Flir BelgiumBA AX905 WiFi and Bluetooth module User Manual
Raymarine UK Ltd. WiFi and Bluetooth module
Contents
- 1. User manual
- 2. User manual statements
User manual
正基科技股份有限公司 SPECIFICATION SPEC-W-014 REV: 1.4 AM NF P ID K EN TI AL SPEC. NO.: DATE: 01.08. 2016 PRODUCT NAME: AP6212 Customer APPROVED Company CO Representative Signature PREPARED REVIEW PM QA APPROVED DCC ISSUE AMPAK Beth Anna Carol Richard 2016.01.20 D.C.C PUBLISH 保存期限:最新版本 C-RD-047A AMPAK AM NF P ID K EN TI AL AP6212 CO WiFi+Bluetooth 4.0+FM RX SIP Module Spec Sheet 保存期限:最新版本 C-RD-047A Revision History Date Revision Content Revised By Version - Preliminary Brian 1.0 2014/09/02 - Pin Definition Modified Brian 1.1 2014/11/26 - Bluetooth Spec Modified Brian 1.2 2014/12/26 - Add Process Brian 1.3 2016/01/08 - Add Reflow Suggestion and MLS Beth 1.4 CO AM NF P ID K EN TI AL 2014/04/08 保存期限:最新版本 C-RD-047A Contents Contents ................................................................................................................... 2 1. Introduction......................................................................................................... 3 2. Features............................................................................................................... 4 3. Deliverables ........................................................................................................ 5 3.1 Deliverables.................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 AM NF P ID K EN TI AL 4. General Specification ......................................................................................... 6 4.1 General Specification...................................................................................... 6 4.2 Voltages.......................................................................................................... 6 4.2.1 Absolute Maximum Ratings.................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 5. WiFi RF Specification ......................................................................................... 7 5.1 2.4GHz RF Specification................................................................................. 7 6. Bluetooth Specification...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. FM Specification ............................................................................................... 10 7.1 FM Specification (TBD)................................................................................. 10 8. Pin Assignments............................................................................................... 11 8.1 Pin Outline .................................................................................................... 11 8.2 Pin Definition ................................................................................................ 11 9. Dimensions ....................................................................................................... 13 9.1 Physical Dimensions..................................................................................... 13 9.2 Layout Recommendation.............................................................................. 14 10. External clock reference .................................................................................. 15 10.1 SDIO Pin Description.................................................................................. 15 CO 11. Host Interface Timing Diagramo...................................................................... 16 11.1 Power-up Sequence Timing Diagram ......................................................... 16 11.2 SDIO Default Mode Timing Diagram........................................................... 18 11.3 SDIO High Speed Mode Timing Diagram.................................................... 19 12. Recommended Reflow Profile ......................................................................... 20 Solder Paste definition .......................................................................................... 21 13. Package Information........................................................................................ 23 13.1Label .......................................................................................................... 23 Label C Inner box label . .................................................................................... 23 Label D Carton box label . ................................................................................. 23 13.2 Dimension ................................................................................................. 24 13.3 MSL Level / Storage Condition ................................................................... 26 保存期限:最新版本 C-RD-047A 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi, Bluetooth and FM functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets, FM radio functional applications and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN. AM NF P ID K EN TI AL The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth and UART / I2S / PCM interface for FM. CO This compact module is a total solution for a combination of WiFi + BT + FM technologies. The module is specifically developed for Smart phones and Portable devices. 保存期限:最新版本 C-RD-047A 2. Features 802.11b/g/n single-band radio Bluetooth V4.0(HS) with integrated Class 1.5 PA and Low Energy (BLE) support Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operation Simultaneous BT/WLAN receive with single antenna WLAN host interface options: - SDIO v2.0 — up to 50 MHz clock rate BT host digital interface: - UART (up to 4 Mbps) FM multiple audio routing options: I2S, PCM, eSCO, A2DP IEEE Co-existence technologies are integrated die solution ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives AM NF P ID K EN TI AL CO A simplified block diagram of the module is depicted in the figure below. 保存期限:最新版本 C-RD-047A 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. AM NF P ID K EN TI AL 3.2 Regulatory certifications CO The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification. 保存期限:最新版本 C-RD-047A 4. General Specification 4.1 General Specification AP6212 Product Description Support WiFi/Bluetooth/FM functionalities Dimension L x W x H: 12 x 12 x 1.5 (typical) mm WiFi Interface SDIOV2.0 BT Interface UART / PCM FM Interface UART / PCM / Audio Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing AM NF P ID K EN TI AL Model Name 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description VBAT WL_VIO_SD Min. Max. Unit Input supply Voltage -0.5 5.5 Digital/Bluetooth/SDIO/ I/O Voltage -0.5 3.6 CO 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Typ. Max. Unit -30 25 85 VBAT 3.0 3.6 4.8 deg.C VDDIO 1.7 3.3 3.6 Operating Temperature 保存期限:最新版本 C-RD-047A 5. WiFi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Description WLAN Standard IEEE 802.11b/g/n, WiFi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz:Ch1 ~ Ch14 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK AM NF P ID K EN TI AL Feature 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM -9dB Output Power 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM -25dB 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM -28dB - MCS=0 PER @ -85 dBm, typical - MCS=1 PER @ -84 dBm, typical - MCS=2 PER @ -82 dBm, typical - MCS=3 PER @ -80 dBm, typical - MCS=4 PER @ -77 dBm, typical - MCS=5 PER @ -73 dBm, typical - MCS=6 PER @ -71 dBm, typical - MCS=7 PER @ -68 dBm, typical 6Mbps PER @ -86 dBm, typical 9Mbps PER @ -85 dBm, typical - 12Mbps PER @ -85 dBm, typical Receive Sensitivity (11g) - 18Mbps @10% PER - 24Mbps PER @ -83 dBm, typical - 36Mbps PER @ -78 dBm, typical - 48Mbps PER @ -73 dBm, typical 54Mbps PER @ -71 dBm, typical 1Mbps PER @ -90 dBm, typical CO Receive Sensitivity (11n,20MHz) @10% PER PER @ -81 dBm, typical Receive Sensitivity (11b) - 2Mbps @8% PER - 5.5Mbps PER @ -88 dBm, typical - 11Mbps Data Rate 保存期限:最新版本 PER @ -87 dBm, typical PER @ -84 dBm, typical 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps C-RD-047A Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps Maximum Input Level 802.11g/n : -20 dBm Small antennas with 0~2 dBi peak gain CO AM NF P ID K EN TI AL Antenna Reference 802.11b : -10 dBm 保存期限:最新版本 C-RD-047A 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402MHz ~ 2480MHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK AM NF P ID K EN TI AL Bluetooth Standard RF Specification Min. Typical. Output Power (Class 1.5) 9 dBm Sensitivity @ BER=0.1% for GFSK (1Mbps) -86 dBm Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) -86 dBm Sensitivity @ BER=0.01% for 8DPSK (3Mbps) -80 dBm Max. GFSK (1Mbps):-20dBm CO Maximum Input Level 保存期限:最新版本 π/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm C-RD-047A 7. FM Specification 7.1 FM Specification (TBD) Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification 76MHz-108MHz Host Interface HCI UART, I2S/PCM Channel step 50 KHz AM NF P ID K EN TI AL Frequency Band Analog Audio output load RL>30KΩ, CL>20pF Characteristics Condition MIN Output Power Level Transmitter (FM Tx load = 120nH, Q>30) dBuV Audio harmonic distortion (fmod=1KHz, △ f=75KHz, Pilot △f=6.75KHz) Audio SNR ( △ f=22.5KHz, I2S audio in SNR ≧ 57dB ) CO Receiver (FM Tx Antenna = 120nH, Q>30) Maximum SNR (fmod=1KHz,△f=22.5 KHz, BW=300Hz to 15KHz) RF input power level 保存期限:最新版本 MONO dB Stereo RDS Sensitivity Audio harmonic distortion (Vin=1mV, △f=75KHz) TYP MAX UNIT dBm fmod= 1KHz fmod= 3KHz MONO dB Stereo dBuV C-RD-047A 10 8. Pin Assignments 8.1 Pin Outline AM NF P ID K EN TI AL < TOP VIEW > 8.2 Pin Definition NO Type Description GND - Ground connections WL_BT_ANT I/O RF I/O port GND - Ground connections CO Name FM_RX FM radio RF input antenna port NC - Floating (Don’t connected to ground) BT_WAKE HOST wake-up Bluetooth device BT_HOST_WAKE Bluetooth device to wake-up HOST NC - Floating (Don’t connected to ground) VBAT Main power voltage source input 10 XTAL_IN Crystal input 11 XTAL_OUT Crystal output 12 WL_REG_ON Internal regulators power enable/disable 13 WL_HOST_WAKE WLAN to wake-up HOST 保存期限:最新版本 C-RD-047A 11 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND - Ground connections 21 VIN_LDO_OUT Internal Buck voltage generation pin 22 VDDIO I/O Voltage supply input 23 VIN_LDO Internal Buck voltage generation pin 24 LPO External Low Power Clock input (32.768KHz) AM NF P ID K EN TI AL 14 PCM_OUT PCM Data output PCM_CLK I/O PCM clock PCM_IN PCM data input PCM_SYNC I/O PCM sync signal NC - Floating (Don’t connected to ground) NC - Floating (Don’t connected to ground) GND - Ground connections NC - Floating (Don’t connected to ground) GND - Ground connections BT_RST_N Low asserting reset for Bluetooth core NC - Floating (Don’t connected to ground) GND - Ground connections GPIO4 I/O WiFi Co-existence pin with LTE GPIO3 I/O WiFi Co-existence pin with LTE GPIO2 I/O WiFi Co-existence pin with LTE GPIO1 I/O WiFi Co-existence pin with LTE UART_RTS_N Bluetooth/FM UART interface 42 UART_TXD Bluetooth/FM UART interface 43 UART_RXD Bluetooth/FM UART interface 44 UART_CTS_N Bluetooth/FM UART interface 45 TP1 FM Analog AUDIO left output 46 TP2 FM Analog AUDIO right output 47 TP3 (NC) - Floating (Don’t connected to ground) 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 CO 41 保存期限:最新版本 C-RD-047A 12 9. Dimensions 9.1 Physical Dimensions (Unit: mm) < Side View > AM NF P ID K EN TI AL < TOP VIEW > CO < TOP VIEW > 保存期限:最新版本 C-RD-047A 13 9.2 Layout Recommendation (Unit: mm) CO AM NF P ID K EN TI AL < TOP VIEW > 保存期限:最新版本 C-RD-047A 14 10. External clock reference External LPO signal characteristics Parameter Nominal input frequency Frequency accuracy Duty cycle Input signal amplitude Signal type Units 32.768 kHz 30 ppm 30 - 70 400 to 1800 mV, p-p Square-wave >100k <5 pF <1 Hz 0.7Vio - Vio AM NF P ID K EN TI AL Input impedance Specification Clock jitter (integrated over 300Hz – 15KHz) Output high voltage CO External Ref_CLK signal characteristics 10.1 SDIO Pin Description The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. 保存期限:最新版本 C-RD-047A 15 Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B) Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B) Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B) SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait AM NF P ID K EN TI AL DATA3 Data Line 3 CLK Clock CMD Command Line 11. Host Interface Timing Diagram 11.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset. CO ※ ※ BT_RST_N: Low asserting reset for Bluetooth and FM only. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating). 保存期限:最新版本 C-RD-047A 16 AM NF P ID K EN TI AL WLAN=ON, Bluetooth=ON CO WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF 保存期限:最新版本 C-RD-047A 17 AM NF P ID K EN TI AL WLAN=OFF, Bluetooth=ON CO 11.2 SDIO Default Mode Timing Diagram 保存期限:最新版本 C-RD-047A 18 AM NF P ID K EN TI AL CO 11.3 SDIO High Speed Mode Timing Diagram 保存期限:最新版本 C-RD-047A 19 12. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 250℃ AM NF P ID K EN TI AL 2.5°C/sec 40~70 sec 2.5℃/sec CO The notification of WiFi module before mounting: The aperture of stencil should be larger than foot print of module, and the stencil thickness should be not less than 0.12mm. Reflow 時需使用 N2, 含氧量建議 5000 ppm 以下, It must use N2 for reflow and suggest the concentration of oxygen less than 5000 ppm . 保存期限:最新版本 C-RD-047A 20 Solder Paste definition W0.6~0.65mm* L1.5~1.6mm 因為模組需要側面爬錫,當鋼網厚度越薄外加錫量 需越多,需依實際生產狀態評估,當使用鋼網 0.08mm或 0.1mm且外加可能性低時則必須考慮 局部加厚鋼網的設計。 鋼網設計主要以增加爬錫的焊錫膏量考量。 Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB pad. We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between 0.6~0.65mm and the L between L1.5~1.6mm. If the thickness of the stencil is thinner, we suggest to adding more solder, to increase the wetting ability. Depends on different production situation, if the stencil thickness is 0.08~0.1mm, and the module nearby area is no more space for expending soldering area, we will suggest to increase the stencil thickness to increase the wetting ability. The major consideration parts of stencil design is to increase the solder paste wetting ability. CO 模組規格 W0.65mm *L0.95mm Pitch 0.9mm PCB Pad建議設計 W0.65~0.75mm *L1.33mm, 且周邊1mm~1.5mm區域考慮不放置零件以利外 加錫量。 鋼網建議厚度為0.12mm~0.15mm, AM NF P ID K EN TI AL 保存期限:最新版本 C-RD-047A 21 Module Specifications L 0.7mm The design for PCB Pad : L:0.8mm We recommend the apertures for stencil L:0.5mm~0.6mm In order to avoid highness impact caused solder paste thickness, the stencil open size can be appropriately retracted CO AM NF P ID K EN TI AL 模組規格 L 0.7mm PCB Pad 設計 L 0.8mm 鋼網開孔建議 L0.5mm~0.6mm 適當內縮可以避免撐高造成高度影響 保存期限:最新版本 C-RD-047A 22 13. Package Information 13.1Label Label A Anti-static and humidity notice AM NF P ID K EN TI AL Label B MSL caution / Storage Condition CO Label C Inner box label . Label D Carton box label . 保存期限:最新版本 C-RD-047A 23 CO AM NF P ID K EN TI AL 13.2 Dimension 保存期限:最新版本 C-RD-047A 24 B Humidity indicator AM NF P ID K EN TI AL Desiccant CO 保存期限:最新版本 C-RD-047A 25 CO AM NF P ID K EN TI AL 13.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs 保存期限:最新版本 C-RD-047A 26
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