Datasheet STM32L432KB STM32L432KC Ultra Low Power Arm® Cortex® M4 32 Bit MCU+FPU, 100DMIPS, Up To 256KB Flash, 64KB SRAM, US Manual
stm32l432kb-manual
stm32l432kb-manual
User Manual:
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- 1 Introduction
- 2 Description
- 3 Functional overview
- 3.1 Arm® Cortex®-M4 core with FPU
- 3.2 Adaptive real-time memory accelerator (ART Accelerator™)
- 3.3 Memory protection unit
- 3.4 Embedded Flash memory
- 3.5 Embedded SRAM
- 3.6 Firewall
- 3.7 Boot modes
- 3.8 Cyclic redundancy check calculation unit (CRC)
- 3.9 Power supply management
- 3.10 Interconnect matrix
- 3.11 Clocks and startup
- 3.12 General-purpose inputs/outputs (GPIOs)
- 3.13 Direct memory access controller (DMA)
- 3.14 Interrupts and events
- 3.15 Analog to digital converter (ADC)
- 3.16 Digital to analog converter (DAC)
- 3.17 Comparators (COMP)
- 3.18 Operational amplifier (OPAMP)
- 3.19 Touch sensing controller (TSC)
- 3.20 Random number generator (RNG)
- 3.21 Timers and watchdogs
- Table 9. Timer feature comparison
- 3.21.1 Advanced-control timer (TIM1)
- 3.21.2 General-purpose timers (TIM2, TIM15, TIM16)
- 3.21.3 Basic timers (TIM6 and TIM7)
- 3.21.4 Low-power timer (LPTIM1 and LPTIM2)
- 3.21.5 Infrared interface (IRTIM)
- 3.21.6 Independent watchdog (IWDG)
- 3.21.7 System window watchdog (WWDG)
- 3.21.8 SysTick timer
- 3.22 Real-time clock (RTC) and backup registers
- 3.23 Inter-integrated circuit interface (I2C)
- 3.24 Universal synchronous/asynchronous receiver transmitter (USART)
- 3.25 Low-power universal asynchronous receiver transmitter (LPUART)
- 3.26 Serial peripheral interface (SPI)
- 3.27 Serial audio interfaces (SAI)
- 3.28 Single wire protocol master interface (SWPMI)
- 3.29 Controller area network (CAN)
- 3.30 Universal serial bus (USB)
- 3.31 Clock recovery system (CRS)
- 3.32 Quad SPI memory interface (QUADSPI)
- 3.33 Development support
- 4 Pinouts and pin description
- 5 Memory mapping
- 6 Electrical characteristics
- 6.1 Parameter conditions
- 6.2 Absolute maximum ratings
- 6.3 Operating conditions
- 6.3.1 General operating conditions
- 6.3.2 Operating conditions at power-up / power-down
- 6.3.3 Embedded reset and power control block characteristics
- 6.3.4 Embedded voltage reference
- 6.3.5 Supply current characteristics
- Table 25. Current consumption in Run and Low-power run modes, code with data processing running from Flash, ART enable (Cache ON Prefetch OFF)
- Table 26. Current consumption in Run and Low-power run modes, code with data processing running from Flash, ART disable
- Table 27. Current consumption in Run and Low-power run modes, code with data processing running from SRAM1
- Table 28. Typical current consumption in Run and Low-power run modes, with different codes running from Flash, ART enable (Cache ON Prefetch OFF)
- Table 29. Typical current consumption in Run and Low-power run modes, with different codes running from Flash, ART disable
- Table 30. Typical current consumption in Run and Low-power run modes, with different codes running from SRAM1
- Table 31. Current consumption in Sleep and Low-power sleep modes, Flash ON
- Table 32. Current consumption in Low-power sleep modes, Flash in power-down
- Table 33. Current consumption in Stop 2 mode
- Table 34. Current consumption in Stop 1 mode
- Table 35. Current consumption in Stop 0
- Table 36. Current consumption in Standby mode
- Table 37. Current consumption in Shutdown mode
- Table 38. Peripheral current consumption
- 6.3.6 Wakeup time from low-power modes and voltage scaling transition times
- 6.3.7 External clock source characteristics
- Table 42. High-speed external user clock characteristics
- Figure 12. High-speed external clock source AC timing diagram
- Table 43. Low-speed external user clock characteristics
- Figure 13. Low-speed external clock source AC timing diagram
- Table 44. LSE oscillator characteristics (fLSE = 32.768 kHz)
- Figure 14. Typical application with a 32.768 kHz crystal
- 6.3.8 Internal clock source characteristics
- Table 45. HSI16 oscillator characteristics
- Figure 15. HSI16 frequency versus temperature
- Table 46. MSI oscillator characteristics
- Figure 16. Typical current consumption versus MSI frequency
- Table 47. HSI48 oscillator characteristics
- Figure 17. HSI48 frequency versus temperature
- Table 48. LSI oscillator characteristics
- 6.3.9 PLL characteristics
- 6.3.10 Flash memory characteristics
- 6.3.11 EMC characteristics
- 6.3.12 Electrical sensitivity characteristics
- 6.3.13 I/O current injection characteristics
- 6.3.14 I/O port characteristics
- 6.3.15 NRST pin characteristics
- 6.3.16 Extended interrupt and event controller input (EXTI) characteristics
- 6.3.17 Analog switches booster
- 6.3.18 Analog-to-Digital converter characteristics
- Table 63. ADC characteristics
- Table 64. Maximum ADC RAIN
- Table 65. ADC accuracy - limited test conditions 1
- Table 66. ADC accuracy - limited test conditions 2
- Table 67. ADC accuracy - limited test conditions 3
- Table 68. ADC accuracy - limited test conditions 4
- Figure 21. ADC accuracy characteristics
- Figure 22. Typical connection diagram using the ADC
- 6.3.19 Digital-to-Analog converter characteristics
- 6.3.20 Comparator characteristics
- 6.3.21 Operational amplifiers characteristics
- 6.3.22 Temperature sensor characteristics
- 6.3.23 Timer characteristics
- 6.3.24 Communication interfaces characteristics
- Table 77. I2C analog filter characteristics
- Table 78. SPI characteristics
- Figure 24. SPI timing diagram - slave mode and CPHA = 0
- Figure 25. SPI timing diagram - slave mode and CPHA = 1
- Figure 26. SPI timing diagram - master mode
- Table 79. Quad SPI characteristics in SDR mode
- Table 80. QUADSPI characteristics in DDR mode
- Figure 27. Quad SPI timing diagram - SDR mode
- Figure 28. Quad SPI timing diagram - DDR mode
- Table 81. SAI characteristics
- Figure 29. SAI master timing waveforms
- Figure 30. SAI slave timing waveforms
- Table 82. USB electrical characteristics
- Table 83. SWPMI electrical characteristics
- 7 Package information
- 7.1 UFQFPN32 package information
- Figure 31. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline
- Table 84. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package mechanical data
- Figure 32. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package recommended footprint
- Figure 33. UFQFPN32 marking (package top view)
- 7.2 Thermal characteristics
- 7.1 UFQFPN32 package information
- 8 Ordering information
- 9 Revision history