FEIBIT ELECTRONIC TECHNOLOGY FZB57A5PF FZB57A5+Module User Manual FZB57A5 specification

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Application ID	MNbFtyg/yuWK48fzebePFw==
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Date Submitted	2018-04-18 00:00:00
Date Available	2018-04-18 00:00:00
Creation Date	2018-04-18 15:55:26
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Document Title	Microsoft Word - FZB57A5+ specification
Document Author:	Joe_Zhou

FZB57A3+
IEEE 802.15.4 ZigBee Module
FCC ID:2AE8BFZB57A5PF
FZB57A5+
2.4 GHz IEEE 802.15.4 ZigBeeModule
characteristicsFeatures：
 ReservingSystem
 IEEE Std. 802.15.4
 Is the Chip Solution
TI CC2530F256RHAR
 Band
2.4G
 Size
18mm*27.1mm*2.3mm
Model Overview：
Model
Installa
tion
method
Support
standard
FZB57A5+
SMT
IEEE 802.15.4
rate（MAX）
250kbps
Band
Antenna
interfac
Remarks
2.4 GHz
IPEX
3.3V
power
supply
1.Briefdescription:
ZigBee module FZB57A5+ is based on TI CC2530F256RHAR, complied with IEEE, complied, and it is also known
as "
The ZigBee module FZB57A5+ is a TI based CC2530F256RHAR development that supports the 2.4GHz IEEE
802.15.4 label
Quasi - maximum support for 250kbps rate wireless network connections.
page 1 of 12
FZB57A3+
IEEE 802.15.4 ZigBee Module
2.PackageoutlineandMounting:（View direction: confront）
NOTE1:General tolerance ±0.2mm unless otherwise stated
3.PinDefinition:
Pin#
10
11
12
13
14
15
16
17
18
Name
GND
VCC
P2_2
P2_1
P2_0
P1_7
P1_6
P1_5
P1_3
P1_2
P1_4
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
Description
Ground connection
3.3V Main Voltage Source Input
Digital I/O Port 2.2/JTAG DC
Digital I/O Port 2.1/JTAG DD
Digital I/O Port 2.0
Digital I/O Port 1.7
Digital I/O Port 1.6
Digital I/O Port 1.5
Digital I/O Port 1.3
Digital I/O Port 1.2
Digital I/O Port 1.4
Digital I/O Port 0.6
Digital I/O Port 0.5/UART RTS
Digital I/O Port 0.4/UART CTS
Digital I/O Port 0.3/UART TXD
Digital I/O Port 0.2/UART RXD
Digital I/O Port 0.1
Digital I/O Port 0.0
page 2 of 12
FZB57A3+
IEEE 802.15.4 ZigBee Module
19
20
RST
GND
Reset
Ground connection
1. ProductPicture:
TOP VIEW
BOTTOM VIEW
Silk screen Description:
1. the character in the red box is PCB figure number.
2. the character in the yellow box is the PCB supplier control character.
3. the character in the blue box is the PCB batch number.
4. the character in the green frame is PCB flame retardant grade.
page 3 of 12
FZB57A3+
IEEE 802.15.4 ZigBee Module
2. key materials:
Serial Key name
number
Model
Specification /
material
Producer
Integrated
circuit
CC2530F256RHAR
VQFN
TI
Integrated
circuit
CC2592RGVR
PVQFN
TI
PCB
JUB7.820.0245-2
FR-4,4LAY
The founding of the UK
Sunlord
crystal
oscillator
E3SB32E00000BE
32M
Hosonic
crystal
oscillator
ETST00327000JE
32.768KHz
Hosonic
Remarks
3. GeneralRequirements:
No.
Feature
Description
6-1
Operation Voltage
3.3±0.3V
6-2
TX Current Consumption
<150mA
6-3
Operation Temperature
6-4
Antenna Type
6-5
CPU Type
6-6
Storage Temperature
-20°C ~ +60°C
no antenna
8051
-40°C ~ +85°C
4. SMTSolder plate recommendation：
page 4 of 12
ZB-T530-RSF1
IEEE 802.15.4 ZigBee Module
5. ElectricalCharacteristics:
Items
Contents
Specification
Frequency
Channel
Data rate
TX Characteristics
1. Power Levels(Calibrated)
1) 21.1dBm Mode
2) 19.7dBm Mode
3) 11.8dBm Mode
2. Spectrum Mask @ target power
3 Constellation Error(EVM)@ target power
4. Frequency Error
RX Characteristics
5 Minimum Input Level Sensitivity(each chain)
6 Maximum Input Level
6.
Min.
IEEE802.15.4
2400~2483.5MHz
CH10 to CH26
250kbps/MAX
Typ.
Max.
Unit
18
17
0%
-40
Min.
19.5
18
10
0%
10%
-10
Typ.
-100
21
19.5
11.5
5.12%
35%
40
Max.
-85
-20
Remark
dBm
ppm
Unit
dBm
dBm
TestSoftwareRequirements:
Mfg. software tool version is SmartRFProgr_1.12.7 or later.
The version of the manufacturing software tool isSmartRFProgr_1.12.7 Or subsequent version。
7.
RefelowStandardCondition:
page 5 of 12
ZB-T530-RSF1
IEEE 802.15.4 ZigBee Module
Heating area: temperature: <150 C, time: 60~90 seconds, the slope control at 1~3 C between /S. Preheating
constant temperature area: temperature: 150 ~ 200 c, time: 60-120 seconds, the slope is between 0.3-0.8.
Reflow zone: peak temperature 235 C ~250 C (suggested peak temperature < 245 C), time 30-70 seconds.
Cooling area: temperature: 217 C ~170 C, the slope at 3~5 /S.
Solder is tin silver copper alloy lead-free solder / Sn&Ag&Cu Lead-free solder (SAC305)。
8.
Mechanical, EnvironmentalandReliabilityTests:
Test Items
4-1
Drop test
4-2
Vibration test
4-3
Impact test
4-4
Soldering ability
test
4-5
Humidity test
Test Conditions
The packed samples within
100Kg can be tested
Drop height:
Face Side: 800/600/450mm
Edge line: 600/450/350mm
Drop time: 1 each Face and
edge.
X-Y-Z direction, first
Frequency changing from
10Hz to 30Hz to 10Hz
,amplitude 0.75mm, 5 times
vibrations, then frequency
Changing from 30Hz to 55
Hz to 30 Hz, amplitude
0.15mm, 5 time vibration.
Impact acceleration:
50m/sec2;
Impact duration: 16ms；
Impact times: 1000.
Qty
Criteria Condition
1xBox
After drop test, the outer box and inner box will
not been broken by appearance visual
inspection.
After test, the Appearance, Power EVM and
Frequency error shall be satisfied with the
specification.
After test, the Appearance, Power EVM and
Frequency error shall be satisfied with the
specification.
1. After soldering, the soldered area must be
covered by a smooth bright solder layer, some
deficiencies such as a small amount of the
pinhole, not wetting are allowed, but the
deficiencies can not be in the same place；
2. At least 90% of soldered area shall becovered
continuously by the solderingmaterial.
Leave samples in 40±3℃,
93% RH @ 96 hours
Leave samples in standard test condition for 2
hours then test, the Appearance, Power, EVM
and Frequency error functional parameter shall
be satisfied with the test specification.
60
After test, leave samples in standard condition
for 1 hour and test, Power, EVM and Frequency
error shall be satisfied with the testspecification.
After test, the Appearance, Power, EVM and
Frequency error shall be Satisfied with the test
specification.
Soldering temperature:
235±5℃
Soldering duration:
2±0.5S
4-6
High temperature
load life test
Thermostat cabinet
temperature: 55±5℃
Applied voltage:
110% rated voltage
Working duration: 200 hour
(Supply Voltage Cycle
23h power on, 1h power off)
4-7
High temperature
load test
Temperature: 55±5℃
Samples work for 16 hours
page 6 of 12
ZB-T530-RSF1
IEEE 802.15.4 ZigBee Module
Low temperature
storage test
Leave the samples in
-25±3℃@24 hours
Leave samples in standard test condition for 2
hours then test, the Appearance, Power, EVM
and Frequency error shall be satisfied with the
test specification.
4-9
Low temperature
load test
Leave samples in
-15±3℃@ 2 hours,
samples’ function
shall be normal, the let
samples work for 1 hour
After test, leave the samples in standard
condition and tested the Appearance, Power,
EVM and Frequency error shall be satisfied with
the test specification.
4-10
Temperature circle
test
One cycle duration
-10±3℃ @3H
40±3℃ @3H
Total cycle: 10x
After test, leave the samples in standard
condition and tested Power EVM and Frequency
error shall be qualified and all the characters
shall be satisfied with the test specification.
4-11
Continuous
TP test
Twice cycle duration
-10±3℃@4H
+60±3℃@4H,
+25@2H@2H
During test, There will not been appeared signal
disconnection or interruption between DUT and
AP.
Discharge voltage: 2kV
C: 150pF
Discharge resistance：330Ω
Positive10 times
1 time for each second
The products can recoverable smoothly after
ESD test.
4-8
4-12
ESD
page 10 of 12
ZB-T530-RSF1
IEEE 802.15.4 ZigBee Module
13. Packaging requirements:
(1) the size of the tray and the setting direction of the module, such as the following.
Feeral Communication Commission (FCC) Radiation Exposure Statement
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
(1)this device may not cause harmful interference, and
(2)this device must accept any interference received, including interference that may cause undesired operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or
changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
‐ Reorient or relocate the receiving antenna.
‐ Increase the separation between the equipment and receiver.
‐Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
‐Consult the dealer or an experienced radio/TV technician for help.
Federal Communication Commission (FCC) Radiation Exposure Statement
When using the module, maintain a distance of 20cm from the body to ensure compliance with RF exposure
requirements.
ZB-T530-RSF1
IEEE 802.15.4 ZigBee Module
A certified modular has the option to use a permanently affixed label, or an electronic label. For a perman
ently affixed label, the module must be labelled with an FCC ID:2AE8BFZB57A5PF. The OEM manual
must provide clear instructions explaining to the OEM the labelling requirements, options and OEM user
manual instructions that are required For a host using a this FCC certified modular with a standard fixed
label, if (1) the module’s FCC ID is notvisible when installed in the host, or (2) if the host is marketed so
that end users do not have straightforward commonly used methods for access to remove the module so
that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed
module:
“Contains Transmitter Module FCC ID: 2AE8BFZB57A5PF or “Contains FCC ID:2AE8BFZB57A5PF ”
must be used. The host OEM user manual must also contain clear instructions on how end users can find
and/or access the module and the FCC ID.
Host product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated with the transmitter module portion. compliance
must be demonstrated to regulations for other transmitter components within the host product; to require
ments for unintentional radiators (Part 15B). To ensure compliance with all nontransmitter functions the
host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operationa
l. If a host was previously authorized as an unintentional radiator under the Declaration of Conformity
procedure without a transmitter certified module and a module is added, the host manufacturer is respons
ible for ensuring that the after the module is installed and operational the host continues to be compliant
with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the
module is integrated with the host, we suggest the host device to recertify part 15B to ensure complete
compliance with FCC requirement: Part 2 Subpart J Equipment Authorization Procedures , KDB784748
D01 v07, and KDB 997198 about importation of radio frequency devices into the United States.

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