Nokia 6085 Rm 198 6086 188 Service Manual 34 V2

User Manual: Phone Nokia 6086 RM-188 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Nokia Customer Care

Service Manual
RM-188; RM-198 (Nokia 6085; Nokia 6086)

Mobile Terminal
Part No: 9254881 (Issue 2)

COMPANY CONFIDENTIAL

Copyright © 2007 Nokia. All rights reserved.

RM-188; RM-198
Amendment Record Sheet

Nokia Customer Care

Amendment Record Sheet
Amendment No

Date

Inserted By

Issue 1

10/2006

ET

Issue 2

02/2007

ET

Page ii

Comments
Added the RM-188 information.

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Copyright

Nokia Customer Care

Copyright
Copyright © 2007 Nokia. All rights reserved.
Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form
without the prior written permission of Nokia is prohibited.
Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia
Corporation. Other product and company names mentioned herein may be trademarks or tradenames of
their respective owners.
Nokia operates a policy of continuous development. Nokia reserves the right to make changes and
improvements to any of the products described in this document without prior notice.
Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,
consequential or indirect damages howsoever caused.
The contents of this document are provided "as is". Except as required by applicable law, no warranties of
any kind, either express or implied, including, but not limited to, the implied warranties of merchantability
and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this
document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.
The availability of particular products may vary by region.

IMPORTANT
This document is intended for use by qualified service personnel only.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page iii

RM-188; RM-198
Warnings and cautions

Nokia Customer Care

Warnings and cautions

Warnings
• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED
WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT
CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,
FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.
• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions
• Servicing and alignment must be undertaken by qualified personnel only.
• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.
• Use only approved components as specified in the parts list.
• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and
alignment.
• Ensure all cables and wires are repositioned correctly.
• During testing never activate the GSM transmitter without a proper antenna load, otherwise GSM PA may
be damaged.

Page iv

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
ESD protection

Nokia Customer Care

ESD protection
Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing
the phone.
Any product of which the covers are removed must be handled with ESD protection. The SIM card can be
replaced without ESD protection if the product is otherwise ready for use.
To replace the covers ESD protection must be applied.
All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity
discharge.
All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside
any ESD Protected Area (EPA).
Every repair action involving opening the product or handling the product components must be done under
ESD protection.
ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.
For more information and local requirements about ESD protection and ESD Protected Area, contact your local
Nokia After Market Services representative.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page v

RM-188; RM-198
Care and maintenance

Nokia Customer Care

Care and maintenance
This product is of superior design and craftsmanship and should be treated with care. The suggestions below
will help you to fulfil any warranty obligations and to enjoy this product for many years.
• Keep the phone and all its parts and accessories out of the reach of small children.
• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that
will corrode electronic circuits.
• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.
• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form
inside, which may damage electronic circuit boards.
• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.
• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.
• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or
attachments could damage the phone and may violate regulations governing radio devices.
All of the above suggestions apply equally to the product, battery, charger or any accessory.

Page vi

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Company Policy

Nokia Customer Care

Company Policy
Our policy is of continuous development; details of all technical modifications will be included with service
bulletins.
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If
any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email.
Please state:
• Title of the Document + Issue Number/Date of publication
• Latest Amendment Number (if applicable)
• Page(s) and/or Figure(s) in error

Please send to:
NOKIA CORPORATION
Nokia Mobile Phones Business Group
Nokia Customer Care
PO Box 86
FIN-24101 SALO
Finland
E-mail: Service.Manuals@nokia.com

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page vii

RM-188; RM-198
Battery information

Nokia Customer Care

Battery information
Note: A new battery's full performance is achieved only after two or three complete charge and
discharge cycles!
The battery can be charged and discharged hundreds of times but it will eventually wear out. When the
operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.
Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers
approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to
a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged
battery will discharge itself over time.
Temperature extremes can affect the ability of your battery to charge.
For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the
product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory
available for the product). Do not attempt to discharge the battery by any other means.
Use the battery only for its intended purpose.
Never use any charger or battery which is damaged.
Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or
pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example
when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery
or the connecting object.
Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce
the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°
F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.
Batteries' performance is particularly limited in temperatures well below freezing.
Do not dispose of batteries in a fire!
Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

Page viii

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Nokia 6085; Nokia 6086 Service Manual Structure

Nokia Customer Care

Nokia 6085; Nokia 6086 Service Manual Structure
1 General Information
2 Parts Lists and Component Layouts
3 Service Software Instructions
4 Service Tools and Service Concepts
5 Disassembly / Reassembly Instructions
6 BB Troubleshooting and Manual Tuning Guide
7 RF Troubleshooting and Manual Tuning Guide
8 System Module
9 RM-188/198 schematics
Glossary

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page ix

Nokia Customer Care

RM-188; RM-198
Nokia 6085; Nokia 6086 Service Manual Structure

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Page x

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

Nokia Customer Care

1 — General Information

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 1 –1

RM-188; RM-198
General Information

Nokia Customer Care

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Page 1 –2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
General Information

Nokia Customer Care

Table of Contents
RM-188/198 product selection..............................................................................................................................1–5
RM-188/198 product features and sales package...............................................................................................1–5
Product and module list ........................................................................................................................................1–7
Mobile enhancements............................................................................................................................................1–7
Technical specifications .........................................................................................................................................1–9
Transceiver general specifications ..................................................................................................................1–9
Main RF characteristics for GSM850/900/1800/1900 (quadband) and EDGE phones .................................1–9
Battery endurance.......................................................................................................................................... 1–10
Environmental conditions ............................................................................................................................. 1–10

List of Tables
Table 1 RM-188/198 ...............................................................................................................................................1–7
Table 2 Audio ..........................................................................................................................................................1–7
Table 3 Battery and chargers ................................................................................................................................1–8
Table 4 Car...............................................................................................................................................................1–8
Table 5 Carrying......................................................................................................................................................1–8
Table 6 Data ............................................................................................................................................................1–8
Table 7 Music ..........................................................................................................................................................1–9

List of Figures
Figure 1 View of RM-188/198................................................................................................................................1–5

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COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 1 –3

RM-188; RM-198
General Information

Nokia Customer Care

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Page 1 –4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
General Information

Nokia Customer Care

RM-188/198 product selection
Nokia RM-188/198 supports 850/900/1800/1900 MHz bands. RM-188/198 will support EGPRS packet data
connection (EDGE) in all these bands. Supported multislot class for both GPRS and EGPRS is MSC 10. RM-188/198
is based on G3.1S, RAP GSM engine.
Note: The RM-188 also supports WLAN 802.11 b/g 2.4 Ghz for UMA (Unlicensed Mobile Access), with
automatic switching between WLAN and cellular networks.
According to GSM standard 05.05, it responds to class 4 (max. 2W) in EGSM 900, class 1 (1W) in GSM 1800 and
class 1 in GSM 1900. It also supports Bluetooth 2.0 + EDR standard. The handset has a full phase 2 Type Approval
and it complies with the GSM Type Approval. RM-188/198 also has a full CE approval and FCC approval.
The main handset display is a 1.8” CSTN passive LCD display that supports up to 262,144 colors (128 x 160
pixels). The mini cover display is a 1” FSTN black-and-white screen with blue LEDs (96 x 68 pixels). The device
also has a VGA camera with a 4x digital post zoom.
RM-188/198 has a FM stereo radio and music player, and it supports microSD card with hotswap possibility.
The MMS implementation follows the OMA MMS 1.2, AMR and SMIL.
WAP 2.0 compatible XHTML browser over HTTP/TCP/IP stack communicates with a gateway in network.
The supported user interface is S40, that is, RM-188/198 software is based on ISA platform.

Figure 1 View of RM-188/198

RM-188/198 product features and sales package

Imaging
• VGA camera (resolution 648 X 488 pixels) with dedicated camera button, and 4x digital zoom
• Phone main display used as viewfinder: use to take normal pictures and videos.
Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 1 –5

RM-188; RM-198
General Information

Nokia Customer Care
• Standard, night, and sequential shot modes; self-timer
• Gallery for storing and editing images
• Three image-quality options: high, normal, basic

• Integrated video recorder: 3GPP spec (H.263 video and AMR audio packed in .3gp format)
• Video resolution: QCIF (176 x 144 Pixel), 15 frames per second
• Video capture time: Up to 5 min

Bearers & transport
• Quadband GSM/EDGE 850/900/1800/1900
• Automatic switching between bands

Software platform
• SW platform: Nokia Series 40

Connectivity
• WLAN 802.11 b/g 2.4 Ghz for UMA, with automatic switching between WLAN and cellular networks
Note: RM-188 only.
• USB 2.0 full-speed
• Bluetooth 2.0
• Pop-Port™ connector with ACI
• Support for SIM Access Profile (SAP)
• Remote or local synchronization with a PC or other compatible device

Productivity
• PIM (Calendar & Contacts)
• XHTML browser over TCP/IP
• Video streaming (3GPP)
• Logs (last calls , timers and history list)
• Audio messaging
• JavaTM MIDP 2.0, CLDC 1.13D API, PIM API, File access API
• MP3
• Data Transfer
• Settings Wizard/Access Point Configurator

Sales package
• Transceiver RM-188/198
• Nokia BL-5C battery
• Nokia compact charger AC-3
• Nokia headset HS-5
• User guide and quick guide

Page 1 –6

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
General Information

Nokia Customer Care

Product and module list
Table 1 RM-188/198

Module name

Type code

Notes

Upper Module

1WJ

Connectors for display, UI PWB,
HWA camera, and earpiece.

Lower Module

1VZ

Main PWB with components.

Flex Cable

1WK

The flex between the upper and
lower module.

Mobile enhancements
Table 2 Audio

Enhancement

Type

Audio adapter

AD-46

Display headset

HS-69

Wired headset

HDB-4
HS-23
HS-3
HS-31
HS-5
HS-8

Wireless headset

HDW-3
HS-12W
HS-13W
HS-24W
HS-25W
HS-26W
HS-34W
HS-38W
HS-39W
HS-50W
HS-51W
HS-57W
HS-58W
HS-59W
HS-71W

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

Page 1 –7

RM-188; RM-198
General Information

Nokia Customer Care
Table 3 Battery and chargers

Type

Name

Note: This phone is charged through the smaller Nokia standard interface (2.0 mm plug). The 3.5 mm
standard charger can be used together with the CA-44 charger adapter.
Battery 970 mAh Li-Ion

BL-5C

Charger adapter (from 3.5 mm -> 2
mm)

CA-44

Compact charger

AC-3

Travel charger

AC-4, AC-5

Table 4 Car

Enhancement
Car kit

Type
CK-1W
CK-7Wi
CK-20W
N610
N616

Car handsfree

BHF-3
HF-3
HF-33
HF-6W

Microphone

MP-2

Mobile charger

DC-4

Mobile holder

CR-39

Mobile holder easy mount

HH-12

Table 5 Carrying

Enhancement
Carrying case

Type
CP-57
CP-109
CP-145

Table 6 Data

Enhancement

Type

Connectivity cable

CA-53

128 MB µSD card

MU-26

Page 1 –8

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General Information

Nokia Customer Care

Enhancement

Type

256 MB µSD card

MU-27

512 MB µSD card

MU-28

1 GB µSD card

MU-22

Table 7 Music

Enhancement

Type

Audio gateway

AD-42W

Mini speakers

MD-2
MD-4

Technical specifications
Transceiver general specifications
Unit

Dimensions (L x W x T)

Transceiver with BL-5C
battery

92x46x23mm

Weight (g)

Volume (cm3)

84g (without battery)

84

Main RF characteristics for GSM850/900/1800/1900 (quadband) and EDGE phones
Parameter

Unit

Cellular system

GSM850, EGSM900, GSM1800/1900 and EDGE

Rx frequency band

GSM850: 869 - 890 MHz
EGSM900: 925 - 960 MHz
GSM1800: 1805 - 1880 MHz
GSM1900: 1930 - 1990 MHz

Tx frequency band

GSM850: 824 - 849 MHz
EGSM900: 880 - 915 MHz
GSM1800: 1710 - 1785 MHz
GSM1900: 1850 - 1910 MHz

Output power

GSM850: +5 … +33dBm/3.2mW … 2W
GSM900: +5 … +33dBm/3.2mW … 2W
GSM1800: +0 … +30dBm/1.0mW … 1W
GSM1900: +0 … +30dBm/1.0mW … 1W

Issue 2

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RM-188; RM-198
General Information

Nokia Customer Care
Parameter

Unit

EDGE output power

EDGE850: +5 … +29dBm/3.2mW … 2W
EDGE900: +5 … +29dBm/3.2mW … 2W
EDGE1800: +0 … +26dBm/1.0mW … 1W
EDGE1900:+0 … +26dBm/1.0mW … 1W

Number of RF channels

GSM850: 124
GSM900: 194
GSM1800: 374
GSM1900: 299

Channel spacing

200 kHz

Number of Tx power levels

GSM850: 15
GSM900: 15
GSM1800: 16
GSM1900: 16

Number of EDGE Tx power levels

GSM850 EDGE: 12
GSM900 EDGE: 12
GSM1800 EDGE: 14
GSM1900 EDGE: 14

Battery endurance
Battery
BL-5C

Capacity (mAh)
970mAh

Talk time

Stand-by

Pure GSM: up to 5h.

Pure GSM: up to 10 days.

UMA: up to 6h.

UMA: up to 4 days.

Charging times
AC-3
Up to 3hrs 30 mins

Environmental conditions
Environmental condition

Ambient temperature

Notes

Normal operation

-15oC...+55oC

Specifications fulfilled

Reduced performance

-25oC...-15oC

Operational for shorts periods
only

+55oC...+70oC
Intermittent operation

-40oC...-15oC
+70oC...+85 oC

Page 1 –10

Operation not guaranteed but an
attempt to operate does not
damage the phone.

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
General Information
Environmental condition

Nokia Customer Care
Ambient temperature

No operation or storage

<-40oC...>+85oC

Charging allowed

-25oC...+50oC

Long term storage conditions

0oC...+85oC

Issue 2

Notes
No storage or operation: an
attempt may damage the phone.

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

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RM-188; RM-198
General Information

Nokia Customer Care

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COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

Nokia Customer Care

2 — Parts Lists and Component
Layouts

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –1

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

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COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

Table of Contents
Exploded view.........................................................................................................................................................2–5
Exploded view ...................................................................................................................................................2–5
General recycling recommendation ................................................................................................................2–6
Mechanical spare parts overview ....................................................................................................................2–6
Parts lists .................................................................................................................................................................2–7
RM-188 mechanical spare parts list.................................................................................................................2–7
RM-198 mechanical spare parts list.............................................................................................................. 2–10
Lower (engine) block ..................................................................................................................................... 2–12
RM-188 lower block component parts list (1VZ_12d) ............................................................................ 2–12
RM-198 lower block component parts list (1VZ_12b) ............................................................................ 2–32
Upper block ..................................................................................................................................................... 2–50
RM-188/198 upper block component parts list (1WJ_10b) ................................................................... 2–50
RM-198 upper block component parts list with HAC (1WJ_10c) ........................................................... 2–52
Component layouts ............................................................................................................................................. 2–54
Lower (engine) block ..................................................................................................................................... 2–54
RM-188 lower block component layout - top (1VZ_12d) ....................................................................... 2–54
RM-188 lower block component layout - bottom (1VZ_12d) ................................................................ 2–54
RM-198 lower block component layout - top (1VZ_12b) ....................................................................... 2–56
RM-198 lower block component layout - bottom (1VZ_12b) ................................................................ 2–57
Upper block ..................................................................................................................................................... 2–58
RM-188/198 upper block component layout - top (1WJ_10b) .............................................................. 2–58
RM-188/198 upper block component layout - bottom (1WJ_10b) ....................................................... 2–59
RM-198 upper block component layout with HAC - top (1WJ_10c) ...................................................... 2–60
RM-198 upper block component layout with HAC - bottom (1WJ_10c) ............................................... 2–61

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Copyright © 2007 Nokia. All rights reserved.

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RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

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Page 2 –4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

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Parts Lists and Component Layouts

Nokia Customer Care

Exploded view
Exploded view

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –5

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

General recycling recommendation

Page 2 –6

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

Mechanical spare parts overview

Parts lists
RM-188 mechanical spare parts list
Note: For Nokia product codes, please refer to the latest Service Bulletins on the Partner Website (PWS).

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

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RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

To ensure you are always using the latest codes, please check the PWS on a daily basis.
Ax and in bold = ASSY
"-" = NOT AVAILABLE
"XXXXXXX" = VARIANTS
"???????" = Code available in Bulletin
I0xx = ITEM codes for upper or mono block
I1xx = ITEM codes for hinge block
I2xx = ITEM codes for lower block
I3xx = ITEM codes for soldered spare parts on the upper, hinge or lower block and not exchangable

ITEM/
CIRCUIT QTY SPARE PART DESCRIPTION
REF.
A1

1

B-COVER UPPER ASSY
(I001 - I002)

I001

1

B-COVER

NOTE

Cannot be reused
when removed

ACTIVITY

LEVEL

-

1

MR

-

MR

1

I002

1

SECONDARY LCD GASKET

I003

1

LCD PM 69X68

MR

1

I004

1

CAMERA MODULE CCP2 VGA

MR

1

I005

4

SCREWS M1,6 x 2,6mm

MR

1

A2

1

1WJ-A UI MODULE (UPPER
BLOCK) (I006 - I007)

-

1

I006

1

PWB 1WJ

MR

-

I007

1

LCD BACK ADHESIVE

MR

-

I008

1

LCD CSTN 128x160
262Kcolor

MR

1

A3

1

A-COVER UPPER
ASSEMBLY (I009 - I015,
I101)

-

1

I009

1

A-COVER

MR

-

I010

1

MAGNET

MR

-

I011

1

GROUND EXTENSION

MR

-

I101

1

HINGE MODULE

MR

1

I012

1

LCD GASKET

MR

-

I013

1

EARP RDF-07A 32OHM

MR

1

I014

1

SPEAKER GASKET

MR

1

I015

1

LCD CONNECTOR PORON

MR

-

I016

1

LCD WINDOW

MR

1

Page 2 –8

Cannot be reused
when removed

Cannot be reused
when removed

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
ITEM/
CIRCUIT QTY SPARE PART DESCRIPTION
REF.
I102

Nokia Customer Care

NOTE

ACTIVITY

LEVEL

ANTENNA CAP

MR

1

I103

1

PWB FLEX 1WK

MR

1

I201

1

A-COVER LOWER ASSY

MR

1

I202

1

FLIP STOPPER

MR

1

I203

1

KEYMAT

MR

1

A4

1

1VZ ENGINE MODULE
ASSY (I204 - I210)

-

-

DOME SHEET

Cannot be reused
when removed

MR

1

Cannot be reused
when removed

MR

1

MR

-

I204

1

I205

1

FM RADIO-FRAME LID

I206

1

ENGINE MODULE

I207

1

RF-SHIELD LID

Cannot be reused
when removed

MR

1

I208

1

RAP SHIELD LID

Cannot be reused
when removed

MR

1

I209

1

WLAN-BT SHIELD LID

Cannot be reused
when removed

MR

1

I210

1

RETU-TAHVO SHIELD LID

Cannot be reused
when removed

MR

1

I211

1

TYPE LABEL

Cannot be reused
when removed

MR

3

A5

1

ANTENNA MODULE
850/900/1800/1900
(I212 - I215)

-

1

I212

1

IHF SPEAKER

MR

1

I213

1

IHF GASKET

MR

1

I214

1

ANTENNA COVER

MR

-

I215

1

ANTENNA

MR

-

A6

1

C-COVER ASSEMBLY (I216
- I225)

-

3

I216

1

VIBRA MOTOR

MR

1

I217

1

MEMORY CARD DOOR

MR

1

I218

1

MICROPHONE

MR

1

I219

1

CONN CHR DIA 2.0MM

MR

1

Issue 2

Cannot be reused
when removed

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –9

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
ITEM/
CIRCUIT QTY SPARE PART DESCRIPTION
REF.

NOTE

ACTIVITY

LEVEL

I220

1

CAMERA KEY

MR

-

I221

1

VOLUME KEY

MR

-

I222

1

C-SHIELD FOAM

MR

-

I223

1

C-COVER SHIELD

MR

-

I224

1

C-COVER

MR

-

I225

1

SIM LID

MR

1

I226

4

SCREW M1.6X6.7

MR

1

I227

1

BATTERY COVER

MO

1

I230

1

UPPER PWB COLOR TAPE

MR

1

Cannot be reused
when removed
Cannot be reused
when removed

RM-198 mechanical spare parts list
Note: For Nokia product codes, please refer to the latest Service Bulletins on the Partner Website (PWS).
To ensure you are always using the latest codes, please check the PWS on a daily basis.
Ax and in bold = ASSY
"-" = NOT AVAILABLE
"XXXXXXX" = VARIANTS
"???????" = Code available in Bulletin
I0xx = ITEM codes for upper or mono block
I1xx = ITEM codes for hinge block
I2xx = ITEM codes for lower block
I3xx = ITEM codes for soldered spare parts on the upper, hinge or lower block and not exchangable

ITEM/
CIRCUIT
REF.

QTY

SPARE PART DESCRIPTION

A1

1

B-COVER UPPER ASSY (I001 I002)

I001

1

B-COVER

NOTE

Cannot be reused
when removed

ACTIVITY

LEVEL

-

1

MR

-

MR

1

I002

1

SECONDARY LCD GASKET

I003

1

LCD PM 69X68

MR

1

I004

1

CAMERA MODULE CCP2 VGA

MR

1

I005

4

SCREWS M1,6 x 2,6mm

MR

1

A2

1

1WJ-A UI MODULE (UPPER
BLOCK) (I006 - I007)

-

1

I006

1

PWB 1WJ

MR

-

Page 2 –10

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
ITEM/
CIRCUIT
REF.

QTY

SPARE PART DESCRIPTION

Nokia Customer Care

NOTE

ACTIVITY

LEVEL

I007

1

LCD BACK ADHESIVE

MR

-

I008

1

LCD CSTN 128x160 262Kcolor

MR

1

A3

1

A-COVER UPPER ASSEMBLY
(I009 - I015, I101)

-

1

I009

1

A-COVER

MR

-

I010

1

MAGNET

MR

-

I011

1

GROUND EXTENSION

MR

-

I101

1

HINGE MODULE

MR

1

I012

1

LCD GASKET

MR

-

I013

1

EARP RDF-07A 32OHM

MR

1

I014

1

SPEAKER GASKET

MR

1

I015

1

LCD CONNECTOR PORON

MR

-

MR

1

ANTENNA CAP

MR

1

I016

1

I102

LCD WINDOW

Cannot be reused
when removed

Cannot be reused
when removed

I103

1

PWB FLEX 1WK

MR

1

I201

1

A-COVER LOWER ASSY

MR

1

I202

1

FLIP STOPPER

MR

1

I203

1

KEYMAT

MR

1

A4

1

1VZ ENGINE MODULE ASSY
(I204 - I210)

-

-

I204

1

DOME SHEET

Cannot be reused
when removed

MR

1

I205

1

FM RADIO-FRAME LID

Cannot be reused
when removed

MR

1

I206

1

ENGINE MODULE

MR

-

RF-SHIELD LID

Cannot be reused
when removed

MR

1

RAP SHIELD LID

Cannot be reused
when removed

MR

1

WLAN-BT SHIELD LID

Cannot be reused
when removed

MR

1

RETU-TAHVO SHIELD LID

Cannot be reused
when removed

MR

1

I207
I208
I209
I210

Issue 2

1
1
1
1

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –11

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
ITEM/
CIRCUIT
REF.

QTY

SPARE PART DESCRIPTION

NOTE

ACTIVITY

LEVEL

Cannot be reused
when removed

MR

3

-

1

MR

1

MR

1

I211

1

TYPE LABEL

A5

1

ANTENNA MODULE
850/900/1800/1900 (I212 I215)

I212

1

IHF SPEAKER

I213

1

IHF GASKET

I214

1

ANTENNA COVER

MR

-

I215

1

ANTENNA

MR

-

A6

1

C-COVER ASSEMBLY (I216 I225)

-

3

I216

1

VIBRA MOTOR

MR

1

I217

1

MEMORY CARD DOOR

MR

1

I218

1

MICROPHONE

MR

1

I219

1

CONN CHR DIA 2.0MM

MR

1

I220

1

CAMERA KEY

MR

-

I221

1

VOLUME KEY

MR

-

I222

1

C-SHIELD FOAM

MR

-

I223

1

C-COVER SHIELD

MR

-

I224

1

C-COVER

MR

-

I225

1

SIM LID

MR

1

I226

4

SCREW M1.6X6.7

MR

1

I227

1

BATTERY COVER

MO

1

MR

1

I230

1

Cannot be reused
when removed

UPPER PWB COLOR TAPE

Cannot be reused
when removed
Cannot be reused
when removed

Lower (engine) block

RM-188 lower block component parts list (1VZ_12d)
Item
A2000
A2100
Page 2 –12

Side
Top
Top

Grid
I

6

D

1

Description and value
SHIELD_040_0
27333

RAP SHIELD ASSY
P3046

~

~

1WN_RIGID

PWB RIGID 1WN
11.9X2.5X2.1 D2

~

~

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item
A2102

Side
Top

Nokia Customer Care

Grid
E

Description and value

7

PWB_1QD

PWB 1QD
10X4.6X1.5

~

~

RETU-TAHVO
AHIELD
ASSEMBLY

~

~

A2400

Top

N

6

SHIELD_040_0
13002

A6000

Top

J

3

SHIELD_040_0
27328

WLAN-BT SHIELD
ASSY P3046

~

~

5

SHIELD_040_0
08558

FM RADIO ASSY
040-008558
P2348

~

~

5

SHIELD_040_0
13089

RF SHIELD
ASSEMBLY WITH
TAPE P3046

~

~

32.768kHz

~

A6100

A7000

Bottom

Top

R

C

B2200

Top

P

6

CRYSTAL_3.3X
1.6_H0.9

CRYSTAL
32.768KHZ
+-30PPM 12.5PF

C2000

Top

N

8

0402C

Chipcap 5% NP0

27p

50V

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

0402C

Chipcap X7R 10%
16V 0402

10n

16V

0402C

Chipcap X7R 10%
16V 0402

10n

16V

0402C

Chipcap X7R 10%
16V 0402

10n

16V

0402C

Chipcap X7R 10%
16V 0402

10n

16V

0402C

Chipcap X7R 10%
16V 0402

10n

16V

10n

16V

C2002
C2003
C2004
C2005
C2006
C2007
C2008
C2009

Bottom
Bottom
Bottom
Bottom
Bottom
Top
Top
Top

R
R
R
R
R
Q
Q
Q

4
4
4
3
3
2
3
3

C2010

Top

Q

3

0402C

Chipcap X7R 10%
16V 0402

C2011

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2012

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2013

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2014

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

0402C

CHIPCAP NP0
220P J 25V 0402

220p

25V

C2015
Issue 2

Top

Q

4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –13

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2016

Top

P

8

0603C_H0.95

CHIPCAP X5R
470N K 25V 0603

470n

25V

C2071

Top

G

3

0402C

Chipcap 5% NP0

27p

50V

C2072

Top

P

2

0402C

Chipcap 5% NP0

27p

50V

C2073

Top

E

5

TANT_C_6.2X3.
4_H1.7

CHIPTCAP 150U M
10V 6X3.2X1.5

150u_10V

10V

C2074

Top

F

2

0402C

Chipcap 5% NP0

10p

50V

C2100

Top

Q

2

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C2101

Top

Q

2

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C2102

Top

Q

2

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

C2103

Top

E

8

0402C

Chipcap 5% NP0

10p

50V

C2104

Top

E

8

0402C

Chipcap 5% NP0

10p

50V

C2105

Bottom

D

2

0402C

Chipcap 5% NP0

27p

50V

C2106

Bottom

C

2

0402C

Chipcap 5% NP0

27p

50V

C2200

Top

O

5

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2201

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2202

Top

P

8

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2203

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2204

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2205

Top

P

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2206

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2207

Top

P

7

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2208

Top

Q

6

0402C

Chipcap 5% NP0

27p

50V

C2209

Top

Q

6

0402C

Chipcap 5% NP0

22p

50V

0603C

CHIPCAP X5R 1U K
16V 0603

1u0

16V

0805C

CHIPCAP X5R 4U7
K 10V 0805

4u7

10V

C2210
C2211

Page 2 –14

Top
Top

N
N

7
7

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2212

Top

N

6

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2213

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2214

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2215

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2216

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2217

Top

P

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2218

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2219

Top

P

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2220

Top

N

6

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2221

Top

N

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2222

Top

N

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2223

Top

O

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2224

Top

P

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2225

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2226

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2227

Top

N

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2228

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2230

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2231

Top

N

5

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2232

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –15

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2233

Top

G

4

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2270

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2271

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2272

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2273

Top

N

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2274

Top

N

6

0402C

Chipcap 5% NP0

27p

50V

C2275

Top

N

5

0402C

Chipcap 5% NP0

27p

50V

C2281

Top

O

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2300

Top

M

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2301

Top

L

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

C2302

Top

N

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

C2303

Top

L

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2304

Top

N

6

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2305

Top

L

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2306

Top

M

4

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2307

Top

L

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2309

Top

L

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

C2310

Top

L

6

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2312

Top

L

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2313

Top

L

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2314

Top

M

7

0805C

CHIPCAP X5R 4U7
K 10V 0805

4u7

10V

Page 2 –16

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2315

Top

N

8

0805C

CHIPCAP X5R 4U7
M 25V 0805

4u7

25V

C2317

Top

O

8

0402C

Chipcap 5% NP0

27p

50V

C2400

Top

N

4

0402C

Chipcap 5% NP0

22p

50V

C2401

Top

N

4

0402C

Chipcap 5% NP0

22p

50V

C2402

Bottom

D

7

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2406

Bottom

C

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2407

Bottom

D

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2412

Top

N

6

0402C

Chipcap 5% NP0

27p

50V

C2413

Bottom

C

7

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2700

Top

Q

3

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2800

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2801

Top

F

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2803

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2805

Top

F

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2806

Top

F

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2807

Top

I

5

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2808

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2809

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2812

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2813

Top

F

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2814

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2816

Top

I

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –17

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2819

Top

I

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2820

Top

F

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2822

Top

F

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2823

Top

I

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2824

Top

J

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2825

Top

F

7

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2826

Top

I

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2828

Top

I

7

0402C

Chipcap 5% NP0

27p

50V

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

100n

16V

C2829

Top

G

8

C2830

Top

H

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

C2831

Top

I

7

0402C

Chipcap 5% NP0

27p

50V

C2833

Top

I

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3000

Top

K

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3001

Top

J

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3002

Top

K

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3003

Top

J

8

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3004

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3005

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3006

Top

K

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3007

Top

K

8

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3008

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

Page 2 –18

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C3009

Top

K

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3200

Top

L

2

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3201

Top

G

2

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C3202

Top

G

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3203

Top

H

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C3204

Top

L

4

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3205

Top

G

3

0402C

Chipcap 5% NP0

27p

50V

18p

50V

C6031

Top

I

2

0402C

CHIPCAP N150
18P J 50V 0402

C6032

Top

H

2

0402C

Chipcap 5% NP0

100p

50V

C6033

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6034

Top

H

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6035

Top

I

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6036

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6037

Top

H

4

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6038

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6039

Top

H

3

0402C

CHIPCAP N150
18P J 50V 0402

18p

50V

C6040

Top

I

4

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

C6051

Top

H

3

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C6052

Top

I

3

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C6055

Top

H

2

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

C6157

Bottom

Q

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –19

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C6158

Bottom

Q

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6164

Bottom

Q

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6165

Bottom

R

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6168

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6170

Bottom

R

5

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6176

Bottom

R

6

0402C

Chipcap 5% NP0

100p

50V

C6178

Bottom

R

6

0402C

Chipcap 5% NP0

27p

50V

C6179

Bottom

Q

6

0402C

Chipcap 5% NP0

47p

50V

C6188

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6189

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6190

Top

P

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6191

Top

P

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6300

Top

K

4

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C6301

Top

K

3

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6303

Top

K

4

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

C6307

Top

J

2

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

C6308

Top

J

4

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6329

Top

J

1

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6330

Top

I

1

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

C6331

Top

K

4

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6335

Top

J

1

0402C

CHIPCAP NP0
220P J 25V 0402

220p

25V

C6338

Top

I

1

0402C

Chipcap 5% NP0

47p

50V

Page 2 –20

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C6341

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6343

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6381

Top

K

3

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6382

Top

K

3

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6383

Top

I

2

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6396

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6397

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6398

Top

J

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6399

Top

J

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C7501

Top

B

4

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C7502

Top

D

4

0402C

Chipcap 5% NP0

10p

50V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

10n

16V

C7503
C7504
C7505
C7506

Top
Top
Top
Top

D
B
D
D

3
4
3
3

C7507

Top

D

3

0402C

Chipcap X7R 10%
16V 0402

C7508

Top

D

3

0402C

Chipcap 5% NP0

18p

50V

C7509

Top

D

3

0402C

Chipcap 5% NP0

10p

50V

C7510

Top

D

4

0402C

Chipcap 5% NP0

27p

50V

C7511

Top

C

3

0603C

CHIPCAP NP0 2N2
G 16V 0603

2n2

16V

C7513

Top

D

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C7514

Top

D

3

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –21

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C7515

Top

B

3

0402C

Chipcap
+-0.25pF NP0

4p7

50V

C7516

Top

C

3

0402C

CHPCAP NP0
470P J 50V 0402

470p

50V

C7518

Top

D

4

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C7520

Top

B

7

0402C

Chipcap
+-0.25pF NP0

3p3

50V

C7522

Top

D

6

0402C

Chipcap
+-0.25pF NP0

1p8

50V

C7524

Top

D

6

0402C

Chipcap
+-0.25pF NP0

1p8

50V

C7525

Top

D

8

0402C

Chipcap 5% NP0

18p

50V

10n

16V

C7586

Top

D

5

0402C

Chipcap X7R 10%
16V 0402

C7590

Top

K

1

0402C

Chipcap 5% NP0

100p

50V

C7592

Top

J

1

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

TFBGA_108

RETU 3.02
TSA1GJWE
TFBGA108

~

~

~

~

D2200

Top

O

6

D2420

Top

G

4

PDSO_G5

OR-GATE 2INPUT
74LVC1G32
SC70-5

D2800

Top

H

6

uBGA_289

RAPGSM V1.1 PA
uBGA289

~

~

COMBO 256M
NOR + 128M DDR
DRAM FBGA133

256MNOR
+128MDDR

~

D3000

Top

J

6

FBGA133_11.1
X10.1

F2000

Top

P

8

0603_FUSE_AV
X2MATS

SM FUSE F 2.0A
32V

2A

~

BATTER_EECEP

RTC BACUP CAPAC
311 SIZE FOR
2.6V 4UAH

2.6V

~

3296-3980M
Hz

~

38.4MHz

~

G2200

Top

G

4

G7500

Top

B

3

VCO_DCS02733

VCO
3296-3980MHZ
4-BAND
MATSUSHITA

G7501

Top

D

2

NKG3176B_H1
.0

VCTCXO 38.4MHZ
2.5V 2MA

Page 2 –22

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

L2000

Top

O

8

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

L2001

Bottom

Q

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

L2002

Bottom

Q

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

L2003

Bottom

R

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

3

COIL_LK_1608

CHIP COIL 68NH J
Q12/100MHZ
0603

68nH

~

2

COIL_LQW160
8

CHIP COIL 56N J
Q38/200MHZ
0603

56nH

~

COIL_LQW160
8

CHIP COIL 56N J
Q38/200MHZ
0603

56nH

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

CHOKE_SER400
_H1.2

INDUCT WW
10UH 0A65 0R35
4X4X1.2

10uH

~

L2004

L2100

L2101

L2202

L2205

L2211

L2212

L2270

L2271

L2301

L2302

Issue 2

Bottom

Bottom

Bottom

Top

Top

Top

Top

Top

Top

Top

Top

R

D

C

2

P

P

N

N

O

O

L

8

8

5

6

5

5

5

M

5

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

220R/
100MHz

~

Page 2 –23

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

L2304

L2305

L2306

L2401

L2402

L2406

L2407

L2408

L2409

L3200

L6030

Side

Top

Top

Top

Bottom

Bottom

Top

Top

Top

Top

Top

Top

Grid

M

L

7

7

M

B

D

I

4

3

2

8

I

8

I

8

I

8

L

2

H

3

Description and value
CHOKE_SER300
_H1.5

CHOKE 22U M 0R7
0.35A
3.0x3.0x1.5

22uH

~

0603_BLM

FERRITE BEAD
0R5 600R/
100MHZ 0603

600R/
100MHz

~

0603_BLM

FERRITE BEAD
0R5 600R/
100MHZ 0603

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

CHIP COIL 2N7
+-0N3 Q29/800M
0402

2n7H

~

2n7H

~

L6031

Top

I

3

0402L

CHIP COIL 2N7
+-0N3 Q29/800M
0402

L6032

Top

I

4

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

0402LQW

CHIP COIL 47N
+-3%
Q25/200MHZ
0402

47nH

~

L6156

Page 2 –24

Bottom

R

5

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value
CHIP COIL 120N J
Q32/150MHZ
0603

120nH

~

L6176

Bottom

R

6

COIL_LQW160
8

L7500

Top

C

5

0402L

CHIP COIL 12N J
Q31/800M 0402

12nH

~

0402L

CHIP COIL 8N2 J
Q28/800MHZ
0402

8n2H

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

3

0402L

CHIP COIL 15N J
Q30/800M 0402

15nH

~

6

TFBGA_84_6.1
5X6.15

TAHVO V5.2 LF
TFBGA84

~

~

USMD8_1.69X
1.69

WHITE LED
DRIVER 4LEDS
500MW 8BUMP
USMD8

~

~

SENSOR_MR10

MAGNETO
RESISTIVE
SENSOR
MRUS71D SOT4

~

~

~

2.8V

L7501

L7502
L7504
L7505
L7515
N2300

N2301

N2402

Top

Top
Top
Top
Top
Top

Top

Bottom

C

5

D
C

4
5

C

5

C
M

M

D

8

7

N3200

Top

G

3

USMD16_2.03
X2.03

VREG & LEVEL
SHIFT LP3928
USMD16

N6030

Top

H

3

CSP_47_3.85X
4.05

BC4-ROM1.0RDL

~

~

N6156

Bottom

Q

5

WLCSP25_3.1X
2.9

FM RECEIVER
TEA5760 N1C

~

~

~

~

N6300

Top

J

3

LFBGA240

WLAN MCM
STLC4550
LFBGA240

N6301

Top

J

1

RF5924

WLAN RF5924
ES3.5

~

~

TFBGA144

AHNE401A
TRANCEIVER
TFBGA144

~

~

N7505

Issue 2

Top

C

4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –25

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

N7520

Top

C

7

RF9282E3.6

PA RF9282E6.5
GSM/EDGE
850/900/1800/1
900

R2000

Bottom

Q

4

0402R

Resistor 5%
63mW

220R

~

4

uBGA11_2.15X
1.65

ASIP MIC W/ESD
RES+CAP+ZDI
BGA11

~

~

0402R

Resistor 5%
63mW

10R

~

0402R

Resistor 5%
63mW

10R

~

0402R

Resistor 5%
63mW

10R

~

0402R

Resistor 5%
63mW

10R

~

3

uBGA5

ASIP 4XESD **PBFREE** BGA5

~

~

4

uBGA11_1.6X2
.15

ASIP SILIC USB
OTG / ESD BGA11

~

~

220k/120k

~

R2001
R2002
R2003
R2004
R2005
R2006
R2007

Bottom
Top
Top
Top
Top
Bottom
Top

Q
Q
Q
Q
Q
Q
Q

3
3
2
3

~

~

R2008

Top

Q

4

0404_RP

RES NETWORK
0W06 220K/
120K J 0404

R2009

Top

Q

4

0402R

Resistor 5%
63mW

220R

~

0402_NTH5

NTC RES 47K J
B=4050+-3%
0402

47k

~

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

14V/50V

~

~

~

R2070

R2071

Top

Top

P

E

2

3

R2100

Top

Q

2

FLIP_CHIP_8_1.
7X1.7

ASIP SINGLE
ENDED
MICROPHONE
INTERF BGA8

R2101

Top

P

2

0402R

Resistor 5%
63mW

220R

~

R2200

Top

P

8

0402R

Resistor 5%
63mW

100k

~

R2201

Top

P

7

0402R

Resistor 5%
63mW

120k

~

Page 2 –26

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

R2212

Top

O

5

0402R

Resistor 5%
63mW

470R

~

R2213

Top

P

7

0402R

Resistor 5%
63mW

4k7

~

R2214

Top

P

8

0402R

Resistor 5%
63mW

4k7

~

R2216

Top

Q

7

0402R

CHIPRES 0W06
2M2 J 0402

2M2

~

R2301

Top

M

8

0402R

Resistor 5%
63mW

3k3

~

R2307

Top

L

4

0402R

Resistor 5%
63mW

100R

~

R2402

Bottom

D

7

0402R

Resistor 5%
63mW

100k

~

R2403

Top

N

6

0402R

Resistor 5%
63mW

4k7

~

R2409

Top

N

8

0402R

Resistor 5%
63mW

390R

~

R2410

Bottom

D

4

0402R

Resistor 5%
63mW

39R

~

R2411

Top

N

7

0402R

Resistor 5%
63mW

390R

~

R2416

Bottom

B

3

0402R

Resistor 5%
63mW

1k0

~

R2420

Top

H

4

0402R

Resistor 5%
63mW

100k

~

R2421

Top

G

4

0402R

Resistor 5%
63mW

100k

~

~

~

R2700

Top

Q

4

uBGA8_1.47X1
.47

ASIP SIM
INTERFACE
**LOW
CAP**BGA8

R2801

Bottom

D

3

0402R

Resistor 5%
63mW

1k0

~

R2802

Bottom

D

3

0402R

Resistor 5%
63mW

1k0

~

R2803

Top

I

8

0402R

Resistor 5%
63mW

100R

~

R2804

Top

H

8

0402R

Resistor 5%
63mW

100R

~

R2806

Top

F

6

0402R

Resistor 5%
63mW

68k

~

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –27

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

R3000

Top

J

5

0402R

Resistor 5%
63mW

4k7

~

R3002

Top

H

8

0402R

Resistor 5%
63mW

10R

~

R3003

Top

I

8

0402R

Resistor 5%
63mW

4k7

~

R3004

Top

K

7

0402R

Resistor 5%
63mW

4k7

~

ASIP EMIF04MMC02F2**PBFREE**

~

~

R3200

Top

L

1

uBGA11_1.62X
2.12

R3201

Top

G

4

0402R

Resistor 5%
63mW

100k

~

R3202

Top

G

3

0402R

Resistor 5%
63mW

22k

~

R3203

Top

K

5

0402R

Resistor 5%
63mW

100k

~

R3204

Top

L

4

0402R

Resistor 5%
63mW

2k2

~

R3205

Top

G

3

0402R

Resistor 5%
63mW

33R

~

R3206

Top

G

4

0402R

Resistor 5%
63mW

33R

~

R6030

Top

H

4

0402R

Resistor 5%
63mW

10k

~

R6031

Top

H

4

0402R

Resistor 5%
63mW

10k

~

R6032

Top

I

4

0402R

CHIPRES 0W06
2R2 J 0402

2R2

~

R6034

Top

H

3

0402R

Resistor 5%
63mW

10k

~

R6035

Top

H

4

0402R

Resistor 5%
63mW

100k

~

R6156

Bottom

Q

4

0402R

Resistor 5%
63mW

10R

~

R6157

Bottom

R

6

0402R

Resistor 5%
63mW

22R

~

R6159

Bottom

R

5

0402R

Resistor 5%
63mW

10k

~

R6160

Bottom

R

4

0402R

Resistor 5%
63mW

100k

~

Page 2 –28

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

R6300

Top

J

2

0402R

CHIPRES 0W06
1M F 100PPM
0402

R6301

Top

K

3

0402R

Resistor 5%
63mW

10k

~

R6302

Top

J

4

0402R

Resistor 5%
63mW

100R

~

R6303

Top

G

5

0402R

Resistor 5%
63mW

100R

~

R6304

Top

I

4

0402R

Resistor 5%
63mW

100R

~

R6305

Top

J

2

0402R

Resistor 5%
63mW

68R

~

R7501

Top

C

3

0402R

Resistor 5%
63mW

2k2

~

R7502

Top

B

4

0402R

CHIPRES 0W06
10K F 0402

10k

~

R7503

Top

D

4

0402R

Resistor 5%
63mW

4k7

~

R7505

Top

C

3

0402R

CHIPRES 0W06
8K2 F 0402

8k2

~

R7506

Top

D

3

0402R

Resistor 5%
63mW

10R

~

R7507

Top

B

4

0402R

Resistor 5%
63mW

10R

~

R7508

Top

D

3

0402R

Resistor 5%
63mW

10R

~

R7509

Top

D

3

0402R

Resistor 5%
63mW

22k

~

R7510

Top

D

7

0402R

Resistor 5%
63mW

15R

~

R7522

Top

D

7

0402R

CHIPRES 0W06
27K F 0402

27k

~

R7590

Top

K

1

0402R

Resistor 5%
63mW

22k

~

R7591

Top

K

1

0402R

Resistor 5%
63mW

68k

~

R7592

Top

K

2

0402R

Resistor 5%
63mW

1k0

~

R7593

Top

J

1

0402R

Chipres 0W06
jumper 0402

0R

~

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

1M0

~

Page 2 –29

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

S2416

Top

F

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S2417

Top

H

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S2423

Top

K

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S3200

Top

O

1

SWITCH_SPVM
110201

SWITCH SPST NO
5V 1MA

~

~

2

TRANS_LDB10

BALUN 2450
+-50MHZ 1DB
1.7X0.9

~

~

2

TRANS_HHM15
17A2

TRANSF BALUN
3800+-550MHZ
0805

~

~

~

~

T6030

T7501

Top

Top

H

C

T7520

Top

B

7

TRANS_LDB15

TRANSF BALUN
1800+-100mhz
2x1.25

V2000

Top

O

8

BGA_4

ASIP TVS BGA4

~

~

V2302

Top

L

4

SOD323F

SCH DI 30V 2A
SOD323F

~

~

6

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

6

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

3

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

LED WHITE
140MCD 5MA
0603

~

~

V2400

V2401

V2402

Bottom

Bottom

Bottom

O

I

I

V2403

Bottom

O

3

LED_48_21SYG
C

V2404

Top

N

7

SOT_666

TRX2+RX4 N
4K7/47K SOT666

~

~

V7590

Top

K

1

SOT323

Tr NPN 12V 35mA
SOT323

~

~

4

SYSCON_MQ20
2_NK_14R3

SM SYSTEM
CONNECTOR
14POL

~

~

TRACEABILITY_
PAD

MODULE ID
COMPONENT
2.8X1.8X0.3

~

~

X2000

X2060

Page 2 –30

Top

Bottom

R

B

6

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

X2070

X2400
X2701

Side

Top

Bottom
Top

Nokia Customer Care

Grid

F

LYNX_BATT_CO
NN_H7.0

SM BATTERY
CONN 3POL SPR
12V 2A

~

~

3

CON_DF30FC_4
0DS_0.4V

SM B2B 2X20
P0.4 F 30V 0.3A
DF30FC-40DS-0.4
V

~

~

3

SIM_CONN_470
192001

SM SIM CONN
6POL P2.54

~

~

~

~

3

C
P

Description and value

X3200

Top

M

2

MOLEX_50087
3_0801

CONN TRF/
MICROSD 12POL
P0.5 10V

X6300

Top

G

2

RF_SWITCH_MS
_156

SM CONN RF JACK
50R 2W 6GHZ

~

~

X7505

Bottom

C

8

RF_SWITCH_MS
_156

SM CONN RF JACK
50R 2W 6GHZ

~

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

6

uBGA25_2.47X
2.47

ASIP 10-CH ESD
EMI FILTER
BGA25

~

~

4

uBGA25_2.47X
2.47

ASIP 10-CH ESD
EMI FILTER
BGA25

~

~

ASIP 10-CH ESD
EMI FILTER
BGA25

~

~

Z2000

Z2001

Z2003

Z2400

Z2403

Top

Top

Top

Bottom

Bottom

Q

Q

Q

D

C

5

4

5

Z2404

Bottom

C

2

uBGA25_2.47X
2.47

Z6300

Top

H

2

LFB2H2G45SG
FB868

CER FILT 2450
+-50MHZ 2.5X2.0

2450MHz

~

1

ANT_RENM050
41

BT/WLAN 1.0 TP
ANTENNA
RELEASE

~

~

FILTER_2.1X1.
7_10P_H0.6

DUAL RX SAW
FILTER
1800/1900MHZ
2016

1800/1900M
Hz

~

Z6302

Z7501

Issue 2

Top

Top

F

C

6

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –31

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Z7503

Z7504

Z7520

Z7521

Side

Top

Top

Top

Top

Grid

D

C

B

B

Description and value

MODULE_SP_L
MZ_137

TX SAW MODULE
GSM
850/900MHZ
4.5X3.2

850/900MHz

~

6

FILTER_2.1X1.
7_10P_H0.65

DUAL RX SAW
FILTER
850/900MHZ
2016

850/900MHz

~

6

FERRITE_FBMJ
1608

FERRITE BEAD
0R01 28R/
100MHZ 0603

28R/100MHz

~

FILTER_LFTC10
N

CER FILT
LFL181699TC1
2400-2483MHZ
1.6

2400-2483M
Hz

~

5

7

RM-198 lower block component parts list (1VZ_12b)
Item

Side

Grid

Description and value

A2000

Top

I

6

SHIELD_040_0
27333

RAP SHIELD ASSY
P3046

~

~

A2100

Top

D

1

1WN_RIGID

PWB RIGID 1WN
11.9X2.5X2.1 D2

~

~

A2102

Top

E

7

PWB_1QD

PWB 1QD
10X4.6X1.5

~

~

6

SHIELD_040_0
13002

RETU-TAHVO
AHIELD
ASSEMBLY

~

~

3

SHIELD_040_0
27328

WLAN-BT SHIELD
ASSY P3046

~

~

5

SHIELD_040_0
08558

FM RADIO ASSY
040-008558
P2348

~

~

5

SHIELD_040_0
13089

RF SHIELD
ASSEMBLY WITH
TAPE P3046

~

~

CRYSTAL
32.768KHZ
+-30PPM 12.5PF

32.768kHz

~

A2400
A6000

A6100

A7000

Top
Top

Bottom

Top

N
J

R

C

B2200

Top

P

6

CRYSTAL_3.3X
1.6_H0.9

C2000

Top

N

8

0402C

Chipcap 5% NP0

27p

50V

C2002

Bottom

R

4

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

C2003

Bottom

R

4

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

Page 2 –32

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2004

Bottom

R

4

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C2005

Bottom

R

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2006

Bottom

R

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2007

Top

Q

2

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2008

Top

Q

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2009

Top

Q

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2010

Top

Q

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2011

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2012

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2013

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2014

Bottom

R

3

0402C

Chipcap 5% NP0

10p

50V

C2015

Top

Q

4

0402C

CHIPCAP NP0
220P J 25V 0402

220p

25V

C2016

Top

P

8

0603C_H0.95

CHIPCAP X5R
470N K 25V 0603

470n

25V

C2071

Top

G

3

0402C

Chipcap 5% NP0

27p

50V

C2072

Top

P

2

0402C

Chipcap 5% NP0

27p

50V

C2073

Top

E

5

TANT_C_6.2X3.
4_H1.7

CHIPTCAP 150U M
10V 6X3.2X1.5

150u_10V

10V

C2074

Top

F

2

0402C

Chipcap 5% NP0

10p

50V

C2100

Top

Q

2

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C2101

Top

Q

2

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C2102

Top

Q

2

0603C

CHIPCAP X5R 2U2
K 6V3 0603

2u2

6V3

C2103

Top

E

8

0402C

Chipcap 5% NP0

10p

50V

C2104

Top

E

8

0402C

Chipcap 5% NP0

10p

50V

C2105

Bottom

D

2

0402C

Chipcap 5% NP0

27p

50V

C2106

Bottom

C

2

0402C

Chipcap 5% NP0

27p

50V

C2200

Top

O

5

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –33

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2201

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2202

Top

P

8

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2203

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2204

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2205

Top

P

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2206

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2207

Top

P

7

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2208

Top

Q

6

0402C

Chipcap 5% NP0

27p

50V

C2209

Top

Q

6

0402C

Chipcap 5% NP0

22p

50V

C2210

Top

N

7

0603C

CHIPCAP X5R 1U K
16V 0603

1u0

16V

C2211

Top

N

7

0805C

CHIPCAP X5R 4U7
K 10V 0805

4u7

10V

C2212

Top

N

6

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2213

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2214

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2215

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2216

Top

O

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2217

Top

P

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2218

Top

P

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2219

Top

P

7

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2220

Top

N

6

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C2221

Top

N

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

Page 2 –34

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2222

Top

N

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2223

Top

O

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2224

Top

P

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2225

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2226

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2227

Top

N

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2228

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2230

Top

P

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2231

Top

N

5

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2232

Top

O

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2233

Top

G

4

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2270

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2271

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2272

Top

O

5

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2273

Top

N

6

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2274

Top

N

6

0402C

Chipcap 5% NP0

27p

50V

C2275

Top

N

5

0402C

Chipcap 5% NP0

27p

50V

C2281

Top

O

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2300

Top

M

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2301

Top

L

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

C2302

Top

N

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –35

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2303

Top

L

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2304

Top

N

6

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2305

Top

L

8

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2306

Top

M

4

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2307

Top

L

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2309

Top

L

5

0805C

CHIPCAP X5R 22U
M 6V3 0805

22u

6V3

C2310

Top

L

6

0603C

CHIPCAP X5R
10UF 6V3 0603

10u

4V

C2312

Top

L

6

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2313

Top

L

7

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2314

Top

M

7

0805C

CHIPCAP X5R 4U7
K 10V 0805

4u7

10V

C2315

Top

N

8

0805C

CHIPCAP X5R 4U7
M 25V 0805

4u7

25V

C2317

Top

O

8

0402C

Chipcap 5% NP0

27p

50V

C2400

Top

N

4

0402C

Chipcap 5% NP0

22p

50V

C2401

Top

N

4

0402C

Chipcap 5% NP0

22p

50V

C2402

Bottom

D

7

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2406

Bottom

C

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2407

Bottom

D

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2412

Top

N

6

0402C

Chipcap 5% NP0

27p

50V

C2413

Bottom

C

7

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C2700

Top

Q

3

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2800

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2801

Top

F

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

Page 2 –36

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2803

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2805

Top

F

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2806

Top

F

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2807

Top

I

5

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C2808

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2809

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2812

Top

H

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2813

Top

F

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2814

Top

G

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2816

Top

I

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2819

Top

I

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2820

Top

F

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2822

Top

F

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2823

Top

I

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2824

Top

J

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2825

Top

F

7

0402C

Chipcap X7R 10%
50V 0402

1n0

50V

C2826

Top

I

7

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C2828

Top

I

7

0402C

Chipcap 5% NP0

27p

50V

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

100n

16V

27p

50V

C2829

Top

G

8

C2830

Top

H

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

C2831

Top

I

7

0402C

Chipcap 5% NP0

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –37

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C2833

Top

I

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3000

Top

K

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3001

Top

J

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3002

Top

K

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3003

Top

J

8

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3004

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3005

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3006

Top

K

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3007

Top

K

8

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3008

Top

J

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3009

Top

K

8

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3200

Top

L

2

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3201

Top

G

2

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C3202

Top

G

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C3203

Top

H

3

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

C3204

Top

L

4

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C3205

Top

G

3

0402C

Chipcap 5% NP0

27p

50V

18p

50V

C6031

Top

I

2

0402C

CHIPCAP N150
18P J 50V 0402

C6032

Top

H

2

0402C

Chipcap 5% NP0

100p

50V

C6033

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6034

Top

H

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

Page 2 –38

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C6035

Top

I

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6036

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6037

Top

H

4

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6038

Top

H

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6039

Top

H

3

0402C

CHIPCAP N150
18P J 50V 0402

18p

50V

C6040

Top

I

4

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

C6051

Top

H

3

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C6052

Top

I

3

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C6055

Top

H

2

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

C6157

Bottom

Q

4

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C6158

Bottom

Q

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6164

Bottom

Q

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6165

Bottom

R

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6168

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6170

Bottom

R

5

0402C

CHIPCAP X5R 1U5
K 4V 0402

1u5

4V

C6176

Bottom

R

6

0402C

Chipcap 5% NP0

100p

50V

C6178

Bottom

R

6

0402C

Chipcap 5% NP0

27p

50V

C6179

Bottom

Q

6

0402C

Chipcap 5% NP0

47p

50V

C6188

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6189

Bottom

Q

6

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6190

Top

P

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

C6191

Top

P

5

0402C_H0.6

CHIPCAP X5R
100N K 16V 0402

100n

16V

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –39

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

C6340

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C6342

Top

I

2

0402C

Chipcap
+-0.25pF NP0

6p8

50V

C7501

Top

B

4

0402C

Chipcap
+-0.25pF NP0

2p7

50V

C7502

Top

D

4

0402C

Chipcap 5% NP0

10p

50V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

0402C

CHIPCAP X5R 1U K
6V3 0402

1u0

6.3V

0603C

CHIPCAP X5R 1U K
6V3 0603

1u0

6.3V

10n

16V

C7503
C7504
C7505
C7506

Top
Top
Top
Top

D
B

3
4

D
D

3
3

C7507

Top

D

3

0402C

Chipcap X7R 10%
16V 0402

C7508

Top

D

3

0402C

Chipcap 5% NP0

18p

50V

C7509

Top

D

3

0402C

Chipcap 5% NP0

10p

50V

C7510

Top

D

4

0402C

Chipcap 5% NP0

27p

50V

C7511

Top

C

3

0603C

CHIPCAP NP0 2N2
G 16V 0603

2n2

16V

C7513

Top

D

3

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C7514

Top

D

3

0402C

CHIPCAP X7R 33N
K 10V 0402

33n

10V

C7515

Top

B

3

0402C

Chipcap
+-0.25pF NP0

4p7

50V

C7516

Top

C

3

0402C

CHPCAP NP0
470P J 50V 0402

470p

50V

C7518

Top

D

4

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C7520

Top

B

7

0402C

Chipcap
+-0.25pF NP0

3p3

50V

C7522

Top

D

6

0402C

Chipcap
+-0.25pF NP0

1p8

50V

C7524

Top

D

6

0402C

Chipcap
+-0.25pF NP0

1p8

50V

C7525

Top

D

8

0402C

Chipcap 5% NP0

18p

50V

Page 2 –40

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C7586

Top

D

5

0402C

Chipcap X7R 10%
16V 0402

10n

16V

C7590

Top

K

1

0402C

Chipcap 5% NP0

100p

50V

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

~

~

C7592

Top

J

1

D2200

Top

O

6

TFBGA_108

RETU 3.02
TSA1GJWE
TFBGA108

D2800

Top

H

6

uBGA_289

RAPGSM V1.1 PA
uBGA289

~

~

COMBO 256M
NOR + 128M DDR
DRAM FBGA133

256MNOR
+128MDDR

~

D3000

Top

J

6

FBGA133_11.1
X10.1

F2000

Top

P

8

0603_FUSE_AV
X2MATS

SM FUSE F 2.0A
32V

2A

~

BATTER_EECEP

RTC BACUP CAPAC
311 SIZE FOR
2.6V 4UAH

2.6V

~

3296-3980M
Hz

~

G2200

Top

G

4

G7500

Top

B

3

VCO_DCS02733

VCO
3296-3980MHZ
4-BAND
MATSUSHITA

G7501

Top

D

2

NKG3176B_H1
.0

VCTCXO 38.4MHZ
2.5V 2MA

38.4MHz

~

220R/
100MHz

~

L2000

Top

O

8

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

L2001

Bottom

Q

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

L2002

Bottom

Q

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

L2003

Bottom

R

3

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

3

COIL_LK_1608

CHIP COIL 68NH J
Q12/100MHZ
0603

68nH

~

2

COIL_LQW160
8

CHIP COIL 56N J
Q38/200MHZ
0603

56nH

~

COIL_LQW160
8

CHIP COIL 56N J
Q38/200MHZ
0603

56nH

~

L2004

L2100

L2101

Issue 2

Bottom

Bottom

Bottom

R

D

C

2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –41

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

L2202

L2205

L2211

L2212

L2270

L2271

L2301

L2302

L2304

L2305

L2306

L2401

L2402

L2406

Page 2 –42

Side

Top

Top

Top

Top

Top

Top

Top

Top

Top

Top

Top

Bottom

Bottom

Top

Grid

P

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

220R/
100MHz

~

5

CHOKE_SER400
_H1.2

INDUCT WW
10UH 0A65 0R35
4X4X1.2

10uH

~

7

CHOKE_SER300
_H1.5

CHOKE 22U M 0R7
0.35A
3.0x3.0x1.5

22uH

~

0603_BLM

FERRITE BEAD
0R5 600R/
100MHZ 0603

600R/
100MHz

~

0603_BLM

FERRITE BEAD
0R5 600R/
100MHZ 0603

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

8

N

N

O

O

L

5

6

5

5

5

M

M

L

7

M

B

4

3

D

I

0603_BLM

FERR.BEAD 220R/
100M 2A 0R05
0603

8

P

Description and value

2

8

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

L2407

L2408

L2409

L3200

L6030

Side

Top

Top

Top

Top

Top

Nokia Customer Care

Grid

I

8

I

8

I

8

L

2

H

3

Description and value

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

0402L

FERRITE BEAD
0.6R 33R/
100MHZ 0402

33R/100MHZ

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

CHIP COIL 2N7
+-0N3 Q29/800M
0402

2n7H

~

2n7H

~

L6031

Top

I

3

0402L

CHIP COIL 2N7
+-0N3 Q29/800M
0402

L6032

Top

I

4

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

5

0402LQW

CHIP COIL 47N
+-3%
Q25/200MHZ
0402

47nH

~

CHIP COIL 120N J
Q32/150MHZ
0603

120nH

~

L6156

Bottom

R

L6176

Bottom

R

6

COIL_LQW160
8

L7500

Top

C

5

0402L

CHIP COIL 12N J
Q31/800M 0402

12nH

~

0402L

CHIP COIL 8N2 J
Q28/800MHZ
0402

8n2H

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

0402L

CHIP COIL 22N J
Q28/800M 0402

22nH

~

3

0402L

CHIP COIL 15N J
Q30/800M 0402

15nH

~

6

TFBGA_84_6.1
5X6.15

TAHVO V5.2 LF
TFBGA84

~

~

L7501

L7502
L7504
L7505
L7515
N2300

Issue 2

Top

Top
Top
Top
Top
Top

C

5

D
C

4
5

C

5

C
M

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –43

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

N2301

N2402

Side

Top

Bottom

Grid

M

D

Description and value

USMD8_1.69X
1.69

WHITE LED
DRIVER 4LEDS
500MW 8BUMP
USMD8

~

~

7

SENSOR_MR10

MAGNETO
RESISTIVE
SENSOR
MRUS71D SOT4

~

~

VREG & LEVEL
SHIFT LP3928
USMD16

~

2.8V

8

N3200

Top

G

3

USMD16_2.03
X2.03

N6030

Top

H

3

CSP_47_3.85X
4.05

BC4-ROM1.0RDL

~

~

N6156

Bottom

Q

5

WLCSP25_3.1X
2.9

FM RECEIVER
TEA5760 N1C

~

~

TFBGA144

AHNE401A
TRANCEIVER
TFBGA144

~

~

~

~

N7505

Top

C

4

N7520

Top

C

7

RF9282E3.6

PA RF9282E6.5
GSM/EDGE
850/900/1800/1
900

R2000

Bottom

Q

4

0402R

Resistor 5%
63mW

220R

~

ASIP MIC W/ESD
RES+CAP+ZDI
BGA11

~

~

R2001

Bottom

Q

4

uBGA11_2.15X
1.65

R2002

Top

Q

3

0402R

Resistor 5%
63mW

10R

~

R2003

Top

Q

3

0402R

Resistor 5%
63mW

10R

~

R2004

Top

Q

2

0402R

Resistor 5%
63mW

10R

~

R2005

Top

Q

3

0402R

Resistor 5%
63mW

10R

~

R2006

Bottom

Q

3

uBGA5

ASIP 4XESD **PBFREE** BGA5

~

~

R2007

Top

Q

4

uBGA11_1.6X2
.15

ASIP SILIC USB
OTG / ESD BGA11

~

~

0404_RP

RES NETWORK
0W06 220K/
120K J 0404

220k/120k

~

R2008

Page 2 –44

Top

Q

4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item
R2009

R2070

R2071

Side
Top

Top

Top

Nokia Customer Care

Grid
Q

P

4

2

E

3

Description and value
0402R

Resistor 5%
63mW

220R

~

0402_NTH5

NTC RES 47K J
B=4050+-3%
0402

47k

~

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

14V/50V

~

~

~

R2100

Top

Q

2

FLIP_CHIP_8_1.
7X1.7

ASIP SINGLE
ENDED
MICROPHONE
INTERF BGA8

R2101

Top

P

2

0402R

Resistor 5%
63mW

220R

~

R2200

Top

P

8

0402R

Resistor 5%
63mW

100k

~

R2201

Top

P

7

0402R

Resistor 5%
63mW

120k

~

R2212

Top

O

5

0402R

Resistor 5%
63mW

470R

~

R2213

Top

P

7

0402R

Resistor 5%
63mW

4k7

~

R2214

Top

P

8

0402R

Resistor 5%
63mW

4k7

~

R2216

Top

Q

7

0402R

CHIPRES 0W06
2M2 J 0402

2M2

~

R2301

Top

M

8

0402R

Resistor 5%
63mW

3k3

~

R2307

Top

L

4

0402R

Resistor 5%
63mW

100R

~

R2402

Bottom

D

7

0402R

Resistor 5%
63mW

100k

~

R2403

Top

N

6

0402R

Resistor 5%
63mW

4k7

~

R2409

Top

N

8

0402R

Resistor 5%
63mW

390R

~

R2410

Bottom

D

4

0402R

Resistor 5%
63mW

39R

~

R2411

Top

N

7

0402R

Resistor 5%
63mW

390R

~

R2416

Bottom

B

3

0402R

Resistor 5%
63mW

1k0

~

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –45

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

R2420

Top

H

4

0402R

Resistor 5%
63mW

100k

~

R2422

Top

G

4

0402R

Chipres 0W06
jumper 0402

0R

~

~

~

R2700

Top

Q

4

uBGA8_1.47X1
.47

ASIP SIM
INTERFACE
**LOW
CAP**BGA8

R2801

Bottom

D

3

0402R

Resistor 5%
63mW

1k0

~

R2802

Bottom

D

3

0402R

Resistor 5%
63mW

1k0

~

R2803

Top

I

8

0402R

Resistor 5%
63mW

100R

~

R2804

Top

H

8

0402R

Resistor 5%
63mW

100R

~

R2806

Top

F

6

0402R

Resistor 5%
63mW

68k

~

R3000

Top

J

5

0402R

Resistor 5%
63mW

4k7

~

R3002

Top

H

8

0402R

Resistor 5%
63mW

10R

~

R3003

Top

I

8

0402R

Resistor 5%
63mW

4k7

~

R3004

Top

K

7

0402R

Resistor 5%
63mW

4k7

~

1

uBGA11_1.62X
2.12

ASIP EMIF04MMC02F2**PBFREE**

~

~

0402R

Resistor 5%
63mW

100k

~

0402R

Resistor 5%
63mW

22k

~

0402R

Resistor 5%
63mW

100k

~

0402R

Resistor 5%
63mW

2k2

~

0402R

Resistor 5%
63mW

33R

~

0402R

Resistor 5%
63mW

33R

~

R3200
R3201
R3202
R3203
R3204
R3205
R3206

Page 2 –46

Top
Top
Top
Top
Top
Top
Top

L
G
G
K

4
3
5

L

4

G
G

3
4

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

R6030

Top

H

4

0402R

Resistor 5%
63mW

10k

~

R6031

Top

H

4

0402R

Resistor 5%
63mW

10k

~

R6032

Top

I

4

0402R

CHIPRES 0W06
2R2 J 0402

2R2

~

R6034

Top

H

3

0402R

Resistor 5%
63mW

10k

~

R6035

Top

H

4

0402R

Resistor 5%
63mW

100k

~

R6156

Bottom

Q

4

0402R

Resistor 5%
63mW

10R

~

R6157

Bottom

R

6

0402R

Resistor 5%
63mW

22R

~

R6159

Bottom

R

5

0402R

Resistor 5%
63mW

10k

~

R6160

Bottom

R

4

0402R

Resistor 5%
63mW

100k

~

R7501

Top

C

3

0402R

Resistor 5%
63mW

2k2

~

R7502

Top

B

4

0402R

CHIPRES 0W06
10K F 0402

10k

~

R7503

Top

D

4

0402R

Resistor 5%
63mW

4k7

~

R7505

Top

C

3

0402R

CHIPRES 0W06
8K2 F 0402

8k2

~

R7506

Top

D

3

0402R

Resistor 5%
63mW

10R

~

R7507

Top

B

4

0402R

Resistor 5%
63mW

10R

~

R7508

Top

D

3

0402R

Resistor 5%
63mW

10R

~

R7509

Top

D

3

0402R

Resistor 5%
63mW

22k

~

R7510

Top

D

7

0402R

Resistor 5%
63mW

15R

~

R7522

Top

D

7

0402R

CHIPRES 0W06
27K F 0402

27k

~

R7590

Top

K

1

0402R

Resistor 5%
63mW

22k

~

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –47

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Side

Grid

Description and value

R7591

Top

K

1

0402R

Resistor 5%
63mW

68k

~

R7592

Top

K

2

0402R

Resistor 5%
63mW

1k5

~

R7593

Top

J

1

0402R

Chipres 0W06
jumper 0402

0R

~

S2416

Top

F

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S2417

Top

H

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S2423

Top

K

8

SWITCH_EVQ5
P701K

SM SW TACT SPST
12V SIDE KEY 3N

~

~

S3200

Top

O

1

SWITCH_SPVM
110201

SWITCH SPST NO
5V 1MA

~

~

2

TRANS_LDB10

BALUN 2450
+-50MHZ 1DB
1.7X0.9

~

~

2

TRANS_HHM15
17A2

TRANSF BALUN
3800+-550MHZ
0805

~

~

~

~

T6030

T7501

Top

Top

H

C

T7520

Top

B

7

TRANS_LDB15

TRANSF BALUN
1800+-100mhz
2x1.25

V2000

Top

O

8

BGA_4

ASIP TVS BGA4

~

~

V2302

Top

L

4

SOD323F

SCH DI 30V 2A
SOD323F

~

~

6

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

6

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

3

LED_48_21SYG
C

LED WHITE
140MCD 5MA
0603

~

~

LED WHITE
140MCD 5MA
0603

~

~

V2400

V2401

V2402

Bottom

Bottom

Bottom

O

I

I

V2403

Bottom

O

3

LED_48_21SYG
C

V2404

Top

N

7

SOT_666

TRX2+RX4 N
4K7/47K SOT666

~

~

V7590

Top

K

1

SOT323

Tr NPN 12V 35mA
SOT323

~

~

Page 2 –48

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

X2000

X2060

X2070

Side

Top

Bottom

Top

Nokia Customer Care

Grid

R

B

F

Description and value

4

SYSCON_MQ20
2_NK_14R3

SM SYSTEM
CONNECTOR
14POL

~

~

6

TRACEABILITY_
PAD

MODULE ID
COMPONENT
2.8X1.8X0.3

~

~

3

LYNX_BATT_CO
NN_H7.0

SM BATTERY
CONN 3POL SPR
12V 2A

~

~

~

~

X2400

Bottom

C

3

CON_DF30FC_4
0DS_0.4V

SM B2B 2X20
P0.4 F 30V 0.3A
DF30FC-40DS-0.4
V

X2701

Top

P

3

SIM_CONN_470
192001

SM SIM CONN
6POL P2.54

~

~

CONN TRF/
MICROSD 12POL
P0.5 10V

~

~

X3200

Top

M

2

MOLEX_50087
3_0801

X6300

Top

G

2

RF_SWITCH_MS
_156

SM CONN RF JACK
50R 2W 6GHZ

~

~

X7505

Bottom

C

8

RF_SWITCH_MS
_156

SM CONN RF JACK
50R 2W 6GHZ

~

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

5

FERRITE_0402

FERRITE BEAD
0.6R 600R/
100MHZ 0402

600R/
100MHz

~

6

uBGA25_2.47X
2.47

ASIP 10-CH ESD
EMI FILTER
BGA25

~

~

4

uBGA25_2.47X
2.47

ASIP 10-CH ESD
EMI FILTER
BGA25

~

~

~

~

2450MHz

~

Z2000

Z2001

Z2003

Z2400

Z2403

Top

Top

Top

Bottom

Bottom

Q

Q

Q

D

C

5

4

Z2404

Bottom

C

2

uBGA25_2.47X
2.47

ASIP 10-CH ESD
EMI FILTER
BGA25

Z6300

Top

H

2

LFB2H2G45SG
FB868

CER FILT 2450
+-50MHZ 2.5X2.0

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –49

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

Z6302

Z7501

Z7503

Z7504

Z7520

Z7521

Side

Top

Top

Top

Top

Top

Top

Grid

F

1

C

6

D

C

5

6

B

6

B

7

Description and value
ANT_RENM050
41

BT/WLAN 1.0 TP
ANTENNA
RELEASE

~

~

FILTER_2.1X1.
7_10P_H0.6

DUAL RX SAW
FILTER
1800/1900MHZ
2016

1800/1900M
Hz

~

MODULE_SP_L
MZ_137

TX SAW MODULE
GSM
850/900MHZ
4.5X3.2

850/900MHz

~

FILTER_2.1X1.
7_10P_H0.65

DUAL RX SAW
FILTER
850/900MHZ
2016

850/900MHz

~

FERRITE_FBMJ
1608

FERRITE BEAD
0R01 28R/
100MHZ 0603

28R/100MHz

~

FILTER_LFTC10
N

CER FILT
LFL181699TC1
2400-2483MHZ
1.6

2400-2483M
Hz

~

Upper block

RM-188/198 upper block component parts list (1WJ_10b)
Note
This component parts list applies to all RM-188 units and those RM-198 units, which are assembled without
the HAC (Hearing Aid Coil). Note that the RM-198 can be assembled with or without the HAC.

Item

Side

Grid

Description and value

C1000

Top

D

6

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C1001

Top

D

8

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C1600

Top

N

5

0402C

Chipcap 5% NP0

27p

50V

C2000

Top

N

4

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C2001

Top

N

4

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C2100

Top

L

3

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

Page 2 –50

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts
Item

Side

Nokia Customer Care

Grid

Description and value

C2101

Top

M

3

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C3000

Top

D

3

0402C

Chipcap X5R
10% 6.3V 0402

220n

6.3V

C3001

Top

D

6

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C3002

Top

D

3

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C3010

Top

C

3

0402C

Chipcap 5% NP0

10p

50V

C3011

Top

C

6

0402C

Chipcap 5% NP0

10p

50V

FERRITE_0402

FERRITE BEAD
600R 300MA
0.6R 0402

600R/300mA

~

600R/300mA

~

L1010

Top

D

6

L1011

Top

C

8

FERRITE_0402

FERRITE BEAD
600R 300MA
0.6R 0402

L1600

Top

N

6

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

2x1000R/
100MHz

~

R1101

Top

K

5

0402R

Resistor 5%
63mW

22k

~

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

14V/50V

~

14V/50V

~

R1600

Top

N

5

R1601

Top

N

5

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

R1701

Top

N

6

0402R

Resistor 5%
63mW

10R

~

V1101

Top

L

6

SOT_666

TRX2+RX4 N
4K7/47K SOT666

~

~

VMT3_R

TRANS N 30V 0A2
0W15 2K2/10K
HFE140 VMT3

~

~

7

CON_DF30FC_4
0DS_0.4V

SM B2B 2X20
P0.4 F 30V 0.3A
DF30FC-40DS-0.
4V

~

~

SM CONN 2X11F
P0.5 30V 0.3A
PWB/PWB

~

~

SM CONN BTB
2X5 F P0.5

~

~

V1102

X1000

Top

Top

L

5

C

X2000

Bottom

O

4

CON_DF23NC_2
2DS

X2100

Top

M

3

CON_DF23C_10
DS

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –51

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care
Item

X3000

Side

Top

Grid

C

5

Description and value
SOCKET_T_051
104_TB3

SOCKET SMIA65
THROUGH BOARD
P0.95

~

~

RM-198 upper block component parts list with HAC (1WJ_10c)
Note
This component parts list applies to those RM-198 units, which are assembled with the HAC (Hearing Aid
Coil). Note that the RM-198 can be assembled with or without the HAC.

C1000

Top

D

6

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C1001

Top

D

8

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C1600

Top

N

5

0402C

Chipcap 5% NP0

27p

50V

C2000

Top

N

4

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C2001

Top

N

4

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C2100

Top

L

3

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C2101

Top

M

3

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C3000

Top

D

3

0402C

Chipcap X5R 10%
6.3V 0402

220n

6.3V

C3001

Top

D

6

0402C

CHIPCAP X5R
100N K 10V 0402

100n

10V

C3002

Top

D

3

0603C

CHIPCAP X5R 4U7
K 6V3 0603

4u7

6.3V

C3010

Top

C

3

0402C

Chipcap 5% NP0

10p

50V

C3011

Top

C

6

0402C

Chipcap 5% NP0

10p

50V

FERRITE_0402

FERRITE BEAD
600R 300MA
0.6R 0402

600R/300mA

~

600R/300mA

~

2x1000R/
100MHz

~

L1010

Top

D

6

L1011

Top

C

8

FERRITE_0402

FERRITE BEAD
600R 300MA
0.6R 0402

L1600

Top

N

6

0405_2_H1.0

CHIP BEAD ARRAY
2X1000R 0405

Page 2 –52

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

L1700
R1101

R1600

Bottom
Top

Top

P
K

N

Nokia Customer Care

4
5

5

INDUCTOR_HA
C_MS20K

CASE SYMBOL FOR
INDUCTOR
PRINTED IN PWB

~

~

0402R

Resistor 5%
63mW

22k

~

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

14V/50V

~

14V/50V

~

R1601

Top

N

5

0402_VAR

CHIP VARISTOR
VWM14V VC50V
0402

V1101

Top

L

6

SOT_666

TRX2+RX4 N
4K7/47K SOT666

~

~

VMT3_R

TRANS N 30V 0A2
0W15 2K2/10K
HFE140 VMT3

~

~

7

CON_DF30FC_4
0DS_0.4V

SM B2B 2X20
P0.4 F 30V 0.3A
DF30FC-40DS-0.4
V

~

~

SM CONN 2X11F
P0.5 30V 0.3A
PWB/PWB

~

~

V1102

X1000

Top

Top

L

5

C

X2000

Bottom

O

4

CON_DF23NC_
22DS

X2100

Top

M

3

CON_DF23C_10
DS

SM CONN BTB 2X5
F P0.5

~

~

5

SOCKET_T_051
104_TB3

SOCKET SMIA65
THROUGH BOARD
P0.95

~

~

X3000

Issue 2

Top

C

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –53

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

Component layouts
Lower (engine) block

RM-188 lower block component layout - top (1VZ_12d)

Page 2 –54

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

RM-188 lower block component layout - bottom (1VZ_12d)

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –55

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

RM-198 lower block component layout - top (1VZ_12b)

Page 2 –56

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

RM-198 lower block component layout - bottom (1VZ_12b)

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –57

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

Upper block

RM-188/198 upper block component layout - top (1WJ_10b)
Note: This component layout applies to all RM-188 units and those RM-198 units, which are
assembled without the HAC (Hearing Aid Coil). Note that the RM-198 can be assembled with or
without the HAC.

Page 2 –58

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Issue 2

RM-188; RM-198
Parts Lists and Component Layouts

Nokia Customer Care

RM-188/198 upper block component layout - bottom (1WJ_10b)
Note: This component layout applies to all RM-188 units and those RM-198 units, which are
assembled without the HAC (Hearing Aid Coil). Note that the RM-198 can be assembled with or
without the HAC.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.

Page 2 –59

Nokia Customer Care

RM-188; RM-198
Parts Lists and Component Layouts

RM-198 upper block component layout with HAC - top (1WJ_10c)
Note: This component layout applies to those RM-198 units, which are assembled with the HAC
(Hearing Aid Coil). Note that the RM-198 can be assembled with or without the HAC.

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RM-198 upper block component layout with HAC - bottom (1WJ_10c)
Note: This component layout applies to those RM-198 units, which are assembled with the HAC
(Hearing Aid Coil). Note that the RM-198 can be assembled with or without the HAC.

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3 — Service Software
Instructions

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Table of Contents
Phoenix installation steps in brief........................................................................................................................3–5
Installing Phoenix ..................................................................................................................................................3–6
Updating Phoenix installation ..............................................................................................................................3–8
Uninstalling Phoenix ..............................................................................................................................................3–9
Repairing Phoenix installation .......................................................................................................................... 3–11
Phone data package overview........................................................................................................................... 3–11
Installing phone data package .......................................................................................................................... 3–12
Uninstalling phone data package...................................................................................................................... 3–15
Configuring users in Phoenix ............................................................................................................................. 3–17
Managing connections in Phoenix..................................................................................................................... 3–17
Installing flash support files for FPS-10 ............................................................................................................ 3–19
Updating FPS-10 flash prommer software........................................................................................................ 3–22

List of Figures
Figure 2 Dongle not found ....................................................................................................................................3–6
Figure 3 Disclaimer text.........................................................................................................................................3–7
Figure 4 InstallShield Wizard Complete ...............................................................................................................3–8
Figure 5 Installation interrupted ..........................................................................................................................3–9
Figure 6 Remove program.................................................................................................................................. 3–10
Figure 7 Finish uninstallation ............................................................................................................................ 3–10
Figure 8 Repair program .................................................................................................................................... 3–11
Figure 9 Data package setup information ........................................................................................................ 3–13
Figure 10 Data package destination folder ...................................................................................................... 3–14
Figure 11 InstallShield Wizard Complete .......................................................................................................... 3–15
Figure 12 Uninstalling phone data package..................................................................................................... 3–16
Figure 13 Finishing data package uninstallation............................................................................................. 3–16
Figure 14 Phoenix login...................................................................................................................................... 3–17
Figure 15 New user configured.......................................................................................................................... 3–17
Figure 16 Select mode: Manual.......................................................................................................................... 3–18
Figure 17 Connections list .................................................................................................................................. 3–19
Figure 18 Connection information .................................................................................................................... 3–19
Figure 19 Product support module information (example from RM-1)......................................................... 3–19
Figure 20 Flash update welcome dialog ........................................................................................................... 3–20
Figure 21 Flash installation interrupted ........................................................................................................... 3–20
Figure 22 Flash destination folder..................................................................................................................... 3–21
Figure 23 Finish flash update............................................................................................................................. 3–22
Figure 24 Prommer SW update finished........................................................................................................... 3–23
Figure 25 Prommer maintenance window....................................................................................................... 3–23
Figure 26 Flash directory window ..................................................................................................................... 3–24

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Phoenix installation steps in brief

Prerequisites
Recommended hardware requirements:
• Computer processor: Pentium 700 MHz or higher
• RAM 256 MB
• Disk space 100-300 MB
Supported operating systems:
• Windows 2000 Service Pack 3 or higher
• Windows XP Service Pack 1 or higher

Context
Phoenix is a service software for reprogramming, testing and tuning phones.
Phoenix installation contains:
• Service software support for all phone models included in the package
• Flash update package files for programming devices
• All needed drivers for:
• PKD-1 (DK2) dongle
• DKU-2 USB cable
Note: Separate installation packages for flash update files and drivers are also available, but it is
not necessary to use them unless there are updates between Phoenix service software releases. If
separate update packages are used, they should be used after Phoenix and data packages have been
installed.
The phone model specific data package includes all changing product specific data:
• Product software binary files
• Files for type label printing
• Validation file for the faultlog repair data reporting system
• All product specific configuration files for Phoenix software components
Note: Phoenix and phone data packages should only be used as complete installation packages.
Uninstallation should be made from the Windows Control Panel.
To use Phoenix, you need to:

Steps
1. Connect a PKD-1 (DK2) dongle to the computer parallel port.
2. Install Phoenix.
3. Install the phone-specific data package.
4. Configure users.
5. Manage connection settings (depends on the tools you are using).
• Update FPS-10 software
Note: There is no need to activate FPS-10.
• Activate SX-4 smart card, if you need tuning and testing functions.
Note: When FPS-10 is used only for product software updates, SX-4 smart card is not needed.
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Results
Phoenix is ready to be used with FPS-10 flash prommer and other service tools.

Installing Phoenix

Prerequisites
• Check that a dongle is attached to the parallel port of your computer.
• Download the Phoenix installation package (for example, phoenix_service_sw_2004_39_x_xx.exe) to your
computer (in C:\TEMP, for instance).
• Close all other programs.
• Depending on your operating system, administrator rights may be required to install Phoenix.
• If uninstalling or rebooting is needed at any point, you will be prompted by the InstallShield program.

Context
At some point during the installation procedure, you may get the following message:

Figure 2 Dongle not found

This may be a result of a defective or too old PKD-1 dongle.
Check the COM/parallel ports used. After correcting the problem, you can restart the installation.
For more detailed information, please refer to Phoenix Help files.
Tip: Each feature in Phoenix has its own Help function, which can be activated while running the
program. Press the F1 key or the feature’s Help button to activate a Help file.

Steps
1. To start the installation, run the application file (for example,phoenix_service_sw_2004_39_x_xx.exe).
2. In the Welcome dialogue, click Next.

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3. Read the disclaimer text carefully and click Yes.

Figure 3 Disclaimer text

4. Choose the destination folder.
The default folder C:\ProgramFiles\Nokia\Phoenix is recommended.
5. To continue, click Next.
To choose another location, click Browse (not recommended).
6. Wait for the components to be copied.
The progress of the installation is shown in the Setup Status window.
7. Wait for the drivers to be installed and updated.
The process may take several minutes to complete.
If the operating system does not require rebooting, the PC components are registered right away.
If the operating system requires restarting your computer, the Install Shield Wizard will notifies about it.
Select Yes... to reboot the PC immediately or No... to reboot the PC manually afterwards.
After the reboot, all components are registered.
Note: Phoenix does not work, if the components have not been registered.

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8. To end the installation, click Finish.

Figure 4 InstallShield Wizard Complete

Next actions
After the installation, Phoenix can be used after:
• installing phone model specific data package for Phoenix
• configuring users and connections
FPS-10 flash prommer can be used after updating their flash update package files.

Updating Phoenix installation

Context
• If you already have the Phoenix service software installed on your computer, you need to update the
software when new versions are released.
• To update Phoenix, you need to follow the same steps as when installing it for the first time.
• When you are updating, for example, from version a14_2004_16_4_47 to a15_2004_24_7_55, the update
will take place automatically without uninstallation.
• Always use the latest available versions of both Phoenix and the phone-specific data package. Instructions
can be found in the phone model specific Technical Bulletins and phone data package readme.txt files
(shown during installation).
• If you try to update Phoenix with the same version you already have (for example, a15_2004_24_7_55 to
a15_2004_24_7_55), you are asked if you want to uninstall the existing version. In this case you can choose
between a total uninstallation or a repair installation in a similar way when choosing to uninstall the
application from the Windows Control Panel.
• If you try to install an older version (for example, downgrade from a15_2004_24_7_55 to
a14_2004_16_4_47), installation will be interrupted.
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Figure 5 Installation interrupted

• Always follow the instructions on the screen.

Steps
1. Download the installation package to your computer hard disk.
2. Close all other programs.
3. Run the application file (for example, phoenix_service_sw_2004_39_x_xx.exe).

Results
A new Phoenix version is installed and driver versions are checked and updated.

Uninstalling Phoenix

Context
You can uninstall Phoenix service software manually from the Windows Control Panel.

Steps
1. Open the Windows Control Panel, and choose Add/Remove Programs.

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2. To uninstall Phoenix, choose Phoenix Service Software→Change/Remove→Remove .

Figure 6 Remove program

The progress of the uninstallation is shown.
3. If the operating system does not require rebooting, click Finish to complete.

Figure 7 Finish uninstallation

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If the operating system requires rebooting, InstallShield Wizard will notify you. Select Yes... to reboot the
PC immediately and No... to reboot the PC manually afterwards.

Repairing Phoenix installation

Context
If you experience any problems with the service software or suspect that files have been lost, use the repair
function before completely reinstalling Phoenix.
Note: The original installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe)
must be found on your PC when you run the repair setup.

Steps
1. Open Windows Control Panel→Add/Remove Programs .
2. Choose Phoenix Service Software→Change/Remove .
3. In the following view, select Repair.

Figure 8 Repair program

Phoenix reinstalls components and registers them.
The procedure is the same as when updating Phoenix.
4. To complete the repair, click Finish.

Phone data package overview
Each product has its own data package (DP). The product data package contains all product-specific data files
to make the Phoenix service software and tools usable with a certain phone model.
The phone data package contains the following:
• Product software binary files
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• Files for type label printing
• Validation file for the fault log repair data reporting system
• All product-specific configuration files for Phoenix software components
Data files are stored in C:\Program Files\Nokia\Phoenix (default).

Installing phone data package

Prerequisites
• A phone-specific data package contains all data required for the Phoenix service software and service tools
to be used with a certain phone model.
• Check that a dongle is attached to the parallel port of your computer.
• Install Phoenix service software.
• Download the installation package (for example, XX-XX_dp_EA_v_1_0.exe) to your computer (for example,
in C:\TEMP).
• Close all other programs.
(XX-XX = type designator of the product)
If you already have Phoenix installed on your computer, you will need to update it when a new version is
released.
Note: Often Phoenix and the phone-specific data package come in pairs, meaning that a certain
version of Phoenix can only be used with a certain version of a data package. Always use the latest
available versions of both. Instructions can be found in phone-specific Technical Bulletins and
readme.txt files of data packages.

Steps
1. To start the installation, run the application file (for example, XX-XX_dp_EA_ v_1_0.exe),
Wait for the installation files to be extracted.

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2. Click Next.

3. In the following view you can see the contents of the data package. Read the text carefully. There is
information about the Phoenix version required with this data package.

Figure 9 Data package setup information

4. To continue, click Next.
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5. Choose the destination folder, and click Next to continue.

Figure 10 Data package destination folder

The InstallShield Wizard checks where Phoenix is installed, and the directory is shown.
6. To start copying the files, click Next.

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Phone model specific files are installed. Please wait.
7. To complete the installation, click Finish.

Figure 11 InstallShield Wizard Complete

Next actions
Phoenix can be used for flashing phones and printing type labels after:
• Configuring users
• Managing connections
FPS-10 can be used after updating their flash update package files.

Uninstalling phone data package

Context
There is no need to uninstall an older version of a data package, unless instructions to do so are given in the
readme.txt file of the data package and bulletins related to the release.
Please read all related documents carefully.

Steps
1. Locate the data package installation file (e.g. XX-XX_dp_EA_v_1_0.exe) from your computer.
2. To start the uninstallation procedure, double-click the data package installation file.

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3. To uninstall the data package, click OK or to interrupt the uninstallation, click Cancel.

Figure 12 Uninstalling phone data package

4. When the data package is uninstalled, click Finish.

Figure 13 Finishing data package uninstallation

Alternative steps
• You can also uninstall the data package manually from
Control Panel→Add/Remove Programs→xx-xx* Phone Data Package . (*= type designator of the
phone).

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Configuring users in Phoenix

Steps
1. Start Phoenix service software, and log in.

Figure 14 Phoenix login

If the user ID is already configured, select s/he from the User name drop-down list, and click OK.
2. To add a new user, or to edit existing ones, click Maintain.
3. To add a new user, click New.
4. Type in the name and initials of the user, and click OK.
The user is added to the user name list.
5. Select the desired user from the User name drop-down list, and click OK.

Figure 15 New user configured

Managing connections in Phoenix

Context
With the Manage Connections feature you can edit and delete existing connections or create new ones.
Note: After choosing the desired connection, and connecting the phone to a PC for the first time,
allow the PC to install the USB device drivers first. Please note that this may take some time to
complete.
If there are problems after the driver installation, check that the USB connection is active from the
Windows Control Panel. If the problem persists, contact the local PC support.

Steps
1. Start Phoenix, and log in.
2. Choose File→Manage Connections... .
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3. To add a new connection, click Add.

4. Select Manual mode, and click Next to continue.
If you want to create the connection using the Connection Wizard, connect the tools and a phone to your
PC. The wizard will automatically try to configure the correct connection.

Figure 16 Select mode: Manual

i

For an FPS-10 flash prommer with a USB Connection, choose the following connection settings:
• Media: FPS-10 USB
• DEVICE_INDEX: 0
• SERIAL_NUM: See Serial No from the label attached to the bottom of FPS-10
• ACTIVE_MEDIA: USB

ii

For an FPS-10 flash prommer with a LAN connection, choose the following connection settings:
• Media: FPS-10 TCP/IP
• NET_SERV_NAME: Click Scan.... Choose your own FPS-10 device based on the correct MAC address.
See Serial No from the label attached to the bottom of your FPS-10.
• PORT_NUM: Use the default value, and click Next.
• PROTOCOL_FAMILY: Use the default value, and click Next.
• SOCKET TYPE: Use the default value, and click Next.
• TX_BUFFER_SIZE: Use the default value, and click Next.
• RX_BUFFER_SIZE: Use the default value, and click Next.

iii For an FPS-8 flash prommer, choose the following connection settings:
• Media: FPS-8
• PORT_NUM: COM Port where FPS-8 is connected
• COMBOX_DEF_MEDIA: FBUS
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iv For a plain USB connection, choose the following connection settings:
Note: First connect the DKU-2 USB cable between the PC USB port and phone.
• Media: USB
5. To complete the configuration, click Finish.
6. Click the connection you want to activate. Use the up/down arrows located on the right hand side to move
it on top of the list, then click Apply.

Figure 17 Connections list

The connection is activated, and it can be used after closing the Manage Connection window.
The connection information is shown at the right hand bottom corner of the screen.

Figure 18 Connection information

7. To use the connection, connect the phone to your PC with correct service tools. Make sure the phone is
switched on, and then choose File→Scan Product .

Results
The product support module information appears in the status bar:

Figure 19 Product support module information (example from RM-1)

Installing flash support files for FPS-10

Prerequisites
Note: You need to install flash support files for FPS-10 only, if you don’t have the latest Phoenix
available or the flash support files have changed after the latest Phoenix release.
• Flash support files are installed automatically, when you install Phoenix. Use Phoenix packages later than
June 2006.
• Normally it is enough to install Phoenix and the phone-specific data package because the Phoenix
installation always includes the latest flash update package files for FPS-10.
• A separate installation package for flash support files is available, and the files can be updated according
to this instruction, if updates appear between new Phoenix / data package releases

Context
If you are not using a separate installation package, you can skip this section and continue with updating
FPS-10 flash prommer software after installing a new phone data package.
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Steps
1. To begin installation, double- click flash_update_x_yy.exe .

Figure 20 Flash update welcome dialog

If the same version of Flash Update package already exists, and you want to reinstall it, the previous
package is first uninstalled. Restart installation again after that.
2. If you try to downgrade the existing version to older ones, the setup will be aborted. If you really want
to downgrade, uninstall newer files manually from Control Panel and then rerun the installation again.

Figure 21 Flash installation interrupted

If an older version exists on your PC and it needs to be updated, click Next to continue installation.

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3. It is highly recommended to install the files to the default destination folder C:\Program Files\Nokia
\Phoenix. Click Next to continue.

Figure 22 Flash destination folder

When installing the flash update files for the first time you may choose another location by selecting
Browse. However, this is not recommended.

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4. To complete the installation procedure, click Finish .

Figure 23 Finish flash update

Next actions
FPS-10 flash prommers must be updated using Phoenix!

Updating FPS-10 flash prommer software

Steps
1. Start Phoenix Service Software and log in, manage connection correctly for your flash prommer.
2. Choose Flashing→Prommer maintenance .
3. When the new flash update package is installed to the computer you will be asked to update the files to
your Prommer. To update the files, click Yes. Click OK if the computer informs you about an unsafe removal
of the device.
4. Alternatively you can update the FPS-10 flash prommer software by clicking the Update button.

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5. Wait until you are notified that update has been successful; the procedure will take a couple of minutes.
Click OK to close the Update Done window.

Figure 24 Prommer SW update finished

6. If you are using the FPS-10 flash prommer, check that it is detected from the progress info. Check also the
status leds in the FPS-10. The MODE2 led (green), VBAT and POWER leds (red) should be lit. If you are using
LAN connection, the LAN led (yellow) should be blinking.
7. Check that your FPS-10 flash prommer has enough memory. Flashing the SU-18 with FPS-10 needs at least
128 MB of SRAM memory in the prommer.

Figure 25 Prommer maintenance window

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Alternative steps
• You can update FPS-10 SW by clicking the Update button and selecting the appropriate fpsxupd.ini file in
C:\Program Files\Nokia\Phoenix\Flash.

Figure 26 Flash directory window

• All files can be loaded separately to the prommer used. To do this, click the right mouse button in the
Flash box files window and select the file type to be loaded.
More information can be found in Phoenix Help.

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4 — Service Tools and Service
Concepts

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Table of Contents
Service tools............................................................................................................................................................4–5
Product specific tools........................................................................................................................................4–5
FS-10 ..............................................................................................................................................................4–5
MJ-111 ...........................................................................................................................................................4–5
RJ-154 ............................................................................................................................................................4–5
SA-87..............................................................................................................................................................4–6
SA-94..............................................................................................................................................................4–6
SS-104............................................................................................................................................................4–7
General tools......................................................................................................................................................4–7
ACP-8E............................................................................................................................................................4–7
CU-4................................................................................................................................................................4–8
FLS-4S ............................................................................................................................................................4–9
FPS-10............................................................................................................................................................4–9
PKD-1 .............................................................................................................................................................4–9
SS-46 ..............................................................................................................................................................4–9
SS-62 ........................................................................................................................................................... 4–10
SS-88 ........................................................................................................................................................... 4–10
SX-4............................................................................................................................................................. 4–10
Cables............................................................................................................................................................... 4–10
CA-35S......................................................................................................................................................... 4–10
CA-53........................................................................................................................................................... 4–11
DAU-9S ........................................................................................................................................................ 4–11
PCS-1 ........................................................................................................................................................... 4–11
XCS-4 ........................................................................................................................................................... 4–11
XRS-6........................................................................................................................................................... 4–12
Service concepts .................................................................................................................................................. 4–12
POS (Point of Sale) flash concept .................................................................................................................. 4–12
Flash concept with FPS-10............................................................................................................................. 4–13
CU-4 flash concept with FPS-10..................................................................................................................... 4–14
Module jig service concept ............................................................................................................................ 4–15
RF testing concept with RF coupler .............................................................................................................. 4–16
Service concept for RF testing and RF/BB tuning ........................................................................................ 4–17

List of Tables
Table 8 Attenuation values for inductive RF coupler SA-94 - fold open ...........................................................4–6
Table 9 Attenuation values for inductive RF coupler SA-94 - fold closed .........................................................4–6

List of Figures
Figure 27 POS flash concept ............................................................................................................................... 4–12
Figure 28 Basic flash concept with FPS-10........................................................................................................ 4–13
Figure 29 CU-4 flash concept with FPS-10......................................................................................................... 4–14
Figure 30 Module jig service concept ................................................................................................................ 4–15
Figure 31 RF testing concept with RF coupler .................................................................................................. 4–16
Figure 32 Service concept for RF testing and RF/BB tuning ............................................................................ 4–17

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Service tools
Product specific tools
The table below gives a short overview of service tools that can be used for testing, error analysis and repair
of product RM-188; RM-198, refer to various concepts.
FS-10

product specific
adapter

Flash adapter FS-10 is used for phone testing and flashing. FS-10 is
used with the generic flash adapter base and control Unit CU-4 or
interface adapter.
When flashing or system testing the phone, the adapter is attached to
replace the phone own battery. All functions (as well as the calibration
voltages, current and the protections for over voltages, over current
and voltage polarity), are performed by CU-4.
MJ-111

Module jig

MJ-111 is meant for component level troubleshooting.

RJ-154

Soldering jig

RJ-154 is used as a soldering jig for the engine module.

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SA-87

RF coupler

SA-87 is a coupler for GSM RF testing. It is used together with FS-10
flash adapter.
•

Attenuation values for inductive RF coupler SA-87
Band

GSM
850

GSM
900

GSM
1800

GSM
1900

Channel Att. RX Tolerance
RX

Att. TX

Low

4,8

5,4

Mid

5,0

High

5, 3

4,8

Low

5,0

5,0

Mid

5,3

High

5,8

6,2

Low

10,3

11,3

Mid

9,3

High

9,3

10,8

Low

10,0

9,5

Mid

9,5

High

9,5

SA-94

+/-2dB

+/-2dB

+/-3dB

+/-3dB

5,0

5,5

11,5

9,8

Tolerance
TX
+/-2dB

+/-2dB

+/-3dB

+/-3dB

9,5

RF coupler

SA-94 is a coupler for Bluetooth and WLAN testing.
•

Table 8 Attenuation values for inductive RF coupler SA-94 - fold open

Attenuation values for inductive RF coupler SA-94
Band

WLA
N/ BT
•

Channel Att. RX Tolerance Att. TX Tolerance
RX
TX
Low

17,0

Mid

17,0

High

17,0

17,0
+/-3dB

17,0

+/-3dB

17,0

Table 9 Attenuation values for inductive RF coupler SA-94 - fold closed

Attenuation values for inductive RF coupler SA-94
Band

WLA
N/BT

Page 4 –6

Channel Att. RX Tolerance Att. TX Tolerance
RX
TX
Low

18,0

Mid

18,0

High

18,0

18,0
+/-3dB

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18,0

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SS-104

Domesheet and
display alignment jig

SS-104 is used for domesheet and display alignment.

General tools
The table below gives a short overview of service tools that can be used for testing, error analysis and repair
of product RM-188; RM-198, refer to various concepts.
ACP-8E

Charger

0675195

Charger (for Europe)
Output: 5.3V DC, 500 mA.

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CU-4

Control unit

CU-4 is a general service tool used with a module jig and/or a flash
adapter. It requires an external 12 V power supply.
The unit has the following features:
• software controlled via USB
• EM calibration function
• Forwards FBUS/Flashbus traffic to/from terminal
• Forwards USB traffic to/from terminal
• software controlled BSI values
• regulated VBATT voltage
• 2 x USB2.0 connector (Hub)
• FBUS and USB connections supported
When using CU-4, note the special order of connecting cables and
other service equipment:

Instructions
1 Connect a service tool (jig, flash adapter) to CU-4.
2 Connect CU-4 to your PC with a USB cable.
3 Connect supply voltage (12 V)
4 Connect an FBUS cable (if necessary).
5 Start Phoenix service software.

Note: Phoenix enables CU-4 regulators via USB when it is
started.
Page 4 –8

Reconnecting the power supply requires a Phoenix restart.
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FLS-4S

Flash device

FLS-4S is a dongle and flash device incorporated into one package,
developed specifically for POS use.

FPS-10

Flash prommer

FPS-10 interfaces with:
• PC
• Control unit
• Flash adapter
• Smart card
FPS-10 flash prommer features:
• Flash functionality for BB5 and DCT-4 terminals
• Smart Card reader for SX-2 or SX-4
• USB traffic forwarding
• USB to FBUS/Flashbus conversion
• LAN to FBUS/Flashbus and USB conversion
• Vusb output switchable by PC command
FPS-10 sales package includes:
• FPS-10 prommer
• Power Supply with 5 country specific cords
• USB cable
PKD-1

SW security device

SW security device is a piece of hardware enabling the use of the
service software when connected to the parallel (LPT) port of the PC.
Without the device, it is not possible to use the service software.
Printer or any such device can be connected to the PC through the
device if needed.
SS-46

Interface adapter

SS-46 acts as an interface adapter between the flash adapter and
FPS-10.

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SS-62

Flash adapter base

Generic base for flash adapters and couplers.

SS-88

Camera removal tool

The camera removal tool SS-88 is used to remove/attach the front
camera module from/to the socket.

SX-4

Smart card

SX-4 is a BB5 security device used to protect critical features in tuning
and testing.
SX-4 is also needed together with FPS-10 when DCT-4 phones are
flashed.

Cables
The table below gives a short overview of service tools that can be used for testing, error analysis and repair
of product RM-188; RM-198, refer to various concepts.
CA-35S

Power cable

CA-35S is a power cable for connecting, for example, the FPS-10 flash
prommer to the Point-Of-Sales (POS) flash adapter.

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CA-53

USB connectivity
cable

USB to system connector cable.

DAU-9S

MBUS cable

The MBUS cable DAU-9S has a modular connector and is used, for
example, between the PC's serial port and module jigs, flash adapters
or docking station adapters.
Note: Docking station adapters valid for DCT4 products.

PCS-1

Power cable

The PCS-1 power cable (DC) is used with a docking station, a module
jig or a control unit to supply a controlled operating voltage.

XCS-4

Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable
for flashing and service purposes.

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XRS-6

RF cable

The RF cable is used to connect, for example, a module repair jig to
the RF measurement equipment.
SMA to N-Connector approximately 610 mm.
Attenuation for:
• GSM850/900: 0.3+-0.1 dB
• GSM1800/1900: 0.5+-0.1 dB
• WLAN: 0.6+-0.1dB

Service concepts
POS (Point of Sale) flash concept

Figure 27 POS flash concept

Type

Description

Product specific tools
BL-5C

Battery

Other tools
ACP-8

Power adapter

FLS-4S

POS flash dongle

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Type

Description
PC with Phoenix service software

Cables
CA-53

USB connectivity cable

Flash concept with FPS-10

Figure 28 Basic flash concept with FPS-10

Type

Description

Product specific tools
FS-10

Flash adapter

Other tools
FPS-10

Flash prommer box

PKD-1/PK-1

SW security device

SS-46

Interface adapter
PC with Phoenix service software

Cables
XCS-4

Modular cable

CA-35S

Power cable

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Type

Description
USB cable

CU-4 flash concept with FPS-10

Figure 29 CU-4 flash concept with FPS-10

Type

Description

Product specific tools
FS-10

Flash adapter

Other tools
CU-4

Control unit

FPS-10

Flash prommer box

PKD-1/PK-1

SW security device

SS-62

Flash adapter base

SX-4

Smart card
PC with Phoenix service software

Cables
PCS-1

Power cable

XCS-4

Modular cable
Standard USB cable

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Type

Description
USB cable

Module jig service concept

Figure 30 Module jig service concept

Type

Description

Phone specific tools
MJ-111

Module jig

Other tools
CU-4

Control unit

FPS-10

Flash prommer box

PKD-1/PK-1

SW security device

SX-4

Smart card
PC with Phoenix service software
Measurement equipment

Cables
PCS-1

DC power cable

XCS-4

Modular cable

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Type
XRS-6

Description
RF cable
USB cable
GPIB control cable

RF testing concept with RF coupler

Figure 31 RF testing concept with RF coupler

Type

Description

Product specific tools
FS-10

Flash adapter

SA-87

RF coupler

Other tools
CU-4

Control unit

SX-4

Smart card

FPS-10

Flash prommer box

PKD-1/PK-1

SW security device

SS-62

Flash adapter base
Measurement equipment
PC with Phoenix service software

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Type

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Description

Cables
PCS-1

Power cable

XCS-4

Modular cable

XRS-6

RF cable
GPIB control cable
USB cable

Service concept for RF testing and RF/BB tuning

Figure 32 Service concept for RF testing and RF/BB tuning

Type

Description

Product specific tools
MJ-111

Module jig

Other tools
CU-4

Control unit

PKD-1/PK-1

SW security device

SX-4

Smart card
Measurement equipment

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Type

Description
Smart card reader
PC with Phoenix service software

Cables
DAU-9s

MBUS cable

PCS-1

DC power cable

XRS-6

RF cable
GPIB control cable
USB cable

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5 — Disassembly / Reassembly
Instructions

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Table of Contents
Upper block disassembly .......................................................................................................................................5–5
Upper block assembly ......................................................................................................................................... 5–10
Lower block disassembly.................................................................................................................................... 5–18
Lower block assembly......................................................................................................................................... 5–22

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Disassembly / Reassembly Instructions

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Upper block disassembly

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Disassembly / Reassembly Instructions

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Nokia Customer Care

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Disassembly / Reassembly Instructions

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Disassembly / Reassembly Instructions

Upper block assembly

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Disassembly / Reassembly Instructions

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Nokia Customer Care

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Disassembly / Reassembly Instructions

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Nokia Customer Care

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Disassembly / Reassembly Instructions

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Lower block disassembly

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Nokia Customer Care

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Disassembly / Reassembly Instructions

Lower block assembly

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Nokia Customer Care

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Disassembly / Reassembly Instructions

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6 — BB Troubleshooting and
Manual Tuning Guide

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Table of Contents
Baseband troubleshooting....................................................................................................................................6–5
General power checking troubleshooting ...........................................................................................................6–7
Clocking troubleshooting ......................................................................................................................................6–8
Battery current measuring fault troubleshooting ........................................................................................... 6–10
Flash programming fault troubleshooting....................................................................................................... 6–11
COMBO memory troubleshooting ...................................................................................................................... 6–12
Keyboard troubleshooting ................................................................................................................................. 6–12
USB troubleshooting ........................................................................................................................................... 6–14
Backup battery troubleshooting........................................................................................................................ 6–15
Charging troubleshooting .................................................................................................................................. 6–16
Dead or jammed troubleshooting ..................................................................................................................... 6–17
MR sensor troubleshooting ................................................................................................................................ 6–18
Vibra troubleshooting......................................................................................................................................... 6–19
MicroSD troubleshooting .................................................................................................................................... 6–20
SIM troubleshooting............................................................................................................................................ 6–21
Display module troubleshooting ....................................................................................................................... 6–22
General instructions for display troubleshooting....................................................................................... 6–22
Display fault troubleshooting (main and second displays) ....................................................................... 6–24
Displays and keyboard backlight troubleshooting ..................................................................................... 6–25
LED driver troubleshooting ........................................................................................................................... 6–26
Camera troubleshooting..................................................................................................................................... 6–28
Introduction to camera troubleshooting .................................................................................................... 6–28
Taking and evaluating test pictures............................................................................................................. 6–28
Camera hardware failure message troubleshooting.................................................................................. 6–29
Camera hardware troubleshooting .............................................................................................................. 6–30
Front camera viewfinder troubleshooting .................................................................................................. 6–31
Front camera bad image quality troubleshooting ..................................................................................... 6–32
Bluetooth troubleshooting................................................................................................................................. 6–33
Introduction to Bluetooth/FM Radio troubleshooting ............................................................................... 6–33
Bluetooth settings for Phoenix..................................................................................................................... 6–34
Bluetooth self tests in Phoenix ..................................................................................................................... 6–35
Bluetooth BER failure troubleshooting ........................................................................................................ 6–37
BT audio failure troubleshooting ................................................................................................................. 6–39
FM Radio troubleshooting ............................................................................................................................. 6–40
Audio troubleshooting........................................................................................................................................ 6–41
Audio troubleshooting test instructions...................................................................................................... 6–41
Internal earpiece troubleshooting ............................................................................................................... 6–44
Internal microphone troubleshooting ......................................................................................................... 6–44
IHF speaker troubleshooting......................................................................................................................... 6–46
External microphone troubleshooting......................................................................................................... 6–47
External earpiece troubleshooting............................................................................................................... 6–48
Introduction to acoustics troubleshooting ................................................................................................. 6–49
Earpiece troubleshooting .............................................................................................................................. 6–50
IHF troubleshooting ....................................................................................................................................... 6–51
Microphone troubleshooting ........................................................................................................................ 6–52
Baseband manual tuning guide......................................................................................................................... 6–53
Energy management calibration .................................................................................................................. 6–53

List of Tables
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Table 10 Display module troubleshooting cases ............................................................................................. 6–22
Table 11 Pixel defects ......................................................................................................................................... 6–23
Table 12 Calibration value limits ....................................................................................................................... 6–53

List of Figures
Figure 33 SleepCLK .................................................................................................................................................6–9
Figure 34 SYSCLK .....................................................................................................................................................6–9
Figure 35 Flashing pic 1. Take single trig measurement for the rise of the BSI signal................................ 6–11
Figure 36 Flashing pic 2. Take single trig measurement for the rise of the BSI signal................................ 6–11
Figure 37 Charging backup battery ................................................................................................................... 6–15
Figure 38 Discharging backup battery .............................................................................................................. 6–15
Figure 39 RM-188 Bluetooth .............................................................................................................................. 6–33
Figure 40 RM-198 Bluetooth .............................................................................................................................. 6–34
Figure 41 RM-188/198 FM radio......................................................................................................................... 6–34
Figure 42 BER test result..................................................................................................................................... 6–35
Figure 43 Bluetooth self tests in Phoenix ......................................................................................................... 6–36
Figure 44 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is
connected. ................................................................................................................................................. 6–43
Figure 45 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is
connected. ................................................................................................................................................. 6–43
Figure 46 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected. ...
6–43

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Baseband troubleshooting

Context
This section is intended to be a guide for localising and repairing electrical faults. The fault repairing is divided
into troubleshooting paths.
The following main troubleshooting tree describes the different baseband troubleshooting paths to be
followed in fault situations.

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Troubleshooting flow

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General power checking troubleshooting

Troubleshooting flow

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Clocking troubleshooting

Troubleshooting flow

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Figure 33 SleepCLK

Figure 34 SYSCLK

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Battery current measuring fault troubleshooting

Troubleshooting flow

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Flash programming fault troubleshooting

Troubleshooting flow

Figure 35 Flashing pic 1. Take single trig measurement for the rise of the BSI signal.

Figure 36 Flashing pic 2. Take single trig measurement for the rise of the BSI signal.

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COMBO memory troubleshooting

Troubleshooting flow

Keyboard troubleshooting

Context
There are two possible failure modes in the keyboard: a) One or more keys can be stuck, so that the key does
not react when a keydome is pressed. This kind of failure is caused by mechanical reasons (dirt, rust), b)
Malfunction of several keys at the same time; this happens when one or more rows or columns are failing
(shortcut or open connection).
For a more detailed description of the keyboard and keymatrix, see section Keyboard. If the failure mode is
not clear, start with the Keyboard Test in Phoenix.

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Troubleshooting flow

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USB troubleshooting

Troubleshooting flow

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Backup battery troubleshooting
Verify that the backup battery is empty (U<1V). Switch the phone on. Measure voltage of the battery when
the main battery is connected to the phone and the phone is switched on.
Wait a few minutes and monitor that the backup battery voltage rises. Switch off the phone, disconnect the
main battery and monitor that the voltage of the backup battery fills up. Normal behaviour of the voltage is
described in the figures below.

Figure 37 Charging backup battery

Figure 38 Discharging backup battery

If the voltage rises and falls quickly, check whether C2233 is broken or short-circuited. Backup battery can
be also dead. If the voltage stays ~0V, check resistance VBACK against GND. If there is no short-circuit, RETU
is faulty. Replace RETU.

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Charging troubleshooting

Troubleshooting flow

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Dead or jammed troubleshooting

Troubleshooting flow

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MR sensor troubleshooting

Troubleshooting flow

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Vibra troubleshooting

Troubleshooting flow

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MicroSD troubleshooting

Troubleshooting flow

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SIM troubleshooting

Troubleshooting flow

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Display module troubleshooting
General instructions for display troubleshooting
The first step is to verify with a working display that the fault is not on the display module itself. The display
module cannot be repaired.
The second step is to check that the cellular engine is working normally. This can be done by connecting the
phone to a docking station and starting Phoenix service software. With the help of Phoenix read the phone
information to check that also the application engine is functioning normally (you should be able to read the
APE ID).
After these checks proceed to the display troubleshooting flowcharts. Use the Display Test tool in Phoenix to
find the detailed fault mode.

Operating modes of the display
The display is in a normal mode when the phone is in active use.
The display is in a partial idle mode when the phone is in the screen saver mode.
The operating modes of the display can be controlled with the help of Phoenix.
Table 10 Display module troubleshooting cases

Display blank

There is no image on the display. The display looks
the same when the phone is on as it does when the
phone is off. Because the main display is
transmissive type only, the backlight of the main
display must be ON when checking the display's
functionality.

Image on the display not correct

Image on the display can be corrupted or a part of
the image can be missing. If a part of the image is
missing, change the display module. If the image is
otherwise corrupted, follow the appropriate
troubleshooting diagram.

Backlight dim or not working at all

Backlight LED components are inside the display
module. Backlight failure can also be in the
connector or in the backlight power source in the
main engine of the phone. Backlight is also
controlled automatically by the ambient light
sensor.
This means that in case the display is working
(image OK), but the backlight is not, follow the
Display and Keyboard Backlight troubleshooting.

Visual defects (pixel)

Pixel defects can be checked by controlling the
display with Phoenix. Use both colours, black and
white, on a full screen.
The display may have some random pixel defects
that are acceptable for this type of display. The
criteria when pixel defects are regarded as a display
failure, resulting in a replacement of the display, are
presented the following table.

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Table 11 Pixel defects

Item
1

2

White dot defect
Defect
counts

Combine
d defect
counts

Black dot
defect

R

G

B

White
Dot
Total

1

1

1

1

1

Total
1

Not allowed.
Two single dot defects that are within 5 mm of each other should
be interpreted as combined dot defect.

Note: Blinking pixels are not allowed in normal operating temperatures and light conditions. 2nd
display is two-colored, black and white with blue LEDs.

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Display fault troubleshooting (main and second displays)

Troubleshooting flow

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Displays and keyboard backlight troubleshooting

Context
The device has one LED driver that provides current for both displays and keyboard backlights. The driver
gets the PWM signal from Tahvo. Because of the main display is transmissive, HW light dimming (controlled
by TAHVO GENOUT01) is also implemented. There is also a switch for selecting which display is lit on. It is not
possible to turn on both displays’ lights at the same time. The backlight brightness can be adjusted manually
in Phoenix.

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LED driver troubleshooting

Troubleshooting flow

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Camera troubleshooting
Introduction to camera troubleshooting
Bad conditions often cause bad pictures. Therefore, the camera operation has to be checked in constant
conditions or by using a second, known-to-be-good Nokia device as reference. Image quality is hard to
measure quantitatively, and the difference between a good and a bad picture can be small. Some training
or experience may be needed to detect what is actually wrong.
When checking for possible errors in camera functionality, knowing what error is suspected significantly
helps the testing by narrowing down the amount of test cases. The following types of image quality problems
are common:
• Dust (black spots)
• Lack of sharpness
• Bit errors

Taking and evaluating test pictures
When taking a test picture, remember the following:
• Avoid bright fluorescent light, 50/60Hz electrical network or high artificial illumination levels
• If the phone is hot, let it rest for a while before taking the picture
• Make sure the optical system is clean
• Use highest possible resolution
• Make sure the light is suffiecient (bright office lightning)
• Do not take the picture towards light source
• Be as still as possible when taking the picture
• Distance should be at least 40cm, 1-2m is recommended
When evaluating a test picture, remember the following:
• The center of the picture is sharper than the edges
• The image may be blurred, though it does not show in the viewfinder
• Analyse the picture from your PC monitor, full colour setting is recommended
• If possible, compare with a picture of the same motive taken with a similar Nokia device

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Camera hardware failure message troubleshooting

Troubleshooting flow

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Camera hardware troubleshooting

Camera hardware troubleshooting

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Front camera viewfinder troubleshooting

Troubleshooting flow

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Front camera bad image quality troubleshooting

Troubleshooting flow

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Bluetooth troubleshooting
Introduction to Bluetooth/FM Radio troubleshooting
There are two main Bluetooth problems that can occur:
Problem

Description

Detachment of the BT antenna.

This would most likely happen if the device has
been dropped repeatedly to the ground. It could
cause the BT antenna to become loose or partially
detached from the PWB. (see next page for details
about BT antenna HW and Mechanics)

A malfunction in the BT ASIC, BB ASICs or Phone’s BT
SMD components.

This is unpredictable and could have many causes
i.e. SW or HW related.

The main issue is to find out if the problem is related to the BT antenna or related to the BT system or the
phone’s BB and then replace/fix the faulty component.

Bluetooth/FM Radio component layout

Figure 39 RM-188 Bluetooth

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Figure 40 RM-198 Bluetooth

Figure 41 RM-188/198 FM radio

Bluetooth settings for Phoenix

Steps
1. Start Phoenix service software.
2. From the File menu, choose Open Product, and then choose the correct type designator from the
Product list.
3. Place the phone to a flash adapter in the local mode.
4. Choose Testing→Bluetooth LOCALS .
5. Locate JBT-9’s serial number (12 digits) found in the type label on the back of JBT-9.
In addition to JBT-9, also SB-6, JBT-3 and JBT-6 Bluetooth test boxes can be used.
6. In the Bluetooth LOCALS window, write the 12-digit serial number on the
Counterpart BT Device Address line.
This needs to be done only once provided that JBT-9 is not changed.
7. Place the JBT-9 box near (within 10 cm) the BT antenna and click Run BER Test.

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Results
Bit Error Rate test result is displayed in the Bit Error Rate (BER) Tests pane in the Bluetooth LOCALS window.

Figure 42 BER test result

Bluetooth self tests in Phoenix

Steps
1. Start Phoenix service software.
2. ChooseFile→Scan Product.
3. Place the phone to a flash adapter.
4. From the Mode drop-down menu, set mode to Local.
5. Choose Testing→Self Tests.
6. In the Self Tests window check the following Bluetooth related tests:
• ST_LPRF_IF_TEST
• ST_LPRF_AUDIO_LINES_TEST
• ST_BT_WAKEUP_TEST

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7. To run the tests, click Start.

Figure 43 Bluetooth self tests in Phoenix

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Bluetooth BER failure troubleshooting

Troubleshooting flow

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BT audio failure troubleshooting

Troubleshooting flow

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FM Radio troubleshooting

Troubleshooting flow

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Audio troubleshooting
Audio troubleshooting test instructions
Differential external earpiece and internal earpiece outputs can be measured either with a single-ended or
a differential probe.
When measuring with a single-ended probe each output is measured against the ground.
Internal handsfree output is measured using a current probe, if a special low-pass filter designed for
measuring a digital amplifier is not available. Note also that when using a current probe, the input signal
frequency must be set to 2kHz.
The input signal for each loop test can be either single-ended or differential.

Required equipment
The following equipment is needed for the tests:
• Oscilloscope
• Function generator (sine waveform)
• Current probe (Internal handsfree PWM output measurement)
• Phoenix service software
• Battery voltage 3.7V

Test procedure
Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be
activated:
• External microphone to Internal earpiece
• External microphone to Internal handsfree speaker
• Internal microphone to External earpiece
Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.
Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test
are presented in the following table.

Phoenix audio loop tests and test results
The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.
Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory
during measurement causes a significant drop in measured quantities.
The gain values presented in the table apply for a differential output vs. single-ended/differential input.

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Loop test

Input terminal

External Mic to External
Earpiece

XMICP and GND

Output
terminal

HSEAR R P,
HSEAR R N
and GND

Path
gain
[dB]
(fixed)

Input Differen Outpu Outp
volta
tial
t DC
ut
ge
output
level curre
[mVp- voltage
[V]
nt
p]
[mVp-p]
[mA]

-2.9

1000

720

1.2

NA

-4.5

1000

600

1.2

NA

-5

1000

560

0

25m
A
(calc
.)

22.7

100

1360

1.2

NA

HSEAR P,
HSEAR N and
GND
XMICN and GND

HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N and
GND

External Mic to Internal
Earpiece

XMICP and GND

EarP and GND
EarN and
GND

XMICN and GND

EarP and GND
EarN and
GND

External Mic to Internal
handsfree

XMICP and GND

B2102 pads

XMICN and GND

B2102 pads

Internal Mic to External
Earpiece

B2100 (OUT/
GND)

HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N and
GND
HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N and
GND

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Measurement data

Figure 44 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is connected.

Figure 45 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is connected.

Figure 46 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected.

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Internal earpiece troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Troubleshooting flow

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IHF speaker troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

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External earpiece troubleshooting

Troubleshooting flow

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Introduction to acoustics troubleshooting

Acoustics troubleshooting
Acoustics design ensures that the sound is detected correctly with a microphone and properly radiated to
the outside of the device by speaker(s). The acoustics of the phone includes three basic systems: earpiece,
Integrated Hands Free (IHF) and microphone.
The sound reproduced from the earpiece radiates through a single hole on the front cover (A-cover). The
sound reproduced from the IHF speakers radiates through a single hole on the Antenna cap (Antenna assy).
Microphone is located at the bottom, next to the system connector.
For a correct functionality of the phone, all sound holes must be always open. When the phone is used, care
must be taken not to close any of those holes with a hand or fingers. The phone should be dry and clean,
and no objects must be located in such a way that they close any of the holes.

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Earpiece troubleshooting

Troubleshooting flow

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IHF troubleshooting

Troubleshooting flow

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Microphone troubleshooting

Troubleshooting flow

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Baseband manual tuning guide
Energy management calibration

Prerequisites
Energy Management (EM) calibration is performed to calibrate the setting (gain and offset) of AD converters
in several channels (that is, battery voltage, BSI, battery current) to get an accurate AD conversion result.
Hardware setup:
• An external power supply is needed.
• Supply 12V DC from an external power supply to CU-4 to power up the phone.
• The phone must be connected to a CU-4 control unit with a product-specific flash adapter.

Steps
1.

Place the phone to the docking station adapter (CU-4 is connected to the adapter).

2.

Start Phoenix service software.

3.

Choose File→ Scan Product.

4.

Choose Tuning→Energy Management Calibration.

5.

To show the current values in the phone memory, click Read, and check that communication between
the phone and CU-4 works.

6.

Check that the CU-4 used check box is checked.

7.

Select the item(s) to be calibrated.
Note: ADC calibration has to be performed before other item(s). However, if all calibrations are
selected at the same time, there is no need to perform the ADC calibration first.

8.

Click Calibrate.
The calibration of the selected item(s) is carried out automatically.
The candidates for the new calibration values are shown in the Calculated values column. If the new
calibration values seem to be acceptable (please refer to the following "Calibration value limits" table),
click Write to store the new calibration values to the phone permanent memory.
Table 12 Calibration value limits

Parameter

9.

Min.

Max.

ADC Offset

-20

20

ADC Gain

12000

14000

BSI Gain

1100

1300

VBAT Offset

2400

2650

VBAT Gain

19000

23000

IBAT (ICal) Gain

6200

15600

Click Read, and confirm that the new calibration values are stored in the phone memory correctly. If the
values are not stored to the phone memory, click Write and/or repeat the procedure again.

10. To end the procedure, close the Energy Management Calibration window.

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7 — RF Troubleshooting and
Manual Tuning Guide

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Table of Contents
Introduction to RF troubleshooting .....................................................................................................................7–5
RF key component placement...............................................................................................................................7–5
Receiver troubleshooting ......................................................................................................................................7–6
Introduction to RX troubleshooting ................................................................................................................7–6
General instructions for RX troubleshooting..................................................................................................7–7
Synthesizer troubleshooting............................................................................................................................7–9
RX GSM850 troubleshooting.......................................................................................................................... 7–10
RX GSM900 troubleshooting.......................................................................................................................... 7–11
RX GSM1800 troubleshooting........................................................................................................................ 7–12
RX GSM1900 troubleshooting........................................................................................................................ 7–13
GSM Rx chain activation for manual measurements / GSM RSSI measurement....................................... 7–14
Transmitter troubleshooting ............................................................................................................................. 7–14
General instructions for TX troubleshooting ............................................................................................... 7–14
TX 850/900 troubleshooting ......................................................................................................................... 7–17
TX 1800/1900 troubleshooting..................................................................................................................... 7–18
Checking antenna functionality .................................................................................................................... 7–19
RF tunings ............................................................................................................................................................ 7–19
Introduction to RF tunings ............................................................................................................................ 7–19
RF autotuning ................................................................................................................................................. 7–20
System mode independent manual tunings .................................................................................................... 7–22
Rf channel filter calibration........................................................................................................................... 7–22
PA (power amplifier) detection .................................................................................................................... 7–23
GSM receiver tunings........................................................................................................................................... 7–24
Rx calibration (GSM) ....................................................................................................................................... 7–24
Rx band filter response compensation (GSM).............................................................................................. 7–27
GSM transmitter tunings..................................................................................................................................... 7–32
Tx IQ tuning (GSM).......................................................................................................................................... 7–32
Tx power level tuning (GSM) ......................................................................................................................... 7–34
RM-188 WLAN troubleshooting.......................................................................................................................... 7–38
Introduction to WLAN troubleshooting ....................................................................................................... 7–38
WLAN functionality test using SB-7 and Phoenix........................................................................................ 7–41
WLAN failure troubleshooting ...................................................................................................................... 7–42

List of Tables
Table 13 Rf channel filter calibration tuning limits ......................................................................................... 7–23
Table 14 RF tuning limits in Rx calibration....................................................................................................... 7–26

List of Figures
Figure 47 RM-188/198 RF key component placement........................................................................................7–6
Figure 48 RF Controls window ..............................................................................................................................7–8
Figure 49 RSSI Reading window ........................................................................................................................ 7–14
Figure 50 RF Controls window ........................................................................................................................... 7–16
Figure 51 BT/WLAN antenna, feed and GND spots of the main antenna....................................................... 7–19
Figure 52 Rf channel filter calibration typical values ...................................................................................... 7–23
Figure 53 WLAN layout part 1 ............................................................................................................................ 7–39
Figure 54 WLAN layout part 2 ............................................................................................................................ 7–39

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Introduction to RF troubleshooting
All measurements should be done using:
• spectrum analyser with a high-frequency high-impedance passive probe (LO-/reference frequencies and
RF power levels)
• oscilloscope with a 10:1 probe (DC-voltages and low frequency signals)
Caution: Also all measurements with an RF coupler should be performed in RF shielded environment
because nearby base stations can disturb sensitive receiver measurements. If there is no possibility
to use RF shielded environment, it should be checked that there are no transmissions on the same
frequencies as used in the tests.
The RF section of the phone is build around one RF ASIC: ASIC N7505.
Note: Before changing N7505, please check the following things: supply voltages and serial
communication coming from baseband toN7505 are OK. Please note that the grounding of the Frond
End Module (FEM) is directly below FEM so it is difficult to check or change.
Most RF semiconductors are static discharge sensitive! ESD protection must be taken care of during repair
(ground straps and ESD soldering irons). N7505 and FEM are moisture sensitive, so parts must be pre-baked
prior to soldering.
In addition to key components, there are lot of discrete components (resistors, inductors and capacitors)
which troubleshooting is done mainly by checking if the soldering of the component is done properly.
Capacitor can be checked for shorts and resistors for value by means of an ohmmeter, but be aware in-circuit
measurements should be evaluated carefully as other components connected to the same node can change
the seen resistance.
Keep in mind that all measured voltages or RF levels depicted in the service manual are rough figures.
Especially RF levels vary because of different measuring equipment or different grounding of the probe used.
When using an RF probe, use a pair of metallic tweezers to connect the probe ground to the PWB ground as
close to the measurement point as possible. If measurements are performed in a product specific module
jig, then “GND” pads should be used for the probe ground.

RF key component placement
The RF section of the phone is build around one RF ASIC: ASIC N7505.

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Figure 47 RM-188/198 RF key component placement

Receiver troubleshooting
Introduction to RX troubleshooting
Rx can be tested by making a phone call or in the local mode. For the local mode testing, use Phoenix service
software.
The main Rx troubleshooting measurement is RSSI measurement. This test measures the signal strength of
the received signal. I and Q branches can be measured separately.
In GSM, the input signal can be either a real GSM signal or a CW signal that is 67.771kHz up from the carrier
frequency.
For service tool usage instructions, refer to section Service Tools and Service Concepts.

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General instructions for RX troubleshooting

Steps
1. Connect a test jig to a computer with a DKU-2 cable or to a FPS-10 flash prommer with a modular cable
(XCS-4).
Make sure that you have a PKD-1 dongle connected to the computer's parallel port.
2. Connect a DC power supply to a module test jig (MJ-111).
Note: Set the DC supply voltage to 12 V and set the jumper connector on the test jig's reg.pass
switch to “ON” position.
3. Connect an RF cable between the RF connector of the phone and measurement equipment or alternatively
use a 50 ohms (at least 2W) dummy, otherwise GSM may be damaged.
Note: Make sure that all connections are made to the correct RF connector and correct type of RF
probe is used.
4. Set Rx on.
i

Set the phone module to the test jig and start Phoenix service software.

ii

Initialize connection to the phone. (With FPS-10 use FBUS driver when using DKU-2 and COMBOX driver).

iii From the File menu, choose product: File -> Choose Product -> xx-x* (* = type designator of the
phone, scan product).
iv From the toolbar, set operating mode to “Local”.
5. EGSM900, GSM850/1800/1900 troubleshooting
i

From the Testing menu, activate the RF Controls window: Testing -> GSM -> RF Controls .

ii In the RF Controls window:
• Select band "GSM850", “GSM900” or “GSM1800” or “GSM1900” (Default = “GSM850”).
• Set Active unit to “Rx” (Default = “Rx”).
• Set Operation mode to “Burst” (Default = “Burst”).
• Set Rx/Tx channel to 190 on GSM850, 37 on GSM900 band or 700 on GSM1800 band or 661 on GSM1900
(Defaults).
• Set Edge to “Off” (Default). (Not active in RXmode).
• Set Tx PA mode to “Free” (Default). (Not active in RXmode).
• Apply 942.46771 MHz (channel 37 + 67.710 kHz offset), 881.66771MHz (channel 190 + 67.710 kHz),
1842.86771 MHz (channel 700 + 67.710 kHz offset) or 1960.06771 MHz (channel 661 + 67.71 kHz) –
90 dBm signal to the RF-connector (remember to compensate for cable attenuation).

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Figure 48 RF Controls window

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Synthesizer troubleshooting

Troubleshooting flow

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RX GSM850 troubleshooting

Troubleshooting flow

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RX GSM900 troubleshooting

Troubleshooting flow

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RX GSM1800 troubleshooting

Troubleshooting flow

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RX GSM1900 troubleshooting

Troubleshooting flow

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GSM Rx chain activation for manual measurements / GSM RSSI measurement

Context
RSSI signal measurement is the main Rx troubleshooting measurement. The test measures the strength of
the received signal.
I and Q branches can be measured separately. In GSM, the input signal can be either a real GSM signal or a
CW (Continuous Wave) signal that is 67.771 kHz above the carrier frequency.

Steps
1. Start Phoenix service software.
2. Choose Testing→GSM→RSSI Reading .
3. Set the RF signal generator for a channel frequency +67.771 kHz in CW mode with a –80 dBm signal level.
Alternatively set the cellular tester downlink channel to the appropriate channel. Make sure that the tester
is set to continuous mode, not to burst mode.
4. In the RSSI Reading window, select the appropriate band and channel.

Figure 49 RSSI Reading window

5. To start the measurement, activate GSM Rx chain, click Start.

Results
RSSI reading values of the selected band and channel are displayed. The RSSI level must be the same value
as that which is set at the signal generator (-80 dBm).

Transmitter troubleshooting
General instructions for TX troubleshooting

Context
• Tx troubleshooting requires Tx operation.
• Do not transmit on frequencies that are in use!
• Transmitter can be controlled in the local mode for diagnostic purposes.
• The most useful Phoenix tool for GSM transmitter testing is "RF Controls".
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• Tx IQ tuning and Tx power tuning can be also used in some cases.
• Remember that retuning is not a fix! Phones are tuned correctly in production.
The first set of steps instructs how to assemble the test setup. This setup is general for all Tx troubleshooting
tasks.
Alternative steps provide specific troubleshooting instructions for Phoenix service software.
Caution: Never activate the GSM transmitter without a proper antenna load. There should be always
50 ohm load connected to the RF connector (antenna, RF-measurement equipment or at least 2
watts dummy load), otherwise GSM PA may be damaged.

Steps
1. Connect a test jig to a computer with a DKU-2 cable or to a FPS-10 flash prommer with a modular cable
(XCS-4).
Make sure that you have a PKD-1 dongle connected to the computer's parallel port.
2. Connect a DC power supply to a module jig (MJ-111).
Note: When repairing or tuning a transmitter, use an external DC supply with at least 3 A current
capability.
Set the DC supply voltage to 12V and set the jumper connector on the test jig's reg.pass switch to
“ON” position.
3. Connect an RF cable between the RF connector of the phone and measurement equipment or alternatively
use a 50 ohms (at least 2 W) dummy, otherwise GSM may be damaged.
Note: Make sure that all connections are made to the correct RF connector and correct type of RF
probe is used.
Normally a spectrum analyser is used as measurement equipment.
Note: The maximum input power of a spectrum analyser is +30 dBm.
To prevent any damage, it is recommended to use 10 dB attenuator on the spectrum analyzer input.
4. Set Tx on.
i

Set the phone module to the test jig and start Phoenix service software.

ii

Initialize connection to the phone. (With FPS-10 use FBUS driver when using DAU-9S and COMBOX
driver).

iii From the File menu, choose product: File -> Choose Product -> xx-x* (* = type designator of the
phone).
iv From the toolbar, set operating mode to “Local”.
5. EGSM900, GSM850/1800/1900 troubleshooting
i

From the Testing menu, activate the RF Controls window: Testing -> GSM -> RF Controls .

ii In the RF Controls window:
• Select band "GSM850", “GSM900” or “GSM1800” or “GSM1900” (Default = “GSM850”).
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• Set Active unit to “Tx” (Default = “Rx”).
• Set Operation mode to “Burst” (Default = “Burst”).
• Set Tx data type to “Random” (Default = “All1”).

• Set Rx/Tx channel to 190 on GSM850, 37 on GSM900 band or 700 on GSM1800 band or 661 on GSM1900
(Defaults).
• Set Edge to “Off” (Default).
• Set Tx PA mode to “Free” (Default).
• Set power level to 5 (Default = 19) on GSM850/900 or to 0 (Default = 15) on GSM1800 or GSM1900.

Figure 50 RF Controls window

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TX 850/900 troubleshooting

Troubleshooting flow

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TX 1800/1900 troubleshooting

Troubleshooting flow

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Checking antenna functionality

Main antenna
The main antenna has one antenna: GSM.
In the GSM antenna, there is one feed and one GND contact.
The antenna is functioning normally when it is visually intact and the antenna pins are intact.

BT/WLAN antenna
BT/WLAN antenna is a ceramic SMD antenna. The antenna is functioning normally when the contacts function
(RDC = 0 ohm) and the antenna is visually intact.

Figure 51 BT/WLAN antenna, feed and GND spots of the main antenna

RF tunings
Introduction to RF tunings
Important: Only perform RF tunings if:
• one or more of the RF components is changed
• flash Memory chip is changed or otherwise corrupted.
RF calibration is always performed with the help of a product-specific module jig, never with an RF coupler.
Using an RF coupler in the calibration phase will cause a complete mistuning of the RF side.
Important: After RF component changes, always use autotuning. Manual tunings are only required
in rare cases.

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Cable and adapter losses
RF cables and adapters have some losses. They have to be taken in account when the phone is tuned. As all
the RF losses are frequency dependent, the user have to be very careful and understand the measurement
setup. In the following table there are RF attenuations of the module jig:
Band

Attenuation

GSM850

0.2 dB

GSM900

0.2 dB

GSM1800

0.3 dB

GSM1900

0.3 dB

RF autotuning

Prerequisites
For information on the recommended test set-up, refer to the corresponding information on PWS/NOL.
Before you can use the auto-tune feature, the GPIB driver from the GPIB card vendor must be installed and
running.
The autotune .ini file must be in a correct place: C:\Program Files\Nokia\Phoenix\products\xx-x*
\autotune_xx-x*.ini (*= indicates the type designator of the phone, e.g. RM-1)

Context
RF autotuning is performed with the aid of Digital Radio Communication Tester. Autotuning covers all RF
tunings that are needed to perform after RF component repairs.
Note: Do not perform RF autotuning without a proper reason. Phones are tuned in production and
an RF tuning may be performed only after component repairs or if the RF tuning information is lost.

Steps
1.

Connect the communication tester to the GPIB bus.

2.

Start Phoenix service software.

3.

From the Tools menu, choose Options -> GPIB Card.

4.

In the Card Type line, select CEC8Bit, then click Start.
After clicking Start, the name of the communication tester appears in the list of found Listeners.

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5.

To specify the cable loss from module jig to the communication tester, choose "Set Loss" from the Tuning
menu.

6.

Click the Cable tab and add the extra cable attenuation.
Note: Cable losses have to be determined on the basis of a cable used.

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7.

To start autotuning, choose Auto-Tune from the Tuning menu.

8.

In the Auto-Tune window, click Options.

9.

In the Auto-Tune options window, see that the "Enable showing of messages" check box is checked,
then click OK.

10. To complete the RF autotuning, click OK.

Results
"Autotuning completed successfully" message appears.

System mode independent manual tunings
Rf channel filter calibration

Context
Rf channel filter calibration tunes the internal low pass filters of Rx and Tx ASICs that limit the bandwidth of
BB IQ signals.
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One common calibration is made for GSM.
Table 13 Rf channel filter calibration tuning limits

Min

Typ

Max

Tx filter

0

10

31

Rx filter

0

16

31

Steps
1. From the Operating mode drop-down menu, set mode to Local.
2. Choose Tuning→Rf Channel Filter Calibration .
3. Click Tune.
4. To save the values to the PMM (Phone Permanent Memory) area, click Write.
5. To close the Rf Channel Filter Calibration window, click Close.

Results

Figure 52 Rf channel filter calibration typical values

PA (power amplifier) detection

Context
The PA detection procedure detects which PA manufacturer is used for phone PAs.
If a PA is changed or if the permanent memory (PMM) data is corrupted, PA detection has to be performed
before Tx tunings.

Steps
1. From the Operating mode drop-down menu, set mode to Local.
2. Choose Tuning→PA Detection .
3. Click Tune.
4. Check that the detected PA manufacturers are corresponding to the actual chips on the board.
5. To end the procedure, click Close.

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GSM receiver tunings
Rx calibration (GSM)

Context
Rx Calibration is used to find out the real gain values of the GSM Rx AGC system and tuning response of the
AFC system (AFC D/A init value and AFC slope)

Steps
1.

Connect the GSM connector of the module jig to a signal generator.

2.

Start Phoenix service software.

3.

From the Operating mode drop-down menu, set mode to Local.

4.

Choose Tuning→GSM→Rx Calibration .

5.

Check the Load from Phone check box, and uncheck Save to Phone.

6.

From the Band drop-down menu, choose e.g. GSM900.

7.

Click Start.

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8.

Click Calibrate.

9.

Connect the signal generator to the phone, and set frequency and amplitude as instructed in the
Rx Calibration with band EGSM900 pop-up window.
Important: The calibration uses a non-modulated CW signal. Increase the signal generator level by
cable attenuation and module jig probe attenuation.

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10. To perform the tuning, click OK.
11. Check that the tuning values are within the limits specified in the following table:
Table 14 RF tuning limits in Rx calibration

Min

Typ

Max

Unit

AFC Value

-200

-105...62

200

AFC slope

0

122

200

106

107...110

114

AFC Value

-200

-105...62

200

AFC slope

0

122

200

106

107...110

114

dB

104

104...109

114

dB

104

104...109

114

dB

GSM850

RSSI0

dB

GSM900

RSSI0
GSM1800
RSSI0
GSM1900
RSSI0

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12. To save values to the phone, check the Save to Phone check box, and click Stop.

Next actions
Repeat steps 3 to 8 for GSM850, GSM1800 and GSM1900

Rx band filter response compensation (GSM)

Prerequisites
Rx calibration must be done before the Rx Band Filter Response Compensation

Context
In each GSM Rx band, there’s a band rejecting filter in front of RF ASIC front end. The amplitude ripple caused
by these filters causes ripple to the RSSI measurement and therefore calibration is needed.
The calibration has to be repeated for each GSM band.

Steps
1.

Connect module jig’s GSM connector to signal generator.

2.

From the dropdown menus, set "Operating mode" to Local, "System mode" to GSM, and Band to GSM900.

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3.

From the Tuning menu, choose GSM -> Rx Band Filter Response Compensation.

4.

Check “Manual” and “Load from Phone” check boxes. Clear “Save to Phone” check box

5.

Click Start.

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6.

Click Tune.

7.

Connect signal generator to the phone and set frequency and amplitude as instructed in the "Rx Band
Filter Response Compensation for EGSM900" popup window.

8.

To perform tuning, click OK.

9.

Go through all 9 frequencies.

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10. Check that the tuning values are within the limits specified in this table:
Min

Typ

Max

Unit

Ch. 118 /
867.26771 MHz

-10

-1

5

dB

Ch. 128 /
869.26771 MHz

-3

0

5

dB

Ch. 140 /
871.66771 MHz

-3

0

5

dB

Ch. 172 /
878.06771 MHz

-3

0

5

dB

Ch. 190 /
881.66771 MHz

-3

0

5

dB

Ch. 217 /
887.06771 MHz

-3

0

5

dB

Ch. 241 /
891.86771 MHz

-3

0

5

dB

Ch. 251 /
893.86771 MHz

-3

0

5

dB

Ch. 261/
895.86771 MHz

-10

-1

5

dB

Ch. 965 /
923.26771 MHz

-10

-1

5

dB

Ch. 975 /
925.26771 MHz

-3

0

5

dB

Ch. 987 /
927.66771 MHz

-3

0

5

dB

Ch. 1009 /
932.06771 MHz

-3

0

5

dB

Ch. 37 /
942.46771 MHz

-3

0

5

dB

Ch. 90 /
953.06771 MHz

-3

0

5

dB

Ch. 114 /
957.86771 MHz

-3

0

5

dB

Ch. 124 /
959.86771 MHz

-3

0

5

dB

Ch. 136 /
962.26771 MHz

-10

-1

5

dB

GSM850

GSM900

GSM1800
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Min

Typ

Max

Unit

Ch. 497 /
1802.26771 MHz

-10

-1

5

dB

Ch. 512 /
1805.26771 MHz

-3

0

5

dB

Ch. 535 /
1809.86771 MHz

-3

0

5

dB

Ch. 606 /
1824.06771 MHz

-3

0

5

dB

Ch. 700 /
1842.86771 MHz

-3

0

5

dB

Ch. 791 /
1861.06771 MHz

-3

0

5

dB

Ch. 870 /
1876.86771 MHz

-3

0

5

dB

Ch. 885 /
1879.86771 MHz

-3

0

5

dB

Ch. 908 /
1884.46771 MHz

-10

-1

5

dB

Ch. 496 /
1927.06771 MHz

-10

-1

5

dB

Ch. 512 /
1930.26771 MHz

-3

0

5

dB

Ch. 537 /
1935.26771 MHz

-3

0

5

dB

Ch. 586 /
1945.06771 MHz

-3

0

5

dB

Ch. 661 /
1960.06771 MHz

-3

0

5

dB

Ch. 736 /
1975.06771 MHz

-3

0

5

dB

Ch. 794 /
1986.66771 MHz

-3

0

5

dB

Ch. 810 /
1989.86771 MHz

-3

0

5

dB

Ch. 835 /
1994.86771 MHz

-10

-1

5

dB

GSM1900

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11. Check the "Save to Phone" check box and click Stop if the values are within the limits.

Next actions
Repeat the steps 4 to 10 for GSM850, GSM1800 and GSM1900.

GSM transmitter tunings
Tx IQ tuning (GSM)

Context
The Tx path branches to I and Q signals at RF I/Q modulator. Modulator and analog hardware located after
it cause unequal amplitude and phase disturbance to I and Q signal paths. Tx IQ tuning tuning balances the
I and Q branches.
Tx IQ tuning must be performed on all GSM bands. .

Steps
1. From the dropdown menus, set "Operating mode" to Local, "System mode" to GSM, and Band to GSM900.
2. From the Tuning menu, choose GSM -> Tx IQ Tuning.

3. Set Mode to Automatic and Edge to Off.
4. Click Start.
Wait until automatic tuning has finished and moved the sliders.
Values are written to the phone memory automatically.
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5. When the values have been written to the phone memory, click the Finish button to end the tuning.

6. Change band to GSM850 and repeat steps 4 to 5.
7. Change band to GSM1800 and repeat steps 4 to 5.
8. Change band to GSM1900 and repeat steps 4 to 5.
9. To close the tuning window, click Close.

Next actions
Tuning sliders should be close to the center of the scale after the tuning and within the limits specified in
the table below. If they are not within the limits, check Tx IQ quality manually.
Min

Typ

Max

Unit

I DC offset / Q DC
offset

-6

-4

6

%

Ampl

-1

0

1

dB

Phase

85

90

95

○

GSM850

GSM900
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Min

Typ

Max

Unit

I DC offset / Q DC
offset

-6

-4

6

%

Ampl

-1

0

1

dB

Phase

85

90

95

○

I/Q DC

-6

0.5

6

%

Ampl

-1

0

1

dB

Phase

95

100

110

○

GSM1800/GSM1900

Tx power level tuning (GSM)

Context
Because of variations at IC process and discrete component values, actual transmitter RF gain of each phone
is different. Tx power level tuning is used to find out mapping factors called 'power coefficients’. These adjust
the GSM transmitter output power to fulfill the specifications.
For EDGE transmission the bias settings of the FEM are adjusted in order to improve linearity. This affects the
PA gain and hence the power levels have to be aligned separately for EDGE transmission.
Tx power level tuning has to be performed on all GSM bands.

Steps
1.

Connect the phone to a spectrum analyzer.

2.

From the dropdown menus, set "Operating mode" to Local, "System mode" to GSM, and Band to GSM900.

3.

From the Tuning menu, choose GSM -> Tx Power Level Tuning.

4.

Set Mode to Automatic and Edge to Off.

5.

Set the spectrum analyzer for power level tuning:
Frequency

channel frequency (836.6MHz GSM850, 897.4MHz
GSM900, 1747.8MHz GSM1800, 1880MHz
GSM1900)

Span

0 Hz

Sweep time

2ms

Trigger

Video triggering (-10dBm)

Resolution BW

3MHz

Video BW

3MHz

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Reference level offset

sum cable attenuation with module jig
attenuation

Reference level

33dBm

A power meter with a peak power detector can be also used. Remember to take the attenuations in the
account!
6.

Click Start.

7.

Adjust power levels 5, 15 and 19 to correspond the "Target dBm" column by pressing + or – keys.

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8.

Click Calculate Coefficients.

9.

Check that the coeffiecient values are within the limits specified in the following table.
Min

Typ

Max

0.45

0.626

0.73

GSM850 EDGE off
PL5 coefficient
PL15 coefficient
PL19 coefficient

0.234
0.12

0.195

0.3

0.35

0.419

0.6

GSM850 EDGE on
PL8 coefficient
PL15 coefficient
PL19 coefficient

0.247
0.12

0.204

0.3

0.45

0.626

0.73

GSM900 EDGE off
PL5 coefficient
PL15 coefficient
PL19 coefficient

0.234
0.12

0.195

0.3

0.35

0.419

0.6

GSM900 EDGE on
PL8 coefficient
PL15 coefficient
PL19 coefficient

0.247
0.12

0.204

0.3

0.45

0.51

0.7

GSM1800 EDGE off
PL0 coefficient

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Min
PL11 coefficient
PL15 coefficient

Nokia Customer Care
Typ

Max

0.219
0.12

0.185

0.3

0.35

0.394

0.6

GSM1800 EDGE on
PL2 coefficient
PL11 coefficient
PL15 coefficient

0.23
0.12

0.194

0.3

0.45

0.482

0.7

GSM1900 EDGE off
PL0 coefficient
PL11 coefficient
PL15 coefficient

0.218
0.12

0.184

0.3

0.35

0.377

0.6

GSM1900 EDGE on
PL2 coefficient
PL11 coefficient
PL15 coefficient

0.23
0.12

0.193

0.3

If the values are within the limits, check that the "Save to Phone Permanent Memory" check box is
checked and click Stop.

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10. Set Edge mode on and start tuning again. Change video averaging to 50.

11. Tune EDGE power levels to the corresponding target power levels.
Only power levels 8, 15 and 19 are tuned in GSM900 and 2, 10 and 15 in GSM1800/1900. The rest are
calculated by clicking the Calculate Coefficients button. Check the coefficients against the RF tuning limits
table presented in Step 9.
12. When the tuning is completed, click Stop.

Next actions
Repeat steps 4 to 9 for GSM1800 and GSM1900. On those bands only power levels 0, 11 and 15 need to be
tuned.

RM-188 WLAN troubleshooting
Introduction to WLAN troubleshooting
The main problem that can occur is malfunction in WLAN or WLAN ASICs or WLAN SMD components. Such
problems are unpredictable and may have many causes, either HW or SW related.
Note: While WLAN power tuning is not possible without power meter especially capable for
measuring WLAN wideband power, WLAN ICs (WLAN IC and WLAN front-end module) shall not be
changed.

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Figure 53 WLAN layout part 1

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Figure 54 WLAN layout part 2

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WLAN functionality test using SB-7 and Phoenix

Steps
1. Place the phone on the SB-7 WLAN test box (see figure below). The coordinates are P1 (upper left corner
of SS-62), G1, O15 and G15.

2. Start Phoenix service software and turn the phone to the local mode.
3. From the Testing menu, choose WLAN Configuration. The following window should come up:

4. Turn the Power state: On and press Scan.
5. After few seconds, a list of found WLAN networks should be updated. If WLAN is working, at least a station
with an SSID name default should be found.
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WLAN failure troubleshooting

Troubleshooting flow

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8 — System Module

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System Module

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Table of Contents
Baseband description ............................................................................................................................................8–5
System module block diagram ........................................................................................................................8–5
Baseband functional description.....................................................................................................................8–6
Absolute maximum ratings..............................................................................................................................8–7
Phone modes of operation...............................................................................................................................8–7
Power distribution ............................................................................................................................................8–8
Bluetooth ...........................................................................................................................................................8–8
USB ......................................................................................................................................................................8–9
RM-188 WLAN.....................................................................................................................................................8–9
MR sensor ........................................................................................................................................................ 8–10
FM radio........................................................................................................................................................... 8–11
Camera............................................................................................................................................................. 8–11
Backup battery................................................................................................................................................ 8–11
CBUS interface................................................................................................................................................. 8–11
FBUS ................................................................................................................................................................. 8–11
ACI interface.................................................................................................................................................... 8–11
VOUT interface ................................................................................................................................................ 8–11
Charger interface............................................................................................................................................ 8–11
MicroSD interface............................................................................................................................................ 8–11
SIM/USIM.......................................................................................................................................................... 8–11
Battery interface............................................................................................................................................. 8–12
User interface.................................................................................................................................................. 8–13
Main display ............................................................................................................................................... 8–13
Cover display.............................................................................................................................................. 8–14
Keyboard .................................................................................................................................................... 8–14
Backlights................................................................................................................................................... 8–14
ASICs................................................................................................................................................................. 8–15
RAP ASIC...................................................................................................................................................... 8–15
EM ASIC (N2200)......................................................................................................................................... 8–15
EM ASIC (N2300)......................................................................................................................................... 8–15
Device memories ............................................................................................................................................ 8–15
RAPGSM memories NOR flash and SDRAM ............................................................................................... 8–15
Audio concept ...................................................................................................................................................... 8–15
Audio HW architecture................................................................................................................................... 8–15
Internal microphone ...................................................................................................................................... 8–16
External microphone...................................................................................................................................... 8–16
Internal earpiece ............................................................................................................................................ 8–17
Internal speakers............................................................................................................................................ 8–17
External earpiece............................................................................................................................................ 8–17
Vibra circuitry ................................................................................................................................................. 8–18
Baseband technical specifications..................................................................................................................... 8–18
External interfaces ......................................................................................................................................... 8–18
Pop-portTM connector ................................................................................................................................... 8–19
VOUT electrical characteristics ...................................................................................................................... 8–20
CBUS connections and electrical characteristics.......................................................................................... 8–20
USB/FBUS connections and electrical characteristics.................................................................................. 8–21
Audio signal electrical characteristics.......................................................................................................... 8–21
Charger connector and charging interface connections & electrical characteristics .............................. 8–21
Battery connector and interface connections & electrical characteristics ............................................... 8–22
Internal interfaces.......................................................................................................................................... 8–22
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Upper block connectors ................................................................................................................................. 8–23
Back-up battery interface connections and electrical characteristics ...................................................... 8–24
RF description ...................................................................................................................................................... 8–24
Introduction to receiver functionality.......................................................................................................... 8–24
GSM receiver.................................................................................................................................................... 8–24
Introduction to transmitter functionality.................................................................................................... 8–25
GSM transmitter.............................................................................................................................................. 8–25
GSM FEM (front end module) ......................................................................................................................... 8–26
Frequency synthesizers ................................................................................................................................. 8–26
Regulators....................................................................................................................................................... 8–26
Frequency mappings........................................................................................................................................... 8–27
GSM850 frequencies ....................................................................................................................................... 8–27
EGSM900 frequencies ..................................................................................................................................... 8–27
GSM1800 frequencies..................................................................................................................................... 8–28
GSM1900 frequencies..................................................................................................................................... 8–30

List of Tables
Table 15 Battery interface connections ............................................................................................................ 8–12
Table 16 Audio connector pin assignments ..................................................................................................... 8–19
Table 17 Charging interface connections ......................................................................................................... 8–21
Table 18 Charging IF electrical characteristics ................................................................................................. 8–22
Table 19 Battery interface connections ............................................................................................................ 8–22
Table 20 Battery IF electrical characteristics .................................................................................................... 8–22
Table 21 Back-up battery connections.............................................................................................................. 8–24
Table 22 Back-up battery electrical characteristics ......................................................................................... 8–24

List of Figures
Figure 55 System level block diagram .................................................................................................................8–6
Figure 56 RM-188/198 functional block diagram ...............................................................................................8–7
Figure 57 RM-188 WLAN block description ....................................................................................................... 8–10
Figure 58 MR sensor connection ........................................................................................................................ 8–10
Figure 59 Battery pin order ................................................................................................................................ 8–12
Figure 60 Main display LCD module................................................................................................................... 8–13
Figure 61 Cover display LCD module.................................................................................................................. 8–14
Figure 62 Audio block diagram.......................................................................................................................... 8–16
Figure 63 Internal microphone circuitry........................................................................................................... 8–16
Figure 64 Internal earpiece circuitry ................................................................................................................. 8–17
Figure 65 Internal speaker circuitry .................................................................................................................. 8–17
Figure 66 External earpiece circuitry (Pop-Port connected on the right)...................................................... 8–18
Figure 67 Vibra circuitry ..................................................................................................................................... 8–18
Figure 68 External audio connector .................................................................................................................. 8–19
Figure 69 Battery connector............................................................................................................................... 8–22
Figure 70 GSM transmitter.................................................................................................................................. 8–25

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Baseband description
System module block diagram
RM-188/RM-198 has two blocks, upper block and lower block. The upper block consists of upper PWB module.
The lower block consists of Engine (BB/RF) PWB module.
The upper block is connected to the lower block (BB/RF module) via a 40-pin connector and a flex cable.
Most of the BB parts (also IHF, RF, WLAN and BT) are on the topside of the Engine Module. FM parts, external
audio small components, MR sensor, upper block connector and keyboard are on the backside of the Engine
Module. Accessories and charger can be connected via the Pop-Port™ connector and the charger connector
at the bottom of the phone.
Upper PWB Module consists of two Displays, Earpiece, Camera, HWA, two DC/DC converters and one regulator
and connector to Engine Module.
Note: In this description, user interface HW (UI HW) covers display, camera, keyboard and keyboard
backlight.
The RM-188 includes WLAN, but it does not include the HAC (Hearing Aid Coil).
The RM-198 does not include WLAN, and it can be assembled with or without the HAC.

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Figure 55 System level block diagram

Baseband functional description
Digital baseband consists of ISA based modem and application sections. Modem functionality is in RAPGSM
ASIC.
The modem section consists of RAPGSM ASIC and NOR Flash and DRAM memory as the core. NOR Flash and
DRAM memories are in one package (Combo) RAPGSM supports cellular protocols of GSM (minimum EDGE glass
10, GPRS phase2). Modem DRAM memory has 128Mbits of memory and NOR flash has 256Mbits of memory.
RAPGSM operates with the system clock of 38.4 MHz, which comes from the VCTCXO.

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Figure 56 RM-188/198 functional block diagram

Absolute maximum ratings
Signal
Battery voltage (idle)

Min

Nom

-0.3

Battery voltage (Call)
Charger input voltage

-0.3

Back-Up supply voltage

0

2.5

Max

Uni
t

+4.5

V

Battery voltage maximum value is
specified during charging is active

+4.3

V

Battery voltage maximum value is
specified during charging is active

+16V

V

2.7

V

Notes

Maximum capacity of the backup
power supply assumed to be 4 µAh.

Phone modes of operation
Mode

Description

NO_SUPPLY

(dead) mode means that the main battery is not present or its voltage is too low (below
EM ASIC (N2200) master reset threshold) and that the back-up battery voltage is too
low.

BACK_UP

The main battery is not present or its voltage is too low but back-up battery voltage is
adequate and the 32kHz oscillator is running (RTC is on).

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Mode

Description

PWR_OFF

In this mode (warm), the main battery is present and its voltage is over EM ASIC (N2200)
master reset threshold. All regulators are disabled, PurX is on low state, the RTC is on
and the oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm),
but the RTC and the oscillator are off.

RESET

RESET mode is a synonym for start-up sequence. RESET mode uses 32kHz clock to count
the REST mode delay (typically 16ms).

SLEEP

SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s
activity is low.

Voltage limits
Parameter

Description

Value

VMSTR

Master reset threshold (EM ASIC N2200)

2.2V (typ.)

VMSTR+

Threshold for charging, rising (EM ASIC N2300)

2.1V (typ.)

VMSTR-

Threshold for charging, falling (EM ASIC N2300)

1.9V (typ.)

VCOFF+

Hardware cutoff (rising)

2.9V (typ.)

VCOFF-

Hardware cutoff (falling)

2.6V (typ.)

SWCOFF

SW cutoff limit

~3.2V

Power key
The system boots up when power key is pressed (adequate battery voltage, VBAT, present).
Power down can be initiated by pressing the power key again (the system is powered down with the aid of
SW).

Power distribution
Power supply components:
•
•
•
•
•

RETU
TAHVO
BT LDO
MicroSD LDO
backlight SMPSs

All the above are powered by the main battery voltage.
Battery voltage is also used on the RF side for power amplifiers (GSM PA) and for RF ASIC Ahne.
Discrete power supplies are used to generate 1.8V for the camera module, 2.85V for MicroSD card and max.
18V for backlight LEDs.
The device supports both 1.8V/3V SIM cards.

Bluetooth
Bluetooth provides a fully digital link for communication between a master unit and one or more slave units.
The system provides a radio link that offers a high degree of flexibility to support various applications and
product scenarios. Data and control interface for a low power RF module is provided. Data rate is regulated
between the master and the slave.
The device Bluetooth is based on BC4 ROM1.0RDL BT chip.
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USB
USB (Universal Serial Bus) provides a wired connectivity between host PC and peripheral devices.
USB is a differential serial bus for USB devices. USB controller (RAP) supports USB specification revision 2.0
with full speed USB (12 Mbps). The device is connected to the USB host through the system connector. The
USB bus is hot plugged capable, which means that USB devices may be plugged in/out at any time.

RM-188 WLAN
WLAN is divided to STLC4550 WLAN transceiver module and radio front-end module RF5924.
STMicroelectronics STLC4550 is a three-die multichip module with passive components, partitioned to radio,
baseband and energy management die.
STLC4550 implements 802.11b/g WLAN radio, which conforms to the IEEE 802.11b/g protocols operating in
2.4 GHz band and supporting OFDM data rates of 54, 48, 36, 24, 18, 12, 9, and 6 Mbps, CCK data rates of 11
and 5.5 Mbps, and legacy data rates of 2 and 1 Mbps. IEEE802.11e/i protocol extensions are included to
implement Quality of Service (QoS) and security functions.
STLC4550 has a fully integrated radio chip including a direct-conversion transceiver, RF synthesizer and VCO,
and high-speed data converters. Digital interface is used for transferring the sampled data between radio
and baseband chip.
The baseband chip implements OFDM/CCK digital baseband processor and ARM9-based MAC with internal
SRAM memories. The baseband includes required logic and interfaces to enable time-shared simultaneous
use of BT and WLAN.
The energy management unit integrates the required power management functions to operate the system
from VBAT (3.0 – 5.5 V). The EM unit generates 1.2 V digital core voltage, two 1.8 V supplies for RF and 2.8 V
LDO for PA bias supply. The EM unit integrates the power-on reset circuitry and level-shifters for RF front-end
GaAs switches.
The host interface is provided by a flexible serial interface (SPI).
The system uses 38.4 MHz reference clock. Low-power sleep mode operation is enabled by low-speed 32 kHz
clock (32768 Hz), and energy management unit low-current stand-by mode.
The RFMD RF5924 Front-End Module (FEM) is a single integrated module. The FEM has integrated b/g power
amplifier, power detector, RX balun and TX filtering.

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Figure 57 RM-188 WLAN block description

MR sensor
MR sensor is used to monitor the position of the upper block in fold construction.
MR sensor detects the fold position. There is a magnet in fold mechanics under the display module and when
the fold is closed MR sensor is in magnetic field.

Figure 58 MR sensor connection

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FM radio
The FM radio circuitry is implemented using a highly integrated radio TEA5760 N1C.
The antenna of the FM Radio is created with the headset. The wires of the headset are used as poles of the
antenna.

Camera
The device uses SMIA65 camera module. SMIA65 is 0.3Mpixel with sensor resolution of 656 x 496.
The camera is powered by using VIO(1.8V) and VAUX(2.78V) voltages from the engine board.

Backup battery
When the main battery is not attached EM ASIC (N2200) goes in backup mode using back-up battery that
supplies voltage to RTC in EM ASIC (N2200).

CBUS interface
CBUS is a "main" system control bus in BB5.0. RAP controls the functionality of EM ASIC (N2200) and EM ASIC
(N2300) ASICs with CBUS.
CBUS is a four-wire half-duplex master-slave interface. In BB5.0 CBUS clock frequency is 2.4 MHz.

FBUS
USB and FBUS have multiplexed interface between EM ASIC (2300) and RAP.

ACI interface
The ACI (Accessory Control Interface) is a point-to-point, bi-directional, single line serial bus.
It has two main features: the insertion and removal detection of an accessory device and acting as a data
bus between phone and accessory, intended for control purposes. A third function of ACI is to identify and
authenticate the accessory.

VOUT interface
Accessory power is supplied by VOUT, a linear low drop-out regulator in EM ASIC (N2300) providing 2.5V at
90mA maximum when active (0.5mA in sleep).

Charger interface
Charging control and charge switch are situated in EM ASIC (N2300).
If the temperature rises too high and the thermal protection is activated, EM ASIC (N2300) goes to protection
mode.

MicroSD interface
The MicroSD card interface is electrically and functionally compatible with the SD card interface.

SIM/USIM
The device has one SIM (Subscriber Identification Module) interface and the SIM card locates under the battery.
SIM interface consists of internal interface between RAP and EM ASIC (N2200) and an external interface
between Retu and SIM contacts.
EM ASIC (N2200) external SIM IF connections and electrical characteristics between ASICs are shown in the
picture.

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SIM interface voltage is first 1.8V when the SIM card is inserted and if the card does not response to the ATR
(answer to reset) 3V interface voltage is used.

Battery interface
The battery interface supports a 3-pole battery interface. The interface consists of three connectors: VBAT,
BSI and GND.
The BSI line is used to recognize the battery capacity by a battery internal pull down resistor.

Figure 59 Battery pin order
Table 15 Battery interface connections

Pin

Signal

I/O

Engine connection

Notes

1

VBAT

->

EM ASIC N2200

VBAT

Battery voltage

2

BSI

->

EM ASIC N2200

BSI

Battery size
indication
(fixed resistor
inside the
battery pack)

3

GND

GND

Ground

Battery temperature is estimated by measuring separate battery temperature NTC via the BTEMP line, which
is located on the transceiver PWB, at a place where the phone temperature is most stable.
For service purposes, the device SW can be forced into local mode by using pull down resistors connected to
the BSI line.

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User interface

Main display

Figure 60 Main display LCD module

Display features:
• Main display: 128x160 262k CSTN passive LCD.
• Transmissive type, screen is 'black' when display illumination is OFF.
• Active area is 28.032 mm x 35.040 mm.
• Partial display function Power saving by pausing display process on part of the screen.
• Build-in RAM capacity 128x160x18bit

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Cover display

Figure 61 Cover display LCD module

Display features:
•
•
•
•
•

Module size (width x height x thickness): 26.0 mm x 26.0 mm x 2.6 mm.
96x68 FSTN, 2 colors black & white with blue LEDs.
Transflective, normally black, inverted.
Partial display function; power saving by pausing display process on part of the screen.
68 x 96 bits RAM.

The display module does not require any tunings in service.

Keyboard
The device keyboard consists of 24 separate keys.
The keyboard is implemented as a matrix keyboard, which is connected directly to the dedicated keyboard
GENIO lines. The power-on key is the same key as the "END" key (when pressed longer -> power OFF or ON).
The keymatrix has six rows and four columns.

Backlights
The main display has two white LEDs and the secondary display has two blue LEDs for display backlight inside
of the display module. Voltage source for backlights is implemented using a white LED driver on the lower
block, which is also used for keyboard backlight.
There is NPN digital transistor which controls which display is lighted at the time. The transistor is controlled
by GENIO03. There is no possibility to turn both display backlights on in the same time.
The driver increases battery voltage up to 18V.
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There are four LEDs in two series for keyboard backlight.

ASICs

RAP ASIC
RAP is a GSM EDGE chip (modem ASIC) with lots of peripheral features:
•
•
•
•
•
•

processor subsystem (PSS) that includes ARM926 MCU as a main processor
DSP and related functions
ASIC clock and reset control
MCU peripherals e.g. CBUS IF, USB IF and SIM IF
DSP peripherals e.g. speech codec
RF codec

EM ASIC (N2200)
EM ASIC (N2200) includes the following functional blocks:
•
•
•
•
•
•
•
•
•
•
•

Start up logic and reset control
Charger detection
Battery voltage monitoring
32.768 kHz clock with external crystal
Real time clock with external backup battery
SIM card interface
Stereo audio codecs and amplifiers
A/D converter
Regulators
Vibra interface
Digital interface (CBUS)

EM ASIC (N2300)
EM ASIC (N2300) is intended for energy management control, supply voltage generation and charge control
of mobile phone.

Device memories

RAPGSM memories NOR flash and SDRAM
Modem memory consists of 128Mbit SDRAM and 256 Mbit NOR flash memory.

Audio concept
Audio HW architecture
The functional core of the audio hardware is built around two ASICs: RAPGSM engine ASIC and the mixedsignal ASIC Retu.
There are three audio transducers:
• 7x11 mm dynamic earpiece
• one 11x15 mm dynamic speaker
• electret microphone module
Note: The RM-188 does not include the HAC (Hearing Aid Coil).
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The RM-198 can be assembled with or without the HAC.

Figure 62 Audio block diagram

Internal microphone
Internal microphone is used for HandPortable (HP) and Internal HandsFree (IHF) call modes.
An analogue electret microphone is connected to N2200 Mic1P and Mic1N inputs via asymmetric electrical
connection.

Figure 63 Internal microphone circuitry

External microphone
Galvanic accessories are connected to the system connector.
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The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated
phone accessories.

Internal earpiece
Internal earpiece is used for the HandPortable (HP) call mode. A dynamic 8mm earpiece capsule is connected
to EM ASIC’s (N2200) differential output EarP and EarN.
Note: The RM-188 does not include the HAC (Hearing Aid Coil).
The RM-198 can be assembled with or without the HAC.

Figure 64 Internal earpiece circuitry

Internal speakers
Internal speakers are used for Internal HandsFree (IHF) call mode, ringing tones, FM-radio and music listening.
The dynamic 11x15mm speaker is connected to Retu ASIC’s outputs HFSp P/N.

Figure 65 Internal speaker circuitry

External earpiece
All galvanic accessories are connected to the system connector (Pop-Port™).
The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated
phone accessories.
Xear lines have 10 Ω series resistors in each line.

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Figure 66 External earpiece circuitry (Pop-Port™ connected on the right)

Vibra circuitry
Vibra is used for vibra-alarm function.
A vibra lifter is used to connect the vibra to the main PWB. The vibra underlay is a simple PWB piece.

Figure 67 Vibra circuitry

Baseband technical specifications
External interfaces
Name of Connection

Connector reference

USB

X2000

Charger

X2002 and X2000

SIM

X2701

MicroSD

X3200

Battery connector

X2070

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Name of Connection

Connector reference

SIM

X2701

Pop-portTM connector
Pop-PortTM connector provides a fully differential 4–wire stereo line-level output connection and fully
differential 2-wire mono line-level or microphone level input connection.
The earpiece and headset signals are multiplexed so that the outputs cannot be used simultaneously.

Figure 68 External audio connector
Table 16 Audio connector pin assignments

Pin #/ Signal
name

Signal
description

Spectral range

Voltage/
Current levels

Max or
nominal serial
impedance

Notes

1/ Charge

V Charge

DC

0-9V/ 0.85A

2/ GND

Charge GND

-

0.85A

100mΩ (PWB+
conn.)

3/ ACI

ACI

1kbits/s

Digital 0 /

47Ω

Insertion &
removal
detection

100mΩ (PWB+
conn.)

200mW

2.5-2.78V
4/ Vout

DC out

DC

2.78V 70 mA
2.5V 90mA

9 / XMIC N

Audio in

300-8k

1Vpp &
2.5-2.78VDC

10 / XMIC P

Audio in

300-8k

1Vpp &
2.5-2.78VDC

11 / HEAR N

Audio out

20-20k

1Vpp

22Ω

12 / HEAR P

Audio out

20-20k

1Vpp

22Ω

13 / HEAR R N

Audio out

20-20k

1Vpp

22Ω

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Not conn. in
mono
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Pin #/ Signal
name

Signal
description

14 / HEAR R P

Audio out

Spectral range

Voltage/
Current levels

Max or
nominal serial
impedance

20-20k

1Vpp

22Ω

Notes

Not conn. in
mono

VOUT electrical characteristics
Description

Parameter

Vout regulator for
external
accessories

VOUT

Min

Max

2.43

2.57

Typical
2.5

Unit

Notes

V

Max load 90mA

CBUS connections and electrical characteristics

CBUS connections
Pin name
RAPGSM

I/O

CbusDa

RAPGSM

<->

CbusClk

RAPGSM

->

CbusEn1X

->

Connection

Notes

Retu

Serdata

Tahvo/FMradio

CbusData

Retu

SerClk

Tahvo/FMradio

CbusClk

Retu

Sersel

Cbus data

Cbus clock, 2.4
MHz
Cbus enable

CBUS electrical characteristics
Description
High-level
input voltage

Parameter

Min

Typ

Max

Unit

VIH

0.7 x VDDS

VDDS

V

Low-level
input voltage

VIL

0

0.3 x
VDDS

V

High-level
output
voltage

VOH

0.8 x VDDS

VDDS

V

Low-level
output
voltage

VOL

0

0.22 x
VDDS

V

Frequency,
CbusClk

f

1

2.5

MHz

Notes
RAPGSM specific

(VDDS = 1.8V)

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Description
Rise and fall
time

Nokia Customer Care
Parameter

Min

Typ

Max

Unit

tR/tF

Notes
Tahvo specific

CLK, DaOut,
EnX

6

ns

DaIn

25

ns

USB/FBUS connections and electrical characteristics
The USB operates in the low-power bus-mode only. The USB host provides VBUS voltage (5V, 100mA at
maximum) to USB device.

Audio signal electrical characteristics
Description

Parameter

Typ

Unit

Notes

XMIC N

Audio in

1

Vpp

DC Offset 2.5-2.78V

XMIC P

Audio in

1

Vpp

DC Offset 2.5-2.78V

HSEAR N

Audio out

1

Vpp

22Ω nominal serial
impedance

HSEAR P

Audio out

1

Vpp

22Ω nominal serial
impedance

HSEAR R N

Audio out

1

Vpp

22Ω nominal serial
impedance
Not connected in
mono

HSEAR R P

Audio out

1

Vpp

22Ω nominal serial
impedance
Not connected in
mono

Charger connector and charging interface connections & electrical characteristics
Table 17 Charging interface connections

Pin

Signal

1

Vchar

2

Charge GND

Issue 2

I/O
In

Engine connection
EM ASIC
(N2300)

VCharIn1, 2

Ground

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Notes
Charging
voltage /
charger
detection,
Center pin
Charger
ground

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Table 18 Charging IF electrical characteristics

Description

Parameter

Vchar

V Charge

Vchar

I Charge

Min
0

Charge GND

Max

Unit

Notes

16

V

Center pin

0.95

A

Center pin

0.85

A

Battery connector and interface connections & electrical characteristics

Figure 69 Battery connector
Table 19 Battery interface connections

Pin

Signal

I/O

Engine connection

Notes

1

VBAT

->

EM ASIC N2200

VBAT

Battery voltage

2

BSI

->

EM ASIC N2200

BSI

Battery size
indication
(fixed resistor
inside the
battery pack)

3

GND

GND

Ground

Table 20 Battery IF electrical characteristics

Description

Parameter

Max

Unit

Operation voltage

VIN

4.23

VDC

Current rating

IIN

0.9

A

Internal interfaces
Name of Connection
UI connector

Connector reference

Notes

X2400

Lower block

X1000

Upper block

Display Suez

X1100

Upper block

Display Naxos

X1101

Upper block

Camera

X1470

Upper block (through hole
socket)

Vibra

A2102

Lower block

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Name of Connection

Connector reference

Notes

Microphone

B2100

Lower block

Earpiece

B1200

Upper block

IHF speaker

X7506

Upper block

Upper block connectors
Pin number,
connector X1000

Destination

Name of the
line/signal

NOTES

2-5

Main display, X2000

Messi0-3, Data
lines

7

Earpiece, B1600

EARP

8

Earpiece, B1600

EARN

10

Main display, X2000

LCDTE

11

X3000, X2100,
X2000

VAUX, analogue
power supply

12

Camera, X3000

CAM_ENABLE,
shutdown

12

Secondary display,
X2100

LCDCS2X, Chip
select

14

Main (X2000) and
secondary (X2100)
display

LCD_RESX, Reset

16

Camera, X3000

CAM_CLK, clock

17

Camera, X3000

CCISCL, serial
clock

18

Camera, X3000

CCISDA, serial
data

21

Main (X2000) and
secondary (X2100)
display

VLEDOUT1,
display lights
supply

22

Main (X2000) and
secondary (X2100)
display

SETCURR1,
display light
return current

24

Camera, X3000

CCPDataP

Differential
data line

25

Camera, X3000

CCPDataN

Differential
data line

27

Camera, X3000

CCPCLKP

Differential
data line

28

Camera, X3000

CCPCLKN

Differential
data line

Issue 2

2.8V

9.6MHz

6-11V
depends on
display

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Pin number,
connector X1000

Destination

Name of the
line/signal

NOTES

30

X3000, X2100,
X2000

VIO, digital
power supply

1.8V

31

Main (X2000) and
secondary (X2100)
display

WRX/SDA, Clock
for main and
Data for
secondary
display

WRx 9.6Mhz

33

Main display, X2000

DIFRDx, read
select

34

Main display, X2000

DIFCSx, Chip
select

35

Main (X2000) and
secondary (X2100)
display

DIFDCx / SCL,
data/command
main and clock
for secondary
display

36-39

Main display, X2000

Messi7-4, Data
lines

Back-up battery interface connections and electrical characteristics
Table 21 Back-up battery connections

Pin name
VBack

I/O
->

Connection

Notes

N2200,
VBack

Table 22 Back-up battery electrical characteristics

Description Parameter
Back-Up
Battery
Voltage

Vback

Min
0

Typ
2.5

Max
2.7

Unit
V

RF description
Introduction to receiver functionality
Receiver functions are implemented in RF ASIC N7505.
The receiver is a linear direct conversion receiver consisting of separate front ends (LNA (Low Noise Amplifier)
and demodulator) for each supported system. After the demodulators, the signal paths are combined to one
common BB path.

GSM receiver
As GSM850, GSM900, GSM1800, GSM1900 Rx branches are functionally identical, the following description is
applicable to all of them.
Page 8 –24

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The received signal goes from the GSM antenna to the front end module (FEM) which includes switches from
band selection. FEM is followed by dedicated SAW filters which are dual packaged so that one holds SAWs for
850 and 900 and the other for 1800 and 1900 bands. The SAW filters are followed by integrated LNAs residing
in N7505.
The LNAs are followed by demodulators which downconvert the signal to baseband I and Q signals.
The channel select filter is set to 115 kHz in the GSM mode.

Introduction to transmitter functionality
Transmitter functions are implemented in the RF ASIC N7505. The ASIC contains a BB frequency low pass filter,
which is tunable according to the signal bandwidth of the system in use.

GSM transmitter
N7505 receives an analogue IQ modulated signal from digital BB, which is first low pass filtered with filter
corner frequency set to approximately 200 kHz. After the filter, the signal is routed to the GSM modulator.
The amplifier gives 40 dB of power control dynamic range.
The appropriate routing after the modulator is selected by biasing either EGSM900 (/GSM850) or
GSM1800/1900 variable gain amplifier. The amplifier gives 40 dB of power control dynamic range.
After the VGA stage the signal exits N7505. In case of GSM1800/1900 the signal goes directly to the FEM thru
a balun, which converts single ended signal into balanced signal needed to feed the FEM. In case of GSM850
and EGSM900 the PA module is preceded by a SAW filter.
TX SAW Z7503 is also dual packaged so that the correct band is selected with control voltage coming from
N7505. SAW also performs the unbalanced to balanced signal transformation. After the filter, the signal is
fed to FEM. Finally the signal is routed to the antenna.

Figure 70 GSM transmitter

GSM power control
A closed control loop comprise an integrated power detector (in FEM) and an error amplifier. The error
amplifier resides in N7505 and it controls the transmitter power of GSM.

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GSM FEM (front end module)
A single GSM/EDGE FEM contains two separate amplifier chains, one for EGSM900 and GSM850 and another
for GSM1800/1900.

Frequency synthesizers
RF ASIC N7505 has a single synthesizer that is used to generate right frequencies for both TX and RX.

Reference oscillators
A 38.4MHz VCTCXO is used as a reference oscillator for the frequency synthesizers.

Regulators
N7505 contains integrated regulators to supply regulated voltages for their internal circuitry and other RF
parts.

Page 8 –26

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Frequency mappings
GSM850 frequencies

Issue 2

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EGSM900 frequencies

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GSM1800 frequencies

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GSM1900 frequencies

Page 8 –30

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9 — RM-188/198 schematics

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Table of Contents
RM-188/198 system connector .............................................................................................................................9–4
RM-188/198 Retu, Tahvo, LED driver ....................................................................................................................9–5
RM-188/198 RAPGSM, memories, FM radio, microSD ..........................................................................................9–6
RM-188/198 WLAN, Bluetooth...............................................................................................................................9–7
RM-188/198 user interface ....................................................................................................................................9–8
RM-188/198 flip PWB .............................................................................................................................................9–9
RM-188/198 RF part............................................................................................................................................. 9–10
RM-188/198 signal overview.............................................................................................................................. 9–11
RM-188/198 component finder.......................................................................................................................... 9–12

Issue 2

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RM-188/198 system connector

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Copyright © 2007 Nokia. All rights reserved.

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Nokia Customer Care

RM-188/198 Retu, Tahvo, LED driver

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

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RM-188/198 RAPGSM, memories, FM radio, microSD

Issue 2

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RM-188/198 WLAN, Bluetooth

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

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RM-188/198 user interface

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

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RM-188/198 flip PWB

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Copyright © 2007 Nokia. All rights reserved.

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RM-188/198 RF part

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Copyright © 2007 Nokia. All rights reserved.

Page 9 –10

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RM-188/198 signal overview

Issue 2

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Copyright © 2007 Nokia. All rights reserved.

Page 9 –11

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RM-188/198 component finder

Issue 2

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Page 9 –12

Nokia Customer Care

Glossary

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A/D-converter

Analog-to-digital converter

ACI

Accessory Control Interface

ADC

Analog-to-digital converter

ADSP

Application DPS (expected to run high level tasks)

AGC

Automatic gain control (maintains volume)

ALS

Ambient light sensor

AMSL

After Market Service Leader

ARM

Advanced RISC Machines

ARPU

Average revenue per user (per month or per year)

ASIC

Application Specific Integrated Circuit

ASIP

Application Specific Interface Protector

B2B

Board to board, connector between PWB and UI board

BB

Baseband

BC02

Bluetooth module made by CSR

BIQUAD

Bi-quadratic ,type of filter function)

BSI

Battery Size Indicator

BT

Bluetooth

CBus

MCU controlled serial bus connected to UPP_WD2,UEME and Zocus

CCP

Compact Camera Port

CDSP

Cellular DSP (expected to run at low levels)

CLDC

Connected limited device configuration

CMOS

Complimentary metal-oxide semiconductor circuit (low power consumption)

COF

Chip on Foil

COG

Chip on Glass

CPU

Central Processing Unit

CSR

cambridge silicon radio

CSTN

Color Super Twisted Nematic

CTSI

Clock Timing Sleep and interrupt block of Tiku

CW

Continuous wave

D/A-converter

Digital-to-analouge converter

DAC

Digital-to-analouge converter

DBI

Digital Battery Interface

DBus

DSP controlled serial bus connected between UPP_WD2 and Helgo

DCT-4

Digital Core Technology

DMA

Direct memory access

DP

Data Package

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DPLL

Digital Phase Locked Loop

DSP

Digital Signal Processor

DtoS

Differential to Single ended

EDGE

Enhanced data rates for global/GSM evaluation

EGSM

Extended GSM

EM

Energy management

EMC

Electromagnetic compability

EMI

Electromagnetic interference

ESD

Electrostatic discharge

FCI

Functional cover interface

FPS

Flash Programming Tool

FR

Full rate

FSTN

Film compensated super twisted nematic

GND

Ground, conductive mass

GPIB

General-purpose interface bus

GPRS

General Packet Radio Service

GSM

Group Special Mobile/Global System for Mobile communication

HF

Hands free

HFCM

Handsfree Common

HS

Handset

HSCSD

High speed circuit switched data (data transmission connection faster than GSM)

HW

Hardware

I/O

Input/Output

IBAT

Battery current

IC

Integrated circuit

ICHAR

Charger current

IF

Interface

IHF

Integrated hands free

IMEI

International Mobile Equipment Identity

IR

Infrared

IrDA

Infrared Data Associasion

ISA

Intelligent software architecture

JPEG/JPG

Joint Photographic Experts Group

LCD

Liquid Crystal Display

LDO

Low Drop Out

LED

Light-emitting diode

Page Glossary–4

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LPRF

Low Power Radio Frequency

MCU

Micro Controller Unit (microprocessor)

MCU

Multiport control unit

MIC, mic

Microphone

MIDP

Mobile Information Device Profile

MIN

Mobile identification number

MIPS

Million instructions per second

MMC

Multimedia card

MMS

Multimedia messaging service

NTC

Negative temperature coefficient, temperature sensitive resistor used as a
temperature sensor

OMA

Object management architechture

OMAP

Operations, maintenance, and administartion part

Opamp

Operational Amplifier

PA

Power amplifier

PDA

Pocket Data Application

PDA

Personal digital assistant

PDRAM

Program/Data RAM (on chip in Tiku)

Phoenix

Software tool of DCT4.x

PIM

Personal Information Management

PLL

Phase locked loop

PM

(Phone) Permanent memory

PUP

General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX

Power-up reset

PWB

Printed Wiring Board

PWM

Pulse width modulation

RC-filter

Resistance-Capacitance filter

RF

Radio Frequency

RF PopPort TM

Reduced function PopPortTM interface

RFBUS

Serial control Bus For RF

RSK

Right Soft Key

RS-MMC

Reduced size Multi Media Card

RSSI

Receiving signal strength indicator

RST

Reset Switch

RTC

Real Time Clock (provides date and time)

RX

Radio Receiver

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SARAM

Single Access RAM

SAW filter

Surface Acoustic Wave filter

SDRAM

Synchronous Dynamic Random Access Memory

SID

Security ID

SIM

Subscriber Identity Module

SMPS

Switched Mode Power Supply

SNR

Signal-to-noice ratio

SPR

Standard Product requirements

SRAM

Static random access memory

STI

Serial Trace Interface

SW

Software

SWIM

Subscriber/Wallet Identification Module

TCXO

Temperature controlled Oscillator

Tiku

Finnish for Chip, Successor of the UPP

TX

Radio Transmitter

UART

Universal asynchronous receiver/transmitter

UEME

Universal Energy Management chip (Enhanced version)

UEMEK

See UEME

UI

User Interface

UPP

Universal Phone Processor

UPP_WD2

Communicator version of DCT4 system ASIC

USB

Universal Serial Bus

VBAT

Battery voltage

VCHAR

Charger voltage

VCO

Voltage controlled oscillator

VCTCXO

Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO

Voltage Controlled Crystal Oscillator

Vp-p

Peak-to-peak voltage

VSIM

SIM voltage

WAP

Wireless application protocol

WD

Watchdog

XHTML

Extensible hypertext markup language

Zocus

Current sensor, (used to monitor the current flow to and from the battery)

Page Glossary–6

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Issue 2



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