Dometic 289023121 HiPromatic ZigBee module User Manual Copyright Develco A S

Dometic GmbH HiPromatic ZigBee module Copyright Develco A S

User Manual

Copyright © Develco A/S All rights reserved. Develco assumes no responsibility for any errors, which may appear in this document. Furthermore, Develco reserves the right to alter the hardware, software, and/or specifications detailed herein at any time without notice, and Develco does not make any commitment to update the information contained herein. All the trademarks listed herein are owned by their respective owners. RoHS
Data Sheet for DevCom 06 ZigBee Module v1.00 2 Contents: 1 Overview ............................................................................................ 5 1.1 Specifications ................................................................................... 5 1.2 General Features ............................................................................... 5 1.3 Interfaces ........................................................................................ 5 1.4 Software Configurations ..................................................................... 6 1.5 ZigBee Technology ............................................................................ 6 2 Electrical Specifications ........................................................................ 7 2.1 Operating Conditions ......................................................................... 7 2.2 DC Electrical Characteristics ............................................................... 7 2.3 AC Electrical Characteristics ................................................................ 8 3 Pin Assignments and Definitions ............................................................ 9 3.1 Assignments for Debug Interface ...................................................... 10 4 Mechanical Specifications ................................................................... 11 4.1 Mechanical Dimensions .................................................................... 11 4.2 Mechanical Implementation .............................................................. 11 5 Certifications .................................................................................... 13 6 Antenna Characteristics ..................................................................... 14 6.1 Internal F-antenna .......................................................................... 14 7 Assembly Guidelines .......................................................................... 15 7.1 PCB Layout Guidelines ..................................................................... 15 7.2 Soldering Guidelines ........................................................................ 19 8 Ordering Information ......................................................................... 21 9 Contact Information .......................................................................... 22 10 About Develco A/S ............................................................................ 23
Data Sheet for DevCom 06 ZigBee Module v1.00 3 Acronyms The following list shows the acronyms used in this document. A/D Analog to Digital CE Conformité Européenne EMC Electromagnetic Compatibility GPIO General Purpose Input Output I2C Inter Integrated Circuit IC Integrated Circuit IDE Integrated Development Environment JTAG Joint Test Action Group LNA Low Noise Amplifier MAC Medium Access Control MCU Micro Controller Unit PA Power Amplifier PCB Printed Circuit Board PHY Physical Layer SBW Spy-Bi-Wire SCI Serial Communication Interface SMD Surface Mount Device SPI Serial Port Interface SW Software UART Universal Asynchronous Receive Transmit USB Universal Serial Bus
Data Sheet for DevCom 06 ZigBee Module v1.00 4 References For more detailed information, please consult the following documents: Texas Instruments, Inc. “MSP430 Hardware Tools, Users Guide SLAU208E, Rev. April 2010” “MSP430F543xA, Datasheet SLAS612A, Rev. March 2010” “CC2529, Datasheet SWRS068, Rev. December 2007” “CC2590, Datasheet SWRS080, Rev. September 2008”
Data Sheet for DevCom 06 ZigBee Module v1.00 5 1 Overview The DevCom 06 ZigBee Module offers a fast-track approach to development of IEEE 802.15.4 and ZigBee applications. The module comes with a 24-pole connector with access to different I/Os. The module has an internal antenna. The DevCom 06 ZigBee Module is available as a module with standard software, but the module is also available with customized software developed by Develco A/S in close co-operation with the customer. The module is based on TI’s 16-bit MSP430 series and the 2.4 GHz ZigBee compliant radio, CC2520. The DevCom 06 ZigBee Module includes the RF front end module, CC2590/CC2591 for extended range performance. The board is supplied with software based on Texas Instruments Z-Stack, ZigBee-2007 Release. 1.1 Specifications • Dimensions: 24 x 25mm • Storage temperature: -30 to +105°C • Operating temperature: -10 to +70°C • Transmitter output power (maximum): 14 dBm1• Receiver sensitivity: -101 dBm @ 1% PER • Supply voltage range: 2.4 to 3.6V @ 25MHz system frequency • Bit rate: 250 kbps • Data rate: 200 kbps • Frequency band: 2400 to 2483.5 MHz • Number of channels: 16 • Current consumption, Rx: 32.1 mA • Current consumption, Tx: 54.3 mA @ 12 dBm • Flash memory: 256 kB • RAM: 16 kB 1.2 General Features • 2.4 GHz IEEE 802.15.4 • Low power consumption (down to 1.5 µA in standby mode. For cable replacement application down to 100 µA) • VCC I/O level • Up to 18 GPIOs (UART, Keyboard inputs, A/D, PWM, Comparator, I2C and SPI) • On-board antenna and prepared for external antenna • CE compliant2• RoHS compliant according to the EU Directive 2002/95/EC • Software development board available 1.3 Interfaces • 24 pin DIL connector (2mm spacing) o Up to 18 GPIOs  Up to 4 UARTs  Up to 7 Interrupt inputs  Up to 6 A/D inputs  Up to 6 Timer / Compare outputs 1 Output power shall be limited to comply with European regulations 2 Pending
Data Sheet for DevCom 06 ZigBee Module v1.00 6  Up to 2 I2Cs  Up to 3 SPI o VCC o GND 1.4 Software Configurations Modules are preloaded with MAC based cable replacement software. 1.5 ZigBee Technology The IEEE 802.15.4 specification is a cost-effective, low data rate (<250 kbps), 2.4 GHz and 868/915 MHz wireless technology designed for personal-area peer-to-peer and star networks. The IEEE 802.15.4 standard is the basis of an application and network layer protocol called ZigBee. A number of companies, including Develco A/S, have formed a consortium known as the ZigBee Alliance. The purpose of this consortium is to create a specification for mesh networking and application profiles. The companies also perform interoperability and certification testing. For additional information about the ZigBee Alliance, please visit the following website http://www.ZigBee.org
Data Sheet for DevCom 06 ZigBee Module v1.00 7 2 Electrical Specifications This section details the operating conditions, DC characteristics and AC characteristics of the DevCom 06 ZigBee Module. 2.1 Operating Conditions Table 2.1 Operating Conditions Parameter Min Typ Max Unit Conditions Supply Voltage (VCC) 2.4 3.0 3.6 V Frequency Range 2.405 2.480 GHz 16 available channels in the 2.4 GHz ISM band Storage Temperature Range -30 +105 °C 0% to 90% relative humidity (non-condensation) Operating Temperature Range -10 +70 °C 0% to 90% relative humidity (non-condensation) 2.2 DC Electrical Characteristics Table 2.2 DC Electrical Characteristics3 Parameter Min Typ Max Unit Conditions Current Consumption4 , Standby 8 μA VCC = 3.0V (Hibernate and Stop3 mode) Excluding on-board regulation Current Consumption, Transmit Mode (Nominal) 65 mA VCC = 3.0V (Transmit mode and Run mode) Output power limited for CE compliance Current Consumption, Receive Mode 30 mA VCC = 3.0V (Receive mode and Run Mode) Input High Voltage (Vih) 0.70*VCC V All digital inputs (-10°C to +70°C) Input Low Voltage (Vil) 0.25* VCC V All digital inputs (-10°C to +70°C) Output High Voltage (Voh) VCC-0.6 V All digital inputs (-10°C to +70°C) @ 6mA Output Low Voltage (Vol) 0.6 V All digital inputs (-10°C to +70°C) @ 6mA 3 VCC=3.0V, Ta=+25°C, unless otherwise noted 4 Current consumptions are for DevCom 06-x and include PHY and MAC only
Data Sheet for DevCom 06 ZigBee Module v1.00 8 2.3 AC Electrical Characteristics Table 2.3 AC Electrical Characteristics5 Parameter Min Typ Max Unit Conditions RF Data Rate 250 kbps Over the air data rate Receiver Sensitivity TBD dBm ≤1% Packet Error Rate, 20-byte payload Saturation (Maximum Input Level) TBD dBm Frequency Error Tolerance 200 kHz Symbol Rate Error Tolerance 80 ppm Transmitter Output Power (Maximum) TBD dBm Output power shall be limited to comply with European regulations Transmitter Output Power (Nominal) TBD dBm Output power limited for CE compliance6 5 VCC=3.0V, Ta=+25°C, unless otherwise noted 6 Excluding antenna gain
Data Sheet for DevCom 06 ZigBee Module v1.00 9 3 Pin Assignments and Definitions The interface of the DevCom 06 ZigBee Module consists of 24 connections. These connections are located in 2 rows of 12 pins each with a pitch of 2mm. 18 of these connections are available as digital General Purpose Input-Output connections for SW development purposes, which includes In-circuit debug and flash programming, UART, Keyboard inputs, A/D, Timer, Comparator, I2C and SPI. Table 3.1 details the pin-out of the 24 interface connections of the DevCom 06 ZigBee Module . For more detailed information about GPIO functionalities, please see the “MSP430F5438 Data Sheet” from Texas Instruments. Table 3.1 Pin Definitions Pin Number Pin Name MSP430 Connections and/or Description 1 VCC (Supply Voltage) Internally connected to AVCC, DVCC1, DVCC2, DVCC3 and DVCC4 2 Reset Connected to /RST 3 BKGD Connected to TEST/SBWTCK 4 GND Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4 5 UART0-RxD / IRQ2 P5.7/UCA1RXD/UCA1SOMI + P2.3/TA1.2 6 UART0-TxD / IRQ3 P5.6/UCA1TXD/UCA1SIMO + P2.5 7 UART1-RxD / SPI1(MISO) P10.5/UCA3RXD/UCA3SOMI 8 UART1-TxD / SPI1(MOSI) P10.4/UCA3TXD/UCA3SIMO 9 PWM4 / I2C1 (SDA) P1.0/TA0CLK/ACLK + P2.4/RTCCLK + P10.1/UCB3SIMO/UCB3SDA 10 PWM1 / I2C1 (SCL) P2.6/ACLK + P10.2/UCB3SOMI/UCB3SCL 11 SPI0 (SCLK) / UART4-RxD P3.5/UCA0RXD/UCA0SOMI + P9.0/UCB2STE/UCA2CLK 12 SPI0 (MOSI) / UART2-TxD P9.4/UCA2TXD/UCA2SIMO 13 SPI0 (MISO) / UART2-RxD P9.5/UCA2RXD/UCA2SOMI 14 SPI0 (CS) / UART4-TxD P3.4/UCA0TXD/UCA0SIMO + P9.3/UCB2CLK/UCA2STE 15 ADC5 / SPI1 (SCLK) P6.5/A5 + P10.0/UCB3STE/UCA3CLK 16 IRQ4 / SPI1 (CS) P2.2/TA1.1 + P10.3/UCB3CLK/UCA3STE 17 IRQ0 / PWM3 P2.7/ADC12CLK/DMAE0 + P4.0/TB0.0 18 IRQ1 / ADC4 P6.4/A4 + P2.1/TA1.0 19 PWM0 / ADC0 P6.0/A0 + P4.1/TB0.1 20 PWM2 / ADC1 P6.1/A1 + P4.2/TB0.2 21 I2C0 (SDA) / ADC2 P6.2/A2 + P9.1/UCB2SIMO/UCB2SDA 22 I2C0 (SCL) / ADC3 P6.3/A3 + P9.2/UCB2SOMI/UCB2SCL 23 GND Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4 24 GND Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4
Data Sheet for DevCom 06 ZigBee Module v1.00 10 3.1 Assignments for Debug Interface The DevCom 06 ZigBee Module has all connections necessary for easy programming and debugging of the module. The USB Flash Emulation Tool, MSP-FET430UIF from Texas Instruments can be used for these purposes. The following connection scheme shows the necessary interconnections, between the programmer and the DevCom06 module. MSP-FET430UIF Connector 2 wire JTAG interconnection (SpyByWire) Devcom06 Connector Vcc supplied from Target:  Vcc MSP-FET430UIF Description Pin Pin Devcom06 Description TDO/TDI 1 2 RESET Vcc Target 4 1 Vcc TCK 7 3 BKGD/Test Gnd 9 4 Gnd Vcc supplied from Programmer: Vcc  TDO/TDI 1 2 RESET Vcc Tool 2 1 Vcc TCK 7 3 BKGD/Test Gnd 9 4 Gnd For proper utilization and detailed information of the USB Flash Emulation Tool, please look into the “MSP430 Hardware Tools – User’s Guide” from Texas Instruments. The User’s guide can be downloaded from http://www.ti.com Figure 3.1 - MSP430-FT430UIF
Data Sheet for DevCom 06 ZigBee Module v1.00 11 4 Mechanical Specifications This chapter details the mechanical specifications for the DevCom 06 ZigBee Module. Parameters described in detail are mechanical dimensions and mechanical implementation. 4.1 Mechanical Dimensions The DevCom 06 ZigBee Module is available for SMD assembling only. The mechanical dimensions is shown in Figure 4.2. Maximum height including PCB is 2.9mm. Figure 4.2 Mechanical dimensions 4.2 Mechanical Implementation To achieve the specified performance and comply with regulatory approvals, the DevCom 06 ZigBee Module must meet the following requirements when implemented to an interface platform. There must not be any ground plane or power plane above or below the antenna part of the module. FR-4 material under the antenna is, however, acceptable. The minimum distance from the DevCom 06 ZigBee Module to one of the mentioned planes must be at least 15mm to each side. See Figure 4.3 for implementation guidelines. All dimensions are designated in millimetres. It is recommended that the ground plane of the interface platform is a as large as possible; the minimum ground plane acceptable must cover the DevCom 06 ZigBee Module , except for the antenna area as mentioned above. It is important that the two pads for ground connections to the external interface board are fixed properly, to provide optimal ground connection and mechanical stability. The drawing below is seen from top side (component side) and shows the soldering connections for the module. It is required that the test points on the solder side of the DevCom 06 ZigBee Module are isolated from the ground plane. Se chapter 7 for coordinates.
Data Sheet for DevCom 06 ZigBee Module v1.00 12 Figure 4.3 Requirements for mechanical implementation of DevCom 06 ZigBee Module The ground plane on the interface board can be on both sides or on one side only.
Data Sheet for DevCom 06 ZigBee Module v1.00 13 5 Certifications The DevCom 06 ZigBee Module is fully CE certified7 and compliant to the following standards: • EN 300 328 V1.7.1 (2006-05) EMC for Radio spectrum Matters (ERM); Data transmission equipment for operating in the 2.4GHz ISM band and using wide band modulation techniques. • EN 301 489-1 V1.6.1 (2005-09) EMC for Radio spectrum Matters (ERM); Common technical requirements. • EN 301 489-17 V1.2.1 (2002-08) EMC for Radio spectrum Matters (ERM); Specific conditions for 2.4GHz wideband transmission systems. • EN 60950 (2000-June) Safety of information technology equipment • EN 50371 (2002) Basic restrictions related to human exposure Part 15 - Class B digital device or peripheral §15.105(b) “This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.” This device complies part 15 of FCC rules and RSS-210 of IC rules. Operation is subjected to the following two conditions : (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. The term "IC" before the equipment certification number only signifies that the Industry Canada technical specifications were met. Changes or modification not expressly approved by the partly responsible for compliance could void the user’s authority to operate the equipment. Ce dispositif est conforme à la norme partie 15 de FCC et CNR-210 d'Industrie Canada. Le terme «IC» devant le numéro de certification de l'équipement signifie uniquement que les spécifications techniques d'Industrie Canada ont été respectées. Les changements ou modifications non expressément approuvés par la partie responsable de conformité pourrait annuler l'autorité de l'utilisateur à utiliser l'équipement" FCC ID: 2AC5K289023121 IC: 12307A-289023121 M/N::"DevCom 06 ZigBee Module 7 Pending
Data Sheet for DevCom 06 ZigBee Module v1.00 14 6 Antenna Characteristics This section details the antenna part of the DevCom 06 ZigBee Module. The module has an internal antenna implemented. NOTE: If any other antenna than the default F-antenna is used, the DevCom 06 ZigBee Module is no longer certain to comply with the already approved certifications. To ensure full compliance, approval is therefore necessary. 6.1 Internal F-antenna The antenna implemented on the DevCom 06 ZigBee Module is an in-PCB F-antenna. The F-antenna has good efficiency and an almost omni-directional radiation pattern. Figure 6.1 and Figure 6.2 show the DevCom 06 ZigBee Module horizontal and vertical radiation patterns. The red colour represents the vertical polarization and the blue colour the horizontal polarization. Both radiations are measured in dBi. Figure 6.1 Horizontal radiation pattern Figure 6.2 Vertical radiation pattern
Data Sheet for DevCom 06 ZigBee Module v1.00 15 7 Assembly Guidelines This chapter details the assembly guidelines for the DevCom 06 ZigBee Module, including guidelines for PCB layout and soldering. 7.1 PCB Layout Guidelines This section describes the guidelines for recommended footprint for the interface PCB for SMD assembling of the DevCom 06 ZigBee Module. The guidelines include recommendations on copper layer, solder mask and solder paste. These recommendations are guidelines only and may need to be adjusted, depending on other components on the interface PCB and the assembly facility in general. The data for copper layout, solder mask and solder paste for the DevCom 06 ZigBee Module are illustrated in Figure 7.4, Figure 7.5 and Figure 7.6. A similar footprint is recommended for the interface PCB as well and illustrated in Figure 7.1, Figure 7.2 and Figure 7.3. It is recommended to adjust the stencil opening and thickness in correlation with the interface PCB. Test points are illustrated in Figure 7.7. Sufficient clearances for the test points are highly recommended to implement in the ground layer on the interface PCB. All dimensions are in millimetres with a tolerance of approximately ±0.05mm.
Data Sheet for DevCom 06 ZigBee Module v1.00 16 Figure 7.1 - Recommended copper layout for the Interface Module Figure 7.2 Recommended solder mask for the Interface Module Figure 7.3 Recommended solder paste for the Interface Module
Data Sheet for DevCom 06 ZigBee Module v1.00 17 Figure 7.4 Copper layout for the DevCom 06 ZigBee Module Figure 7.5 Solder mask for the DevCom 06 ZigBee Module Figure 7.6 Solder paste for the DevCom 06 ZigBee Module
Data Sheet for DevCom 06 ZigBee Module v1.00 18 Figure 7.7 Test points for the DevCom 06 ZigBee Module
Data Sheet for DevCom 06 ZigBee Module v1.00 19 7.2 Soldering Guidelines This section describes soldering guidelines for the interface PCB for SMD assembling of the DevCom 06 ZigBee Module. The guidelines include recommendations on the soldering profile. Concerning humidity and sensitivity, the DevCom 06 ZigBee Module must be handled in accordance with IPC/JEDEC J-STD-020C classification 3. Figure 7.8 illustrates a recommended reflow soldering profile for the DevCom 06 ZigBee Module (Extracted from IPC/JEDEC J-STD-020C). These recommendations are guidelines only and may need to be adjusted, depending on other components on the interface PCB and the assembly facility in general. Figure 7.8 Soldering guidelines for the DevCom 06 ZigBee Module
Data Sheet for DevCom 06 ZigBee Module v1.00 20
Data Sheet for DevCom 06 ZigBee Module v1.00 21 8 Ordering Information The DevCom 06 ZigBee Modules includes the following variants: Product name Order number Develco item number DevCom 06-SB ZigBee Module DevCom06-SB A0043Z0000
Data Sheet for DevCom 06 ZigBee Module v1.00 22 9 Contact Information Technical support, Sales & DevCom Registration : Please contact Develco: Sales & Marketing Olof Palmes Allé 40 8200 Aarhus N Denmark Tel. +45 87 400 300 devcom@develco.com http://www.develco.com
Data Sheet for DevCom 06 ZigBee Module v1.00 23 10 About Develco A/S Develco is an independent design house. It was founded in 1989, and most of our staff have an engineering background. Develco's core competencies are in electronic engineering and embedded software. As we work in close partnerships in an extensive and highly competent network, we are able to handle very comprehensive projects. Our customers are primarily industrial operators who have their own product line. We provide complete solutions that turn our customers into leaders in their field. Develco transfers knowledge across business lines. We work in several lines of business - Wireless, Automotive & Industrial. The synergy achieved by working with diverse companies in a broad spectrum of businesses benefits all of our customers. Technological development is an area of high priority in Develco. We continuously strive to introduce new technologies and improve quality, doing our utmost to keep our customers on the leading edge. Develco is a member of the ZigBee Alliance and is also a Freescale Alliance Partner. We have been developing ZigBee enabled products since January 2004, e.g. for home control, security and AMR systems, the first of which have already been brought into production. Develco is ISO14001:2004 and ISO9001:2000 certified.

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