Freescale Semiconductor 1231X-MRB Developmental Board User Manual 12311DHRM

Freescale Semiconductor, Inc. Developmental Board 12311DHRM

manual

Document Number: 12311DHRMRev. 103/2012 12311 Development HardwareReference Manual
How to Reach Us:Home Page:www.freescale.comE-mail:support@freescale.comUSA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center, CH3701300 N. Alma School RoadChandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130support@freescale.comEurope, Middle East, and Africa:Freescale Halbleiter Deutschland GmbHTechnical Information CenterSchatzbogen 781829 Muenchen, Germany+44 1296 380 456 (English)+46 8 52200080 (English)+49 89 92103 559 (German)+33 1 69 35 48 48 (French)support@freescale.comJapan:Freescale Semiconductor Japan Ltd.HeadquartersARCO Tower 15F1-8-1, Shimo-Meguro, Meguro-ku,Tokyo 153-0064, Japan0120 191014 or +81 3 5437 9125support.japan@freescale.comAsia/Pacific:Freescale Semiconductor Hong Kong Ltd.Technical Information Center2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong+800 2666 8080support.asia@freescale.comFor Literature Requests Only:Freescale Semiconductor Literature Distribution CenterP.O. Box 5405Denver, Colorado 802171-800-521-6274 or 303-675-2140Fax: 303-675-2150LDCForFreescaleSemiconductor@hibbertgroup.comInformation in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008, 2009, 2010, 2011, 2012. All rights reserved.
12311 Development Hardware Reference Manual, Rev. 1Freescale Semiconductor iii ContentsAbout This BookAudience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vOrganization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vChapter 1 Safety Information1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.1 Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.3 Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.4 Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2 Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.2.1 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.3 Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2Chapter 2 MC12311 Development Platform Overview and Description2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.2.1 TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32.3 Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4Chapter 3 12311-MRB3.1 12311-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.2.1 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.2.2 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.3 Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.3.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.3.2 IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-113.4 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-133.4.1 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
12311 Development Hardware Reference Manual, Rev. 1iv Freescale Semiconductor Chapter 4 PCB Manufacturing Specifications4.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor v About This BookThis manual describes Freescale’s 12311-MRB development platform hardware. The MC12311 development platform is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller.AudienceThis manual is intended for system designers.OrganizationThis document is organized into the following chapters.Chapter 1 Safety Information — Highlights some of the FCC requirements.Chapter 2 HCS08 Development Platform Overview and Description — Provides an overview of the two boards that comprise the MC12311 development platform.Chapter 3 Modular Reference Board — This chapter details the 12311-MRB evaluation board based on the Freescale MC12311 device.Chapter 4 PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the various 12311-MRB printed circuit boards (PCBs).Revision HistoryThe following table summarizes revisions to this document since the previous release (Rev 0.0).Revision HistoryLocation RevisionChapter 3 New schematic for Figure 3-9.
12311 Development Hardware Reference Manual, Rev. 1 vi Freescale Semiconductor Definitions, Acronyms, and AbbreviationsThe following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital ConverterAES Advanced Encryption StandardCTS Clear to SendDAC Digital to Analog ConverterI2C Inter-Integrated Circuit is a multi-master serial computer busISM Industrial Scientific Medical 2.4 GHz radio frequency bandJTAG Joint Test Action GroupLGA Land Grid ArrayMAC Media Access ControllerMCU Microcontroller UnitPCB Printed circuit boardPiP Platform in PackagePWM Pulse-width modulation RCM Remote Control ModuleREM Remote Extender BoardRTS Request to SendSMA Connector SubMiniature version “A” connector SPI Serial Peripheral InterfaceSSI Synchronous Serial InterfaceTACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.TELCO Telephone CompanyUSB Universal Serial BusVCP Virtual Com Port
12311 Development Hardware Reference Manual, Rev. 1Freescale Semiconductor 1-1Chapter 1 Safety Information1.1 FCC GuidelinesThis equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful.1.1.1 LabelingFCC labels are physically located on the back of the board.1.1.2 Operating ConditionsThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:• This device may not cause harmful interference.• This device must accept any interference received, including interference that may cause undesired operation.1.1.3 Exposure LimitsThis equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons.1.1.4 Antenna RestrictionsAn intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional
Safety Information12311 Development Hardware Reference Manual, Rev. 11-2 Freescale Semiconductorradiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.2 Regulatory Approval For Canada (IC RSS 210)This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device.1.2.1 26 PART 5 – AppendixLe présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.3 Electrostatic Discharge ConsiderationsAlthough damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM).All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:• Flexible fabric, solid fixed size, or disposable ESD wrist straps• Static control workstations, static control monitors and table or floor static control systems• Static control packaging and transportation materials and environmental systems1.4 Disposal InstructionsThis product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal.
12311 Development Hardware Reference Manual, Rev. 1Freescale Semiconductor 2-1Chapter 2 MC12311 Development Platform Overview and Description2.1 IntroductionThe MC12311 development platform is an evaluation environment based on the Freescale MC12311 device. The MC12311 is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller. This configuration allows users to minimize the use of external components.The MC12311 is targeted for the following low-power wireless applications:• Automated Meter Reading• Wireless Sensor Networks• Home and Building Automation• Wireless Alarm and Security Systems• Industrial Monitoring and Control• Wireless MBUS Standard (EN13757-4:2005)Freescale supplements the MC12311 with tools and software that include hardware evaluation and development boards, software development IDE and applications, drivers, custom PHY usable with Freescale’s IEEE 802.15.4 compatible MAC, and an available wireless MBUS solution.The MC12311 development platform is comprised of two boards:• 12311-Modular Reference Board (12311-MRB) - this board contains the MC12311 device with 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The board can be used as a simple standalone evaluation platform or as a daughter card to the other MC12311 development platform boards or to a custom, application specific motherboard. — Provides compact reference design for device footprint and RF layout— Provides pre-designed MC12311 hardware (device and function)— Provides access to the MC12311 full set of GPIO— Provides MCU BDM debug port— Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED and power management.• TWR-RF Board . The TWR-RF board is a motherboard for the MC12311 and 12311-MRB daughter boards, to enable its use within the Tower system. The TWR-RF board is a Tower Controller Module compatible with the Freescale Tower System. The 12311-MRB + TWR-RF can run standalone, outside the Tower system. The following list summarizes the features of the TWR-RF Module:
MC12311 Development Platform Overview and Description12311 Development Hardware Reference Manual, Rev. 12-2 Freescale Semiconductor— Standard sockets 100 mils J5 and J4 (2X9 and 2x10) to connect MC12311 and 12311-MRB daughter boards— Standard header 100 mils J1 (2x20) to enable signalling path to TWR primary and secondary connectors.— Standard header 100 mils J6 (3x12) to enable signalling to on board HW and USB interface or to TWR system Hardware — On-board regulator to provide external supply— Four (4) user-controllable LEDs — Four (4) user push-button switches— USB Type B connectorWhether the 12311-MRB is used in a simple standalone application or in combination with another host card, Freescale provides a complete software development environment called the Freescale BeeKit Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI) allows users to create, modify, and update various wireless networking implementations. A wide range of software functionality is available to complement the 12311-MRB and these are provided as codebases within BeeKit.2.2 FeaturesThe MC12311 development platform is built around the concept of having a single daughter card (12311-MRB) that contains the MC12311 IC and all necessary I/O connections for use as a self-contained module or for connection to an application motherboard like the TWR-RF board.Figure 2-1 shows a photo of the 12311-MRB.Figure 2-1. 12311-MRBFeatures of the MC12311 development platform include:
MC12311 Development Platform Overview and Description12311 Development Hardware Reference Manual, Rev. 1Freescale Semiconductor 2-3• Based on Freescale’s low-cost MC12311 sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller, and a functional set of MCU peripherals into a 60-pin LGA package• Reference design area with small footprint, low cost RF node— Unbalance input/output port — Flexible RF-Front End for different bands operation— High Sensitivity: down to -120dBm at 1.2kbps• 32 MHz reference oscillator• BDM serial MCU debug port• Optional secondary 32.768 kHz crystal oscillator for accurate low power timing• Master reset switch• Full power regulation and management• 12311-MRB board provides— Required circuitry for MC12311 - crystals and RF circuitry — Local power supply regulation— Access to all GPIO— Standalone or daughter card use modes— BDM connector2.2.1 TWR-RF ModuleThe 12311-MRB can run in the Freescale Tower System using the RF-Tower module (TWR-RF). Features of the TWR-RF module include:• Standard sockets 100 mils J5 and J4 (2 x 9 and 2 x 10) to connect either a 1323x Modular Reference Board (1323x-MRB) or a 12311 Modular Reference Board (12311-MRB)• Standard header 100 mils J1 (2 x 20) to enable signalling path to TWR primary and secondary connectors.• Standard header 100 mils J6 (3 x 12) to enable signalling to on board HW and USB interface or to TWR system Hardware • On-board regulator to provide external supply• Four (4) user-controllable LEDs • Four (4) user push-button switches• USB Type B connectorFigure 2-2 shows a simplified block diagram of the Freescale Tower RF system.
MC12311 Development Platform Overview and Description12311 Development Hardware Reference Manual, Rev. 12-4 Freescale SemiconductorFigure 2-2. Simplified TWR-RF Block DiagramSee the TWR-RF Reference Manual for more information about the RF-Tower module.2.3 Driver ConsiderationsWhen users first connect a 12311-MRB to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory:C:\Program Files\Freescale\DriversIf installing the BeeKit software package to another drive or directory, indicate the Drivers directory created by the installer in the custom location where BeeKit was installed.Follow the instructions as they appear on the screen to complete driver installation.If BeeKit is not installed, be aware of the following:• The boards use FSL USB2SER USB to UART bridge converter.• Download the appropriate driver and follow the instructions to complete driver installation from www.freescale.com.
12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-1Chapter 3 12311-MRB3.1 12311-MRB OverviewThe 12311-MRB is an evaluation board based on the Freescale MC12311 device. The 12311-MRB provides a platform to evaluate the MC12311 device, develop software and applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including SMA for antenna connection and/or instrumentation, and supporting circuitry. This basic board is intended as the core module for MC12311 evaluation and application development and can be used in the following modes:• Simple standalone evaluation platform• Daughtercard to other Development Platform boards (TWR-RF, 1323x-RCM or 1323x-REM)• Daughtercard to an application specific motherboard.3.1.1 FeaturesThe 12311-MRB provides the following features:• Small form factor (2 x 2 inches)• 4-Layer metal, 0.034 inch thick FR4 board• MC12311 reference design area— LGA footprint and power supply bypass— 32 MHz reference oscillator crystal— RF components and layout• Low cost RF node— Differential input/output port (typically used with a balun)— High sensitivity of -120 dBm at 1.2 KBPS— SMA output connector for Transmit/Receive Output• Two connectors provided daughter card mounting— 20-Pin primary connector— 18-Pin secondary connector— Provide main supply voltage to board— Provide access to all MC12311 GPIO• Flexible board power supply— 3.3 V LDO series regulator supplied
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-2 Freescale Semiconductor— Regulator bypass jumper option— Separate external voltage source option— Power-on green LED— Jumpers allow various block current measurements• 6-Pin BDM serial MCU debug port• MC12311 reset switch3.1.2 Form FactorFigure 3-1 shows the 12311-MRB connector and header locations.Figure 3-1. 12311-MRBFigure 3-2 shows a footprint of the 12311-MRB with the location of the IO Headers J2 and J3. Users can create a motherboard to mount the 12311-MRB and headers J2 and J3 are used for that connection.• Both headers have standard 0.10in / 2.54 mm pin spacing• J2 is 20-pin and J3 is 18-pin• Both are pin headers mounted on the bottom side of the 12311-MRB and are intended to plug into matching receptacles on the motherboard.BDMport(J5)Primary 20‐pinIOConnector (J15)Secondary 18‐pinIOConnector (J14)RFIOScMA(J2)PABoost SMA(J1)J13J6J9J8J3J4J12J11J7J10Reset SW
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-3 Figure 3-2. 12311-MRB Top Side (Component Side) Footprint3.1.3 Board Level SpecificationsTable 3-1. 12311-MRB SpecificationsParameter Min Typ Max Units Notes/ConditionsGeneralSize (PCB: X, Y) 51 x 512.01 x 2.01mminchesLayer build (PCB) 0.80.034mminches4-LayerDielectric material (PCB) FR4PowerVoltage supply (DC)With 3.3 V regulator in use 3.50 10 V Full module useCurrent consumption TBD mA
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-4 Freescale SemiconductorTemperatureOperating temperature (see note) -40 +25 +70 °C • Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C.Storage temperature -30 +25 +70 °CRF ReceiverFSK Sensitivity -105 to -120dBmOOK Sensitivity -112 dBmAdjacent channel Rejection (Offset = +/- 25 KHz or 50 KHz)-42 dB2nd order Intercept point +75 dBm3rd order Intercept point +20 dBmRSSI dynamic range -115 0RF TransmitterRF Power Output (RFIO pin) -18 -3 dBm Programmable in 1dB stepsAdjacent channel Power (25KHz offset)-37 dBmRegulatory ApprovalFCC Product is approved accordingly to the FCC part 15 standardCE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standardCE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standardsSafetyUL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standardsEnvironmentRoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003Table 3-1. 12311-MRB Specifications (continued)Parameter Min Typ Max Units Notes/Conditions
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-53.2 Functional DescriptionThe 12311-MRB is built around Freescale’s MC12311 56-pin LGA platform. Figure 3-2 shows a simple block diagram. This board is intended as a simple evaluation platform and as a building block for application development. The 4-layer board provides the MC12311 with its required RF circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference layout by the user target board.In additional to the base MC12311 functionality, the 12311-MRB provides features to assist in debug, reset button, simple power manager, and expansion connectors for the GPIO. In the following sections, refer to:•Figure 3-1 for location of connectors and features•Figure 3-3 for the functional blocks•Figure 3-9 for the board schematicFigure 3-3. 12311-MRB Block Diagram3.2.1 RF Performance and ConsiderationsThe MC12311 transceiver is a single-chip integrated circuit ideally suited for today's high performance ISM band RF applications. It is intended for use as a high-performance, low-cost FSK and OOK RF transceiver for robust, frequency agile, half-duplex bi-directional RF links. The MC12311 is intended for applications over a wide frequency range, including the 868 MHz European and the 902-928 MHz North American ISM bands.
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-6 Freescale SemiconductorThe 12311-MRB uses a flexible RF path topology that make it suitable for working in different frequency bands by replacing a minimum number of components while providing good RF performance. The following table shows the different BOM according to different Frequency Bands of operation.NOTESee the MC12311 Data Sheet and Reference Manual for more RF design information.Figure 3-4. 12311-MRB RF Circuitry3.2.2 ClocksThe MC12311 provides for two clocks:• 32 MHz Reference Oscillator - Figure 3-5 shows the external 32 MHz external crystal Y1. This mounted crystal must meet the MC12311 specifications. — Capacitors C22 and C25 provide the bulk of the crystal load capacitance. — Signal DIO5/CLKOUT can be used to supply an external clock to MCU die and to measure a the 32MHz oscillator frequency. — The 12311-MRB has provision for injecting an external 32 MHz clock source as an alternative to use of the onboard crystal:– The crystal Y1 should be removed– C23 must be mounted– The external 32 MHz source is connected to 2-pin header J4.• Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal Y2 (see Figure 3-6). This oscillator can be used for a low power accurate time base.
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-7— The module comes provided with this Y2 crystal and its load capacitors C34 and C35.— Load capacitors C34 and C35 provide the entire crystal load capacitance— The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R10 and R11 enable use of IO signals PTB7 and PTB6 via the IO connector— Use J8 to enable crystal signaling to MCU die from the DIO5 or from the 32kHz crystal.Figure 3-5. 12311-MRB 32 MHz Reference Oscillator CircuitFigure 3-6. 12311-MRB 32.768 kHz Optional Oscillator Circuit
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-8 Freescale Semiconductor3.3 Reset and BDM Debug PortThe reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header locations.• Reset switch SW1 is active low and provides a hardware reset to the MC12311 MCU die and can also provide a RESET to the radio die by adding a jumper to J7. The Reset circuit also includes an LED for monitoring purposes.• The 6-pin BDM 2x3 header J5 is provided to connect the MC1213x serial debug port to a standard HC9S08 debug module.Figure 3-7. 12311-MRB Reset Switch and BDM Port
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-93.3.1 Power ManagementThe 12311-MRB power management circuit is shown in Figure 3-8. Figure 3-8. 12311-MRB Power Management CircuitPower to the 12311-MRB can be configured in several ways and the circuit has the following features:• Board can be supplied through the IO headers (V_BRD)• Board can be supplied from an external DC supply (J6)— The external supply can be unregulated (V_UNREG) and make use of the onboard 3.3 V LDO regulator— The external supply voltage can be used directly without use of the LDO• 8-Pin 2x4 header J13 provides means to supply current to various board components and also measure current if desired• Green LED D1 is available as a power indicator.Table 3-2 shows the header configuration information for the various power supply modes.NOTE• The Freescale TWR-RF development boards generate the system power supply on the motherboard and supply the voltage to the 12311-MRB through the V_BRD pin of Headers J2 and J3. In this mode, the current flows to the 12311-MRB through the pins.• If an external supply is used via 12311-MRB header J5, current flows to the motherboard through the V_BRD pin of Headers J2 and J3. THE MOTHERBOARD SUPPLY SHOULD NOT BE USED.• In all modes, the IO voltage supply of peripherals on a motherboard must be the same voltage as V_BRD, which is also the voltage applied to the IC MC1213x.
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-10 Freescale SemiconductorHeader J13 provides means to disable different sub-circuits or measure current and connections are described in Table 3-3. Current measurements can be made by inserting a current meter in place of a designated jumper.Table 3-2. 12311-MRB Power ConfigurationsMode VoltageRangeExternal SourceJ6Ext Mode SelectJ9Current EnableJ13 DescriptionSource V_BRD 2.7 - 3.6 V11The MC12311 can run as low as 1.8 VNot used Not used - all pins openShort Pins 3-4 -short other desired suppliesNormal Operation - The 12311-MRB main supply is supplied by the motherboard through the J15 and J14 HeadersExternal Source - Using LDO3.5 - 16 V Connected - suppliesDC VoltageShort Pins 1-2 Short pins for all desired suppliesExternal voltage w/regulation - • Input range is set by the LDO regulator. • 3.3 V is supplied to 12311-MRB; do not use motherboard supply • J14 and J15 Headers supply voltage to V_BRD pins when J13, Pins 3-4 are shortedExternal Source - Not Using LDO2.7 - 3.6 V Connected - suppliesDC VoltageShort Pins 2-3 Short pins for all desired suppliesExternal voltage w/o regulation - • Input range is set by the onboard circuitry • 2.7 - 3.3 V is supplied to 12311-MRB • J14 and J15 Headers supply voltage to V_BRD pinsTable 3-3. Power Distribution Header J13SupplyDesignationHeaderPins DescriptionV_RF 1 - 2 Supply voltage to MC12311 -Radio die • Normally jumpered • Supplies only the MC12311 Radio dieNormally always same voltage as V_BRDV_BRD 3 - 4 Supply voltage connected to IO Connectors J2 and J3 - • This supplies J2 and J3 if an external MRB supply is used • This voltage supplies the MRB if the motherboard is the main power • This connection is normally always jumperedV_IC 5 - 6 Supply voltage to MC12311 -MCU die • Normally jumpered • Supplies only the MC12311 MCU die • Normally always same voltage as V_BRDV_LED 7 - 8 Supply voltage to power indicator LED • Jumper to use indicator or IR blaster • Leave open for lowest power
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-113.3.2 IO Connectors J2 and J3The two IO connectors J14 and J15 are standard 100 mil pin headers mounted on the back (non-component side) of the 12311-MRB.The primary header J15 is 20-pin and the secondary header J14 is 18-pin, and they are mounted physically in such a manner as to prevent reverse insertion of the 12311-MRB into a motherboard receptacle (see Figure 3-2). When the TWR-RF, 1323x-RCM or 1323x-REM or custom motherboard is plugged into these connectors, they allow access to MC12311 MCU GPIO.• V_BRD is the connector supply voltage.— Depending on power supply configuration, this voltage may supply the 12311-MRB from the motherboard or the 12311-MRB may supply this voltage to the motherboard. See Section 3.3.1, “Power Management”.— Peripherals IO to the MC12311 and the MC12311 supply should use this same voltageNOTEThe TWR-RF, 1323x-RCM and 1323x-REM and 12311-MRB are supplied configured for the motherboard to supply main power.• Some of the GPIO are shared with onboard devices. Check for the 12311-MRB schematic and Table 3-4 and Table 3-5 for any conflict.• BDM port signal PTA4/BKGD is NOT connected to the IO headers to prevent possible interference with the debug port.Table 3-4. 20 Pin ConnectorHeader Pin Number MC12311 Pin Name Description1 V_BRD VDD supply to module2NC3 GND Module ground4NC5 PTB1/TXD UART TXD input to MCU6NC7 PTB0/RXD UART RXD Output from MCU8NC9 PTA7 GPIO / Timer IO10 RESET MCU Reset11 PTA2/SDA I2C Bus data signal (SDA)12 PTD4/KBI2P4 UART flow control RTS input into MCU (implemented in Freescale software)13 PTA3/SCL I2C Bus clock signal (SCL)14 PTD3/KBI2P UART flow control CTS output from MCU (implemented in Freescale software)15 GND Module ground16 DIO5/CLKOUT Reference Crystal Oscillator
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-12 Freescale Semiconductor17 PTA0/KBI1P0 Port A Bit 0 / KBI1 Input Bit 018 PTA1/KBI1P1 Port A Bit 1 / KBI1 Input Bit 119 PTB2/KBI1P2 Port B Bit 2 / KBI1 Input Bit 220 PTB3/KBI1P3 Port B Bit 3 / KBI1 Input Bit 3Table 3-5. 18 Pin ConnectorHeader Pin Number MC12311 Pin Name Description1 V_BRD VDD supply to module2 PTB7/EXTAL Port B Bit 7 - signal shared with 32.768 kHz oscillator3 PTB6/XTAL_32K Port B Bit 6 - signal shared with 32.768 kHz oscillator4 GND Module Ground5 PTB5/TPM1CH1 Port B Bit 5 6 PTB4/TPM2CH1 Port B Bit 47 PTC3/TPM3CH3 Port C Bit 38 PTC2/TPM3CH2 Port C Bit 2 9 PTC1/TPM3CH1 Port C Bit 110 PTD2 Port D Bit 211 PTA6/TPM1CH2 Port A Bit 612 PTC7 Port C Bit 713 PTC6 Port C Bit 614 PTC5/TPM3CH5 Port C Bit 515 PTC4/TPM3CH4 Port C Bit 416 DIO2 Transceiver GPIO Bit 217 DIO3 Transceiver GPIO Bit 318 GND Module ground Table 3-4. 20 Pin Connector (continued)Header Pin Number MC12311 Pin Name Description
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-14 Freescale SemiconductorFigure 3-10. Modular Reference Board PCB Component Location (Top View)Figure 3-11. Modular Reference Board PCB Test Points
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-15Figure 3-12. Modular Reference Board PCB Layout (Top View)Figure 3-13. Modular Reference Board PCB Layout (Bottom View)
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-16 Freescale Semiconductor3.4.1 Bill of MaterialsThe following table details the bill of materials.Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number1 4 BH1,BH2,BH3,BH4125 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER2 3 C1,C7,C23 (DNP)10PF CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A3 2 C5,C6 10PF CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A4 10 C14,C19,C20,C21,C24,C30,C31,C33,C37,C380.1UF CAP CER 0.1UF 16V 10% X7R 0402Kemet C0402C104K4RAC5 2 C16,C18 220PF CAP CER 220PF 50V 5% C0G 0402Kemet C0402C221J5GAC6 3 C17,C27,C280.01UF CAP CER 0.01UF 50V 10% X7R 0402Murata GCM155R71H103KA55D7 2 C22,C25 11PF CAP CER 11PF 50V 5% C0G 0402 Murata GRM1555C1H110JZ01D8 2 C34,C35 12PF CAP CER 12PF 50V 5% C0G 0402 Murata GRM1555C1H120JZ01D9 1 C26 10UF CAP CER 10UF 10V 10% X5R 0805Murata GRM21BR61A106KE19_10 1 C29 2.2UF CAP CER 2.2UF 10V 10% X7R 0603Murata GRM188R71A225KE15D11 1 C32 1UF CAP CER 1.0UF 10V 10% X7R 0603Murata GRM188R71A105KA61D12 1 C36 1000pF CAP CER 1000PF 50V 5% C0G 0402Murata GRM1555C1H102JA01D13 1 D1 GREEN LED GRN SGL 30MA SMT 0805 Lite On LTST-C171KGKT14 2 D2,D3 MBR0520LT1G DIODE SCH 0.5A 20V SOD-123 On Semiconductor MBR0520LT1G15 1 D4 RED LED RED CLEAR SGL 30MA SMT 0805Lite On LTST-C171KRKT16 2 J1,J2 CON_1_SMA CON 1 COAX SMA SKT TH -- 376H AUSamtec SMA-J-P-H-ST-TH117 6 J3,J4,J6,J7,J10,J11HDR 1X2 HDR 1X2 TH 100MIL SP 330H SN 115LSamtec TSW-102-07-T-S18 1 J5 HDR 2X3 HDR 2X3 TH 100MIL CTR 335H AU 95LSamtec TSW-103-07-S-D19 2 J8,J9 HDR TH 1X3 HDR 1X3 TH 100MIL SP 339H AU 100LSamtec TSW-103-07-G-S
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-1720 1 J12 961204-6404-ARHDR 2X2 TH 100MIL CTR 323H AU 130L3m 961204-6404-AR21 1 J13 HDR_2X4 HDR 2X4 TH 100MIL CTR 330H AU 100LSamtec TSW-104-07-S-D22 1 J14 HDR 2X9 HDR 2X9 TH 100MIL CTR 330H AUSamtec TSW-109-07-S-D23 1 J15 HDR_10X2 HDR 2X10 TH 100MIL CTR 330H AU 100LSamtec TSW-110-07-S-D24 1 L6 33nH IND -- 0.033UH@100MHZ 200MA 5% 0402Toko Inc. LL1005-FHL33NJ25 2 R2,R4 4.7K RES MF 4.7K 1/10W 5% 0603 Vishay Intertechnology CRCW06034K70JNEA26 1 R3 330 RES MF 330 OHM 1/16W 5% 0402 Vishay Intertechnology CRCW0402330RJNED27 6 R5,R7,R8,R9,R10,R110 RES MF ZERO OHM 1/10W -- 0603Vishay Intertechnology CRCW06030000Z0EA28 1 R6 10.0K RES MF 10.0K 1/16W 1% 0402 Vishay Intertechnology CRCW040210K0FKED29 1 R12 15K RES MF 15K 1/16W 5% 0402 Vishay Intertechnology CRCW040215K0JNED30 1 R13 422 RES MF 422 OHM 1/10W 1% 0603Yageo America RC0603FR-07422RL31 1 SW1 SW_MOM SW SPST MOM PB 50MA 12V SMTAlps Electric (Usa) Inc. SKQYPDE01032 3 TL1,TL2,TL3TESTLOOP TEST POINT PAD SIZE 3.4MM X 1.8MM SMTKeystone Electronics 501533 22 TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,TP10,TP11,TP12,TP13,TP14,TP15,TP16,TP17,TP18,TP19,TP20,TP21,TP22TPAD_040 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDERNotacomponent NOTACOMPONENT34 1 U1 MC12311 IC MCU 8BIT 32KB FLASH 2KB RAM 50MHZ 1.8-3.6V LGA60Freescale SemiconductorMC1231135 1 U2 LP2985AIM5-3.3IC VREG LDO 3.3V 150MA 3.8-16V SOT-23-5National SemiconductorLP2985AIM5-3.3/NOPB36 1 Y1 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MMNdk EXS00A-CS0236837 1 Y2 32.768KHZ XTAL 32.768KHZ SMT ROHS COMPLIANTEpson Electronics FC-135 32.7680KA-A3Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number
12311-MRB12311 Development Hardware Reference Manual, Rev. 1 3-18 Freescale Semiconductor1 1 C2 3.3pf CAP CER 3.3PF 25V 0.1PF -- 0402AVX 04023J3R3BBSTR2 1 C4 5.6PF CAP CER 5.6PF 50V +/-0.25PF C0G CC0402MURATA GJM1555C1H5R6CB01D3 2 C3,C9 6.8PF CAP CER 6.8PF 50V 0.5PF C0G 0402MURATA GRM1555C1H6R8DZ01J4 1 C10 47PF CAP CER 47PF 50V 5% C0G 0402 CAL-CHIP GMC04CG470J50NT-LF5 1 C13 8.2PF CAP CER 8.2PF 50V 0.25PF C0G 0402AVX 04025A8R2CAT2A6 1 C15 4.7PF CAP CER 4.7PF 50V 0.25PF C0G 0402MURATA GRM1555C1H4R7CA01D7 2 C8,C11 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A8 1 C12 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A9 2 L1,L3 5.6NH IND AIR 5.6NH@100MHZ 300MA 0.3NH 0402muRata LQG15HN5N6S02D10 2 L2,L4 0.0068UH IND -- 0.0068UH@100MHZ 300MA 5% 0402MURATA LQG15HS6N8J02D11 1 L7 0.0039UH IND -- 0.0039UH@100MHZ 300MA +/-0.3NH 0402MURATA LQG15HN3N9S02D12 1 L5 33nH IND -- 0.033UH@100MHZ 200MA 5% 0402TOKO INC. LL1005-FHL33NJ13 1 R1 (L9 in 433 BOM)0 RES MF ZERO OHM 1/10W -- 0402Panasonic ERJ-2GE0R00XTable 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number
12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 4-1Chapter 4 PCB Manufacturing SpecificationsThis chapter provides the specifications used to manufacture the MC12311 Development hardware printed circuit board (PCB) described in this manual.The MC12311 Development hardware PCBs must comply with the following:• The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm)• The PCB manufacturer’s logo is required• The PCB production week and year code is required— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc.• The required Underwriter’s Laboratory (UL) Flammability Rating— The level is 94V-0 (http://www.ul.com/plastics/flame.html)— The UL information must be stamped on the back of the PCB solder maskNOTE• A complete set of design files is available for the 12311 Development hardware at the Freescale web site (http:www.freescale.com/802154) under reference designs. It is recommended that this design or one of a number of other reference designs be used as a starting point for a custom application.• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the same web site to provide additional design guidance.4.1 Single PCB ConstructionThis section describes individual PCB construction details.• The MC12311 PCB is a four-layer, multi layer designs• The PCBs contains no blind, buried, or micro vias• PCB data:— MC12311 Size: Approximately 51 x 51mm (2.01 x 2.01 inches)— MC12311 Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask)The following table defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms.
PCB Manufacturing Specifications12311 Development Hardware Reference Manual, Rev. 1 4-2 Freescale SemiconductorNOTEThe MC12311 contains sub 1 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup (see Figure 4-1) information is provided with the reference design.Figure 4-1. MC12311 PCB Stackup Cross-Section (Four Layer)• Solder mask is required• Silk screen is required4.2 PanelizationThe panel size can be negotiated depending on production volume.4.3 MaterialsThe PCB composite materials must meet the following requirements:• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance.Table 4-1. MC12311 Layer by Layer OverviewLayer Artwork Identification File Name1 Silkscreen Top SILK_TOP.art2 Top Layer Metal TOP.art3 Ground Layer GND.art4 Power Layer PWR.art5 Bottom Layer Metal BOTTOM.art6 Silkscreen Bottom SILK_BOTTOM.artDielectricDielectricDielectricMetal 1Metal 2Metal 3Metal 4
PCB Manufacturing Specifications12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 4-3• Copper Foil - — Top and Bottom copper layers must be 1 oz. copper— Interior layers must be 1/2 oz. copper• Plating - All pad plating must be Hot Air Levelling (HAL)4.4 Solder MaskThe solder mask must meet the following requirements: • Solder mask type: Liquid Film Electra EMP110 or equivalent• Solder mask thickness: 10 – 30 µm4.5 Silk ScreenThe silk screen must meet the following requirements:• Silkscreen color: White• Silkscreen must be applied after application of solder mask if solder mask is required• The silkscreen ink must not extend into any plated-thru-holes• The silk screen must be clipped back to the line of resistance4.6 Electrical PCB Testing• All PCBs must be 100 percent tested for opens and shorts• Impedance Measurement - An impedance measurement report is not mandatory4.7 Packaging Packaging for the PCBs must be the following requirements:• Finished PCBs must remain in panel• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability.4.8 Hole Specification/Tool TableSee the ncdrill-1-4.tap file included with the Gerber files and the FAB-23451.pdf file.
PCB Manufacturing Specifications12311 Development Hardware Reference Manual, Rev. 1 4-4 Freescale Semiconductor4.9 File DescriptionFiles included with the download include Design, Gerber and PDF files. Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing.PDF files included are:• FAB-27108.pdf — Board fabrication drawing• GRB-27108.zip — Metal layers, solder mask, solder paste and silk screen• SPF-27108.pdf — SchematicDesign files are in Allegro format with OrCAD schematic capture.

Navigation menu