Flir BelgiumBA AX905 WiFi and Bluetooth module User Manual

Raymarine UK Ltd. WiFi and Bluetooth module

Contents

User manual

AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 正基科技股份有限公司 SPECIFICATION SPEC. NO.： REV： 1.4 DATE： 01.08. 2016 PRODUCT NAME： AP6212 Customer APPROVED Company Representative Signature REVIEW PREPARED PM QA APPROVED DCC ISSUE SPEC-W-014BethAnnaCarolRichard2016.01.20AMPAKD.C.C PUBLISH
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A AMPAK AP6212 WiFi+Bluetooth 4.0+FM RX SIP Module Spec Sheet
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 1Revision History Date Revision Content Revised By Version2014/04/08 - Preliminary Brian 1.0 2014/09/02 - Pin Definition Modified Brian 1.1 2014/11/26 - Bluetooth Spec Modified Brian 1.2 2014/12/26 - Add Process Brian 1.3 2016/01/08 - Add Reflow Suggestion and MLS Beth 1.4
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 2Contents Contents ................................................................................................................... 2 1. Introduction......................................................................................................... 3 2. Features............................................................................................................... 4 3. Deliverables ........................................................................................................ 5 3.1 Deliverables.................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification......................................................................................... 6 4.1 General Specification...................................................................................... 6 4.2 Voltages.......................................................................................................... 6 4.2.1 Absolute Maximum Ratings.................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 5. WiFi RF Specification......................................................................................... 7 5.1 2.4GHz RF Specification................................................................................. 7 6. Bluetooth Specification...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. FM Specification............................................................................................... 10 7.1 FM Specification (TBD)................................................................................. 10 8. Pin Assignments............................................................................................... 11 8.1 Pin Outline .................................................................................................... 11 8.2 Pin Definition ................................................................................................ 11 9. Dimensions ....................................................................................................... 13 9.1 Physical Dimensions..................................................................................... 13 9.2 Layout Recommendation.............................................................................. 14 10. External clock reference .................................................................................. 15 10.1 SDIO Pin Description.................................................................................. 15 11. Host Interface Timing Diagramo...................................................................... 16 11.1 Power-up Sequence Timing Diagram ......................................................... 16 11.2 SDIO Default Mode Timing Diagram........................................................... 18 11.3 SDIO High Speed Mode Timing Diagram.................................................... 19 12. Recommended Reflow Profile......................................................................... 20 Solder Paste definition.......................................................................................... 2113. Package Information........................................................................................ 23 13.1Label .......................................................................................................... 23 Label C Inner box label . .................................................................................... 23Label D Carton box label . ................................................................................. 2313.2 Dimension ................................................................................................. 24 13.3 MSL Level / Storage Condition ................................................................... 26
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 31. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi, Bluetooth and FM functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets, FM radio functional applications and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth and UART / I2S / PCM interface for FM. This compact module is a total solution for a combination of WiFi + BT + FM technologies. The module is specifically developed for Smart phones and Portable devices.
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 42. Features  802.11b/g/n single-band radio  Bluetooth V4.0(HS) with integrated Class 1.5 PA and Low Energy (BLE) support  Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operation  Simultaneous BT/WLAN receive with single antenna  WLAN host interface options: - SDIO v2.0 — up to 50 MHz clock rate  BT host digital interface: - UART (up to 4 Mbps)  FM multiple audio routing options: I2S, PCM, eSCO, A2DP  IEEE Co-existence technologies are integrated die solution  ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives A simplified block diagram of the module is depicted in the figure below.
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 53. Deliverables 3.1 Deliverables The following products and software will be part of the product.  Module with packaging  Evaluation Kits  Software utility for integration, performance test.  Product Datasheet.  Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 64. General Specification 4.1 General Specification 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description Min. Max. UnitVBAT Input supply Voltage -0.5 5.5 V WL_VIO_SD Digital/Bluetooth/SDIO/ I/O Voltage -0.5 3.6 V 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Typ. Max. Unit Operating Temperature -30 25 85 deg.CVBAT 3.0 3.6 4.8 V VDDIO 1.7 3.3 3.6 V Model Name AP6212 Product Description Support WiFi/Bluetooth/FM functionalities Dimension L x W x H: 12 x 12 x 1.5 (typical) mm WiFi Interface SDIOV2.0 BT Interface UART / PCM FM Interface UART / PCM / Audio Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 75. WiFi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11b/g/n, WiFi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB Output Power 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM  -28dB - MCS=0 PER @ -85 dBm, typical - MCS=1 PER @ -84 dBm, typical - MCS=2 PER @ -82 dBm, typical - MCS=3 PER @ -80 dBm, typical - MCS=4 PER @ -77 dBm, typical - MCS=5 PER @ -73 dBm, typical - MCS=6 PER @ -71 dBm, typical Receive Sensitivity (11n,20MHz) @10% PER - MCS=7 PER @ -68 dBm, typical - 6Mbps PER @ -86 dBm, typical - 9Mbps PER @ -85 dBm, typical - 12Mbps PER @ -85 dBm, typical - 18Mbps PER @ -83 dBm, typical - 24Mbps PER @ -81 dBm, typical - 36Mbps PER @ -78 dBm, typical - 48Mbps PER @ -73 dBm, typical Receive Sensitivity (11g) @10% PER - 54Mbps PER @ -71 dBm, typical - 1Mbps PER @ -90 dBm, typical - 2Mbps PER @ -88 dBm, typical - 5.5Mbps PER @ -87 dBm, typical Receive Sensitivity (11b) @8% PER - 11Mbps PER @ -84 dBm, typical 802.11b : 1, 2, 5.5, 11Mbps Data Rate 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 8Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm Maximum Input Level 802.11g/n : -20 dBm Antenna Reference Small antennas with 0~2 dBi peak gain
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 96. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402MHz ~ 2480MHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK RF Specification Min. Typical. Max. Output Power (Class 1.5) 9 dBm Sensitivity @ BER=0.1% for GFSK (1Mbps) -86 dBm Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) -86 dBm Sensitivity @ BER=0.01% for 8DPSK (3Mbps) -80 dBm GFSK (1Mbps):-20dBm π/4-DQPSK (2Mbps) :-20dBm Maximum Input Level 8DPSK (3Mbps) :-20dBm
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 107. FM Specification 7.1 FM Specification (TBD) Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Frequency Band 76MHz-108MHz Host Interface HCI UART, I2S/PCM Channel step 50 KHz Analog Audio output load RL>30KΩ, CL>20pF Characteristics Condition MIN TYP MAX UNITOutput Power Level dBuVAudio harmonic distortion (fmod=1KHz, △f=75KHz, Pilot △f=6.75KHz) % MONO Transmitter (FM Tx load = 120nH, Q>30) Audio SNR (△f=22.5KHz, I2S audio in SNR ≧57dB ) Stereo dB RDS Sensitivity dBmfmod=1KHz Audio harmonic distortion (Vin=1mV, △f=75KHz) fmod=3KHz % MONO Maximum SNR △(fmod=1KHz, f=22.5KHz, BW=300Hz to 15KHz) Stereo dB Receiver (FM Tx Antenna = 120nH, Q>30) RF input power level dBuV
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 118. Pin Assignments 8.1 Pin Outline < TOP VIEW > 8.2 Pin Definition NO Name Type Description 1 GND － Ground connections 2 WL_BT_ANT I/O RF I/O port 3 GND － Ground connections 4 FM_RX I FM radio RF input antenna port 5 NC － Floating (Don’t connected to ground) 6 BT_WAKE I HOST wake-up Bluetooth device 7 BT_HOST_WAKE O Bluetooth device to wake-up HOST 8 NC － Floating (Don’t connected to ground) 9 VBAT P Main power voltage source input 10 XTAL_IN I Crystal input 11 XTAL_OUT O Crystal output 12 WL_REG_ON I Internal regulators power enable/disable 13 WL_HOST_WAKE O WLAN to wake-up HOST
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 1214 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND － Ground connections 21 VIN_LDO_OUT P Internal Buck voltage generation pin 22 VDDIO P I/O Voltage supply input 23 VIN_LDO P Internal Buck voltage generation pin 24 LPO I External Low Power Clock input (32.768KHz) 25 PCM_OUT O PCM Data output 26 PCM_CLK I/O PCM clock 27 PCM_IN I PCM data input 28 PCM_SYNC I/O PCM sync signal 29 NC － Floating (Don’t connected to ground) 30 NC － Floating (Don’t connected to ground) 31 GND － Ground connections 32 NC － Floating (Don’t connected to ground) 33 GND － Ground connections 34 BT_RST_N I Low asserting reset for Bluetooth core 35 NC － Floating (Don’t connected to ground) 36 GND － Ground connections 37 GPIO4 I/O WiFi Co-existence pin with LTE 38 GPIO3 I/O WiFi Co-existence pin with LTE 39 GPIO2 I/O WiFi Co-existence pin with LTE 40 GPIO1 I/O WiFi Co-existence pin with LTE 41 UART_RTS_N O Bluetooth/FM UART interface 42 UART_TXD O Bluetooth/FM UART interface 43 UART_RXD I Bluetooth/FM UART interface 44 UART_CTS_N I Bluetooth/FM UART interface 45 TP1 O FM Analog AUDIO left output 46 TP2 O FM Analog AUDIO right output 47 TP3 (NC) － Floating (Don’t connected to ground)
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 139. Dimensions 9.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > < TOP VIEW >
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 149.2 Layout Recommendation (Unit: mm) < TOP VIEW >
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 1510. External clock reference External LPO signal characteristics Parameter Specification Units Nominal input frequency 32.768 kHz Frequency accuracy 30 ppm Duty cycle 30 - 70 % Input signal amplitude 400 to 1800 mV, p-p Signal type Square-wave - Input impedance >100k <5  pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz Output high voltage 0.7Vio - Vio V External Ref_CLK signal characteristics 10.1 SDIO Pin Description The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 16 Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)  Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B)  Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B) SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 11. Host Interface Timing Diagram 11.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. ※ WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset. ※ BT_RST_N: Low asserting reset for Bluetooth and FM only. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating).
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 17 WLAN=ON, Bluetooth=ON WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 18 WLAN=OFF, Bluetooth=ON 11.2 SDIO Default Mode Timing Diagram
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 19 11.3 SDIO High Speed Mode Timing Diagram
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 2012. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 2.5 /sec℃ 2.5°C/sec40~70 sec250℃ThenotificationofWiFimodulebeforemounting:Theapertureofstencilshouldbelargerthanfootprintofmodule,andthestencilthicknessshouldbenotlessthan0.12mm. Reflow 時需使用 N2, 含氧量建議 5000 ppm 以下, ItmustuseN2forreflowandsuggesttheconcentrationofoxygenlessthan5000ppm.
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 21Solder Paste definition  Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm  The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB pad.  We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between 0.6~0.65mm and the L between L1.5~1.6mm.  If the thickness of the stencil is thinner, we suggest to adding more solder, to increase the wetting ability. Depends on different production situation, if the stencil thickness is 0.08~0.1mm, and the module nearby area is no more space for expending soldering area, we will suggest to increase the stencil thickness to increase the wetting ability.  The major consideration parts of stencil design is to increase the solder paste wetting ability.  模組規格 W0.65mm *L0.95mm Pitch 0.9mm  PCB Pad建議設計 W0.65~0.75mm *L1.33mm，且周邊1mm~1.5mm區域考慮不放置零件以利外加錫量。  鋼網建議厚度為0.12mm~0.15mm，W0.6~0.65mm* L1.5~1.6mm  因為模組需要側面爬錫，當鋼網厚度越薄外加錫量需越多，需依實際生產狀態評估，當使用鋼網0.08mm或 0.1mm且外加可能性低時則必須考慮局部加厚鋼網的設計。  鋼網設計主要以增加爬錫的焊錫膏量考量。
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 22 模組規格 L 0.7mm PCB Pad 設計 L 0.8mm 鋼網開孔建議 L0.5mm~0.6mm 適當內縮可以避免撐高造成高度影響  Module Specifications L 0.7mm  The design for PCB Pad : L:0.8mm  We recommend the apertures for stencil L:0.5mm~0.6mm  In order to avoid highness impact caused solder paste thickness, the stencil open size can be appropriately retracted
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 2313. Package Information 13.1Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label .
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 2413.2 Dimension
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 25 AB C Humidity indicator Desiccant C D
AMPAK CONFIDENTIAL 保存期限:最新版本 C-RD-047A 2613.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs

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