Flir BelgiumBA AX905 WiFi and Bluetooth module User Manual

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Document ID	3321001
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Document Description	User manual
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Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2017-03-17 00:00:00
Date Available	2017-03-17 00:00:00
Creation Date	2016-01-19 13:58:11
Producing Software	Acrobat Distiller 9.0.0 (Windows)
Document Lastmod	2016-02-23 10:41:10
Document Title	Microsoft Word - AP6212 datasheet_V1.4_09022014.doc
Document Creator	PScript5.dll Version 5.2.2
Document Author:	beth.chou

正基科技股份有限公司
SPECIFICATION
SPEC-W-014
REV：
1.4
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SPEC. NO.：
DATE：
01.08. 2016
PRODUCT NAME：
AP6212
Customer APPROVED
Company
CO
Representative
Signature
PREPARED
REVIEW
PM
QA
APPROVED
DCC ISSUE
AMPAK
Beth
Anna
Carol
Richard
2016.01.20
D.C.C PUBLISH
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AMPAK
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AP6212
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WiFi+Bluetooth 4.0+FM RX
SIP Module Spec Sheet
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Revision History
Date
Revision Content
Revised By Version
- Preliminary
Brian
1.0
2014/09/02
- Pin Definition Modified
Brian
1.1
2014/11/26
- Bluetooth Spec Modified
Brian
1.2
2014/12/26
- Add Process
Brian
1.3
2016/01/08
- Add Reflow Suggestion and MLS
Beth
1.4
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2014/04/08
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Contents
Contents ................................................................................................................... 2
1. Introduction......................................................................................................... 3
2. Features............................................................................................................... 4
3. Deliverables ........................................................................................................ 5
3.1 Deliverables.................................................................................................... 5
3.2 Regulatory certifications ................................................................................. 5
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4. General Specification ......................................................................................... 6
4.1 General Specification...................................................................................... 6
4.2 Voltages.......................................................................................................... 6
4.2.1 Absolute Maximum Ratings.................................................................... 6
4.2.2 Recommended Operating Rating ........................................................... 6
5. WiFi RF Specification ......................................................................................... 7
5.1 2.4GHz RF Specification................................................................................. 7
6. Bluetooth Specification...................................................................................... 9
6.1 Bluetooth Specification ................................................................................... 9
7. FM Specification ............................................................................................... 10
7.1 FM Specification (TBD)................................................................................. 10
8. Pin Assignments............................................................................................... 11
8.1 Pin Outline .................................................................................................... 11
8.2 Pin Definition ................................................................................................ 11
9. Dimensions ....................................................................................................... 13
9.1 Physical Dimensions..................................................................................... 13
9.2 Layout Recommendation.............................................................................. 14
10. External clock reference .................................................................................. 15
10.1 SDIO Pin Description.................................................................................. 15
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11. Host Interface Timing Diagramo...................................................................... 16
11.1 Power-up Sequence Timing Diagram ......................................................... 16
11.2 SDIO Default Mode Timing Diagram........................................................... 18
11.3 SDIO High Speed Mode Timing Diagram.................................................... 19
12. Recommended Reflow Profile ......................................................................... 20
Solder Paste definition .......................................................................................... 21
13. Package Information........................................................................................ 23
13.1Label .......................................................................................................... 23
Label C Inner box label . .................................................................................... 23
Label D Carton box label . ................................................................................. 23
13.2 Dimension ................................................................................................. 24
13.3 MSL Level / Storage Condition ................................................................... 26
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1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module
which has all of the WiFi, Bluetooth and FM functionalities. The highly integrated module
makes the possibilities of web browsing, VoIP, Bluetooth headsets, FM radio functional
applications and other applications. With seamless roaming capabilities and advanced
security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless
LAN.
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The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a
speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE
802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated
module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth and
UART / I2S / PCM interface for FM.
CO
This compact module is a total solution for a combination of WiFi + BT + FM technologies.
The module is specifically developed for Smart phones and Portable devices.
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2. Features




802.11b/g/n single-band radio
Bluetooth V4.0(HS) with integrated Class 1.5 PA and Low Energy (BLE) support
Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operation
Simultaneous BT/WLAN receive with single antenna
WLAN host interface options:
- SDIO v2.0 — up to 50 MHz clock rate
BT host digital interface:
- UART (up to 4 Mbps)
FM multiple audio routing options: I2S, PCM, eSCO, A2DP
IEEE Co-existence technologies are integrated die solution
ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions
around WLAN receives
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A simplified block diagram of the module is depicted in the figure below.
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3. Deliverables
3.1 Deliverables
The following products and software will be part of the product.
 Module with packaging
 Evaluation Kits
 Software utility for integration, performance test.
 Product Datasheet.
 Agency certified pre-tested report with the adapter board.
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3.2 Regulatory certifications
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The product delivery is a pre-tested module, without the module level certification.
For module approval, the platform’s antennas are required for the certification.
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4. General Specification
4.1 General Specification
AP6212
Product Description
Support WiFi/Bluetooth/FM functionalities
Dimension
L x W x H: 12 x 12 x 1.5 (typical) mm
WiFi Interface
SDIOV2.0
BT Interface
UART / PCM
FM Interface
UART / PCM / Audio
Operating temperature
-30°C to 85°C
Storage temperature
-40°C to 85°C
Humidity
Operating Humidity 10% to 95% Non-Condensing
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Model Name
4.2 Voltages
4.2.1 Absolute Maximum Ratings
Symbol
Description
VBAT
WL_VIO_SD
Min. Max. Unit
Input supply Voltage
-0.5
5.5
Digital/Bluetooth/SDIO/ I/O Voltage
-0.5
3.6
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4.2.2 Recommended Operating Rating
The module requires two power supplies: VBAT and VDDIO.
Min.
Typ.
Max.
Unit
-30
25
85
VBAT
3.0
3.6
4.8
deg.C
VDDIO
1.7
3.3
3.6
Operating Temperature
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5. WiFi RF Specification
5.1 2.4GHz RF Specification
Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C
Description
WLAN Standard
IEEE 802.11b/g/n, WiFi compliant
Frequency Range
2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band)
Number of Channels
2.4GHz：Ch1 ~ Ch14
Modulation
802.11b : DQPSK, DBPSK, CCK
802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK
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Feature
802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB
Output Power
802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB
802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM  -28dB
- MCS=0
PER @ -85 dBm, typical
- MCS=1
PER @ -84 dBm, typical
- MCS=2
PER @ -82 dBm, typical
- MCS=3
PER @ -80 dBm, typical
- MCS=4
PER @ -77 dBm, typical
- MCS=5
PER @ -73 dBm, typical
- MCS=6
PER @ -71 dBm, typical
- MCS=7
PER @ -68 dBm, typical
6Mbps
PER @ -86 dBm, typical
9Mbps
PER @ -85 dBm, typical
- 12Mbps
PER @ -85 dBm, typical
Receive Sensitivity (11g) - 18Mbps
@10% PER
- 24Mbps
PER @ -83 dBm, typical
- 36Mbps
PER @ -78 dBm, typical
- 48Mbps
PER @ -73 dBm, typical
54Mbps
PER @ -71 dBm, typical
1Mbps
PER @ -90 dBm, typical
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Receive Sensitivity
(11n,20MHz)
@10% PER
PER @ -81 dBm, typical
Receive Sensitivity (11b) - 2Mbps
@8% PER
- 5.5Mbps
PER @ -88 dBm, typical
- 11Mbps
Data Rate
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PER @ -87 dBm, typical
PER @ -84 dBm, typical
802.11b : 1, 2, 5.5, 11Mbps
802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
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Data Rate
(20MHz ,Long GI,800ns)
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Data Rate
(20MHz ,short GI,400ns)
802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps
Maximum Input Level
802.11g/n : -20 dBm
Small antennas with 0~2 dBi peak gain
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Antenna Reference
802.11b : -10 dBm
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6. Bluetooth Specification
6.1 Bluetooth Specification
Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C
Feature
Description
General Specification
Bluetooth V4.0 of 1, 2 and 3 Mbps.
Host Interface
UART
Antenna Reference
Small antennas with 0~2 dBi peak gain
Frequency Band
2402MHz ~ 2480MHz
Number of Channels
79 channels
Modulation
FHSS, GFSK, DPSK, DQPSK
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Bluetooth Standard
RF Specification
Min.
Typical.
Output Power (Class 1.5)
9 dBm
Sensitivity @ BER=0.1%
for GFSK (1Mbps)
-86 dBm
Sensitivity @ BER=0.01%
for π/4-DQPSK (2Mbps)
-86 dBm
Sensitivity @ BER=0.01%
for 8DPSK (3Mbps)
-80 dBm
Max.
GFSK (1Mbps):-20dBm
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Maximum Input Level
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π/4-DQPSK (2Mbps) :-20dBm
8DPSK (3Mbps) :-20dBm
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7. FM Specification
7.1 FM Specification (TBD)
Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C
Feature
Description
General Specification
76MHz-108MHz
Host Interface
HCI UART, I2S/PCM
Channel step
50 KHz
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Frequency Band
Analog Audio output load RL>30KΩ, CL>20pF
Characteristics
Condition
MIN
Output Power Level
Transmitter
(FM Tx load = 120nH,
Q>30)
dBuV
Audio harmonic distortion
(fmod=1KHz,
△ f=75KHz,
Pilot △f=6.75KHz)
Audio SNR
( △ f=22.5KHz, I2S
audio in SNR ≧
57dB )
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Receiver
(FM Tx Antenna =
120nH, Q>30)
Maximum SNR
(fmod=1KHz,△f=22.5
KHz, BW=300Hz to
15KHz)
RF input power level
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MONO
dB
Stereo
RDS Sensitivity
Audio
harmonic
distortion
(Vin=1mV, △f=75KHz)
TYP MAX UNIT
dBm
fmod=
1KHz
fmod=
3KHz
MONO
dB
Stereo
dBuV
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8. Pin Assignments
8.1 Pin Outline
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< TOP VIEW >
8.2 Pin Definition
NO
Type
Description
GND
－
Ground connections
WL_BT_ANT
I/O
RF I/O port
GND
－
Ground connections
CO
Name
FM_RX
FM radio RF input antenna port
NC
－
Floating (Don’t connected to ground)
BT_WAKE
HOST wake-up Bluetooth device
BT_HOST_WAKE
Bluetooth device to wake-up HOST
NC
－
Floating (Don’t connected to ground)
VBAT
Main power voltage source input
10
XTAL_IN
Crystal input
11
XTAL_OUT
Crystal output
12
WL_REG_ON
Internal regulators power enable/disable
13
WL_HOST_WAKE
WLAN to wake-up HOST
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11
SDIO_DATA_2
I/O
SDIO data line 2
15
SDIO_DATA_3
I/O
SDIO data line 3
16
SDIO_DATA_CMD
I/O
SDIO command line
17
SDIO_DATA_CLK
I/O
SDIO clock line
18
SDIO_DATA_0
I/O
SDIO data line 0
19
SDIO_DATA_1
I/O
SDIO data line 1
20
GND
－
Ground connections
21
VIN_LDO_OUT
Internal Buck voltage generation pin
22
VDDIO
I/O Voltage supply input
23
VIN_LDO
Internal Buck voltage generation pin
24
LPO
External Low Power Clock input (32.768KHz)
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PCM_OUT
PCM Data output
PCM_CLK
I/O
PCM clock
PCM_IN
PCM data input
PCM_SYNC
I/O
PCM sync signal
NC
－
Floating (Don’t connected to ground)
NC
－
Floating (Don’t connected to ground)
GND
－
Ground connections
NC
－
Floating (Don’t connected to ground)
GND
－
Ground connections
BT_RST_N
Low asserting reset for Bluetooth core
NC
－
Floating (Don’t connected to ground)
GND
－
Ground connections
GPIO4
I/O
WiFi Co-existence pin with LTE
GPIO3
I/O
WiFi Co-existence pin with LTE
GPIO2
I/O
WiFi Co-existence pin with LTE
GPIO1
I/O
WiFi Co-existence pin with LTE
UART_RTS_N
Bluetooth/FM UART interface
42
UART_TXD
Bluetooth/FM UART interface
43
UART_RXD
Bluetooth/FM UART interface
44
UART_CTS_N
Bluetooth/FM UART interface
45
TP1
FM Analog AUDIO left output
46
TP2
FM Analog AUDIO right output
47
TP3 (NC)
－
Floating (Don’t connected to ground)
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
CO
41
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9. Dimensions
9.1 Physical Dimensions
(Unit: mm)
< Side View >
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< TOP VIEW >
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< TOP VIEW >
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9.2 Layout Recommendation
(Unit: mm)
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< TOP VIEW >
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10. External clock reference
External LPO signal characteristics
Parameter
Nominal input frequency
Frequency accuracy
Duty cycle
Input signal amplitude
Signal type
Units
32.768
kHz
 30
ppm
30 - 70
400 to 1800
mV, p-p
Square-wave

>100k
<5
pF
<1
Hz
0.7Vio - Vio
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Input impedance
Specification
Clock jitter (integrated over 300Hz – 15KHz)
Output high voltage
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External Ref_CLK signal characteristics
10.1 SDIO Pin Description
The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50
MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt
signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN
device wants to turn on the SDIO interface. The ability to force the control of the gated
clocks from within the WLAN chip is also provided.
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


Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)
Function 1 Backplane Function to access the internal System On Chip (SOC)
address space (Max BlockSize / ByteCount = 64B)
Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max
BlockSize/ByteCount=512B)
SDIO Pin Description
SD 4-Bit Mode
DATA0 Data Line 0
DATA1 Data Line 1 or Interrupt
DATA2 Data Line 2 or Read Wait
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DATA3 Data Line 3
CLK
Clock
CMD
Command Line
11. Host Interface Timing Diagram
11.1 Power-up Sequence Timing Diagram
The module has signals that allow the host to control power consumption by enabling or
disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described
below.
Additionally, diagrams are provided to indicate proper sequencing of the signals for carious
operating states. The timing value indicated are minimum required values: longer delays are
also acceptable.
WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is
high, the regulators are enabled and the WLAN section is out of reset. When this
pin is low the WLAN section is in reset.
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※
※
BT_RST_N: Low asserting reset for Bluetooth and FM only. This pin has no effect
on WLAN and does not control any PMU functions. This pin must be driven high or
low (not left floating).
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AM
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WLAN=ON, Bluetooth=ON
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WLAN=OFF, Bluetooth=OFF
WLAN=ON, Bluetooth=OFF
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AM
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WLAN=OFF, Bluetooth=ON
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11.2 SDIO Default Mode Timing Diagram
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11.3 SDIO High Speed Mode Timing Diagram
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12. Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : 2 times
250℃
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2.5°C/sec
40~70 sec
2.5℃/sec
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The notification of WiFi module before mounting:
The aperture of stencil should be larger than foot print of module, and the stencil thickness should
be not less than 0.12mm.
Reflow 時需使用 N2, 含氧量建議 5000 ppm 以下,
It must use N2 for reflow and suggest the concentration of oxygen less than 5000 ppm .
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Solder Paste definition






W0.6~0.65mm* L1.5~1.6mm
因為模組需要側面爬錫，當鋼網厚度越薄外加錫量
需越多，需依實際生產狀態評估，當使用鋼網
0.08mm或 0.1mm且外加可能性低時則必須考慮
局部加厚鋼網的設計。
鋼網設計主要以增加爬錫的焊錫膏量考量。
Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm
The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in
the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB
pad.
We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between
0.6~0.65mm and the L between L1.5~1.6mm.
If the thickness of the stencil is thinner, we suggest to adding more solder, to increase
the wetting ability. Depends on different production situation, if the stencil thickness is
0.08~0.1mm, and the module nearby area is no more space for expending soldering
area, we will suggest to increase the stencil thickness to increase the wetting ability.
The major consideration parts of stencil design is to increase the solder paste wetting
ability.
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

模組規格 W0.65mm *L0.95mm Pitch 0.9mm
PCB Pad建議設計 W0.65~0.75mm *L1.33mm，
且周邊1mm~1.5mm區域考慮不放置零件以利外
加錫量。
鋼網建議厚度為0.12mm~0.15mm，
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Module Specifications L 0.7mm
The design for PCB Pad : L:0.8mm
We recommend the apertures for stencil L:0.5mm~0.6mm
In order to avoid highness impact caused solder paste thickness, the stencil open size
can be appropriately retracted
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



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模組規格 L 0.7mm
PCB Pad 設計 L 0.8mm
鋼網開孔建議 L0.5mm~0.6mm
適當內縮可以避免撐高造成高度影響
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13. Package Information
13.1Label
Label A Anti-static and humidity notice
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Label B MSL caution / Storage Condition
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Label C Inner box label .
Label D Carton box label .
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CO
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13.2 Dimension
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B
Humidity indicator
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Desiccant
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CO
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13.3 MSL Level / Storage Condition
※NOTE : Accumulated baking time should not exceed 96hrs
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