Freescale Semiconductor 1322X-LPB 1322x-LPB User Manual
Freescale Semiconductor, Inc. 1322x-LPB
Users Manual Rev 2
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| Document Description | Users Manual Rev 2 |
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| Date Submitted | 2008-07-24 00:00:00 |
| Date Available | 2008-07-31 00:00:00 |
| Creation Date | 2008-07-17 09:39:08 |
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1322x-Low Power Board (1322x-LPB) Reference Manual Document Number: 1322xLPBRM Rev. 1.1 07/2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. ARM is the registered trademark of ARM Limited. ARM7TDMI-S is the trademark of ARM Limited. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005, 2006, 2007, 2008. All rights reserved. Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety Information 1.1 1.2 1.2.1 1.2.2 1.2.3 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 1322x-LPB Module Overview and Description 2.1 2.2 2.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Chapter 3 System Overview and Functional Block Descriptions 3.1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.2 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.2.1 1322x-LPB Form Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.3 RF 2.4 GHz ISM Band radio design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.4 Power Sources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.4.1 External DC Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.4.2 Battery Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 3.4.3 Optional Use of MC1322x Buck Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 3.5 Clock Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.5.1 Reference Oscillator (24 MHz nominal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 3.5.2 32.768 kHz Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.6 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.7 Low Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 3.7.1 Switched VCC for Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 3.7.2 Measuring Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.7.3 Other Low Power Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.8 User Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 3.8.1 LEDs, Switches, and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 3.8.2 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3.8.3 3.8.4 3.8.5 3.8.6 ARM JTAG Debug Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UART Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 3-12 3-13 3-14 Chapter 4 Schematic, Board Layout, and Bill of Materials 1322x-LPB Reference Manual, Rev. 1.1 ii Freescale Semiconductor About This Book This manual describes Freescale’s 1322x-LPB evaluation board. The 1322x-LPB contains a Freescale third-generation, low power, 2.4 GHz radio frequency transceiver, with 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE Standard 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP). Audience This manual is intended for system designers. Organization This document is organized into 4 chapters. Chapter 1 Safety Information — Describes that any modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful. Chapter 2 1322x-LPB Module Overview and Description — Introduces the 1322x-LPB, which is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x device. Chapter 3 System Overview and Functional Block Descriptions — This section provides an overview of the 1322x-LPB and its block diagram. Chapter 4 Schematic and Bill of Material — Contains the schematic, board layout, and bill of material (BOM). Revision History The following table summarizes revisions to this document since the previous release (Rev 1.0). Revision History Location Chapter 1 Revision Updated FCC information. 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor iii Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.4 GHz radio frequency band JTAG Joint Test Action Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. SN Sensor Node pcb Printed circuit board PiP Platform in Package PWM Pulse-width modulation RTS Request to Send SMA Connector Sub Miniature version “A” connector SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port 1322x-LPB Reference Manual, Rev. 1.1 iv Freescale Semiconductor Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and make operation of the product unlawful. NOTE:The statement above applies also to the Industry Canada Approval 1.2 FCC Labeling FCC labels are physically located on the back of the board. 1.2.1 47 C.F.R. Sec. 15.21 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 1322x-LPB Reference Manual, Rev. 1.0 Freescale Semiconductor 1-1 Safety Information 1.2.2 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. 3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon. 1.2.3 47 C.F.R. Sec.15.203 An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.3 Regulatory Approval For Canada This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: Section 1.1 of this manual also applies to the Industry Canada Approval 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 1322x-LPB Reference Manual, Rev. 1.0 1-2 Freescale Semiconductor Chapter 2 1322x-LPB Module Overview and Description 2.1 Introduction The 1322x-LPB is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x device. The heart of the MC1322x USB module is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The 1322x-LPB provides a platform to evaluate the MC1322x device, develop software and applications, demonstrate IEEE 802.15.4 and ZigBee networking capabilities, and implement low power operation. The small form factor illustrates a small footprint, 2-layer printed circuit board (PCB) layout with integrated printed-wire F-antenna. The LPB provides a GPIO connector to interface with application devices, a separate second unbuffered UART connector, and a full JTAG debug port connector. Figure 2-1. 1322x-LPB The 1322x-LPB is specifically intended as a prototype development platform for low power applications, use of the buck converter, 2-layer PCB design, use of the 32.768 crystal oscillator, and non-standard crystal reference oscillators (requiring PLL operation). 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 2-1 1322x-LPB Module Overview and Description 2.2 Features The 1322x-LPB provides the following features: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP) • MC1322x provides a highly integrated, low cost RF node — On-board balun and antenna switch in package — Typical -95 dBm sensitivity — Typical 0 dBm output power, with max approximately +4 dBm — F-antenna • Standard JTAG debug/development interface connector • Power management circuit with on-board regulation for multiple power sources — Can be powered from DC power jack, two AAA batteries, or optional Lithium coin cells — On/Off power switch — Optional header for measuring MC1322x current — Power-on green LED • Supports optional use of buck converter • User interface switches and LEDs — 2 push buttons for application purposes — 2 processor controlled red LEDs for application purposes — Header for hardware reset • User interfaces include — 12-pin GPIO connector provides access to ADC inputs, unbuffered UART2 port, I2C port, and KBI pins (provide wake-up capabilities from low power) — 6-pin UART connector provides access to second unbuffer UART1 port • System clock options — Default 24 MHz crystal reference oscillator. Supports use of PLL with non-default 13-26 MHz crystal. — Optional 32.768 kHz crystal oscillator for accurate real-time delays (crystal is mounted). • Fixed 1.5 V reference for ADC VREFH during battery operation • Separate switched VCC (via P-channel MOSFET) for power control of off-chip peripheral functions. 1322x-LPB Reference Manual, Rev. 1.1 2-2 Freescale Semiconductor 1322x-LPB Module Overview and Description 2.3 Board Level Specifications Table 2-1. 1322x-LPB Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (Enclosure: X, Y, Z) Size (PCB: X, Y) Layer build (PCB) 74x56x37 mm 65x45 mm 0.8 / 0.032 mm / in Dielectric material (PCB) 2-Layer FR4 Power Voltage supply (DC) 4.4 12 Voltage supply (Batteries) 2.0 3.6 55 mA Current consumption Temperature Operating temperature -30 +25 +85 °C Storage temperature -30 +25 +85 °C 2480 MHz RF Frequency range 2405 Range (outdoor / line of sight) 300 All 16 channels in the 2450 MHz band, 5 MHz spacing Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board) RF Transmitter 802.15.4 Output power -30 Harmonics 2nd harmonics 3rd harmonics +4 dBm -38 -35 dBm dBm Over range of Pout from IC control in 2 dB steps. Note: On channel 26, output power should not exceed -5.5 dBm (Power setting 0x0E) to meet FCC part 15 requirements. Harmonics are compliant to ETSI and FCC regulatory approval standards RF Receiver Sensitivity -95 dBm <1% PER for 20-byte packets Regulatory Approval FCC Product complies accordingly to the FCC part 15 standard 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 2-3 1322x-LPB Module Overview and Description Table 2-1. 1322x-LPB Specifications (continued) Parameter Units Notes/Conditions CE (ETSI) Product complies accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product complies accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product complies accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 1322x-LPB Reference Manual, Rev. 1.1 2-4 Freescale Semiconductor Chapter 3 System Overview and Functional Block Descriptions This section provides an overview of the 1322x-LPB and its block diagram. 3.1 System Block Diagram The following is the 1322x-LPB system level block diagram. SW_VCC JTAG Debug KBI DC Adaptor 2xAAA Battery Power Management VCC Lithium Coin Cell PCB F-Antenna 12-Pin GPIO HDR GPIO MC13224V/225V Advanced ZigBee™- Compliant PiP 2 Pushbuttons 6-Pin UART HDR UART1 2 LEDs PLL Filter 24 MHz 32.768 KHz Figure 3-1. 1322x-LPB Block Diagram 3.2 Design Overview The heart of the 1322x-LPB is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The main attributes of the 1322x-LPB module are: • Small footprint with a 2-layer PCB and F-antenna • Support for very low power operation • Support for Lithium coin cell operation • Support for optional buck converter • Support for 32.768 KHz crystal oscillator • Support for non-standard reference oscillator crystal (13-26 MHz and requires use of PLL filter) 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-1 System Overview and Functional Block Descriptions The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4 applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core. 24 MHz (typ) 32.768 KHz (optional) BATTERY DETECT CLOCK & RESET MODULE (CRM) DUAL 12-BIT ADC MODULE RADIO INTERFACE MODULE (RIF) DIGITAL MODEM ANALOG TRANSMITTER BALUN JTAG/ Nexus DEBUG TX MODEM RF TX/RX SWITCH RX MODEM ANALOG RECEIVER 802.15.4 MAC ACCELERATOR (MACA) IEEE 802.15.4 TRANSCEIVER MC13225 Platform-in-Package (PiP) IEEE 802.15.4/ZIGBEE SOLUTION Buck Regulator ANALOG POWER MANAGEMENT VOLTAGE REGULATION ADVANCED SECURITY MODULE (ASM) SPI FLASH MODULE (SPIF) 128KBYTE NON-VOLATILE MEMORY (SERIAL FLASH) ARM7 TDMI-S 32-BIT CPU BUS INTERFACE & MEMORY ARBITRATOR ARM INTERRUPT CONTROLLER (AITC) 96KBYTE SRAM (24K WORDS x 32 BITS) 80KBYTE ROM (20KWORDS x 32 BITS) TIMER MODULE (TMR) (4 Tmr Blocks) UART MODULE (UART0) UART MODULE (UART1) SYNC SERIAL INTERFACE (SSI/i2S) KEYBOARD INTERFACE (KBI) UP TO 64 IO PINS RF OSCILLATOR CLOCK GENERATION INTER-IC BUS MODULE (I2C) SERIAL PERIPHERAL INTERFACE (SPI) GPIO and IO CONTROL Figure 3-2. MC1322x Block Diagram The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna. PA BALUN ANALOG TRANSMITTER RF TX/RX SW ITCH LNA ANALOG RECEIVER Figure 3-3. MC1322x RF Interface 1322x-LPB Reference Manual, Rev. 1.1 3-2 Freescale Semiconductor System Overview and Functional Block Descriptions 3.2.1 1322x-LPB Form Factor The MC1322x allows for very small footprint applications. The 1322x-LPB circuit board illustrates a small footprint for the MC1322x/RF area and use of a 2 metal layer design. This board can be used as a template for a 2-layer PCB design (design files are available), or additional reference designs are available through the Freescale web site. Freescale provides a one-stop-shop approach to guide customers with their wireless solutions to help minimize product time-to-market. One important recommendation is to follow the layout application guide as described in the Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual (ZHDCRM). This manual describes Printed Circuit Board (PCB) footprint guidelines for the MC1322x LGA 71 package. Included are layouts of the component copper layer, solder mask, and solder paste stencil. GPIO (J2) UART (J3) JTAG (J1) F-Antenna Power LED J18 J20 LED 1 LED 2 J19 J16 J17 DC Power Connect Power Switch SW1 SW2 Figure 3-4. 1322x-LPB PCB Top View Figure 3-4 shows the 1322x-LPB PCB top view. Refer to this figure in the following sections. 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-3 System Overview and Functional Block Descriptions 3.3 RF 2.4 GHz ISM Band radio design The MC1322x transceiver includes a low noise amplifier, 1mW nominal output power, PA with internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. The 1322x-LPB requires only a minimum amount of external components and a chip-antenna for a complete solution. Figure 3-5 shows the RF network external to the MC1322x. • Typical nominal output power is 0 dBm, with +4 dBm max • Typical sensitivity is -95 dBm. • Frequency range is 2405 to 2480 MHz • Typical range (outdoors, line of sight) is 300 meters • Uses a minimum number of RF components RF C1 Not Mounted 10pF RF_RX_TX L1 3.9nH Not Mounted C3 1pF Not Mounted ANT1 F_Antenna RF_GND Figure 3-5. 1322x-LPB RF Network. 3.4 Power Sources To allow maximum versatility, the 1322x-LPB can be powered via a DC source (nominally 5 VDC) or a variety of battery sources. • An “OFF/ON” slide switch (SW5) is provided that disconnects all supplies, no matter which is active. • A green “PWR” LED (D5) is provides as a Power-On indicator. • All sources are isolated via diodes. 3.4.1 External DC Source The DC source is typically an AC-DC converter • The DC source can be from 4.4 to 12 VDC • When connected, it automatically shuts down the battery supply. • The DC source is regulated to 3.3 V; however, the raw battery pack voltage directly supplies the circuitry 1322x-LPB Reference Manual, Rev. 1.1 3-4 Freescale Semiconductor System Overview and Functional Block Descriptions 3.4.2 Battery Sources The battery source can be either a AAA battery pack (2 cells) or an optional Lithium coin cell: • AAA source - as supplied, the 1322x-LPB has a 2-cell AAA battery holder mounted. The typical usable voltage range for 2 AAA cells is ~3.1V down to 2.2 - 2.0V. Note that a Schottky diode and a switch MOSFET are in series with the battery pack, and these will impact the lowest usable voltage for the battery pack. • Lithium coin cell source - in some very low duty cycle applications where the system mostly “sleeps” in low power, the use of a Lithium coin cell can be considered. To assist in this design, the 1322x-LPB supports mounting a socket for a coin cell — The AAA battery holder must first be removed. — Mount one of two sockets for a Lithium coin cell – Renata #SMTU2477N-1 - SMD holder for CR2477N cell (950 mAh) – Renata #SMTU2450N-1 - SMD holder for CR2450N cell (540 mAh) — The bottom view of the 1322x-LPB is shown in Figure 3-6. – The mounting pads for the socket are noted (both sockets use the same pads). Be sure to observe proper polarity. – The mounting pads for two 100µF tantalum capacitors (C59 & C60) are also provided. NOTE Designing with Manganese Dioxide Lithium Coin Cell technology can be very challenging. It is recommended to consider the following: • • • • Source impedance is high, typically about 25 ohms. Consider the fluctuation in source voltage under heavy current load (~20 mA or more). The addition of heavy bulk capacitance (such as C59 & C60) on VCC can help minimize voltage drop under heavy current. High current duty cycle is critical; every effort must be made to minimize high current activity (primarily TX and RX). When developing a coin cell application, it is highly recommended to use the external DC source for all code development and early testing. Life of coin cells can be very short with continual and/or heavy load. 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-5 System Overview and Functional Block Descriptions Socket Pads C59 and C60 Pads Figure 3-6. 1322x-LPB PCB Bottom View 3.4.3 Optional Use of MC1322x Buck Regulator The MC1322x is typically used in a single source, unregulated VCC configuration (VBATT connected in parallel with LREG_BK_FB), and the 1322x-LPB is supplied in this connection. However, the MC1322x also has an optional buck switched regulator, and the 1322x-LPB supports use of the buck function. Figure 3-7 shows the VCC connection at the MC1322x device. The PCB is supplied with the 0-ohm R66 component mounted, which is the simple non-regulated configuration. To allow use of the buck regulator: • Remove R66 • Mount L2; an SMD power 100uH inductor, from manufacturer TDK # SLF6028T-101MR42-PF (see Chapter 4, “Schematic, Board Layout, and Bill of Materials”). • Mount C52; a 100 µF ceramic capacitor. NOTE Use of the buck converter requires proper initialization, control and support through the application software. Refer to the MC1322x Reference Manual. VCC TP45 TP44 R65 VBATT COIL_BK LREG_BK_FB L2 R66 100uH Not Mounted 0R 0R Not Mounted J16 TSM-102-01-L-SV C52 C8 10uF 100pF Not Mounted C10 1uF Not Mounted Current Measurement Figure 3-7. MC1322x Main Power Connection 1322x-LPB Reference Manual, Rev. 1.1 3-6 Freescale Semiconductor System Overview and Functional Block Descriptions 3.5 Clock Sources The 1322x-LPB supports two primary clock sources for the MC1322x. 3.5.1 Reference Oscillator (24 MHz nominal) The reference oscillator is the primary source for all internal MC1322x clocks. Figure 3-8 shows the LPB circuitry related to the reference oscillator. The default frequency for the reference oscillator is 24 MHz and the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two additional options for the module: • X1 can be replaced by a 13-26 MHz crystal - It must meet MC1322x specifications. In addition, the onboard PLL must be used in this case. The PCB provides for the PLL filter components, but these are not populated. To use a non-standard crystal, the PLL filter components of R5, C4, and C5 must be populated. Also, software must enable use of the PLL for the internal modem clock. • An external clock source can be supplied as the reference source - This is typically 24 MHz. The frequency must be accurate to +/-40ppm. The external clock source can supplied via test point TP86 and C57 (10 pF) must also be installed. External Clock Source VCC TP86 RF_PLL_FLT R72 1K Not Mounted C57 10pF X1 24.00MHz R5 240R Not Mounted TP1 XTAL_24_OUT C5 180nF Not Mounted Not Mounted TP9 XTAL_24_IN TP87 R73 1K Not Mounted C4 27nF Not Mounted C58 10pF Not Mounted PLL External Filter Figure 3-8. Reference Oscillator Related Circuitry 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-7 System Overview and Functional Block Descriptions 3.5.2 32.768 kHz Crystal Oscillator Provision is also made for the secondary 32.768 kHz oscillator crystal X2. This oscillator can be used on the MC1322x for a low power accurate RTC timebase and wake-up state machine. The module comes with this crystal and its load capacitors C7 and C12 mounted. Although use of the oscillator is optional, the module is provided ready for use. See Figure 3-9. TP10 XTAL_32_OUT X2 32.768kHz C7 22pF XTAL_32_IN C12 22pF Figure 3-9. 32.768 KHz Oscillator Related Circuitry 3.6 FLASH Memory Recovery Jumpers and Erase The MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of doing so: • JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can be changed. • Load new FLASH image via UART1 port NOTE The 1322x-LPB provides a header for UART1 that is NOT buffered for RS232 operation. If users must employ UART1 with the Freescale Test Tool running on a PC, they must provide an appropriate RS232 interface board to connect to a PC serial COM port. — The Freescale BeeKit IDE suite download provides a software tool called “Test Tool”. This application runs on a PC and can be used with a client running on the MC1322x to test the platform. — Test Tool also has the capability to load a new image into the FLASH. NOTE The FLASH must be cleared before loading a new image. The 1322x-LPB has two jumper sites designated as J19 and J20 (see Figure 3-4) that must be used to erase the FLASH: 1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar, as well as, short Jumper J20 Pin 1 to Pin 2 with a second shorting bar 2. Turn on power, push the reset button, and wait a few seconds. 1322x-LPB Reference Manual, Rev. 1.1 3-8 Freescale Semiconductor System Overview and Functional Block Descriptions 3. Turn off power and remove the jumper shorts as required. 4. The board is now ready for boot operation. After the FLASH is erased, the module can be loaded with a new image through the UART1 port using Test Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit download. SW_VCC C2 100nF R103 10K TP3 ADC2_VREH TP103 J19 ADC2_VREFL Recovery Mode HDR_1X2 1-2 ADC2_VREFH -> "0" 3-4 ADC2_VREFL -> "1" VCC J20 R104 10K HDR_1X2 Figure 3-10. FLASH Erase Headers 3.7 Low Power Operation The 1322x-LPB intended to develop low power operation and applications code. It has been designed to allow low current measurement and support MC1322x low power application needs. NOTE It is strongly suggested that the user review the low power considerations described in the MC13224/225 Reference Manual. 3.7.1 Switched VCC for Peripheral Functions The MC1322x by default does not retain power to its GPIO pads while in low power mode (KBI signals are the exception and do retain power). As a result, GPIO pads should not be driven high while the device is in low power or extraneous current exist. The 1322x-LPB provides a switched VCC for devices connected to the MC1322x while low power mode so that these devices can be disabled when appropriate. Figure 3-11 shows the switched VCC circuit. • A P-channel MOSFET is used as a switch to turn SW_VCC ON or OFF as required. • The MOSFET gate is driven by signal KBI_3 which is always powered and defaults to an output in the high state when in low power. This condition turns off SW_VCC in low power mode. NOTE The user must program/control GPIO25 under run (operational) mode. The KBI pins are controlled by the CRM in low power mode; they revert to their GPIO control during normal run mode. As a result, GPIO25 must be programmed as an output and controlled to enable SW_VCC as appropriate for use, or alternatively, GPIO can be programmed as the KBI function under normal operation. 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-9 System Overview and Functional Block Descriptions • • SW_VCC is provided on the J2 GPIO Pin Header SW_VCC also powers U17 the voltage reference for ADC operation. TP47 VCC TP29 R68 TP32 MAIN SUPPLY 0R C56 4.7uF SW_VCC Q2 FDV302 KBI_3 Figure 3-11. Switched VCC for Peripheral Devices 3.7.2 Measuring Current The 1322x-LPB provides three primary points for current measurement: • Total current to the board - reference Figure 3-11. R68 can be removed and current can be measured between TP29 and TP47. • Total current to the MC13224/225 - reference Figure 3-7. R65 can be removed and current can be measured through jumper J16. • ADC voltage reference current - reference Figure 3-12. Voltage reference U17 is enabled via J18; current can be measured through this jumper. 3.7.3 Other Low Power Considerations When designing low power operation, consider: • Indicator LEDs D1 and D2 are connected to ground not VCC, so as to not put GPIO high during low lower mode. • The GPIO connector (J2) provides access and connectivity to the MC13224/225 — SW_VCC is provided. — No peripheral device should pull a GPIO high during low power mode — Signal SWITCH1 is connected to KBI_4 and can be used as a wake-up interrupt to the MC13224/225. See the CRM chapter of the MC13224/225 Reference Manual. — Signal SWITCH2 is connected to KBI_0 and can be used as a wake-up signal from the MC13224/225 to an external device. See the CRM chapter of the MC13224/225 Reference Manual. • The UART1 connector (J3) provides direct access to the MC13224/225 GPIO. If low power mode is enabled and UART1 is connected to an external device, extraneous high leakage current can occur if any of the UART1 signals is driven high. 1322x-LPB Reference Manual, Rev. 1.1 3-10 Freescale Semiconductor System Overview and Functional Block Descriptions 3.8 User Interfaces This section provides a summary of the user interfaces. 3.8.1 LEDs, Switches, and Reset For application interface the 1322x-LPB provides: • Two red LEDs (D1 and D2)are driven by the MCU and controlled by the software application. • Two pushbuttons (SW1 and SW2) are connected to the MCU GPIO for software application. Only SW1 has interrupt generation capability, and can be used as an input for low power wake-up. • Jumper J17 provides a hardware reset capability. Shorting Pin 1 to Pin 2 causes the hardware reset input to be held low and resets the MC13224/225. 3.8.2 ADC Voltage References When using the ADC input channels ADC2 and ADC3 (through J2), consider; • The ADC high voltage reference ADC2_VREFH is tied to SW_VCC through a resistor. This reference is not absolute and will move as VCC decreases with battery operation. • A fixed voltage reference for ADC1_VREFH is provided (see Figure 3-12). — The fixed voltage is 1.5 VDC. — The LM285M (U17) is programmed via R120 and R121 to provide a constant reference — The reference can be enabled via jumper J18. This number can also be used to measure current to the reference circuit. — This reference is useful for battery operation where a known, fixed high reference voltage for the ADC is required. SW_VCC J18 HDR_1X2 U17 R1 10K TP106 LM285M 1.5V ADC1_VREFH R120 120K 1% R121 24.9K 1% Figure 3-12. ADC Voltage 1.5 VDC Voltage Reference 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-11 System Overview and Functional Block Descriptions 3.8.3 ARM JTAG Debug Interface Connector The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly separated from the GPIO and UART pin headers and located at the rear side of the module. The 20-pin connector is designated “JTAG” on the silk-screen and has Pin 1 designated for correct plug-in of the development cable. Table 3-1 shows the device pins that are connected to the associated JTAG header pinouts. Table 3-1. ARM JTAG 20-Pin Connector Assignments (J1) Name1 Pin # Pin # Name VCC VCC NC2 GND TDI GND TMS GND TCK 10 GND RTCK 11 12 GND TDO 13 14 GND RESET3 15 16 GND NC 17 18 GND NC 19 20 GND NC means No Connect. MC1322x does not support separate JTAG reset TRST. 3 VCC through a 100k-ohm pullup. 3.8.4 GPIO Connector The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 12-pin header. The connector provides access to MCU GPIO, two timer GPIOs, two ADC inputs, UART2 port, and the I2C port. Power is also provided on the connector. • SW_VCC is the main supply voltage. Current draw should be limited to 50 mA. • Signals SWITCH1 and SWITCH2 are in parallel with onboard switches SW1 and SW2. • KBI signals are provided through SWITCH1 and SWITCH2 for low power control and interface Table 3-2. GPIO Connector J2 Pinouts Pin Number Name Function Notes UART2_RX UART2 RX data input / GPIO19 UART2 receive data input. UART2_TX UART2 TX data output / GPIO18 UART2 transmit data output. I2C_SDA I2C Bus data / GPIO13 I2C bus signal SDA. Pull-up to SW_VCC available 1322x-LPB Reference Manual, Rev. 1.1 3-12 Freescale Semiconductor System Overview and Functional Block Descriptions Table 3-2. GPIO Connector J2 Pinouts (continued) I2C_SCL I2C Bus clock / GPIO12 I2C bus signal SCL. Pull-up to SW_VCC available TMR3 Timer 3 IO signal / GPIO11 Pin can be used as Counter 3 output or counter input clock. TMR1 Timer 1 IO signal / GPIO9 Pin can be used as Counter 1 output or counter input clock. ADC3 ADC analog input Channel 3/ GPIO33 ADC sample channel can be used by either ADC1 or ADC2. ADC2 ADC analog input Channel 2/ GPIO32 ADC sample channel can be used by either ADC1 or ADC2. SWITCH1 KBI_4 input/ GPIO26 Asynchronous interrupt input can be used as wake-up signal. 10 SWITCH2 KBI_0_HST_WK output/ GPIO22 Can be used as a wake-up indicator output to external device. 11 GND System ground 12 SW_VCC Switched voltage supply 3.8.5 UART Connector The UART connector (J3) is a standard 2.54mm/0.1inch spacing, 6-pin header. The connector provides access to the unbuffered UART1 signals. Power is also provided on the connector. • VCC is the main board supply voltage. Current draw should be limited to 50 mA. • If low power mode is enabled on the module, all signals on J3 must be not be driven high. • Signals are unbuffered for RS232; an adaptor board is needed to talk to a PC serial COM port Table 3-3. UART Connector J3 Pinouts Pin Number Name Function Notes UART1_RX UART1 RX data input / GPIO19 UART2 receive data input. UART1_TX UART2 TX data output / GPIO18 UART2 transmit data output. UART1_CTS UART1 Clear to Send output / GPIO16 UART1 CTS control output. UART1_RTS UART1 Request to Send input / GPIO17 UART1 RTS control input. GND System ground VCC Main voltage supply 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 3-13 System Overview and Functional Block Descriptions 3.8.6 Jumper Selection Table 3-4 lists all the possible jumper selections for the 1322x-LPB. The jumpers available on the board are: • J16 - used to measure MC1322x current • J17 - used to reset MC1322x • J18 - used to enable 1.5V reference • J19, J20 - used to recover/clear FLASH. See Table 3-4. Table 3-4. LPB Jumper Selection Pin Header Pin Number Connection Description Default Setting J16 1-2 Connect to ammeter to measure MC1322x current. R65 should be removed Not mounted. Can be mounted for operation w/o R65 J17 1-2 Connect to reset MC1322x Not mounted J18 1-2 Connect to enable 1.5V reference Not mounted J19, J20 1-2, 1-2 Connect both to recover/clear FLASH. See Section 3.6, “FLASH Memory Recovery Jumpers and Erase” Not mounted 1322x-LPB Reference Manual, Rev. 1.1 3-14 Freescale Semiconductor Freescale Semiconductor DJ-005 J4 UART1_RX UART1_CTS UART2_RX I2C_SDA TMR3 ADC3 SWITCH1 R6 390R 10 12 90122-6 J3 D6 VCC TP26 10 12 2468 BC1 R69 10K C53 1uF R11 220R SWITCH2 SWITCH1 D5 LGR971 POWER R70 100K 3 4 2 1 C59 100uF Not Mounted C55 4.7uF 3 4 2 1 D8 MBR0520LT1 Q1 ZXM61P02F VCC 0R R68 CR2477N TP47 VCC BC2 SMTU2477N-1 Not Mounted C56 4.7uF TP29 Power Measurement TP87 TP86 External Clock Source J19 VREFH -> "0" J20 VREFL -> "1" RT1 500mA J19 1.5V VCC R103 10K CR2450N BC3 SMTU2450N-1 Not Mounted KBI_3 C7 22pF X2 32.768kHz C12 22pF X1 24.00MHz SWITCH1 KBI_3 LED2 LED1 SWITCH2 TP85 TP84 I2C_SDA I2C_SCL 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 84 85 86 87 88 93 94 95 96 97 104 105 106 115 47 XTAL_24_IN XTAL_24_OUT MC13225 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 GND_FLAG_1 GND_FLAG_2 GND_FLAG_3 GND_FLAG_4 GND_FLAG_5 GND_FLAG_6 GND_FLAG_7 GND_FLAG_8 GND_FLAG_9 GND_FLAG_10 GND_FLAG_11 GND_FLAG_12 GND_FLAG_13 GND_FLAG_14 GND_FLAG_15 GND_FLAG_16 GND_FLAG_17 GND_FLAG_18 GND_FLAG_19 XTAL_32_IN KBI_7 KBI_6 KBI_5 KBI_4 KBI_3 KBI_2 KBI_1 KBI_0_HST_WK SSI_TX SSI_RX SSI_BITCK SSI_FSYN SPI_SCK SPI_MOSI SPI_MISO SPI_SS I2C_SDA I2C_SCL UART1_TX UART1_RX UART1_RTS UART1_CTS UART2_TX UART2_RX UART2_RTS UART2_CTS TMR3 TMR2 TMR1 TMR0 ADC1_VREFL ADC2_VREFL ADC1_VREFH ADC2_VREFH ADC0 ADC1 ADC2 ADC3 ADC4 ADC5 ADC6 ADC7_RTCK U1 TP10 48 XTAL_32_OUT TP9 50 49 TP1 35 36 37 38 39 40 41 42 34 33 31 32 27 28 29 30 21 22 20 19 17 18 UART1_TX UART1_RX UART1_RTS UART1_CTS 23 24 25 26 62 61 63 64 16 15 13 14 TMR1 R105 0R TMR3 TP105 TP104 ADC2 ADC3 UART2_TX UART2_RX R71 10K Not Mounted R104 10K TP103 R1 10K SW_VCC TP3 C58 10pF Not Mounted SW_VCC Q2 FDV302 TP32 R73 1K Not Mounted Not Mounted C57 10pF R74 10K SW_VCC TSM-102-01-L-SV J20 C2 100nF J18 TSM-102-01-L-SV SW_VCC R72 1K Not Mounted R4 0R Not Mounted R3 0R TSM-102-01-L-SV JTAG RTCK Disable JTAG RTCK Enable Recovery Mode RTCK SW2 DTSM63N SWITCH2 R121 24.9K 1% R120 120K 1% C60 100uF Not Mounted MBR0520LT1 D7 SW1 DTSM63N SWITCH1 Push Buttons LM285M TP28 C54 100nF U17 SW5B MFP213N-RA LT1129CST-3.3 GND1 GND2 Vin Vout U2 Power Management UART1_TX UART1_RTS UART2_TX I2C_SCL TMR1 ADC2 SWITCH2 V_MAIN C51 100nF C50 100nF SW_VCC TP8 VCC Power ON R106 4.7K Not Mounted SW_VCC R7 390R D2 LHR974 LED2 2xAAA Cells MBR0520LT1 UART Pin Header 90122-12 11 J2 GPIO Pin Header SW5A MFP213N-RA 11 TP5 D1 LHR974 LED1 R107 4.7K Not Mounted SW_VCC TP4 LED2 LED1 LEDs NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45 NC46 DIG_REG NVM_REG LREG_BK_FB COIL_BK VBATT RESETB TMS TCK TDI TDO EVTI_B EVTO_B MSEO1_B MSEO0_B MCKO/IO50 RDY_B MDO07 MDO06 MDO05 MDO04 MDO03 MDO02 MDO01 MDO00 RF_PLL_FLT VREG_ANA PA_POS PA_NEG RF_GND ANT_2 ANT_1 TX_ON RX_ON RF_RX_TX 80 81 82 83 89 90 91 92 98 99 100 101 107 108 109 110 116 117 118 119 125 126 127 128 134 135 136 137 138 139 140 141 142 143 144 145 124 133 44 43 45 51 12 11 10 132 123 113 114 131 122 129 130 120 121 111 112 102 103 46 55 54 53 58 57 56 52 59 60 100uH Not Mounted L2 90122-20 11 13 15 17 19 J1 10 12 14 16 18 20 ZZ1 Label 1322X-LPB JDP7051_2 PCB1 10 12 14 16 18 20 JTAG Debug RTCK 11 13 15 DBGRQ 17 DBGACK 19 nTRST VCC TSM-102-01-L-SV Current Measurement J16 C11 1nF R12 100K VCC ANT1 F_Antenna VCC TP45 C10 1uF Not Mounted 0R R65 Not Mounted TP44 C4 27nF Not Mounted C3 1pF Not Mounted C52 C8 10uF 100pF Not Mounted 0R R66 C5 180nF Not Mounted R5 240R Not Mounted L1 3.9nH Not Mounted 10pF C1 RF C6 100nF REF3 1Ref REF2 1Ref REF1 1Ref MH3 MH2 MH1 Reset TSM-102-01-L-SV J17 VCC FCP: _X_ of Sheet SOURCE: SCH-23453 PDF: SPF-23453 Tuesday, April 08, 2008 PUBI: --- Date: FIUO: --- Document Number Main Schematic 1322X-LPB Size Page Title: ICAP Classification: Drawing Title: Rev Chapter 4 Schematic, Board Layout, and Bill of Materials Figure 4-1. 1322x-LPB Schematic 1322x-LPB Reference Manual, Rev. 1.1 4-1 Schematic, Board Layout, and Bill of Materials Figure 4-2. 1322x-LPB PCB Component Location (Top View) Figure 4-3. 1322x-LPB PCB Test Points (Bottom View) 1322x-LPB Reference Manual, Rev. 1.1 4-2 Freescale Semiconductor Schematic, Board Layout, and Bill of Materials Figure 4-4. 1322x-LPB PCB Layout (Top View) Figure 4-5. 1322x-LPB PCB Layout (Bottom View) 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 4-3 Schematic, Board Layout, and Bill of Materials Table 4-1. Bill of Materials Qty Part Reference Description Value Voltage Power Tolerance Manufacturer Manufacturer Part Number ANT1 PCB F ANTENNA F ANTENNA NOT A PART NOT A PART BC1 PCB Battery Holder 2xAAA 2468 Keystone 2468 BC2 Surface mount coin cell holder CR2477N SMTU2477N-1 Reneta SMTU2477N-1 BC3 Surface mount coin cell holder CR2450N SMTU2450N-1 Renata SMTU2450N-1 C1,C57,C5 Ceramic Capacitor COG 10pF 50V 5% Murata GRM1555C1H1 00JZ01 C2,C6,C50 Ceramic Capacitor ,C51,C54 X5R 100nF 10V 10% Murata GRM155R61A1 04KA01D C3 Ceramic Capacitor COG 1pF 50V 0.25pF Murata GRM1555C1H1 R0CZ01D C4 Ceramic Multilayer Capacitor X7R 27nF 10V 5% Vishay VJ0402Y273JX QCW1BC C5 Ceramic Multilayer Capacitor X7R 180nF 16V 5% Vishay VJ0603Y184JX JCW1BC C7,C12 Ceramic Capacitor COG 22pF 50V 5% Murata GRM1555C1H2 20JZ01J C8 Ceramic Capacitor COG 100pF 50V 5% Murata GRM1555C1H1 01JZ01 C10 Ceramic Capacitor X5R 1uF 6.3V 10% Murata GRM155R60J1 05KE19B C11 Ceramic Capacitor X7R 1nF 50V 10% Murata GRM155R71H1 02KA01D C52 Ceramic Capacitor for smoothing X5R 10uF 10V 10% Murata GRM21BR61J1 06KE19L C53 Ceramic Multilayer Capacitor X7R NoPb 1uF 16V 15% Murata GRM21BR71C 105 C55,C56 Ceramic Multilayer Capacitor X5R 4.7uF 16V 15% Phycomp 2222 781 13672 C59,C60 Low ESR Tantal Capacitor 100uF 16V +/-10% AVX TPSD107K016 R150 D1,D2 SMD Red topled LHR974 OSRAM Q62702P5182 D5 SMD Green topled LGR971 OSRAM Q65110P5179 D6,D7,D8 SMD Power Schottky Rectifier MBR0520LT1 20V On MBR0520LT1G Semiconductor 1322x-LPB Reference Manual, Rev. 1.1 4-4 Freescale Semiconductor Schematic, Board Layout, and Bill of Materials Table 4-1. Bill of Materials (continued) J1 Dual Row Right Angle 90122-20 pin header 0.38um gold Molex 90122-0770 J2 Dual Row Right Angle 90122-12 pin header 0.38um gold Molex 90122-0766 J3 Dual Row Right Angle 90122-6 pin header 0.38um gold Molex 90122-0763 J4 DC Power Jack PCB, 2mm DJ-005 Taitek 2DC-0005-D10 J16,J17,J1 Single Row Straight 8,J19,J20 Pin Header SMD TSM-102-01-LSV Samtec TSM-102-01-LSV L1 HF Chip coil 3.9nH 5% Murata LQG15HS3N9S 02D L2 SMD power inductor 100uH 20% TDK SLF6028T-101 MR42-PF PCB1 Q1 P-channel MOSFET 20V Zetex ZXM61P02F Q2 Digital P-Channel FET FDV302 25V Fairchild FDV302P RT1 Polyswitch 500mA Overcurrent Protection Device 13.2V Tyco Electronics microSMD050F R1,R69,R7 Fixed resistor RC31 4,R103,R1 04 10K 50V 0.063 2% Philips 2322 705 50103 R65 Fixed resistor RC21 0R 50V 0.063 5% Philips 2322 702 91002 R3,R66,R6 Fixed resistor RC31 8,R105 0R 50V 0.063 2% Philips 2322 705 91002 R4 Fixed resistor RC31 0R 50V 0.063 2% Philips 2322 705 91002 R5 Fixed resistor RC31 240R 50V 0.063 2% Philips 2322 705 50241 R6,R7 Fixed resistor RC31 390R 50V 0.063 2% Philips 2322 705 50391 R11 Fixed resistor RC31 220R 50V 0.063 2% Philips 2322 705 50221 R12,R70 Fixed resistor RC31 100K 50V 0.063 2% Philips 2322 705 50104 R71 Fixed resistor RC31 10K 50V 0.063 2% Philips 2322 705 50103 JDP7051_2 ZXM61P02F 1322x-LPB Reference Manual, Rev. 1.1 Freescale Semiconductor 4-5 Schematic, Board Layout, and Bill of Materials Table 4-1. Bill of Materials (continued) R72,R73 Fixed resistor RC31 1K 50V 0.063 2% Philips 2322 705 50102 R106,R107 Fixed resistor RC31 4.7K 50V 0.063 2% Philips 2322 705 50472 R120 RES MF 120K 1/16W 120K 1% 0402 1/16W 1% KOA SPEER RK73H1ETTP1 203F R121 RES MF 24.9K 1/16W 24.9K 1% 0402 1/16W 1% KOA SPEER RK73H1ETTP2 492F SW1,SW2 SMD Tact Switch 2.6N DTSM63N (7.0mm) Diptronic DTSM-63R-V-B SW5 Miniature Slide Switch MFP213N-RA 2 pole Knitter-Switch MFP213N-RA U1 ZigBee Wireless MC13225 Transceiver and ARM7 processor Freescale MC13225 U2 LDO voltage regulator LT1129CST-3.3 3V3 Linear Technology LT1129CST-3.3 U17 IC VREG ADJ 1.24-5.3V 20MA SOIC8 LM285M NATIONAL SEMICONDU CTOR LM285M/NOPB X1 Crystal SMD 24.00MHz +-10ppm NDK NX3225SA-24 MHz / S1-3085-15109 X2 Crystal SMD 32.768kHz +-20ppm Abracon ABS25-32.76812.5-2-T 1322x-LPB Reference Manual, Rev. 1.1 4-6 Freescale Semiconductor
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