Freescale Semiconductor 1322X-SRB 1322X-SRB User Manual
Freescale Semiconductor, Inc. 1322X-SRB
Users Manual Rev 2
Document Number: 1322xSNRM
Rev. 1.1
07/2008
1322x Sensor Node
Reference Manual
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
support@freescale.com
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064, Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-521-6274 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use
Freescale Semiconductor products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the information
in this document.
Freescale Semiconductor reserves the right to make changes without further notice to any products
herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical”
parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can
and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by customer’s
technical experts. Freescale Semiconductor does not convey any license under its patent rights nor
the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for
use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the Freescale
Semiconductor product could create a situation where personal injury or death may occur. Should
Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses,
and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
ARM is the registered trademark of ARM Limited. ARM7TDMI-S is the trademark of ARM Limited.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other
product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2007, 2008. All rights reserved.
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor i
Contents
About This Book
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Chapter 1
Safety1322x Sensor Node Information
1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.1 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.2 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.3 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 Regulatory Approval For Canada. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Chapter 2
1322x Sensor Node Module Overview and Description
2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Chapter 3
System Overview and Functional Block Descriptions
3.1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3 Power Management and Measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.4 Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.5 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.6 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.7 Debug/Development Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.8 Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.8.1 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.8.2 Pressure Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.8.3 Three-axis Accelerometer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.9 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.10 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.11 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Chapter 4
Interface Locations and Pinouts
4.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
1322x Sensor Node Reference Manual, Rev. 1.1
ii Freescale Semiconductor
4.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2.1 Supply Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2.2 On/Off Switch and Power On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.3 RF Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.4 USB Connector (“B” Receptacle). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.5 LEDs, Switch, Buttons and Joystick. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.6 Debug/Development Connector (ARM JTAG Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.7 Audio Subsystem Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.8 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.9 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.10 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.11 Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
Chapter 5
Schematic, Board Layout, and Bill of Material
1322x-Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor iii
About This Book
This manual describes Freescale’s 1322x Sensor Node evaluation board. The 1322x Sensor Node contains
Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4
GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE
802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA
Platform-in-Package (PiP).
Audience
This manual is intended for system designers.
Organization
This document is organized into 4 chapters.
Chapter 1 Safety Information — Highlights some of the FCC requirements.
Chapter 2 1322x Sensor Node Overview and Description — This chapter introduces 1322x
Sensor Node which is an IEEE, 802.15.4 compliant evaluation board based on the
Freescale MC1322x device.
Chapter 3 System Overview and Functional Block Descriptions — This section provides an
overview of the 1322x Sensor Node and system block diagrams.
Chapter 4 Interface Locations and Pinouts — This chapter provides a description of the
interface locations and pinout of the 1322x Sensor Node PCB.
Chapter 5 Schematic and Bill of Materials — This chapter provides the schematic, board
layout, and Bill of Materials (BOM).
Revision History
The following table summarizes revisions to this document since the previous release (Rev 1.0).
Revision History
Location Revision
Chapter 1 Updated FCC information.
1322x-Sensor Node Reference Manual, Rev. 1.1
iv Freescale Semiconductor
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC Analog to Digital Converter
AES Advanced Encryption Standard
ARM Advanced RISC Machine
CTS Clear to Send
DAC Digital to Analog Converter
DMA Direct Memory Access
I2C Inter-Integrated Circuit is a multi-master serial computer bus
ISM Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG Joint Test Action Group
LGA Land Grid Array
MAC Media Access Controller
MCU Microcontroller Unit
NEXUS An embedded processor development tool interface that helps design engineers
identify software and hardware-level issues.
SN Sensor Node
pcb Printed circuit board
PiP Platform in Package
PWM Pulse-width modulation
RTS Request to Send
SMA Connector SubMiniature version “A” connector
SPI Serial Peripheral Interface
SSI Synchronous Serial Interface
TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO Telephone Company
USB Universal Serial Bus
VCP Virtual Com Port
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 1-1
Chapter 1
Safety1322x Sensor Node Information
1.1 FCC Guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and make operation of the product unlawful. NOTE: The statement above
applies also to the Industry Canada Approval.
1.2 FCC Labeling
FCC labels are physically located on the back of the board.
1.2.1 47 C.F.R. Sec. 15.21
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the interference
by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Safety1322x Sensor Node Information
1322x Sensor Node Reference Manual, Rev. 1.1
1-2 Freescale Semiconductor
1.2.2 47 C.F.R. Sec.15.105(b)
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following three
conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired
operation.
3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon.
1.2.3 47 C.F.R. Sec.15.203
An intentional radiator shall be designed to ensure that no antenna other than that furnished by the
responsible party shall be used with the device. The use of a permanently attached antenna or of an
antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with
the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be
replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This
requirement does not apply to carrier current devices or to devices operated under the provisions of
Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional
radiators that must be professionally installed, such as perimeter protection systems and some field
disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be
measured at the installation site. However, the installer shall be responsible for ensuring that the proper
antenna is employed so that the limits in this Part are not exceeded.
1.3 Regulatory Approval For Canada
This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: Section 1.1
of this manual also applies to the Industry Canada Approval
1.4 Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 2-1
Chapter 2
1322x Sensor Node Module Overview and Description
2.1 Introduction
The 1322x Sensor Node is an IEEE 802.15.4 compliant evaluation board based on the Freescale
MC1322X device. The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA
Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple
proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed
to provide a highly integrated, total solution, with premier processing capabilities and very low power
consumption.
The 1322x Sensor Node provides a platform to evaluate the MC1322x device, develop software and
applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The Sensor Node
surrounds the core device with capabilities that provide a complete 802.15.4 radio, user interface,
debugging capabilities, connection to personal computers (PCs) and other devices, sensors, and portability.
Figure 2-1. 1322x Sensor Node
1322x Sensor Node Module Overview and Description
1322x Sensor Node Reference Manual, Rev. 1.1
2-2 Freescale Semiconductor
2.2 Features
The 1322x Sensor Node provides the following features:
• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software
stack
• Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete,
low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware
acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals
into a 99-pin LGA Platform-in-Package (PiP)
• MC1322x provides a highly integrated, low cost RF node
— On-board balun and antenna switch in package
— Typical -95 dBm sensitivity
— Typical 0 dBm output power, with max approximately +3 dBm
— Printed F-antenna
• USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications
• Audio subsystem
— 2.5mm audio jack for microphone and mono earpiece
— Input amplifier and anti-aliasing filter for an electret microphone
— Output path to second order analog filter from either 10-bit serial DAC or PWM as output
signal sources
— I2C controlled 32-position linear nonvolatile volume control for audio circuit
— Audio output amplifier for both earpiece or on-board dynamic speaker (switched by headset
jack)
• Freescale pressure sensor with 0-10 kPA range
• Temperature sensor with the full operating temperature range of the board with a ±3°C accuracy.
• Freescale XYZ tri-axis accelerometer for measuring changes in forces applied to the board (typical
sensitivity of 800 mV/g @ 1.5g)
• 20-pin connector for standard JTAG debug/development interface
• Power management circuit with on-board regulation for multiple power sources
— Can be powered from USB interface, DC power jack or two AA batteries
— On/Off power switch
— Power-on green LED
• User interface switches and LEDs
— 4-directional TACT switch with center push for application purposes
— 4 pushbuttons for application purposes
— 4 processor controlled red LEDs for application purposes
— Reset switch
• 26-pin user header for selected General Purpose Input Output signals and data interfaces
• System clock options
1322x Sensor Node Module Overview and Description
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 2-3
— Default 24 MHz crystal reference oscillator (13 to 26 MHz crystal optional)
— Reference oscillator can be driven from an external source
— Optional 32.768 kHz crystal oscillator for accurate real-time delays (not mounted)
2.3 Board Level Specifications
Table 2-1. 1322x Sensor Node Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (Enclosure: X, Y, Z) 95x60x40 mm
Size (PCB: X, Y) 85x50 mm
Layer build (PCB) 0.8 /
0.032 mm /
in 4-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (DC) 4.4 5 12 V
Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification
Voltage supply (Batteries) 3 3.2 V
Current consumption 100 mA
Temperature
Operating temperature (see note) -20 +25 +85 °C
Storage temperature -30 +25 +85 °C
USB interface USB 2.0 and 1.1 full-speed compatible
Audio
Audio (Input sensitivity) -40 dB Accepts electret microphone element
Audio (Output)
Attenuation
Temperature Sensor
LM61BIM3 (National Semi) See data sheet
Pressure Sensor
MPXV5010GC6U (Freescale Semi) See data sheet
Tri-axis Low-g Accelerometer
MMA7260QR2 (Freescale Semi) See data sheet
RF
802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band
1322x Sensor Node Module Overview and Description
1322x Sensor Node Reference Manual, Rev. 1.1
2-4 Freescale Semiconductor
Range (outdoor / line of sight) 700 Meter <1% PER for 20-byte packets (point-to-point
in communications with 1322X Sensor
Reference Board)
RF Transmitter
802.15.4 Output power -30 0 +3 dBm Over range of Pout from IC control in 2 dB
steps.
Note: On channel 26, output power should
not exceed -4 dBm (power setting
0x0E) to meet FCC Part 15
requirements.
Harmonics
2nd harmonics
3rd harmonics -38
-35
dBm
dBm
Harmonics are compliant to ETSI and FCC
regulatory approval standards
RF Receiver
802.15.4 sensitivity -95 dBm <1% PER for 20-byte packets
Proprietary high-speed mode
sensitivity -80 dBm <1% PER for a minimum data payload of
400 packets
Regulatory Approval
FCC Product is approved accordingly to the FCC
part 15 standard
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
Table 2-1. 1322x Sensor Node Specifications (continued)
Parameter Units Notes/Conditions
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 3-1
Chapter 3
System Overview and Functional Block Descriptions
This section provides an overview of the Sensor Node and block diagrams.
3.1 System Block Diagram
The following is the 1322x Sensor Node system level block diagram.
Figure 3-1. 1322x Sensor Node Block Diagram
24 MHz 32.768
KHz
Audio
Output
DAC
DAC101S101
Earphone
Power
Manage-
ment
DC Adaptor
2xAA Battery
USB Bus Power
VCC
MC13224V/225V
Advanced ZigBee™- Compliant PiP
Ext
Clock
Source
13-26MHz Clk Clk
Debug
Interface
20-Pin
JTAG
Conn
JTAG
JTAG
Power
Measure-
ments
Audio
Mic Input w/
Amp / LP
Filter
ADC Mic
SSI
TMR3 - PWM Audio
Output
Amp / LP
Filter
Audio
Volume
Control
MAX5434
Audio
Amp
NCP4896 Speaker
GPIO
26-Pin
Header
GPIO User
Apps
USB
Interface
FT232RQ
UART USB
Conn
GPIO 4 Push Buttons,
Joystick,
Reset Switch,
On/Off Switch
GPIO 4 Red LEDs,
1 Green LED
XYZ
Sensor
MMA7260Q
ADC
Force (g)
Pressure
Sensor
MPX5010G
ADCPressure
(kPa)
Temperature
Sensor
LM61
ADC
Temp (ºC)
PCB F-Antenna
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
3-2 Freescale Semiconductor
3.2 System Overview
The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP)
solution that can be used for wireless applications ranging from simple proprietary point-to-point
connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly
integrated, total solution, with premier processing capabilities and very low power consumption.
The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4
applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is
mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM
is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and
communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for
transceiver packet data complement the processor core.
Figure 3-2. MC1322x Block Diagram
On-board peripherals include the following:
• Two dedicated UART modules capable of 2 Mbps with CTS/RTS support
• SPI port with programmable master and slave operation
• Keyboard interface capability.
• Two 12-bit analog-to-digital converters (ADCs) with 8 input channels
• Four independent 16-bit timers with PWM capability.
• Inter-integrated circuit (I2C) interface
• Synchronous Serial Interface (SSI) with I2S and SPI capability and FIFO data buffering
TIMER
MODULE
(TMR)
(4 Tmr Blocks)
UART
MODULE
(UART0)
UART
MODULE
(UART1)
SYNC SERIAL
INTERFACE
(SSI/i2S)
KEYBOARD
INTERFACE
(KBI)
INTER-IC BUS
MODULE
(I2C)
SERIAL
PERIPHERAL
INTERFACE
(SPI)
DUAL
12-BIT
ADC
MODULE
GPIO and IO
CONTROL
UP TO 64 IO PINS
ARM7
TDMI-S
32-BIT
CPU
BUS
INTERFACE
& MEMORY
ARBITRATOR
ARM
INTERRUPT
CONTROLLER
(AITC)
JTAG/
Nexus
DEBUG
ADVANCED
SECURITY
MODULE
(ASM)
CLOCK &
RESET
MODULE
(CRM)
RADIO
INTERFACE
MODULE
(RIF)
96KBYTE
SRAM
(24K WORDS x
32 BITS)
80KBYTE
ROM
(20KWORDS x
32 BITS)
RF
OSCILLATOR
&
CLOCK GENERATION
SPI
FLASH
MODULE
(SPIF)
802.15.4
MAC
ACCELERATOR
(MACA)
DIGITAL
MODEM
TX
MODEM
RX
MODEM
128KBYTE
NON-VOLATILE
MEMORY
(SERIAL
FLASH)
ANALOG
TRANSMITTER
ANALOG
RECEIVER
RF
TX/RX
SWITCH
IEEE 802.15.4 TRANSCEIVER
BALUN
ANALOG
POWER
MANAGEMENT
&
VOLTAGE
REGULATION
MC13225
Platform-in-Package (PiP)
IEEE 802.15.4/ZIGBEE SOLUTION
Buck
Regulator
24 MHz (typ) 32.768 KHz (optional)
BATTERY
DETECT
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 3-3
The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun
along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA
provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95
dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the
smallest footprint in the industry. All components are integrated into the package except the crystal and
antenna.
Figure 3-3. MC1322x RF Interface
Augmenting the core device on the Sensor Node are:
• Low-cost 2.4 GHz ISM Band radio
• 2.0 USB connection
• User interface with pushbuttons, and LEDs
• Versatile power sources and management
• Debug / development port
• Audio subsystem
• Pressure, temperature, and accelerometer sensors
• GPIO connector for system expansion
Users are encouraged to reference the board schematic for the topics covered in the following sections.
3.3 Power Management and Measurement
To allow maximum versatility, the Sensor Node can be powered via a DC source (typically an AC-DC
converter; nominally 5 Vdc), the USB node, or an onboard battery pack with 2 AA alkaline batteries.
• The DC source or USB will automatically shutdown the battery supply.
• The DC source and the USB power are regulated to 3.3 V, however, the raw battery pack voltage
directly supplies the circuitry
• All sources are isolated via diodes.
• An on/off switch and a power-on LED are provided (see Section 4.2.2, “On/Off Switch and Power
On Indicator”).
ANALOG
TRANSMITTER
ANALOG
RECEIVER
RF
TX/RX
SWITCH
BALUN
LNA
PA
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
3-4 Freescale Semiconductor
• Zero-ohm resistors are provided to allow isolation and measurement of various system components
(see Section 4.2.3, “Power Measurement”)
3.4 Low-cost 2.4 GHz ISM Band radio
The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component
required for the radio is an antenna. The Sensor Node provides a pcb printed metal F-antenna for a
complete solution. Figure 3-4 shows the RF network external to the MC1322x.
• Typical nominal output power is 0 dBm, with +4 dBm max
• Typical sensitivity is -95 dBm.
• Frequency range is 2405 to 2480 MHz
• Typical range (outdoors, line of sight) is 300 meters
Figure 3-4. Sensor Node RF Network.
3.5 USB Interface
For many applications or demonstrations it is desirable to connect the Sensor Node to a PC or other device.
A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232R USB
UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the
module.
The USB interface is configured as a “Bus Powered” device and will therefore draw all required power
from the USB interface. The device is USB 2.0 full speed compatible.
3.6 User Interface
The Sensor Node provides multiple means for user interface for both debug and demonstration.
• Four individual pushbuttons can be used as input, and a 4-direction tactile joystick switch with
center push is wired in parallel with the individual pushbuttons. These pushbuttons have interrupt
generation capability.
• Four individual LEDs can be used as indicators for debug or status.
ANT1
F_Antenna
C1
10pF
Not Mounted
L1
3.9nH
Not Mounted
C3
1pF
Not Mounted
RF
RF_RX_TX
RF_GND
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 3-5
3.7 Debug/Development Interface
There is a standard JTAG debug port (for pinouts see Section 4.6, “Debug/Development Connector (ARM
JTAG Interface)”). A 20-pin connector is provided for a standard JTAG debug interface that only requires
a simple interface cable to connect to the PC and uses standard ARM software development tools.
3.8 Sensors
The SN provides a temperature sensor, a pressure sensor, and a three axis low-g accelerometer. All three
sensors provide analog voltage outputs and require use of the MC13224/225 ADCs.
NOTE
• There are two VREFH voltages. ADC2_VREFH is tied to the device
VCC and moves with the VCC voltage, i.e., either the regulated voltage
or the battery voltage. ADC2_VREFH is useful if the application wants
the ADC reference to scale with the supply voltage (as for audio),
however, it is unreliable for a fixed voltage reference such as the
temperature sensor. In contrast, ADC1_VREFH is tied to a fixed 1.5 V
reference (see Section 4.10, “ADC Voltage References”). This fixed
reference should be used for battery operation where a known voltage is
required.
• All sensor voltage outputs are conditioned with RC filtering to help
eliminate noise.
• The user is referenced to the individual data sheets for each of the
sensors for detailed information.
3.8.1 Temperature Sensor
The temperature sensor is a National Semiconductor LM61BIM3. Its accuracy is ±3°C, and its output
voltage is typically 0.600 Vdc at 0°C with a slope of +10 mV/°C. The sensor requires only one ADC input
and is constantly powered.
Figure 3-5. Typical Voltage Out vs. Temperature for LM61B
0.000
0.200
0.400
0.600
0.800
1.000
1.200
0 102030405060
Temp (Degrees C)
Temp Vo (Vdc)
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
3-6 Freescale Semiconductor
3.8.2 Pressure Sensor
The pressure sensor is a Freescale Semiconductor MPXV5010GC6U fully integrated device. It provides
a high level analog output signal that is proportional to the applied pressure. Its accuracy is ±5%, and its
output voltage is typically 0.200 Vdc at 0 offset pressure with a slope of +450 mV/kPa (1.0 kPa
[kiloPascal] equals 0.145 psi.). The sensor requires only one ADC input and is constantly powered .
The pressure sensor has an axial port (upright tube) for connecting tubing for a pressure source. The
outside dimension of the tube is 3.0 mm nominal, and the tube is accessible through the top of the plastic
enclosure.
3.8.3 Three-axis Accelerometer
The three-axis accelerometer is the MMA7260QR2 device from Freescale Semiconductor. The
MMA7260QR2 is specified for sensitivity in four ranges (1.5g/2g/4g/6g). The range is selectable via
control lines. Consult the data sheet for sensitivity and other information. Each axis requires an ADC input
(three total), and the accelerometer can be powered down.
3.9 Audio Subsystem
The audio subsystem provides means for simple output sounds/tones or for TELCO voice quality audio.
• A 2.5mm stereo jack is provided to interface to a typical telephone-type headset with an electret
microphone and a single earphone.
• Audio input - The audio input is taken from the headset electret microphone (mic).
— An onboard 10 k-ohm resistor circuit biases the mic for an ~1 Vdc operating voltage.
— The mic AC signal is filtered and amplified through a active low-pass filter with a voltage gain
of about 30 (~30 dB). The filter topology is a multiple feedback (MFB) 3-pole, linear phase
design. The target cutoff frequency is 3.6 kHz. The filter is intended as an anti-aliasing filter
for sampled data.
— The input amplifier output is sampled via the onboard MC1322x ADC. The sampling
frequency is programmable.
• Audio output source - The audio output can be sourced from both a serial 10-bit DAC and a PWM
timer output.
— The 10-bit serial DAC uses the SSI port to send provide the digital sample data.
— The PWM timer output is typically modulated to create a Class-D amplifier. Secondarily, a
simple 50% duty cycle signal can provide simple tones.
— The audio output source is jumper selectable via J7
• Audio output processing - The DAC or PWM out signal is filtered through an active 2-pole LPF.
From the filter the signal passes through a passive attenuator, and then is amplified and driven to
either an on-board speaker or the headset earphone.
— The attenuator provides a volume control that is controlled via a software 32 linear tap
programmable, non-volatile digital potentiometer. The interface to the potentiometer is the I2C
port.
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 3-7
— The onboard speaker is automatically disconnected if a headset is plugged-in.
3.10 GPIO Connector
The GPIO connector (J2) provides a number of data interfaces and GPIO for external system expansion,
Section 4.8, “GPIO Connector” gives details.
• Some of the GPIO are shared with onboard devices. The user should take care to avoid conflict.
• Power supply voltage is provided
— Current draw should be limited to 50 mA.
— A separate regulated voltage can be enabled
• Provision is made to supply an external reference clock if desired.
3.11 Clocks
The MC1322x Sensor Mode provides for two system clock sources.
• MC1322x Reference Oscillator - The default frequency for the reference oscillator is 24 MHz and
the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two
additional options for the module
— X1 can be replaced by a 13-26 MHz crystal (it must meet MC1322x specifications), however,
the onboard PLL must be used in this case. The pcb provides for PLL filter components, but
these are not populated.
— An external clock source can be supplied as the reference source (typically 24 MHz). The
frequency must be accurate to +/-40ppm. The external clock source is supplied through GPIO
Connector J2, and crystal X1 must be removed and capacitor C58 mounted (see Chapter 5,
“Schematic, Board Layout, and Bill of Material”, Sheet 1).
— 32.768 kHz Crystal Oscillator - Provision is also made for an optional secondary 32.768 kHz
crystal X2. This oscillator can be used for a low power accurate timebase. The module comes
without this crystal and its load capacitors C7 and C12 unmounted (see Chapter 5, “Schematic,
Board Layout, and Bill of Material”, Sheet 1).
System Overview and Functional Block Descriptions
1322x Sensor Node Reference Manual, Rev. 1.1
3-8 Freescale Semiconductor
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 4-1
Chapter 4
Interface Locations and Pinouts
This chapter provides a description of the interface location and pinout of the 1322x Sensor Node printed
circuit board (PCB).
4.1 Overview
This section details the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and
connectors on the 1322x Sensor Node circuit board which is the main board for the 1322x Sensor Node.
Users should refer to the figures in the subsequent sections while moving through this chapter. Users
should also reference the circuit board schematic in Chapter 5, “Schematic, Board Layout, and Bill of
Material”, for additional information.
Figure 4-1. 1322x Sensor Node PCB Top View
Tact Switches
On-Off Switch
JTAG ConnectorGPIO Connector
DC
Supply
Joystick
Audio
Connector
Buzzer
USB
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
4-2 Freescale Semiconductor
4.2 Power Management
The module can be powered from the DC power jack, the USB port, or the battery pack.
4.2.1 Supply Sources
Table 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100
mA.
4.2.2 On/Off Switch and Power On Indicator
The following are used with the power management:
• Switch SW7 - 4-pole slide switch disconnects ALL sources
• Green LED D5 - indicates power from any source
4.2.3 Power Measurement
It is possible to isolate various circuit blocks to measure current draw via 0-ohm resistors. The resistors
are all mounted as default.
Below is a list of the supplies.
• R68 -> VCC (Output from main on-board regulator)
• R65 -> VBATT (Supply for MC1322x)
• R37 -> V_PRE (Supply for pressure sensor)
• R38 -> V_XYZ (Supply for accelerometer)
• R43 -> V_AUD (Supply for audio circuit)
• R44 -> V_TMP (Supply for temp sensor)
• R64 -> 3V (Output from on-board regulator for GPIO customer access), or alternately, R66 (not
mounted) can enable separate regulator U12.
4.3 RF Circuitry
The printed metal F-antenna (ANT1) is the only option for this module.
Table 4-1. Power Supply Sources
Source Connector Min
(Volts) Typical
(Volts) Max
(Volts) Notes
DC Source J5 4.4 5 12 Use DC only source. The connector is a 2 mm DC power
jack; positive center conductor.
USB J6 4.4 5 5.25
AA Battery
Pack BC1 ~2.0 3 3.2 Two AA cells. Battery pack is automatically disabled by
either DC source or USB. Accessible through the door on
the bottom of the plastic enclosure.
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 4-3
4.4 USB Connector (“B” Receptacle)
The USB connector is designated as J6. Figure 4-2 shows the connector pinout.
Figure 4-2. USB Connector Pinout
4.5 LEDs, Switch, Buttons and Joystick
The Sensor Node contains a total of four red LEDs and one green LED
• The four red LEDs are driven by the MCU and controlled by the software application.
• As previously discussed, the green LED is directly connected to the on-board regulation and acts
as “Power On” indication.
As also previously discussed SW7 is an on/off slide switch that connects the power supplies.
There are five pushbuttons total.
• One pushbutton (SW5) is separate and provides a master hardware Reset.
• Four additional pushbuttons are connected to the MCU GPIO for software application. These
buttons all have interrupt generation capability
A joystick (SW6) is also provided.
• The joystick is a “4-direction TACT Switch with Center Push”.
• The 4-directional TACT switches are connected in parallel with the four user pushbuttons.
• The center push switch is separate and does not have interrupt generation capability
Table 4-2. Switch and LED Summary
Item GPIO Connection Feature
PWR (green) VCC ‘Power On’ indication
LED1 (red) KBI_1 Application specific
LED2 (red) KBI_2 Application specific
LED3 (red) KBI_3 Application specific
LED4 (red) TX_ON Application specific
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
4-4 Freescale Semiconductor
4.6 Debug/Development Connector (ARM JTAG Interface)
The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface
is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly
separated from the GPIO pin header (J2) and located at the rear side of the module. The 20-pin connector
has Pin 1 marking for correct plug-in of the development cable.
Table 4-3 shows the device pins that are connected to the associated JTAG header pin outs if the JTAG
connector is used.
SW1 (pushbutton) KBI_4 Interrupt functionality. In parallel with SW6 (right).
SW2 (pushbutton) KBI_5 Interrupt functionality. In parallel with SW6 (down).
SW3 (pushbutton) KBI_6 Interrupt functionality. In parallel with SW6 (left).
SW4 (pushbutton) KBI_7 Interrupt functionality. In parallel with SW6 (up).
SW5 (RST) RESETB HW reset
SW6 (right) KBI_4 Interrupt functionality. In parallel with SW1.
SW6 (down) KBI_5 Interrupt functionality. In parallel with SW2.
SW6 (left) KBI_6 Interrupt functionality. In parallel with SW3.
SW6 (up) KBI_7 Interrupt functionality. In parallel with SW4.
SW6 (center) KBI_0_HST_WK Host wake up output functionality. No interrupt functionality
Table 4-3. ARM JTAG 20-Pin Connector Assignments (J1)
Name1
1NC means No Connect.
Pin # Pin # Name
VCC 1 2 VCC
NC2
2MC1322x does not support separate JATG reset TRST.
34GND
TDI 5 6 GND
TMS 7 8 GND
TCK 9 10 GND
RTCK 11 12 GND
TDO 13 14 GND
RESET3
3VCC through a 100k-ohm pullup.
15 16 GND
NC 17 18 GND
NC 19 20 GND
Table 4-2. Switch and LED Summary (continued)
Item GPIO Connection Feature
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 4-5
4.7 Audio Subsystem Connections
The audio subsystem uses the following connections:
• 2.5mm stereo jack J3 - for headset mic and earphone
• Jumper J7 - selects audio output source. See Figure 4-3 for connections
Figure 4-3. J7 Audio Output Source Jumper
4.8 GPIO Connector
The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header. The connector provides
access to MCU GPIO, an external clock source connection, a timer output, ADC inputs, the SSI port, a
UART port, the SPI port, the I2C port, and the serial DAC output. Power is also provided on the connector.
• VCC is the main supply voltage. Current draw should be limited to 50 mA.
• CLKIN can be used to supply an external reference clock (nominally 24 MHz). The onboard
crystal must be removed and an ac-coupling capacitor added.
• Some of the GPIO are shared with onboard devices. Check for any conflict.
• The serial DAC output is available at the connector. The DAC output should not be selected as the
output audio source (J7) when used off board.
Table 4-4. GPIO Connector J2 Pinouts
Pin Name Function Notes
1 TMR1 Timer I/O or GPIO Hardwired to accelerometer G-SEL1.
2 CLKIN Source for external clock to
reference oscillator • 13-26 MHz reference clock with <40 ppm accuracy
• Onboard crystal must be removed
• Enable signal to MC1322x by adding C58, 10pF; see
schematic
3 VCC Voltage supply from module 3V output from on-board regulation
4 GND System ground
5 ADC1 ADC Analog Input Channel or GPIO
6 ADC2 ADC Analog Input Channel or GPIO Hardwired to accelerometer XOUT. Disable accelerometer.
7 ADC3 ADC Analog Input Channel or GPIO Hardwired to accelerometer YOUT. Disable accelerometer.
8 ADC4 ADC Analog Input Channel or GPIO Hardwired to accelerometer ZOUT. Disable accelerometer
Audio Select
1-2 DAC
3-2 PWM
11
22
33
J7
TSM-103-01-L-SV
AUD FILTER INPUT
SERIAL DAC
PWM
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
4-6 Freescale Semiconductor
4.9 FLASH Memory Recovery Jumpers and Erase
The MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at
boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of
doing so:
• JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can
be changed.
• Load new FLASH image via UART1 port -
NOTE
The 1322x Sensor Node provides access for UART1 through the USB
connection. If users need to employ UART1 with the Test Tool running on
a PC, they must access the UART through the USB port as a virtual COM
port.
— The Freescale BeeKit IDE suite download provides a software tool called “Test Tool”. This
application runs on a PC and can be used with a client running on the MC1322x to test the
platform.
9 ADC5 ADC Analog Input Channel or GPIO Hardwired to pressure out.
10 DAC_OUT Serial DAC Output Jumper J7 selects DAC output as audio output source
11 SSI_TX SSI Port or GPIO Hardwired to serial DAC
12 SSI_RX SSI Port or GPIO
13 SSI_FSYN SSI Port or GPIO Hardwired to serial DAC
14 SSI_BITCLK SSI Port or GPIO Hardwired to serial DAC
15 KBI_0_HST_WK Hardwired to “center” on joystick
16 KBI_4 Hardwired to “right” on joystick and SW1
17 UART2_TX UART2 or GPIO
18 UART2_RX UART2 or GPIO
19 UART2_RTS UART2 or GPIO
20 UART2_CTS UART2 or GPIO
21 I2C_SCL I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has
I2C address 0x50
22 I2C_SDA I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has
I2C address 0x50
23 SPI_SCK SPI Port or GPIO
24 SPI_SS SPI Port or GPIO
25 SPI_MOSI SPI Port or GPIO
26 SPI_MISO SPI Port or GPIO
Table 4-4. GPIO Connector J2 Pinouts (continued)
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 4-7
— Test Tool also has the capability to load a new image into the FLASH.
NOTE
The FLASH must first be cleared before loading a new image.
The 1322x Sensor Node has two jumper sites (J19 and J20, Figure 4-4) that must be used to erase the
FLASH:
1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar.
2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar.
3. Turn on power, push the reset button and wait a few seconds.
4. Turn off power and remove the jumpers.
5. The board is now ready for boot operation.
After the FLASH is erased, the module can be loaded with a new image through the USB port using Test
Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit download.
Figure 4-4. FLASH Erase Headers
4.10 ADC Voltage References
Two ADC reference voltages are provided:
• The reference voltage for ADC2_VREFH is tied to VCC which is regulated when the board is
supplied from the DC source or the USB port. However, this voltage moves with VCC when power
is supplied via the battery source.
• A fixed voltage reference for ADC1_VREFH is provided (see Figure 4-5).
— The fixed voltage is 1.5 Vdc.
— The LM285M (U17) is programmed via R120 and R121 to provide a constant reference
— The reference can be enabled via Jumper J18.
— This reference is useful for battery operation where a known, fixed high reference voltage for
the ADC is required.
ADC2_VREFH -> "0"
ADC2_VREFL -> "1"
Re cover y M ode
1
2
J19
HDR_2X1 1
2
J20
HDR_2X1
R103
10K
C2
100nF
TP103
TP3
R104
10K
VCC
VCC
ADC2_VREFL
ADC2_VREFH
Interface Locations and Pinouts
1322x Sensor Node Reference Manual, Rev. 1.1
4-8 Freescale Semiconductor
Figure 4-5. ADC Voltage 1.5 Vdc Voltage Reference
4.11 Jumper Selection
Table 4-5 lists all the possible jumper selections for the Sensor Node. The jumpers available on the board
are:
• J7 - Selects audio output source
• J18 - Sets fixed ADC reference voltage
• J19, J20- Clears MC1322x onboard FLASH. See Table 4-5.
Table 4-5. Sensor Node Jumper Selection
Pin
Header Pin Number
Connection Description Default
Setting
J7 1-2
2-3
Connect to enable audio path from DAC
Connect to enable audio path from PWM
Not mounted
Mounted
J18 1-2 Connect to enable ADC 1.5V reference Not mounted
J19, J20 1-2, 1-2 Connect both to recover/clear FLASH. See Section 4.9, “FLASH Memory
Recovery Jumpers and Erase” Not mounted
1.5V
R1
10K
1
1
2
2
3
3
4
455
66
77
88
U17
LM285M
R121
24.9K
1%
R120
120K
1%
1
2
J18
HDR_2X1
Not Mounted
VCC
ADC1_VREFH
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 5-1
Chapter 5
Schematic, Board Layout, and Bill of Material
Figure 5-1. Sensor Node Schematic (1 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
VCC
VCC VCC
VCC
V_MAIN
VCC
V_PRE
V_XYZ
V_AUD
V_TMP
VCC
VCC VCC
VCC
VCC VCC
VCC
LED1
LED2
LED3
LED4
SWITCH4
SWITCH3
SWITCH2
SWITCH1
LED1
LED2
LED4
LED3
SWITCH4
SWITCH3
SWITCH2
SWITCH1
SWITCH5
UART1_CTS
UART1_TX
UART1_RX
UART1_RTS
RESET
RESET
RTCK
RTCK
SWITCH1
SWITCH2
SWITCH3
SWITCH4
SWITCH5
UART2_TX
UART2_RTS
UART2_RX
UART2_CTS
SPI_SCK
SPI_SCK
SPI_MOSI
SPI_SS
SPI_MISO
I2C_SCL
ADC1
ADC2
ADC3ADC4
ADC5
ADC2
ADC3
ADC4
ADC5
UART2_TX
UART2_RX
UART2_CTS
UART2_RTS
I2C_SDA
I2C_SCL
I2C_SDA
SPI_MOSI
SPI_SS
SPI_MISO
TMR1
TMR1
ADC1
SSI_TX
SSI_BITCK
SSI_FSYN
SSI_RX
SSI_TX
SSI_BITCK SSI_FSYN
SSI_RX
SWITCH1 SWITCH5
DAC_OUT
DAC_OUT
CLKIN
CLKIN
ADC1_VREFH
ADC2_VREFH
ADC1_VREFL
ADC2_VREFL
ADC1_VREFH
ADC2_VREFH
ADC1_VREFL
ADC2_VREFL
UART1_TX
UART1_CTS
UART1_RX
UART1_RTS
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Main Schematic
35
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Main Schematic
35
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Main Schematic
35
_X_ ---
---
GPIO
Pin Header
Push
Buttons
LEDs
RF
JTAG Debug
DBGRQ
DBGACK
nTRST
JTAG RTCK
Enable
Reset
Button
Power ON
Joystick
JTAG RTCK
Disable
External
Clock
Source
Note: SSI_FSYN becomes CLKO
under test conditions
Note: SWITCH 5 does not have interrupt capability
1-2 ADC2_VREFH -> "0"
3-4 ADC2_VREFL -> "1"
Recovery Mode
1.5V
R8
390R
R8
390R
J18
HDR_2X1
Not Mounted
J18
HDR_2X1
Not Mounted
1
2
R105
0R
R105
0R
C5
180nF
Not Mounted
C5
180nF
Not Mounted
R66
0R
Not Mounted
R66
0R
Not Mounted
TP6TP6
TP103TP103
C7
22pF
Not Mounted
C7
22pF
Not Mounted
C9
10nF
Not Mounted
C9
10nF
Not Mounted
TP10TP10
R3
0R
R3
0R
C12
22pF
Not Mounted
C12
22pF
Not Mounted
R123 1KR123 1K
R14
1K
R14
1K
R65
0R
R65
0R
R71
10K
Not Mounted
R71
10K
Not Mounted
U12
LT1129CST-3.3
U12
LT1129CST-3.3
Vin 1
Vout
3
GND1 2
GND2 4
SW1
DTSM63N
SWITCH1
SW1
DTSM63N
SWITCH1
3
12
4
PCB1
JDP7049_3
PCB1
JDP7049_3
D1
LHR974
LED1
D1
LHR974
LED1
C11
1nF
C11
1nF
R6
390R
R6
390R
R5
240R
Not Mounted
R5
240R
Not Mounted C4
27nF
Not Mounted
C4
27nF
Not Mounted
TP9TP9
ZZ1
Label 1322X-SRB
ZZ1
Label 1322X-SRB
SW4
DTSM63N
SWITCH4
SW4
DTSM63N
SWITCH4
3
12
4
D4
LHR974
LED4
D4
LHR974
LED4
TP4TP4
R4
0R
Not Mounted
R4
0R
Not Mounted
D11
MBR0520LT1
D11
MBR0520LT1
R11
220R
R11
220R
J19
HDR_2X1
J19
HDR_2X1
1
2
R12
100K
R12
100K
C48
4.7uF
C48
4.7uF
R70
1K
Not Mounted
R70
1K
Not Mounted
TP45TP45
U1
MC13225
U1
MC13225
UART2_RTS
13
EVTI_B 132
MCKO/IO50 131
MSEO0_B 114
EVTO_B 123
RDY_B 122
MSEO1_B 113
VBATT 45
LREG_BK_FB 44
COIL_BK 43
ADC2_VREFL
61 ADC1_VREFL
62
ADC1_VREFH
63
ADC2_VREFH
64
ADC0
1
ADC1
2
ADC2
3
ADC3
4
ADC4
5
ADC5
6
ADC6
7
ADC7_RTCK
8
MDO00 103
MDO01 102
MDO02 112
MDO03 111
MDO04 121
MDO05 120
MDO06 130
MDO07 129
TDI 10
RF_GND 58
TDO 9
UART2_CTS
14
UART2_RX
15
TCK 11
TMS 12
RESETB 51
VREG_ANA 55
XTAL_24_OUT
49
RF_PLL_FLT 46
XTAL_24_IN
50
KBI_0_HST_WK
42
XTAL_32_IN
47
ANT_1 56
XTAL_32_OUT
48
RF_RX_TX 60
ANT_2 57
UART2_TX
16
RX_ON 59
PA_POS 54
PA_NEG 53
TX_ON 52
UART1_RTS
17
UART1_CTS
18
UART1_RX
19 UART1_TX
20
I2C_SDA
21
I2C_SCL
22
TMR3
23
TMR2
24
TMR1
25
TMR0
26
SPI_SCK
27
SPI_MOSI
28
SPI_MISO
29
SPI_SS
30
SSI_BITCK
31
SSI_FSYN
32
SSI_RX
33 SSI_TX
34
KBI_1
41 KBI_2
40 KBI_3
39 KBI_4
38 KBI_5
37 KBI_6
36 KBI_7
35
GND_FLAG_1
75
DIG_REG 124
NVM_REG 133
GND_FLAG_2
76
GND_FLAG_3
77
GND_FLAG_4
78
GND_FLAG_5
79
GND_FLAG_6
84
GND_FLAG_7
85
GND_FLAG_8
86
GND_FLAG_9
87
GND_FLAG_10
88
GND_FLAG_11
93
GND_FLAG_12
94
GND_FLAG_13
95
GND_FLAG_14
96
GND_FLAG_15
97
GND_FLAG_16
104
GND_FLAG_17
105
GND_FLAG_18
106
GND_FLAG_19
115
NC1
65
NC2
66
NC3
67
NC4
68
NC5
69
NC6
70
NC7
71
NC8
72
NC9
73
NC10
74
NC11 80
NC12 81
NC13 82
NC14 83
NC15 89
NC16 90
NC17 91
NC18 92
NC19 98
NC20 99
NC21 100
NC22 101
NC23 107
NC24 108
NC25 109
NC26 110
NC27 116
NC28 117
NC29 118
NC30 119
NC31 125
NC32 126
NC33 127
NC34 128
NC35 134
NC36 135
NC37 136
NC38 137
NC39 138
NC40 139
NC41 140
NC42 141
NC43 142
NC44 143
NC45 144
NC46 145
R1
10K
R1
10K
05 - USB/Power Supply Schematic
USB / Power Supply
UART1_CTS
UART1_TX
UART1_RTS
UART1_RX
V_XYZ
V_AUD
V_TMP
V_PRE
ANT1
F_Antenna
ANT1
F_Antenna
R121
24.9K
1%
R121
24.9K
1%
C51
10pF
Not Mounted
C51
10pF
Not Mounted
J1
90122-20
J1
90122-20
1
1
3
3
5
5
7
7
9
9
11
11
13
13
15
15
17
17
19
19
22
44
66
88
10 10
12 12
14 14
16 16
18 18
20 20
SW3
DTSM63N
SWITCH3
SW3
DTSM63N
SWITCH3
3
12
4
R124 1KR124 1K
R69
1K
Not Mounted
R69
1K
Not Mounted
C49
1uF
C49
1uF
SW2
DTSM63N
SWITCH2
SW2
DTSM63N
SWITCH2
3
12
4
C6
100nF
C6
100nF
SW6
SKRHA
SW6
SKRHA
C
3
A
1
Ce
2
D4
Co 5
B6
NC1
7NC2 8
C10
1uF
Not Mounted
C10
1uF
Not Mounted
J2
90122-26
J2
90122-26
11
33
55
77
99
11 11
13 13
15 15
17 17
19 19
21 21
23 23
25 25
2
2
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
22
24
24
26
26
C50
100nF
C50
100nF
X1
24.00MHz
X1
24.00MHz
REF1
Ref
REF1
Ref
1
1
TP8TP8
TP2TP2
MH2MH2
1
TP7TP7
C3
1pF
Not Mounted
C3
1pF
Not Mounted
MH3MH3
1
TP5TP5
TP46TP46
D5
LGR971
POWER
D5
LGR971
POWER
TP3TP3
J20
HDR_2X1
J20
HDR_2X1
1
2
R64
0R
R64
0R
C2
100nF
C2
100nF
D3
LHR974
LED3
D3
LHR974
LED3
C1
10pF
Not MountedC1
10pF
Not Mounted
R103
10K
R103
10K
SW5
DTSM63N
RESET
SW5
DTSM63N
RESET
3
12
4
TP44TP44
REF2
Ref
REF2
Ref
1
1
R125 1KR125 1K
U17
LM285M
U17
LM285M
1
1
2
2
3
3
4
455
66
77
88
R7
390R
R7
390R
TP1TP1
04 - Sensor/Audio Schematic
Sensor/Audio
G-SEL1
G-SEL2
ZOUT
YOUT
XOUT
G_SLEEP
TEMP_OUT
PRESS_OUT
SCLK
AUDIO_PWM
Din
AUDIO_MIC
SYNC
DAC_OUT
V_PRE
V_XYZ
V_TMP
V_AUD
VOL_SCL
VOL_SDA
R104
10K
R104
10K
MH1MH1
1
C54
10pF
Not Mounted
C54
10pF
Not Mounted
D2
LHR974
LED2
D2
LHR974
LED2
TP11TP11
R9
390R
R9
390R
C8
100pF
C8
100pF
X2
32.768kHz
Not Mounted
X2
32.768kHz
Not Mounted
R120
120K
1%
R120
120K
1%
REF3
Ref
REF3
Ref
1
1
L1
3.9nH
Not Mounted
L1
3.9nH
Not Mounted
R122 1KR122 1K
R73
10K
R73
10K
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
5-2 Freescale Semiconductor
Figure 5-2. Sensor Node Schematic (2 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
G-SEL2
G-SEL1
XOUT
G_SLEEP
ZOUT
YOUT
TEMP_OUT
PRESS_OUT
Din
AUDIO_MIC
AUDIO_PWM
SCLK
DAC_OUT
SYNC
V_TMP
V_PRE
V_XYZ
VOL_SDA
V_AUD
VOL_SCL
V_XYZ
V_PRE
V_TMP
V_PRE
V_TMP
V_AUD
V_AUD
V_AUD
V_AUD
V_AUD
V_XYZ
V_TMP
V_PRE
V_AUD
V_AUD
VCC
V_XYZ
V_AUD
VCC
V_AUD
V_AUD
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Sensor/Audio Schematic
45
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Sensor/Audio Schematic
45
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
Sensor/Audio Schematic
45
_X_ ---
---
XYZ Sensor
Pressure Sensor
Audio Select
1-2 DAC
3-2 PWM
Audio Filter
Temperature Sensor
Audio Amp
Enable
Audio Amp
Disable
Audio Amplifier
Audio DAC
Mic. Biasing
BUZ1
NDT-03C
BUZ1
NDT-03C
+1
-2
NC1 3
NC2 4
R34
0R
Not Mounted
R34
0R
Not Mounted
+
-
U14A
MC33204DTBG
+
-
U14A
MC33204DTBG
3
2
1
411
C74
100pF
C74
100pF
R107
4.7K
R107
4.7K
R111 0RR111 0R
R15
4.7K
R15
4.7K
TP18TP18
TP51TP51
R25
1K
R25
1K
C13
100nF
C13
100nF
R35
1K
R35
1K
C22
100nF
C22
100nF
R57
4.7K
R57
4.7K
C28
47nF
C28
47nF
TP14TP14
R110 0RR110 0R
TP22TP22
TP17TP17
R88
51K
R88
51K
C23
100nF
C23
100nF
R58
27K
R58
27K
R84
0R
R84
0R
TP24TP24
U4
DAC101S101
U4
DAC101S101
SCLK 5
VDD
3
GND
2SYNC 6
Din 4
Vout
1
TP15TP15
C46
270pF
C46
270pF
C27
100nF
C27
100nF
C24
1uF
C24
1uF
R17 1KR17 1K
TP13TP13
C75
4.7nF
C75
4.7nF
R109 0RR109 0R
R32
0R
Not Mounted
R32
0R
Not Mounted
TP50TP50
R61
13K
R61
13K
TP20TP20
R26
100K
R26
100K
C32
10UF
C32
10UF
R24
100K
R24
100K
TP16TP16
TP21TP21
C15
100nF
C15
100nF
R106
4.7K
R106
4.7K
J3
STX-2550-5NTR
J3
STX-2550-5NTR
1
3
5
4
2
R67
27K
R67
27K
R18 1KR18 1K
TP49TP49
R30
220R
R30
220R
J7
TSM-103-01-L-SV
J7
TSM-103-01-L-SV
11
22
33
R23
100K
R23
100K
U5
MPXV5010G
U5
MPXV5010G
Vs+
2
Vo
4
GND
3
NC5 8
NC4 7
NC3 6
NC2 5
NC1 1
R59
27K
R59
27K
TP25TP25
R29
47K
R29
47K
R87
10K
R87
10K
C45
220nF
C45
220nF
R56
4.7K
R56
4.7K
+
-
U14B
MC33204DTBG
+
-
U14B
MC33204DTBG
5
6
7
C33
22nF
C33
22nF
+
-
U14D
MC33204DTBG
+
-
U14D
MC33204DTBG
12
13
14
TP12TP12 C14
10UF
C14
10UF
C21
100nF
C21
100nF
R31
1K
R31
1K
R16 1KR16 1K
+
-
U14C
MC33204DTBG
+
-
U14C
MC33204DTBG
10
8
9
R85
11K
R85
11K
U6
NCP4896
U6
NCP4896
INM C1
SE/BTL A1
VP1
B1
GND
B3 OUTB
A3
NC
B2
OUTA
C3
BYP A2
SD C2
R86
1.8K
R86
1.8K
U3
MMA7260Q
U3
MMA7260Q
XOUT
15 N/C2 11
N/C3 10
N/C4 9
N/C5 8
N/C7 6
N/C8 5
g-Select 1
1
g-Select 2
2
N/C6 7
N/C1 16
VSS 4
VDD 3
EP
17
SleepMode
12
ZOUT
13 YOUT
14
C25
1uF
C25
1uF
R108 0RR108 0R
R20
200K
R20
200K
C17
100nF
C17
100nF
C19
22uF
C19
22uF
TP19TP19
TP23TP23
C44
1uF
C44
1uF
C31
100nF
C31
100nF
R60
8.2K
R60
8.2K
U13
MAX5434
U13
MAX5434
VCC 1
GND 2
SDA 4
SCL 3
L
6
W
5
TP27TP27
R33
0R
R33
0R
C30
100nF
C30
100nF
TP48TP48
R74
10K
Not Mounted
R74
10K
Not Mounted
C20
47pF
C20
47pF
C18
100nF
C18
100nF
C47
3.3nF
C47
3.3nF
C16
100nF
C16
100nF
C26
100nF
C26
100nF
U7
LM61
U7
LM61
Vs+
1
Vo
2
GND
3
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 5-3
Figure 5-3. Sensor Node Schematic (3 of 3)
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
UART1_TX
UART1_CTS
UART1_RX
UART1_RTS
V_PRE
V_XYZ
V_AUD
V_TMP
V_USB
V_USB
V_AUD
V_XYZ
V_PRE
V_TMP
VCC
V_MAIN
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
USB/Power Supply
55
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
USB/Power Supply
55
_X_ ---
---
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
SOURCE: SCH-23451 PDF: SPF-23451 B
1322X-SRB
C
Thursday, March 27, 2008
USB/Power Supply
55
_X_ ---
---
2xAA Cells
USB Interface
Power Management Power Measurement
SW7-4
MFP461N-RA
SW7-4
MFP461N-RA
10
11
12
U9
LT1129CST-3.3
U9
LT1129CST-3.3
Vin
1Vout 3
GND1
2
GND2
4
TP30TP30
C41
100nF
C41
100nF
J5
DJ-005
J5
DJ-005
1
3
2
SW7-2
MFP461N-RA
SW7-2
MFP461N-RA
4
5
6
R40
10K
R40
10K
C37
4.7uF
C37
4.7uF
TP42TP42
TP31TP31
C35
100nF
C35
100nF
U10
FT232R
U10
FT232R
TxD 30
RxD 2
RTS 32
CTS 8
DTR 31
DSR 6
DCD 7
RI 3
AGND 24
GND1
4
GND2
17
VCC
19 VCCIO 1
3V3OUT
16
USBDM
15
USBDP
14
RESET
18
OSCI
27
OSCO
28
EP 33
CBUS4 9
CBUS3 11
CBUS2 10
CBUS1 21
CBUS0 22
NC1
5
NC2
12
NC3
13
GND3
20
NC4
23
NC5 25
NC6 29
TEST
26
TP33TP33
D8
MBR0520LT1
D8
MBR0520LT1
D9
MBR0520LT1
D9
MBR0520LT1
Q1
ZXM61P02F
Q1
ZXM61P02F
R68
0R
R68
0R
R43
0R
R43
0R
TP29TP29
TP36TP36
RT2
500mA
RT2
500mA
C38
100nF
C38
100nF
J6
USB-B
J6
USB-B
VUSB 1
Data- 2
Data+ 3
GND 4
SHIELD1 5
SHIELD2 6
C40
100nF
C40
100nF
TP39TP39
C42
15pF
C42
15pF
C34
1uF
C34
1uF
D7
MBR0520LT1
D7
MBR0520LT1
TP47TP47
TP40TP40
TP38TP38
R42
100K
R42
100K
R44
0R
R44
0R
BC1
2462
BC1
2462
+1
-
2
R50 0RR50 0R
SW7-3
MFP461N-RA
SW7-3
MFP461N-RA
7
8
9
SW7-1
MFP461N-RA
SW7-1
MFP461N-RA
1
2
3
C43
15pF
C43
15pF
TP28TP28
R38
0R
R38
0R
D10
MBR0520LT1
D10
MBR0520LT1
TP41TP41
C53
4.7uF
C53
4.7uF
TP43TP43
L2
60OHM
L2
60OHM
1 2
R37
0R
R37
0R
TP26TP26
C36
4.7uF
C36
4.7uF
RT1
500mA
RT1
500mA
TP34TP34
TP32TP32
C52
10nF
C52
10nF
D6
MBR0520LT1
D6
MBR0520LT1
R51 0RR51 0R
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
5-4 Freescale Semiconductor
Figure 5-4. Sensor Node PCB Component Location (Top View)
Figure 5-5. Sensor Node PCB Test Points (Bottom View)
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 5-5
Figure 5-6. Sensor Node PCB Layout (Top View)
Figure 5-7. Sensor Node PCB Layout (Bottom View)
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
5-6 Freescale Semiconductor
Table 5-1. Bill of Materials
QTY Part
Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part
Number
1 ANT1 F_Antenna PCB F
ANTENNA NOT A PART NOT A PART
1 BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C
1 BC1 PCB Battery
Holder 2xAA 2462 Keystone 2462
0C1,C51,C
54 Ceramic Capacitor
C0G 10pF 50V 5% Murata GRM1555C1H100JZ01
2 C14,C32 CAP CER 10UF
6.3V 20% X5R
0603
10uF 6.3V 20% PANASONIC ECJ1VB0J106M
3C24,C25,
C44 Ceramic Capacitor
X5R 1uF 6.3V 10% Murata GRM155R60J105KE19B
0 C10 Ceramic Capacitor
X5R 1uF 6.3V 10% Murata GRM155R60J105KE19B
1 C11 Ceramic Capacitor
X7R 1nF 50V 10% Murata GRM155R71H102KA01D
1 C19 Ceramic Capacitor
X5R 22uF 6.3V 20% Murata GRM21BR60J226ME39L
19 C2,C6,C1
3,C15,C16
,C17,C18,
C21,C22,
C23,C26,
C27,C30,
C31,C35,
C38,C40,
C41,C50
Ceramic Capacitor
X5R 100nF 10V 10% Murata GRM155R61A104KA01D
1 C20 Ceramic Capacitor
C0G 47pF 50V 5% Murata GRM1555C1H470JZ01D
1 C28 Ceramic Capacitor
X7R 47nF 25V 10% Murata GRM155R71E473KA88
0 C3 Ceramic Capacitor
C0G 1pF 50V 0.25pF Murata GRM1555C1H1R0CZ01D
1 C33 Ceramic Capacitor
X7R 22nF 25V 10% Murata GRM155R71E223KA61D
2 C34,C49 Ceramic Multilayer
Capacitor X7R
NoPb
1uF 16V 15% Murata GRM21BR71C105
3C36,C37,
C48 Ceramic Multilayer
Capacitor X5R 4.7uF 16V 15% Phycomp 2222 781 13672
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 5-7
0 C4 Ceramic Multilayer
Capacitor X7R 27nF 10V 5% Vishay VJ0402Y273JXQCW1BC
2 C42,C43 Ceramic Capacitor
C0G 15pF 50V 5% Murata GRM1555C1H150JZ01J
1 C45 Ceramic Capacitor
X7R 220nF 10V 10% Murata GRM188R71A224KA01
1 C46 Ceramic Capacitor
C0G 270pF 50V 5% Murata GRM1555C1H271JA01
1 C47 Ceramic Capacitor
C0G 3.3nF 50V 15% Murata GRM155R71H332KA01
0 C5 Ceramic Multilayer
Capacitor X7R 180nF 16V 5% Vishay VJ0603Y184JXJCW1BC
1 C53 Ceramic Multilayer
Capacitor X5R 4.7uF 10V 10% Murata GRM219R61A475KE34D
0 C7,C12 Ceramic Capacitor
C0G 22pF 50V 5% Murata GRM1555C1H220JZ01J
2 C8,C74 Ceramic Capacitor
C0G 100pF 50V 5% Murata GRM1555C1H101JZ01
1 C52 Ceramic Capacitor
X7R 10nF 25V 10% Murata GRM155R71E103KA01D
1 C75 Ceramic Capacitor
X7R 4.7nF 25V Murata GRM155R71E472KA01D
0 C9 Ceramic Capacitor
X7R 10nF 25V 10% Murata GRM155R71E103KA01D
4 D1,D2,D3,
D4 SMD Red topled LHR974 OSRAM Q62702P5182
1 D5 SMD Green topled LGR971 OSRAM Q65110P5179
6 D6,D7,D8,
D9,D10,D
11
SMD Power
Schottky Rectifier MBR0520LT1 20V On
Semiconductor MBR0520LT1G
1 J3 2.5mm Audio
stereo jack with
switch
STX-2550-5NTR Kycon STX-2550-5NTR
1 J7 Single Row
Straight Pin
Header SMD w.
Plastic Pick &
Place Pad
TSM-103-01-L-S
VSamtec TSM-103-01-L-SV-P-TR
2 J19,J20 HDR 1X2 TH
100MIL SP 330H
AU
TSW-102-07-S-S SAMTEC TSW-102-07-S-S
Table 5-1. Bill of Materials
QTY Part
Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part
Number
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
5-8 Freescale Semiconductor
1 J18 HDR 1X2 TH
100MIL SP 330H
AU
TSW-102-07-S-S SAMTEC TSW-102-07-S-S
0 L1 HF Chip coil 3.9nH 5% Murata LQG15HS3N9S02D
1 L2 Chip Ferrite Bead 500mA Murata BLM11P600Sxx
1 Q1 P-channel
MOSFET ZXM61P02F 20V Zetex ZXM61P02F
6R1,R40,R
73,R87,R1
03,R104
Fixed resistor
RC31 10K 50V 2% Philips 2322 705 50103
17 R3,R33,R
37,R38,R4
3,R44,R50
,R51,R64,
R65,R68,
R84,R105,
R108,R10
9,R110,R1
11
Fixed resistor
RC31 0R 50V 2% Philips 2322 705 91002
0R4,R32,R
34,R66 Fixed resistor
RC31 0R 50V 2% Philips 2322 705 91002
2 R11,R30 Fixed resistor
RC31 220R 50V 2% Philips 2322 705 50221
5R12,R23,
R24,R26,
R42
Fixed resistor
RC31 100K 50V 2% Philips 2322 705 50104
7R14,R16,
R17,R18,
R25,R31,
R35
Fixed resistor
RC31 1K 50V 2% Philips 2322 705 50102
0 R69,R70 Fixed resistor
RC31 1K 50V 2% Philips 2322 705 50102
5R15,R56,
R57,R106,
R107
Fixed resistor
RC31 4.7K 50V 2% Philips 2322 705 50472
1 R20 Fixed resistor
RC31 200K 50V 2% YAGEO
AMERICA RC0402JR-07200KL
0 R71,R74 Fixed resistor
RC31 10K 50V 2% Philips 2322 705 50103
1 R29 Fixed resistor
RC31 47K 50V 2% Philips 2322 705 50473
0 R5 Fixed resistor
RC31 240R 50V 2% Philips 2322 705 50241
Table 5-1. Bill of Materials
QTY Part
Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part
Number
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
Freescale Semiconductor 5-9
3R58,R59,
R67 Fixed resistor
RC31 27K 50V 2% Philips 2322 705 50273
4 R6,R7,R8,
R9 Fixed resistor
RC31 390R 50V 2% Philips 2322 705 50391
1 R60 Fixed resistor
RC31 8.2K 50V 2% Philips 2322 705 50822
1 R61 Fixed resistor
RC31 13K 50V 2% Philips 2322 705 50133
1 R85 Fixed resistor
RC32 11K 50V KOA SPEER RK73H1ETTP1102F
1 R86 Fixed resistor
RC33 1.8K 50V KOA SPEER RK73H1ETTP1801F
1 R88 Fixed resistor
RC34 51K 200V KOA SPEER RK73H1ETTP5102F
1 R120 RES MF 120K
1/16W 1% 0402 120K 1% KOA SPEER RK73H1ETTP1203F
1 R121 RES MF 24.9K
1/16W 1% 0402 24.9K 1% KOA SPEER RK73H1ETTP2492F
4 R122,R12
3,R124,R1
25
RES MF 1.0K
1/16W 5% 0402 1K 5% VISHAY
INTERTECHN
OLOGY
CRCW04021K00JNED
2 RT1,RT2 Polyswitch
Overcurrent
Protection Device
500mA 13.2V Tyco
Electronics microSMD050F
5 SW1,SW2,
SW3,SW4,
SW5
SMD Tact Switch
2.6N (7.0mm) DTSM63N Diptronic DTSM-63N-V-B
1 SW6 4-directional TACT
switch with center
push SMD
SKRHA ALPS SKRHAAE010
1 SW7 Miniature Slide
Switch 4 pole MFP461N-RA Knitter-Switch MFP461N-RA
1 U1 ZigBee Wireless
Transceiver and
ARM7 processor
MC13225 Freescale MC13225
1U10 USB UART,
PB-free FT232R FTDI FT232RQ
1 U13 Digitally Controlled
Potentiometer,
50Kohm
MAX5434 Maxim MAX5434LEZT+T
Table 5-1. Bill of Materials
QTY Part
Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part
Number
Schematic, Board Layout, and Bill of Material
1322x Sensor Node Reference Manual, Rev. 1.1
5-10 Freescale Semiconductor
1 U3 +/-1.5g to 6g Three
axis low-g
accelerometer
MMA7260Q Freescale MMA7260QR2
1 U4 10-bit Low Power
DAC with rail to rail
output
DAC101S101 National
Semiconductor
s
DAC101S101CIMK-NoPB
1 U5 Integrated
Pressure Sensor MPXV5010G Freescale MPXV5010GC6U
1 U6 Audio class AB
amplifier, 1,0W NCP4896 On
Semiconductor NCP4896FCT1G
1 U7 Temperature
Sensor 2,7V LM61 National
Semiconductor
s
LM61BIM3
2 U9,U12 LDO voltage
regulator 3V3 LT1129CST-3.3 Linear
Technology LT1129CST-3.3
1 U14 IC LIN OPAMP
QUAD 2.2MHZ
1.8-12V TSSOP14
MC33204DTBG ON
SEMICONDUC
TOR
MC33204DTBG
1 U17 IC VREG ADJ
1.24-5.3V 20MA
SOIC8
LM285M National
Semiconductor
s
LM285M/NOPB
1 X1 Crystal SMD 24.00MHz +-10ppm NDK NX3225SA-24MHz (for
OA/AV and BlueTooth) /
S1-3085-1510-9
0 X2 Crystal SMD 32.768kHz +-20ppm Abracon ABS25-32.768KHZ-T
1 J1 Dual Row Right
Angle pin header
0.38um gold
90122-20 Molex 90122-0770
1 J2 Dual Row Right
Angle pin header
0.38um gold
90122-26 Molex 90122-0773
1 J5 DC Power Jack
PCB, 2mm DJ-005 Taitek 2DC-0005-D100
1J6 USB-series "B"
receptacle USB-B AMP 292304-1
Table 5-1. Bill of Materials
QTY Part
Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part
Number