Freescale Semiconductor 1231X-MRB Developmental Board User Manual 12311DHRM
Freescale Semiconductor, Inc. Developmental Board 12311DHRM
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| Date Submitted | 2012-07-10 00:00:00 |
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12311 Development Hardware Reference Manual Document Number: 12311DHRM Rev. 1 03/2012 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008, 2009, 2010, 2011, 2012. All rights reserved. Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Chapter 1 Safety Information 1.1 1.1.1 1.1.2 1.1.3 1.1.4 1.2 1.2.1 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 MC12311 Development Platform Overview and Description 2.1 2.2 2.2.1 2.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TWR-RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-2 2-3 2-4 Chapter 3 12311-MRB 3.1 3.1.1 3.1.2 3.1.3 3.2 3.2.1 3.2.2 3.3 3.3.1 3.3.2 3.4 3.4.1 12311-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor iii Chapter 4 PCB Manufacturing Specifications 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4-2 4-2 4-3 4-3 4-3 4-3 4-3 4-4 12311 Development Hardware Reference Manual, Rev. 1 iv Freescale Semiconductor About This Book This manual describes Freescale’s 12311-MRB development platform hardware. The MC12311 development platform is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller. Audience This manual is intended for system designers. Organization This document is organized into the following chapters. Chapter 1 Safety Information — Highlights some of the FCC requirements. Chapter 2 HCS08 Development Platform Overview and Description — Provides an overview of the two boards that comprise the MC12311 development platform. Chapter 3 Modular Reference Board — This chapter details the 12311-MRB evaluation board based on the Freescale MC12311 device. Chapter 4 PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the various 12311-MRB printed circuit boards (PCBs). Revision History The following table summarizes revisions to this document since the previous release (Rev 0.0). Revision History Location Chapter 3 Revision New schematic for Figure 3-9. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard CTS Clear to Send DAC Digital to Analog Converter I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.4 GHz radio frequency band JTAG Joint Test Action Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit PCB Printed circuit board PiP Platform in Package PWM Pulse-width modulation RCM Remote Control Module REM Remote Extender Board RTS Request to Send SMA Connector SubMiniature version “A” connector SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port 12311 Development Hardware Reference Manual, Rev. 1 vi Freescale Semiconductor Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful. 1.1.1 Labeling FCC labels are physically located on the back of the board. 1.1.2 Operating Conditions This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference. • This device must accept any interference received, including interference that may cause undesired operation. 1.1.3 Exposure Limits This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. 1.1.4 Antenna Restrictions An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 1-1 Safety Information radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.2 Regulatory Approval For Canada (IC RSS 210) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: 1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device. 1.2.1 26 PART 5 – Appendix Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.3 Electrostatic Discharge Considerations Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM). All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test. When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods: • Flexible fabric, solid fixed size, or disposable ESD wrist straps • Static control workstations, static control monitors and table or floor static control systems • Static control packaging and transportation materials and environmental systems 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 12311 Development Hardware Reference Manual, Rev. 1 1-2 Freescale Semiconductor Chapter 2 MC12311 Development Platform Overview and Description 2.1 Introduction The MC12311 development platform is an evaluation environment based on the Freescale MC12311 device. The MC12311 is a highly-integrated, cost-effective, system-in-package (SIP), sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller. This configuration allows users to minimize the use of external components. The MC12311 is targeted for the following low-power wireless applications: • Automated Meter Reading • Wireless Sensor Networks • Home and Building Automation • Wireless Alarm and Security Systems • Industrial Monitoring and Control • Wireless MBUS Standard (EN13757-4:2005) Freescale supplements the MC12311 with tools and software that include hardware evaluation and development boards, software development IDE and applications, drivers, custom PHY usable with Freescale’s IEEE 802.15.4 compatible MAC, and an available wireless MBUS solution. The MC12311 development platform is comprised of two boards: • 12311-Modular Reference Board (12311-MRB) - this board contains the MC12311 device with 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The board can be used as a simple standalone evaluation platform or as a daughter card to the other MC12311 development platform boards or to a custom, application specific motherboard. — Provides compact reference design for device footprint and RF layout — Provides pre-designed MC12311 hardware (device and function) — Provides access to the MC12311 full set of GPIO — Provides MCU BDM debug port — Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED and power management. • TWR-RF Board . The TWR-RF board is a motherboard for the MC12311 and 12311-MRB daughter boards, to enable its use within the Tower system. The TWR-RF board is a Tower Controller Module compatible with the Freescale Tower System. The 12311-MRB + TWR-RF can run standalone, outside the Tower system. The following list summarizes the features of the TWR-RF Module: 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 2-1 MC12311 Development Platform Overview and Description — Standard sockets 100 mils J5 and J4 (2X9 and 2x10) to connect MC12311 and 12311-MRB daughter boards — Standard header 100 mils J1 (2x20) to enable signalling path to TWR primary and secondary connectors. — Standard header 100 mils J6 (3x12) to enable signalling to on board HW and USB interface or to TWR system Hardware — On-board regulator to provide external supply — Four (4) user-controllable LEDs — Four (4) user push-button switches — USB Type B connector Whether the 12311-MRB is used in a simple standalone application or in combination with another host card, Freescale provides a complete software development environment called the Freescale BeeKit Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI) allows users to create, modify, and update various wireless networking implementations. A wide range of software functionality is available to complement the 12311-MRB and these are provided as codebases within BeeKit. 2.2 Features The MC12311 development platform is built around the concept of having a single daughter card (12311-MRB) that contains the MC12311 IC and all necessary I/O connections for use as a self-contained module or for connection to an application motherboard like the TWR-RF board. Figure 2-1 shows a photo of the 12311-MRB. Figure 2-1. 12311-MRB Features of the MC12311 development platform include: 12311 Development Hardware Reference Manual, Rev. 1 2-2 Freescale Semiconductor MC12311 Development Platform Overview and Description • • • • • • • • 2.2.1 Based on Freescale’s low-cost MC12311 sub-1GHz wireless node solution with an FSK or OOK modulation-capable transceiver and low-power QE32 8-bit microcontroller, and a functional set of MCU peripherals into a 60-pin LGA package Reference design area with small footprint, low cost RF node — Unbalance input/output port — Flexible RF-Front End for different bands operation — High Sensitivity: down to -120dBm at 1.2kbps 32 MHz reference oscillator BDM serial MCU debug port Optional secondary 32.768 kHz crystal oscillator for accurate low power timing Master reset switch Full power regulation and management 12311-MRB board provides — Required circuitry for MC12311 - crystals and RF circuitry — Local power supply regulation — Access to all GPIO — Standalone or daughter card use modes — BDM connector TWR-RF Module The 12311-MRB can run in the Freescale Tower System using the RF-Tower module (TWR-RF). Features of the TWR-RF module include: • Standard sockets 100 mils J5 and J4 (2 x 9 and 2 x 10) to connect either a 1323x Modular Reference Board (1323x-MRB) or a 12311 Modular Reference Board (12311-MRB) • Standard header 100 mils J1 (2 x 20) to enable signalling path to TWR primary and secondary connectors. • Standard header 100 mils J6 (3 x 12) to enable signalling to on board HW and USB interface or to TWR system Hardware • On-board regulator to provide external supply • Four (4) user-controllable LEDs • Four (4) user push-button switches • USB Type B connector Figure 2-2 shows a simplified block diagram of the Freescale Tower RF system. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 2-3 MC12311 Development Platform Overview and Description Figure 2-2. Simplified TWR-RF Block Diagram See the TWR-RF Reference Manual for more information about the RF-Tower module. 2.3 Driver Considerations When users first connect a 12311-MRB to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory: C:\Program Files\Freescale\Drivers If installing the BeeKit software package to another drive or directory, indicate the Drivers directory created by the installer in the custom location where BeeKit was installed. Follow the instructions as they appear on the screen to complete driver installation. If BeeKit is not installed, be aware of the following: • The boards use FSL USB2SER USB to UART bridge converter. • Download the appropriate driver and follow the instructions to complete driver installation from www.freescale.com. 12311 Development Hardware Reference Manual, Rev. 1 2-4 Freescale Semiconductor Chapter 3 12311-MRB 3.1 12311-MRB Overview The 12311-MRB is an evaluation board based on the Freescale MC12311 device. The 12311-MRB provides a platform to evaluate the MC12311 device, develop software and applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including SMA for antenna connection and/or instrumentation, and supporting circuitry. This basic board is intended as the core module for MC12311 evaluation and application development and can be used in the following modes: • Simple standalone evaluation platform • Daughtercard to other Development Platform boards (TWR-RF, 1323x-RCM or 1323x-REM) • Daughtercard to an application specific motherboard. 3.1.1 Features The 12311-MRB provides the following features: • Small form factor (2 x 2 inches) • 4-Layer metal, 0.034 inch thick FR4 board • MC12311 reference design area — LGA footprint and power supply bypass — 32 MHz reference oscillator crystal — RF components and layout • Low cost RF node — Differential input/output port (typically used with a balun) — High sensitivity of -120 dBm at 1.2 KBPS — SMA output connector for Transmit/Receive Output • Two connectors provided daughter card mounting — 20-Pin primary connector — 18-Pin secondary connector — Provide main supply voltage to board — Provide access to all MC12311 GPIO • Flexible board power supply — 3.3 V LDO series regulator supplied 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-1 12311-MRB • • 3.1.2 — Regulator bypass jumper option — Separate external voltage source option — Power-on green LED — Jumpers allow various block current measurements 6-Pin BDM serial MCU debug port MC12311 reset switch Form Factor Figure 3-1 shows the 12311-MRB connector and header locations. PA Boost SMA (J1) J8 RFIO ScMA (J2) J3 J4 J6 J9 BDM port (J5) J7 J13 J12 J11 J10 Reset SW Primary 20‐pin IO Connector (J15) Secondary 18‐pin IO Connector (J14) Figure 3-1. 12311-MRB Figure 3-2 shows a footprint of the 12311-MRB with the location of the IO Headers J2 and J3. Users can create a motherboard to mount the 12311-MRB and headers J2 and J3 are used for that connection. • Both headers have standard 0.10in / 2.54 mm pin spacing • J2 is 20-pin and J3 is 18-pin • Both are pin headers mounted on the bottom side of the 12311-MRB and are intended to plug into matching receptacles on the motherboard. 12311 Development Hardware Reference Manual, Rev. 1 3-2 Freescale Semiconductor 12311-MRB Figure 3-2. 12311-MRB Top Side (Component Side) Footprint 3.1.3 Board Level Specifications Table 3-1. 12311-MRB Specifications Parameter Min Typ Max Units 51 x 51 2.01 x 2.01 mm inches Notes/Conditions General Size (PCB: X, Y) Layer build (PCB) 0.8 0.034 mm 4-Layer inches Dielectric material (PCB) FR4 Power Voltage supply (DC) With 3.3 V regulator in use Current consumption 3.50 10 TBD mA Full module use 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-3 12311-MRB Table 3-1. 12311-MRB Specifications (continued) Parameter Min Typ Max Units Notes/Conditions Operating temperature (see note) -40 +25 +70 °C • Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C. Storage temperature -30 +25 +70 °C Temperature RF Receiver FSK Sensitivity -105 to -120 dBm OOK Sensitivity -112 dBm Adjacent channel Rejection (Offset = +/- 25 KHz or 50 KHz) -42 dB 2nd order Intercept point +75 dBm 3rd order Intercept point +20 dBm RSSI dynamic range -115 -18 -3 dBm -37 dBm RF Transmitter RF Power Output (RFIO pin) Adjacent channel Power (25KHz offset) Programmable in 1dB steps Regulatory Approval FCC Product is approved accordingly to the FCC part 15 standard CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 12311 Development Hardware Reference Manual, Rev. 1 3-4 Freescale Semiconductor 12311-MRB 3.2 Functional Description The 12311-MRB is built around Freescale’s MC12311 56-pin LGA platform. Figure 3-2 shows a simple block diagram. This board is intended as a simple evaluation platform and as a building block for application development. The 4-layer board provides the MC12311 with its required RF circuitry, 32 MHz reference oscillator crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference layout by the user target board. In additional to the base MC12311 functionality, the 12311-MRB provides features to assist in debug, reset button, simple power manager, and expansion connectors for the GPIO. In the following sections, refer to: • Figure 3-1 for location of connectors and features • Figure 3-3 for the functional blocks • Figure 3-9 for the board schematic Figure 3-3. 12311-MRB Block Diagram 3.2.1 RF Performance and Considerations The MC12311 transceiver is a single-chip integrated circuit ideally suited for today's high performance ISM band RF applications. It is intended for use as a high-performance, low-cost FSK and OOK RF transceiver for robust, frequency agile, half-duplex bi-directional RF links. The MC12311 is intended for applications over a wide frequency range, including the 868 MHz European and the 902-928 MHz North American ISM bands. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-5 12311-MRB The 12311-MRB uses a flexible RF path topology that make it suitable for working in different frequency bands by replacing a minimum number of components while providing good RF performance. The following table shows the different BOM according to different Frequency Bands of operation. NOTE See the MC12311 Data Sheet and Reference Manual for more RF design information. Figure 3-4. 12311-MRB RF Circuitry 3.2.2 Clocks The MC12311 provides for two clocks: • 32 MHz Reference Oscillator - Figure 3-5 shows the external 32 MHz external crystal Y1. This mounted crystal must meet the MC12311 specifications. — Capacitors C22 and C25 provide the bulk of the crystal load capacitance. — Signal DIO5/CLKOUT can be used to supply an external clock to MCU die and to measure a the 32MHz oscillator frequency. — The 12311-MRB has provision for injecting an external 32 MHz clock source as an alternative to use of the onboard crystal: – The crystal Y1 should be removed – C23 must be mounted – The external 32 MHz source is connected to 2-pin header J4. • Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal Y2 (see Figure 3-6). This oscillator can be used for a low power accurate time base. 12311 Development Hardware Reference Manual, Rev. 1 3-6 Freescale Semiconductor 12311-MRB — The module comes provided with this Y2 crystal and its load capacitors C34 and C35. — Load capacitors C34 and C35 provide the entire crystal load capacitance — The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R10 and R11 enable use of IO signals PTB7 and PTB6 via the IO connector — Use J8 to enable crystal signaling to MCU die from the DIO5 or from the 32kHz crystal. Figure 3-5. 12311-MRB 32 MHz Reference Oscillator Circuit Figure 3-6. 12311-MRB 32.768 kHz Optional Oscillator Circuit 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-7 12311-MRB 3.3 Reset and BDM Debug Port The reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header locations. • Reset switch SW1 is active low and provides a hardware reset to the MC12311 MCU die and can also provide a RESET to the radio die by adding a jumper to J7. The Reset circuit also includes an LED for monitoring purposes. • The 6-pin BDM 2x3 header J5 is provided to connect the MC1213x serial debug port to a standard HC9S08 debug module. Figure 3-7. 12311-MRB Reset Switch and BDM Port 12311 Development Hardware Reference Manual, Rev. 1 3-8 Freescale Semiconductor 12311-MRB 3.3.1 Power Management The 12311-MRB power management circuit is shown in Figure 3-8. Figure 3-8. 12311-MRB Power Management Circuit Power to the 12311-MRB can be configured in several ways and the circuit has the following features: • Board can be supplied through the IO headers (V_BRD) • Board can be supplied from an external DC supply (J6) — The external supply can be unregulated (V_UNREG) and make use of the onboard 3.3 V LDO regulator — The external supply voltage can be used directly without use of the LDO • 8-Pin 2x4 header J13 provides means to supply current to various board components and also measure current if desired • Green LED D1 is available as a power indicator. Table 3-2 shows the header configuration information for the various power supply modes. • • • NOTE The Freescale TWR-RF development boards generate the system power supply on the motherboard and supply the voltage to the 12311-MRB through the V_BRD pin of Headers J2 and J3. In this mode, the current flows to the 12311-MRB through the pins. If an external supply is used via 12311-MRB header J5, current flows to the motherboard through the V_BRD pin of Headers J2 and J3. THE MOTHERBOARD SUPPLY SHOULD NOT BE USED. In all modes, the IO voltage supply of peripherals on a motherboard must be the same voltage as V_BRD, which is also the voltage applied to the IC MC1213x. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-9 12311-MRB Table 3-2. 12311-MRB Power Configurations Mode Voltage Range External Source J6 Ext Mode Select J9 Source V_BRD 2.7 - 3.6 V1 Not used Not used - all pins open External Source - Using LDO 3.5 - 16 V Connected supplies DC Voltage Short Pins 1-2 Short pins for all desired supplies External voltage w/regulation • Input range is set by the LDO regulator. • 3.3 V is supplied to 12311-MRB; do not use motherboard supply • J14 and J15 Headers supply voltage to V_BRD pins when J13, Pins 3-4 are shorted External Source - Not Using LDO 2.7 - 3.6 V Connected supplies DC Voltage Short Pins 2-3 Short pins for all desired supplies External voltage w/o regulation • Input range is set by the onboard circuitry • 2.7 - 3.3 V is supplied to 12311-MRB • J14 and J15 Headers supply voltage to V_BRD pins Current Enable J13 Description Short Pins 3-4 - Normal Operation short other desired The 12311-MRB main supply is supplies supplied by the motherboard through the J15 and J14 Headers The MC12311 can run as low as 1.8 V Header J13 provides means to disable different sub-circuits or measure current and connections are described in Table 3-3. Current measurements can be made by inserting a current meter in place of a designated jumper. Table 3-3. Power Distribution Header J13 Supply Designation Header Pins V_RF 1-2 Supply voltage to MC12311 -Radio die • Normally jumpered • Supplies only the MC12311 Radio die Normally always same voltage as V_BRD V_BRD 3-4 Supply voltage connected to IO Connectors J2 and J3 • This supplies J2 and J3 if an external MRB supply is used • This voltage supplies the MRB if the motherboard is the main power • This connection is normally always jumpered V_IC 5-6 Supply voltage to MC12311 -MCU die • Normally jumpered • Supplies only the MC12311 MCU die • Normally always same voltage as V_BRD V_LED 7-8 Supply voltage to power indicator LED • Jumper to use indicator or IR blaster • Leave open for lowest power Description 12311 Development Hardware Reference Manual, Rev. 1 3-10 Freescale Semiconductor 12311-MRB 3.3.2 IO Connectors J2 and J3 The two IO connectors J14 and J15 are standard 100 mil pin headers mounted on the back (non-component side) of the 12311-MRB.The primary header J15 is 20-pin and the secondary header J14 is 18-pin, and they are mounted physically in such a manner as to prevent reverse insertion of the 12311-MRB into a motherboard receptacle (see Figure 3-2). When the TWR-RF, 1323x-RCM or 1323x-REM or custom motherboard is plugged into these connectors, they allow access to MC12311 MCU GPIO. • V_BRD is the connector supply voltage. — Depending on power supply configuration, this voltage may supply the 12311-MRB from the motherboard or the 12311-MRB may supply this voltage to the motherboard. See Section 3.3.1, “Power Management”. — Peripherals IO to the MC12311 and the MC12311 supply should use this same voltage NOTE The TWR-RF, 1323x-RCM and 1323x-REM and 12311-MRB are supplied configured for the motherboard to supply main power. • Some of the GPIO are shared with onboard devices. Check for the 12311-MRB schematic and Table 3-4 and Table 3-5 for any conflict. BDM port signal PTA4/BKGD is NOT connected to the IO headers to prevent possible interference with the debug port. • Table 3-4. 20 Pin Connector Header Pin Number MC12311 Pin Name V_BRD NC GND NC PTB1/TXD NC PTB0/RXD NC PTA7 10 RESET 11 PTA2/SDA 12 PTD4/KBI2P4 13 PTA3/SCL 14 PTD3/KBI2P 15 GND 16 DIO5/CLKOUT Description VDD supply to module Module ground UART TXD input to MCU UART RXD Output from MCU GPIO / Timer IO MCU Reset I2C Bus data signal (SDA) UART flow control RTS input into MCU (implemented in Freescale software) I2C Bus clock signal (SCL) UART flow control CTS output from MCU (implemented in Freescale software) Module ground Reference Crystal Oscillator 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-11 12311-MRB Table 3-4. 20 Pin Connector (continued) Header Pin Number MC12311 Pin Name 17 PTA0/KBI1P0 Port A Bit 0 / KBI1 Input Bit 0 18 PTA1/KBI1P1 Port A Bit 1 / KBI1 Input Bit 1 19 PTB2/KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 20 PTB3/KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 Description Table 3-5. 18 Pin Connector Header Pin Number MC12311 Pin Name V_BRD PTB7/EXTAL Port B Bit 7 - signal shared with 32.768 kHz oscillator PTB6/XTAL_32K Port B Bit 6 - signal shared with 32.768 kHz oscillator GND PTB5/TPM1CH1 Port B Bit 5 PTB4/TPM2CH1 Port B Bit 4 PTC3/TPM3CH3 Port C Bit 3 PTC2/TPM3CH2 Port C Bit 2 PTC1/TPM3CH1 Port C Bit 1 10 PTD2 Port D Bit 2 11 PTA6/TPM1CH2 Port A Bit 6 12 PTC7 Port C Bit 7 13 PTC6 Port C Bit 6 14 PTC5/TPM3CH5 Port C Bit 5 15 PTC4/TPM3CH4 Port C Bit 4 16 DIO2 Transceiver GPIO Bit 2 17 DIO3 Transceiver GPIO Bit 3 18 GND Module ground Description VDD supply to module Module Ground 12311 Development Hardware Reference Manual, Rev. 1 3-12 Freescale Semiconductor 12311-MRB Figure 3-10. Modular Reference Board PCB Component Location (Top View) Figure 3-11. Modular Reference Board PCB Test Points 12311 Development Hardware Reference Manual, Rev. 1 3-14 Freescale Semiconductor 12311-MRB Figure 3-12. Modular Reference Board PCB Layout (Top View) Figure 3-13. Modular Reference Board PCB Layout (Bottom View) 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-15 12311-MRB 3.4.1 Bill of Materials The following table details the bill of materials. Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number BH1,BH2,B 125 H3,BH4 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER C1,C7,C23 10PF (DNP) CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A C5,C6 CAP CER 10PF 50V 5% C0G 0402 Avx 04025A100JAT2A 10 C14,C19,C 0.1UF 20,C21,C2 4,C30,C31, C33,C37,C 38 CAP CER 0.1UF 16V 10% X7R 0402 Kemet C0402C104K4RAC C16,C18 CAP CER 220PF 50V 5% C0G 0402 Kemet C0402C221J5GAC C17,C27,C 0.01UF 28 CAP CER 0.01UF 50V 10% X7R 0402 Murata GCM155R71H103KA55D C22,C25 11PF CAP CER 11PF 50V 5% C0G 0402 Murata GRM1555C1H110JZ01D C34,C35 12PF CAP CER 12PF 50V 5% C0G 0402 Murata GRM1555C1H120JZ01D C26 10UF CAP CER 10UF 10V 10% X5R 0805 Murata GRM21BR61A106KE19_ 10 C29 2.2UF CAP CER 2.2UF 10V 10% X7R 0603 Murata GRM188R71A225KE15D 11 C32 1UF CAP CER 1.0UF 10V 10% X7R 0603 Murata GRM188R71A105KA61D 12 C36 1000pF CAP CER 1000PF 50V 5% C0G 0402 Murata GRM1555C1H102JA01D 13 D1 GREEN LED GRN SGL 30MA SMT 0805 Lite On LTST-C171KGKT 14 D2,D3 MBR0520LT1G DIODE SCH 0.5A 20V SOD-123 On Semiconductor MBR0520LT1G 15 D4 RED LED RED CLEAR SGL 30MA SMT Lite On 0805 LTST-C171KRKT 16 J1,J2 CON_1_SMA CON 1 COAX SMA SKT TH -376H AU SMA-J-P-H-ST-TH1 17 J3,J4,J6,J7 HDR 1X2 ,J10,J11 HDR 1X2 TH 100MIL SP 330H SN Samtec 115L TSW-102-07-T-S 18 J5 HDR 2X3 HDR 2X3 TH 100MIL CTR 335H AU 95L Samtec TSW-103-07-S-D 19 J8,J9 HDR TH 1X3 HDR 1X3 TH 100MIL SP 339H AU Samtec 100L TSW-103-07-G-S 10PF 220PF Samtec 12311 Development Hardware Reference Manual, Rev. 1 3-16 Freescale Semiconductor 12311-MRB Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number 20 J12 961204-6404-A HDR 2X2 TH 100MIL CTR 323H AU 130L 3m 961204-6404-AR 21 J13 HDR_2X4 HDR 2X4 TH 100MIL CTR 330H AU 100L Samtec TSW-104-07-S-D 22 J14 HDR 2X9 HDR 2X9 TH 100MIL CTR 330H AU Samtec TSW-109-07-S-D 23 J15 HDR_10X2 HDR 2X10 TH 100MIL CTR 330H AU 100L Samtec TSW-110-07-S-D 24 L6 33nH IND -- 0.033UH@100MHZ 200MA Toko Inc. 5% 0402 25 R2,R4 4.7K RES MF 4.7K 1/10W 5% 0603 26 R3 330 RES MF 330 OHM 1/16W 5% 0402 Vishay Intertechnology CRCW0402330RJNED 27 R5,R7,R8, 0 R9,R10,R1 RES MF ZERO OHM 1/10W -0603 Vishay Intertechnology CRCW06030000Z0EA 28 R6 10.0K RES MF 10.0K 1/16W 1% 0402 Vishay Intertechnology CRCW040210K0FKED 29 R12 15K RES MF 15K 1/16W 5% 0402 Vishay Intertechnology CRCW040215K0JNED 30 R13 422 RES MF 422 OHM 1/10W 1% 0603 Yageo America 31 SW1 SW_MOM SW SPST MOM PB 50MA 12V SMT Alps Electric (Usa) Inc. SKQYPDE010 32 TL1,TL2,TL TESTLOOP TEST POINT PAD SIZE 3.4MM X 1.8MM SMT Keystone Electronics 33 22 TP1,TP2,T TPAD_040 P3,TP4,TP 5,TP6,TP7, TP8,TP9,T P10,TP11, TP12,TP13 ,TP14,TP1 5,TP16,TP 17,TP18,T P19,TP20, TP21,TP22 TEST POINT PAD 40MIL DIA SMT, Notacomponent NO PART TO ORDER NOTACOMPONENT 34 U1 MC12311 IC MCU 8BIT 32KB FLASH 2KB RAM 50MHZ 1.8-3.6V LGA60 Freescale Semiconductor MC12311 35 U2 LP2985AIM5-3 IC VREG LDO 3.3V 150MA .3 3.8-16V SOT-23-5 National Semiconductor LP2985AIM5-3.3/NOPB 36 Y1 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MM Ndk EXS00A-CS02368 37 Y2 32.768KHZ XTAL 32.768KHZ SMT ROHS COMPLIANT Epson Electronics FC-135 32.7680KA-A3 LL1005-FHL33NJ Vishay Intertechnology CRCW06034K70JNEA RC0603FR-07422RL 5015 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 3-17 12311-MRB Table 3-6. Bill of Materials Item Qty Reference Value Description Mfg. Name Mfg. Part Number C2 3.3pf CAP CER 3.3PF 25V 0.1PF -0402 AVX 04023J3R3BBSTR C4 5.6PF CAP CER 5.6PF 50V +/-0.25PF C0G CC0402 MURATA GJM1555C1H5R6CB01D C3,C9 6.8PF CAP CER 6.8PF 50V 0.5PF C0G 0402 MURATA GRM1555C1H6R8DZ01J C10 47PF CAP CER 47PF 50V 5% C0G 0402 CAL-CHIP GMC04CG470J50NT-LF C13 8.2PF CAP CER 8.2PF 50V 0.25PF C0G AVX 0402 04025A8R2CAT2A C15 4.7PF CAP CER 4.7PF 50V 0.25PF C0G MURATA 0402 GRM1555C1H4R7CA01D C8,C11 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A C12 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A L1,L3 5.6NH IND AIR 5.6NH@100MHZ 300MA muRata 0.3NH 0402 LQG15HN5N6S02D 10 L2,L4 0.0068UH IND -- 0.0068UH@100MHZ 300MA 5% 0402 MURATA LQG15HS6N8J02D 11 L7 0.0039UH IND -- 0.0039UH@100MHZ 300MA +/-0.3NH 0402 MURATA LQG15HN3N9S02D 12 L5 33nH IND -- 0.033UH@100MHZ 200MA TOKO INC. 5% 0402 LL1005-FHL33NJ 13 R1 (L9 in 433 BOM) RES MF ZERO OHM 1/10W -0402 ERJ-2GE0R00X Panasonic 12311 Development Hardware Reference Manual, Rev. 1 3-18 Freescale Semiconductor Chapter 4 PCB Manufacturing Specifications This chapter provides the specifications used to manufacture the MC12311 Development hardware printed circuit board (PCB) described in this manual. The MC12311 Development hardware PCBs must comply with the following: • The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm) • The PCB manufacturer’s logo is required • The PCB production week and year code is required — The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask — The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc. • The required Underwriter’s Laboratory (UL) Flammability Rating — The level is 94V-0 (http://www.ul.com/plastics/flame.html) — The UL information must be stamped on the back of the PCB solder mask • • 4.1 NOTE A complete set of design files is available for the 12311 Development hardware at the Freescale web site (http:www.freescale.com/802154) under reference designs. It is recommended that this design or one of a number of other reference designs be used as a starting point for a custom application. The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the same web site to provide additional design guidance. Single PCB Construction This section describes individual PCB construction details. • The MC12311 PCB is a four-layer, multi layer designs • The PCBs contains no blind, buried, or micro vias • PCB data: — MC12311 Size: Approximately 51 x 51mm (2.01 x 2.01 inches) — MC12311 Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask) The following table defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 4-1 PCB Manufacturing Specifications Table 4-1. MC12311 Layer by Layer Overview Layer Artwork Identification File Name Silkscreen Top SILK_TOP.art Top Layer Metal TOP.art Ground Layer GND.art Power Layer PWR.art Bottom Layer Metal BOTTOM.art Silkscreen Bottom SILK_BOTTOM.art NOTE The MC12311 contains sub 1 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup (see Figure 4-1) information is provided with the reference design. Metal 1 Dielectric Metal 2 Dielectric Metal 3 Dielectric Metal 4 Figure 4-1. MC12311 PCB Stackup Cross-Section (Four Layer) • • 4.2 Solder mask is required Silk screen is required Panelization The panel size can be negotiated depending on production volume. 4.3 Materials The PCB composite materials must meet the following requirements: • Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance. 12311 Development Hardware Reference Manual, Rev. 1 4-2 Freescale Semiconductor PCB Manufacturing Specifications • • 4.4 Copper Foil — Top and Bottom copper layers must be 1 oz. copper — Interior layers must be 1/2 oz. copper Plating - All pad plating must be Hot Air Levelling (HAL) Solder Mask The solder mask must meet the following requirements: • Solder mask type: Liquid Film Electra EMP110 or equivalent • Solder mask thickness: 10 – 30 µm 4.5 Silk Screen The silk screen must meet the following requirements: • Silkscreen color: White • Silkscreen must be applied after application of solder mask if solder mask is required • The silkscreen ink must not extend into any plated-thru-holes • The silk screen must be clipped back to the line of resistance 4.6 • • 4.7 Electrical PCB Testing All PCBs must be 100 percent tested for opens and shorts Impedance Measurement - An impedance measurement report is not mandatory Packaging Packaging for the PCBs must be the following requirements: • Finished PCBs must remain in panel • Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability. 4.8 Hole Specification/Tool Table See the ncdrill-1-4.tap file included with the Gerber files and the FAB-23451.pdf file. 12311 Development Hardware Reference Manual, Rev. 1 Freescale Semiconductor 4-3 PCB Manufacturing Specifications 4.9 File Description Files included with the download include Design, Gerber and PDF files. Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing. PDF files included are: • FAB-27108.pdf — Board fabrication drawing • GRB-27108.zip — Metal layers, solder mask, solder paste and silk screen • SPF-27108.pdf — Schematic Design files are in Allegro format with OrCAD schematic capture. 12311 Development Hardware Reference Manual, Rev. 1 4-4 Freescale Semiconductor
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