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Nokia Customer Care

Service Manual
RM-596 (Nokia N8-00; L3&4)

Mobile Terminal
Part No: (Issue 2)

COMPANY CONFIDENTIAL

RM-596
Amendment Record Sheet

Amendment Record Sheet
Amendment No

Date

Inserted By

Issue 1

07/2010

Issue 2

08/2010

Page ii

Comments
A minor update has been made to
section Product selection.

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
Copyright

Copyright
Copyright © 2010 Nokia. All rights reserved.
Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form
without the prior written permission of Nokia is prohibited.
Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia
Corporation. Other product and company names mentioned herein may be trademarks or tradenames of
their respective owners.
Nokia operates a policy of continuous development. Nokia reserves the right to make changes and
improvements to any of the products described in this document without prior notice.
Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,
consequential or indirect damages howsoever caused.
The contents of this document are provided "as is". Except as required by applicable law, no warranties of
any kind, either express or implied, including, but not limited to, the implied warranties of merchantability
and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this
document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.
The availability of particular products may vary by region.

IMPORTANT
This document is intended for use by qualified service personnel only.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Page iii

RM-596
Warnings and cautions

Warnings and cautions

Warnings
• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED
WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT
CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,
FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.
• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions
• Servicing and alignment must be undertaken by qualified personnel only.
• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.
• Use only approved components as specified in the parts list.
• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and
alignment.
• Ensure all cables and wires are repositioned correctly.
• Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the
measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb
nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.
• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise
GSM or WCDMA PA may be damaged.

Page iv

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
For your safety

For your safety

QUALIFIED SERVICE
Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES
Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES
When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect
incompatible products.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Page v

RM-596
ESD protection

ESD protection
Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing
the phone.
Any product of which the covers are removed must be handled with ESD protection. The SIM card can be
replaced without ESD protection if the product is otherwise ready for use.
To replace the covers ESD protection must be applied.
All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity
discharge.
All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside
any ESD Protected Area (EPA).
Every repair action involving opening the product or handling the product components must be done under
ESD protection.
ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.
For more information and local requirements about ESD protection and ESD Protected Area, contact your local
Nokia After Market Services representative.

Page vi

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
Care and maintenance

Care and maintenance
This product is of superior design and craftsmanship and should be treated with care. The suggestions below
will help you to fulfil any warranty obligations and to enjoy this product for many years.
• Keep the phone and all its parts and accessories out of the reach of small children.
• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that
will corrode electronic circuits.
• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.
• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form
inside, which may damage electronic circuit boards.
• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.
• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.
• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or
attachments could damage the phone and may violate regulations governing radio devices.
All of the above suggestions apply equally to the product, battery, charger or any accessory.

Issue 2

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Page vii

RM-596
Company policy

Company policy
Our policy is of continuous development; details of all technical modifications will be included with service
bulletins.
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If
any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email.
Please state:
• Title of the Document + Issue Number/Date of publication
• Latest Amendment Number (if applicable)
• Page(s) and/or Figure(s) in error

Please send to:
NOKIA CORPORATION
Nokia Mobile Phones Business Group
Nokia Customer Care
PO Box 86
FIN-24101 SALO
Finland
E-mail: Service.Manuals@nokia.com

Page viii

COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
Battery information

Battery information
Note: A new battery's full performance is achieved only after two or three complete charge and
discharge cycles!
The battery can be charged and discharged hundreds of times but it will eventually wear out. When the
operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.
Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers
approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to
a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged
battery will discharge itself over time.
Temperature extremes can affect the ability of your battery to charge.
For good operation times with Li-Ion batteries, discharge the battery from time to time by leaving the product
switched on until it turns itself off (or by using the battery discharge facility of any approved accessory
available for the product). Do not attempt to discharge the battery by any other means.
Use the battery only for its intended purpose.
Never use any charger or battery which is damaged.
Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or
pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example
when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery
or the connecting object.
Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce
the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°
F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.
Batteries' performance is particularly limited in temperatures well below freezing.
Do not dispose of batteries in a fire!
Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Copyright © 2010 Nokia. All rights reserved.

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RM-596
Battery information

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COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
Nokia N8-00; L3&4 Service Manual Structure

Nokia N8-00; L3&4 Service Manual Structure
1 General Information
2 Service Tools and Service Concepts
3 BB Troubleshooting and Manual Tuning Guide
4 Cellular RF troubleshooting
5 Camera Module Troubleshooting
6 System Module
Glossary

Issue 2

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RM-596
Nokia N8-00; L3&4 Service Manual Structure

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COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

Nokia Customer Care

1 — General Information

Issue 2

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RM-596
General Information

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Issue 2

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General Information

Table of Contents
Product selection................................................................................................................................................... 1–5
Product features and sales package.................................................................................................................... 1–5
Product and module list ....................................................................................................................................... 1–9
Mobile enhancements........................................................................................................................................... 1–9
Technical specifications ..................................................................................................................................... 1–11
Transceiver general specifications .............................................................................................................. 1–11
Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/V/IV/II/I phones ........................ 1–11
Battery endurance......................................................................................................................................... 1–13
Environmental conditions ............................................................................................................................ 1–13

List of Tables
Table 1 Audio ......................................................................................................................................................... 1–9
Table 2 Car........................................................................................................................................................... 1–10
Table 3 Data ........................................................................................................................................................ 1–10
Table 4 Messaging .............................................................................................................................................. 1–11
Table 5 Power ..................................................................................................................................................... 1–11

List of Figures
Figure 1 View of RM-596....................................................................................................................................... 1–5

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General Information

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Issue 2

RM-596
General Information

Product selection
RM-596 is a GSM/WCDMA dual-mode handportable monoblock multimedia computer with a capacitive touch
UI, integrated GPS (A-GPS OMA SUPL), WLAN and a TV-out connection. It supports GSM 850/900/1800/1900
and WCDMA I/II/IV/V/VIII bands, GPRS/EGPRS and WCDMA/HSDPA/HSUPA data bearers.
For WCDMA the maximum bit rate is up to 384 kbit/s for downlink and 384 kbit/s for uplink with simultaneous
CS speech or CS video (max. 64 kbit/s). RM-596 supports HSDPA category 9 with downlink peak data rate up
to 10.2 Mbit/s (in limited use cases), HSUPA belongs to category 5 with uplink peak data rate up to 2.0 Mbit/
s (in limited use cases).
In PS/CS mode, RM-596 supports DTM with multi slot class 32 (max. 5 RX + 3 TX, sum 6). With EGPRS this means
maximum download speed of up to 236.8 kbit/s simultaneously with speech. With GPRS this means maximum
download speed of up to 85.6 kbit/s simultaneously with speech.
In PS only mode, RM-596 supports MSC 33 (max. 5 Rx + 4 TX, sum 6) timeslots resulting in maximum download
speed of up to 296 kbit/s with EGPRS, and up to 107 kbit/s with GPRS.
RM-596 has a large AMOLED nHD 3.5” (640 x 360 pixels) colour display (active area 43.2 mm x 76.8 mm) with
16 million colors. It also has a 12 megapixel autofocus camera with Carl Zeiss optics, 2 x digital zoom and an
integrated Xenon flash. The device supports two-way video calls with two integrated cameras, one on the
front and one on the back.
The MMS implementation follows the OMA MMS standard release 1.3. The browser is a highly advanced
Internet browser also capable of viewing operator domain XHTML Mobile Profile (MP) content. The device
also supports Bluetooth 2.1 EDR standard.
RM-596 uses Symbian ^3 for Nokia devices operating system, and supports the full Web Browser for S60,
which brings desktop-like Web browsing experience to mobile devices. It also supports MIDP Java 2.1 ,
providing a good platform for compelling 3rd party applications.

Figure 1 View of RM-596

Product features and sales package

Imaging
Main camera:
• Sensor: 12 megapixel
• Carl Zeiss Optics: Tessar ™ lens
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RM-596
General Information
• F number/Aperture: F2.8
• Digital zoom: 2x
• Auto focus: Two-stage capture key
• Focal length: 28 mm (35 mm equivalent)
• Focus range: 10 cm ~ infinity
• Flash: Integrated Xenon flash
• Macro focus distance: 10-50 cm
• Shutter speed: Mechanical shutter 1/1000~1/4 s
Secondary camera:
• Sensor: VGA (640 x 480 pixels)
• F number/Aperture: F2.8
• Fixed focus
Video:
• Video resolution: nHD 25 fps (720p)
• Audio recording: AAC (AMR for MMS)
• Video stabilization
• Video clip length: Max. 90 min
• Video file format: .mp4 (default), .3gp (for MMS)
• White balance: automatic, sunny, cloudy, incandescent, fluorescent
• Scene: Auto, Night
• Colour tone: normal, sepia, B&W, vivid, negative
• Zoom (digital): 3x
• Video recording indicator
Photo:
• Aspect ratio: 16:9 (9Mpix) , 4:3 (12Mpix)
• View finder: Full screen view finder
• Still image resolutions: up to 12 megapixel: 4000 x 3000
• Still image file format: JPEG/EXIF
• Auto exposure: center weighted AE
• Image orientation: automatic
• Exposure compensation: +2 ~ -2EV at 0.5 step
• White balance: automatic, sunny, cloudy, incandescent, fluorescent
• Scene: auto, sports, portrait, close-up, landscape, night, user defined
• Colour tone: normal, sepia, B&W, vivid, negative
• Zoom (digital): 2x

Edit
• On device Photo editor and Video editor (manual & automatic)

View
• 3.5” nHD (640 x 360 pixels) colour display (active area 43.2 mm x 76.8 mm), up to 16M colors, 16:9 aspect
ratio
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COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
General Information
• Digital Ambient Light Sensor (ALS) – used to optimize display/key brightness and power consumption
• Slideshow from Gallery

Share
• Nokia XpressShare - share effortlessly from Gallery or after capture via Email, Bluetooth or MMS
• Direct connection to TV via cable or WLAN (UPnP)
• Video call and video sharing support. (WCDMA services)
• Online Album: Image/Video uploading from Gallery

Print
• Nokia XpressPrint – direct printing via USB (PictBridge), Bluetooth (BPP), and WLAN (UPnP), from memory
card or via online printing

Store
• 16 GB internal user memory
• Nokia XpressTransfer – easy to transfer and organize photos and video between your device and a
compatible PC
• Nokia Lifeblog (mobile & PC)

Music
• Digital music player: supports MP3/ AAC/ eAAC/ eAAC+/ WMA/ AMR-NB/ AMR-WB with playlists, equalizer
and album art
• Synchronise music with Microsoft Windows Media Player 10 & 11
• One click CD ripping, converting and transferring music to your device using Nokia Music Manager
• Stereo FM radio (87.5-108 MHz /76-90 MHz) with Visual Radio™ support
• Bluetooth speakers
• Integrated handsfree speaker
• Nokia Music Headset (WH-701), inbox

Media
• Full-screen video playback to view downloaded, streamed or recorded video clips
• Supported video formats: MPEG-4 , H.264/AVC, H.263/3GPP, VC-1, Real Video 10, ON2 VP6, Flash video

Productivity
Context management:
• OMA DRM version 2.0
• OTA provisioning & over the air SW update (FOTA)
• Ovi Suite
• Web Browser (OSS), Java ™ MIDP 2.1, XHTML browsing over TCP/IP
Messaging:
• E-mail (SMTP, IMAP4, POP3), MMS, SMS, unified editor
• IM client
Office applications:
• Viewing of email attachments – .doc, .xls, .ppt, .pdf, .zip
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RM-596
General Information
• Mail for Exchange
PIM:
• Contacts, calendar, to-do, notes, recorder, calculator, clock, converter
Synchronization:
• Local/Remote (using SyncML)
• Data: Calendar, Contacts, To-do, Notes, E-mail
• PC Applications: Microsoft Outlook (98, 2000, 2002, 2003), Outlook Express, Lotus Organizer (5.0, 6.0),
Lotus Notes (5.0, 6.0)
Call management:
• Call logs, speed dial, voice dialling (with SIND) and voice commands
• Nokia Push to Talk (PoC)

Connectivity
• Integrated GPS (A-GPS OMA SUPL)
• Nokia Maps 3.0, including Friend Finder
• WLAN - IEEE802.11 g/b/n with UPnP support
• HDMI type C connector
• Micro USB interface with USB 2.0 high speed
• Bluetooth wireless technology 2.1 + EDR + A2DP
• FM transmitter
• MicroSD memory card - support up to 32 GB
• Nokia 3.5 mm AV connector
• 2.0 mm DC connector

Add-on software framework
• Symbian ^3 for Nokia devices
• Java: MIDP2.1
• C++ and Java SDKs
• Flash Lite 4.0

Additional technical specifications
• Vibrating alert
• 3GPP Rel 5/6 WCDMA , Rel 4 EGSM compliant
• Speech codecs supported: AMR, NB AMR, WB AMR, FR, EFR
• GPRS/EGPRS Class B, Multi slot class 33
• Dual Transfer Mode (DTM) class A, multi slot class 32
• WCDMA DL 384 kbit/s, UL 384 kbit/s
• HSDPA up to 10.2 Mbps, HSUPA 2 Mbps

Sales package
• Transceiver RM-596
• Charger (AC-15)
• Battery (BL-4D)
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COMPANY CONFIDENTIAL
Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
General Information
• Music headset (WH-701)
• Connectivity cable (CA-101)
• HDMI adapter (CA-157)
• Micro USB OTG to USB adapter (CA-156)
• CD-ROM
• User Guide

Product and module list
Module name

Type code

System/RF module PWB

Notes

3CE

Upper flex module
UI flex module
Flash flex module

Mobile enhancements
Table 1 Audio

Enhancement

Type

Music headset

WH-701

Nokia Wireless Stereo Gateway

AD-42W

Mini speakers

MD-8
MD-9

Hearing aids

HDA-12
LPS-5

Wired headsets

WH-205
WH-502
WH-700
WH-701
WH-800
WH-900

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RM-596
General Information
Enhancement
Bluetooth headsets

Type
BH-103
BH-214
BH-215
BH-500
BH-501
BH-503
BH-504
BH-505
BH-606
BH-607
BH-702
BH-704
BH-804
BH-805
BH-900
BH-902
BH-904
BH-905

Bluetooth speakers

MD-5W
MD-7W

Table 2 Car

Enhancement

Type

Nokia Universal Mobile Holder

CR-99

Speakerphone

HF-310
HF-510

Mobile charger

DC-9
DC-10
DC-11

Table 3 Data

Enhancement
Connectivity cable

Type
CA-101
CA-101D

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Copyright © 2010 Nokia. All rights reserved.

Issue 2

RM-596
General Information
Enhancement

Type

Micro USB OTG to USB adapter cable

CA-156

HDMI adapter cable

CA-157

MicroSD card

MU-43, 8GB
MU-44, 16GB
MU-xx 32GB

Table 4 Messaging

Enhancement

Type

Other multimedia peripherals

SU-33W

Stylus

STYLUS PEN ASSY

Table 5 Power

Enhancement

Type

Battery 1200 mAh Li-ion

BL-4D

Travel charger

AC-6
AC-8
AC-10
AC-15

Technical specifications
Transceiver general specifications
Unit
Transceiver with BL-4D
1200 mAh Li-ion battery
pack

Dimensions (L x W x T)
(mm)
113.5 x 59.0 x 12.9

Weight (g)
135

Volume (cm3)
86

Main RF characteristics for GSM850/900/1800/1900 and WCDMA VIII/V/IV/II/I phones
Parameter
Cellular system

Issue 2

Unit
GSM850, EGSM900, GSM1800/1900, WCDMA VIII (900), WCDMA V
(850), WCDMA IV (1700/2100), WCDMA II (1900) and WCDMA I
(2100)

COMPANY CONFIDENTIAL
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Page 1 – 11

RM-596
General Information
Parameter
Rx frequency band

Unit
GSM850: 869 - 894MHz
EGSM900: 925 - 960 MHz
GSM1800: 1805 - 1880 MHz
GSM1900: 1930 - 1990 MHz
WCDMA VIII (900): 925 - 960 MHz
WCDMA V (850): 869 - 894 MHz
WCDMA IV (1700/2100): 2110 - 2155 MHz
WCDMA II (1900): 1930 - 1990 MHz
WCDMA I (2100): 2110 - 2170 MHz

Tx frequency band

GSM850: 824 - 849 MHz
EGSM900: 880 - 915 MHz
GSM1800: 1710 - 1785 MHz
GSM1900: 1850 - 1910 MHz
WCDMA VIII (900): 880 - 915 MHz
WCDMA V (850): 824 - 849 MHz
WCDMA IV (1700/2100): 1710 - 1755 MHz
WCDMA II (1900): 1850 - 1910 MHz
WCDMA I (2100): 1920 - 1980 MHz

Output power

GSM850: +5 ...+33 dBm/3.2 mW ... 2 W
GSM900: +5 … +33 dBm/3.2 mW … 2 W
GSM1800: +0 … +30 dBm/1.0 mW … 1 W
GSM1900: +0 … +30 dBm/1.0 mW … 1 W
WCDMA VIII (900): -50 ... +24 dBm/0.01 μW ... 251 mW
WCDMA V (850): -50 ... +24 dBm/0.01 μW ... 251 mW
WCDMA IV (1700/2100): -50 ... +24 dBm/0.01 μW ... 251 mW
WCDMA II (1900): -50 ... +21 dBm/0.01 μW ... 126 mW
WCDMA I (2100): -50 ... +24 dBm/0.01 μW ... 251 mW

EDGE output power

EDGE850: +5 … +27 dBm/3.2 mW … 501 mW
EDGE900: +5 … +27 dBm/3.2 mW … 501 mW
EDGE1800: +0 … +26 dBm/1.0 mW … 398 mW
EDGE1900:+0 … +26d Bm/1.0 mW … 398 mW

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Issue 2

RM-596
General Information
Parameter

Unit

Number of RF channels

GSM850: 124
GSM900: 174
GSM1800: 374
GSM1900: 299
WCDMA VIII (900): 152
WCDMA V (850): 108
WCDMA IV (1700/2100): 211
WCDMA II (1900): 289
WCDMA I (2100): 277

Channel spacing

200 kHz (WCDMA II, IV and V 100/200 kHz)

Number of Tx power levels

GSM850: 15
GSM900: 15
GSM1800: 16
GSM1900: 16
WCDMA VIII (900): 75
WCDMA V (850): 75
WCDMA IV (1700/2100): 75
WCDMA II (1900): 75
WCDMA I (2100): 75

Battery endurance
Battery
BL-4D

Capacity
(mAh)
1200

Talk time

Stand-by

Music playback

Video playback
H.264 720p 30fps

Up to 12 h
(GSM)

Up to 390 h
(GSM)

Up to 6 h
(WCDMA)

Up to 400 h
(WCDMA)

Up to 50 h

Up to 7 h

Environmental conditions

Temperature conditions
Environmental condition

Ambient temperature

Notes

Normal operation

-15oC...+55oC

Specifications fulfilled

Reduced performance

-25oC...-15oC

Operational for shorts periods
only

+55oC...+70oC

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RM-596
General Information
Environmental condition

Ambient temperature

Intermittent operation

-40oC...-15oC
+70oC...+85 oC

Notes
Operation not guaranteed but an
attempt to operate does not
damage the phone.

No operation or storage

<-40oC...>+85oC

No storage or operation: an
attempt may damage the phone.

Charging allowed

-10oC...+60oC

BTemp measurement range for
charging.

Long term storage conditions

0oC...+85oC

Humidity
Relative humidity range is 5...95%.
The HW module is not protected against water. Condensed or splashed water might cause malfunction. Any
submersion of the phone will cause permanent damage. Long-term high humidity, with condensation, will
cause permanent damage because of corrosion.

Vibration
The module should withstand the following vibrations:
• 5 - 10 Hz; +10dB / octave
• 10 - 50 Hz; 5.58 m2 / s3 (0.0558 g2/ Hz)
• 50 - 300 Hz; - 10 dB / octave

ESD strength
Conducted discharge is 8 kV (>10 discharges) and air contact 15 kV ( >10 discharges ).
The standard for electrostatic discharge is IEC 61000-4-2, and this device fulfils level 4 requirements.

RoHS
This device uses RoHS compliant components and lead-free soldering process.

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Copyright © 2010 Nokia. All rights reserved.

Issue 2

Nokia Customer Care

2 — Service Tools and Service
Concepts

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Copyright © 2010 Nokia. All rights reserved.

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Service Tools and Service Concepts

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Service Tools and Service Concepts

Table of Contents
Service tools........................................................................................................................................................... 2–5
Product specific tools....................................................................................................................................... 2–5
MJ-241 .......................................................................................................................................................... 2–5
RJ-233 ........................................................................................................................................................... 2–5
SD-60 ............................................................................................................................................................ 2–6
General tools..................................................................................................................................................... 2–6
AC-35............................................................................................................................................................. 2–6
ACF-8 ............................................................................................................................................................. 2–6
CU-4............................................................................................................................................................... 2–7
FLS-5 ............................................................................................................................................................. 2–8
FPS-21........................................................................................................................................................... 2–8
JXS-1.............................................................................................................................................................. 2–9
PK-1............................................................................................................................................................... 2–9
SB-6............................................................................................................................................................... 2–9
SB-7............................................................................................................................................................... 2–9
SRT-6.......................................................................................................................................................... 2–10
SS-182........................................................................................................................................................ 2–10
SS-93 .......................................................................................................................................................... 2–10
SX-4............................................................................................................................................................ 2–10
Cables.............................................................................................................................................................. 2–10
CA-101 ....................................................................................................................................................... 2–11
CA-158RS ................................................................................................................................................... 2–11
CA-31D ....................................................................................................................................................... 2–11
CA-89DS ..................................................................................................................................................... 2–12
DAU-9S ....................................................................................................................................................... 2–12
PCS-1 .......................................................................................................................................................... 2–12
XRS-6.......................................................................................................................................................... 2–13
Service concepts ................................................................................................................................................. 2–13
POS (Point of Sale) flash concept ................................................................................................................. 2–13
Flashing, certificate restore and product code change option 2 ............................................................. 2–14
Module jig service concept ........................................................................................................................... 2–15
RF testing and BB/RF tuning concept with module jig.............................................................................. 2–16

List of Figures
Figure 2 POS flash concept ................................................................................................................................
Figure 3 Flashing, certificate restore and product code change ...................................................................
Figure 4 Module jig service concept .................................................................................................................
Figure 5 RF testing and BB/RF tuning concept with module jig....................................................................

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2–13
2–14
2–15
2–16

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Service Tools and Service Concepts

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Issue 2

RM-596
Service Tools and Service Concepts

Service tools
Product specific tools
The table below gives a short overview of service devices that can be used for testing, error analysis, and
repair of product RM-596. For the correct use of the service devices, and the best effort of workbench setup,
please refer to various concepts.
MJ-241

Module jig

MJ-241 is meant for troubleshooting, testing, tuning and flashing on
the engine level (CU-4 supported).
The jig includes the following features:
• Provides mechanical interface with the engine module
• Provides galvanic connection to all needed test pads in module
• Connector for control unit
• Access for AV- and USB connectors
• CA-158RS cable is used together with this jig for RF testing
•

Attenuation values for galvanic RF connection MJ-241
Band

Default f/
MHz RX

Att. RX

Default f/
MHz TX

Att. TX

GSM 850

881.6

0.1

836.6

0.1

GSM 900

942.4

0.1

897.4

0.1

GSM 1800

1842.8

0.2

1747.8

0.2

GSM 1900

1960.0

0.2

1880.0

0.2

WCDMA I

2140.0

0.2

1950.0

0.2

WCDMA II

1960.0

0.2

1880.0

0.2

WCDMA IV

2140.0

0.2

1740.0

0.2

WCDMA V

880.0

0.1

835.0

0.1

WCDMA VIII

942.6

0.1

897.6

0.1

WLAN

n/a

2442.0

0.3

FM / Tx

n/a

RJ-233

Soldering jig

RJ-233 is a soldering jig used for soldering and as a rework jig for the
engine module.

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RM-596
Service Tools and Service Concepts
SD-60

Dummy battery

SD-60 dummy battery is meant for component level troubleshooting..

General tools
The table below gives a short overview of service devices that can be used for testing, error analysis, and
repair of product RM-596. For the correct use of the service devices, and the best effort of workbench setup,
please refer to various concepts.
AC-35

Power supply

Universal power supply for FPS-21; included in the FPS-21 sales
package.
Input 100V…230V 50Hz…60Hz, output voltage of 12 V and output
current up to 3 A.

ACF-8

Universal power
supply

The ACF-8 universal power supply is used to power FLS-5.

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Issue 2

RM-596
Service Tools and Service Concepts
CU-4

Control unit

CU-4 is a general service tool used with a module jig and/or a flash
adapter. It requires an external 12 V power supply.
The unit has the following features:
• software controlled via USB
• EM calibration function
• Forwards FBUS/Flashbus traffic to/from terminal
• Forwards USB traffic to/from terminal
• software controlled BSI values
• regulated VBATT voltage
• 2 x USB2.0 connector (Hub)
• FBUS and USB connections supported
When using CU-4, note the special order of connecting cables and
other service equipment:

Instructions
1 Connect a service tool (jig, flash adapter) to CU-4.
2 Connect CU-4 to your PC with a USB cable.
3 Connect supply voltage (12 V)
4 Connect an FBUS cable (if necessary).
5 Start Phoenix service software.

Note: Phoenix enables CU-4 regulators via USB when it is
started.
Reconnecting the power supply requires a Phoenix restart.

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RM-596
Service Tools and Service Concepts
FLS-5

Flash device

FLS-5 is a dongle and flash device incorporated into one package,
developed specifically for POS use.
Note: FLS-5 can be used as an alternative to PK-1.

FPS-21

Flash prommer

FPS-21 sales package:
• FPS-21 prommer
• AC-35 power supply
• CA-31D USB cable
FPS-21 interfaces:

Front
• Service cable connector
Provides Flashbus, USB and VBAT connections to a mobile device.
• SmartCard socket
A SmartCard is needed to allow DCT-4 generation mobile device
programming.
Rear
• DC power input
For connecting the external power supply (AC-35).
• Two USB A type ports (USB1/USB3)
Can be used, for example, for connecting external storage memory
devices or mobile devices
• One USB B type device connector (USB2)
For connecting a PC.
• Phone connector
Service cable connection for connecting Flashbus/FLA.
• Ethernet RJ45 type socket (LAN)
For connecting the FPS-21 to LAN.
Inside
• Four SD card memory slots
For internal storage memory.
Note: In order to access the SD memory card slots inside
FPS-21, the prommer needs to be opened by removing the
front panel, rear panel and heatsink from the prommer body.

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Issue 2

RM-596
Service Tools and Service Concepts
JXS-1

RF shield box

Because the WCDMA network disturbs the RX side testing of the WCDMA
phone and the Tx signal of the WCDMA phone can severely disturb the
WCDMA network, a shield box is needed in all testing, tuning and fault
finding which requires WCDMA RF signal.
The shield box is not an active device, it contains only passive filtering
components for RF attenuation.

PK-1

Software protection
key

PK-1 is a hardware protection key with a USB interface. It has the same
functionality as the PKD-1 series dongle.
PK-1 is meant for use with a PC that does not have a series interface.
To use this USB dongle for security service functions please register
the dongle in the same way as the PKD-1 series dongle.
SB-6

Bluetooth test and
interface box (sales
package)

The SB-6 test box is a generic service device used to perform Bluetooth
bit error rate (BER) testing, and establishing cordless FBUS connection
via Bluetooth. An ACP-8x charger is needed for BER testing and an
AXS-4 cable in case of cordless interface usage testing .
Sales package includes:
• SB-6 test box
• Installation and warranty information

SB-7

WLAN test box

WLAN test requires defined position for the device.

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RM-596
Service Tools and Service Concepts
SRT-6

Opening tool

SRT-6 is used to open phone covers.
Note: The SRT-6 is included in the Nokia Standard Toolkit.

SS-182

Camera removal tool

The camera removal tool SS-182 is used to remove/attach a camera
module from/to the camera socket of the phone PWB.

SS-93

Opening tool

SS-93 is used for opening JAE connectors.
Note: The SS-93 is included in Nokia Standard Toolkit.

SX-4

Smart card

SX-4 is a BB5 security device used to protect critical features in tuning
and testing.
SX-4 is also needed together with FPS-21 when DCT-4 phones are
flashed.

Cables
The table below gives a short overview of service devices that can be used for testing, error analysis, and
repair of product RM-596. For the correct use of the service devices, and the best effort of workbench setup,
please refer to various concepts.

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Issue 2

RM-596
Service Tools and Service Concepts
CA-101

Micro USB cable

The CA-101 is a USB-to-microUSB data cable that allows connections
between the PC and the phone.

CA-158RS

RF tuning cable

Product-specific adapter cable for RF tuning.

CA-31D

USB cable

The CA-31D USB cable is used to connect FPS-21 to a PC. It is included
in the FPS-21 sales package.

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RM-596
Service Tools and Service Concepts
CA-89DS

Cable

Provides VBAT and Flashbus connections to mobile device
programming adapters.

DAU-9S

MBUS cable

The MBUS cable DAU-9S has a modular connector and is used, for
example, between the PC's serial port and module jigs, flash adapters
or docking station adapters.
Note: Docking station adapters valid for DCT4 products.

PCS-1

Power cable

The PCS-1 power cable (DC) is used with a docking station, a module
jig or a control unit to supply a controlled voltage.

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Issue 2

RM-596
Service Tools and Service Concepts
XRS-6

RF cable

The RF cable is used to connect, for example, a module repair jig to
the RF measurement equipment.
SMA to N-Connector approximately 610 mm.
Attenuation for:
• GSM850/900: 0.3+-0.1 dB
• GSM1800/1900: 0.5+-0.1 dB
• WCDMA/WLAN: 0.6+-0.1dB

Service concepts
POS (Point of Sale) flash concept

Figure 2 POS flash concept

Type

Description

Product specific tools
BL-4D

Battery

Other tools
FLS-5

POS flash dongle
PC with service software

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Page 2 – 13

RM-596
Service Tools and Service Concepts
Type

Description

Cables
CA-101

Micro USB cable

Flashing, certificate restore and product code change option 2

Figure 3 Flashing, certificate restore and product code change

Type

Description

Product specific devices
BL-4D

Battery

Other devices
FPS-21

Flash prommer box

AC-35

Power supply

PK-1

SW security device

SX-4

Smart card
PC with service software

Cables
CA-101
Page 2 – 14

Micro USB cable
COMPANY CONFIDENTIAL
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Issue 2

RM-596
Service Tools and Service Concepts
Type

Description
USB cable

Module jig service concept

Figure 4 Module jig service concept

Type

Description

Phone specific devices
MJ-241

Module jig

Other devices
CU-4

Control unit

FPS-21

Flash prommer box

PK-1

SW security device

SX-4

Smart card
PC with VPOS and service software
Measurement equipment

Cables
CA-89DS

Service cable

PCS-1

DC power cable

XRS-6

RF cable
USB cable

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RM-596
Service Tools and Service Concepts
Type

Description
GPIB control cable

CA-158RS

Product specific RF adapter cable

RF testing and BB/RF tuning concept with module jig

Figure 5 RF testing and BB/RF tuning concept with module jig

Type

Description

Product specific tools
MJ-241

Module jig

Other tools
CU-4

Control unit

PK-1

SW security device

SX-4

Smart card
PC with service software
Smart card reader

Cables
DAU-9S

MBUS cable

PCS-1

Power cable

XRS-6

RF cable

Page 2 – 16

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Issue 2

RM-596
Service Tools and Service Concepts
Type

Description
USB cable

CA-158RS

Issue 2

Product specific RF adapter cable

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RM-596
Service Tools and Service Concepts

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Issue 2

Nokia Customer Care

3 — BB Troubleshooting and
Manual Tuning Guide

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BB Troubleshooting and Manual Tuning Guide

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Issue 2

RM-596
BB Troubleshooting and Manual Tuning Guide

Table of Contents
Baseband main troubleshooting ......................................................................................................................... 3–7
Power and charging troubleshooting.............................................................................................................. 3–10
Backup battery troubleshooting.................................................................................................................. 3–10
Battery current measuring fault troubleshooting ..................................................................................... 3–11
General power checking troubleshooting .................................................................................................. 3–12
Dead or jammed device troubleshooting ................................................................................................... 3–13
Dynamo charging troubleshooting ............................................................................................................. 3–14
Clocking troubleshooting ............................................................................................................................. 3–15
USB charging troubleshooting..................................................................................................................... 3–17
Interface troubleshooting ................................................................................................................................. 3–18
USB flashing fault troubleshooting ............................................................................................................. 3–18
USB data interface troubleshooting ............................................................................................................ 3–19
SIM card troubleshooting ............................................................................................................................. 3–19
Memory troubleshooting.............................................................................................................................. 3–23
MicroSD card troubleshooting ................................................................................................................ 3–23
External memory eMMC troubleshooting .............................................................................................. 3–23
NOR troubleshooting ............................................................................................................................... 3–25
SDRAM troubleshooting........................................................................................................................... 3–26
IVE troubleshooting ........................................................................................................................................... 3–27
Introduction to IVE troubleshooting ........................................................................................................... 3–27
IVE troubleshooting ...................................................................................................................................... 3–28
TV out troubleshooting...................................................................................................................................... 3–29
Introduction to HDTV and SDTV troubleshooting ...................................................................................... 3–29
HDTV out troubleshooting............................................................................................................................ 3–31
SDTV out troubleshooting ............................................................................................................................ 3–31
Display module troubleshooting ...................................................................................................................... 3–34
General instructions for display troubleshooting...................................................................................... 3–34
Introduction to display troubleshooting .................................................................................................... 3–35
Display fault troubleshooting ...................................................................................................................... 3–37
Touch panel troubleshooting....................................................................................................................... 3–37
Illumination troubleshooting ...................................................................................................................... 3–39
Charging illumination troubleshooting ................................................................................................. 3–39
Menu key backlight troubleshooting ..................................................................................................... 3–40
Keyboard troubleshooting ................................................................................................................................ 3–41
Keys troubleshooting.................................................................................................................................... 3–41
Power key troubleshooting.......................................................................................................................... 3–41
Sensors troubleshooting ................................................................................................................................... 3–43
Accelerometer troubleshooting................................................................................................................... 3–43
Magnetometer troubleshooting .................................................................................................................. 3–44
Proximity sensor troubleshooting............................................................................................................... 3–46
ALS technical description and troubleshooting ......................................................................................... 3–46
Ambient Light Sensor (ALS)..................................................................................................................... 3–46
ALS functionality check ............................................................................................................................ 3–47
Re-tuning ALS ........................................................................................................................................... 3–48
ALS troubleshooting ................................................................................................................................ 3–49
Audio troubleshooting....................................................................................................................................... 3–50
Audio troubleshooting test instructions..................................................................................................... 3–50
External earpiece troubleshooting.............................................................................................................. 3–52
External microphone troubleshooting........................................................................................................ 3–52
Internal earpiece troubleshooting .............................................................................................................. 3–54
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RM-596
BB Troubleshooting and Manual Tuning Guide
Internal handsfree (IHF) troubleshooting...................................................................................................
Internal microphone troubleshooting ........................................................................................................
Vibra troubleshooting...................................................................................................................................
Connectivity module troubleshooting .............................................................................................................
Introduction to connectivity module troubleshooting .............................................................................
Bluetooth/FM radio and WLAN troubleshooting........................................................................................
Introduction to Bluetooth/FM radio troubleshooting..........................................................................
Introduction to WLAN troubleshooting .................................................................................................
Bluetooth and FM radio self tests in Phoenix.............................................................................................
WLAN self test in Phoenix.............................................................................................................................
Bluetooth BER test in Phoenix .....................................................................................................................
FMRX radio receiver testing..........................................................................................................................
FMTX transmitter antenna connectivity test in Phoenix ...........................................................................
FMTX transmitter tuning and power measurement in Testing and Tuning Tool ...................................
WLAN TX and RX testing in Phoenix ............................................................................................................
WLAN TX BiP testing procedure in Phoenix ................................................................................................
WLAN TX BiP testing procedure in Testing and Tuning Tool ....................................................................
Bluetooth troubleshooting ..........................................................................................................................
FMRX receiver troubleshooting....................................................................................................................
FMTX transmitter troubleshooting ..............................................................................................................
WLAN troubleshooting .................................................................................................................................
GPS troubleshooting ..........................................................................................................................................
Introduction to GPS troubleshooting ..........................................................................................................
GPS settings for Phoenix...............................................................................................................................
Quick Test window...................................................................................................................................
GPS control................................................................................................................................................
GPS failure troubleshooting .........................................................................................................................
GPS basic checks troubleshooting ...............................................................................................................
Baseband manual tuning guide........................................................................................................................
Certificate restoring for BB5 products.........................................................................................................
Energy management calibration .................................................................................................................

3–55
3–56
3–57
3–57
3–57
3–59
3–59
3–62
3–63
3–64
3–64
3–65
3–66
3–67
3–70
3–71
3–72
3–75
3–76
3–77
3–78
3–78
3–78
3–80
3–80
3–80
3–81
3–82
3–84
3–84
3–89

List of Tables
Table 6 Display module troubleshooting cases...............................................................................................
Table 7 Pixel defects ..........................................................................................................................................
Table 8 Defects table..........................................................................................................................................
Table 9 Antenna tuning value limits for RM-596 ............................................................................................
Table 10 Calibration value limits ......................................................................................................................

3–34
3–35
3–35
3–67
3–89

List of Figures
Figure 6 BufSleepClk and SleepClk signals on R2808 pads. The resistor is not assembled.........................
Figure 7 Expected Crystal clock input to BCM2727B on Oscilloscope ............................................................
Figure 8 Expected SDTV CVBS PAL signal on Oscilloscope...............................................................................
Figure 9 Expected SDTV CVBS NTSC signal on Oscilloscope.............................................................................
Figure 10 Ambient Light Sensor .......................................................................................................................
Figure 11 Hardware connections between BB and BOB1.0M-b .....................................................................
Figure 12 Bluetooth/WLAN/GPS antenna.........................................................................................................
Figure 13 Connectivity module's component layout, bottom side ...............................................................
Figure 14 Connectivity module's component layout, top side ......................................................................
Figure 15 Bluetooth and FM radio self tests in Phoenix.................................................................................

3–16
3–28
3–33
3–34
3–47
3–58
3–58
3–59
3–59
3–64

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Issue 2

RM-596
BB Troubleshooting and Manual Tuning Guide
Figure 16 Bluetooth BER test in Phoenix .........................................................................................................
Figure 17 FMTX transmitter antenna connectivity test in Phoenix ...............................................................
Figure 18 Component layout, bottom side......................................................................................................
Figure 19 GPS layout and basic test points......................................................................................................
Figure 20 GPS Quick Test window ....................................................................................................................
Figure 21 GPS Control dialogue box .................................................................................................................

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3–65
3–66
3–79
3–79
3–80
3–81

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BB Troubleshooting and Manual Tuning Guide

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Issue 2

RM-596
BB Troubleshooting and Manual Tuning Guide

Baseband main troubleshooting

Context
Always start the troubleshooting procedure by running the Phoenix self tests. If a test fails, please follow the
diagrams below. If the phone is dead and you cannot perform the self tests, go to Dead or jammed device
troubleshooting.

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RM-596
BB Troubleshooting and Manual Tuning Guide

Troubleshooting flow - Page 1 of 3

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BB Troubleshooting and Manual Tuning Guide

Troubleshooting flow - Page 2 of 3

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RM-596
BB Troubleshooting and Manual Tuning Guide

Troubleshooting flow - Page 3 of 3

Power and charging troubleshooting
Backup battery troubleshooting

Troubleshooting flow

Page 3 – 10

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BB Troubleshooting and Manual Tuning Guide

Battery current measuring fault troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

General power checking troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Dead or jammed device troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Dynamo charging troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Clocking troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Figure 6 BufSleepClk and SleepClk signals on R2808 pads. The resistor is not assembled.

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RM-596
BB Troubleshooting and Manual Tuning Guide

USB charging troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Interface troubleshooting
USB flashing fault troubleshooting

Troubleshooting flow

Page 3 – 18

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BB Troubleshooting and Manual Tuning Guide

USB data interface troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

SIM card troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

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BB Troubleshooting and Manual Tuning Guide

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BB Troubleshooting and Manual Tuning Guide

Memory troubleshooting

MicroSD card troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

External memory eMMC troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

NOR troubleshooting

Context
NOR flash interface is an electrical interface between the memory and the digital ASIC. It is used for accessing
the memory IC for SW instructions and data.

Troubleshooting flow

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RM-596
BB Troubleshooting and Manual Tuning Guide

SDRAM troubleshooting

Context
SDRAM interface is an electrical interface between the memory and the digital Asic. It is used for accessing
the memory IC for SW instructions and data.

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

IVE troubleshooting
Introduction to IVE troubleshooting
The IVE engine is a next generation imaging and video engine based on BCM2727B. The BCM2727B acts as
imaging, video, display, and HDTV and SDTV hardware accelerator.
The following references on the PWB help in the effective debugging and troubleshooting of IVE.
Sr. No

Reference

Description

B1400

19.2MHz Crystal

D1400

IVE/BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting.
Sr. No

Signal name

Measuring point

Description

VIVE_2V5_FILT

C1419/C1417

2.5V supply to BCM2727B

VIVE_2V8_FILT

C1414

2.8V supply to BCM2727B

VIVE_1V8_FILT

L1402/C1450

1.8V supply to BCM2727B

VBAT

L1403/C1466

VBAT supply to BCM2727B

RUN

J1425

Enable signal to IVE. This needs to be
High for IVE to be Up.

XIN

C1448

19.2MHz clock to IVE

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BB Troubleshooting and Manual Tuning Guide

IVE troubleshooting

Troubleshooting flow

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BB Troubleshooting and Manual Tuning Guide

Figure 7 Expected Crystal clock input to BCM2727B on Oscilloscope

TV out troubleshooting
Introduction to HDTV and SDTV troubleshooting

HDTV
The phone has HDTV capability. The phone can be connected to an HDTV through a Type A to Type C HDMI
cable.
The following references on the PWB help in the effective debugging and troubleshooting of HDTV Out.
Sr. No

Reference

Description

X1650

HDMI connector

N1653

HDMI connector ASIP on HDMI bus

N1654

HDMI bus ASIP on control bus

Z1650 to Z1653

Common mode choke on HDMI bus

N1651

HDMI 5V regulator

D1400

BCM2727B IC

D1653

HPD signal buffer

V1657

HDMI +5V ESD protection

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The following test points on the PWB help in the effective debugging and troubleshooting.
Sr No

Signal name

Measuring point

Description

HDMI_REG_EN

R1672

Enable signal for VHDMI_5V0 regulator. This
signal needs to be High for regulator to be On.

VHDMI_5V0

L1653/C1657

5V supply to HDMI sink.

HDMI_CABLE_DET

SW1.X1650

HDMI cable detect signal to HDMI source. This
signal goes Low when a cable is inserted.

HDMI_HPD

19.X1650

Hot Plug Detect signal to HDMI source. This
signal goes High when a cable is inserted.

HDMI_I2C(1:0)

15.X1650

I2C signals for HDMI.

16.X1650

SDTV
The phone has SDTV capability. The phone can be connected to an analog TV through a TV Out cable.
The following references on the PWB help in the effective debugging and troubleshooting of SDTV Out.
Sr. No

Reference

Description

R1419

DAC termination resistor. Resistor value 15 OHMS.

D1400

BCM2727B IC

N2001

Analog switch

L2001

Ferrite bead on the CVBS signal

X2001

AV connector

The following test points on the PWB help in the effective debugging and troubleshooting.
Sr No
1

Page 3 – 30

Signal name
CVBS

Measuring point
X2001.1/J2002

Description
SDTV signal

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HDTV out troubleshooting

Troubleshooting flow

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SDTV out troubleshooting

Troubleshooting flow

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Figure 8 Expected SDTV CVBS PAL signal on Oscilloscope

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Figure 9 Expected SDTV CVBS NTSC signal on Oscilloscope

Display module troubleshooting
General instructions for display troubleshooting
The first step is to verify with a working display that the fault is not on the display module itself. The display
module cannot be repaired.
The second step is to check that the engine is working normally. This can be done by connecting the phone
to a docking station and starting Phoenix service software. With the help of Phoenix read the phone
information to check that also the application engine is functioning normally (you should be able to read the
APE ID).
After these checks proceed to the display troubleshooting flowcharts. Use the Display Test tool in Phoenix to
find the detailed fault mode.

Pixel defects
Table 6 Display module troubleshooting cases

Display blank

There is no image on the display. The display looks
the same when the phone is on as it does when the
phone is off.

Image on the display not correct

Image on the display can be corrupted or a part of
the image can be missing. If a part of the image is
missing, change the display module. If the image is
otherwise corrupted, follow the appropriate
troubleshooting diagram.

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Visual defects (pixel)

Pixel defects can be checked by controlling the
display with Phoenix. Use both colors, black and
white, on a full screen. R, G, B are also helpful.
The display may have some random pixel defects
that are acceptable for this type of display. The
criteria when pixel defects are regarded as a display
failure, resulting in a replacement of the display, are
presented in the following table.

Table 7 Pixel defects

Bright sub-pixels

(sometimes called on-pixels or stuck-on) are
characterized by the appearance of bright/colored
pixels in, for example, black full screen picture.

Dark sub-pixels

(sometimes called off-pixels, stuck-off, or black
pixels) are characterized by the appearance of dark
pixels in white, red, green, or blue full-screen
picture.

Combined sub-pixel

defects are characterized by at least two sub-pixels
defects (bright or dim) being closer than 5 mm to
each other.

Temporal sub-pixels

(sometimes called blinking defects) exhibit
temporal variations not related to any steady-state
video input. Temporal sub-pixel defects may be
intermittent, exhibit a sudden change of state, or
be flickering.

Table 8 Defects table

Item

Bright dot (subpixel) defect

Defect counts

Not allowed

Combined subpixel defect

Not allowed

Temporal subpixel defect

Not allowed

Dark dot (subpixel) defect

Total

Note: Blinking pixels are not allowed in normal operating temperatures and light conditions.

Introduction to display troubleshooting
The display module used is based on AM OLED technology and supports display format of 360 columns x 640
rows. The dimension of the display module is 47.8 mm x 86.3 mm x 2.12 mm. The module will interface to
the phone via FPC with a 20 pins board to board connector.
The following references on the PWB help in the effective debugging and troubleshooting of the display.

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Sr No

Reference

Description

X1600

Display connector

Z1600, Z1601

Common Mode Choke on DSI bus

R1601/C1605

Series resistor on display Reset line. Reset signal needs to be
High for the display to be Up.

D1400

BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting.
Sr. No

Signal name

Measuring point

Description

VIO

L1600/C1600

1.8V supply to display

VBAT

L1601/C1602

VBAT supply to display

TE0

R1600

Tearing effect signal from display module.

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Display fault troubleshooting

Troubleshooting flow

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Touch panel troubleshooting

Troubleshooting flow

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Illumination troubleshooting

Charging illumination troubleshooting

Troubleshooting flow

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Menu key backlight troubleshooting

Troubleshooting flow

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Keyboard troubleshooting
Keys troubleshooting

Troubleshooting flow

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Power key troubleshooting

Troubleshooting flow

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Sensors troubleshooting
Accelerometer troubleshooting

Troubleshooting flow

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Magnetometer troubleshooting

Equipment
• Non-magnetic, horizontal table
• nearest ferromagnetic part, distance more than 50 cm
• Traditional needle type compass for reference
• Rotating platform (sheet of wood or plastic)
• PC with Phoenix

Preparation of phone
• Set the rotating platform to the table
• Set the phone and reference compass to the rotating platform
• Connect the phone to the PC and start Phoenix

Tests
• General troubleshooting test
• Self-test (ST)
• Azimuth check test

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Magnetometer general troubleshooting flow

Azimuth check
• Search magnetically quiet place for the test table
• No disturbing elements near the table, such as motors, coils, electric currents or similar
• Calibrate the phone as described in the user manual
• The indicator must be GREEN
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• Rotate the platform manually one round on the horizontal table with steps of approximately 15° degrees
• The reference angle direction value from the reference compass = REF(angle)
• Read the phone value = ACT(angle)
• Calculate for every step (24 steps)
• Result(angle) = REF(angle) - ACT(angle)
• The result is the real angle difference of angles in a 360° degrees continuous round
• Criteria:
• If the Result(angle) value < 15° degrees GO, otherwise NOGO

Proximity sensor troubleshooting

Troubleshooting flow

ALS technical description and troubleshooting

Ambient Light Sensor (ALS)
Pupumon V1100 is a digital Ambient Light Sensor (ALS) which is connected to RAPU via I2C_2 bus. It does not
have an interrupt signal as in Augumon ALS. Power supply voltage is provided from VAUX2 output of EM ASIC.
ALS is used in backlight control system to measure the amount of ambient light reaching display surface so
that it is possible to adjust the display (and keypad) brightness in order to achieve good user experience.
This also helps in saving power.
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Figure 10 Ambient Light Sensor

ALS functionality check

Steps
1. Connect the phone to Phoenix and set the phone (e.g. on the table) so that the amount of ambient light
seen by ALS is as stabile as possible.
2. Start Phoenix.
3. Choose File -> Scan product .
4. Choose Testing -> Display Test .
5. Open the Lights tab, check Ambient Light Sensor check box, click Read , cover the sensor and click
Read again. When covered, Luminance reading should be less than after clicking Read without covering
the sensor.
6. If the component does not give any reading or reading does not change when the sensor is/is not covered,
replace the part.

• After replacing the ALS, if the calibration values of the new sensor are lost or for some other reason,
ALS re-tuning is required.
• When doing the ALS calibration procedure, it is required to have a reference phone which includes a
calibrated ALS. ALS re-tuning instructions show why the reference phone is needed.

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Re-tuning ALS

Steps
1.

Connect reference phone to Phoenix and set the phone (e.g. on the table) so that the amount of ambient
light seen by ALS is as stable as possible.

Start Phoenix.

Choose File→Scan Product.

Choose Tuning -> Ambient Light Sensor Calibration. You should see the following window:

Read AD-count values for Channel 0 and Channel 1 by click Read button and write them down.

Repeat 1-5 for the phone to be calibrated and make sure the phone to be calibrated is located in the
same place as reference phone was when luminance reading was taken.

Calculate co-efficient from reference phone and phone to be calibrated AD-count values by division: Coefficient = AD-count(reference phone) / AD-count(phone to be calibrated), write down the calculated coefficient values.

-> Iterate by changing Channel 0 and Channel 1 (reference level) values (remove cross from ‘Use default
values only’). After writing some value to Channel 0 and Channel 1 (reference value), calibrate button
must be pressed. Stop iterating when Co-efficient is equal to Co-efficient calculated in step 7. Note that
decimal numbers should be used in the iteration in order to achieve enough precision (e.g. 200.2455)

After having same Co-efficient value in “Co-efficient” textbox as the calculated value, make sure that
ambient light values (read using Testing → Display Test → “Luminance” textbox) are almost the same
in reference phone and calibrated phone. Remember that illuminance readings for reference and
calibrated phones must be done in the same ambient light conditions. If illuminance values differs a lot
(difference max. +- 10%), repeat whole ALS re-tuning procedure.

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10. To end the calibration, click Close.

ALS troubleshooting

Troubleshooting flow

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Audio troubleshooting
Audio troubleshooting test instructions
Single-ended external earpiece and differential internal earpiece outputs can be measured either with a
single-ended or a differential probe.
When measuring with a single-ended probe each output is measured against the ground.
Internal handsfree output is measured using a current probe, if a special low-pass filter designed for
measuring a digital amplifier is not available. Note also that when using a current probe, the input signal
frequency must be set to 2 kHz.
The input signal for each loop test can be either single-ended or differential. Exception to this is a digital
microphone which needs input signal from an external sound source (laptop speaker) to playback, eg. 1 kHz
sine wave from 5 cm distance.

Required equipment
The following equipment is needed for the tests:
• Oscilloscope
• Function generator (sine waveform)
• Current probe (Internal handsfree DPMA output measurement)
• Phoenix service software
• Battery voltage 3.7V
• Sound source (laptop speaker or B&K type 4231 calibrator)

Test procedure
Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be
activated:
• External headset mic to earpiece
• External headset mic to IHF mono
• Internal digital microphone to headset
Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.
Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test
are presented in the following table.

Phoenix audio loop tests and test results
The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.
Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory
during measurement causes a significant drop in measured quantities.
The gain values presented in the table apply for a differential output vs. single-ended/differential input.
Loop test

Input
terminal

Output
terminal

Path gain
[dB]
(fixed)

Input
voltage
[mVp-p]

Output DC
level [V]

Output
voltage
[mVp-p]

External
headset
mic to
earpiece

HS_MIC &
GND

EAR 1 &
GND

300

1.35

300

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EAR 0 &
GND
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Loop test

Input
terminal

Output
terminal

Path gain
[dB]
(fixed)

Input
voltage
[mVp-p]

External
headset
mic to IHF
mono

HS_MIC &
GND

L4855 &
L4856

200

630

Internal
digital
micropho
ne to
headset

Acoustica
l Input,
1kHz sine
wave

94 dBSPL

Issue 2

Output DC
level [V]

Output
voltage
[mVp-p]

L4857 &
L4858
HS_L &
GND
HS_R &
GND

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External earpiece troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

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Internal earpiece troubleshooting

Troubleshooting flow

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Internal handsfree (IHF) troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Troubleshooting flow

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Vibra troubleshooting

Troubleshooting flow

Connectivity module troubleshooting
Introduction to connectivity module troubleshooting
The BOB1.0M-b module supports WLAN, BT, FMRX and FMTX. From a troubleshooting point of view, WLAN is
tested separately, but BT, FMRX and FMTX are checked in parallel.
REFOUT_EXT1 single ended 38.4 MHz analog clock from Linko RF is provided to BOB1.0M-b. The clock request
for the reference clock in the BOB1.0M-b module is shared between WLAN and BT blocks. When either system
requires a clock, this signal will be active. The CLK_REQ is connected to ExtSysClkReq pin of RAPU. The SLEEPCLK
input of 32.768 KHz clock from EM ASIC is used for power management and for FM in low power mode. The
internal SMPS supplies the whole BOB1.0M-b solution from the phone battery supply, VBAT, apart from VIO
which is needed for interface signal reference levels.
The following figure shows a top level block diagram of the BOB1.0M-b module.

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Figure 11 Hardware connections between BB and BOB1.0M-b

Bluetooth/WLAN/GPS antenna
The Bluetooth/WLAN/GPS antenna is product specific (antenna integrated into phone's top cap). On phones
with WLAN, the Bluetooth RF signal is routed from the connectivity module through the RF diplexer and a
shared Bluetooth/WLAN/GPS antenna is used. The FM receiver RF signal is routed through a product specific
FM antenna matching circuit to the phone headset connector. The FM radio audio signal is routed to the
headset connector through the BB ASIC shared by the phone audio functions. The camera plate in the back
cover works as an FM transmitter antenna.
The antenna positions are presented in the following figure.

Figure 12 Bluetooth/WLAN/GPS antenna

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Component layout and test points of the connectivity module

Figure 13 Connectivity module's component layout, bottom side

Figure 14 Connectivity module's component layout, top side

Bluetooth/FM radio and WLAN troubleshooting

Introduction to Bluetooth/FM radio troubleshooting
The Bluetooth and FM radio receiver/transmitter functions are combined so these features are checked when
troubleshooting.
The following problems can occur with the Bluetooth and FM radio hardware:

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Symptom

Problem

Repair solution

Unable to switch on Bluetooth on
phone user interface

Open circuit solder joints or
component failure of BOB
module or SMD components

Replacement of BOB module

Able to send data file to another
Bluetooth device, but unable to
hear audio through functional
Bluetooth headset

Open circuit solder joints or
component failure of BOB
module (PCM interface)

Replacement of BOB module

Able to switch on Bluetooth on
phone user interface, but unable
to detect other Bluetooth devices

Open circuit solder joints or
detached component in
Bluetooth antenna circuit

Repair of Bluetooth antenna
circuit

Problems connecting to specific
manufacturer/model Bluetooth
accessory (specific Bluetooth
profile supported by phone and
accessory in product
specification)

Possible interoperability issue
with accessory fixed in recent
Nokia phone software release
(check Nokia Service Bulletin for
the latest information)

Update phone software to
the latest version if advised
in Nokia Service Bulletin

Able to turn on FM radio and
Bluetooth on phone user
interface, but unable to detect
local FM radio stations with FM
headset inserted

Open circuit solder joints or
detached component in FM
antenna circuit

Repair of FM receiver antenna
circuit

Able to perform scans to detect
local FM radio stations with
functional FM headset inserted,
but unable to hear FM audio
through headset

Open circuit solder joints or
detached component in FM
receiver audio path between
Bluetooth/FM ASIC and headset

Repair of FM audio circuit

Note: The phone
Bluetooth Address and
software version are
displayed by pressing
*#2820# when Bluetooth
is on.

Users may experience the following problems resulting in functional phones being returned to the repair
centre:
Symptom

Problem

Repair solution

Bluetooth feature does not
operate as desired with another
Bluetooth device

Bluetooth Profile implemented
in Bluetooth accessory not
supported in Nokia phone

Use Bluetooth accessory with
Bluetooth profiles supported
by phone

Poor FM radio reception (unable
to detect many radio stations)

Nokia headset not being used

Use Nokia headset

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Symptom
Poor FM transmitter range (for
example with car radio)

Problem

Repair solution

Large path loss between the
phone FM transmitter antenna
and external FM radio aerial (for
example, FM aerial routing
inside car is very well screened
or greater than 3 metre
distance between the phone
and FM radio)

Change the setup of aerial on
FM radio used for listening to
audio

BT and FM radio test coverage
The tests listed in the table below should be performed to verify whether the Bluetooth and FM receiver and
transmitter are functional. The use of self tests is described in section Bluetooth and FM radio self tests in
Phoenix.
Test

Test Coverage

Repair solution

Blueooth Self Test: ST_LPRF_IF_TEST

Bluetooth-FM ASIC UART interface
(controls Bluetooth and FM
receiver and transmitter)

Replacement of BOB module
(or repair of phone BB)

Bluetooth Self Test:
ST_BT_WAKEUP_TEST

Bluetooth ASIC interrupt control
interface

Replacement of BOB module
(or repair of phone BB)

Bluetooth Self Test:
ST_LPRF_AUDIO_LINES_TEST

Bluetooth ASIC PCM interface

Replacement of BOB module
(or repair of phone BB)

Bluetooth Functional Test: BER test
with BT-Box or functional test with
other Bluetooth device

Bluetooth antenna circuit

Repair of Bluetooth antenna
circuit (including RF filter or
WLAN switch if fitted)

FM Radio Functional Test: Perform
scan for local radio stations and
check station list displayed on
phone

FM receiver antenna circuit

Repair of FM antenna circuit
(between BTHFMWLAN ASIC
and headset connector)

FM Radio Functional Test: Listen to
local radio station

FM receiver audio circuit

Repair of FM receiver audio
circuit (between BTHFMWLAN
ASIC and headset connector)

FM Transmitter Antenna Test: Read
Antenna Tuning Values in Phoenix
or functional test transmitting
music to nearby radio

FM transmitter antenna circuit and
antenna

Replacement of FM transmitter
circuit or antenna

The self tests run from Phoenix software are used for fault diagnosis.
If Phoenix software is not available, the functional tests with phone accessories are sufficient to verify the
functionality of Bluetooth and FM radio receiver and transmitter.
If Bob1.0M-b module has been replaced, the WLAN tuning must be performed to ensure that the
output complies with ETSI/ FCC legal limits.

FMTX troubleshooting faults
Possible faults
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Expected fault reports relating to the FMTx 2.1 implementation may consist of one or more of the following;
1 No left audio
2 No right audio
3 No audio
4 Can’t start FMTx
5 Can’t locate FM transmission on an FM receiver or no FM transmission
6 Distortion on audio
7 Poor reception on FM receiver
8 No RDS information
Initial fault analysis
Where possible, attempt to reproduce and verify the reported fault. Intermittent problems are likely to be
due to bad connections or broken components/solder joints. Any faults relating to poor FM transmitter
performance or frequent failure to locate usable frequencies when performing a scan are likely to be due to
some kind of antenna issues.
In handsets that utilise an antenna solution in a removable cover it is likely that the connecting interface
pins are either damaged, dirty or that the cover fits poorly perhaps due to broken tabs/latching lugs. Poor
audio fault reports may also be due to the above antenna issues.

Introduction to WLAN troubleshooting
The following problems can occur with the WLAN hardware:
Symptom

Problem

Repair solution

Unable to switch on WLAN on
phone user interface

Open circuit solder joints or
component failure of BOB
module

Replacement of BOB module
or Host

Able to turn on WLAN via phone
user interface, but unable to
detect any WLAN APs or other
WLAN devices

Open circuit solder joints or
component failure of BOB
module or filter

Replacement of BOB module
or filter

Able to turn on WLAN via phone
user interface and find APs and
other WLAN devices, but not able
to connect

Problem with TX part of WLAN
circuit

Replacement of BOB module

Slow download speed when
using WLAN as connection
method

System clock possibly degraded

Change system clock source

Users may experience the following problems resulting in functional phones being returned to the repair
centre:
Symptom

Problem

WLAN does not operate as desired
with another WLAN device

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Other WLAN device is not
conforming to ETSI/FCC
specifications

Repair solution
Use only certified WLAN
products

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WLAN test coverage
The tests listed in the table below should be performed to verify whether WLAN is functional. WLAN should
be re-tested after repair.
Test

Test Coverage

Repair solution

WLAN Self Test: ST_WLAN_TEST

WLAN SPI and control interface
(data interface and control of
WLAN)

Replacement of BOB module

Bluetooth Functional Test: BER test
with BT-Box or functional test with
another Bluetooth device

Antenna connection from module,
including filter

Replacement of BOB module or
antenna components

WLAN TX Tuning

Checks WLAN TX path up to
module output and calibrates the
new module if fitted

Replacement of BOB module or
antenna components

Bluetooth and FM radio self tests in Phoenix

Prerequisites
A flash adapter (or phone data cable) connected to a PC with Phoenix service software is required.

Steps
1. Place the phone in the flash adapter or connect data cable to phone.
2. Start Phoenix service software.
3. Choose File → Scan Product.
4. From the Mode drop-down menu, set mode to Local.
5. Choose Testing → Self Tests.
6. In the Self Tests window check the following Bluetooth and FM radio related tests:
• ST_LPRF_IF_TEST
• ST_LPRF_AUDIO_LINES_TEST
• ST_BT_WAKEUP_TEST

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7. To run the tests, click Start.

Figure 15 Bluetooth and FM radio self tests in Phoenix

WLAN self test in Phoenix

Prerequisites
A flash adapter (or phone data cable) connected to a PC with Phoenix service software is required.

Steps
1. Place the phone in the flash adapter or connect data cable to phone.
2. Start Phoenix service software.
3. Choose File → Scan Product.
4. From the Mode drop-down menu, set mode to Local.
5. Choose Testing → Self Tests.
6. In the Self Tests window check the following WLAN test:
• ST_WLAN_TEST
7. To run the test, click Start.

Bluetooth BER test in Phoenix

Prerequisites
JBT-9, or SB-6 Bluetooth test box (BT-box) is required to perform a BER test. If a BT-box is not available,
Bluetooth functionality can be checked by transferring a file to another Bluetooth phone.

Steps
1. Connect data cable to phone.
2. Start Phoenix service software.
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3. Choose File → Scan Product.
4. Choose Testing → Bluetooth LOCALS .
5. Locate the BT-box serial number (12 digits) found in the type label on the back of the JBT-9, or SB-6
Bluetooth test box.
6. In the Bluetooth LOCALS window, write the 12-digit serial number on the Counterpart BT Device
Address line.
7. Place the BT-box near (within 10 cm) of the phone and click Start BER Test.

Figure 16 Bluetooth BER test in Phoenix

FMRX radio receiver testing

Steps
1. Set signal generator parameters:
• FM modulation on
• Frequency 100MHz
• FM deviation 22kHz
• Modulation frequency 1kHz
• RF level should be varied during the test to obtain good audio signal quality
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• Connect suitable antenna to signal generator
Note: You may alternately use a known good FM radio broadcast as a test signal.
2. Attach the Nokia headset to the phone’s AV connector.
3. Use Scroll button to autotune to the radio frequency.
4. Set volume to suitable level.
5. Check audio quality with a headset.

FMTX transmitter antenna connectivity test in Phoenix

Context
The purpose is to check the connectivity between the FM TX antenna and Bob ASIC. The FM transmitter antenna
can be checked by reading the ‘Antenna Tuning Values’ displayed in the FM TX Control test display in Phoenix.
This test can be performed with the product specific FM TX antenna assembled. Alternatively, this test can
be performed with the FM antenna pins terminated with the external impedance provided by the MJ-241 test
jig, but then this test will not test the phone’s own FMTX antenna connectivity anymore.

Steps
1. Connect data cable to phone including FM transmitter antenna.
2. Start Phoenix service software.
3. Choose File → Scan Product .
4. Choose Testing → FMTX Control .
5. Set frequency to near the bottom of the band (92 MHz) and press the Activate button.

Figure 17 FMTX transmitter antenna connectivity test in Phoenix

6. Set the ‘RF Output Power’ to 120uV.
7. Press the Read button and record ‘Antenna Tuning Value’.
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8. Set frequency to near the top of the band (107 MHz) and press the Activate button again.
9. Press the Read button and record ‘Antenna Tuning Value’.

Results
The test limits for the antenna tuning varactor value are product specific.
Table 9 Antenna tuning value limits for RM-596

Antenna tuning value
Frequency

Low limit

High limit

92 MHz

126

107 MHz

The default value (displayed when there is no antenna present) is 0…2. If both values are 0…2, this
indicates there is a poor connection between the FMTX antenna and the Bob ASIC.

FMTX transmitter tuning and power measurement in Testing and Tuning Tool

Context
Note: RF cables and adapters have some losses. They have to be taken into account when the FMTX
is measured. Approximately, the FMTX RF loss in the MJ-241 test jig is around 24 dB. Cable
attenuations have to be taken into account separately.
FMTX has been tuned correctly in production. There is no reason to do re-calibration unless the memory
(D3000) is corrupted. But it is a good way to ensure the RF performance by these tuning and power
measurements.
FMTX can be tuned and measured automatically with Testing and Tuning Tool. Actually it performs output
power level writings and measurements for FMTX. The results are displayed and logged in a result file, if
initiated.
For hardware requirements for auto tuning, please refer to RF testing and BB/RF tuning concept with module
jig in section 'Service Tools and Service Concepts'.

Steps
1. Make sure the phone is connected to the PC.
2. Connect the RF cable between the MJ-241 test jig (SMA RF connector located next to the BT/WLAN/GPS
antenna connector) and the communication tester.

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3. Start Nokia Care Suite application.

4. To open the application, double-click the Testing And Tuning Tool icon.
5. If the application is able to find a connected phone, the following view will open:

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6. Click on the RF Tuning button and select from the drop-down menu:

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7. RF tunings will be ready when all the tunings and measurements are green in the tool window and no
errors occur.

WLAN TX and RX testing in Phoenix

Context
The basic WLAN RX and TX functionality can be checked with Phoenix.

Steps
1. Place the phone in the flash adapter or connect data cable to phone.
2. Start Phoenix service software.
3. Choose File → Scan Product.

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4. Choose Testing → WLAN RX Tests or WLAN TX Tests. See the following figures.

WLAN TX BiP testing procedure in Phoenix

Context
Note: This is an alternative procedure to tune the WLAN TX. The other, recommended procedure is
described in chapter WLAN TX BiP testing procedure in Testing and Tuning Tool (page 3–72 ) .
Note: No external measurement equipment is required as the calibration is completely handled
internally. RF cable and adapter losses do not need to be taken into account while WLAN TX tuning
is proceeded.
WLAN TX has been BiP (Build in Prduction line testing) tuned correctly in production. There is no reason to
do re-calibration unless the Bob1.0M-b (N6300) is changed or memory (D3000) is corrupted.
WLAN TX can be tuned automatically with Testing and Tuning Tool. It performs calibrations and tunings of
WLAN TX. The results are displayed and logged in a result file, if initiated.

Steps
1.

Place the phone in the flash adapter or connect data cable to phone.

Start Phoenix service software.

Choose File → Scan Product.

Choose Tuning → WLAN_TX_TUNING. See the following figure.

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5.

Select “Sub-Band 0” as indicated in the figure.

Open the Extended Tuning menu. See the following figure.

Type the correct tuning values. The values are circled in the figure above.

Click Write and Close.

Click Start Power Calibration and read the result from the Result box.

10. If TXPowerCal response returns ‘Passed’ results, the WLAN TX BiP test is successful.

WLAN TX BiP testing procedure in Testing and Tuning Tool

Context
Note: No external measurement equipment is required as the calibration is completely handled
internally. RF cable and adapter losses do not need to be taken into account while WLAN TX tuning
is proceeded.
WLAN TX has been BiP (Build in Prduction line testing) tuned correctly in production. There is no reason to
do re-calibration unless the Bob1.0M-b (N6300) is changed or memory (D3000) is corrupted.
WLAN TX can be tuned automatically with Testing and Tuning Tool. It performs calibrations, tunings and
measurements of WLAN TX. The results are displayed and logged in a result file, if initiated.

Steps
1. Make sure the phone is connected to the PC.

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2. Start Nokia Care Suite application.

3. To open the application, double-click the Testing And Tuning Tool icon.
4. If the application is able to find a connected phone, the following view will open:

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5. Click on the RF Tuning button and select from the drop-down menu:

6. RF tunings will be ready when all the tunings and measurements are green in the tool window and no
errors occur.

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7. If errors do happen, failed tuning/testing steps are marked with a red color and more detailed results are
shown on the screen.

Bluetooth troubleshooting

Troubleshooting flow

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FMRX receiver troubleshooting

Troubleshooting flow

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FMTX transmitter troubleshooting

Troubleshooting flow

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WLAN troubleshooting

Troubleshooting flow

GPS troubleshooting
Introduction to GPS troubleshooting
GPSCost4.1D is a single chip GPS receiver, comprising both RF and BB blocks integrated in a single digital die.
GPSCost4.1D is connected to RAPU ASIC via I2C_1 and some GENIOs. GPSCost4.1 D operates in Multi-master
mode and the REF clock is requested via AGPS_CLK_REQ signal connected to RAPU genio46. REFOUT_EXT2 single
ended 38.4 MHz analog clock from Linko RF is provided to GPSCost4.1D.

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The GPS components are located on the bottom side of the PWB. Satellite signals are picked up by the
Bluetooth/WLAN/GPS antenna in the top end cap. The signal is then routed through a diplexer before being
processed by the GPS5350 receiver ASIC.

Figure 18 Component layout, bottom side

Figure 19 GPS layout and basic test points

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GPS settings for Phoenix

Quick Test window
This test will perform 3 tests in one: Self test, Oscillator Test and CW Test and will provide a Pass/Fail Response
for each. The HW Self Test confirms basic communication with the GPS ASIC. The oscillator test confirms the
frequency accuracy of the GPS TCXO against the Ref_Clk. The CW Test confirms end-to-end connectivity
between the GPS antenna and the GPS ASIC. It also contains a receive button.
Before this test is performed a known good phone should be tested in order to calibrate the setup. The signal
level of the Signal Generator should be adjusted so a reading of SNR 35 dB is achieved with the reference
unit. A good starting point is to set up the signal generator to -50 dBm.
These checks are part of GPS failure troubleshooting.

Figure 20 GPS Quick Test window

GPS control

Prerequisites
A flash adapter with RF connector connected to a PC with Phoenix service software is required. The GPS signal
should be connected to the RF connector. Calibrate the signal level with a known good phone. Signal level
will be high (approx -45 dBm) because it is a leakage connection.

Context
Use the following to test GPS using Phoenix.

Steps
1. Place phone to Flash Adaptor.
2. Start Phoenix service software.
3. From the File menu, select Scan Product and check that the correct product version is displayed.

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4. From the Testing menu, select GPS Control. This opens up GPS Control dialogue box, as shown in the
figure below, and enables the GPS.

Figure 21 GPS Control dialogue box

Select Idle to confirm the GPS is enabled and is in idle mode; at this point all clocks should be present,
GPS_En_Reset & SleepX should be high, and Vdd_Dig, Vcc_TCXO & Vcc_PLL/VCO will be present.
Receiver On turns on all RF sections of the ASIC and so all LDOs will be on.

GPS failure troubleshooting

Context
GPS troubleshooting is broken down into two parts: general GPS failure troubleshooting and GPS basic checks
troubleshooting. The GPS failure troubleshooting flow can be followed and, where applicable, will feed into
the GPS basic checks troubleshooting flow.

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Troubleshooting flow

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GPS basic checks troubleshooting

Troubleshooting flow

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Baseband manual tuning guide
Certificate restoring for BB5 products

Context
This procedure is performed when the device certificate is corrupted for some reason.
All tunings (RF & Baseband, UI) must be done after performing the certificate restoring procedure.
The procedure for certificate restoring is the following:
• Flash the phone with the latest available software using FPS-20 or FPS-21.
• Create a request file.
• Send the file to Nokia by e-mail. Use the following addresses depending on your location:
• APAC: sydney.service@nokia.com
• CHINA: repair.ams@nokia.com
• E&A: salo.repair@nokia.com
• AMERICAS: fls1.usa@nokia.com
• When you receive a reply from Nokia, carry out certificate restoring.
• Tune the phone completely.
Note: SX-4 smart card is needed.
• If the phone resets after certificate restoring, reflash the phone again.
Required equipment and setup:
• Phoenix service software v 2009.41 or newer.
• The latest phone model specific Phoenix data package.
• Care dongle
• SX-4 smart card (Enables BB5 testing and tuning features)
• Activated FPS-20 flash prommer OR FPS-21 flash prommer
• Flash update package 08.30.012 or newer for FPS-20 or FPS-21 flash prommers
• CU-4 control unit
• USB cable from PC USB Port to CU-4 control unit
• Phone model specific adapter for CU-4 control unit
• PCS-1 cable to power CU-4 from external power supply
• Service cable between flash prommer and CU-4
Note: CU-4 must be supplied with +12 V from an external power supply in all steps of certificate
restoring.

Steps
1. Program the phone software.
i

Start Phoenix and login. Make sure the connection has been managed correctly for FPS-20 or FPS-21.

Update the phone MCU software to the latest available version.
If the new flash is empty and the phone cannot communicate with Phoenix, reflash the phone.

iii Choose the product manually from File → Open Product , and click OK.
Wait for the phone type designator (e.g. “RM-1” ) to be displayed in the status bar.
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iv Go to Flashing → SW Update and wait until Phoenix reads the product data as shown in the following
picture.

Product

is automatically set according to the phone support module which was opened manually,
but the flash files cannot be found because the correct data cannot be read from the phone
automatically.

Code

must be chosen manually, it determines the correct flash files to be used. Please choose the
correct product code (can be seen in the phone type label) from the dropdown list.

Flash Type

must be set to Phone as Manufactured.

To continue, click Start.
Progress bars and messages on the screen show actions during phone programming, please wait.

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Programming is completed when Flashing Completed message is displayed.
The product type designator and MCU SW version are displayed in the status bar.
vi Close the SW Update window and then choose File → Close Product .
2. Create a Request file.
For this procedure, you must supply +12 V to CU-4 from an external power supply.
i

To connect the phone with Phoenix, choose File → Scan Product .

Choose Tools → Certificate Restore .

iii To choose a location for the request file, click Browse.

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iv Name the file so that you can easily identify it, and click Open.

The name of the file and its location are shown.

To create the Request file, click Start.

vi When the file for certificate restore has been created, send it to Nokia as an e-mail attachment.
3. Restore certificate.
For this procedure, you must supply +12 V to CU-4 from an external power supply.
i

Save the reply file sent by Nokia to your computer.

Start Phoenix service software.

iii Choose File → Scan Product .

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iv From the Tools menu, choose Certificate Restore and select Process a response file in the Action
pane.

To choose the location where response file is saved, click Browse.

vi Click Open.

The name of the file and the path where it is located are shown.
vii To write the file to phone, click Start.

Next actions
After a successful rewrite, you must retune the phone completely by using Phoenix tuning functions.
Important: Perform all tunings: RF, BB, and UI.
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Energy management calibration

Prerequisites
Energy Management (EM) calibration is performed to calibrate the setting (gain and offset) of AD converters
in several channels (that is, battery voltage, BSI, battery current) to get an accurate AD conversion result.
Hardware setup:
• An external power supply is needed.
• Supply 12V DC from an external power supply to CU-4 to power up the phone.
• The phone must be connected to a CU-4 control unit with a product-specific flash adapter.

Steps
1.

Place the phone to the docking station adapter (CU-4 is connected to the adapter).

Start Phoenix service software.

Choose File → Scan Product.

Choose Tuning → Energy Management Calibration.

To show the current values in the phone memory, click Read, and check that communication between
the phone and CU-4 works.

Check that the CU-4 used check box is checked.

Select the item(s) to be calibrated.
Note: ADC calibration has to be performed before other item(s). However, if all calibrations are
selected at the same time, there is no need to perform the ADC calibration first.

Click Calibrate.
The calibration of the selected item(s) is carried out automatically.
The candidates for the new calibration values are shown in the Calculated values column. If the new
calibration values seem to be acceptable (please refer to the following "Calibration value limits" table),
click Write to store the new calibration values to the phone permanent memory.
Table 10 Calibration value limits

Parameter

Min.

Max.

ADC Offset

-30

+40

ADC Gain

12000

14000

BSI Gain

1100

1350

VBAT Offset

2635

2755

VBAT Gain

14900

15900

VCHAR Gain

N/A

IBAT (ICal) Gain

7750

12250

Click Read, and confirm that the new calibration values are stored in the phone memory correctly. If the
values are not stored to the phone memory, click Write and/or repeat the procedure again.

10. To end the procedure, close the Energy Management Calibration window.

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4 — Cellular RF
troubleshooting

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Table of Contents
General instructions for cellular RF troubleshooting......................................................................................... 4–5
Cellular RF key components.................................................................................................................................. 4–6
Cellular RF main troubleshooting ........................................................................................................................ 4–7
Cellular RF main troubleshooting ................................................................................................................... 4–7
Self test troubleshooting.............................................................................................................................. 4–10
Troubleshooting with RF Self tests......................................................................................................... 4–10
RF-BB interface self test troubleshooting.............................................................................................. 4–11
RF supply self test troubleshooting........................................................................................................ 4–12
VBAT level.................................................................................................................................................. 4–13
VXO level.................................................................................................................................................... 4–14
VIO level..................................................................................................................................................... 4–15
VREF level .................................................................................................................................................. 4–15
VHIA (Vhi) level ......................................................................................................................................... 4–16
VDCDCA (Vlow) level ................................................................................................................................. 4–16
VPA level.................................................................................................................................................... 4–17
RF tuning and testing ........................................................................................................................................ 4–17
RF auto tuning and testing with Nokia Care Suite..................................................................................... 4–17
RF auto tuning procedure ............................................................................................................................ 4–18
Automatic RF testing with Nokia Care Suite............................................................................................... 4–22
Troubleshooting with Testing And Tuning Tool ........................................................................................ 4–23
Manual transmitter (TX) testing with Phoenix........................................................................................... 4–26
General instructions for transmitter (TX) activation ............................................................................ 4–26
GSM transmitter activation...................................................................................................................... 4–26
WCDMA transmitter activation................................................................................................................ 4–29
Manual receiver (RX) testing with Phoenix ................................................................................................ 4–30
General instructions for manual receiver testing ................................................................................. 4–30
GSM RX chain activation for manual measurements/GSM RSSI measurement .................................. 4–31
WCDMA RX chain activation for manual measurement ........................................................................ 4–31
WCDMA RSSI measurement ..................................................................................................................... 4–32
Antenna ............................................................................................................................................................... 4–33
Antenna overview ......................................................................................................................................... 4–33
Antenna troubleshooting ............................................................................................................................. 4–35

List of Figures
Figure 22 Linko shields ......................................................................................................................................... 4–7
Figure 23 GSM/WCDMA antenna connection pads........................................................................................... 4–35
Figure 24 Pogo pins for GSM/WCDMA antenna ................................................................................................ 4–35
Figure 25 Cellular antenna fail situation.......................................................................................................... 4–36
Figure 26 C-clip for WLAN/BT/GPS antenna ..................................................................................................... 4–36
Figure 27 C-clip for FM TX antenna ................................................................................................................... 4–37
Figure 28 GND pogo pin for FM TX antenna ..................................................................................................... 4–37

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General instructions for cellular RF troubleshooting

Most RF semiconductors are static sensitive
ESD protection must be applied during repair (ground straps and ESD soldering irons).

Measuring equipment
All measurements should be done using:
• An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10 Mohm//8 pF.
• Willtek 440x/3100, Rohde & Schwarz CMU-200 or CMW-500 radio communication tester.
Note: A mobile phone WCDMA transmitter should never be tested with full TX power (permitted
only if measurements and tests are performed in an RF-shielded environment). Even low power
WCDMA transmitters may disturb nearby WCDMA networks and cause problems to 3G cellular
communication in a wide area.
Note: All measurements with an RF coupler should be performed in an RF-shielded environment
because nearby base stations can disturb sensitive receiver measurements. If there is no possibility
to use an RF-shielded environment, testing at frequencies of nearby base stations should be avoided.
Note: All communication test set screen dumps are from CMU-200. Other testers are different.

RF auto tune
Cellular RF parameters should always be re-tuned by means of Testing and Tuning Tool if one or more of the
RF components have been changed or memory (D3000) is corrupted.

RF shield cans
Once a peel-off type RF shield can is opened, a repair lid (Nokia code 9501325) should always be installed.
RF shielding does not work at all if RF shield cans are left open.

Level of repair
The scope of this guideline is to verify functionality of the cellular RF block as well as possible without
removing RF shields.

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Cellular RF key components

Linko RF has the following key components:
• Älli N7512 (Transceiver RF ASIC)
• Aura N7509 (RF power management ASIC)
• UKKO N7510 (Power amplifier, PA)
• QuBBE Z7513 (Front end module)
Linko RF has separate RF shielding cans for:
• Älli N7512 + surroundings (Shield C)
• QuBBE Z7513 + Ukko PA N7510 (Shield B)
• Aura N7509 + surroundings (Shield A)

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Figure 22 Linko shields

RF shield A is peel-off type and can be opened for repair purposes. The other two RF shield cans (B and C) are
solid and should not be opened in service centers.
The maximum height of the shields is 1.70 mm.

Cellular RF main troubleshooting
Cellular RF main troubleshooting

Context
Always start the cellular RF related troubleshooting procedure by following the diagram below.

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Troubleshooting flow — Page 1 of 2

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Troubleshooting flow — Page 2 of 2

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Self test troubleshooting

Troubleshooting with RF Self tests

Context
ÄLLI (N7512) RF ASIC contains test structures that can be used to detect certain RF related errors. In order to
use these self tests the most efficient way, it is very important that the tests are performed in a certain order,
or at least that the error data is analyzed in this order. The tests are designed so that by going through them
in this order it is easy to find the problem component without any redundant checks. The flowcharts
presented in this document are based on that idea.
The testing order recommended and used in this troubleshooting guide is the following:
1 ST_CDSP_RF_BB_IF test (ID hex. 56)
• Tests the functionality of the BB/Linko serial interface & reset lines.
• If this test fails, it means that there is a problem in programming of the N7512 and all of the following
tests cannot give correct data.
2 ST_CDSP_RF_SUPPLY_TEST (ID hex. 53)
• Tests the functionality of N7512 bias block, regulators, reference voltage line and supply connections,
as well as almost all Aura (N7509) regulator voltages..
• If this test fails, all other N7512 tests can/will fail.
3 ST_CDSP_DIGI_RXTX_IF_TEST (ID hex. 7D)
• Test checks that the digital RX and TX lines between BB and N7512 are properly connected.
4 ST_CDSP_STROBE_TEST (ID hex. 7C)
• Tests the functionality of the RFStrobe signal..
5 ST_CDSP_PA_ID_PIN_TEST (ID hex. 7F)
• The purpose of this test is to identify the PAs of the different vendors.
• Tests also the functionality of the temperature sensor V7502.
6 ST_CDSP_TX_WCDMA_POWER_TEST (ID hex. 4B)
• Tests the basic functionality of the WCDMA transmitter.
To get the best out of these instructions you need to be have the valid schematics at hand.

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Troubleshooting flow

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RF-BB interface self test troubleshooting

Troubleshooting flow

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RF supply self test troubleshooting

Troubleshooting flow

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VBAT level

Check the VBAT level at the L7504. The level should be the same as the battery voltage and always on.

VXO level

Check the VXO level (2.5V) at C2222. The signal is always on when the phone is in local mode.

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VIO level

Check the VIO level (1.8V) at C2806. The signal is always on when the phone is in local mode.

VREF level

Check the Vref level (1.2 V) at C7529.

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The GSM or WCDMA transmitter (or receiver) has to be activated before the Vref supply voltage can be
measured. Follow the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM
transmitter activation' or 'WCDMA transmitter activation'.

VHIA (Vhi) level

Check the VHIA level (2.6 V) at L7509.
The GSM or WCDMA transmitter (or receiver) has to be activated before the VPA supply voltage can be
measured. Follow the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM
transmitter activation' or 'WCDMA transmitter activation'.

VDCDCA (Vlow) level

Check the VDCDCA level (1.5 V) at C7528.
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The WCDMA transmitter has to be activated before the VDCDCA supply voltage can be measured. Follow the
instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → 'WCDMA transmitter activation'.
Note: The VDCDCA signal is continuously on when WCDMA TX is activated.

VPA level
The GSM or WCDMA transmitter has to be activated before the VPA supply voltage can be measured. Follow
the instructions given in chapter 'Manual transmitter (TX) testing with Phoenix → GSM transmitter activation'
or 'WCDMA transmitter activation'.
Check the VPA voltage level at C7514.

In WCDMA mode, the voltage levels should be:
• 0.4…0.8 V @ Start level 0 dBm
• 0.8…1.3 V @ Start level 10 dBm
• 3.0…4.2 V @ Start level 24 dBm
In GSM mode, the voltage levels should be:
• 0.1…0.5 V @ GSM 900 & Tx Power Level 19
• 0.5…1.1 V @ GSM 900 & Tx Power Level 12
• 3.5…4.3 V @ GSM 900 & Tx Power Level 5
Note: The VPA signal is continuously on when WCDMA TX is activated, but has a pulsed nature in
GSM TX mode (the signal is on only when a GSM TX burst is transmitted).
Note: The VPA signal is not tested by ST_CDSP_RF_SUPPLY_TEST.

RF tuning and testing
RF auto tuning and testing with Nokia Care Suite

Introduction to cellular RF tunings
RM-596 cellular RF engine has been tuned correctly in production. There is no reason to do re-calibration
unless one or more of the RF components are changed or memory (D3000) is corrupted.
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RM-596 can be tuned automatically. Auto tuning is designed to align the phone's RF part easily and faster. It
performs calibrations, tunings and measurements of RX and TX. The results are displayed and logged in a
result file, if initiated.
Note: Always perform RF tuning with the help of the module jig MJ-241, never with RF couplers.
Using an RF coupler in the tuning phase will cause a complete mistuning of the RF part.
Important: After RF component changes, always perform cellular RF auto tuning.

Cable and adapter losses
RF cables and adapters have some losses. They have to be taken into account when the phone is tuned. As
all the RF losses are frequency dependent, the user has to act very carefully and understand the measurement
setup. For RF attenuations of the CA-158RS RF cable, please refer to section 'Service Tools and Service
Concepts'.

Hardware set up
For hardware requirements for auto tuning, please refer to RF testing and BB/RF tuning concept with module
jig in section 'Service Tools and Service Concepts'.

Nokia Care Suite preparations
Install Testing And Tuning Tool add-on application to Nokia Care Suite. Automatic RF testing and tuning is
not possible without this application. There is no more support in Phoenix to auto tune RM-596 product.
Install the phone specific data package, for example Nokia_firmware_RM-596_EUROPE_10.014_v41.0.exe. This
defines phone specific settings.

RF auto tuning procedure
Note: If RF splitter is in use, skip steps 10, 11 and 12.
1

Make sure the phone (in the module jig) is connected to the PC.

Connect the RF cable between the phone (low band antenna connector) and the communication tester.
If an RF splitter is in use, connect both low and high band antenna cables.

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Cellular RF troubleshooting
3

Start Nokia Care Suite application. The following window opens:

Note: The window appearance may differ depending on the Nokia Care Suite version.
Note: Fuse, Multi Software Updater, Product Support Tool For Store and Testing And Tuning Tool
are Care Suite add-on applications. The list is different if there are different add-on applications
installed.
4

To open the application, double-click Testing And Tuning Tool icon.

If the application is able to find a connected phone, the following view will open:

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7
8
9

Note: The window appearance may differ depending on the Nokia Care Suite and Testing And Tuning
Tool versions
Click on the RF Tuning button. The following view opens:

Note: The window appearance may differ depending on the Nokia Care Suite and Testing And Tuning
Tool versions
Select Cellular RF Tunings and Tests from the drop-down menu.
Select the RF cable used (and possible RF splitter / RF shield box) from the drop-down menu. CA-158RS
attenuation values are always taken automatically into account when RM-596 product is connected to
Nokia Care Suite tool.
Click the Run button.

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Cellular RF troubleshooting
Note: The window appearance may differ depending on the Nokia Care Suite and Testing And Tuning
Tool versions
10 If no critical errors happen during the low band RF tuning procedure, the following window will pop up:

11 Change the CA-158RS cable to the high band RF connector on the phone PWB.

12 Click OK and RF tunings will automatically be performed for high cellular bands.
13 RF tunings will be ready when all the tunings and measurements are green in the tool window and no
errors occur.
14 If errors do happen, failed tuning/testing steps are marked with a red color and more detailed results
are shown on the screen. An example fail case is shown below:

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Note: The window appearance may differ depending on the Nokia Care Suite and Testing And Tuning
Tool versions

Automatic RF testing with Nokia Care Suite
Testing And Tuning Tool add-on application can be used also for non-signalling RF tests. The automatic RF
testing procedure is the same as explained in the chapter RF auto tuning procedure, but RF Testing should
be selected in the Testing And Tuning Tool main window instead of RF Tuning .

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Note: The window appearance may differ depending on the Nokia Care Suite and Testing And Tuning
Tool versions.
RF Testing selection does all the same measurements as RF Tuning , but does not perform any tunings.
RF Testing is a safe way to check the basic cellular RF performance of the phone. The following test cases will
be performed (the complete set of measurements may differ depending on the data package content):
• GSM SNR
• GSM RSSI
• GSM / EDGE TX Power Level
• GSM Modulation & Switching spectrum
• GSM EDGE EVM
• GSM Burst Template
• GSM Phase Error
• WCDMA RSSI
• WCDMA SNR
• WCDMA TX Power Range
• WCDMA TX Max Output Power
• WCDMA ACP
• WCDMA EVM

Troubleshooting with Testing And Tuning Tool

Context
If limit fails occur while RF tests are performed with Testing And Tuning Tool, the user has to be very careful
to understand the measurement results. Fails may occur because of many reasons:
1 RF attenuation between the phone and the communication tester is something else as expected by the
Testing And Tuning Tool. Please check that cable, splitter and shield box selections are correct in the
Testing And Tuning Tool main window.
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2 Test limits (specified in the product specific data package) are quite tight. Small limit violations do not
always mean that the tested product is broken, but the RF performance may not be as good as it should
be.
3 RX measurements (RSSI, SNR) may fail because of strong signals from base stations nearby. It is
recommended to always perform RF measurements in an RF-shielded environment (in an RF-shield box
or room).
4 The phone is really broken and needs more specific troubleshooting. Typical for these cases is that RF
Testing gives measurement results which are far from the test limits.
Note: Start the more specific troubleshooting always from the chapter Cellular RF main
troubleshooting (page 4–7 ) . The troubleshooting flow below may be misleading if followed
without upper level instructions.

Troubleshooting flow — Page 1 of 3

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Troubleshooting flow — Page 2 of 3

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Troubleshooting flow — Page 3 of 3

Manual transmitter (TX) testing with Phoenix

General instructions for transmitter (TX) activation
Please note the following before performing transmitter tests:
• TX troubleshooting requires TX operation
• Do not transmit on frequencies that are in use
• The transmitter can be controlled in local mode for diagnostic purposes
• The most useful Phoenix tool for GSM transmitter testing is “RF Controls”, in WCDMA transmitter testing
the best tool is “TX Control”
Note: Never activate the GSM or WCDMA transmitter without a proper antenna load. Always connect
a 50 Ω load to the RF connector (antenna, RF measurement equipment or at least a 2 W dummy
load), otherwise the power amplifier (PA) may be damaged.

GSM transmitter activation

Steps
1. Set the phone to local mode.
2. Activate the RF controls tool in Phoenix ( Testing → GSM → RF Controls ).
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3. Make settings as shown in the figure:

4. GSM transmitter is activated when Active Unit is set to “Tx”. Aura (N7509) supply voltages are on for
measurement purposes after this step is completed.
5. Optional step (not needed if GSM TX activation only required): Check the basic TX parameters (i.e. power,
phase error, modulation and switching spectrum) manually, using a communication analyzer (for example
CMU–200). Change power level (in “RF Controls” tool) and make sure the power reading follows
accordingly.

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WCDMA transmitter activation

Steps
1. Set the phone to local mode.
2. In Phoenix, select Testing → WCDMA → TX Control .
3. Select Algorithm mode tab.
4. In the TX Control window, make settings as in the figure:

5. Click Send to enable the settings and activate TX. If settings are changed (e.g. new channel or power level),
you have to click RF Stop and Send again. Aura (N7509) supply voltages are on for measurement purposes
after this step is completed.
6. Optional step (not needed if WCDMA TX activation only required): Check the basic TX parameters using a
communication analyzer (for example CMU–200).
Note: RM-596 WCDMA TX power classes: WCDMA I, IV, V and VIII class 3 (maximum output power
+24 dBm), WCDMA II class 4 (maximum output power +21 dBm).

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Manual receiver (RX) testing with Phoenix

General instructions for manual receiver testing
RX can be tested manually by making a phone call or in local mode. For the local mode testing, use Phoenix
service software.
The most important RX measurement in local mode is RSSI reading. This test measures the signal strength
of the received signal. For GSM RSSI measurements, see chapter GSM RX chain activation for manual
measurements/GSM RSSI measurement. For a similar test in WCDMA mode, see chapter WCDMA RSSI
measurement.

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GSM RX chain activation for manual measurements/GSM RSSI measurement

Prerequisites
Connect a signal generator to a proper RF connector on the phone PWB (note: there are two antenna
connectors for cellular RF on the phone PWB, one for low bands and one for high bands).

Steps
1. Set the phone to local mode.
2. Activate GSM RSSI reading in Phoenix ( Testing → GSM → RSSI Reading )

3. Use the following frequrencies and RF levels in RF generator for different GSM bands:
Setting

GSM850

GSM900

GSM1800

GSM1900

Phoenix: Monitor

190

700

661

RF frequency

881.6 MHz

942.4 MHz

1842.8 MHz

1960.0 MHz

Signal generator
frequency

881.66771 MHz

942.46771 MHz

1842.86771 MHz

1960.06771 MHz

Signal generator
RF level (CW
signal)

-60dBm

Channel

Results
The RSSI level reading should reflect the level of the signal generator (- losses) +/- 5 dB.
When varying the level in the range of -30 to -102 dBm, the reading should follow within +/-5 dB.

WCDMA RX chain activation for manual measurement

Steps
1. Set the phone to local mode.
2. Activate RX Control tool in Phoenix (Testing —> WCDMA —> RX Control) .
3. In the RX Control window, make the following settings:

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4. Click Start to activate the WCDMA RX. If the settings are changed later on (for example, change of channel)
you have to click Stop and Start again.
Note: Channels for testing: WCDMA I 10700, II 9800, IV 1637, V 4408, VIII 3012.
Note: Clicking Stop also disables TX control if it was active.

WCDMA RSSI measurement

Prerequisites
WCDMA RX must be activated before RSSI can be measured. For instructions, please refer to chapter WCDMA
RX chain activation for manual measurement. Connect a signal generator to a proper RF connector on the
phone PWB (note: there are two antenna connectors for cellular RF on the phone PWB, one for low bands
and one for high bands).

Steps
1. Use the following frequencies and RF levels in RF generator for different WCDMA bands:
Setting

WCDMA I

WCDMA II

WCDMA IV

WCDMA V

WCDMA VIII

Phoenix: Channel

10700

9800

1637

4408

3012

RX frequency

2140.0 MHz

1960.0 MHz

2132.4 MHz

881.6 MHz

942.4 MHz

Signal generator
frequency

2141.0 MHz

1961.0 MHz

2133.4 MHz

882.6 MHz

943.4 MHz

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Setting
Signal generator
RF level (CW
signal)

WCDMA I
-48 dBm

WCDMA II
-48 dBm

WCDMA IV
-48 dBm

WCDMA V
-48 dBm

WCDMA VIII
-48 dBm

2. Activate WCDMA RSSI reading in Phoenix (Testing —> WCDMA —> Rx Power Measurement) .
3. In the Rx Power Measurement window, make the following settings:

4. Click Start to perform the measurement.

Results
The Result reading should reflect the level of the signal generator (- losses) +/- 5 dB.
When varying the level in the range of -40 to -100 dB, the reading should follow within +/- 5 dB.
Note: In some versions of the Phoenix service tool, the WCDMA Rx Power Measurement tool does
not work as it should. In these cases, the result is something really small (for example -8387684.9).

Antenna
Antenna overview
RM–596 has three internal antennas:
• The main antenna which is integrated to the lower end gap of the phone
• GPS/WLAN/Bluetooth antenna below the upper end gap of the phone
• FM TX antenna which is integrated to the decoration part surrounding the main camera
The main antenna covers GSM and WCDMA bands and has separate antenna feeds for low and high bands.
Connection from the phone PWB to the antenna flex is implemented by pogo pins (3pcs). The main antenna
consists of an antenna flex which is integrated between two plastic parts in the lower end gap of the phone.

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GPS, BT and WLAN RF interfaces are connected to one common antenna. RF feed from the phone PWB to the
antenna is made by one spring clip.

The FM TX antenna is a metallic decoration part at the top of the camera bumb. RF feed from the PWB is
implemented by a spring contact and a GND connection to the PWB by a pogo pin.

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Antenna troubleshooting

Cellular antenna
The main antenna is functioning normally when the feed and GND pads take proper contact to the pogo pins
on the phone PWB, and the antenna part is visually intact.
The main antenna has three connection pads. Check that these pads have a proper contact to the pogo pins
on the phone PWB. Check also that all three pogo pins exist and work properly.

Figure 23 GSM/WCDMA antenna connection pads

Figure 24 Pogo pins for GSM/WCDMA antenna

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A typical fail situation is shown in the picture below. Cellular antenna fastenings are broken or screws holding
the end gap are loose. There is a visible gap between the phone and the antenna part.

Figure 25 Cellular antenna fail situation

WLAN/BT/GPS antenna
Check that the only pad in the WLAN/Bluetooth/GPS antenna takes a proper contact to the C-clip on the phone
PWB and the C-clip is clearly open.

Figure 26 C-clip for WLAN/BT/GPS antenna

FM TX antenna
Check that the pad in the FM TX antenna takes a proper contact to the C-clip on the phone PWB and the C-clip
is clearly open. Check also that a GND pogo pin exists in the phone mechanics and takes a proper contact to
the PWB.

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Figure 27 C-clip for FM TX antenna

Figure 28 GND pogo pin for FM TX antenna

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Issue 2

Nokia Customer Care

5 — Camera Module
Troubleshooting

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Camera Module Troubleshooting

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Camera Module Troubleshooting

Table of Contents
Introduction to camera module troubleshooting ............................................................................................. 5–5
The effect of image taking conditions on image quality .................................................................................. 5–6
Image quality analysis ...................................................................................................................................... 5–10
Possible faults in image quality................................................................................................................... 5–10
Testing for dust in camera module ............................................................................................................. 5–11
Testing camera image sharpness ................................................................................................................ 5–12
Effects of dirty or defective camera lens protection window................................................................... 5–13
Faulty pixels in images ................................................................................................................................. 5–14
Flash photography problems ....................................................................................................................... 5–15
Main (back) camera troubleshooting flowcharts............................................................................................ 5–16
No recognizable viewfinder image ............................................................................................................. 5–16
Bad image quality troubleshooting ............................................................................................................ 5–17
Main camera troubleshooting...................................................................................................................... 5–18
Secondary camera troubleshooting ................................................................................................................. 5–20
Flash troubleshooting........................................................................................................................................ 5–22

List of Figures
Figure 29 Only center part of image is in focus due to limited depth of focus .............................................. 5–6
Figure 30 Blurring caused by shaking hands ..................................................................................................... 5–7
Figure 31 Near objects get skewed when taking images from a moving vehicle.......................................... 5–7
Figure 32 Noisy image taken in +70 degrees Celsius ........................................................................................ 5–8
Figure 33 Image taken against light ................................................................................................................... 5–8
Figure 34 Flicker in an image; object illuminated by strong fluorescent light............................................... 5–9
Figure 35 A lens reflection effect caused by sunshine....................................................................................... 5–9
Figure 36 Good image taken indoors............................................................................................................... 5–10
Figure 37 Good image taken outdoors ............................................................................................................ 5–10
Figure 38 Effects of dust on optical path ......................................................................................................... 5–11
Figure 39 Image taken with clear protection window .................................................................................. 5–13
Figure 40 Image taken with greasy protection window ............................................................................... 5–13
Figure 41 Image of point light sources taken with a clean protective window.......................................... 5–14
Figure 42 Image of point light sources taken with a dirty (finger print) protective window ................... 5–14
Figure 43 Enlargement of a hot pixel............................................................................................................... 5–15
Figure 44 Light from the flash has reflected on particles in front of the camera ....................................... 5–15

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Camera Module Troubleshooting

Introduction to camera module troubleshooting

Background, tools and terminology
Faults or complaints in camera operation can be roughly categorised into three subgroups:
1 Camera is not functional at all; no image can be taken.
2 Images can be taken but there is nothing recognizable in them.
3 Images can be taken and they are recognizable but for some reason the quality of images is seriously
degraded, or customer complains about image quality.
Image quality is very hard to measure quantitatively, and even comparative measurements are difficult
(comparing two images) to do, if the difference is small. Especially if the user is not satisfied with his/her
device's image quality, and tells, for example, that the images are not sharp, it is fairly difficult to accurately
test the device and get an exact figure which would tell whether the device is functioning properly.
Often subjective evaluation has to be used for finding out if a certain property of the camera is acceptable
or not. Some training or experience of a correctly operating reference device may be needed in order to
detect what actually is wrong, or is there anything wrong at all.
It is easy for the user to take bad images in bad conditions. Therefore the camera operation has to be checked
always in constant conditions (lighting, temperature) or by using a second, known-to-be good device as
reference. Experience helps significantly in analysing image quality.

Terms
Autofocus

Camera module contains lens movement mechanics for focus adjustment.
Autofocus enables camera to take sharp images of objects positioned
between 10cm to infinity. During AF the viewfinder image will be
momentarily blurred as the camera searches for the right focus setting.

Digital zoom

Digital zoom is done by first cropping the image by the zoom ratio and
then upscaling it to the output resolution. This will decrease the image
quality especially with high zoom ratios.

Dynamic range

Camera's ability to capture details in dark and bright areas of the scene
simultaneously.

Exposure time

Camera modules use silicon sensor to collect light and for forming an
image. The imaging process roughly corresponds to traditional film
photography, in which exposure time means the time during which the
film is exposed to light coming through optics. Increasing the time will
allow for more light hitting the film and thus results in brighter image. The
operation principle is exactly the same with silicon sensor, but the shutter
functionality is handled electronically.

Flicker

Phenomenon, which is caused by pulsating in scene lighting, typically
appearing as wide horizontal stripes in an image.

ND-filter

Neutral density filter is a filter which is used in very bright conditions to
reduce the amount of light hitting the sensor. The filter is built into the
camera module and applied automatically when needed.

Noise

Variation of response between pixels with same level of input illumination.

Resolution

Usually the amount of pixels in the camera sensor. In some occasions the
term resolution is used for describing the sharpness of the images.

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Sensitivity

Camera module's sensitivity to light. In equivalent illumination conditions,
a less sensitive camera needs a longer exposure time to gather enough
light in forming a good image. Analogous to ISO speed in photographic
film.

Sharpness

Good quality images are 'sharp' or 'crisp', meaning that image details are
well visible in the picture. However, certain issues, such as non-idealities
in optics, cause image blurring, making objects in picture to appear 'soft'.
Each camera type typically has its own level of performance.

Shutter

The electronic shutter is used when short exposure times are needed and
in video. When the mechanical shutter is used a black sheet will cover the
lens after the exposure.

The effect of image taking conditions on image quality
There are some factors, which may cause poor image quality, if not taken into account by the end user when
shooting images, and thus may result in complaints. The items listed are normal to camera operation and
are not a reason for changing the camera module.

Autofocus
When the camera is focusing a lens is moved inside the module to give the sharpest possible image. This
camera module is specified to operate satisfactorily from 10 cm to infinite distance of scene objects. Trying
to photograph objects closer than 10 cm is likely to result in a blurred out of focus image. The lack of sharpness
is first visible in full resolution images. Images taken very close to the subject, a limited depth of focus will
be visible, that is the upper or lower parts of the image may be out of focus. This is normal; do not change
the camera module.

Figure 29 Only center part of image is in focus due to limited depth of focus

The amount of light available
In dim conditions camera runs out of sensitivity. The exposure time is long (especially in the night mode)
and the risk of getting shaken (= blurred) images increases. In addition, image noise level grows. The
maximum exposure time in the night mode is ¼ seconds. Therefore, images need to be taken with extreme
care and by supporting the phone when the amount of light reflected from the target is low. Because of the
longer exposure time and larger gain value, noise level increases in low light conditions. Sometimes blurring
may even occur in daytime, if the image is taken very carelessly. See the figure below for an example. This
is normal; do not change the camera module.
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Figure 30 Blurring caused by shaking hands

Movement in bright light
If an image is taken of moving objects or if the device is used in a moving vehicle, object 'skewing' or 'tilting'
may occur. This phenomenon is fundamental to most CMOS camera types, and may happen when using the
electronic shutter. The movement of camera or object sometimes cause blurring indoors or in dim lighting
conditions because of long exposure time. This is normal; do not change the camera module.

Figure 31 Near objects get skewed when taking images from a moving vehicle

Temperature
High temperatures inside the mobile phone cause more noise to appear in images. For example, in +70
degrees (Celsius), the noise level may be very high, and it further grows if the conditions are dim. If the phone
processor has been heavily loaded for a long time before taking an image, the phone might have considerably
higher temperature inside than in the surrounding environment. This is also normal to camera operation;
do not change the camera module.

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Figure 32 Noisy image taken in +70 degrees Celsius

Phone display
If the display contrast is set too dark, the image quality degrades: the images may be very dark depending
on the setting. If the display contrast is set too bright, image contrast appears bad and "faint". This problem
is solved by setting the display contrast correctly. This is normal behaviour; do not change the camera module.

Basic rules of photography (especially shooting against light)
Because of dynamic range limitations, taking images against bright light might cause either saturated image
or the actual target appear too dark. In practice, this means that when taking an image indoors and having,
for example, a window behind the object, the result is usually poor. This is normal behaviour; do not change
the camera module.

Figure 33 Image taken against light

Flicker
In some occasions a bright fluorescent light may cause flicker in the viewfinder and captured image. This
phenomenon may also be a result, if images are taken indoors under the mismatch of 50/60 Hz electricity
network frequency. The electricity frequency used is automatically detected by the camera module. In some
very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon
increases. Flickering occurs also under high artificial illumination level. Flickering only occurs when the rolling
shutter is used. This is normal behaviour; do not change the camera module.
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Figure 34 Flicker in an image; object illuminated by strong fluorescent light

Bright light outside of image view
Especially the sun can cause clearly visible lens glare phenomenon and poor contrast in images. This happens
because of undesired reflections inside the camera optics. Generally this kind of reflections are common in
all optical systems. This is normal behaviour; do not change the camera module.

Figure 35 A lens reflection effect caused by sunshine

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Examples of good quality images

Figure 36 Good image taken indoors

Figure 37 Good image taken outdoors

Image quality analysis
Possible faults in image quality
When checking for possible errors in camera functionality, knowing what error is suspected significantly
helps the testing by narrowing down the amount of test cases. The following types of image quality problems
may be expected to appear:
• Dust (black spots)
• Lack of sharpness
• Bit errors
In addition, there are many other kinds of possibilities for bad image quality, but those are ruled out from
the scope of this document since the probability of their appearance is small.

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Testing for dust in camera module

Symptoms and diagnosis
For detecting these kinds of problems, take an image of a uniform white surface and analyse it in full
resolution. A good quality PC monitor is preferred for analysis. Search carefully, since finding these defects
is not always easy. Figure "Effects of dust on optical path" is an example image containing easily detectable
dust problems.
When taking a white image, use uniformly lightened white paper or white wall. One possibility is to use
uniform light but in this case make sure that the camera image is not flickering when taking the test image.
In case flickering happens, try to reduce illumination level. Use JPEG image format for analysing, and set the
image quality parameter to ‘High Quality’.
Black spots in an image are caused by dirt particles trapped inside the optical system. Clearly visible and
sharp edged black dots in an image are typically dust particles on the image sensor. These spots are searched
for in the manufacturing phase, but it is possible that the camera body cavity contains a particle, which may
move onto the image sensor active surface, for example, when the phone is dropped. Thus it is also possible
that the problem will disappear before the phone is brought to service. The camera should be replaced if the
problem is present when the service technician analyses the phone.
If a dust particle is lying on the infrared filter surface on either side, they are hard to locate because they are
out of focus, and appear in the image as large, grayish and fading-edge 'blobs'. Sometimes they are invisible
to the eye, and thus the user probably does not notice them at all. However, it is possible that a larger particle
disturbs the user, causing need for service.

Figure 38 Effects of dust on optical path

If large dust particles get trapped on top of the lens surface in the cavity between camera window and lens,
they will cause image blurring and poor contrast. The dust gasket between the window and lens should
prevent any particles from getting into the cavity after the manufacturing phase.
If dust particles are found on the sensor, this is classified as a manufacturing error of the module and the
camera should be replaced. Any particles inside the cavity between the protection window and lens have
most probably been trapped there in the assembly phase at a Nokia factory. Unauthorized disassembling of
the product can also be the root of the problem. However, in most cases it should be possible to remove the
particle(s) by using clean compressed air. Never wipe the lens surface before trying compressed air; the
possibility of damaging the lens is substantial. Always check the image sharpness after removing dust.

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Testing camera image sharpness

Symptoms and diagnosis
If pictures taken with a device are claimed to be blurry, there are five possible sources for the problem:
1 The protection window is fingerprinted, soiled, dirty, visibly scratched or broken.
2 The camera module has failed to focus correctly, producing a blurred image.
3 User has tried to take pictures in too dark conditions and images are blurred due to handshake or
movement. This is not a cause to replace camera module.
4 There is dirt between the protection window and the camera lens.
5 The protection window is defective. This can be either a manufacturing failure or caused by the user. The
window should be changed.
A quantitative analysis of sharpness is very difficult to conduct in any other environment than optics
laboratory. Therefore, subjective analysis should be used.
If no visible defects (items 1-4) are found, a couple of test images should be taken. Generally, a wellilluminated typical indoor scene, such as the one in Figure "Good image taken indoors", can be used as a
target. The main considerations are:
• The camera module has to be given time to focus correctly. Correct focusing is normally indicated with a
flashing icon or green bracket in the viewfinder. During focusing, the image in the viewfinder moves
slightly back and forth, this is normal and shows that the lens unit is moving. During the movement a faint
sound can be heard from the camera head.
• The protection window has to be clean.
• The amount of light (300 – 600 lux (bright office lighting)) is sufficient.
• The scene should contain, for example, small objects for checking sharpness. Their distance should be 1
– 2 meters.
• If possible, compare the image to another image of the same scene, taken with a different device. Note
that the reference device has to be a similar Nokia phone.
There are several conditions in which AF operation is challenging for the camera module, i.e. failing from
time to time. These include:
• Low light scenes and night mode
• Scenes with low contrast
• Fast-moving objects
AF operation is disabled on purpose in "night", "landscape", and "sports" modes.
When using these modes the lens is set to a predetermined focal position and is not moved during use.
The AF lens is fixed in hyper focal in video mode.
Under low light and night mode the AF function is slower than under good light, it may even fail to find
correct focus position. Low contrast scenes or fast moving objects may also slow down or cause AF to fail.
This is normal operation, and is not a cause to replace camera.
The operation of AF can be tested by taking images of objects at different distances. Good distances are 20
cm, 60 cm and infinity (>3 m). Any LED or xenon flashes should not be used while taking the images.
The taken images should be analysed on PC screen at 100% scaling simultaneously with a reference image.
Pay attention to the computer display settings; at least 65000 colors (16 bit) have to be used. 256 (8-bit)
color setting is not sufficient; true color (24 bit, 16 million colors) or 32 bit (full color) setting is recommended.
If the differences are noticeable at a glance and also if the one under investigation is significantly inferior,
the module might have a faulty lens. In this case, the module should be changed. Always re-check the
resolution after changing the camera module. If a different module produces a clearly noticeable quality gap,
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the fault is probably in the camera window. Check the window by looking carefully through it when replacing
the module. As references Figure "Good image taken indoors" and Figure "Good image taken outdoors" can
be used. Another possibility is to use a service point comparison phone, if available.

Effects of dirty or defective camera lens protection window
The following series of images demonstrates the effects of fingerprints on the camera protection window.
Note: The effects of any dirt in images can vary very much; it may be difficult to judge if the window
has been dirty when some image has been taken or if something else has been wrong. That is why
the cleanness of the protection window should always be checked and the window should be wiped
clean with a suitable cloth.

Figure 39 Image taken with clear protection window

Figure 40 Image taken with greasy protection window

Bright point light sources might cause images that have flares around the light source if the protection
window is dirty. A smeared fingerprint may be hard to see on the protective window but if will affect the
image quality. These flares can be avoided by cleaning the window with a suitable cloth.

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Figure 41 Image of point light sources taken with a clean protective window

Figure 42 Image of point light sources taken with a dirty (finger print) protective window

Faulty pixels in images
Faulty pixels are pixels that do not respond to light in the same way as the pixels around them. There are
three main types of faulty pixels, dead, stuck and hot pixels.
Dead pixels are always black or significantly darker than their surrounding. Dead pixels appear as black spots
in all lightning conditions. Camera modules producing images with dead pixels that are clearly noticeable
should be replaced.
If the pixel remains always saturated to its maximum value it is stuck. Stuck pixels may appear as red, green,
blue or white spots in all lightning conditions. Camera modules producing images with one or more stuck
pixels should be replaced.
Hot pixels are pixels that easily saturate in dim light conditions. It is normal to get a lot of noise and hot
pixels in night conditions or otherwise dark conditions. The hot pixels should disappear when the ambient
light is increased, but may still appear in darker areas of an otherwise well illuminated scene. This is normal
behavior, do not change the camera.
When examining an image for defect pixels, test images should be viewed as 100% enlargements on a PC
monitor.

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Figure 43 Enlargement of a hot pixel

Flash photography problems
Use of flash device may affect the image in many ways.
• White balance errors. The image may get a wrong tone due to mixing of flash colour temperature and
ambient lightning. This is unwanted but normal feature.
• Dust reflections. Dust or water drops in front of the flash unit may reflect strongly to the camera sensor.
See the following figure.

Figure 44 Light from the flash has reflected on particles in front of the camera

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Camera Module Troubleshooting

Main (back) camera troubleshooting flowcharts
No recognizable viewfinder image

Troubleshooting flow

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Bad image quality troubleshooting

Troubleshooting flow

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Camera Module Troubleshooting

Main camera troubleshooting

Context
The following references on the PWB help in the effective debugging and troubleshooting of the main/
primary camera.
Sr. No

Reference

Description

X1476

Primary camera socket

R1477, R1478

Pull-up resistors on primary camera I2C lines. Resistor value 4.7
KOHMS.

D1400

BCM2727B IC

N1515

VCAM_1V8 regulator

N1517

VCAM_2V8 regulator

The following test points on the PWB help in the effective debugging and troubleshooting.
Sr. No

Signal name

Measuring point

Description

VBAT

L1476/C1476

VBAT supply to primary camera

VCAM_1V8

L1477/C1479

1.8V supply to primary camera

VCAM_2V8

L1478/C1482

2.8V supply to primary camera

VDIG_ENABLE

J1515

Enable signal for VCAM_1V8 regulator. This
signal needs to be High for the regulator to
be On.

VANA_ENABLE

J1516

Enable signal for VCAM_2V8 regulator. This
signal needs to be High for the regulator to
be On.

PRI_CAM_CLK

J1476

External clock signal to primary camera

PRI_CAM_SHUTDO
WN

J1477

Shutdown signal to primary camera. This
needs to be High for the camera to be Up.

PRI_CAM_I2C(1:0)

R1477, R1478

I2C signals for primary camera

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Troubleshooting flow

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Camera Module Troubleshooting

Secondary camera troubleshooting

Context
The following references on the PWB help in the effective debugging and troubleshooting of the secondary
camera.
Sr. No

Reference

Description

H1487

Secondary camera

R1487, R1488

Pull-up resistors on the secondary camera I2C lines. Resistor value
4.7 KOHMS.

D1400

BCM2727B IC

N1515

VCAM_1V8 regulator

N1517

VCAM_2V8 regulator

The following test points on the PWB help in the effective debugging and troubleshooting.
Sr. No

Signal name

Measuring point

Description

VCAM_1V8

L1487/C1488

1.8V supply to secondary camera

VCAM_2V8

L1488/C1491

2.8V supply to secondary camera

VDIG_ENABLE

J1515

Enable signal for VCAM_1V8 regulator. This signal
needs to be High for the regulator to be On.

VANA_ENABLE

J1516

Enable signal for VCAM_2V8 regulator. This signal
needs to be High for the regulator to be On.

SEC_CAM_CLK

J1487

External clock signal to secondary camera

SEC_CAM_SHUTDOW
N

J1488

Shutdown signal to secondary camera. This
needs to be High for the camera to be Up.

SEC_CAM_I2C(1:0)

R1487, R1488

I2C signals for secondary camera

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Troubleshooting flow

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Flash troubleshooting

Context
The following references on the PWB help in the effective debugging and troubleshooting of the flash.
Sr. No

Reference

Description

N1504

Flash driver

X1505

Habanero flash connector

D1400

BCM2727B IC

The following test points on the PWB help in the effective debugging and troubleshooting of the flash.
Sr. No

Signal name

Measuring point

Description

VBAT

L1507/pin3 of X1505

VBAT supply to flash and flash driver

FLASH_READY_XE

J1430

Ready signal from flash module

FLASH_CHARGE_XE

J1504

Charge signal to flash module. This needs to
be High for the charging to start.

CAM_FLASH_STROBE

J1503

Strobe signal to flash module. This needs to
be High for flashing.

FLASH_INDICATOR_XE

R1508

Flash indicator signal to flash driver

FLASH_AFASSIST_XE

J1506

Flash auto focus signal to flash driver

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Troubleshooting flow

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Nokia Customer Care

6 — System Module

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System Module

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System Module

Table of Contents
Introduction........................................................................................................................................................... 6–5
Phone description ............................................................................................................................................ 6–5
Energy management.......................................................................................................................................... 6–11
Battery and charging .................................................................................................................................... 6–11
Normal and extreme voltages ..................................................................................................................... 6–11
Power key and system power up ................................................................................................................ 6–12
Modes of operation ....................................................................................................................................... 6–12
Power distibution ......................................................................................................................................... 6–13
Clocking scheme ............................................................................................................................................ 6–14
SIM interface ....................................................................................................................................................... 6–15
Device memory ................................................................................................................................................... 6–16
BOB1.0M-b module............................................................................................................................................. 6–16
GPS interface ....................................................................................................................................................... 6–18
USB ....................................................................................................................................................................... 6–19
USB interface and charging .......................................................................................................................... 6–19
MicroUSB connector ...................................................................................................................................... 6–19
Charger interface ................................................................................................................................................ 6–20
User interface...................................................................................................................................................... 6–20
Touch module................................................................................................................................................ 6–20
Proximity sensor ........................................................................................................................................... 6–21
Imaging and video ........................................................................................................................................ 6–22
Multimedia application processor .......................................................................................................... 6–22
Display module......................................................................................................................................... 6–22
TV-out interface........................................................................................................................................ 6–22
Cameras..................................................................................................................................................... 6–23
Illumination ................................................................................................................................................... 6–24
Keyboard interface........................................................................................................................................ 6–25
Ambient Light Sensor (ALS) .......................................................................................................................... 6–25
Accelerometer................................................................................................................................................ 6–26
Magnetometer ............................................................................................................................................... 6–27
Audio concept ..................................................................................................................................................... 6–28
Audio HW architecture.................................................................................................................................. 6–28
Internal earpiece ........................................................................................................................................... 6–30
Internal handsfree (IHF) speakers ............................................................................................................... 6–30
Internal microphones ................................................................................................................................... 6–30
External earpiece and microphone ............................................................................................................. 6–31
Vibra ............................................................................................................................................................... 6–31
AV connector.................................................................................................................................................. 6–32
Cellular RF technical description ....................................................................................................................... 6–32
RF block .......................................................................................................................................................... 6–32
QuBBE ............................................................................................................................................................. 6–33
Receiver (RX) .................................................................................................................................................. 6–33
Synthesizer..................................................................................................................................................... 6–33
Transmitter (TX) ............................................................................................................................................ 6–33
Frequency mappings.......................................................................................................................................... 6–35
GSM850 frequencies ...................................................................................................................................... 6–35
EGSM900 frequencies .................................................................................................................................... 6–35
GSM1800 frequencies.................................................................................................................................... 6–36
GSM1900 frequencies.................................................................................................................................... 6–38
WCDMA I (2100) Rx frequencies ................................................................................................................... 6–39
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System Module
WCDMA I (2100) Tx frequencies ...................................................................................................................
WCDMA II (1900) frequencies .......................................................................................................................
WCDMA IV (1700/2100) frequencies ............................................................................................................
WCDMA V (850) frequencies .........................................................................................................................
WCDMA VIII (900) frequencies......................................................................................................................

6–40
6–41
6–42
6–43
6–44

List of Tables
Table 11 Nominal voltages................................................................................................................................ 6–11

List of Figures
Figure 45 Battery pin order ...............................................................................................................................
Figure 46 Blade battery connector ...................................................................................................................
Figure 47 Power distribution diagram ............................................................................................................
Figure 48 SIM interface ......................................................................................................................................
Figure 49 Puzzle SIM connector circuitry ........................................................................................................
Figure 50 BOB1.0M-b module block diagram and application circuit...........................................................
Figure 51 BOB1.0M-b interface in RM-596 .......................................................................................................
Figure 52 GPS interface......................................................................................................................................
Figure 53 USB interface......................................................................................................................................
Figure 54 MicroUSB connector ..........................................................................................................................
Figure 55 Charger interface...............................................................................................................................
Figure 56 Touch system block diagram ...........................................................................................................
Figure 57 Proximity sensor ...............................................................................................................................
Figure 58 BCM2727B block diagram .................................................................................................................
Figure 59 Primary camera interface .................................................................................................................
Figure 60 Secondary camera interface.............................................................................................................
Figure 61 Illumination .......................................................................................................................................
Figure 62 Ambient Light Sensor .......................................................................................................................
Figure 63 Accelerometer....................................................................................................................................
Figure 64 Magnetometer ...................................................................................................................................
Figure 65 RM-596 Audio block diagram...........................................................................................................
Figure 66 Internal earpiece diagram................................................................................................................
Figure 67 Internal handsfree (IHF) speaker diagram .....................................................................................
Figure 68 Internal microphones diagram........................................................................................................
Figure 69 Vibra diagram ....................................................................................................................................
Figure 70 AV connector......................................................................................................................................
Figure 71 Linko RF block diagram ....................................................................................................................

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6–11
6–11
6–13
6–15
6–16
6–17
6–18
6–18
6–19
6–19
6–20
6–21
6–21
6–22
6–23
6–24
6–25
6–26
6–27
6–28
6–29
6–30
6–30
6–31
6–31
6–32
6–32

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System Module

Introduction
Phone description
RAPUYAMA is the main digital baseband ASIC in the phone. It contains functionality for both WCDMA and GSM
EDGE. The hardware accelerator is used for imaging and video.
GAZOO/PEARL (N2200) is the main audio and energy management controller for the phone.

Key components
Function
Main PWB

Description

Item ref

3CE

Upper flex module
UI flex module
Flash flex module
Baseband ASIC

EM ASIC GAZOO/PEARL

N2200

RF ASIC

ÄLLI

N7512

Processor

RAPUYAMA

D2800

GSM/WCDMA PA

UKKO

N7510

GSM850/900/1800/1900
WCDMA I, II, IV, V and VIII
Oscillators

VCTCXO

G7500

TCXO 16.368 MHZ

G6200

Crystal 32.768KHZ

B2200

Crystal 38.4 MHZ

B7500

Crystal 19.2 MHZ

B1400

CMT memory

Combo POP4 2G DDR + 4G M3 NAND (stacked with RAPU)

D3000

Back-up capacitor

RTC back-up capacitor

G2200

WLAN/ Bluetooth/ FM
radio/ FM transmitter

BOB 1.0M-b module

N6300

GPS

GPSCost4.1

N6200

Battery

BL-4D

Battery connector

Tabby blade interface

X2070

UI flex connector

Board-to board connector for UI flex module

X2500

Display connector

Board-to-board connector

X1600

RF connectors

X6701
X7500
X7501

USB transceiver

D3300

MicroSD connector

X3200

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System Module
Function

Description

Item ref

eMMC

16GB internal mass memory

D3200

USB connector

Micro USB-AB

X3300

SIM connector

X2700

Resetto

HW reset with power key

N2400

IVE

Imaging processor

D1400

AV connector

Standard 3.5mm

X2001

Charging connector

Dynamo

X3350

HDMI connector

X1650

Earpiece

Petra

B2111

Microphone

Knopfler

B2100
B2101

IHF

Donau

Vibra

B2150
M2105

Accelerometer

3-axis accelerometer Ahti

N1103

Magnetometer

3-axis magnetic sensor

N1105

Digital Ambient Light
Sensor

Pupumon

V1100

Dynamo charging circuit

N3350

USB charging circuit

N3301

Camera socket

X1476

Xenon flash connector

X1505

Front camera

H1487

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System Module

Key component placement

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System Module

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System Module

System module block diagram

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System Module

Board and module connections

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System Module

Energy management
Battery and charging

BP-4L battery
The phone is powered by a 3-pole BL-4D battery 1200 mAh battery. The three poles are named VBAT, BSI and
GND where the BSI line is used to recognize the battery capacity. This is done by means of an internal battery
pull down resistor.

Figure 45 Battery pin order

The battery temperature is estimated by measuring separate temperature NTC resistor via the BTEMP line of
EM ASIC N2200. This is located on the main PWB, near the battery connector.

Battery connector
The battery connector is a blade connector. It has three blades;
• BSI (Battery size indicator)
• GND (Ground)
• VBAT (Battery voltage)

Figure 46 Blade battery connector

Charging
The phone is charged through the 2 mm Nokia standard interface charger plug. Charging is controlled by
dynamo charging IC BQ24156 (N3350). Dynamo charger detection is handled by EM ASIC (N2200) and external
components are needed to protect the baseband module against EMC, reverse polarity and transient
frequency deviation. For charger detection, a pulse of duration 15ms is sent to EM ASIC via V3370 MOSFET.

Normal and extreme voltages
Energy management is mainly carried out in the EM ASIC (N2200) that contains a number of regulators. In
addition, there are also some external regulators.
In the table below normal and extreme voltages are shown when a BL-4D battery is used.
Table 11 Nominal voltages

Voltage

Voltage [V]

Condition

General Conditions
Nominal voltage
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System Module
Voltage

Voltage [V]

Condition

Higher extreme voltage
(fast charging)

4.230
HW Shutdown Voltages

Vmstr+

2.1 ± 0.1

Off to on

Vmstr-

1.9 ± 0.1

On to off

SW Shutdown Voltages
Sw shutdown

3.15

In call

Sw shutdown

3.25

In idle

Min Operating Voltage
Vcoff+

2.9 ± 0.1

Off to on

Vcoff-

2.6 ± 0.1

On to off

Power key and system power up
When the battery is placed in the phone, the power key circuits are energized. When the power key is pressed,
the system boots up (if an adequate battery voltage is present).
Power down can be initiated by pressing the power key again and the system is powered down with the aid
of SW. The power key is connected to EM ASIC (N2200) via the PWRONX signal.
The PWRONX line cannot be detected when SW hangs. For that reason, the user has to remove the battery.
Because the semi-fixed battery is difficult to remove, a fixed delay circuit Resetto IC (N2400) is used. The
PWRONX is also connected to Resetto. When the user presses the power key beyond 7.5 secs, it generates a
reset which is connected to EM ASIC’s UserResetX line. The UserResetX is entirely HW controlled, so even when
SW hangs, the phone can be powered down by pressing the power key beyond 7.5 sec.

Modes of operation
Mode

Description

NO_SUPPLY

(Dead) mode means that the main battery is not present or its voltage is too low (below
N2200 master reset threshold) and that the back-up battery voltage is too low.

BACK_UP

The main battery is not present or its voltage is too low but back-up battery is adequate
and the 32 kHz oscillator is running.

PWR_OFF

In this mode (warm), the main battery is present and its voltage is over N2200 master
reset threshold. All regulators are disabled, PURX is on low state, the RTC is on and the
oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm), but the
RTC and the oscillator are off.

RESET

RESET mode is a synonym for start-up sequence. RESET mode uses 32 kHz clock to count
the RESET mode delay (typically 16ms).

SLEEP

SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s
activity is low.

FLASHING

FLASHING mode is for SW downloading.

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Power distibution

Figure 47 Power distribution diagram

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Clocking scheme

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System Module

SIM interface
The phone has a SIM (Subscriber Identification Module) interface including a SIM connector.
The SIM interface consists of an internal interface between RAPU and EM ASIC (N2200), and an external
interface between EM ASIC and SIM contacts.

Figure 48 SIM interface

As the phone does not have a traditional battery cover due to semi-fixed battery concept, the SIM card can
be removed and inserted without removing the battery. For safe SIM card functionality, a new Puzzle pushpush SIM reader with card detection and removal pre-warning switches is used.
Pre-warning and card detect signals are connected together in the Puzzle layout symbol, so there is only one
switch connection in the schematics symbol. The combined switch signal is connected through an inverter
to Gazoo/Pearl SimDetX input. The following figure shows the principle of SIM circuitry with the Puzzle.

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RM-596
System Module

Figure 49 Puzzle SIM connector circuitry

The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM
card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is
used.

Device memory
The memory components of the device are internal COMBO POP4 2Gb DDR + 4Gb M3 (NAND), a card reader for
MicroSD, and 16GB eMMC memory which is non-removable and internal to the phone.
The MicroSD is used as a user’s data storage memory. The µSD card is connected to RAPU via EM ASIC which
has an internal level shifter with an ESD protection filter. The μSD card door state is detected by a detect
switch connected to RAPU Genio25. When the door is open, the uSD card is powered off. Hot swap is supported,
which means that the card may be plugged in/out at any time, without removing the battery.
The device uses 16GB eMMC (D3200) external memory. The eMMC interface is a 6-wire serial/parallel data bus
which includes a clock (CLK), 4 data signals (DAT), and command (CMD) wires. The eMMC interface is completely
formed of the GENIOs of RAPU. The eMMC consists of an internal NAND controller and an MMC controller for I/
O interface. It is a dual supply device which requires VCC of 2.9V for the NAND core and VCCQ of 1.8V for the
MMC I/O interface.

BOB1.0M-b module
The BOB1.0M-b module provides full 802.11b,g & n WLAN, BT 2.1 + EDR, FM RDS and FM TX connectivity.

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RM-596
System Module
BOB is the name given to a generic technology release that combines WLAN, Bluetooth, FM Rx and FM TX radio
on a single monolithic IC. RM-596 uses BOB1.0M-b module that consists of a single chip transceiver WL1271,
plus a separate RF front end (FE) device. The BOB1.0M-b release operates in the 2.4GHz (ISM) and the
76-108MHz FM bands.

Figure 50 BOB1.0M-b module block diagram and application circuit

From a troubleshooting point of view, WLAN is tested separately, but BTH, FMRX and FMTX are checked in
parallel.
REFOUT_EXT1 single ended 38.4 MHz analog clock from Linko RF is provided to BOB1.0M-b. The clock request
for the reference clock in the BOB1.0M-b module is shared between WLAN and BTHFM blocks. When either
system requires a clock, this signal will be active. The CLK_REQ is connected to ExtSysClkReq pin of RAPU. The
SLEEPCLK input of 32.768 KHz clock from EM ASIC is used for power management and for FM in low power
mode.
The internal SMPS supplies the whole BOB1.0M-b solution from the phone battery supply, VBAT, apart from
VIO, which is needed for interface signal reference levels.

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RM-596
System Module

Figure 51 BOB1.0M-b interface in RM-596

GPS interface
RM-596 includes an inbuilt single chip GPS receiver GPSCost4.1D, comprising both RF and BB blocks integrated
in a single digital die. GPSCost4.1D is connected to RAPU ASIC via I2C_1 and some GENIOs. GPSCost4.1 D operates
in Multi-master mode and the REF clock is requested via AGPS_CLK_REQ signal connected to RAPU genio46.
REFOUT_EXT2 single ended 38.4 MHz analog clock from Linko RF is provided to GPSCost4.1D.

Figure 52 GPS interface

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System Module

USB
USB interface and charging
The phone has an interface for USB (Universal Serial Bus). USB is a differential serial bus that provides a wired
connectivity between a PC and peripheral devices, as in this case a mobile phone.

Figure 53 USB interface

The phone supports USB 2.0 with High-Speed (480 Mbps).
Hot swap is supported, which means that USB devices may be plugged in and out at any time.

MicroUSB connector
This phone is provided with a specific connector for microUSB.

Figure 54 MicroUSB connector

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RM-596
System Module

Charger interface
The charger interface is a 2 mm Dynamo charger plug. Older chargers with a 3.5 mm plug are supported via
the charger adapter cable CA-44.
Charging is controlled by Dynamo charging SMPS circuit. EM ASIC is used only for waking up the system when
the charger is connected.

Figure 55 Charger interface

User interface
Touch module
This phone uses Synaptic capacitive touch series 2000 for displays.
The Synaptics DT touch module is interfaced to I2C0 bus of RAPU via level shifter (N2500). RAPU’s GenIO123
is used for Touch INT. The level shifter is used in between the RAPU and Synaptics touch module for level
translation from 1.8V to 2.5V and vice versa.
The Synaptics DT touch module operates with VAUX2 -supply output from EMASIC. VIO is used for port-A supply
and VAUX2 is used for port-B supplies of the level shifter. The OE signal of the level shifter is tied to VAUX2 so
that the interfaces would be enabled once VAUX2 is available.
Whenever the user touches the touch screen, the controller raises an interrupt to RAPU which initiates I2C
transactions to identify the locations the user touches on the display.

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System Module

Figure 56 Touch system block diagram

Proximity sensor
Proximity sensor (N1104) Rosa Long is connected to RAPU via a single GenIO. Power supply voltage is provided
from VAUX1 output of EM ASIC. The proximity sensor is an optical reflective sensor mainly comprising of an
optical transmitter LED and optical receiver photo transistor. The proximity sensor is used is to detect indirect
impulses from the transmitter to the receiver to measure reflections from the reflective surface.
One of the typical applications of the proximity sensor is for using the proximity INT output as an indication
to SW of a phone being present near to human ear while attending a call. In such a case, the human body
will act as a reflector, due to which more IR rays fall on the photo transistor of the proximity sensor and the
o/p of the proximity sensor goes from LOW to HIGH. This LOW to HIGH transition is used as an indication to
SW of the presence of a reflector (human body in this case). SW can then switch off the display as the user is
not looking at it while attending the call. This helps in current saving. Similarly, when the user moves the
phone away from the ear, the proximity o/p goes from HIGH to LOW. This is an indication to SW that there
is no reflector nearby and the display should be switched on.

Figure 57 Proximity sensor

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RM-596
System Module

Imaging and video

Multimedia application processor
Multimedia application processor, BCM2727B, is used as a HW accelerator for imaging and video graphics.
The key features of BCM2727B are:
• 12MPIx primary camera
• Secondary camera
• Xenon flash
• nHD OLED DSI display
• 720p HDMI or NTSC/PAL analog TV-out
MeSSI-16 and CCP2-Tx are the key interfaces between RapuYama and BCM2727B. BCM2727B has in-build
256Mb stacked SDRAM.

Figure 58 BCM2727B block diagram

Display module
This phone uses a 3.5’’ OLED type nHD Alexander display with 16 million colors. The display module supports
the display format of 640 rows x 360 columns . The dimension of the display module is 47.8 mm x 86.3 mm
x 2.12 mm. The module interfaces to the phone via FPC with a 20 pins board to board connector.
The primary display is controlled by BCM2727B over DSI interface. The DSI Interface is used for data transfer
and control. Other display signals, RESET and TE, are interfaced to BCM2727B.

TV-out interface
The phone has HDTV and SDTV capability. The phone can be connected to HDTV through Type A to Type C HDMI
cable, and to analog TV through a TV-out cable.
BCM2727B supports both 720p 30fps HDMI and Analog PAL/NTSC TV-out.
For the HDMI interface, both audio and video data is passed from the host to BCM2727B over MeSSI-16
interface and BCM2727B sends the data to the HDMI connector.
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System Module
For the Analog TV-out, video data is passed from the host to the BCM2727B over MeSSI-16 interface and
BCM2727B sends it to the AV connector. Audio is routed separately by the host to the AV connector.

Cameras
This phone has two cameras, a 12 MPix resolution main camera and a VGA resolution secondary camera.
Xenon flash is used for the main camera.

Primary camera (Swordtail)
The primary camera is a 12 Megapixel auto focus camera module. The module size is 12.5 mm x 12.5 mm x
9 mm and it fits into the 20-pin camera socket on the phone. The camera module is SMIA profile 2 compliant
and is configured by the BCM2727B using I2C control bus. Image data is transferred to the BCM2727B for
furher processing over CSI-2 (PRI_CAM_CSI).

Figure 59 Primary camera interface

Secondary camera (VGA Acme mini)
The secondary camera is a 0.3 Megapixel fixed focus camera module. It is SMIA compliant and is configured
by the BCM2727B using I2C control bus. Image data is transferred to the BCM2727B for further processing
over a CCP based bus (SEC_CAM_CCP).

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System Module

Figure 60 Secondary camera interface

Flash (Xenon)
The Xenon flash module consists of a flash lamp, capacitor bank and a LED. The flash lamp is used for flash
and pre-flash operations. The capacitor is used to store the electrical energy for discharge of the flash lamp.
Xenon flash is controlled from BCM2727B via AS3685A flash driver which is used to drive the LED in the flash
module for auto focus and indication operations. The driver has GPIO control for STROBE, ENABLE and auto
focus assist.

Illumination

Key illumination
Only MENU or HOME key illumination is supported and is handled by RGB 3 channel LED driver NJOY-3. 2 white
LEDS, V2420 and V2422, are used for MENU key illumination. These LEDs are connected in parallel to R output
of NJOY-3 LED driver.

Charging illumination
2 white LEDs are used for charging indication.
One white LED (V2410) is connected to EM ASIC “ChInd” pin and blinks only during dead battery USB charging
in intervals of 1.5s. This LED is OFF during Dynamo dead battery charging and when the charging is taking
place under SW control.
The second white LED (V2411) is connected to B output of NJOY-3 LED driver and glows for indicating USB or
Dynamo charging controlled by SW. This LED is OFF during dead battery Dynamo and USB charging. Neither
LED V2410 nor V2411 glows during Dynamo dead battery charging case.

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System Module

Figure 61 Illumination

Keyboard interface
MENU key (Home key), Volume-up and Volume-down key, Lock key, and Camera Capture and auto focus key
are directly connected to RAPU BB ASIC.

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System Module

Figure 62 Ambient Light Sensor

Accelerometer
Accelerometer is a geometric type component which can be configured either to generate an inertial wakeup interrupt signal when a programmable acceleration threshold is exceeded along one of the three axes (x,
y, and z), or to detect a free-fall event. Each axis has its own sensor and those can measure positive and
negative directions.
The 3D accelerometer (N1103) Ahti_A sensor is connected to RAPU via two GENIOs ie Genio12 and Genio44
and I2C_0 bus. Power supply voltage is provided from VIO & VAUX2 output of EM ASIC.
It has the following features:
• 2.16V to 3.6V supply voltage
• 1.8V compatible IOs
• Low power consumption
• ±2g/±8g dynamically selectable scale
• I2C/SPI digital output interface
• Embedded self test
• 10000g high shock survivability
• Pb free/RoHS compliancy

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System Module

Figure 63 Accelerometer

Magnetometer
3D magnetometer sensor (N1105) is connected to RAPU via two GENIOs ie Genio40 and Genio41 and I2C_0
bus. Power supply voltage is provided from VIO & VAUX1 output of EM ASIC. The magnetometer is used as a
city compass sensor. It detects the earth magnetic field density and composes bearing information for
navigation applications.
The magnetometer has the following features:
• 3-axis magnetometer device suitable for compass application
• Built-in A to D converter for magnetometer data out
• Self test function
• I2C bus interface
• Power modes: OFF mode, stand-by mode and active mode
• DRDY function for measurement data ready
• INT function to inform exceeding magnetic field strength threshold.
The operating temperature is -20°C to +85°C.
The operating supply voltages are:
• Analogue supply +2.4V to +3.6V
• Digital interface supply +1.70V to analogue supply voltage.

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RM-596
System Module

Figure 64 Magnetometer

Audio concept
Audio HW architecture
TPA6140 (N2000), BoostMono (N2150) along with mixed-signal ASIC Gazoo/Pearl provides the analogue audio
output interfaces and RAPU provides the digital audio output interface support.

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System Module

Figure 65 RM-596 Audio block diagram

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RM-596
System Module

Internal earpiece
The internal earpiece used is Petra (8X12) and is connected to EM ASIC EARP and EARN lines.

Figure 66 Internal earpiece diagram

Internal handsfree (IHF) speakers
IHF speakers used are Donau and are connected to BoostMono Vallu N2150. Vallu is a mono D-class speaker
amplifier with an integrated inductive boost converter. Vallu’s differential audio inputs are connected to EM
ASIC Gazoo/Pearl XEarL, XEarLC and it can be enabled/disabled by Genout105 from Rapu.

Figure 67 Internal handsfree (IHF) speaker diagram

Internal microphones
Digital microphones used are Knopfler and are connected to Rapu. DigiMic CLK is connected to RAPU Genio72
and DigiMic DATA is connected to Rapu Genio39.

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System Module

Figure 68 Internal microphones diagram

External earpiece and microphone
The AV headset earpiece is connected to TPA6140 audio amplifier which is used for high quality audio output
and to guarantee long playback time for accessory use. TPA6140 is connected to Gazoo/Pearl XEarL, XEarLC,
XEarR, XEarRC lines for audio and is controlled via I2C_2 bus by RAPU.
The AV headset microphone line is connected to EM ASIC Gazoo/Pearl Mic2 line via AV switch N2001.

Vibra
Vibra is connected to VibraN and VibraP lines of EM ASIC Gazoo/Pearl.

Figure 69 Vibra diagram

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System Module

AV connector
The AV connector handles both audio and video signals output. It has audio left and right signals separately
(pins 4 and 5) and the microphone signal wired to pin 3.

Figure 70 AV connector

The AVVideoControl signal handles microphone usage of the AV connector. The plug detection signal handles
the AV connector plug detection with HeadDet signal from EM ASIC.

Cellular RF technical description
RF block
Linko RF consists of the following key components:
• Älli (Transceiver RF Asic)
• Aura (RF power management Asic)
• Ukko PA
• QuBBE (Front end module)

Figure 71 Linko RF block diagram

The RF block uses RF ASIC N7512 that performs the RF back-end functions of receive and transmit function of
the cellular transceiver.

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System Module

QuBBE
The front end module called QuBBE contains the needed front end filters and the switches. QuBBE contains:
• 3 duplexers (Band II, V, VIII)
• 1 triplexer (Band I, IV)
• 12 switches with the control
• Low and high band GSM TX low bass filters
• 50 ohms low and high and antenna interface
The control signals for the switches come from Älli.

Receiver (RX)
Linko RF has higher integration level compared to previous RF generations and especially more digital design
blocks have been integrated to Älli, RF Asic.
Älli contains the receiver chain from LNAs to digital base band interface. Digital RX baseband interface
contains four data and one clk signals. The data rate and clock frequency depend on the use case.
The main blocks in Älli are:
• LNAs: Balanced inputs for 850, 900, 1800, 1900, 2100 bands
• Passive mixer
• Analog baseband: Programmable for different modes
• ADC: Programmable Sigma Delta Modulator topology ADC
• RX Digital Front End (RXDFE): Contains for example digital filtering, DC offset compensation, wide/
narrowband power measurement blocks
There is integrated external LNA matching on the bands 900, 1800, 1900 and 2100. On 850 band, there is an
integrated matching.

Synthesizer
The synthesizer has separate highly integrated 4GHz VCOs for RX and TX. The integrator capacitors of the loop
filter are outside of the IC. The PLLs are fractional type of dividers.
The reference oscillator is an on-chip 38.4 MHz digitally controlled oscillator. The 38.4 MHz crystal is outside
of Älli. DCXO delivers the internal clock to Älli, differential clock signal to BB, and two single mode clock signals
to NCW modules. Älli delivers a clk signal to diversity RX. The oscillator is controlled via RFBus with AFC signal.
Temperature compensation of the oscillator is running by the SW in Älli. The temperature sensor itself is
outside of Älli.

Transmitter (TX)
The main features of Linko1 transmitter are:
• Common PA for GSM and WCDMA
• High and low band signal paths
• Low band: 824 - 915 MHz
• High band: 1710 - 1980 MHz
• Two operation modes in PA
• Saturation mode in GMSK usage
• Linear mode in Edge and WCDMA usage
• No TX filter between PA and Älli
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RM-596
System Module
• Common regulators for GSM and WCDMA
• Boost and SMPS regulators in Aura
• Feeding the supply voltage to PA
• Operation frequency varies depending on the used system
Frequency

SMPS

Boost

DCDC

WCDMA

3.0 MHz (typ)

4.5 MHz (typ)

1.3 MHz (typ)

GSM

9.5 MHz

7.5 MHz

2.7 MHz

• Digital interface to baseband
• WCDMA mode
• Digital IQ interface
• 3 data and 1 clk signals
• GSM mode
• GSM TX data bits are sourced from baseband via RFBus to Älli
In GMSK mode, the output level of Älli is kept high with all power levels, and the output power is adjusted
by altering the collector voltage of PA. In practice, the output level of Älli is also slightly changed (optimized)
in the highest power level to keep the PA compression level more constant, which results in better overall
efficiency and performance.
In WCDMA and EDGE mode, the output power is tuned by output level of Älli. The supply voltage in WCDMA
mode is adjusted in power levels to optimize the current consumption.

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System Module

Frequency mappings
GSM850 frequencies

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RM-596
System Module

EGSM900 frequencies

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System Module

GSM1800 frequencies

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System Module

GSM1900 frequencies

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System Module

WCDMA I (2100) Rx frequencies

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RM-596
System Module

WCDMA I (2100) Tx frequencies

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System Module

WCDMA II (1900) frequencies

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System Module

WCDMA IV (1700/2100) frequencies

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System Module

WCDMA V (850) frequencies

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RM-596
System Module

WCDMA VIII (900) frequencies
Uplink CH (TX)

Freq (MHz)

VCO (MHz)

Downlink CH (RX) Freq (MHz)

VCO (MHz)

2712

882,4

3529,6

2937

927,4

3709,6

2713

882,6

3530,4

2938

927,6

3710,4

2714

882,8

3531,2

2939

927,8

3711,2

2715

883

3532

2940

928

3712

2716

883,2

3532,8

2941

928,2

3712,8

2717

883,4

3533,6

2942

928,4

3713,6

2718

883,6

3534,4

2943

928,6

3714,4

2719

883,8

3535,2

2944

928,8

3715,2

2720

884

3536

2945

929

3716

2721

884,2

3536,8

2946

929,2

3716,8

2722

884,4

3537,6

2947

929,4

3717,6

2723

884,6

3538,4

2948

929,6

3718,4

2724

884,8

3539,2

2949

929,8

3719,2

2725

885

3540

2950

930

3720

2726

885,2

3540,8

2951

930,2

3720,8

2727

885,4

3541,6

2952

930,4

3721,6

2728

885,6

3542,4

2953

930,6

3722,4

2729

885,8

3543,2

2954

930,8

3723,2

2730

886

3544

2955

931

3724

2731

886,2

3544,8

2956

931,2

3724,8

2732

886,4

3545,6

2957

931,4

3725,6

2733

886,6

3546,4

2958

931,6

3726,4

2734

886,8

3547,2

2959

931,8

3727,2

2735

887

3548

2960

932

3728

2736

887,2

3548,8

2961

932,2

3728,8

2737

887,4

3549,6

2962

932,4

3729,6

2738

887,6

3550,4

2963

932,6

3730,4

2739

887,8

3551,2

2964

932,8

3731,2

2740

888

3552

2965

933

3732

2741

888,2

3552,8

2966

933,2

3732,8

2742

888,4

3553,6

2967

933,4

3733,6

2743

888,6

3554,4

2968

933,6

3734,4

2744

888,8

3555,2

2969

933,8

3735,2

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System Module
Uplink CH (TX)

Freq (MHz)

VCO (MHz)

Downlink CH (RX) Freq (MHz)

VCO (MHz)

2745

889

3556

2970

934

3736

2746

889,2

3556,8

2971

934,2

3736,8

2747

889,4

3557,6

2972

934,4

3737,6

2748

889,6

3558,4

2973

934,6

3738,4

2749

889,8

3559,2

2974

934,8

3739,2

2750

890

3560

2975

935

3740

2751

890,2

3560,8

2976

935,2

3740,8

2752

890,4

3561,6

2977

935,4

3741,6

2753

890,6

3562,4

2978

935,6

3742,4

2754

890,8

3563,2

2979

935,8

3743,2

2755

891

3564

2980

936

3744

2756

891,2

3564,8

2981

936,2

3744,8

2757

891,4

3565,6

2982

936,4

3745,6

2758

891,6

3566,4

2983

936,6

3746,4

2759

891,8

3567,2

2984

936,8

3747,2

2760

892

3568

2985

937

3748

2761

892,2

3568,8

2986

937,2

3748,8

2762

892,4

3569,6

2987

937,4

3749,6

2763

892,6

3570,4

2988

937,6

3750,4

2764

892,8

3571,2

2989

937,8

3751,2

2765

893

3572

2990

938

3752

2766

893,2

3572,8

2991

938,2

3752,8

2767

893,4

3573,6

2992

938,4

3753,6

2768

893,6

3574,4

2993

938,6

3754,4

2769

893,8

3575,2

2994

938,8

3755,2

2770

894

3576

2995

939

3756

2771

894,2

3576,8

2996

939,2

3756,8

2772

894,4

3577,6

2997

939,4

3757,6

2773

894,6

3578,4

2998

939,6

3758,4

2774

894,8

3579,2

2999

939,8

3759,2

2775

895

3580

3000

940

3760

2776

895,2

3580,8

3001

940,2

3760,8

2777

895,4

3581,6

3002

940,4

3761,6

2778

895,6

3582,4

3003

940,6

3762,4

2779

895,8

3583,2

3004

940,8

3763,2

Issue 2

Page 6 – 45

RM-596
System Module
Uplink CH (TX)

Freq (MHz)

VCO (MHz)

Downlink CH (RX) Freq (MHz)

VCO (MHz)

2780

896

3584

3005

941

3764

2781

896,2

3584,8

3006

941,2

3764,8

2782

896,4

3585,6

3007

941,4

3765,6

2783

896,6

3586,4

3008

941,6

3766,4

2784

896,8

3587,2

3009

941,8

3767,2

2785

897

3588

3010

942

3768

2786

897,2

3588,8

3011

942,2

3768,8

2787

897,4

3589,6

3012

942,4

3769,6

2788

897,6

3590,4

3013

942,6

3770,4

2789

897,8

3591,2

3014

942,8

3771,2

2790

898

3592

3015

943

3772

2791

898,2

3592,8

3016

943,2

3772,8

2792

898,4

3593,6

3017

943,4

3773,6

2793

898,6

3594,4

3018

943,6

3774,4

2794

898,8

3595,2

3019

943,8

3775,2

2795

899

3596

3020

944

3776

2796

899,2

3596,8

3021

944,2

3776,8

2797

899,4

3597,6

3022

944,4

3777,6

2798

899,6

3598,4

3023

944,6

3778,4

2799

899,8

3599,2

3024

944,8

3779,2

2800

900

3600

3025

945

3780

2801

900,2

3600,8

3026

945,2

3780,8

2802

900,4

3601,6

3027

945,4

3781,6

2803

900,6

3602,4

3028

945,6

3782,4

2804

900,8

3603,2

3029

945,8

3783,2

2805

901

3604

3030

946

3784

2806

901,2

3604,8

3031

946,2

3784,8

2807

901,4

3605,6

3032

946,4

3785,6

2808

901,6

3606,4

3033

946,6

3786,4

2809

901,8

3607,2

3034

946,8

3787,2

2810

902

3608

3035

947

3788

2811

902,2

3608,8

3036

947,2

3788,8

2812

902,4

3609,6

3037

947,4

3789,6

2813

902,6

3610,4

3038

947,6

3790,4

2814

902,8

3611,2

3039

947,8

3791,2

Page 6 – 46

Issue 2

RM-596
System Module
Uplink CH (TX)

Freq (MHz)

VCO (MHz)

Downlink CH (RX) Freq (MHz)

VCO (MHz)

2815

903

3612

3040

948

3792

2816

903,2

3612,8

3041

948,2

3792,8

2817

903,4

3613,6

3042

948,4

3793,6

2818

903,6

3614,4

3043

948,6

3794,4

2819

903,8

3615,2

3044

948,8

3795,2

2820

904

3616

3045

949

3796

2821

904,2

3616,8

3046

949,2

3796,8

2822

904,4

3617,6

3047

949,4

3797,6

2823

904,6

3618,4

3048

949,6

3798,4

2824

904,8

3619,2

3049

949,8

3799,2

2825

905

3620

3050

950

3800

2826

905,2

3620,8

3051

950,2

3800,8

2827

905,4

3621,6

3052

950,4

3801,6

2828

905,6

3622,4

3053

950,6

3802,4

2829

905,8

3623,2

3054

950,8

3803,2

2830

906

3624

3055

951

3804

2831

906,2

3624,8

3056

951,2

3804,8

2832

906,4

3625,6

3057

951,4

3805,6

2833

906,6

3626,4

3058

951,6

3806,4

2834

906,8

3627,2

3059

951,8

3807,2

2835

907

3628

3060

952

3808

2836

907,2

3628,8

3061

952,2

3808,8

2837

907,4

3629,6

3062

952,4

3809,6

2838

907,6

3630,4

3063

952,6

3810,4

2839

907,8

3631,2

3064

952,8

3811,2

2840

908

3632

3065

953

3812

2841

908,2

3632,8

3066

953,2

3812,8

2842

908,4

3633,6

3067

953,4

3813,6

2843

908,6

3634,4

3068

953,6

3814,4

2844

908,8

3635,2

3069

953,8

3815,2

2845

909

3636

3070

954

3816

2846

909,2

3636,8

3071

954,2

3816,8

2847

909,4

3637,6

3072

954,4

3817,6

2848

909,6

3638,4

3073

954,6

3818,4

2849

909,8

3639,2

3074

954,8

3819,2

Issue 2

Page 6 – 47

RM-596
System Module
Uplink CH (TX)

Freq (MHz)

VCO (MHz)

Downlink CH (RX) Freq (MHz)

VCO (MHz)

2850

910

3640

3075

955

3820

2851

910,2

3640,8

3076

955,2

3820,8

2852

910,4

3641,6

3077

955,4

3821,6

2853

910,6

3642,4

3078

955,6

3822,4

2854

910,8

3643,2

3079

955,8

3823,2

2855

911

3644

3080

956

3824

2856

911,2

3644,8

3081

956,2

3824,8

2857

911,4

3645,6

3082

956,4

3825,6

2858

911,6

3646,4

3083

956,6

3826,4

2859

911,8

3647,2

3084

956,8

3827,2

2860

912

3648

3085

957

3828

2861

912,2

3648,8

3086

957,2

3828,8

2862

912,4

3649,6

3087

957,4

3829,6

2863

912,6

3650,4

3088

957,6

3830,4

Page 6 – 48

Issue 2

Nokia Customer Care

Glossary

Issue 2

Page Glossary– 1

RM-596
Glossary

(This page left intentionally blank.)

Page Glossary– 2

Issue 2

RM-596
Glossary
A/D-converter

Analogue-to-digital converter

ACI

Accessory Control Interface

ADC

Analogue-to-digital converter

ADSP

Application DPS (expected to run high level tasks)

AGC

Automatic gain control (maintains volume)

ALS

Ambient light sensor

AMSL

After Market Service Leader

ARM

Advanced RISC Machines

ARPU

Average revenue per user (per month or per year)

ASIC

Application Specific Integrated Circuit

ASIP

Application Specific Interface Protector

B2B

Board to board, connector between PWB and UI board

Board Assembly

Baseband

BC02

Bluetooth module made by CSR

BIQUAD

Bi-quadratic (type of filter function)

BSI

Battery Size Indicator

Bluetooth

CBus

MCU controlled serial bus connected to UPP_WD2, UEME and Zocus

CCP

Compact Camera Port

CDMA

Code division multiple access

CDSP

Cellular DSP (expected to run at low levels)

CLDC

Connected limited device configuration

CMOS

Complimentary metal-oxide semiconductor circuit (low power consumption)

COF

Chip on Foil

COG

Chip on Glass

CPU

Central Processing Unit

CSD

Circuit-switched data

CSR

Cambridge silicon radio

CSTN

Colour Super Twisted Nematic

CTSI

Clock Timing Sleep and interrupt block of Tiku

Continuous wave

D/A-converter

Digital-to-analogue converter

DAC

Digital-to-analogue converter

DBI

Digital Battery Interface

DBus

DSP controlled serial bus connected between UPP_WD2 and Helgo

Issue 2

Page Glossary– 3

RM-596
Glossary
DCT-4

Digital Core Technology

DMA

Direct memory access

Data Package

DPLL

Digital Phase Locked Loop

DSP

Digital Signal Processor

DTM

Dual Transfer Mode

DtoS

Differential to Single ended

EDGE

Enhanced data rates for global/GSM evolution

EGSM

Extended GSM

Energy management

EMC

Electromagnetic compatibility

EMI

Electromagnetic interference

ESD

Electrostatic discharge

FCI

Functional cover interface

Frequency Modulation

FPS

Flash Programming Tool

Full rate

FSTN

Film compensated super twisted nematic

GMSK

Gaussian Minimum Shift Keying

GND

Ground, conductive mass

GPIB

General-purpose interface bus

GPRS

General Packet Radio Service

GSM

Group Special Mobile/Global System for Mobile communication

HSDPA

High-speed downlink packet access

Hands free

HFCM

Handsfree Common

Handset

HSCSD

High speed circuit switched data (data transmission connection faster than GSM)

Hardware

I/O

Input/Output

IBAT

Battery current

Integrated circuit

ICHAR

Charger current

Interface

IHF

Integrated hands free

IMEI

International Mobile Equipment Identity

Page Glossary– 4

Issue 2

RM-596
Glossary
IR

Infrared

IrDA

Infrared Data Association

ISA

Intelligent software architecture

JPEG/JPG

Joint Photographic Experts Group

LCD

Liquid Crystal Display

LDO

Low Drop Out

LED

Light-emitting diode

LPRF

Low Power Radio Frequency

MCU

Micro Controller Unit (microprocessor)

MCU

Multiport control unit

MIC, mic

Microphone

MIDP

Mobile Information Device Profile

MIN

Mobile identification number

MIPS

Million instructions per second

MMC

Multimedia card

MMS

Multimedia messaging service

MP3

Compressed audio file format developed by Moving Picture Experts Group

MTP

Multipoint-to-point connection

NFC

Near field communication

NTC

Negative temperature coefficient, temperature sensitive resistor used as a
temperature sensor

OMA

Object management architecture

OMAP

Operations, maintenance, and administration part

Opamp

Operational Amplifier

Power amplifier

PCM

Pulse Code Modulation

PDA

Pocket Data Application

PDA

Personal digital assistant

PDRAM

Program/Data RAM (on chip in Tiku)

Phoenix

Software tool of DCT4.x and BB5

PIM

Personal Information Management

PLL

Phase locked loop

(Phone) Permanent memory

PUP

General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX

Power-up reset

PWB

Printed Wiring Board

Issue 2

Page Glossary– 5

RM-596
Glossary
PWM

Pulse width modulation

RC-filter

Resistance-Capacitance filter

RDS

Radio Data Service

Radio Frequency

RF PopPort ™

Reduced function PopPort ™ interface

RFBUS

Serial control Bus For RF

RSK

Right Soft Key

RS-MMC

Reduced size Multimedia Card

RSS

Web content Syndication Format

RSSI

Receiving signal strength indicator

RST

Reset Switch

RTC

Real Time Clock (provides date and time)

Radio Receiver

SARAM

Single Access RAM

SAW filter

Surface Acoustic Wave filter

SDRAM

Synchronous Dynamic Random Access Memory

SID

Security ID

SIM

Subscriber Identity Module

SMPS

Switched Mode Power Supply

SNR

Signal-to-noise ratio

SPR

Standard Product requirements

SRAM

Static random access memory

STI

Serial Trace Interface

Software

SWIM

Subscriber/Wallet Identification Module

TCP/IP

Transmission control protocol/Internet protocol

TCXO

Temperature controlled Oscillator

Tiku

Finnish for Chip, Successor of the UPP

Radio Transmitter

UART

Universal asynchronous receiver/transmitter

UEME

Universal Energy Management chip (Enhanced version)

UEMEK

See UEME

User Interface

UPnP

Universal Plug and Play

UPP

Universal Phone Processor

UPP_WD2

Communicator version of DCT4 system ASIC

Page Glossary– 6

Issue 2

RM-596
Glossary
USB

Universal Serial Bus

VBAT

Battery voltage

VCHAR

Charger voltage

VCO

Voltage controlled oscillator

VCTCXO

Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO

Voltage Controlled Crystal Oscillator

View Finder

Vp-p

Peak-to-peak voltage

VSIM

SIM voltage

WAP

Wireless application protocol

WCDMA

Wideband code division multiple access

Watchdog

WLAN

Wireless local area network

XHTML

Extensible hypertext markup language

Zocus

Current sensor (used to monitor the current flow to and from the battery)

Issue 2

Page Glossary– 7

RM-596
Glossary

(This page left intentionally blank.)

Page Glossary– 8

Issue 2

www.s-manuals.com

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Title                           : Nokia N8-00 RM-596 - Service Manual Level 3&4. www.s-manuals.com.
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Nokia N8 00 RM 596 Service Manual Level 3&4. Www.s Manuals.com. 3,4 V2.0

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