Fibocom Wireless L816AM LTE module User Manual ng

Fibocom Wireless Inc. LTE module ng

Users Manual

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page1of42L816-AM Hardware User ManualVersion: 2.0.4Update date: 2016.09.18
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page2of42Applicability TableNo.Product modelDescription1L816-AMN/A
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page3of42CopyrightCopyright © 2016 Fibocom Wireless Inc. All rights reserved.Without the prior written permission of the copyright holder, any company or individual is prohibited toexcerpt, copy any part of or the entire document, or distribute the document in any form.NoticeThe document is subject to update from time to time owing to the product version upgrade or otherreasons. Unless otherwise specified, the document only serves as the user guide. All the statements,information and suggestions contained in the document do not constitute any explicit or implicitguarantee.TrademarkThe trademark is registered and owned by Fibocom Wireless Inc.Version RecordVersionUpdate DateDescriptionV2.0.02016-04-28Initial versionV2.0.12016-07-19Sections describe modificationsV2.0.22016-07-26Modified descriptionV2.0.32016-07-28Update part chartV2.0.42016-09-18Add product certification of warnings
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page4of42Contents1 Foreword....................................................................................................................................... 61.1 Introduction........................................................................................................................................... 61.2 Reference Standard............................................................................................................................ 61.3 Related Documents............................................................................................................................. 62 Overview........................................................................................................................................72.1 Introduction........................................................................................................................................... 72.2 Specification..........................................................................................................................................72.3 Warnings............................................................................................................................................... 82.4 Application Framework..................................................................................................................... 112.5 Hardware Framework........................................................................................................................123 Application Interface................................................................................................................133.1 LGA Interface..................................................................................................................................... 133.1.1 Pin Distribution.............................................................................................................................. 133.1.2 Pin Definition.................................................................................................................................... 143.2 Power Supply..................................................................................................................................... 193.2.1 Power Supply................................................................................................................................... 193.2.2 Power Consumption........................................................................................................................213.3 Control Signal.....................................................................................................................................223.3.1 Module Start-up............................................................................................................................... 223.3.1.1 Start-up Circuit.............................................................................................................................223.3.1.2 Start-up Timing............................................................................................................................ 233.3.2 Module Shutdown............................................................................................................................243.3.3 Module Reset................................................................................................................................... 253.4 USB Interface..................................................................................................................................... 263.4.1 USB Interface Definition................................................................................................................. 263.4.2 USB Interface Application.............................................................................................................. 263.5 USIM Interface................................................................................................................................... 273.5.1 USIM Pins......................................................................................................................................... 273.5.2 USIM Interface Circuit.....................................................................................................................283.5.2.1 N.C. SIM Card Slot..................................................................................................................... 283.5.2.2 N.O. SIM Card Slot..................................................................................................................... 283.5.3 USIM Hot-Plugging..........................................................................................................................293.5.4 USIM Design.................................................................................................................................... 30
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page5of423.6 GPIO.................................................................................................................................................... 303.6.1 FW_Ready........................................................................................................................................ 313.6.2 SMS_Ready......................................................................................................................................313.6.3 Wakeup_Host...................................................................................................................................313.6.4 PA_Blanking..................................................................................................................................... 323.7 Interrupt Control................................................................................................................................. 323.7.1 W_Disable#...................................................................................................................................... 323.7.2 BodySar.............................................................................................................................................333.8 Other Interfaces................................................................................................................................. 334 RF Interface................................................................................................................................ 344.1 Operating Band.................................................................................................................................. 344.2 Transmitting Power............................................................................................................................344.3 Receiver Sensitivity........................................................................................................................... 354.4 RF PCB Design..................................................................................................................................364.4.1 Trace Routing Principle.................................................................................................................. 364.4.2 RF Impedance Design.................................................................................................................... 364.5 Antenna Design..................................................................................................................................374.5.1 Antenna Design Requirements..................................................................................................... 375 Structure Specification............................................................................................................385.1 Product Appearance..........................................................................................................................385.2 Dimension of Structure..................................................................................................................... 395.3 Recommended Design for PCB Bonding Pad.............................................................................. 405.4 SMT Paster.........................................................................................................................................415.5 Storage................................................................................................................................................425.5.1 Storage Life...................................................................................................................................... 425.5.2 Workshop Life.................................................................................................................................. 425.5.3 Recommended baking standards:................................................................................................425.6 Packing................................................................................................................................................425.6.1 Tray Package....................................................................................................................................42
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page6of421 Foreword1.1 IntroductionThe document describes the electrical characteristics, RF performance, dimensions and applicationenvironment, etc. of L816-AM-00 (hereinafter referred to as L816-AM). With the assistance of thedocument and other instructions, the developers can quickly understand the hardware functions ofL816-AM modules and develop products.1.2 Reference StandardThe design of the product complies with the following standards:3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:Conformance specification3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radiotransmission and reception (FDD);Part 1: Conformance specification3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radiotransmission and reception; Part 1: Conformance testing3GPP TS 21.111 V10.0.0: USIM and IC card requirements3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment(SIM-ME) interface3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)application3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) ApplicationToolkit(USAT)3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobileterminals and ancillary equipment3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)1.3 Related DocumentsRF Antenna Application Design SpecificationFIBOCOM_L8 Family System Driver Integration and Application GuidanceL816-AM AT Commands ManualL816-AM SMT Application Design Specification
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page7of422 Overview2.1 IntroductionThe L816-AM module are highly integrated 4G wireless communication LGA modules, which supportsLTE FDD/WCDMA/GSM systems (3 modes and 7 bands).2.2 SpecificationSpecificationOperating BandLTE FDD: Band II,IV, XIIWCDMA/HSPA+: Band I,II,V(VI),VIIIGSM/GPRS/EDGE: 850/900/1800/1900MHzDataTransmissionLTE FDDRel.9, 10Mbps DL/5Mbps UL (Cat 1)WCDMA / HSDPA /HSUPA:UMTS:384 kbps DL/384 kbps ULHSDPA CAT 7:7.2 Mbps Down;HSUPA CAT 6:5.76 Mbps UpGPRS/EDGEGPRS:MSC 10, CS-4 80 Kbps Down/20Kbps UpPower SupplyDC 3.3V～4.5VTemperatureOperating: -10°C ～+55°CStorage: -40°C ～+85°CPhysicalcharacteristicsPackage: LGA 115 pinsDimension:30.0 x 21.0 x 1.55mmWeight:~2.4gInterfacesAntennaWWAN Main Antenna x 1WWAN Diversity Antenna x 1FunctionInterfaceUSIM 3V/1.8VUSB 2.0 x 1EINT, GPIOUSIM x 1RF MIPI,RF GPO
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page8of42SoftwareAT commands3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commandsFirmware updateUSB2.3 Warnings2.3.1 CE StatementEU Regulatory Conformance:Hereby, We, FIBOCOM Wireless Inc. declares that this device L816-AM is in compliance with theessential requirements and other relevant provisions of Directive 1999/5/EC.CE 0560R&TTE Regulation:In all cases assessment of the final product must be mass against the Essential requirements of theR&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2requirements.The maximum antenna gain for frequency 900 is 3dBi; for frequency 1800 is 5dBi and the antennaseparation distance is 20cm.2.3.2 FCC StatementFederal Communication Commission Interference StatementThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) this device must accept any interferencereceived, including interference that may cause undesired operation.This equipment has been tested and found to comply with the limits for a Class B digital device, pursuantto Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmfulinterference in a residential installation. This equipment generates, uses and can radiate radio frequencyenergy and, if not installed and used in accordance with the instructions, may cause harmful interferenceto radio communications. However, there is no guarantee that interference will not occur in a particular
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page9of42installation. If this equipment does cause harmful interference to radio or television reception, which canbe determined by turning the equipment off and on, the user is encouraged to try to correct theinterference by one of the following measures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit different from thatto which the receiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Caution:Any changes or modifications not expressly approved by the party responsible for compliance couldvoid the user's authority to operate this equipment.This transmitter must not be co-located or operating in conjunction with any other antenna ortransmitter.Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.This equipment should be installed and operated with minimum distance 20cm between the radiator &your body.This device is intended only for OEM integrators under the following conditions:1) The antenna must be installed such that 20 cm is maintained between the antenna andusers, and the maximum antenna gain allowed for use with this device is 5dBi.2) The transmitter module may not be co-located with any other transmitter or antenna.As long as 2 conditions above are met, further transmitter test will not be required. However, the OEMintegrator is still responsible for testing their end-product for any additional compliance requirementsrequired with this module installedIMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptopconfigurations or co-location with another transmitter), then the FCC authorization is no longer consideredvalid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator willbe responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCCauthorization.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page10of42End Product LabelingThis transmitter module is authorized only for use in device where the antenna may be installed such that20 cm may be maintained between the antenna and users. The final end product must be labeled in avisible area with the following: “Contains FCC ID: ZMOL816AM and IC:21374-L816AM”. The grantee'sFCC ID & IC ID can be used only when all FCC&IC compliance requirements are met.Manual Information To the End UserThe OEM integrator has to be aware not to provide information to the end user regarding how to install orremove this RF module in the user’s manual of the end product which integrates this module. The enduser manual shall include all required regulatory information/warning as show in this manual.2.3.3 IC StatementIndustry Canada statementThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject tothe following two conditions:1) this device may not cause interference, and2) this device must accept any interference, including interference that may cause undesiredoperation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes:1) l'appareil ne doit pas produire de brouillage, et2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillageest susceptible d'en compromettre le fonctionnement.This Class B digital apparatus complies with Canadian ICES-003.Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that thisdevice does not cause harmful interference.Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à lacondition que cet appareil ne provoque aucune interférence nuisible.This device and its antenna(s) must not be co-located or operating in conjunction with any otherantenna or transmitter, except tested built-in radios.Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autreantenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.The County Code Selection feature is disabled for products marketed in the US/ Canada.La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés auxÉtats-Unis et au Canada.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page11of42Radiation Exposure Statement:This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. Thisequipment should be installed and operated with minimum distance 20cm between the radiator & yourbody.Déclaration d'exposition aux radiations:Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour unenvironnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm dedistance entre la source de rayonnement et votre corps.2.4 Application FrameworkThe peripheral applications for L816-AM module are shown in Figure 2-1:Figure2-1 Application Framework
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page12of422.5 Hardware FrameworkThe hardware framework in Figure 2-2 shows the main hardware functions of L816-AM module, includingbase band and RF functions.Baseband contains the followings:GSM/UMTS/LTE FDD controller/Power supplyNAND+LPDDR2 RAMApplication interfaceRF contains the followings:RF TransceiverRF Power/PARF Front EndRF FilterFigure 2-2 Hardware Framework
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page13of423 Application Interface3.1 LGA InterfaceThe L816-AM module applies LGA packaging, with a total of 115 pins.3.1.1 Pin DistributionFigure 3-1 Pin Map (TOP Perspective View)
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page14of423.1.2 Pin DefinitionThe L816-AM pin definition is as follows:PinPin NameI/OResetValuePin DescriptionTypeUSB2.013USB_DPI/OTUSB Data Positive0.3---3V14USB_DNI/OTUSB Data Negative0.3---3V15VBUSPIUSB VBUS Supply2.0---5.25VSIM17SIM1_DATAI/OLUSIM data, internal 4.7KΩ pull-up1.8V/3V18SIM1_RSTOLUSIM reset1.8V/3V19SIM1_CLKOLUSIM clock1.8V/3V20VSIM1POUSIM power supply1.8V/3V26SIM1_CDIUSIM card detection with 390KΩ pull-up, active high1.8VEINT31Wakeup_ModemIPDReservedCMOS 1.8V40W_Disable#IPDDisable WWANCMOS 1.8V27BodySarIPDBody SAR detectionCMOS 1.8VGPIO28FW_ReadyOPDFW_Ready outputCMOS 1.8V29SMS_ReadyOPDSMS_Ready outputCMOS 1.8V30USB_En/DisableOPDEnable_Disable-USB Signal OutputCMOS 1.8V33PA_BlankingOPDPA_Blanking outputCMOS 1.8V42GPIO_ModemI/OPDReservedCMOS 1.8V39Wakeup_HostOPDWakeup_Host outputANT61Main_ANTI/OMain antenna68DIV_ANTIDiversity antennaANT Tunable
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page15of42PinPin NameI/OResetValuePin DescriptionType9RFE_RFFE2_VIOPORFFE2 VIO for tunable ANT1.8V10RFE_RFFE2_SCLKOReserved1.8V11RFE_RFFE2_SDATAI/OReserved1.8VRF GPO4GPIO_RF1ORF_GPIO_12.3V5GPIO_RF2ORF_GPIO_22.3V7ASM_2V5POASM_2V52.5VModule Control32Reset_NIModule reset input with 100KΩ pull-up1.8V41Power_On/OffIModule power on/off signal.Advise the customer to increase the200KΩ pull-down1.8VPower45VBAT_BBPI-Power inputPower supply46VBAT_PAPI-Power inputPower supply47VBAT_PAPI-Power inputPower supply48VBAT_TRPI-Power inputPower supplyGND1GND--GNDGround2GND--GNDGround3GND--GNDGround6GND--GNDGround8GND--GNDGround12GND--GNDGround16GND--GNDGround21GND--GNDGround22GND--GNDGround23GND--GNDGround24GND--GNDGround
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page16of42PinPin NameI/OResetValuePin DescriptionType25GND--GNDGround34GND--GNDGround35GND--GNDGround36GND--GNDGround37GND--GNDGround38GND--GNDGround43GND--GNDGround44GND--GNDGround49GND--GNDGround50GND--GNDGround51GND--GNDGround52GND--GNDGround53GND--GNDGround54GND--GNDGround55GND--GNDGround56GND--GNDGround57GND--GNDGround58GND--GNDGround59GND--GNDGround60GND--GNDGround62GND--GNDGround63GND--GNDGround64GND--GNDGround65GND--GNDGround66GND--GNDGround67GND--GNDGround69GND--GNDGround70GND--GNDGround
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page17of42PinPin NameI/OResetValuePin DescriptionTypeTG1GND--Thermal GroundGroundTG2GND--Thermal GroundGroundTG3GND--Thermal GroundGroundTG4GND--Thermal GroundGroundTG5GND--Thermal GroundGroundTG6GND--Thermal GroundGroundTG7GND--Thermal GroundGroundTG8GND--Thermal GroundGroundTG9GND--Thermal GroundGroundTG10GND--Thermal GroundGroundTG11GND--Thermal GroundGroundTG12GND--Thermal GroundGroundTG13GND--Thermal GroundGroundTG14GND--Thermal GroundGroundTG15GND--Thermal GroundGroundTG16GND--Thermal GroundGroundTG17GND--Thermal GroundGroundTG18GND--Thermal GroundGroundTG19GND--Thermal GroundGroundTG20GND--Thermal GroundGroundTG21GND--Thermal GroundGroundTG22GND--Thermal GroundGroundTG23GND--Thermal GroundGroundTG24GND--Thermal GroundGroundTG25GND--Thermal GroundGroundTG26GND--Thermal GroundGroundTG27GND--Thermal GroundGroundTG28GND--Thermal GroundGround
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page18of42PinPin NameI/OResetValuePin DescriptionTypeTG29GND--Thermal GroundGroundTG30GND--Thermal GroundGroundTG31GND--Thermal GroundGroundTG32GND--Thermal GroundGroundTG33GND--Thermal GroundGroundTG34GND--Thermal GroundGroundTG35GND--Thermal GroundGroundTG36GND--Thermal GroundGroundTG37GND--Thermal GroundGroundTG38GND--Thermal GroundGroundTG39GND--Thermal GroundGroundTG40GND--Thermal GroundGroundTG41GND--Thermal GroundGroundTG42GND--Thermal GroundGroundTG43GND--Thermal GroundGroundTG44GND--Thermal GroundGroundTG45GND--Thermal GroundGroundH: High Voltage LevelL: Low Voltage LevelPD: Pull-DownPU: Pull-UpT: Tri-StateOD: Open DrainPP: Push-PullPI: Power InputPO: Power OutputNote:The unused pins can be left floating.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page19of423.2 Power SupplyThe power interface for L816-AM module is as follows:PinPin NameI/OPin DescriptionDC Parameters （V）MinimumValueTypicalValueMaximumValue45VBAT_BBPIPower input to BB3.33.84.546VBAT_PAPIPower input to RF PADC-DC3.33.84.547VBAT_PAPIPower input to RF PADC-DC3.33.84.548VBAT_TRPIPower input totransceiver3.33.84.515VBUSPIUSB power supply2.03.85.2520VSIM1POSIM1 power supply1.8V/3V3.2.1 Power SupplyThe L816-AM module should be powered through the VBAT pins, and the power supply design is shownin Figure 3-2:Figure 3-2 Power Supply Design
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page20of42The filter capacitor design for power supply is shown in the following table:RecommendedcapacitanceApplicationDescription220uF x 2Voltage-stabilizing capacitorsReduce power fluctuations of the module inoperation, requiring capacitors with low ESRLDO or DC/DC power supply requires thecapacitor of no less than 440uFThe capacitor for battery power supplycan be reduced to 100～220uF1uF,100nFDigital signal noiseFilter out the interference generated from theclock and digital signals39pF,33pF850/900 MHz frequency bandFilter out low frequency band RF interference18pF,8.2pF,6.8pF1800/1900,2100MHz frequencybandFilter out medium/high frequency band RFinterferenceThe stable power supply can ensure the normal operation of L816-AM module; and the ripple of thepower supply should be less than 165mV in design. When the module operates under GSM mode (Bursttransmit), the maximum operating current can reach 2A, so the power source should be not lower than3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:Figure 3-3 Power Supply Limit
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page21of423.2.2 Power ConsumptionIn the case of 3.8V power supply, the power consumption for L816-AM module is shown in the followingtable:ParameterModeConditionAverageCurrent(mA)IoffPower offPower supply, module power offTBDIIdleGPRSMFRMS=5TBDWCDMADRX=8TBDLTE FDDDRX=8TBDRadio OffAT+CFUN=4, Flight modeTBDISleepGPRSMFRMS=2TBDMFRMS=5TBDMFRMS=9TBDWCDMADRX=6TBDDRX=8TBDDRX=9TBDLTE FDDPaging cycle #64 frames (0.64 sec DRx cycle)TBDRadio OffAT+CFUN=4,Flight modeTBDIGPRS-RMSCS4GPRS1Rx slotnTX slotGPRS Data transfer GSM850; PCL=5; 1Rx/2TxTBDGPRS Data transfer GSM900; PCL=5; 1Rx/2TxTBDGPRS Data transfer DCS1800; PCL=0; 1Rx/2TxTBDGPRS Data transfer PCS1900; PCL=0; 1Rx/2TxTBDIEGPRS-RMSMCS9EDGEEDGE Data transfer GSM850; PCL=8; 1Rx/2TxTBDEDGE Data transfer GSM900; PCL=8; 1Rx/2TxTBDEDGE Data transfer DCS1800; PCL=2; 1Rx/2TxTBDEDGE Data transfer PCS1900; PCL=2; 1Rx/2TxTBDIWCDMA-RMSWCDMAWCDMA Data transfer Band I @+23dBmTBDWCDMA Data transfer Band II @+23dBmTBD
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page22of42ParameterModeConditionAverageCurrent(mA)WCDMA Data transfer Band V(VI) @+23dBmTBDWCDMA Data transfer Band VIII @+23dBmTBDILTE-RMSLTE FDDLTE FDD Data transfer Band 2 @+23dBmTBDLTE FDD Data transfer Band 4 @+23dBmTBDLTE FDD Data transfer Band 12 @+23dBmTBD3.3 Control SignalThe L816-AM module provides two control signals to execute the power on/off and reset operations, thepin definition is as follows:PinPin NameI/OReset ValueFunctionsType41Power_On/OffIPower on/off signal with internal 200KΩpull-down.High: Power onLow or floating: Power off1.8V32Reset_NIReset signal with 100KΩ internalpull-up, active low.1.8V3.3.1 Module Start-up3.3.1.1 Start-up CircuitThe VRTC output from the module can be used as the pull up voltage and the module has two start-upmodes:AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure3-4:Automatically start-up when powered on, and the circuit design is shown in Figure 3-5:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page23of42Figure 3-4 Circuit for Module Start-up Controlled by APFigure 3-5 Circuit for Automatic Start-up3.3.1.2 Start-up TimingAfter powering on, the module will start-up by pulling up the Power_On/Off signal for more than 20ms(100ms is recommended).The start-up timing is shown in Figure 3-6:Figure 3-6 Timing Control for Start-up
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page24of42Note:The Reset_N is required to pull high with a 1s delay after the VBAT, because it takes some timeto charge the capacitors for +3.3V power supply. If the VBAT power supply is already stablebefore starting up the module, the delay time can be ignored.3.3.2 Module ShutdownThe L816-AM module can be shut down by software or hardware control.Control modeActionConditionSoftwareSending AT+CPWROFFcommandNormal shutdown.HardwarePull down Power_On/Off pinOnly used when a hardware exception occursand the software control cannot be used.The module can be shut down by sending AT+CPWROFF command. When the module receives theshutdown command, the module will plug Low the FW_Ready and start the finalization process (thereverse process of initialization), and it will be completed after 3s. In the finalization process, the modulewill save the network, SIM card and some other parameters from memory, then clear the memory andPMU will be powered off. The control timing is shown in Figure 3-7:Figure 3-7 Software Shutdown Timing ControlAfter the software shutdown, the Power_On/Off pin will remain high which prevents the module fromrestarting again. To enable the next restart, the Power_On/Off pin should be pulled low after shuttingdown.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page25of423.3.3 Module ResetThe L816-AM module can reset to its initial status by pulling down the Reset_N signal for more than 10ms(100ms is recommended), and the module will restart after the Reset_N signal is released. When thecustomer executes Reset_N function, the PMU remains its power inside the module. The recommendedcircuit design is shown in the Figure 3-8:Figure 3-8 Recommended Design for Reset CircuitThe reset control timing is shown in Figure 3-9:Figure 3-9 Reset Timing ControlNote:Reset_N is a sensitive signal, it’s recommended to add a filter capacitor close to the module. Incase of PCB layout, the Reset_N signal lines should keep away from the RF interference andprotected by GND. Also, the Reset_N signal lines shall neither near the PCB edge nor route onthe surface planes to avoid module from reset caused by ESD problems.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page26of423.4 USB InterfaceThe L816-AM module supports USB 2.0 which is compatible with USB High-Speed (480 Mbit/s) and USBFull-Speed (12 Mbit/s). For the USB timing and electrical specification of L816-AM module, please refer to“Universal Serial Bus Specification 2.0”.3.4.1 USB Interface DefinitionPinPin NameI/OReset ValuePin DescriptionType15VBUSPIUSB power supply2.0---5.25V14USB_DNIOTUSB Data Negative0.3---3V13USB_DPIOTUSB Data Positive0.3---3VThe VBUS power supply is used as the detection of the USB port; after VBUS is powered on, the USBfunction of the module will be enabled and the enumeration will begin. The VBUS pin is only used for thedetection of USB port, and the supply current is about 1mA. When USB_DN & USB_DP are disconnected,the module will not enter sleep mode for the case if VBUS power is supplied.The USB driver will map 3 COM ports and 4 NCM ports, which are described as follows:2 COM ports are used to send AT Commands.1 COM port is used to capture LOG information with debugging softwares.4 NCM ports are virtual network ports, which are used to initiate the data service.Note:One COM port can be used as the Modem COM port to initiate the data service. Since the speedof the Modem COM port is not sufficient for the 150 Mbps peak downlink speed requirement forLTE, so it is not recommended to be used.3.4.2 USB Interface ApplicationThe reference circuit is shown in Figure 3-10:Figure 3-10 Reference Circuit for USB Interface
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page27of42Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalentcapacitance of 1pF or smaller ones on the USB_DN/DP differential signal lines, it is recommended to use0.5pF TVS diodes. There is no special requirement for TVS diodes on VBUS pin, normally the 8 ~ 10pFTVS diodes can be used.USB_DN and USB_DP are high speed differential signal lines with the maximum transfer rate of 480Mbit/s, so the following rules shall be followed carefully in the case of PCB layout:USB_DN and USB_DP signal lines should have the differential impedance of 90 ohms.USB_DN and USB_DP signal lines should be parallel and have the equal length, the right anglerouting should be avoided.USB_DN and USB_DP signal lines should be routed on the layer that is next to the ground layer,and be wrapped with GND on both sides and layers.3.5 USIM InterfaceThe L816-AM module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.3.5.1 USIM PinsThe USIM pins are described as follows:PinPin NameI/OReset ValuePin DescriptionType20VSIM1POUSIM power supply1.8V/3V18SIM1_RSTOLUSIM reset1.8V/3V19SIM1_CLKOLUSIM clock1.8V/3V17SIM1_DATAI/OLUSIM data with internal 4.7KΩ pull-up1.8V/3V26SIM1_CDIUSIM card detection with 390KΩ pull up.Active-high, and high level means SIMcard is inserted; and low level means SIMcard is detached.1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page28of423.5.2 USIM Interface Circuit3.5.2.1 N.C. SIM Card SlotThe reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-11:Figure 3-11 Reference Circuit for N.C. SIM Card SlotThe principles for N.C. SIM card slot design are described as follows:When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives theSIM1_CD pin low.When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives theSIM1_CD pin high.Suggested SIM1_CD pin increase TVS to protect the pin.3.5.2.2 N.O. SIM Card SlotThe reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-12:Figure 3-12 Reference Circuit for N.O. SIM Card Slot
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page29of42The principles for N.O. SIM card slot design are described as follows:When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives theSIM1_CD pin low.When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives theSIM1_CD pin high.Suggested SIM1_CD pin increase TVS to protect the pin.3.5.3 USIM Hot-PluggingThe L816-AM module supports the SIM card hot-plugging detection function, which determines whetherthe SIM card is inserted or detached by detecting the SIM1_CD pin state of the SIM card slot.The SIM card hot-plugging detection function can be configured by “AT+MSMPD” command, and thedescription for AT command is as follows:AT CommandHot-plugging DetectionFunction DescriptionAT+MSMPD=1EnableDefault value, the SIM card hot-plugging detectionfunction is enabled.The module can detect whether the SIM card is insertedor not through the SIM1_CD pin state.AT+MSMPD=0DisableThe SIM card hot-plugging detection function is disabled.The module reads the SIM card when starting up, and theSIM1_CD status will not be detected.After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card isinserted when the SIM1_CD pin is high, then executes the initialization program and finish the networkregistration after reading the SIM card information. When the SIM1_CD pin is low, the module determinesthat the SIM card is detached and does not read the SIM card.Note:By default, SIM1_CD is active-high, which can be switched to active-low by the AT command.Please refer to the AT Commands Manual for the AT command.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page30of423.5.4 USIM DesignThe SIM card circuit design shall meet the EMC standards and ESD requirements with the improvedcapability to resist interference, to ensure that the SIM card can work stably. The following guidelinesshould be noted in case of design:The SIM card slot placement should near the module as close as possible, and away from theRF antenna, DC/DC power supply, clock signal lines, and other strong interference sources.The SIM card slot with a metal shielding housing can improve the anti-interference ability.The trace length between the SIM card slot and the module should not exceed 100mm, or itcould reduce the signal quality.The SIM1_CLK and SIM1_DATA signal lines should be isolated by GND to avoid crosstalkinterference. If it is difficult for the layout, the whole SIM signal lines should be wrapped withGND as a group at least.The filter capacitors and ESD devices for SIM card signals should be placed near to the SIMcard slot, and the ESD devices with 22~33pF capacitance should be used.3.6 GPIOThe L816-AM module provides four signals to indicate the operating status of the module, the statusindicator pins are as follows:PinPin NameI/OReset ValuePin DescriptionType28FW_ReadyOPDModem SMS Ready InformHOST 1.8VCMOS 1.8V29SMS_ReadyOPDModem FW Ready InformHOST 1.8VCMOS 1.8V30USB_En/DisableOPDReservedCMOS 1.8V39Wakeup_HostOPDModule wakes up Host (AP).CMOS 1.8V33PA_BlankingOPDPA Blanking output, externalGPS control signal.CMOS 1.8V42GPIO_ModemOPDReservedCMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page31of423.6.1 FW_ReadyFirmware ready is a modem driven GPIO, which on power on reset, it should be low. Once the firmware inthe modem is ready after boot, it should assert (high) GPIO. In an unlikely event of a firmware/modemcrash, if a crash/exception handler is to be run, FW ready GPIO should be de-asserted.FW_Ready timing is shown in Figure 3-6，3-7，3-9。3.6.2 SMS_ReadySMS ready is a modem driven GPIO, which should be low while power up/off and reset sequences.Whenever modem receives an SMS from the network, it should assert (high) GPIO during 100msec, thende-assert (low).SMS ready GPIO should be triggered by non-class 2 “SIM card data” messages regardless messagestorage status (even the storage is full and not be able to store new received message).SMS_Ready timing is shown in Figure 3-13:Figure 3-13 SMS_Ready Timing3.6.3 Wakeup_HostThe Wakeup_Host signal is used to wake the Host (AP) when there is an incoming call, SMS or other datarequests. The definition of Wakeup_Host signal is as follows:Operating ModeWakeup_Host SignalRinging /SMS or data requestsPull high 100ms then pull low (pulse signal).Idle/Sleeplow levelWakeup_Host timing is shown in Figure 3-14:Figure 3-14 Wakeup_Host Timing
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page32of423.6.4 PA_BlankingWhile the module works in GSM frequency band, the PA_Blanking pin will output the pulse signals thatsynchronize with the GSM burst TX timing. As the GSM TX may interfere the receiving of the GPS signal,AP can disable GPS or stop receiving GPS data when it detects the PA_Blanking pulse signals, to avoidGPS working abnormally.Operating modesPA_BLANKING signalDefaultLow levelGSM burst TXOutput the pulse signals that synchronize with the GSM burst TX.PA_BLANKING timing is shown in Figure 3-15:Figure 3-15 PA_Blanking Timing3.7 Interrupt ControlThe L816-AM module provides four interrupt signals, and the pin definition is as follows:PinPin NameI/OReset ValuePin DescriptionType31Wakeup_ModemIPDReservedCMOS 1.8V40W_Disable#IPDEnable/Disable RF networkCMOS 1.8V27BodySarIPUBody SAR detectionCMOS 1.8V3.7.1 W_Disable#The module provides a hardware pin to enable/disable WWAN RF function, and the function can also becontrolled by the AT command. The module enters the Flight mode after the RF function is disabled. Thedefinition of W_Disable# signal is as follows:W_Disable# signalFunctionHigh/FloatingWWAN enable, the module exits the Flight mode.LowWWAN disable, the module enters Flight mode.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page33of423.7.2 BodySarThe L816-AM module supports the BodySar detection function. The voltage level is high by default forBodySar, and when the SAR sensor detects the closing human body, the BodySar signal will be pulleddown. As the result, the module then lowers down its emission power to its default threshold value, thusreducing the RF radiation on the human body. The threshold of emission power can be set by the ATCommands. The definition for BodySar function is as follows:BodySar signalFunctionHigh/FloatingThe module keeps the default emission power.LowLower the maximum emission power to the threshold value of the module.3.8 Other InterfacesANT Tunable, and RF_GPO.PinPin NameI/OReset ValuePin DescriptionType9RFE_RFFE2_VIOPOPDRF LOGIC SWITCH1.8V10RFE_RFFE2_SCLKOPDReserved1.8V11RFE_RFFE2_SDATAI/OPDReserved1.8VPinPin NameI/OReset ValuePin DescriptionType4GPIO_RF1OPDRF LOGIC SWITCH2.3V5GPIO_RF2OPDRF LOGIC SWITCH2.3VThe RFFE port will be re-purposed to be GPO, with GPO1/GPO2, they can be used control externalDPDT, SPxT.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page34of424 RF Interface4.1 Operating BandThe L816-AM module provides main and diversity antenna interfaces; main antenna is used to transmitand receive RF signals, and the diversity antenna is only used to receive RF signals. The operating bandsof the antennas are as follows:OperatingBandDescriptionModeTx (MHz)Rx (MHz)Band 1IMT 2100MHzWCDMA1920 - 19802110 - 2170Band 2PCS 1900MHzLTE FDD/WCDMA/GSM1850 - 19101930 - 1990Band 3DCS 1800MHzGSM1710 - 17851805 - 1880Band 4AWS 1700MHzLTE FDD1710 - 17552110 - 2155Band 5CLR 850MHzWCDMA/GSM824 - 849869 - 894Band 6850MHzWCDMA830 - 840875 -885Band 8E-GSM 900MHzWCDMA/GSM880 - 915925 - 960Band 12Lower SMH/LSMHblocks A/B/CLTE FDD699 - 716729 - 7464.2 Transmitting PowerThe transmitting power for each band of the L816-AM module is as follows:ModeBandTx Power(dBm)NoteGPRS(1 slot Tx)GSM85032.5±1dBmGSM90032.5±1dBmDCS180029.5±1dBmPCS190029.5±1dBmWCDMABand I23±1dBmBand II23±1dBmBand V23±1dBmBand VI23±1dBm
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page35of42ModeBandTx Power(dBm)NoteBand VIII23±1dBmLTE FDDBand 223±1dBm10MHz Bandwidth, 1 RBBand 423±1dBm10MHz Bandwidth, 1 RBBand 1223±1dBm10MHz Bandwidth, 1 RB4.3 Receiver SensitivityThe receiver sensitivity for each band of the L816-AM module is as follows:ModeBandRx Sensitivity(dbm)-typicalNoteGPRSGSM850TBDBLER<10%GSM900TBDBLER<10%DCS1800TBDBLER<10%PCS1900TBDBLER<10%WCDMABand ITBDBER<0.1%Band IITBDBER<0.1%Band VTBDBER<0.1%Band VITBDBER<0.1%Band VIIITBDBER<0.1%LTE FDDBand 2TBD10MHz BandwidthBand 4TBD10MHz BandwidthBand 12TBD10MHz BandwidthNote:The above LTE values are measured for the Dual-Antenna situation (Main + Diversity). Forsingle main antenna (without Diversity), the sensitivity will drop around 3dBm for each band ofLTE. The WCDMA and GSM have not diversity function.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page36of424.4 RF PCB Design4.4.1 Trace Routing PrincipleThe L816-AM module supports dual antennas, which meets the requirements for LTE of 3GPP. TheMAIN_ANT is used to transmit and receive RF signals, while the DIV_ANT is used to receive RF signals.Using diversity antenna to improve the receiving sensitivity of RF antenna and double the download rate.Since L816-AM is an LTE module, dual antennas should be applied to meet the performancerequirements.The L816-AM module does not provide RF connector itself, so routing RF traces are required for theconnection with RF connectors or antenna feed points on the application mainboard. It is recommendedto use the microstrip line for RF trace, with the insertion loss controlled within 0.2dB and impedancecontrolled at 50Ω.It is recommended to reserve a π circuit (the parallel inductors should connect to the RF trace) betweenthe L816-AM module and the antenna connectors (or the feed points). The parallel devices are directlyacross the RF lines and no branch is allowed.Figure 4-1 L816-AM Antenna π Circuit4.4.2 RF Impedance DesignThe RF traces impedance of the antenna interface shall be controlled at 50Ω.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page37of424.5 Antenna Design4.5.1 Antenna Design RequirementsThe L816-AM module provides Main and Diversity antenna interfaces, and the antenna designrequirements are as follows：Main antenna requirements for L816-AM moduleFrequency rangeThe most proper antenna to adapt the frequencies should be used.Bandwidth(GPRS/EDGE）GSM850 : 70 MHzGSM900 : 80 MHzGSM1800(DCS) : 170 MHzGSM1900(PCS) : 140 MHzBandwidth (WCDMA)WCDMA band I(2100) : 250 MHzWCDMA band II(1900) : 140 MHzWCDMA band V(850) : 70 MHzWCDMA band VI(850): 55MHzWCDMA band VIII(900) : 80 MHzBandwidth (LTE)LTE band 2(1900): 140 MHzLTE Band 4(1700): 445 MHzLTE band 12(700): 50 MHzImpedance50 OhmInput power> 35dBm(2W) peak power GSM> 25dBm average power WCDMA & LTERecommendedstanding-wave ratio(SWR)≤ 2:1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page38of425 Structure Specification5.1 Product AppearanceThe product appearance for L816-AM module is shown in Figure 5-1:Figure 5-1 Module Appearance
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page39of425.2 Dimension of StructureThe structural dimension of the L816-AM module is shown in Figure 5-2:Figure 5-2 Dimension of Structure
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page40of425.3 Recommended Design for PCB Bonding PadRecommended Design for PCB Bonding Pad of the L816-AM module is shown in Figure 5-3Figure5-3 Recommended Design for PCB Bonding Pad (Unit: mm)
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page41of425.4 SMT PasterSMT Paster of the L816-AM module is shown in Figure Figure5-4Please refer to L816-AM SMT Application Design SpecificationStencil thickness≥0.12mmFigure5-4 Recommended Design for stencil (Unit: mm)
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L816-AM Hardware User Manual Page42of425.5 Storage5.5.1 Storage LifeStorage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is12 months.5.5.2 Workshop LifeFor the module integrated some components for “Class 3” humidity-sensitive ,the workshop life need24hours. After unpacking and under the environment with the room temperature of 23±5 ℃and therelative humidity of less than 60%, the reflow production or other high-temperature operations shall beconducted within 24 hours for products, or products shall be stored in the environment with the relativehumidity of less than 10%, in order to keep products dry.5.5.3 Recommended baking standards:Continuous baking time: 24 hours.Temperature: 125±5℃.Oven: Heat convection oven.Component tray can NOT be baked on high temperature, Need use high temperature tray baking5.6 PackingThe L816-AM module uses the tray sealed vacuum packing, combined with the outer packing methodusing the hard cartoon box, so that the storage, transportation and the usage of modules can be protectedto the greatest extent.Note:The vacuum package bag includes the humidity card and a desiccant. The module is thehumidity sensitive device, and the humidity sensitivity level is Class 3, which meets therequirements of the American Electronic Component Industry Association (JEDEC). Please readthe relevant application guidance and precautions referred to herein, to avoid the permanentdamage to the product caused by humidity.5.6.1 Tray PackagePlease read the L816-AM packing instructions of Fibocom company 《FIBOCOM-SAL-WI-63 L816-AM PackingInstruction A0》.

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