FEIBIT ELECTRONIC TECHNOLOGY FZB57A5PF FZB57A5+Module User Manual FZB57A5 specification

SHENZHEN FEIBIT ELECTRONIC TECHNOLOGY Co., LTD FZB57A5+Module FZB57A5 specification

user manual

FZB57A3+ IEEE 802.15.4 ZigBee Module page 1 of 12 FCC ID:2AE8BFZB57A5PF FZB57A5+ 2.4 GHz IEEE 802.15.4 ZigBeeModule characteristicsFeatures：  ReservingSystem  IEEE Std. 802.15.4  Is the Chip Solution TI CC2530F256RHAR  Band 2.4G  Size 18mm*27.1mm*2.3mm Model Overview： 1.Briefdescription: ZigBee module FZB57A5+ is based on TI CC2530F256RHAR, complied with IEEE, complied, and it is also known as " The ZigBee module FZB57A5+ is a TI based CC2530F256RHAR development that supports the 2.4GHz IEEE 802.15.4 label Quasi - maximum support for 250kbps rate wireless network connections. Model Installation method Support standard rate（MAX） Band Antenna interface Remarks FZB57A5+ SMT IEEE 802.15.4 250kbps 2.4 GHz IPEX 3.3V power supply
FZB57A3+ IEEE 802.15.4 ZigBee Module page 2 of 12 2.PackageoutlineandMounting:（View direction: confront） NOTE1:General tolerance ±0.2mm unless otherwise stated 3.PinDefinition: Pin# Name Description 1 GND Ground connection 2 VCC 3.3V Main Voltage Source Input 3 P2_2 Digital I/O Port 2.2/JTAG DC 4 P2_1 Digital I/O Port 2.1/JTAG DD 5 P2_0 Digital I/O Port 2.0 6 P1_7 Digital I/O Port 1.7 7 P1_6 Digital I/O Port 1.6 8 P1_5 Digital I/O Port 1.5 9 P1_3 Digital I/O Port 1.3 10 P1_2 Digital I/O Port 1.2 11 P1_4 Digital I/O Port 1.4 12 P0_6 Digital I/O Port 0.6 13 P0_5 Digital I/O Port 0.5/UART RTS 14 P0_4 Digital I/O Port 0.4/UART CTS 15 P0_3 Digital I/O Port 0.3/UART TXD 16 P0_2 Digital I/O Port 0.2/UART RXD 17 P0_1 Digital I/O Port 0.1 18 P0_0 Digital I/O Port 0.0
FZB57A3+ IEEE 802.15.4 ZigBee Module page 3 of 12 19 RST Reset 20 GND Ground connection 1. ProductPicture: TOP VIEW BOTTOM VIEW Silk screen Description: 1. the character in the red box is PCB figure number. 2. the character in the yellow box is the PCB supplier control character. 3. the character in the blue box is the PCB batch number. 4. the character in the green frame is PCB flame retardant grade.
FZB57A3+ IEEE 802.15.4 ZigBee Module page 4 of 12 2. key materials: Serial number Key name Model Specification / material Producer Remarks 1 Integrated circuit CC2530F256RHAR VQFN TI 2 Integrated circuit CC2592RGVR PVQFN TI 3 PCB JUB7.820.0245-2 FR-4,4LAY The founding of the UK Sunlord 4 crystal oscillator E3SB32E00000BE 32M Hosonic 5 crystal oscillator ETST00327000JE 32.768KHz Hosonic 3. GeneralRequirements: No. Feature Description 6-1 Operation Voltage 3.3±0.3V 6-2 TX Current Consumption <150mA 6-3 Operation Temperature -20°C ~ +60°C 6-4 Antenna Type no antenna 6-5 CPU Type 8051 6-6 Storage Temperature -40°C ~ +85°C 4. SMTSolder plate recommendation：
page 5 of 12 ZB-T530-RSF1 IEEE 802.15.4 ZigBee Module 5. ElectricalCharacteristics: Items Contents Specification IEEE802.15.4 Frequency 2400~2483.5MHz Channel CH10 to CH26 Data rate 250kbps/MAX Min. Typ. Max. Unit Remark TX Characteristics 1. Power Levels(Calibrated) 1) 21.1dBm Mode 18 19.5 21 dBm 2) 19.7dBm Mode 17 18 19.5 3) 11.8dBm Mode 9 10 11.5 2. Spectrum Mask @ target power / 0% 5.12% 3 Constellation Error(EVM)@ target power 0% 10% 35% 4. Frequency Error -40 -10 40 ppm RX Characteristics Min. Typ. Max. Unit 5 Minimum Input Level Sensitivity(each chain) / -100 -85 dBm 6 Maximum Input Level / / -20 dBm 6. TestSoftwareRequirements: Mfg. software tool version is SmartRFProgr_1.12.7 or later. The version of the manufacturing software tool isSmartRFProgr_1.12.7 Or subsequent version。 7. RefelowStandardCondition:
page 6 of 12 ZB-T530-RSF1 IEEE 802.15.4 ZigBee Module Heating area: temperature: <150 C, time: 60~90 seconds, the slope control at 1~3 C between /S. Preheating constant temperature area: temperature: 150 ~ 200 c, time: 60-120 seconds, the slope is between 0.3-0.8. Reflow zone: peak temperature 235 C ~250 C (suggested peak temperature < 245 C), time 30-70 seconds. Cooling area: temperature: 217 C ~170 C, the slope at 3~5 /S. Solder is tin silver copper alloy lead-free solder / Sn&Ag&Cu Lead-free solder (SAC305)。 8. Mechanical, EnvironmentalandReliabilityTests: Test Items Test Conditions Qty Criteria Condition 4-1 Drop test The packed samples within 100Kg can be tested Drop height: Face Side: 800/600/450mm Edge line: 600/450/350mm Drop time: 1 each Face and edge. 1xBox After drop test, the outer box and inner box will not been broken by appearance visual inspection. 4-2 Vibration test X-Y-Z direction, first Frequency changing from 10Hz to 30Hz to 10Hz ,amplitude 0.75mm, 5 times vibrations, then frequency Changing from 30Hz to 55 Hz to 30 Hz, amplitude 0.15mm, 5 time vibration. 3 After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. 4-3 Impact test Impact acceleration: 50m/sec2; Impact duration: 16ms； Impact times: 1000. 3 After test, the Appearance, Power EVM and Frequency error shall be satisfied with the specification. 4-4 Soldering ability test Soldering temperature: 235±5℃ Soldering duration: 2±0.5S 3 1. After soldering, the soldered area must be covered by a smooth bright solder layer, some deficiencies such as a small amount of the pinhole, not wetting are allowed, but the deficiencies can not be in the same place； 2. At least 90% of soldered area shall becovered continuously by the solderingmaterial. 4-5 Humidity test Leave samples in 40±3℃, 93% RH @ 96 hours 3 Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error functional parameter shall be satisfied with the test specification. 4-6 High temperature load life test Thermostat cabinet temperature: 55±5℃ Applied voltage: 110% rated voltage Working duration: 200 hour (Supply Voltage Cycle 23h power on, 1h power off) 60 After test, leave samples in standard condition for 1 hour and test, Power, EVM and Frequency error shall be satisfied with the testspecification. 4-7 High temperature load test Temperature: 55±5℃ Samples work for 16 hours 3 After test, the Appearance, Power, EVM and Frequency error shall be Satisfied with the test specification.
ZB-T530-RSF1 IEEE 802.15.4 ZigBee Module page 10 of 12 4-8 Low temperature storage test Leave the samples in -25±3℃@24 hours 3 Leave samples in standard test condition for 2 hours then test, the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. 4-9 Low temperature load test Leave samples in -15±3℃@ 2 hours, samples’ function shall be normal, the let samples work for 1 hour 3 After test, leave the samples in standard condition and tested the Appearance, Power, EVM and Frequency error shall be satisfied with the test specification. 4-10 Temperature circle test One cycle duration -10±3℃ @3H 40±3℃ @3H Total cycle: 10x 3 After test, leave the samples in standard condition and tested Power EVM and Frequency error shall be qualified and all the characters shall be satisfied with the test specification. 4-11 Continuous TP test Twice cycle duration -10±3℃@4H +60±3℃@4H, +25@2H@2H 3 During test, There will not been appeared signal disconnection or interruption between DUT and AP. 4-12 ESD Discharge voltage: 2kV C: 150pF Discharge resistance：330Ω Positive10 times 1 time for each second 3 The products can recoverable smoothly after ESD test.
ZB-T530-RSF1 IEEE 802.15.4 ZigBee Module 13. Packaging requirements: (1) the size of the tray and the setting direction of the module, such as the following. Feeral Communication Commission (FCC) Radiation Exposure Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1)this device may not cause harmful interference, and (2)this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorien‐t or relocate the receiving antenna. Increase the separation between the equipment and receiver.‐ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.‐ Consult the dealer or an experienced radio/TV ‐technician for help. Federal Communication Commission (FCC) Radiation Exposure Statement When using the module, maintain a distance of 20cm from the body to ensure compliance with RF exposure requirements.
ZB-T530-RSF1 IEEE 802.15.4 ZigBee Module A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labelled with an FCC ID:2AE8BFZB57A5PF. The OEM manual must provide clear instructions explaining to the OEM the labelling requirements, options and OEM user manual instructions that are required For a host using a this FCC certified modular with a standard fixed label, if (1) the module’s FCC ID is notvisible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: 2AE8BFZB57A5PF or “Contains FCC ID:2AE8BFZB57A5PF ” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. Host product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15B). To ensure compliance with all nontransmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. If a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, we suggest the host device to recertify part 15B to ensure complete compliance with FCC requirement: Part 2 Subpart J Equipment Authorization Procedures , KDB784748 D01 v07, and KDB 997198 about importation of radio frequency devices into the United States.

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