ELITEGROUP COMPUTER SYSTEMS ED2LN30PA1 DATA CARD User Manual Part 1
ELITEGROUP COMPUTER SYSTEMS CO., LTD DATA CARD Part 1
Contents
- 1. User Manual Part 1
- 2. User Manual Part 2
- 3. User Manual
User Manual Part 1
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. Copyright © Telit Communications S.p.A. 2011. Contents Figure 1 M.2 HSPA+ Block Diagram................................................................................................................ 18 Figure 2 M.2 APAC LTE Module Block Diagram............................................................................................ 19 Figure 3 M.2 LTE Module Block Diagram........................................................................................................ 20 Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine .................................................................. 21 Figure 5 PCI Express M.2 Module Interface ..................................................................................................... 22 Figure 6 GNSS Connections and Interface ........................................................................................................ 31 Figure 7 Typical LED Connection..................................................................................................................... 36 Figure 8 Antenna Control – Connections Detail................................................................................................ 39 Figure 9 In-Device Coexistence Architecture.................................................................................................... 40 Figure 10 RF Antenna – Coaxial Connector Location....................................................................................... 46 Figure 11 M.2 Carrier Board.............................................................................................................................. 48 Figure 12 Windows 7 Software Architecture..................................................................................................... 52 Figure 13 Windows 8 Software Architecture..................................................................................................... 53 Figure 14 Linux Software Architecture ............................................................................................................. 55 Figure 15 Android Software Architecture.......................................................................................................... 59 Figure 16 Chrome Software Architecture .......................................................................................................... 60 Figure 17 WWAN Card 3042 Mechanical Dimensions .................................................................................... 74 Figure 18 WWAN Card 3042 Slot Key Details................................................................................................. 75 Figure 19 WWAN Card Type 3042 Top-Side Mounting Land Pattern............................................................. 76 Figure 20 WWAN Card 3042 Mid-plane Land Pattern with Slot Key Removed.............................................. 77 Figure 21 Antenna Connector Location ............................................................................................................. 78 Table 1 M.2 Module - General Feature.............................................................................................................. 14 Table 2. M.2 Module - RF Band Support ......................................................................................................... 15 Table 3. M.2 Module - Data Services ................................................................................................................ 17 Table 4 M.2 Host Interface Signals.................................................................................................................... 22 Table 5 USB HS Interprocessor Communications Interface.............................................................................. 27 Table 6 USB SSIC – ICP Interface.................................................................................................................... 28 Table 7 (U)SIM Interface Signals ...................................................................................................................... 29 Table 8 X-GOLD™ Baseband to GNSS Interface Signals................................................................................ 32 Table 9 GNSS Module Interface Signals ........................................................................................................... 32 Table 10 Power-on & Reset Signals .................................................................................................................. 33 Table 11 Radio Disable Signal........................................................................................................................... 34 Table 12 Host Radio Disable Interface (W_DISABLE#) .................................................................................. 35 Table 13 LED#1 Signal...................................................................................................................................... 36 Table 14 LED State Indicator ............................................................................................................................ 36 Table 15 Wake on WWAN Signal..................................................................................................................... 37 Table 16 DPR#/ SAR Support Signal ................................................................................................................ 38 Table 17 Tunable Antenna Control Signals ....................................................................................................... 39 Table 18 Coexistence – Hardware Synchronization Signals.............................................................................. 41 Table 19 Power & Ground Signals .................................................................................................................... 42 Table 20 M.2 Configuration Pins....................................................................................................................... 43 Table 21 Audio Signals (Future development) ................................................................................................. 43 Table 22 No Connect Pins ................................................................................................................................. 45 Table 23 Antenna Requirements........................................................................................................................ 45 Table 24 Operating Environment....................................................................................................................... 61 Table 25 M.2 Module Power Delivery Requirements - Ultrabook.................................................................... 62 Table 26 VBAT Power Delivery Requirements – Direct Connections (Tablet) ................................................ 62 Table 27 DC Specification for 3.3V Logic Signaling ........................................................................................ 63 Table 28 DC Specification for 1.8V Logic Signaling ........................................................................................ 63 Table 29 LTE Power Consumption.................................................................................................................... 64 Table 30 UMTS Power Consumption................................................................................................................ 64 Table 31 GSM Power Consumption .................................................................................................................. 65 Table 32 Conducted Transmit Power – 2G........................................................................................................ 67 Table 33 Conducted Transmit Power – 3G........................................................................................................ 67 Table 34 Conducted Transmit Power – LTE ..................................................................................................... 68 Table 35 Rx Sensitivity - GSM.......................................................................................................................... 68 Table 36 Rx Sensitivity - UMTS ....................................................................................................................... 69 Table 37 Rx Sensitivity - LTE ........................................................................................................................... 69 Table 38 Antenna Recommendation.................................................................................................................. 71 Table 39 Antenna Recommendation - Bandwidth of Main & Diversity Antenna............................................. 71 Table 40 GNSS Sensitivity ................................................................................................................................ 72 Table 40 Antenna Connector Assignment ......................................................................................................... 78 This document is a technical specification for Telit’s next generation form factor M.2 module family. The next generation form factor M.2 module family is a natural transition from the PCI Express Mini Card and Half Mini Card to a smaller form factor size. The M.2 Card Type 3042 offers single sided component mounting, 75 pins (8 dedicated for key), in a compact size (30 mm x 42 mm). A range of 2G/3G/4G (LTE) M.2 modules supporting multiple operating systems and unique features in the WWAN Card Type 3042 form factor are available. The document will cover the features of the M.2 modules presently available. It will also identify the M.2 module application interface along with hardware, software, reliability, and mechanical specifications. The intent of this document is to provide design guidelines and information for each M.2 module. In addition to the M.2 module family features and performance metrics, this document describes the interface signals, operating conditions, physical and mechanical requirements of the M.2 cards. This document is intended for editors who are about to write or edit documentation for Telit. For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at: TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. This document contains the following chapters (sample): “Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. “Chapter 2: “Chapter two” gives an overview of the features of the product. “Chapter 3: “Chapter three” describes in details the characteristics of the product. “Chapter 6: “Conformity Assessment Issues” provides some fundamental hints about the conformity assessment that the final application might need. “Chapter 7: “Safety Recommendation” provides some safety recommendations that must be follow by the customer in the design of the application that makes use of the AA99-XXX. Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. TBA This section will provide an overview of the standard features of a M.2 Card, information on the various SKUs of 2G/3G/4G (LTE) M.2 modules along with a respective functional block diagram of each SKU. There are five different M.2 modules available in the M.2 Card Type 3042 form factor: HN930 - HSPA+ LN930-AP - APAC LTE LN930 - LTE A comparison of the features, RF band Support, and data rates for the various M.2 modules is shown in Table 1 through Table 3 Table 1 M.2 Module - General Feature Mechanical M.2 Card Type 3042 Slot B 30 mm x 42 mm Pin count: 75 (67 usable, 8 slot) Operating Voltage 3.3 V +/- 5% Operating Temperature – Normal – Extended Application Interface (75 pin card) M.2 module LN930 Additional Information LN930-AP Description HN930 Feature Extreme - This is the surrounding air temperature of the module inside the platform when the card is fully operating at worst case condition Interprocessor Communications USB 2.0 High-speed USIM w/ Card Detect SIM_CLK, SIM_RESET, SIM_IO, SIM_PWR, SIM_DETECT Full_Card_Power_On_Off M.2 Control Reset# W_DISABLE# LED #1 DPR (Body SAR) Wake on WWAN GNSS Disable Global Positioning (GPS/ GLONASS) I2C_SCL, I2C_SDA, I2_IRQ, CLKOUT, TX_BLANKING Antenna Tuning (4) GPO (RF Transceiver) RF Coexistence (3) GPIO RF Antenna Main & Diversity/ GNSS Separate coax connectors Debug JTAG ETM11 MIPI PTI Table 2. M.2 Module - RF Band Support M.2 Module 2110 MHz 2170 MHz 002 II 1850 MHz 1910 MHz 1930 MHz 1990 MHz 1710 MHz 1785 MHz 1805 MHz 1880 MHz 1710 MHz 1755 MHz 2110 MHz 2155 MHz 824 MHz 849 MHz 869 MHz 894 MHz 830 MHz 840 MHz 875 MHz 885 MHz 2500 MHz 2570 MHz 2620 MHz 2690 MHz 880 MHz 915 MHz 925 MHz 960 MHz 1749.9 MHz 1784.9 MHz 1844.9 MHz 1879.9 MHz 010 X 1710 MHz 1770 MHz 2110 MHz 2170 MHz 011 XI 1427.9 MHz 1447.9 MHz 1475.9 MHz 1495.9 MHz 699 MHz 716 MHz 729 MHz 746 MHz 003 III 004 IV 005 V 006 VI 007 VII 008 VIII 009 IX 012 XII GSM LTE LN930 LTE 1920 MHz 1980 MHz LN930-AP LTE 001 I UMTS GSM HN930 UMTS UE Receive UMTS UE Transmit GSM RF Band 013 XIII 777 MHz 787 MHz 746 MHz 756 MHz 014 XIV 788 MHz 798 MHz 758 MHz 768 MHz 017 XVII 704 MHz 716 MHz 7734 MHz 746 MHz 815 MHz -830 MHz 860 MHz -875 MHz 830 MHz 845 MHz 875 MHz 890 MHz 832 MHz 862 MHz 791 MHz 821 MHz 1447.9 MHz 1462.9 MHz 1495.9 MHz 1510.9 MHz 022 XXII 3410 MHz 3490 MHz 3510 MHz 3590 MHz 023 XXIII 2000 MHz 2020 MHz 2180 MHz 2200 MHz 024 XXIV 1626.5 MHz 1660.5 MHz 1525 MHz 1559 MHz 025 XXV 1850 MHz 1915 MHz 1930 MHz 1995 MHz 026 XXVI 814 MHz 849 MHz 859 MHz 894 MHz 027 XXVII 806 MHz 824 MHz 851 MHz 869 MHz 028 XXVIII 703 MHz 748 MHz 758 MHz 803 MHz 018 XVIII 019 XIX 020 XX 021 XXI 029 XXIX 1850 MHz 1910 MHz or 1710 MHz 1755 MHz 716 MHz 728 MHz 001 I 1920 MHz 1980 MHz 2110 MHz 2170 MHz Table 3. M.2 Module - Data Services LN930 LN930-AP M.2 module HN930 Data Service GPRS Class 33: DL 85.6 kbps, UL 85.6 kbps EDGE Class 33: DL 236.8 kbps, UL 236.8 kbps WCDMA: DL 384 kbps, UL 384 kbps HSPA+: DL 21 Mbps, UL 5.7 Mbps HSPA+: DL 42 Mbps, UL 5.7 Mbps LTE FDD: DL: 100 Mbps, UL 50 Mbps LTE FDD: DL: 150 Mbps, UL 50 Mbps Module supports DL 150 Mbps in LN930. This is only for generic SW and VZW SW, but not for AT&T SW. The M.2 HSPA+ module is Intel’s Next Generation Form Factor design based on Intel’s XMM™6260 modem platform. The M.2 HSPA+ card is a dual-mode (UMTS/GSM) 3GPP release 7 HSPA+ modem. The M.2 HSPA+ module includes support at the 75 pin application interface for M.2 Control, USB 2.0 HS, GNSS, and USIM. Antenna Tuning is not supported. A block diagram of the M.2 HSPA+ module is shown in Figure 1. Figure 1 M.2 HSPA+ Block Diagram The M.2 APAC LTE module is another Intel design based on the XMM™7160 modem platform. The module has a targeted area of operation in the Asia Pacific rim and offers 3G and LTE datacard functionality, 2G Functionality is not supported. The M.2 APC LTE module includes support at the 75 pin application interface for M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning. A block diagram of the M.2 APAC LTE module is shown in Figure 2. Figure 2 M.2 APAC LTE Module Block Diagram The M.2 LTE module is based on Intel’s XMM™7160 modem platform. The M.2 LTE module is a triple-mode (2G, 3G, and 4G) 3GPP release 9 modem providing datacard functionality. The M.2 LTE module includes support at the 75 pin application interface for M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning. A block diagram of the M.2 LTE module is shown in Figure 3. Figure 3 M.2 LTE Module Block Diagram A more detailed interconnect diagram of the RF Engine utilized on the M.2 LTE Module is shown in Figure 4. TM SMARTi 4G PMB5740 Diversity Receiver RD_H1 RD_H1X RD_H3 RD_H3X VBAT RD_M1 RD_M1X RD_M2 RD_M2X SD2_1V8 RD_L1 RD_L1X RD_L2 RD_L2X RD_L4 RD_L4X RD_L3 RD_L3X Diversity Switch & Filter Module B7 Div Filter VBAT B7 B1/B4 Diversity Antenna B2/B25 B3 B5/B26 B13/B17 B8 RFE_RFFE_VIO RFE_RFFE_SDATA B20 RFE_RFFE_SCLK B20 Div Filter REF OSC AFC_DAC Combined Receiver Main Switch & Duplexer Module XO_SUP XO RX_H2 RX_H2X B7 RX_H3 RX_H3X B1 RX_H4 RX_H4X RX_M1 RX_M1X RX_M2 Clock and Control RFE_RFFE_VIO RFE_RFFE_SDATA XOX VCTCXO B7 Duplexer RFE_RFFE_SCLK B4 Main Antenna B2/B25 Coupler B3 RX_M2X XGOLDTM 716 DigRF RX_L1 RX_L1X RX_L2 RX_L2X B5/B26 RX_L4 RX_L4X B13/B17 RX_L3 RX_L3X B20 B8 B20 Duplexer VBAT VBAT RFE_PADCDC_MI PA DCDC PA Control PADACF PADACF_P PADACS VBAT B7 PA RFFE RFFE_VIO RFFE_SDATA RFFE_SCLK Transmitter Measurement Unit Battery RFE_NTC RFE_PADCDC_MI M1 M2 M3 TQ_X TQ_H TQ_L TP_H TP_L RFE_RFFE_VIO RFE_RFFE_SDATA RFE_RFFE_SCLK B1 B4 B2/B25 B3 GSM_HB RFE_TQ_H RFE_TP_H RFE_TQ_L RFE_TP_L VBAT FBR SCPA B20 B5/B26 B8 B17 B13 GSM_LB FBR_RF1 FBR_RF2 Figure 4 Detailed Interconnection of M.2 LTE Modem RF Engine This section describes the signals available to the host processor at the 75 pin application interface. Eight signals are eliminated by the notch on the host connector, leaving 67 usable signals. A diagram of the M.2 module identifying the 75 pin interface is shown in Figure 5. Note that the M.2 module has all components mounted on the top side. Odd pin numbers are on the top side while even pins on the bottom side. Figure 5 PCI Express M.2 Module Interface A complete description of all interface signals available at the host interface is listed in Table 4. Some features, such as GNSS and Antenna Tuning, are not available on every M.2 module. On those modules, the signals at the application interface are not connected on the M.2 module. Table 4 M.2 Host Interface Signals Pin Signal Name I/O Description Supply CONFIG_3 Presence Indication: WWAN M.2 Connects to GND internally 3.3V M.2 Supply Pin 3.3 V 3.3 V GND Ground 3.3V M.2 LTE Supply Pin 3.3 V 3.3 V GND Ground FULL_CARD_POWER_OFF# Control signal to power On/Off M.2. 1.8 V USB D+ IO USB 2.0 HS DPLUS Signal W_DISABLE# USB D– IO Active low signal to Disable Radio Operation USB 2.0 HS DMINUS Signal 3.3 V 10 LED#1 11 GND Open Drain, active low signal used for add-in card to provide status Ground 12 SLOT KEY 13 SLOT KEY 14 SLOT KEY 15 SLOT KEY 16 SLOT KEY 17 SLOT KEY 18 SLOT KEY 19 SLOT KEY 3.3 V 20 AUDIO0 IO PCM Clock (I2S_CLK) 1.8 V 21 CONFIG_0 Configuration Status. Presently not connected on WWAN M.2 module. 22 AUDIO1 PCM In (I2S_RX) 1.8 V 23 WAKE_WWAN# Wake On WWAN Use by M.2 to wake up host. 1.8 V 24 AUDIO2 PCM Out (I2S_TX) 1.8 V 25 DPR 1.8 V 26 GNSS_DISABLE# Dynamic Power Reduction Body SAR control signal Disable GNSS function 27 GND Ground 28 AUDIO3 IO PCM Sync (I2S_WA0) 1.8 V 29 SSIC_RxN 30 UIM-RESET SSIC Receive N (Not Supported) SIM Reset (I) 31 SSIC_RxP 32 UIM-CLK SSIC Receive P (Not Supported) SIM Clock (I) 33 GND Ground 34 UIM-DATA IO SIM Data (I/O) 35 SSIC_TxN 36 UIM-PWR SSIC Transmit N (Not Supported) SIM power 37 SSIC_TxP 38 N/C 39 GND 40 I2C_SCL 1.8 V 1.8 V/3.0 V 1.8 V/3.0 V 1.8 V/3.0 V 1.8 V/3.0 V SSIC Transmit P (Not Supported) Not connected internally on M.2 Ground IO I2C Clock – GNSS Support 1.8 V 41 N/C Not connected internally on M.2 I2C Data – GNSS Support 42 I2C_SDA IO 43 N/C 44 I2C_IRQ 45 GND 46 SYSCLK 26 MHz reference Clock output for external GNSS module 1.8 V 47 N/C 48 TX_BLANKING 49 N/C 50 N/C 51 GND Not connected internally on M.2 GNSS Blanking Signal used to indicate 2G Tx burst and LTE band 13 Tx burst. Not connected internally on M.2 Not connected internally on M.2 Ground 52 N/C internally on 53 N/C internally on 54 N/C internally on 55 N/C internally on 56 N/C internally on 57 GND Not connected M.2 Not connected M.2 Not connected M.2 Not connected M.2 Not connected M.2 Ground 58 N/C 59 ANTCTL0 60 COEX3 61 ANTCTL1 62 COEX2 63 ANTCTL2 64 COEX1 65 ANTCTL3 66 SIM DETECT 67 68 Not connected internally on M.2 GNSS Interrupt Request – GNSS Support Ground 1.8 V 1.8 V 1.8 V Not connected internally on M.2 RF Antenna Tuning Control Signal 0 Wireless Coexistence between WWAN and WiFi/BT modules. IDC_LteDtxEnv RF Antenna Tuning Control Signal 1 Wireless Coexistence between WWAN and WiFi/BT modules. IDC_CwsPriority 1.8 V RF Antenna Tuning Control Signal 2 Wireless Coexistence between WWAN and WiFi/BT modules. IDC_LteFrameSync 1.8 V 1.8 V RF Antenna Tuning Control Signal 3 SIM Card Detection (I) (low active). Pull-up resistor on WWAN M.2 module RESET# Single control to reset WWAN 1.8 V N/C Not connected internally on M.2 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 69 CONFIG_1 Configuration Status WWAN M.2 Connects to GND internally 70 3.3V WWAN Supply Pin 3.3 V 71 GND Ground 72 3.3V WWAN Supply Pin 3.3 V 73 GND Ground 74 3.3V WWAN Supply Pin 3.3 V 75 CONFIG_2 Configuration Status WWAN M.2 Connects to GND internally This section provides details on the various interfaces available M.2 modules. There are two interfaces on the M.2 host interface that support interprocessor communications (ICP); however, for the WWAN M.2 modules covered by the Product Description only the USB 2.0 High-speed port will be supported. The other ICP interface, USB Super-speed Inter-Chip (USB_SSIC), is not supported and the signals should not be connected at the host. The host processor, connected via an ICP interface, has access to the functions of the WWAN card. The USB 2.0 High-speed interface supports the following device classes: CDC-MBIM, CDCACM, and CDC-NCM. The USB Controller is compliant to the USB 2.0 Specification and with the Link Power Management (LPM) Addendum. LPM introduces a new sleep state (L1) which significantly reduces the transitional latencies between the defined power states; hence, improving the responsiveness of the WWAN platform regarding connecting to the internet (Quick Connect). USB2.0 LPM L1 Support Support for OS assisted fast dormancy Selective Suspend support • Very low power when in Selective Suspend: <4mw when connected to network (wake) <1 mW no wake It supports High-speed (HS, 480 MBit/s); Full-speed (FS, 12 MBit/s) transfers. Low- speed mode is not supported. Because there is not a separate USB-controlled voltage bus, USB functions implemented on the M.2 module are expected to report as self-powered devices General Features In device mode : High-speed (480 MBit/s) and Full-speed (12 MBit/s) In host mode: High-speed (480 MBit/s), Full-speed (12 MBit/s). Low-speed mode (1.5 Mbit/s) is not supported. Support for 16 bidirectional end points and channels including the end point 0. Table 5 USB HS Interprocessor Communications Interface Signal Name Description Pin USB_D+ USB Data Plus Direction (WWAN) I, O USB_D– USB Data Minus I, O Voltage Level Per USB 2.0 specification The USB Super-speed IC (USB SSIC) solution is not supported by the WWAN M.2 modules presented in this Product Description. It is set aside for future development. These signals should be left un-connected on the host. Table 6 USB SSIC – ICP Interface Signal Name Description Pin Direction (WWAN) Operating Voltage Range SSIC_RXN USB SSIC Receiver Signal N 29 SSIC_RXP USB SSIC Receiver Signal P 31 Per SSIC specification SSIC_TXN USB SSIC Transmitter Signal N 35 SSIC_TXP USB SSIC Transmitter Signal P 37 The USIM interface is compatible with the ISO 7816-3 IC Card standard on the issues required by the GSM 11.12 and GSM 11.18 standard. Both 1.8 V and 3 V SIM Cards are supported. A few comments on the SIM_DETECT signal 1. An external pull-up resistor is connected to SIM_DETECT on the WWAN M.2 module. 2. When a SIM is inserted, SIM_DETECT will be high. 3. When a SIM is removed or not present, SIM_DETECT will be low. 4. The host does not need to drive this signal. It can be tri-stated. Table 7 (U)SIM Interface Signals Signal Name Description Pin UIM_CLK Clock SIM Card 32 Direction (WWAN) UIM_DATA Input/ Output SIM Card 34 I, O UIM_RESET Reset signal for SIM card 30 USIM_PWR 1.8 V/3 V Supply for SIM Card 36 SIM Detect SIM Card Detection 66 Voltage Level 1.8 V/3.0 1.8 V/3.0 1.8 V/3.0 1.8 V/3.0 1.8 V The following design guidelines are recommended for the SIM card socket mounted on the host system: Length of the traces UIM_CLK, UIM_DATA, and UIM_RESET should not exceed 10 cm. UIM_DATA is a sensitive open-drain bi-directional signal. It should not be mounted beside the UIM_CLK signal for long distances. It is recommended to place the UIM_RST trace between UIM_DATA and UIM_CLK to provide isolation. If the traces are run a long distance, surround the UIM_DATA with ground to shield from system noise and UIM_CLK. The rise time for UIM_DATA should not exceed 1 µs per the 3GPP specification. High input capacitance may increase rise time and lead to certification failure. Keep UIM traces with low capacitance between each other and to GND An ESD component with high capacitance may increase rise time. The pull-up current cannot be increased to speed up rise time, because the pull-up current must not exceed 1 mA including any crosstalk. Pull-up current is defined by the 4.7 k pull-up resistor (to USIM_PWR) on the WWAN M.2 module, plus 200 µA from the baseband chip is approximately 0.8 mA. Place a decoupling capacitor close to the SIM card socket. Some M.2 modules incorporate GPS and GLONASS receivers with aGPS to support Global Positioning. For M.2 modules that feature GNSS support, see Table 1, the M.2 module incorporates the CG1960 Single-Chip GNSS Device, which is a complete receiver for simultaneous reception and processing of both GPS and GLONASS signals. It includes LNA, mixer, bandpass filter, VCO, ALC, fractional-N frequency synthesizer, digital tunable filters, PGA stage, and multibit ADCs. A UART interface is used by the X-GOLD™ Communications Processor on the M.2 module to control the GNSS device. The solution offers best-in-class acquisition and tracking sensitivity, TFF and accuracy. The GNSS device supports several different power management modes which gives the lowest possible energy usage per fix. The pre-calculated location data will be sent over the USB host interface. In addition, the M.2 will produce GPS data when the system is in sleep mode via an I2C interface to allow for applications to be available in low power modes. GNSS General Features Autonomous GPS / GLONASS Assisted GPS Using SUPL 1.0/2.0 • MS Assisted positioning ( SET / NET Initiated ) • MS Based positioning ( SET / NET Initiated ) SUPL 2.0 Feature Sets Version Negotiation Periodic Triggers Emergency Positioning Area Event Triggers (SET Init & NET Init) Application ID Enhanced Cell Id Multiple Location IDs Session Info Query Location Transfer to 3rd Party Notification Verification Based on Current Location Location Request to another SET A diagram of the GNSS connections on the M.2 module is shown in Figure 6. This diagram identifies the signals between the X-GOLD™ baseband and GNSS devices along with the USB and GNSS signals available to the host at the card interface. Figure 6 GNSS Connections and Interface A description of the signals between the X-GOLD™ baseband and the CG1960 interface are defined in Table 8. Table 8 X-GOLD™ Baseband to GNSS Interface Signals Signal VBAT 1.8V UART Description Battery Supply 1.8 V Supply provided from X-GOLD™ Baseband The data and control I/F between the X-GOLD™ baseband and the GNSS device is over a 4 wire UART interface which include CTS/RTS handshaking. PDB X-GOLD™ baseband uses this signal to control Power-on/reset of the GNSS device LPO_CLK X-GOLD™ baseband provides a permanently active 32 kHz clock to the GNSS device EXT_REF_CLK X-GOLD™ baseband provides a 26 MHz clock to the GNSS device for frequency aiding. EXT_DUT_CLK X-GOLD™ baseband provides this signal to notify the GNSS device of that GSM Tx activity (PA Blanking) EXT_FRM_SYNC X-GOLD™ baseband provides a strobe signal to the GNSS device to allow fine time assistance based on 3GPP cell timing. The GNSS signals available to the host at the WWAN module interface to support GNSS operation are shown in Table 9. Table 9 GNSS Module Interface Signals Signal Name Description I2C_SCL I2C_SDA I2C_IRQ SYSCLK TX_BLANKING I2C Clock I2C Data I2C IRQ - Interrupt signal Synchronization Clock TX Blanking – Active High when M.2 is transmitting. GNSS_DISABLE# GNSS Disable High: GNSS function is determine by AT command. Low: GNSS function is disabled. GNSS_DISABLE# pin has a pull-up resistor on the WWAN M.2 module Pin Direction Voltage (WWAN) Level 40 42 44 46 48 I, O I, O 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 26 1.8 V The system control interface is used to control the power-up and reset of the WWAN module. There are additional control signals to disable the radio, drive an LED as a status indicator, an output to wake the host processor, and an input for body SAR. The host processor has two signals that can be used to power on and reset the modem. Powering off the modem is accomplished through an AT command. Table 10 Power-on & Reset Signals Signal Name Description FULL_CARD_POWER_ON_OFF Modem power on: For Tablet based designs only; this signal is used for power on-off control of X-GOLD™ Baseband IC.WWAN M.2 module Logic Low: M.2 Off Logic High: WWAN M.2 Power On This pin has an internal pull-down resistor. RESET# Ultrabook designs: Ultrabook host should deliver a 1.8V signal to turn on the module. If 1.8V is not feasible, recommend using a 47k series resistor connected to 3.3V. Reset the WWAN system. This signal is used to reset the module. This signal is part of the modem rigorous power-off procedure. The host will first assert this signal, followed by assertion of: FULL_CARD_POWER_OFF# signal (for Tablet) Pin Direction Voltage (WWAN) Level 1.8 V 67 1.8 V Switch off 3.3V regulator (for Ultrabook) Asserting RESET first is to trigger PMU internal state machine to run shutdown sequences e.g. for SIM and external memory controller (EMIC), before switching off power supplies. Asynchronous, active low signal. When active, the WWAN M.2 module will be placed in a power–on reset condition. RESET# pin has a pull-up resistor on the WWAN M.2 module An additional control signal is used to disable the radio on the module. Signal W_DISABLE# is provided to allow users to disable, via a system-provided switch, the add-in card’s radio operation in order to meet public safety regulations or when otherwise desired. Implementation of this signal is required for systems and all add—in cards that implement radio frequency capabilities. The W_DISABLE1 signal is an active low signal that when driven low by the system shall disable radio operation. The assertion and de-assertion of the W_DISABLE# signal is asynchronous to any system clock. All transients resulting from mechanical switches need to be de-bounced by the host system and no further signal conditioning will be required. When the W_DISABLE# signal is asserted, all radios attached to the add-in card shall be disabled. When the W_DISABLE# is not asserted or in a high impedance state, the radio may transmit if not disabled by other means such as software. The operation of the W_DISABLE# Signal is: Enable, ON (3.3V): The radio transmitter is to be made capable of transmitting. Disable, OFF (low): The radio transmitter(s) is to be made incapable of transmitting. Standard TTL signaling levels shall be used making it compatible with 1.8 V and 3.3 V signaling. W_DISABLE# pin has a pull-up resistor on the M.2 module. Table 11 Radio Disable Signal Signal Name Detailed Description Pin Direction Voltage (WWAN) Level W_DISABLE# Disable Radio. This active low signal allows the host to disable the M.2 radio operation in order to meet public safety regulations or when otherwise desired. Logic Low: M.2 Off Logic High: function is determined by Software (AT Command). Compatible with 1.8 V/3.3 If this pin is left un-connected, functionality is controlled by software. Care should be taken not to activate this pin unless there is a critical failure and all other methods of regaining control and/or communication with the M.2 module have failed. Standard TTL signaling levels shall be used. Table 12 Host Radio Disable Interface (W_DISABLE#) Requirement Radio disable duration Detailed Description On reception of a HW or SW disable signal, the WWAN module will initiate within one second the mandatory cellular procedures (which are dependent on current state) for disconnecting from the cellular network. The time taken to complete the procedures will be dependent on external factors including but not limited to: 3G/4GPP specifications, network implementation, radio conditions, etc. Once those procedures are complete, the WWAN module will switch off the RF. Radio enable duration On reception of a hardware or software enable signal the WWAN module will initiate within one second the mandatory cellular procedures for connecting to the cellular network. Radio enable during selective suspend If radio is disabled due to W_DISABLE# assertion and WWAN module is in selective suspend, then W_DISABLE# de-assertion shall be detected by WWAN module and the module shall initiate exit from selective suspend. An LED will be used to provide status indications to users via system provided indicators. LED#1 (pin 10) is an active low output signal intended to drive system-mounted LED indicators. These signals shall be capable of sinking to ground a minimum of 9.0 mA at up to a maximum VOL of 400 mV. Table 13 LED#1 Signal Signal Name Detailed Description Pin LED#1 LED Status Indicator 10 Direction (WWAN) O (OD) Voltage Level 3.3 V Figure 7 is an example of how an LED indicator is typically connected in a platform/system using 3.3 V. The series resistor can be adjusted to obtain the desired brightness. Figure 7 Typical LED Connection The indication protocol for the LED is shown in Table 14. Table 14 LED State Indicator State Definition OFF ON The LED is emitting no The LED is emitting light in a stable non-flashing state Characteristics WWAN Not Powered registered but not transmitting or receiving An output signal is available to wake the host system, WAKE_WWAN#. This is an active low, open-drain output. This output requires a pull-up resistor on the host system. Table 15 Wake on WWAN Signal Signal Name Detailed Description Pin WAKE_WWAN# Used by M.2 module to wake the host. Active Low, Open Drain output 23 Direction (WWAN) O (OD) Voltage Level 3.0 V With the arrival of Tablets and Ultrabook™ platforms where the antenna is in the base of the unit, there is a significant issue passing Specific Absorption rate (SAR) requirements for certification. The WWAN M.2 module has the ability to configure RF TX power levels based on proximity sensor input from the host. A WWAN M.2 power control API is available to the host to dynamically reduce RF transmit power levels of the WWAN module based on proximity sensor input from the host. The DPR# (Dynamic Power Reduction) signal is available on the host interface to assist in meeting regulatory SAR (Specific Absorption Rate) requirements for RF exposure. The signal is provided by a host system proximity sensor to the WWAN module to provide an input trigger causing a reduction in the radio transmit output power. In conjunction with the DPR signal, a full power control API is available to the host to adjust the RF transmit power level of the WWAN module. DPR pin has a pull-up resistor on the WWAN M.2 module. Table 16 DPR#/ SAR Support Signal Signal Name Detailed Description Pin DPR# Dynamic Power reduction. 25 Direction (WWAN) Voltage Level 1.8 V In notebook platforms, since the WWAN antennas are usually located on the top of the lid, there is a long RF mini-coax cable that can be up to 60 cm long between the antenna and WWAN module, it is preferred to use switches/tunable components directly on the antenna for antenna band switching/tuning to improve efficiency. On select WWAN M.2 modules, four (4) GPOs are available on the host interface that can be connected to an external antenna switch, to load the antenna with different impedances, configuring the different frequency responses for the main antenna. A sample block diagram depicting the antenna control signal connections to the antenna switch is shown in Figure 8. Intel’s current antenna control solution offers an open loop control solution. The WWAN M.2 modem expects the AP to provide the antenna profile detection and through a predefined API, notify the WWAN M.2 modem with the correct antenna profile. The WWAN M.2 modem then applies the proper antenna profile data accordingly. Figure 8 Antenna Control – Connections Detail The electrical specification for the antenna control GPIOs are shown in Table 17. Table 17 Tunable Antenna Control Signals Signal Name ANTCTL0 ANTCTL1 ANTCTL2 ANTCTL3 Description Antenna Control 0 Antenna Control 1 Antenna Control 2 Antenna Control 3 Smarti™ 4G Signal GPO8 RFFE2_SDATA/ GPO9 RFFE2_SCLK/ GPO10 RFFE2_VIO/ GPO11 Pin 59 61 63 65 Direction (WWAN) Voltage Level 1.8V 1.8V 1.8V 1.8V As more and more radios are added to PC Ultrabook™ and tablet platforms, the sources RF interference increases significantly as multiple radios will have overlapping transmissions and receptions. This problem will increase further as overlapping bands continue to be rolled out; WIFI, BT, WWAN will all use overlapping band from 2300 MHz to 2600 MHz. In-Device Coexistence is a feature which improves the user experience and maximizes throughput and Quality of Service of connectivity systems (WLAN, BT and GNSS) when these radios are simultaneously running with the WWAN M.2 LTE modem. A diagram of the In-Device Coexistence architecture is shown in Figure 6. Application Processor apps coexistence interface X-GOLD™ 716 Message –based I/F) NRT Apps Coex I/F Message –based I/F) NRT Coex I/F apps coexistence interface CPU NRT Coexistence interface NRT coexistence controller NRT Coexistence interface LTE L1 IDC_CwsPriority RT Coexistence interface IDC_LteFrameSync IDC_LteDtxEnv RT Coexistence interface RT coexistence controller Connectivity Chip (WLAN/BT/GNSS) Figure 9 In-Device Coexistence Architecture Seamless Co-running In-Device-Coexistence primarily aims at avoiding interference between radio systems to allow seamless co-running where LTE and WLAN/BT/GNSS ensuring their maximum throughput and performance. To do so, a Non Real Time (NRT) coexistence controller is implemented on the ARM™ CPU. The NRT coexistence controller centralizes LTE, WLAN, BT and GNSS information and performs interference avoidance mechanisms, selecting interference-safe frequency configurations whenever possible. The NRT coexistence controller is also in charge of enabling some Real Time (RT) coexistence mechanisms when NRT mechanisms are not sufficient to guarantee seamless co-running of LTE and connectivity systems (WLAN, BT, and GNSS). Inter-system Synchronization For the cases where co-running of LTE and connectivity systems cannot be achieved, a Real Time (RT) coexistence controller is implemented in the LTE Layer-1 subsystem. The RT coexistence controller is in control of the RT coexistence interface, which is exposed to the connectivity chip. The RT coexistence controller exploits real time information received from the LTE Layer-1 subsystem and from the connectivity chip to coordinate LTE and connectivity “in the air” activities. The coordination function protects LTE traffic while optimizing the throughput and availability of WLAN/BT/GNSS. When operating in this mode, the connectivity systems have reduced capability since they access the medium when LTE is inactive, or when their respective operations do not impact each other significantly. The Non Real-Time mechanism implements a messaging based interface, formatted as AT commands that are passed to the AP host over the IPC interface (USB). A simple piece of SW residing on the AP host will tunnel the Non Real-Time messages between the BT/WLAN device and M.2 module, translate AT commands to/from the BT/WLAN driver commands, and maintain the states of the BT/ WLAN and M.2 LTE modem. The host software will also be responsible for initializing the Real-Time mechanism. The Real-Time mechanism consists of 3 GPIO signals which allow the synchronization of multiple TX and RX events. The signals to support real Time coexistence are listed in Table 18. If the coexistence signals are not used by the host system, they should not be connected. Table 18 Coexistence – Hardware Synchronization Signals Signal Name COEX3 Description COEX2 IDC _CwsPriority - 0 : Low priority / 1 : high priority CWS Indicates if the coming activity is high priority Pin IDC_LteDtxEnv - Synchronous signal 60 indicating LTE UL gap. Envelop signal with edges occurring 1ms before in-the-air gap (raising and falling edges) RT arbiter indicates to connectivity cores when there is no LTE Tx (Envelope) 62 Direction (WWAN) Voltage Level 1.8 V 1.8 V COEX1 IDC_LteFrameSync - Synchronous signal indicating LTE frame start. Indicates LTE frame start to BT/WLAN device. Can be used by BT to synch up periodic activity with LTE timing 64 1.8 V The M.2 modules require the host to provide the 3.3 V power source. The voltage source is expected to be available during the system’s stand-by/suspend state to support wake event processing on the communications card. The 3.3 V power and ground pins are listed in Table 19. Section 8, Power Delivery Requirements, provides electrical requirements for the power supply and I/O signals. Table 19 Power & Ground Signals Power Pins Description 2, 4, 70, 72, 74 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 3.3 V Supply Ground The USB port on the M.2 module will be used to support system tracing of the Protocol stack. The USB HS and USB_SSIC ports can be used for software download, tracing, and manufacturing testing The JTAG & MIPI PTI1 ports are accessible on the module to support system debug. A temporary cable assembly over flat flex should be assembled on bottom of the module and lead out of the final product. The cable would not be mounted on the final product. There are 4 configuration pins on the M.2 module to assist the host identifying the presence of an Add-In card in the socket. On the M.2 module, pins CONFIG_0..3 are configured as shown in Table 20. All configuration pins can be read and decoded by the host platform to recognize the indicated module configuration and host interface supported. On the host side, each of the CONFIG_0..3 signals needs to be fitted with a pull-up resistor. Table 20 M.2 Configuration Pins Signal Name Description Pin CONFIG_0 This signal is not connected to the WWAN M.2 module. 21 Direction (WWAN) Voltage Level CONFIG_1 Tied to Ground internally on the WWAN M.2 module. 69 0V CONFIG_2 Tied to Ground internally on the WWAN M.2 module. 75 0V CONFIG_3 Tied to Ground internally on the WWAN M.2 module. 0V There are 4 signals on the host interface that are reserved to support a digital audio interface. This is for future development, all existing WWAN M.2 modules do not support audio; therefore, these signals should be left unconnected at the host to avoid any contention. Table 21 Audio Signals (Future development) Signal Name Description Pin Direction (WWAN) Voltage Level AUDIO0 PCM Clock (I2S_CLK) 20 IO 1.8 V AUDIO1 PCM In (I2S_RX) 22 1.8 V AUDIO2 PCM Out (I2S_ TX) 24 1.8 V AUDIO3 PCM Sync (I2S_WA0) 28 IO 1.8 V The M.2 has several No Connect pins. The pins are not connected on the M.2 module. Table 22 No Connect Pins Pins Description 38, 41, 43, 47, 49, 50, 52, 53, 54, 55, 56, 58, 68 No Connect Pins 12, 13, 14, 15, 16, 17, 18, 19 Slot key The M.2 module has space for six antenna connectors; yet, as a minimum, only two will be populated to support a main Rx/Tx antenna and a secondary antenna that will be multiplexed between the Diversity receiver and GPS receiver (if applicable). Further details on the antenna connector assignment can be found in Section 11.3. The antenna signals are not available at the host interface but have their own connectors. A diagram on the M.2 module with the location of the RF connectors appears in Figure 10. Table 23 Antenna Requirements Requirement Detailed Description Connection to module Multi-band single antenna Rx Diversity antenna The connector of WWAN antenna cable is I-PEX MHF4 or equivalent GPS Antenna The GPS antenna will share the Diversity antenna connector. Single antenna has to support all bands of WWAN module specified in the Product Features. Diversity antenna has to support all bands WWAN module specified in the Product Features in addition GPS/GLONAAS frequencies. Figure 10 RF Antenna – Coaxial Connector Location Intel Mobile Communications provides a carrier development board to facilitate system test and verification of the M.2 module. In addition, a set of comprehensive tools to enable rapid integration and customization of the M.2 software is provided. The hardware and software tools for M.2 development are summarized below. The M.2 Carrier Board, shown in Figure 11, is Intel Mobile Communications hardware platform to facilitate the test and verification on the M.2 module. Once the M.2 module is mounted on the Carrier board, the user has access to all necessary interfaces on the module (host interface signals, debug and trace, and antenna) allowing full system test, debugging, and diagnostics. The carrier board with a mounted WWAN M.2 module is shown in Figure 11. Carrier Board. Note: The Main and Diversity antenna locations have been swapped on the FIH7160 PR3.2 and earlier modules. Figure 11 M.2 Carrier Board Intel Mobile Communications provides a utility program called FlashTool for downloading a binary image into the Flash memory of the M.2 module. The USB-HS port or USIF on the platform is used for connection to a PC via a USB cable for flashing. FlashTool is a Win32/64 application built on top of the dynamic link library, Download.DLL. PhoneTool is a development tool built on top of the so-called “production test dll, DWDIO.dll”. PhoneTool can be used to fine tune the parameters of: Audio configuration and settings (if enabled on M.2 module) NV (Non-Volatile) memory RF power ramp Security data IMEI SIM Real Time Clock It also includes interfaces for: AT Terminal for sending and receiving AT commands. DWDIO interface for manual access to the production test dll DWDIO.dll. Generic Test Interface (GTI) for RF calibration. System Trace Tool (STT) allows capturing trace sub-streams from different sources on the platform in one combined stream. Depending on the trace interface bandwidth, the combined data stream can be sent either over one of the standard communication interfaces (e.g. USB) or over a dedicated highspeed MIPI trace interface. Captured trace data includes standard 3GPP IPC messages, print statements inserted by developers in the code, error messages, and core dump (crash) information. The actual decoding of the trace data is done by pluggable decoder libraries, DLL’s and scripts, which are specific to the version of the mobile station software from which the trace is captured. The STT application has a GUI (Graphical User Interface) which provides an easy to use graphical interface to view, search and analyze trace data. It supports advanced message filtering runs on all Microsoft Windows® platforms. STT will become the only tool for trace analysis in the future, the legacy trace tools, Mobile Analyser and Artemis, will be continue to be supported for the 2G/3G WWAN M.2 HSPA+ module. XMMCalTool is a utility program that can be used for RF calibration. XMMCalTool supports the following features: Optimized calibration 3G TX closed loop power control Parallel calibration 2G low/high band Non-signaling verification Industry leading fast sequenced test concept Supports parallel RX and TX verification Proven Single-Ended BER for faster BER < 4 sec/per channel for 3G fast verification (BER, RSSI, TX, ILPC) Tester supported: R&S CMU200, CMW500, and Agilent 8960 M.2 modules are marketed for use on Tablet, Ultrabook, and Laptop devices. OEM vendors routinely offer multiple hardware configurations for the same base model, with different processor speed, drive type, or display type, etc. Each configuration has a different Radio Frequency emission profile with the possibility of introducing new interference sources to a modem module. The Noise Profiling Tool will measure, record down & plot graph of the RF noise level present on each RX channel. This SW tool will switch on receiver port and sweep all applicable RX channels on each band and each technology (WiFi, Bluetooth, GPS, and GLONASS). This will allow OEM vendors to quickly know the noise jamming profile to the modem module plugged in their devices.
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No XMP Toolkit : Adobe XMP Core 5.4-c005 78.147326, 2012/08/23-13:03:03 Modify Date : 2017:05:10 15:39:19-04:00 Create Date : 2017:05:10 15:39:16-04:00 Metadata Date : 2017:05:10 15:39:19-04:00 Format : application/pdf Document ID : uuid:2308b325-7c53-4c9f-b5e9-fecd5d5f2609 Instance ID : uuid:fad8b834-f282-4f39-9ad3-79eeb9aed445 Producer : doPDF Ver 8.4 Build 935 Page Count : 50EXIF Metadata provided by EXIF.tools