltage hFE = 10 © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 0.01 IC [A], COLLECTOR CURRENT IC [A], COLLECTOR CURRENT 0.1 1E-3 o TA = 125 C www.fairchildsemi.com 5 2 1000 o T J =25 C CAPACITANCE [pF] VCE[V], VOLTAGE 3 .0 A 2 .0 A 1 .0 A 1 0 .4 A IC = 0 .2 A 0 1 10 100 100 Cob (Emitter Open) 10 1 1k Cob (Emitter Grounded) 1 10 IB [m A], B AS E C U R R E N T 100 1000 Figure 10. Typical Collector Saturation Voltage Figure 11. Capacitance 2.0 250 o o ta = 25 C L=1mH SRF=480KHz 225 ta = 25 C L=1mH SRF=480KHz 1.8 hfe=10 common emitter 200 1.6 175 1.4 Time [us] 150 Time [ns] 10000 COLLECTOR-BASE VOLTAGE[V] 125 hfe=5 common emitter 100 hfe=10 common emitter hfe=5 common emitter 1.2 1.0 hfe=5 ESBC 0.8 75 0.6 50 25 hfe=10 ESBC hfe=5 ESBC 0.4 hfe=10 ESBC 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.2 0.2 2.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IC [A], COLLECTOR CURRENT IC [A], COLLECTOR CURRENT Figure 13. Inductive Load Collector Current Storage Time (tstg) Figure 12. Inductive Load Collector Current Fall-Time (tf) 300 200 o o ta = 25 C L=1mH SRF=480KHz 180 ta = 25 C L=1mH SRF=480KHz 280 260 240 140 220 120 200 100 Time [ns] Time [ns] 160 hfe=10 common emitter 80 hfe=10 ESBC 60 0 0.2 160 hfe=5 common emitter 140 hfe=10 commom emitter 100 hfe=5 common emitter 0.4 0.6 0.8 80 hfe=5 ESBC 1.0 1.2 hfe=10 ESBC 60 1.4 1.6 1.8 0.2 2.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IC [A], COLLECTOR CURRENT IC [A], COLLECTOR CURRENT Figure 15. Inductive Load Collector Voltage Rise-Time (tr) Figure 14. Inductive Load Collector Voltage Fall-Time (tf) © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 180 120 40 20 hfe=5 ESBC www.fairchildsemi.com 6 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Typical Performance Characteristics (Continued) 300 3 o ta = 25 C L=1mH SRF=480KHz 280 VDD = +/-50V, RLOAD = 500KΩ IC [A], COLLECTOR CURRENT 260 240 hfe=5 ESBC Time [ns] 220 200 hfe=10 common emitter 180 hfe=5 common emitter 160 140 hfe=10 ESBC 120 VBE(off) = 5V 2 1 100 0 80 0.2 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 200 400 600 800 1000 1200 1400 1600 1800 VCE [V], COLLECTOR-EMITTER VOLTAGE IC [A], COLLECTOR CURRENT Figure 16. Inductive Load Collector Current / Voltage Crossover (tc) Figure 17. BJT Reverse Bias Safe Operating Area 3 o TC = 25 C HFE = 4 IC [mA], COLLECTOR CURRENT IC [A], COLLECTOR CURRENT VDD = +/-50V, RLOAD = 500Kohms 2 1 Single 80us Pulse 10 1 0.1 0 0 200 400 600 800 1000 1200 1400 1600 1800 0 2000 500 1000 1500 2000 VCE [V], COLLECTOR-EMITTER VOLTAGE VCE [V], COLLECTOR-EMITTER VOLTAGE Figure 18. ESBC RBSOA Figure 19. Crossover Forward Bias Safe Operating Area (FBSOA) PD [W], POWER DISSIPATION 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150 175 200 C o T [ C], CASE TEMPERATURE Figure 20. Power Derating © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 7 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Typical Performance Characteristics (Continued) Figure 21. Test Circuit for Inductive Load and Reverse Bias Safe Operating } } sT sT } pj A pi pj A A k|{ k|{ R\G} Figure 22. Energy Rating Test Circuit VCE Figure 24. FBSOA Figure 23. fT Measurement © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 8 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Test Circuits FJBE2150D — ESBC™ Rated NPN Silicon Transistor Test Circuits (Continued) Figure 25. Simplified Saturated Switch Driver Circuit Functional Test Waveforms Figure 26. Crossover Time Measurement 90% Vce 90% Ic 10% Vce 10% Ic Figure 27. Saturated Switching Waveform © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 9 Figure 29. Storage Time - ESBC FET Gate (off) to IC Fall-Time Figure 28. Storage Time - Common Emitter Base Turn-off (Ib2) to IC Fall-Time © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 10 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Functional Test Waveforms (Continued) ` X _~ 1YWWTXWWW}Gkj xGyGXYWro¡ Y X |m[WW^ [^Wr Z tiyYWX\Wj{{| Y Z Y[}gWUZZh X XWWWm Z\} Y XWWWm Z\} ^ \ [ w]rl[[Wh twX]W_i[^Xh ZZm [\W} [^Wr ttZYY}i YY} YL FJBE2150DTU mqilYX]Wk{t Xu[X[_ [^Wr ZZm [\W} } [^Wr Q ] _ mkj]\\ v|{ \ o} ttzkZW^W jz [^Wr oXXhnX}t kl{ X mi Y Z XYTX[} XWm [ ttZXY}j XY} \L [} ZZm [\W} Xu[X[_~z [^Wr XWWm Y\} WUZ\hG QGtGGG Figure 30. 8 W; Secondary-Side Regulation: 3 Capacitor Input; Quasi Resonant Driving ESBC Switches Figure 31. VCC Derived Figure 32. Vbias Supply Derived © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 Figure 33. Proportional Drive www.fairchildsemi.com 11 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Very Wide Input Voltage Range Supply $ 0 $ 0 /$1'3$77(515(&200(1'$7,21 % 0,1 & 6(('(7$ 127(6 *$8*(3/$1( 6($7,1*3/$1( $3$&.$*(&21)250672-('(&72 9$5,$7,21$%(;&(37:+(5(127(' %$//',0(16,216$5(,10,//,0(7(56 & 2872)-('(&67$1'$5'9$/8( '',0(16,21$1'72/(5$1&($63(5$60( < (',0(16,216$5((;&/86,9(2)%8556 02/')/$6+$1'7,(%$53527586,216 )/$1'3$77(515(&200(1'$7,21%$6,1* )520,3& *'5$:,1*),/(1$0(72'5(9 5 % '(7$,/$ 6&$/( Figure 34. 2 LEAD, TO-263, JEDEC TO263 VARIATION AB, D2PAK © 2013 Fairchild Semiconductor Corporation FJBE2150D Rev. 1.4 www.fairchildsemi.com 12 FJBE2150D — ESBC™ Rated NPN Silicon Transistor Physical Dimensions TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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