Dometic 289023121 HiPromatic ZigBee module User Manual Copyright Develco A S
Dometic GmbH HiPromatic ZigBee module Copyright Develco A S
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User Manual
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| Document ID | 2518115 |
| Application ID | 4PpXvZNNcdBePETg192+ZQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 50.9kB (636240 bits) |
| Date Submitted | 2015-01-29 00:00:00 |
| Date Available | 2015-01-29 00:00:00 |
| Creation Date | 2014-12-15 08:36:05 |
| Producing Software | Adobe PDF Library 9.0 |
| Document Lastmod | 2014-12-15 08:36:12 |
| Document Title | Copyright © Develco A/S |
| Document Creator | Acrobat PDFMaker 9.1 til Word |
| Document Author: | Johnny Jonassen |
Copyright © Develco A/S All rights reserved. Develco assumes no responsibility for any errors, which may appear in this document. Furthermore, Develco reserves the right to alter the hardware, software, and/or specifications detailed herein at any time without notice, and Develco does not make any commitment to update the information contained herein. All the trademarks listed herein are owned by their respective owners. RoHS Data Sheet for DevCom 06 ZigBee Module v1.00 Contents: Overview............................................................................................ 5 1.1 Specifications ................................................................................... 5 1.2 General Features............................................................................... 5 1.3 Interfaces ........................................................................................ 5 1.4 Software Configurations ..................................................................... 6 1.5 ZigBee Technology ............................................................................ 6 Electrical Specifications ........................................................................ 7 2.1 Operating Conditions ......................................................................... 7 2.2 DC Electrical Characteristics ............................................................... 7 2.3 AC Electrical Characteristics................................................................ 8 Pin Assignments and Definitions ............................................................ 9 3.1 Assignments for Debug Interface ...................................................... 10 Mechanical Specifications ................................................................... 11 4.1 Mechanical Dimensions .................................................................... 11 4.2 Mechanical Implementation .............................................................. 11 Certifications .................................................................................... 13 Antenna Characteristics ..................................................................... 14 6.1 Internal F-antenna .......................................................................... 14 Assembly Guidelines .......................................................................... 15 7.1 PCB Layout Guidelines ..................................................................... 15 7.2 Soldering Guidelines ........................................................................ 19 Ordering Information ......................................................................... 21 Contact Information .......................................................................... 22 10 About Develco A/S ............................................................................ 23 Data Sheet for DevCom 06 ZigBee Module v1.00 Acronyms The following list shows the acronyms used in this document. A/D CE EMC GPIO I2C IC IDE JTAG LNA MAC MCU PA PCB PHY SBW SCI SMD SPI SW UART USB Analog to Digital Conformité Européenne Electromagnetic Compatibility General Purpose Input Output Inter Integrated Circuit Integrated Circuit Integrated Development Environment Joint Test Action Group Low Noise Amplifier Medium Access Control Micro Controller Unit Power Amplifier Printed Circuit Board Physical Layer Spy-Bi-Wire Serial Communication Interface Surface Mount Device Serial Port Interface Software Universal Asynchronous Receive Transmit Universal Serial Bus Data Sheet for DevCom 06 ZigBee Module v1.00 References For more detailed information, please consult the following documents: Texas Instruments, Inc. “MSP430 Hardware Tools, Users Guide SLAU208E, Rev. April 2010” “MSP430F543xA, Datasheet SLAS612A, Rev. March 2010” “CC2529, Datasheet SWRS068, Rev. December 2007” “CC2590, Datasheet SWRS080, Rev. September 2008” Data Sheet for DevCom 06 ZigBee Module v1.00 1 Overview The DevCom 06 ZigBee Module offers a fast-track approach to development of IEEE 802.15.4 and ZigBee applications. The module comes with a 24-pole connector with access to different I/Os. The module has an internal antenna. The DevCom 06 ZigBee Module is available as a module with standard software, but the module is also available with customized software developed by Develco A/S in close co-operation with the customer. The module is based on TI’s 16-bit MSP430 series and the 2.4 GHz ZigBee compliant radio, CC2520. The DevCom 06 ZigBee Module includes the RF front end module, CC2590/CC2591 for extended range performance. The board is supplied with software based on Texas Instruments Z-Stack, ZigBee-2007 Release. 1.1 Specifications • • • • • • • • • • • • • • Dimensions: 24 x 25mm Storage temperature: -30 to +105°C Operating temperature: -10 to +70°C Transmitter output power (maximum): 14 dBm 1 Receiver sensitivity: -101 dBm @ 1% PER Supply voltage range: 2.4 to 3.6V @ 25MHz system frequency Bit rate: 250 kbps Data rate: 200 kbps Frequency band: 2400 to 2483.5 MHz Number of channels: 16 Current consumption, Rx: 32.1 mA Current consumption, Tx: 54.3 mA @ 12 dBm Flash memory: 256 kB RAM: 16 kB 1.2 General Features • • • • • • • • 2.4 GHz IEEE 802.15.4 Low power consumption (down to 1.5 µA in standby mode. For cable replacement application down to 100 µA) VCC I/O level Up to 18 GPIOs (UART, Keyboard inputs, A/D, PWM, Comparator, I2C and SPI) On-board antenna and prepared for external antenna CE compliant 2 RoHS compliant according to the EU Directive 2002/95/EC Software development board available 1.3 Interfaces • 24 pin DIL connector (2mm spacing) o Up to 18 GPIOs Up to 4 UARTs Up to 7 Interrupt inputs Up to 6 A/D inputs Up to 6 Timer / Compare outputs Output power shall be limited to comply with European regulations Pending Data Sheet for DevCom 06 ZigBee Module VCC GND v1.00 Up to 2 I2Cs Up to 3 SPI 1.4 Software Configurations Modules are preloaded with MAC based cable replacement software. 1.5 ZigBee Technology The IEEE 802.15.4 specification is a cost-effective, low data rate (<250 kbps), 2.4 GHz and 868/915 MHz wireless technology designed for personal-area peer-to-peer and star networks. The IEEE 802.15.4 standard is the basis of an application and network layer protocol called ZigBee. A number of companies, including Develco A/S, have formed a consortium known as the ZigBee Alliance. The purpose of this consortium is to create a specification for mesh networking and application profiles. The companies also perform interoperability and certification testing. For additional information about the ZigBee Alliance, please visit the following website http://www.ZigBee.org Data Sheet for DevCom 06 ZigBee Module v1.00 2 Electrical Specifications This section details the operating conditions, DC characteristics and AC characteristics of the DevCom 06 ZigBee Module. 2.1 Operating Conditions Table 2.1 Operating Conditions Parameter Supply Voltage (VCC) Max 3.6 Unit Conditions 2.405 2.480 GHz 16 available channels in the 2.4 GHz ISM band Storage Temperature Range -30 +105 °C Operating Temperature Range -10 +70 °C Max Unit μA Frequency Range Min 2.4 Typ 3.0 0% to 90% relative humidity (non-condensation) 0% to 90% relative humidity (non-condensation) 2.2 DC Electrical Characteristics Table 2.2 DC Electrical Characteristics 3 Parameter Current Consumption4, Standby Min Current Consumption, Transmit Mode (Nominal) 65 Current Consumption, Receive Mode Input High Voltage (Vih) Input Low Voltage (Vil) Output High Voltage (Voh) Output Low Voltage (Vol) Typ mA 30 0.70* VCC VCC0.6 mA 0.25* VCC 0.6 Conditions VCC = 3.0V (Hibernate and Stop3 mode) Excluding on-board regulation VCC = 3.0V (Transmit mode and Run mode) Output power limited for CE compliance VCC = 3.0V (Receive mode and Run Mode) All digital inputs +70°C) All digital inputs +70°C) All digital inputs +70°C) @ 6mA All digital inputs +70°C) @ 6mA (-10°C to (-10°C to (-10°C to (-10°C to VCC=3.0V, Ta=+25°C, unless otherwise noted Current consumptions are for DevCom 06-x and include PHY and MAC only Data Sheet for DevCom 06 ZigBee Module v1.00 2.3 AC Electrical Characteristics Table 2.3 AC Electrical Characteristics 5 Parameter RF Data Rate Min Typ 250 Max Unit kbps Conditions Over the air data rate ≤1% Packet Error Rate, 20byte payload Receiver Sensitivity TBD dBm Saturation (Maximum Input Level) TBD dBm Frequency Error Tolerance Symbol Rate Error Tolerance 200 80 kHz ppm Transmitter Output Power (Maximum) TBD dBm Transmitter Output Power (Nominal) TBD dBm Output power shall be limited to comply with European regulations Output power limited for CE compliance 6 VCC=3.0V, Ta=+25°C, unless otherwise noted Excluding antenna gain Data Sheet for DevCom 06 ZigBee Module v1.00 3 Pin Assignments and Definitions The interface of the DevCom 06 ZigBee Module consists of 24 connections. These connections are located in 2 rows of 12 pins each with a pitch of 2mm. 18 of these connections are available as digital General Purpose Input-Output connections for SW development purposes, which includes In-circuit debug and flash programming, UART, Keyboard inputs, A/D, Timer, Comparator, I2C and SPI. Table 3.1 details the pin-out of the 24 interface connections of the DevCom 06 ZigBee Module . For more detailed information about GPIO functionalities, please see the “MSP430F5438 Data Sheet” from Texas Instruments. Table 3.1 Pin Definitions Pin Number Pin Name VCC (Supply Voltage) Reset BKGD GND UART0-RxD / IRQ2 UART0-TxD / IRQ3 UART1-RxD / SPI1(MISO) UART1-TxD / SPI1(MOSI) PWM4 / I2C1 (SDA) 10 PWM1 / I2C1 (SCL) 11 SPI0 (SCLK) / UART4-RxD 12 13 14 SPI0 (MOSI) / UART2-TxD SPI0 (MISO) / UART2-RxD SPI0 (CS) / UART4-TxD 15 ADC5 / SPI1 (SCLK) 16 IRQ4 / SPI1 (CS) 17 IRQ0 / PWM3 18 IRQ1 / ADC4 19 PWM0 / ADC0 20 PWM2 / ADC1 21 I2C0 (SDA) / ADC2 22 I2C0 (SCL) / ADC3 23 24 GND GND MSP430 Connections and/or Description Internally connected to AVCC, DVCC1, DVCC2, DVCC3 and DVCC4 Connected to /RST Connected to TEST/SBWTCK Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4 P5.7/UCA1RXD/UCA1SOMI + P2.3/TA1.2 P5.6/UCA1TXD/UCA1SIMO + P2.5 P10.5/UCA3RXD/UCA3SOMI P10.4/UCA3TXD/UCA3SIMO P1.0/TA0CLK/ACLK + P2.4/RTCCLK + P10.1/UCB3SIMO/UCB3SDA P2.6/ACLK + P10.2/UCB3SOMI/UCB3SCL P3.5/UCA0RXD/UCA0SOMI + P9.0/UCB2STE/UCA2CLK P9.4/UCA2TXD/UCA2SIMO P9.5/UCA2RXD/UCA2SOMI P3.4/UCA0TXD/UCA0SIMO + P9.3/UCB2CLK/UCA2STE P6.5/A5 + P10.0/UCB3STE/UCA3CLK P2.2/TA1.1 + P10.3/UCB3CLK/UCA3STE P2.7/ADC12CLK/DMAE0 + P4.0/TB0.0 P6.4/A4 + P2.1/TA1.0 P6.0/A0 + P4.1/TB0.1 P6.1/A1 + P4.2/TB0.2 P6.2/A2 + P9.1/UCB2SIMO/UCB2SDA P6.3/A3 + P9.2/UCB2SOMI/UCB2SCL Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4 Internally connected to AVSS, DVSS1, DVSS2, DVSS3 and DVSS4 Data Sheet for DevCom 06 ZigBee Module v1.00 3.1 Assignments for Debug Interface The DevCom 06 ZigBee Module has all connections necessary for easy programming and debugging of the module. The USB Flash Emulation Tool, MSP-FET430UIF from Texas Instruments can be used for these purposes. The following connection scheme shows the necessary interconnections, between the programmer and the DevCom06 module. MSP-FET430UIF Connector 2 wire JTAG interconnection (SpyByWire) Vcc supplied from Target: Vcc MSP-FET430UIF Devcom06 Description Pin Pin Description TDO/TDI RESET Vcc Target Vcc TCK BKGD/Test Gnd Gnd Vcc supplied from Programmer: Vcc TDO/TDI RESET Vcc Tool Vcc TCK BKGD/Test Gnd Gnd Devcom06 Connector For proper utilization and detailed information of the USB Flash Emulation Tool, please look into the “MSP430 Hardware Tools – User’s Guide” from Texas Instruments. The User’s guide can be downloaded from http://www.ti.com Figure 3.1 - MSP430-FT430UIF 10 Data Sheet for DevCom 06 ZigBee Module v1.00 4 Mechanical Specifications This chapter details the mechanical specifications for the DevCom 06 ZigBee Module. Parameters described in detail are mechanical dimensions and mechanical implementation. 4.1 Mechanical Dimensions The DevCom 06 ZigBee Module is available for SMD assembling only. The mechanical dimensions is shown in Figure 4.2. Maximum height including PCB is 2.9mm. Figure 4.2 Mechanical dimensions 4.2 Mechanical Implementation To achieve the specified performance and comply with regulatory approvals, the DevCom 06 ZigBee Module must meet the following requirements when implemented to an interface platform. There must not be any ground plane or power plane above or below the antenna part of the module. FR-4 material under the antenna is, however, acceptable. The minimum distance from the DevCom 06 ZigBee Module to one of the mentioned planes must be at least 15mm to each side. See Figure 4.3 for implementation guidelines. All dimensions are designated in millimetres. It is recommended that the ground plane of the interface platform is a as large as possible; the minimum ground plane acceptable must cover the DevCom 06 ZigBee Module , except for the antenna area as mentioned above. It is important that the two pads for ground connections to the external interface board are fixed properly, to provide optimal ground connection and mechanical stability. The drawing below is seen from top side (component side) and shows the soldering connections for the module. It is required that the test points on the solder side of the DevCom 06 ZigBee Module are isolated from the ground plane. Se chapter 7 for coordinates. 11 Data Sheet for DevCom 06 ZigBee Module v1.00 Figure 4.3 Requirements for mechanical implementation of DevCom 06 ZigBee Module The ground plane on the interface board can be on both sides or on one side only. 12 Data Sheet for DevCom 06 ZigBee Module v1.00 5 Certifications The DevCom 06 ZigBee Module is fully CE certified 7 and compliant to the following standards: • • • • • EN 300 328 V1.7.1 (2006-05) EMC for Radio spectrum Matters (ERM); Data transmission equipment for operating in the 2.4GHz ISM band and using wide band modulation techniques. EN 301 489-1 V1.6.1 (2005-09) EMC for Radio spectrum Matters (ERM); Common technical requirements. EN 301 489-17 V1.2.1 (2002-08) EMC for Radio spectrum Matters (ERM); Specific conditions for 2.4GHz wideband transmission systems. EN 60950 (2000-June) Safety of information technology equipment EN 50371 (2002) Basic restrictions related to human exposure Part 15 - Class B digital device or peripheral §15.105(b) “This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.” This device complies part 15 of FCC rules and RSS-210 of IC rules. Operation is subjected to the following two conditions : (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. The term "IC" before the equipment certification number only signifies that the Industry Canada technical specifications were met. Changes or modification not expressly approved by the partly responsible for compliance could void the user’s authority to operate the equipment. Ce dispositif est conforme à la norme partie 15 de FCC et CNR-210 d'Industrie Canada. Le terme «IC» devant le numéro de certification de l'équipement signifie uniquement que les spécifications techniques d'Industrie Canada ont été respectées. Les changements ou modifications non expressément approuvés par la partie responsable de conformité pourrait annuler l'autorité de l'utilisateur à utiliser l'équipement" FCC ID: 2AC5K289023121 IC: 12307A-289023121 M/N::"DevCom 06 ZigBee Module Pending 13 Data Sheet for DevCom 06 ZigBee Module v1.00 6 Antenna Characteristics This section details the antenna part of the DevCom 06 ZigBee Module. The module has an internal antenna implemented. NOTE: If any other antenna than the default F-antenna is used, the DevCom 06 ZigBee Module is no longer certain to comply with the already approved certifications. To ensure full compliance, approval is therefore necessary. 6.1 Internal F-antenna The antenna implemented on the DevCom 06 ZigBee Module is an in-PCB F-antenna. The F-antenna has good efficiency and an almost omni-directional radiation pattern. Figure 6.1 and Figure 6.2 show the DevCom 06 ZigBee Module horizontal and vertical radiation patterns. The red colour represents the vertical polarization and the blue colour the horizontal polarization. Both radiations are measured in dBi. Figure 6.1 Horizontal radiation pattern Figure 6.2 Vertical radiation pattern 14 Data Sheet for DevCom 06 ZigBee Module v1.00 7 Assembly Guidelines This chapter details the assembly guidelines for the DevCom 06 ZigBee Module, including guidelines for PCB layout and soldering. 7.1 PCB Layout Guidelines This section describes the guidelines for recommended footprint for the interface PCB for SMD assembling of the DevCom 06 ZigBee Module. The guidelines include recommendations on copper layer, solder mask and solder paste. These recommendations are guidelines only and may need to be adjusted, depending on other components on the interface PCB and the assembly facility in general. The data for copper layout, solder mask and solder paste for the DevCom 06 ZigBee Module are illustrated in Figure 7.4, Figure 7.5 and Figure 7.6. A similar footprint is recommended for the interface PCB as well and illustrated in Figure 7.1, Figure 7.2 and Figure 7.3. It is recommended to adjust the stencil opening and thickness in correlation with the interface PCB. Test points are illustrated in Figure 7.7. Sufficient clearances for the test points are highly recommended to implement in the ground layer on the interface PCB. All dimensions are in millimetres with a tolerance of approximately ±0.05mm. 15 Data Sheet for DevCom 06 ZigBee Module v1.00 Figure 7.1 - Recommended copper layout for the Interface Module Figure 7.2 Recommended solder mask for the Interface Module Figure 7.3 Recommended solder paste for the Interface Module 16 Data Sheet for DevCom 06 ZigBee Module v1.00 Figure 7.4 Copper layout for the DevCom 06 ZigBee Module Figure 7.5 Solder mask for the DevCom 06 ZigBee Module Figure 7.6 Solder paste for the DevCom 06 ZigBee Module 17 Data Sheet for DevCom 06 ZigBee Module v1.00 Figure 7.7 Test points for the DevCom 06 ZigBee Module 18 Data Sheet for DevCom 06 ZigBee Module v1.00 7.2 Soldering Guidelines This section describes soldering guidelines for the interface PCB for SMD assembling of the DevCom 06 ZigBee Module. The guidelines include recommendations on the soldering profile. Concerning humidity and sensitivity, the DevCom 06 ZigBee Module must be handled in accordance with IPC/JEDEC J-STD-020C classification 3. Figure 7.8 illustrates a recommended reflow soldering profile for the DevCom 06 ZigBee Module (Extracted from IPC/JEDEC J-STD-020C). These recommendations are guidelines only and may need to be adjusted, depending on other components on the interface PCB and the assembly facility in general. Figure 7.8 Soldering guidelines for the DevCom 06 ZigBee Module 19 Data Sheet for DevCom 06 ZigBee Module v1.00 20 Data Sheet for DevCom 06 ZigBee Module v1.00 8 Ordering Information The DevCom 06 ZigBee Modules includes the following variants: Product name DevCom 06-SB ZigBee Module Order number DevCom06-SB Develco item number A0043Z0000 21 Data Sheet for DevCom 06 ZigBee Module v1.00 9 Contact Information Technical support, Sales & DevCom Registration : Please contact Develco: Sales & Marketing Olof Palmes Allé 40 8200 Aarhus N Denmark Tel. +45 87 400 300 devcom@develco.com http://www.develco.com 22 Data Sheet for DevCom 06 ZigBee Module v1.00 10 About Develco A/S Develco is an independent design house. It was founded in 1989, and most of our staff have an engineering background. Develco's core competencies are in electronic engineering and embedded software. As we work in close partnerships in an extensive and highly competent network, we are able to handle very comprehensive projects. Our customers are primarily industrial operators who have their own product line. We provide complete solutions that turn our customers into leaders in their field. Develco transfers knowledge across business lines. We work in several lines of business - Wireless, Automotive & Industrial. The synergy achieved by working with diverse companies in a broad spectrum of businesses benefits all of our customers. Technological development is an area of high priority in Develco. We continuously strive to introduce new technologies and improve quality, doing our utmost to keep our customers on the leading edge. Develco is a member of the ZigBee Alliance and is also a Freescale Alliance Partner. We have been developing ZigBee enabled products since January 2004, e.g. for home control, security and AMR systems, the first of which have already been brought into production. Develco is ISO14001:2004 and ISO9001:2000 certified. 23
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