Fibocom Wireless L816AM LTE module User Manual ng
Fibocom Wireless Inc. LTE module ng
Users Manual
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 3156027 |
| Application ID | SfwiKUAarb0zL5qTNB+dWw== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 172.13kB (2151654 bits) |
| Date Submitted | 2016-10-05 00:00:00 |
| Date Available | 2017-04-04 00:00:00 |
| Creation Date | 2016-09-21 10:04:10 |
| Document Lastmod | 2016-09-27 15:08:52 |
| Document Title | ng |
| Document Creator | WPS Office |
| Document Author: | fangs |
L816-AM Hardware User Manual Version: 2.0.4 Update date: 2016.09.18 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 1 of 42 Applicability Table No. Product model Description L816-AM N/A Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 2 of 42 Copyright Copyright © 2016 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark The trademark is registered and owned by Fibocom Wireless Inc. Version Record Version Update Date Description V2.0.0 2016-04-28 Initial version V2.0.1 2016-07-19 Sections describe modifications V2.0.2 2016-07-26 Modified description V2.0.3 2016-07-28 Update part chart V2.0.4 2016-09-18 Add product certification of warnings Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 3 of 42 Contents 1 Foreword....................................................................................................................................... 6 1.1 Introduction........................................................................................................................................... 6 1.2 Reference Standard............................................................................................................................ 6 1.3 Related Documents............................................................................................................................. 6 2 Overview........................................................................................................................................7 2.1 Introduction........................................................................................................................................... 7 2.2 Specification..........................................................................................................................................7 2.3 Warnings............................................................................................................................................... 8 2.4 Application Framework..................................................................................................................... 11 2.5 Hardware Framework........................................................................................................................12 3 Application Interface................................................................................................................13 3.1 LGA Interface..................................................................................................................................... 13 3.1.1 Pin Distribution.............................................................................................................................. 13 3.1.2 Pin Definition.................................................................................................................................... 14 3.2 Power Supply..................................................................................................................................... 19 3.2.1 Power Supply................................................................................................................................... 19 3.2.2 Power Consumption........................................................................................................................21 3.3 Control Signal.....................................................................................................................................22 3.3.1 Module Start-up............................................................................................................................... 22 3.3.1.1 Start-up Circuit.............................................................................................................................22 3.3.1.2 Start-up Timing............................................................................................................................ 23 3.3.2 Module Shutdown............................................................................................................................24 3.3.3 Module Reset................................................................................................................................... 25 3.4 USB Interface..................................................................................................................................... 26 3.4.1 USB Interface Definition................................................................................................................. 26 3.4.2 USB Interface Application.............................................................................................................. 26 3.5 USIM Interface................................................................................................................................... 27 3.5.1 USIM Pins......................................................................................................................................... 27 3.5.2 USIM Interface Circuit.....................................................................................................................28 3.5.2.1 N.C. SIM Card Slot..................................................................................................................... 28 3.5.2.2 N.O. SIM Card Slot..................................................................................................................... 28 3.5.3 USIM Hot-Plugging..........................................................................................................................29 3.5.4 USIM Design.................................................................................................................................... 30 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 4 of 42 3.6 GPIO.................................................................................................................................................... 30 3.6.1 FW_Ready........................................................................................................................................ 31 3.6.2 SMS_Ready......................................................................................................................................31 3.6.3 Wakeup_Host...................................................................................................................................31 3.6.4 PA_Blanking..................................................................................................................................... 32 3.7 Interrupt Control................................................................................................................................. 32 3.7.1 W_Disable#...................................................................................................................................... 32 3.7.2 BodySar.............................................................................................................................................33 3.8 Other Interfaces................................................................................................................................. 33 4 RF Interface................................................................................................................................ 34 4.1 Operating Band.................................................................................................................................. 34 4.2 Transmitting Power............................................................................................................................34 4.3 Receiver Sensitivity........................................................................................................................... 35 4.4 RF PCB Design..................................................................................................................................36 4.4.1 Trace Routing Principle.................................................................................................................. 36 4.4.2 RF Impedance Design.................................................................................................................... 36 4.5 Antenna Design..................................................................................................................................37 4.5.1 Antenna Design Requirements..................................................................................................... 37 5 Structure Specification............................................................................................................38 5.1 Product Appearance..........................................................................................................................38 5.2 Dimension of Structure..................................................................................................................... 39 5.3 Recommended Design for PCB Bonding Pad.............................................................................. 40 5.4 SMT Paster.........................................................................................................................................41 5.5 Storage................................................................................................................................................ 42 5.5.1 Storage Life...................................................................................................................................... 42 5.5.2 Workshop Life.................................................................................................................................. 42 5.5.3 Recommended baking standards:................................................................................................42 5.6 Packing................................................................................................................................................42 5.6.1 Tray Package....................................................................................................................................42 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 5 of 42 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L816-AM-00 (hereinafter referred to as L816-AM). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L816-AM modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: 3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance specification 3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio transmission and reception (FDD);Part 1: Conformance specification 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT) 3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 1.3 Related Documents RF Antenna Application Design Specification FIBOCOM_L8 Family System Driver Integration and Application Guidance L816-AM AT Commands Manual L816-AM SMT Application Design Specification Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 6 of 42 2 Overview 2.1 Introduction The L816-AM module are highly integrated 4G wireless communication LGA modules, which supports LTE FDD/WCDMA/GSM systems (3 modes and 7 bands). 2.2 Specification Specification LTE FDD: Band Operating Band II,IV, XII WCDMA/HSPA+: Band I,II,V(VI),VIII GSM/GPRS/EDGE: 850/900/1800/1900MHz LTE FDD Rel.9, 10Mbps DL/5Mbps UL (Cat 1) Data WCDMA / HSDPA / UMTS:384 kbps DL/384 kbps UL Transmission HSUPA: HSDPA CAT 7:7.2 Mbps Down;HSUPA CAT 6:5.76 Mbps Up GPRS/EDGE GPRS:MSC 10, CS-4 80 Kbps Down/20Kbps Up Power Supply Temperature DC 3.3V～4.5V Operating: -10°C ～+55°C Storage: -40°C ～+85°C Package: LGA 115 pins Physical characteristics Dimension:30.0 x 21.0 x 1.55mm Weight:~2.4g Interfaces Antenna WWAN Main Antenna x 1 WWAN Diversity Antenna x 1 USIM 3V/1.8V USB 2.0 x 1 Function Interface EINT, GPIO USIM x 1 RF MIPI,RF GPO Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 7 of 42 Software AT commands 3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands Firmware update USB 2.3 Warnings 2.3.1 CE Statement EU Regulatory Conformance: Hereby, We, FIBOCOM Wireless Inc. declares that this device L816-AM is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. CE 0560 R&TTE Regulation: In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2 requirements. The maximum antenna gain for frequency 900 is 3dBi; for frequency 1800 is 5dBi and the antenna separation distance is 20cm. 2.3.2 FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 8 of 42 installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 5dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 9 of 42 End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: ZMOL816AM and IC:21374-L816AM”. The grantee's FCC ID & IC ID can be used only when all FCC&IC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 2.3.3 IC Statement Industry Canada statement This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: 1) this device may not cause interference, and 2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1) l'appareil ne doit pas produire de brouillage, et 2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this device does not cause harmful interference. Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la condition que cet appareil ne provoque aucune interférence nuisible. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter, except tested built-in radios. Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées. The County Code Selection feature is disabled for products marketed in the US/ Canada. La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux États-Unis et au Canada. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 10 of 42 Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. 2.4 Application Framework The peripheral applications for L816-AM module are shown in Figure 2-1: Figure2-1 Application Framework Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 11 of 42 2.5 Hardware Framework The hardware framework in Figure 2-2 shows the main hardware functions of L816-AM module, including base band and RF functions. Baseband contains the followings: GSM/UMTS/LTE FDD controller/Power supply NAND+LPDDR2 RAM Application interface RF contains the followings: RF Transceiver RF Power/PA RF Front End RF Filter Figure 2-2 Hardware Framework Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 12 of 42 3 Application Interface 3.1 LGA Interface The L816-AM module applies LGA packaging, with a total of 115 pins. 3.1.1 Pin Distribution Figure 3-1 Pin Map (TOP Perspective View) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 13 of 42 3.1.2 Pin Definition The L816-AM pin definition is as follows: Pin Pin Name I/O 13 USB_DP I/O 14 USB_DN I/O 15 VBUS PI 17 SIM1_DATA I/O 18 SIM1_RST 19 Reset Pin Description Type USB Data Positive 0.3---3V USB Data Negative 0.3---3V USB VBUS Supply 2.0---5.25V USIM data, internal 4.7KΩ pull-up 1.8V/3V USIM reset 1.8V/3V SIM1_CLK USIM clock 1.8V/3V 20 VSIM1 PO USIM power supply 1.8V/3V 26 SIM1_CD 31 Wakeup_Modem PD Reserved CMOS 1.8V 40 W_Disable# PD Disable WWAN CMOS 1.8V 27 BodySar PD Body SAR detection CMOS 1.8V 28 FW_Ready PD FW_Ready output CMOS 1.8V 29 SMS_Ready PD SMS_Ready output CMOS 1.8V 30 USB_En/Disable PD Enable_Disable-USB Signal Output CMOS 1.8V 33 PA_Blanking PD PA_Blanking output CMOS 1.8V 42 GPIO_Modem I/O PD Reserved CMOS 1.8V 39 Wakeup_Host PD Wakeup_Host output 61 Main_ANT I/O Main antenna 68 DIV_ANT Diversity antenna Value USB2.0 SIM USIM card detection with 390KΩ pullup, active high 1.8V EINT GPIO ANT ANT Tunable Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 14 of 42 Pin Pin Name I/O RFE_RFFE2_VIO 10 11 Reset Pin Description Type PO RFFE2 VIO for tunable ANT 1.8V RFE_RFFE2_SCLK Reserved 1.8V RFE_RFFE2_SDATA I/O Reserved 1.8V GPIO_RF1 RF_GPIO_1 2.3V GPIO_RF2 RF_GPIO_2 2.3V ASM_2V5 PO ASM_2V5 2.5V Module reset input with 100KΩ pull-up 1.8V Value RF GPO Module Control 32 Reset_N Module power on/off signal. 41 Power_On/Off Advise the customer to increase the 200KΩ pull-down 1.8V 45 VBAT_BB PI Power input Power supply 46 VBAT_PA PI Power input Power supply 47 VBAT_PA PI Power input Power supply 48 VBAT_TR PI Power input Power supply GND GND Ground GND GND Ground GND GND Ground GND GND Ground GND GND Ground 12 GND GND Ground 16 GND GND Ground 21 GND GND Ground 22 GND GND Ground 23 GND GND Ground 24 GND GND Ground Power GND Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 15 of 42 Pin Pin Name I/O 25 GND 34 GND 35 Reset Pin Description Type GND Ground GND Ground GND GND Ground 36 GND GND Ground 37 GND GND Ground 38 GND GND Ground 43 GND GND Ground 44 GND GND Ground 49 GND GND Ground 50 GND GND Ground 51 GND GND Ground 52 GND GND Ground 53 GND GND Ground 54 GND GND Ground 55 GND GND Ground 56 GND GND Ground 57 GND GND Ground 58 GND GND Ground 59 GND GND Ground 60 GND GND Ground 62 GND GND Ground 63 GND GND Ground 64 GND GND Ground 65 GND GND Ground 66 GND GND Ground 67 GND GND Ground 69 GND GND Ground 70 GND GND Ground Value Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 16 of 42 Pin Pin Name I/O TG1 GND TG2 GND TG3 Reset Pin Description Type Thermal Ground Ground Thermal Ground Ground GND Thermal Ground Ground TG4 GND Thermal Ground Ground TG5 GND Thermal Ground Ground TG6 GND Thermal Ground Ground TG7 GND Thermal Ground Ground TG8 GND Thermal Ground Ground TG9 GND Thermal Ground Ground TG10 GND Thermal Ground Ground TG11 GND Thermal Ground Ground TG12 GND Thermal Ground Ground TG13 GND Thermal Ground Ground TG14 GND Thermal Ground Ground TG15 GND Thermal Ground Ground TG16 GND Thermal Ground Ground TG17 GND Thermal Ground Ground TG18 GND Thermal Ground Ground TG19 GND Thermal Ground Ground TG20 GND Thermal Ground Ground TG21 GND Thermal Ground Ground TG22 GND Thermal Ground Ground TG23 GND Thermal Ground Ground TG24 GND Thermal Ground Ground TG25 GND Thermal Ground Ground TG26 GND Thermal Ground Ground TG27 GND Thermal Ground Ground TG28 GND Thermal Ground Ground Value Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 17 of 42 Pin Pin Name I/O TG29 GND TG30 GND TG31 Reset Pin Description Type Thermal Ground Ground Thermal Ground Ground GND Thermal Ground Ground TG32 GND Thermal Ground Ground TG33 GND Thermal Ground Ground TG34 GND Thermal Ground Ground TG35 GND Thermal Ground Ground TG36 GND Thermal Ground Ground TG37 GND Thermal Ground Ground TG38 GND Thermal Ground Ground TG39 GND Thermal Ground Ground TG40 GND Thermal Ground Ground TG41 GND Thermal Ground Ground TG42 GND Thermal Ground Ground TG43 GND Thermal Ground Ground TG44 GND Thermal Ground Ground TG45 GND Thermal Ground Ground H: High Voltage Level L: Low Voltage Level Value PD: Pull-Down PU: Pull-Up T: Tri-State OD: Open Drain PP: Push-Pull PI: Power Input PO: Power Output Note: The unused pins can be left floating. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 18 of 42 3.2 Power Supply The power interface for L816-AM module is as follows: DC Parameters （V） Pin Pin Name I/O Pin Description 45 VBAT_BB PI 46 VBAT_PA PI 47 VBAT_PA PI 48 VBAT_TR PI 15 VBUS PI USB power supply 20 VSIM1 PO SIM1 power supply 3.2.1 Power input to BB Power input to RF PA DC-DC Power input to RF PA DC-DC Power input to transceiver Minimum Typical Maximum Value Value Value 3.3 3.8 4.5 3.3 3.8 4.5 3.3 3.8 4.5 3.3 3.8 4.5 2.0 3.8 5.25 1.8V/3V Power Supply The L816-AM module should be powered through the VBAT pins, and the power supply design is shown in Figure 3-2: Figure 3-2 Power Supply Design Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 19 of 42 The filter capacitor design for power supply is shown in the following table: Recommended capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR 220uF x 2 Voltage-stabilizing capacitors LDO or DC/DC power supply requires the capacitor of no less than 440uF The capacitor for battery power supply can be reduced to 100～220uF Filter out the interference generated from the 1uF,100nF Digital signal noise 39pF,33pF 850/900 MHz frequency band Filter out low frequency band RF interference 1800/1900,2100MHz frequency Filter out medium/high frequency band RF band interference 18pF,8.2pF,6.8pF clock and digital signals The stable power supply can ensure the normal operation of L816-AM module; and the ripple of the power supply should be less than 165mV in design. When the module operates under GSM mode (Burst transmit), the maximum operating current can reach 2A, so the power source should be not lower than 3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3: Figure 3-3 Power Supply Limit Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 20 of 42 3.2.2 Power Consumption In the case of 3.8V power supply, the power consumption for L816-AM module is shown in the following table: Parameter Mode Condition Average Current(mA) Ioff IIdle Power off Power supply, module power off TBD GPRS MFRMS=5 TBD WCDMA DRX=8 TBD LTE FDD DRX=8 TBD Radio Off AT+CFUN=4, Flight mode TBD MFRMS=2 TBD MFRMS=5 TBD MFRMS=9 TBD DRX=6 TBD DRX=8 TBD DRX=9 TBD LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) TBD Radio Off AT+CFUN=4,Flight mode TBD GPRS Data transfer GSM850; PCL=5; 1Rx/2Tx TBD GPRS Data transfer GSM900; PCL=5; 1Rx/2Tx TBD GPRS Data transfer DCS1800; PCL=0; 1Rx/2Tx TBD GPRS Data transfer PCS1900; PCL=0; 1Rx/2Tx TBD EDGE Data transfer GSM850; PCL=8; 1Rx/2Tx TBD EDGE Data transfer GSM900; PCL=8; 1Rx/2Tx TBD EDGE Data transfer DCS1800; PCL=2; 1Rx/2Tx TBD EDGE Data transfer PCS1900; PCL=2; 1Rx/2Tx TBD WCDMA Data transfer Band I @+23dBm TBD WCDMA Data transfer Band II @+23dBm TBD GPRS ISleep WCDMA GPRS IGPRS-RMS CS4 1Rx slot nTX slot IEGPRS-RMS EDGE MCS9 IWCDMA-RMS WCDMA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 21 of 42 Parameter Mode Condition Average Current(mA) ILTE-RMS LTE FDD WCDMA Data transfer Band V(VI) @+23dBm TBD WCDMA Data transfer Band VIII @+23dBm TBD LTE FDD Data transfer Band 2 @+23dBm TBD LTE FDD Data transfer Band 4 @+23dBm TBD LTE FDD Data transfer Band 12 @+23dBm TBD 3.3 Control Signal The L816-AM module provides two control signals to execute the power on/off and reset operations, the pin definition is as follows: Pin Pin Name I/O Reset Value Functions Type Power on/off signal with internal 200KΩ 41 Power_On/Off pull-down. 1.8V High: Power on Low or floating: Power off 32 Reset_N 3.3.1 Reset signal with 100KΩ internal 1.8V pull-up, active low. Module Start-up 3.3.1.1 Start-up Circuit The VRTC output from the module can be used as the pull up voltage and the module has two start-up modes: AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure 3-4: Automatically start-up when powered on, and the circuit design is shown in Figure 3-5: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 22 of 42 Figure 3-4 Circuit for Module Start-up Controlled by AP Figure 3-5 Circuit for Automatic Start-up 3.3.1.2 Start-up Timing After powering on, the module will start-up by pulling up the Power_On/Off signal for more than 20ms (100ms is recommended).The start-up timing is shown in Figure 3-6: Figure 3-6 Timing Control for Start-up Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 23 of 42 Note: The Reset_N is required to pull high with a 1s delay after the VBAT, because it takes some time to charge the capacitors for +3.3V power supply. If the VBAT power supply is already stable before starting up the module, the delay time can be ignored. 3.3.2 Module Shutdown The L816-AM module can be shut down by software or hardware control. Control mode Software Hardware Action Condition Sending AT+CPWROFF command Pull down Power_On/Off pin Normal shutdown. Only used when a hardware exception occurs and the software control cannot be used. The module can be shut down by sending AT+CPWROFF command. When the module receives the shutdown command, the module will plug Low the FW_Ready and start the finalization process (the reverse process of initialization), and it will be completed after 3s. In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and PMU will be powered off. The control timing is shown in Figure 3-7: Figure 3-7 Software Shutdown Timing Control After the software shutdown, the Power_On/Off pin will remain high which prevents the module from restarting again. To enable the next restart, the Power_On/Off pin should be pulled low after shutting down. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 24 of 42 3.3.3 Module Reset The L816-AM module can reset to its initial status by pulling down the Reset_N signal for more than 10ms (100ms is recommended), and the module will restart after the Reset_N signal is released. When the customer executes Reset_N function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-8: Figure 3-8 Recommended Design for Reset Circuit The reset control timing is shown in Figure 3-9: Figure 3-9 Reset Timing Control Note: Reset_N is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In case of PCB layout, the Reset_N signal lines should keep away from the RF interference and protected by GND. Also, the Reset_N signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD problems. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 25 of 42 3.4 USB Interface The L816-AM module supports USB 2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-Speed (12 Mbit/s). For the USB timing and electrical specification of L816-AM module, please refer to “Universal Serial Bus Specification 2.0”. 3.4.1 USB Interface Definition Pin Pin Name I/O 15 VBUS PI 14 USB_DN IO 13 USB_DP IO Reset Value Pin Description Type USB power supply 2.0---5.25V USB Data Negative 0.3---3V USB Data Positive 0.3---3V The VBUS power supply is used as the detection of the USB port; after VBUS is powered on, the USB function of the module will be enabled and the enumeration will begin. The VBUS pin is only used for the detection of USB port, and the supply current is about 1mA. When USB_DN & USB_DP are disconnected, the module will not enter sleep mode for the case if VBUS power is supplied. The USB driver will map 3 COM ports and 4 NCM ports, which are described as follows: 2 COM ports are used to send AT Commands. 1 COM port is used to capture LOG information with debugging softwares. 4 NCM ports are virtual network ports, which are used to initiate the data service. Note: One COM port can be used as the Modem COM port to initiate the data service. Since the speed of the Modem COM port is not sufficient for the 150 Mbps peak downlink speed requirement for LTE, so it is not recommended to be used. 3.4.2 USB Interface Application The reference circuit is shown in Figure 3-10: Figure 3-10 Reference Circuit for USB Interface Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 26 of 42 Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_DN/DP differential signal lines, it is recommended to use 0.5pF TVS diodes. There is no special requirement for TVS diodes on VBUS pin, normally the 8 ~ 10pF TVS diodes can be used. USB_DN and USB_DP are high speed differential signal lines with the maximum transfer rate of 480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout: USB_DN and USB_DP signal lines should have the differential impedance of 90 ohms. USB_DN and USB_DP signal lines should be parallel and have the equal length, the right angle routing should be avoided. USB_DN and USB_DP signal lines should be routed on the layer that is next to the ground layer, and be wrapped with GND on both sides and layers. 3.5 USIM Interface The L816-AM module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM Pins The USIM pins are described as follows: Pin Pin Name I/O 20 VSIM1 PO 18 SIM1_RST 19 SIM1_CLK 17 SIM1_DATA Reset Value Pin Description Type USIM power supply 1.8V/3V USIM reset 1.8V/3V USIM clock 1.8V/3V I/O USIM data with internal 4.7KΩ pull-up 1.8V/3V USIM card detection with 390KΩ pull up. 26 SIM1_CD Active-high, and high level means SIM 1.8V card is inserted; and low level means SIM card is detached. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 27 of 42 3.5.2 USIM Interface Circuit 3.5.2.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-11: Figure 3-11 Reference Circuit for N.C. SIM Card Slot The principles for N.C. SIM card slot design are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM1_CD pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM1_CD pin high. Suggested SIM1_CD pin increase TVS to protect the pin. 3.5.2.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-12: Figure 3-12 Reference Circuit for N.O. SIM Card Slot Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 28 of 42 The principles for N.O. SIM card slot design are described as follows: When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM1_CD pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM1_CD pin high. Suggested SIM1_CD pin increase TVS to protect the pin. 3.5.3 USIM Hot-Plugging The L816-AM module supports the SIM card hot-plugging detection function, which determines whether the SIM card is inserted or detached by detecting the SIM1_CD pin state of the SIM card slot. The SIM card hot-plugging detection function can be configured by “AT+MSMPD” command, and the description for AT command is as follows: AT Command Hot-plugging Detection Function Description Default value, the SIM card hot-plugging detection AT+MSMPD=1 Enable function is enabled. The module can detect whether the SIM card is inserted or not through the SIM1_CD pin state. The SIM card hot-plugging detection function is disabled. AT+MSMPD=0 Disable The module reads the SIM card when starting up, and the SIM1_CD status will not be detected. After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is inserted when the SIM1_CD pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM1_CD pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note: By default, SIM1_CD is active-high, which can be switched to active-low by the AT command. Please refer to the AT Commands Manual for the AT command. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 29 of 42 3.5.4 USIM Design The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in case of design: The SIM card slot placement should near the module as close as possible, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The SIM1_CLK and SIM1_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.6 GPIO The L816-AM module provides four signals to indicate the operating status of the module, the status indicator pins are as follows: Pin Pin Name I/O Reset Value Pin Description Type 28 FW_Ready PD 29 SMS_Ready PD 30 USB_En/Disable PD Reserved CMOS 1.8V 39 Wakeup_Host PD Module wakes up Host (AP). CMOS 1.8V 33 PA_Blanking PD 42 GPIO_Modem PD Modem SMS Ready Inform HOST 1.8V Modem FW Ready Inform HOST 1.8V PA Blanking output, external GPS control signal. Reserved CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 30 of 42 3.6.1 FW_Ready Firmware ready is a modem driven GPIO, which on power on reset, it should be low. Once the firmware in the modem is ready after boot, it should assert (high) GPIO. In an unlikely event of a firmware/modem crash, if a crash/exception handler is to be run, FW ready GPIO should be de-asserted. FW_Ready timing is shown in Figure 3-6，3-7，3-9。 3.6.2 SMS_Ready SMS ready is a modem driven GPIO, which should be low while power up/off and reset sequences. Whenever modem receives an SMS from the network, it should assert (high) GPIO during 100msec, then de-assert (low). SMS ready GPIO should be triggered by non-class 2 “SIM card data” messages regardless message storage status (even the storage is full and not be able to store new received message). SMS_Ready timing is shown in Figure 3-13: Figure 3-13 SMS_Ready Timing 3.6.3 Wakeup_Host The Wakeup_Host signal is used to wake the Host (AP) when there is an incoming call, SMS or other data requests. The definition of Wakeup_Host signal is as follows: Operating Mode Wakeup_Host Signal Ringing /SMS or data requests Pull high 100ms then pull low (pulse signal). Idle/Sleep low level Wakeup_Host timing is shown in Figure 3-14: Figure 3-14 Wakeup_Host Timing Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 31 of 42 3.6.4 PA_Blanking While the module works in GSM frequency band, the PA_Blanking pin will output the pulse signals that synchronize with the GSM burst TX timing. As the GSM TX may interfere the receiving of the GPS signal, AP can disable GPS or stop receiving GPS data when it detects the PA_Blanking pulse signals, to avoid GPS working abnormally. Operating modes PA_BLANKING signal Default Low level GSM burst TX Output the pulse signals that synchronize with the GSM burst TX. PA_BLANKING timing is shown in Figure 3-15: Figure 3-15 3.7 PA_Blanking Timing Interrupt Control The L816-AM module provides four interrupt signals, and the pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type 31 Wakeup_Modem PD Reserved CMOS 1.8V 40 W_Disable# PD Enable/Disable RF network CMOS 1.8V 27 BodySar PU Body SAR detection CMOS 1.8V 3.7.1 W_Disable# The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_Disable# signal is as follows: W_Disable# signal Function High/Floating WWAN enable, the module exits the Flight mode. Low WWAN disable, the module enters Flight mode. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 32 of 42 3.7.2 BodySar The L816-AM module supports the BodySar detection function. The voltage level is high by default for BodySar, and when the SAR sensor detects the closing human body, the BodySar signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition for BodySar function is as follows: BodySar signal Function High/Floating The module keeps the default emission power. Low Lower the maximum emission power to the threshold value of the module. 3.8 Other Interfaces ANT Tunable, and RF_GPO. Pin Pin Name I/O RFE_RFFE2_VIO PO 10 RFE_RFFE2_SCLK 11 Reset Value Pin Description Type PD RF LOGIC SWITCH 1.8V PD Reserved 1.8V RFE_RFFE2_SDATA I/O PD Reserved 1.8V Pin Pin Name I/O Pin Description Type GPIO_RF1 PD RF LOGIC SWITCH 2.3V GPIO_RF2 PD RF LOGIC SWITCH 2.3V Reset Value The RFFE port will be re-purposed to be GPO, with GPO1/GPO2, they can be used control external DPDT, SPxT. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 33 of 42 4 RF Interface 4.1 Operating Band The L816-AM module provides main and diversity antenna interfaces; main antenna is used to transmit and receive RF signals, and the diversity antenna is only used to receive RF signals. The operating bands of the antennas are as follows: Operating Description Mode Tx (MHz) Rx (MHz) Band 1 IMT 2100MHz WCDMA 1920 - 1980 2110 - 2170 Band 2 PCS 1900MHz LTE FDD/WCDMA/GSM 1850 - 1910 1930 - 1990 Band 3 DCS 1800MHz GSM 1710 - 1785 1805 - 1880 Band 4 AWS 1700MHz LTE FDD 1710 - 1755 2110 - 2155 Band 5 CLR 850MHz WCDMA/GSM 824 - 849 869 - 894 Band 6 850MHz WCDMA 830 - 840 875 -885 Band 8 E-GSM 900MHz WCDMA/GSM 880 - 915 925 - 960 LTE FDD 699 - 716 729 - 746 Band Lower SMH/LSMH Band 12 4.2 blocks A/B/C Transmitting Power The transmitting power for each band of the L816-AM module is as follows: Mode Band Tx Power(dBm) GSM850 32.5±1dBm GPRS GSM900 32.5±1dBm (1 slot Tx) DCS1800 29.5±1dBm PCS1900 29.5±1dBm WCDMA Band I 23±1dBm Band II 23±1dBm Band V 23±1dBm Band VI 23±1dBm Note Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 34 of 42 Mode Band LTE FDD 4.3 Tx Power(dBm) Note Band VIII 23±1dBm Band 2 23±1dBm 10MHz Bandwidth, 1 RB Band 4 23±1dBm 10MHz Bandwidth, 1 RB Band 12 23±1dBm 10MHz Bandwidth, 1 RB Receiver Sensitivity The receiver sensitivity for each band of the L816-AM module is as follows: Mode Band GPRS WCDMA LTE FDD Rx Sensitivity(dbm)-typical Note GSM850 TBD BLER<10% GSM900 TBD BLER<10% DCS1800 TBD BLER<10% PCS1900 TBD BLER<10% Band I TBD BER<0.1% Band II TBD BER<0.1% Band V TBD BER<0.1% Band VI TBD BER<0.1% Band VIII TBD BER<0.1% Band 2 TBD 10MHz Bandwidth Band 4 TBD 10MHz Bandwidth Band 12 TBD 10MHz Bandwidth Note: The above LTE values are measured for the Dual-Antenna situation (Main + Diversity). For single main antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE. The WCDMA and GSM have not diversity function. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 35 of 42 4.4 RF PCB Design 4.4.1 Trace Routing Principle The L816-AM module supports dual antennas, which meets the requirements for LTE of 3GPP. The MAIN_ANT is used to transmit and receive RF signals, while the DIV_ANT is used to receive RF signals. Using diversity antenna to improve the receiving sensitivity of RF antenna and double the download rate. Since L816-AM is an LTE module, dual antennas should be applied to meet the performance requirements. The L816-AM module does not provide RF connector itself, so routing RF traces are required for the connection with RF connectors or antenna feed points on the application mainboard. It is recommended to use the microstrip line for RF trace, with the insertion loss controlled within 0.2dB and impedance controlled at 50Ω. It is recommended to reserve a π circuit (the parallel inductors should connect to the RF trace) between the L816-AM module and the antenna connectors (or the feed points). The parallel devices are directly across the RF lines and no branch is allowed. Figure 4-1 L816-AM Antenna π Circuit 4.4.2 RF Impedance Design The RF traces impedance of the antenna interface shall be controlled at 50Ω. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 36 of 42 4.5 Antenna Design 4.5.1 Antenna Design Requirements The L816-AM module provides Main and Diversity antenna interfaces, and the antenna design requirements are as follows： Main antenna requirements for L816-AM module Frequency range The most proper antenna to adapt the frequencies should be used. GSM850 : 70 MHz Bandwidth GSM900 : 80 MHz (GPRS/EDGE） GSM1800(DCS) : 170 MHz GSM1900(PCS) : 140 MHz WCDMA band I(2100) : 250 MHz WCDMA band II(1900) : 140 MHz Bandwidth (WCDMA) WCDMA band V(850) : 70 MHz WCDMA band VI(850): 55MHz WCDMA band VIII(900) : 80 MHz Bandwidth (LTE) Impedance Input power LTE band 2(1900): 140 MHz LTE Band 4(1700): 445 MHz LTE band 12(700): 50 MHz 50 Ohm > 35dBm(2W) peak power GSM > 25dBm average power WCDMA & LTE Recommended standing-wave ratio ≤ 2:1 (SWR) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 37 of 42 5 Structure Specification 5.1 Product Appearance The product appearance for L816-AM module is shown in Figure 5-1: Figure 5-1 Module Appearance Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 38 of 42 5.2 Dimension of Structure The structural dimension of the L816-AM module is shown in Figure 5-2: Figure 5-2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 39 of 42 5.3 Recommended Design for PCB Bonding Pad Recommended Design for PCB Bonding Pad of the L816-AM module is shown in Figure 5-3 Figure5-3 Recommended Design for PCB Bonding Pad (Unit: mm) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 40 of 42 5.4 SMT Paster SMT Paster of the L816-AM module is shown in Figure Figure5-4 Please refer to L816-AM SMT Application Design Specification Stencil thickness≥0.12mm Figure5-4 Recommended Design for stencil (Unit: mm) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 41 of 42 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%. Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is 12 months. 5.5.2 Workshop Life For the module integrated some components for “Class 3” humidity-sensitive ,the workshop life need 24hours. After unpacking and under the environment with the room temperature of 23±5 ℃ and the relative humidity of less than 60%, the reflow production or other high-temperature operations shall be conducted within 24 hours for products, or products shall be stored in the environment with the relative humidity of less than 10%, in order to keep products dry. 5.5.3 Recommended baking standards: Continuous baking time: 24 hours. Temperature: 125±5℃. Oven: Heat convection oven. Component tray can NOT be baked on high temperature, Need use high temperature tray baking 5.6 Packing The L816-AM module uses the tray sealed vacuum packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Note: The vacuum package bag includes the humidity card and a desiccant. The module is the humidity sensitive device, and the humidity sensitivity level is Class 3, which meets the requirements of the American Electronic Component Industry Association (JEDEC). Please read the relevant application guidance and precautions referred to herein, to avoid the permanent damage to the product caused by humidity. 5.6.1 Tray Package Please read the L816-AM packing instructions of Fibocom company 《FIBOCOM-SAL-WI-63 L816-AM Packing Instruction A0》. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L816-AM Hardware User Manual Page 42 of 42
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.7 Linearized : No XMP Toolkit : Adobe XMP Core 5.6-c015 84.158975, 2016/02/13-02:40:29 Format : application/pdf Creator : fangs Description : Title : ng Comments : Company : Source Modified : D:20160921100410+02'04' Create Date : 2016:09:21 10:04:10+02:00 Creator Tool : WPS Office Modify Date : 2016:09:27 15:08:52+08:00 Metadata Date : 2016:09:27 15:08:52+08:00 Keywords : Producer : Document ID : uuid:19a8525b-a58d-443e-9763-ec3b4ae7ab16 Instance ID : uuid:2d23bc08-1dc9-4ded-a385-e9b2f8b23d29 Page Count : 42 Author : fangs Subject : Trapped : falseEXIF Metadata provided by EXIF.tools