Freescale Semiconductor 1322X-LPB 1322x-LPB User Manual

Freescale Semiconductor, Inc. 1322x-LPB

Users Manual Rev 2

Document Number: 1322xLPBRMRev. 1.107/2008 1322x-Low Power Board(1322x-LPB)Reference Manual
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1322x-LPB Reference Manual, Rev. 1.1Freescale Semiconductor i ContentsAbout This BookAudience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiOrganization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiChapter 1 Safety Information1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2 FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2.1 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2.2 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.2.3 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.3 Regulatory Approval For Canada. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2Chapter 2 1322x-LPB Module Overview and Description2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3Chapter 3 System Overview and Functional Block Descriptions3.1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.2 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.2.1 1322x-LPB Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33.3 RF 2.4 GHz ISM Band radio design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.4 Power Sources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.4.1 External DC Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.4.2 Battery Sources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.4.3 Optional Use of MC1322x Buck Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.5 Clock Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.5.1 Reference Oscillator (24 MHz nominal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.5.2 32.768 kHz Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.6 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.7 Low Power Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.1 Switched VCC for Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.2 Measuring Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-103.7.3 Other Low Power Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-103.8 User Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-113.8.1 LEDs, Switches, and Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-113.8.2 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
1322x-LPB Reference Manual, Rev. 1.1ii Freescale Semiconductor 3.8.3 ARM JTAG Debug Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-123.8.4 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-123.8.5 UART Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-133.8.6 Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14Chapter 4 Schematic, Board Layout, and Bill of Materials
1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor iii About This BookThis manual describes Freescale’s 1322x-LPB evaluation board. The 1322x-LPB contains a Freescale third-generation, low power, 2.4 GHz radio frequency transceiver, with 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE Standard 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP).AudienceThis manual is intended for system designers.OrganizationThis document is organized into 4 chapters.Chapter 1 Safety Information — Describes that any modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful.Chapter 2 1322x-LPB Module Overview and Description — Introduces the 1322x-LPB, which is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x device. Chapter 3 System Overview and Functional Block Descriptions — This section provides an overview of the 1322x-LPB and its block diagram.Chapter 4 Schematic and Bill of Material — Contains the schematic, board layout, and bill of material (BOM).Revision HistoryThe following table summarizes revisions to this document since the previous release (Rev 1.0).SRevision HistoryLocation RevisionChapter 1 Updated FCC information.
1322x-LPB Reference Manual, Rev. 1.1 iv Freescale Semiconductor Definitions, Acronyms, and AbbreviationsThe following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital ConverterAES Advanced Encryption StandardARM Advanced RISC MachineCTS Clear to SendDAC Digital to Analog ConverterDMA Direct Memory AccessI2C Inter-Integrated Circuit is a multi-master serial computer busISM Industrial Scientific Medical 2.4 GHz radio frequency bandJTAG Joint Test Action GroupLGA Land Grid ArrayMAC Media Access ControllerMCU Microcontroller UnitNEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. SN Sensor Nodepcb Printed circuit boardPiP Platform in PackagePWM Pulse-width modulation RTS Request to SendSMA Connector Sub Miniature version “A” connector SPI Serial Peripheral InterfaceSSI Synchronous Serial InterfaceTACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.TELCO Telephone CompanyUSB Universal Serial BusVCP Virtual Com Port
1322x-LPB Reference Manual, Rev. 1.0 Freescale Semiconductor 1-1Chapter 1 Safety Information1.1 FCC GuidelinesThis equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and make operation of the product unlawful. NOTE:The statement aboveapplies also to the Industry Canada Approval 1.2 FCC LabelingFCC labels are physically located on the back of the board.1.2.1 47 C.F.R. Sec. 15.21This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
Safety Information1322x-LPB Reference Manual, Rev. 1.0 1-2 Freescale Semiconductor1.2.2 47 C.F.R. Sec.15.105(b)This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons.This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions:1. This device may not cause harmful interference.2. This device must accept any interference received, including interference that may cause undesired operation.3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon. 1.2.3 47 C.F.R. Sec.15.203An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.3 Regulatory Approval For CanadaThis Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7.Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: Section 1.1 of this manual also applies to the Industry Canada Approval 1.4 Disposal InstructionsThis product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal.
1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 2-1Chapter 2 1322x-LPB Module Overview and Description2.1 IntroductionThe 1322x-LPB is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x device. The heart of the MC1322x USB module is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.The 1322x-LPB provides a platform to evaluate the MC1322x device, develop software and applications, demonstrate IEEE 802.15.4 and ZigBee networking capabilities, and implement low power operation. The small form factor illustrates a small footprint, 2-layer printed circuit board (PCB) layout with integrated printed-wire F-antenna. The LPB provides a GPIO connector to interface with application devices, a separate second unbuffered UART connector, and a full JTAG debug port connector.Figure 2-1. 1322x-LPB The 1322x-LPB is specifically intended as a prototype development platform for low power applications, use of the buck converter, 2-layer PCB design, use of the 32.768 crystal oscillator, and non-standard crystal reference oscillators (requiring PLL operation).
1322x-LPB Module Overview and Description1322x-LPB Reference Manual, Rev. 1.1 2-2 Freescale Semiconductor2.2 FeaturesThe 1322x-LPB provides the following features:• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack• Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP)• MC1322x provides a highly integrated, low cost RF node— On-board balun and antenna switch in package— Typical -95 dBm sensitivity— Typical 0 dBm output power, with max approximately +4 dBm—F-antenna• Standard JTAG debug/development interface connector• Power management circuit with on-board regulation for multiple power sources— Can be powered from DC power jack, two AAA batteries, or optional Lithium coin cells— On/Off power switch— Optional header for measuring MC1322x current— Power-on green LED• Supports optional use of buck converter• User interface switches and LEDs— 2 push buttons for application purposes— 2 processor controlled red LEDs for application purposes— Header for hardware reset• User interfaces include— 12-pin GPIO connector provides access to ADC inputs, unbuffered UART2 port, I2C port, and KBI pins (provide wake-up capabilities from low power)— 6-pin UART connector provides access to second unbuffer UART1 port• System clock options— Default 24 MHz crystal reference oscillator. Supports use of PLL with non-default 13-26 MHz crystal.— Optional 32.768 kHz crystal oscillator for accurate real-time delays (crystal is mounted).• Fixed 1.5 V reference for ADC VREFH during battery operation• Separate switched VCC (via P-channel MOSFET) for power control of off-chip peripheral functions.
1322x-LPB Module Overview and Description1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 2-32.3 Board Level SpecificationsTable 2-1. 1322x-LPB SpecificationsParameter Units Notes/ConditionsMIN TYP MAXGeneralSize (Enclosure: X, Y, Z) 74x56x37 mmSize (PCB: X, Y) 65x45 mmLayer build (PCB) 0.8 /0.032 mm / in 2-LayerDielectric material (PCB) FR4PowerVoltage supply (DC) 4.4 5 12 VVoltage supply (Batteries) 2.0 3 3.6 VCurrent consumption 55 mATemperatureOperating temperature -30 +25 +85 °CStorage temperature -30 +25 +85 °CRFFrequency range 2405 2480 MHz All 16 channels in the 2450 MHz band, 5 MHz spacingRange (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board)RF Transmitter802.15.4 Output power -30 0 +4 dBm Over range of Pout from IC control in 2 dB steps.Note: On channel 26, output power should not exceed -5.5 dBm (Power setting 0x0E) to meet FCC part 15 requirements.Harmonics2nd harmonics3rd harmonics -38-35dBmdBmHarmonics are compliant to ETSI and FCC regulatory approval standardsRF ReceiverSensitivity -95 dBm <1% PER for 20-byte packetsRegulatory ApprovalFCC Product complies accordingly to the FCC part 15 standard
1322x-LPB Module Overview and Description1322x-LPB Reference Manual, Rev. 1.1 2-4 Freescale SemiconductorCE (ETSI) Product complies accordingly to the EN 300 328 V1.7.1 (2006-10) standardCE (EMC) Product complies accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standardsSafetyUL Product complies accordingly to the IEC 60950-1 and EN 60950-1, First Edition standardsEnvironmentRoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003Table 2-1. 1322x-LPB Specifications (continued)Parameter Units Notes/Conditions
1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-1Chapter 3 System Overview and Functional Block DescriptionsThis section provides an overview of the 1322x-LPB and its block diagram.3.1 System Block DiagramThe following is the 1322x-LPB system level block diagram.Figure 3-1. 1322x-LPB Block Diagram3.2 Design OverviewThe heart of the 1322x-LPB is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The main attributes of the 1322x-LPB module are:• Small footprint with a 2-layer PCB and F-antenna• Support for very low power operation• Support for Lithium coin cell operation• Support for optional buck converter• Support for 32.768 KHz crystal oscillator• Support for non-standard reference oscillator crystal (13-26 MHz and requires use of PLL filter)MC13224V/225VAdvanced ZigBee™- Compliant PiP6-PinUARTHDRUART1JTAG DebugPCB F-Antenna24 MHz 32.768KHz12-PinGPIOHDRPLLFilterGPIO2 Pushbuttons2 LEDsPowerManage-mentDC Adaptor2xAAA BatteryLithium Coin CellVCCSW_VCCKBI
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-2 Freescale SemiconductorThe MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4 applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core.Figure 3-2. MC1322x Block DiagramThe RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna.Figure 3-3. MC1322x RF InterfaceTIMERMODULE(TMR)(4 Tmr Blocks)UARTMODULE(UART0)UARTMODULE(UART1)SYNC SERIALINTERFACE(SSI/i2S)KEYBOARDINTERFACE(KBI)INTER-IC BUSMODULE(I2C)SERIALPERIPHERALINTERFACE(SPI)DUAL12-BITADCMODULEGPIO and IOCONTROLUP TO 64 IO PINSARM7TDMI-S32-BITCPUBUSINTERFACE& MEMORYARBITRATORARMINTERRUPTCONTROLLER(AITC)JTAG/NexusDEBUGADVANCEDSECURITYMODULE(ASM)CLOCK &RESETMODULE(CRM)RADIOINTERFACEMODULE(RIF)96KBYTESRAM(24K WORDS x32 BITS)80KBYTEROM(20KWORDS x32 BITS)RFOSCILLATOR&CLOCK GENERATIONSPIFLASHMODULE(SPIF)802.15.4MACACCELERATOR(MACA)DIGITALMODEMTXMODEMRXMODEM128KBYTENON-VOLATILEMEMORY(SERIALFLASH)ANALOGTRANSMITTERANALOGRECEIVERRFTX/RXSWITCHIEEE 802.15.4 TRANSCEIVERBALUNANALOGPOWERMANAGEMENT&VOLTAGEREGULATIONMC13225Platform-in-Package (PiP)IEEE 802.15.4/ZIGBEE SOLUTIONBuckRegulator24 MHz (typ) 32.768 KHz (optional)BATTERYDETECTANALOGTRANSMITTERANALOGRECEIVERRFTX/RXSWITCHBALUNLNAPA
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-33.2.1 1322x-LPB Form FactorThe MC1322x allows for very small footprint applications. The 1322x-LPB circuit board illustrates a small footprint for the MC1322x/RF area and use of a 2 metal layer design. This board can be used as a template for a 2-layer PCB design (design files are available), or additional reference designs are available through the Freescale web site.Freescale provides a one-stop-shop approach to guide customers with their wireless solutions to help minimize product time-to-market. One important recommendation is to follow the layout application guide as described in the Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual (ZHDCRM). This manual describes Printed Circuit Board (PCB) footprint guidelines for the MC1322x LGA 71 package. Included are layouts of the component copper layer, solder mask, and solder paste stencil.Figure 3-4. 1322x-LPB PCB Top ViewFigure 3-4 shows the 1322x-LPB PCB top view. Refer to this figure in the following sections.DC JTAG (J1)UART (J3)GPIO (J2)PowerConnectPower Switch SW1 SW2Power LEDLED 1LED 2F-AntennaJ18J20J19J16J17
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-4 Freescale Semiconductor3.3 RF 2.4 GHz ISM Band radio designThe MC1322x transceiver includes a low noise amplifier, 1mW nominal output power, PA with internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. The 1322x-LPB requires only a minimum amount of external components and a chip-antenna for a complete solution. Figure 3-5 shows the RF network external to the MC1322x.• Typical nominal output power is 0 dBm, with +4 dBm max• Typical sensitivity is -95 dBm.• Frequency range is 2405 to 2480 MHz• Typical range (outdoors, line of sight) is 300 meters• Uses a minimum number of RF componentsFigure 3-5. 1322x-LPB RF Network.3.4 Power SourcesTo allow maximum versatility, the 1322x-LPB can be powered via a DC source (nominally 5 VDC) or a variety of battery sources.• An “OFF/ON” slide switch (SW5) is provided that disconnects all supplies, no matter which is active.• A green “PWR” LED (D5) is provides as a Power-On indicator.• All sources are isolated via diodes.3.4.1 External DC SourceThe DC source is typically an AC-DC converter• The DC source can be from 4.4 to 12 VDC• When connected, it automatically shuts down the battery supply.• The DC source is regulated to 3.3 V; however, the raw battery pack voltage directly supplies the circuitry ANT1F_AntennaL13.9nHNot MountedC31pFNot MountedRFC110pFNot MountedRF_RX_TXRF_GND
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-53.4.2 Battery SourcesThe battery source can be either a AAA battery pack (2 cells) or an optional Lithium coin cell:• AAA source - as supplied, the 1322x-LPB has a 2-cell AAA battery holder mounted. The typical usable voltage range for 2 AAA cells is ~3.1V down to 2.2 - 2.0V. Note that a Schottky diode and a switch MOSFET are in series with the battery pack, and these will impact the lowest usable voltage for the battery pack.• Lithium coin cell source - in some very low duty cycle applications where the system mostly “sleeps” in low power, the use of a Lithium coin cell can be considered. To assist in this design, the 1322x-LPB supports mounting a socket for a coin cell— The AAA battery holder must first be removed.— Mount one of two sockets for a Lithium coin cell– Renata #SMTU2477N-1 - SMD holder for CR2477N cell (950 mAh)– Renata #SMTU2450N-1 - SMD holder for CR2450N cell (540 mAh)— The bottom view of the 1322x-LPB is shown in Figure 3-6.– The mounting pads for the socket are noted (both sockets use the same pads). Be sure to observe proper polarity.– The mounting pads for two 100µF tantalum capacitors (C59 & C60) are also provided.NOTEDesigning with Manganese Dioxide Lithium Coin Cell technology can be very challenging. It is recommended to consider the following:• Source impedance is high, typically about 25 ohms. Consider the fluctuation in source voltage under heavy current load (~20 mA or more).• The addition of heavy bulk capacitance (such as C59 & C60) on VCC can help minimize voltage drop under heavy current.• High current duty cycle is critical; every effort must be made to minimize high current activity (primarily TX and RX).• When developing a coin cell application, it is highly recommended to use the external DC source for all code development and early testing. Life of coin cells can be very short with continual and/or heavy load.
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-6 Freescale SemiconductorFigure 3-6. 1322x-LPB PCB Bottom View3.4.3 Optional Use of MC1322x Buck RegulatorThe MC1322x is typically used in a single source, unregulated VCC configuration (VBATT connected in parallel with LREG_BK_FB), and the 1322x-LPB is supplied in this connection. However, the MC1322x also has an optional buck switched regulator, and the 1322x-LPB supports use of the buck function.Figure 3-7 shows the VCC connection at the MC1322x device. The PCB is supplied with the 0-ohm R66 component mounted, which is the simple non-regulated configuration. To allow use of the buck regulator:• Remove R66• Mount L2; an SMD power 100uH inductor, from manufacturer TDK # SLF6028T-101MR42-PF (see Chapter 4, “Schematic, Board Layout, and Bill of Materials”).• Mount C52; a 100 µF ceramic capacitor.NOTEUse of the buck converter requires proper initialization, control and support through the application software. Refer to the MC1322x Reference Manual.Figure 3-7. MC1322x Main Power ConnectionC59 and C60 PadsSocket Pads 1122J16TSM-102-01-L-SVTP44C5210uFNot MountedC8100pFTP45Current MeasurementL2100uHNot MountedR650RNot MountedVCCR660RC101uFNot MountedVBATTCOIL_BKLREG_BK_FB
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-73.5 Clock SourcesThe 1322x-LPB supports two primary clock sources for the MC1322x.3.5.1 Reference Oscillator (24 MHz nominal)The reference oscillator is the primary source for all internal MC1322x clocks. Figure 3-8 shows the LPB circuitry related to the reference oscillator. The default frequency for the reference oscillator is 24 MHz and the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two additional options for the module:• X1 can be replaced by a 13-26 MHz crystal - It must meet MC1322x specifications. In addition, the onboard PLL must be used in this case. The PCB provides for the PLL filter components, but these are not populated. To use a non-standard crystal, the PLL filter components of R5, C4, and C5 must be populated. Also, software must enable use of the PLL for the internal modem clock.• An external clock source can be supplied as the reference source - This is typically 24 MHz. The frequency must be accurate to +/-40ppm. The external clock source can supplied via test point TP86 and C57 (10 pF) must also be installed.Figure 3-8. Reference Oscillator Related Circuitry C5810pFNot MountedR731KNot MountedVCCR721KNot MountedC5710pFNot MountedTP1TP9X124.00MHzExternalClockSourceTP87TP86R5240RNot MountedC5180nFNot MountedC427nFNot MountedRF_PLL_FLTXTAL_24_OUTXTAL_24_INPLL External Filter
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-8 Freescale Semiconductor3.5.2 32.768 kHz Crystal Oscillator Provision is also made for the secondary 32.768 kHz oscillator crystal X2. This oscillator can be used on the MC1322x for a low power accurate RTC timebase and wake-up state machine. The module comes with this crystal and its load capacitors C7 and C12 mounted. Although use of the oscillator is optional, the module is provided ready for use. See Figure 3-9.Figure 3-9. 32.768 KHz Oscillator Related Circuitry3.6 FLASH Memory Recovery Jumpers and EraseThe MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of doing so:• JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can be changed.• Load new FLASH image via UART1 port -NOTEThe 1322x-LPB provides a header for UART1 that is NOT buffered for RS232 operation. If users must employ UART1 with the Freescale Test Tool running on a PC, they must provide an appropriate RS232 interface board to connect to a PC serial COM port.— The Freescale BeeKit IDE suite download provides a software tool called “Test Tool”. This application runs on a PC and can be used with a client running on the MC1322x to test the platform.— Test Tool also has the capability to load a new image into the FLASH. NOTEThe FLASH must be cleared before loading a new image.The 1322x-LPB has two jumper sites designated as J19 and J20 (see Figure 3-4) that must be used to erase the FLASH:1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar, as well as, short Jumper J20 Pin 1 to Pin 2 with a second shorting bar2. Turn on power, push the reset button, and wait a few seconds. C722pFC1222pFX232.768kHzTP10XTAL_ 32 _OU TXTAL_ 32 _I N
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-93. Turn off power and remove the jumper shorts as required.4. The board is now ready for boot operation.After the FLASH is erased, the module can be loaded with a new image through the UART1 port using Test Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit download.Figure 3-10. FLASH Erase Headers3.7 Low Power OperationThe 1322x-LPB intended to develop low power operation and applications code. It has been designed to allow low current measurement and support MC1322x low power application needs.NOTEIt is strongly suggested that the user review the low power considerations described in the MC13224/225 Reference Manual.3.7.1 Switched VCC for Peripheral FunctionsThe MC1322x by default does not retain power to its GPIO pads while in low power mode (KBI signals are the exception and do retain power). As a result, GPIO pads should not be driven high while the device is in low power or extraneous current exist. The 1322x-LPB provides a switched VCC for devices connected to the MC1322x while low power mode so that these devices can be disabled when appropriate.Figure 3-11 shows the switched VCC circuit.• A P-channel MOSFET is used as a switch to turn SW_VCC ON or OFF as required.• The MOSFET gate is driven by signal KBI_3 which is always powered and defaults to an output in the high state when in low power. This condition turns off SW_VCC in low power mode.NOTEThe user must program/control GPIO25 under run (operational) mode. The KBI pins are controlled by the CRM in low power mode; they revert to their GPIO control during normal run mode. As a result, GPIO25 must be programmed as an output and controlled to enable SW_VCC as appropriate for use, or alternatively, GPIO can be programmed as the KBI function under normal operation.1-2 ADC2_VREFH -> "0"3-4 ADC2_VREFL -> "1"Recovery M odeVCC R10410KC2100nFTP103R10310KSW_VCCTP312J19HDR_1X2 12J20HDR_1X2ADC2_VREHADC2_VREFL
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-10 Freescale Semiconductor• SW_VCC is provided on the J2 GPIO Pin Header• SW_VCC also powers U17 the voltage reference for ADC operation.Figure 3-11. Switched VCC for Peripheral Devices3.7.2 Measuring CurrentThe 1322x-LPB provides three primary points for current measurement:• Total current to the board - reference Figure 3-11. R68 can be removed and current can be measured between TP29 and TP47.• Total current to the MC13224/225 - reference Figure 3-7. R65 can be removed and current can be measured through jumper J16.• ADC voltage reference current - reference Figure 3-12. Voltage reference U17 is enabled via J18; current can be measured through this jumper.3.7.3 Other Low Power ConsiderationsWhen designing low power operation, consider:• Indicator LEDs D1 and D2 are connected to ground not VCC, so as to not put GPIO high during low lower mode.• The GPIO connector (J2) provides access and connectivity to the MC13224/225— SW_VCC is provided.— No peripheral device should pull a GPIO high during low power mode— Signal SWITCH1 is connected to KBI_4 and can be used as a wake-up interrupt to the MC13224/225. See the CRM chapter of the MC13224/225 Reference Manual.— Signal SWITCH2 is connected to KBI_0 and can be used as a wake-up signal from the MC13224/225 to an external device. See the CRM chapter of the MC13224/225 Reference Manual.• The UART1 connector (J3) provides direct access to the MC13224/225 GPIO. If low power mode is enabled and UART1 is connected to an external device, extraneous high leakage current can occur if any of the UART1 signals is driven high.KBI_3SW_VCCTP32R680RTP47 VCCTP29C564.7uFQ2FDV302MAIN SUPPLY
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-113.8 User InterfacesThis section provides a summary of the user interfaces.3.8.1 LEDs, Switches, and ResetFor application interface the 1322x-LPB provides:• Two red LEDs (D1 and D2)are driven by the MCU and controlled by the software application.• Two pushbuttons (SW1 and SW2) are connected to the MCU GPIO for software application. Only SW1 has interrupt generation capability, and can be used as an input for low power wake-up.• Jumper J17 provides a hardware reset capability. Shorting Pin 1 to Pin 2 causes the hardware reset input to be held low and resets the MC13224/225.3.8.2 ADC Voltage ReferencesWhen using the ADC input channels ADC2 and ADC3 (through J2), consider;• The ADC high voltage reference ADC2_VREFH is tied to SW_VCC through a resistor. This reference is not absolute and will move as VCC decreases with battery operation.• A fixed voltage reference for ADC1_VREFH is provided (see Figure 3-12).— The fixed voltage is 1.5 VDC.— The LM285M (U17) is programmed via R120 and R121 to provide a constant reference— The reference can be enabled via jumper J18. This number can also be used to measure current to the reference circuit.— This reference is useful for battery operation where a known, fixed high reference voltage for the ADC is required.Figure 3-12. ADC Voltage 1.5 VDC Voltage Reference R110KSW_VCC12J18HDR_1X2R120120K1%R12124.9K1%TP1061.5V1122334455667788U17LM285MADC1_VREFH
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-12 Freescale Semiconductor3.8.3 ARM JTAG Debug Interface ConnectorThe MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly separated from the GPIO and UART pin headers and located at the rear side of the module. The 20-pin connector is designated “JTAG” on the silk-screen and has Pin 1 designated for correct plug-in of the development cable. Table 3-1 shows the device pins that are connected to the associated JTAG header pinouts.3.8.4 GPIO ConnectorThe GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 12-pin header. The connector provides access to MCU GPIO, two timer GPIOs, two ADC inputs, UART2 port, and the I2C port. Power is also provided on the connector.• SW_VCC is the main supply voltage. Current draw should be limited to 50 mA.• Signals SWITCH1 and SWITCH2 are in parallel with onboard switches SW1 and SW2.• KBI signals are provided through SWITCH1 and SWITCH2 for low power control and interfaceTable 3-1. ARM JTAG 20-Pin Connector Assignments (J1)Name11NC means No Connect.Pin # Pin # NameVCC 1 2 VCCNC22MC1322x does not support separate JTAG reset TRST.34GNDTDI 5 6 GNDTMS 7 8 GNDTCK 9 10 GNDRTCK 11 12 GNDTDO 13 14 GNDRESET33VCC through a 100k-ohm pullup.15 16 GNDNC 17 18 GNDNC 19 20 GNDTable 3-2. GPIO Connector J2 PinoutsPinNumber Name Function Notes1 UART2_RX UART2 RX data input / GPIO19 UART2 receive data input.2 UART2_TX UART2 TX data output / GPIO18 UART2 transmit data output.3I2C_SDA I2C Bus data / GPIO13 I2C bus signal SDA. Pull-up to SW_VCC available
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-133.8.5 UART ConnectorThe UART connector (J3) is a standard 2.54mm/0.1inch spacing, 6-pin header. The connector provides access to the unbuffered UART1 signals. Power is also provided on the connector.• VCC is the main board supply voltage. Current draw should be limited to 50 mA.• If low power mode is enabled on the module, all signals on J3 must be not be driven high.• Signals are unbuffered for RS232; an adaptor board is needed to talk to a PC serial COM port4I2C_SCL I2C Bus clock / GPIO12 I2C bus signal SCL. Pull-up to SW_VCC available5 TMR3 Timer 3 IO signal / GPIO11 Pin can be used as Counter 3 output or counter input clock.6 TMR1 Timer 1 IO signal / GPIO9 Pin can be used as Counter 1 output or counter input clock.7 ADC3 ADC analog input Channel 3/ GPIO33 ADC sample channel can be used by either ADC1 or ADC2.8 ADC2 ADC analog input Channel 2/ GPIO32 ADC sample channel can be used by either ADC1 or ADC2.9 SWITCH1 KBI_4 input/ GPIO26 Asynchronous interrupt input can be used as wake-up signal.10 SWITCH2 KBI_0_HST_WK output/ GPIO22 Can be used as a wake-up indicator output to external device.11 GND System ground12 SW_VCC Switched voltage supplyTable 3-3. UART Connector J3 PinoutsPinNumber Name Function Notes1 UART1_RX UART1 RX data input / GPIO19 UART2 receive data input.2 UART1_TX UART2 TX data output / GPIO18 UART2 transmit data output.3 UART1_CTS UART1 Clear to Send output / GPIO16 UART1 CTS control output.4 UART1_RTS UART1 Request to Send input / GPIO17 UART1 RTS control input.5 GND System ground6 VCC Main voltage supplyTable 3-2. GPIO Connector J2 Pinouts (continued)
System Overview and Functional Block Descriptions1322x-LPB Reference Manual, Rev. 1.1 3-14 Freescale Semiconductor3.8.6 Jumper SelectionTable 3-4 lists all the possible jumper selections for the 1322x-LPB. The jumpers available on the board are:• J16 - used to measure MC1322x current• J17 - used to reset MC1322x• J18 - used to enable 1.5V reference• J19, J20 - used to recover/clear FLASH. See Table 3-4.Table 3-4. LPB Jumper SelectionPin Header Pin NumberConnection Description Default SettingJ16 1-2 Connect to ammeter to measure MC1322x current. R65 should be removed Not mounted. Can be mounted for operation w/o R65J17 1-2 Connect to reset MC1322x Not mountedJ18 1-2 Connect to enable 1.5V reference Not mountedJ19, J20 1-2, 1-2 Connect both to recover/clear FLASH. See Section 3.6, “FLASH Memory Recovery Jumpers and Erase” Not mounted
1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 4-1Chapter 4 Schematic, Board Layout, and Bill of Materials Figure 4-1. 1322x-LPB Schematic5544332211D DC CB BA AVCCVCC VCCVCCV_MAIN VCCVCCSW_VCCVCCVCCVCCSW_VCCSW_VCCSW_VCCSW_VCCSW_VCC SW_VCCLED1LED2SWITCH2SWITCH1LED1LED2SWITCH2SWITCH1UART1_TXUART1_CTSUART1_RXUART1_RTSRTCKRTCKUART2_RXI2C_SCLADC3ADC2UART2_TXUART2_RXI2C_SDAI2C_SCLI2C_SDATMR1TMR1UART2_TXUART1_TXUART1_RXTMR3TMR3SWITCH1 SWITCH2UART1_RTSUART1_CTSADC2ADC3KBI_3KBI_3Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE: SCH-23453 PDF: SPF-23453 B1322X-LPBCTuesday, April 08, 2008Main Schematic33_X_ ------Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE: SCH-23453 PDF: SPF-23453 B1322X-LPBCTuesday, April 08, 2008Main Schematic33_X_ ------Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SOURCE: SCH-23453 PDF: SPF-23453 B1322X-LPBCTuesday, April 08, 2008Main Schematic33_X_ ------ GPIOPin HeaderPushButtonsLEDsRFJTAG DebugDBGRQDBGACKnTRSTJTAG RTCKEnablePower ONJTAG RTCKDisableExternalClockSourcePower Management Power Measurement2xAAA CellsCR2477N UARTPin HeaderJ19 VREFH -> "0"J20 VREFL -> "1"Recovery ModeCR2450NReset1.5VCurrent MeasurementC8100pFC8100pFX232.768kHzX232.768kHzR11220RR11220RR731KNot MountedR731KNot MountedTP3TP3TP10TP10J4DJ-005J4DJ-005132C54100nFC54100nFR1050RR1050RD6MBR0520LT1D6MBR0520LT1R120120K1%R120120K1%J18TSM-102-01-L-SVJ18TSM-102-01-L-SV1122C5810pFNot MountedC5810pFNot MountedR6390RR6390RTP103TP103REF3RefREF3Ref11R10410KR10410KU17LM285MU17LM285M1122334455667788R12124.9K1%R12124.9K1%J19TSM-102-01-L-SVJ19TSM-102-01-L-SV1122R70100KR70100KC5210uFNot MountedC5210uFNot MountedR1064.7KNot MountedR1064.7KNot MountedTP29TP29C111nFC111nFJ20TSM-102-01-L-SVJ20TSM-102-01-L-SV1122R5240RNot MountedR5240RNot MountedR6910KR6910KMH2MH21C427nFNot MountedC427nFNot MountedTP45TP45TP32TP32TP85TP85+C59100uFNot Mounted+C59100uFNot MountedR680RR680RR30RR30RSW2DTSM63NSWITCH2SW2DTSM63NSWITCH23124TP8TP8REF1RefREF1Ref11X124.00MHzX124.00MHzR110KR110KC31pFNot MountedC31pFNot MountedBC3SMTU2450N-1Not MountedBC3SMTU2450N-1Not Mounted+1-2ZZ1Label 1322X-LPBZZ1Label 1322X-LPBL13.9nHNot MountedL13.9nHNot MountedC2100nFC2100nFTP1TP1TP47TP47C531uFC531uFD7MBR0520LT1D7MBR0520LT1C1222pFC1222pFC5710pFNot MountedC5710pFNot MountedTP26TP26+C60100uFNot Mounted+C60100uFNot MountedR40RNot MountedR40RNot MountedU1MC13225U1MC13225UART2_RTS13EVTI_B 132MCKO/IO50 131MSEO0_B 114EVTO_B 123RDY_B 122MSEO1_B 113VBATT 45LREG_BK_FB 44COIL_BK 43ADC2_VREFL61 ADC1_VREFL62ADC1_VREFH63ADC2_VREFH64ADC01ADC12ADC23ADC34ADC45ADC56ADC67ADC7_RTCK8MDO00 103MDO01 102MDO02 112MDO03 111MDO04 121MDO05 120MDO06 130MDO07 129TDI 10RF_GND 58TDO 9UART2_CTS14UART2_RX15TCK 11TMS 12RESETB 51VREG_ANA 55XTAL_24_OUT49RF_PLL_FLT 46XTAL_24_IN50KBI_0_HST_WK42XTAL_32_IN47ANT_1 56XTAL_32_OUT48RF_RX_TX 60ANT_2 57UART2_TX16RX_ON 59PA_POS 54PA_NEG 53TX_ON 52UART1_RTS17UART1_CTS18UART1_RX19 UART1_TX20I2C_SDA21I2C_SCL22TMR323TMR224TMR125TMR026SPI_SCK27SPI_MOSI28SPI_MISO29SPI_SS30SSI_BITCK31SSI_FSYN32SSI_RX33 SSI_TX34KBI_141 KBI_240 KBI_339 KBI_438 KBI_537 KBI_636 KBI_735GND_FLAG_175DIG_REG 124NVM_REG 133GND_FLAG_276GND_FLAG_377GND_FLAG_478GND_FLAG_579GND_FLAG_684GND_FLAG_785GND_FLAG_886GND_FLAG_987GND_FLAG_1088GND_FLAG_1193GND_FLAG_1294GND_FLAG_1395GND_FLAG_1496GND_FLAG_1597GND_FLAG_16104GND_FLAG_17105GND_FLAG_18106GND_FLAG_19115NC165NC266NC367NC468NC569NC670NC771NC872NC973NC1074NC11 80NC12 81NC13 82NC14 83NC15 89NC16 90NC17 91NC18 92NC19 98NC20 99NC21 100NC22 101NC23 107NC24 108NC25 109NC26 110NC27 116NC28 117NC29 118NC30 119NC31 125NC32 126NC33 127NC34 128NC35 134NC36 135NC37 136NC38 137NC39 138NC40 139NC41 140NC42 141NC43 142NC44 143NC45 144NC46 145R10310KR10310KBC12468BC12468+1-2R721KNot MountedR721KNot MountedPCB1JDP7051_2PCB1JDP7051_2TP9TP9BC2SMTU2477N-1Not MountedBC2SMTU2477N-1Not Mounted+1-2R12100KR12100KRT1500mART1500mATP5TP5R7410KR7410KC564.7uFC564.7uFJ290122-12J290122-12113355779911112244668810 1012 12C110pFNot MountedC110pFNot MountedJ16TSM-102-01-L-SVJ16TSM-102-01-L-SV1122C6100nFC6100nFMH1MH11MH3MH31D2LHR974LED2D2LHR974LED2SW5BMFP213N-RASW5BMFP213N-RA456C5180nFNot MountedC5180nFNot MountedR650RR650RD5LGR971POWERD5LGR971POWERJ17TSM-102-01-L-SVJ17TSM-102-01-L-SV1122C554.7uFC554.7uFC101uFNot MountedC101uFNot MountedR1074.7KNot MountedR1074.7KNot MountedC50100nFC50100nFC51100nFC51100nFJ190122-20J190122-201133557799111113131515171719192244668810 1012 1214 1416 1618 1820 20Q1ZXM61P02FQ1ZXM61P02FREF2RefREF2Ref11TP4TP4J390122-6J390122-6113355224466U2LT1129CST-3.3U2LT1129CST-3.3Vin1Vout 3GND12GND24TP87TP87L2100uHNot MountedL2100uHNot MountedSW1DTSM63NSWITCH1SW1DTSM63NSWITCH13124ANT1F_AntennaANT1F_AntennaTP28TP28TP84TP84C722pFC722pFR7110KNot MountedR7110KNot MountedTP44TP44TP86TP86R7390RR7390RQ2FDV302Q2FDV302SW5AMFP213N-RASW5AMFP213N-RA1237 8D1LHR974LED1D1LHR974LED1TP105TP105R660RR660RTP104TP104D8MBR0520LT1D8MBR0520LT1
Schematic, Board Layout, and Bill of Materials1322x-LPB Reference Manual, Rev. 1.1 4-2 Freescale SemiconductorFigure 4-2. 1322x-LPB PCB Component Location (Top View)Figure 4-3. 1322x-LPB PCB Test Points (Bottom View)
Schematic, Board Layout, and Bill of Materials1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 4-3Figure 4-4. 1322x-LPB PCB Layout (Top View)Figure 4-5. 1322x-LPB PCB Layout (Bottom View)
Schematic, Board Layout, and Bill of Materials1322x-LPB Reference Manual, Rev. 1.1 4-4 Freescale SemiconductorTable 4-1. Bill of MaterialsQty Part Reference Description Value Voltage Power Tolerance Manufacturer Manufacturer Part Number1 ANT1 PCB F ANTENNA F ANTENNA NOT A PART NOT A PART1 BC1 PCB Battery Holder 2xAAA 2468 Keystone 24680 BC2 Surface mount coin cell holder CR2477N SMTU2477N-1 Reneta SMTU2477N-10 BC3 Surface mount coin cell holder CR2450N SMTU2450N-1 Renata SMTU2450N-10 C1,C57,C58Ceramic Capacitor COG 10pF 50V 5% Murata GRM1555C1H100JZ015 C2,C6,C50,C51,C54 Ceramic Capacitor X5R 100nF 10V 10% Murata GRM155R61A104KA01D0 C3 Ceramic Capacitor COG 1pF 50V 0.25pF Murata GRM1555C1H1R0CZ01D0 C4 Ceramic Multilayer Capacitor X7R 27nF 10V 5% Vishay VJ0402Y273JXQCW1BC0 C5 Ceramic Multilayer Capacitor X7R 180nF 16V 5% Vishay VJ0603Y184JXJCW1BC2 C7,C12 Ceramic Capacitor COG 22pF 50V 5% Murata GRM1555C1H220JZ01J1 C8 Ceramic Capacitor COG 100pF 50V 5% Murata GRM1555C1H101JZ010 C10 Ceramic Capacitor X5R 1uF 6.3V 10% Murata GRM155R60J105KE19B1 C11 Ceramic Capacitor X7R 1nF 50V 10% Murata GRM155R71H102KA01D0 C52 Ceramic Capacitor for smoothing X5R 10uF 10V 10% Murata GRM21BR61J106KE19L1 C53 Ceramic Multilayer Capacitor X7R NoPb 1uF 16V 15% Murata GRM21BR71C1052 C55,C56 Ceramic Multilayer Capacitor X5R 4.7uF 16V 15% Phycomp 2222 781 136720 C59,C60 Low ESR Tantal Capacitor 100uF 16V +/-10% AVX TPSD107K016R1502 D1,D2 SMD Red topled LHR974 OSRAM Q62702P51821 D5 SMD Green topled LGR971 OSRAM Q65110P51793 D6,D7,D8 SMD Power Schottky Rectifier MBR0520LT1 20V On Semiconductor MBR0520LT1G
Schematic, Board Layout, and Bill of Materials1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 4-51 J1 Dual Row Right Angle pin header 0.38um gold90122-20 Molex 90122-07701 J2 Dual Row Right Angle pin header 0.38um gold90122-12 Molex 90122-07661 J3 Dual Row Right Angle pin header 0.38um gold90122-6 Molex 90122-07631 J4 DC Power Jack PCB, 2mm DJ-005 Taitek 2DC-0005-D1005 J16,J17,J18,J19,J20 Single Row Straight Pin Header SMD TSM-102-01-L-SV Samtec TSM-102-01-L-SV0 L1 HF Chip coil 3.9nH 5% Murata LQG15HS3N9S02D0 L2 SMD power inductor 100uH 20% TDK SLF6028T-101MR42-PF1 PCB1 JDP7051_21 Q1 P-channel MOSFET ZXM61P02F 20V Zetex ZXM61P02F1 Q2 Digital P-Channel FET FDV302 25V Fairchild FDV302P1 RT1 Polyswitch Overcurrent Protection Device500mA 13.2V Tyco Electronics microSMD050F5 R1,R69,R74,R103,R104Fixed resistor RC31 10K 50V 0.063W2% Philips 2322 705 501031 R65 Fixed resistor RC21 0R 50V 0.063W5% Philips 2322 702 910024 R3,R66,R68,R105 Fixed resistor RC31 0R 50V 0.063W2% Philips 2322 705 910020 R4 Fixed resistor RC31 0R 50V 0.063W2% Philips 2322 705 910020 R5 Fixed resistor RC31 240R 50V 0.063W2% Philips 2322 705 502412 R6,R7 Fixed resistor RC31 390R 50V 0.063W2% Philips 2322 705 503911 R11 Fixed resistor RC31 220R 50V 0.063W2% Philips 2322 705 502212 R12,R70 Fixed resistor RC31 100K 50V 0.063W2% Philips 2322 705 501040 R71 Fixed resistor RC31 10K 50V 0.063W2% Philips 2322 705 50103Table 4-1. Bill of Materials (continued)
Schematic, Board Layout, and Bill of Materials1322x-LPB Reference Manual, Rev. 1.1 4-6 Freescale Semiconductor0 R72,R73 Fixed resistor RC31 1K 50V 0.063W2% Philips 2322 705 501020 R106,R107 Fixed resistor RC31 4.7K 50V 0.063W2% Philips 2322 705 504721 R120 RES MF 120K 1/16W 1% 0402 120K 1/16W 1% KOA SPEER RK73H1ETTP1203F1 R121 RES MF 24.9K 1/16W 1% 0402 24.9K 1/16W 1% KOA SPEER RK73H1ETTP2492F2 SW1,SW2 SMD Tact Switch 2.6N (7.0mm) DTSM63N Diptronic DTSM-63R-V-B1 SW5 Miniature Slide Switch 2 pole MFP213N-RA Knitter-Switch MFP213N-RA1 U1 ZigBee Wireless Transceiver and ARM7 processorMC13225 Freescale MC132251 U2 LDO voltage regulator 3V3 LT1129CST-3.3 Linear Technology LT1129CST-3.31 U17 IC VREG ADJ 1.24-5.3V 20MA SOIC8LM285M NATIONAL SEMICONDUCTORLM285M/NOPB1 X1 Crystal SMD 24.00MHz +-10ppm NDK NX3225SA-24MHz / S1-3085-1510-91 X2 Crystal SMD 32.768kHz +-20ppm Abracon ABS25-32.768-12.5-2-TTable 4-1. Bill of Materials (continued)

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