LG KG270 Manual

User Manual: LG-KG270-Manual

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Service Manual

Service Manual
KG270/MG160

Model : KG270/MG160

Date: April, 2007 / Issue 1.0

Table Of Contents
1. INTRODUCTION ...............................5

4.13 Headphone Trouble .............................75

1.1 Purpose .................................................. 5

4.14 Charging Trouble .................................77

1.2 Regulatory Information............................ 5

4.15 FM Radio Trouble ................................79

2. PERFORMANCE...............................7

5. DOWNLOAD.......................................82

2.1 H/W Features...........................................7

5.1 Download Setup.....................................82

2.2 S/W Features ...........................................8

5.2 Download Process .................................83

3. TECHNICAL BRIEF ........................14

6. BLOCK DIAGRAM ..........................88

3.1 Digital Main Processor(PMB7880).........14

7. Circuit Diagram ..............................89

3.2 Power Amplifier Module (SKY77318) ....22
3.3 26 MHz Clock (DCXO)...........................24
3.4 RTC(32.768KHz Crystal) .......................25
3.5 LCD Interface(3-wire SPI interface) .......26

8. PCB LAYOUT ..................................93
9. ENGINEERING MODE ....................95

3.6 SIM Card Interface.................................28

9.1 About Engineering Mode .......................95

3.7 KEYPAD Interface .................................29

9.2 Access Codes ........................................95

3.8 Battery Charging Block Interface ...........30

9.3 Key Operation ........................................95

3.9 RF Interface ...........................................31

9.4 Engineering Mode Menu Tree ...............95

3.10 Audio Interface.....................................33

10. CALIBRATION ..............................92

3.11 Key LED Interface................................37
3.12 Vibrator Interface .................................38
3.13 Memory Interface .................................39

10.1 Test Equipment Setup .........................92
10.2 Calibration Steps..................................92

3.14 Power Block Interface ..........................40

11. STAND ALONE TEST .................109

3.15 FM Radio Interface ..............................42

11.1 Test Program Setting .........................109

4. TROUBLE SHOOTING ...................44

11.2 Tx Test ...............................................111

4.1 RF Trouble .............................................44

11.3 RX Test ..............................................112

4.3 Power On Trouble..................................54

12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 113

4.4 SIM Card Trouble...................................56

12.1 Exploded View .................................. 113

4.2 TX Trouble .............................................50

4.5 Vibrator Trouble .....................................58
4.6 Keypad Trouble......................................60
4.7 RTC Trouble ..........................................62
4.8. Key backlight Trouble ...........................64
4.9. LCD Trouble..........................................66
4.10. Microphone Trouble ............................69
4.11. Receiver Trouble.................................71
4.12 Speaker Trouble ..................................73
-3-

12.2 Replacement Parts ............................115
12.3 Accessory ......................................... 124

-4-

1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, description and download the features of
this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

-5-

1. INTRODUCTION

E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

-6-

2. PERFORMANCE

2. PERFORMANCE
2.1 H/W Features
Item

Specifications

Band

GSM DUAL Band(900/1800)

Type

Bar type

Dimension

98 * 45 * 12.9mm

Weight

60g

Battery

750mAh Li-ion

Talk Time

Over 2hours @EGSM,TX Level : 5

Stand-by Time

Over 200 hours @Paging period : 5

RTC

Under 4 hours when removed battery.

Antenna

Internal Type(Dual-band)

LCD(Main)

1.52"(128x128 pixels), 65K Color STN LCD

Back Light

Yes

Back Light color

Blue

Vibrator

Yes

Speaker&Receiver

Yes(11x07 Receiver, 16®™ Speaker)

C-MIC

Yes

Earphone Jack

Mono or Stereo(Optional)

SIM

Yes(Plug in Type) : 3.0V

MIDI

16 poly

I/O Connect

18 Pins (included Earphone Jack)

-7-

2. PERFORMANCE

2.2 S/W Features
Function

Detail Item

Specification

Operating System OS

O

Data

Circuit

O

Packet

X

Infrared (IrDA)

X

Bluetooth

X

USB

X

USB Mass storage

X

RS232

O

Voice Recording

X

Voice Command

X

Answering machine

X

User Memory

O

TBD

X

MMS

Connectivity

Voice Function

Memory

Etc.

OSE

Under 300KB

Pictures (Still Image &
X
Moving Image)
X

MP3 (Music Contents)

X

Java Contents

O

Wallpaper

3 bitmap images

O

Ringtone

10 MIDI Ringtones

X

external memory (microSD)

Camera

Camera Module

X

Audio

Voice Codec

O

AMR

O

FM Radio

O

Integrated handsfree speaker

O

-8-

FR, HR, EFR, AMR-NB

Speaker phone mode

2. PERFORMANCE

Function
Display

Detail Item

Specification

RSSI

O

6 level

Battery Level

O

5 level

RTC

O

Multi?Language

O

Basic:English
Max. 4 language of Latin
2 or 3 language of etc.

Quick Access Mode

X

PLMN/Service Indicator

O

Dimming Clock

X

Dual Clock

X

Local Time / Selected Area Time

Last Dialed Number

O

10

Last Received Number

O

10

Last Missed Number

O

10

Scratch Pad Memory

X

Call

Call Waiting

O

Manage-ment

Call Swap

O

Call Retrieve

O

Auto Answer

X

Automatic Redial

O

Calling Line dentification

O

Full Call divert

O

Speed Dialing

O

Last Number Redial

O

Multi-party Call (Conference Call)

O

Explicit Call Transfer

X

Normal Features

-9-

Etc.

2. PERFORMANCE

Function
Network

DTMF

Audio

Cell Broadcast

Detail Item

Specification

Automatic Network Selection

O

Manual Network Selection

O

Network Service Status

O

DTMF Signaling

O

DTMF Enable & Disable

O

Key Tone Volume

O

6 Level (Include Mute)

Ring Tone Volume

O

6 Level (Include Mute)

Ring Tone Pattern

O

10Type(fixed)

Ring Type Silent

O

Vibrator & Ring (Indicator)

Earpiece Volume

O

6 Level (Include Mute)

Mute

O

Read Cell Broadcast

O

Cell Broadcast Categories

O

Cell Broadcast Message

O

Language
Phone Book

Entry

O

300

Field

O

Office,Mobile

Numeric Store and Recall

O

Alphabetic Store

O

Alphabetic Recall

O

Scroll by alphabetic or

O

numeric order
Last Number Dialed

O

10

Last Number Missed

O

10

Last Number Received

O

10

Copy & Move

O

Fixed Dial Number

O

Barred Dial Number

X

Service Dial Number

O

Email Entry

X

Picture ID

X

Video Caller ID

X

My Name card

X

- 10 -

Etc.

2. PERFORMANCE

Function
Supp. Services

Detail Item
Call Forwarding

Call Barring

Specification
O

All Incoming Calls,

O

No Reply

O

On Busy,

O

Not reachable

O

All Outgoing Calls,

O

International Calls,

O

Etc.

Calls except to Home Country
incoming Calls,

O

All incoming Calls when roaming

Conference Call

O

up to 3 calls

Plug?In Type

O

3 V only

SIM Lock

O

Service Provider / Network Lock

SIM Toolkit

O

Class 1, 2, 3

Prepaid SIM Operation

O

Mega SIM

X

Short Messaging

Read Message

O

Manage-ment

Write and Edit Message

O

Send and Receive Message

O

Reply to Message

O

SIM

Not Support EMS

Forward Message
Extract Number from Message

O

Message Status

O

Message Unread Indicator

O

Settable Message Center Number, O
Reply Path and Validity
Visible and Audible Message

O
O

Receive Alerting
Voice Mail

O

Settable Voice Mail Center Number

O

Message Protocol

O

Normal, Fax, National Paging,
Email, X400, ERMES, Voice

Message Overflow Indicator

O

Message Center Number

O

Help Menu

X

- 11 -

2. PERFORMANCE

Function
Sound contents

Detail Item

Specification

Ringtones

O

Karaoke

X

Stutter Sound

X

Flip tone

X

Button tone

O

Others

X

Miscellaneous

Development & Test Facility

O

Function

Field Test Facility

O

Display Software Version

O

IMEI

O

Language

O

Selectable Auto Language

Predictive word input

O

T9

Schedule

O

20 input (20 character)

To Do List

X

50 input

Memo

O

20 input (40 character)

D-day counter

X

Send via Bluetooth

X

Setting Local Time

O

Display Two Number of Cities Time

X

Dual clock

Daylight saving

X

Summer time calibration function

NITS

X

Automatic setting as country code in SIM

O

Currency, Surface, Length, Weight,

Text Input
Scheduler

World Time

Unit converter

Schedule, Memo, To Do list, Messaging

Temperature, Volume, Velocity
Stop watch

O

Calculator

Calculation

O

PC Sync

Phone Book Sync

X

Message Sync

X

Multimedia Contents Sync

X

Scheduler Sync

X

+-*/

E-MAIL, EMS, Schedule, Phonebook,
Name card etc.

Sync ML

DS

X

DM

X

Game
Menu

X
Quick Access Mode (Profile)

X

External Interface Electrical Man Machine Interface O
Development and Test Facility

O

- 12 -

Etc.

2. PERFORMANCE

Function
Handset

Security

Real Time Clock

Accessory

Detail Item

Specification

Restore Factory Setting
Read Software Version
Battery Charging Mode
Emergency Call
Handset Lock
Security Code
SIM Lock
Key guard
12/24 hour
Calendar
Time Zone
Daylight saving
Alarm Manager
Dimming Clock
Power-off Alarm
On Alarm Event
Hand strap
Embedded microSD Card
microSD Adapter
Stereo earmic

O
O
O
O
O
O
O
O
O
O
O
X
O
X
O
O
X
X
X
O

earmic w/music remote controller
Neck strap
LCD Cleaner
Holster
Data cable
CD
Holster charger

X
X
X
X
O
X
X

additional standard battery
Extended Battery
Desktop Charger
Cigar Lighter Adapter
Portable Handsfree
Bluetooth headset
Bluetooth stereo earset controller
Car kit
Leather Pouch
Stylus Pen

X
X
X
X
X
X
X
X
X
X
X
X

Compass

- 13 -

Etc.

Delete all

Automatic Leap Year Adjustment

Once, Daily, Mon~Fri, Mon~Sat

Display

EarMic Type

Provides optionally
only for supporting
FM radio function.

RS232 cable

Option

Standard battery Back-up
and Holster function

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF
3.1 Digital Main Processor(PMB7880)

Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM

- 14 -

3. TECHNICAL BRIEF

3.1.1 Overview of E-GOLDvoice
The E-GOLDvoice is a GSM baseband modem including RF transceiver covering the low bands
GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands.
E-GOLDvoice is Dual Band, therefore, it supports by default a low / high pair of bands at the same
time:
1. GSM850 / GSM1800
2. GSM850 / GSM1900
3. GSM900 / GSM1800
4. GSM900 / GSM1900
The E-GOLDvoice is optimized for voice-centric Mobile Phone applications.
The E-GOLDvoice is designed as a single chip solution that integrates the digital, mixed-signal, RF
functionality and a direct-to-battery Power Management Unit.
The transceiver consists of:
• Constant gain direct conversion receiver with an analog I/Q baseband interface
• Fully integrated Sigma/Delta-synthesizer capability
• Fully integrated two-band RF oscillator
• Two-band digital GMSK modulator with digital TX interface
• Digitally controlled crystal oscillator generating system clocks.
The E-GOLDvoice supports a direct battery connection, hence eliminating the need for an external
Power Management Unit. The E-GOLDvoice has different power down modes and an integrated
power up sequencer.
The E-GOLDvoice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating
temperature range from -40C to 85C. It is manufactured using the 0.13 •Ïm CMOS process.

- 15 -

3. TECHNICAL BRIEF

3.1.2 Features
] Baseband
• High performance fixed-point TEAKlite DSP
• C166S high performance microcontroller
• There are several Interfaces:
- I2S interface for DAI connections (for Tape Approval)
- High Speed SSC Interface for connection of external peripherals
- SIM Interface
- Keypad Interface (6x4 or 5x5 keys)
- EBU for external RAM/FLASH connection
- Asynchronous serial interface
- JTAG Interface
- Black & white and color displays are supported
- PWM source to drive vibrator
- Keypad and display backlight supported.
] Receiver
• Constant gain, direct conversion receiver with fully integrated blocking filter
• Two integrated LNAs
• No need of interstage and IF filter
• Highly linear RF quadrature demodulator
• Programmable DC output level
• Very low power budget.
] Transmitter
• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz
• Single ended outputs to PA, Pout = +3.5 dBm
• Very low power budget.
] RF-Synthesizer
• Σ∆Synthesizer for multi-slot operation
• Fast lock-in times (< 150 •Ïs)
• Integrated loop filter
• RF Oscillator
• Fully integrated RF VCO.
] Crystal Oscillator
• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.

- 16 -

3. TECHNICAL BRIEF

] Mixed Signal and Power Management Unit
• DC/DC boost for voltages up to 15V for driving White or Blue LEDs
• 8-Ohm loud speaker driver (250/350mW)
• 16-Ohm earpiece driver
• 32-Ohm headset driver
• 4 measurement interfaces (PA temperature, battery voltage, battery temperature,and ambient
temperature)
• Differential microphone input
• System start up circuitry
• Charger circuitry for NiCd, NiMh and LiIon cells
• Integrated regulators for direct connection to battery.

- 17 -

3. TECHNICAL BRIEF

3.1.3 GSM System Description
The E-GOLDvoice is suited for mobile stations operating in the GSM850/900/1800/1900 bands.
In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified
to target level by the RF transceiver chipset.
Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel
filtering is done by a digital baseband filter in each path.
The DSP performs:
1. The GMSK equalization of the received baseband signal (SAIC support available)
2. Viterbi channel decoding supported by an hardware accelerator.
The recovered digital speech data is fed into the speech decoder.
The E-GOLDvoice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC
algorithms.
The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data
stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a
programmable gain stage.
The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output
driver for external loud speaker is implemented.
In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.
The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled
voice signal passes a digital decimation filter.
The E-GOLDvoice performs speech and channel encoding (including voice activity detection (VAD)
and discontinuous transmission (DTX)) and digital GMSK modulation.
In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in
the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLDvoice
supports dual band applications.
Finally, an RF power module amplifies the RF transmit signal at the required power level. Using
software, the E-GOLDvoice controls the gain of the power amplifier by predefined ramping curves (16
words, 11 bits).
For baseband operation, the E-GOLDvoice supports:
• Making or receiving a voice call
• Sending or receiving an SMS.

- 18 -

3. TECHNICAL BRIEF

3.1.4 PMU Details
The E-GOLDvoice includes battery charger support (various sensor connections for temperature,
battery technology, voltage, etc.) and a ringer buffer.
E-GOLDvoice avoids the need for an external power management component because its internal
power management unit contains:
• Voltage regulators for the On-chip and Off-chip functional blocks
• Charger circuitry for NiCd, NiMh and LiIon cells.

3.1.5 Bus Concept
The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus.
There is an interconnection between the TEAKlite bus and the C166S X-Bus.

3.1.6 C166S Buses
The C166S is connected to three buses:
1. Local Memory (LM) bus
2. X-Bus
3. PD-Bus.

3.1.7 TEAKLite Bus
The TEAKlite is connected to the TEAKlite bus.

3.1.8 Bus Interconnections
The interconnection between the X-Bus and the TEAKlite Bus uses:
• Multicore Synchronization
• Shared Memory.

3.1.9 Clock Concept
The E-GOLDvoice has a flexible clock control.

3.1.10 Interrupt Concept
The C166 MCU carries out the E-GOLDvoice interrupt system.

3.1.11 Debug Concept
The E-GOLDvoice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in
parallel with:
• A single JTAG port (that is, on a single host)
• Mutual breakpoint control.

- 19 -

3. TECHNICAL BRIEF

3.1.12 C166 Debug Concept
The debugging of the C166 uses the OCDS and the Cerberus.

3.1.13 TEAKLite Debug Concept
TEAKlite debugging uses the OCEM and the SEIB.

3.1.14 Power Management
The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone
application. The integrated PMU is directly connected to the battery and provides a set of linear
voltage regulators (LDO’s).
These LDO’s generate all required supply voltages and currents needed in a low feature mobile
phone. A charger control circuit charges NiCd, NiMH and LiIon batteries.
The charger control supports hardware controlled pre-charging and software controlled charging. It
offers a wide charger voltage range, making halfwave/full-wave charging with cheap transformers
possible.
White/blue backlight generation is supported with a special driver for very a low external parts count.
Power consumption during operation phases is minimized due to flexible clock switching In the
Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the
controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during
Standby via SW.

3.1.15 On-Chip Security Concept
Secure boot is based on a public/private key approach. Flash images that are not signed with the
private key during phone manufacture cannot be loaded.
Verification of the Flash code is done with the public key. The public key as well as hash and verify
algorithms are stored in the ROM, which ensures a hardware secured boot procedure.
The following security features are supported:
• Prevention of illegal Flash programming
• Flash programming makes use of the E-GOLDvoice ID for personalization checks with IMEI and
SIM-lock protection

- 20 -

3. TECHNICAL BRIEF

The security features use the following mechanism:
• Boot ROM flow:
- Controls the boot transition to external flash
- Controls the flash update
• Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLDvoice chip has its
own fused ID.
Further details on the E-GOLDvoice security concept are not publicly documented.

3.1.16 Asynchronous Operation Mode Concept
The E-GOLDvoice can operate in either:
• The traditional synchronous mode with the 26MHz system clock synchronized on the base station
• A special asynchronous mode (XO concept).
In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the
residual frequency offset is compensated in the digital signal processing domain. This processing
includes frequency and timing compensation of the baseband and voiceband signals.

- 21 -

3. TECHNICAL BRIEF

3.2 Power Amplifier Module (SKY77318)

Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching
circuitry for 50 Ω input and output impedances and a Power Amplifier Control (PAC) block with an
internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC
function and interface circuitry.
Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA
block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA
blocks share common power supply pins to distribute current.
The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold.

- 22 -

3. TECHNICAL BRIEF

RF input and output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the
number of external components for a quad-band design. Extremely low leakage current (2.5 µA,
typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains
bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the
Band Select (BS) signal.
In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT orGSM_OUT) and the Analog
Power Control (VAPC) controls the level of output power.
The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power
amplifier control (iPAC) function, which is insensitive to variations in temperature, power supply,
process, and input power.
The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.

- 23 -

3. TECHNICAL BRIEF

3.3 26 MHz Clock (DCXO)

Figure. 3-3 E-GoldVoice DCXO Overview

DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature
Compensated Crystal Oscillator) are two different techniques used To maintain the mobile’s reference
oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial
crystal frequency offset, temperature drift and aging.
These static and dynamic frequency variations have to be compensated, otherwise the mobile would
be in danger of losing connection to the network.
The technique used to perform the frequency compensation is generally termed Automatic Frequency
Control (AFC).
To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation
(which is continuously updated) required based on the measured frequency error. Then the required
AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns
control the DCXO core and generates The 26MHz system clock.

- 24 -

3. TECHNICAL BRIEF

3.4 RTC(32.768KHz Crystal)

32.768KHZ CRYSTAL
X100
32KIN
32KOUT

4

3

1

2

MC-146_12_5PF
18p

18p

C104

C105

32.768KHz

Figure. 3-4 E-Gold Voice RTC Interface

The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external
interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup
battery. This allows the generation of external interrupts, even when the main PMB7880 supply
voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC
and VSS_RTC.
The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880
F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip
32 KHz oscillator module.
The low clock frequency and the optimized low power design give the possibility to run the chip with a
minimum of power dissipation. For example, for this specific application the 26 MHz reference
oscillator can be switched off during system standby and a lowpower time reference can be kept when
the 32k clock is provided to the RTC.
The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32
kHz oscillator, as described in the following sections. The module RTC Shell solely performs level
translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally
associated with the RTC.

- 25 -

3. TECHNICAL BRIEF

3.5 LCD Interface(3-wire SPI interface)
2V8_VIO
CN200
1
2

LCD_RESET
SSC0_CLK

R205
R207

4

47

5

47

7

R206

47

8

R208

47

CS3
SSC0_MTSR

10

MLED1

11

MLED2
C209
27p

6

9

MLED

C208
NA

MTPD

3

MTPG

C210
27p

12
14
15

13
R210
100K

C211
27p

LCD_ID

C212
27p

C213
NA

C221
1u

IMSA-9671S-13Y902
(ENQY0013801)

Figure 3-5-1. LCD Interface

VBAT

CHARGE PUMP
U200
5

8

MLED

11

W_LED_DRV

R202
100K

C202
27p

4

IN

AAT3157ITP-T1
10
C1+

C1C2+

C200
1u

9
7
C201

CP

1u
C2-

EN_SET

GND

D1
D2
D3
NC

6
1
2
3
12

MLED1
MLED2

C203
27p

Figure 3-5-2. Charge pump interface

- 26 -

C204
27p

C214
NA

3. TECHNICAL BRIEF

Signals
CS3

Description
This signal enable to access to the driver IC of LCD.

SSC0_MTSR

This signal transfer serial data to driver IC.

SSC0_CLK

This signal transfer serial clock to driver IC.

LCD_RESET
MLED

This signal makes driver IC to HW default status.
This signal provide power to white LEDs.

MLED1/2

This signal be feed back from white LEDs.

2V8_VIO

This signal provides power to LCD modules.(2.8V)

The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a trimode
load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED
applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel
from a 2.7V to 5.5V input.
The current sinks may be operated individually or in parallel for driving higher current LEDs. A low
external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make
this part ideally suited for small, battery-powered applications. AnalogicTech's S2Cwire™ (Simple
Serial Control™) serial digital input is used to enable, disable, and set current for each LED with 16
settings down to 50µA.
The low-current mode supply current can be as low as 50µA to save power.

Data

Output (mA/Ch)

Data

Output (mA/Ch)

1

20.0

9

5.0

2

17.0

10

4.2

3

14.0

11

3.4

4

12.0

12

2.8

5

10.0

13

1.0

6

8.6

14

0.5

7

7.0

15

0.1

8

6.0

16

0.05

Figure 3-5-3. Charge pump Output Current

- 27 -

3. TECHNICAL BRIEF

3.6 SIM Card Interface
2V85_VSIM

SIM_DATA

R303

2V85_VSIM
0

R302

4.7K

2V85_VSIM

J300
4
GND
VCC
5
VPP
RST
6
CLK
I_O
8
GND2 GND1

1
2
3
7

SIM_RST
SIM_CLK
C311
0.1u

C310
22p

C312
22p

Figure 3-6. SIM CARD Interface

The EGoldVoice provides SIM Interface Module. The AD6527 checks status Periodically During
established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.

Signals

Description

SIM_RST

This signal makes SIM card to HW default status.

SIM_CLK

This signal is transferred to SIM card.

SIM_DATA

This signal is interface datum.

- 28 -

3. TECHNICAL BRIEF

3.7 KEYPAD Interface
2V0_VRTC

KEY MATRIX
END
SW200
END_KEY

1

SW201

2

SW202

3

SW203

SW204

LEFT

SW205

MENU

R201
KEY_OUT1
680
C205
NA

SW206

4

SW207

7

SW212

5

SW208

8

SW213

6

SW209

9

SW214

UP

SW210

SEL

R203
KEY_OUT2
680
C206
NA

SW211

RIGHT

SW215

SEND

R204
KEY_OUT3
680
C207
NA

SW216

*

SW2170

SW218

#

SW219

DOWN

R209
KEY_OUT4
680
C215
NA

C216
NA

C217
NA

C218
NA

C219
NA

C220
NA

R211 680
KEY_IN0
R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4

Figure 3-7 KEY MAXTRIX Interface

The keypad interface is connected to the X-Bus, together with the XBIU and the Shared Memory
Register, using a single Bus Interface.
The keypad supports two scan modes:
• By default, the keypad is a 4x6 scan matrix (4 input and 6 output pins).
• To set the keypad to a 5x5 scan matrix (5 input and 5 output pins)
The scan mode should be determined at the very beginning of the system start because changes are
not allowed later.

- 29 -

3. TECHNICAL BRIEF

3.8 Battery Charging Block Interface
CHARGING IC
2V8_VIO

VBAT VCHARGE

VCHARGE
R118
NA
R119

1.8K

U101
1

CHARGE_DETECT

2
R121
CHG_STATUS
NA
C126
(10V,K,X5R)
1u
C127
0.015u

VIN
_FAULT

VBAT
VSEN_TEMP

10
C125
1u

9

R120
NA

(10V,K,X5R)
3
4

_STATUS

IREF

TIME

V2P8

5
GND
11
PGND

EN

8
R122

0
CHG_EN_TEST

7
R123

6

NA
CHG_EN

C128

R124

R125

1u

160K

100K

ISL9201IRZ-T
(1%)

Figure 3-8. Charging IC Interface

The AAT3681A is a high performance battery charger designed to charge single Cell
lithiumion/polymer batteries with up to 500mA of current from an external power source.
It is a stand-alone charging solution, with just one external component required For complete
functionality. The AAT3681A precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells.
The adapter/USB charge input constant current level can be programmed up to 500mA for rapid
charging applications.
The AAT3681A has four basic modes for the battery charge cycle:
pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.

- 30 -

3. TECHNICAL BRIEF

3.9 RF Interface
LMSP2PAA-575TEMP

FL400
9
3
7

VC1
VC2
C417
27p

5
8
10

C418
27p

IN

GSM1800_1900TX
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
GND1
GND2
GND3

GSM850_900TX
GSM850_900RX

1
6

2
4

Figure 3-9-1. ASM interface
C419

G4

G3

G1

4 I2

O2_2

6

O2_1

7

O1_2

8

O1_1

9

C420

1 I1

FL401

GSM_RXN

L403
18nH

5 10
G2

3

2

3p

C421

3p

GSM_RXP

3p

DCS_RXN

B9308
L404
5.1nH

PART_NO SFSB0001401

IN CASE OF GSM850/PCS1900
CHANGE THIS DUAL SAW FILTER
TO PART_NO SFSB0001301

C422

3p

DCS_RXP

Figure 3-9-2. SAW Filter interface

E-GOLDvoice features a fully integrated constant-gain direct conversion receiver, i.e. there is no
interstage filter needed and the baseband level at the analogue IQinterface follows directly the RF
input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching
schemes are possible.
An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and
reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset
compensation is implemented and can be switched depending on the gain setting.

- 31 -

(50V,J,NP0)

(10V,Z,Y5V)

(50V,J,NP0)

VBAT

(16V,K,X7R)

(50V,J,NP0)

C401
39p

R402

1K

TX_RAMP

3. TECHNICAL BRIEF

VBAT
R404

R405
DCS_PCS_OUT

0

0

VAPC
15
R406

11

0
C411
NA

19

C412
NA

EGSM_OUT
RSVD_GND

U400
SKY77318

2

DCS_PCS_IN
EGSM_IN

3

(50V,J,NP0) (16V,K,X7R)
R407

4

GSM_OUT
0

ENABLE

P_GND

BS

18

TXON_PA

1

R408
NA

R409
NA

BS
C413
27p

C414
27p

16
14
13
12
10
9
8
7
5

R410
0
C415
NA

DCS_PCS_OUT

C408
0.01u
C409
NA

GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1

21

C407
27p
VCC1A

C406
18p

6

C405
33p

VCC1B

C402
10u
(2012)

VBATT

C404
0.01u

20

C403
12p

17

L402
NA

C416
NA

Figure 3-9-3. PAM(Power Amplifier Module) interface
The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant
envelope GMSK modulation. This configuration allows a very low power design with a reduced
external component count.
The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface
signal into the digital modulator.
The following Gaussian filter shapes the digital data stream for the GMSK modulation. Additionally a
pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low
distortion at the transmit output.
The filtered digital data stream is scaled appropriately and added to the channel word. This sum is fed
into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values
representing the high resolution fractional input signal. This sequence controls the MMD (multi
modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the
VCO is achieved.

- 32 -

3. TECHNICAL BRIEF

3.10 Audio Interface

K14
LOUD2
L15
LOUD1
VMIC
MICP2
MICN2
MICP1
MICN1
EPPA1
EPP1
EPN1

VMIC

SPK_N
SPK_P

P12
P11
R12
P15
R13
M14
M12
N15

AUXIP
AUXIN
VINNORP
VINNORN
EPPA1
REC_P
REC_N

C124
1000p

Figure 3-10-1 Audio interface

The audio front-end of E-GOLDvoice offers the digital and analog circuit blocks for both receive and
transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying
stages for connecting acoustic transducers to the E-GOLDvoice. In the transmit direction the supply
voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated
on the E-GOLDvoice.
For E-GOLDvoice the EPp1/EPn1 driver are used as differntial Earpiece-Driver, EPPa1 is used as
single-ended Headset-Driver.
The audio front-end itself can be considered to be organized in three sub-blocks:
• Interface to processor cores (TEAKlite and - indirectly - C166S)
• Digital filters
• Analog part.

- 33 -

3. TECHNICAL BRIEF

The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus
and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller.
The audio front-end Generates interrupts on certain occasions, for example, when exchange of data is
requested. The core interface part of the audio front-end also contains the control and status registers
which are used to set up certain operation modes of the peripheral.
The section next to the core interface contains the digital filters for interpolation and decimation of the
audio signals being received and transmitted. The data path for the receive direction can be set up to
process sampling rates between 8kHz and 48kHz.
The interpolation filters for the respective sampling rates are implemented in a dedi-cated hardware
block and are automatically selected to suite the chosen sampling rate.
Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of
4 MHz, is performed digitally. D-to-A conversion, postfiltering, and final amplification are performed on
the analog part. The amplifier buffer for voiceband receive does also support ringer functionality. The
ringer functionality is activated by Setting bits RINGSELPN or RINGSELPA in the voiceband part of
the analog control register.
In transmit direction, amplification, prefiltering and A-to-D conversion (analog ∑∆ modulation) are
performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass
decimation filter for further processing by DSP firmware.
Two sampling rates, 8kHz and 16kHz, are supported.
The analog section contains all the necessary analog functional blocks including microphone supply
generation, output and input amplifiers and analog filtering.
Signals

Description

EPp1

Main Receiver Positive signal(Differential signal)

EPn1

Main Receiver Negative signal(Differential signal)

EPpa1

Headset signal(Single Ended signal)

Loud1

Speaker Output Positive signal(Differential signal)

Loud2

Speaker Output Negative signal(Differential signal)

MICP1

Main Microphone Positive signal(Differential signal)

MICN1

Main Microphone Negative signal(Differential signal)

MICP2

Headset Microphone Positive signal(Differential signal)

MICN2

Headset Microphone Negative signal(Differential signal)

VMIC

Main/Headset Microphone supply power

- 34 -

3. TECHNICAL BRIEF

RECEIVER
L100

22nH

L101

22nH

CN100
1

REC_P

2

C100
39p

11*07*3T receiver

REC_N

(SURY0013001)
C102
39p

C103
39p

Figure 3-10-2 Main Receiver interface

SPEAKER

SPEAKER AMPLIFIER
R102
C116

R103

NA

VBAT

82K

NA

C118

0.1u

R105

U100
A3

20K
SPK_P

A1
C3

20K

100K

R110

0.22u

LOUD_SPK_EN

82K

R106

C1

INM

OUTA

_SD

VM

BYPASS

VP

L103

27nH CN101
1

L104

27nH
2

A2
B2

16pi 3.4T speaker

(SUSY0025801)

B3

C120
1 uF

D100

C122 C123
0.1u 0.1u

(2012)
C121

RADIO_SPK_L

0.1u

R108

20K
C119

NCP2890AFCT2G
C2
OUTB

INP

(10V,K)

Gain : Rf/Rin

Figure 3-10-3 Main Speaker interface

- 35 -

diode

R104

diode

0.1u

VM_P

C117

B1

SPK_N

D101

3. TECHNICAL BRIEF

VMIC

MAIN_MIC
R300
1K

R301

C303
39p

2.2K

R304

C306

VINNORP

C304
10u

0.1u
OB4-15L42-C33L

100ohm
C308

C307
0.1u

2
1

39p
R307

C309

0.1u

MIC300

VINNORN

R309

C313

2.2K

C314

39p

39p

100ohm

Figure 3-10-4 Main Microphone interface

1.5K

R316

VMIC

C317

R318

AUXIN
C318
NA

C320

0.1u

C321

2V8_VIO

39p

AUXIP

EAR_MIC
I/O CONNECTOR

2.2K
C319
10u

0.1u

R321

100K

VCHARGE

FOR RADIO
FB300

1800

FB301
FB302

10u
10u

1800
1800

HS_DET
2V8_VIO

39p

39p

RPWRON
R324
100K

C326

C323
C324

C325

NA

R323 100K

R322

CN301

2V8_VIO

2V8_VIO

AUXOP_FML
AUXOP_FMR
TXD
RXD

FM_ANT
VBAT

DSR
C328
56p

C327
10u
(2012)
(10V,Z,Y5V)

(50V,J,NP0)

L300
270nH
1608

21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18

FOR RADIO

2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG

20
22

HSEJ-18S04-25R
VBAT

BATT_TEMP

R332

C336
3p

0

3
2
1
CN302

C337
18p
(50V,J,NP0)

(50V,C,NP0)
(TOL:0.25P)

Figure 3-10-5 Headset interface

- 36 -

C322
10p

3. TECHNICAL BRIEF

3.11 Key LED Interface

KEY_BACKLIGHT

R222

1K

1u
C223

R221
100ohm
LD205
LEBB-S14H

R220
100ohm
LD204
LEBB-S14H

R219
100ohm
LD203
LEBB-S14H

R218
100ohm
LD202
LEBB-S14H

R217
100ohm
LD201
LEBB-S14H

R216
100ohm

1u
C222
(10V,K,X5R)

VBAT

LD200
LEBB-S14H

KEY BACKLIGHT

(10V,K,X5R)

2SC5585
Q200
R223
10K

Figure 3-11 Key LED interface
This handset has 6 LEDs that illuminates blue color.
Control signal is controlled by EGold-voice with PWM and handset has 3 methods, ON, OFF and
Dimming.

- 37 -

3. TECHNICAL BRIEF

3.12 Vibrator Interface

VIBRATOR
VBAT

C302
27p
(50V,J,NP0)

CN300
1

D300

1SS302-T5L_F_H

VBAT

2
C305
R305
27p
10

R306

(1608)

Q300
2SC5585

VIBRATOR
100K

R308

1K

Figure 3-12 Vibrator interface
This handset has vibrator operation. Control signal is controlled by EGold-voice with PWM.

- 38 -

3. TECHNICAL BRIEF

3.13 Memory Interface
VBAT

(NOT MOUNTED)

2V8_VMEM_S

U300

BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT

C300
NA

MEMORY

C301
NA
U301
G2
E3
H3
F4
F5
H6
E6
G7
H2
F3
G3
H4
G6
F6
H7
F7

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

G4
R310

0

G5

2V8_VMEM_S

VCCF
VCCS

2V8_VMEM
2V8_VMEM

R311

NA

R315

NA

2V8_VIO

C316
0.1u

_OE
_WE
_LB
_UB
_CE1F
_CE1S
CE2S
RY__BY
WP_ACC
_RSTF

G8
VSS1
E2
VSS2
C8
D8
E7
F8
H5

RFU0
RFU1
RFU2
RFU3
RFU4

_OE
_WR
ADD00
BHE_N
CS0n
CS1n

0

TP300
F2
A5
A3
B3
F1
G1
B5
C4
A4
B4

R314

C315
0.1u

ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21

R313 100K

2V8_VMEM

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

S71GL032A40BAW0F
E1
A0
D1
A1
C1
A2
B1
A3
D2
A4
C2
A5
B2
A6
A2
A7
A6
A8
C6
A9
D6
A10
A7
A11
B7
A12
C7
A13
D7
A14
B8
A15
E8
A16
D3
A17
C3
A18
B6
A19
C5
A20

R312 100K

1
2
3

_RY_BY

Figure 3-13 Memory interface

In E-GOLDvoice, the 16bits demultiplex X-bus interface is used for memory device support. NOR
Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be
supported for flash memories.
Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus
interface.
Up to 3 external CS signals can be generated to save external glue logic.
Access to very slow memories is supported via a special ‘Ready’ function.
The system MCU clock is set to run with 26Mhz.

- 39 -

3. TECHNICAL BRIEF

1V5_VRF0

2V85_VSIM

2V8_VIO

VRF1

1u

1u
C109

1u

1u
C108

C110

1u

C106

C112
22K

220n

R101

C114

VBAT

VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13

J13
K15
F15
B11
K10
M11
J10
G12
K12

G13
G15
G14
J12
J14
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP

VSS9
VSS8
VSS6
VSS5
VSS4
VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1

6.8K

C111
1u

BAT100

C113
1u

VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC

2V0_VRTC
2V8_VIO
2V8_VMEM

L102
18nH

M8
F10
K7
K8
J8
B9
B8
R7
R6
F6
L4
G10
J7
G9

2V85_VSIM

R100

C107

2V0_VRTC
1u

2V5_VANA

VD1

(1608)

C101

2.2u

VD1

3V2_VBUF

2V8_VMEM

3.14 Power Block Interface

C115
(1608)
2.2u
REXT

D12

(16V,K,X5R)

A9
XOX
A8
XO

Figure 3-14-1 Power Block interface

The E-GOLDvoice integrated power management unit (PMU) supports direct connection to battery
(DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage
regulators. The input of these linear voltage regulators is the battery voltage. The external memory and
SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal
generated supply voltages.
The integrated power management also provides the control state machine for system start up,
including start up with discharged batteries, trickle charging and system reset control. After system
start up several methods are implemented for active and idle power saving.

- 40 -

3. TECHNICAL BRIEF

Name

Output Voltage(V) Output Current (mA)

Comment

LRTC

2.0

4

Used for the real time and digital PMU supply

LD1

1.2/1.5

150

Used for the core supplies (MCU and DSP via switch)

LIO

1.8/2.85

30

Used for the I/O pad supply and, for example, the display

LRFXO

2.5

10

Used for the crystal oscillator supply

LMEM

2.5

100

Used for the external memory supply, voltage can be
configured during startup

LANA

2.5

100

Used for analog (audio and baseband processing) and
headset driver

LSIM

1.8/2.85

30

Used of the SIM card supply

LBUF

2.6/2.8/3.0/3.2

300

Used for the loudspeaker and earpiece driver

LRFRX

2.5

100

Used for the RF RX part

LRFTRX

1.5

120

Used for the RF TX/TX part

Figure 3-14-2 EGold Voice PMU
LDO output voltage selection
• LD1, LIO, LSIM, LBUF output voltage programmable by software.
• LMEM output voltage is selectable by pin configuration upon startup.
Active and idle power saving options:
• The flexible clock switching options allow minimizing the power consumption during the operation
phases of the E-GOLDvoice.
• Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and
switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is
switched off and the controller RAM is switched to a power saving mode.
Start-up and Reset Control State Machine Features
• Power up upon battery insertion, push button, alarm, charger connection.
• Detection of battery exchange or re-insertion.
• Complete start-up sequence management.
• System turn-on, system turn-off operation management including emergency (under-voltage) and
programmed shutdown functions.
• Internal reset of the baseband, including silent reset.
• Tri-state function of the baseband module.
• Standby mode controlled by VCXO_EN provided by SCCU module.

- 41 -

27K

2.7K

NO RADIO

RADIO_DETECT

RADIO

R339
27K

RADIO_DETECT

RADIO_EN

0

NA

C334

R343
100K

1
2
3

(10V,K,X5R)

C341
1u

VBAT

1
2
3
4
5

U302
SI4702-B16

BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT

C342
1u

2V8_RADIO

R334
10K

NC1
FMIP
RFGND
GND1
_RST

2V8_RADIO

U304

FM_RST

FM_SCL
FM_SDA

FM_RST

C331 100p

NA

FM_INT
RADIO_AMP_SHDN
TP301
FM_INT

_SEN
SCLK
SDIO
RCLK
VIO
6
7
8
9
10

R325

4.7K

FM_ANT

R328

R336

RADIO_AMP_SHDN (FOR FM RADIO)

PGND
NC2
GPIO1
GPIO2
GPIO3
VA

21
20
19
18
17
16
4.7K

15
14
13
12
11

47

R338

FM_32K

0.1u
0.1u

EPPA1

FOR RADIO

AUXOP_FMR

RADIO_SPK_R

C335
22n

C332
C333

C329
1u 2V8_RADIO

2V8_RADIO

2V8_RADIO

GND3
LOUT
ROUT
GND2
VD

0.1u

2V8_VIO

R337

- 42 C339

RADIO

20K
20K

R342
NA

C340
0.1u

2

5

4

3

C338
0.1u

NC1

IN1

COM1

NO1

VCC

GND

NC2

IN2

COM2

NO2

6

7

8

9

10

U305
NLAS5223BMNR2G

R335
100K

1

2V8_VIO

RADIO_AMP_SHDN

R329
R330

C330
1u

2V8_RADIO

VIN2

VIN1

VDD

VOUT2

VOUT1

U303 LM4809LD

39K

R345
100K

NA

R340

R333

R327

R331

AUXOP_FML

RADIO_SPK_L

3
9

6

8

HEADSET_RADIO_SEL

FOR RADIO

39K

2
BYPASS GND
4
_SHDN BGND

5

1

7

R326

0

0

240K

R344

330K

R341

2V8_VIO

EPPA1

RADIO_SPK_R

RADIO_SPK_L

3. TECHNICAL BRIEF

3.15 FM Radio Interface

3. TECHNICAL BRIEF

3.15.1 FM Tunner
The Si4702 patented digital low-IF architecture reduces external components and eliminates the need
for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the
worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the
gain of the LNA to optimize sensitivity and rejection of strong interferers.
For two-wire operation, a transfer begins with the START condition. The control word is latched
internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address
equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address
by setting SDIO low on the next falling SCLK edge. For write operations, the device acknowledge Is
followed by an eight bit data word latched internally on rising edges of SCLK.
The device always acknowledges the data by setting SDIO low on the next falling SCLK edge. An
internal address counter automatically increments to allow continuous data byte writes, starting with
the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower
byte of the last register is reached. The internal address counter then automatically wraps around to
the upper byte of register 00h and proceeds from there until continuous writes cease. Data transfer
ceases with the STOP command. After every STOP Command, The internal address counter is reset.
For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling
SCLK edges. An internal address counter automatically increments to allow continuous data byte
reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and
onward until the lower byte of the last register is reached. The internal address counter then
automatically wraps around to the upper byte of register 00h and proceeds from there until continuous
reads cease. After each byte of data is read, the controller IC should return an acknowledge if an
additional byte of data will be requested. Data transfer ceases with the STOP command. After every
STOP command, the internal address counter is reset.

3.15.2 Headphone Amplifier
The MAX4411 fixed-gain, stereo headphone driver features Maxim’s patented DirectDrive architecture,
eliminating the large output-coupling capacitors required By conventional single-supply headphone
drivers. The device consists of two 80mW Class AB headphone drivers, internal feedback network
(fixed -1.5V/V gain), undervoltage lockout (UVLO)/shutdown control, charge pump, and
comprehensive click-and-pop suppression circuitry.

- 43 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 RF Trouble

SW400

FL400

FL401

U400

U102
X101

REFERENCE

PART Description

U400

PAM (Power Amp. Module)

X101

DCXO (26MHz)

FL400

ASM (Antenna Switch Module)

SW400

Mobile Switch

FL401

RX SAW Filter

- 44 -

4. TROUBLE SHOOTING

RF Trouble
TEST POINT

Antenna Matching component

Antenna.Contact Point

SW400

TP400

TP401

TP402

TP403

TP404

TP405

CIRCUIT DIAGRAM
R400
NA
R401

L400

Antenna Matching component

0

R403

L401

Coupling Capacitor

- 45 -

G2

RF

G1

ANT

SW400
RF500

Mobile SW

1p

2.2nH

C400

0

C410
22p

22nH

4. TROUBLE SHOOTING

CHECKING FLOW

START

NG

Check
Antenna PAD&
Intenna Contact

Change Antenna

NG

Check
Matching component

Resolder component

OK
NG
Check
Mobile SW

Change SW400

OK

Download
And
Calibration

NG

Change PCB

- 46 -

4. TROUBLE SHOOTING

RX Trouble
TEST POINT

CHECKING FLOW

START

Setup Test Equipment
Cell Power :-74d Bm
GSM850 CH190
PCS CH660

SW400

FL400

Check point.
DCXO(X101)

FL401

U400

Check point
mobile SW &
ASM & SAW
Filter(SW400,F
L400,FL401)
U102
X101

Re-Download S/W &
CAL

- 47 -

4. TROUBLE SHOOTING

RX Trouble
(1) Checking VCTCXO Circuit
TEST POINT

CHECKING FLOW

Is the waveform
of Pin3 similar to
DCXO(X101)
Waveform?
SW400

Yes

FL400

DCXO Circuit is OK.
See next page to check
PLL Circuit.

FL401

U400

U102
X101

CIRCUIT

Waveform

4

HOT1 1

GND2

Pin 2

X101
NX3225SA
3 HOT2

2 GND1

26MHz

Waveform

( NX3225SA(W-188-34-7)

Pin 1

2V8_VIO

R107
NA

- 48 -

No

Replace
X101

4. TROUBLE SHOOTING

RX Trouble

TEST POINT

CHECKING FLOW

Check Pin 1, 2 of
SW400
with RF Cable

SW400

Signal is
OK ?

Replace
Mobile SW
(SW400)

Yes

FL400

Pin 6

Pin 4

N
o

Check Pin 4,6 of
FL400 ?

FL401

N
o

Replace ASM
(FL400)

U400

Yes

Check Pin 6,7 and 8,9 of
FL401 ?
U102

N
o

Replace SAW
Filter (FL401)

Yes

Mobile SW & ASM is OK.
See next page

* FL401 6,7 and 8,9 output are
balanced

- 49 -

4. TROUBLE SHOOTING

4.2 TX Trouble
TEST POINT

CHECKING FLOW
Setup Test Equipment
Cell Power : - 74dBm
GSM850 CH190
PCS CH661

Check point
DCXO(X101)

SW400

FL400

Check point
ULC2(U102)Outp
ut Signal

FL401

U400

Check point
PAM(U400)
Control Signal

Check
ASM & Mobile
S/W & SAW
(FL400,SW400
,FL401)

U102
X101

Re-Download S/W & RF
CAL

- 50 -

4. TROUBLE SHOOTING

TX Trouble
CIRCUIT

(50V,J,NP0)

(10V,Z,Y5V)

(50V,J,NP0)

(50V,J,NP0)

VBAT

(16V,K,X7R)

U400

C401
39p

R402

1K

TX_RAMP

TEST POINT

VBAT
R404

R405
DCS_PCS_OUT

0

0

VAPC

LB RF Input

15
R406

11

0
C411
NA

19

C412
NA

EGSM_OUT

2

DCS_PCS_IN

U400
SKY77318

RSVD_GND

EGSM_IN

(50V,J,NP0) (16V,K,X7R)
R407

4

GSM_OUT
0

ENABLE

P_GND

BS

18

TXON_PA

1

R408
NA

R409
NA

BS
C413
27p

C414
27p

16
14
13
12
10
9
8
7
5

R410
0

HB RF Input

DCS_PCS_OUT

C408
0.01u
C409
NA

3

GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1

21

C407
27p
6

C406
18p

VCC1A

C405
33p

(2012)

VCC1B

C402
10u

20

C404
0.01u

VBATT

C403
12p

17

L402
NA

C416
NA

C415
NA

U102

Waveform

CHECKING FLOW
Check Control
Signals

Signals are
Normal ?

Yes

Paon & BS

ASM

PAM Control
Signal is OK.
See next page to
check
ASM & Mobile SW
Circuit.

Vapc

- 51 -

N
o

Check
ULC2(U102)

4. TROUBLE SHOOTING

TX Trouble
TEST POINT

CIRCUIT
TP400

TP401

TP402

TP403

TP404

TP405

R400
NA
R401

C400

0

1p

L400

2.2nH

SW400

L401

SW400
RF500

FL401

G2

RF

G1

ANT

U400

0

R403

FL400

22nH

C410
22p

U102
X101
FL400
9
3
7

VC1
VC2
C417
27p

LMSP2PAA-575TEMP

1
GSM1800_1900TX
6
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
IN

5
2
GND1 GSM850_900TX
8
4
GND2 GSM850_900RX
10
GND3

C418
27p

Mode

GSM900 TX

DCS1800 TX

GSM800 RX

DCS1800 RX

VC1

H(2.7V)

L

L

L

VC2

L

H(2.7V)

L

L

- 52 -

4. TROUBLE SHOOTING

RX Trouble
TEST POINT

CHECKING FLOW
Check Pin 1, 2 of
SW400
with RF Cable

Signal is
OK ?

SW400

No

Replace Mobile
SW (SW400)

No

Check ULC2
(U102)

No

Replace ASM
(FL400)

Yes

FL400

Pin 1

Pin 7

Pin 2

FL401

U400

Pin 3

Check Pin 1,2

Yes

Control
Signal is
OK ?
Yes

U102
Pin 3,7
Signal is
normal ?
Yes

Mobile SW & ASM is
OK.
Check Antenna.

- 53 -

4. TROUBLE SHOOTING

4.3 Power On Trouble
TEST POINT
Check Points
C107

-Battery Voltage( Need to over 3.35V)

C111

-Power-On Key detection (PWRON signal)

C101

-Outputs of LDOs from EGV
LDO

VOLTAGE

PART

V_BUF

3.2V

C101

V_MEM

2.8V

C109

V_IO

2.8V

C107

V_SIM

2.85V

C108

VRF0

1.5V

C110

V_ANA

2.5V

C113

C109
C110

EGV
IC

C106

26Mhz

1V5_VRF0

VRF1

1u

1u
C109

1u

1u
C108

C110

1u

C106

C112

- 54 -

VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13

22K

220n

R101

C114
G13
G15
G14
J12
J14

J13
K15
F15
B11
K10
M11
J10
G12
K12

VBAT

IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP

VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1

6.8K

C111
1u

BAT100

C113
1u

VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC

2V0_VRTC
2V8_VIO
2V8_VMEM

L102
18nH

B9
B8
R7
R6
F6
L4
G10
J7
G9

2V85_VSIM

R100

C107

2V0_VRTC
1u

2V5_VANA

VD1

(1608)

C101

2.2u

VD1

3V2_VBUF

2V8_VMEM

2V8_VIO

2V85_VSIM

CIRCUIT

C115
(1608)
2.2u
REXT

D12

A9
XOX
A8
XO

(16V,K,X5R)

4. TROUBLE SHOOTING

Power On Trouble
CHECKING FLOW

START

Check Battery Voltage
> 3.35V

NO
Charge or Change Battery

YES

Push power-on key
And check the level change
of PWRKEY

NO

Check the contact of power key
Or dome-switch

YES

Check the voltage of
The LDO outputs at U102

NO
Replace U102

YES

THE PHONE WILL
POWER ON.

- 55 -

LDO

VOLTAGE

PART

V_BUF

3.2V

C101

V_MEM

2.8V

C109

V_IO

2.8V

C107

V_SIM

2.85V

C108

VRF0

1.5V

C110

V_ANA

2.5V

C113

4. TROUBLE SHOOTING

4.4. SIM Card Trouble
TEST POINT

R302/C310

J300.PIN1
C331/C332

CIRCUIT DIAGRAM
2V85_VSIM

0

2V85_VSIM

SIM_DATA

R303

R302

4.7K

2V85_VSIM

J300
4
GND
VCC
5
VPP
RST
6
CLK
I_O
8
GND2 GND1

1
2
3
7

SIM_RST
SIM_CLK
C311
0.1u

C310
22p

- 56 -

C312
22p

4. TROUBLE SHOOTING

Checking Flow

START

NO
Change the SIM Card. Our phone
supports only 3V SIM card.

Does the SIM cards
supports 3V ?

YES

R302/C310/
C311/C312

Check soldering
status of J300 and
Other component

NG
Resolder J300 or
other component

OK

J300.PIN1 = 2.85V

NG
Check J300.PIN1

OK

Re-download SW

Check Operation

OK

Change board

- 57 -

Change board

4. TROUBLE SHOOTING

4.5. Vibrator Trouble
TEST POINT

Q300.PIN3
R306

R308
R305

CIRCUIT DIAGRAM
VBAT

C302
27p
(50V,J,NP0)

CN300
1

D300

1SS302-T5L_F_H

VBAT

2
C305
R305
27p
10

R306

Q300
2SC5585

VIBRATOR
100K

R308

1K

- 58 -

(1608)

4. TROUBLE SHOOTING

Checking Flow

START

Enter the engineering mode,
and set vibrator on.

R306=2.8V
R308=0.7V

Check Voltage Level of
R306/R308

NG
Change PCB

OK

Q300.PIN3=0V
R305=0V

Check Voltage Level of
Q300.PIN3 and R305

OK

Replace Vibrator

- 59 -

NG
Change Q300

4. TROUBLE SHOOTING

4.6. Keypad Trouble
TEST POINT

R215
R201

R214

R211

R212
R203

R209
R204

R213

CIRCUIT DIAGRAM
2V0_VRTC

KEY MATRIX
END
SW200
END_KEY

1

SW201

2

SW202

3

SW203

SW204

LEFT

SW205

MENU

R201
KEY_OUT1
680
C205
NA

SW206

4

SW207

7

SW212

5

SW208

8

SW213

6

SW209

9

SW214

UP

SW210

SEL

R203
KEY_OUT2
680
C206
NA

SW211

RIGHT

SW215

SEND

R204
KEY_OUT3
680
C207
NA

SW216

*

SW2170

SW218

#

SW219

DOWN

R209
KEY_OUT4
680
C215
NA

C216
NA

C217
NA

R211 680
KEY_IN0
R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4

- 60 -

C218
NA

C219
NA

C220
NA

4. TROUBLE SHOOTING

Checking Flow

START

NG
Check Metal Doom

Change Metal Doom

OK

R201/R203/R204
R209/R211/R212
R213/R214/R215

Check soldering status
Of component

OK
Change PCB

- 61 -

NG
Resolder component

4. TROUBLE SHOOTING

4.7 RTC Trouble
CIRCUIT
Check Points
- 32.768KHz is right clock
- The power of RTC is right.

N7
SWITCH_ON
P6
OSC32K
R5
F32K
B4
CLKOUT

PWRON
32KOUT
32KIN
CHG_STATUS

X100
2

1u

1

BAT100

22K
R101

18p
C105

C114
G13
G15
G14
J12
J14
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP

VDD_LD1
G12
VDD_LRTC
K12

18p
C104

32.768KHz

220n

MC-146_12_5PF

- 62 -

6.8K

VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13

32KOUT

3

C112

32KIN

R100

4

4. TROUBLE SHOOTING

CHECKING FLOW

START

Is the frequency
about 32Khz?

Replace X100 and try again.

YES

Is VRTC
about 2.0V?

Replace BAT100

YES

RTC will work properly

- 63 -

4. TROUBLE SHOOTING

4.8. Key backlight Trouble
TEST POINT

D203

D200

Q200.PIN3
R204
D20 4

D201

R203

Q200.PIN2
D205

D202

CIRCUIT DIAGRAM

KEY_BACKLIGHT

R222

1K

2SC5585
Q200
R223
10K

- 64 -

1u
C223

R221
100ohm
LD205
LEBB-S14H

R220
100ohm
LD204
LEBB-S14H

R219
100ohm
LD203
LEBB-S14H

R218
100ohm
LD202
LEBB-S14H

R217
100ohm
LD201
LEBB-S14H

R216
100ohm

1u
C222
(10V,K,X5R)

VBAT

LD200
LEBB-S14H

KEY BACKLIGHT

(10V,K,X5R)

4. TROUBLE SHOOTING

Checking Flow

START

R222=2.8V

Check Voltage Level
Of R222

NO

Change PCB

Replace component
YES
NG

R222=0.7V

Check Voltage Level
Of R222 and Q200.PIN2

NO
Check component
R222 and Q200

YES

LD200~LD205
R216~R221

Check LED
component

YES

Change PCB

- 65 -

NO

Replace component

4. TROUBLE SHOOTING

4.9. LCD Trouble
TEST POINT
CN200

R207R205

R206R208

C221

CIRCUIT DIAGRAM
2V8_VIO
CN200
1
2
MTPG

LCD_RESET
SSC0_CLK

R205
R207

5

47

7

MLED2
C208
NA

4

47

MLED

C209
27p

C210
27p

MTPD

3

6

R206

47

8

R208

47

CS3
SSC0_MTSR

9
10

MLED1

11
13

R210
100K

12
14
15

IMSA-9671S-13Y902
(ENQY0013801)

- 66 -

LCD_ID
C221
1u

C211
27p

C212
27p

C213
NA

C214
NA

4. TROUBLE SHOOTING

Checking Flow

START

NO
Backlight is OK?

Change PCB

YES

Check Operation
After LCD changes

OK

Change LCD

NG
C221=2.8V
Control Signal=
Refer to next page

Check Control
Signal and Power
Including soldering status

NG

Replace component
Or change PCB

OK

Check soldering
status of CN200

OK

Change PCB

- 67 -

NG

Replace CN200

4. TROUBLE SHOOTING

WAVEFORM

SS0_SCK

LCD_CS

]SS0_MTSR pattern is out randomly when clock is fluctiatied.
, clock frequency is 13MHz and LCD_RESET is High(2.8V).

- 68 -

4. TROUBLE SHOOTING

4.10. Microphone Trouble
TEST POINT

Microphone component

R300

MIC.P

CIRCUIT DIAGRAM
VMIC

MAIN_MIC
R300
1K

R301

C303
39p

2.2K

R304
VINNORP

C306

C304
10u

0.1u
OB4-15L42-C33L

100ohm
C308

C307
0.1u

39p
R307

C309

0.1u

MIC300

VINNORN
39p
C314

2.2K

39p

R309

C313

100ohm

- 69 -

2
1

4. TROUBLE SHOOTING

Checking Flow

Make a call

R300.VMIC=2.5V

NO

Check voltage level
of R300

Replace PCB

YES

NG

Check component
status around MIC

Re-solder or
replace the Component

OK

Check status of MIC

NG

Re-solder or
replace Microphone

OK

Check the voltage Level
of MIC_P
MIC_P= about 1.2~1.5V DC
with a few tens mV
OK

Replace PCB

- 70 -

NG
Change Microphone

4. TROUBLE SHOOTING

4.11. Receiver Trouble
TEST POINT

L101
C103

L100
C102

REC.N

REC.P

CIRCUIT DIAGRAM

RECEIVER
L100

22nH

L101

22nH

REC_P
C100
39p

CN100
1
2

11*07*3T receiver

REC_N

(SURY0013001)
C102
39p

- 71 -

C103
39p

4. TROUBLE SHOOTING

Checking Flow

Press any Key

Check L100/L101
C102/103

Check component
status

NG

Re-solder or
replace the Component

YES

L100&L101 bias will
Fluctiate signal above
1.2V

Check L100 &
L101

NG

Re-solder or
replace the Component

OK

Check Receiver

OK

Replace PCB

- 72 -

NG

replace Receiver

4. TROUBLE SHOOTING

4.12 Speaker Trouble
TEST POINT
Check Points
- Speaker spring contact
- Audio amp soldering

L103

L104

CN101íS 1PIN

CN101íS 2PIN

C120

CN200
AMP IC

C117

R111

C118

CIRCUIT

SPEAKER

SPEAKER AMPLIFIER
R102
C116

R103

NA

VBAT

82K

NA

C118

0.1u

R105

U100
A3

20K
SPK_P

A1
C3

R106
20K

100K

R110

0.22u

LOUD_SPK_EN

82K

0.1u

C1

INM

OUTA

_SD

VM

BYPASS

VP

L103

27nH CN101
1

L104

27nH
2

A2
B2

16pi 3.4T speaker

(SUSY0025801)

B3

C120
1 uF
(2012)

C121

C119

R108

20K
RADIO_SPK_L

NCP2890AFCT2G
C2
OUTB

INP

(10V,K)

Gain : Rf/Rin

- 73 -

D100

C122 C123
0.1u 0.1u

diode

R104

diode

0.1u

VM_P

C117

B1

SPK_N

D101

4. TROUBLE SHOOTING

Checking Flow

Start

Check the voltage level
of U100 = Vbat?

No

Check
The battery

Yes

Check the Signal,
C117,C118

No

Check
U102

Yes

Check the Level of
U100.C3 = Low ?

No

Check
U102

Yes

Check the Signal,
L102,L103

No

Re-solder
L102,L103

No

Re-Assemble
or Re-place
Speaker

Yes

Check the Contact
Of CN101

Yes
Try again
or Change the Board

- 74 -

4. TROUBLE SHOOTING

4.13 Headphone Trouble
TEST POINT
Check Points
-18pin IO connector
-Passive Parts slodering Status

C321

CN301

C322
FB300
FB302 FB301

CIRCUIT DIAGRAM

1.5K

R316

VMIC

C317

R318

AUXIN
C318
NA

C320

0.1u

C321

2V8_VIO

39p

AUXIP

EAR_MIC
I/O CONNECTOR

2.2K
C319
10u

0.1u

R321

100K

VCHARGE

FOR RADIO
FB300

1800

FB301
FB302

10u
10u

1800
1800

HS_DET
2V8_VIO

39p

39p

RPWRON
R324
100K

C326

C323
C324

C325

NA

R323 100K

R322

CN301

2V8_VIO

2V8_VIO

AUXOP_FML
AUXOP_FMR
TXD
RXD

FM_ANT
VBAT

DSR
C328
56p

C327
10u
(2012)
(10V,Z,Y5V)

(50V,J,NP0)

L300
270nH
1608

21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18

FOR RADIO

2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG

20
22

HSEJ-18S04-25R
VBAT

BATT_TEMP

R332

C336
3p

0

3
2
1
CN302

C337
18p
(50V,J,NP0)

(50V,C,NP0)
(TOL:0.25P)

- 75 -

C322
10p

4. TROUBLE SHOOTING

CHECKING FLOW

START

Does the audio
profile of the phone
change to the
earphone mode?

No

No

Re-solder CN301 or Change
another Ear- Mic set and Try again

Check the voltage Level
CN301.8 = Low?

Yes

Replace U100 or Change Board

Yes

Mic

Earphone

Go to MIC
Trouble section
Acoustic

Check the signal Level
at AUX_MIC.
Is it about 1.2~1.5V DC
with a few tens mV AC?

No

Re-solder causal
component
(CN301)

Does waveform at
U102.EPPA1
fluctuate?

Yes

No

Replace U100 or
Change the board

Yes

Change another Ear-Mic set and Try again

Does waveform at
CN301.4 and CN301.5
fluctuate?

No

Re-solder causal
component
(CN302,C322 etc.)

Change another Ear-Mic set and Try again

- 76 -

4. TROUBLE SHOOTING

4.14 Charging Trouble
TEST POINT

R124

Check Points
-Connection of TA (check TA voltage 5.2V)
-Charging Current Path component voltage
drop
-Battery voltage
-Charging IC

Charger
IC
U101

VBAT

VCHARGE
=5.2V

C126

C125

CN301

CIRCUIT

CHARGING IC
2V8_VIO

VBAT VCHARGE

VCHARGE
R118
NA
R119

1.8K

U101
1

CHARGE_DETECT

2
R121
CHG_STATUS
NA
C126
(10V,K,X5R)
1u
C127
0.015u

VIN

VBAT

_FAULT

VSEN_TEMP

10
C125
1u

9

R120
NA

(10V,K,X5R)
3
4

_STATUS

IREF

TIME

V2P8

5
GND
11
PGND

EN

8
R122

CHG_EN_TEST
R123

6

NA
CHG_EN

C128

R124

R125

1u

160K

100K

ISL9201IRZ-T
(1%)

- 77 -

0

7

4. TROUBLE SHOOTING

Checking Flow

START

I/O Connector(CN301)
Is well-soldered ?

NO

Resolder the CN300
Pin 12,13 : VCHARGE

YES

Is The Voltage of C126
5.2V ?

NO

The TA is out of order
Change the TA

YES
LOW

The Voltage of C128
Is 2.8V

Replace the
U101

YES

Check the voltage of R124
High or Low?

NO
Check the U102

YES

Battery is charged?

NO

YES

Charging is
properly operating

- 78 -

The battery may have
problems.
Change the battery.

4. TROUBLE SHOOTING

4.15. FM Radio Trouble
TEST POINT

R332
R338/R337/R336
U304.P 1

U304.P4
R327 R331

U302
U303

R329/R330
C332/C333

- 79 -

27K

2.7K

RADIO

RADIO_DETECT

NO RADIO

R339
27K

RADIO_DETECT

0

RADIO_EN

R328

NA

C334

R343
100K

1
2
3

(10V,K,X5R)

C341
1u

VBAT

1
2
3
4
5

U302
SI4702-B16

BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT

C342
1u

2V8_RADIO

R334
10K

NC1
FMIP
RFGND
GND1
_RST

2V8_RADIO

U304

FM_RST

FM_SCL
FM_SDA

FM_RST

C331 100p

NA

FM_INT
RADIO_AMP_SHDN
TP301
FM_INT

_SEN
SCLK
SDIO
RCLK
VIO
6
7
8
9
10

R325

4.7K

FM_ANT

R336

RADIO_AMP_SHDN (FOR FM RADIO)

PGND
NC2
GPIO1
GPIO2
GPIO3
VA

21
20
19
18
17
16
4.7K

15
14
13
12
11

47

R338

FM_32K

0.1u
0.1u

EPPA1

FOR RADIO

AUXOP_FMR

RADIO_SPK_R

C335
22n

C332
C333

C329
1u 2V8_RADIO

2V8_RADIO

2V8_RADIO

GND3
LOUT
ROUT
GND2
VD

0.1u

2V8_VIO

R337

- 80 C339

RADIO

20K
20K

R342
NA

C340
0.1u

2

5

4

3

C338
0.1u

NC1

IN1

COM1

NO1

VCC

GND

NC2

IN2

COM2

NO2

6

7

8

9

10

U305
NLAS5223BMNR2G

R335
100K

1

2V8_VIO

RADIO_AMP_SHDN

R329
R330

C330
1u

2V8_RADIO

VIN2

VIN1

VDD

VOUT2

VOUT1

U303 LM4809LD

39K

R345
100K

NA

R340

R333

R331

R327

AUXOP_FML

RADIO_SPK_L

3
9

6

8

HEADSET_RADIO_SEL

FOR RADIO

39K

2
BYPASS GND
4
_SHDN BGND

5

1

7

R326

0

0

240K

R344

330K

R341

2V8_VIO

EPPA1

RADIO_SPK_R

RADIO_SPK_L

4. TROUBLE SHOOTING

CIRCUIT DIAGRAM

4. TROUBLE SHOOTING

Checking Flow

Connector Headset and
Turn on Radio and
tuned channel

U304.PIN1 = High
U304.PIN4=2.8V

Check LDO
Power

NO
Change U304

YES

R336/R337/338
Check I2C signal and 32K clock

Check
Control Signal

NG
Change PCB

OK

R329/R330
C332/C333

Check
Audio Output
Of Transceiver

NG

Change U302

OK

R327/R331

Check
Audio Output
Of Amplifier

OK

Change PCB

- 81 -

NG
Change U303

5. DOWNLOAD

5. DOWNLOAD
5.1 Download Setup
Configure system like figure 5-1.

Figure 9-1. Download Setup

- 82 -

5. DOWNLOAD

5.2 Download Process
5.2.1. Download step[1]

: Start or Stop download
: Selected configuration DLL file
: File name donwloading
File(F) → Exit(X) : End program
Setting(S) → Configuration : configuration download condition DLL, SW files and etc.
About(H) → MultiGSM : Provide version information
First, select Setting Menu.

- 83 -

5. DOWNLOAD

5.2.2. Download step[2]

: Select a appropriated DLL file
- You must select KG270_xxxxxx.DLL file.
: Select configuration file
You must select cmd.m0 file
: Select download speed
You must 460800. System supports maximum 460800bps.
: Select port
select start and end port be operated

- 84 -

5. DOWNLOAD

5.2.3. Download step[3]

: Select files downloaded
KG270 have 4 files, *.eep, *.fls, *.dffs and *.cust.
But You must not select *.eep file.

- 85 -

5. DOWNLOAD

5.2.4. Download step[4]

: Start download and stop download next step.
If configuration is finished, then push start button and then button is changed to STOP.
Turn on power of multi download and connector phones.
If download is started, then push start button else program will download repeatedly.

- 86 -

5. DOWNLOAD

5.2.5. Download step[5]

: This region appears donwload status.
If download is finished, PASS or FAIL.message is showed.

- 87 -

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

- 88 -

7. CIRCUIT DIAGRAM

1

2

3

5

4

7

6

8

9

10

12

11

13

14

15

16

A

A

RECEIVER

1u

G3

2V0_VRTC
TDO
TDI
TMS
TCK
TRSTn
TRIG_OUT
TRIG_IN
CHG_EN

R115
100K

VBAT

UART PORT

GND
RX
TX
NC1

ON_SW ON_SW

D

VBAT VBAT
NC2
PWR
URXD NC3
NC4
UTXD
DSR
RTS
CTS

1
2
3
4
5
6
7
8
9
10
11
12

C2
D5
F4
E4
D4
G4
D2
H4
C1
F1
F2

ADD00
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10

RXD
TXD
RPWRON

1V5_VRF0
1u

1u
C109

C110

1u

C112

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10

4

A3

20K
0.1u

C118

A1

R105
C3

20K
0.1u

R106
20K

LOUD_SPK_EN

68K

AUXIP
AUXIN
VINNORP
VINNORN
EPPA1
REC_P
REC_N

B2
B1
B3
A2
A4
A3
P5
M7
N7
P6
R5
B4

R116

1.8K

F

U101
1

VIN

2
R121
CHG_STATUS
NA
C126

_FAULT

4

1u
C127
0.015u

BHE_N
_WR

VBAT
VSEN_TEMP

10
C125
1u

9

R120
NA

(10V,K,X5R)
3

(10V,K,X5R)

_STATUS

IREF

TIME

V2P8

5
GND
11
PGND

EN

8
R122

0

R123

NA

CHG_EN_TEST

7
6

C

CHG_EN
C128

R124

R125

1u

160K

100K

ISL9201IRZ-T

CS3
CS1n
CS0n

(1%)

ADD21
ADD20
ADD19
ADD18
ADD17
ADD16
ADD15
ADD14
ADD13
ADD12
ADD11

D

VRF2
E_FUSE

1u

0.1u

47n
C130

E

C133
GND1

E

VBAT VCHARGE
R118
NA

R119

Date
11/16

Designer
VBAT2

D101

VD1

VBAT

VBAT1

C122 C123
0.1u 0.1u

2V8_VIO

Section
VBAT

D100

(10V,K)

VCHARGE

_OE

CS100

C120

0

CHARGE_DETECT

BHE_N
_WR

16pi 3.4T speaker

(SUSY0025801)

CHARGING IC

BS
FM_32K (FOR FM RADIO)
VC2
VC1
TXON_PA

N5
M6
E3
E2
R3
M5
K3
P4
G1
E1
H1
D1
F3
L3
K4
J4
H3
J3
H2
G2

B2

C124
1000p

PWRON
32KOUT
32KIN
CHG_STATUS

B7
A5
A6
B6
A7

D

Gain : Rf/Rin

HEADSET_RADIO_SEL (FOR FM RADIO)
VIBRATOR
KEY_BACKLIGHT
W_LED_DRV
RADIO_EN
(FOR FM RADIO)
(FOR FM RADIO)
FM_RST
_RESET

27nH

B3

C121

R112
47K

VP

27nH CN101
1

L104

2

1 uF

VMIC

SPK_N
SPK_P

P12
P11
R12
P15
R13
M14
M12
N15

VM

BYPASS

L103

A2

(2012)

R110

R111
100K

100K

BATT_TEMP
TX_RAMP

_SD

R109
LCD_ID

P13

C1

82K

C119

OUTA

B1

(FOR FM RADIO)

RADIO_SPK_L

INM

0.22u

RADIO_DETECT

R107
NA

NCP2890AFCT2G
C2
OUTB

INP

diode

U100

R104

diode

0.1u

VM_P

HOT1 1

26MHz

GND2
3 HOT2

2 GND1

C117

VRF1

C129

E

OE_N
ADV_N
BHE_N
WR_N
RD_N
CS3_N
CS1_N
CS0_N
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11

SPK_N

2V8_VIO

R108

VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13

T_OUT8
T_OUT4
T_OUT3
T_OUT2
T_OUT0

CHARGE_DETECT

35
34
33
32
31
30
29
28

J13
K15
F15
B11
K10
M11
J10
G12
K12

D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15

SC100

27
26
25
24
23
22
21
20
19

T2IN
VIB_CONTROL
BACK_LIGHT
W_LED_DRV
CC00IO
RSTOUT_N
RESET_N
SAFE_RES
SWITCH_ON
OSC32K
F32K
CLKOUT

PMB7880
U102

1V5_VRF0

1
2
3
4
5
6
7
8
9

220n

22K

VSS9
VSS8
VSS6
VSS5
VSS4
VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1

TDO
TDI
TMS
TCK
TRST_N
TRIG_OUT
TRIG_IN
NMI_N (FOR CHARGING IC)
MON1
MON2

H12
CDT
J9
CS

GND
RX
TX
UFLS

R4
P1
P2
N2
L1
M2
K1
J2
P3
R2
M1
N1
L2
K2
J1
M4

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

C

UA100
3G
2.5G

MON100

(FOR 2.8V VMEM SELECTION)

G4

P8
M10
P9
R9
K9
B5
C5
F7
N6
N9

NA
X101
NX3225SA

( NX3225SA(W-188-34-7)

DEFAULT_BANDSEL

VBAT

82K

4700p

R117
NA

R8
CCIO
M9
CCVZ_N
P7
CCLK
R10
CCRST
N8
CCIN

SIM_DATA
FM_INT
SIM_CLK
SIM_RST
LOUD_SPK_EN

(FOR FM RADIO)

R103

NA

C132

EXTRSTn

TRIG_IN
TRIG_OUT

VMIC
MICP2
MICN2
MICP1
MICN1
EPPA1
EPP1
EPN1

4700p

TDO

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16

H9
SCL
H10
SDA

C116

SPK_P

DCS_RXP
DCS_RXN
GSM_RXP
GSM_RXN

K14
LOUD2
L15
LOUD1

C131

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

DCS_PCS_OUT
GSM_OUT

N10
M9
R14
M0
R11
M7
P10
M2

PAOUT1

VDD_TRX
VDD_LO
VDD_DIG
VDD_RX
VDD_VCO
VDD_LRF_XO
VSS_RF1
VSS_RF2
VSS_RF3
VSS_RF4
VSS_RF5
VSS_RF6
VSS_RF7
VSS_RF8
VSS_RF9
VSS_RF10
VSS_RF11
VSS_RF12
VSS_RF13
E_FUSE
NC1
NC2
NC3
NC4

G2

(30uA)
(VOLTAGE SENSING)
(30uA)
(90uA)

J6
SSC0_CLK
K6
SSC0_MRST
G6
SSC0_MTSR (FOR LCD SPI INTERFACE)
H6
DISP_REST

FM_SCL
FM_SDA

R102

E15
RX34
D15
RX34X
C15
RX12
B15
RX12X

M7,9 : ~0.96V

SPEAKER

SPEAKER AMPLIFIER

(16V,K,X5R)

D12

C11
A11
D10
F13
F14
A10
A15
A12
B14
B13
B12
B10
C14
C10
D11
D14
E12
E13
E14
G3
R15
J15
A1
R1

G1

(FOR FM RADIO)
(FOR FM RADIO)

C115
(1608)
2.2u
REXT

A9
XOX
A8
XO

M0,2 : ~1.92V

G7
RXD
H7
TXD
H8
RTS_N
G8
CTS_N

(FOR CHARGING IC)

CN102

R114
NA

DSR

SSC0_CLK
CHG_EN_TEST
SSC0_MTSR
LCD_RESET

(NOT MOUNTED)
(FOR SW DEBUGGING / NOT MOUNTED)

TRSTn
TDI
TMS
TCK

F

RXD
TXD
HS_DET
DSR

C
VBAT

A13
TX2
A14
TX1

VSS_EPLS
VSS_MS1
VSS_MS2
VSS_MS3
VSS_MS4
VSS_MS5
VSS_MS6
VSS_MS7

R113
NA
(R110 will be changed to NA
for mass production)

RXD
TXD

KP0
KP1
KP2
KP3
KP4
KP5
KP6
KP7
KP8
KP9

L12
K13
M15
L13
L14
N14
P14
N11

2V8_VIO

2V8_VMEM

ON BOARD ARM9 JTAG & ETM INTERFACE

VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC

M8
F10
K7
K8
J8
B9
B8
R7
R6
F6
L4
G10
J7
G9
KEY_OUT1
KEY_OUT2
KEY_OUT3
KEY_OUT4
KEY_IN0
KEY_IN1
KEY_IN2
KEY_IN3
KEY_IN4

D

E

C8
D6
D7
C7
D9
C6
C9
D8
F9
F8

C106

BAT100

C113
1u

L102
18nH

R101

NA

C111
1u

C114

R199

NA

G13
G15
G14
J12
J14

R198

NA

IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP

R197

0

6.8K

1u

1u

VD1

R196

2V0_VRTC
2V8_VIO
2V8_VMEM

18p
C105

C

B

C103
39p

2V0_VRTC

R100

2V85_VSIM

18p
C104

32.768KHz

R199

2

(SURY0013001)

C108

(1608)

KG270
MG160a

MC-146_12_5PF

R198

CN100
1

11*07*3T receiver
C102
39p

C107

2

R197

22nH
22nH

C100
39p

VRF1

REC_N

KG278, MG160b, KG275

2V5_VANA

1

32KOUT

R196

L100
L101

REC_P

2.2u

3

2V8_VMEM

VD1

MODEL

X100
4

32KIN

C101

B

2V8_VIO

3V2_VBUF

32.768KHZ CRYSTAL

2V85_VSIM

3

GND2

2006

Sign & Name

SANG-YOEN.LEE

Sheet/
MODEL

GB3_RADIO
SPFY0144601

Sheets

1/4

10
11
12
13
14
15
16
17
18

Checked
DRAWING
F

NAME

Approved

Iss.
1

2

3

4

5

6

7

Notice No.

Date

Name

LG Electronics Inc.

DRAWING
NO.

BB

VER-1.1

9

8

LG(42)-A-5505-10:01

LG Electronics Inc.

- 89 -

7. CIRCUIT DIAGRAM

1

2

3

4

7

6

5

8

9

10

A
2V0_VRTC

A

KEY MATRIX

CHARGE PUMP

VBAT

END
SW200

U200
5

END_KEY

8

MLED

1

SW201

2

SW202

3

SW203

SW204

LEFT

11

W_LED_DRV
SW205

AAT3157ITP-T1
10
C1+

IN

C1C2+

1u
C2-

EN_SET

R202
100K

C202
27p

4

D1
D2
D3
NC

GND

6
1
2
3
12
C203
27p

680
SW206

SW207

4

SW208

5

SW209

6

ID

SII

HIGH

1.9V

SHARP

LOW

0V

GP

MLED1
MLED2

KEY_OUT1
C205
NA

MAKER

C201

CP

MENU

R201

C200
1u

9
7

Voltage

0.9V

150Kohm pull up

C204
27p

SW210

UP

B

SEL
2V8_VIO

R203
KEY_OUT2
680
C206
NA

CN200
SW211

SW212

7

SW213

8

SW214

9

RIGHT

1

SW215

2

SEND

KEY_OUT3

LCD_RESET
680
C207
NA

SSC0_CLK
SW216

SW218

SW217 0

*

SW219

#

R205
R207

4

47

5

47

7

DOWN
MLED

C208
NA

KEY_OUT4
680
C215
NA

C217
NA

C216
NA

C219
NA

C218
NA

C209
27p

C220
NA

6

R206

47

8

R208

47

CS3
SSC0_MTSR

9
10

MLED1

11

MLED2

R209

MTPD

3

MTPG

R204

C210
27p

13
R210
100K

R211 680

12
14
15

LCD_ID

C211
27p

C212
27p

C213
NA

C214
NA

C221
1u

IMSA-9671S-13Y902
(ENQY0013801)

KEY_IN0

C

R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4

VBAT

KEY BACKLIGHT

D

R222

1K

1u
C223

R220
100ohm

R221
100ohm
LD205
LEBB-S14H

R219
100ohm

LD204
LEBB-S14H

LD203
LEBB-S14H

R217
100ohm

R218
100ohm
LD202
LEBB-S14H

LD201
LEBB-S14H

1u
C222
KEY_BACKLIGHT

LD200
LEBB-S14H

(10V,K,X5R)

R216
100ohm

D

(10V,K,X5R)

2SC5585
Q200
R223
10K

E

Section

Date

Designer

11/16
2006

Sign & Name
MODEL

GB3_RADIO

HYUN-OK.LEE

Sheet/
Sheets

2/4

Checked
DRAWING
NAME

AUDIO,LCD,KEY

Approved

Iss.
1

2

3

4

Notice No.

Date

Name

DRAWING

LG Electronics Inc.

NO.

REV-1.1

5

LGIC(42)-A-5505-10:01

LG Electronics Inc.

- 90 -

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

14

13

15

16

A

A

VIBRATOR
SIM_CONNECTOR

U300

BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT

R310

0

G5

2V8_VMEM_S

VCCS

1SS302-T5L_F_H

D300

R304

(1608)

0.1u

VIBRATOR

C312
22p

1K

OB4-15L42-C33L
C308

C307
0.1u

Q300
2SC5585

2
1

39p
R307

C309

0.1u

MIC300

VINNORN
100ohm
R309

2.2K
2V8_VMEM

39p

C311
0.1u

B

100ohm
R306

C310
22p

C306

VINNORP

SIM_RST
SIM_CLK

39p

VCCF

J300

C304
10u

C303
39p

2.2K

C305
R305
27p
10

4
1
GND
VCC
5
2
VPP
RST
3
6
CLK
I_O
8
7
GND2 GND1

SIM_DATA

R301

2

C314

G4

C

2V8_VMEM

TP300
NA

NA

_OE
_WE
_LB
_UB
_CE1F
_CE1S
CE2S
RY__BY
WP_ACC
_RSTF

G8
VSS1
E2
VSS2
C8
D8
E7
F8
H5

C316
0.1u

RFU0
RFU1
RFU2
RFU3
RFU4

_OE
_WR
ADD00
BHE_N
CS0n
CS1n

0

R311

R315

2V8_VIO

F2
A5
A3
B3
F1
G1
B5
C4
A4
B4

R313 100K

C315
0.1u

2V85_VSIM

1K

C313

C

ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21

CN300
1

R314

2V8_VMEM

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

C302
27p
(50V,J,NP0)

2V85_VSIM
4.7K

G2
E3
H3
F4
F5
H6
E6
G7
H2
F3
G3
H4
G6
F6
H7
F7

DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15

2V85_VSIM

S71GL032A40BAW0F
E1
A0
D1
A1
C1
A2
B1
A3
D2
A4
C2
A5
B2
A6
A2
A7
A6
A8
C6
A9
D6
A10
A7
A11
B7
A12
C7
A13
D7
A14
B8
A15
E8
A16
D3
A17
C3
A18
B6
A19
C5
A20

0

U301

100K

MEMORY

C301
NA

R302

C300
NA

B

VMIC

MAIN_MIC

VBAT

VBAT

R300

R312 100K

1
2
3

R308

(NOT MOUNTED)

2V8_VMEM_S

R303

VBAT

_RY_BY
VMIC

REMOTE POWER ON

D

1.5K

R316
C317
R317
R319

RPWRON

RPWRON
END_KEY

47
0

PWRON

R318

AUXIN
C318
NA

C320

0.1u

C321

E

2V8_VIO

39p

AUXIP

EAR_MIC
I/O CONNECTOR

2.2K
C319
10u

0.1u
R320
100K

1
2
3
4
5

C331 100p
NA
C334

FM_RST

NC1
FMIP
RFGND
GND1
_RST

U302
SI4702-B16

6
7
8
9
10

39p

39p

2V8_VIO

C326

C325

DSR
C327
10u
(2012)

C329
1u 2V8_RADIO

39K

(10V,Z,Y5V)

U303 LM4809LD
7
GND3
LOUT
ROUT
GND2
VD

15
14
13
12
11

C332
C333

C328
56p
(50V,J,NP0)

C322
10p

1608
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18

FOR RADIO

2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D

F

9,10 : BATT
11 : R/ON
12,13 : CHG

20
22

C330
1u

0.1u
0.1u

R329
R330

20K
20K

1
5

C335
22n

VDD

VOUT1

VOUT2

0

6

R331

0

HSEJ-18S04-25R
RADIO_SPK_L

3
9

R332

BATT_TEMP

C336
3p

2V8_RADIO

0

3
2
1
CN302

C337
18p

39K

C338
0.1u

R335
100K

R334
10K

C

RADIO_SPK_R

VIN2

2
BYPASS GND
4
_SHDN BGND

RADIO_AMP_SHDN

8

R327

VBAT
VIN1

R333

(50V,J,NP0)
(50V,C,NP0)
(TOL:0.25P)

0.1u

2V8_RADIO

1800
1800

2V8_RADIO

_SEN
SCLK
SDIO
RCLK
VIO

FM_RST

FB301
FB302

R324
100K

2V8_RADIO

21
20
19
18
17
16
0

10u
10u

1800

RPWRON

PGND
NC2
GPIO1
GPIO2
GPIO3
VA
R328

FM_ANT

C323
C324

FOR RADIO
FB300

HS_DET

R326

C

100K

NA
NA
TP301
FM_INT

R325

VCHARGE

R323 100K

R322
FM_INT
RADIO_AMP_SHDN

2V8_VIO

E
L300
270nH

CN301

AUXOP_FML
AUXOP_FMR
TXD
RXD

RADIO

RADIO_AMP_SHDN (FOR FM RADIO)

F

FM_ANT
VBAT

2V8_VIO

2V8_VIO

R321

D

D

C339

4.7K

4.7K

R337

R336

D

2V8_VIO

FM_SCL
FM_SDA
R338

FM_32K

47

C340
0.1u

RADIO_DETECT

U305
NLAS5223BMNR2G
1

R339
27K

2V8_RADIO

VBAT

RADIO_SPK_R
U304

E

1
2
3

RADIO_EN

BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT

RADIO

R342
NA

RADIO_SPK_L

9

8
IN2

4

AUXOP_FML
R341

R340
NA

FOR RADIO

EPPA1

NC2
6

NC1

E

330K

7
IN1

5

EPPA1

R344

GND

Section

Date

Sign & Name

Designer

11/16
2006

SANG-YEON.LEE

Sheet/

240K
C341
1u

RADIO_DETECT

COM2

COM1

FOR RADIO

R343
100K

NO2

NO1
3

AUXOP_FMR

2V8_VIO

10
VCC

2

C342
1u

HEADSET_RADIO_SEL

MODEL

Sheets

GB3_RADIO
SPFY0144601

3/4

R345
100K

(10V,K,X5R)

27K

Checked
2006

NO RADIO

2.7K

DRAWING

F

NAME

Approved

RADIO,MEMORY,AUDIO,I/O

2006

Iss.
1

2

3

4

5

6

7

Notice No.

Date

Name

LG Electronics Inc.

DRAWING
NO.

VER-1.1

9

8

LG(42)-A-5505-10:01

LG Electronics Inc.

- 91 -

7. CIRCUIT DIAGRAM

1

2

TP400

TP401

TP402

3

TP404

TP403

4

5

6

7

8

9

10

TP405

R400
NA
R401

0

1p

AA

22nH

C401
39p

0

R403

R402

L401

1K

L400

2.2nH

C400

TX_RAMP

A

(50V,J,NP0)

(50V,J,NP0)

(10V,Z,Y5V)

(50V,J,NP0)

(16V,K,X7R)

G2

VBAT
VBAT
DCS_PCS_OUT
0

0

L402
NA

VAPC
15
C410
22p

R406

11

0

19

C412
NA

21

DCS_PCS_OUT
EGSM_OUT
RSVD_GND

3
7

VC1
VC2
C417
27p

LMSP2PAA-575TEMP

0

1
GSM1800_1900TX
6
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
IN

2

3

(50V,J,NP0) (16V,K,X7R)
R407

4

GSM_OUT
0

ENABLE
BS

18

TXON_PA

1

R408
NA

R409
NA

BS
C413
27p

C414
27p

16
14
13
12
10
9
8
7
5

FL400

EGSM_IN

P_GND

R410

9

DCS_PCS_IN

U400
SKY77318

C408
0.01u
C409
NA

GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1

C411
NA

C407
27p
6

C406
18p

VCC1A

C405
33p

VCC1B

C402
10u
(2012)

17

C404
0.01u

20

C403
12p

VBATT

B

C

R405

R404

RF

G1

ANT

SW400
RF500

C416
NA

C415
NA

C

5
2
GND1 GSM850_900TX
8
4
GND2 GSM850_900RX
10
GND3

C418
27p

C419

O2_2

6

O2_1

7

O1_2

8

O1_1

9

C420

1 I1

FL401

DEFAULT_BANDSEL

G4

G3

G1

4 I2

TP406

GSM_RXN

L403
18nH

5 10
G2

3

2

3p

C421

3p

GSM_RXP

3p

DCS_RXN

B9308
L404
5.1nH

PART_NO SFSB0001401
D

D

IN CASE OF GSM850/PCS1900
CHANGE THIS DUAL SAW FILTER
TO PART_NO SFSB0001301

C422

3p

DCS_RXP

Section
Designer
Checked

E

Approved

Date
11/16
2006

Sign & Name
KEE-OUN.PARK

2006

1

2

3

4

5

6

Sheet/Sheets

GB3_RADIO

4/4

DRAWING
NAME

RF

DRAWING
NO.

VER-1.1

2006

LG Electronics Inc.
LGIC(42)-A-5505-10:01

MODEL

7

LG Electronics Inc.

- 92 -

8. PCB LAYOUT

- 93 -

8. PCB LAYOUT

- 94 -

9. ENGINEERING MODE

9. ENGINEERING MODE
9.1 About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset.

9.2 Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch
back to non-engineering mode operation.

9.3 Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key
will switch back to the original test menu.

9.4 Engineering Mode Menu Tree

ENGINEERING MODE

1. BB TEST

2. Model Version

3. Eng Mode

4. Call Timer

5. Factory Reset

6. MF Test

- 95 -

9. ENGINEERING MODE

BB TEST

1. Backlight

1. Backlight On
2. Backlight Off
3. Backlight Value

2. LCD
1. Red

1. LCD Color

2. Green
3. Blue

2. Contrast

4. Black
5. White
6. Auto LCD
3. Battery Info

4. Vibrator

1. Vibrator On
2. Vibrator Off

1. Audio Test

5. Audio

2. Close

*

6. FM Radio

* FM Radio function is not supported

- 96 -

9. ENGINEERING MODE

9.4.1 BB Test
9.4.1.1 Backlight
➀ backlight on : LCD backlight is off.
➁ backlight off : LCD backlight is on.
➂ backlight value : LCD backlight brightness is controlled by 20% from 100 to 0.

9.4.1.2 LCD
➀ LCD color : This menu includes 5 color menu and automatic color change.
5 color menu is Red, Green, Blue, Black and White.
➁ LCD contrast : This menu displays a contrast value and LCD maker.

9.4.1.3 Battery Info
This menu displays the information of battery, as example battery voltage level and temperature.
In line 2, battery voltage level is displayed with average and instant value.
In line 3. battery temperature value is displayed, but this value is ADC value.
In line 4. Icon number of battery voltage is displayed.

9.4.1.4 Vibrator
This menu can control vibrator on and off operation.

9.4.1.5 Audio
This menu can control MIDI operation

- 97 -

9. ENGINEERING MODE

Model Version

9.4.2 Model Version
This menu displays the Model software version.

Eng Mode

1. Serving Cell

2. Neighbour Cells

3. Reset Information

- 98 -

9. ENGINEERING MODE

9.4.3 Eng Mode
9.4.3.1 Serving Cell
This Menu dispays the the informations of Serving Cell environment.
For example, ARFCN, RF Level etc.
ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Idle
mode
RxLev : RX level of Serving Cell while Idle mode
C1 : C1 Value of Serving Cell, This value will be used to decide cell reselection.
C2 : C2 Value of Serving Cell, This value will be used to decide cell reselection.
BPM : Paging period of Serving Cell
ARFCND : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while
Dedicated mode
RxLf : Full RX level of Serving Cell
RxLs : Sub RX level of Serving Cell
RxQf : Full RX qual of Serving Cell
RxQs : Sub RX qual of Serving Cell
DSC : Downlink Signal Counter
RLL : Radio Link Loss Counter
Chtyp : Channel type of Serving Cell
Chmod : Channel Mode of Serving Cell
DTX : Discontinuous Transmission mode of Serving Cell
MCC : Mobile Country Code of Serving Cell
MNC : Mobile Country Code of Serving Cell
LAC : Location Area Code of Serving Cell
CID : Cell ID of Serving Cell
BSIC : Base Tranceiver Station Identity Code of Serving Cell
TxPwrMax : MS_TXPWR_MAX_CCH value of Serving Cell
RxMin : RXLEV_ACCESS_MIN value of Serving Cell
C2vld : C2_VALID value of Serving Cell
CRoff : CELL_RESELECT_OFFSET value of Serving Cell
TMPoff : TEMPORARY_OFFSET value of Serving Cell
PTime : PENALTY_TIME value of Serving Cell
RF# : Number of frequencies in MA(Mobile Allocation)
T3212 : Periodic Location Update Timer
TxPwrLev : Current Tx power of MS
ACC : Access Control Class
Band : Current Band Information
TA : Current Timing Advance
Cipher : Cipher mode of Serving Cell
CBQ : Cell Bar Quality flag of Serving Cell
CBA : Cell Bar Access flag of Serving Cell

- 99 -

9. ENGINEERING MODE

9.4.3.2 Neighbour Cells
This menu displays the informations of Neighbour Cells.
ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Neighbour Cell
RxLev : Rx Level of Neighbour Cell
C1 : C1 Value of Neighbour Cell, This value will be used to decide cell reselection.
C2 : C2 Value of Neighbour Cell, This value will be used to decide cell reselection.
MCC : Mobile Country Code of Neighbour Cell
MNC : Mobile Network Code of Neighbour Cell
LAC : Location Area Code of Neighbour Cell
CID : Cell ID of Neighbour Cell
BSIC : Base Tranceiver Station Identity Code of Neighbour Cell

9.4.3.3 Reset Information
This menu displays the information of reset point in source code, call stack.

- 100 -

9. ENGINEERING MODE

Call Timer

9.4.4 Call Timer
This menu displays the time of all calls, including the received calls.

Factory Reset

9.4.5 Factory Reset
This menu is to format data block in the flash memory and this procedure set up the default value in
data block.

- 101 -

9. ENGINEERING MODE

MF TEST

1. All auto Test

2. Backlight

3. Audio

4. Vibrator

5. LCD

6. Key Pad

*

7. Mic Speaker

*

8. FM radio

* function is not supported

- 102 -

9. ENGINEERING MODE

9.4.6 MF TEST
This manufacturing mode is designed to do the baseband test automatically.
Selecting this menu will process the test automatically, and phone displays the previous menu after
completing the test.

9.4.6.1 All auto Test
LCD, Backlight, Vibrator, Buzzer, Key Pad

9.4.6.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.

9.4.6.3 Audio
This menu is to test the volume of Melody. It rings in the following sequence.
Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.

9.4.6.4 Vibrator
Vibrator is on for about 1.5 seconds.

9.4.6.5 LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.

9.4.6.6 Key Pad
When a pop-up message shows ‘Press Any Key’, you may press any keys.
If the key is working properly, name of the key is displayed on the screen.

- 103 -

10. CALIBRATION

10. CALIBRATION
10.1 Test Equipment Setup

4.000V 0.0000A

10.2 Calibration Steps
10.2.1 Tune on the phone
10.2.2 Execute “HK_28.exe”

- 104 -

10. CALIBRATION

10.2.3 Click “SETTING” Memu

KG278

10.2.4 Setup “Ezlooks” menu such as the following fugure

- 105 -

10. CALIBRATION

10.2.5 Setup “Line System” menu such as the following fugure

KG278

Adjust the number of times.

10.2.6 Setup Logic operation such as the following figure

KG278

Operation Mode
1. By-Pass: not control by GPIB
2. Normal : control by GPIB

Setup UART Port
PWR : Power Supply
CELL :Call-Test Equipment

- 106 -

10. CALIBRATION

10.2.7 Select “MODEL”
10.2.8 Click “START” for RF calibration

KG278

10.2.9 RF Calibration finish

- 107 -

10. CALIBRATION

10.2.10 Calibration data will be saved to the following folder

- 108 -

11. STAND ALONE TEST

11. STAND ALONE TEST
11.1 Test Program Setting
11.1.1 Set COM Port
11.1.2 Check PC Baud rate(115200)
11.1.3 Confirm EEPROM & Delta file prefix name

11.1.4 Click “V24AT#ON” and then “Update Info” for communicating Phone
and Test Program

Not Connected

- 109 -

11. STAND ALONE TEST

Connected

11.1.5 For the purpose of the Standalone Test, Change the Phone to “ptest
mode” and then Click the “Reset” bar.
11.1.6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test
setup is finished.

Change "ptest mode"

- 110 -

11. STAND ALONE TEST

11.2 Tx Test
11.2.1 Click “Non signaling mode” bar and then confirm “OK” test in the
command line

11.2.2 Put the number of TX Channel in the ARFCN
11.2.3 Select “TX” in the RF mode menu and “PCL” in the PA Level menu
11.2.4 Finally, Click “Write All” bar and try the efficiency test of Phone

- 111 -

11. STAND ALONE TEST

11.3 RX Test
11.3.1 Put the number of RX Channel in the ARFCN
11.3.2 Select “RX” in the RF mode menu
11.3.3 Finally, Click “Write All” bar and try the efficiency test of Phone

- 112 -

12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW

22

20

21
15
7
18
14

12

13
17

10

19
11

1

16

9

3

4

8

2
5

23

6

- 113 -

- 114 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts

Level

Location
No.

1

Description

Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC

Part Number

Specification

Color

GSM,BAR/FILP

TGSM0050103

Black

2

AAAY00

ADDITION

AAAY0203337

Black

2

APEY00

PHONE

APEY0429703

Black

3

ACGK00

COVER ASSY,FRONT

ACGK0085205

Black

4

MCJK00

COVER,FRONT

MCJK0069001

MOLD, PC LUPOY SC-1004A, , , , ,

4

MPBG00

PAD,LCD

MPBG0058101

4

MPBM00

PAD,RECEIVER

4

MTAB00

4

Remark

Black

7

COMPLEX, (empty), , , , ,

Without
Color

14

MPBM0016401

COMPLEX, (empty), , , , ,

Without
Color

15

TAPE,PROTECTION

MTAB0168901

COMPLEX, (empty), , , , ,

Without
Color

20

MTAD00

TAPE,WINDOW

MTAD0065701

COMPLEX, (empty), , , , ,

Without
Color

21

4

MWAC00

WINDOW,LCD

MWAC0077002

CUTTING, PMMA MR 200, , , , ,

Black

22

4

SURY00

RECEIVER

SURY0013001

PIN ,109 dB,32 ohm,11*7 ,3T ,; , , , , , ,CONTACT ,

3

ACGM00

COVER ASSY,REAR

ACGM0086801

4

ENZY00

CONNECTOR,ETC

ENZY0019901

3 PIN,3 mm,STRAIGHT , ,

4

MCCZ00

CAP

MCCZ0024001

MOLD, Urethane Rubber S185A, , , , ,

Black

4

4

MCJN00

COVER,REAR

MCJN0065001

MOLD, PC LUPOY SC-1004A, , , , ,

Black

8

4

MLAB00

LABEL,A/S

MLAB0000601

HUMIDITY STICKER

Without
Color

2

4

MPBN00

PAD,SPEAKER

MPBN0039901

COMPLEX, (empty), , , , ,

Without
Color

16

3

GMEY00

SCREW MACHINE,BIND

GMEY0002001

1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7

3

MBJA00

BUTTON,DIAL

MBJA0023209

COMPLEX, (empty), , , , ,

Black

12

3

MCCF00

CAP,MOBILE SWITCH

MCCF0042301

MOLD, Urethane Rubber S185A, , , , ,

Black

5

3

MLAK00

LABEL,MODEL

MLAK0006901

5

ADCA00

DOME ASSY,METAL

ADCA0063901

Without
Color

10

5

MLAZ00

LABEL

MLAZ0038301

PID Label 4 Array

Without
Color

6

SC100

CAN,SHIELD

MCBA0016401

PRESS, NS, 0.2, , , ,

Without
Color

18
Black

- 115 -

3

23

19

12. EXPLODED VIEW & REPLACEMENT PART LIST



Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC

Level

Location
No.

Description

Part Number

4

SJMY00

VIBRATOR,MOTOR

SJMY0007903

3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,

VIBRATOR,MOTOR

SJMY0007904

3 V,.1 A,4*8 ,height 5.8mm ,; ,3V , , ,11000 , , , ,

Specification

Color

Remark
9

4

SNGF00

ANTENNA,GSM,FIXED

SNGF0022402

3.0 ,-2.0 dBd,, ,internal, GSM900/1800 ,; ,DUAL ,-2.0 ,50
,3.0

11

4

SUSY00

SPEAKER

SUSY0025801

PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT

1

3

SAFY00

PCB ASSY,MAIN

SAFY0193036

4

SAFB00

PCB ASSY,MAIN,INSERT

SAFB0061605

5

SUMY00

MICROPHONE

SUMY0003802

FPCB ,-42 dB,4*1.5 ,

5

SVLM00

LCD MODULE

SVLM0024402

MAIN ,128*128 ,35.78*39.7*2.7 ,65k ,CSTN ,TM ,S6B33BG
,1.52" Serial IF Only for CI

4

SAFF00

PCB ASSY,MAIN,SMT

SAFF0114336

5

SAFC

PCB ASSY,MAIN,SMT
BOTTOM

SAFC0086602

6

BAT100

BATTERY,CELL,LITHIUM

SBCL0001901

3.3 V,0.025 mAh,COIN ,Capacitor type Backup Batt. Pb-Free
,; ,3.3 ,0.025mAh ,COIN

6

C100

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C101

CAP,CERAMIC,CHIP

ECCH0005602

2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

6

C104

CAP,CERAMIC,CHIP

ECCH0000113

18 pF,50V,J,NP0,TC,1005,R/TP

6

C105

CAP,CERAMIC,CHIP

ECCH0000113

18 pF,50V,J,NP0,TC,1005,R/TP

6

C106

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C107

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C108

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C109

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C110

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C111

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C112

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C113

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C114

CAP,CHIP,MAKER

ECZH0001216

220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C115

CAP,CERAMIC,CHIP

ECCH0005602

2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

6

C117

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C118

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C119

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C120

CAP,CERAMIC,CHIP

ECCH0002101

1 uF,10V ,K ,B ,TC ,2012 ,R/TP

17

- 116 -

13

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

C121

CAP,CERAMIC,CHIP

ECCH0002004

0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

6

C122

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C123

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C124

CAP,CERAMIC,CHIP

ECCH0000143

1 nF,50V,K,X7R,HD,1005,R/TP

6

C125

CAP,CHIP,MAKER

ECZH0001215

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C126

CAP,CHIP,MAKER

ECZH0001215

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C127

CAP,CERAMIC,CHIP

ECCH0000157

15 nF,16V,K,X7R,HD,1005,R/TP

6

C128

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C129

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C130

CAP,CERAMIC,CHIP

ECCH0002002

47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

6

C131

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C132

CAP,CHIP,MAKER

ECZH0001106

4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

6

C133

CAP,CHIP,MAKER

ECZH0001106

4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

6

C200

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C201

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C202

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C203

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C204

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C209

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C210

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C211

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C212

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C221

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C222

CAP,CHIP,MAKER

ECZH0001215

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C223

CAP,CHIP,MAKER

ECZH0001215

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C302

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C303

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C304

CAP,CERAMIC,CHIP

ECCH0006501

10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

6

C305

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C306

CAP,CERAMIC,CHIP

ECCH0000161

33 nF,16V,K,X7R,HD,1005,R/TP

6

C307

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C308

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C309

CAP,CERAMIC,CHIP

ECCH0000161

33 nF,16V,K,X7R,HD,1005,R/TP

6

C310

CAP,CERAMIC,CHIP

ECCH0000115

22 pF,50V,J,NP0,TC,1005,R/TP

Description

Part Number

Specification

- 117 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

C311

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C312

CAP,CERAMIC,CHIP

ECCH0000115

22 pF,50V,J,NP0,TC,1005,R/TP

6

C313

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C314

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C315

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C316

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C317

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C319

CAP,CERAMIC,CHIP

ECCH0006501

10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

6

C320

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C321

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C322

CAP,CERAMIC,CHIP

ECCH0000110

10 pF,50V,D,NP0,TC,1005,R/TP

6

C323

CAP,CERAMIC,CHIP

ECCH0006501

10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

6

C324

CAP,CERAMIC,CHIP

ECCH0006501

10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP

6

C325

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C326

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C327

CAP,CERAMIC,CHIP

ECCH0003002

10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP

6

C328

CAP,CHIP,MAKER

ECZH0000841

56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C329

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C330

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C331

CAP,CHIP,MAKER

ECZH0000813

100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C332

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C333

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C335

CAP,CERAMIC,CHIP

ECCH0000179

22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

6

C336

CAP,CERAMIC,CHIP

ECCH0000104

3 pF,50V,C,NP0,TC,1005,R/TP

6

C337

CAP,CERAMIC,CHIP

ECCH0000113

18 pF,50V,J,NP0,TC,1005,R/TP

6

C338

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C339

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C340

CAP,CERAMIC,CHIP

ECCH0000182

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6

C341

CAP,CHIP,MAKER

ECZH0001215

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6

C342

CAP,CERAMIC,CHIP

ECCH0004904

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6

C400

CAP,CHIP,MAKER

ECZH0000802

1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6

C401

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C402

CAP,CERAMIC,CHIP

ECCH0003002

10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP

6

C403

CAP,CHIP,MAKER

ECZH0000816

12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Description

Part Number

Specification

- 118 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

C404

CAP,CERAMIC,CHIP

ECCH0000155

10 nF,16V,K,X7R,HD,1005,R/TP

6

C405

CAP,CHIP,MAKER

ECZH0000830

33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C406

CAP,CERAMIC,CHIP

ECCH0000113

18 pF,50V,J,NP0,TC,1005,R/TP

6

C407

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C408

CAP,CERAMIC,CHIP

ECCH0000155

10 nF,16V,K,X7R,HD,1005,R/TP

6

C410

CAP,CERAMIC,CHIP

ECCH0009505

22 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP

6

C413

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C414

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C417

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C418

CAP,CHIP,MAKER

ECZH0000826

27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6

C419

CAP,CERAMIC,CHIP

ECCH0000104

3 pF,50V,C,NP0,TC,1005,R/TP

6

C420

CAP,CERAMIC,CHIP

ECCH0000104

3 pF,50V,C,NP0,TC,1005,R/TP

6

C421

CAP,CERAMIC,CHIP

ECCH0000104

3 pF,50V,C,NP0,TC,1005,R/TP

6

C422

CAP,CERAMIC,CHIP

ECCH0000104

3 pF,50V,C,NP0,TC,1005,R/TP

6

CN200

CONNECTOR,FFC/FPC

ENQY0013801

13 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT
,TOP ,SMD ,R/TP ,[empty] ,

6

CN301

CONNECTOR,I/O

ENRY0006401

18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

6

D300

DIODE,SWITCHING

EDSY0005301

SC-70 ,80 V,0.1 A,R/TP ,

6

FB300

FILTER,BEAD,CHIP

SFBH0008105

1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

6

FB301

FILTER,BEAD,CHIP

SFBH0008105

1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

6

FB302

FILTER,BEAD,CHIP

SFBH0008105

1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

6

FL400

FILTER,SEPERATOR

SFAY0010101

850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC
,Dual Band ASM, 2.5x2.5x1.2

6

FL401

FILTER,SAW,DUAL

SFSB0001401

942.5 MHz,35 MHz,2.1 dB,20 dB,1842.5 MHz,75 MHz,2.3
dB,12 dB,2.0*1.6*0.68 ,SMD
,925M~960M,1805M~1880M,10p,B,150_82,150_15,EGSM
+DCS Rx ,; ,942.5, 1842.5 ,2.0*1.6*0.68 ,SMD ,R/TP

6

J300

CONN,SOCKET

ENSY0018101

6 PIN,ETC , ,2.54 mm,H=1.5

6

L102

INDUCTOR,CHIP

ELCH0001032

18 nH,J ,1005 ,R/TP ,PBFREE

6

L103

INDUCTOR,CHIP

ELCH0004715

27 nH,J ,1005 ,R/TP ,

6

L104

INDUCTOR,CHIP

ELCH0004715

27 nH,J ,1005 ,R/TP ,

6

L300

INDUCTOR,CHIP

ELCH0001556

270 nH,J ,1608 ,R/TP ,

6

L400

INDUCTOR,CHIP

ELCH0004721

2.2 nH,S ,1005 ,R/TP ,

6

L401

INDUCTOR,CHIP

ELCH0001413

22 nH,J ,1005 ,R/TP ,PBFREE

6

L403

INDUCTOR,CHIP

ELCH0001032

18 nH,J ,1005 ,R/TP ,PBFREE

6

L404

INDUCTOR,CHIP

ELCH0003814

5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

6

Q200

TR,BJT,NPN

EQBN0007101

EMT3 ,0.15 W,R/TP ,LOW FREQUENCY

Description

Part Number

Specification

- 119 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

Q300

TR,BJT,NPN

EQBN0007101

EMT3 ,0.15 W,R/TP ,LOW FREQUENCY

6

R100

RES,CHIP,MAKER

ERHZ0000506

6800 ohm,1/16W ,J ,1005 ,R/TP

6

R101

RES,CHIP,MAKER

ERHZ0000244

22 Kohm,1/16W ,F ,1005 ,R/TP

6

R102

RES,CHIP

ERHY0000278

82K ohm,1/16W,J,1005,R/TP

6

R104

RES,CHIP,MAKER

ERHZ0000438

20 Kohm,1/16W ,J ,1005 ,R/TP

6

R105

RES,CHIP,MAKER

ERHZ0000438

20 Kohm,1/16W ,J ,1005 ,R/TP

6

R106

RES,CHIP,MAKER

ERHZ0000438

20 Kohm,1/16W ,J ,1005 ,R/TP

6

R108

RES,CHIP

ERHY0000278

82K ohm,1/16W,J,1005,R/TP

6

R109

RES,CHIP,MAKER

ERHZ0000507

68 Kohm,1/16W ,J ,1005 ,R/TP

6

R110

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R111

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R112

RES,CHIP,MAKER

ERHZ0000287

47 Kohm,1/16W ,F ,1005 ,R/TP

6

R115

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R116

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R119

RES,CHIP

ERHY0003401

1800 ohm,1/16W ,J ,1005 ,R/TP

6

R122

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R124

RES,CHIP

ERHY0008402

160 Kohm,1/16W ,F ,1005 ,R/TP

6

R125

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R197

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R202

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R205

RES,CHIP,MAKER

ERHZ0000483

47 ohm,1/16W ,J ,1005 ,R/TP

6

R206

RES,CHIP,MAKER

ERHZ0000483

47 ohm,1/16W ,J ,1005 ,R/TP

6

R207

RES,CHIP,MAKER

ERHZ0000483

47 ohm,1/16W ,J ,1005 ,R/TP

6

R208

RES,CHIP,MAKER

ERHZ0000483

47 ohm,1/16W ,J ,1005 ,R/TP

6

R210

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R222

RES,CHIP,MAKER

ERHZ0000404

1 Kohm,1/16W ,J ,1005 ,R/TP

6

R223

RES,CHIP,MAKER

ERHZ0000405

10 Kohm,1/16W ,J ,1005 ,R/TP

6

R300

RES,CHIP,MAKER

ERHZ0000404

1 Kohm,1/16W ,J ,1005 ,R/TP

6

R301

RES,CHIP,MAKER

ERHZ0000443

2200 ohm,1/16W ,J ,1005 ,R/TP

6

R302

RES,CHIP,MAKER

ERHZ0000485

4700 ohm,1/16W ,J ,1005 ,R/TP

6

R303

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R304

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R305

RES,CHIP,MAKER

ERHZ0000702

10 ohm,1/10W ,J ,1608 ,R/TP

6

R306

RES,CHIP,MAKER

ERHZ0000404

1 Kohm,1/16W ,J ,1005 ,R/TP

Description

Part Number

Specification

- 120 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

R307

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R308

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R309

RES,CHIP,MAKER

ERHZ0000443

2200 ohm,1/16W ,J ,1005 ,R/TP

6

R310

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R312

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R313

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R314

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R316

RES,CHIP,MAKER

ERHZ0000529

1.5 Kohm,1/16W ,J ,1005 ,R/TP

6

R317

RES,CHIP,MAKER

ERHZ0000405

10 Kohm,1/16W ,J ,1005 ,R/TP

6

R318

RES,CHIP,MAKER

ERHZ0000443

2200 ohm,1/16W ,J ,1005 ,R/TP

6

R319

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R320

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R321

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R323

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R324

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R326

RES,CHIP,MAKER

ERHZ0000476

39 Kohm,1/16W ,J ,1005 ,R/TP

6

R327

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R328

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R329

RES,CHIP,MAKER

ERHZ0000438

20 Kohm,1/16W ,J ,1005 ,R/TP

6

R330

RES,CHIP,MAKER

ERHZ0000438

20 Kohm,1/16W ,J ,1005 ,R/TP

6

R331

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R332

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R333

RES,CHIP,MAKER

ERHZ0000476

39 Kohm,1/16W ,J ,1005 ,R/TP

6

R334

RES,CHIP,MAKER

ERHZ0000405

10 Kohm,1/16W ,J ,1005 ,R/TP

6

R335

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R336

RES,CHIP,MAKER

ERHZ0000485

4700 ohm,1/16W ,J ,1005 ,R/TP

6

R337

RES,CHIP,MAKER

ERHZ0000485

4700 ohm,1/16W ,J ,1005 ,R/TP

6

R338

RES,CHIP,MAKER

ERHZ0000483

47 ohm,1/16W ,J ,1005 ,R/TP

6

R339

RES,CHIP,MAKER

ERHZ0000454

27 Kohm,1/16W ,J ,1005 ,R/TP

6

R341

RES,CHIP,MAKER

ERHZ0000467

330 Kohm,1/16W ,J ,1005 ,R/TP

6

R343

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R344

RES,CHIP,MAKER

ERHZ0000450

240 Kohm,1/16W ,J ,1005 ,R/TP

6

R345

RES,CHIP,MAKER

ERHZ0000406

100 Kohm,1/16W ,J ,1005 ,R/TP

6

R401

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

Description

Part Number

Specification

- 121 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

R402

RES,CHIP,MAKER

ERHZ0000404

1 Kohm,1/16W ,J ,1005 ,R/TP

6

R403

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R404

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R405

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R406

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R407

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

R410

RES,CHIP,MAKER

ERHZ0000401

0 ohm,1/16W ,J ,1005 ,R/TP

6

SW400

CONN,RF SWITCH

ENWY0004501

,SMD , dB,H=3.6, Straight type

6

U100

IC

EUSY0176402

Flip-Chip CSP ,9 PIN,R/TP ,Audio Power Amplifier

6

U101

IC

EUSY0328601

DFN ,10 PIN,R/TP ,Li-ion charger IC, 1A, 10Pin, 3x3, DFN

6

U102

IC

EUSY0317401

BGA ,189 PIN,R/TP ,E-Gold voice

6

U200

IC

EUSY0238702

TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154
Low cost version)

6

U301

IC

EUSY0328001

BGA ,56 PIN,R/TP ,32Mb/4Mb , 200 nm, MirroBit

6

U302

IC

EUSY0320801

QFN ,20 PIN,R/TP ,FM Tuner Chip, 3*3*0.57, Pb Free

6

U303

IC

EUSY0142501

LLP ,8 PIN,R/TP ,Dual 105mW Headphone Amplifier

6

U304

IC

EUSY0223002

HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT
CONTROL / 2.8V

6

U305

IC

EUSY0300101

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog
Switch, PB-Free

6

U400

PAM

SMPY0014001

35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band

6

X100

X-TAL

EXXY0004602

.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD
,6.9*1.4*1.3 ,

6

X101

X-TAL

EXXY0018404

26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm at 30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , , ,SMD
,R/TP

5

SAFD

PCB ASSY,MAIN,SMT TOP

SAFD0085602

6

C102

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

C103

CAP,CERAMIC,CHIP

ECCH0000120

39 pF,50V,J,NP0,TC,1005,R/TP

6

L100

INDUCTOR,CHIP

ELCH0004711

22 nH,J ,1005 ,R/TP ,

6

L101

INDUCTOR,CHIP

ELCH0004711

22 nH,J ,1005 ,R/TP ,

6

LD200

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

LD201

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

LD202

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

LD203

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

LD204

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

LD205

DIODE,LED,CHIP

EDLH0006001

Blue ,1608 ,R/TP ,Blue SMD LED

6

R201

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

Description

Part Number

Specification

- 122 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location
No.

6

R203

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R204

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R209

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R211

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R212

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R213

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R214

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R215

RES,CHIP,MAKER

ERHZ0000505

680 ohm,1/16W ,J ,1005 ,R/TP

6

R216

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R217

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R218

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R219

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R220

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

R221

RES,CHIP

ERHY0003301

100 ohm,1/16W ,J ,1005 ,R/TP

6

SPFY00

PCB,MAIN

SPFY0144601

FR-4 ,.0.8mm,BUILD-UP 4 ,KG270/KG278 Main PCB

Description

Part Number

Specification

- 123 -

Color

Remark

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory

Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC

Level

Location
No.

3

MCJA00

COVER,BATTERY

MCJA0040301

MOLD, PC LUPOY SC-1004A, , , , ,

3

SBPL00

BATTERY PACK,LI-ION

SBPL0089503

3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Europe
Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 ,
,ALLTEL SILVER ,Innerpack ,Europe Label

BATTERY PACK,LI-ION

SBPL0088203

3.7 V,750 mAh,1 CELL,PRISMATIC ,GB3 BATT(CMW
standard batt), Europe, Pb-Free ,; ,3.7 ,750 ,0.2C
,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack
,Europe Label

Description

Part Number

Specification

3

SGEY00

EAR PHONE/EAR MIKE SET

SGEY0003209

; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty]
,BLACK,EARPHONE HOUSING:SILVER ,18P MMI
CONNECTOR ,MONO18P(5P)LOW COST

3

SSAD00

ADAPTOR,AC-DC

SSAD0024901

100-240V ,5060 Hz,5.1 V,.7 A,CB/GOST ,AC-DC
ADAPTOR ,; ,100Vac~350Vac ,5.1V (+0.15, -0.2) ,700mA
,5060 , ,WALL 2P ,I/O CONNECTOR ,

ADAPTOR,AC-DC

SSAD0024902

100-240V ,5060 Hz,5.2 V,0.7 A,CB/GOST ,AC-DC
ADAPTOR ,; ,100Vac~350Vac ,5.2±0.3V ,700mA ,5060 ,
,WALL 2P ,I/O CONNECTOR ,

- 124 -

Color

Remark

Black

6

Note

Note

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