Ehong Technology MB05 Bluetooth Module User Manual EH MB05 Datasheet V2 0x

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EH
H-MB05
FCC ID:2ACCRMB
B05
Audio Mo
Blue
etooth®
® Techno
ology A
odule
• Bluetooth radiio
Fully embedd
ded Bluetootth® v3.0+ED
DR
Class2 modu
ule
12
28-bit encryyption securitty
Range up to 15m
Multipoint ca
apability(7 trransmit data
a devices
co
onnected att the same time)
• Sup
pport profile
es
SPP (Master and slave)
iA
AP (ipod acccessory proto
ocol)
HFP ,A2DP,A
AVRCP,HID(Salve)
• Use
er interface
Send
AT com
mmand overr UART
Firmware upg
grade over U
USB
With SPP serrvice active:: 560kbps transmission
sp
peed (UART
T)
PCM interfacce (I2S,SPDIF)
I2
2C interface
e(Master )
• Aud
dio codec
16
6bit internal stereo code
ec :95dB SN
NR for DAC
64
4MIPS Kalim
mba DSP co
oprocessor
Support Apt-X
X ,AAC, Aptt-XLL,SBC codec
• Gen
neral I/O
11 general pu
urpose I/Os
2 analogue I//O
• FCC and Bluetooth
h® qualifie
ed
• Single vo
oltage sup
pply: 3.3V typical
• Small forrm factor: 23.24 x 11
1.93 x
2.2mm
• Operating tempera
ature rang
ge: -40 °C
to
o 85 °C
• The ope
eration dis
stance >20
0cm
Version 2.0
JJuly 21 2014
Ehong Technology
Coo., Ltd
B
Bluetooth Aud
dio Module
1. Conte
nts
1.
Des
scription .............................................................................................................................................................4
2.
App
plication .............................................................................................................................................................4
3.
EH--MB05 Product numberring ...........................................................................................................................4
4.
Elec
ctrical Charracteristic ......................................................................................................................................5
4.1.
Recommen
nd operation conditions .............................................................................................................5
4.2.
Absolute Maximum
Ratting ..........................................................................................................................5
4.3.
Power conssumptions ....................................................................................................................................5
4.4. Input/outpu
ut Terminal Characteristic
cs .......................................................................................................6
4.4..1. Digital Terminals......................................................................................................................................6
4.5. USB .................................................................................................................................................................6
4.5..1. Interna
al CODEC An
nalogue to Digital
Converter................................................................................7
4.5..2. Interna
al CODEC Diigital to Analogue Converter ...............................................................................8
5.
Pinout and Terrminal Description .....................................................................................................................9
5.1.
6.
Pin assignm
ment ..............................................................................................................................................9
Phy
ysical Interfa
aces ............................................................................................................................................. 111
6.1.
Power Supp
ply............................................................................................................................................... 111
6.2.
Reset ............................................................................................................................................................. 122
6.3.
PIO ................................................................................................................................................................ 122
6.4.
AIO ................................................................................................................................................................ 122
6.5.
UART ............................................................................................................................................................ 133
6.6. I2C Masterr.................................................................................................................................................... 133
6.6..1. Apple iOS
CP referrence design
n ........................................................................................................ 144
6.7. Digital Audiio Interfaces ............................................................................................................................. 155
6.7..1. PCM ........................................................................................................................................................ 166
6.7..2. Digital Audio Interfa
ace (I2S) ................................................................................................................ 166
6.7..3. IEC 60
0958 Interfacce (SPDIF) ............................................................................................................. 199
6.8.
Microphone
e input......................................................................................................................................... 200
6.9.
Analog Outtput stage ................................................................................................................................... 200
6.10.
USB ........................................................................................................................................................... 211
7.
EH--MB05 Referrence Desig
gn ............................................................................................................................ 222
8.
Mec
chanical and
d PCB Footprint Charac
cteristics ........................................................................................ 233
9.
RF Layout Guid
delines ........................................................................................................................................ 233
9.1.
Feed Line a
and Antenna
a ............................................................................................................................. 244
Ehong Technology
Coo., Ltd
B
Bluetooth Aud
dio Module
9.2.
10.
Matching network in fre
ee space ............................................................................................................... 255
Reflow
Profille................................................................................................................................................... 26
2. Table
of Tables
TABLE 1:: RECOMMEND
DED OPERATIING CONDITIO
ONS ...................................................................................................... 5
TABLE 2:: ABSOLUTE MAXIMUM RATTING RECOMM
MENDED OPER
RATING COND
DITIONS .................................................... 5
TABLE 3:: POWER CON
NSUMPTIONS .................................................................................................................................... 6
TABLE 4:: DIGITAL TER
RMINAL ............................................................................................................................................. 6
TABLE 5:: USB TERMIN
NAL .................................................................................................................................................. 7
TABLE 6:: ANALOGUE TTO DIGITAL CONVERTER ................................................................................................................7
TABLE 7:: DIGITAL TO ANALOGUE CONVERTER ................................................................................................................8
TABLE 8:: PIN TERMIN
NAL DESCRIPT
TION ......................................................................................................................... 11
TABLE 9:: PIN STATUS ON RESET .................................................................................................................................... 12
TABLE 10
0: POSSIBLE UART
SETTIN
NGS ......................................................................................................................... 13
TABLE 11
1: ALTERNATIIVE FUNCTION
NS OF THE DIG
GITAL AUDIO BUS INTERFAC
CE ON THE PC
CM INTERFAC
CE............... 16
TABLE 12
2 : DIGITAL AUDIO
INTERFA
ACE SLAVE TIMING ................................................................................................. 18
TABLE 13
3: DIGITAL AUDIO
INTERFA
ACE MASTER TIMING .............................................................................................. 18
TABLE 14
4: USB INTER
RFACE COMPO
ONENT VALUE
ES ...................................................................................................... 21
3. Table
of Fig
gures
FIGURE 1：
1 PINOUT O
OF EH-MB05......................
............................................................................................................9
FIGURE 2：
2 POWER SUPPLY PCB DESIGN .................................................................................................................. 11
FIGURE 3:
3 CONNECTIO
ON TO HOST DEVICE
.................................................................................................................... 13
FIGURE 4:
4 EXAMPLE EEPROM
CONNECTION
WITH I2C INTER
RFACE .......................................................................... 14
FIGURE 5:
5 APPLE CO-PROCESSOR 2.0C....................................................................................................................... 14
FIGURE 6:
6 APPLE CO-PROCESSOR 2.0B ....................................................................................................................... 15
FIGURE 7:
7 AUDIO INTE
ERFACE .......................................................................................................................................... 15
FIGURE 8:
8 DIGITAL AUDIO
INTERFAC
CE MODES .............................................................................................................. 17
FIGURE 9:
9 DIGITAL AUDIO
INTERFAC
CE SLAVE TIM
MING .................................................................................................. 18
FIGURE 10:
1 DIGITAL AUDIO INTERFA
ACE MASTER TIMING ............................................................................................ 19
FIGURE 11:
1 EXAMPLE CIRCUIT FOR
R SPDIF INTERFACE (CO-A
AXIAL) .......................................................................... 19
FIGURE 12:
1 EXAMPLE CIRCUIT FOR
R SPDIF INTERFACE (OPTIC
CAL) ............................................................................ 20
FIGURE 13:
1 MICROPHONE BIASING (SINGLE CHA
ANNEL SHOWN
N) ................................................................................ 20
FIGURE 14:
1 SPEAKER OUTPUT ........................................................................................................................................ 21
FIGURE 15:
1 USB CON
NNECTIONS .................................................................................................................................... 21
FIGURE 16:
1 REFERENCE DESIGN ................................................................................................................................... 22
FIGURE 17:
1 RECOMME
ENDED PCB MOUNTING PATTERN
(UNITT: MM, DEVIATTION:0.02MM))TOP VIEW ..................... 23
FIGURE 18:
1 CLEARANCE AREA OF ANTENNA
................................................................................................................. 24
FIGURE 19:
1 ANTENNA
A REFERENCE DESIGN ................................................................................................................... 25
FIGURE 20:
2 PI MATCH NETWORK EX
XAMPLE ................................................................................................................... 25
FIGURE 21:
2 RECOMME
ENDED REFLO
OW PROFILE ............................................................................................................ 26
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
1. De
escriptio
on
The EH
H-MB05 is a
an easy to use
u Bluetoo
oth module, compliant with
w Bluetoo
oth v3.0+ED
DR. The
module
e provides ccomplete RF
F platform in a small fo
orm factor.
H-MB05 ena
ables electro
onic devicess with wirele
ess connecttivity, not requiring any
y RF
The EH
experie
ence or expe
ertise for inttegration intto the final product.
The EH-MB05
5 module, being a
certified
d solution, o
optimizes the time to market
of the
e final appliccation.
The mo
odule is designed for maximum
pe
erformance in
i a minima
al space inclluding fast speed
UART and
a 11gene
eral purpose
e I/O lines, 1 analogue I//O lines, seve
eral serial in
nterface opttions, and
up to 60
00 kbps tran
nsmission speed
with SPP
service
e active, 200 kbps with
h iAP service
e active.
The mo
odule is exte
ernal antenna, the imp
pedance of tthe feed line
e between tthe RF port and the
antenna
a shall be 50Ω.Embedd
ded Bluetoo
oth AT comm
mand firmw
ware is a frie
endly interface,
Support different Bluetooth profiiles, such as SPP, A2D
DP, AVRCP
P, HFP, HID
D, iAP and etc.
e iAP
uetooth usin
ng apple’s authenticati
on coproce
essor.
over Blu
Custom
mers using th
he Apple au
uthenticatio
on IC must register as developers,
to become an
Apple certified
MFI member. License
feess may applyy, for additio
onal informa
ation visit:
http://de
eveloper.ap
pple.com/pro
ograms/which-program
m/index.htm
ml.
Certified
d MFI developers deve
eloping elecctronic acce
essories that connect to
o an iPod®,
®
®
iPhone , and iPad
d can gain
n access to technical do
ocumentatio
on, hardwarre compone
ents,
technical support and
a certifica
ation logos.
Custom
mized firmwa
are for perip
pheral devic
ce interactio
on, power optimization,, security, and other
propriettary features may be su
upported an
nd can be ordered pre-loaded and configured
d.
2. Ap
pplicatio
on
•
•
•
•
•
•
•
Home entertainm
ment
Serviice diagnosstics
Office
e and mobiile accessories
Commercial
Multtimedia spea
aker
Autom
motive
Human interface
e devices
3. EH
H-MB05 Product
t numbe
ering
EH
H-MB
B05X
A.
B.
EH
H -------------MB05 -------------
Ehong Technology
Co
o., Ltd
Com
mpany Nam
me(Ehong))
Mod
dule Name
B
Bluetooth Aud
dio Module
4. Ele
ectrical Charactteristic
4.1. Recomm
mend ope
eration condition
ns
Operating Con
ndition
Min
Typica
al
Max
Unitt
Stora
age Temperrature
-40
--
+105
°C
Operrating Temp
perature Ra
ange
-40
--
+85
°C
PIO Voltage
+1.7
+3.3
+3.6
AIO Voltage
+1.42
+1.5
+1.5
57
VDD Voltage
+2.7
+3.3
+3.6
RF frrequency
2400
2441
2480
00
MHzz
Table 1: Recom
mmended Op
perating Conditions
4.2. Absolute
e Maximum Ratin
ng
Rating
Min
Max
Unitt
Stora
age Temperature
-40
+125
°C
Operrating Temp
perature
-40
+85
°C
PIO Voltage
-0.4
+3.6
AIO Voltage
-0.4
+1.5
57
VDD Voltage
-0.4
+3.6
USB_
_DP/USB_DN Voltage
-0.4
+3.6
Othe
er Terminal V
Voltages exxcept RF
-0.4
VDD+
+0.
Table 2: Absolute
e Maximum Rating Reco
ommended Operating C
Conditions
4.3. Power consump
ptions
Operating Con
ndition
Min
Typ
pical
Max
Unit
Stand
dby, withoutt deep sleep
2.1
3.1
mA
Stand
dby, with de
eep sleep
0.11
0.7
mA
(b)
Inquiry window time
40
mA
Conn
nected (Deep sleep
disab
ble, sniff(a) e
enable )
3.3
mA
Conn
nected (Dee
ep sleep on,
sniff(aa) enable)
0.4
mA
18
20
22
mA
Conn
nected with data transffer
Conn
nected with audio
strea
aming (A2DP)
Ehong Technology
Co
o., Ltd
35
40
mA
B
Bluetooth Aud
dio Module
Note :
depends on the firmware
e used. Typiccal values arre shown in tthe table.
Power consumption
(a)
Sniff mode
----- In Sniff mode, the
t duty cyclle of the slavve’s activity in
n the piconett may be red
duced. If a
slave is in active mode on an AC
CL logical transport, it sha
all listen in evvery ACL slo
ot to the master traffic,
hat link is be
eing treated as
a a scatter net
n link or is absent due to
t hold mode
e. With sniff mode,
the
unless th
time slotts when a sla
ave is listenin
ng are reducced, so the master
shall only
transmit to a slave in
n specified
time slotts. The sniff a
anchor pointts are spaced
d regularly with
w an interval of Tsniff.
(b)
Radio on(Inquiry )-----Search tim
me is 22 seco
onds
4.4. Input/ou
utput Terrminal Ch
haracteriistics
4.4.1. Digital Te
erminals
Supplly Voltage
e Levels
Min
Typ
Max
Unit
-0.3
+0.25xVDD
0.6
625VDD
VDD+0.3
0.125
0.7
75xVDD
VDD
Ii input leakage cu
urrent at Vin=VDD
or 0V
-100
100
nA
Ioz tri-sttate output leakage current at Vo=VDD
or 0V
-100
100
nA
With sttrong pull-up
-100
-40
-10
uA
With sttrong pull-do
own
10
40
100
μA
With weak
pull-up
-5
-1.0
-0.2
μA
With weak
pull-do
own
-0.2
+1.0
5.0
μA
CI Inpu
ut Capacitan
nce
1.0
5.0
pF
Rpuw we
eak pull-up strength att VDD-0.2V
500k
2M
Ω
Rpdw we
eak pull-dow
wn strength
h at 0.2V
500k
2M
Ω
Rpus strrong pull-up
p strength at
a VDD-0.2V
10k
50k
Ω
Rpds strrong pull-do
own strength at 0.2V
10k
50k
Ω
Input Voltage
Lev
vels
VIL inpu
ut logic leve
el low
Table 3: Po
ower consum
mptions
VIH input logic leve
el high
Output Voltage L
Levels
VOL outtput logic le
evel low, lOL = 4.0mA
VOH output logic le
evel high, lOH
O = -4.0mA
Input and
Tri-state Current
Resisttive Strength
Table 4: Digital T
Terminal
4.5. USB
USB Terminals
Input Threshold
Ehong Technology
Co
o., Ltd
Min
Typical
Max
Unitt
B
Bluetooth Aud
dio Module
VIL inp
put logic leve
el low
VIH inp
put logic level high
0.7VDD
Input Leakage C
Current
GND < VIN < VDD(a)
-1
CI Inpu
ut capacitan
nce
2.5
Outpu
ut Voltage L
Levels to Correctly
Te
erminated USB Cable
VOL output logic le
evel low
0.0
VOH ou
utput logic le
evel high
2.8
0.3VDD
10.0
μA
pF
0.2
VDD
Tab
ble 5: USB Terminal
(a) Inte
ernal USB pull-up dissable
4.5.1. Internal CODEC
An
nalogue to
o Digital Converter
Conditio
ons
Parrameter
Min
Typ
Max
Unit
Resolu
ution
16
Bits
Input Sample
Ratte, Fsample
44.1
kHz
-24
-3
82
81
80
79
79
78
21.5
42
Input full
f scale at maximum gain
(differe
ential)
Input full
f scale at minimum gain
(differential)
800
3dB Bandwidth
20
dB
dB
mV
rms
mV
rms
kHz
Microp
phone mode
e input impe
edance
kΩ
Signal to Noise
Ratio, SNR
Digital Gain
Analog
gue Gain
Fsamplee
8kHz
fin=1kHz
Hz
Hz->20kHz 11.025kH
B/W=20H
A-Weightted
16kHzz
THD+N<
<1%
22.050kH
Hz
150mV Vpk-pk
32kHzz
44.1kHz
Digital Ga
ain Resoluttion = 1/32 dB
Analogue
e Gain Reso
olution = 3d
dB
THD+N (micropho
one input) @ 30mv rms input
Table 6: Analogue to D
Digital Conve
erter
Ehong Technology
Co
o., Ltd
0.04
dB
B
Bluetooth Aud
dio Module
4.5.2. Internal C
CODEC Dig
gital to An
nalogue Converter
Conditiions
Parrameter
Min
Typ
Max
Unit
Resolu
ution
16
Bits
Output Sample Ra
ate, Fsample
48
kHz
-24
95
95
95
95
95
95
95
21.5
-21
750
16
OC
500
0.01
dB
dB
mV
rms
Ω
pF
THD+N
N 16Ω load
0.1
SNR (L
Load=16Ω, 0dBFS inpu
ut relative to
o digital
silence
e)
95
dB
Signal to Noise
Ratio, SNR
Digital Gain
Analog
gue Gain
Fsample
8kHzz
fin=1kHzz
B/W=20Hz->20kHzz 11.025kkHz
16kHzz
A-Weigh
hted
THD+N<
<0.01%
22.050kkHz
0dBFS signal
32kHzz
Load = 100kΩ
44.1kH
Hz
48kHzz
Digital Gain
Resolu
ution = 1/32 dB
Analogu
ue Gain Res
solution = 3dB
Output voltage fulll swing (diffferential)
Allowed
d Load
Resistive
Capacitivve
THD+N
N 100kΩ loa
ad
Table 7: Dig
gital to Analogue Conve
erter
Ehong Technology
Co
o., Ltd
dB
B
Bluetooth Aud
dio Module
5. Pin
nout and
d Termin
nal Desc
cription
5.1. Pin assignment
Figure 1： Pinout o
of EH-MB05
Pin
Symboll
I/O Typ
pe
GND
RESETB
SPI_CLK
SPI_MISO
SPI_MOS
SI
SPI_CSB
LED0
PIO3
PCM_OUT
10
MIC_RP
Analog
gue
Micropho
one input po
ositive, right
11
MIC_RN
Analog
gue
Micropho
one input ne
egative, righ
ht
Ground
CMOS
S input with weak
interna
al pull-up
w weak in
nternal pullInput with
down
S output, tri--state, with
CMOS
weak internal pull-down
S input, with weak
CMOS
interna
al pull-down
Input with
w weak in
nternal pullup
Open drain
output
Bi-directional with
programmable strrength
interna
al pull-up/do
own
CMOS
S output, tri--state, with
weak internal pull-down
Ehong Technology
Co
o., Ltd
Desc
cription
Ground
Active LO
OW RESET
TB, input de
ebounced
so must be low for >5ms
to cau
use a
RESETB
Serial Pe
eripheral intterface cloc
ck for
programming only
Serial Pe
eripheral Intterface outp
put for
programming only
Serial Pe
eripheral Intterface inpu
ut for
programming only
Chip sele
ect for Syncchronous Se
erial
Interface
e for program
mming onlyy, active
low
LED Drivver
Program
mmable inpu
ut/output line
Synchron
nous Data O
Output
B
Bluetooth Aud
dio Module
12
PIO0
13
PIO1
14
PCM_IN
15
GND
16
PCM_SYN
NC
17
RF_GND
18
RF_IN
19
RF_GND
20
PCM_CLK
21
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Bi-directional with
programmable strrength
interna
al pull-up/do
own
S Input, with
h weak
CMOS
interna
al pull-down
Program
mmable inpu
ut/output line
Program
mmable inpu
ut/output line
Synchron
nous Data IInput
Ground
Ground
Bi-directional with
h weak
interna
al pull-down
Synchron
nous Data S
Sync
RF Gro
ound
RF groun
nd
RF
RF Transsceiver inpu
ut/output line
RF Gro
ound
RF groun
nd
h weak
Bi-directional with
interna
al pull-down
Synchron
nous Data C
Clock
AIO0
Bi-directional
Analogue
e programm
mable input//output line
22
GND
Ground
Ground
23
MIC_LP
Analog
gue
Micropho
one input po
ositive, left
24
MIC_LN
Analog
gue
Micropho
one input ne
egative, righ
ht
25
SPK_LN
Analog
gue
Speaker output neg
gative, left
26
SPK_LP
Analog
gue
Speaker output positive, left
27
SPK_RN
Analog
gue
Speaker output neg
gative, right
28
SPK_RP
Analog
gue
Speaker output positive, right
29
PIO13
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Program
mmable inpu
ut/output line
30
VDD
3V3 po
ower input
3V3 pow
wer input
31
USB_DP
Bi-directional
USB data
a plus with selectable internal
1.5K pulll up resistorr
32
USB_DN
Bi-directional
USB data
a minus
33
GND
Ground
Ground
34
PIO9
35
PIO14
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Ehong Technology
Co
o., Ltd
Program
mmable inpu
ut/output line
Program
mmable inpu
ut/output line
B
Bluetooth Aud
dio Module
36
PIO4
Bi-directional with
programmable strrength
interna
al pull-up/do
own
37
GND
Ground
38
UART_TX
39
UART_RX
40
PIO8
41
PIO7
42
PIO6
OS output,
Bi-directional CMO
tri-state
e, with wea
ak internal
pull-up
CMOS
S input with weak
interna
al pull-down
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Bi-directional with
programmable strrength
interna
al pull-up/do
own
Program
mmable inpu
ut/output line
Ground
UART da
ata output
UART da
ata input
Program
mmable inpu
ut/output line
Program
mmable inpu
ut/output line
Program
mmable inpu
ut/output line
Table 8: PIN
P Termina
al Descriptio
on
6. Ph
hysical In
nterface
es
6.1. Power Supply
The
e module DC
C3.3V powe
er input.
Pow
wer supply p
pin connecttion capacito
or to chip and pin as fa
ar as possib
ble close
Cap
pacitor deco
ouples powe
er to the chip
Cap
pacitor prevvents noise coupling ba
ack to powe
er plane.
Figure 2： Power Supp
ply PCB Des
sign
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
6.2. Reset
The mo
odule may be
b reset fro
om several sources: R
RESETB pin
n, power-on
n reset, a UART
breakk
charactter or via so
oftware conffigured watcchdog timerr.
The RE
ESETB pin is an active low RESET
TB and is in
nternally filte
ered using tthe internal low
frequen
ncy clock osscillator. A RESETB
will be perform
med betwee
en 1.5 and 4
4.0ms follow
wing
RESET
TB being acttive. It is rec
commended
d that RESE
ETB be app
plied for a p
period greater than
5ms.
At RESETB the dig
gital I/O pins are set to
o inputs for b
bi-directiona
al pins and outputs are
e tri-state.
The pulll-down statte is shown below.
Pin Name
/ Grroup
Pin
n Status on
n RESETB
USB_DP
USB_DN
UART_RX
UART_TX
SPI_MOSI
SPI_CLK
SPI_CSB
SPI_MISO
RESETB
PIOs
PCM_IN
PCM_CLK
PCM_SYNC
PCM_OUT
N/a
N/a
PD
PU
PD
PD
PU
PD
PU
PD
PD
PD
PD
PD
Table 9:
9 Pin Status on Reset
6.3. PIO
EH-MB05 has a to
otal of 11 dig
gital program
mmable I/O
O terminals. They are powered
from
m VDD
(3.3V). Their functiions depend
d on firmwa
are running on the deviice. PIO line
es can be configured
through
h software to
o have eithe
er weak or strong
pull-ups or pull--downs.
Note:
All PIO lines are co
onfigured ass inputs with weak pulll-downs at reset.
Any of the
t PIO line
es can be co
onfigured as interrupt rrequest line
es or as wakke-up lines from sleep
modes.
6.4. AIO
EH-MB05 has 2 an
nalogue I/O
O terminals. Their functiions depend
d on softwa
are. Typicallly ADC
function
ns can be co
onfigured to
o battery vo
oltage meassurement. They
can alsso be used as a digital
PIO.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
6.5. UART
This is a standard
d UART interface forr communiccating with
h other seriial devices
s. The
UART interface provides
a simple me
echanism fo
or commun
nicating wiith other se
erial
devices
s using the
e RS232 protocol.
The UA
ART CTS a
and RTS signals
can
n be used to
t impleme
ent RS232 hardware flow
control where botth are activve low indicators.
Parameter
Baud Rate
Possible Values
Minimum
Maximu
um
Flow Conttrol
Parity
Number of Sto
op Bits
Bits per Byyte
1200 baud
d (≤2%Errorr)
9600 baud
d (≤1%Errorr)
3M baud (≤1%Error)
RTS/CTS
S or None
None, Od
dd or Even
1o
or 2
Table 10: Possible UART Setting
gs
T Host dev
To
vice
Figure 3: Connection
6.6. I2C Mastter
PIO6, PIO7
and PIO8 can be used to forrm a maste
er I2C interfa
ace. The intterface is fo
ormed using
softwarre to drive th
hese lines. It is suited only to rela
atively slow functions ssuch as drivving a LCD,
keyboard scanner or EEPRO
OM. In the case, PIO
O lines need
d to be pulled up thro
ough 2.2KΩ
Ω
resistorrs.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure 4: Example
EE
EPROM Connection with
h I2C Interfa
ace
6.6.1. Apple iOS
S CP referrence desiign
The figu
ures below give an indicative overrview of wha
at the hardw
ware conce
ept looks like
e. A
specificc MFI co-pro
ocessor layo
out is availa
able for licensed MFI developers
ffrom the MF
FI program.
Figure 5: Apple Co-processor 2.0
0C
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure 6: Apple Co-processor 2.0
0B
6.7. Digital A
Audio Intterfaces
The au
udio interface circuit co
onsists of:
■ Stereo audio codec
■ Dual audio
o inputs and
d outputs
■ A configurrable PCM, I²S or SPD
DIF interface
Figure
e 2 outlines th
he functiona
al blocks of the interface. The code
ec supports stereo playyback and
record
ding of audio
o signals at multiple sa
ample rates with a reso
olution of 16
6-bit. The AD
DC and
the DA
AC of the co
odec each contain
2 independent channels. Any
A ADC orr DAC channel can be
run at its own independent sample
rate.
Figure 7: Audio Interface
The in
nterface for the digital audio
bus sh
hares the sa
ame pins ass the PCM ccodec interfface
descriibed in Tablle 11, which
h means each of the au
udio buses are mutually exclusive
e in their
usage
e. Table 11 lists
these alternative
functions.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
PCM
M Interface
SPDIF Interface
I²S Interfa
ace
PCM
M_OUT
SPDIF_
_OUT
SD_OUT
PCM
M_IN
SPDIF_
_IN
SD_IN
PCM
M_SYNC
WS
PCM
M_CLK
SCK
Ta
able 11: Alte
ernative Fun
nctions of th
he Digital Audio Bus Interface on the
t PCM Inte
erface
The aud
dio input cirrcuitry conssists of a du
ual audio inp
put that can
n be configu
ured to be either
single-e
ended or fully differential and prog
grammed fo
or either miccrophone o
or line input.. It has an
analogu
ue and digittal program
mmable gain
n stage for optimization
n of differen
nt microphones.
The aud
dio output circuitry
con
nsists of a dual
differen
ntial class A-B
A output sstage.
6.7.1. PCM
The aud
dio pulse co
ode modula
ation (PCM)) interface supports
co
ontinuous tra
ansmission and
receptio
on of PCM e
encoded au
udio data ovver Bluetoo
oth.
Hardwa
are on EH-M
MB05 allows the data to
t be sent to
o and received from a SCO connection. Up
to three
e SCO conn
nections can
n be supported by the PCM interfface at any one time.
EH-MB05 can ope
erate as the PCM interfface master generating
g PCM_SYNC and PC
CM_CLK or
as a PC
CM interface
e slave acccepting exte
ernally gene
erated PCM
M_SYNC and PCM_CLK.
EH-MB05 is compatible with a variety of clock forma
ats, includin
ng Long Fra
ame Sync, Short
Frame Sync and GCI
G timing environmen
nts.
It suppo
orts 13-bit or
o 16-bit line
ear, 8-bit u--law or A-law
w compand
ded sample formats an
nd can
receive and transm
mit on any selection
of three of the
e first four slots
following PCM_SYNC.
EH-MB05 interface
es directly to
t PCM aud
dio devices including th
he following
g:
■ Qualccomm MSM
M 3000 serie
es and MSM
M 5000 seriies CDMA baseband
devices
■ OKI MSM7705
fo
our channe
el A-law and
d μ-law COD
DEC
■ Motorrola MC145
5481 8-bit A-law
and μ-law CODE
EC
■ Motorrola MC145
5483 13-bit linear COD
DEC
■ STW 5093 and 5
5094 14-bit linear COD
DECs(8)
■ EH-M
MB05 is also
o compatible with the Motorola
SS
SI interface
6.7.2. Digital Au
udio Interfface (I2S)
The dig
gital audio in
nterface sup
pports the industry sta
andard form
mats for I2S, left-justified or rightjustified
d. The interfface shares
s the same pins of the PCM interfa
ace as Tab
ble 11.
The I2S
S interface can
c be enabled by usin
ng AT+ com
mmands. Th
he module iis an I2S slave device
with the
e default firm
mware. Con
ntact with EHong
for sp
pecial firmw
ware when u
use the module as an
I2S masster. The I2
2S support following
fo
ormats:
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure
8: Dig
gital Audio Interface Mo
odes
Sym
mbol
tch
tcl
topd
tssu
tsh
tisu
tih
Paramete
er
SCK
Frequency
W Freque
WS
ency
SCK
high time
SCK
low tim
me
SCK
to SD_
_OUT dela
ay
W to SCK
WS
K set up tim
me
W to SCK
WS
K hold time
SD_IN
to SCK set-up time
SD_IN
to SCK hold tim
me
Ehong Technology
Co
o., Ltd
Min
80
80
20
20
20
20
Typical
Max
6.2
96
20
Unit
MHz
kHz
ns
ns
ns
ns
ns
ns
ns
B
Bluetooth Aud
dio Module
Ta
able 12 : Digittal Audio Inte
erface Slave Timing
Figu
ure 9: Digita
al Audio Inte
erface Slave
e Timing
Sym
mbol
topd
tspd
tisu
tih
Paramete
er
SCK
Frequency
W Freque
WS
ency
SCK
to SD_
_OUT dela
ay
SCK
to WS
S delay
SD_IN
to SCK set-up time
SD_IN
to SCK hold tim
me
Min
20
10
Typical
Table 13: Digital Audio Inte
erface Maste
er Timing
Ehong Technology
Co
o., Ltd
Max
6.2
96
20
20
Unit
MHz
kHz
ns
ns
ns
ns
B
Bluetooth Aud
dio Module
Figurre 10: Digita
al Audio Inte
erface Maste
er Timing
6.7.3. IEC 60958
8 Interface
e (SPDIF)
Through AT+ com
mmand to switch if SPD
DIF is used.The IEC 60
0958 interfa
ace is a digiital audio
interfa
ace that use
es bi-phase coding to minimise
the
e DC conten
nt of the transmitted sig
gnal and
allowss the receive
er to decode
e the clock in
nformation from
the tran
nsmitted sig
gnal. The IEC 60958
speciffication is ba
ased on the
e 2 industry standards:
■ AES/EBU
■ Sony and Philips inte
erface specification SPD
DIF
The in
nterface is ccompatible with
w IEC 60958-1, IEC 60958-3 an
nd IEC 6095
58-4.
The SPDIF interfa
ace signalss are SPDIF
F_IN and SP
PDIF_OUT and
a are sha
ared on the PCM
interfa
ace pins. Th
he input and
d output stages of the SPDIF
pins can interfacce to:
■ A 75Ω coa
axial cable with
w an RCA
A connector, see Figurre 11.
■ An opticall link that usses Toslink optical com
mponents, se
ee Figure 12.
Figure 11: Example Circuit
for SPDIF
Interfa
ace (Co-Axia
al)
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure 12
2: Example Circuit for S
SPDIF Interfface (Optica
al)
6.8. Microph
hone inpu
ut
Figure 13
3: Micropho
one Biasing (Single Cha
annel Shown
n)
The aud
dio input is intended fo
or use in the
e range from
m 1μA @ 94
4dB SPL to about 10μA
A @ 94dB
SPL. With
W biasing resistors R1 and R2 eq
qual to 1kΩ
Ω, this requirres microph
hones with sensitivity
between about –40
0dBV and –60dBV.
–
The micropho
one for each
h channel sh
hould be bia
ased as
shown in Figure 14
4.
6.9.
Analog Output stage
The outtput stage d
digital circuittry converts
s the signal from 16-bitt per sample
e, linear PC
CM of
variable
e sampling frequency
to a 2Mbits/ss 5-bit multii-bit bit strea
am, which iss fed into th
he analogue
output circuitry.
The outtput stage ccircuit is com
mprised a DAC
with gain setting an
nd class AB
B amplifier. The output
is availa
able as a differential sig
gnal betwee
en SPKR_L
LN and SPK
KR_LP for th
he right cha
annel, as
Figure 14
1 shows, a
and between SPKL_RN
N and SPKL
L_RP for the
e left chann
nel.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figurre 15: Speak
ker output
6.10. USB
This is a full speed
d (12M bits
s/s) USB interface for communica
ating with other
compa
atible digital
devicess. The mod
dule acts as
a a USB peripheral,
responding
g to requesst from a master
hostt
controller, such as a PC.
The US
SB interface
e is capable of driving a USB cable
e directly. No
N external USB transcceiver is
required
d. The devicce operatess as a USB peripheral, responding
g to requestts from a master host
controller such as a PC. Both the OHCI and
a the UHCI standard
ds are supported. The set of USB
endpoin
nts impleme
ented can behave
as specified in the
t USB se
ection of the
e Bluetooth
specificcation v2.1+
+EDR or alte
ernatively can
c appear as
a a set of endpoints
appropriate to USB
audio devices such
h as speake
ers.
The mo
odule has an internal USB
pull-up
p resistor. This
pulls the USB_DP pin weakly
y high when
module
e is ready to
o enumerate
e. It signals to the USB
B master tha
at it is a full speed (12M
Mbit/s) USB
device.
Figure 16: USB Co
onnections
Identifiier
Value
Function
Rs
27Ω Nominal
Impedance matching to USB
cable
Table 14: USB
B Interface C
Component Values
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Note:
USB_ON
N is only use
ed when the firmware
nee
ed an input to
o detect if US
SB is conneccted and the USB
function shall be ena
abled. In such case it is shared
with th
he module PIO
P terminalss. If detection
n is not
w USB, suc
ch as USB DFU
or USB CDC), USB_
_ON is not ne
eeded.
needed (firmware alrready runs with
7. EH
H-MB05 Referen
ce Design
Figure 17: Referen
nce Design
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
8. Me
echanica
al and PCB
Footprint Characteristics
Fig
gure 18: Rec
commended
d PCB Moun
nting Pattern
n (Unit: mm, Deviation:0.02mm)TO
OP View
9. RF
F Layoutt Guidelines
EH-MB05 has an o
on-board PC
CB antenna
a. PCB desiign to ensurre enough cclearance area of
antenna
a, area leng
gth is 1.6 tim
mes of antenna length, area width is 4 times of
o antenna width, the
bigger the
t better if the space allows.
The
e specific sizze as shown figure below.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure 19: Clearance area
of antenna
9.1.
Feed Line and Antenna
The imp
pedance of the feed lin
ne between the RF porrt and the an
ntenna shalll be 50Ω.
A good
ground
d directly un
nder the fee
ed line is alw
ways neede
ed for imped
dance contrrol.
Route the feed
d line as curve lines wh
hen needed
d, avoid 90 or
o even lesss degree an
ngles style.
The
e width of th
he feed line
e, the distan
nce of the fe
eed line to th
he ground p
plane are ke
eys to the
imp
pedance. Assk your PCB
B supplier to
t control th
he impedancce of the fee
ed line.
For the antenna,
 Wh
hen PCB an
ntenna is ussed, matchin
ng networkss shall be used to optim
mize the antenna’s
signal strength
h.
 Use
e as many vias
as possible to con
nnect the grround plane
es nearby th
he antenna.



Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
Figure 20: Antenna refference des
sign
9.2.
Matchin
ng netwo
ork in free space
The spe
ecs of a Fra
actus standard antenna
a are measured in theiir evaluation
n board (in free space)),
which iss an ideal case. In a re
eal design, components
s nearby the
e antenna, semiconductors,
LCD’s, batteries, covers,
conn
nectors, etcc affect the a
antenna performance. This is the reason
why it iss highly recommended
d to place 04
402 pads fo
or a PI matcching netwo
ork as close as
possible
e to the antenna feedin
ng point. Do
o it in the grround plane
e area, not in the cleara
ance area.
This is a degree off freedom to
o tune the antenna
oncce the desig
gn is finished and taking into
account all elemen
nts of the syystem (batte
eries, displa
ays, covers, etc).
Figure 21: PI match ne
etwork exam
mple
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
10.
Reflow Profile
The soldering proffile dependss on variouss parameterrs necessita
ating a set u
up for each application
n.
or guidance on solder reflow.
The datta here is giiven only fo
℃
250
217
210
25
min
Figure
22: Recommende
ed Reflow Profile
Pre-hea
at zone (A
A) — This zone raises the temperrature at a controlled rrate, typica
ally 0.5 – 2
C/s. The
T purpose
e of this zone is to pre
eheat the PC
CB board and
a compon
nents to 120
0 ~ 150 C.
This sta
age is requiired to distrribute the he
eat uniform
mly to the PC
CB board a
and complettely remove
solvent to reduce tthe heat sho
ock to comp
ponents.
brium Zone
e 1 (B) — In this sta
age the fluxx becomes soft and u
uniformly en
ncapsulates
Equilib
solder particles
and spread ovver PCB bo
oard, preven
nting them from being re-oxidized
d. Also with
elevatio
on of tempe
erature and liquefaction
n of flux, each activatorr and rosin get activate
ed and startt
eliminatting oxide film formed
d on the surface
of each solde
er particle and PCB board. The
temperrature is recommende
ed to be 15
50 to 210 for 60 to 12
20 second for this zo
one.
Equilib
brium Zone
e 2 (c) (op
ptional) — In order to
o resolve th
he upright ccomponent issue, it iss
recomm
mended to keep
the tem
mperature in
n 210 – 217
7  for about 20 to 30 ssecond.
Reflow
w Zone (D) — The prrofile in the
e figure is designed fo
or Sn/Ag3.0/Cu0.5. It
I can be a
referencce for other lead-free solder. The
e peak tem
mperature sh
hould be hiigh enough to achieve
good wetting
but not so hig
gh as to ca
ause comp
ponent disccoloration o
or damage. Excessive
solderin
ng time ca
an lead to
o intermetallic growth which ca
an result in
n a brittle joint. The
recomm
mended pea
ak temperatture (Tp) is 230 ~ 250
0 C. The soldering
tim
me should be
b 30 to 90
second when the temperature
e is above 217
2 C.
Cooling
g Zone (E)) — The coo
oling ate sh
hould be fasst, to keep the solder grains small which will
give a lo
ongerlasting
g joint. Typ
pical cooling rate should be 4 C
C.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
11. Coontact Infoormation
k.com.cn
Sales: sales@ehlin
Technic
cal support: support@eh
hlink.com.cn
Phone: +86 21 64769993
Fax: +86 21 647658
833
Street address:
Rom
m1505, Blk 1st ,No.833 South Hong
g mei Rd ,M
Ming hang dis
strict shangh
hai
Note: FCC RF exp
posure requirements
1. Radia
ated transm
mit power must be equa
al to or lowe
er than that specified in
n the FCC Grant
of
Equip
pment Authorization for FCC ID:2A
ACCRMB05
5.
2. To co
omply with FCC regula
ations limitin
ng both maxximum RF output
powe
er and huma
an
expossure to RF radiation, maximum
an
ntenna gain
n (including cable loss) must not exceed: .
Bluettooth <4.0 d
dBi
3. This module mu
ust not transsmit simulta
aneously witth any otherr antenna o
or transmitte
er.
4. This device com
mplies with part
p 15 of th
he FCC Rule
es. Operatio
on is subjecct to the folllowing two
cond
ditions:
(1) Th
his device may
m not cau
use harmful interferencce, and (2) this
device must accep
pt any
interference received,inc
cluding inte
erference tha
at may causse undesire
ed operation
n.
5.The host
end pro
oduct must include a usser manual that clearlyy defines op
perating req
quirements
and conditions
th
hat must be
e observed to ensure ccompliance with current FCC RF exposure
guide
elines.
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
For porrtable device
es, in addition to the co
onditions 1 through 5 described
above, a sep
parate
approva
al is require
ed to satisfy the SAR re
equirementss of FCC Pa
art 2.1093
If the de
evice is use
ed for other equipment that separa
ate approva
al is required
d for all othe
er
operatin
ng configura
ations, inclu
uding portab
ble configurrations with respect to 2.1093 and
d different
antenna
a configurattions.
EM integrato
ors must be
e provided w
with labeling
g instruction
ns of finishe
ed
For thiss device, OE
productts.Please re
efer to KDB7
784748 D01 v07, sectiion 8. Page
e 6/7 last two
o paragraph
hs:
A certifiied modularr has the op
ption to use a permane
ently affixed label, or an
n electronicc label. For
a perma
anently affixxed label, th
he module must
be lab
belled with an
a FCC ID - Section 2.926 (see
2.2 Cerrtification (la
abelling requirements) above). The
e OEM man
nual must p
provide clea
ar
instructions explain
ning to the OEM
the labelling requ
uirements,o
options and OEM user manual
instructions that arre required (see next paragraph).
ost using a certified mo
odular with a standard fixed label,, if (1) the m
module’s FC
CC ID is not
For a ho
visible when
installed in the ho
ost, or (2) iff the host iss marketed so
s that end users do not have
straightt forward co
ommonly ussed methodss for accesss to remove
e the module
e so that the FCC ID
of the module
is vissible; then an
a additiona
al permanent label refe
erring to the
e enclosed
module
e:“Contains Transmitterr Module FC
CC ID: 2AC
CCRMB05” or
o “Containss FCC ID:
2ACCR
RMB05” musst be used. The host OEM
user manual
mustt also conta
ain clear instructions
on how end users can find and/or accesss the module and the FCC
ID.
The fina
al host / mo
odule combination mayy also need to be evalu
uated againsst the FCC Part 15B
criteria for unintenttional radiattors in order to be prop
perly authorrized for ope
eration as a Part 15
digital device.
ers manual or instructio
on manual for
f an intentional or un
nintentional radiator sha
all caution
The use
the use
er that chang
ges or modifications no
ot expresslyy approved by the partyy responsib
ble for
complia
ance could void
the use
er's authoritty to operate the equipment. In ca
ases where the manuall
is provid
ded only in a form othe
er than pape
er, such as on a computer disk orr over the In
nternet, the
informa
ation require
ed by this se
ection may be included
d in the man
nual in that alternative form,
provide
ed the user can
c reasona
ably be exp
pected to ha
ave the capability to acccess inform
mation in
that form
m.
This de
evice compliies with parrt 15 of the FCC
Rules.. Operation is subject tto the follow
wing two
conditio
ons: (1) Thiss device ma
ay not cause
e harmful in
nterference,, and (2) thiis device must accept
any inte
erference re
eceived, inccluding interrference tha
at may causse undesired
d operation.
This equipment ha
as been testted and found to comply with the limits
for a C
Class B digital device,
pursuan
nt to part 15
5 of the FCC
C Rules. Th
hese limits are
a designe
ed to provide
e reasonable
protection against harmful inte
erference in
n a residenttial installation. This eq
quipment ge
enerates,
uses an
nd can radia
ate radio fre
equency ene
ergy and, iff not installe
ed and used
d in accorda
ance with
the instructions, may cause ha
armful interrference to radio
comm
munications.. However, there is no
guaranttee that inte
erference will not occurr in a particu
ular installa
ation. If this equipment does
cause harmful
inte
erference to radio or television rece
eption, whicch can be d
determined by turning
Ehong Technology
Co
o., Ltd
B
Bluetooth Aud
dio Module
the equ
uipment off and
a on, the user is enccouraged to
o try to corre
ect the interrference by one or
more off the following measure
es:
—Reorient or reloccate the recceiving ante
enna.
—Increase the sep
paration bettween the equipment
and receiverr.
—Conn
nect the equ
uipment into
o an outlet on
o a circuit different
fro
om that to w
which the rec
ceiver is
connected.
—Conssult the dealler or an experienced radio/TV
tecchnician forr help.
Ehong Technology
Co
o., Ltd

---

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